WO2024051703A1 - Seed crystal holder and crystal growth method - Google Patents

Seed crystal holder and crystal growth method Download PDF

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Publication number
WO2024051703A1
WO2024051703A1 PCT/CN2023/117096 CN2023117096W WO2024051703A1 WO 2024051703 A1 WO2024051703 A1 WO 2024051703A1 CN 2023117096 W CN2023117096 W CN 2023117096W WO 2024051703 A1 WO2024051703 A1 WO 2024051703A1
Authority
WO
WIPO (PCT)
Prior art keywords
seed crystal
crystal holder
seed
holder
connecting rod
Prior art date
Application number
PCT/CN2023/117096
Other languages
French (fr)
Chinese (zh)
Inventor
王宇
官伟明
顾鹏
雷沛
Original Assignee
眉山博雅新材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 眉山博雅新材料股份有限公司 filed Critical 眉山博雅新材料股份有限公司
Priority to TW112134314A priority Critical patent/TW202413742A/en
Publication of WO2024051703A1 publication Critical patent/WO2024051703A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B19/00Liquid-phase epitaxial-layer growth
    • C30B19/06Reaction chambers; Boats for supporting the melt; Substrate holders
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B28/00Production of homogeneous polycrystalline material with defined structure
    • C30B28/12Production of homogeneous polycrystalline material with defined structure directly from the gas state

Definitions

  • This specification relates to the field of crystal preparation, and in particular to a seed crystal support and a crystal growth method.
  • the liquid phase method is one of the methods for growing crystals (for example, silicon carbide single crystal).
  • the seed crystal needs to be bonded to the seed crystal holder before growing the crystal.
  • the bonding quality of the seed crystal directly affects the quality of the prepared crystal.
  • the seed crystal needs to be bonded to the seed crystal holder, and the seed crystal is brought into contact with the melt by lowering the seed crystal holder, thereby achieving crystal growth. Therefore, the structural design of the seed crystal holder and the bonding condition between the seed crystal holder and the crystal are all very important for the growth of the crystal.
  • One or more embodiments of this specification provide a seed crystal holder, which includes a seed crystal holder body and a connecting rod.
  • the seed crystal holder body is fixed on one end of the connecting rod.
  • the seed crystal holder body is located away from the connecting rod.
  • One side of the connecting rod is provided with a seed crystal bonding surface.
  • the seed crystal holder body includes a hollow first inner cavity, and a channel for cooling medium to circulate is provided in the connecting rod; the channel is connected to the first inner cavity.
  • the seed crystal holder body is provided with a first through hole communicating with the first inner cavity.
  • a cooling medium diffusion structure is provided in the inner cavity.
  • the cooling medium diffusion structure includes a shell, a second inner cavity is formed in the shell, a plurality of diffusion holes are provided on the shell, and the channel is connected with the second inner cavity, The diffusion hole communicates with the first inner cavity and the second inner cavity.
  • the seed crystal holder further includes a cooling device that delivers the cooling medium to the channel, and the cooling medium flows in the channel at a preset flow rate.
  • the cooling medium is an inert gas
  • the preset flow rate is greater than 0.4m/s.
  • the seed crystal holder further includes a weight-increasing structure connected to the seed crystal holder body.
  • the seed crystal holder further includes a cooling structure provided on the connecting rod, and the cooling structure cools the cooling medium in the channel.
  • the seed crystal holder further includes a driving mechanism and a stirring mechanism.
  • the other end of the connecting rod is connected to the driving mechanism.
  • the driving mechanism drives the seed crystal holder body around the connecting rod through the connecting rod.
  • the axis of the connecting rod rotates; the stirring mechanism is connected to the seed crystal holder body, and the stirring mechanism stirs the melt used for crystal growth.
  • the stirring mechanism includes a mounting rod and a stirring paddle, and the stirring paddle is located on a side of the seed crystal bonding surface away from the connecting rod.
  • the number of the stirring mechanisms is multiple, and the plurality of stirring mechanisms are arranged around the seed holder body.
  • the stirring mechanism is made of one or more of tungsten alloy and high-temperature ceramics.
  • the seed crystal holder body includes at least two sub-parts, each of the at least two sub-parts is provided with a half groove; the seed crystal holder further includes a locking structure and a locking structure.
  • the connecting structure is provided at one end of the connecting rod and the seed crystal holder body; the at least two sub-parts are spliced so that the half-slots on each of the at least two sub-parts are spliced into a snap-in connection slot, the clamping structure is clamped in the clamping slot; the locking structure fixes the spliced at least two sub-parts.
  • the at least two sub-parts include a first sub-part and a second sub-part with the same structure; the first sub-part and the second sub-part are axially symmetrical with respect to the axis of the connecting rod. set up.
  • the engaging groove is a first groove body and a second groove body arranged along the axial direction of the connecting rod, and the first groove body is closer to the seed crystal than the second groove body.
  • the snap-in structure is in the shape of a polyhedron.
  • the locking structure includes an annular groove and a locking ring; the annular groove is arranged around the outer wall of the seed crystal holder body, and the locking ring is sleeved on the spliced at least two sub-units. outside and arranged in the annular groove.
  • the seed crystal holder further includes an annular protective holder, and the protective holder is provided with a shape similar to the shape of the seed crystal holder body. Matching accommodation cavity; the protective bracket is arranged around the seed crystal holder body, and the protective bracket is arranged around one end of the connecting rod connected to the seed crystal holder body.
  • the seed crystal holder further includes an annular first protective sleeve, the first protective sleeve is set outside the connecting rod, and the first protective sleeve is located between the connecting rod and the protective sleeve. between care.
  • the connecting rod includes a first outer diameter segment and a second outer diameter segment along the axial direction of the connecting rod; the outer diameter of the first outer diameter segment is smaller than that of the second outer diameter segment. outer diameter, the first outer diameter section is closer to the seed crystal holder body than the second outer diameter section; the first protective sleeve includes a first inner diameter section and a second inner diameter along the axial direction of the connecting rod section; the outer diameter of the first inner diameter section is smaller than the inner diameter of the second inner diameter section, the first inner diameter section matches the first outer diameter section, the second inner diameter section matches the second outer diameter section segment matching.
  • a side surface of the protective bracket away from the connecting rod is provided with an annular second protective sleeve, the second protective sleeve is embedded in the protective bracket, and the second protective sleeve arranged around the accommodation cavity.
  • an end of the second protective sleeve away from the connecting rod is attached to the seed crystal.
  • a first groove is provided on the side surface of the protective bracket away from the connecting rod; the diameter of the first groove is larger than the diameter of the side of the accommodation cavity away from the connecting rod.
  • the diameter of the opening; the first groove includes a communication portion connected to the opening and an annular portion surrounding the communication portion; the bottom surface of the annular portion and the seed bonding surface are located on the same plane;
  • the annular protective sleeve is arranged on the bottom surface of the annular part.
  • the diameter of the first groove is 5 mm to 10 mm larger than the diameter of the opening.
  • graphite paper is adhered to the bonding surface of the seed crystal, and the graphite paper protrudes from a side of the second protective sleeve away from the connecting rod in a direction away from the connecting rod. surface.
  • the seed crystal bonding device includes one or more bonding components.
  • the bonding components include a support component and a pressure component.
  • the support component The seed crystal holder is supported, and the pressing member applies pressure, and the pressure presses the seed crystal holder and the seed crystal on the seed crystal holder toward each other.
  • the support component includes a first pressure part and a second pressure part
  • the pressure applying component includes a first pressure plate
  • the side wall of the first pressure part includes at least one first vent hole
  • the second pressing piece is nestedly connected to the first pressing piece; during the bonding and fixing process of the seed crystal, the seed crystal is placed on the upper surface of the second pressing piece, and the seed crystal holder is placed on the seed crystal.
  • the upper surface of the crystal; the first pressure plate applies pressure to the seed crystal support.
  • the bottom of the first pressing member includes a second through hole
  • the bottom of the second pressing member includes a first protrusion
  • the first protrusion and the second through hole cooperate with each other to achieve the Nested connection of the first pressing part and the second pressing part.
  • the cross-sectional diameter of the first exhaust hole includes 0.01mm-10mm.
  • the vertical distance between the first exhaust hole and the upper surface of the second pressure part is between 0.2 mm and 5 mm. within the range.
  • the side wall of the second pressing member includes at least one second vent hole, and the first vent hole at least partially corresponds to the second vent hole.
  • the cross-sectional diameter of the second exhaust hole includes 0.01mm-10mm.
  • the vertical distance between the second exhaust hole and the upper surface of the second pressure part is in the range of 0.2mm-5mm.
  • the height of the second pressing part is smaller than the height of the first pressing part.
  • the seed crystal holder is threadedly connected to the first pressing member.
  • the bottom of the first pressure plate includes a second protrusion
  • the upper part of the seed crystal support includes a second groove
  • the second protrusion cooperates with the second groove to realize the first The connection between the pressure plate and the seed crystal holder.
  • the support component includes an annular base, the annular base and a cover, the seed crystal holder is placed on the annular base;
  • the cover includes an annular side wall and a cover plate, the side wall Set outside the annular base, the cover exerts pressure on the seed crystal on the seed crystal holder.
  • it also includes a first connecting member and a second connecting member, the first connecting member is provided on the annular base, and the second connecting member is provided on the cover; the first connecting member is provided on the annular base, and the second connecting member is provided on the cover;
  • the connecting piece is detachably connected to the second connecting piece; when the first connecting piece is connected to the second connecting piece, the cover plate of the cover exerts pressure on the seed crystal on the seed crystal holder.
  • a locking structure is provided on the base, and the locking structure fixes the seed crystal holder to the annular base.
  • the side of the seed crystal holder away from the seed crystal bonding surface is provided with a connecting threaded hole
  • the locking structure includes a locking disk, a locking piece and a locking nut.
  • the locking piece It includes a tray, a first threaded rod and a second threaded rod, the tray supports the side of the seed crystal holder away from the seed crystal bonding surface, the first threaded rod cooperates with the connecting threaded hole;
  • the locking plate is provided with a mounting hole, the second threaded rod passes through the mounting hole, and the locking nut cooperates with the second threaded rod; the locking nut and the tray are respectively located at the Two sides of the locking disk along the axis direction of the mounting hole.
  • the tray is made of elastic material.
  • a supporting structure is provided on the inner wall of the annular base, and the supporting structure includes an annular connecting plate, an annular supporting plate and an annular supporting protrusion; the outer ring connection of the annular supporting plate The annular connecting plate, the inner ring of the annular supporting plate is provided with the annular supporting protrusion, the annular supporting protrusion supports the seed crystal holder; the annular connecting plate is connected to the annular base inner wall.
  • a bubble removal device is provided on the cover, and the bubble removal device removes bubbles between the seed crystal and the seed crystal holder.
  • the bubble removal device includes a slot, an insert plate and a roller; the slot is provided on the cover, the insert plate is located in the slot, and the roller is provided on the cover. One end of the inserting plate; the inserting plate moves in the slot to drive the roller to roll the seed crystal.
  • the other end of the plug-in board is provided with a pull ring.
  • the number of the bonding components is multiple, the support component includes a support plate, the support plate supports the seed crystal and the seed crystal holder, and the seed crystal is located on the support plate. between the disk and the seed crystal holder; the seed crystal bonding device also includes a support frame and a plurality of pressure driving parts provided on the support frame, the support disk is provided on the support frame, so The seed crystal bonding device includes a plurality of bonding components, and a plurality of pressure driving members are respectively connected to a plurality of the pressure members; the pressure driving member causes the pressure member to exert an orientation on the seed crystal holder. The pressure of the support plate.
  • the support frame includes a plurality of support rods extending in a vertical direction, and the plurality of support rods are arranged at intervals along the circumference of the support plate; a plurality of the pressure driving members are provided on On at least one of the support rods, a plurality of the pressure driving members are arranged at intervals along the vertical direction, and a plurality of seed bonding assemblies are arranged at intervals along the vertical direction.
  • the pressure driving member includes a pneumatic pressure driving member or a hydraulic pressure driving member.
  • the support rod provided with the pressure-applying driving member is provided with a pressure-transmitting medium channel, and at least one of the pressure-applying driving members is connected to the pressure-transmitting medium channel through a valve.
  • the support plate is rotatably disposed on the support frame, the rotation axis of the support plate is parallel to the support rod, and the seed bonding device further includes a rotation drive member, The rotation driving member is connected with the support plate to drive the support plate to rotate.
  • the rotational driving member includes a magnetic element, a power source and a magnetic driving member; the magnetic driving member is magnetically coupled to the magnetic element, the magnetic element is fixed on the support plate, and the magnetic driving member is magnetically coupled to the magnetic element.
  • the driving member is fixed on the output end of the power source; the power source drives the magnetic driving member to rotate to drive the magnetic element to drive the support plate to rotate.
  • the pressure-applying component includes a limiting pressure plate provided on the support frame
  • the pressure-applying driving member includes a first sub-driving member and a second sub-driving member
  • the first sub-driving member The first sub-driving part and the second sub-driving part are arranged at intervals along the circumference of the limiting pressure plate, and the The first sub-driving member and the second sub-driving member are both connected to the limiting pressure plate.
  • the seed bonding device further includes a pressure sensor, the pressure sensor being used to determine the pressure exerted by each of the pressure applying components.
  • the seed bonding device further includes a controller, the controller is signally connected to both the valve and the pressure sensor; the controller is configured to: based on the pressure sensor sensed Pressure data adjusts the opening of the valve.
  • a crucible including a crucible body, a driving assembly and a temperature field holding disk.
  • the driving assembly includes a driving source and a connecting mechanism.
  • the connecting mechanism is connected between the driving source and the crucible.
  • the driving assembly drives the crucible body to rotate around the axis of the crucible body relative to the temperature field holding disk; the temperature field holding disk is provided on the connection structure and is located between the driving source and the between the bottom of the crucible body.
  • connection mechanism includes a rotating column and a first supporting tray, the first supporting tray is provided at one end of the rotating column, and the driving source is connected to the other end of the rotating column.
  • the first supporting tray includes a plurality of stepped grooves arranged concentrically.
  • connection mechanism includes a second supporting tray, the second supporting tray is annular, the second supporting tray is located between the first supporting tray and the driving source, and the second supporting tray is annular.
  • the inner ring of the supporting tray is fixed to the outer wall of the rotating column; the second supporting tray and the temperature field holding disk are connected through a ball structure.
  • the material of the temperature field holding disk is at least one of mullite, corundum, and alumina.
  • the crucible further includes a plurality of telescopic support rods, one end of the telescopic support rods is connected to the bottom of the temperature field holding plate.
  • the crucible further includes a connecting ring and a locking mechanism, and a locking hole is provided on the side wall of the connecting ring; the connecting ring is sleeved on the output shaft of the driving source and the rotating Outside the other end of the column, the locking hole cooperates with the locking mechanism to fix the connecting ring with the output shaft of the driving source and the rotating column.
  • One or more embodiments of this specification provide a crystal growth method, using the seed crystal holder as described in the previous embodiment, including the following steps: bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body; The seed crystal holder with the seed crystal attached to it is sunk into the melt used for crystal growth in the crucible, and the surface of the side of the seed crystal away from the seed crystal holder is located at the highest temperature of the melt. at the position; use the upward pulling method Growing crystals.
  • a part of the seed holder body is located in the melt, and another part of the seed holder body is located outside the melt.
  • the seed crystal holder can rotate around the axis of the connecting rod, and the crucible can rotate around the axis of the crucible; the axis of the connecting rod is parallel to the axis of the crucible; the use Growing crystals by the upward pulling method includes controlling the rotation of the seed holder and the crucible in opposite directions.
  • the rotation speed of the seed crystal holder is 0 rpm-20 rpm; the rotation speed of the crucible is 0 rpm-20 rpm.
  • the product of the value of the rotation speed of the seed holder and the value of the rotation speed of the crucible is 20 or 150.
  • the method before sinking the seed crystal holder with the seed crystal adhered to it into the melt used for crystal growth, the method further includes: heating the melt to 1720°C to 1780°C.
  • the use of the upward pulling method to grow crystals includes: keeping the seed crystal holder with the seed crystal attached to sink into the melt for 10 to 30 minutes; The pulling speed pulls the seed crystal support to perform crystal growth.
  • the use of the upward pulling method to grow the crystal includes: after the crystal grows for 10h to 30h, the crystal is pulled away from the melt at a pulling speed of 30mm/h-40mm/h, and the The distance between the crystal and the melt surface is 15 mm to 25 mm.
  • bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body includes: making the diameter of the seed crystal 5 mm-10 mm larger than the diameter of the seed crystal holder body, and the seed crystal The crystal protrudes from the side surface of the protective bracket away from the connecting rod by 0.1mm-0.2mm.
  • Figure 1 is an exemplary structural diagram of a seed crystal holder according to some embodiments of this specification.
  • FIG. 2A is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification.
  • 2B is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification.
  • 2C is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification.
  • Figure 3 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification.
  • Figure 4 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification.
  • Figure 5 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification.
  • Figure 6A is an exemplary front view of the first sub-section in accordance with some embodiments of the present disclosure.
  • Figure 6B is an exemplary front view of the second sub-portion shown in accordance with some embodiments of the present specification.
  • Figure 6C is an exemplary front view of the first sub-part and the second sub-part after splicing according to some embodiments of this specification;
  • Figure 7 is an exemplary top view of another seed crystal support according to some embodiments of this specification.
  • Figure 8 is an exemplary cross-sectional view of a locking structure according to some embodiments of the present specification.
  • Figure 9 is an exemplary bottom view of a locking structure according to some embodiments of the present specification.
  • Figure 10 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification.
  • Figure 11 is an exemplary module diagram of a seed bonding device according to some embodiments of this specification.
  • Figure 12 is an exemplary structural diagram of a seed bonding device according to some embodiments of this specification.
  • Figure 13 is an exemplary structural diagram of a seed crystal assembly according to some embodiments of this specification.
  • Figure 14 is an exemplary cross-sectional view of another seed bonding device according to some embodiments of the present specification.
  • Figure 15A is an exemplary structural diagram of a locking member according to some embodiments of this specification.
  • Figure 15B is an exemplary top view of a bubble removal device according to some embodiments of the present specification.
  • Figure 16 is an exemplary structural diagram of another seed bonding device according to some embodiments of this specification.
  • Figure 17 is an exemplary block diagram of a crucible according to some embodiments of the present specification.
  • Figure 18 is an exemplary structural diagram of a connection mechanism according to some embodiments of this specification.
  • Figure 19 is an exemplary structural diagram of a second supporting tray according to some embodiments of this specification.
  • Figure 20A is an exemplary structural diagram of a telescopic support rod according to some embodiments of this specification.
  • Figure 20B is an exemplary structural diagram of a temperature field holding disk according to some embodiments of this specification.
  • Figure 21 is an exemplary structural diagram of a connecting ring according to some embodiments of this specification.
  • Figure 22 is an exemplary flow chart of a crystal growth method according to some embodiments of this specification.
  • Figure 23 is a schematic diagram of a generated crystal according to some embodiments of the present specification.
  • system means of distinguishing between different components, elements, parts, portions or assemblies at different levels.
  • said words may be replaced by other expressions if they serve the same purpose.
  • Figure 1 is an exemplary structural diagram of a seed crystal holder according to some embodiments of this specification.
  • This specification provides a seed crystal holder 100, which can be used to achieve crystal growth.
  • the seed crystal 130 needs to be bonded to the seed crystal holder 100.
  • the seed crystal holder 100 can be arranged on the seed crystal bonding device 30.
  • the raw materials for preparing the crystal are placed in the crucible 400. 100 and the temperature field where the crucible 400 is located are heated, causing the raw materials to volatilize into gas phase components and move to the upper seed crystal 130, thereby realizing crystal growth by the liquid phase method.
  • the aforementioned seed crystal 130 may include a semiconductor seed crystal, for example, a silicon carbide seed crystal.
  • FIGS. 12-16 and its related descriptions for more information about the crucible 400, please refer to FIGS. 17-20B and its related descriptions.
  • the seed crystal holder 100 may include a seed crystal holder body 110 and a connecting rod 120 .
  • the seed crystal holder body 110 is used to fix the seed crystal 130.
  • the material of the seed crystal holder body 110 can be graphite.
  • the seed crystal holder body 110 can bond the seed crystal 130 under certain conditions (for example, vacuuming, heating, etc.).
  • the seed crystal holder body 110 may be configured in a columnar shape (the cylindrical seed crystal holder body 110 shown in Figure 1), a cone shape (the frustum seed crystal holder body 110 shown in Figure 10), or other feasible shapes.
  • the connecting rod 120 is used to connect the seed crystal holder body 110 and the driving device (such as the driving mechanism 150 below), so that the driving device can drive the seed crystal holder body 110 to move along the axial direction of the connecting rod 120 or around the axis of the connecting rod 120 Turn.
  • the seed crystal holder body 110 is fixed on one end of the connecting rod 120 .
  • the seed crystal holder body 110 and the connecting rod 120 can be connected in various ways.
  • a connecting threaded hole is provided on the side of the seed crystal holder body 110 away from the seed crystal bonding surface 111, and a connecting thread can be provided on the connecting rod 120.
  • the connecting rod 120 can be connected to the aforementioned connecting threaded hole through the connecting thread. The cooperation realizes threaded connection with the seed crystal holder body 110.
  • the connecting rod 120 can also be connected to the seed crystal holder body 110 in other possible connection ways. For other possible connection ways, please refer to Figures 5 to 7 and their related descriptions.
  • a seed bonding surface 111 is provided on the side of the seed holder body 110 away from the connecting rod for bonding the seed crystal 130 to the seed holder body 110 .
  • the seed crystal bonding surface 111 may be a flat surface to ensure that the seed crystal 130 can be more stably bonded to the seed crystal holder body 110 .
  • the seed crystal bonding surface 111 can be provided on the end surface of the seed crystal holder body 110 .
  • the seed crystal bonding surface 111 can be on the end surface of the cylinder.
  • the seed crystal bonding surface 111 can be on the end face with a larger area in the truncated cone.
  • the connecting rod 120 can exert pressure on the seed crystal holder body, and the seed crystal 130 can be stably bonded to the seed crystal holder.
  • the crystal bonding surface 111 it helps to improve the quality of crystal growth.
  • the seed crystal holder body 110 may also include a hollow first inner cavity 112 , and a channel 121 for cooling medium to circulate may be provided in the connecting rod 120 .
  • the channel 121 is connected to the first inner cavity 112 .
  • the cavities 112 are connected.
  • the first inner cavity 112 is an internal space formed by the hollow structure of the seed crystal holder body 110 and is used to collect cooling medium to reduce the temperature of the seed crystal holder body 110 .
  • the shape of the first inner cavity 112 matches the shape of the seed holder body 110 so that the wall thickness of the seed holder 100 is uniform, thereby achieving uniform heat transfer.
  • the seed holder body 110 can be a cylinder, a cube or a polygonal prism, and correspondingly, the shape of the first inner cavity 112 can also be a cylinder, a cube or a polygonal prism, etc.
  • the connecting rod 120 may be a hollow rod to form a channel to pass the cooling medium.
  • the cooling medium refers to the fluid used to cool the seed crystal support, such as helium, argon, etc.
  • the cooling medium may be an inert gas (eg, room temperature argon).
  • the channel 121 in the connecting rod 120 is connected to the first inner cavity 112, and the cooling medium can enter the first inner cavity 112 of the seed crystal holder body 110 through the channel 121, thereby performing maintenance on the seed crystal holder body 110. Cooling, and because the temperature of the melt in the crucible 400 is relatively high, cooling the seed crystal holder body 110 can increase the temperature gradient inside the seed crystal holder body 110 and help accelerate the formation of crystals.
  • the seed holder body 110 may also be provided with a first through hole 113 communicating with the first inner cavity 112 .
  • First through hole 113 The first inner cavity 112 may be connected to the furnace cavity of the crystal growth furnace 200 for discharging the cooling medium from the first inner cavity 112 into the crystal growth furnace 200 .
  • the seed holder body 110 may be provided with one or more first through holes 113 .
  • the shape of the first through hole 113 may be circular, elliptical, or any other shape.
  • the first through hole 113 may be provided on any surface of the seed holder body 110 except the seed bonding surface 111 . As shown in FIG. 2A , a plurality of first through holes 113 are provided on the upper wall of the seed crystal holder body 110 .
  • the first inner cavity 112 is connected to the furnace cavity through the first through hole 113, so that the cooling medium that has basically lost its effectiveness can be discharged from the first inner cavity 112 through the first through hole 113, so that new cooling medium can be continuously supplied.
  • Entering the seed crystal holder body 110 through the channel 121 helps to improve the cooling effect of the seed crystal holder body 110. In addition, it can also prevent the internal pressure of the seed crystal holder body 110 from rising, ensuring the safe use of the seed crystal holder body 110.
  • a cooling medium diffusion structure 114 disposed in the first inner cavity 112 may also be provided in the first inner cavity 112 .
  • the cooling medium diffusion structure 114 may be used to assist the diffusion of the cooling medium in the first inner cavity 112 .
  • the cooling medium diffusion structure 114 can be a spiral blade disposed at the outlet of the channel 121 in the first inner cavity 112. When the cooling medium enters the first inner cavity 112 through the channel 121, the cooling medium can exert force on the aforementioned spiral blade. , thereby causing the spiral blades to rotate, thereby driving the incoming cooling medium to be scattered everywhere in the first inner cavity 112 along with the spiral blades.
  • Some embodiments of this specification use the cooling medium diffusion structure 114 to help diffuse the cooling medium evenly in the first inner cavity 112, thereby ensuring that various positions of the seed crystal holder body 110 can be cooled evenly, so that the seed crystal holder body 110 can be evenly cooled.
  • the temperature distribution within 110 is more uniform.
  • cooling medium diffusion structure 114 may include one or more hollow tubular structures.
  • the aforementioned tubular structure may be a round tube, a square tube or a tubular structure with other cross-section shapes.
  • the cooling medium diffusion structure 114 includes multiple tubular structures
  • one end of the multiple tubular structures has an inlet connected to the channel 121 and the other end may include multiple outlets.
  • the multiple outlets may respectively guide the cooling medium into the first inner cavity 112 .
  • the temperature of the seed crystal holder body 110 can also be detected by a temperature detection device (for example, an external thermal imager) to obtain corresponding temperature information (for example, a thermal infrared image).
  • the seed crystal holder 100 can communicate with a processor (not shown), which can be used to control crystal generation.
  • the processor can determine the location where temperature adjustment is required based on the temperature information.
  • the preset temperature adjustment condition may be that the temperature difference of each area in the seed crystal holder body 110 does not exceed the preset temperature difference threshold.
  • the processor can determine the temperature distribution of the seed crystal holder body 110 based on the aforementioned temperature information.
  • the processor may determine the aforementioned local location as a location that requires temperature adjustment.
  • the processor can determine the corresponding cooling medium diffusion structure 114 based on the location where temperature adjustment is required, and control the input of the cooling medium to the corresponding cooling medium diffusion structure 114 to cool the location, and continuously obtain the cooled seed crystals.
  • the temperature information indicates that the location requiring temperature adjustment does not meet the preset temperature adjustment conditions.
  • the processor can determine the corresponding cooling medium diffusion structure 114 through the temperature adjustment correspondence table and the location where temperature adjustment is required.
  • the aforementioned temperature adjustment correspondence table may include the temperature adjustment position corresponding to each of the plurality of tubular structures in the cooling medium diffusion structure 114, that is, the corresponding position of the outlet of each of the plurality of tubular structures.
  • the cooling medium diffusion structure 114 by arranging the cooling medium diffusion structure 114 into multiple tubular structures, local temperature can be adjusted in a directional manner to avoid local temperatures being too high to reduce the quality of crystal formation.
  • the temperature of crystal generation can be automatically adjusted, thereby effectively improving the quality of crystal generation.
  • the tubular structure can be spirally wrapped around the inner wall of the first inner cavity 112 , with one end of the inlet connected to the channel 121 , and finally exiting from the first through hole 113 .
  • the cooling medium diffusion structure 114 can be a square tube, and the square tube can be spirally wrapped around and completely attached to all inner walls or designated areas of the first inner cavity 112 .
  • the aforementioned tubular structure can also be extended outside the crystal growth furnace 200 .
  • the cooling medium in the tubular structure can cool down the seed holder body 110.
  • the cooled cooling medium can continue to be exported to the outside of the crystal growth furnace 200 through the tubular structure.
  • controllability of cooling can also be improved through the aforementioned settings.
  • the cooling medium can be continued to be input into the aforementioned tubular structure by stopping, so that the current cooling medium can stay at a designated location.
  • new cooling medium can be continuously input into the aforementioned tubular structure. With the new cooling After the medium enters, the used cooling medium will flow out of the aforementioned tubular structure to ensure the controllability of the cooling process.
  • the cooling medium diffusion structure 114 may include a housing 1141 , a second inner cavity 1142 is formed in the housing 1141 , and the channel 121 is connected to the second inner cavity 1142 so that the cooling medium can enter. in the second inner cavity 1142.
  • the housing 1141 is provided with a plurality of diffusion holes 1143.
  • the diffusion holes 1143 communicate with the first inner cavity 112 and the second inner cavity 1142, so that the cooling medium in the second inner cavity 1142 can diffuse to the first inner cavity through the diffusion holes 1143. 112 everywhere.
  • the shape of the aforementioned housing 1141 can be adapted to the first inner cavity 112 .
  • the housing 1141 can be in various shapes, such as cuboid, cube, cylinder or other shapes.
  • the material of the housing 1141 can be graphite, high-temperature ceramics, stainless steel, etc.
  • the cooling medium can enter the second inner cavity 1142 through the channel 121, and then diffuse through the second inner cavity 1142.
  • the holes 1143 enter the first inner cavity 112 to help the cooling medium diffuse more quickly while preventing the cooling medium from accumulating at the outlet of the channel 121 .
  • the seed holder 100 may further include a cooling device (not shown).
  • the cooling device is a device that provides cooling medium to the seed holder body 110, and can deliver the cooling medium to the channel 121.
  • the cooling device can output the cooling medium at a certain flow rate, so that the cooling medium flows in the channel 121 at a preset flow rate.
  • the outlet of the cooling device can be connected to the channel 121, and a power structure (such as a transfer pump) can also be provided in the cooling device or the channel to provide power for the cooling medium, drive it away from the cooling device, and make the cooling medium flow at a preset flow rate. It flows in the channel 121 toward the seed crystal support body 110 .
  • the preset flow rate of the cooling medium is greater than 0.4m/s.
  • the cooling medium may be at room temperature. In other embodiments, the cooling medium may be cooled to a certain temperature, such as 10°, 15°, 20°, etc. It is worth noting that because the temperature in the crystal growth furnace 200 equipped with the seed crystal holder body 110 is relatively high, the cooling medium with a low flow rate may be heated. In some embodiments of this specification, the preset flow rate is set to greater than 0.4 m/s, can prevent the cooling medium from being heated, thereby ensuring the cooling effect of the cooling medium on the seed crystal holder body 110.
  • the seed crystal holder body 110 is configured to have a structure with the first inner cavity 112, the mass of the seed crystal holder body 110 is reduced, which may cause shaking. Therefore, in some embodiments of this specification, the seed crystal holder 100 may also include a weight-increasing structure (not shown), and the weight-increasing structure may be welded or bonded to the side of the seed crystal holder body 110 away from the connecting rod 120 connected in other ways.
  • the weight-increasing structure can be disposed in the first inner cavity 112, or can be disposed on the outer wall of the seed crystal holder body 110 (for example, on any outer wall except the seed crystal bonding surface 111).
  • a weight-increasing structure may be used to increase the weight of the seed crystal support body 110 .
  • the weight-increasing structure can be a variety of shapes, such as plate-like structure, ring-like structure, etc.
  • the material of the weight-increasing structure can be stainless steel, high-temperature ceramics, tungsten alloy, etc.
  • the seed crystal holder body 110 by connecting the weight-increasing structure to the seed crystal holder body 110, the seed crystal holder body 110 can be weighted, preventing the seed crystal holder body 110 from shaking during the crystal growth process, and contributing to the stability of the crystal. generated to ensure the quality of the grown crystals.
  • the seed crystal holder 100 may also include a cooling structure (not shown), and the cooling structure may be provided on the connecting rod 120 for cooling the cooling medium in the channel 121 .
  • the cooling structure may include a variety of structures, such as condensers, expansion valves, etc. or any combination thereof.
  • the cooling structure may be an annular structure attached to the inner wall of the connecting rod 120. When the cooling medium passes through the channel 121, the cooling structure may cool the cooling medium in the channel 121 by reducing the pressure of the cooling medium and/or exchanging heat with the cooling medium. .
  • Some embodiments of this specification can lower the temperature of the cooling medium by arranging a cooling structure, thereby preventing the cooling medium from being heated too quickly by the surrounding environment, and trying to ensure that the cooling medium enters the first inner cavity 112 at a lower temperature, thereby allowing the cooling medium to enter the first inner cavity 112 at a lower temperature.
  • the inner cavity 112 can absorb the heat of the seed crystal holder body 110 more quickly and efficiently, which helps to improve the cooling effect of the seed crystal holder body 110 .
  • the cooling structure includes a cooling circuit 123 that delivers cooling fluid for cooling the cooling medium.
  • cooling circuit 123 is provided outside the connecting rod.
  • the cooling structure may include a cooling jacket 124 , the cooling jacket 124 is set on the connecting rod 120 , and the cooling circuit 123 is provided on the cooling jacket 124 .
  • the cooling fluid may be a cooling liquid, such as water.
  • cooling circuit 123 may include an input channel and an output channel.
  • the input and output channels may be parallel to the channel 121 conveying the cooling medium.
  • the output channel and the output channel may be arranged in a spiral shape surrounding the channel 121 that transports the cooling medium.
  • the seed crystal holder 100 may further include a driving mechanism 150 and a stirring mechanism 160 .
  • the driving mechanism 150 refers to a mechanism that converts other energy sources into mechanical energy and generates kinetic energy.
  • the driving mechanism 150 may include a variety of types, such as a motor, a pneumatic source, a hydraulic source, etc.
  • the driving mechanism 150 may be connected to the other end of the connecting rod 120 , where the other end of the connecting rod 120 refers to the end away from the seed holder body 110 .
  • the driving mechanism 150 can drive the seed crystal holder body 110 to rotate around the axis A of the connecting rod 120 through the connecting rod 120 .
  • the driving structure 150 By arranging the driving structure 150, during the crystal growth process, the seed crystal holder 100 can rotate at a required speed to ensure stable growth of the crystal.
  • the stirring mechanism 160 can stir the melt 140 for crystal growth. As shown in FIGS. 3 and 4 , the stirring mechanism 160 can be connected to the seed crystal holder body 110 . When the driving mechanism 150 drives the seed crystal holder 100 to rotate, the stirring mechanism 160 can stir the melt 140 .
  • the stirring mechanism 160 can be in various shapes, such as rod-shaped, plate-shaped or other various irregular shapes. It should be noted that during the crystal growth process, the stirring mechanism 160 needs to extend below the liquid level of the melt 140 to stir the melt 140 .
  • the driving mechanism 150 drives the seed crystal holder body 110 to rotate around the axis A of the connecting rod 120.
  • the rotation of the seed crystal holder body 110 can also drive the stirring mechanism 160 to rotate around the axis A of the connecting rod 120, thereby achieving Stirring the melt 140 can increase the flow rate of the melt 140, help improve the mass transfer route of key substances in the melt 140, ensure uniform mass transfer, and improve crystal growth efficiency.
  • the stirring mechanism 160 may include a mounting rod 161 and a stirring paddle 162 .
  • One mounting rod 161 corresponds to one stirring paddle 162 .
  • the shape of the stirring blade 162 may include a variety of shapes, such as a paddle stirring blade, a disc turbine blade, etc.
  • the stirring paddle 162 is located on the side of the seed crystal bonding surface 111 away from the connecting rod 120 .
  • the stirring paddle 162 can extend into the inside of the melt 140 to stir the melt 140 .
  • the stirring mechanism 160 can include a mounting rod 161 and a stirring paddle 162. One end of the mounting rod 161 is connected to the seed crystal holder body 110, and the other end is connected to the stirring paddle 162.
  • the operation of the driving mechanism 150 can drive The seed crystal holder body 110 rotates along the axis A, and The mounting rod 161 is driven to rotate along the axis A, and the rotation of the mounting rod 161 can drive the stirring paddle 162 connected thereto to move, so that the stirring paddle 162 stirs the melt 140 .
  • the number of stirring mechanisms 160 may be multiple, and the plurality of stirring mechanisms 160 are arranged around the seed holder body.
  • the stirring mechanism 160 may be centrally symmetrically arranged relative to the axis A.
  • the seed crystal holder 100 may include two stirring mechanisms 160 , wherein the two stirring mechanisms 160 are arranged centrally symmetrically based on the axis A.
  • the number of the stirring mechanism 160 may also be single.
  • the seed crystal holder 100 may include a single stirring mechanism 160, and the stirring paddle 162 of the single stirring mechanism 160 may include multiple blades.
  • the stirring mechanism 160 rotates around the axis A
  • the blades of the aforementioned stirring paddle 162 may rotate around the axis A.
  • the center of the paddle 162 rotates, which helps increase the flow rate of the melt 140 .
  • the material of the stirring mechanism 160 may be one or more of tungsten alloy and high-temperature ceramics.
  • the stirring mechanism 160 made of tungsten alloy, high-temperature ceramics and other materials can have higher stability in the high-temperature melt 140, effectively increasing the service life of the stirring mechanism 160.
  • the seed holder body 110 includes at least two sub-sections. As shown in FIGS. 6A , 6B and 6C , the seed holder body 110 may include two sub-parts, namely a first sub-part 115 and a second sub-part 116 . The seed holder body may also include three sub-parts, four sub-parts or other numbers of sub-parts. The following describes an embodiment in which the seed holder body 110 includes two sub-parts.
  • the first sub-part 115 and the second sub-part 116 can be spliced to form the seed holder body 110.
  • the seed crystal holder body 110 can be in various shapes such as a table shape or a cylindrical shape, and its sub-parts can be in shapes corresponding to the divided seed crystal holder body 110 .
  • the first sub-part 115 and the second sub-part 116 may be in the shape of a semi-cylinder or a semi-conical cone.
  • the shapes and sizes of different sub-sections of the seed holder body 110 may also be different.
  • the first sub-section 115 may be a three-quarter cylinder
  • the second sub-section 116 may be a quarter cylinder. That is to say, the cross-sectional area of the first sub-portion 115 perpendicular to the axis of the first sub-portion 115 is greater than the cross-sectional area of the second sub-portion 116 perpendicular to the axis of the second sub-portion 116 .
  • the cross section of the first sub-portion 115 perpendicular to the axis of the first sub-portion 115 is bounded by major arcs and straight lines
  • the cross-section of the second sub-portion 116 perpendicular to the axis of the second sub-portion 116 is bounded by minor arcs and straight lines.
  • the splicing of at least two sub-parts of the seed crystal holder body 110 may refer to placing and combining the at least two sub-parts according to a predetermined position, thereby splicing them into a complete seed crystal holder body 110 .
  • At least two sub-parts of the seed holder body 110 can be spliced in various ways. For example, at least two sub-parts can be placed together according to a predetermined position; for another example, one of any two adjacent sub-parts is provided with a positioning groove and the other is provided with a positioning protrusion. It is put into the positioning groove to realize the positioning of two adjacent sub-parts, thereby combining at least two sub-parts together.
  • each of the at least two sub-portions of the seed holder body 110 is provided with a half-slot.
  • a half slot can be understood as a part of a complete snap slot.
  • the splicing of at least two sub-parts causes the half-grooves on each of the at least two sub-parts to be spliced into a complete snap-in groove 170 . That is to say, the sub-section is a part of the seed crystal holder body 110 and the half-slot is a part of the snap-in groove 170.
  • the half-slots are spliced into the snap-in slot.
  • first sub-portion 115 may be provided with a first half-slot 1150
  • second sub-portion 116 may be provided with a second half-slot 1160.
  • the first sub-portion 115 and the second sub-portion 116 are spliced to form the first half-slot.
  • 1150 and the second half-slot 1160 are spliced into the snap-in slot 170 .
  • the first half groove 1150 is located in the first sub-portion 115 and is provided at an end of the first sub-portion 115 connected to the connecting rod 120 .
  • the second half groove 1160 is located in the second sub-portion 116 and is provided at an end of the second sub-portion 116 connected to the connecting rod 120 .
  • the structure of the second half-slot 1160 may be the same as the structure of the first half-slot 1150 , and may be symmetrical about the axis A of the connecting rod 120 .
  • the structures of the first half groove 1150 and the second half groove 1160 may be different.
  • the first half groove 1150 and the second half groove 1160 are spliced to form a locking groove 170, in which the connecting rod 120 and the locking structure 118 can be embedded.
  • the seed crystal holder 100 may also include a locking structure 117 and a clamping structure 118.
  • the snap-in structure 118 is provided at one end of the connecting rod 120 connected to the seed crystal holder body 110 .
  • the clamping structure 118 can be clamped in the clamping groove, so that the connecting rod 120 and the seed crystal holder body 110 are closely connected through the clamping structure 118 .
  • the snap-in structure 118 may include a variety of three-dimensional structures (such as cubes, cylinders, etc.), and is located at the end connecting the connecting rod 120 and the seed holder body 110 .
  • the snap-in structure 118 can be understood as being able to be accommodated in the snap-in groove 170 and not disengaged from the snap-in groove 170 after being snap-locked. There can be multiple ways of engaging the engaging structure 118 and the engaging groove 170. For details, please refer to the relevant description below.
  • the locking structure 117 is provided on the outer wall of the seed holder body 110 and can fix at least two spliced sub-parts (such as the first sub-part 115 and the second sub-part 116 ).
  • the locking structure 117 may include bolts, nuts and protruding structures.
  • the protruding structures are provided on the first sub-part 115 and the second sub-part 116. There are threaded holes in the protruding structures through which the bolts can pass.
  • the threaded holes on the protruding structure of the first sub-part 115 and the threaded holes on the protruding structure of the second sub-part 116 are fixed by nuts, thereby fixing the first sub-part 115 and the second sub-part 116 .
  • the seed crystal holder body 110 and the connecting rod 120 are often connected through threads.
  • the screw-connected part will generate holes due to the existence of undercut grooves, and gas can enter the cavity space, thereby affecting the seed crystal.
  • the average temperature gradient of the body 110 Uniform changes induce the formation of cavities on the crystal growth surface. Therefore, in some embodiments of this specification, by arranging the seed crystal holder body 110 to include at least two sub-parts, the locking structure 117 fixes the at least two sub-parts, and the clamping structure 118 is clamped in the clamping groove, it is possible to The seed holder body 110 and the connecting rod 120 are tightly connected without a space for gas to enter, which solves the problem of the undercut groove. It not only allows the temperature of the seed holder body 110 to change evenly, but also facilitates the subsequent separation of the crystal holders ( Just unlock the locking structure 117), which greatly improves the quality of the prepared crystal.
  • ablation of the seed crystal holder body 110 can achieve the separation of the crystal and the seed crystal holder body 110 after crystal growth.
  • the ablation speed depends on the ablation of the concave thread on the top of the seed crystal holder body 110. In the orientation of the equipment, when there is no attachment in the threaded hole on the top of the seed crystal holder body 110, the ablation speed will gradually slow down after about one third of the ablation in the upwind direction for 12 hours.
  • a combination surface will appear at the splicing location of multiple sub-parts. As shown in Figure 7, there is a combination surface B where the first sub-part 115 and the second sub-part 116 are spliced.
  • the combination surface B can play a certain guiding role in the ablation process, speed up the later ablation speed, and help improve the ablation process. The efficiency of crystal support separation.
  • At least two sub-parts of the seed holder body 110 include a first sub-part 115 and a second sub-part 116 with the same structure.
  • the first sub-part 115 and the second sub-part 116 are symmetrical about the axis of the connecting rod. Axisymmetric setup.
  • the structure of each sub-part may be the same and arranged evenly and symmetrically.
  • the structures of the first sub-part 115 and the second sub-part 116 can be the same.
  • the portion 116 may be arranged symmetrically with the axis A of the connecting rod 120 as the axis of symmetry.
