WO2024040627A1 - 疏水图案化胶带及其制作方法 - Google Patents

疏水图案化胶带及其制作方法 Download PDF

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Publication number
WO2024040627A1
WO2024040627A1 PCT/CN2022/115895 CN2022115895W WO2024040627A1 WO 2024040627 A1 WO2024040627 A1 WO 2024040627A1 CN 2022115895 W CN2022115895 W CN 2022115895W WO 2024040627 A1 WO2024040627 A1 WO 2024040627A1
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WIPO (PCT)
Prior art keywords
layer
patterned
hydrophobic
tape
plate body
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PCT/CN2022/115895
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English (en)
French (fr)
Inventor
高晓宇
李硕
Original Assignee
北京华卓精科科技股份有限公司
北京优微精密测控技术研究有限公司
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Publication of WO2024040627A1 publication Critical patent/WO2024040627A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/20—Sealing arrangements characterised by the shape
    • B60J10/27—Sealing arrangements characterised by the shape having projections, grooves or channels in the longitudinal direction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape

Definitions

  • the present disclosure relates to the technical field of sealing equipment, and in particular to a hydrophobic patterned tape and a manufacturing method thereof.
  • tapes are usually arranged in a flat belt structure, which serves as a sealing member and can be used to seal holes or gaps in components to be sealed.
  • a flat belt structure which serves as a sealing member and can be used to seal holes or gaps in components to be sealed.
  • the tape seals a gap between the upper surfaces of two parts to be sealed with a height difference, its sealing effect is poor.
  • the tape in the related art has a problem of poor sealing effect on the gap between the two parts to be sealed where there is a height difference.
  • this application proposes a hydrophobic patterned tape and a manufacturing method thereof, which solves the problem of the tape having poor sealing effect on the gap between two parts to be sealed with a height difference.
  • the hydrophobic patterned tape of the present disclosure includes: a patterned layer having an upper surface and a lower surface, the patterned layer having a ladder structure; a hydrophobic film layer disposed on the upper surface of the patterned layer; and an adhesive layer disposed on the pattern on the lower surface of the chemical layer; and a release film layer, arranged on the adhesive layer; and a hydrophobic protective layer, arranged on the hydrophobic film layer.
  • the patterned layer includes a patterned body layer.
  • the patterned main layer can not only enable the adhesive layer provided on its lower surface to bond and seal the gap between the upper end surfaces of the two adjacent parts to be sealed with a height difference, but also can enhance the hydrophobic patterning.
  • the overall strength of the tape This ensures that the hydrophobic patterned tape has better applicability and stronger sealing ability.
  • the patterned layer includes a planar body layer and a patterned film layer disposed on the planar body layer.
  • the planar main layer and the patterned film layer can not only enable the adhesive layer provided on the lower surface thereof to bond and seal the gap between the upper end surfaces with a height difference on the two adjacent components to be sealed, but also can Enhances the overall strength of hydrophobic patterned tapes. This ensures that the hydrophobic patterned tape has better applicability and stronger sealing ability.
  • the hydrophobic patterned tape is provided with a first positioning hole, the first positioning hole penetrates the hydrophobic protective layer, and the first positioning hole is used for bonding and positioning the hydrophobic patterned tape and the component to be sealed.
  • the first positioning hole provided on the hydrophobic film layer can be aligned with the positioning structure on the component to be sealed, thereby ensuring that the glue layer provided on the patterned layer can cover the stepped surface formed on the component to be sealed, thereby Ensure that the hydrophobic patterned tape can seal and bond the gap between the upper end surfaces of two adjacent parts to be sealed that have a height difference.
  • the glue layer is a stepped plate structure.
  • the stepped plate structure includes: a first plate body; a second plate body, one end of which is bent and connected to the first plate body; and a third plate body, which is connected to the second plate body. The other end is bent and connected; wherein, the first plate body and the third plate body are arranged in parallel, and are respectively located on opposite sides of the second plate body.
  • the glue layer is a stepped plate structure.
  • the stepped plate structure includes: a first plate body; and a second plate body, which is arranged parallel to the first plate body, and the second plate body and the first plate body are in a first direction. Stagger settings upward.
  • the present disclosure also provides a tape making method, which is used to make the above-mentioned hydrophobic patterned tape.
  • the tape making method includes: making a patterned layer;
  • the upper surface of the patterned layer is hydrophobized to form a hydrophobic film layer
  • hydrophobic surface of the hydrophobic film layer is attached with a hydrophobic protective layer
  • Glue is attached to the lower surface of the patterned layer to form a glue layer
  • a release film is attached to the adhesive surface of the adhesive layer to form a release film layer.
  • making the patterned layer includes the following steps:
  • a patterned photoresist layer is left after the first development
  • a vacuum coating method is used to deposit a film layer.
  • making the patterned layer includes the following steps:
  • a patterned photoresist layer is left on the silicon wafer after development
  • the template solution is cross-linked and solidified to form a template
  • the template is removed to obtain the patterned main layer.
  • the present disclosure provides a hydrophobic patterned tape and a method for making the tape. Compared with the existing technology, it has at least the following beneficial effects:
  • the adhesive layer disposed on its lower surface can bond and cover the bonding surfaces with height differences on the components to be sealed, thereby sealing the upper surfaces with height differences on the two adjacent components to be sealed.
  • the gap between the end faces This further expands the scope of application of the hydrophobic patterned tape.
