WO2024040725A1 - 背光模组及显示装置 - Google Patents

背光模组及显示装置 Download PDF

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Publication number
WO2024040725A1
WO2024040725A1 PCT/CN2022/125838 CN2022125838W WO2024040725A1 WO 2024040725 A1 WO2024040725 A1 WO 2024040725A1 CN 2022125838 W CN2022125838 W CN 2022125838W WO 2024040725 A1 WO2024040725 A1 WO 2024040725A1
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WO
WIPO (PCT)
Prior art keywords
light
circuit board
flexible circuit
section
guide plate
Prior art date
Application number
PCT/CN2022/125838
Other languages
English (en)
French (fr)
Inventor
陈志详
张政德
Original Assignee
瑞仪(广州)光电子器件有限公司
瑞仪光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞仪(广州)光电子器件有限公司, 瑞仪光电股份有限公司 filed Critical 瑞仪(广州)光电子器件有限公司
Priority to US18/467,464 priority Critical patent/US20240126006A1/en
Publication of WO2024040725A1 publication Critical patent/WO2024040725A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/20—Light-tight connections for movable optical elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065—Manufacturing aspects; Material aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like

Definitions

  • the present invention relates to an optical device, and in particular to a backlight module and a display device that can improve overall uniform brightness.
  • a general backlight module includes a light source, a frame and a light guide plate.
  • the light source includes a circuit board and a light-emitting diode arranged on the circuit board.
  • the light guide plate is arranged next to the light emitting diode, and the light incident surface of the light guide plate is close to the light emitting surface of the light emitting diode or there is only a small gap, thereby effectively utilizing the light of the light emitting diode.
  • tape is used to fix the light guide plate to the circuit board during assembly. Since the tape has a certain thickness, the light guide plate cannot adhere to the circuit board, resulting in the light emitting surface of the light emitting diode being damaged. It cannot be completely aligned with the central axis of the light-incident surface of the light guide plate, which causes the risk of light leakage at the light-emitting surface of the light guide plate close to the light-emitting diode. It is prone to bright bands or uneven brightness, which affects the optical quality of the backlight module. .
  • an object of the present invention is to provide a backlight module that can avoid the problem of light leakage.
  • the backlight module includes an outer frame unit, a light guide plate disposed in the outer frame unit and having a light-incident side, a light-emitting unit, a plurality of fixing glues for fixing the light-emitting unit to the light guide plate, and a plurality of abutment structures.
  • the light-emitting unit includes a flexible circuit board and a plurality of light-emitting components spaced on the flexible circuit board.
  • the flexible circuit board has a first surface and a second surface opposite to the first surface.
  • the light-emitting component is disposed on the first surface and emits light toward the light incident side of the light guide plate.
  • a plurality of fixing glues are arranged at intervals, and each light-emitting part corresponds to between two adjacent fixing glues.
  • the abutment structure is arranged corresponding to the position of the light-emitting component, and abuts against the flexible circuit board through the second surface of the flexible circuit board, so that the flexible circuit board is deformed at
  • the resisting structure is a protruding structure formed on the second surface of the flexible circuit board.
  • the outer frame unit includes a back frame, and the back frame has a load-bearing section for carrying the light guide plate.
  • the second surface of the flexible circuit board is abutted against the load-bearing section, and the abutment structure is supported by the load-bearing section. Push against the flexible circuit board.
  • the outer frame unit includes a back frame, and the back frame has a carrying section for carrying the light guide plate, a connecting section connected to the carrying section, and an extension section connected to the connecting section and extending in the same direction as the carrying section.
  • the load-bearing section, the connecting section and the extension section together surround the accommodation space, the light-emitting unit and the light guide plate are limited in the accommodation space, the second surface of the flexible circuit board is pressed against the extension section, and the abutment structure is supported by the extension section. Push against the flexible circuit board.
  • the outer frame unit includes a back frame and an upper frame provided on the back frame.
  • the back frame and the upper frame together surround an accommodation space.
  • the light-emitting unit and the light guide plate are limited to the accommodation space.
  • the soft The second surface of the flexible circuit board is pressed against the upper frame, and the abutting structure is pushed against the flexible circuit board by the upper frame.
  • the abutting structure is a protruding structure formed on the outer frame unit.
  • the outer frame unit includes a back frame.
  • the back frame has a load-bearing section for carrying the light guide plate.
  • the second surface of the flexible circuit board is abutted against the load-bearing section, and the abutment structure is formed on the load-bearing section. And against the flexible circuit board.
  • the outer frame unit includes a back frame, and the back frame has a carrying section for carrying the light guide plate, a connecting section connected to the carrying section, and an extension section connected to the connecting section and extending in the same direction as the carrying section.
  • the load-bearing section, the connecting section and the extension section together surround the accommodation space
  • the light-emitting unit and the light guide plate are limited in the accommodation space
  • the second surface of the flexible circuit board is abutted against the extension section
  • the abutment structure is formed on the extension section And against the flexible circuit board.