  • At least two sub-parts of the seed holder body 110 have the same structure and are arranged symmetrically, which can facilitate production and manufacturing, which may improve the assembly efficiency of the seed holder body 110 .
  • the engaging grooves 170 are arranged along the axis A direction of the connecting rod 120 to form a first groove body 171 and a second groove body 172 .
  • the first groove body 171 is closer to the seed bonding surface than the second groove body 172; the cross-sectional area of the first groove body 171 along the axis A perpendicular to the connecting rod 120 is larger than that of the second groove body 172 along the axis A perpendicular to the connecting rod 120.
  • the cross-sectional area of the axis A; the cross-sectional area of the clamping structure 118 along the axis A perpendicular to the connecting rod 120 is greater than the cross-sectional area of the connecting rod 120 along the axis A perpendicular to the connecting rod 120 .
  • the first groove body 171 is used to fix the clamping structure 118
  • the second groove body 172 is used to accommodate the connecting rod 120 . Therefore, correspondingly, the area of the cross-section of the snap-in structure 118 along the axis A perpendicular to the connecting rod 120 is greater than the area of the cross-section of the connecting rod 120 along the axis A perpendicular to the connecting rod 120 .
  • the shape of the first groove 171 is consistent with the snap-in connection.
  • the shape of the structure 118 is adapted so that the clamping structure 118 can be clamped in the first groove 171 .
  • the shape of the second slot 172 is adapted to the shape of the end of the connecting rod 120 close to the clamping structure 118 .
  • the connecting rod 120 The end close to the clamping structure 118 is located in the second groove body 172 so that the clamping structure 118 fixes the relative position of the connecting rod 120 and the seed crystal holder body 110 .
  • the connecting rod 120 and the seed crystal holder body 110 are embedded and combined through the snap-in structure 118, which helps to avoid the aforementioned cavity problem caused by the existence of the undercut groove and ensures that the connecting rod 120 and the seed crystal holder body 110 are stable connection.
  • the following description takes at least two sub-portions including a first sub-portion 115 (having a first half-slot 1150 thereon) and a second sub-portion 116 (having a second half-slot 1160 thereon) as an example.
  • the first half groove 1150 can be divided into a first upper half groove 1151 and a first lower half groove 1152 .
  • the second half groove 1160 can be divided into a second upper half groove 1161 and a second lower half groove 1162 .
  • FIG. 6A the first half groove 1150 can be divided into a first upper half groove 1151 and a first lower half groove 1152 .
  • the second half groove 1160 can be divided into a second upper half groove 1161 and a second lower half groove 1162 .
  • the first upper half groove 1151 and the second upper half groove 1161 can be spliced to form the first groove body 171
  • the first lower half groove 1152 and the second lower half groove 1162 can be spliced to form the second groove body 172 .
  • the snap-in structure 118 may be in the shape of a polyhedron. As shown in FIG. 7 , the cross-section of the snap-in structure 118 may be a cube. In some embodiments of this specification, by setting the snap-in structure 118 in a polyhedral shape, it is possible to ensure that the snap-in structure 118 rotates synchronously when the seed crystal holder body 110 rotates. It can be understood that if the seed crystal holder body 110 does not rotate when generating crystals, the clamping structure 110 may also be a cylinder.
  • the snap-in groove 170 and the snap-in structure 118 can have various shapes, as long as the snap-in structure 118 can be locked into the snap-in slot 170 without being detached from the snap-in slot 170 .
  • the engaging groove 170 may be a trapezoidal groove, that is to say, the cross-sectional areas perpendicular to the axis A at different positions of the engaging groove 170 are different. The closer to the seed bonding surface 111 , the vertical cross-sectional area of the engaging groove 170 is The cross-sectional area along axis A is larger.
  • the clamping structure 118 may also be a quadrangular pyramid.
  • the locking structure 117 may include an annular groove 1171 and a locking ring 1172.
  • the annular groove 1171 can be arranged around the outer wall of the seed crystal holder body 110 , and the locking ring 1172 is set outside at least two sub-parts (such as the first sub-part 115 and the second sub-part 116 ) after splicing, and is arranged in the annular groove 1171 Inside.
  • the outer wall of the annular groove 1171 is provided with external threads
  • the inner wall of the locking ring 1172 is provided with internal threads.
  • the locking ring 1172 is connected to the annular groove 1171 through a threaded connection, so that the locking ring 1172 is set into the annular groove.
  • the external threads on the outer wall of the annular groove 1171 do not exceed the top of the seed crystal holder body 110 to avoid failure in hot pressing in the later stage.
  • the bottom of the locking ring 1172 and the annular groove 1171 in the locking structure 117 can fit with the seed holder body 110 .
  • the locking ring 1172 surrounds the seed crystal holder body 110 on the outer wall of the seed crystal holder body 110, and can lock at least two spliced sub-parts (such as the first sub-part 115 and the second sub-part 116) to secure the seed crystal holder body 110.
  • 110 is fixed and restricted to realize the fixation of at least two sub-parts, thereby ensuring the tight connection between the seed crystal holder body 110 and the connecting rod 120, and the locking operation is simple and convenient.
  • the seed crystal holder 100 may further include a protection bracket 180 for protecting the seed crystal holder body 110 .
  • the seed crystal holder 100 can also include an annular protective bracket 180.
  • the protective bracket 180 is provided with a receiving cavity 184 that matches the shape of the seed crystal holder body 110.
  • the protective bracket 180 can be arranged around the seed crystal holder body 110. .
  • the protective bracket 180 can also surround the seed crystal bracket body 110 and connect the Rod 120 connects one end.
  • the aforesaid accommodating cavity 184 can accommodate the seed crystal holder body 110 , and the seed crystal holder body 110 can be closely attached to the inner wall of the accommodating cavity 184 .
  • the protective bracket 180 may be made of graphite material.
  • the side of the protective bracket 180 close to the connecting rod 120 is the upper surface.
  • the upper surface of the protective bracket 180 is provided with a third through hole.
  • the shape of the third through hole can match the shape of the connecting rod 120 (for example, the connecting rod 120 is a cylinder).
  • Rod-shaped (the third through hole may be a cylindrical hole), the third through hole is connected to the aforementioned accommodation cavity 184, and the diameter of the third through hole matches the outer diameter of the outer wall of the connecting rod 120 along the axial direction of the connecting rod 120.
  • the hole can be arranged with the axis A of the connecting rod 120 as the axis.
  • the connecting rod 120 can pass through the third through hole on the upper surface of the protective bracket 180 and be connected to the seed crystal bracket body 110 in various ways (for example, threaded connection, buckle connection, the method described in the above embodiment, etc.).
  • the protective bracket 180 surrounds the seed crystal holder 110 to avoid the appearance of an adhesion layer on the surface of the seed crystal holder body 110, thereby achieving control of the axial and radial temperature gradients of the seed crystal holder body 110, thereby improving the crystal quality. Stable quality and form.
  • the seed crystal holder 100 may also include an annular first protective sleeve 181 , the first protective sleeve 181 is set outside the connecting rod 120 , and the first protective sleeve 181 is located between the connecting rod 120 and the protective bracket 180 .
  • the first protective cover 181 can be used to prevent volatile matter from entering between the seed crystal holder body 110 and the connecting rod 120 and between the protective holder 180 and the connecting rod 120 .
  • the first protective sleeve 181 may be an annular cylinder with a hollow interior.
  • the inner wall of the first protective sleeve 181 wraps the connecting rod 120 , the outer wall is connected to the surface of the protective bracket 180 , and the bottom surface is embedded in the protective bracket 180 .
  • the upper surface of the protective bracket 180 may be provided with an annular groove, and the size of the annular groove is adapted to the first protective sleeve 181 so that the outer wall and bottom surface of the first protective sleeve 181 fit in the annular groove.
  • the connecting rod 120 may include a first outer diameter section r 3 and a second outer diameter section r 2 along the axial direction of the connecting rod 120 .
  • the outer diameter of the first outer diameter section r 3 is smaller than the outer diameter of the second outer diameter section r 2 , and the first outer diameter section r 3 is closer to the seed holder body 110 than the second outer diameter section r 2 .
  • the first protective sleeve 181 includes a first inner diameter section r 4 and a second inner diameter section r 1 along the axial direction of the connecting rod 120 ; the first inner diameter section r 4 is smaller than the inner diameter of the second inner diameter section r 1 , and the first inner diameter section r 1 r 4 is closer to the seed holder body 110 than the second inner diameter section r 1 .
  • the first inner diameter section r 4 can match the first outer diameter section r 3
  • the second inner diameter section r 1 can match the second outer diameter section r 2 .
  • the first protective sleeve 181 can connect the connecting rod 120 with the protective bracket 180.
  • the first inner diameter section r4 and the second inner diameter section r1 of the first protective sleeve 181 are respectively connected to the first outer diameter section of the connecting rod 120.
  • the connection part of the diameter section r 3 and the second outer diameter section r 2 is fit.
  • the outer wall of the first protective sleeve 181 is connected to the protective bracket 180 , and the bottom surface is embedded in the protective bracket 180 .
  • the connecting rod 120 and the protective bracket 180 are connected through the first protective cover 181, which can more effectively prevent volatile matter from entering between the seed crystal bracket body 110 and the connecting rod 120, and between the protective bracket 180 and the connecting rod 120. Adhesion is caused between them, which facilitates cutting crystal separation or ablation separation.
  • a side surface of the protective bracket 180 away from the connecting rod 120 may be provided with an annular second protective sleeve 182.
  • the second protective sleeve 182 is embedded in the protective bracket 180, and the second protective sleeve 182 surrounds the accommodation cavity. 184 settings.
  • the end of the second protective sleeve 182 away from the connecting rod 120 can be attached to the side of the seed crystal 130 close to the connecting rod 120 to prevent volatilization.
  • Objects may enter between the seed crystal holder body 110 and the connecting rod 120 and between the protective holder 180 and the connecting rod 120 to cause adhesion.
  • the second protective cover 182 can prevent the volatile matter of the melt 140 from entering the seed crystal holder body 110 and corroding the graphite paper or the seed crystal holder body 110. It can also ensure that the seed crystal 130 is not stressed when pulling, thereby preventing The seed crystal 130 falls off.
  • the ratio of the height of the second protective sleeve 182 along the axial direction of the connecting rod 120 to the diameter of the seed bonding surface 111 of the seed holder body 110 is 3:150.
  • a first groove 183 may be provided on a side surface of the protective bracket 180 away from the connecting rod 120 .
  • the diameter of the aforementioned first groove 183 is larger than the diameter L of the opening of the side of the accommodation cavity 184 away from the connecting rod 120 .
  • the aforementioned first groove 183 includes a communication portion 1831 connected to the opening and an annular portion 1832 surrounding the communication portion; the bottom surface of the annular portion 1832 (i.e., the upper surface of the first groove) is bonded to the seed crystal.
  • the surface 111 is located on the same plane, the annular portion 1832 of the first groove 183 is adapted to the shape of the second protective sleeve 182 , and the second protective sleeve 182 is provided on the bottom surface of the annular portion 1832 of the first groove 183 .
  • the first groove 183 can allow the second protective cover 182 to be embedded in the protective bracket, which can further prevent volatiles from entering between the seed crystal bracket body 110 and the connecting rod 120, and between the protective bracket 180 and the connecting rod 120. causing adhesion between them.
  • the bottom surface of the annular portion 1832 ie, the upper surface of the first groove
  • the size of the first groove 183 can basically match the size of the seed crystal, and can also facilitate the operator to determine the bonding position of the seed crystal to a certain extent and ensure the concentricity between the seed crystal and the seed crystal holder 100 .
  • the diameter of the first groove 183 is 5 mm to 10 mm larger than the diameter of the opening to facilitate the placement of the annular portion and to facilitate the embedding of the second protective sleeve 182 into the protective bracket 180 , thus ensuring that the seed crystal can be more stable. Ground bonding.
  • graphite paper 119 may be adhered to the seed crystal bonding surface 111 .
  • Graphite paper 119 can be used to fix the seed crystal 130 .
  • the size of the graphite paper 119 can be adapted to the seed crystal bonding surface 111 so that the graphite paper 119 is completely attached to the seed crystal bonding surface 111 .
  • stone The ink paper 119 can be bonded to the seed crystal bonding surface 111 through hot melt glue.
  • the graphite paper 119 protrudes from the lower surface of the second protective sleeve 182 in a direction away from the connecting rod 120 (ie, direction D as shown in FIG. 10 ).
  • the graphite paper 119 can be oriented away from the connecting rod 120 and protrude 0.1mm-0.2mm from the side surface of the second protective sleeve 182 away from the connecting rod 120 to ensure that the seed crystal 130 can be convexed in the direction away from the connecting rod 120 .
  • the seed crystal 130 starts to grow at a certain speed after contacting the melt 140. As time goes by, the crucible wall begins to corrode, the melt 140 evaporates, etc., which will cause the liquid level of the melt 140 to rise. As it gradually decreases, the relative speed at which the seed crystal 130 deviates from the liquid surface of the melt 140 gradually accelerates, so that it cannot grow according to the prescribed pulling speed.
  • the seed crystal 130 can be fully contacted with the liquid level of the melt 140, and the crystal can be pulled according to the formula. Speed growth.
  • the aforementioned seed crystal holder 100 may be disposed in the seed crystal bonding device 30 , and the seed crystal bonding device 30 may bond the seed crystal 130 based on the seed crystal holder 100 .
  • the aforementioned seed crystal bonding device 30 can be used to bond the seed crystal 130 .
  • FIG. 11 is an exemplary structural diagram of a seed bonding device 30 according to some embodiments of this specification.
  • the seed bonding device 30 may include one or more bonding components 300 , and the bonding components 300 may include a supporting component 310 and a pressure component 320 .
  • the support member 310 may be used to support the seed holder 100 .
  • the support member 310 may be used to support the seed holder body 110 .
  • the supporting component 310 can also be used to support the seed holder body 110 and the connecting rod 120 .
  • the support component 310 may include a support frame made of metal, stainless steel, or other materials, and the structures that need to be supported in the seed crystal holder 100 may be fixed on the support frame.
  • the pressing component 320 can apply pressure to the seed crystal 130 and/or the seed crystal holder 100 , and the pressure can press the seed crystal holder 100 and the seed crystal 130 on the seed crystal holder 100 toward each other.
  • the seed crystal bonding device 30 provided with one or more bonding components 300, not only can the seed crystal holder 100 and the seed crystal 130 be pressed toward each other during the bonding process, but the seed crystal can also be fixed.
  • the support 100 makes the bonding process more stable, thereby improving the bonding effect of the seed crystal 130.
  • the seed bonding device 30 may also include a vacuum furnace cavity 31, a vacuum component 32, a column 33, a motor 34, a screw rod 35, a pressure column 36, a support component 37, a heating component 38, and a lower pressure plate 39 .
  • the vacuum furnace chamber 31 may be a place where the seed crystal 130 is bonded, and the vacuum assembly 32 may be used to perform vacuuming on the vacuum cranial cavity 31 .
  • the upright column 33 can be disposed on the top of the vacuum chamber 31 , and the motor 34 can be fixedly disposed (for example, bolted or welded) on the upright column 33 .
  • the screw rod 35 is rotatably connected to the motor 34.
  • the screw rod 35 When the motor 34 is running, the screw rod 35 can rotate around the central axis to move up and down.
  • the upper end of the pressure column 36 can be connected with the lower end of the screw rod 35.
  • the pressure column 36 When the screw rod 35 rotates and moves up and down, the pressure column 36 can also move up and down.
  • the pressure column 36 moves downward, it can exert pressure on the bonding assembly 300.
  • the support component 37 can be placed at the bottom of the seed bonding device 30 for supporting the heating component 38 and the lower platen 39 .
  • the heating component 38 may be disposed between the support component 37 and the lower pressure plate 39 to provide the heat required for bonding the seed crystal 130 .
  • the lower pressure plate 39 can be placed on the upper surface of the heating component 38, and the bonding component 300 can be placed on the upper part of the lower pressure plate 39 to cooperate with the pressure column 36 to exert pressure on the bonding component 300 to bond the seed crystal 130 to the seed crystal holder. 100 on.
  • the seed crystal holder 100 and the seed crystal 130 can be placed in the bonding assembly 300, and the vacuum is controlled by other components inside the seed crystal bonding device 30 (for example, the vacuum assembly 32, the pressure column 36, the heating assembly 38 and the lower pressure plate 39).
  • the cavity 31 evacuates the vacuum and applies pressure to the bonding assembly 300 to bond the seed crystal 130 to the seed crystal holder 100 to perform crystal growth.
  • the supporting component 310 includes a first pressing member 380 and a second pressing member 390
  • the pressing member 320 includes a first pressing plate 322 .
  • the second pressing part 390 is nested with the first pressing part 380.
  • the seed crystal 130 is placed on the upper surface of the second pressing part 390, and the seed crystal holder 100 is placed on the upper surface of the seed crystal 130.
  • the first pressure plate 322 can apply pressure to the seed crystal holder 100, so that the seed crystal 130 can be bonded to the seed crystal holder 100.
  • the side wall of the first pressing member 380 may include at least one first vent hole 383 .
  • At least one first exhaust hole 383 may penetrate horizontally through the side wall of the first pressing member 380 .
  • At least one first exhaust hole 383 may be evenly and symmetrically distributed on the side wall of the first pressing member 380 .
  • At least one first exhaust hole 383 may be located at the same height in the vertical direction.
  • the first pressing member 380 may be in the shape of a cylinder with an internal cavity 381 .
  • a cylinder, cube or polygonal prism with an internal cavity may be a cylinder, a cube or a polygonal prism.
  • the shape of the second pressing member 390 may be a cylinder, a cube or a polygonal prism.
  • the shape and/or size of the internal cavity of the first pressing part 380 is adapted to the shape and/or size of the second pressing part 390, so that the second pressing part 390 can be placed inside the first pressing part 380 without causing significant damage.
  • Movement e.g., the movable amount is less than a preset threshold.
  • the shape and/or size of the internal cavity of the first pressing member 380 may be adapted to the shape and/or size of the second pressing member 390 .
  • the shape of the outer wall of the first pressing member 390 is consistent or substantially consistent, and the size of the internal cavity of the first pressing member 380 is slightly larger than the size of the outer wall of the second pressing member 390, and the size of the internal cavity of the first pressing member 380 is the same as that of the second pressing member 390.
  • the difference in size of the outer walls is less than a first preset size threshold (eg, 3 mm).
  • the first preset size threshold can be a default value, or can be adjusted according to different situations.
  • the shape of the outer wall of the second pressing part 390 is a cylinder
  • the shape of the internal cavity of the first pressing part 380 is also a cylinder
  • the diameter of the internal cavity of the first pressing part 380 is slightly larger than that of the second pressing part 390
  • the diameter of the outer wall for example, the diameter of the outer wall of the second pressing part 390 is 15 cm, and the diameter of the internal cavity of the first pressing part 380 is 15.3 cm).
  • the second pressing part 390 can be placed in the first pressing part 380 without significant movement, and the nested connection between the first pressing part 38 and the second pressing part 390 is relatively stable.
  • the bottom of the first pressing member 380 includes a second through hole 382, and the bottom of the second pressing member 390 includes a first protrusion 391.
  • the first protrusion 391 and the second through hole 382 cooperate with each other to realize the first pressing member. 380 and the nested connection of the second pressing piece 390.
  • the shape of the second through hole 382 may be a cylinder, a cube or a polygonal prism. To facilitate installation, the second through hole 382 may be cylindrical. In some embodiments, the diameter of the second through hole 382 may include 5 mm to 150 mm. In some embodiments, the diameter of the second through hole 382 may include 8mm-140mm. In some embodiments, the diameter of the second through hole 382 may include 10 mm-130 mm. In some embodiments, the diameter of the second through hole 382 may include 20 mm-120 mm. In some embodiments, the diameter of the second through hole 382 may include 30mm-110mm. In some embodiments, the diameter of the second through hole 382 may include 40mm-100mm.
  • the diameter of the second through hole 382 may include 50mm-90mm. In some embodiments, the diameter of the second through hole 382 may include 60mm-80mm. In some embodiments, the diameter of the second through hole 382 may include 70mm-75mm.
  • the shape of the first protrusion 391 may be a cylinder, a cube or a polygonal prism.
  • the first protrusion 391 and the second through hole 382 may be disposed concentrically.
  • the shape and/or size of the second through hole 382 is adapted to the shape and/or size of the first protrusion 391 such that the first protrusion 391 can be placed in the second through hole 382 without significant movement (eg, The movable amount is less than the preset threshold).
  • the shape and/or size of the second through hole 382 is adapted to the shape and/or size of the first protrusion 391.
  • the shape of the first protrusion 391 is consistent or substantially consistent with the shape of the second through hole 382.
  • the size of the second through hole 382 is slightly larger than the size of the first protrusion 391 and the difference between the size of the second through hole 382 and the size of the first protrusion 391 is less than the second preset size threshold (eg, 3 mm).
  • the second preset size threshold can be a default value, or can be adjusted according to different situations. For example, if the first protrusion 391 is in the shape of a cylinder, then the second through hole 382 is also in the shape of a cylinder, and the diameter of the second through hole 382 is slightly larger than the diameter of the first protrusion 391 (for example, the first protrusion 391 is in the shape of a cylinder). 391 has a diameter of 5 cm, and the second through hole 382 has a diameter of 5.3 cm).
  • the second pressing member 390 can be placed in the first pressing member 380 and the first protrusion 391 Cooperating with the second through hole 382, the first pressing member 380 and the second pressing member 390 are nested and connected, thereby making the overall structural connection of the bonding assembly 300 more stable.
  • the cross-sectional diameter of the first exhaust hole 383 may include 0.01mm-10mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 0.1mm-9mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 1 mm to 8 mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 2 mm to 7 mm.
  • the diameter of the first exhaust hole 383 may include 3 mm to 6 mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 4 mm to 5 mm.
  • the vertical distance between the first exhaust hole 383 and the upper surface of the second pressure part 390 is in the range of 0.2-5 mm. In some embodiments, after the first pressure part 380 and the second pressure part 390 are nested and connected, the vertical distance between the first exhaust hole 382 and the upper surface of the second pressure part 390 may be in the range of 0.5mm-4.5mm. . In some embodiments, after the first pressing part 380 and the second pressing part 390 are nested and connected, the vertical distance between the first exhaust hole 383 and the upper surface of the second part 390 may be in the range of 1 mm to 4 mm.
  • the vertical distance between the first exhaust hole 383 and the upper surface of the second pressure part 390 may be in the range of 2 mm-3 mm.
  • the side wall of the second pressing member 390 includes at least one second vent hole 393 .
  • at least one second exhaust hole 393 can penetrate horizontally through the side wall of the slot 392 on the second pressing member 390 , and the slot 392 is used to place the seed crystal 130 .
  • At least one second exhaust hole 393 may be evenly and symmetrically distributed on the side wall of the slot 392, and at least one second exhaust hole 393 may be located at the same height in the vertical direction.
  • the first exhaust hole 383 at least partially corresponds to the second exhaust hole 393.
  • the first exhaust hole 383 at least partially corresponds to the second exhaust hole 393.
  • the first pressure member 380 and the second pressure member 390 may be nested. After connection, part or all of the first exhaust hole 383 and the second exhaust hole 393 overlap. Alternatively, after the first pressure member 380 and the second pressure member 390 are nested and connected, the first exhaust hole 383 and the second exhaust hole 393 may overlap.
  • the two exhaust holes 393 are arranged concentrically.
  • the size of the first exhaust hole 383 and the size of the second exhaust hole 393 may be the same or different.
  • the first exhaust hole 383 and the second exhaust hole 393 at least partially correspond, which can improve the exhaust effect during the bonding process of the seed crystal 130 and help improve the quality of the prepared crystal.
  • the cross-sectional diameter of the second exhaust hole 393 may include 0.01 mm to 10 mm to improve the exhaust effect during the bonding process of the seed crystal 130 .
  • the diameter of the second exhaust hole 393 may include 1 mm to 8 mm.
  • the diameter of the second exhaust hole 393 may include 2 mm to 7 mm.
  • the diameter of the second exhaust hole 393 may include 3 mm to 6 mm.
  • the diameter of the second exhaust hole 393 may include 4mm-5mm.
  • the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 390 is in the range of 0.2 mm to 5 mm to improve the exhaust effect during the bonding process of the seed crystal 130 .
  • the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 120 may be in the range of 0.5mm-4.5mm.
  • the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 390 may be in the range of 1 m to 4 m.
  • the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 390 may be in the range of 2m-3m.
  • the height of the second pressing part 390 may be smaller than the height of the first pressing part 380, so that after the second pressing part 390 and the first pressing part 380 are nested and connected, the second pressing part 390 may be located on the first pressing part 380. In the internal cavity 381 of the pressing member 380.
  • the seed crystal holder 100 and the first pressing member 380 may be threaded.
  • the upper part of the side wall of the internal cavity 381 of the first pressing member 380 may be provided with a threaded structure, and the side wall of the seed crystal holder 100 may be provided with a threaded structure.
  • the second pressing part 390 can be located in the cavity surrounded by the seed crystal holder 100 and the first pressing part 380 .
  • the bottom of the first pressure plate 322 includes a second protrusion 3221
  • the upper part of the seed crystal holder 100 includes a second groove 3222.
  • the second protrusion 3221 and the second groove 3222 cooperate to realize the first pressure plate 380 and Seed crystal holder 100 connection.
  • the shape of the second protrusion 3221 may be a cylinder, a cube or a polygonal prism.
  • the side wall of the second protrusion 3221 may be provided with a threaded structure
  • the inner wall of the second groove 3222 may be provided with a threaded structure
  • the second protrusion 3221 and the second groove 3222 may be threadedly connected.
  • the support component 310 may further include an annular base 311 and a cover 312, and the seed crystal holder 100 may be placed on the annular base 311.
  • the annular base 311 may be cylindrical, and the diameter of the annular base 311 may be greater than or less than the maximum diameter of the seed crystal holder 100 (ie, the diameter of the seed crystal bonding surface 111).
  • the seed crystal bonding surface 111 can be placed stably on the annular base 311.
  • the outer surface of the seed crystal holder 100 can be placed on the annular base 311.
  • the cover 312 may also be cylindrical.
  • the cover 312 includes an annular side wall 3121 and a cover plate 3122 .
  • the side wall 3121 can be set outside the annular base 311 .
  • the inner wall of the side wall 3121 may fit with the outer wall of the annular base 311 .
  • the cover plate 3122 can be cylindrical with a hollow interior, located at the upper end of the annular base 311 as shown in Figure 14, and the cross-sectional area of the cover plate 3122 along the axis A perpendicular to the seed crystal holder 100 is larger than the bottom surface of the annular base 311 along the axis perpendicular to the seed. The cross-sectional area of the axis A of the crystal holder 100.
  • the cover 312 can apply pressure toward the annular base 311 to the seed crystal 130 attached to the seed crystal holder 100 .
  • the seed crystal holder 100 is fixed through the annular base 311 and at the same time, pressure is applied to the seed crystal 130 through the cover 312 to press the seed crystal 130 toward the seed crystal holder 100, thereby achieving quick and convenient removal of the seed crystal 130. bonding.
  • the seed bonding device 30 may further include a first connecting member 331 and a second connecting member 332, wherein the first connecting member 331 may be provided on the annular base 311 and the second connecting member 332 may be provided on the annular base 311. On the cover 312.
  • the first connecting member 331 may be detachably connected to the second connecting member 332.
  • the first connecting member 331 may be a snap ring, a hook, a snap block or other structures located on the side wall of the annular base 311 .
  • the second connecting member 332 may include a positioning protrusion 3321 and a buckle 3322.
  • the positioning protrusion 3321 may be disposed on the lower surface or side surface of the side wall 3121 of the cover 312 as shown in FIG. 14 for connecting the second connecting member 332 is fixed on the cover 312.
  • the buckle 3322 can be driveably connected to the fixing protrusion 3321, and the buckle 3322 can be buckled in the first connecting piece 331 to connect the first connecting piece 331 with the second connecting piece 332.
  • the cover The cover plate 3122 of 312 exerts pressure on the seed crystal 130 on the seed crystal holder 100 to bond the seed crystal 130 .
  • the buckle 3322 is disengaged from the first connecting member 331, the first connecting member 331 and the second connecting member 332 are disengaged.
  • first connecting member 331 and the second connecting member 332 may be connecting ropes.
  • One end of the first connecting member 331 is wound around the outer peripheral side of the annular base 331
  • one end of the second connecting member 332 is wound around the cover 312
  • the lower surface or side surface of the side wall 3121, the other end of the first connecting member 331 is connected to the other end of the second connecting member 332.
  • the seed bonding device 30 may include a plurality of first connecting members 331 and a plurality of second connecting members 332, wherein the plurality of first connecting members 331 and the plurality of second connecting members 332 cooperate with each other in a one-to-one correspondence. As shown in FIG. 14 , the seed bonding device 30 may include two first connecting members 331 and two second connecting members 332 , wherein each first connecting member 331 cooperates with a second connecting member 332 respectively.
  • Some embodiments of this specification use the first connecting member 331 and the second connecting member 332 to facilitate quick connection of the cover 312 and the annular base 311, thereby applying pressure to the seed crystal holder 100.
  • configuring the first connecting member 331 and the second connecting member 332 to be detachably connected can avoid misalignment of the seed crystal holder 100 and the seed crystal 130 caused by fixed connection, thereby improving the bonding effect.
  • the annular base 311 may also be provided with a locking structure 340 .
  • the locking structure 340 can be used to fix the seed crystal holder 100 to the annular base 311 to improve the stability of the seed crystal holder 100 during the crystal growth process and improve the quality of crystal formation.
  • the locking structure 340 may include a latch, and the seed crystal holder 130 and the side wall 3121 may be provided with latch holes whose positions and sizes match the aforementioned latch pins. The aforementioned latch pins may be inserted into the latch holes to thereby fix the seed crystal holder 100 to on the ring base 311.
  • the side of the seed crystal holder 100 away from the seed crystal bonding surface 111 is provided with a connecting threaded hole
  • the locking structure 340 includes a lock.
  • the aforementioned locking member may include a tray 3421 , a first threaded rod 3422 and a second threaded rod 3423 .
  • the first threaded rod 3422 and the second threaded rod 3423 may be located on both sides of the tray 3421 in the thickness direction. As shown in FIG.
  • the first threaded rod 3422 can cooperate with the connecting threaded hole (not shown), be inserted into the connecting threaded hole, and then be threadedly connected with the seed crystal holder 100 .
  • a threaded hole may be provided in the tray 3421 so as to be threadably connected to the first threaded rod 3422 to support the side of the seed crystal holder 100 away from the seed crystal bonding surface 111 .
  • the first threaded rod 3422 can be fixed to the tray 3421 by bonding, welding or other fixed connection methods.
  • the second threaded rod 3423 can be located on the side of the tray 3421 away from the seed bonding surface 111 and is threadedly connected to the tray 341 .
  • the locking disk 341 may be located on the side of the tray 3421 away from the seed crystal bonding surface 111 , and the locking disk 341 may be a disk that fits the inner wall of the annular base 311 .
  • the locking plate 341 may be provided with a mounting hole, and the second threaded rod 3423 may pass through the mounting hole and cooperate with the locking nut 343 .
  • the locking nut 343 and the tray 3421 may be respectively located on both sides of the locking plate 341 along the axis direction of the mounting hole (same as the thickness direction of the tray 3421).
  • the axis direction of the mounting hole may be the same as the axis A of the seed crystal holder 100 .
  • the connecting threaded hole of the seed crystal holder 100 and the locking disk 341 are connected through a locking piece and fixed by a locking nut 343, so that the seed crystal holder 100 can be fixed on the annular base 311 more stably.
  • the locking disk 341 cooperates with the annular base 311 to help improve the concentricity between the seed crystal holder 100 and the seed crystal 130 .
  • the tray 341 can be made of elastic material (such as rubber, plastic), which can absorb pressure or friction when the seed crystal holder 100 rotates to achieve a buffering effect and avoid damage to the seed crystal holder during the hot pressing process.
  • Ontology 110 can be made of elastic material (such as rubber, plastic), which can absorb pressure or friction when the seed crystal holder 100 rotates to achieve a buffering effect and avoid damage to the seed crystal holder during the hot pressing process.
  • a supporting structure 350 can also be provided on the inner wall of the annular base 311 .
  • the aforementioned supporting structure 350 may include an annular connecting plate 351 , an annular supporting plate 352 and an annular supporting protrusion 353 .
  • the annular connecting plate 351 can be used to connect the inner wall of the annular base 311 .
  • the outer wall of the annular connecting plate 351 can fit with the inner wall of the annular base 311 , and its shape can be adapted to the shape of the inner wall of the annular base 311 .
  • the inner wall of the annular base 311 is cylindrical, and correspondingly, the annular connecting plate 351 is a ring.
  • the inner wall of the annular base 311 may be provided with a snap-in groove that matches the annular connecting plate 351, and the annular connecting plate 351 is embedded in the aforementioned snap-in groove.
  • the shape of the annular supporting plate 352 can be adapted to the shape of the annular connecting plate 351.
  • the annular connecting plate 351 is a circular ring
  • the annular supporting plate 352 can be a circular ring.
  • the outer ring of the annular supporting plate 352 is connected to the annular connecting plate 351, and the inner ring is provided with an annular supporting protrusion 353.
  • the annular supporting protrusion 353 can be used to support the seed crystal holder 100, and its cross section can be semicircular or other shapes (eg, inverted cone).
  • the aforementioned annular supporting protrusion 353 can be made of elastic material (such as rubber), which can absorb pressure or friction when the seed crystal holder 100 rotates to achieve a buffering effect and help protect the seed crystal holder during the hot pressing process.
  • Ontology 110 can be used to support the seed crystal holder 100, and its cross section can be semicircular or other shapes (eg, inverted cone).
  • the aforementioned annular supporting protrusion 353 can be made of elastic material (such as rubber), which can absorb pressure or friction when the seed crystal holder 100 rotates to achieve a buffering effect and help protect the seed crystal holder during the hot pressing process.
  • Ontology 110 Ontology 110.
  • Some embodiments of this specification help to support the seed crystal holder 100 more stably by setting the supporting structure 350, effectively reducing the deflection of the seed crystal holder 100 after being pressed.
  • the annular supporting protrusion 353 is conducive to matching different tapers.
  • the seed crystal holder 100 is used for support.
  • Glue will be used when the seed crystal 130 and the seed crystal holder 100 are bonded.
  • the viscous glue will generate bubbles during the bonding process.
  • the seed crystal bonding surface 111 can be provided with a coating, and the coating can be a thermoplastic (such as polytetrafluoroethylene), which can maintain the smoothness of the seed crystal bonding surface 111 and thereby enable better drainage. Bubbles produced during extrusion.
  • the seed bonding device may further include a bubble removal device.
  • a bubble removal device may be provided on the cover 312 , and the aforementioned bubble removal device may be used to remove bubbles between the seed crystal 130 and the seed crystal holder 100 .
  • the bubble removal device may be provided between the cover 312 and the seed crystal holder 100 .
  • the bubble removal device may include a device that drives the seed crystal holder to rotate (such as the rotational driving member 370 shown in FIG. 16 below. For more information about the rotational driving member 370, please refer to FIG. 16 and its related description).
  • the bubble removal device includes the rotary driving member 370 shown in FIG.
  • the seed crystal holder 100 that has been bonded to the seed crystal 130 can be removed from the annular base 311 and then placed on a driving seed crystal holder.
  • the seed crystal holder 100 rotates, so that the air bubbles between the seed crystal holder 100 and the seed crystal 130 can be discharged.
  • bubbles can be removed through a bubble removal device to improve the bonding effect between the seed crystal 130 and the seed crystal holder 100 .
  • the bubble removal device may also include a slot 361 , an insert plate 362 and a roller 363 .
  • the slot 361 is located on the cover 312 for accommodating the plug-in board 362 and limiting the movement direction of the plug-in board 362 .
  • the plug-in board 362 is strip-shaped, and its size is adapted to the slot 361 .
  • Board 362 may be located within slot 361.
  • the roller 363 can be disposed at one end of the insert plate 362 .
  • the diameter of the aforementioned roller 363 may be smaller than the height of the slot 361 , so that the roller 363 can move within the slot 361 .
  • the aforementioned roller 363 can be made of elastic material (such as rubber) to avoid damage to the seed crystal 130 or the seed crystal holder 100 when it moves.
  • the insert plate 362 can support the seed crystal holder 100. After the seed crystal 130 is bonded, the insert plate 362 can move (for example, left and right) in the slot 361 to drive the roller 363 to roll the seed. Crystal 130. In some embodiments of this specification, the insert plate 362 drives the roller 363 to roll the seed crystal 130, thereby squeezing out the bubbles generated during the bonding process of the seed crystal 130 and improving the bonding quality between the seed crystal 130 and the seed crystal holder 100.
  • the other end of the inserting plate 362 may also be provided with a pull ring 364 .
  • pulling the pull ring 364 can drive the inserting plate 362 to move, thereby driving the roller 363 to roll the seed crystal 130, thereby squeezing the bubbles more conveniently.
  • the bubble removal device may further include a rolling rotary member (not shown in the figure).
  • the rolling rotating member can exert a certain pressure on the seed crystal 130 in a direction toward the seed crystal bonding surface 111 .
  • the rolling rotating member can also rotate on a fixed axis (such as axis A). By applying pressure to the seed crystal 130 while rotating, the gas between the seed crystal 130 and the seed crystal holder 100 can be discharged.
  • the surface of the rolling rotating member in contact with the seed crystal 130 may be provided with balls, rollers or rollers, etc., to reduce friction between the rolling rotating member and the seed crystal 130 .
  • the support member 310 may include a support plate 313 .
  • the aforementioned support plate 313 is used to support the seed crystal 130 and the seed crystal holder 100 .
  • the support plate 313 may be in the shape of a disc, a square disc, or the like.
  • the cross-sectional area of the support plate 313 along the axis A perpendicular to the seed crystal holder 100 is larger than the cross-sectional area of the seed crystal holder 100 or the seed crystal 130 along the axis A perpendicular to the seed crystal holder 100 .
  • the seed crystal 130 is located between the support plate 313 and the seed crystal holder 110 .
  • the seed bonding device 30 may further include a support frame 314 and a plurality of pressure driving members provided on the support frame 314 .
  • the support plate 313 is provided on the aforementioned support frame 314 .
  • the pressure driving member may include a pump device (eg, an electric pump) for driving the pressure member 320 to apply pressure to the seed crystal holder 100 .
  • the pressure driving member may also include a pneumatic pressure driving member or a hydraulic pressure driving member.
  • the seed bonding device 30 may include multiple bonding assemblies 300 , and the plurality of pressure driving members are respectively connected to the pressure applying components 320 in each bonding assembly 300 , so that the pressure applying components 320 Pressure is applied to the seed holder 100 toward the support plate 313 .
  • the support plate 313 can support the seed crystal holder 100 and limit its position to prevent the seed crystal holder 100 from being displaced.
  • multiple bonding components 300 can be bonded simultaneously. Multiple groups of bonding to improve bonding efficiency.
  • the seed crystal bonding device 30 may include three bonding components 300, which are spaced apart along the vertical direction. The vertical direction is the same as the axial direction of the seed crystal holder 100.
  • Each bonding component 300 has a pair of When the seed crystal 130 of one seed crystal holder 100 is bonded, the pressure driving member can simultaneously drive the pressure components 320 of three bonding assemblies 300 to press the corresponding seed crystal holder 100, thereby realizing multiple groups at the same time. Bonding of seed crystal 130.
  • the support frame 314 may include a plurality of support rods 315 extending along the aforementioned vertical direction.
  • the support rods 315 are arranged at intervals along the circumferential direction of the support plate 313 .
  • a plurality of pressure driving members can be provided on at least one support rod 315, and the plurality of pressure driving members are spaced apart along the vertical direction, and the plurality of bonding assemblies 300 are spaced apart along the vertical direction, thereby facilitating multiple The pressure driving member applies pressure at one time to bond multiple bonding components 300 and reduces space occupation.
  • the support rod 315 provided with the pressure driving member may also be provided with a pressure transmission medium channel, and at least one pressure driving member may be connected to the pressure transmission medium channel through the valve 316 .
  • the aforementioned valve 316 may be provided on a support rod 315 provided with a pressure driver. By opening the valve 316, the seed crystal bonding device 30 can transmit the air pressure or hydraulic pressure generated by the pressure driving component through the pressure transmission medium channel, so as to transmit the air pressure or hydraulic pressure to the pressure application component 320 to apply pressure on the seed crystal holder 100. .
  • the seed bonding device 30 may further include a rotational driving member 370 , which is connected to the support plate 313 to drive the support plate 313 to rotate.
  • the rotation driving member may include a motor, and the motor may drive the support plate 313 to rotate.
  • the rotary driving member 370 may include a pneumatic driving member located at the bottom of the support plate 313.
  • the pneumatic driving member may be a circular turntable.
  • the bottom of the pneumatic driving member may be connected to a gas compressor.
  • the gas compressor may transmit compressed air to the pneumatic driving member.
  • the pneumatic driving member is driven to rotate, thereby driving the support plate 313 to rotate.
  • the rotation of the support plate 313 can drive out the air bubbles at the bonding point of the seed crystal 130, which can effectively prevent the seed crystal 130 from detaching due to weak bonding. .
  • rotational drive 370 may include a magnetic element, a power source 371 and a magnetic drive.
  • the magnetic element can be fixed on the support plate 313.
  • a magnetic driver can be used to drive the magnetic element in rotation.
  • the magnetic drive may be a circular turntable.
  • the magnetic driving member can be fixed on the output end of the power source 371, and the magnetic driving member is magnetically coupled with the magnetic element.
  • the power source 371 can convert other energy sources into kinetic energy for driving the magnetic driving member to rotate.
  • the power source 371 drives the magnetic driving component to rotate, and then drives the magnetic element to drive the support plate 313 to rotate. This can more conveniently control the rotation of the support plate 313 and reduce friction and vibration when the support plate 313 rotates.
  • the pressure component 320 may include a limiting pressure plate 317 provided on the support frame 314 .
  • the limiting pressure plate 317 is a disc with a protrusion at the bottom, and the protrusion is connected to the seed crystal holder 110 (for example, threaded or snap-fitted).
  • the pressure driving member may include a first sub-driving member 381 and a second sub-driving member 381 .
  • the first sub-driving member 381 and the second sub-driving member 382 can be disposed on different supporting rods 314 to adjust the distance between different positions of the limiting pressure plate 317 and the supporting plate 313 .
  • the structures of the first sub-driving member 381 and the second sub-driving member 382 may be the same, for example, they may both be movable support bases.
  • the first sub-driving member 381 and the second sub-driving member 382 may be arranged at intervals along the circumference of the limiting pressure plate 317 , and both the first sub-driving member 381 and the second sub-driving member 382 are connected to the limiting pressure plate 317 .
  • the first sub-driving member 381 and the second sub-driving member 381 can apply pressure to the seed crystal holder 100 from different positions, which helps to avoid uneven stress on the seed crystal holder 100 caused by applying pressure from a single position. .
  • the seed bonding device 30 may also include a pressure sensor 321, which is used to determine whether each application The pressure exerted by the pressing member 320.
  • the pressure sensor 321 can be set at the connection point between the support rod 315 and the support frame 314 , and can be used to sense the driving pressure of the pressure driving member and/or the pressure at the valve 316 .
  • the pressure sensor 321 can also be directly provided on the upper surface of the support plate 313 to directly sense the pressure on the seed crystal holder 100 .
  • the pressure at the seed crystal holder 100 can be sensed directly or indirectly, which helps to better control the bonding process of the seed crystal 130, facilitates timely adjustment when the pressure is too large or too small, and effectively prevents Too much pressure causes the seed crystal 130 to be crushed, or too little pressure causes the bonding quality of the seed crystal 130 to decrease.
  • the seed bonding device 30 may further include a controller, and the controller may be connected to the valve 316 and the pressure sensor 321 via signals.
  • the controller may adjust the opening of valve 316 based on pressure data sensed by pressure sensor 321 .
  • the controller can obtain the pressure data obtained by the pressure sensor 321 in real time.
  • the controller can increase the opening of the valve 316 to improve the bonding effect of the seed crystal 130 ;
  • the controller can reduce the opening of the valve 316 to prevent the seed crystal 130 from being crushed.
