WO2024040494A1 - 振动传感器 - Google Patents

振动传感器 Download PDF

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Publication number
WO2024040494A1
WO2024040494A1 PCT/CN2022/114686 CN2022114686W WO2024040494A1 WO 2024040494 A1 WO2024040494 A1 WO 2024040494A1 CN 2022114686 W CN2022114686 W CN 2022114686W WO 2024040494 A1 WO2024040494 A1 WO 2024040494A1
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WIPO (PCT)
Prior art keywords
vibration
circuit board
cavity
diaphragm
fixed
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Ceased
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PCT/CN2022/114686
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English (en)
French (fr)
Inventor
孟珍奎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to JP2022576894A priority Critical patent/JP7538259B1/ja
Priority to PCT/CN2022/114686 priority patent/WO2024040494A1/zh
Priority to US18/073,452 priority patent/US12126961B2/en
Publication of WO2024040494A1 publication Critical patent/WO2024040494A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/46—Special adaptations for use as contact microphones, e.g. on musical instrument, on stethoscope
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones
    • H04R2410/03—Reduction of intrinsic noise in microphones

Definitions

  • the utility model relates to the field of acoustic-electric conversion, and in particular to a vibration sensor used in bone conduction electronic products.
  • vibration sensors convert vibration signals into electrical signals. With the development of consumer electronics, vibration sensors are used more and more widely.
  • Vibration sensors in the related art include diaphragm components as vibration sensing devices and MEMS microphones as vibration detection devices that convert vibration signals into electrical signals.
  • the existing vibration sensing device is only provided on one side of the vibration detection device, making the vibration The detection sensitivity of the sensor is limited and the signal-to-noise ratio is poor.
  • This utility model is to provide a vibration sensor with high sensitivity and high signal-to-noise ratio.
  • the utility model proposes a vibration sensor, which includes:
  • circuit board which forms a receiving cavity
  • the first vibration component is fixed on one side of the circuit board and has a first vibration cavity.
  • the first vibration component includes a first diaphragm spaced apart from the circuit board and a first diaphragm fixed on the circuit board. the first mass block of the first diaphragm;
  • a second vibration component which is fixed on the other side of the circuit board and has a second vibration cavity.
  • the second vibration component includes a second diaphragm spaced apart from the circuit board and a second diaphragm fixed on the circuit board. the second mass of the second diaphragm;
  • the MEMS chip is accommodated in the receiving cavity and electrically connected to the circuit board;
  • the ASIC chip is accommodated in the receiving cavity and electrically connected to the MEMS chip;
  • the circuit board is provided with a first through hole connecting the receiving cavity and the first vibration cavity, and a second through hole connecting the receiving cavity and the second vibration cavity;
  • the vibration of the first vibration component causes the air pressure in the first vibration chamber to change and is transmitted to the MEMS chip through the first through hole.
  • the vibration of the second vibration component causes the air pressure in the second vibration chamber to change and passes through the first through hole.
  • the second through hole is passed to the MEMS chip.
  • the circuit board includes a first circuit board and a second circuit board that are relatively spaced apart and a third circuit board connecting the first circuit board and the second circuit board.
  • the first circuit board and the third circuit board are connected to each other.
  • the two circuit boards and the third circuit board surround the receiving cavity, the first through hole penetrates through the first circuit board, and the second through hole penetrates through the second circuit board.
  • the first vibration component further includes a first metal ring fixed to the first circuit board, and the first diaphragm is fixed to an end of the first metal ring away from the first circuit board, so The first diaphragm, the first metal ring and the first circuit board are surrounded to form the first vibration cavity, and the first mass block is contained in the first vibration cavity and interacts with it along its vibration direction.