  • the outer frame unit includes a back frame and an upper frame provided on the back frame.
  • the back frame and the upper frame together surround an accommodation space.
  • the light-emitting unit and the light guide plate are limited to the accommodation space.
  • the soft The second surface of the flexible circuit board is pressed against the upper frame, and the abutment structure is formed on the upper frame to push against the flexible circuit board.
  • the first surface of the flexible circuit board has a plurality of fixing areas for setting fixing glue and a plurality of setting areas for setting light-emitting components, and the fixing areas and the setting areas are non-coplanar.
  • Another technical means of the present invention is to form a protrusion on the first surface of the flexible circuit board at a position against the structure so as to be coplanar with the surface of the fixing glue.
  • Another object of the present invention is to provide a display device, including the aforementioned backlight module and a display panel disposed on the backlight module.
  • the effect of the present invention is that by abutting the flexible circuit board through the second surface of the flexible circuit board, the thickness of the fixing glue can be correspondingly compensated, so that the flexible circuit board can be deformed at a specific position and can be adjusted.
  • the position of the light-emitting part relative to the light guide plate allows the light-emitting part to be aligned with the light-incident surface of the light guide plate to improve the coupling effect between the light guide plate and the light-emitting part and prevent light from leaking from the light-emitting surface of the light guide plate close to the light-emitting part.
  • Figure 1 is a perspective view of the first preferred embodiment of the backlight module of the present invention
  • Figure 2 is an exploded perspective view illustrating the internal structure of the first preferred embodiment
  • Figure 3 is a partial cross-sectional view illustrating the relative positions of various components in the first preferred embodiment, in which the light-emitting unit is an inverted design;
  • Figure 4 is a partial cross-sectional view illustrating another form of the first preferred embodiment, in which the light-emitting unit is of a positive assembly design;
  • Figure 5 is an exploded perspective view illustrating another form of the first preferred embodiment, in which the outer frame unit includes an upper frame and a back frame;
  • Figure 6 is an exploded perspective view of the second preferred embodiment of the backlight module of the present invention.
  • Figure 7 is a partial cross-sectional view illustrating the relative positions between components in the second preferred embodiment, in which the light-emitting unit is an inverted design;
  • Figure 8 is a partial cross-sectional view illustrating another form of the second preferred embodiment, in which the light-emitting unit is of a positive assembly design
  • Figure 9 is an exploded perspective view illustrating another form of the second preferred embodiment, in which the outer frame unit includes an upper frame and a back frame; and
  • Figure 10 is a perspective view of a preferred embodiment of the display device of the present invention.
  • a first preferred embodiment of the backlight module B of the present invention which includes an outer frame unit 2 , a reflective sheet 3 disposed on the outer frame unit 2 , and a reflective sheet 3 disposed in the outer frame unit 2 .
  • the outer frame unit 2 includes a back frame 21.
  • the back frame 21 has a carrying section 211 for carrying the reflective sheet 3 and the light guide plate 4, a connecting section 212 connected to the carrying section 211, and a connecting section 212 connected to the connecting section 212.
  • the extension section 213 extends in the same direction as the load-bearing section 211 .
  • the bearing section 211 , the connecting section 212 and the extension section 213 collectively surround the accommodation space 20 .
  • the light-emitting unit 5 includes a flexible circuit board 51 and a plurality of light-emitting elements 52 spaced on the flexible circuit board 51 .
  • the flexible circuit board 51 has a first surface 511 and a second surface 512 opposite to the first surface 511 .
  • the light-emitting component 52 is disposed on the first surface 511 and emits light toward the light incident surface 41 of the light guide plate 4 .
  • the light-emitting unit 5 is fixed on the light guide plate 4 through a plurality of fixing glues 6 .
  • a plurality of fixing glues 6 are arranged at intervals, and each light-emitting member 52 corresponds to between two adjacent fixing glues 6 .
  • the backlight module B disclosed in this embodiment does not use a continuously extending fixing tape, which can avoid the above-mentioned problems of extended bright lines, reduced brightness, and uneven brightness of incident light.
  • the first surface 511 of the flexible circuit board 51 has a plurality of fixing areas 513 for setting the fixing glue 6 and a plurality of setting areas 514 for setting the light-emitting components 52 .
  • the backlight module B also includes a plurality of abutment structures 7 .
  • the abutment structures 7 are arranged corresponding to the positions of the light-emitting components 52 and abut against the soft circuit board 51 through the second surface 512 of the flexible circuit board 51 .
  • the circuit board 51 can thereby correspondingly compensate for the thickness of the fixing glue 6, so that the flexible circuit board 51 deforms at the position against the structure 7, or the flexible circuit board 51 changes in height at the position against the structure 7,
  • the position of the light-emitting element 52 relative to the light guide plate 4 can be adjusted to align the light-emitting element 52 with the light guide plate 4 to improve the coupling effect between the light guide plate 4 and the light-emitting element 52 and avoid the risk of light leakage. In this way, the overall thickness of the display device can be reduced to comply with the thinning trend of display devices and be applied to the design of ultra-thin models.