  • This specification also provides a crucible 400.
  • Crucible 400 may be used to generate gas phase components required for crystal growth.
  • the raw materials in the crucible 400 eg, the melt 140
  • crucible 400 may include a crucible body 450 , a drive assembly 460 , and a temperature field holding disk 410 .
  • the crucible body 450 is used to carry the melt 140 for crystal growth.
  • the crucible body 450 may be in a cylindrical shape, and the melt 140 may be disposed in the crucible body 450.
  • the melt 140 is heated, and the seed crystal 130 in the seed crystal holder 100 is in contact with the melt 140, thereby realizing crystallization. grow.
  • Thermal field holding disk 410 may be used to maintain the thermal field.
  • the driving assembly 460 can drive the crucible body 450 to rotate around the axis E of the crucible body 450 relative to the temperature field holding disk 410 .
  • the driving assembly 460 may include a driving source and a connecting mechanism 420.
  • the connecting mechanism 420 may be connected between the driving source and the bottom of the crucible body 450.
  • the driving source may be located at the bottom of the connecting mechanism 420 to provide driving force for the driving assembly 460.
  • the aforementioned driving source may include a combination of various driving devices and transmission devices, and the driving device may include a motor, a hydraulic cylinder, a pneumatic cylinder, etc.
  • the temperature field holding disk 410 may be disposed on the connection structure 420 and located between the driving source and the bottom of the crucible body 450 .
  • the temperature field holding disk 410 may be disk-shaped or otherwise shaped.
  • the material of the temperature field holding disk 410 is at least one of mullite, corundum, and alumina. The above material settings can make the temperature field holding disk 410 adaptable to high temperature environments, helping to improve the temperature field maintenance. Disk 410 stability.
  • the thermal field holding disk 410 can keep the thermal field stationary when the crucible 400 rotates, so as to prevent its deflection and tilt from causing contact with the coil and ignition, making it impossible to continue to grow crystals.
  • the temperature field holding disk 410 can also remain relatively stationary with the crucible 400 to maintain the temperature stability of the crucible 400 and ensure the quality of crystal formation.
  • Some embodiments of this specification can drive the crucible body 450 to rotate around the axis E of the crucible body 450 by arranging the driving assembly 460, so that the crucible 400 and the seed crystal 130 can rotate in opposite directions, and the crucible 400 and the seed crystal 130 can also rotate alternately, etc.
  • the steps formed on the crystal are washed in different directions to reduce the width and size of the steps, making the crystal flatter and reducing the inclusion of flux.
  • the rotation of the crucible body 450 can make the crystal flatter and reduce the inclusion of flux, greatly improving the overall mass transfer of the melt, thereby effectively increasing the thickness of the crystal.
  • the connection mechanism 420 may include a rotating column 421 and a first supporting tray 422 .
  • the first supporting tray 422 is provided at one end of the rotating column 421 , and the driving source is connected to the other end of the rotating column 421 .
  • the first supporting tray 422 may be cylindrical for supporting the crucible body 450
  • the rotating column 421 may be cylindrical for driving the first supporting tray 422 to rotate.
  • the rotating column 421 can be connected to the driving source through couplings, bearings and other connecting parts.
  • the material of the first supporting tray 422 can be graphite, and the material of the rotating column 421 can be high-temperature resistant materials such as mullite, corundum, and alumina.
  • the driving source drives the rotating column 421 to rotate, which can further drive the crucible body 450 in the first supporting tray 422 to rotate.
  • the first supporting tray 422 may include a plurality of concentrically arranged stepped grooves.
  • the aforementioned plurality of stepped grooves are all concentric with the rotating column 421, and their sizes are adapted to the sizes of a plurality of different crucible bodies 450.
  • multiple stepped grooves arranged concentrically can be used to position crucible bodies 450 of various sizes, and crucible bodies 450 of different sizes and shapes can be replaced according to actual conditions to prevent the crucible body 450 from being separated from the first bearing.
  • the tray 422 is offset concentrically.
  • the plurality of stepped grooves on the first supporting tray 422 may also include a limiting structure (for example, a rubber ring) to prevent the crucible body 450 from sliding during rotation.
  • connection mechanism 420 further includes a second supporting tray 423 .
  • the second supporting tray 423 may be used to support the temperature field holding tray 410 .
  • the material of the second tray 423 may be at least one of high temperature resistant materials such as mullite, corundum, and alumina.
  • the second supporting tray 423 may be annular, and the inner ring of the second supporting tray 423 is fixed to the outer wall of the rotating column 421 .
  • the second tray 423 may be located between the first tray 422 and the driving source.
  • the second supporting tray 423 can be located at the bottom of the temperature field holding plate 410 and is connected to the temperature field holding plate 410 through a ball structure 424.
  • the second supporting tray 423 may include a plurality of ball structures 424.
  • the plurality of ball structures 424 may be fixed on the second supporting tray 423 through one or more positioning devices.
  • the plurality of ball structures 424 may be axially centered around the second supporting tray 423. Evenly distributed. As shown in FIG.
  • the ball structure 424 can be arranged as two groups of rings with different radii, taking the center of the second supporting tray 423 as the center of the circle. It is worth mentioning that the material of the thermal field is easily pulverized, has low hardness and stability, and cannot guarantee absolute balance during rotation. Therefore, the thermal field holding disk 410 may be deflected and tilted during rotation, causing it to contact the coil and break. Fire, thus unable to continue to grow crystals. At the same time, it will also destroy the stability within the crucible body 450 and lead to an increase in uncontrollable factors. Some embodiments of this specification connect the second supporting tray 423 and the temperature field holding tray 410 through a ball structure 424, which can maintain the temperature when the rotating column 421 rotates. Keeping the field holding disk 410 stationary helps prevent the increase in uncontrollable factors causing the rotation of the temperature field holding disk 410 .
  • the crucible 400 may also include a plurality of telescopic support rods 430.
  • the telescopic support rod 430 can be used to support the temperature field holding plate 410 , and one end of the telescopic supporting rod 430 is connected to the bottom of the temperature field holding plate 410 .
  • the telescopic support rod 430 may include a sliding rod 431 and a fixed rod 432.
  • the sliding rod 431 can move up and down along the axis of the telescopic support rod 430.
  • the sliding rod 431 and the fixed rod 431 may be tightened by threads or other locks. Tightening mechanism.
  • the temperature field holding plate 410 may have three fourth through holes 411 evenly distributed around the axial direction of the temperature field holding plate 410.
  • the size of the fourth through holes 411 is adapted to the sliding rod 431, and the sliding rod can pass through
  • the threaded connection or other connection methods pass through the fourth through hole 411 and are fixed in the temperature field holding plate 410 .
  • Some embodiments of this specification use multiple telescopic support rods 430 to prevent the temperature field holding disk 410 from tilting during the rotation of the crucible 400, thereby ensuring normal crystal growth.
  • the crucible 400 may also include a connecting ring 440 and a locking mechanism.
  • the aforementioned locking hole 441 cooperates with the locking mechanism to fix the connecting ring 440 to the output shaft of the driving source and the rotating column 421.
  • the connecting ring 440 can be a hollow cylinder with a side wall provided with a plurality of locking holes 441 axially symmetrical along the connecting ring 440.
  • the connecting ring 440 can be sleeved on the output shaft of the driving source and Outside the other end of the rotating column 421 (that is, the end close to the driving source).
  • the locking mechanism can be a screw, and the size of the locking hole 441 is adapted to the locking mechanism.
  • the connecting ring 440 can be fixed to the output shaft of the driving source and the rotating column 421.
  • the output shaft of the driving source and the rotating column 421 can be fixed to the connecting ring 440 through the connecting ring 440 and the locking mechanism.
  • the driving source can stably drive the rotating column 421 to rotate, which helps to prevent the rotating column 421 from rotating. when disconnected from the driving source.
  • the seed crystal holder 110 can undergo crystal growth through the crystal growth method described in the process 2200 shown in FIG. 22 .
  • Figure 22 is an exemplary flow chart of a crystal growth method according to some embodiments of the present specification. In some embodiments, this method may be accomplished using a seed holder (such as the one shown in Figure 10). As shown in Figure 22, process 2200 includes the following steps.
  • Step 2210 Bond the seed crystal to the seed crystal bonding surface of the seed crystal holder body.
  • the seed crystal can be bonded to the seed crystal bonding surface.
  • the seed crystal can be fixed by graphite paper.
  • graphite paper For more information on the seed crystal bonding surface and graphite paper, please refer to the relevant parts of the previous article, such as Figure 1, Figure 10, etc.
  • bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body includes: making the diameter of the seed crystal slightly larger than the diameter of the seed crystal holder body, and making the seed crystal slightly protrude away from the protective support. One side of the connecting rod.
  • the diameter of the seed crystal is 5 mm-10 mm larger than the diameter of the seed crystal holder body, and the seed crystal protrudes away from the protective support.
  • the surface of one side of the connecting rod is 0.1mm-0.2mm; in addition, the protective bracket can also wrap the seed crystal to achieve axial and radial temperature gradient control; the protective bracket also has a protective effect on the seed crystal. For example, after the seed crystal sinks into the protective bracket, the seed crystal is not stressed when it is pulled, thus preventing the seed crystal from falling off.
  • the diameter of the seed crystal is slightly larger than the diameter of the seed crystal support body, and the seed crystal slightly protrudes from the side surface of the protective support away from the connecting rod, which can ensure that the seed crystal Full contact with the melt.
  • the step of bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body can be The method further includes attaching the seed crystal to an end of the second protective sleeve 182 away from the connecting rod 120 and bonding it to the seed crystal bonding surface 111 of the seed crystal holder body 110 . This ensures that during the crystal growth process, the second protective cover 182 can effectively prevent volatiles from the melt from entering between the seed crystal and the protective support 180 and between the seed crystal support body 110 and the protective support.
  • Step 2220 sink the seed crystal holder with the seed crystal attached to it into the melt used for crystal growth in the crucible, and the surface of the side of the seed crystal away from the seed crystal holder body is located at the position with the highest temperature of the melt.
  • Figure 23 is a schematic diagram of a generated crystal according to some embodiments of the present specification. As shown in Figure 23, the seed crystal holder may be sunk into the melt 2320 for crystal growth in the crucible 400. Among them, melt 2320 refers to the molten state of the raw materials used to generate crystals.
  • a surface of a side of the seed crystal away from the seed crystal holder is substantially located at a position with the highest melt temperature. It can be understood that the distance between the surface of the side of the seed crystal away from the seed crystal support and the high temperature line with the highest melt temperature is very small, such as less than 1% of the overall depth of the melt. As shown in Figure 23, the surface of the side of the seed crystal away from the seed crystal support is located at the high temperature line 2310 of the melt. High temperature line 2310 may represent the highest temperature of the melt.
  • a portion of the seed holder is located in the melt and another portion of the seed holder is located outside the melt.
  • a part of the seed crystal holder is located in the melt, and the other part of the seed crystal holder is located outside the melt. It can be understood that exposing part of the seed crystal holder outside the melt can ensure the axial and radial temperature gradient control of the seed crystal holder and ensure better crystal growth.
  • the seed crystal holder is kept out of contact with the melt as much as possible to avoid volatile matter from adhering to the seed crystal holder, which would make it difficult to separate the crystal holder after crystal growth.
  • the seed crystal support should try not to come into contact with the melt, which is actually not conducive to the growth of the crystal.
  • part of the seed crystal holder can be located in the melt and the other part is located outside the melt.
  • the seed crystal can be placed near the high temperature line of the melt, which can ensure better crystal growth.
  • the method before sinking the seed crystal holder with the seed crystal attached into the melt for crystal growth, the method further includes: heating the melt to a preset temperature range.
  • the preset temperature range for melt heating may be 1720°C to 1780°C. It can be understood that heating the melt to a temperature range of 1720°C to 1780°C can ensure full melting of the melt and facilitate subsequent crystal growth.
  • Step 2230 use the upward pull method to grow crystals.
  • crystals can be grown by a pull-up method.
  • the seed holder can rotate around the axis of the connecting rod, and the crucible can rotate around the axis of the crucible; the axis of the connecting rod is parallel to the axis of the crucible.
  • the seed crystal holder can rotate around the axis A of the connecting rod, and the crucible can rotate around the axis of the crucible.
  • the axis of the crucible is parallel to the axis of the connecting rod.
  • growing crystals using the upward pulling method further includes: controlling the seed holder and the crucible to rotate in opposite directions.
  • the pulling can be performed better and the crystal growth efficiency can be improved.
  • the rotation speed of the seed crystal holder is 0 rpm-20 rpm; the rotation speed of the crucible is 0 rpm-20 rpm.
  • the product of the value of the rotation speed of the seed holder and the value of the rotation speed of the crucible is a preset value.
  • the product of the value of the rotation speed of the seed holder and the value of the rotation speed of the crucible is 20 or 150.
  • the product of the value of the rotation speed of the seed crystal holder and the value of the rotation speed of the crucible is controlled to be 20 or 150, which can ensure stable, fast, and high-quality growth of the crystal.
  • using the upward pulling method to grow crystals includes: keeping the seed crystal holder with the seed crystal attached to sink into the melt for 10 to 30 minutes, and pulling the seeds at a pulling speed of 0.01 mm/h to 0.2 mm/h. Crystal support for crystal growth.
  • the pulling speed may be 0.05mm/h.
  • the crystal is pulled away from the melt at a pulling speed of 30 mm/h to 40 mm/h, and the crystal and the melt surface have a separation height of 15 mm to 25 mm.
  • the crystal growth method further includes: after the crystal growth is completed, cutting the seed crystal holder along a cutting plane parallel to the seed crystal bonding surface to separate the seed crystal holder from the crystal.
  • the cutting plane covers the seed crystal support body, the protective support and the second protective cover. Due to the arrangement of the protective bracket and the second protective cover, there is no volatile matter attached between the seed crystal and the seed crystal bracket body, and the seed crystal bracket can be easily cut to separate the seed crystal bracket from the crystal.
  • the crystal growth method described in the above embodiments prevents adhesion caused by volatile substances, there is no other substance attached between the seed crystal and the seed crystal holder body, and the diameter of the seed crystal is larger than the seed crystal holder.
  • the main body can easily separate crystals; in addition, the protective bracket can also adjust the axial and radial temperature gradients to ensure stable and efficient growth of seed crystals. Therefore, the crystal growth method described in the embodiments of this specification can obtain crystals efficiently and quickly, and the obtained crystals are easy to separate.
  • process 2200 is only for example and illustration, and does not limit the scope of application of this specification.
  • various modifications and changes can be made to process 2200 under the guidance of this description. However, such modifications and changes remain within the scope of this specification.
  • numbers are used to describe the quantities of components and properties. It should be understood that such numbers used to describe the embodiments are modified by the modifiers "approximately”, “approximately” or “substantially” in some examples. Grooming. Unless otherwise stated, “about,” “approximately,” or “substantially” means that the stated number is allowed to vary by ⁇ 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending on the desired features of the individual embodiment. In some embodiments, numerical parameters should account for the specified number of significant digits and use general digit preservation methods. Although the numerical ranges and parameters used to identify the breadth of ranges in some embodiments of this specification are approximations, in specific embodiments, such numerical values are set as accurately as is feasible.

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Abstract

Provided in the embodiments of the description are a seed crystal holder and a crystal growth method. The seed crystal holder comprises a seed crystal holder body and a connecting rod. The seed crystal holder body is fixed to one end of the connecting rod. A seed crystal bonding surface is arranged on the side of the seed crystal holder body away from the connecting rod.

Description

一种籽晶托及晶体生长方法A kind of seed crystal support and crystal growth method
交叉引用cross reference
本申请要求2022年09月09日提交的申请号为202222415184.0的中国申请的优先权,其全部内容通过引用并入本文。This application claims priority to the Chinese application with application number 202222415184.0 submitted on September 9, 2022, the entire content of which is incorporated herein by reference.
技术领域Technical field
本说明书涉及晶体制备领域,特别涉及一种籽晶托及晶体生长方法。This specification relates to the field of crystal preparation, and in particular to a seed crystal support and a crystal growth method.
背景技术Background technique
液相法是生长晶体(例如,碳化硅单晶)的方法之一。在使用液相法进行晶体(例如,半导体晶体)生长时,需要先将籽晶粘接在籽晶托上,再进行晶体生长,籽晶的粘接质量直接影响制备的晶体的质量。在使用上提拉法制备晶体时,需要将籽晶粘接在籽晶托上,通过降低籽晶托使籽晶与熔液接触,从而实现晶体的生长。因此,籽晶托的结构设计、籽晶托与晶体的粘接情况等对于晶体的生长都非常重要。The liquid phase method is one of the methods for growing crystals (for example, silicon carbide single crystal). When using the liquid phase method to grow crystals (for example, semiconductor crystals), the seed crystal needs to be bonded to the seed crystal holder before growing the crystal. The bonding quality of the seed crystal directly affects the quality of the prepared crystal. When preparing crystals using the upward pulling method, the seed crystal needs to be bonded to the seed crystal holder, and the seed crystal is brought into contact with the melt by lowering the seed crystal holder, thereby achieving crystal growth. Therefore, the structural design of the seed crystal holder and the bonding condition between the seed crystal holder and the crystal are all very important for the growth of the crystal.
发明内容Contents of the invention
本说明书一个或多个实施例提供一种籽晶托,其包括籽晶托本体和连接杆,所述籽晶托本体固定在所述连接杆的一端,所述籽晶托本体上远离所述连接杆的一侧设有籽晶粘接面。One or more embodiments of this specification provide a seed crystal holder, which includes a seed crystal holder body and a connecting rod. The seed crystal holder body is fixed on one end of the connecting rod. The seed crystal holder body is located away from the connecting rod. One side of the connecting rod is provided with a seed crystal bonding surface.
在一些实施例中,所述籽晶托本体包括中空的第一内腔,所述连接杆内设有供冷却介质流通的通道;所述通道与所述第一内腔相连通。In some embodiments, the seed crystal holder body includes a hollow first inner cavity, and a channel for cooling medium to circulate is provided in the connecting rod; the channel is connected to the first inner cavity.
在一些实施例中,所述籽晶托本体上设有与所述第一内腔连通的第一通孔。In some embodiments, the seed crystal holder body is provided with a first through hole communicating with the first inner cavity.
在一些实施例中,所述内腔中设有冷却介质扩散结构。In some embodiments, a cooling medium diffusion structure is provided in the inner cavity.
在一些实施例中,所述冷却介质扩散结构包括壳体,所述壳体内形成第二内腔,所述壳体上设有多个扩散孔,所述通道与所述第二内腔连通,所述扩散孔连通所述第一内腔和所述第二内腔。In some embodiments, the cooling medium diffusion structure includes a shell, a second inner cavity is formed in the shell, a plurality of diffusion holes are provided on the shell, and the channel is connected with the second inner cavity, The diffusion hole communicates with the first inner cavity and the second inner cavity.
在一些实施例中,所述籽晶托还包括冷却设备,所述冷却设备将所述冷却介质输送给所述通道,所述冷却介质以预设流速在所述通道内流动。In some embodiments, the seed crystal holder further includes a cooling device that delivers the cooling medium to the channel, and the cooling medium flows in the channel at a preset flow rate.
在一些实施例中,所述冷却介质为惰性气体,预设流速大于0.4m/s。In some embodiments, the cooling medium is an inert gas, and the preset flow rate is greater than 0.4m/s.
在一些实施例中,所述籽晶托还包括增重结构,所述增重结构连接在所述籽晶托本体上。In some embodiments, the seed crystal holder further includes a weight-increasing structure connected to the seed crystal holder body.
在一些实施例中,所述籽晶托还包括设于所述连接杆上的冷却结构,所述冷却结构冷却所述通道内的冷却介质。In some embodiments, the seed crystal holder further includes a cooling structure provided on the connecting rod, and the cooling structure cools the cooling medium in the channel.
在一些实施例中,所述籽晶托还包括驱动机构和搅拌机构,所述连接杆的另一端与所述驱动机构相连,所述驱动机构通过连接杆带动所述籽晶托本体绕所述连接杆的轴线旋转;所述搅拌机构连接在所述籽晶托本体上,所述搅拌机构搅拌用于晶体生长的熔液。In some embodiments, the seed crystal holder further includes a driving mechanism and a stirring mechanism. The other end of the connecting rod is connected to the driving mechanism. The driving mechanism drives the seed crystal holder body around the connecting rod through the connecting rod. The axis of the connecting rod rotates; the stirring mechanism is connected to the seed crystal holder body, and the stirring mechanism stirs the melt used for crystal growth.
在一些实施例中,所述搅拌机构包括安装杆和搅拌桨,所述搅拌桨位于所述籽晶粘接面的远离所述连接杆的一侧。In some embodiments, the stirring mechanism includes a mounting rod and a stirring paddle, and the stirring paddle is located on a side of the seed crystal bonding surface away from the connecting rod.
在一些实施例中,所述搅拌机构的数量是多个,多个所述搅拌机构环绕所述籽晶托本体设置。In some embodiments, the number of the stirring mechanisms is multiple, and the plurality of stirring mechanisms are arranged around the seed holder body.
在一些实施例中,所述搅拌机构的材质为钨合金、高温陶瓷中的一种或多种。In some embodiments, the stirring mechanism is made of one or more of tungsten alloy and high-temperature ceramics.
在一些实施例中,所述籽晶托主体包括至少两个子部,所述至少两个子部的每个所述子部上均设有半槽;所述籽晶托还包括锁紧结构和卡接结构,所述卡接结构设于连接杆与所述籽晶托本体连接的一端;所述至少两个子部拼接而使得至少两个子部中各个所述子部上的半槽拼接成卡接槽,所述卡接结构卡接在所述卡接槽内;锁紧结构将拼接的所述至少两个子部相固定。In some embodiments, the seed crystal holder body includes at least two sub-parts, each of the at least two sub-parts is provided with a half groove; the seed crystal holder further includes a locking structure and a locking structure. The connecting structure is provided at one end of the connecting rod and the seed crystal holder body; the at least two sub-parts are spliced so that the half-slots on each of the at least two sub-parts are spliced into a snap-in connection slot, the clamping structure is clamped in the clamping slot; the locking structure fixes the spliced at least two sub-parts.
在一些实施例中,所述至少两个子部包括结构相同的第一子部和第二子部;所述第一子部和所述第二子部以所述连接杆的轴线为对称轴对称设置。In some embodiments, the at least two sub-parts include a first sub-part and a second sub-part with the same structure; the first sub-part and the second sub-part are axially symmetrical with respect to the axis of the connecting rod. set up.
在一些实施例中,所述卡接槽沿所述连接杆的轴线方向排列的第一槽体和第二槽体,所述第一槽体比所述第二槽体更靠近所述籽晶粘接面;所述第一槽体沿垂直于所述连接杆的轴线的截面的面积大于所述第二槽体沿垂直于所述连接杆的轴线的截面的面积;所述卡接结构沿垂直于所述连接杆的轴线的截面的面积大于所述连接杆沿垂直于所述连接杆的轴线的截面的面积。In some embodiments, the engaging groove is a first groove body and a second groove body arranged along the axial direction of the connecting rod, and the first groove body is closer to the seed crystal than the second groove body. The bonding surface; the area of the first groove body along the cross-section perpendicular to the axis of the connecting rod is greater than the area of the second groove body along the cross-section perpendicular to the axis of the connecting rod; the clamping structure is along the The area of the cross section perpendicular to the axis of the connecting rod is greater than the area of the cross section of the connecting rod along the axis perpendicular to the connecting rod.
在一些实施例中,所述卡接结构呈多面体形状。In some embodiments, the snap-in structure is in the shape of a polyhedron.
在一些实施例中,所述锁紧结构包括环形槽和锁紧环;所述环形槽环绕所述籽晶托主体的外壁设置,所述锁紧环套设在拼接后的所述至少两个子部外且设置在所述环形槽内。In some embodiments, the locking structure includes an annular groove and a locking ring; the annular groove is arranged around the outer wall of the seed crystal holder body, and the locking ring is sleeved on the spliced at least two sub-units. outside and arranged in the annular groove.
在一些实施例中,所述籽晶托还包括环形的保护托,所述保护托内设有与所述籽晶托本体的形状 匹配的容纳腔;所述保护托环绕所述籽晶托本体设置,且所述保护托环绕所述连接杆的与所述籽晶托本体连接的一端设置。In some embodiments, the seed crystal holder further includes an annular protective holder, and the protective holder is provided with a shape similar to the shape of the seed crystal holder body. Matching accommodation cavity; the protective bracket is arranged around the seed crystal holder body, and the protective bracket is arranged around one end of the connecting rod connected to the seed crystal holder body.
在一些实施例中,所述籽晶托还包括环形的第一保护套,所述第一保护套套设在所述连接杆外,且所述第一保护套位于所述连接杆与所述保护托之间。In some embodiments, the seed crystal holder further includes an annular first protective sleeve, the first protective sleeve is set outside the connecting rod, and the first protective sleeve is located between the connecting rod and the protective sleeve. between care.
在一些实施例中,所述连接杆沿所述连接杆的轴向包括第一外径段和第二外径段;所述第一外径段的外径小于所述第二外径段的外径,所述第一外径段比所述第二外径段更靠近所述籽晶托本体;所述第一保护套沿所述连接杆的轴向包括第一内径段和第二内径段;所述第一内径段的外径小于所述第二内径段的内径,所述第一内径段与所述第一外径段匹配,所述第二内径段与所述第二外径段匹配。In some embodiments, the connecting rod includes a first outer diameter segment and a second outer diameter segment along the axial direction of the connecting rod; the outer diameter of the first outer diameter segment is smaller than that of the second outer diameter segment. outer diameter, the first outer diameter section is closer to the seed crystal holder body than the second outer diameter section; the first protective sleeve includes a first inner diameter section and a second inner diameter along the axial direction of the connecting rod section; the outer diameter of the first inner diameter section is smaller than the inner diameter of the second inner diameter section, the first inner diameter section matches the first outer diameter section, the second inner diameter section matches the second outer diameter section segment matching.
在一些实施例中,所述保护托的远离所述连接杆的一侧表面上设有环形的第二保护套,所述第二保护套嵌入所述保护托内,且所述第二保护套环绕所述容纳腔设置。In some embodiments, a side surface of the protective bracket away from the connecting rod is provided with an annular second protective sleeve, the second protective sleeve is embedded in the protective bracket, and the second protective sleeve arranged around the accommodation cavity.
在一些实施例中,当所述籽晶粘接面上粘接有籽晶时,所述第二保护套远离所述连接杆的一端与所述籽晶贴合。In some embodiments, when a seed crystal is bonded to the seed crystal bonding surface, an end of the second protective sleeve away from the connecting rod is attached to the seed crystal.
在一些实施例中,所述保护托的远离所述连接杆的一侧表面上设有第一凹槽;所述第一凹槽的直径大于所述容纳腔背离所述连接杆的一侧的开口的直径;所述第一凹槽包括与所述开口连通的连通部分以及环绕在所述连通部分外的环形部分;所述环形部分的底面与所述籽晶粘接面位于同一平面上;所述环形保护套设于所述环形部分的底面上。In some embodiments, a first groove is provided on the side surface of the protective bracket away from the connecting rod; the diameter of the first groove is larger than the diameter of the side of the accommodation cavity away from the connecting rod. The diameter of the opening; the first groove includes a communication portion connected to the opening and an annular portion surrounding the communication portion; the bottom surface of the annular portion and the seed bonding surface are located on the same plane; The annular protective sleeve is arranged on the bottom surface of the annular part.
在一些实施例中,所述第一凹槽的直径大于所述开口的直径5mm-10mm。In some embodiments, the diameter of the first groove is 5 mm to 10 mm larger than the diameter of the opening.
在一些实施例中,所述籽晶粘接面上粘接有石墨纸,所述石墨纸朝向远离所述连接杆的方向凸出于所述第二保护套的远离所述连接杆的一侧表面。In some embodiments, graphite paper is adhered to the bonding surface of the seed crystal, and the graphite paper protrudes from a side of the second protective sleeve away from the connecting rod in a direction away from the connecting rod. surface.
本说明书一个或多个实施例提供一种籽晶粘接装置,所述籽晶粘接装置包括一个或多个粘接组件,所述粘接组件包括支撑部件和施压部件,所述支撑部件支撑籽晶托,所述施压部件施加压力,所述压力将所述籽晶托和所述籽晶托上的籽晶相向压合。One or more embodiments of this specification provide a seed crystal bonding device. The seed crystal bonding device includes one or more bonding components. The bonding components include a support component and a pressure component. The support component The seed crystal holder is supported, and the pressing member applies pressure, and the pressure presses the seed crystal holder and the seed crystal on the seed crystal holder toward each other.
在一些实施例中,所述支撑部件包括第一压件和第二压件,所述施压部件包括第一压盘;所述第一压件的侧壁包括至少一个第一排气孔;所述第二压件与所述第一压件嵌套连接;其中,在籽晶粘接固定过程中,籽晶放置于所述第二压件的上表面,籽晶托放置于所述籽晶上表面;所述第一压盘向所述籽晶托施加压力。In some embodiments, the support component includes a first pressure part and a second pressure part, the pressure applying component includes a first pressure plate; the side wall of the first pressure part includes at least one first vent hole; The second pressing piece is nestedly connected to the first pressing piece; during the bonding and fixing process of the seed crystal, the seed crystal is placed on the upper surface of the second pressing piece, and the seed crystal holder is placed on the seed crystal. The upper surface of the crystal; the first pressure plate applies pressure to the seed crystal support.
在一些实施例中,所述第一压件底部包括第二通孔,所述第二压件底部包括第一凸起,所述第一凸起与所述第二通孔相互配合实现所述第一压件和所述第二压件的嵌套连接。In some embodiments, the bottom of the first pressing member includes a second through hole, the bottom of the second pressing member includes a first protrusion, and the first protrusion and the second through hole cooperate with each other to achieve the Nested connection of the first pressing part and the second pressing part.
在一些实施例中,所述第一排气孔的横截面直径包括0.01mm-10mm。In some embodiments, the cross-sectional diameter of the first exhaust hole includes 0.01mm-10mm.
在一些实施例中,所述第一压件和所述第二压件嵌套连接后,所述第一排气孔与所述第二压件上表面的竖直距离在0.2mm-5mm的范围内。In some embodiments, after the first pressure part and the second pressure part are nested and connected, the vertical distance between the first exhaust hole and the upper surface of the second pressure part is between 0.2 mm and 5 mm. within the range.
在一些实施例中,所述第二压件的侧壁包括至少一个第二排气孔,所述第一排气孔与所述第二排气孔至少部分相对应。In some embodiments, the side wall of the second pressing member includes at least one second vent hole, and the first vent hole at least partially corresponds to the second vent hole.
在一些实施例中,所述第二排气孔的横截面直径包括0.01mm-10mm。In some embodiments, the cross-sectional diameter of the second exhaust hole includes 0.01mm-10mm.
在一些实施例中,所述第二排气孔与所述第二压件上表面的竖直距离在0.2mm-5mm的范围内。In some embodiments, the vertical distance between the second exhaust hole and the upper surface of the second pressure part is in the range of 0.2mm-5mm.
在一些实施例中,所述第二压件的高度小于所述第一压件的高度。In some embodiments, the height of the second pressing part is smaller than the height of the first pressing part.
在一些实施例中,所述籽晶托与所述第一压件螺纹连接。In some embodiments, the seed crystal holder is threadedly connected to the first pressing member.
在一些实施例中,所述第一压盘底部包括第二凸起,所述籽晶托上部包括第二凹槽,所述第二凸起和所述第二凹槽配合实现所述第一压盘和所述籽晶托的连接。In some embodiments, the bottom of the first pressure plate includes a second protrusion, the upper part of the seed crystal support includes a second groove, and the second protrusion cooperates with the second groove to realize the first The connection between the pressure plate and the seed crystal holder.
在一些实施例中,支撑部件包括环形底座,所述环形底座和盖体,所述籽晶托放置在所述环形底座上;所述盖体包括环形的侧壁和盖板,所述侧壁套设在所述环形底座外,所述盖体向所述籽晶托上的籽晶施加压力。In some embodiments, the support component includes an annular base, the annular base and a cover, the seed crystal holder is placed on the annular base; the cover includes an annular side wall and a cover plate, the side wall Set outside the annular base, the cover exerts pressure on the seed crystal on the seed crystal holder.
在一些实施例中,还包括第一连接件和第二连接件,所述第一连接件设于所述环形底座上,所述第二连接件设于所述盖体上;所述第一连接件与所述第二连接件可拆卸连接;当所述第一连接件与所述第二连接件连接,所述盖体的盖板向所述籽晶托上的籽晶施加压力。In some embodiments, it also includes a first connecting member and a second connecting member, the first connecting member is provided on the annular base, and the second connecting member is provided on the cover; the first connecting member is provided on the annular base, and the second connecting member is provided on the cover; The connecting piece is detachably connected to the second connecting piece; when the first connecting piece is connected to the second connecting piece, the cover plate of the cover exerts pressure on the seed crystal on the seed crystal holder.
在一些实施例中,所述底座上设有锁紧结构,所述锁紧结构将所述籽晶托固定到所述环形底座上。In some embodiments, a locking structure is provided on the base, and the locking structure fixes the seed crystal holder to the annular base.
在一些实施例中,所述籽晶托的远离所述籽晶粘接面的一侧设有连接螺纹孔,锁紧结构包括锁紧盘、锁紧件和锁紧螺母,所述锁紧件包括托盘、第一螺纹杆和第二螺纹杆,所述托盘承托所述籽晶托的远离所述籽晶粘接面的一侧,所述第一螺纹杆与所述连接螺纹孔配合;所述锁紧盘上设有安装孔,所述第二螺纹杆穿过所述安装孔,所述锁紧螺母与所述第二螺纹杆配合;所述锁紧螺母和所述托盘分别位于所述锁紧盘的沿所述安装孔的轴线方向的两侧。In some embodiments, the side of the seed crystal holder away from the seed crystal bonding surface is provided with a connecting threaded hole, and the locking structure includes a locking disk, a locking piece and a locking nut. The locking piece It includes a tray, a first threaded rod and a second threaded rod, the tray supports the side of the seed crystal holder away from the seed crystal bonding surface, the first threaded rod cooperates with the connecting threaded hole; The locking plate is provided with a mounting hole, the second threaded rod passes through the mounting hole, and the locking nut cooperates with the second threaded rod; the locking nut and the tray are respectively located at the Two sides of the locking disk along the axis direction of the mounting hole.
在一些实施例中,所述托盘由弹性材料制成。 In some embodiments, the tray is made of elastic material.
在一些实施例中,所述环形底座的内壁上设有承托结构,所述承托结构包括环形连接板、环形承托板和环形承托凸起;所述环形承托板的外环连接所述环形连接板,所述环形承托板的内环设有所述环形承托凸起,所述环形承托凸起承托所述籽晶托;所述环形连接板连接所述环形底座的内壁。In some embodiments, a supporting structure is provided on the inner wall of the annular base, and the supporting structure includes an annular connecting plate, an annular supporting plate and an annular supporting protrusion; the outer ring connection of the annular supporting plate The annular connecting plate, the inner ring of the annular supporting plate is provided with the annular supporting protrusion, the annular supporting protrusion supports the seed crystal holder; the annular connecting plate is connected to the annular base inner wall.
在一些实施例中,所述盖体上设气泡去除装置,所述气泡去除装置去除籽晶与所述籽晶托之间的气泡。In some embodiments, a bubble removal device is provided on the cover, and the bubble removal device removes bubbles between the seed crystal and the seed crystal holder.
在一些实施例中,所述气泡去除装置包括插槽、插板和滚轮;所述插槽设于所述盖体上,所述插板位于所述插槽内,所述滚轮设于所述插板的一端;所述插板在所述插槽内运动,以带动所述滚轮滚压所述籽晶。In some embodiments, the bubble removal device includes a slot, an insert plate and a roller; the slot is provided on the cover, the insert plate is located in the slot, and the roller is provided on the cover. One end of the inserting plate; the inserting plate moves in the slot to drive the roller to roll the seed crystal.
在一些实施例中,所述插板的另一端设有拉环。In some embodiments, the other end of the plug-in board is provided with a pull ring.
在一些实施例中,所述粘接组件的数量是多个,所述支撑部件包括支撑盘,所述支撑盘承托所述籽晶和所述籽晶托,所述籽晶位于所述支撑盘和所述籽晶托之间;所述籽晶粘接装置还包括支撑架以及设于所述支撑架上的多个施压驱动件,所述支撑盘设于所述支撑架上,所述籽晶粘接装置包括多个粘接组件,多个施压驱动件分别与多个所述施压部件连接;所述施压驱动件使得所述施压部件对所述籽晶托施加朝向所述支撑盘的压力。In some embodiments, the number of the bonding components is multiple, the support component includes a support plate, the support plate supports the seed crystal and the seed crystal holder, and the seed crystal is located on the support plate. between the disk and the seed crystal holder; the seed crystal bonding device also includes a support frame and a plurality of pressure driving parts provided on the support frame, the support disk is provided on the support frame, so The seed crystal bonding device includes a plurality of bonding components, and a plurality of pressure driving members are respectively connected to a plurality of the pressure members; the pressure driving member causes the pressure member to exert an orientation on the seed crystal holder. The pressure of the support plate.
在一些实施例中,所述支撑架包括沿着竖直方向延伸的多根支撑杆,多根所述支撑杆沿所述支撑盘的周向间隔布置;多个所述施压驱动件设于至少一根所述支撑杆上,且多个所述施压驱动件沿所述竖直方向间隔布置,多个籽晶粘接组件沿竖直方向间隔布置。In some embodiments, the support frame includes a plurality of support rods extending in a vertical direction, and the plurality of support rods are arranged at intervals along the circumference of the support plate; a plurality of the pressure driving members are provided on On at least one of the support rods, a plurality of the pressure driving members are arranged at intervals along the vertical direction, and a plurality of seed bonding assemblies are arranged at intervals along the vertical direction.
在一些实施例中,所述施压驱动件包括气压施压驱动件或液压施压驱动件。In some embodiments, the pressure driving member includes a pneumatic pressure driving member or a hydraulic pressure driving member.
在一些实施例中,设置有所述施压驱动件的所述支撑杆上设有传压介质通道,至少一个所述施压驱动件通过阀门与所述传压介质通道连通。In some embodiments, the support rod provided with the pressure-applying driving member is provided with a pressure-transmitting medium channel, and at least one of the pressure-applying driving members is connected to the pressure-transmitting medium channel through a valve.
在一些实施例中,所述支撑盘可旋转地设于所述支撑架上,所述支撑盘的旋转轴线平行于所述支撑杆,所述籽晶粘接装置还包括旋转驱动件,所述旋转驱动件与所述支撑盘连接,以驱动所述支撑盘旋转。In some embodiments, the support plate is rotatably disposed on the support frame, the rotation axis of the support plate is parallel to the support rod, and the seed bonding device further includes a rotation drive member, The rotation driving member is connected with the support plate to drive the support plate to rotate.
在一些实施例中,所述旋转驱动件包括磁性元件、动力源和磁性驱动件;所述磁性驱动件与所述磁性元件磁耦合,所述磁性元件固定在所述支撑盘上,所述磁性驱动件固定在所述动力源的输出端上;所述动力源驱动所述磁性驱动件旋转,以驱动所述磁性元件带动所述支撑盘旋转。In some embodiments, the rotational driving member includes a magnetic element, a power source and a magnetic driving member; the magnetic driving member is magnetically coupled to the magnetic element, the magnetic element is fixed on the support plate, and the magnetic driving member is magnetically coupled to the magnetic element. The driving member is fixed on the output end of the power source; the power source drives the magnetic driving member to rotate to drive the magnetic element to drive the support plate to rotate.
在一些实施例中,所述施压部件包括设于所示支撑架上的限位压盘,所述施压驱动件包括第一子驱动件和第二子驱动件,所述第一子驱动件和所述第二子驱动件设于不同的所述支撑杆上;所述第一子驱动件和所述第二子驱动件沿所述限位压盘的周向间隔布置,且所述第一子驱动件和所述第二子驱动件均与所述限位压盘连接。In some embodiments, the pressure-applying component includes a limiting pressure plate provided on the support frame, the pressure-applying driving member includes a first sub-driving member and a second sub-driving member, and the first sub-driving member The first sub-driving part and the second sub-driving part are arranged at intervals along the circumference of the limiting pressure plate, and the The first sub-driving member and the second sub-driving member are both connected to the limiting pressure plate.
在一些实施例中,所述籽晶粘接装置还包括压力传感器,所述压力传感器用于确定各个所述施压部件所施加的压力。In some embodiments, the seed bonding device further includes a pressure sensor, the pressure sensor being used to determine the pressure exerted by each of the pressure applying components.
在一些实施例中,所述籽晶粘接装置还包括控制器,所述控制器与所述阀门和所述压力传感器均信号连接;所述控制器被配置为:基于所述压力传感器感应的压力数据,调节所述阀门的开度。In some embodiments, the seed bonding device further includes a controller, the controller is signally connected to both the valve and the pressure sensor; the controller is configured to: based on the pressure sensor sensed Pressure data adjusts the opening of the valve.
本说明书一个或多个实施例提供一种坩埚,包括坩埚本体、驱动组件和温场保持盘,所述驱动组件包括驱动源和连接机构,所述连接机构连接在所述驱动源与所述坩埚本体的底部之间,所述驱动组件驱动所述坩埚本体绕坩埚本体的轴线相对所述温场保持盘旋转;所述温场保持盘设于所述连接结构上,且位于所述驱动源与所述坩埚本体的底部之间。One or more embodiments of this specification provide a crucible, including a crucible body, a driving assembly and a temperature field holding disk. The driving assembly includes a driving source and a connecting mechanism. The connecting mechanism is connected between the driving source and the crucible. Between the bottom of the body, the driving assembly drives the crucible body to rotate around the axis of the crucible body relative to the temperature field holding disk; the temperature field holding disk is provided on the connection structure and is located between the driving source and the between the bottom of the crucible body.
在一些实施例中,所述连接机构包括旋转柱和第一承托盘,所述第一承托盘设于所述旋转柱的一端,所述驱动源连接在所述旋转柱的另一端。In some embodiments, the connection mechanism includes a rotating column and a first supporting tray, the first supporting tray is provided at one end of the rotating column, and the driving source is connected to the other end of the rotating column.
在一些实施例中,所述第一承托盘上包括同心布置的多个阶梯状凹槽。In some embodiments, the first supporting tray includes a plurality of stepped grooves arranged concentrically.
在一些实施例中,所述连接机构包括第二承托盘,所述第二承托盘呈环形,所述第二承托盘位于所述第一承托盘和所述驱动源之间,所述第二承托盘的内环与所述旋转柱的外壁固定;所述第二承托盘与所述温场保持盘之间通过滚珠结构连接。In some embodiments, the connection mechanism includes a second supporting tray, the second supporting tray is annular, the second supporting tray is located between the first supporting tray and the driving source, and the second supporting tray is annular. The inner ring of the supporting tray is fixed to the outer wall of the rotating column; the second supporting tray and the temperature field holding disk are connected through a ball structure.
在一些实施例中,所述温场保持盘的材质为莫来石、刚玉以及氧化铝中的至少一种。In some embodiments, the material of the temperature field holding disk is at least one of mullite, corundum, and alumina.
在一些实施例中,所述坩埚还包括多根伸缩支撑杆,所述伸缩支撑杆的一端连接在所述温场保持盘的底部。In some embodiments, the crucible further includes a plurality of telescopic support rods, one end of the telescopic support rods is connected to the bottom of the temperature field holding plate.
在一些实施例中,所述坩埚还包括连接环和锁紧机构,所述连接环的侧壁上设有锁紧孔;所述连接环套设在所述驱动源的输出轴以及所述旋转柱的另一端外,所述锁紧孔与所述锁紧机构配合而将所述连接环与所述驱动源的输出轴以及所述旋转柱固定。In some embodiments, the crucible further includes a connecting ring and a locking mechanism, and a locking hole is provided on the side wall of the connecting ring; the connecting ring is sleeved on the output shaft of the driving source and the rotating Outside the other end of the column, the locking hole cooperates with the locking mechanism to fix the connecting ring with the output shaft of the driving source and the rotating column.