  • the problem in the related art that the tape with a flat belt structure has a poor sealing effect on the gap between two parts to be sealed with a height difference is solved.
  • Figure 1 shows a schematic structural diagram of the hydrophobic patterned tape according to Embodiment 1 of the present disclosure
  • Figure 2 shows a schematic structural diagram of the hydrophobic patterned tape according to Embodiment 2 of the present disclosure
  • Figure 3 shows a schematic structural diagram of the parts to be sealed using the hydrophobic patterned tape in Figures 1 and 2;
  • Figure 4a shows a schematic diagram of the bonding between the hydrophobic patterned tape according to Embodiment 1 of the present disclosure and the component to be sealed in Figure 3 (the hydrophobic protective film is not removed after positioning);
  • Figure 4b shows a schematic diagram of the bonding between the hydrophobic patterned tape according to Embodiment 1 of the present disclosure and the component to be sealed in Figure 3 (the hydrophobic protective film is removed after positioning);
  • Figures 5a, 5b, 5c, 5d, 5e and 5f show a schematic diagram of the manufacturing process of the hydrophobic patterned tape according to Embodiment 1 of the present disclosure
  • Figures 6a, 6b, 6c, 6d, 6e, 6f and 6g show a schematic diagram of the manufacturing process of the hydrophobic patterned tape according to Embodiment 2 of the present disclosure.
  • the shape of the patterned layer 10 in the present disclosure is complementary to the pattern shape of the pre-bonded area (for example, the pattern shape of the pre-bonded area is stepped, and the shape of the patterned layer 10 is also stepped, to ensure that Cover the pre-bonded area).
  • “Patterned” in this disclosure means complementary to the pattern shape of the prebonded area.
  • the present disclosure provides a hydrophobic patterned tape 100 , which includes a patterned layer 10 , a hydrophobic film layer 20 , an adhesive layer 30 , a release film layer 40 and a hydrophobic protective layer 50 .
  • the patterned layer 10 has an upper surface 11 and a lower surface 12, and the patterned layer 10 has a ladder structure.
  • the hydrophobic film layer 20 is provided on the upper surface 11 of the patterned layer 10
  • the glue layer 30 is provided on the lower surface 12 of the patterned layer 10
  • the hydrophobic protective layer 50 is provided on the hydrophobic film layer 20 .
  • the glue layer 30 disposed on its lower surface 12 can bond and cover the bonding surface 201 with a height difference on the component 200 to be sealed, thereby sealing two adjacent ones.
  • the bonding surface 201 in this disclosure is a stepped surface (bonding surface 201), including the upper end surfaces 2011 of two adjacent components to be sealed 200 and the higher component to be sealed 200 is higher than the other one. Side surface 2012 of the portion of component 200 to be sealed.
  • the step structure in the hydrophobic patterned tape 100 is designed to exactly match the step surface to meet the high adhesion requirements of the adhesive surface 201 for the tape.
  • the hydrophobic patterned tape 100 only needs to expand the required bonding gap 300 or the hole area by 10% to 20%.
  • the stepped plate structure may include a first plate body, a second plate body and a third plate body.
  • One end of the second plate body is bent and connected to the first plate body
  • the third plate body is bent and connected to the other end of the second plate body.
  • the first plate body and the third plate body are arranged in parallel, and are respectively located on opposite sides of the second plate body.
  • the glue layer has a stepped plate structure
  • the stepped plate structure includes a first plate body and a second plate body, wherein the second plate body is arranged parallel to the first plate body, The second plate body and the first plate body are staggered in the first direction (the vertical direction in Figures 1 and 2).
  • the first plate body and the second plate body are respectively disposed on the lower surface of the patterned layer.
  • the lower surface 12 of the patterned layer 10 includes a first surface, a second surface and a third surface.
  • the first surface is parallel to the third surface
  • the second surface is parallel to the first surface.
  • the first plate body is arranged on the first surface
  • the second plate body is arranged on the second surface
  • the third plate body is arranged on the third surface.
  • the patterned layer 10 includes a patterned body layer 14 .
  • the patterned body layer 14 can not only enable the glue layer 30 provided on its lower surface to bond and seal the gap 300 between the upper end surfaces of the two adjacent components 200 to be sealed with a height difference, but also can strengthen the Overall strength of hydrophobic patterned tape 100. This ensures that the hydrophobic patterned tape 100 has better applicability and stronger sealing ability.
  • the hydrophobic protective layer 50 is provided with a first positioning hole 60, and the first positioning hole 60 is used for bonding the hydrophobic patterned tape 100 to the component to be sealed 200. position.
  • the first positioning hole 60 provided on the hydrophobic protective layer 50 can be aligned with the positioning structure on the component 200 to be sealed, thereby ensuring that the glue layer 30 provided on the patterned layer 10 can cover the components formed on the component 200 to be sealed.
  • the stepped surface ensures that the hydrophobic patterned tape 100 can bond and seal the gap 300 between the upper end surfaces of two adjacent components 200 to be sealed that have a height difference.
  • Embodiment 2 The differences between Embodiment 2 and Embodiment 1 are as follows:
  • the patterned layer 10 includes a planar body layer 17 and a patterned film layer 13 disposed on the planar body layer 17 .