  • the resisting structure 7 is a protruding structure formed on the second surface 512 of the flexible circuit board 51 .
  • the resisting structure 7 can be a protruding structure formed by ink printing, other types of materials or microstructures on the second surface 512 of the flexible circuit board 51, so it should not be limited to the description of this embodiment. .
  • the light guide plate 4 is bonded to the first surface 511 of the flexible circuit board 51 using the fixing glue 6 .
  • the light guide plate 4 and the light emitting unit 5 are placed and limited in the accommodating space 20 . At this time, as shown in FIG.
  • the second surface 512 of the flexible circuit board 51 is abutted against the extended section 213 of the back frame 21 , and since the abutment structure 7 protrudes from the second surface 512 , the light guide plate 4 is in contact with the light-emitting After the unit 5 is placed and positioned, the abutment structure 7 will push against the flexible circuit board 51, thereby correspondingly compensating the thickness of the fixing glue 6, causing the flexible circuit board 51 to deform at the position of the abutment structure 7, or causing the soft circuit board 51 to deform.
  • the circuit board 51 produces a height change in its position against the structure 7 .
  • the fixing area 513 and the setting area 514 will become non-coplanar.
  • the flexible circuit board 51 forms a downward protrusion at a position against the structure 7 (that is, the setting area 514) to form a co-planar surface with the surface of the fixing glue 6.
  • the light-emitting component 52 located in the setting area 514 moves downward, and then The position of the light-emitting element 52 relative to the light guide plate 4 is adjusted to align with the light incident surface 41 of the light guide plate 4 to improve the coupling effect between the light guide plate 4 and the light-emitting element 52 and avoid the risk of light leakage.
  • the present invention uses the flexible design of the flexible circuit board 51 and the arrangement of the resisting structure 7 to push against the position of the flexible circuit board 51 corresponding to the light-emitting element 52 to cause deformation to compensate for the thickness of the fixing glue 6.
  • Adjust the position of the light-emitting part 52 relative to the light guide plate 4 optimize the coupling effect between the light guide plate 4 and the light-emitting part 52, prevent light from leaking from the light-emitting surface of the light guide plate 4 close to the light-emitting part 52, reduce the generation of bright lines, and improve the overall Uniform brightness. In this way, the overall thickness of the display device can be reduced to comply with the thinning trend of display devices and be applied to the design of ultra-thin models.
  • the light-emitting unit 5 has an inverse assembly design (the flexible circuit board 51 is at the top and the light-emitting element 52 is at the bottom). Therefore, the second surface 512 of the flexible circuit board 51 is supported by the resisting structure 7 and The upper extension section 213 resists, causing the flexible circuit board 51 to deform downward at the position against the structure 7 , and then pushes the light-emitting element 52 downward to align with the light incident surface 41 of the light guide plate 4 .
  • the light-emitting unit 5 may also be of a positive assembly design (the flexible circuit board 51 is at the bottom and the light-emitting component 52 is at the top), and the second surface 512 of the flexible circuit board 51 is attached Against the load-bearing section 211 of the back frame 21 , the second surface 512 of the flexible circuit board 51 is resisted by the abutment structure 7 and the load-bearing section 211 below, so that the flexible circuit board 51 is formed at the position of the abutment structure 7 It deforms upward, and then pushes the light-emitting member 52 upward to align with the light incident surface 41 of the light guide plate 4 .
  • the forward assembly method shown in FIG. 4 also allows the light-emitting unit 5 to be easily assembled on the back frame 21 in a direct view, which is helpful for assembly alignment and saves assembly time.
  • the outer frame unit 2 only surrounds the accommodation space 20 by the back frame 21 .
  • the outer frame unit 2 may include a back frame 21 and an upper frame 22 disposed on the back frame 21 .
  • the back frame 21 and the upper frame 22 together surround the accommodation space 20 .
  • the light-emitting unit 5 and the light guide plate 4 are limited in the accommodation space 20.
  • the second surface 512 of the flexible circuit board 51 is pressed against the upper frame 22.
  • the abutment structure 7 is resisted by the upper frame 22 and pushes against the flexible circuit board. 51.
  • the flexible circuit board 51 can be applied to different forms of outer frame units 2, thereby increasing the scope of application. Therefore, the outer frame unit 2 can use a single component of the back frame 21, which helps to reduce the inventory of multiple components and save management costs, or it can be composed of two components, the back frame 21 and the upper frame 22, and the light-emitting unit 5 can be pre-assembled.
  • the upper frame 22 is easy to see directly, which helps in assembly alignment and saves assembly time. If rework is needed, the upper frame 22 can be simply replaced without replacing the entire back frame 21, so this should not be used. The description of the examples is limited.
  • a second preferred embodiment of the backlight module B of the present invention is roughly the same as the first preferred embodiment.