本说明书一个或多个实施例提供一种晶体生长方法,使用如前述实施例中所述的籽晶托,包括以下步骤:将籽晶粘接在籽晶托本体的籽晶粘接面上;将粘有所述籽晶的所述籽晶托沉入坩埚中的用于晶体生长的熔体中,且所述籽晶的远离所述籽晶托的一侧表面位于所述熔体温度最高的位置处;使用上提拉法 生长晶体。One or more embodiments of this specification provide a crystal growth method, using the seed crystal holder as described in the previous embodiment, including the following steps: bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body; The seed crystal holder with the seed crystal attached to it is sunk into the melt used for crystal growth in the crucible, and the surface of the side of the seed crystal away from the seed crystal holder is located at the highest temperature of the melt. at the position; use the upward pulling method Growing crystals.
在一些实施例中,所述籽晶托本体的一部分位于所述熔体中,所述籽晶托本体的另一部分位于所述熔体外。In some embodiments, a part of the seed holder body is located in the melt, and another part of the seed holder body is located outside the melt.
在一些实施例中,所述籽晶托能够绕着连接杆的轴线旋转,所述坩埚能够绕着所述坩埚的轴线旋转;所述连接杆的轴线与所述坩埚的轴线平行;所述使用上提拉法生长晶体包括:控制所述籽晶托和所述坩埚沿着相反的方向旋转。In some embodiments, the seed crystal holder can rotate around the axis of the connecting rod, and the crucible can rotate around the axis of the crucible; the axis of the connecting rod is parallel to the axis of the crucible; the use Growing crystals by the upward pulling method includes controlling the rotation of the seed holder and the crucible in opposite directions.
在一些实施例中,所述籽晶托的旋转速度是0rpm~20rpm;所述坩埚的旋转速度是0rpm~20rpm。In some embodiments, the rotation speed of the seed crystal holder is 0 rpm-20 rpm; the rotation speed of the crucible is 0 rpm-20 rpm.
在一些实施例中,所述籽晶托的旋转速度的数值与所述坩埚的旋转速度的数值的乘积为20或150。In some embodiments, the product of the value of the rotation speed of the seed holder and the value of the rotation speed of the crucible is 20 or 150.
在一些实施例中,在将粘有所述籽晶的所述籽晶托沉入用于晶体生长的熔体中之前,还包括:将所述熔体升温至1720℃~1780℃。In some embodiments, before sinking the seed crystal holder with the seed crystal adhered to it into the melt used for crystal growth, the method further includes: heating the melt to 1720°C to 1780°C.
在一些实施例中,所述使用上提拉法生长晶体包括:保持粘有所述籽晶的所述籽晶托沉入所述熔体10min~30min;按照0.01mm/h~0.2mm/h的提拉速度提拉所述籽晶托而进行晶体生长。In some embodiments, the use of the upward pulling method to grow crystals includes: keeping the seed crystal holder with the seed crystal attached to sink into the melt for 10 to 30 minutes; The pulling speed pulls the seed crystal support to perform crystal growth.
在一些实施例中,所述使用上提拉法生长晶体包括:在晶体生长10h~30h后,按30mm/h-40mm/h的提拉速度将晶体提拉离开所述熔体,且所述晶体与所述熔体表面具有15mm~25mm的间隔高度。In some embodiments, the use of the upward pulling method to grow the crystal includes: after the crystal grows for 10h to 30h, the crystal is pulled away from the melt at a pulling speed of 30mm/h-40mm/h, and the The distance between the crystal and the melt surface is 15 mm to 25 mm.
在一些实施例中,将籽晶粘接在籽晶托本体的籽晶粘接面上,包括:使得所述籽晶的直径大于所述籽晶托本体的直径5mm-10mm,且所述籽晶突出于所述保护托的远离所述连接杆的一侧表面0.1mm-0.2mm。In some embodiments, bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body includes: making the diameter of the seed crystal 5 mm-10 mm larger than the diameter of the seed crystal holder body, and the seed crystal The crystal protrudes from the side surface of the protective bracket away from the connecting rod by 0.1mm-0.2mm.
在一些实施例中,所述保护托的远离所述连接杆的一侧表面上设有环形的第二保护套,所述第二保护套嵌入所述保护托内,且所述第二保护套环绕所述容纳腔设置;所述将籽晶粘接在籽晶托本体的籽晶粘接面上,包括:将籽晶与所述第二保护套远离所述连接杆的一端贴合,并粘接在籽晶托本体的籽晶粘接面上;所述晶体生长方法还包括:在晶体生长完成后,沿平行于所述籽晶粘接面的切割平面切割所述籽晶托,以将所述籽晶托与所述晶体分离;所述切割平面覆盖所述籽晶托本体、所述保护托和所述第二保护套。In some embodiments, a side surface of the protective bracket away from the connecting rod is provided with an annular second protective sleeve, the second protective sleeve is embedded in the protective bracket, and the second protective sleeve Set around the accommodation cavity; bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body includes: fitting the seed crystal with the end of the second protective sleeve away from the connecting rod, and Bonded to the seed crystal bonding surface of the seed crystal holder body; the crystal growth method also includes: after the crystal growth is completed, cutting the seed crystal holder along a cutting plane parallel to the seed crystal bonding surface, so as to Separate the seed crystal support from the crystal; the cutting plane covers the seed crystal support body, the protective support and the second protective cover.
附图说明Description of the drawings
本说明书将以示例性实施例的方式进一步说明,这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的,在这些实施例中,相同的编号表示相同的结构,其中:This specification is further explained by way of example embodiments, which are described in detail by means of the accompanying drawings. These embodiments are not limiting. In these embodiments, the same numbers represent the same structures, where:
图1是根据本说明书一些实施例所示的籽晶托的示例性结构图;Figure 1 is an exemplary structural diagram of a seed crystal holder according to some embodiments of this specification;
图2A是根据本说明书一些实施例所示的另一籽晶托的示例性剖面图;2A is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification;
图2B是根据本说明书一些实施例所示的另一籽晶托的示例性剖面图;2B is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification;
图2C是根据本说明书一些实施例所示的另一籽晶托的示例性剖面图;2C is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification;
图3是根据本说明书一些实施例所示的另一籽晶托的示例性剖面图;Figure 3 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification;
图4是根据本说明书一些实施例所示的另一籽晶托的示例性剖面图;Figure 4 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification;
图5是根据本说明书一些实施例所示的另一籽晶托的示例性剖面图;Figure 5 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification;
图6A是根据本说明书一些实施例所示的第一子部的示例性正视图;Figure 6A is an exemplary front view of the first sub-section in accordance with some embodiments of the present disclosure;
图6B是根据本说明书一些实施例所示的第二子部的示例性正视图;Figure 6B is an exemplary front view of the second sub-portion shown in accordance with some embodiments of the present specification;
图6C是根据本说明书一些实施例所示的第一子部与第二子部拼接后的示例性正视图;Figure 6C is an exemplary front view of the first sub-part and the second sub-part after splicing according to some embodiments of this specification;
图7是根据本说明书一些实施例所示的另一籽晶托示例性俯视图;Figure 7 is an exemplary top view of another seed crystal support according to some embodiments of this specification;
图8是根据本说明书一些实施例所示的锁紧结构的示例性剖面图;Figure 8 is an exemplary cross-sectional view of a locking structure according to some embodiments of the present specification;
图9是根据本说明书一些实施例所示的锁紧结构的示例性仰视图;Figure 9 is an exemplary bottom view of a locking structure according to some embodiments of the present specification;
图10是根据本说明书一些实施例所示的另一籽晶托的示例性剖面图;Figure 10 is an exemplary cross-sectional view of another seed holder according to some embodiments of the present specification;
图11是根据本说明书一些实施例所示的籽晶粘接装置的示例性模块图;Figure 11 is an exemplary module diagram of a seed bonding device according to some embodiments of this specification;
图12是根据本说明书一些实施例所示的籽晶粘接装置的示例性结构图;Figure 12 is an exemplary structural diagram of a seed bonding device according to some embodiments of this specification;
图13是根据本说明书一些实施例所示的籽晶组件的示例性结构图;Figure 13 is an exemplary structural diagram of a seed crystal assembly according to some embodiments of this specification;
图14是根据本说明书一些实施例所示的另一籽晶粘接装置的示例性剖面图;Figure 14 is an exemplary cross-sectional view of another seed bonding device according to some embodiments of the present specification;
图15A是根据本说明书一些实施例所示的锁紧件的示例性结构图;Figure 15A is an exemplary structural diagram of a locking member according to some embodiments of this specification;
图15B是根据本说明书一些实施例所示的气泡去除装置的示例性俯视图;Figure 15B is an exemplary top view of a bubble removal device according to some embodiments of the present specification;
图16是根据本说明书一些实施例所示的另一籽晶粘接装置的示例性结构图;Figure 16 is an exemplary structural diagram of another seed bonding device according to some embodiments of this specification;
图17是根据本说明书一些实施例所示的坩埚的示例性模块图;Figure 17 is an exemplary block diagram of a crucible according to some embodiments of the present specification;
图18是根据本说明书一些实施例所示的连接机构的示例性结构图;Figure 18 is an exemplary structural diagram of a connection mechanism according to some embodiments of this specification;
图19是根据本说明书一些实施例所示的第二承托盘的示例性结构图;Figure 19 is an exemplary structural diagram of a second supporting tray according to some embodiments of this specification;
图20A是根据本说明书一些实施例所示的伸缩支撑杆的示例性结构图;Figure 20A is an exemplary structural diagram of a telescopic support rod according to some embodiments of this specification;
图20B是根据本说明书一些实施例所示的温场保持盘的示例性结构图; Figure 20B is an exemplary structural diagram of a temperature field holding disk according to some embodiments of this specification;
图21是根据本说明书一些实施例所示的连接环的示例性结构图;Figure 21 is an exemplary structural diagram of a connecting ring according to some embodiments of this specification;
图22是根据本说明书一些实施例所示的晶体生长方法的示例性流程图;Figure 22 is an exemplary flow chart of a crystal growth method according to some embodiments of this specification;
图23是根据本说明书一些实施例所示的生成晶体的示意图。Figure 23 is a schematic diagram of a generated crystal according to some embodiments of the present specification.
具体实施方式Detailed ways
为了更清楚地说明本说明书实施例的技术方案,下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地,下面描述中的附图仅仅是本说明书的一些示例或实施例,对于本领域的普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图将本说明书应用于其它类似情景。除非从语言环境中显而易见或另做说明,图中相同标号代表相同结构或操作。In order to explain the technical solutions of the embodiments of this specification more clearly, the accompanying drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some examples or embodiments of this specification. For those of ordinary skill in the art, without exerting any creative efforts, this specification can also be applied to other applications based on these drawings. Other similar scenarios. Unless obvious from the locale or otherwise stated, the same reference numbers in the figures represent the same structure or operation.
应当理解,本文使用的“系统”、“装置”、“单元”和/或“模块”是用于区分不同级别的不同组件、元件、部件、部分或装配的一种方法。然而,如果其他词语可实现相同的目的,则可通过其他表达来替换所述词语。It will be understood that the terms "system", "apparatus", "unit" and/or "module" as used herein are a means of distinguishing between different components, elements, parts, portions or assemblies at different levels. However, said words may be replaced by other expressions if they serve the same purpose.
如本说明书和权利要求书中所示,除非上下文明确提示例外情形,“一”、“一个”、“一种”和/或“该”等词并非特指单数,也可包括复数。一般说来,术语“包括”与“包含”仅提示包括已明确标识的步骤和元素,而这些步骤和元素不构成一个排它性的罗列,方法或者设备也可能包含其它的步骤或元素。As shown in this specification and claims, words such as "a", "an", "an" and/or "the" do not specifically refer to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only imply the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements.
图1是根据本说明书一些实施例所示的籽晶托的示例性结构图。Figure 1 is an exemplary structural diagram of a seed crystal holder according to some embodiments of this specification.
本说明书提供了一种籽晶托100,该籽晶托100可以用于实现晶体生长。在制备晶体时,需要将籽晶130粘接在籽晶托100上,籽晶托100可以设置在籽晶粘接装置30上,将制备晶体的原料放置于坩埚400内,通过对籽晶托100以及坩埚400所在的温场进行加热,使原料挥发为气相组分并运动至上部籽晶130处,从而实现液相法的晶体生长。其中,前述籽晶130可以包括半导体籽晶,例如,碳化硅籽晶。关于籽晶粘接装置30的更多内容参见图12-图16及其相关说明,关于坩埚400的更多内容参见图17-图20B及其相关说明。This specification provides a seed crystal holder 100, which can be used to achieve crystal growth. When preparing a crystal, the seed crystal 130 needs to be bonded to the seed crystal holder 100. The seed crystal holder 100 can be arranged on the seed crystal bonding device 30. The raw materials for preparing the crystal are placed in the crucible 400. 100 and the temperature field where the crucible 400 is located are heated, causing the raw materials to volatilize into gas phase components and move to the upper seed crystal 130, thereby realizing crystal growth by the liquid phase method. Wherein, the aforementioned seed crystal 130 may include a semiconductor seed crystal, for example, a silicon carbide seed crystal. For more information about the seed bonding device 30, please refer to FIGS. 12-16 and its related descriptions, and for more information about the crucible 400, please refer to FIGS. 17-20B and its related descriptions.
如图1所示,籽晶托100可以包括籽晶托本体110和连接杆120。籽晶托本体110用于固定籽晶130,籽晶托本体110的材质可以为石墨,籽晶托本体110可以在一定条件(例如,抽真空、加热等)下对籽晶130进行粘接。籽晶托本体110可以设置为柱状(如图1中所示的圆柱状籽晶托本体110)、台状(如图10中所示圆台状籽晶托本体110)或其他可行形状。As shown in FIG. 1 , the seed crystal holder 100 may include a seed crystal holder body 110 and a connecting rod 120 . The seed crystal holder body 110 is used to fix the seed crystal 130. The material of the seed crystal holder body 110 can be graphite. The seed crystal holder body 110 can bond the seed crystal 130 under certain conditions (for example, vacuuming, heating, etc.). The seed crystal holder body 110 may be configured in a columnar shape (the cylindrical seed crystal holder body 110 shown in Figure 1), a cone shape (the frustum seed crystal holder body 110 shown in Figure 10), or other feasible shapes.
连接杆120用于连接籽晶托本体110与驱动设备(如下文的驱动机构150),从而使得驱动设备可以驱动籽晶托本体110沿着连接杆120的轴向运动或者绕连接杆120的轴线转动。如图1所示,籽晶托本体110固定在连接杆120的一端。籽晶托本体110与连接杆120的连接方式可以有多种。在一些实施例中,籽晶托本体110的远离籽晶粘接面111的一侧设有连接螺纹孔,连接杆120上可以设有连接螺纹,连接杆120可以通过连接螺纹与前述连接螺纹孔的配合实现与籽晶托本体110螺纹连接。连接杆120还可以其他可行连接方式与籽晶托本体110相连,关于其他可行连接方式可以参见图5至图7及其相关描述。The connecting rod 120 is used to connect the seed crystal holder body 110 and the driving device (such as the driving mechanism 150 below), so that the driving device can drive the seed crystal holder body 110 to move along the axial direction of the connecting rod 120 or around the axis of the connecting rod 120 Turn. As shown in FIG. 1 , the seed crystal holder body 110 is fixed on one end of the connecting rod 120 . The seed crystal holder body 110 and the connecting rod 120 can be connected in various ways. In some embodiments, a connecting threaded hole is provided on the side of the seed crystal holder body 110 away from the seed crystal bonding surface 111, and a connecting thread can be provided on the connecting rod 120. The connecting rod 120 can be connected to the aforementioned connecting threaded hole through the connecting thread. The cooperation realizes threaded connection with the seed crystal holder body 110. The connecting rod 120 can also be connected to the seed crystal holder body 110 in other possible connection ways. For other possible connection ways, please refer to Figures 5 to 7 and their related descriptions.
在一些实施例中,如图1所示,籽晶托本体110上远离连接杆的一侧设有用于将籽晶130粘接在籽晶托本体110上的籽晶粘接面111。籽晶粘接面111可以是平面,以保证籽晶130可以更加稳定地粘接在籽晶托本体110上。籽晶粘接面111可以设于籽晶托本体110的端面。例如,籽晶托本体110为圆柱形时,籽晶粘接面111可以在圆柱的端面。又例如,籽晶托本体110为圆台形时,籽晶粘接面111可以在圆台中面积较大的端面。In some embodiments, as shown in FIG. 1 , a seed bonding surface 111 is provided on the side of the seed holder body 110 away from the connecting rod for bonding the seed crystal 130 to the seed holder body 110 . The seed crystal bonding surface 111 may be a flat surface to ensure that the seed crystal 130 can be more stably bonded to the seed crystal holder body 110 . The seed crystal bonding surface 111 can be provided on the end surface of the seed crystal holder body 110 . For example, when the seed crystal holder body 110 is cylindrical, the seed crystal bonding surface 111 can be on the end surface of the cylinder. For another example, when the seed crystal holder body 110 is in the shape of a truncated cone, the seed crystal bonding surface 111 can be on the end face with a larger area in the truncated cone.
本说明书的一些实施例,通过将籽晶托100中的籽晶托本体110固定在连接杆120的一端,可以使连接杆120对籽晶托本体施加压力,籽晶130可以稳定粘接在籽晶粘接面111上,有助于提高晶体生长质量。In some embodiments of this specification, by fixing the seed crystal holder body 110 in the seed crystal holder 100 to one end of the connecting rod 120, the connecting rod 120 can exert pressure on the seed crystal holder body, and the seed crystal 130 can be stably bonded to the seed crystal holder. On the crystal bonding surface 111, it helps to improve the quality of crystal growth.
在一些实施例中,如图2A所示,籽晶托本体110还可以包括中空的第一内腔112,连接杆120内还可以设有供冷却介质流通的通道121,通道121与第一内腔112相连通。第一内腔112是籽晶托本体110的中空结构形成的内部空间,用于汇集冷却介质以降低籽晶托本体110的温度。在一些实施例中,第一内腔112的形状与籽晶托本体110的形状相匹配,以使得籽晶托100的壁厚度均匀,进而实现传热均匀。例如,籽晶托本体110可以为圆柱体、立方体或多棱柱,对应的,第一内腔112的形状也可以为圆柱体、立方体或多棱柱等。连接杆120可以为空心杆,以形成通道,从而通入冷却介质。冷却介质指用于冷却籽晶托的流体,例如氦气、氩气等。在一些实施例中,冷却介质可以为惰性气体(如,常温氩气)。In some embodiments, as shown in FIG. 2A , the seed crystal holder body 110 may also include a hollow first inner cavity 112 , and a channel 121 for cooling medium to circulate may be provided in the connecting rod 120 . The channel 121 is connected to the first inner cavity 112 . The cavities 112 are connected. The first inner cavity 112 is an internal space formed by the hollow structure of the seed crystal holder body 110 and is used to collect cooling medium to reduce the temperature of the seed crystal holder body 110 . In some embodiments, the shape of the first inner cavity 112 matches the shape of the seed holder body 110 so that the wall thickness of the seed holder 100 is uniform, thereby achieving uniform heat transfer. For example, the seed holder body 110 can be a cylinder, a cube or a polygonal prism, and correspondingly, the shape of the first inner cavity 112 can also be a cylinder, a cube or a polygonal prism, etc. The connecting rod 120 may be a hollow rod to form a channel to pass the cooling medium. The cooling medium refers to the fluid used to cool the seed crystal support, such as helium, argon, etc. In some embodiments, the cooling medium may be an inert gas (eg, room temperature argon).
本说明书一些实施例,通过连接杆120内的通道121与第一内腔112相连,冷却介质可以通过通道121进入籽晶托本体110的第一内腔112中,从而对籽晶托本体110进行冷却,而因为坩埚400中熔液的温度较高,对籽晶托本体110的冷却可以增加籽晶托本体110内部的温度梯度,有助于加快晶体的生成。In some embodiments of this specification, the channel 121 in the connecting rod 120 is connected to the first inner cavity 112, and the cooling medium can enter the first inner cavity 112 of the seed crystal holder body 110 through the channel 121, thereby performing maintenance on the seed crystal holder body 110. Cooling, and because the temperature of the melt in the crucible 400 is relatively high, cooling the seed crystal holder body 110 can increase the temperature gradient inside the seed crystal holder body 110 and help accelerate the formation of crystals.
在一些实施例中,籽晶托本体110还可以设有与第一内腔112连通的第一通孔113。第一通孔113 可以将第一内腔112与晶体生长炉200的炉腔连通,用于将冷却介质从第一内腔112排出到晶体生长炉200中。籽晶托本体110可以设置有一个或多个第一通孔113。第一通孔113的形状可以为圆形、椭圆形等或其他任意形状。在一些实施例中,第一通孔113可以设置在籽晶托本体110的除了籽晶粘接面111之外的任意表面上。如图2A所示,籽晶托本体110的上壁设有多个第一通孔113。通过第一通孔113将第一内腔112与炉腔连通,可以使得已基本失去效用的冷却介质可以通过第一通孔113排出第一内腔112,以使新的冷却介质可以源源不断地通过通道121进入籽晶托本体110,从而有助于提高对籽晶托本体110的冷却效果,此外,也能够避免籽晶托本体110内部压力升高,保证籽晶托本体110的安全使用。In some embodiments, the seed holder body 110 may also be provided with a first through hole 113 communicating with the first inner cavity 112 . First through hole 113 The first inner cavity 112 may be connected to the furnace cavity of the crystal growth furnace 200 for discharging the cooling medium from the first inner cavity 112 into the crystal growth furnace 200 . The seed holder body 110 may be provided with one or more first through holes 113 . The shape of the first through hole 113 may be circular, elliptical, or any other shape. In some embodiments, the first through hole 113 may be provided on any surface of the seed holder body 110 except the seed bonding surface 111 . As shown in FIG. 2A , a plurality of first through holes 113 are provided on the upper wall of the seed crystal holder body 110 . The first inner cavity 112 is connected to the furnace cavity through the first through hole 113, so that the cooling medium that has basically lost its effectiveness can be discharged from the first inner cavity 112 through the first through hole 113, so that new cooling medium can be continuously supplied. Entering the seed crystal holder body 110 through the channel 121 helps to improve the cooling effect of the seed crystal holder body 110. In addition, it can also prevent the internal pressure of the seed crystal holder body 110 from rising, ensuring the safe use of the seed crystal holder body 110.
在一些实施例中,第一内腔112中还可以设在第一内腔112中的冷却介质扩散结构114。冷却介质扩散结构114可以用于辅助冷却介质在第一内腔112中进行扩散。例如,冷却介质扩散结构114可以为设置在通道121在第一内腔112中出口处的螺旋叶片,当冷却介质通过通道121进入第一内腔112内时,冷却介质可以对前述螺旋叶片施加力,从而使得螺旋叶片旋转,从而带动进入的冷却介质随螺旋叶片散落在第一内腔112中的各处。本说明书一些实施例通过冷却介质扩散结构114,有助于使冷却介质在第一内腔112中均匀地扩散,从而保证籽晶托本体110的各个位置能够被均匀地降温,使得籽晶托本体110内的温度分布更加均匀。In some embodiments, a cooling medium diffusion structure 114 disposed in the first inner cavity 112 may also be provided in the first inner cavity 112 . The cooling medium diffusion structure 114 may be used to assist the diffusion of the cooling medium in the first inner cavity 112 . For example, the cooling medium diffusion structure 114 can be a spiral blade disposed at the outlet of the channel 121 in the first inner cavity 112. When the cooling medium enters the first inner cavity 112 through the channel 121, the cooling medium can exert force on the aforementioned spiral blade. , thereby causing the spiral blades to rotate, thereby driving the incoming cooling medium to be scattered everywhere in the first inner cavity 112 along with the spiral blades. Some embodiments of this specification use the cooling medium diffusion structure 114 to help diffuse the cooling medium evenly in the first inner cavity 112, thereby ensuring that various positions of the seed crystal holder body 110 can be cooled evenly, so that the seed crystal holder body 110 can be evenly cooled. The temperature distribution within 110 is more uniform.
在一些实施例中,冷却介质扩散结构114可以包括一个或多个中空的管状结构。前述管状结构可以为圆管、方管或截面为其他形状的管状结构。In some embodiments, cooling medium diffusion structure 114 may include one or more hollow tubular structures. The aforementioned tubular structure may be a round tube, a square tube or a tubular structure with other cross-section shapes.
当前述冷却介质扩散结构114包括多个管状结构时,前述多个管状结构一端入口与通道121连接,另一端可以包括多个出口,多个出口可以分别将冷却介质导向第一内腔112内的多个不同位置,以使冷却介质在第一内腔112中多个位置均匀扩散。When the cooling medium diffusion structure 114 includes multiple tubular structures, one end of the multiple tubular structures has an inlet connected to the channel 121 and the other end may include multiple outlets. The multiple outlets may respectively guide the cooling medium into the first inner cavity 112 . A plurality of different positions, so that the cooling medium is evenly diffused at multiple positions in the first inner cavity 112 .
在一些实施例中,在晶体生成时,还可以通过温度检测装置(例如,外部的热像仪)对籽晶托本体110的温度进行检测,获得对应的温度信息(例如,热红外线图像)。籽晶托100可以与处理器(图未示出)通信,前述处理器可以用于对晶体生成进行控制。当前述温度信息满足预设温度调整条件时,处理器可以基于前述温度信息,确定需要进行温度调整的位置。例如,预设温度调整条件可以为籽晶托本体110中各个区域的温差不超过预设的温差阈值,处理器可以前述温度信息,确定籽晶托本体110的温度分布,当前述温度分布表征籽晶托本体110中某一局部位置的温度与其他区域的温度的温差大于温前述差阈值时,处理器可以将前述局部位置确定为需要进行温度调整的位置。处理器可以基于需要进行温度调整的位置,确定对应的冷却介质扩散结构114,并控制冷却介质输入至对应的冷却介质扩散结构114,以对该位置进行降温,并不断获取降温处理后的籽晶托本体110对应的温度信息,直至前述温度信息表征前述需要进行温度调整的位置不满足预设温度调整条件。其中,处理器可以通过温度调整对应表以及需要进行温度调整的位置,确定对应的冷却介质扩散结构114。前述温度调整对应表可以包括冷却介质扩散结构114中的多个管状结构每一个对应的温度调整位置,即多个管状结构中每一个的出口对应的位置。本说明书的一些实施例通过将前述冷却介质扩散结构114设置为多个管状结构,可以有指向性的对局部温度进行调节,避免局部温度过高而降低晶体生成的质量。此外,通过前述对籽晶托本体110的温度进行监测,可以自动对晶体生成的温度进行调整,从而有效提高晶体生成的质量。In some embodiments, when the crystal is generated, the temperature of the seed crystal holder body 110 can also be detected by a temperature detection device (for example, an external thermal imager) to obtain corresponding temperature information (for example, a thermal infrared image). The seed crystal holder 100 can communicate with a processor (not shown), which can be used to control crystal generation. When the temperature information satisfies the preset temperature adjustment condition, the processor can determine the location where temperature adjustment is required based on the temperature information. For example, the preset temperature adjustment condition may be that the temperature difference of each area in the seed crystal holder body 110 does not exceed the preset temperature difference threshold. The processor can determine the temperature distribution of the seed crystal holder body 110 based on the aforementioned temperature information. When the aforementioned temperature distribution represents the seed When the temperature difference between a certain local location in the crystal support body 110 and the temperature in other areas is greater than the temperature difference threshold, the processor may determine the aforementioned local location as a location that requires temperature adjustment. The processor can determine the corresponding cooling medium diffusion structure 114 based on the location where temperature adjustment is required, and control the input of the cooling medium to the corresponding cooling medium diffusion structure 114 to cool the location, and continuously obtain the cooled seed crystals. Depending on the temperature information corresponding to the main body 110, the temperature information indicates that the location requiring temperature adjustment does not meet the preset temperature adjustment conditions. The processor can determine the corresponding cooling medium diffusion structure 114 through the temperature adjustment correspondence table and the location where temperature adjustment is required. The aforementioned temperature adjustment correspondence table may include the temperature adjustment position corresponding to each of the plurality of tubular structures in the cooling medium diffusion structure 114, that is, the corresponding position of the outlet of each of the plurality of tubular structures. In some embodiments of this specification, by arranging the cooling medium diffusion structure 114 into multiple tubular structures, local temperature can be adjusted in a directional manner to avoid local temperatures being too high to reduce the quality of crystal formation. In addition, by monitoring the temperature of the seed crystal holder body 110 as mentioned above, the temperature of crystal generation can be automatically adjusted, thereby effectively improving the quality of crystal generation.
当前述冷却介质扩散结构114包括一个管状结构时,前述一个管状结构可以呈螺旋状环绕贴合在第一内腔112的内壁,其一端入口与通道121连接,并最后从第一通孔113中导出至到晶体生长炉200。例如,前述冷却介质扩散结构114可以为一根方管,前述方管可以呈螺旋状环绕完全贴合在第一内腔112的所有内壁或指定区域。进一步的,前述管状结构还可以延伸至晶体生长炉200外。可以理解的是,通过将冷却介质通过前述管状结构进入第一内腔112,当管状结构与第一内腔112的内壁贴合时,管状结构中的冷却介质可以对籽晶托本体110进行降温,降温后的冷却介质可以继续通过管状结构导出至晶体生长炉200外。本说明书的一些实施例通过前述设置可以使得冷却介质并不直接与籽晶托本体110接触,但仍能够对籽晶托本体110进行降温,避免冷却介质进入籽晶托本体110内难以清洗、造成堵塞等,或进入晶体生长炉200内对晶体生长产生影响。此外,通过前述设置还可以提高进行冷却的可控性。例如,可以通过停止向前述管状结构内继续输入冷却介质,从而当前冷却介质可以停留在指定部位,当需要更新冷却介质时,可以向前述管状结构内继续输入新的冷却介质,随着新的冷却介质的进入,使用后的冷却介质会流出前述管状结构,以保障冷却过程的可控性。When the cooling medium diffusion structure 114 includes a tubular structure, the tubular structure can be spirally wrapped around the inner wall of the first inner cavity 112 , with one end of the inlet connected to the channel 121 , and finally exiting from the first through hole 113 . Exported to the crystal growth furnace 200. For example, the cooling medium diffusion structure 114 can be a square tube, and the square tube can be spirally wrapped around and completely attached to all inner walls or designated areas of the first inner cavity 112 . Furthermore, the aforementioned tubular structure can also be extended outside the crystal growth furnace 200 . It can be understood that by passing the cooling medium into the first inner cavity 112 through the aforementioned tubular structure, when the tubular structure is in contact with the inner wall of the first inner cavity 112, the cooling medium in the tubular structure can cool down the seed holder body 110. , the cooled cooling medium can continue to be exported to the outside of the crystal growth furnace 200 through the tubular structure. Some embodiments of this specification can use the aforementioned settings so that the cooling medium does not directly contact the seed crystal holder body 110, but can still cool the seed crystal holder body 110 to prevent the cooling medium from entering the seed crystal holder body 110, making it difficult to clean and causing problems. Clogging, etc., or entering the crystal growth furnace 200 may affect crystal growth. In addition, the controllability of cooling can also be improved through the aforementioned settings. For example, the cooling medium can be continued to be input into the aforementioned tubular structure by stopping, so that the current cooling medium can stay at a designated location. When the cooling medium needs to be updated, new cooling medium can be continuously input into the aforementioned tubular structure. With the new cooling After the medium enters, the used cooling medium will flow out of the aforementioned tubular structure to ensure the controllability of the cooling process.
在一些实施例中,如图2A所示,冷却介质扩散结构114可以包括壳体1141,壳体1141内形成第二内腔1142,通道121与第二内腔1142连通,以使冷却介质可以进入第二内腔1142中。壳体1141上设有多个扩散孔1143,扩散孔1143连通第一内腔112和第二内腔1142,以使第二内腔1142内的冷却介质可以通过扩散孔1143扩散至第一内腔112的各处。前述壳体1141的形状可以与第一内腔112相适应。壳体1141可以为各种形体,例如长方体、正方体、圆柱体或其他形体。壳体1141的材质可以为石墨、高温陶瓷、不锈钢等。本说明书一些实施例中,冷却介质可以通过通道121进入第二内腔1142,再通过扩散 孔1143进入第一内腔112,有助于冷却介质更快速地扩散,同时避免冷却介质堆积在通道121的出口处。In some embodiments, as shown in FIG. 2A , the cooling medium diffusion structure 114 may include a housing 1141 , a second inner cavity 1142 is formed in the housing 1141 , and the channel 121 is connected to the second inner cavity 1142 so that the cooling medium can enter. in the second inner cavity 1142. The housing 1141 is provided with a plurality of diffusion holes 1143. The diffusion holes 1143 communicate with the first inner cavity 112 and the second inner cavity 1142, so that the cooling medium in the second inner cavity 1142 can diffuse to the first inner cavity through the diffusion holes 1143. 112 everywhere. The shape of the aforementioned housing 1141 can be adapted to the first inner cavity 112 . The housing 1141 can be in various shapes, such as cuboid, cube, cylinder or other shapes. The material of the housing 1141 can be graphite, high-temperature ceramics, stainless steel, etc. In some embodiments of this specification, the cooling medium can enter the second inner cavity 1142 through the channel 121, and then diffuse through the second inner cavity 1142. The holes 1143 enter the first inner cavity 112 to help the cooling medium diffuse more quickly while preventing the cooling medium from accumulating at the outlet of the channel 121 .
在一些实施例中,籽晶托100还可以包括冷却设备(图未示出)。冷却设备是为籽晶托本体110提供冷却介质的设备,其可以将冷却介质输送给通道121。冷却设备可以以一定流速输出冷却介质,以使得冷却介质以预设流速在通道121内流动。例如,冷却设备的出口可以与通道121连通,冷却设备或通道内还可以设置有动力结构(如,输送泵),以为冷却介质提供动力,驱使其离开冷却设备,并使冷却介质以预设流速在通道121内向籽晶托本体110流动。In some embodiments, the seed holder 100 may further include a cooling device (not shown). The cooling device is a device that provides cooling medium to the seed holder body 110, and can deliver the cooling medium to the channel 121. The cooling device can output the cooling medium at a certain flow rate, so that the cooling medium flows in the channel 121 at a preset flow rate. For example, the outlet of the cooling device can be connected to the channel 121, and a power structure (such as a transfer pump) can also be provided in the cooling device or the channel to provide power for the cooling medium, drive it away from the cooling device, and make the cooling medium flow at a preset flow rate. It flows in the channel 121 toward the seed crystal support body 110 .
在一些实施例中,冷却介质的预设流速大于0.4m/s。在一些实施例中,冷却介质可以是常温的。在另一些实施例中,冷却介质可以是被冷却到一定温度的,如10°、15°、20°等。值得说明的是,由于搭载有该籽晶托本体110的晶体生长炉200内温度较高,流速较低的冷却介质可能被加热,本说明书的一些实施例中通过将预设流速设置为大于0.4m/s,可以防止冷却介质被加热,从而保证冷却介质对籽晶托本体110的冷却效果。In some embodiments, the preset flow rate of the cooling medium is greater than 0.4m/s. In some embodiments, the cooling medium may be at room temperature. In other embodiments, the cooling medium may be cooled to a certain temperature, such as 10°, 15°, 20°, etc. It is worth noting that because the temperature in the crystal growth furnace 200 equipped with the seed crystal holder body 110 is relatively high, the cooling medium with a low flow rate may be heated. In some embodiments of this specification, the preset flow rate is set to greater than 0.4 m/s, can prevent the cooling medium from being heated, thereby ensuring the cooling effect of the cooling medium on the seed crystal holder body 110.
可以理解的是,由于籽晶托本体110设置为具有第一内腔112的结构,籽晶托本体110的质量减轻,可能导致晃动。因此在本说明书的一些实施例中,籽晶托100还可以包括增重结构(图未示出),增重结构可以与籽晶托本体110上远离连接杆120的一侧通过焊接或粘接等方式相连。增重结构可以设置在第一内腔112中,也可以设置在籽晶托本体110的外壁上(如,除籽晶粘接面111外的任意外壁上)。增重结构可以用于增重籽晶托本体110。增重结构可以是多种形状结构,例如、板状结构、环状结构等。增重结构的材质可以为不锈钢、高温陶瓷、钨合金等多种。本说明书的一些实施例中,通过将增重结构连接在籽晶托本体110上,可以加重籽晶托本体110,避免籽晶托本体110在晶体生长过程中的晃动,有助于晶体的稳定生成,从而保证生长的晶体的品质。It can be understood that since the seed crystal holder body 110 is configured to have a structure with the first inner cavity 112, the mass of the seed crystal holder body 110 is reduced, which may cause shaking. Therefore, in some embodiments of this specification, the seed crystal holder 100 may also include a weight-increasing structure (not shown), and the weight-increasing structure may be welded or bonded to the side of the seed crystal holder body 110 away from the connecting rod 120 connected in other ways. The weight-increasing structure can be disposed in the first inner cavity 112, or can be disposed on the outer wall of the seed crystal holder body 110 (for example, on any outer wall except the seed crystal bonding surface 111). A weight-increasing structure may be used to increase the weight of the seed crystal support body 110 . The weight-increasing structure can be a variety of shapes, such as plate-like structure, ring-like structure, etc. The material of the weight-increasing structure can be stainless steel, high-temperature ceramics, tungsten alloy, etc. In some embodiments of this specification, by connecting the weight-increasing structure to the seed crystal holder body 110, the seed crystal holder body 110 can be weighted, preventing the seed crystal holder body 110 from shaking during the crystal growth process, and contributing to the stability of the crystal. generated to ensure the quality of the grown crystals.
在一些实施例中,籽晶托100还可以包括冷却结构(图未示出),冷却结构可以设于连接杆120上,用于冷却通道121内的冷却介质。冷却结构可以包括多种,例如冷凝器、膨胀阀等或其任意组合。冷却结构可以是环状结构,附着在连接杆120的内壁,当冷却介质通过通道121时,冷却结构可以通过降低冷却介质的压力和/或与冷却介质进行热量交换以冷却通道121内的冷却介质。本说明书一些实施例通过设置冷却结构,可以使冷却介质温度降低,避免了冷却介质被周围环境过快地加热,尽量保证冷却介质以温度较低的状态进入第一内腔112,从而在第一内腔112中可以更快速高效地吸收籽晶托本体110的热量,有助于提高对籽晶托本体110的冷却效果。In some embodiments, the seed crystal holder 100 may also include a cooling structure (not shown), and the cooling structure may be provided on the connecting rod 120 for cooling the cooling medium in the channel 121 . The cooling structure may include a variety of structures, such as condensers, expansion valves, etc. or any combination thereof. The cooling structure may be an annular structure attached to the inner wall of the connecting rod 120. When the cooling medium passes through the channel 121, the cooling structure may cool the cooling medium in the channel 121 by reducing the pressure of the cooling medium and/or exchanging heat with the cooling medium. . Some embodiments of this specification can lower the temperature of the cooling medium by arranging a cooling structure, thereby preventing the cooling medium from being heated too quickly by the surrounding environment, and trying to ensure that the cooling medium enters the first inner cavity 112 at a lower temperature, thereby allowing the cooling medium to enter the first inner cavity 112 at a lower temperature. The inner cavity 112 can absorb the heat of the seed crystal holder body 110 more quickly and efficiently, which helps to improve the cooling effect of the seed crystal holder body 110 .
在一些实施例中,冷却结构包括冷却回路123,冷却回路123输送用于冷却冷却介质的冷却流体。在一些实施例中,冷却回路123设置在连接杆外。如图2B以及图2C所示,冷却结构可以包括冷却套124,该冷却套124套设在连接杆120上,冷却回路123设置在冷却套124上。在一些实施例中,冷却流体可以是冷却液,例如,水。在一些实施例中,冷却回路123可以包括输入通道和输出通道。在一些实施例中,输入通道和输出通道可以平行于输送冷却介质的通道121。在另一些实施例中,为了更好地冷却所述冷却介质,输出通道和输出通道可以呈环绕输送冷却介质的通道121布置的螺旋状。In some embodiments, the cooling structure includes a cooling circuit 123 that delivers cooling fluid for cooling the cooling medium. In some embodiments, cooling circuit 123 is provided outside the connecting rod. As shown in FIG. 2B and FIG. 2C , the cooling structure may include a cooling jacket 124 , the cooling jacket 124 is set on the connecting rod 120 , and the cooling circuit 123 is provided on the cooling jacket 124 . In some embodiments, the cooling fluid may be a cooling liquid, such as water. In some embodiments, cooling circuit 123 may include an input channel and an output channel. In some embodiments, the input and output channels may be parallel to the channel 121 conveying the cooling medium. In other embodiments, in order to better cool the cooling medium, the output channel and the output channel may be arranged in a spiral shape surrounding the channel 121 that transports the cooling medium.
在一些实施例中,如图3所示,籽晶托100还可以包括驱动机构150和搅拌机构160。In some embodiments, as shown in FIG. 3 , the seed crystal holder 100 may further include a driving mechanism 150 and a stirring mechanism 160 .
驱动机构150是指将其他能源转换为机械能,并产生动能的机构。驱动机构150可以包括多种,例如电机、气压源、液压源等。驱动机构150可以与连接杆120的另一端相连,其中,连接杆120的另一端是指远离籽晶托本体110的一端。驱动机构150可以通过连接杆120带动籽晶托本体110绕连接杆120的轴线A旋转。通过设置驱动结构150,在晶体生长的过程中,籽晶托100可以按照需要的速度进行旋转,以保证晶体的稳定生长。The driving mechanism 150 refers to a mechanism that converts other energy sources into mechanical energy and generates kinetic energy. The driving mechanism 150 may include a variety of types, such as a motor, a pneumatic source, a hydraulic source, etc. The driving mechanism 150 may be connected to the other end of the connecting rod 120 , where the other end of the connecting rod 120 refers to the end away from the seed holder body 110 . The driving mechanism 150 can drive the seed crystal holder body 110 to rotate around the axis A of the connecting rod 120 through the connecting rod 120 . By arranging the driving structure 150, during the crystal growth process, the seed crystal holder 100 can rotate at a required speed to ensure stable growth of the crystal.
搅拌机构160可以对用于晶体生长的熔液140进行搅拌。如图3至图4所示,搅拌机构160可以连接在籽晶托本体110上,在驱动机构150驱动籽晶托100旋转的过程中,可以使得搅拌机构160对熔液140进行搅拌。搅拌机构160可以为多种形状,如杆状、板状或其他各种不规则的形状。需要说明的时候,在晶体生长的过程中,搅拌机构160需要伸入到熔液140的液面以下,以实现对熔液140的搅拌。The stirring mechanism 160 can stir the melt 140 for crystal growth. As shown in FIGS. 3 and 4 , the stirring mechanism 160 can be connected to the seed crystal holder body 110 . When the driving mechanism 150 drives the seed crystal holder 100 to rotate, the stirring mechanism 160 can stir the melt 140 . The stirring mechanism 160 can be in various shapes, such as rod-shaped, plate-shaped or other various irregular shapes. It should be noted that during the crystal growth process, the stirring mechanism 160 needs to extend below the liquid level of the melt 140 to stir the melt 140 .
在晶体生长过程中,籽晶130与熔液140只在液面表面接触,因此熔液140整体的搅动较少,流速不高,这会导致熔液140整体的传质不够就均匀,进而导致对晶体生长品质的影响。本说明书一些实施例中,通过驱动机构150带动籽晶托本体110绕连接杆120的轴线A旋转,籽晶托本体110的旋转同时可以带动搅拌机构160绕连接杆120的轴线A旋转,从而实现对熔液140的搅拌,可以增大熔液140的流速,有助于改善熔液140中关键物质的传质路线,保证传质均匀,提高晶体生长效率。During the crystal growth process, the seed crystal 130 and the melt 140 are only in contact with each other on the liquid surface. Therefore, the overall agitation of the melt 140 is less and the flow rate is not high. This will cause the overall mass transfer of the melt 140 to be insufficient and uniform, which in turn leads to Effect on crystal growth quality. In some embodiments of this specification, the driving mechanism 150 drives the seed crystal holder body 110 to rotate around the axis A of the connecting rod 120. The rotation of the seed crystal holder body 110 can also drive the stirring mechanism 160 to rotate around the axis A of the connecting rod 120, thereby achieving Stirring the melt 140 can increase the flow rate of the melt 140, help improve the mass transfer route of key substances in the melt 140, ensure uniform mass transfer, and improve crystal growth efficiency.