  • the first circuit boards are arranged at intervals.
  • the second vibration component further includes a second metal ring fixed to the second circuit board, and the second diaphragm is fixed to an end of the second metal ring away from the second circuit board, so The second diaphragm, the second metal ring and the second circuit board surround the second vibration cavity, and the second mass block is fixed to the second diaphragm and away from the second circuit board. side.
  • the second vibration component further includes a fourth circuit board fixed on the side of the second diaphragm away from the second circuit board, and the second diaphragm and the fourth circuit board are surrounded by a A third vibration cavity, the second mass block is accommodated in the third vibration cavity.
  • the MEMS chip is fixed on the second circuit board, and the MEMS chip includes a base fixed on the second circuit board and having a back cavity, a diaphragm fixed on the base, and a diaphragm connected to the diaphragm.
  • the base cover is disposed on the second through hole relative to the spaced back plate so that the second through hole connects the back cavity and the second vibration cavity.
  • the back plate is fixed to the side of the diaphragm away from the back cavity, and the back plate is provided with a number of sound holes penetrating it.
  • the ASIC chip is fixed on the second circuit board.
  • the orthogonal projected area of the first diaphragm along its vibration direction is equal to the orthogonal projected area of the second diaphragm along its vibration direction.
  • a receiving cavity is formed by a circuit board.
  • a MEMS chip and an ASIC chip are arranged in the receiving cavity, and first vibration cavities are respectively provided on opposite sides of the circuit board.
  • a first vibration component and a second vibration component with a second vibration cavity.
  • the circuit board is provided with a first through hole connecting the first vibration cavity and the receiving cavity and a first through hole connecting the second vibration cavity.
  • a second through hole is connected to the receiving cavity. The first vibration component vibrates so that the air pressure in the first vibration chamber changes and is transmitted to the MEMS chip through the first through hole.
  • the second vibration component vibrates so that The air pressure in the second vibration cavity changes and is transmitted to the MEMS chip through the second through hole; through the above structural design, the MEMS chip can better sense the vibration generated by the two sets of vibration components and transfer the induced vibration The signal is converted into an electrical signal, which effectively improves the sensitivity and greatly improves the signal-to-noise ratio.
  • Figure 1 is a schematic diagram of the vibration sensor in the utility model
  • Figure 2 is a schematic diagram of the vibration sensor in the present utility model.
  • the present invention provides a vibration sensor 100 , which includes a circuit board 1 surrounding a receiving cavity 10 , a first vibration component 2 and a second vibration component respectively fixed on opposite sides of the circuit board 1 .
  • the circuit board 1 includes a first circuit board 11 and a second circuit board 12 that are relatively spaced apart and a third circuit board 13 connecting the first circuit board 11 and the second circuit board 12.
  • the first circuit board 11 , the second circuit board 12 and the third circuit board 13 surround and form the receiving cavity 10 .
  • the first vibration component 2 includes a first metal ring 21 fixed on the first circuit board 11 , fixed on an end of the first metal ring 21 away from the first circuit board 11 and connected with the first circuit.
  • the first diaphragm 22 arranged at intervals on the plate 11 and the first mass 23 fixed to the first diaphragm 22; the first diaphragm 22, the first metal ring 21 and the first circuit board 11
  • a first vibration cavity 20 is formed around it.
  • the first diaphragm 22 senses vibration, it vibrates in the first vibration cavity 20. It can be understood that the first mass block 23 is accommodated in the first vibration cavity 20.
  • the vibration cavity 20 is spaced apart from the first circuit board 11 along the vibration direction of the first diaphragm 22 .
  • the second vibration component 3 also includes a second metal ring 31 fixed on the second circuit board 12, fixed on an end of the second metal ring 31 away from the second circuit board 12 and connected with the second circuit board 12.