  • the outer frame unit 2 includes a back frame 21, and the back frame 21 also has a structure for carrying a light guide plate.
  • the bearing section 211 of 4, the connecting section 212 connected to the bearing section 211 and the extension section 213 connected to the connecting section 212 and extending in the same direction as the bearing section 211, the bearing section 211, the connecting section 212 and the extension section 213 together surround the accommodation Space 20.
  • the light-emitting unit 5 and the light guide plate 4 are limited in the accommodation space 20 .
  • the difference between the second preferred embodiment and the first preferred embodiment is that the resisting structure 7 is a protruding structure formed on the extension section 213 of the back frame 21 of the outer frame unit 2 .
  • the fixing glue 6 is also first used to couple the light guide plate 4 to the first surface 511 of the flexible circuit board 51 .
  • the light guide plate 4 and the light emitting unit 5 are placed and limited in the accommodating space 20 .
  • the second surface 512 of the flexible circuit board 51 is pressed against the extended section 213 of the back frame 21 , so the abutment structure 7 located at the extended section 213 will push against the flexible circuit board 51 , causing the The position of the flexible circuit board 51 corresponding to the abutment structure 7 is deformed. Since the resisting structure 7 is arranged corresponding to the position of the light-emitting element 52 , the position of the light-emitting element 52 relative to the light guide plate 4 can be adjusted to align with the light incident surface 41 of the light guide plate 4 .
  • the light-emitting unit 5 has an inverse assembly design, so the abutment structure 7 is formed on the extension section 213 and pushes against the second surface 512 of the flexible circuit board 51 .
  • the abutment structure 7 is formed on the load-bearing section 211 of the back frame 21 , and the light-emitting unit 5 is of a positive assembly design, and the second surface 512 of the flexible circuit board 51 abuts In the carrying section 211 , the abutting structure 7 can abut the flexible circuit board 51 , and further push the light-emitting element 52 to align with the light incident surface 41 of the light guide plate 4 .
  • the forward assembly method shown in FIG. 8 also allows the light-emitting unit 5 to be easily assembled on the back frame 21 in a direct view, which is helpful for assembly alignment and saves assembly time.
  • the outer frame unit 2 may include a back frame 21 and an upper frame 22 disposed on the back frame 21 .
  • the back frame 21 and the upper frame 22 together surround the accommodation space 20 .
  • the light-emitting unit 5 and the light guide plate 4 are limited in the accommodation space 20 .
  • the second surface 512 of the flexible circuit board 51 abuts the upper frame 22 .
  • the abutment structure 7 is formed on the upper frame 22 to push the flexible circuit board 51 . In this way, the flexible circuit board 51 can be applied to different forms of outer frame units 2, thereby increasing the scope of application.
  • the outer frame unit 2 can use a single component of the back frame 21, which helps to reduce the inventory of multiple components and save management costs, or it can be composed of two components, the back frame 21 and the upper frame 22, so that the light-emitting unit 5 can be pre-assembled. It is assembled on the upper frame 22 that is easy to see directly, which helps in assembly alignment and saves assembly time. If rework is needed, the upper frame 22 can be simply replaced without replacing the entire back frame 21, so it should not be replaced with The description of this embodiment is limited.
  • the abutment structure 7 is directly formed on the back frame 21. Therefore, the abutment structure 7 can be formed at the same time when the back frame 21 is manufactured. This can reduce the processing procedures and reduce the manufacturing cost in the entire manufacturing process. cost.
  • a display panel 8 is provided on the backlight module B of each of the aforementioned preferred embodiments, which is the display device D as shown in FIG. 10 .
  • the backlight module B and the display device D of the present invention can correspondingly compensate for the fixing glue 6 by making the abutment structure 7 abut against the flexible circuit board 51 through the second surface 512 of the flexible circuit board 51 .