在一些实施例中,如图4所示,搅拌机构160可以包括安装杆161和搅拌桨162。一个安装杆161对应一个搅拌桨162。搅拌桨162的形状可以包括多种,例如,浆式搅拌桨、圆盘涡轮桨等。搅拌桨162位于籽晶粘接面111远离连接杆120的一侧。搅拌桨162可以伸入熔液140内部,以便对熔液140进行搅拌。如图3和图4所示,搅拌机构160可以包括安装杆161和搅拌桨162,安装杆161的一端与籽晶托本体110连接,另一端与搅拌桨162相连,驱动机构150的运作可以带动籽晶托本体110沿轴线A旋转,进 而带动安装杆161沿轴线A旋转旋转,通过安装杆161的旋转可以带动与其连接的搅拌桨162运动,从而使得搅拌桨162对熔液140进行搅拌。In some embodiments, as shown in FIG. 4 , the stirring mechanism 160 may include a mounting rod 161 and a stirring paddle 162 . One mounting rod 161 corresponds to one stirring paddle 162 . The shape of the stirring blade 162 may include a variety of shapes, such as a paddle stirring blade, a disc turbine blade, etc. The stirring paddle 162 is located on the side of the seed crystal bonding surface 111 away from the connecting rod 120 . The stirring paddle 162 can extend into the inside of the melt 140 to stir the melt 140 . As shown in Figures 3 and 4, the stirring mechanism 160 can include a mounting rod 161 and a stirring paddle 162. One end of the mounting rod 161 is connected to the seed crystal holder body 110, and the other end is connected to the stirring paddle 162. The operation of the driving mechanism 150 can drive The seed crystal holder body 110 rotates along the axis A, and The mounting rod 161 is driven to rotate along the axis A, and the rotation of the mounting rod 161 can drive the stirring paddle 162 connected thereto to move, so that the stirring paddle 162 stirs the melt 140 .
在一些实施例中,搅拌机构160的数量可以是多个,多个搅拌机构160环绕籽晶托本体设置。在一些实施例中,搅拌机构160可以相较于轴线A呈中心对称排布。如图3所示,籽晶托100可以包括两个搅拌机构160,其中,前述两个搅拌机构160基于轴线A呈中心对称对称排布。In some embodiments, the number of stirring mechanisms 160 may be multiple, and the plurality of stirring mechanisms 160 are arranged around the seed holder body. In some embodiments, the stirring mechanism 160 may be centrally symmetrically arranged relative to the axis A. As shown in FIG. 3 , the seed crystal holder 100 may include two stirring mechanisms 160 , wherein the two stirring mechanisms 160 are arranged centrally symmetrically based on the axis A.
在一些实施例中,搅拌机构160的数量也可以是单个。如图4所示,籽晶托100可以包括单个搅拌机构160,单个搅拌机构160的搅拌桨162可以包括多个叶片,在搅拌机构160绕轴线A转动时,前述搅拌桨162的叶片可以绕搅拌桨162的中心进行自转,有助于加大熔液140的流速。In some embodiments, the number of the stirring mechanism 160 may also be single. As shown in Figure 4, the seed crystal holder 100 may include a single stirring mechanism 160, and the stirring paddle 162 of the single stirring mechanism 160 may include multiple blades. When the stirring mechanism 160 rotates around the axis A, the blades of the aforementioned stirring paddle 162 may rotate around the axis A. The center of the paddle 162 rotates, which helps increase the flow rate of the melt 140 .
在一些实施例中,搅拌机构160的材质可以为钨合金、高温陶瓷中的一种或多种。采用钨合金、高温陶瓷等材料制作的搅拌机构160可以在高温熔液140中具有较高的稳定性,有效提高搅拌机构160的使用寿命。In some embodiments, the material of the stirring mechanism 160 may be one or more of tungsten alloy and high-temperature ceramics. The stirring mechanism 160 made of tungsten alloy, high-temperature ceramics and other materials can have higher stability in the high-temperature melt 140, effectively increasing the service life of the stirring mechanism 160.
在一些实施例中,籽晶托本体110包括至少两个子部。如图6A、图6B以及图6C所示,籽晶托本体110可以包括两个子部,即第一子部115和第二子部116。籽晶托本体也可以包括三个子部、四个子部或其他数量的子部。在下文以籽晶托本体110包括两个子部的实施例进行说明。In some embodiments, the seed holder body 110 includes at least two sub-sections. As shown in FIGS. 6A , 6B and 6C , the seed holder body 110 may include two sub-parts, namely a first sub-part 115 and a second sub-part 116 . The seed holder body may also include three sub-parts, four sub-parts or other numbers of sub-parts. The following describes an embodiment in which the seed holder body 110 includes two sub-parts.
如图6C所示为例,第一子部115和第二子部116可以拼接形成籽晶托本体110。可以理解的是,如前所述,籽晶托本体110可以是台状、圆柱状等多种形状,其子部可以是与籽晶托本体110分割后对应的形状。以籽晶托本体110为圆台状或圆柱状为例,第一子部115和第二子部116可以是半圆柱或半圆台形状。As shown in FIG. 6C for example, the first sub-part 115 and the second sub-part 116 can be spliced to form the seed holder body 110. It can be understood that, as mentioned above, the seed crystal holder body 110 can be in various shapes such as a table shape or a cylindrical shape, and its sub-parts can be in shapes corresponding to the divided seed crystal holder body 110 . Taking the seed crystal holder body 110 as being in the shape of a truncated cone or a cylinder as an example, the first sub-part 115 and the second sub-part 116 may be in the shape of a semi-cylinder or a semi-conical cone.
在一些实施例中,籽晶托本体110不同子部的形状和大小也可能不同。示例性的,第一子部115可以为四分之三圆柱,第二子部116可以为四分之一圆柱。也就是说,第一子部115的垂直于第一子部115轴线的截面面积大于第二子部116的垂直于第二子部116轴线的截面面积。例如,第一子部115的垂直于第一子部115轴线的截面是优弧和直线围成,第二子部116的垂直于第二子部116轴线的截面是劣弧和直线围成的。In some embodiments, the shapes and sizes of different sub-sections of the seed holder body 110 may also be different. For example, the first sub-section 115 may be a three-quarter cylinder, and the second sub-section 116 may be a quarter cylinder. That is to say, the cross-sectional area of the first sub-portion 115 perpendicular to the axis of the first sub-portion 115 is greater than the cross-sectional area of the second sub-portion 116 perpendicular to the axis of the second sub-portion 116 . For example, the cross section of the first sub-portion 115 perpendicular to the axis of the first sub-portion 115 is bounded by major arcs and straight lines, and the cross-section of the second sub-portion 116 perpendicular to the axis of the second sub-portion 116 is bounded by minor arcs and straight lines. .
籽晶托本体110的至少两个子部的拼接可以是指将至少两个子部按照预定的位置摆放、组合在一起,从而拼接成一个完整的籽晶托本体110。籽晶托本体110的至少两个子部可以通过多种方式拼接。例如,至少两个子部可以只需按照预定的位置摆放在一起;又例如,任意相邻的两个子部中一个上设有定位凹槽,另一个上设有定位凸起,通过将定位凸起放入定位凹槽内而实现相邻两个子部的定位,从而将至少两个子部组合到一起。The splicing of at least two sub-parts of the seed crystal holder body 110 may refer to placing and combining the at least two sub-parts according to a predetermined position, thereby splicing them into a complete seed crystal holder body 110 . At least two sub-parts of the seed holder body 110 can be spliced in various ways. For example, at least two sub-parts can be placed together according to a predetermined position; for another example, one of any two adjacent sub-parts is provided with a positioning groove and the other is provided with a positioning protrusion. It is put into the positioning groove to realize the positioning of two adjacent sub-parts, thereby combining at least two sub-parts together.
在一些实施例中,籽晶托本体110的至少两个子部的每个子部上均设有半槽。需要说明的是,半槽可以理解为一个完整的卡接槽的一部分。至少两个子部的拼接使得至少两个子部中各个子部上的半槽拼接成完整的卡接槽170。也就是说,子部是籽晶托本体110的一部分,半槽是卡接槽170的一部分,通过将子部拼接成籽晶托本体110,也实现了半槽拼接成的卡接槽。例如,第一子部115上可以设有第一半槽1150,第二子部116上可以设有第二半槽1160,第一子部115和第二子部116拼接而使得第一半槽1150和第二半槽1160拼接成卡接槽170。In some embodiments, each of the at least two sub-portions of the seed holder body 110 is provided with a half-slot. It should be noted that a half slot can be understood as a part of a complete snap slot. The splicing of at least two sub-parts causes the half-grooves on each of the at least two sub-parts to be spliced into a complete snap-in groove 170 . That is to say, the sub-section is a part of the seed crystal holder body 110 and the half-slot is a part of the snap-in groove 170. By splicing the sub-sections into the seed crystal holder body 110, the half-slots are spliced into the snap-in slot. For example, the first sub-portion 115 may be provided with a first half-slot 1150, and the second sub-portion 116 may be provided with a second half-slot 1160. The first sub-portion 115 and the second sub-portion 116 are spliced to form the first half-slot. 1150 and the second half-slot 1160 are spliced into the snap-in slot 170 .
如图5以及图6A~图6C所示,第一半槽1150位于第一子部115,且设置在第一子部115与连接杆120连接的一端。第二半槽1160位于第二子部116,且设置在第二子部116与连接杆120连接的一端。在一些实施例中,第二半槽1160的结构与第一半槽1150的结构可以相同,且以连接杆120的轴线A为对称轴对称。在另一些实施例中,第一半槽1150和第二半槽1160的结构可以不同。第一半槽1150与第二半槽1160拼接形成卡接槽170,可以将连接杆120与卡接结构118镶嵌在卡接槽内。As shown in FIG. 5 and FIG. 6A to FIG. 6C , the first half groove 1150 is located in the first sub-portion 115 and is provided at an end of the first sub-portion 115 connected to the connecting rod 120 . The second half groove 1160 is located in the second sub-portion 116 and is provided at an end of the second sub-portion 116 connected to the connecting rod 120 . In some embodiments, the structure of the second half-slot 1160 may be the same as the structure of the first half-slot 1150 , and may be symmetrical about the axis A of the connecting rod 120 . In other embodiments, the structures of the first half groove 1150 and the second half groove 1160 may be different. The first half groove 1150 and the second half groove 1160 are spliced to form a locking groove 170, in which the connecting rod 120 and the locking structure 118 can be embedded.
在一些实施例中,籽晶托100还可以包括锁紧结构117和卡接结构118。In some embodiments, the seed crystal holder 100 may also include a locking structure 117 and a clamping structure 118.
如图5所示,卡接结构118设于连接杆120与籽晶托本体110连接的一端。卡接结构118可以卡接在卡接槽内,以使得连接杆120与籽晶托本体110通过卡接结构118紧密相连。卡接结构118可以包括多种立体结构(如正方体、圆柱体等),且其位于连接杆120与籽晶托本体110连接一端。卡接结构118可以理解为能够被容纳在卡接槽170内,且在卡接后不会与卡接槽170脱离。卡接结构118与卡接槽170的卡接方式可以有多种,具体请参见下文的相关说明。As shown in FIG. 5 , the snap-in structure 118 is provided at one end of the connecting rod 120 connected to the seed crystal holder body 110 . The clamping structure 118 can be clamped in the clamping groove, so that the connecting rod 120 and the seed crystal holder body 110 are closely connected through the clamping structure 118 . The snap-in structure 118 may include a variety of three-dimensional structures (such as cubes, cylinders, etc.), and is located at the end connecting the connecting rod 120 and the seed holder body 110 . The snap-in structure 118 can be understood as being able to be accommodated in the snap-in groove 170 and not disengaged from the snap-in groove 170 after being snap-locked. There can be multiple ways of engaging the engaging structure 118 and the engaging groove 170. For details, please refer to the relevant description below.
如图5所示,锁紧结构117设于籽晶托本体110的外壁,可以将拼接的至少两个子部(如第一子部115和第二子部116)相固定。在一些实施例中,锁紧结构117可以包括螺栓、螺母以及凸起结构,凸起结构设于第一子部115与第二子部116上,凸起结构中存在螺纹孔,螺栓可以穿过第一子部115的凸起结构上的螺纹孔以及第二子部116的凸起结构上的螺纹孔,并通过螺母固定,进而将第一子部115与第二子部116固定。As shown in FIG. 5 , the locking structure 117 is provided on the outer wall of the seed holder body 110 and can fix at least two spliced sub-parts (such as the first sub-part 115 and the second sub-part 116 ). In some embodiments, the locking structure 117 may include bolts, nuts and protruding structures. The protruding structures are provided on the first sub-part 115 and the second sub-part 116. There are threaded holes in the protruding structures through which the bolts can pass. The threaded holes on the protruding structure of the first sub-part 115 and the threaded holes on the protruding structure of the second sub-part 116 are fixed by nuts, thereby fixing the first sub-part 115 and the second sub-part 116 .
可以理解的是,在晶体生长的过程中,籽晶托本体110与连接杆120往往通过螺纹连接,螺钉连接的部分会因为存在退刀槽而产生空洞,气体可以进入空洞空间,从而影响籽晶托本体110温度梯度的均 匀变化,诱发晶体生长面空洞的形成。因此,本说明书一些实施例,通过将籽晶托本体110设置成包括至少两个子部,锁紧结构117将至少两个子部相固定,并将卡接结构118卡接在卡接槽内,可以使籽晶托本体110与连接杆120紧密连接而不存在能够进入气体的空间,解决了退刀槽的问题,不仅可以使籽晶托本体110温度均匀变化,也便于后期的进行晶托分离(解除锁紧结构117的锁紧即可),大大提高了制备的晶体的质量。It can be understood that during the process of crystal growth, the seed crystal holder body 110 and the connecting rod 120 are often connected through threads. The screw-connected part will generate holes due to the existence of undercut grooves, and gas can enter the cavity space, thereby affecting the seed crystal. The average temperature gradient of the body 110 Uniform changes induce the formation of cavities on the crystal growth surface. Therefore, in some embodiments of this specification, by arranging the seed crystal holder body 110 to include at least two sub-parts, the locking structure 117 fixes the at least two sub-parts, and the clamping structure 118 is clamped in the clamping groove, it is possible to The seed holder body 110 and the connecting rod 120 are tightly connected without a space for gas to enter, which solves the problem of the undercut groove. It not only allows the temperature of the seed holder body 110 to change evenly, but also facilitates the subsequent separation of the crystal holders ( Just unlock the locking structure 117), which greatly improves the quality of the prepared crystal.
此外,值得说明的是对籽晶托本体110进行烧蚀可以实现晶体生长后晶体与籽晶托本体110的分离,烧蚀的速度相关于取决于籽晶托本体110顶部内凹螺纹在烧蚀设备中的朝向,在籽晶托本体110顶部螺纹孔无附着物时,逆风方向12小时烧蚀约三分之一后烧蚀速度会逐渐减慢。在本说明书的上述实施例中,多个子部的拼接部位会出现组合面。如图7所示,第一子部115和第二子部116拼接的部位存在组合面B,组合面B在烧蚀过程中可以起一定的引导作用,加快后期烧蚀速度,有助于提高晶托分离的效率。In addition, it is worth mentioning that ablation of the seed crystal holder body 110 can achieve the separation of the crystal and the seed crystal holder body 110 after crystal growth. The ablation speed depends on the ablation of the concave thread on the top of the seed crystal holder body 110. In the orientation of the equipment, when there is no attachment in the threaded hole on the top of the seed crystal holder body 110, the ablation speed will gradually slow down after about one third of the ablation in the upwind direction for 12 hours. In the above-mentioned embodiments of this specification, a combination surface will appear at the splicing location of multiple sub-parts. As shown in Figure 7, there is a combination surface B where the first sub-part 115 and the second sub-part 116 are spliced. The combination surface B can play a certain guiding role in the ablation process, speed up the later ablation speed, and help improve the ablation process. The efficiency of crystal support separation.
在一些实施例中,籽晶托本体110的至少两个子部包括结构相同的第一子部115和第二子部116,第一子部115和第二子部116以连接杆的轴线为对称轴对称设置。在另一些实施例中,当籽晶托本体包括三个及以上的子部时,每个子部的结构均可以相同,且均匀、对称地排列。In some embodiments, at least two sub-parts of the seed holder body 110 include a first sub-part 115 and a second sub-part 116 with the same structure. The first sub-part 115 and the second sub-part 116 are symmetrical about the axis of the connecting rod. Axisymmetric setup. In other embodiments, when the seed holder body includes three or more sub-parts, the structure of each sub-part may be the same and arranged evenly and symmetrically.
以籽晶托本体包括两个子部为例,如图6A、图6B、图6C及图7,第一子部115和第二子部116的结构可以相同,第一子部115和第二子部116可以以连接杆120的轴线A为对称轴对称设置。Taking the seed crystal holder body as an example including two sub-parts, as shown in Figure 6A, Figure 6B, Figure 6C and Figure 7, the structures of the first sub-part 115 and the second sub-part 116 can be the same. The portion 116 may be arranged symmetrically with the axis A of the connecting rod 120 as the axis of symmetry.
本说明书的一些实施例中,籽晶托本体110的至少两个子部结构相同且对称排列,可以便于生产制造,其可能提升籽晶托本体110的组装效率。In some embodiments of this specification, at least two sub-parts of the seed holder body 110 have the same structure and are arranged symmetrically, which can facilitate production and manufacturing, which may improve the assembly efficiency of the seed holder body 110 .
如图5至图7所示,卡接槽170沿连接杆120的轴线A方向排列而成第一槽体171和第二槽体172。第一槽体171比第二槽体172更靠近籽晶粘接面;第一槽体171沿垂直于连接杆120的轴线A的截面的面积大于第二槽体172沿垂直于连接杆120的轴线A的截面的面积;卡接结构118沿垂直于连接杆120的轴线A的截面的面积大于连接杆120沿垂直于连接杆120的轴线A的截面的面积。As shown in FIGS. 5 to 7 , the engaging grooves 170 are arranged along the axis A direction of the connecting rod 120 to form a first groove body 171 and a second groove body 172 . The first groove body 171 is closer to the seed bonding surface than the second groove body 172; the cross-sectional area of the first groove body 171 along the axis A perpendicular to the connecting rod 120 is larger than that of the second groove body 172 along the axis A perpendicular to the connecting rod 120. The cross-sectional area of the axis A; the cross-sectional area of the clamping structure 118 along the axis A perpendicular to the connecting rod 120 is greater than the cross-sectional area of the connecting rod 120 along the axis A perpendicular to the connecting rod 120 .
第一槽体171用于固定卡接结构118,第二槽体172用于容纳连接杆120。因此,对应的,卡接结构118沿垂直于连接杆120的轴线A的截面的面积大于连接杆120沿垂直于连接杆120的轴线A的截面的面积,第一槽体171的形状与卡接结构118的形状适配,以使卡接结构118可以卡接在第一槽体171内,第二槽体172的形状与连接杆120靠近卡接结构118的端部位形状适配,连接杆120靠近卡接结构118的端部位于第二槽体172内,以使得卡接结构118对连接杆120与籽晶托本体110的相对位置进行固定。本说明书一些实施例,连接杆120与籽晶托本体110通过卡接结构118镶嵌式结合,有助于避免前述因存在退刀槽造成的空洞问题,且保证连接杆120与籽晶托本体110的稳定连接。The first groove body 171 is used to fix the clamping structure 118 , and the second groove body 172 is used to accommodate the connecting rod 120 . Therefore, correspondingly, the area of the cross-section of the snap-in structure 118 along the axis A perpendicular to the connecting rod 120 is greater than the area of the cross-section of the connecting rod 120 along the axis A perpendicular to the connecting rod 120 . The shape of the first groove 171 is consistent with the snap-in connection. The shape of the structure 118 is adapted so that the clamping structure 118 can be clamped in the first groove 171 . The shape of the second slot 172 is adapted to the shape of the end of the connecting rod 120 close to the clamping structure 118 . The connecting rod 120 The end close to the clamping structure 118 is located in the second groove body 172 so that the clamping structure 118 fixes the relative position of the connecting rod 120 and the seed crystal holder body 110 . In some embodiments of this specification, the connecting rod 120 and the seed crystal holder body 110 are embedded and combined through the snap-in structure 118, which helps to avoid the aforementioned cavity problem caused by the existence of the undercut groove and ensures that the connecting rod 120 and the seed crystal holder body 110 are stable connection.
下面以至少两个子部包括第一子部115(其上具有第一半槽1150)和第二子部116(其上具有第二半槽1160)为例进行说明。如图6A,第一半槽1150可以分为第一上半槽1151和第一下半槽1152。如图6B,第二半槽1160可以分为第二上半槽1161和第二下半槽1162。如图6C,第一上半槽1151和第二上半槽1161可以拼接形成第一槽体171,第一下半槽1152和第二下半槽1162可以拼接形成第二槽体172。The following description takes at least two sub-portions including a first sub-portion 115 (having a first half-slot 1150 thereon) and a second sub-portion 116 (having a second half-slot 1160 thereon) as an example. As shown in FIG. 6A , the first half groove 1150 can be divided into a first upper half groove 1151 and a first lower half groove 1152 . As shown in FIG. 6B , the second half groove 1160 can be divided into a second upper half groove 1161 and a second lower half groove 1162 . As shown in FIG. 6C , the first upper half groove 1151 and the second upper half groove 1161 can be spliced to form the first groove body 171 , and the first lower half groove 1152 and the second lower half groove 1162 can be spliced to form the second groove body 172 .
在一些实施例中,卡接结构118可以呈多面体形状。如图7所示,卡接结构118的截面可以为正方体。本说明书一些实施例,通过将卡接结构118设置为多面体形状,可以在籽晶托本体110旋转时,保证卡接结构118同步转动。可以理解的是,如果籽晶托本体110生成晶体时不旋转,卡接结构110也可以是圆柱体。In some embodiments, the snap-in structure 118 may be in the shape of a polyhedron. As shown in FIG. 7 , the cross-section of the snap-in structure 118 may be a cube. In some embodiments of this specification, by setting the snap-in structure 118 in a polyhedral shape, it is possible to ensure that the snap-in structure 118 rotates synchronously when the seed crystal holder body 110 rotates. It can be understood that if the seed crystal holder body 110 does not rotate when generating crystals, the clamping structure 110 may also be a cylinder.
需要说明的是,卡接槽170和卡接结构118的形状可以有多种,只要能够实现卡接结构118卡接到卡接槽170中,且不会从卡接槽170中脱离出即可。仅作为示例,卡接槽170可以为梯形槽,也就是说卡接槽170的不同位置的垂直于轴线A的截面的截面积不同,越靠近籽晶粘接面111,卡接槽170的垂直于轴线A的截面的截面积越大。对应地,卡接结构118也可以为四棱台。It should be noted that the snap-in groove 170 and the snap-in structure 118 can have various shapes, as long as the snap-in structure 118 can be locked into the snap-in slot 170 without being detached from the snap-in slot 170 . For example only, the engaging groove 170 may be a trapezoidal groove, that is to say, the cross-sectional areas perpendicular to the axis A at different positions of the engaging groove 170 are different. The closer to the seed bonding surface 111 , the vertical cross-sectional area of the engaging groove 170 is The cross-sectional area along axis A is larger. Correspondingly, the clamping structure 118 may also be a quadrangular pyramid.
如图8至图9所示,锁紧结构117可以包括环形槽1171和锁紧环1172。环形槽1171可以环绕籽晶托本体110的外壁设置,锁紧环1172套设在拼接后的至少两个子部(如第一子部115以及第二子部116)外,且设置在环形槽1171内。在一些实施例中,环形槽1171的外壁设有外螺纹,锁紧环1172的内壁设有内螺纹。锁紧环1172与环形槽1171通过螺纹连接的方式连接,以使得锁紧环1172设置到环形槽内。此外,环形槽1171的外壁上的外螺纹不超过籽晶托本体110的顶部,避免后期无法热压。As shown in FIGS. 8-9 , the locking structure 117 may include an annular groove 1171 and a locking ring 1172. The annular groove 1171 can be arranged around the outer wall of the seed crystal holder body 110 , and the locking ring 1172 is set outside at least two sub-parts (such as the first sub-part 115 and the second sub-part 116 ) after splicing, and is arranged in the annular groove 1171 Inside. In some embodiments, the outer wall of the annular groove 1171 is provided with external threads, and the inner wall of the locking ring 1172 is provided with internal threads. The locking ring 1172 is connected to the annular groove 1171 through a threaded connection, so that the locking ring 1172 is set into the annular groove. In addition, the external threads on the outer wall of the annular groove 1171 do not exceed the top of the seed crystal holder body 110 to avoid failure in hot pressing in the later stage.
锁紧结构117中锁紧环1172的底部以及环形槽1171可以与籽晶托本体110贴合。锁紧环1172在籽晶托本体110的外壁将籽晶托本体110环绕,可以将拼接的至少两个子部(如第一子部115和第二子部116)锁紧,对籽晶托本体110进行固定限制,实现至少两个子部的固定,从而保障籽晶托本体110与连接杆120的紧密连接,且锁紧操作简单方便。The bottom of the locking ring 1172 and the annular groove 1171 in the locking structure 117 can fit with the seed holder body 110 . The locking ring 1172 surrounds the seed crystal holder body 110 on the outer wall of the seed crystal holder body 110, and can lock at least two spliced sub-parts (such as the first sub-part 115 and the second sub-part 116) to secure the seed crystal holder body 110. 110 is fixed and restricted to realize the fixation of at least two sub-parts, thereby ensuring the tight connection between the seed crystal holder body 110 and the connecting rod 120, and the locking operation is simple and convenient.
在一些实施例中,籽晶托100还可以包括用于对籽晶托本体110进行保护的保护托180。如图10所示,籽晶托100还可以包括环形的保护托180,保护托180内设有与籽晶托本体110的形状匹配的容纳腔184,保护托180可以环绕籽晶托本体110设置。此外,保护托180还可以环绕籽晶托本体110与连接 杆120连接的一端。其中,前述容纳腔184可以容纳籽晶托本体110,籽晶托本体110可以与容纳腔184的内壁紧密贴合。保护托180可以由石墨材料制成。保护托180的接近连接杆120的一面为上表面,保护托180的上表面设有第三通孔,第三通孔的形状可以与连接杆120的形状相匹配(例如,连接杆120为圆柱杆状,第三通孔可以为圆柱孔),第三通孔与前述容纳腔184连通,第三通孔的孔径与连接杆120外壁沿连接杆120轴向的外径相匹配,第三通孔可以以连接杆120的轴线A为轴设置,连接杆120可以从保护托180上表面的第三通孔穿过,与籽晶托本体110通过多种方式连接(例如,螺纹连接、卡扣连接、上文实施例所述的方式等)。In some embodiments, the seed crystal holder 100 may further include a protection bracket 180 for protecting the seed crystal holder body 110 . As shown in Figure 10, the seed crystal holder 100 can also include an annular protective bracket 180. The protective bracket 180 is provided with a receiving cavity 184 that matches the shape of the seed crystal holder body 110. The protective bracket 180 can be arranged around the seed crystal holder body 110. . In addition, the protective bracket 180 can also surround the seed crystal bracket body 110 and connect the Rod 120 connects one end. The aforesaid accommodating cavity 184 can accommodate the seed crystal holder body 110 , and the seed crystal holder body 110 can be closely attached to the inner wall of the accommodating cavity 184 . The protective bracket 180 may be made of graphite material. The side of the protective bracket 180 close to the connecting rod 120 is the upper surface. The upper surface of the protective bracket 180 is provided with a third through hole. The shape of the third through hole can match the shape of the connecting rod 120 (for example, the connecting rod 120 is a cylinder). Rod-shaped (the third through hole may be a cylindrical hole), the third through hole is connected to the aforementioned accommodation cavity 184, and the diameter of the third through hole matches the outer diameter of the outer wall of the connecting rod 120 along the axial direction of the connecting rod 120. The hole can be arranged with the axis A of the connecting rod 120 as the axis. The connecting rod 120 can pass through the third through hole on the upper surface of the protective bracket 180 and be connected to the seed crystal bracket body 110 in various ways (for example, threaded connection, buckle connection, the method described in the above embodiment, etc.).
值得说明的是,当顶部籽晶130提拉生长时,籽晶托本体110与籽晶130贴合处会被挥发物包裹,籽晶托本体110表面也会有一层附着层,这不仅会导致晶托无法直接分离,附着层也会影响籽晶托110对热量的吸收和释放,影响晶体的生长及质量。本说明书一些实施例,通过保护托180将籽晶托110环绕,可以避免籽晶托本体110的表面出现附着层,实现籽晶托本体110轴向和径向温度梯度的控制,进而提高晶体的质量和形态稳定。It is worth mentioning that when the top seed crystal 130 is pulled to grow, the joint between the seed crystal holder body 110 and the seed crystal 130 will be wrapped by volatile matter, and there will also be an adhesion layer on the surface of the seed crystal holder body 110. This will not only cause The crystal support cannot be separated directly, and the adhesion layer will also affect the absorption and release of heat by the seed crystal support 110, affecting the growth and quality of the crystal. In some embodiments of this specification, the protective bracket 180 surrounds the seed crystal holder 110 to avoid the appearance of an adhesion layer on the surface of the seed crystal holder body 110, thereby achieving control of the axial and radial temperature gradients of the seed crystal holder body 110, thereby improving the crystal quality. Stable quality and form.
在一些实施例中,籽晶托100还可以包括环形的第一保护套181,第一保护套181套设在连接杆120外,且第一保护套181位于连接杆120与保护托180之间。第一保护套181可以用于避免挥发物进入籽晶托本体110与连接杆120之间、保护托180与连接杆120之间。如图10所示,第一保护套181可以是内部中空的环形圆柱,第一保护套181的内壁包裹连接杆120,外壁与保护托180的表面相连,底面嵌入保护托180。保护托180的上表面可以设有环形凹槽,环形凹槽的尺寸与第一保护套181适配,以使第一保护套181的外壁及底面贴合在环形凹槽中。In some embodiments, the seed crystal holder 100 may also include an annular first protective sleeve 181 , the first protective sleeve 181 is set outside the connecting rod 120 , and the first protective sleeve 181 is located between the connecting rod 120 and the protective bracket 180 . The first protective cover 181 can be used to prevent volatile matter from entering between the seed crystal holder body 110 and the connecting rod 120 and between the protective holder 180 and the connecting rod 120 . As shown in FIG. 10 , the first protective sleeve 181 may be an annular cylinder with a hollow interior. The inner wall of the first protective sleeve 181 wraps the connecting rod 120 , the outer wall is connected to the surface of the protective bracket 180 , and the bottom surface is embedded in the protective bracket 180 . The upper surface of the protective bracket 180 may be provided with an annular groove, and the size of the annular groove is adapted to the first protective sleeve 181 so that the outer wall and bottom surface of the first protective sleeve 181 fit in the annular groove.
如图10所示,连接杆120沿连接杆120的轴向可以包括第一外径段r3和第二外径段r2。第一外径段r3的外径小于第二外径段r2的外径,第一外径段r3比第二外径段r2更靠近籽晶托本体110。对应的,第一保护套181沿连接杆120的轴向包括第一内径段r4和第二内径段r1;第一内径段r4小于第二内径段r1的内径,第一内径段r4比第二内径段r1更靠近籽晶托本体110。其中,第一内径段r4可以与第一外径段r3匹配,第二内径段r1可以与第二外径段r2匹配。如图10所示,第一保护套181可以将连接杆120与保护托180连接,第一保护套181的第一内径段r4和第二内径段r1分别与连接杆120中第一外径段r3与第二外径段r2连接部位贴合,第一保护套181的外壁与保护托180相连,底面嵌入保护托180中。As shown in FIG. 10 , the connecting rod 120 may include a first outer diameter section r 3 and a second outer diameter section r 2 along the axial direction of the connecting rod 120 . The outer diameter of the first outer diameter section r 3 is smaller than the outer diameter of the second outer diameter section r 2 , and the first outer diameter section r 3 is closer to the seed holder body 110 than the second outer diameter section r 2 . Correspondingly, the first protective sleeve 181 includes a first inner diameter section r 4 and a second inner diameter section r 1 along the axial direction of the connecting rod 120 ; the first inner diameter section r 4 is smaller than the inner diameter of the second inner diameter section r 1 , and the first inner diameter section r 1 r 4 is closer to the seed holder body 110 than the second inner diameter section r 1 . Among them, the first inner diameter section r 4 can match the first outer diameter section r 3 , and the second inner diameter section r 1 can match the second outer diameter section r 2 . As shown in Figure 10, the first protective sleeve 181 can connect the connecting rod 120 with the protective bracket 180. The first inner diameter section r4 and the second inner diameter section r1 of the first protective sleeve 181 are respectively connected to the first outer diameter section of the connecting rod 120. The connection part of the diameter section r 3 and the second outer diameter section r 2 is fit. The outer wall of the first protective sleeve 181 is connected to the protective bracket 180 , and the bottom surface is embedded in the protective bracket 180 .
本说明书一些实施例,通过第一保护套181将连接杆120与保护托180间相连,能够更有效地防止挥发物进入籽晶托本体110与连接杆120之间、保护托180与连接杆120之间造成粘连,方便实现切割晶体分离或烧蚀分离。In some embodiments of this specification, the connecting rod 120 and the protective bracket 180 are connected through the first protective cover 181, which can more effectively prevent volatile matter from entering between the seed crystal bracket body 110 and the connecting rod 120, and between the protective bracket 180 and the connecting rod 120. Adhesion is caused between them, which facilitates cutting crystal separation or ablation separation.
在一些实施例中,保护托180的远离连接杆120的一侧表面上可以设有环形的第二保护套182,第二保护套182嵌入保护托180内,且第二保护套182环绕容纳腔184设置。In some embodiments, a side surface of the protective bracket 180 away from the connecting rod 120 may be provided with an annular second protective sleeve 182. The second protective sleeve 182 is embedded in the protective bracket 180, and the second protective sleeve 182 surrounds the accommodation cavity. 184 settings.
如图10所示,当籽晶粘接面111上粘接有籽晶130时,第二保护套182远离连接杆120的一端可以与籽晶130靠近连接杆120的一面贴合,以防止挥发物进入籽晶托本体110与连接杆120之间、保护托180与连接杆120之间造成粘连。As shown in Figure 10, when the seed crystal 130 is bonded to the seed crystal bonding surface 111, the end of the second protective sleeve 182 away from the connecting rod 120 can be attached to the side of the seed crystal 130 close to the connecting rod 120 to prevent volatilization. Objects may enter between the seed crystal holder body 110 and the connecting rod 120 and between the protective holder 180 and the connecting rod 120 to cause adhesion.
本说明书一些实施例,通过第二保护套182可以避免熔液140挥发物进入籽晶托本体110腐蚀石墨纸或籽晶托本体110,还可以保证提拉时籽晶130不受力,进而避免籽晶130脱落。In some embodiments of this specification, the second protective cover 182 can prevent the volatile matter of the melt 140 from entering the seed crystal holder body 110 and corroding the graphite paper or the seed crystal holder body 110. It can also ensure that the seed crystal 130 is not stressed when pulling, thereby preventing The seed crystal 130 falls off.
在一些实施例中,第二保护套182沿连接杆120的轴向的高度与籽晶托本体110的籽晶粘接面111的直径的比值为3∶150。通过对第二保护套182的高度轴向高度与籽晶粘接面111的直径的比值的设置,可以保证第二保护套的182的尺寸可以更有效地起到防护作用。In some embodiments, the ratio of the height of the second protective sleeve 182 along the axial direction of the connecting rod 120 to the diameter of the seed bonding surface 111 of the seed holder body 110 is 3:150. By setting the ratio of the axial height of the second protective sleeve 182 to the diameter of the seed bonding surface 111, it can be ensured that the size of the second protective sleeve 182 can play a more effective protective role.
在一些实施例中,保护托180远离连接杆120的一侧表面上可以设有第一凹槽183。前述第一凹槽183的直径大于容纳腔184背离连接杆120的一侧的开口的直径L。如图10所示,前述第一凹槽183包括与开口连通的连通部分1831以及环绕在连通部分外的环形部分1832;环形部分1832的底面(即第一凹槽上表面)与籽晶粘接面111位于同一平面上,第一凹槽183的环形部分1832与第二保护套182的形状适配,第二保护套182设于第一凹槽183环形部分1832的底面上。In some embodiments, a first groove 183 may be provided on a side surface of the protective bracket 180 away from the connecting rod 120 . The diameter of the aforementioned first groove 183 is larger than the diameter L of the opening of the side of the accommodation cavity 184 away from the connecting rod 120 . As shown in Figure 10, the aforementioned first groove 183 includes a communication portion 1831 connected to the opening and an annular portion 1832 surrounding the communication portion; the bottom surface of the annular portion 1832 (i.e., the upper surface of the first groove) is bonded to the seed crystal. The surface 111 is located on the same plane, the annular portion 1832 of the first groove 183 is adapted to the shape of the second protective sleeve 182 , and the second protective sleeve 182 is provided on the bottom surface of the annular portion 1832 of the first groove 183 .
在本说明书的实施例中,第一凹槽183可以使得第二保护套182镶嵌入保护托,可以进一步防止挥发物进入籽晶托本体110与连接杆120之间、保护托180与连接杆120之间造成粘连。此外,由于环形部分1832的底面(即第一凹槽上表面)与籽晶粘接面111位于同一平面上,部分籽晶可以粘接到环形部分1832的底面上,并且与第二保护套182贴合。第一凹槽183的尺寸可以与籽晶的尺寸基本匹配,也能够在一定程度上便于操作者确定籽晶的粘接位置,保证籽晶与籽晶托100的同心度。In the embodiment of this specification, the first groove 183 can allow the second protective cover 182 to be embedded in the protective bracket, which can further prevent volatiles from entering between the seed crystal bracket body 110 and the connecting rod 120, and between the protective bracket 180 and the connecting rod 120. causing adhesion between them. In addition, since the bottom surface of the annular portion 1832 (ie, the upper surface of the first groove) is located on the same plane as the seed crystal bonding surface 111 , part of the seed crystal can be bonded to the bottom surface of the annular portion 1832 and with the second protective sleeve 182 fit. The size of the first groove 183 can basically match the size of the seed crystal, and can also facilitate the operator to determine the bonding position of the seed crystal to a certain extent and ensure the concentricity between the seed crystal and the seed crystal holder 100 .
在一些实施例中,第一凹槽183的直径大于开口的直径5mm-10mm,以便于环形部分的设置,同时方便第二保护套182嵌入保护托180中,这样也可以保证籽晶能够更稳定地粘接。In some embodiments, the diameter of the first groove 183 is 5 mm to 10 mm larger than the diameter of the opening to facilitate the placement of the annular portion and to facilitate the embedding of the second protective sleeve 182 into the protective bracket 180 , thus ensuring that the seed crystal can be more stable. Ground bonding.
在一些实施例中,籽晶粘接面111上可以粘接有石墨纸119。石墨纸119可以用于对籽晶130进行固定。石墨纸119的尺寸可以与籽晶粘接面111适配,以使石墨纸119完全贴合于籽晶粘接面111。石 墨纸119可以通过热熔胶粘接在籽晶粘接面111上。石墨纸119朝向远离连接杆120的方向(即如图10所示的D方向)凸出于第二保护套182的下表面。例如,石墨纸119可以朝向远离连接杆120的方向,凸出于第二保护套182远离连接杆120的一侧表面0.1mm-0.2mm,以保证籽晶130可以朝向远离连接杆120的方向凸出于保护托180的下表面。值得说明的是,籽晶130接触熔液140后开始按一定的速度提拉生长,随着时间的推移,坩埚壁开始腐蚀、熔液140蒸发等情况的发生会导致熔液140的液面高度随之逐渐降低,籽晶130偏离熔液140液面的相对速度逐渐加快,从而无法按照制定提拉速度生长。本说明书一些实施例,通过将石墨纸设置于凸出第二保护套182的远离连接杆120的一侧表面,可以使籽晶130与熔液140的液面充分接触,晶体可以按照制定提拉速度生长。In some embodiments, graphite paper 119 may be adhered to the seed crystal bonding surface 111 . Graphite paper 119 can be used to fix the seed crystal 130 . The size of the graphite paper 119 can be adapted to the seed crystal bonding surface 111 so that the graphite paper 119 is completely attached to the seed crystal bonding surface 111 . stone The ink paper 119 can be bonded to the seed crystal bonding surface 111 through hot melt glue. The graphite paper 119 protrudes from the lower surface of the second protective sleeve 182 in a direction away from the connecting rod 120 (ie, direction D as shown in FIG. 10 ). For example, the graphite paper 119 can be oriented away from the connecting rod 120 and protrude 0.1mm-0.2mm from the side surface of the second protective sleeve 182 away from the connecting rod 120 to ensure that the seed crystal 130 can be convexed in the direction away from the connecting rod 120 . To protect the lower surface of the bracket 180 . It is worth mentioning that the seed crystal 130 starts to grow at a certain speed after contacting the melt 140. As time goes by, the crucible wall begins to corrode, the melt 140 evaporates, etc., which will cause the liquid level of the melt 140 to rise. As it gradually decreases, the relative speed at which the seed crystal 130 deviates from the liquid surface of the melt 140 gradually accelerates, so that it cannot grow according to the prescribed pulling speed. In some embodiments of this specification, by arranging graphite paper on the side surface of the protruding second protective sleeve 182 away from the connecting rod 120, the seed crystal 130 can be fully contacted with the liquid level of the melt 140, and the crystal can be pulled according to the formula. Speed growth.
在一些实施例中,前述籽晶托100可以设置在籽晶粘接装置30中,籽晶粘接装置30可以基于籽晶托100进行粘接籽晶130。前述籽晶粘接装置30可以用于粘接籽晶130。In some embodiments, the aforementioned seed crystal holder 100 may be disposed in the seed crystal bonding device 30 , and the seed crystal bonding device 30 may bond the seed crystal 130 based on the seed crystal holder 100 . The aforementioned seed crystal bonding device 30 can be used to bond the seed crystal 130 .
图11是根据本说明书一些实施例所示的籽晶粘接装置30的示例性结构图。FIG. 11 is an exemplary structural diagram of a seed bonding device 30 according to some embodiments of this specification.
如图11所示,籽晶粘接装置30可以包括一个或多个粘接组件300,粘接组件300可以包括支撑部件310和施压部件320。As shown in FIG. 11 , the seed bonding device 30 may include one or more bonding components 300 , and the bonding components 300 may include a supporting component 310 and a pressure component 320 .
支撑部件310可以用于支撑籽晶托100。例如,支撑部件310可以用于支撑籽晶托本体110。再例如,支撑部件310还可以用于支撑籽晶托本体110和连接杆120。支撑部件310可以包括金属、不锈钢等材料制成的支撑架,籽晶托100中的需要进行支撑的结构可以固定在支撑架上。The support member 310 may be used to support the seed holder 100 . For example, the support member 310 may be used to support the seed holder body 110 . For another example, the supporting component 310 can also be used to support the seed holder body 110 and the connecting rod 120 . The support component 310 may include a support frame made of metal, stainless steel, or other materials, and the structures that need to be supported in the seed crystal holder 100 may be fixed on the support frame.
施压部件320可以向籽晶130和/或籽晶托100施加压力,该压力可以将籽晶托100和籽晶托100上的籽晶130相向压合。The pressing component 320 can apply pressure to the seed crystal 130 and/or the seed crystal holder 100 , and the pressure can press the seed crystal holder 100 and the seed crystal 130 on the seed crystal holder 100 toward each other.
本说明书一些实施例,通过设置有一个或多个粘接组件300的籽晶粘接装置30,在粘接过程中不仅可以将籽晶托100与籽晶130相向压合,还可以固定籽晶托100,使粘接过程更加稳定,进而提高籽晶130的粘接效果。In some embodiments of this specification, through the seed crystal bonding device 30 provided with one or more bonding components 300, not only can the seed crystal holder 100 and the seed crystal 130 be pressed toward each other during the bonding process, but the seed crystal can also be fixed. The support 100 makes the bonding process more stable, thereby improving the bonding effect of the seed crystal 130.