  • the planar body layer 17 and the patterned film layer 13 can both enable the glue layer 30 provided on its lower surface to bond and seal the gap between the upper end surfaces of the two adjacent components 200 to be sealed that have a height difference. 300, and can enhance the overall strength of the hydrophobic patterned tape 100. This ensures that the hydrophobic patterned tape 100 has better applicability and stronger sealing ability.
  • the present disclosure also provides an adhesive tape manufacturing method for manufacturing the hydrophobic patterned adhesive tape 100 in Embodiment 1.
  • the tape making method includes the following steps:
  • the first step is to make the patterned layer 10;
  • the second step is to roughen both sides of the patterned layer 10;
  • the third step is to hydrophobicize the upper surface 11 of the patterned layer 10 to form a hydrophobic film layer 20;
  • a hydrophobic protective layer 50 is attached to the hydrophobic surface of the hydrophobic film layer 20;
  • glue is attached to the lower surface 12 of the patterned layer 10 to form the glue layer 30;
  • a release film is attached to the adhesive surface of the adhesive layer 30 to form a release film layer 40 .
  • making the patterned layer includes the following steps (refer to Figures 5a to 5f):
  • a photoresist layer 500 is coated on the silicon wafer 15 (refer to Figure 5b);
  • the prepared mask 400 is placed in the shielding area for UV exposure (refer to Figure 5c);
  • a patterned photoresist layer 500 is left on the silicon wafer after development
  • the fourth step is to invert the template solution on the patterned photoresist layer 500 and perform ultraviolet exposure;
  • the template solution is cross-linked and solidified to form template 600 (refer to Figure 5d);
  • the sixth step is to tear off the template 600 and apply the solution of the patterned body layer 14 on the template 600 (refer to Figure 5e, after the solution coating is completed, the template 600 is inverted on the patterned photoresist layer 500);
  • the template 600 is removed to obtain the patterned body layer 14 (refer to FIG. 5f).
  • the pattern on the mask 400 is opposite to the target pattern.
  • the present disclosure also provides an adhesive tape production method for producing the hydrophobic patterned adhesive tape in Embodiment 2.
  • the tape making method includes the following steps:
  • the first step is to make the patterned layer 10;
  • the second step is to roughen both sides of the patterned layer 10;
  • the third step is to hydrophobicize the upper surface of the patterned layer 10 to form a hydrophobic film layer 20;
  • a hydrophobic protective layer 50 is attached to the hydrophobic surface of the hydrophobic film layer 20;
  • glue is attached to the lower surface 12 of the patterned layer 10 to form the glue layer 30;
  • a release film is attached to the adhesive surface of the adhesive layer 30 to form a release film layer 40 .
  • making the patterned layer 10 includes the following steps (refer to Figures 6a to 6g):
  • the photoresist layer 500 is coated on the surface of the body layer 16 (refer to Figure 6b);
  • the prepared mask 400 is placed in the shielding area for the first UV exposure (refer to Figure 6c);
  • a patterned photoresist layer 500 is left after the first development (refer to Figure 6d);
  • the fourth step is to perform a second UV exposure on the patterned photoresist layer 500 (refer to Figure 6e);
  • the fifth step is to deposit a film layer 700 on the surface of the patterned photoresist layer 500 and the body layer after the second UV exposure (refer to Figure 6f);
  • the sixth step is to leave the main body layer 16 and the patterned film layer 13 after the second development (refer to Figure 6g);
  • the pattern on the mask 400 is opposite to the target pattern.
  • a vacuum coating method is used to coat the patterned photoresist layer 500 on the surface.
  • a film layer is deposited on the surface of the resist layer 500 and the main body layer.
  • main body layer 16 in the fourth embodiment is the planar main layer 17 in the second embodiment.
  • the present disclosure also provides a method for using the tape.
  • the method for using the tape includes:
  • the second step is the positioning of the hydrophobic patterned tape 100 and the component to be sealed 200;
  • the hydrophobic patterned tape 100 is bonded to the component to be sealed 200;
  • the fourth step is to remove the hydrophobic protective layer 50 of the hydrophobic patterned tape 100 .
  • the component to be sealed 200 is provided with a second positioning hole 202, and the positioning of the hydrophobic patterned tape 100 and the component to be sealed 200 includes the following steps:
  • a positioning pin is inserted into the second positioning hole 202 and the first positioning hole 60 .
  • the present disclosure prepares the hydrophobic patterned tape 100 through a simple method (the preparation method in Embodiments 3 and 4), and realizes the hydrophobic treatment through the patterned main material (patterned layer 10) and the surface. It compensates for the height difference between the connecting parts (two adjacent parts to be sealed 200) and prevents external impurities such as particles, moisture, etc. from entering the interior of the parts, and also prevents liquid from leaking from the adjacent interfaces. In the sealing of parts It has application potential in the field of water and waterproofing.
  • hydrophobic patterned tape 100 in the present disclosure is used to seal gaps 300 between different components or defects such as holes on the upper surfaces of components, and can make up for the height difference (more) between different components through patterned design. There is a height difference between the upper end surfaces 2011 of two adjacent parts 200 to be sealed).
  • the patterned design of the hydrophobic patterned tape 100 can be formed on the main material (the patterned main layer 14 in the second embodiment) through photolithography, electroplating, evaporation, vapor deposition and other solutions (the method in Embodiment 4). ) is deposited with a patterned film layer 13 on top.
  • Patterned host material preparation can also be achieved through a template method (the method in Embodiment 3).