  • thickness so that the flexible circuit board 51 can be deformed at a specific position, and the position of the light-emitting element 52 relative to the light guide plate 4 can be adjusted, so that the light-emitting element 52 can be aligned with the light incident surface 41 of the light guide plate 4 to improve the height of the light guide plate 4
  • the coupling effect with the light-emitting element 52 prevents light from leaking from the light-emitting surface of the light guide plate 4 close to the light-emitting element 52 , reduces the risk of light leakage caused by the generation of bright lines, and improves the overall uniform brightness, thus achieving the purpose of the present invention.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Planar Illumination Modules (AREA)
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Abstract

一种背光模组（B）和显示装置，背光模组（B）包含外框单元（2）、设置于外框单元（2）内的导光板（4）、发光单元（5）、将发光单元（5）固定于导光板（4）上的多个固定胶（6）及多个抵靠结构（7）。发光单元（5）包括软性电路板（51）及间隔设置于软性电路板（51）上的多个发光件（52）。通过抵靠结构（7）使软性电路板（51）在特定位置产生形变，而能调整发光件（52）相对于导光板（4）的位置，使发光件（52）可以对准导光板（4）的入光面，由此避免光线由导光板（4）的出光面靠近发光件（52）的位置漏出，减少亮线的产生，提高整体匀亮度。

Description

背光模组及显示装置
本申请要求享有于2022年8月22日提交的申请号为202211004675.4、发明名称为“背光模组及显示器”的中国专利申请的优先权，在此通过引用将其全部内容结合于本申请中。
技术领域
本发明涉及一种光学装置，特别是涉及一种能提高整体匀亮度的背光模组及显示装置。
背景技术
一般的背光模组包含光源、框架以及导光板。光源包括电路板以及设置在电路板上的发光二极管。导光板设置在发光二极管旁，且导光板的入光面贴合发光二极管的出光面或是只存在一个很小的间隙，藉此可有效利用发光二极管的光线。
在某些型态的背光模组中，进行组装时会利用胶带将导光板固定于电路板上，由于胶带具有一定的厚度，使导光板无法服贴于电路板上，导致发光二极管的出光面无法完全对合于导光板的入光面的中心轴，由此引起导光板的出光面靠近发光二极管处有漏光的风险，容易出现亮带或亮度不均的问题，影响背光模组的光学品味。
发明内容
因此，本发明的目的在于提供一种能避免漏光问题的背光模组。
背光模组包含外框单元、设置于外框单元内且具有入光侧的导光板、发光单元、将发光单元固定于导光板上的多个固定胶及多个抵靠结构。发光单元包括软性电路板及间隔设置于软性电路板上的多个发光件。软性电路板具有第一表面及相反于第一表面的第二表面，发光件设置于第一表面 并朝向导光板的入光侧散发光线。多个固定胶间隔设置，每一发光件对应于两个相邻的固定胶之间。抵靠结构对应发光件的位置设置，并经由软性电路板的第二表面抵靠于软性电路板，以使软性电路板于抵靠结构的位置产生形变。
本发明的另一技术手段，在于抵靠结构为形成于软性电路板的第二表面的凸出结构。
本发明的另一技术手段，在于外框单元包括背框，背框具有用以承载导光板的承载段，软性电路板的第二表面贴抵于承载段，抵靠结构受到承载段的顶抵而推抵软性电路板。
本发明的另一技术手段，在于外框单元包括背框，背框具有用以承载导光板的承载段、连接于承载段的连接段及连接于连接段且与承载段同向延伸的延伸段，承载段、连接段及延伸段共同围绕出容置空间，发光单元及导光板限位于容置空间内，软性电路板的第二表面贴抵于延伸段，抵靠结构受到延伸段的顶抵而推抵软性电路板。
本发明的另一技术手段，在于外框单元包括背框及设置于背框上的上框，背框与上框共同围绕出容置空间，发光单元及导光板限位于容置空间内，软性电路板的第二表面贴抵于上框，抵靠结构受到上框的顶抵而推抵软性电路板。
本发明的另一技术手段，在于抵靠结构为形成于外框单元上的凸出结构。
本发明的另一技术手段，在于外框单元包括背框，背框具有用以承载导光板的承载段，软性电路板的第二表面贴抵于承载段，抵靠结构形成于承载段上而抵靠软性电路板。