如图12所示,籽晶粘接装置30还可以包括真空炉腔31、真空组件32、立柱33、电机34、丝杆35、压力柱36、支撑组件37、加热组件38、下压盘39。其中,真空炉腔31可以是籽晶130粘接的场所,真空组件32可以用于对真空颅腔31进行抽真空处理。立柱33可以设置于真空腔体31的顶部,电机34可以固定设置(例如,螺栓连接、焊接)于立柱33上。丝杆35与电机34可以转动连接,在电机34运行时,丝杆35可以绕中心轴转动从而上下运动。压力柱36的上端可以与丝杆35的下端连接,在丝杆35转动和上下运动时压力柱36也可以上下运动,压力柱36向下运动时可以对粘接组件300施加压力。支撑组件37可以放置于籽晶粘接装置30的底部,用于支撑加热组件38和下压盘39。加热组件38可以设置于支撑组件37与下压盘39之间,用于提供籽晶130粘接时所需要的热量。加热组件38的上表面可以放置下压盘39,下压盘39的上部可以放置粘接组件300,以与压力柱36配合对粘接组件300施加压力,将籽晶130粘接在籽晶托100上。籽晶托100和籽晶130可以放置于粘接组件300中,通过籽晶粘接装置30内部的其他组件(例如,真空组件32、压力柱36、加热组件38和下压盘39)对真空腔体31抽真空和对粘接组件300施加压力,以将籽晶130粘接于籽晶托100上,从而进行晶体生长。As shown in Figure 12, the seed bonding device 30 may also include a vacuum furnace cavity 31, a vacuum component 32, a column 33, a motor 34, a screw rod 35, a pressure column 36, a support component 37, a heating component 38, and a lower pressure plate 39 . The vacuum furnace chamber 31 may be a place where the seed crystal 130 is bonded, and the vacuum assembly 32 may be used to perform vacuuming on the vacuum cranial cavity 31 . The upright column 33 can be disposed on the top of the vacuum chamber 31 , and the motor 34 can be fixedly disposed (for example, bolted or welded) on the upright column 33 . The screw rod 35 is rotatably connected to the motor 34. When the motor 34 is running, the screw rod 35 can rotate around the central axis to move up and down. The upper end of the pressure column 36 can be connected with the lower end of the screw rod 35. When the screw rod 35 rotates and moves up and down, the pressure column 36 can also move up and down. When the pressure column 36 moves downward, it can exert pressure on the bonding assembly 300. The support component 37 can be placed at the bottom of the seed bonding device 30 for supporting the heating component 38 and the lower platen 39 . The heating component 38 may be disposed between the support component 37 and the lower pressure plate 39 to provide the heat required for bonding the seed crystal 130 . The lower pressure plate 39 can be placed on the upper surface of the heating component 38, and the bonding component 300 can be placed on the upper part of the lower pressure plate 39 to cooperate with the pressure column 36 to exert pressure on the bonding component 300 to bond the seed crystal 130 to the seed crystal holder. 100 on. The seed crystal holder 100 and the seed crystal 130 can be placed in the bonding assembly 300, and the vacuum is controlled by other components inside the seed crystal bonding device 30 (for example, the vacuum assembly 32, the pressure column 36, the heating assembly 38 and the lower pressure plate 39). The cavity 31 evacuates the vacuum and applies pressure to the bonding assembly 300 to bond the seed crystal 130 to the seed crystal holder 100 to perform crystal growth.
在一些实施例中,支撑部件310包括第一压件380和第二压件390,施压部件320包括第一压盘322。第二压件390与第一压件380嵌套连接,在籽晶130粘接固定过程中,籽晶130放置于第二压件390的上表面,籽晶托100放置于籽晶130上表面,第一压盘322可以向籽晶托100施加压力,以使得籽晶130可以粘接在籽晶托100上。In some embodiments, the supporting component 310 includes a first pressing member 380 and a second pressing member 390 , and the pressing member 320 includes a first pressing plate 322 . The second pressing part 390 is nested with the first pressing part 380. During the bonding and fixing process of the seed crystal 130, the seed crystal 130 is placed on the upper surface of the second pressing part 390, and the seed crystal holder 100 is placed on the upper surface of the seed crystal 130. , the first pressure plate 322 can apply pressure to the seed crystal holder 100, so that the seed crystal 130 can be bonded to the seed crystal holder 100.
第一压件380的侧壁可以包括至少一个第一排气孔383。至少一个第一排气孔383可以水平贯穿第一压件380的侧壁。至少一个第一排气孔383可以均匀对称分布于第一压件380的侧壁上。至少一个第一排气孔383可以位于竖直方向上的同一高度。The side wall of the first pressing member 380 may include at least one first vent hole 383 . At least one first exhaust hole 383 may penetrate horizontally through the side wall of the first pressing member 380 . At least one first exhaust hole 383 may be evenly and symmetrically distributed on the side wall of the first pressing member 380 . At least one first exhaust hole 383 may be located at the same height in the vertical direction.
如图13所示,第一压件380的形状可以为具有内部空腔381的柱体。例如,具有内部空腔的圆柱体、立方体或多棱柱。第一压件380的内部空腔的形状可以为圆柱体、立方体或多棱柱。第二压件390的形状可以为圆柱体、立方体或多棱柱。第一压件380的内部空腔的形状和/或尺寸与第二压件390的形状和/或尺寸相适配,使得第二压件390可以放置于第一压件380内且不发生大幅移动(例如,可移动量小于预设阈值)。具体地,第一压件380的内部空腔的形状和/或尺寸与第二压件390的形状和/或尺寸相适配可以是第一压件380的内部空腔的形状与第二压件390外壁的形状一致或大体一致,以及第一压件380的内部空腔的尺寸略大于第二压件390外壁的尺且第一压件380的内部空腔的尺寸与第二压件390外壁的尺寸的差值小于第一预设尺寸阈值(如,3mm)。第一预设尺寸阈值可以是默认值,也可以根据不同情况调整。例如,第二压件390外壁的形状为圆柱体,则第一压件380的内部空腔的形状也为圆柱体,并且第一压件380的内部空腔的直径略大于第二压件390外壁的直径(例如,第二压件390外壁的直径为15cm,第一压件380的内部空腔的直径为15.3cm)。As shown in FIG. 13 , the first pressing member 380 may be in the shape of a cylinder with an internal cavity 381 . For example, a cylinder, cube or polygonal prism with an internal cavity. The shape of the internal cavity of the first pressing member 380 may be a cylinder, a cube or a polygonal prism. The shape of the second pressing member 390 may be a cylinder, a cube or a polygonal prism. The shape and/or size of the internal cavity of the first pressing part 380 is adapted to the shape and/or size of the second pressing part 390, so that the second pressing part 390 can be placed inside the first pressing part 380 without causing significant damage. Movement (e.g., the movable amount is less than a preset threshold). Specifically, the shape and/or size of the internal cavity of the first pressing member 380 may be adapted to the shape and/or size of the second pressing member 390 . The shape of the outer wall of the first pressing member 390 is consistent or substantially consistent, and the size of the internal cavity of the first pressing member 380 is slightly larger than the size of the outer wall of the second pressing member 390, and the size of the internal cavity of the first pressing member 380 is the same as that of the second pressing member 390. The difference in size of the outer walls is less than a first preset size threshold (eg, 3 mm). The first preset size threshold can be a default value, or can be adjusted according to different situations. For example, if the shape of the outer wall of the second pressing part 390 is a cylinder, then the shape of the internal cavity of the first pressing part 380 is also a cylinder, and the diameter of the internal cavity of the first pressing part 380 is slightly larger than that of the second pressing part 390 The diameter of the outer wall (for example, the diameter of the outer wall of the second pressing part 390 is 15 cm, and the diameter of the internal cavity of the first pressing part 380 is 15.3 cm).
通过设置第一压件380的内部空腔的形状和/或尺寸与第二压件390的形状和/或尺寸相适配,使 得第二压件390可以放置于第一压件380内且不发生大幅移动,第一压件38与第二压件390嵌套连接较为稳固。By configuring the shape and/or size of the internal cavity of the first pressing member 380 to match the shape and/or size of the second pressing member 390, The second pressing part 390 can be placed in the first pressing part 380 without significant movement, and the nested connection between the first pressing part 38 and the second pressing part 390 is relatively stable.
在一些实施例中,第一压件380底部包括第二通孔382,第二压件390底部包括第一凸起391,第一凸起391与第二通孔382相互配合实现第一压件380和第二压件390的嵌套连接。In some embodiments, the bottom of the first pressing member 380 includes a second through hole 382, and the bottom of the second pressing member 390 includes a first protrusion 391. The first protrusion 391 and the second through hole 382 cooperate with each other to realize the first pressing member. 380 and the nested connection of the second pressing piece 390.
如图13所示,第二通孔382的形状可以为圆柱体、立方体或多棱柱。为了便于安装,第二通孔382可以为圆柱体。在一些实施例中,第二通孔382的直径可以包括5mm-150mm。在一些实施例中,第二通孔382的直径可以包括8mm-140mm。在一些实施例中,第二通孔382的直径可以包括10mm-130mm。在一些实施例中,第二通孔382的直径可以包括20mm-120mm。在一些实施例中,第二通孔382的直径可以包括30mm-110mm。在一些实施例中,第二通孔382的直径可以包括40mm-100mm。在一些实施例中,第二通孔382的直径可以包括50mm-90mm。在一些实施例中,第二通孔382的直径可以包括60mm-80mm。在一些实施例中,第二通孔382的直径可以包括70mm-75mm。As shown in FIG. 13 , the shape of the second through hole 382 may be a cylinder, a cube or a polygonal prism. To facilitate installation, the second through hole 382 may be cylindrical. In some embodiments, the diameter of the second through hole 382 may include 5 mm to 150 mm. In some embodiments, the diameter of the second through hole 382 may include 8mm-140mm. In some embodiments, the diameter of the second through hole 382 may include 10 mm-130 mm. In some embodiments, the diameter of the second through hole 382 may include 20 mm-120 mm. In some embodiments, the diameter of the second through hole 382 may include 30mm-110mm. In some embodiments, the diameter of the second through hole 382 may include 40mm-100mm. In some embodiments, the diameter of the second through hole 382 may include 50mm-90mm. In some embodiments, the diameter of the second through hole 382 may include 60mm-80mm. In some embodiments, the diameter of the second through hole 382 may include 70mm-75mm.
第一凸起391的形状可以为圆柱体、立方体或多棱柱。第一凸起391与第二通孔382可以同心设置。第二通孔382的形状和/或尺寸与第一凸起391的形状和/或尺寸相适配,使得第一凸起391可以放置于第二通孔382内且不发生大幅移动(例如,可移动量小于预设阈值)。具体地,第二通孔382的形状和/或尺寸与第一凸起391的形状和/或尺寸相适配可以是第一凸起391的形状与第二通孔382的形状一致或大体一致,以及第二通孔382的尺寸略大于第一凸起391的尺寸且第二通孔382的尺寸与第一凸起391的尺寸的差值小于第二预设尺寸阈值(如,3mm)。第二预设尺寸阈值可以是默认值,也可以根据不同情况调整。例如,第一凸起391的形状为圆柱体,则第二通孔382的形状也为圆柱体,并且第二通孔382的直径略大于第一凸起391的直径(例如,第一凸起391的直径为5cm,第二通孔382的直径为5.3cm)。The shape of the first protrusion 391 may be a cylinder, a cube or a polygonal prism. The first protrusion 391 and the second through hole 382 may be disposed concentrically. The shape and/or size of the second through hole 382 is adapted to the shape and/or size of the first protrusion 391 such that the first protrusion 391 can be placed in the second through hole 382 without significant movement (eg, The movable amount is less than the preset threshold). Specifically, the shape and/or size of the second through hole 382 is adapted to the shape and/or size of the first protrusion 391. The shape of the first protrusion 391 is consistent or substantially consistent with the shape of the second through hole 382. , and the size of the second through hole 382 is slightly larger than the size of the first protrusion 391 and the difference between the size of the second through hole 382 and the size of the first protrusion 391 is less than the second preset size threshold (eg, 3 mm). The second preset size threshold can be a default value, or can be adjusted according to different situations. For example, if the first protrusion 391 is in the shape of a cylinder, then the second through hole 382 is also in the shape of a cylinder, and the diameter of the second through hole 382 is slightly larger than the diameter of the first protrusion 391 (for example, the first protrusion 391 is in the shape of a cylinder). 391 has a diameter of 5 cm, and the second through hole 382 has a diameter of 5.3 cm).
通过设置第二通孔382的形状和/或尺寸与第一凸起391的形状和/或尺寸相适配,使得第二压件390可以放置于第一压件380内且第一凸起391与第二通孔382相互配合,实现第一压件380和第二压件390的嵌套连接,从而使得粘接组件300的整体结构连接更为稳固。By configuring the shape and/or size of the second through hole 382 to match the shape and/or size of the first protrusion 391, the second pressing member 390 can be placed in the first pressing member 380 and the first protrusion 391 Cooperating with the second through hole 382, the first pressing member 380 and the second pressing member 390 are nested and connected, thereby making the overall structural connection of the bonding assembly 300 more stable.
在一些实施例中,第一排气孔383的横截面为圆形时,第一排气孔383的横截面直径可以包括0.01mm-10mm。在一些实施例中,第一排气孔383的横截面为圆形时,第一排气孔383的直径可以包括0.1mm-9mm。在一些实施例中,第一排气孔383的横截面为圆形时,第一排气孔383的直径可以包括1mm-8mm。在一些实施例中,第一排气孔383的横截面为圆形时,第一排气孔383的直径可以包括2mm-7mm。在一些实施例中,第一排气孔383的横截面为圆形时,第一排气孔383的直径可以包括3mm-6mm。在一些实施例中,第一排气孔383的横截面为圆形时,第一排气孔383的直径可以包括4mm-5mm。通过合理设置第一排气孔383的尺寸,可以加强籽晶130粘接固定过程中的排气效果,从而提升粘接固定效果,提高制备的晶体质量。In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the cross-sectional diameter of the first exhaust hole 383 may include 0.01mm-10mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 0.1mm-9mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 1 mm to 8 mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 2 mm to 7 mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 3 mm to 6 mm. In some embodiments, when the cross-section of the first exhaust hole 383 is circular, the diameter of the first exhaust hole 383 may include 4 mm to 5 mm. By reasonably setting the size of the first exhaust hole 383, the exhaust effect during the bonding and fixing process of the seed crystal 130 can be enhanced, thereby improving the bonding and fixing effect and improving the quality of the prepared crystal.
在一些实施例中,第一压件380和第二压件390嵌套连接后,第一排气孔383与第二压件390上表面的竖直距离在0.2-5mm的范围内。在一些实施例中,第一压件380和第二压件390嵌套连接后,第一排气孔382与第二压件390上表面的竖直距离可以在0.5mm-4.5mm的范围内。在一些实施例中,第一压件380和第二压件390嵌套连接后,第一排气孔383与第二件390上表面的竖直距离可以在1mm-4mm的范围内。在一些实施例中,第一压件380和第二压件390嵌套连接后,第一排气孔383与第二压件390上表面的竖直距离可以在2mm-3mm的范围内。通过控制第一排气孔383与第二压件390上表面的竖直距离,可以加强籽晶130粘接固定过程中的排气效果,从而提升粘接固定效果,提高制备的晶体质量。In some embodiments, after the first pressure part 380 and the second pressure part 390 are nested and connected, the vertical distance between the first exhaust hole 383 and the upper surface of the second pressure part 390 is in the range of 0.2-5 mm. In some embodiments, after the first pressure part 380 and the second pressure part 390 are nested and connected, the vertical distance between the first exhaust hole 382 and the upper surface of the second pressure part 390 may be in the range of 0.5mm-4.5mm. . In some embodiments, after the first pressing part 380 and the second pressing part 390 are nested and connected, the vertical distance between the first exhaust hole 383 and the upper surface of the second part 390 may be in the range of 1 mm to 4 mm. In some embodiments, after the first pressure part 380 and the second pressure part 390 are nested and connected, the vertical distance between the first exhaust hole 383 and the upper surface of the second pressure part 390 may be in the range of 2 mm-3 mm. By controlling the vertical distance between the first exhaust hole 383 and the upper surface of the second pressing member 390, the exhaust effect during the bonding and fixing process of the seed crystal 130 can be enhanced, thereby improving the bonding and fixing effect and improving the quality of the prepared crystal.
在一些实施例中,第二压件390的侧壁包括至少一个第二排气孔393。如图13所示,至少一个第二排气孔393可以水平贯穿第二压件390上卡槽392的侧壁,卡槽392用于放置籽晶130。至少一个第二排气孔393可以均匀对称分布于卡槽392的侧壁上,至少一个第二排气孔393可以位于竖直方向上的同一高度。In some embodiments, the side wall of the second pressing member 390 includes at least one second vent hole 393 . As shown in FIG. 13 , at least one second exhaust hole 393 can penetrate horizontally through the side wall of the slot 392 on the second pressing member 390 , and the slot 392 is used to place the seed crystal 130 . At least one second exhaust hole 393 may be evenly and symmetrically distributed on the side wall of the slot 392, and at least one second exhaust hole 393 may be located at the same height in the vertical direction.
第一排气孔383与第二排气孔393至少部分相对应,第一排气孔383与第二排气孔393至少部分相对应可以是第一压件380和第二压件390嵌套连接后,第一排气孔383与第二排气孔393的部分或全部相重合,也可以是第一压件380和第二压件390嵌套连接后,第一排气孔383与第二排气孔393同心设置。第一排气孔383的尺寸与第二排气孔393的尺寸可以相同,也可以不同。The first exhaust hole 383 at least partially corresponds to the second exhaust hole 393. The first exhaust hole 383 at least partially corresponds to the second exhaust hole 393. The first pressure member 380 and the second pressure member 390 may be nested. After connection, part or all of the first exhaust hole 383 and the second exhaust hole 393 overlap. Alternatively, after the first pressure member 380 and the second pressure member 390 are nested and connected, the first exhaust hole 383 and the second exhaust hole 393 may overlap. The two exhaust holes 393 are arranged concentrically. The size of the first exhaust hole 383 and the size of the second exhaust hole 393 may be the same or different.
本说明书一些实施例将第一排气孔383与第二排气孔393至少部分相对应,可以提高籽晶130粘接过程中的排气效果,有助于提高制备的晶体质量。In some embodiments of this specification, the first exhaust hole 383 and the second exhaust hole 393 at least partially correspond, which can improve the exhaust effect during the bonding process of the seed crystal 130 and help improve the quality of the prepared crystal.
在一些实施例中,第二排气孔393的横截面直径可以包括0.01mm-10mm,以提高籽晶130粘接过程中的排气效果。在一些实施例中,第二排气孔393的横截面为圆形时,第二排气孔393的直径可以包括1mm-8mm。在一些实施例中,第二排气孔393的横截面为圆形时,第二排气孔393的直径可以包括2mm-7mm。在一些实施例中,第二排气孔393的横截面为圆形时,第二排气孔393的直径可以包括3mm-6mm。在一些实施例中,第二排气孔393的横截面为圆形时,第二排气孔393的直径可以包括 4mm-5mm。In some embodiments, the cross-sectional diameter of the second exhaust hole 393 may include 0.01 mm to 10 mm to improve the exhaust effect during the bonding process of the seed crystal 130 . In some embodiments, when the cross-section of the second exhaust hole 393 is circular, the diameter of the second exhaust hole 393 may include 1 mm to 8 mm. In some embodiments, when the cross-section of the second exhaust hole 393 is circular, the diameter of the second exhaust hole 393 may include 2 mm to 7 mm. In some embodiments, when the cross-section of the second exhaust hole 393 is circular, the diameter of the second exhaust hole 393 may include 3 mm to 6 mm. In some embodiments, when the cross-section of the second exhaust hole 393 is circular, the diameter of the second exhaust hole 393 may include 4mm-5mm.
在一些实施例中,第二排气孔393与第二压件390上表面的竖直距离在0.2mm-5mm的范围内,以提高籽晶130粘接过程中的排气效果。在一些实施例中,第二排气孔393与第二压件120上表面的竖直距离可以在0.5mm-4.5mm的范围内。在一些实施例中,第二排气孔393与第二压件390上表面的竖直距离可以在1m-4m的范围内。在一些实施例中,第二排气孔393与第二压件390上表面的竖直距离可以在2m-3m的范围内。In some embodiments, the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 390 is in the range of 0.2 mm to 5 mm to improve the exhaust effect during the bonding process of the seed crystal 130 . In some embodiments, the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 120 may be in the range of 0.5mm-4.5mm. In some embodiments, the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 390 may be in the range of 1 m to 4 m. In some embodiments, the vertical distance between the second exhaust hole 393 and the upper surface of the second pressing member 390 may be in the range of 2m-3m.
在一些实施例中,第二压件390的高度可以小于第一压件380的高度,以使第二压件390与第一压件380嵌套连接后,第二压件390可以位于第一压件380的内部空腔381内。In some embodiments, the height of the second pressing part 390 may be smaller than the height of the first pressing part 380, so that after the second pressing part 390 and the first pressing part 380 are nested and connected, the second pressing part 390 may be located on the first pressing part 380. In the internal cavity 381 of the pressing member 380.
在一些实施例中,籽晶托100与第一压件380可以螺纹连接。第一压件380的内部空腔381侧壁上部可以设置螺纹结构,籽晶托100的侧壁可以设置螺纹结构。籽晶托100与第一压件380螺纹连接后,第二压件390可以位于籽晶托100与第一压件380围成的空腔内。In some embodiments, the seed crystal holder 100 and the first pressing member 380 may be threaded. The upper part of the side wall of the internal cavity 381 of the first pressing member 380 may be provided with a threaded structure, and the side wall of the seed crystal holder 100 may be provided with a threaded structure. After the seed crystal holder 100 and the first pressing part 380 are threadedly connected, the second pressing part 390 can be located in the cavity surrounded by the seed crystal holder 100 and the first pressing part 380 .
在一些实施例中,第一压盘322底部包括第二凸起3221,籽晶托100上部包括第二凹槽3222,第二凸起3221和第二凹槽3222配合实现第一压盘380和籽晶托100的连接。In some embodiments, the bottom of the first pressure plate 322 includes a second protrusion 3221, and the upper part of the seed crystal holder 100 includes a second groove 3222. The second protrusion 3221 and the second groove 3222 cooperate to realize the first pressure plate 380 and Seed crystal holder 100 connection.
第二凸起3221的形状可以为圆柱体、立方体或多棱柱。第二凸起3221的侧壁可以设置螺纹结构,第二凹槽3222的内侧壁可以设置螺纹结构,且第二凸起3221与第二凹槽3222可以螺纹连接。通过设置第二凹槽3222与第二凸起3221螺纹连接,使得第二凹槽3222与第二凸起3221相互配合,实现第一压盘322和籽晶托100的连接,进而实现在不同温度或不同压力下分阶段对籽晶130以及粘接剂进行挤压排气,以更好地将籽晶130粘接在籽晶托100上。The shape of the second protrusion 3221 may be a cylinder, a cube or a polygonal prism. The side wall of the second protrusion 3221 may be provided with a threaded structure, the inner wall of the second groove 3222 may be provided with a threaded structure, and the second protrusion 3221 and the second groove 3222 may be threadedly connected. By arranging the second groove 3222 and the second protrusion 3221 to be threadedly connected, the second groove 3222 and the second protrusion 3221 cooperate with each other to realize the connection between the first pressure plate 322 and the seed crystal holder 100, thereby realizing the operation at different temperatures. Or the seed crystal 130 and the adhesive are extruded and exhausted in stages under different pressures to better bond the seed crystal 130 to the seed crystal holder 100 .
在一些实施例中,支撑部件310还可以包括环形底座311和盖体312,籽晶托100可以放置在环形底座311上。环形底座311可以为圆筒状,环形底座311的直径可以大于或小于籽晶托100的最大直径(即籽晶粘接面111的直径)。环形底座311的直径大于籽晶托100的最大直径时,籽晶粘接面111可以平稳放置在环形底座311上。环形底座311的直径小于籽晶托100的最大直径时,籽晶托100的外表面可以放置在环形底座311上。盖体312也可以为圆筒状。如图14所示,盖体312包括环形的侧壁3121和盖板3122,侧壁3121可以套设在环形底座311外。在一些实施例中,侧壁3121的内壁可以与环形底座311的外壁贴合。盖板3122可以为内部中空的圆柱状,位于环形底座311如图14所示的上端部,且盖板3122沿垂直于籽晶托100的轴线A的截面面积大于环形底座311底面沿垂直于籽晶托100的轴线A的截面面积。盖体312可以朝向环形底座311向贴合在籽晶托100上的籽晶130施加压力。本说明书一些实施例通过环形底座311固定籽晶托100的同时通过盖体312对籽晶130施加压力,使籽晶130向籽晶托100压合,进而实现对籽晶130的快速、方便地粘接。In some embodiments, the support component 310 may further include an annular base 311 and a cover 312, and the seed crystal holder 100 may be placed on the annular base 311. The annular base 311 may be cylindrical, and the diameter of the annular base 311 may be greater than or less than the maximum diameter of the seed crystal holder 100 (ie, the diameter of the seed crystal bonding surface 111). When the diameter of the annular base 311 is larger than the maximum diameter of the seed crystal holder 100, the seed crystal bonding surface 111 can be placed stably on the annular base 311. When the diameter of the annular base 311 is smaller than the maximum diameter of the seed crystal holder 100, the outer surface of the seed crystal holder 100 can be placed on the annular base 311. The cover 312 may also be cylindrical. As shown in FIG. 14 , the cover 312 includes an annular side wall 3121 and a cover plate 3122 . The side wall 3121 can be set outside the annular base 311 . In some embodiments, the inner wall of the side wall 3121 may fit with the outer wall of the annular base 311 . The cover plate 3122 can be cylindrical with a hollow interior, located at the upper end of the annular base 311 as shown in Figure 14, and the cross-sectional area of the cover plate 3122 along the axis A perpendicular to the seed crystal holder 100 is larger than the bottom surface of the annular base 311 along the axis perpendicular to the seed. The cross-sectional area of the axis A of the crystal holder 100. The cover 312 can apply pressure toward the annular base 311 to the seed crystal 130 attached to the seed crystal holder 100 . In some embodiments of this specification, the seed crystal holder 100 is fixed through the annular base 311 and at the same time, pressure is applied to the seed crystal 130 through the cover 312 to press the seed crystal 130 toward the seed crystal holder 100, thereby achieving quick and convenient removal of the seed crystal 130. bonding.
在一些实施例中,籽晶粘接装置30还可以包括第一连接件331和第二连接件332,其中,第一连接件331可以设于环形底座311上,第二连接件332可以设于盖体312上。In some embodiments, the seed bonding device 30 may further include a first connecting member 331 and a second connecting member 332, wherein the first connecting member 331 may be provided on the annular base 311 and the second connecting member 332 may be provided on the annular base 311. On the cover 312.
第一连接件331可以与第二连接件332可拆卸连接。如图14所示,第一连接件331可以是位于环形底座311侧壁上的卡环、卡钩、卡接块等结构。第二连接件332可以包括定位凸起3321和卡扣3322,定位凸起3321可以设置于盖体312的侧壁3121的如图14所示的下表面或侧表面,用于将第二连接件332固定在盖体312上。卡扣3322可以可传动地连接到固定凸起3321上,且卡扣3322可以卡接在第一连接件331中,以使第一连接件331与第二连接件332连接,此时,盖体312的盖板3122向籽晶托100上的籽晶130施加压力,以对籽晶130进行粘接。卡扣3322脱离第一连接件331时,第一连接件331与第二连接件332脱离。The first connecting member 331 may be detachably connected to the second connecting member 332. As shown in FIG. 14 , the first connecting member 331 may be a snap ring, a hook, a snap block or other structures located on the side wall of the annular base 311 . The second connecting member 332 may include a positioning protrusion 3321 and a buckle 3322. The positioning protrusion 3321 may be disposed on the lower surface or side surface of the side wall 3121 of the cover 312 as shown in FIG. 14 for connecting the second connecting member 332 is fixed on the cover 312. The buckle 3322 can be driveably connected to the fixing protrusion 3321, and the buckle 3322 can be buckled in the first connecting piece 331 to connect the first connecting piece 331 with the second connecting piece 332. At this time, the cover The cover plate 3122 of 312 exerts pressure on the seed crystal 130 on the seed crystal holder 100 to bond the seed crystal 130 . When the buckle 3322 is disengaged from the first connecting member 331, the first connecting member 331 and the second connecting member 332 are disengaged.
在一些实施例中,第一连接件331和第二连接件332可以为连接绳,第一连接件331的一端缠绕在环形底座331的外周侧,第二连接件332的一端缠绕在盖体312的侧壁3121的下表面或侧表面,第一连接件331的另一端与第二连接件332的另一端相连。In some embodiments, the first connecting member 331 and the second connecting member 332 may be connecting ropes. One end of the first connecting member 331 is wound around the outer peripheral side of the annular base 331 , and one end of the second connecting member 332 is wound around the cover 312 The lower surface or side surface of the side wall 3121, the other end of the first connecting member 331 is connected to the other end of the second connecting member 332.
籽晶粘接装置30可以包括多个第一连接件331和多个第二连接件332,其中,多个第一连接件331和多个第二连接件332一一对应地相互配合。如图14所示,籽晶粘接装置30可以包括两个第一连接件331和两个第二连接件332,其中,每一第一连接件331分别和一个第二连接件332配合。The seed bonding device 30 may include a plurality of first connecting members 331 and a plurality of second connecting members 332, wherein the plurality of first connecting members 331 and the plurality of second connecting members 332 cooperate with each other in a one-to-one correspondence. As shown in FIG. 14 , the seed bonding device 30 may include two first connecting members 331 and two second connecting members 332 , wherein each first connecting member 331 cooperates with a second connecting member 332 respectively.
本说明书一些实施例通过第一连接件331与第二连接件332,方便将盖体312与环形底座311快速连接,进而对籽晶托100施加压力。此外,将第一连接件331与第二连接件332设置为可拆卸连接,可以避免固定连接造成的籽晶托100与籽晶130错位,进而提高粘接效果。Some embodiments of this specification use the first connecting member 331 and the second connecting member 332 to facilitate quick connection of the cover 312 and the annular base 311, thereby applying pressure to the seed crystal holder 100. In addition, configuring the first connecting member 331 and the second connecting member 332 to be detachably connected can avoid misalignment of the seed crystal holder 100 and the seed crystal 130 caused by fixed connection, thereby improving the bonding effect.
在一些实施例中,环形底座311上还可以设有锁紧结构340。锁紧结构340可以用于将籽晶托100固定到环形底座311上,以提高籽晶托100在长晶过程中的稳定性,提高晶体生成的质量。例如,锁紧结构340可以包括插销,籽晶托130和侧壁3121中可以设有位置及尺寸与前述插销相匹配的插销孔,前述插销可以插入插销孔中,进而将籽晶托100固定到环形底座311上。In some embodiments, the annular base 311 may also be provided with a locking structure 340 . The locking structure 340 can be used to fix the seed crystal holder 100 to the annular base 311 to improve the stability of the seed crystal holder 100 during the crystal growth process and improve the quality of crystal formation. For example, the locking structure 340 may include a latch, and the seed crystal holder 130 and the side wall 3121 may be provided with latch holes whose positions and sizes match the aforementioned latch pins. The aforementioned latch pins may be inserted into the latch holes to thereby fix the seed crystal holder 100 to on the ring base 311.
在一些实施例中,籽晶托100远离籽晶粘接面111的一侧设有连接螺纹孔,锁紧结构340包括锁 紧盘341、锁紧件和锁紧螺母343。如图15A所示前述锁紧件可以包括托盘3421、第一螺纹杆3422和第二螺纹杆3423。第一螺纹杆3422和第二螺杆3423可位于托盘3421的厚度方向的两侧。如图14所示,第一螺纹杆3422可以与连接螺纹孔(图未示出)配合,插入连接螺纹孔中,进而与籽晶托100螺纹连接。在一些实施例中,托盘3421中可以设置有螺纹孔(图未示出),从而可以与第一螺纹杆3422螺纹相连,以承托籽晶托100远离籽晶粘接面111的一侧。在另一些实施例中,第一螺纹杆3422可以通过粘接、焊接等固定连接方式固定到托盘3421上。第二螺纹杆3423可以位于托盘3421远离籽晶粘接面111的一侧并与托盘341螺纹相连。锁紧盘341可以位于托盘3421远离籽晶粘接面111的一侧,锁紧盘341可以为与环形底座311内壁贴合的圆盘。锁紧盘341上可以设有安装孔,第二螺纹杆3423可以穿过前述安装孔与锁紧螺母343配合。锁紧螺母343和托盘3421可以分别位于锁紧盘341沿安装孔的轴线方向(同托盘3421的厚度方向)的两侧。安装孔的轴线方向可以与籽晶托100的轴线A的方向相同。本说明书一些实施例通过锁紧件连接籽晶托100的连接螺纹孔和锁紧盘341,并通过锁紧螺母343固定,可以更稳定地将籽晶托100固定于环形底座311上,同时,通过锁紧盘341与环形底座311配合,有利于提高籽晶托100与籽晶130的同心度。In some embodiments, the side of the seed crystal holder 100 away from the seed crystal bonding surface 111 is provided with a connecting threaded hole, and the locking structure 340 includes a lock. Tightening disk 341, locking piece and locking nut 343. As shown in FIG. 15A , the aforementioned locking member may include a tray 3421 , a first threaded rod 3422 and a second threaded rod 3423 . The first threaded rod 3422 and the second threaded rod 3423 may be located on both sides of the tray 3421 in the thickness direction. As shown in FIG. 14 , the first threaded rod 3422 can cooperate with the connecting threaded hole (not shown), be inserted into the connecting threaded hole, and then be threadedly connected with the seed crystal holder 100 . In some embodiments, a threaded hole (not shown) may be provided in the tray 3421 so as to be threadably connected to the first threaded rod 3422 to support the side of the seed crystal holder 100 away from the seed crystal bonding surface 111 . In other embodiments, the first threaded rod 3422 can be fixed to the tray 3421 by bonding, welding or other fixed connection methods. The second threaded rod 3423 can be located on the side of the tray 3421 away from the seed bonding surface 111 and is threadedly connected to the tray 341 . The locking disk 341 may be located on the side of the tray 3421 away from the seed crystal bonding surface 111 , and the locking disk 341 may be a disk that fits the inner wall of the annular base 311 . The locking plate 341 may be provided with a mounting hole, and the second threaded rod 3423 may pass through the mounting hole and cooperate with the locking nut 343 . The locking nut 343 and the tray 3421 may be respectively located on both sides of the locking plate 341 along the axis direction of the mounting hole (same as the thickness direction of the tray 3421). The axis direction of the mounting hole may be the same as the axis A of the seed crystal holder 100 . In some embodiments of this specification, the connecting threaded hole of the seed crystal holder 100 and the locking disk 341 are connected through a locking piece and fixed by a locking nut 343, so that the seed crystal holder 100 can be fixed on the annular base 311 more stably. At the same time, The locking disk 341 cooperates with the annular base 311 to help improve the concentricity between the seed crystal holder 100 and the seed crystal 130 .
在一些实施例中,托盘341可以由弹性材料(如,橡胶、塑料)制成,可以吸收压力或籽晶托100在旋转时的摩擦,达到缓冲的效果,能够避免热压过程损坏籽晶托本体110。In some embodiments, the tray 341 can be made of elastic material (such as rubber, plastic), which can absorb pressure or friction when the seed crystal holder 100 rotates to achieve a buffering effect and avoid damage to the seed crystal holder during the hot pressing process. Ontology 110.
在一些实施例中,环形底座311的内壁上还可以设有承托结构350。如图14所示,前述承托结构350可以包括环形连接板351、环形承托板352和环形承托凸起353。In some embodiments, a supporting structure 350 can also be provided on the inner wall of the annular base 311 . As shown in FIG. 14 , the aforementioned supporting structure 350 may include an annular connecting plate 351 , an annular supporting plate 352 and an annular supporting protrusion 353 .
环形连接板351可以用于连接环形底座311的内壁。环形连接板351的外壁可以与环形底座311的内壁贴合,其形状可以与环形底座311的内壁的形状相适应。例如,环形底座311的内壁呈圆柱形,对应的,环形连接板351为圆环。环形底座311的内壁上可以设有与环形连接板351相配的卡接凹槽,环形连接板351嵌入前述卡接凹槽内。The annular connecting plate 351 can be used to connect the inner wall of the annular base 311 . The outer wall of the annular connecting plate 351 can fit with the inner wall of the annular base 311 , and its shape can be adapted to the shape of the inner wall of the annular base 311 . For example, the inner wall of the annular base 311 is cylindrical, and correspondingly, the annular connecting plate 351 is a ring. The inner wall of the annular base 311 may be provided with a snap-in groove that matches the annular connecting plate 351, and the annular connecting plate 351 is embedded in the aforementioned snap-in groove.
环形承托板352的形状可以与环形连接板351的形状相适应,例如,环形连接板351为圆环时,对应的,环形承托板352可以为圆环。环形承托板352的外环连接环形连接板351,内环设有环形承托凸起353。The shape of the annular supporting plate 352 can be adapted to the shape of the annular connecting plate 351. For example, when the annular connecting plate 351 is a circular ring, correspondingly, the annular supporting plate 352 can be a circular ring. The outer ring of the annular supporting plate 352 is connected to the annular connecting plate 351, and the inner ring is provided with an annular supporting protrusion 353.
环形承托凸起353可以用于承托籽晶托100,其截面可以为半圆形或其他形状(例如,倒圆锥形)。前述环形承托凸起353可以由弹性材料(如,橡胶)制成,可以吸收压力或籽晶托100在旋转时的摩擦,达到缓冲的效果,有助于在热压过程中保护籽晶托本体110。The annular supporting protrusion 353 can be used to support the seed crystal holder 100, and its cross section can be semicircular or other shapes (eg, inverted cone). The aforementioned annular supporting protrusion 353 can be made of elastic material (such as rubber), which can absorb pressure or friction when the seed crystal holder 100 rotates to achieve a buffering effect and help protect the seed crystal holder during the hot pressing process. Ontology 110.
本说明书一些实施例通过设置承托结构350有助于更稳定地承托籽晶托100,有效减少籽晶托100受压后产生的偏移,环形承托凸起353有利于配合不同锥度的籽晶托100进行承托。Some embodiments of this specification help to support the seed crystal holder 100 more stably by setting the supporting structure 350, effectively reducing the deflection of the seed crystal holder 100 after being pressed. The annular supporting protrusion 353 is conducive to matching different tapers. The seed crystal holder 100 is used for support.
籽晶130与籽晶托100粘接时会使用胶,粘接过程中有黏度的胶会产生气泡。在一些实施例中,籽晶粘接面111可以设有涂层,涂层可以是热塑性塑料(如聚四氟乙烯),可以保持籽晶粘接面111的光滑度,从而能更好地排出挤压中产生的气泡。Glue will be used when the seed crystal 130 and the seed crystal holder 100 are bonded. The viscous glue will generate bubbles during the bonding process. In some embodiments, the seed crystal bonding surface 111 can be provided with a coating, and the coating can be a thermoplastic (such as polytetrafluoroethylene), which can maintain the smoothness of the seed crystal bonding surface 111 and thereby enable better drainage. Bubbles produced during extrusion.
在一些实施例中,籽晶粘接装置还可以包括气泡去除装置。在一些实施例中,气泡去除装置可以设于盖体312上,前述气泡去除装置可以用于去除籽晶130与籽晶托100之间的气泡。气泡去除装置可以设在盖体312与籽晶托100之间。在另一些实施例中,气泡去除装置可以包括驱动籽晶托旋转的设备(如下文中图16所示的旋转驱动件370,关于旋转驱动件370更多内容可以参见图16及其相关描述)。当气泡去除装置包括下文中图16所示的旋转驱动件370时,可以将已经与籽晶130粘接的籽晶托100从环形底座311上取下,然后将其放置到一个驱动籽晶托100旋转的设备上,在盖体312提供的压力下,籽晶托100旋转,可以使得籽晶托100与籽晶130之间的气泡被排出。In some embodiments, the seed bonding device may further include a bubble removal device. In some embodiments, a bubble removal device may be provided on the cover 312 , and the aforementioned bubble removal device may be used to remove bubbles between the seed crystal 130 and the seed crystal holder 100 . The bubble removal device may be provided between the cover 312 and the seed crystal holder 100 . In other embodiments, the bubble removal device may include a device that drives the seed crystal holder to rotate (such as the rotational driving member 370 shown in FIG. 16 below. For more information about the rotational driving member 370, please refer to FIG. 16 and its related description). When the bubble removal device includes the rotary driving member 370 shown in FIG. 16 below, the seed crystal holder 100 that has been bonded to the seed crystal 130 can be removed from the annular base 311 and then placed on a driving seed crystal holder. On a 100-degree rotating device, under the pressure provided by the cover 312, the seed crystal holder 100 rotates, so that the air bubbles between the seed crystal holder 100 and the seed crystal 130 can be discharged.
本说明书一些实施例通过气泡去除装置可以将气泡去除,提高籽晶130与籽晶托100之间的粘接效果。In some embodiments of this specification, bubbles can be removed through a bubble removal device to improve the bonding effect between the seed crystal 130 and the seed crystal holder 100 .
如图14及图15B所示,气泡去除装置还可以包括插槽361、插板362和滚轮363。插槽361位于盖体312上,用于容纳插板362并限制插板362的运动方向。插板362为条状,其尺寸与插槽361适配。插板362可以位于插槽361内。滚轮363可以设置在插板362的一端。前述滚轮363的直径可以小于插槽361的高度,以使得滚轮363可以在插槽361内运动。前述滚轮363可以为弹性材料(如,橡胶)制作,以避免其运动时对籽晶130或籽晶托100造成损坏。As shown in FIG. 14 and FIG. 15B , the bubble removal device may also include a slot 361 , an insert plate 362 and a roller 363 . The slot 361 is located on the cover 312 for accommodating the plug-in board 362 and limiting the movement direction of the plug-in board 362 . The plug-in board 362 is strip-shaped, and its size is adapted to the slot 361 . Board 362 may be located within slot 361. The roller 363 can be disposed at one end of the insert plate 362 . The diameter of the aforementioned roller 363 may be smaller than the height of the slot 361 , so that the roller 363 can move within the slot 361 . The aforementioned roller 363 can be made of elastic material (such as rubber) to avoid damage to the seed crystal 130 or the seed crystal holder 100 when it moves.
籽晶130粘接前,插板362可以对籽晶托100进行支撑,籽晶130粘接后,插板362可以在插槽361内运动(例如,左右运动),以带动滚轮363滚压籽晶130。本说明书一些实施例,通过插板362带动滚轮363滚压籽晶130,可以挤出籽晶130在粘接过程中产生的气泡,提高籽晶130与籽晶托100之间的粘接质量。Before the seed crystal 130 is bonded, the insert plate 362 can support the seed crystal holder 100. After the seed crystal 130 is bonded, the insert plate 362 can move (for example, left and right) in the slot 361 to drive the roller 363 to roll the seed. Crystal 130. In some embodiments of this specification, the insert plate 362 drives the roller 363 to roll the seed crystal 130, thereby squeezing out the bubbles generated during the bonding process of the seed crystal 130 and improving the bonding quality between the seed crystal 130 and the seed crystal holder 100.
如图14及图15B所示,插板362的另一端还可以设有拉环364。籽晶130粘接后,拉动拉环364可以带动插板362运动,进而带动滚轮363滚压籽晶130,更方便地实现对气泡的挤压。 As shown in FIG. 14 and FIG. 15B , the other end of the inserting plate 362 may also be provided with a pull ring 364 . After the seed crystal 130 is bonded, pulling the pull ring 364 can drive the inserting plate 362 to move, thereby driving the roller 363 to roll the seed crystal 130, thereby squeezing the bubbles more conveniently.