  • This patterned body material (the patterned body layer 14 in Embodiment 1) forms a complementary shape to the shape of the bonding part, and is used to compensate for the height difference between bonding surfaces of different heights, thereby achieving improved surface flatness. promote.
  • the main material (patterned main layer 14) prepares a hydrophobic film layer 20 on the surface through spraying, vapor deposition, magnetron sputtering and other processes.
  • the hydrophobic film layer 20 is generally low surface energy polysiloxane, fluorine Composite films of alkyl siloxanes, fluoropolymers and their nanoparticles, with thicknesses ranging from tens of nanometers to hundreds of nanometers.
  • the hydrophobic surface is often covered with a thin transparent protective film.
  • the other side of the patterned main layer 14 is covered with a stable and adhesive layer 30 for adhering the adhesive tape.
  • a release film layer 40 is added to the surface of the adhesive layer 30, so that the hydrophobic patterned tape 100 is easier to detach and stick.
  • the prepared hydrophobic patterned tape 100 can be aligned and adhered to the second positioning hole 202 of the bonded component (the component to be sealed 200 ) through the first positioning hole 60 . As shown in Figure 3, there is a gap 300 between the bonded components and a certain height difference.
  • the pattern of the patterned body layer 14 of the hydrophobic patterned tape 100 is designed according to the gaps 300 or holes of the components to be adhered, and the convex areas of the hydrophobic patterned tape 100 and the recessed areas of the bonding components are complementary, and the two are complementary through
  • the positioning holes (the first positioning hole 60 and the second positioning hole 202) are aligned and pasted, the release film layer 40 and the hydrophobic protective layer 50 are removed, and the hydrophobic patterned tape 100 is tightly bonded to the component to be sealed 200. That's it.
  • the result is a surface that is hydrophobic and more planar.
  • the hydrophobic patterned tape 100 in the present disclosure can solve the following technical problems:
  • the hydrophobic patterned tape 100 is hydrophobic and has a contact angle greater than 90°, which solves the problem of the surface being wetted by water;
  • the hydrophobic patterned tape 100 can fill the hole defects on the surface of a single component and solve the problem of droplet leakage on the component's plane;