  • the second diaphragm 32 arranged at intervals on the circuit board 12 and the second mass 33 fixed to the second diaphragm 32; the second diaphragm 32, the second metal ring 31 and the second circuit board 12 is surrounded by a second vibration cavity 30, and when the second diaphragm 32 senses vibration, it vibrates in the second vibration cavity 30; it can be understood that the second mass block 33 is accommodated in the second vibration cavity 30.
  • the second vibration cavity 30 is spaced apart from the second circuit board 12 along the vibration direction of the second diaphragm 32; in this embodiment, the second mass block 33 is fixed to the second diaphragm. 32 is away from the side of the second circuit board 12 .
  • the MEMS chip 4 and the ASIC chip 5 are both fixed on the second circuit board 12 , the MEMS chip 4 is electrically connected to the second circuit board 12 , and the ASIC chip 5 It is electrically connected to the MEMS chip 4 .
  • the first circuit board 11 is provided with a first through hole 111 that connects the receiving cavity 10 and the first vibration cavity 20
  • the second circuit board 12 connects the receiving cavity 10 and the first vibration cavity 20
  • the second through hole 121 communicates with the second vibration cavity 30;
  • the first through hole 111 is provided through the first circuit board 11, and the second through hole 121 is provided through the second circuit board 12;
  • the MEMS chip 4 enables the MEMS chip 4 to pick up the vibration signal generated by the first vibration component 20; similarly, when the second diaphragm 32 in the second vibration component 30 drives the second The vibration of the mass 33 causes the air pressure in the second vibration cavity 30 to change, which is transmitted to the MEMS chip 4 through the second through hole 121 , so that the MEMS chip 4 picks up the air pressure generated by the second vibration component 3 vibration signal.
  • the MEMS chip 4 includes a base 41 fixed to the second circuit board 12 and having a back cavity 40 , a diaphragm 42 fixed to the base 41 , and a back plate spaced apart from the diaphragm 42 . 43.
  • the base 41 is covered with the second through hole 121 so that the second through hole 121 will
  • the back cavity 40 is connected with the second vibration cavity 30 .
  • the back plate 43 is fixed to the side of the diaphragm 42 away from the back cavity 40 .
  • the back plate 43 is provided with a number of sound holes 431 penetrating therethrough, so that the sound holes 431 pass through the back plate 43 .
  • the air pressure change transmitted from a through hole 111 can be transmitted to the diaphragm 42 of the MEMS chip 4 through the sound hole 431 .
  • the second vibration component 3 also includes a fourth circuit board 34 fixed on the side of the second diaphragm 32 away from the second circuit board 12 , and the second diaphragm 43 and the fourth circuit board 34 are connected to the fourth circuit board 34 .
  • the circuit board 34 is surrounded by a third vibration cavity 35 , and the second mass 33 is received in the third vibration cavity 35 .
  • the orthogonal projected area of the first diaphragm 22 along its vibration direction is equal to the orthogonal projected area of the second diaphragm 32 along its vibration direction.
  • a receiving cavity is formed by a circuit board.
  • a MEMS chip and an ASIC chip are arranged in the receiving cavity, and first vibration cavities are respectively provided on opposite sides of the circuit board.
  • a first vibration component and a second vibration component with a second vibration cavity.
  • the circuit board is provided with a first through hole connecting the first vibration cavity and the receiving cavity and a first through hole connecting the second vibration cavity.
  • a second through hole is connected to the receiving cavity. The first vibration component vibrates so that the air pressure in the first vibration chamber changes and is transmitted to the MEMS chip through the first through hole.
  • the second vibration component vibrates so that The air pressure in the second vibration cavity changes and is transmitted to the MEMS chip through the second through hole; through the above structural design, the MEMS chip can better sense the vibration generated by the two sets of vibration components and transfer the induced vibration The signal is converted into an electrical signal, which effectively improves the sensitivity and greatly improves the signal-to-noise ratio.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)