在一些实施例中,气泡去除装置还可以包括滚压转动件(图中未示出)。滚压转动件可以向朝向籽晶粘接面111的方向对籽晶130施加一定的压力。同时滚压转动件还可以以某个固定的轴(如轴线A)旋转,通过一边旋转一边对籽晶130施加压力,可以使得籽晶130与籽晶托100之间的气体排出。在以下实施例中,滚压转动件上与籽晶130接触的表面可以设有滚珠、滚柱或滚轮等,以减少滚压转动件与籽晶130之间的摩擦。In some embodiments, the bubble removal device may further include a rolling rotary member (not shown in the figure). The rolling rotating member can exert a certain pressure on the seed crystal 130 in a direction toward the seed crystal bonding surface 111 . At the same time, the rolling rotating member can also rotate on a fixed axis (such as axis A). By applying pressure to the seed crystal 130 while rotating, the gas between the seed crystal 130 and the seed crystal holder 100 can be discharged. In the following embodiments, the surface of the rolling rotating member in contact with the seed crystal 130 may be provided with balls, rollers or rollers, etc., to reduce friction between the rolling rotating member and the seed crystal 130 .
在一些实施例中,如图16所示,支撑部件310可以包括支撑盘313。前述支撑盘313用于承托籽晶130和籽晶托100。在一些实施例中,支撑盘313可以为圆盘状、方形盘状等。支撑盘313的沿垂直于籽晶托100的轴线A的截面面积大于籽晶托100或籽晶130沿垂直于籽晶托100的轴线A的截面面积。籽晶130位于支撑盘313与籽晶托110之间。In some embodiments, as shown in FIG. 16 , the support member 310 may include a support plate 313 . The aforementioned support plate 313 is used to support the seed crystal 130 and the seed crystal holder 100 . In some embodiments, the support plate 313 may be in the shape of a disc, a square disc, or the like. The cross-sectional area of the support plate 313 along the axis A perpendicular to the seed crystal holder 100 is larger than the cross-sectional area of the seed crystal holder 100 or the seed crystal 130 along the axis A perpendicular to the seed crystal holder 100 . The seed crystal 130 is located between the support plate 313 and the seed crystal holder 110 .
在一些实施例中,籽晶粘接装置30还可以包括支撑架314以及设于支撑架314上的多个施压驱动件。支撑盘313设于前述支撑架314上。施压驱动件可以包括泵类设备(如,电动泵),用于驱动施压部件320对籽晶托100施加压力。在一些实施例中,施压驱动件还可以包括气压施压驱动件或液压施压驱动件。In some embodiments, the seed bonding device 30 may further include a support frame 314 and a plurality of pressure driving members provided on the support frame 314 . The support plate 313 is provided on the aforementioned support frame 314 . The pressure driving member may include a pump device (eg, an electric pump) for driving the pressure member 320 to apply pressure to the seed crystal holder 100 . In some embodiments, the pressure driving member may also include a pneumatic pressure driving member or a hydraulic pressure driving member.
在一些实施例中,籽晶粘接装置30可以包括多个粘接组件300,前述多个施压驱动件分别与每一粘接组件300中的施压部件320连接,以使施压部件320对籽晶托100施加朝向支撑盘313的压力。当施压驱动件向籽晶托100施加压力时,支撑盘313可以承托住籽晶托100,对其进行限位,避免籽晶托100发生位移,同时多个粘接组件300可以同时进行多组粘接,提高粘接效率。如图16所示,籽晶粘接装置30可以包括3个粘接组件300,沿着竖直方向间隔布置,前述竖直方向与籽晶托100的轴向相同,每个粘接组件300对一个籽晶托100的籽晶130进行粘接,当施压驱动件可以同时驱动3个粘接组件300的施压部件320对对应的籽晶托100进行施压,进而实现同时进行的多组籽晶130的粘接。In some embodiments, the seed bonding device 30 may include multiple bonding assemblies 300 , and the plurality of pressure driving members are respectively connected to the pressure applying components 320 in each bonding assembly 300 , so that the pressure applying components 320 Pressure is applied to the seed holder 100 toward the support plate 313 . When the pressure driving member applies pressure to the seed crystal holder 100, the support plate 313 can support the seed crystal holder 100 and limit its position to prevent the seed crystal holder 100 from being displaced. At the same time, multiple bonding components 300 can be bonded simultaneously. Multiple groups of bonding to improve bonding efficiency. As shown in Figure 16, the seed crystal bonding device 30 may include three bonding components 300, which are spaced apart along the vertical direction. The vertical direction is the same as the axial direction of the seed crystal holder 100. Each bonding component 300 has a pair of When the seed crystal 130 of one seed crystal holder 100 is bonded, the pressure driving member can simultaneously drive the pressure components 320 of three bonding assemblies 300 to press the corresponding seed crystal holder 100, thereby realizing multiple groups at the same time. Bonding of seed crystal 130.
如图16所示,支撑架314可以包括沿着前述竖直方向延伸的多根支撑杆315。支撑杆315沿支撑盘313的周向间隔布置。多个施压驱动件可以设于至少一根支撑杆315上,且多个施压驱动件沿竖直方向间隔布置,多个粘接组件300沿竖直方向间隔布置,从而有助于多个施压驱动件一次施压对多个粘接组件300进行粘接,并减少空间的占用。As shown in FIG. 16 , the support frame 314 may include a plurality of support rods 315 extending along the aforementioned vertical direction. The support rods 315 are arranged at intervals along the circumferential direction of the support plate 313 . A plurality of pressure driving members can be provided on at least one support rod 315, and the plurality of pressure driving members are spaced apart along the vertical direction, and the plurality of bonding assemblies 300 are spaced apart along the vertical direction, thereby facilitating multiple The pressure driving member applies pressure at one time to bond multiple bonding components 300 and reduces space occupation.
在一些实施例中,设置有施压驱动件的支撑杆315上还可以设有传压介质通道,至少一个施压驱动件可以通过阀门316与传压介质通道连通。前述阀门316可以设置在设置有施压驱动件的支撑杆315上。通过开启阀门316,籽晶粘接装置30可以通过传压介质通道对施压驱动件产生的气压或液压进行传送,以将气压或液压传至施压组件320,对籽晶托100进行施压。In some embodiments, the support rod 315 provided with the pressure driving member may also be provided with a pressure transmission medium channel, and at least one pressure driving member may be connected to the pressure transmission medium channel through the valve 316 . The aforementioned valve 316 may be provided on a support rod 315 provided with a pressure driver. By opening the valve 316, the seed crystal bonding device 30 can transmit the air pressure or hydraulic pressure generated by the pressure driving component through the pressure transmission medium channel, so as to transmit the air pressure or hydraulic pressure to the pressure application component 320 to apply pressure on the seed crystal holder 100. .
在一些实施例中,支撑盘313可旋转地设于支撑架314上,支撑盘313的旋转轴线可以平行于支撑杆314。籽晶粘接装置30还可以包括旋转驱动件370,前述旋转驱动件370与支撑盘313连接,以驱动支撑盘313旋转。例如,旋转驱动件可以包括电机,电机可以带动支撑盘313的旋转。又例如,旋转驱动件370可以包括位于支撑盘313底部的气动驱动件,气动驱动件可以为圆形转盘,气动驱动件的底部与气体压缩器相连,气体压缩器可以将压缩空气传递至气动驱动件中带动气动驱动件旋转,进而带动支撑盘313的旋转。In some embodiments, the support plate 313 is rotatably disposed on the support frame 314 , and the rotation axis of the support plate 313 can be parallel to the support rod 314 . The seed bonding device 30 may further include a rotational driving member 370 , which is connected to the support plate 313 to drive the support plate 313 to rotate. For example, the rotation driving member may include a motor, and the motor may drive the support plate 313 to rotate. For another example, the rotary driving member 370 may include a pneumatic driving member located at the bottom of the support plate 313. The pneumatic driving member may be a circular turntable. The bottom of the pneumatic driving member may be connected to a gas compressor. The gas compressor may transmit compressed air to the pneumatic driving member. The pneumatic driving member is driven to rotate, thereby driving the support plate 313 to rotate.
本说明书一些实施例,通过将支撑盘313旋转地设于支撑架314上,支撑盘313的旋转可以将籽晶130粘接处的气泡赶出,可以有效防止粘接不牢固导致籽晶130脱离。In some embodiments of this specification, by rotating the support plate 313 on the support frame 314, the rotation of the support plate 313 can drive out the air bubbles at the bonding point of the seed crystal 130, which can effectively prevent the seed crystal 130 from detaching due to weak bonding. .
在一些实施例中,旋转驱动件370可以包括磁性元件、动力源371和磁性驱动件。磁性元件可以固定在支撑盘313上。磁性驱动件可以用于驱动磁性元件旋转。在一些实施例中,磁性驱动件可以为圆形转盘。磁性驱动件可以固定在动力源371的输出端上,磁性驱动件与磁性元件磁耦合。动力源371可以将其他能源转换为动能,用于驱动磁性驱动件旋转。本说明书一些实施例,通过动力源371驱动磁性驱动件旋转,进而驱动磁性元件带动支撑盘313旋转,可以更方便地控制支撑盘313的旋转,减小支撑盘313旋转时的摩擦及振动。In some embodiments, rotational drive 370 may include a magnetic element, a power source 371 and a magnetic drive. The magnetic element can be fixed on the support plate 313. A magnetic driver can be used to drive the magnetic element in rotation. In some embodiments, the magnetic drive may be a circular turntable. The magnetic driving member can be fixed on the output end of the power source 371, and the magnetic driving member is magnetically coupled with the magnetic element. The power source 371 can convert other energy sources into kinetic energy for driving the magnetic driving member to rotate. In some embodiments of this specification, the power source 371 drives the magnetic driving component to rotate, and then drives the magnetic element to drive the support plate 313 to rotate. This can more conveniently control the rotation of the support plate 313 and reduce friction and vibration when the support plate 313 rotates.
在一些实施例中,施压部件320可以包括设于支撑架314上的限位压盘317。如图16所示,在一些实施例中,限位压盘317为底部有凸起的圆盘,凸起部分与籽晶托110相连(例如,螺纹或卡扣连接)。In some embodiments, the pressure component 320 may include a limiting pressure plate 317 provided on the support frame 314 . As shown in FIG. 16 , in some embodiments, the limiting pressure plate 317 is a disc with a protrusion at the bottom, and the protrusion is connected to the seed crystal holder 110 (for example, threaded or snap-fitted).
在一些实施例中,施压驱动件可以包括第一子驱动件381和第二子驱动件381。第一子驱动件381和第二子驱动件382可以设于不同的支撑杆314上,以调整限位压盘317不同位置与支撑盘313间的距离。第一子驱动件381与第二子驱动件382的结构可以相同,例如,可以均为可移动的支撑底座。第一子驱动件381和第二子驱动件382可以沿限位压盘317的周向间隔布置,且第一子驱动件381和第二子驱动件382均与限位压盘317连接。In some embodiments, the pressure driving member may include a first sub-driving member 381 and a second sub-driving member 381 . The first sub-driving member 381 and the second sub-driving member 382 can be disposed on different supporting rods 314 to adjust the distance between different positions of the limiting pressure plate 317 and the supporting plate 313 . The structures of the first sub-driving member 381 and the second sub-driving member 382 may be the same, for example, they may both be movable support bases. The first sub-driving member 381 and the second sub-driving member 382 may be arranged at intervals along the circumference of the limiting pressure plate 317 , and both the first sub-driving member 381 and the second sub-driving member 382 are connected to the limiting pressure plate 317 .
本说明书一些实施例,第一子驱动件381和第二子驱动件381可以从不同的位置向籽晶托100施加压力,有助于避免从单一位置施加压力导致籽晶托100受力不均。In some embodiments of this specification, the first sub-driving member 381 and the second sub-driving member 381 can apply pressure to the seed crystal holder 100 from different positions, which helps to avoid uneven stress on the seed crystal holder 100 caused by applying pressure from a single position. .
在一些实施例中,籽晶粘接装置30还可以包括压力传感器321,压力传感器321用于确定各个施 压部件320所施加的压力。如图16所示,在一些实施例中,压力传感器321可以套设在支撑杆315与支撑架314连接的部位,可以用于感应施压驱动件的驱动压力和/或阀门316处的压力。在另一些实施例中,压力传感器321还可以直接设在支撑盘313的上表面以直接感应籽晶托100所受的压力。通过压力传感器321,可以直接或间接感应籽晶托100处的压力,有助于对籽晶130粘接过程的更好把控,便于在压力过大或过小时及时做出调整,有效防止因压力过大导致籽晶130被压碎,或因压力过小导致籽晶130的粘接质量降低。In some embodiments, the seed bonding device 30 may also include a pressure sensor 321, which is used to determine whether each application The pressure exerted by the pressing member 320. As shown in FIG. 16 , in some embodiments, the pressure sensor 321 can be set at the connection point between the support rod 315 and the support frame 314 , and can be used to sense the driving pressure of the pressure driving member and/or the pressure at the valve 316 . In other embodiments, the pressure sensor 321 can also be directly provided on the upper surface of the support plate 313 to directly sense the pressure on the seed crystal holder 100 . Through the pressure sensor 321, the pressure at the seed crystal holder 100 can be sensed directly or indirectly, which helps to better control the bonding process of the seed crystal 130, facilitates timely adjustment when the pressure is too large or too small, and effectively prevents Too much pressure causes the seed crystal 130 to be crushed, or too little pressure causes the bonding quality of the seed crystal 130 to decrease.
在一些实施例中,籽晶粘接装置30还可以包括控制器,前述控制器与阀门316和压力传感器321均可以信号连接。在一些实施例中,控制器可以基于压力传感器321感应的压力数据,调节阀门316的开度。例如,控制器可以实时获取压力传感器321获取到的压力数据,当前述压力数据小于预设的参考压力最小值时,控制器可以加大阀门316的开度,以提高籽晶130的粘接效果;当前述压力数据大于预设的参考压力最大值时,控制器可以减小阀门316的开度,以防止籽晶130被压碎。本说明书一些实施例,通过判断压力传感器321感应的压力数据,进而自动地对阀门316的开度进行调节,有助于调控每个粘接组件300的压力,使每个粘接组件300受力均衡,可以有效防止压力过大导致籽晶130被压碎,或因压力过小影响籽晶130的粘接效果。In some embodiments, the seed bonding device 30 may further include a controller, and the controller may be connected to the valve 316 and the pressure sensor 321 via signals. In some embodiments, the controller may adjust the opening of valve 316 based on pressure data sensed by pressure sensor 321 . For example, the controller can obtain the pressure data obtained by the pressure sensor 321 in real time. When the pressure data is less than the preset minimum reference pressure, the controller can increase the opening of the valve 316 to improve the bonding effect of the seed crystal 130 ; When the aforementioned pressure data is greater than the preset maximum reference pressure, the controller can reduce the opening of the valve 316 to prevent the seed crystal 130 from being crushed. In some embodiments of this specification, by judging the pressure data sensed by the pressure sensor 321, and then automatically adjusting the opening of the valve 316, it helps to regulate the pressure of each bonding component 300, so that each bonding component 300 is stressed. Balance can effectively prevent the seed crystal 130 from being crushed due to excessive pressure, or affecting the bonding effect of the seed crystal 130 due to too small pressure.
本说明书还提供了一种坩埚400。坩埚400可以用于生成晶体生长所需的气相组分。坩埚400中的原料(如,熔液140)可以在温场的作用下挥发为气相组分并运动至上部粘接在籽晶托100上的籽晶130处,从而实现晶体生长。This specification also provides a crucible 400. Crucible 400 may be used to generate gas phase components required for crystal growth. The raw materials in the crucible 400 (eg, the melt 140) can volatilize into gas phase components under the action of the temperature field and move to the upper seed crystal 130 bonded to the seed crystal holder 100, thereby achieving crystal growth.
在一些实施例中,如图17所示,坩埚400可以包括坩埚本体450、驱动组件460和温场保持盘410。In some embodiments, as shown in FIG. 17 , crucible 400 may include a crucible body 450 , a drive assembly 460 , and a temperature field holding disk 410 .
坩埚本体450用于承载用于晶体生长的熔液140。坩埚本体450可以呈圆筒状,坩埚本体450中可以设置有熔液140,通过加热坩埚本体450以加热熔液140,籽晶托100中的籽晶130与熔液140相接触,进而实现晶体生长。The crucible body 450 is used to carry the melt 140 for crystal growth. The crucible body 450 may be in a cylindrical shape, and the melt 140 may be disposed in the crucible body 450. By heating the crucible body 450, the melt 140 is heated, and the seed crystal 130 in the seed crystal holder 100 is in contact with the melt 140, thereby realizing crystallization. grow.
温场保持盘410可以用于保持热场。Thermal field holding disk 410 may be used to maintain the thermal field.
驱动组件460可以驱动坩埚本体450绕坩埚本体450的轴线E相对温场保持盘410旋转。驱动组件460可以包括驱动源和连接机构420,连接机构420可以连接在驱动源与坩埚本体450的底部之间,驱动源可以位于连接机构420底部,为驱动组件460提供驱动力。前述驱动源可以包括各种驱动设备与传动设备的组合,驱动设备可以包括电机、液压缸、气压缸等。The driving assembly 460 can drive the crucible body 450 to rotate around the axis E of the crucible body 450 relative to the temperature field holding disk 410 . The driving assembly 460 may include a driving source and a connecting mechanism 420. The connecting mechanism 420 may be connected between the driving source and the bottom of the crucible body 450. The driving source may be located at the bottom of the connecting mechanism 420 to provide driving force for the driving assembly 460. The aforementioned driving source may include a combination of various driving devices and transmission devices, and the driving device may include a motor, a hydraulic cylinder, a pneumatic cylinder, etc.
温场保持盘410可以设于连接结构420上,且位于驱动源与坩埚本体450的底部之间。在一些实施例中,温场保持盘410可以为圆盘状或其他形状。在一些实施例中,温场保持盘410的材质为莫来石、刚玉以及氧化铝中的至少一种,通过以上材料设置可以使得温场保持盘410适应高温环境,有助于提高温场保持盘410的稳定性。The temperature field holding disk 410 may be disposed on the connection structure 420 and located between the driving source and the bottom of the crucible body 450 . In some embodiments, the temperature field holding disk 410 may be disk-shaped or otherwise shaped. In some embodiments, the material of the temperature field holding disk 410 is at least one of mullite, corundum, and alumina. The above material settings can make the temperature field holding disk 410 adaptable to high temperature environments, helping to improve the temperature field maintenance. Disk 410 stability.
温场保持盘410可以使热场在坩埚400旋转时保持静止,以避免其偏移倾斜导致与线圈接触而打火,无法继续长晶。此外,当坩埚400沿坩埚本体450的轴线E上下运动时,温场保持盘410还可以与坩埚400保持相对静止,以维持坩埚400的温度稳定,保障晶体生成的质量。The thermal field holding disk 410 can keep the thermal field stationary when the crucible 400 rotates, so as to prevent its deflection and tilt from causing contact with the coil and ignition, making it impossible to continue to grow crystals. In addition, when the crucible 400 moves up and down along the axis E of the crucible body 450, the temperature field holding disk 410 can also remain relatively stationary with the crucible 400 to maintain the temperature stability of the crucible 400 and ensure the quality of crystal formation.
本说明书一些实施例通过设置驱动组件460可以驱动坩埚本体450绕坩埚本体450的轴线E旋转,从而可以使得坩埚400与籽晶130对转,还可以使得坩埚400与籽晶130交替旋转等,对晶体上形成的台阶进行不同方向的冲刷从而减小台阶的宽度以及大小,使晶体更加平整并减少夹杂的助熔剂。Some embodiments of this specification can drive the crucible body 450 to rotate around the axis E of the crucible body 450 by arranging the driving assembly 460, so that the crucible 400 and the seed crystal 130 can rotate in opposite directions, and the crucible 400 and the seed crystal 130 can also rotate alternately, etc. The steps formed on the crystal are washed in different directions to reduce the width and size of the steps, making the crystal flatter and reducing the inclusion of flux.
坩埚本体450的旋转可以使晶体更加平整并减少夹杂的助熔剂,极大提高熔体整体的传质,进而有效提升晶体厚度。The rotation of the crucible body 450 can make the crystal flatter and reduce the inclusion of flux, greatly improving the overall mass transfer of the melt, thereby effectively increasing the thickness of the crystal.
如图18所示,连接机构420可以包括旋转柱421和第一承托盘422,第一承托盘422设于旋转柱421的一端,驱动源连接在旋转柱421的另一端。如图18所示,第一承托盘422可以为圆筒状,用于承托坩埚本体450,旋转柱421可以为圆柱状,用于带动第一承托盘422旋转。旋转柱421可以通过联轴器、轴承等连接件与驱动源连接。第一承托盘422的材质可以为石墨,旋转柱421的材质可以为莫来石、刚玉、氧化铝等耐高温材料。本说明书一些实施例通过驱动源驱动旋转柱421旋转,可以进一步带动第一承托盘422中的坩埚本体450旋转。As shown in FIG. 18 , the connection mechanism 420 may include a rotating column 421 and a first supporting tray 422 . The first supporting tray 422 is provided at one end of the rotating column 421 , and the driving source is connected to the other end of the rotating column 421 . As shown in FIG. 18 , the first supporting tray 422 may be cylindrical for supporting the crucible body 450 , and the rotating column 421 may be cylindrical for driving the first supporting tray 422 to rotate. The rotating column 421 can be connected to the driving source through couplings, bearings and other connecting parts. The material of the first supporting tray 422 can be graphite, and the material of the rotating column 421 can be high-temperature resistant materials such as mullite, corundum, and alumina. In some embodiments of this specification, the driving source drives the rotating column 421 to rotate, which can further drive the crucible body 450 in the first supporting tray 422 to rotate.
如图18所示,第一承托盘422上可以包括同心布置的多个阶梯状凹槽。前述多个阶梯状凹槽均与旋转柱421同心,且尺寸与多个不同坩埚本体450的尺寸适配。本说明书一些实施例通过同心布置的多个阶梯状凹槽,可以对多种不同尺寸的坩埚本体450进行定位,并结合实际情况替换不同尺寸形状的坩埚本体450,防止坩埚本体450与第一承托盘422同心偏移。在一些实施例中,第一承托盘422上的多个阶梯状凹槽处还可以包括有限位结构(例如,橡胶圈),防止坩埚本体450在旋转时滑动。As shown in FIG. 18 , the first supporting tray 422 may include a plurality of concentrically arranged stepped grooves. The aforementioned plurality of stepped grooves are all concentric with the rotating column 421, and their sizes are adapted to the sizes of a plurality of different crucible bodies 450. In some embodiments of this specification, multiple stepped grooves arranged concentrically can be used to position crucible bodies 450 of various sizes, and crucible bodies 450 of different sizes and shapes can be replaced according to actual conditions to prevent the crucible body 450 from being separated from the first bearing. The tray 422 is offset concentrically. In some embodiments, the plurality of stepped grooves on the first supporting tray 422 may also include a limiting structure (for example, a rubber ring) to prevent the crucible body 450 from sliding during rotation.
在一些实施例中,连接机构420还包括第二承托盘423。第二承托盘423可以用于承托温场保持盘410。第二承托盘423的材质可以为莫来石、刚玉以及氧化铝等耐高温材料中的至少一种。 In some embodiments, the connection mechanism 420 further includes a second supporting tray 423 . The second supporting tray 423 may be used to support the temperature field holding tray 410 . The material of the second tray 423 may be at least one of high temperature resistant materials such as mullite, corundum, and alumina.
如图19所示,在一些实施例中,第二承托盘423可以呈环形,第二承托盘423的内环与旋转柱421的外壁固定。第二承托盘423可以位于第一承托盘422和驱动源之间。在一些实施例中,第二承托盘423可以位于温场保持盘410底部,且与温场保持盘410之间通过滚珠结构424连接。第二承托盘423可以包括多个滚珠结构424,前述多个滚珠结构424可以通过一种或多种定位装置固定在第二承托盘423上,多个滚珠结构424绕第二承托盘423轴向均匀分布。如图19所示,滚珠结构424可以以第二承托盘423的圆心为圆心,布置为半径不同的两组圆环排布。值得说明的是,热场的材质易粉化,硬度和稳定性较低,不能保证旋转时的绝对平衡,故温场保持盘410在旋转时可能会偏移倾斜,导致其与线圈接触而打火,从而无法继续长晶。同时,也会破坏坩埚本体450内的稳定性导致不可控因素的增加,本说明书一些实施例通过滚珠结构424连接第二承托盘423与温场保持盘410,可以在旋转柱421转动时保持温场保持盘410的静止,有助于防止温场保持盘410旋转的不可控因素增加。As shown in FIG. 19 , in some embodiments, the second supporting tray 423 may be annular, and the inner ring of the second supporting tray 423 is fixed to the outer wall of the rotating column 421 . The second tray 423 may be located between the first tray 422 and the driving source. In some embodiments, the second supporting tray 423 can be located at the bottom of the temperature field holding plate 410 and is connected to the temperature field holding plate 410 through a ball structure 424. The second supporting tray 423 may include a plurality of ball structures 424. The plurality of ball structures 424 may be fixed on the second supporting tray 423 through one or more positioning devices. The plurality of ball structures 424 may be axially centered around the second supporting tray 423. Evenly distributed. As shown in FIG. 19 , the ball structure 424 can be arranged as two groups of rings with different radii, taking the center of the second supporting tray 423 as the center of the circle. It is worth mentioning that the material of the thermal field is easily pulverized, has low hardness and stability, and cannot guarantee absolute balance during rotation. Therefore, the thermal field holding disk 410 may be deflected and tilted during rotation, causing it to contact the coil and break. Fire, thus unable to continue to grow crystals. At the same time, it will also destroy the stability within the crucible body 450 and lead to an increase in uncontrollable factors. Some embodiments of this specification connect the second supporting tray 423 and the temperature field holding tray 410 through a ball structure 424, which can maintain the temperature when the rotating column 421 rotates. Keeping the field holding disk 410 stationary helps prevent the increase in uncontrollable factors causing the rotation of the temperature field holding disk 410 .
在一些实施例中,坩埚400还可以包括多根伸缩支撑杆430。伸缩支撑杆430可以用于支撑温场保持盘410,伸缩支撑杆430的一端连接在温场保持盘410的底部。如图20A所示,伸缩支撑杆430可以包括滑动杆431和固定杆432,滑动杆431可以沿伸缩支撑杆430轴向上下移动,滑动杆431与固定杆431间可以通过收紧螺纹或其他锁紧机构固定。滑动杆431远离固定杆432的一端可以与温场保持盘410的第四通孔411连接。如图20B所示,温场保持盘410中可以有三个绕温场保持盘410轴向均匀分布的第四通孔411,第四通孔411的尺寸与滑动杆431适配,滑动杆可以通过螺纹连接或其他连接方式通过第四通孔411,并固定在温场保持盘410中。本说明书一些实施例通过多根伸缩支撑杆430,可以防止温场保持盘410在坩埚400旋转的过程中发生倾斜,进而保证晶体正常生长。In some embodiments, the crucible 400 may also include a plurality of telescopic support rods 430. The telescopic support rod 430 can be used to support the temperature field holding plate 410 , and one end of the telescopic supporting rod 430 is connected to the bottom of the temperature field holding plate 410 . As shown in Figure 20A, the telescopic support rod 430 may include a sliding rod 431 and a fixed rod 432. The sliding rod 431 can move up and down along the axis of the telescopic support rod 430. The sliding rod 431 and the fixed rod 431 may be tightened by threads or other locks. Tightening mechanism. One end of the sliding rod 431 away from the fixed rod 432 can be connected to the fourth through hole 411 of the temperature field holding plate 410 . As shown in Figure 20B, the temperature field holding plate 410 may have three fourth through holes 411 evenly distributed around the axial direction of the temperature field holding plate 410. The size of the fourth through holes 411 is adapted to the sliding rod 431, and the sliding rod can pass through The threaded connection or other connection methods pass through the fourth through hole 411 and are fixed in the temperature field holding plate 410 . Some embodiments of this specification use multiple telescopic support rods 430 to prevent the temperature field holding disk 410 from tilting during the rotation of the crucible 400, thereby ensuring normal crystal growth.
在一些实施例中,坩埚400还可以包括连接环440和锁紧机构。前述锁紧孔441与锁紧机构配合可以将连接环440与驱动源的输出轴以及旋转柱421固定。如图21所示,连接环440可以为内部中空的圆柱,其侧壁上设有沿连接环440轴向对称的多个锁紧孔441,连接环440可以套设在驱动源的输出轴以及旋转柱421的另一端(即靠近驱动源的一端)外。锁紧机构可以为螺钉,锁紧孔441的尺寸与锁紧机构适配,通过锁紧机构与锁紧孔441的配合可以将连接环440与驱动源的输出轴以及旋转柱421固定。本说明书一些实施例通过连接环440和锁紧机构可以将驱动源的输出轴以及旋转柱421与连接环440相固定,驱动源可以稳定地驱动旋转柱421旋转,有助于防止旋转柱421旋转时脱离驱动源。In some embodiments, the crucible 400 may also include a connecting ring 440 and a locking mechanism. The aforementioned locking hole 441 cooperates with the locking mechanism to fix the connecting ring 440 to the output shaft of the driving source and the rotating column 421. As shown in Figure 21, the connecting ring 440 can be a hollow cylinder with a side wall provided with a plurality of locking holes 441 axially symmetrical along the connecting ring 440. The connecting ring 440 can be sleeved on the output shaft of the driving source and Outside the other end of the rotating column 421 (that is, the end close to the driving source). The locking mechanism can be a screw, and the size of the locking hole 441 is adapted to the locking mechanism. Through the cooperation of the locking mechanism and the locking hole 441, the connecting ring 440 can be fixed to the output shaft of the driving source and the rotating column 421. In some embodiments of this specification, the output shaft of the driving source and the rotating column 421 can be fixed to the connecting ring 440 through the connecting ring 440 and the locking mechanism. The driving source can stably drive the rotating column 421 to rotate, which helps to prevent the rotating column 421 from rotating. when disconnected from the driving source.
在一些实施例中,籽晶托110可以通过如图22所示流程2200所述的晶体生长方法进行晶体生长。In some embodiments, the seed crystal holder 110 can undergo crystal growth through the crystal growth method described in the process 2200 shown in FIG. 22 .
图22是根据本说明书一些实施例所示的晶体生长方法的示例性流程图。在一些实施例中,该方法可以通过使用籽晶托(如图10所示的籽晶托)来完成。如图22所示,流程2200包括下述步骤。Figure 22 is an exemplary flow chart of a crystal growth method according to some embodiments of the present specification. In some embodiments, this method may be accomplished using a seed holder (such as the one shown in Figure 10). As shown in Figure 22, process 2200 includes the following steps.
步骤2210,将籽晶粘接在籽晶托本体的籽晶粘接面上。Step 2210: Bond the seed crystal to the seed crystal bonding surface of the seed crystal holder body.
籽晶可以被粘接在籽晶粘接面上。在一些实施例中,籽晶可以通过石墨纸进行固定。关于籽晶粘接面以及石墨纸的更多说明可以参见前文相关部分,如图1、图10等。The seed crystal can be bonded to the seed crystal bonding surface. In some embodiments, the seed crystal can be fixed by graphite paper. For more information on the seed crystal bonding surface and graphite paper, please refer to the relevant parts of the previous article, such as Figure 1, Figure 10, etc.
在一些实施例中,将籽晶粘接在籽晶托本体的籽晶粘接面上,包括:使籽晶的直径略大于籽晶托本体的直径,且籽晶略突出于保护托的远离连接杆的一侧表面。In some embodiments, bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body includes: making the diameter of the seed crystal slightly larger than the diameter of the seed crystal holder body, and making the seed crystal slightly protrude away from the protective support. One side of the connecting rod.
在一些优选实施例中,将籽晶粘接在籽晶托本体的籽晶粘接面上时,籽晶的直径大于籽晶托本体的直径5mm-10mm,且籽晶突出于保护托的远离连接杆的一侧表面0.1mm-0.2mm;此外,保护托还可以对籽晶进行包裹,实现轴向和径向的温度梯度控制;保护托对籽晶还存在保护作用。例如,籽晶沉入保护托后,提拉时籽晶不受力,避免了籽晶脱落。In some preferred embodiments, when the seed crystal is bonded to the seed crystal bonding surface of the seed crystal holder body, the diameter of the seed crystal is 5 mm-10 mm larger than the diameter of the seed crystal holder body, and the seed crystal protrudes away from the protective support. The surface of one side of the connecting rod is 0.1mm-0.2mm; in addition, the protective bracket can also wrap the seed crystal to achieve axial and radial temperature gradient control; the protective bracket also has a protective effect on the seed crystal. For example, after the seed crystal sinks into the protective bracket, the seed crystal is not stressed when it is pulled, thus preventing the seed crystal from falling off.
本说明书的一些实施例中,在粘接籽晶时,使籽晶的直径略大于籽晶托本体的直径,且籽晶略突出于保护托的远离连接杆的一侧表面,可以保证籽晶与熔体的充分接触。In some embodiments of this specification, when bonding the seed crystal, the diameter of the seed crystal is slightly larger than the diameter of the seed crystal support body, and the seed crystal slightly protrudes from the side surface of the protective support away from the connecting rod, which can ensure that the seed crystal Full contact with the melt.
在一些实施例中,当籽晶托具有图10中所示的保护托180、第二保护套182等部件时,将籽晶粘接在籽晶托本体的籽晶粘接面上的步骤可以进一步包括将籽晶与第二保护套182远离连接杆120的一端贴合,并粘接在籽晶托本体110的籽晶粘接面111上。这样可以保证在晶体生长的过程中,第二保护套182可以有效地防止熔体的挥发物进入籽晶与保护托180之间以及籽晶托本体110与保护托之间。In some embodiments, when the seed crystal holder has components such as the protective bracket 180 and the second protective cover 182 shown in Figure 10, the step of bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body can be The method further includes attaching the seed crystal to an end of the second protective sleeve 182 away from the connecting rod 120 and bonding it to the seed crystal bonding surface 111 of the seed crystal holder body 110 . This ensures that during the crystal growth process, the second protective cover 182 can effectively prevent volatiles from the melt from entering between the seed crystal and the protective support 180 and between the seed crystal support body 110 and the protective support.
步骤2220,将粘有籽晶的籽晶托沉入坩埚中的用于晶体生长的熔体中,且籽晶的远离籽晶托本体的一侧表面位于熔体温度最高的位置处。Step 2220: sink the seed crystal holder with the seed crystal attached to it into the melt used for crystal growth in the crucible, and the surface of the side of the seed crystal away from the seed crystal holder body is located at the position with the highest temperature of the melt.
图23是根据本说明书一些实施例所示的生成晶体的示意图。如图23所示,籽晶托可以沉入坩埚400中的用于晶体生长的熔体2320中。其中,熔体2320是指用于生成晶体的原料的熔融态。Figure 23 is a schematic diagram of a generated crystal according to some embodiments of the present specification. As shown in Figure 23, the seed crystal holder may be sunk into the melt 2320 for crystal growth in the crucible 400. Among them, melt 2320 refers to the molten state of the raw materials used to generate crystals.
在一些实施例中,籽晶的远离籽晶托的一侧表面基本位于熔体温度最高的位置处。其可以理解为籽晶的远离籽晶托的一侧表面与熔体温度最高的高温线之间的距离很小,如小于熔体整体深度的1%等。如图23,籽晶的远离籽晶托的一侧表面位于熔体的高温线2310处。高温线2310可以表示熔体的最高温度处。 In some embodiments, a surface of a side of the seed crystal away from the seed crystal holder is substantially located at a position with the highest melt temperature. It can be understood that the distance between the surface of the side of the seed crystal away from the seed crystal support and the high temperature line with the highest melt temperature is very small, such as less than 1% of the overall depth of the melt. As shown in Figure 23, the surface of the side of the seed crystal away from the seed crystal support is located at the high temperature line 2310 of the melt. High temperature line 2310 may represent the highest temperature of the melt.
在一些实施例中,籽晶托的一部分位于熔体中,籽晶托的另一部分位于熔体外。参照图23,籽晶托的一部分位于熔体中,籽晶托的另一部分位于熔体外。可以理解的是,籽晶托的一部分裸露在熔体外可以保证籽晶托轴向和径向的温度梯度控制,保证晶体更好生长。在一些实施例中,籽晶托尽量不与熔体接触,从而避免挥发物附着到籽晶托上,以免晶体生长后难以实现晶托分离。但是籽晶托尽量不与熔体接触其实不利于晶体的生长。而由于保护托180的设置,尤其是进一步设置了第一保护套181和第二保护套182后,挥发物不会附着到籽晶托本体上。在解决了这一问题后,籽晶托可以一部分位于熔体中,另一部分位于熔体外,籽晶可以放置到熔体的高温线附近,这样可以保证晶体更好地生长。In some embodiments, a portion of the seed holder is located in the melt and another portion of the seed holder is located outside the melt. Referring to Figure 23, a part of the seed crystal holder is located in the melt, and the other part of the seed crystal holder is located outside the melt. It can be understood that exposing part of the seed crystal holder outside the melt can ensure the axial and radial temperature gradient control of the seed crystal holder and ensure better crystal growth. In some embodiments, the seed crystal holder is kept out of contact with the melt as much as possible to avoid volatile matter from adhering to the seed crystal holder, which would make it difficult to separate the crystal holder after crystal growth. However, the seed crystal support should try not to come into contact with the melt, which is actually not conducive to the growth of the crystal. Due to the arrangement of the protective holder 180, especially after the first protective cover 181 and the second protective cover 182 are further provided, volatile matter will not adhere to the seed crystal holder body. After solving this problem, part of the seed crystal holder can be located in the melt and the other part is located outside the melt. The seed crystal can be placed near the high temperature line of the melt, which can ensure better crystal growth.
在一些实施例中,在将粘有籽晶的籽晶托沉入用于晶体生长的熔体中之前,还包括:将熔体升温至预设温度区间。在一些优选实施例中,熔体升温的预设温度区间可以是1720℃~1780℃。可以理解的是,将熔体升温至1720℃~1780℃的温度区间,可以保证熔体的充分熔融,便于后续晶体生长。In some embodiments, before sinking the seed crystal holder with the seed crystal attached into the melt for crystal growth, the method further includes: heating the melt to a preset temperature range. In some preferred embodiments, the preset temperature range for melt heating may be 1720°C to 1780°C. It can be understood that heating the melt to a temperature range of 1720°C to 1780°C can ensure full melting of the melt and facilitate subsequent crystal growth.
步骤2230,使用上提拉法生长晶体。Step 2230, use the upward pull method to grow crystals.
在一些实施例中,晶体可以通过上提拉法生长。In some embodiments, crystals can be grown by a pull-up method.
在一些实施例中,籽晶托能够绕着连接杆的轴线旋转,坩埚能够绕着坩埚的轴线旋转;连接杆的轴线与坩埚的轴线平行。In some embodiments, the seed holder can rotate around the axis of the connecting rod, and the crucible can rotate around the axis of the crucible; the axis of the connecting rod is parallel to the axis of the crucible.
如图23所示,籽晶托能够绕着连接杆的轴线A旋转,坩埚能够绕着坩埚的轴线旋转。其中,坩埚的轴线与连接杆的轴线平行。As shown in Figure 23, the seed crystal holder can rotate around the axis A of the connecting rod, and the crucible can rotate around the axis of the crucible. Among them, the axis of the crucible is parallel to the axis of the connecting rod.
在一些实施例中,使用上提拉法生长晶体还包括:控制籽晶托和坩埚沿着相反的方向旋转。在本说明书一些实施例中,通过相反的方向旋转籽晶托和坩埚,可以更好地进行提拉,提高晶体生长效率。In some embodiments, growing crystals using the upward pulling method further includes: controlling the seed holder and the crucible to rotate in opposite directions. In some embodiments of this specification, by rotating the seed crystal holder and the crucible in opposite directions, the pulling can be performed better and the crystal growth efficiency can be improved.
在一些实施例中,籽晶托的旋转速度是0rpm~20rpm;坩埚的旋转速度是0rpm~20rpm。In some embodiments, the rotation speed of the seed crystal holder is 0 rpm-20 rpm; the rotation speed of the crucible is 0 rpm-20 rpm.
在一些实施例中,籽晶托的旋转速度的数值与坩埚的旋转速度的数值的乘积为预设值。In some embodiments, the product of the value of the rotation speed of the seed holder and the value of the rotation speed of the crucible is a preset value.
在一些优选实施例中,籽晶托的旋转速度的数值与坩埚的旋转速度的数值的乘积为20或150。In some preferred embodiments, the product of the value of the rotation speed of the seed holder and the value of the rotation speed of the crucible is 20 or 150.
在本说明书的一些实施例中,控制籽晶托的旋转速度的数值与坩埚的旋转速度的数值的乘积为20或150,可以保证晶体稳定、快速、高质量地生长。In some embodiments of this specification, the product of the value of the rotation speed of the seed crystal holder and the value of the rotation speed of the crucible is controlled to be 20 or 150, which can ensure stable, fast, and high-quality growth of the crystal.
在一些实施例中,使用上提拉法生长晶体包括:保持粘有籽晶的籽晶托沉入熔体10min~30min,以及按照0.01mm/h~0.2mm/h的提拉速度提拉籽晶托而进行晶体生长。In some embodiments, using the upward pulling method to grow crystals includes: keeping the seed crystal holder with the seed crystal attached to sink into the melt for 10 to 30 minutes, and pulling the seeds at a pulling speed of 0.01 mm/h to 0.2 mm/h. Crystal support for crystal growth.
在一些优选实施例中,提拉速度可以为0.05mm/h。In some preferred embodiments, the pulling speed may be 0.05mm/h.
在本说明书的一些实施例中,通过上述实施例,可以保证晶体在熔体稳定的情况下生长。In some embodiments of this specification, through the above embodiments, it is possible to ensure that the crystal grows under the condition that the melt is stable.
在一些实施例中,在晶体生长10h~30h后,按30mm/h-40mm/h的提拉速度将晶体提拉离开熔体,且晶体与熔体表面具有15mm~25mm的间隔高度。In some embodiments, after the crystal grows for 10 to 30 hours, the crystal is pulled away from the melt at a pulling speed of 30 mm/h to 40 mm/h, and the crystal and the melt surface have a separation height of 15 mm to 25 mm.
值得说明的是,在晶体生长一段时间后,由于坩埚壁腐蚀、熔体蒸发等情况,导致熔体液面高度逐渐降低,使得籽晶离开熔体的相对速度逐渐加快,导致晶体生长缓慢甚至不生长。基于前述实施例中所述的生长时间、提拉高度以及间隔高度可以较好地克服上述问题,使得晶体更好地生长。It is worth mentioning that after the crystal grows for a period of time, due to corrosion of the crucible wall, evaporation of the melt, etc., the height of the melt level gradually decreases, causing the relative speed of the seed crystal to leave the melt to gradually increase, resulting in slow or even no growth of the crystal. grow. Based on the growth time, pull height and spacing height described in the previous embodiments, the above problems can be better overcome, allowing the crystal to grow better.
在一些实施例中,晶体生长方法还包括:在晶体生长完成后,沿平行于籽晶粘接面的切割平面切割籽晶托,以将籽晶托与晶体分离。其中,切割平面覆盖籽晶托本体、保护托和第二保护套。由于保护托和第二保护套的设置,籽晶与籽晶托本体之间没有挥发物的附着,可以实现方便地切割而将籽晶托与晶体分离。In some embodiments, the crystal growth method further includes: after the crystal growth is completed, cutting the seed crystal holder along a cutting plane parallel to the seed crystal bonding surface to separate the seed crystal holder from the crystal. Wherein, the cutting plane covers the seed crystal support body, the protective support and the second protective cover. Due to the arrangement of the protective bracket and the second protective cover, there is no volatile matter attached between the seed crystal and the seed crystal bracket body, and the seed crystal bracket can be easily cut to separate the seed crystal bracket from the crystal.
在本说明书的一些实施例中,上述实施例所述的晶体生长方法,由于阻碍了挥发物质导致的粘连,籽晶与籽晶托本体之间无其它物质附着,且籽晶直径大于籽晶托本体,可以轻松对晶体进行分离;此外,保护托还可以在调节轴向和径向的温度梯度的保证籽晶稳定、高效地生长。因此,本说明书实施例中所述的晶体生长方法可以高效、快速地获得晶体,且获得的晶体易于分离。In some embodiments of this specification, the crystal growth method described in the above embodiments prevents adhesion caused by volatile substances, there is no other substance attached between the seed crystal and the seed crystal holder body, and the diameter of the seed crystal is larger than the seed crystal holder. The main body can easily separate crystals; in addition, the protective bracket can also adjust the axial and radial temperature gradients to ensure stable and efficient growth of seed crystals. Therefore, the crystal growth method described in the embodiments of this specification can obtain crystals efficiently and quickly, and the obtained crystals are easy to separate.