本发明的另一技术手段，在于外框单元包括背框，背框具有用以承载导光板的承载段、连接于承载段的连接段及连接于连接段且与承载段同向延伸的延伸段，承载段、连接段及延伸段共同围绕出容置空间，发光单元及导光板限位于容置空间内，软性电路板的第二表面贴抵于延伸段，抵靠结构形成于延伸段上而抵靠软性电路板。
本发明的另一技术手段，在于外框单元包括背框及设置于背框上的上 框，背框与上框共同围绕出容置空间，发光单元及导光板限位于容置空间内，软性电路板的第二表面贴抵于上框，抵靠结构形成于上框上而推抵软性电路板。
本发明的另一技术手段，在于软性电路板的第一表面具有用以设置固定胶的多个固定区及用以设置发光件的多个设置区，固定区与设置区非共平面。
本发明的另一技术手段，在于软性电路板的第一表面于抵靠结构的位置形成凸起而与固定胶的表面形成共平面。
本发明的另一目的，在于提供一种显示装置，包含如前所述的背光模组及设置于背光模组上的显示面板。
本发明的功效在于，通过抵靠结构经由软性电路板的第二表面抵靠于软性电路板，可对应补偿固定胶的厚度，以使软性电路板在特定位置产生形变，而能调整发光件相对于导光板的位置，使发光件可以对准导光板的入光面，以提高导光板与发光件之间的耦合效果，避免光线由导光板的出光面靠近发光件的位置漏出而发生漏光风险，减少亮线的产生，提高整体匀亮度。如此一来，可有助于减小显示装置的整体厚度，以符合显示装置的薄化趋势，应用于超薄化机种设计。
附图说明
为了更完整地了解实施例及其优点，现在参照附图做出下列描述，其中：
图1是本发明的背光模组的第一较佳实施例的立体图；
图2是说明第一较佳实施例的内部结构的立体分解图；
图3是说明第一较佳实施例中各元件之间的相对位置的局部剖示图，其中，发光单元为反组式设计；
图4是说明第一较佳实施例的另一种形态的局部剖示图，其中，发光单元为正组式设计；
图5是说明第一较佳实施例的另一种形态的立体分解图，其中，外框单元包括上框及背框；
图6是本发明的背光模组的第二较佳实施例的立体分解图；
图7是说明第二较佳实施例中各元件之间的相对位置的局部剖示图，其中，发光单元为反组式设计；
图8是说明第二较佳实施例的另一种形态的局部剖示图，其中，发光单元为正组式设计；
图9是说明第二较佳实施例的另一种形态的立体分解图，其中，外框单元包括上框及背框；及
图10是本发明的显示装置的较佳实施例的立体图。
具体实施方式
有关本发明的相关申请专利特色与技术内容，在以下配合附图的较佳实施例的详细说明中，将可清楚的呈现。在进行详细说明之前，应注意的是，类似的元件以相同的附图标记来表示。
参阅图1及图2，为本发明的背光模组B的第一较佳实施例，包含外框单元2、设置于外框单元2上的反射片3、设置于外框单元2内且位于反射片3上的导光板4及发光单元5。
如图2所示，外框单元2包括背框21，背框21具有用以承载反射片3及导光板4的承载段211、连接于承载段211的连接段212及连接于连接段212且与承载段211同向延伸的延伸段213。承载段211、连接段212及延伸段213共同围绕出容置空间20。
如图2及图3所示，发光单元5包括软性电路板51及间隔设置于软性电路板51上的多个发光件52。参阅图3，软性电路板51具有第一表面511及相反于第一表面511的第二表面512，发光件52设置于第一表面511并朝向导光板4的入光面41散发光线。其中，发光单元5通过多个固定胶6固定于导光板4上。多个固定胶6间隔设置，而每一发光件52对应于两个相邻的固定胶6之间。
相较于习知技术中固定胶带连续延伸设置在导光板的入光面而非间隔设置的方式，因此其反而容易产生入光处的延伸亮线问题，同时辉度也会有所下降。再者，固定胶带时如有气泡产生，也会造成入光亮暗不均。本 实施例所揭露的背光模组B未使用连续延伸的固定胶带，即可以避免上述提及的延伸亮线、辉度下降、入光亮暗不均等问题。
更详细地说，软性电路板51的第一表面511具有用于设置固定胶6的多个固定区513及用于设置发光件52的多个设置区514。
参阅图2及图3，背光模组B还包含多个抵靠结构7，抵靠结构7对应于发光件52的位置设置，并经由软性电路板51的第二表面512抵靠于软性电路板51，由此可对应补偿固定胶6的厚度，以使软性电路板51于抵靠结构7的位置产生形变，或者使软性电路板51于抵靠结构7的位置产生高度变化，而能调整发光件52相对于导光板4的位置，使发光件52对准至导光板4，以提高导光板4与发光件52之间的耦合效果，避免漏光风险的发生。如此一来，可有助于减小显示装置的整体厚度，以符合显示装置的薄化趋势，应用于超薄化机种设计。
于本实施例中，抵靠结构7为形成于软性电路板51的第二表面512的凸出结构。举例来说，抵靠结构7可以是于软性电路板51的第二表面512上利用油墨印刷、其他种类的材质或微结构形成的凸出结构，所以不应以本实施例的说明为限。