Abstract

本实用新型提供的振动传感器包括具有收容腔的电路板以及在电路板的相对两侧分别设置的具有第一振动腔的第一振动组件和具有第二振动腔的第二振动组件；电路板上设有将第一振动腔与收容腔连通的第一通孔以及将第二振动腔与收容腔连通的第二通孔，第一振动组件振动使得第一振动腔内气压变化并通过第一通孔传递至MEMS芯片，第二振动组件振动使得第二振动腔内气压变化并通过第二通孔传递至MEMS芯片；本实用新型提供的振动传感器中的MEMS芯片可更好地感应由两组振动组件产生的振动，并将感应的振动信号转化为电信号，有效提高了灵敏度的同时信噪比也有较大提升。

Description

振动传感器 技术领域
本实用新型涉及一种声电转换领域，尤其涉及一种用于骨传导电子产品的振动传感器。
 背景技术
不同于传统麦克风的通过空气传导采集声音，振动传感器是将将振动信号转化为电信号。随着消费类电子产品的发展，振动传感器的应用越来越广泛。
 技术问题
相关技术中的振动传感器包括作为振动感应装置的振膜组件以及将振动信号转化为电信号的作为振动检测装置的MEMS麦克风，现有的振动感应装置仅在振动检测装置的一侧设置，使得振动传感器的检测灵敏度有所限制，信噪比不佳。
因此，实有必要提供一种新的振动传感器解决上述技术问题。
 技术解决方案
本实用新型的目的在于提供一种灵敏度高、信噪比高的振动传感器。
为了达到上述目的，本实用新型提出一种振动传感器，所述振动传感器包括：
电路板，所述电路板围成收容腔；
第一振动组件，所述第一振动组件固定于所述电路板的一侧且具有第一振动腔，所述第一振动组件包括与所述电路板间隔设置的第一振膜以及固定于所述第一振膜的第一质量块；
第二振动组件，所述第二振动组件固定于所述电路板的另一侧且具有第二振动腔，所述第二振动组件包括与所述电路板间隔设置的第二振膜以及固定于所述第二振膜的第二质量块；
MEMS芯片，所述MEMS芯片收容于所述收容腔内并与所述电路板电性连接；
ASIC芯片，所述ASIC芯片收容于所述收容腔内并与所述MEMS芯片电性连接；
所述电路板上设有将所述收容腔与所述第一振动腔连通的第一通孔，以及将所述收容腔与所述第二振动腔连通的第二通孔；
所述第一振动组件振动使得第一振动腔内气压变化并通过所述第一通孔传递至所述MEMS芯片，所述第二振动组件振动使得所述第二振动腔内气压变化并通过所述第二通孔传递至所述MEMS芯片。
优选的，所述电路板包括相对间隔设置的第一电路板和第二电路板以及连接所述第一电路板和第二电路板的第三电路板，所述第一电路板、所述第二电路板以及所述第三电路板围设形成所述收容腔，所述第一通孔贯穿设于所述第一电路板，所述第二通孔贯穿设于所述第二电路板。
优选的，所述第一振动组件还包括固定于所述第一电路板的第一金属环，所述第一振膜固定于所述第一金属环远离所述第一电路板的一端，所述第一振膜、所述第一金属环以及所述第一电路板围设形成所述第一振动腔，所述第一质量块收容于所述第一振动腔内并沿其振动方向与所述第一电路板间隔设置。
优选的，所述第二振动组件还包括固定于所述第二电路板的第二金属环，所述第二振膜固定于所述第二金属环远离所述第二电路板的一端，所述第二振膜、所述第二金属环以及所述第二电路板围设形成所述第二振动腔，所述第二质量块固定于所述第二振膜远离所述第二电路板的一侧。
优选的，所述第二振动组件还包括固定于所述第二振膜远离所述第二电路板一侧的第四电路板，所述第二振膜与所述第四电路板围设形成第三振动腔，所述第二质量块收容于所述第三振动腔内。
优选的，所述MEMS芯片固定于所述第二电路板，所述MEMS芯片包括固定于所述第二电路板且具有背腔的基底、固定于所述基底的振膜以及与所述振膜相对间隔设置的背板，所述基底盖设于所述第二通孔以使所述第二通孔将所述背腔与所述第二振动腔连通。
优选的，所述背板固定于所述振膜远离所述背腔的一侧，所述背板上设有若干贯穿其上的声孔。
优选的，所述ASIC芯片固定于所述第二电路板。
优选的，所述第一振膜沿其振动方向上的正投影面积等于所述第二振膜沿其振动方向上的正投影面积。
 有益效果
与相关技术相比，本实用新型的振动传感器中，通过电路板围设形成收容腔，收容腔内设置MEMS芯片和ASIC芯片，并在所述电路板的相对两侧分别设置具有第一振动腔的第一振动组件和具有第二振动腔的第二振动组件，所述电路板上设有将所述第一振动腔与所述收容腔连通的第一通孔以及将所述第二振动腔与所述收容腔连通的第二通孔，所述第一振动组件振动使得第一振动腔内气压变化并通过所述第一通孔传递至所述MEMS芯片，所述第二振动组件振动使得所述第二振动腔内气压变化并通过所述第二通孔传递至所述MEMS芯片；通过上述结构设计，MEMS芯片可更好地感应由两组振动组件产生的振动，并将感应的振动信号转化为电信号，有效提高了灵敏度的同时信噪比也有较大提升。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1是本实用新型中振动传感器的示意图；