应当注意的是,上述有关流程2200的描述仅仅是为了示例和说明,而不限定本说明书的适用范围。对于本领域技术人员来说,在本说明书的指导下可以对流程2200进行各种修正和改变。然而,这些修正和改变仍在本说明书的范围之内。It should be noted that the above description of process 2200 is only for example and illustration, and does not limit the scope of application of this specification. For those skilled in the art, various modifications and changes can be made to process 2200 under the guidance of this description. However, such modifications and changes remain within the scope of this specification.
上文已对基本概念做了描述,显然,对于本领域技术人员来说,上述详细披露仅仅作为示例,而并不构成对本说明书的限定。虽然此处并没有明确说明,本领域技术人员可能会对本说明书进行各种修改、改进和修正。该类修改、改进和修正在本说明书中被建议,所以该类修改、改进、修正仍属于本说明书示范实施例的精神和范围。The basic concepts have been described above. It is obvious to those skilled in the art that the above detailed disclosure is only an example and does not constitute a limitation of this specification. Although not explicitly stated herein, various modifications, improvements, and corrections may be made to this specification by those skilled in the art. Such modifications, improvements, and corrections are suggested in this specification, and therefore such modifications, improvements, and corrections remain within the spirit and scope of the exemplary embodiments of this specification.
同时,本说明书使用了特定词语来描述本说明书的实施例。如“一个实施例”、“一实施例”、和/或“一些实施例”意指与本说明书至少一个实施例相关的某一特征、结构或特点。因此,应强调并注意的是,本说明书中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一个替代性实施例”并不一定是指同一实施例。此外,本说明书的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。 At the same time, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment,""anembodiment," and/or "some embodiments" means a certain feature, structure, or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that “one embodiment” or “an embodiment” or “an alternative embodiment” mentioned twice or more at different places in this specification does not necessarily refer to the same embodiment. . In addition, certain features, structures or characteristics in one or more embodiments of this specification may be appropriately combined.
此外,除非权利要求中明确说明,本说明书所述处理元素和序列的顺序、数字字母的使用、或其他名称的使用,并非用于限定本说明书流程和方法的顺序。尽管上述披露中通过各种示例讨论了一些目前认为有用的发明实施例,但应当理解的是,该类细节仅起到说明的目的,附加的权利要求并不仅限于披露的实施例,相反,权利要求旨在覆盖所有符合本说明书实施例实质和范围的修正和等价组合。例如,虽然以上所描述的系统组件可以通过硬件设备实现,但是也可以只通过软件的解决方案得以实现,如在现有的服务器或移动设备上安装所描述的系统。In addition, unless explicitly stated in the claims, the order of the processing elements and sequences, the use of numbers and letters, or the use of other names in this specification are not intended to limit the order of the processes and methods in this specification. Although the foregoing disclosure discusses by various examples some embodiments of the invention that are presently considered useful, it is to be understood that such details are for purposes of illustration only and that the appended claims are not limited to the disclosed embodiments. To the contrary, rights The claims are intended to cover all modifications and equivalent combinations consistent with the spirit and scope of the embodiments of this specification. For example, although the system components described above can be implemented through hardware devices, they can also be implemented through software-only solutions, such as installing the described system on an existing server or mobile device.
同理,应当注意的是,为了简化本说明书披露的表述,从而帮助对一个或多个发明实施例的理解,前文对本说明书实施例的描述中,有时会将多种特征归并至一个实施例、附图或对其的描述中。但是,这种披露方法并不意味着本说明书对象所需要的特征比权利要求中提及的特征多。实际上,实施例的特征要少于上述披露的单个实施例的全部特征。Similarly, it should be noted that, in order to simplify the expression disclosed in this specification and thereby help understand one or more embodiments of the invention, in the previous description of the embodiments of this specification, multiple features are sometimes combined into one embodiment. accompanying drawings or descriptions thereof. However, this method of disclosure does not imply that the subject matter of the description requires more features than are mentioned in the claims. In fact, embodiments may have less than all features of a single disclosed embodiment.
一些实施例中使用了描述成分、属性数量的数字,应当理解的是,此类用于实施例描述的数字,在一些示例中使用了修饰词“大约”、“近似”或“大体上”来修饰。除非另外说明,“大约”、“近似”或“大体上”表明所述数字允许有±20%的变化。相应地,在一些实施例中,说明书和权利要求中使用的数值参数均为近似值,该近似值根据个别实施例所需特点可以发生改变。在一些实施例中,数值参数应考虑规定的有效数位并采用一般位数保留的方法。尽管本说明书一些实施例中用于确认其范围广度的数值域和参数为近似值,在具体实施例中,此类数值的设定在可行范围内尽可能精确。In some embodiments, numbers are used to describe the quantities of components and properties. It should be understood that such numbers used to describe the embodiments are modified by the modifiers "approximately", "approximately" or "substantially" in some examples. Grooming. Unless otherwise stated, "about," "approximately," or "substantially" means that the stated number is allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending on the desired features of the individual embodiment. In some embodiments, numerical parameters should account for the specified number of significant digits and use general digit preservation methods. Although the numerical ranges and parameters used to identify the breadth of ranges in some embodiments of this specification are approximations, in specific embodiments, such numerical values are set as accurately as is feasible.
针对本说明书引用的每个专利、专利申请、专利申请公开物和其他材料,如文章、书籍、说明书、出版物、文档等,特此将其全部内容并入本说明书作为参考。与本说明书内容不一致或产生冲突的申请历史文件除外,对本说明书权利要求最广范围有限制的文件(当前或之后附加于本说明书中的)也除外。需要说明的是,如果本说明书附属材料中的描述、定义、和/或术语的使用与本说明书所述内容有不一致或冲突的地方,以本说明书的描述、定义和/或术语的使用为准。Each patent, patent application, patent application publication and other material, such as articles, books, instructions, publications, documents, etc. cited in this specification is hereby incorporated by reference into this specification in its entirety. Application history documents that are inconsistent with or conflict with the content of this specification are excluded, as are documents (currently or later appended to this specification) that limit the broadest scope of the claims in this specification. It should be noted that if there is any inconsistency or conflict between the descriptions, definitions, and/or the use of terms in the accompanying materials of this manual and the content described in this manual, the descriptions, definitions, and/or the use of terms in this manual shall prevail. .
最后,应当理解的是,本说明书中所述实施例仅用以说明本说明书实施例的原则。其他的变形也可能属于本说明书的范围。因此,作为示例而非限制,本说明书实施例的替代配置可视为与本说明书的教导一致。相应地,本说明书的实施例不仅限于本说明书明确介绍和描述的实施例。 Finally, it should be understood that the embodiments described in this specification are only used to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Accordingly, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to those expressly introduced and described in this specification.

Claims (72)

  1. 一种籽晶托,其特征在于,其包括籽晶托本体和连接杆,所述籽晶托本体固定在所述连接杆的一端,所述籽晶托本体上远离所述连接杆的一侧设有籽晶粘接面。A seed crystal holder, characterized in that it includes a seed crystal holder body and a connecting rod, the seed crystal holder body is fixed on one end of the connecting rod, and the side of the seed crystal holder body away from the connecting rod Equipped with seed crystal bonding surface.
  2. 如权利要求1所述的籽晶托,其特征在于,所述籽晶托本体包括中空的第一内腔,所述连接杆内设有供冷却介质流通的通道;所述通道与所述第一内腔相连通。The seed crystal holder according to claim 1, characterized in that the seed crystal holder body includes a hollow first inner cavity, and a channel for cooling medium to circulate is provided in the connecting rod; the channel is connected to the first hollow cavity. An inner cavity is connected.
  3. 如权利要求2所述的籽晶托,其特征在于,所述籽晶托本体上设有与所述第一内腔连通的第一通孔。The seed crystal holder according to claim 2, wherein the seed crystal holder body is provided with a first through hole communicating with the first inner cavity.
  4. 如权利要求2所述的籽晶托,其特征在于,所述内腔中设有冷却介质扩散结构。The seed crystal holder of claim 2, wherein a cooling medium diffusion structure is provided in the inner cavity.
  5. 如权利要求4所述的籽晶托,其特征在于,所述冷却介质扩散结构包括壳体,所述壳体内形成第二内腔,所述壳体上设有多个扩散孔,所述通道与所述第二内腔连通,所述扩散孔连通所述第一内腔和所述第二内腔。The seed crystal holder of claim 4, wherein the cooling medium diffusion structure includes a shell, a second inner cavity is formed in the shell, a plurality of diffusion holes are provided on the shell, and the channel Communicated with the second lumen, the diffusion hole communicates with the first lumen and the second lumen.
  6. 如权利要求2所述的籽晶托,其特征在于,所述籽晶托还包括冷却设备,所述冷却设备将所述冷却介质输送给所述通道,所述冷却介质以预设流速在所述通道内流动。The seed crystal holder according to claim 2, wherein the seed crystal holder further includes a cooling device, the cooling device delivers the cooling medium to the channel, and the cooling medium flows at a preset flow rate. flow in the channel.
  7. 如权利要求6所述的籽晶托,其特征在于,所述冷却介质为惰性气体,预设流速大于0.4m/s。The seed crystal holder of claim 6, wherein the cooling medium is an inert gas, and the preset flow rate is greater than 0.4m/s.
  8. 如权利要求2所述的籽晶托,其特征在于,所述籽晶托还包括增重结构,所述增重结构连接在所述籽晶托本体上。The seed crystal holder according to claim 2, wherein the seed crystal holder further includes a weight-increasing structure, and the weight-increasing structure is connected to the seed crystal holder body.
  9. 如权利要求2所述的籽晶托,其特征在于,所述籽晶托还包括设于所述连接杆上的冷却结构,所述冷却结构冷却所述通道内的冷却介质。The seed crystal holder according to claim 2, wherein the seed crystal holder further includes a cooling structure provided on the connecting rod, and the cooling structure cools the cooling medium in the channel.
  10. 如权利要求1所述的籽晶托,其特征在于,所述籽晶托还包括驱动机构和搅拌机构,所述连接杆的另一端与所述驱动机构相连,所述驱动机构通过连接杆带动所述籽晶托本体绕所述连接杆的轴线旋转;The seed crystal holder according to claim 1, characterized in that the seed crystal holder further includes a driving mechanism and a stirring mechanism, the other end of the connecting rod is connected to the driving mechanism, and the driving mechanism drives the driving mechanism through the connecting rod. The seed crystal holder body rotates around the axis of the connecting rod;
    所述搅拌机构连接在所述籽晶托本体上,所述搅拌机构搅拌用于晶体生长的熔液。The stirring mechanism is connected to the seed crystal holder body, and the stirring mechanism stirs the melt used for crystal growth.
  11. 如权利要求10所述的籽晶托,其特征在于,所述搅拌机构包括安装杆和搅拌桨,所述搅拌桨位于所述籽晶粘接面的远离所述连接杆的一侧。The seed crystal holder according to claim 10, wherein the stirring mechanism includes a mounting rod and a stirring paddle, and the stirring paddle is located on a side of the seed crystal bonding surface away from the connecting rod.
  12. 如权利要求10所述的籽晶托,其特征在于,所述搅拌机构的数量是多个,多个所述搅拌机构环绕所述籽晶托本体设置。The seed crystal holder according to claim 10, characterized in that the number of the stirring mechanisms is multiple, and the plurality of stirring mechanisms are arranged around the seed crystal holder body.
  13. 如权利要求10所述的籽晶托,其特征在于,所述搅拌机构的材质为钨合金、高温陶瓷中的一种或多种。The seed crystal holder of claim 10, wherein the stirring mechanism is made of one or more materials selected from tungsten alloy and high-temperature ceramics.
  14. 如权利要求1所述的籽晶托,其特征在于,所述籽晶托主体包括至少两个子部,所述至少两个子部的每个所述子部上均设有半槽;The seed crystal holder according to claim 1, wherein the seed crystal holder main body includes at least two sub-parts, and each of the at least two sub-parts is provided with a half groove;
    所述籽晶托还包括锁紧结构和卡接结构,所述卡接结构设于连接杆与所述籽晶托本体连接的一端;The seed crystal holder also includes a locking structure and a snap-in structure, and the snap-in structure is provided at one end of the connecting rod connected to the seed crystal holder body;
    所述至少两个子部拼接而使得至少两个子部中各个所述子部上的半槽拼接成卡接槽,所述卡接结构卡接在所述卡接槽内;The at least two sub-parts are spliced so that the half-slots on each of the at least two sub-parts are spliced into a snap-in slot, and the snap-in structure is snap-fitted in the snap slot;
    锁紧结构将拼接的所述至少两个子部相固定。The locking structure fixes the spliced at least two sub-parts.
  15. 如权利要求14所述的籽晶托,其特征在于,所述至少两个子部包括结构相同的第一子部和第二子部;所述第一子部和所述第二子部以所述连接杆的轴线为对称轴对称设置。The seed crystal holder of claim 14, wherein the at least two sub-parts include a first sub-part and a second sub-part with the same structure; the first sub-part and the second sub-part are so The axis of the connecting rod is arranged symmetrically about the axis of symmetry.
  16. 如权利要求14所述的籽晶托,其特征在于,所述卡接槽沿所述连接杆的轴线方向排列的第一槽体和第二槽体,所述第一槽体比所述第二槽体更靠近所述籽晶粘接面;所述第一槽体沿垂直于所述连接杆的轴线的截面的面积大于所述第二槽体沿垂直于所述连接杆的轴线的截面的面积;所述卡接结构沿垂直于所述连接杆的轴线的截面的面积大于所述连接杆沿垂直于所述连接杆的轴线的截面的面积。 The seed crystal holder according to claim 14, characterized in that the engaging groove has a first groove body and a second groove body arranged along the axial direction of the connecting rod, and the first groove body is larger than the third groove body. The second tank body is closer to the seed crystal bonding surface; the area of the first tank body along the cross-section perpendicular to the axis of the connecting rod is larger than the cross-section of the second tank body along the axis perpendicular to the connecting rod. The area of the clamping structure along the cross-section perpendicular to the axis of the connecting rod is greater than the area of the connecting rod along the cross-section perpendicular to the axis of the connecting rod.
  17. 如权利要求14所述的籽晶托,其特征在于,所述卡接结构呈多面体形状。The seed crystal holder according to claim 14, wherein the clamping structure is in the shape of a polyhedron.
  18. 如权利要求14所述的籽晶托,其特征在于,所述锁紧结构包括环形槽和锁紧环;所述环形槽环绕所述籽晶托主体的外壁设置,所述锁紧环套设在拼接后的所述至少两个子部外且设置在所述环形槽内。The seed crystal holder according to claim 14, characterized in that the locking structure includes an annular groove and a locking ring; the annular groove is arranged around the outer wall of the seed crystal holder body, and the locking ring is sleeved It is arranged outside the spliced at least two sub-parts and inside the annular groove.
  19. 如权利要求1所述的籽晶托,其特征在于,所述籽晶托还包括环形的保护托,所述保护托内设有与所述籽晶托本体的形状匹配的容纳腔;所述保护托环绕所述籽晶托本体设置,且所述保护托环绕所述连接杆的与所述籽晶托本体连接的一端设置。The seed crystal holder according to claim 1, wherein the seed crystal holder further includes an annular protective holder, and the protective holder is provided with an accommodation cavity that matches the shape of the seed crystal holder body; The protective bracket is arranged around the seed crystal holder body, and the protective bracket is arranged around one end of the connecting rod connected to the seed crystal holder body.
  20. 如权利要求19所述的籽晶托,其特征在于,所述籽晶托还包括环形的第一保护套,所述第一保护套套设在所述连接杆外,且所述第一保护套位于所述连接杆与所述保护托之间。The seed crystal holder according to claim 19, characterized in that the seed crystal holder further includes an annular first protective sleeve, the first protective sleeve is set outside the connecting rod, and the first protective sleeve Located between the connecting rod and the protective bracket.
  21. 如权利要求20所述的籽晶托,其特征在于,所述连接杆沿所述连接杆的轴向包括第一外径段和第二外径段;所述第一外径段的外径小于所述第二外径段的外径,所述第一外径段比所述第二外径段更靠近所述籽晶托本体;The seed crystal holder according to claim 20, wherein the connecting rod includes a first outer diameter section and a second outer diameter section along the axial direction of the connecting rod; the outer diameter of the first outer diameter section is smaller than the outer diameter of the second outer diameter segment, and the first outer diameter segment is closer to the seed crystal holder body than the second outer diameter segment;
    所述第一保护套沿所述连接杆的轴向包括第一内径段和第二内径段;所述第一内径段的外径小于所述第二内径段的内径,所述第一内径段与所述第一外径段匹配,所述第二内径段与所述第二外径段匹配。The first protective sleeve includes a first inner diameter section and a second inner diameter section along the axial direction of the connecting rod; the outer diameter of the first inner diameter section is smaller than the inner diameter of the second inner diameter section, and the first inner diameter section The second inner diameter segment matches the first outer diameter segment and the second inner diameter segment matches the second outer diameter segment.
  22. 如权利要求19所述的籽晶托,其特征在于,所述保护托的远离所述连接杆的一侧表面上设有环形的第二保护套,所述第二保护套嵌入所述保护托内,且所述第二保护套环绕所述容纳腔设置。The seed crystal holder according to claim 19, characterized in that an annular second protective cover is provided on a side surface of the protective holder away from the connecting rod, and the second protective cover is embedded in the protective holder. inside, and the second protective sleeve is arranged around the accommodation cavity.
  23. 如权利要求22所述的籽晶托,其特征在于,当所述籽晶粘接面上粘接有籽晶时,所述第二保护套远离所述连接杆的一端与所述籽晶贴合。The seed crystal holder of claim 22, wherein when a seed crystal is bonded to the seed crystal bonding surface, an end of the second protective sleeve away from the connecting rod is attached to the seed crystal. combine.
  24. 如权利要求22所述的籽晶托,其特征在于,所述保护托的远离所述连接杆的一侧表面上设有第一凹槽;所述第一凹槽的直径大于所述容纳腔背离所述连接杆的一侧的开口的直径;所述第一凹槽包括与所述开口连通的连通部分以及环绕在所述连通部分外的环形部分;The seed crystal holder according to claim 22, characterized in that a first groove is provided on a side surface of the protection holder away from the connecting rod; the diameter of the first groove is larger than that of the accommodation cavity. The diameter of the opening on the side facing away from the connecting rod; the first groove includes a communicating portion communicating with the opening and an annular portion surrounding the communicating portion;
    所述环形部分的底面与所述籽晶粘接面位于同一平面上;所述环形保护套设于所述环形部分的底面上。The bottom surface of the annular part and the seed crystal bonding surface are located on the same plane; the annular protective sleeve is provided on the bottom surface of the annular part.
  25. 如权利要求24所述的籽晶托,其特征在于,所述第一凹槽的直径大于所述开口的直径5mm-10mm。The seed crystal holder of claim 24, wherein the diameter of the first groove is 5 mm to 10 mm larger than the diameter of the opening.
  26. 如权利要求24所述的籽晶托,其特征在于,所述籽晶粘接面上粘接有石墨纸,所述石墨纸朝向远离所述连接杆的方向凸出于所述第二保护套的远离所述连接杆的一侧表面。The seed crystal holder according to claim 24, wherein graphite paper is adhered to the seed crystal bonding surface, and the graphite paper protrudes from the second protective sleeve in a direction away from the connecting rod. The side surface away from the connecting rod.
  27. 一种籽晶粘接装置,其特征在于,所述籽晶粘接装置包括一个或多个粘接组件,所述粘接组件包括支撑部件和施压部件,所述支撑部件支撑籽晶托,所述施压部件施加压力,所述压力将所述籽晶托和所述籽晶托上的籽晶相向压合。A seed crystal bonding device, characterized in that the seed crystal bonding device includes one or more bonding components, the bonding component includes a support component and a pressure component, and the support component supports the seed crystal holder, The pressing member applies pressure, and the pressure presses the seed crystal holder and the seed crystal on the seed crystal holder toward each other.
  28. 如权利要求27所述的籽晶粘接装置,其特征在于,所述支撑部件包括第一压件和第二压件,所述施压部件包括第一压盘;The seed bonding device according to claim 27, wherein the supporting member includes a first pressing member and a second pressing member, and the pressing member includes a first pressing plate;
    所述第一压件的侧壁包括至少一个第一排气孔;所述第二压件与所述第一压件嵌套连接;其中,在籽晶粘接固定过程中,籽晶放置于所述第二压件的上表面,籽晶托放置于所述籽晶上表面;所述第一压盘向所述籽晶托施加压力。The side wall of the first pressing part includes at least one first vent hole; the second pressing part is nested with the first pressing part; wherein, during the bonding and fixing process of the seed crystal, the seed crystal is placed on On the upper surface of the second pressing member, the seed crystal holder is placed on the upper surface of the seed crystal; the first pressure plate applies pressure to the seed crystal holder.
  29. 如权利要求28所述的籽晶粘接装置,其特征在于,所述第一压件底部包括第二通孔,所述第二压件底部包括第一凸起,所述第一凸起与所述第二通孔相互配合实现所述第一压件和所述第二压件的嵌套连接。The seed bonding device of claim 28, wherein the bottom of the first pressing member includes a second through hole, the bottom of the second pressing member includes a first protrusion, and the first protrusion is connected to the second through hole. The second through holes cooperate with each other to realize the nested connection of the first pressing part and the second pressing part.
  30. 如权利要求28所述的籽晶粘接装置,其特征在于,所述第一排气孔的横截面直径包括0.01mm-10mm。The seed bonding device according to claim 28, wherein the cross-sectional diameter of the first exhaust hole includes 0.01mm-10mm.
  31. 如权利要求28所述的籽晶粘接装置,其特征在于,所述第一压件和所述第二压件嵌套连接后,所述第一排气孔与所述第二压件上表面的竖直距离在0.2mm-5mm的范围内。 The seed crystal bonding device according to claim 28, characterized in that after the first pressure part and the second pressure part are nested and connected, the first exhaust hole and the second pressure part are The vertical distance of the surface is in the range of 0.2mm-5mm.
  32. 如权利要求28所述的籽晶粘接装置,其特征在于,所述第二压件的侧壁包括至少一个第二排气孔,所述第一排气孔与所述第二排气孔至少部分相对应。The seed bonding device of claim 28, wherein the side wall of the second pressing member includes at least one second exhaust hole, and the first exhaust hole and the second exhaust hole are At least partially corresponding.
  33. 如权利要求32所述的籽晶粘接装置,其特征在于,所述第二排气孔的横截面直径包括0.01mm-10mm。The seed bonding device according to claim 32, wherein the cross-sectional diameter of the second exhaust hole includes 0.01mm-10mm.
  34. 如权利要求32所述的籽晶粘接装置,其特征在于,所述第二排气孔与所述第二压件上表面的竖直距离在0.2mm-5mm的范围内。The seed bonding device according to claim 32, wherein the vertical distance between the second exhaust hole and the upper surface of the second pressing member is in the range of 0.2mm-5mm.
  35. 如权利要求28所述的籽晶粘接装置,其特征在于,所述第二压件的高度小于所述第一压件的高度。The seed bonding device according to claim 28, wherein the height of the second pressing member is smaller than the height of the first pressing member.
  36. 如权利要求28所述的籽晶粘接装置,其特征在于,所述籽晶托与所述第一压件螺纹连接。The seed crystal bonding device according to claim 28, wherein the seed crystal holder is threadedly connected to the first pressing member.
  37. 如权利要求28所述的籽晶粘接装置,其特征在于,所述第一压盘底部包括第二凸起,所述籽晶托上部包括第二凹槽,所述第二凸起和所述第二凹槽配合实现所述第一压盘和所述籽晶托的连接。The seed crystal bonding device of claim 28, wherein the bottom of the first pressure plate includes a second protrusion, the upper part of the seed crystal support includes a second groove, and the second protrusion and the The second groove cooperates to realize the connection between the first pressure plate and the seed crystal holder.
  38. 如权利要求27所述的籽晶粘接装置,其特征在于,支撑部件包括环形底座,所述环形底座和盖体,所述籽晶托放置在所述环形底座上;所述盖体包括环形的侧壁和盖板,所述侧壁套设在所述环形底座外,所述盖体向所述籽晶托上的籽晶施加压力。The seed crystal bonding device according to claim 27, wherein the support component includes an annular base, the annular base and a cover, the seed crystal holder is placed on the annular base; the cover includes an annular base The side wall and cover plate are set outside the annular base, and the cover exerts pressure on the seed crystal on the seed crystal holder.
  39. 如权利要求38所述的籽晶粘接装置,其特征在于,还包括第一连接件和第二连接件,所述第一连接件设于所述环形底座上,所述第二连接件设于所述盖体上;所述第一连接件与所述第二连接件可拆卸连接;The seed bonding device according to claim 38, further comprising a first connecting member and a second connecting member, the first connecting member is provided on the annular base, and the second connecting member is provided on the annular base. On the cover body; the first connecting piece and the second connecting piece are detachably connected;
    当所述第一连接件与所述第二连接件连接,所述盖体的盖板向所述籽晶托上的籽晶施加压力。When the first connecting member is connected to the second connecting member, the cover plate of the cover exerts pressure on the seed crystal on the seed crystal holder.
  40. 如权利要求38所述的籽晶粘接装置,其特征在于,所述底座上设有锁紧结构,所述锁紧结构将所述籽晶托固定到所述环形底座上。The seed crystal bonding device of claim 38, wherein a locking structure is provided on the base, and the locking structure fixes the seed crystal holder to the annular base.
  41. 如权利要求40所述的籽晶粘接装置,其特征在于,所述籽晶托的远离所述籽晶粘接面的一侧设有连接螺纹孔,锁紧结构包括锁紧盘、锁紧件和锁紧螺母,所述锁紧件包括托盘、第一螺纹杆和第二螺纹杆,所述托盘承托所述籽晶托的远离所述籽晶粘接面的一侧,所述第一螺纹杆与所述连接螺纹孔配合;所述锁紧盘上设有安装孔,所述第二螺纹杆穿过所述安装孔,所述锁紧螺母与所述第二螺纹杆配合;The seed crystal bonding device according to claim 40, wherein the seed crystal holder is provided with a connecting threaded hole on a side away from the seed crystal bonding surface, and the locking structure includes a locking plate, a locking plate, and a locking plate. and a locking nut. The locking member includes a tray, a first threaded rod and a second threaded rod. The tray supports the side of the seed crystal holder away from the seed crystal bonding surface. A threaded rod cooperates with the connecting threaded hole; the locking plate is provided with a mounting hole, the second threaded rod passes through the mounting hole, and the locking nut cooperates with the second threaded rod;
    所述锁紧螺母和所述托盘分别位于所述锁紧盘的沿所述安装孔的轴线方向的两侧。The locking nut and the tray are respectively located on both sides of the locking plate along the axis of the mounting hole.
  42. 如权利要求41所述的籽晶粘接装置,其特征在于,所述托盘由弹性材料制成。The seed bonding device of claim 41, wherein the tray is made of elastic material.
  43. 如权利要求38所述的籽晶粘接装置,其特征在于,所述环形底座的内壁上设有承托结构,所述承托结构包括环形连接板、环形承托板和环形承托凸起;所述环形承托板的外环连接所述环形连接板,所述环形承托板的内环设有所述环形承托凸起,所述环形承托凸起承托所述籽晶托;所述环形连接板连接所述环形底座的内壁。The seed crystal bonding device according to claim 38, wherein a supporting structure is provided on the inner wall of the annular base, and the supporting structure includes an annular connecting plate, an annular supporting plate and annular supporting protrusions. ; The outer ring of the annular supporting plate is connected to the annular connecting plate, and the inner ring of the annular supporting plate is provided with the annular supporting protrusion, and the annular supporting protrusion supports the seed crystal holder. ; The annular connecting plate is connected to the inner wall of the annular base.
  44. 如权利要求38所述的籽晶粘接装置,其特征在于,所述盖体上设气泡去除装置,所述气泡去除装置去除籽晶与所述籽晶托之间的气泡。The seed crystal bonding device according to claim 38, wherein a bubble removal device is provided on the cover, and the bubble removal device removes bubbles between the seed crystal and the seed crystal holder.
  45. 如权利要求44所述的籽晶粘接装置,其特征在于,所述气泡去除装置包括插槽、插板和滚轮;所述插槽设于所述盖体上,所述插板位于所述插槽内,所述滚轮设于所述插板的一端;所述插板在所述插槽内运动,以带动所述滚轮滚压所述籽晶。The seed bonding device of claim 44, wherein the bubble removal device includes a slot, an insert plate and a roller; the slot is provided on the cover, and the insert plate is located on the cover. In the slot, the roller is located at one end of the inserting plate; the inserting plate moves in the slot to drive the roller to roll the seed crystal.
  46. 如权利要求45所述的籽晶粘接装置,其特征在于,所述插板的另一端设有拉环。The seed bonding device according to claim 45, wherein the other end of the inserting plate is provided with a pull ring.
  47. 如权利要求27所述的籽晶粘接装置,其特征在于,所述粘接组件的数量是多个,所述支撑部件包括支撑盘,所述支撑盘承托所述籽晶和所述籽晶托,所述籽晶位于所述支撑盘和所述籽晶托之间;The seed crystal bonding device according to claim 27, wherein the number of the bonding components is multiple, and the support member includes a support plate, and the support plate supports the seed crystal and the seed crystal. Crystal holder, the seed crystal is located between the support plate and the seed crystal holder;
    所述籽晶粘接装置还包括支撑架以及设于所述支撑架上的多个施压驱动件,所述支撑盘设于所述支撑 架上,所述籽晶粘接装置包括多个粘接组件,多个施压驱动件分别与多个所述施压部件连接;所述施压驱动件使得所述施压部件对所述籽晶托施加朝向所述支撑盘的压力。The seed bonding device further includes a support frame and a plurality of pressure driving parts provided on the support frame, and the support plate is provided on the support frame. On the frame, the seed crystal bonding device includes a plurality of bonding components, a plurality of pressure driving parts are respectively connected to a plurality of the pressure parts; the pressure driving part causes the pressure part to press the seed The crystal support exerts pressure towards the support plate.
  48. 如权利要求47所述的籽晶粘接装置,其特征在于,所述支撑架包括沿着竖直方向延伸的多根支撑杆,多根所述支撑杆沿所述支撑盘的周向间隔布置;多个所述施压驱动件设于至少一根所述支撑杆上,且多个所述施压驱动件沿所述竖直方向间隔布置,多个籽晶粘接组件沿竖直方向间隔布置。The seed bonding device of claim 47, wherein the support frame includes a plurality of support rods extending in a vertical direction, and the plurality of support rods are arranged at intervals along the circumference of the support plate. ; A plurality of the pressure driving members are provided on at least one of the support rods, and the plurality of pressure driving members are spaced apart along the vertical direction, and a plurality of seed bonding components are spaced apart along the vertical direction. layout.
  49. 如权利要求47所述的籽晶粘接装置,其特征在于,所述施压驱动件包括气压施压驱动件或液压施压驱动件。The seed bonding device according to claim 47, wherein the pressure driving member includes a pneumatic pressure driving member or a hydraulic pressure driving member.
  50. 如权利要求49所述的籽晶粘接装置,其特征在于,设置有所述施压驱动件的所述支撑杆上设有传压介质通道,至少一个所述施压驱动件通过阀门与所述传压介质通道连通。The seed bonding device of claim 49, wherein the support rod provided with the pressure driving member is provided with a pressure transmission medium channel, and at least one of the pressure driving members communicates with the pressure driving member through a valve. The pressure transmission medium channels are connected.
  51. 如权利要求47所述的籽晶粘接装置,其特征在于,所述支撑盘可旋转地设于所述支撑架上,所述支撑盘的旋转轴线平行于所述支撑杆,所述籽晶粘接装置还包括旋转驱动件,所述旋转驱动件与所述支撑盘连接,以驱动所述支撑盘旋转。The seed crystal bonding device of claim 47, wherein the support plate is rotatably mounted on the support frame, the rotation axis of the support plate is parallel to the support rod, and the seed crystal The bonding device further includes a rotational driving member connected with the support plate to drive the support plate to rotate.
  52. 如权利要求51所述的籽晶粘接装置,其特征在于,所述旋转驱动件包括磁性元件、动力源和磁性驱动件;所述磁性驱动件与所述磁性元件磁耦合,所述磁性元件固定在所述支撑盘上,所述磁性驱动件固定在所述动力源的输出端上;所述动力源驱动所述磁性驱动件旋转,以驱动所述磁性元件带动所述支撑盘旋转。The seed bonding device of claim 51, wherein the rotational driving member includes a magnetic element, a power source and a magnetic driving member; the magnetic driving member is magnetically coupled to the magnetic element, and the magnetic element Fixed on the support plate, the magnetic driving member is fixed on the output end of the power source; the power source drives the magnetic driving member to rotate to drive the magnetic element to drive the support plate to rotate.
  53. 如权利要求48所述的籽晶粘接装置,其特征在于,所述施压部件包括设于所示支撑架上的限位压盘,所述施压驱动件包括第一子驱动件和第二子驱动件,所述第一子驱动件和所述第二子驱动件设于不同的所述支撑杆上;The seed bonding device of claim 48, wherein the pressure component includes a limiting pressure plate provided on the support frame, and the pressure driving component includes a first sub-driving component and a third sub-driving component. Two sub-driving parts, the first sub-driving part and the second sub-driving part are provided on different support rods;
    所述第一子驱动件和所述第二子驱动件沿所述限位压盘的周向间隔布置,且所述第一子驱动件和所述第二子驱动件均与所述限位压盘连接。The first sub-driving member and the second sub-driving member are arranged at intervals along the circumference of the limiting pressure plate, and both the first sub-driving member and the second sub-driving member are in contact with the limiting pressure plate. Pressure plate connection.
  54. 如权利要求50所述的籽晶粘接装置,其特征在于,所述籽晶粘接装置还包括压力传感器,所述压力传感器用于确定各个所述施压部件所施加的压力。The seed crystal bonding device according to claim 50, wherein the seed crystal bonding device further includes a pressure sensor, and the pressure sensor is used to determine the pressure exerted by each of the pressure applying components.
  55. 如权利要求54所述的籽晶装置,其特征在于,所述籽晶粘接装置还包括控制器,所述控制器与所述阀门和所述压力传感器均信号连接;所述控制器被配置为:The seed crystal device of claim 54, wherein the seed crystal bonding device further includes a controller, the controller is signally connected to both the valve and the pressure sensor; the controller is configured for:
    基于所述压力传感器感应的压力数据,调节所述阀门的开度。Based on the pressure data sensed by the pressure sensor, the opening of the valve is adjusted.
  56. 一种坩埚,其特征在于,包括坩埚本体、驱动组件和温场保持盘,所述驱动组件包括驱动源和连接机构,所述连接机构连接在所述驱动源与所述坩埚本体的底部之间,所述驱动组件驱动所述坩埚本体绕坩埚本体的轴线相对所述温场保持盘旋转;所述温场保持盘设于所述连接结构上,且位于所述驱动源与所述坩埚本体的底部之间。A crucible, characterized in that it includes a crucible body, a driving assembly and a temperature field holding disk. The driving assembly includes a driving source and a connecting mechanism. The connecting mechanism is connected between the driving source and the bottom of the crucible body. , the driving assembly drives the crucible body to rotate around the axis of the crucible body relative to the temperature field holding disk; the temperature field holding disk is provided on the connection structure and is located between the driving source and the crucible body between the bottom.
  57. 如权利要求56所述的坩埚,其特征在于,所述连接机构包括旋转柱和第一承托盘,所述第一承托盘设于所述旋转柱的一端,所述驱动源连接在所述旋转柱的另一端。The crucible of claim 56, wherein the connection mechanism includes a rotating column and a first supporting tray, the first supporting tray is provided at one end of the rotating column, and the driving source is connected to the rotating column. the other end of the column.
  58. 如权利要求57所述的坩埚,其特征在于,所述第一承托盘上包括同心布置的多个阶梯状凹槽。The crucible of claim 57, wherein the first supporting tray includes a plurality of concentrically arranged stepped grooves.
  59. 如权利要求57所述的坩埚,其特征在于,所述连接机构包括第二承托盘,所述第二承托盘呈环形,所述第二承托盘位于所述第一承托盘和所述驱动源之间,所述第二承托盘的内环与所述旋转柱的外壁固定;The crucible of claim 57, wherein the connection mechanism includes a second supporting tray, the second supporting tray is annular, and the second supporting tray is located between the first supporting tray and the driving source. The inner ring of the second supporting tray is fixed to the outer wall of the rotating column;
    所述第二承托盘与所述温场保持盘之间通过滚珠结构连接。The second supporting tray and the temperature field holding tray are connected through a ball structure.
  60. 如权利要求56所述的坩埚,其特征在于,所述温场保持盘的材质为莫来石、刚玉以及氧化铝中的至少一种。The crucible of claim 56, wherein the temperature field holding disk is made of at least one of mullite, corundum and alumina.
  61. 如权利要求56所述的坩埚,其特征在于,所述坩埚还包括多根伸缩支撑杆,所述伸缩支撑杆的一 端连接在所述温场保持盘的底部。The crucible of claim 56, wherein the crucible further includes a plurality of telescopic support rods, one of the telescopic support rods The end is connected to the bottom of the temperature field holding disk.
  62. 权利要求56所述的坩埚,其特征在于,所述坩埚还包括连接环和锁紧机构,所述连接环的侧壁上设有锁紧孔;所述连接环套设在所述驱动源的输出轴以及所述旋转柱的另一端外,所述锁紧孔与所述锁紧机构配合而将所述连接环与所述驱动源的输出轴以及所述旋转柱固定。The crucible of claim 56, wherein the crucible further includes a connecting ring and a locking mechanism, and a locking hole is provided on the side wall of the connecting ring; the connecting ring is sleeved on the driving source. Outside the output shaft and the other end of the rotating column, the locking hole cooperates with the locking mechanism to fix the connecting ring to the output shaft of the driving source and the rotating column.
  63. 一种晶体生长方法,其特征在于,使用权利要求19-26所述的籽晶托,包括以下步骤:A crystal growth method, characterized by using the seed crystal holder described in claims 19-26, including the following steps:
    将籽晶粘接在籽晶托本体的籽晶粘接面上;Bond the seed crystal to the seed crystal bonding surface of the seed crystal holder body;
    将粘有所述籽晶的所述籽晶托沉入坩埚中的用于晶体生长的熔体中,且所述籽晶的远离所述籽晶托的一侧表面位于所述熔体温度最高的位置处;The seed crystal holder with the seed crystal attached to it is sunk into the melt used for crystal growth in the crucible, and the surface of the side of the seed crystal away from the seed crystal holder is located at the highest temperature of the melt. at the position;
    使用上提拉法生长晶体。Crystals were grown using the pull-up method.
  64. 如权利要求63所述的晶体生长方法,其特征在于,所述籽晶托本体的一部分位于所述熔体中,所述籽晶托本体的另一部分位于所述熔体外。The crystal growth method of claim 63, wherein a part of the seed crystal holder body is located in the melt, and another part of the seed crystal holder body is located outside the melt.
  65. 如权利要求63所述的晶体生长方法,其特征在于,所述籽晶托能够绕着连接杆的轴线旋转,所述坩埚能够绕着所述坩埚的轴线旋转;所述连接杆的轴线与所述坩埚的轴线平行;The crystal growth method of claim 63, wherein the seed crystal holder can rotate around the axis of the connecting rod, and the crucible can rotate around the axis of the crucible; the axis of the connecting rod is in contact with the axis of the connecting rod. The axes of the crucible are said to be parallel;
    所述使用上提拉法生长晶体包括:The use of the upward pulling method to grow crystals includes:
    控制所述籽晶托和所述坩埚沿着相反的方向旋转。The seed holder and the crucible are controlled to rotate in opposite directions.
  66. 如权利要求65所述的晶体生长方法,其特征在于,所述籽晶托的旋转速度是0rpm~20rpm;所述坩埚的旋转速度是0rpm~20rpm。The crystal growth method of claim 65, wherein the rotation speed of the seed crystal holder is 0 rpm to 20 rpm; the rotation speed of the crucible is 0 rpm to 20 rpm.
  67. 如权利要求66所述的晶体生长方法,其特征在于,所述籽晶托的旋转速度的数值与所述坩埚的旋转速度的数值的乘积为20或150。The crystal growth method of claim 66, wherein the product of the rotational speed of the seed holder and the rotational speed of the crucible is 20 or 150.
  68. 如权利要求63所述的晶体生长方法,其特征在于,在将粘有所述籽晶的所述籽晶托沉入用于晶体生长的熔体中之前,还包括:The crystal growth method according to claim 63, characterized in that, before sinking the seed crystal holder with the seed crystal adhered to it into the melt used for crystal growth, it further includes:
    将所述熔体升温至1720℃~1780℃。The melt is heated to 1720°C to 1780°C.
  69. 如权利要求63所述的晶体生长方法,其特征在于,所述使用上提拉法生长晶体包括:The crystal growth method according to claim 63, wherein growing the crystal using the upward pulling method includes:
    保持粘有所述籽晶的所述籽晶托沉入所述熔体10min~30min;Keep the seed crystal holder with the seed crystal attached and sink into the melt for 10 to 30 minutes;
    按照0.01mm/h~0.2mm/h的提拉速度提拉所述籽晶托而进行晶体生长。The seed crystal support is pulled at a pulling speed of 0.01 mm/h to 0.2 mm/h to perform crystal growth.
  70. 如权利要求63所述的晶体生长方法,其特征在于,所述使用上提拉法生长晶体包括:The crystal growth method according to claim 63, wherein growing the crystal using the upward pulling method includes:
    在晶体生长10h~30h后,按30mm/h-40mm/h的提拉速度将晶体提拉离开所述熔体,且所述晶体与所述熔体表面具有15mm~25mm的间隔高度。After the crystal grows for 10 to 30 hours, the crystal is pulled away from the melt at a pulling speed of 30 mm/h to 40 mm/h, and the crystal and the melt surface have a separation height of 15 mm to 25 mm.
  71. 如权利要求63所述的晶体生长方法,其特征在于,所述将籽晶粘接在籽晶托本体的籽晶粘接面上包括:The crystal growth method of claim 63, wherein bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body includes:
    使得所述籽晶的直径大于所述籽晶托本体的直径5mm-10mm,且所述籽晶突出于所述保护托的远离所述连接杆的一侧表面0.1mm-0.2mm。The diameter of the seed crystal is 5 mm-10 mm larger than the diameter of the seed crystal holder body, and the seed crystal protrudes 0.1 mm-0.2 mm from the side surface of the protective holder away from the connecting rod.
  72. 如权利要求63所述的晶体生长方法,其特征在于,所述保护托的远离所述连接杆的一侧表面上设有环形的第二保护套,所述第二保护套嵌入所述保护托内,且所述第二保护套环绕所述容纳腔设置;The crystal growth method according to claim 63, wherein an annular second protective sleeve is provided on a side surface of the protective bracket away from the connecting rod, and the second protective sleeve is embedded in the protective bracket. inside, and the second protective sleeve is arranged around the accommodation cavity;
    所述将籽晶粘接在籽晶托本体的籽晶粘接面上包括:The method of bonding the seed crystal to the seed crystal bonding surface of the seed crystal holder body includes:
    将籽晶与所述第二保护套远离所述连接杆的一端贴合,并粘接在籽晶托本体的籽晶粘接面上;Fit the seed crystal to the end of the second protective sleeve away from the connecting rod, and bond it to the seed crystal bonding surface of the seed crystal holder body;
    所述晶体生长方法还包括:The crystal growth method also includes:
    在晶体生长完成后,沿平行于所述籽晶粘接面的切割平面切割所述籽晶托,以将所述籽晶托与所述晶体分离;After the crystal growth is completed, cutting the seed crystal holder along a cutting plane parallel to the seed crystal bonding surface to separate the seed crystal holder from the crystal;
    所述切割平面覆盖所述籽晶托本体、所述保护托和所述第二保护套。 The cutting plane covers the seed crystal holder body, the protective holder and the second protective cover.
PCT/CN2023/117096 2022-09-09 2023-09-05 Seed crystal holder and crystal growth method WO2024051703A1 (en)

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