组装时，首先，利用固定胶6使导光板4结合于软性电路板51的第一表面511。接着，将导光板4与发光单元5放置并限位于容置空间20内。此时，如图3所示，软性电路板51的第二表面512贴抵于背框21的延伸段213，而由于抵靠结构7凸出于第二表面512，因此导光板4与发光单元5放置定位后，抵靠结构7会推抵软性电路板51，由此可对应补偿固定胶6的厚度，使软性电路板51在抵靠结构7的位置产生形变，或者使软性电路板51于抵靠结构7的位置产生高度变化。也就是说，软性电路板51在受到抵靠结构7推抵后，会使固定区513与设置区514形成非共平面。软性电路板51于抵靠结构7的位置(也就是设置区514)形成向下凸起而与固定胶6的表面形成共平面，同时使得位于设置区514的发光件52向下移动，进而调整发光件52相对于导光板4的位置以对准导光板4的入光面41，以提高导光板4与发光件52之间的耦合效果，避免漏光风险发生。
本发明藉由软性电路板51具有弹性的设计，再配合抵靠结构7的设 置，可以推抵软性电路板51上对应于发光件52的位置产生形变，以补偿固定胶6的厚度，调整发光件52相对于导光板4的位置，优化导光板4与发光件52的耦合效果，避免光线由导光板4的出光面的靠近发光件52的位置漏出，减少亮线的产生，提高整体匀亮度。如此一来，可有助于减小显示装置的整体厚度，以符合显示装置的薄化趋势，应用于超薄化机种设计。
如图2及图3所示，发光单元5为反组式设计(软性电路板51在上方，发光件52在下方)，因此软性电路板51的第二表面512受到抵靠结构7及其上方的延伸段213的顶抵，使得软性电路板51在抵靠结构7的位置产生向下变形，进而向下推抵发光件52以对准导光板4的入光面41。在某些实施例中，如图4所示，发光单元5也可以为正组式设计(软性电路板51在下方，发光件52在上方)，软性电路板51的第二表面512贴抵于背框21的承载段211，软性电路板51的第二表面512受到抵靠结构7及其下方的承载段211的顶抵，使得软性电路板51在抵靠结构7的位置产生向上变形，进而向上推抵发光件52以对准导光板4的入光面41。如此一来，不论背框21有无延伸段213，皆能配合软性电路板51进行组装，增加适用范围。除此之外，图4所示的正向组立方式，也可以使发光单元5以直视方式简便组装在背框21上，有助于组装对位，节省组装时间。
另外，要特别说明的是，在第一较佳实施例中，外框单元2如图2所示，只由背框21围绕出容置空间20。在某些实施例中，如图5所示，外框单元2可以包括背框21及设置于背框21上的上框22，背框21与上框22共同围绕出容置空间20。发光单元5及导光板4限位于容置空间20内，软性电路板51的第二表面512贴抵于上框22，抵靠结构7受到上框22的顶抵而推抵软性电路板51。藉此，使软性电路板51可以应用于不同形态的外框单元2，增加适用范围。因此，外框单元2可以采用单一部材的背框21，有助于减少多种部材的库存，节省管理成本，或由背框21与上框22两个部材组成，发光单元5便可以预先组装在容易直视的上框22，这有助于组装对位，节省组装时间，如需重工时也可以简单替换掉上框22，而不需连同整体背框21全部替换，所以不应以本实施例的说明为限。
参阅图6，为本发明的背光模组B的第二较佳实施例，其与第一较佳实施例大致相同，外框单元2包括背框21，背框21同样具有用以承载导光板4的承载段211、连接于承载段211的连接段212及连接于连接段212且与承载段211同向延伸的延伸段213，承载段211、连接段212及延伸段213共同围绕出容置空间20。发光单元5及导光板4限位于容置空间20内。第二较佳实施例与第一较佳实施例的不同处在于：抵靠结构7为形成于外框单元2的背框21的延伸段213上的凸出结构。
参阅图6及图7，在本较佳实施例中进行组装时，同样是首先利用固定胶6使导光板4结合于软性电路板51的第一表面511。接着，将导光板4与发光单元5放置并限位于容置空间20内。此时，如图7所示，软性电路板51的第二表面512贴抵于背框21的延伸段213，因此位于延伸段213的抵靠结构7会推抵软性电路板51，使软性电路板51的对应于抵靠结构7的位置产生形变。由于抵靠结构7对应发光件52的位置设置，因此可以调整发光件52相对于导光板4的位置，以对准导光板4的入光面41。
如图7所示，发光单元5为反组式设计，因此抵靠结构7形成于延伸段213上并推抵软性电路板51的第二表面512。在某些实施例中，如图8所示，抵靠结构7形成于背框21的承载段211上，而发光单元5为正组式设计，软性电路板51的第二表面512贴抵于承载段211，使得抵靠结构7可以顶抵软性电路板51，进而推抵发光件52以对准导光板4的入光面41。因此，不论背框21有无延伸段213，皆能配合软性电路板51进行组装，增加适用范围。除此之外，图8所示的正向组立方式，也可以使发光单元5以直视方式简便组装在背框21上，有助于组装对位，节省组装时间。
在某些实施例中，如图9所示，外框单元2可以包括背框21及设置于背框21上的上框22，背框21与上框22共同围绕出容置空间20。发光单元5及导光板4限位于容置空间20内，软性电路板51的第二表面512贴抵于上框22，抵靠结构7形成于上框22而推抵软性电路板51。藉此，使软性电路板51可以应用于不同形态的外框单元2，增加适用范围。因此，外框单元2可以采用单一部材的背框21，有助于减少多种部材的库存，节省管理成本，或是由背框21与上框22两个部材组成，发光单元5便可以 预先组装在容易直视的上框22，这有助于组装对位，节省组装时间，如需重工时也可以简单替换掉上框22，而不需连同整体背框21全部替换，所以不应以本实施例的说明为限。
于第二较佳实施例中，抵靠结构7直接形成于背框21上，因此在背框21制造时就可以同时成型出抵靠结构7，在整个制造流程上可以减少加工程序，降低制造成本。