  • the hydrophobic patterned tape 100 can achieve sealing between components and solve the problem of water leakage on a plane composed of two or more components;
  • the surface roughness value of the hydrophobic workbench is very small, and the surface height difference is required to not exceed 20um.
  • the patterning process of the hydrophobic patterned tape 100 can make up for this small height difference.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)

Abstract

一种疏水图案化胶带(100)及其制作方法，疏水图案化胶带(100)包括：图案化层(10)，具有上表面(11)和下表面(12)，图案化层(10)为阶梯结构；疏水膜层(20)，设置在图案化层(10)的上表面(11)上；胶层(30)，设置在图案化层(10)的下表面(12)上；离型膜层(40)，设置在胶层(30)上；疏水保护层(50)，设置在疏水膜层(20)上。由于图案化层(10)为阶梯结构，这样设置在其下表面(12)上的胶层(30)能够粘接覆盖待密封部件(200)上存在高度差的粘接表面(201)，从而密封相邻的两个待密封部件(200)上存在高度差的上端面(2011)之间的缝隙(300)。进而扩大了疏水图案化胶带(100)的适用范围。同时解决了相关技术中平带结构的胶带对存在高度差的两个待密封部件(200)之间的缝隙(300)密封效果较差的问题。

Description

疏水图案化胶带及其制作方法
相关申请的交叉引用
本公开要求享有于2022年08月26日提交的中国专利申请CN202211030999.5的优先权，上述申请的全部内容通过引用并入本文中。
技术领域
本公开涉及密封设备技术领域，特别地涉及一种疏水图案化胶带及其制作方法。
背景技术
目前，胶带通常设置成平带结构，其作为密封件，能够用于密封待密封部件中的孔洞或缝隙。然而，当胶带密封存在高度差的两个待密封部件上表面之间的缝隙时，其密封效果较差。
以上也就是说，针对存在高度差的两个待密封部件之间的缝隙，相关技术中的胶带存在对其密封效果较差的问题。
发明内容
针对上述现有技术中的问题，本申请提出了一种疏水图案化胶带及其制作方法，解决了胶带存在的对存在高度差的两个待密封部件之间的缝隙密封效果较差的问题。
本公开的疏水图案化胶带，包括：图案化层，具有上表面和下表面，图案化层为阶梯结构；以及疏水膜层，设置在图案化层的上表面上；以及胶层，设置在图案化层的下表面上；以及离型膜层，设置在胶层上；以及疏水保护层，设置在疏水膜层上。
在一个实施方式中，图案化层包括图案化主体层。通过本实施方式，图案化主体层既能够使得设置在其下表面上的胶层粘接密封相邻的两个待密封部件上存在高度差的上端面之间的缝隙，又能够增强疏水图案化胶带的整体强度。从而确保疏水图案化胶带具有较好的适用性和较强的密封能力。
在一个实施方式中，图案化层包括平面主体层和设置在平面主体层上的图案化膜层。通过本实施方式，平面主体层和图案化膜层既能够使得设置在其下表面 上的胶层粘接密封相邻的两个待密封部件上存在高度差的上端面之间的缝隙，又能够增强疏水图案化胶带的整体强度。从而确保疏水图案化胶带具有较好的适用性和较强的密封能力。
在一个实施方式中，疏水图案化胶带上设置有第一定位孔，第一定位孔贯穿疏水保护层，第一定位孔用于疏水图案化胶带与待密封部件的粘接定位。通过本实施方式，疏水膜层上设置的第一定位孔能够与待密封部件上的定位结构对准，从而确保设置在图案化层上的胶层能够覆盖待密封部件上形成的阶梯面，从而确保疏水图案化胶带能够密封粘接密封相邻的两个待密封部件上存在高度差的上端面之间的缝隙。
在一个实施方式中，胶层为阶梯板结构，阶梯板结构包括：第一板体；以及第二板体，一端与第一板体弯折连接；以及第三板体，与第二板体的另一端弯折连；其中，第一板体与第三板体平行设置，且分别位于第二板体的相对设置的两侧。
在一个实施方式中，胶层为阶梯板结构，阶梯板结构包括：第一板体；以及第二板体，与第一板体平行设置，第二板体与第一板体在第一方向上错开设置。
本公开还提供了一种胶带制作方法，胶带制作方法用于制作上述的疏水图案化胶带，胶带制作方法包括：制作图案化层；
图案化层的双面粗糙化；
图案化层的上表面疏水化处理，以形成疏水膜层；
疏水膜层的疏水表面附上一层疏水保护层；
图案化层的下表面附胶，以形成胶层；
胶层的胶面上附离型膜，以形成离型膜层。
在一个实施方式中，制作图案化层包括以下步骤：
在主体层表面涂覆光刻胶层；
将制备好的掩膜板，放在遮挡区进行第一次紫外曝光；
第一次显影后留下图形化的光刻胶层；
对图形化的光刻胶层实施第二次紫外曝光；
在经过第二次紫外曝光后的图形化的光刻胶层和主体层表面上沉积一层膜层；
第二次显影后留下主体层和图案化膜层。
在一个实施方式中，在经过第二次紫外曝光后的图形化的光刻胶层和主体层表面上沉积一层膜层的步骤中，采用真空镀膜的方法沉积一层膜层。
在一个实施方式中，制作图案化层包括以下步骤：
在硅片上涂覆一层光刻胶层；
将制备好的掩膜板放在遮挡区进行紫外曝光；
显影后硅片上留下图案化的光刻胶层；
将模板溶液倒置在图案化的光刻胶层上，并进行紫外曝光；
模板溶液交联固化形成模板；
撕下模板，将图案化主体层的溶液涂敷在模板上；
图案化主体层的溶液固化后再去除模板，得到图案化主体层。
上述技术特征可以各种适合的方式组合或由等效的技术特征来替代，只要能够达到本公开的目的。
本公开提供的一种疏水图案化胶带及其胶带制作方法，与现有技术相比，至少具备有以下有益效果：