图2是本实用新型中振动传感器的示意图。 
 本发明的最佳实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述。
如图1至图2，本实用新型提供了一种振动传感器100，其包括围设形成收容腔10的电路板1、分别固定于所述电路板1相对两侧的第一振动组件2和第二振动组件3以及收容于所述收容腔10内的MEMS芯片4以及ASIC芯片5。
所述电路板1包括相对间隔设置的第一电路板11和第二电路板12以及连接所述第一电路板11和第二电路板12的第三电路板13，所述第一电路板11、所述第二电路板12以及所述第三电路板13围设形成所述收容腔10。
所述第一振动组件2包括固定于所述第一电路板11的第一金属环21、固定于所述第一金属环21远离所述第一电路板11的一端并与所述第一电路板11间隔设置的第一振膜22以及固定于所述第一振膜22的第一质量块23；所述第一振膜22、所述第一金属环21以及所述第一电路板11围设形成第一振动腔20，当所述第一振膜22感应到振动后在所述第一振动腔20内振动；可以理解的是，所述第一质量块23收容于所述第一振动腔20内并沿所述第一振膜22的振动方向与所述第一电路板11间隔设置。
所述第二振动组件3还包括固定于所述第二电路板12的第二金属环31、固定于所述第二金属环31远离所述第二电路板12的一端并与所述第二电路板12间隔设置的第二振膜32以及固定于所述第二振膜32的第二质量块33；所述第二振膜32、所述第二金属环31以及所述第二电路板12围设形成第二振动腔30，当所述第二振膜32感应到振动后在所述第二振动腔30内振动；可以理解的是，所述第二质量块33收容于所述第二振动腔内30内并沿所述第二振膜32的振动方向与所述第二电路板12间隔设置；在本实施例中，所述第二质量块33固定于所述第二振膜32远离所述第二电路板12的一侧。
在本实施例中，所述MEMS芯片4和所述ASIC芯片5均固定于所述第二电路板12，所述MEMS芯片4与所述第二电路板12电性连接，所述ASIC芯片5与所述MEMS芯片4电性连接。
具体的，所述第一电路板11上设有将所述收容腔10与所述第一振动腔20连通的第一通孔111，所述第二电路板12将所述收容腔10与所述第二振动腔30连通的第二通孔121；所述第一通孔111贯穿设于所述第一电路板11，所述第二通孔121贯穿设于所述第二电路板12；当所述第一振动组件20中的所述第一振膜22带动所述第一质量块23振动使得所述第一振动腔20内的气压变化，通过所述第一通孔111传递至所述MEMS芯片4，使得所述MEMS芯片4拾取到所述第一振动组件20产生的振动信号；相同的，当所述第二振动组件30中的所述第二振膜32带动所述第二质量块33振动使得所述第二振动腔30内的气压变化，通过所述第二通孔121传递至所述MEMS芯片4，使得所述MEMS芯片4拾取到所述第二振动组件3产生的振动信号。
具体的，所述MEMS芯片4包括固定于所述第二电路板12且具有背腔40的基底41、固定于所述基底41的振膜42以及与所述振膜42相对间隔设置的背板43，为了使得所述MEMS芯片4能接收到通过所述第二通孔121传递的气压变化，所述基底41盖设于所述第二通孔121以使得所述第二通孔121将所述背腔40与所述第二振动腔30连通。在本实施例中，所述背板43固定于所述振膜42远离所述背腔40的一侧，所述背板43上设有若干贯穿其上的声孔431，使得通过所述第一通孔111传递来的气压变化能通过所述声孔431传递至所述MEMS芯片4的所述振膜42。
进一步的，所述第二振动组件3还包括固定于所述第二振膜32远离所述第二电路板12一侧的第四电路板34，所述第二振膜43与所述第四电路板34围设形成第三振动腔35，所述第二质量块33收容于所述第三振动腔内35。
在本实施例中，所述第一振膜22沿其振动方向上的正投影面积等于所述第二振膜32沿其振动方向上的正投影面积。
与相关技术相比，本实用新型的振动传感器中，通过电路板围设形成收容腔，收容腔内设置MEMS芯片和ASIC芯片，并在所述电路板的相对两侧分别设置具有第一振动腔的第一振动组件和具有第二振动腔的第二振动组件，所述电路板上设有将所述第一振动腔与所述收容腔连通的第一通孔以及将所述第二振动腔与所述收容腔连通的第二通孔，所述第一振动组件振动使得第一振动腔内气压变化并通过所述第一通孔传递至所述MEMS芯片，所述第二振动组件振动使得所述第二振动腔内气压变化并通过所述第二通孔传递至所述MEMS芯片；通过上述结构设计，MEMS芯片可更好地感应由两组振动组件产生的振动，并将感应的振动信号转化为电信号，有效提高了灵敏度的同时信噪比也有较大提升。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (9)