于前述各较佳实施例的背光模组B上设置显示面板8，即为如图10所示的显示装置D。
综上所述，本发明的背光模组B及显示装置D，通过使抵靠结构7经由软性电路板51的第二表面512抵靠于软性电路板51，可对应补偿固定胶6的厚度，以使软性电路板51在特定位置产生形变，而能调整发光件52相对于导光板4的位置，使发光件52可以对准导光板4的入光面41，以提高导光板4与发光件52之间的耦合效果，避免光线由导光板4的出光面靠近发光件52的位置漏出，减少亮线的产生而发生漏光风险，提高整体匀亮度，确实能达成本发明的目的。
以上所述仅为本发明的较佳实施例，应当不能以此限定本发明实施的范围，即大凡依本发明的权利要求范围及说明内容所作的简单的等效变化与修饰，皆仍属本发明的专利涵盖范围内。
【附图标记列表】
B       背光模组
D       显示装置
2       外框单元
20      容置空间
21      背框
211     承载段
212     连接段
213     延伸段
22      上框
3       反射片
4       导光板
41      入光面
5       发光单元
51      软性电路板
511     第一表面
512     第二表面
513     固定区
514     设置区
52      发光件
6       固定胶
7       抵靠结构
8       显示面板。

Claims (12)

  1. 一种背光模组，包含：
    外框单元；
    导光板，其设置于所述外框单元内，所述导光板具有入光侧；
    发光单元，其包括软性电路板及间隔设置于所述软性电路板上的多个发光件，所述软性电路板具有第一表面及相反于所述第一表面的第二表面，所述发光件设置于所述第一表面并朝向所述导光板的入光侧散发光线；
    多个固定胶，其用以将所述软性电路板固定于所述导光板上，所述多个固定胶间隔设置，每一发光件对应于两个相邻的固定胶之间；及
    多个抵靠结构，其对应所述发光件的位置设置，并经由所述软性电路板的所述第二表面抵靠于所述软性电路板，以使所述软性电路板于所述抵靠结构的位置产生形变。
  2. 根据权利要求1所述的背光模组，其中，所述抵靠结构为形成于所述软性电路板的第二表面的凸出结构。
  3. 根据权利要求2所述的背光模组，其中，所述外框单元包括背框，所述背框具有用以承载所述导光板的承载段，所述软性电路板的所述第二表面贴抵于所述承载段，所述抵靠结构受到所述承载段的顶抵而推抵所述软性电路板。
  4. 根据权利要求2所述的背光模组，其中，所述外框单元包括背框，所述背框具有用以承载所述导光板的承载段、连接于所述承载段的连接段及连接于所述连接段且与所述承载段同向延伸的延伸段，所述承载段、所述连接段及所述延伸段共同围绕出容置空间，所述发光单元及所述导光板限位于所述容置空间内，所述软性电路板的所述第二表面贴抵于所述延伸段，所述抵靠结构受到所述延伸段的顶抵而推抵所述软性电路板。
  5. 根据权利要求2所述的背光模组，其中，所述外框单元包括背框及设置于所述背框上的上框，所述背框与所述上框共同围绕出容置空间，所述发光单元及所述导光板限位于所述容置空间内，所述软性电路板的所述第二表面贴抵于所述上框，所述抵靠结构受到所述上框的顶抵而推抵所述 软性电路板。
  6. 根据权利要求1所述的背光模组，其中，所述抵靠结构为形成于所述外框单元上的凸出结构。
  7. 根据权利要求6所述的背光模组，其中，所述外框单元包括背框，所述背框具有用以承载所述导光板的承载段，所述软性电路板的所述第二表面贴抵于所述承载段，所述抵靠结构形成于所述承载段上而抵靠所述软性电路板。
  8. 根据权利要求6所述的背光模组，其中，所述外框单元包括背框，所述背框具有用以承载所述导光板的承载段、连接于所述承载段的连接段及连接于所述连接段且与所述承载段同向延伸的延伸段，所述承载段、所述连接段及所述延伸段共同围绕出容置空间，所述发光单元及所述导光板限位于所述容置空间内，所述软性电路板的所述第二表面贴抵于所述延伸段，所述抵靠结构形成于所述延伸段上而抵靠所述软性电路板。
  9. 根据权利要求6所述的背光模组，其中，所述外框单元包括背框及设置于所述背框上的上框，所述背框与所述上框共同围绕出容置空间，所述发光单元及所述导光板限位于所述容置空间内，所述软性电路板的所述第二表面贴抵于所述上框，所述抵靠结构形成于所述上框上而推抵所述软性电路板。
  10. 根据权利要求1至9中任一项所述的背光模组，其中，所述软性电路板的所述第一表面具有用以设置所述固定胶的多个固定区及用以设置所述发光件的多个设置区，所述固定区与所述设置区非共平面。
  11. 根据权利要求1至9中任一项所述的背光模组，其中，所述软性电路板的所述第一表面于所述抵靠结构的位置形成凸起而与所述固定胶的表面形成共平面。
  12. 一种显示装置，包括根据权利要求1至11中任一项所述的背光模组及设置于所述背光模组上的显示面板。
PCT/CN2022/125838 2022-08-22 2022-10-18 背光模组及显示装置 WO2024040725A1 (zh)

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