由于图案化层为阶梯结构，这样设置在其下表面上的胶层能够粘接覆盖待密封部件上存在高度差的粘接表面，从而密封相邻的两个待密封部件上存在高度差的上端面之间的缝隙。进而扩大了疏水图案化胶带的适用范围。同时解决了相关技术中平带结构的胶带对存在高度差的两个待密封部件之间的缝隙密封效果较差的问题。
附图说明
在下文中将基于实施例并参考附图来对本公开进行更详细的描述。其中：
图1显示了本公开实施例一的疏水图案化胶带结构示意图；
图2显示了本公开实施例二的疏水图案化胶带结构示意图；
图3显示了图1和图2中疏水图案化胶带用于密封的待密封部件的结构示意图；
图4a显示了本公开实施例一的疏水图案化胶带与图3中的待密封部件粘接示意图(定位后未去掉疏水保护膜)；
图4b显示了本公开实施例一的疏水图案化胶带与图3中的待密封部件粘接示意图(定位后去掉疏水保护膜)；
图5a、5b、5c、5d、5e和5f显示了本公开实施例一的疏水图案化胶带的制造过程示意图；
图6a、6b、6c、6d、6e、6f和6g显示了本公开实施例二的疏水图案化胶带的制造过程示意图。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例。
图中的附图标记为：
10、图案化层；11、上表面；12、下表面；13、图案化膜层；14、图案化主体层；15、硅片；16、主体层；17、平面主体层；20、疏水膜层；30、胶层；40、离型膜层；50、疏水保护层；60、第一定位孔；100、疏水图案化胶带；200、待密封部件；201、粘接表面；2011、上端面；2012、侧表面；202、第二定位孔；300、缝隙；400、掩膜板；500、光刻胶层；600、模板；700、膜层。
具体实施方式
下面将结合附图对本公开作进一步说明。
需要说明的是，本公开中的待密封部件200的数量为多个，且沿水平方向(不限于水平方向)间隔设置，多个待密封部件200中相邻的两个的上端面2011存在高度差，相邻两个待密封部件200的上端面2011之间形成待密封的缝隙300。
需要说明的是，本公开中的图案化层10的形状与预粘接面积的图案形状互补(比如预粘接面积的图案形状为阶梯状，图案化层10的形状也为阶梯状，以确保将预粘接面积覆盖)。本公开中的“图案化”是指与预粘接面积的图案形状互补。
如图1和图2所示，本公开提供了一种疏水图案化胶带100，其包括图案化层10、疏水膜层20、胶层30、离型膜层40和疏水保护层50。其中，图案化层10具有上表面11和下表面12，图案化层10为阶梯结构。疏水膜层20设置在图案化层10的上表面11上，胶层30设置在图案化层10的下表面12上，疏水保护层50设置在疏水膜层20上。
上述设置中，由于图案化层10为阶梯结构，这样设置在其下表面12上的胶 层30能够粘接覆盖待密封部件200上存在高度差的粘接表面201，从而密封相邻的两个待密封部件200上存在高度差的上端面2011之间的缝隙300。进而扩大了疏水图案化胶带100的适用范围。同时解决了相关技术中平带结构的胶带对存在高度差的两个待密封部件200之间的缝隙300密封效果较差的问题。
需要说明的是，本公开中的粘接表面201为阶梯面(粘接表面201)，包括相邻的两个待密封部件200的上端面2011和高度较高的待密封部件200高于另外一个待密封部件200部分的侧表面2012。疏水图案化胶带100中的阶梯结构设计成正好与阶梯面相配合，以满足粘接表面201对胶带的高贴合度要求。
需要说明的是，对于平面度要求较低或者本身平面度满足要求的情况下，疏水图案化胶带100只需要按照所要粘接缝隙300或者孔洞面积扩大10％～20％即可。
具体地，如图1和图2所示，阶梯板结构可包括第一板体、第二板体和第三板体。其中，第二板体的一端与第一板体弯折连接，第三板体与第二板体的另一端弯折连。其中，第一板体与第三板体平行设置，且分别位于第二板体的相对设置的两侧。
当然在本公开附图中未显示出的替代实施例中，胶层为阶梯板结构，阶梯板结构包括第一板体和第二板体，其中第二板体与第一板体平行设置，第二板体与第一板体在第一方向上(图1和图2的竖直方向)错开设置。第一板体和第二板体分别设置在图案化层的下表面上。
具体地，如图1和图2所示，图案化层10的下表面12包括第一表面、第二表面和第三表面，第一表面与第三表面相平行，第二表面与第一表面和第三表面垂直连接，第一板体设置在第一表面上、第二板体设置在第二表面上，第三板体设置在第三表面上。
实施例一
具体地，如图1所示，在一个实施例中，图案化层10包括图案化主体层14。
上述设置中，图案化主体层14既能够使得设置在其下表面上的胶层30粘接密封相邻的两个待密封部件200上存在高度差的上端面之间的缝隙300，又能够增强疏水图案化胶带100的整体强度。从而确保疏水图案化胶带100具有较好的适用性和较强的密封能力。
具体地，如图4a和4b所示，在一个实施例中，疏水保护层50上设置有第 一定位孔60，第一定位孔60用于疏水图案化胶带100与待密封部件200的粘接定位。
上述设置中，疏水保护层50上设置的第一定位孔60能够与待密封部件200上的定位结构对准，从而确保设置在图案化层10上的胶层30能够覆盖待密封部件200上形成的阶梯面，从而确保疏水图案化胶带100能够粘接密封相邻的两个待密封部件200上存在高度差的上端面之间的缝隙300。
实施例二
实施例二与实施例一具有区别点如下：
具体地，如图2所示，在一个实施例中，图案化层10包括平面主体层17和设置在平面主体层17上的图案化膜层13。
上述设置中，平面主体层17和图案化膜层13既能够使得设置在其下表面上的胶层30粘接密封相邻的两个待密封部件200上存在高度差的上端面之间的缝隙300，又能够增强疏水图案化胶带100的整体强度。从而确保疏水图案化胶带100具有较好的适用性和较强的密封能力。
实施例二与实施例一其他结构相同，不再此处赘述。
实施例三
本公开还提供了一种胶带制作方法，用于制作实施例一中的疏水图案化胶带100。胶带制作方法包括以下步骤：
第一步，制作图案化层10；
第二步，图案化层10的双面粗糙化；
第三步，图案化层10的上表面11疏水化处理，以形成疏水膜层20；
第四步，疏水膜层20的疏水表面附上一层疏水保护层50；