  1. 一种振动传感器，其特征在于，所述振动传感器包括：
    电路板，所述电路板围成收容腔；
    第一振动组件，所述第一振动组件固定于所述电路板的一侧且具有第一振动腔，所述第一振动组件包括与所述电路板间隔设置的第一振膜以及固定于所述第一振膜的第一质量块；
    第二振动组件，所述第二振动组件固定于所述电路板的另一侧且具有第二振动腔，所述第二振动组件包括与所述电路板间隔设置的第二振膜以及固定于所述第二振膜的第二质量块；
    MEMS芯片，所述MEMS芯片收容于所述收容腔内并与所述电路板电性连接；
    ASIC芯片，所述ASIC芯片收容于所述收容腔内并与所述MEMS芯片电性连接；
    所述电路板上设有将所述收容腔与所述第一振动腔连通的第一通孔，以及将所述收容腔与所述第二振动腔连通的第二通孔；
    所述第一振动组件振动使得第一振动腔内气压变化并通过所述第一通孔传递至所述MEMS芯片，所述第二振动组件振动使得所述第二振动腔内气压变化并通过所述第二通孔传递至所述MEMS芯片。
  2. 根据权利要求1所述的振动传感器，其特征在于，所述电路板包括相对间隔设置的第一电路板和第二电路板以及连接所述第一电路板和第二电路板的第三电路板，所述第一电路板、所述第二电路板以及所述第三电路板围设形成所述收容腔，所述第一通孔贯穿设于所述第一电路板，所述第二通孔贯穿设于所述第二电路板。
  3. 根据权利要求2所述的振动传感器，其特征在于，所述第一振动组件还包括固定于所述第一电路板的第一金属环，所述第一振膜固定于所述第一金属环远离所述第一电路板的一端，所述第一振膜、所述第一金属环以及所述第一电路板围设形成所述第一振动腔，所述第一质量块收容于所述第一振动腔内并沿其振动方向与所述第一电路板间隔设置。
  4. 根据权利要求2所述的振动传感器，其特征在于，所述第二振动组件还包括固定于所述第二电路板的第二金属环，所述第二振膜固定于所述第二金属环远离所述第二电路板的一端，所述第二振膜、所述第二金属环以及所述第二电路板围设形成所述第二振动腔，所述第二质量块固定于所述第二振膜远离所述第二电路板的一侧。
  5. 根据权利要求4所述的振动传感器，其特征在于，所述第二振动组件还包括固定于所述第二振膜远离所述第二电路板一侧的第四电路板，所述第二振膜与所述第四电路板围设形成第三振动腔，所述第二质量块收容于所述第三振动腔内。
  6. 根据权利要求2所述的振动传感器，其特征在于，所述MEMS芯片固定于所述第二电路板，所述MEMS芯片包括固定于所述第二电路板且具有背腔的基底、固定于所述基底的振膜以及与所述振膜相对间隔设置的背板，所述基底盖设于所述第二通孔以使所述第二通孔将所述背腔与所述第二振动腔连通。
  7. 根据权利要求6所述的振动传感器，其特征在于，所述背板固定于所述振膜远离所述背腔的一侧，所述背板上设有若干贯穿其上的声孔。
  8. 根据权利要求6所述的振动传感器，其特征在于，所述ASIC芯片固定于所述第二电路板。
  9. 根据权利要求1所述的振动传感器，其特征在于，所述第一振膜沿其振动方向上的正投影面积等于所述第二振膜沿其振动方向上的正投影面积。
     
PCT/CN2022/114686 2022-08-25 2022-08-25 振动传感器 Ceased WO2024040494A1 (zh)

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