第五步，图案化层10的下表面12附胶，以形成胶层30；
第六步，胶层30的胶面上附离型膜，以形成离型膜层40。
具体地，在一个实施例中，制作图案化层包括以下步骤(参考图5a至图5f)：
第一步，在硅片15上涂覆一层光刻胶层500(参考图5b)；
第二步，将制备好的掩膜板400放在遮挡区进行紫外曝光(参考图5c)；
第三步，显影后硅片上留下图案化的光刻胶层500；
第四步，将模板溶液倒置在图案化的光刻胶层500上，并进行紫外曝光；
第五步，模板溶液交联固化形成模板600(参考图5d)；
第六步，撕下模板600，将图案化主体层14的溶液涂敷在模板600上(参考图5e，溶液涂敷完成后将模板600再倒置在图案化的光刻胶层500上)；
第七步，图案化主体层14的溶液固化后再去除模板600，得到图案化主体层14(参考图5f)。
其中，掩膜板400上的图案与目标图案相反。
实施例四
本公开还提供了一种胶带制作方法，用于制作实施例二中的疏水图案化胶带。胶带制作方法包括以下步骤：
第一步，制作图案化层10；
第二步，图案化层10的双面粗糙化；
第三步，图案化层10的上表面疏水化处理，以形成疏水膜层20；
第四步，疏水膜层20的疏水表面附上一层疏水保护层50；
第五步，图案化层10的下表面12附胶，以形成胶层30；
第六步，胶层30的胶面上附离型膜，以形成离型膜层40。
具体地，在一个实施例中，制作图案化层10包括以下步骤(参考图6a至图6g)：
第一步，在主体层16表面涂覆光刻胶层500(参考图6b)；
第二步，将制备好的掩膜板400，放在遮挡区进行第一次紫外曝光(参考图6c)；
第三步，第一次显影后留下图形化的光刻胶层500(参考图6d)；
第四步，对图形化的光刻胶层500实施第二次紫外曝光(参考图6e)；
第五步，在经过第二次紫外曝光后的图形化的光刻胶层500和主体层表面上沉积一层膜层700(参考图6f)；
第六步，第二次显影后留下主体层16和图案化膜层13(参考图6g)；
其中，掩膜板400上的图案与目标图案相反。
具体地，在一个实施例中，在经过第二次紫外曝光后的图形化的光刻胶层500和主体层表面上沉积一层膜层的步骤中，采用真空镀膜的方法在图形化的光刻胶层500和主体层表面沉积一层膜层。
需要说明的是，在本实施例四中的主体层16就是实施例二中的平面主体层 17。
实施例五
本公开还提供了一种胶带使用方法，胶带使用方法包括：
第一步，取下疏水图案化胶带100的离型膜层40；
第二步，疏水图案化胶带100与待密封部件200的定位；
第三步，将疏水图案化胶带100粘接在待密封部件200上；
第四步，取下疏水图案化胶带100的疏水保护层50。
具体地，在一个实施例中，待密封部件200上设置有第二定位孔202，疏水图案化胶带100与待密封部件200的定位包括以下步骤：
第一步，将疏水图案化胶带上的第一定位孔60与第二定位孔202对准；
第二步，在第二定位孔202和第一定位孔60内插入定位销。
需要说明的是，本公开通过简单的方法(实施例三和四中的制备方法)制备了疏水图案化胶带100，通过图案化的主体材料(图案化层10)以及表面的疏水处理，实现对连接部件(相邻的两个待密封部件200)之间高度差的弥补作用，并防止外界杂质比如颗粒、水分等进入部件内部，也避免了液体从相邻界面间泄漏，在零部件的密封和防水领域有应用潜力。
需要说明的是，本公开中的疏水图案化胶带100用于密封不同部件之间的缝隙300或者部件上表面的孔洞等缺陷，且通过图案化的设计可以弥补不同部件之间的高度差(多个待密封部件200中相邻的两个的上端面2011存在的高度差)。
需要说明的是，疏水图案化胶带100的图案化设计可以通过光刻、电镀、蒸镀、气相沉积等方案(实施例四中的方法)在主体材料(实施例二中的图案化主体层14)上面沉积一层图案化膜层13。也可以通过模板法(实施例三中的方法)实现图案化的主体材料制备。这种图案化的主体材料(实施例一中的图案化主体层14)，与粘结部位的形状形成互补的形状，用于弥补粘结不同高度表面的高度差，从而实现表面的平整度的提升。主体材料(图案化主体层14)通过喷涂、气相沉积、磁控溅射等工艺方法在表面制备一层疏水膜层20，该疏水膜层20一般为低表面能的聚硅氧烷类、氟烷基硅氧烷类、氟聚合物类及其纳米微粒的复合膜，厚度从几十纳米到几百纳米。为了避免疏水表面受到外界的表面破坏和颗粒污染，常在疏水表面覆盖一层薄的透明保护膜。图案化主体层14的另一面覆盖一层稳定且粘力较大的胶层30，用于胶带的贴附。此外，胶层30表面再附加一 层离型膜层40，这样疏水图案化胶带100就更易脱粘附进行粘贴。
已制备的疏水图案化胶带100通过第一定位孔60可与所粘结部件(待密封部件200)的第二定位孔202实现对位和粘贴。如图3所示，所粘结的部件和之间存在缝隙300，且有一定的高度差。疏水图案化胶带100的图案化主体层14的图案根据所需粘附的部件缝隙300或者孔洞而设计，并且疏水图案化胶带100的凸起区和粘结部件的凹陷区实现互补，两者通过定位孔(第一定位孔60与第二定位孔202)实现对准粘贴，去除离型膜层40和疏水保护层50将疏水图案化胶带100紧紧粘结在待密封部件200上，即可得到表面疏水且平面度更高的表面。
本公开中的疏水图案化胶带100能够解决如下技术问题：
1、该疏水图案化胶带100具有疏水性，接触角大于90°，解决了表面被水润湿的问题；
2、该疏水图案化胶带100能够实现单个部件表面孔洞缺陷的填补，解决了部件平面液滴泄漏问题；
3、该疏水图案化胶带100能够实现部件之间的密封，解决了两个及以上部件组成的平面漏水问题；
4、疏水工作台表面粗糙度值很小，其表面高度差要求不超过20um，而疏水图案化胶带100的图案化处理可以对这种微小的高度差进行弥补。
在本公开的描述中，需要理解的是，术语“上”、“下”、“底”、“顶”、“前”、“后”、“内”、“外”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
虽然在本文中参照了特定的实施方式来描述本公开，但是应该理解的是，这些实施例仅仅是本公开的原理和应用的示例。因此应该理解的是，可以对示例性的实施例进行许多修改，并且可以设计出其他的布置，只要不偏离所附权利要求所限定的本公开的精神和范围。应该理解的是，可以通过不同于原始权利要求所描述的方式来结合不同的从属权利要求和本文中所述的特征。还可以理解的是，结合单独实施例所描述的特征可以使用在其他所述实施例中。

Claims (10)

  1. 一种疏水图案化胶带，其特征在于，包括：
    图案化层，具有上表面和下表面，所述图案化层为阶梯结构；以及
    疏水膜层，设置在所述图案化层的上表面上；以及
    胶层，设置在所述图案化层的下表面上；以及
    离型膜层，设置在所述胶层上；以及
    疏水保护层，设置在所述疏水膜层上。
  2. 根据权利要求1所述的疏水图案化胶带，其特征在于，所述图案化层包括图案化主体层。
  3. 根据权利要求1所述的疏水图案化胶带，其特征在于，所述图案化层包括平面主体层和设置在所述平面主体层上的图案化膜层。
  4. 根据权利要求1至3中任一项所述的疏水图案化胶带，其特征在于，所述疏水图案化胶带上设置有第一定位孔，所述第一定位孔贯穿所述疏水保护层，所述第一定位孔用于所述疏水图案化胶带与待密封部件的粘接定位。
  5. 根据权利要求2所述的疏水图案化胶带，其特征在于，所述胶层为阶梯板结构，所述阶梯板结构包括：
    第一板体；
    第二板体，一端与所述第一板体弯折连接；以及
    第三板体，与所述第二板体的另一端弯折连；以及
    其中，所述第一板体与所述第三板体平行设置，且分别位于所述第二板体的相对设置的两侧。
  6. 根据权利要求2所述的疏水图案化胶带，其特征在于，所述胶层为阶梯板结构，所述阶梯板结构包括：
    第一板体；以及
    第二板体，与所述第一板体平行设置，所述第二板体与所述第一板体在第一方向上错开设置。
  7. 一种胶带制作方法，其特征在于，所述胶带制作方法用于制作疏水图案化胶带，所述胶带制作方法包括：
    制作图案化层；
    所述图案化层的双面粗糙化；
    所述图案化层的上表面疏水化处理，以形成疏水膜层；
    所述疏水膜层的疏水表面附上一层疏水保护层；
    所述图案化层的下表面附胶，以形成胶层；
    所述胶层的胶面上附离型膜，以形成离型膜层。
  8. 根据权利要求7所述的胶带制作方法，其特征在于，制作图案化层包括以下步骤：
    在主体层表面涂覆光刻胶层；
    将制备好的掩膜板，放在遮挡区进行第一次紫外曝光；
    第一次显影后留下图形化的光刻胶层；
    对所述图形化的光刻胶层实施第二次紫外曝光；
    在经过第二次紫外曝光后的所述图形化的光刻胶层和主体层表面上沉积一层膜层；
    第二次显影后留下所述主体层和图案化膜层。
  9. 根据权利要求8所述的胶带制作方法，其特征在于，在经过第二次紫外曝光后的所述图形化的光刻胶层和主体层表面上沉积一层膜层的步骤中，采用真空镀膜的方法沉积一层膜层。
  10. 根据权利要求7所述的胶带制作方法，其特征在于，制作图案化层包括以下步骤：
    在硅片上涂覆一层光刻胶层；
    将制备好的掩膜板放在遮挡区进行紫外曝光；
    显影后硅片上留下图案化的光刻胶层；
    将模板溶液倒置在图案化的所述光刻胶层上，并进行紫外曝光；
    所述模板溶液交联固化形成模板；
    撕下所述模板，将图案化主体层的溶液涂敷在所述模板上；
    所述图案化主体层的溶液固化后再去除所述模板，得到所述图案化主体层。
PCT/CN2022/115895 2022-08-26 2022-08-30 疏水图案化胶带及其制作方法 WO2024040627A1 (zh)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101474896A (zh) * 2009-01-21 2009-07-08 重庆大学 复合结构的超疏水膜
JP2017013353A (ja) * 2015-06-30 2017-01-19 東洋アルミエコープロダクツ株式会社 撥水性粘着積層体及びそれを用いた粘着テープ
CN109843391A (zh) * 2016-10-18 2019-06-04 3M创新有限公司 膨胀型阻火带材构造
CN109957345A (zh) * 2017-12-26 2019-07-02 清华大学 疏水膜
CN111410921A (zh) * 2020-05-02 2020-07-14 冯亿生 一种复合保护膜
CN211199097U (zh) * 2019-07-31 2020-08-07 江苏皇冠新材料科技有限公司 图案化胶带
CN113736382A (zh) * 2020-05-29 2021-12-03 株式会社永佑 阶梯差附着性优良的防水胶带

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101474896A (zh) * 2009-01-21 2009-07-08 重庆大学 复合结构的超疏水膜
JP2017013353A (ja) * 2015-06-30 2017-01-19 東洋アルミエコープロダクツ株式会社 撥水性粘着積層体及びそれを用いた粘着テープ
CN109843391A (zh) * 2016-10-18 2019-06-04 3M创新有限公司 膨胀型阻火带材构造
CN109957345A (zh) * 2017-12-26 2019-07-02 清华大学 疏水膜
CN211199097U (zh) * 2019-07-31 2020-08-07 江苏皇冠新材料科技有限公司 图案化胶带
CN111410921A (zh) * 2020-05-02 2020-07-14 冯亿生 一种复合保护膜
CN113736382A (zh) * 2020-05-29 2021-12-03 株式会社永佑 阶梯差附着性优良的防水胶带

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