WO2024037406A1 - 摄像头模组和电子设备 - Google Patents

摄像头模组和电子设备 Download PDF

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Publication number
WO2024037406A1
WO2024037406A1 PCT/CN2023/112144 CN2023112144W WO2024037406A1 WO 2024037406 A1 WO2024037406 A1 WO 2024037406A1 CN 2023112144 W CN2023112144 W CN 2023112144W WO 2024037406 A1 WO2024037406 A1 WO 2024037406A1
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WIPO (PCT)
Prior art keywords
sleeve
probe
substrate
camera module
assembly
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PCT/CN2023/112144
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English (en)
French (fr)
Inventor
张平
夏瑞
Original Assignee
维沃移动通信有限公司
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Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2024037406A1 publication Critical patent/WO2024037406A1/zh

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/14Picture signal circuitry for video frequency region
    • H04N5/21Circuitry for suppressing or minimising disturbance, e.g. moiré or halo

Definitions

  • This application belongs to the technical field of electronic equipment, and specifically relates to a camera module and electronic equipment.
  • the camera modules of most electronic devices are retractable camera modules.
  • the lens is nested in a sleeve. Through the movement of the lens and the sleeve, the distance between the lens and the photosensitive chip is controlled, thereby using Shoot with an aperture that better matches the shooting scene to improve the film effect.
  • the sleeve in the camera module may be in contact with the outside world and be affected by external static electricity, causing electromagnetic interference to the components inside the camera module, causing the camera module to malfunction.
  • the purpose of the embodiments of this application is to provide a camera module and electronic equipment that can solve the technical problem that the camera module is affected by external static electricity and may cause the camera module to malfunction.
  • embodiments of the present application provide a camera module, including a lens component, a sleeve component, a substrate and a conductive component;
  • the lens assembly is connected to the base plate through the sleeve assembly;
  • the sleeve assembly includes at least two sleeves nested in sequence. Among the two adjacent sleeves, the first sleeve is nested in the second sleeve, and the first sleeve can be opposite to the second sleeve.
  • the axis moves away from or closer to the substrate;
  • the lens assembly is installed in at least one target sleeve among the at least two sleeves and is arranged opposite to the photosensitive chip on the substrate;
  • the first end of the conductive component is connected to the substrate, and the second end of the conductive component is connected to the
  • the target sleeve is connected, and the target sleeve is conductively connected to the ground line of the substrate through the conductive component.
  • embodiments of the present application provide an electronic device, including the camera module described in the first aspect.
  • the camera module in the embodiment of the present application includes a lens assembly, a sleeve assembly, a substrate and a conductive assembly; the lens assembly is connected to the substrate through the sleeve assembly; the sleeve assembly includes at least two sleeves nested in sequence, two adjacent sleeves The first sleeve is nested in the second sleeve, and the first sleeve can move away from or close to the base plate relative to the axis of the second sleeve; the lens assembly is installed on at least one of the at least two sleeves.
  • the sleeve Inside the sleeve, it is arranged opposite to the photosensitive chip on the substrate; the first end of the conductive component is connected to the substrate, the second end of the conductive component is connected to the target sleeve, and the target sleeve is conductively connected to the ground line of the substrate through the conductive component .
  • the above-mentioned target sleeve that may be exposed to the external environment is conductively connected to the ground circuit of the substrate through the first probe and the second probe, thereby conducting the electrostatic charge on the target sleeve to the ground of the substrate. circuit to achieve electrostatic discharge and prevent components inside the camera module from being interfered with by static electricity.
  • Figure 1 is a schematic structural diagram of a camera module provided by an embodiment of the present application.
  • Figure 2 is one of the structural schematic diagrams of the conductive component provided by the embodiment of the present application.
  • FIG. 3 is the second structural schematic diagram of the conductive component provided by the embodiment of the present application.
  • Figure 1 is a schematic structural diagram of a camera module provided by an embodiment of the present application.
  • the camera module includes a lens assembly, a sleeve assembly, a substrate 10 and a conductive component 20;
  • the lens assembly is connected to the base plate 10 through the sleeve assembly;
  • the sleeve assembly includes at least two sleeves nested in sequence. Among the two adjacent sleeves, the first sleeve is nested in the second sleeve, and the first sleeve can be opposite to the second sleeve.
  • the axis moves away from or close to the substrate 10;
  • the lens assembly is installed in at least one target sleeve 31 of the at least two sleeves, and is arranged opposite to the photosensitive chip 11 on the substrate 10;
  • the first end of the conductive component 20 is connected to the substrate 10 , the second end of the conductive component 20 is connected to the target sleeve 31 , and the target sleeve 31 is connected to the target sleeve 31 through the conductive component 20
  • the ground trace of the substrate 10 is electrically connected.
  • the sleeve assembly in this embodiment includes at least two sleeves nested in sequence. Among the two adjacent sleeves, the first sleeve is nested in the second sleeve, and the first sleeve can be opposite to the second sleeve.
  • the axis of the barrel moves, that is, the sleeve assembly can move away from or toward the base plate 10 .
  • the sleeve that is not nested with other sleeves is called the target sleeve 31 , and the target sleeve 31 is set on the lens assembly.
  • the lens 42 in the lens assembly is arranged opposite to the photosensitive chip 11 on the substrate 10 .
  • the application principle of this embodiment is: the target sleeve 31 exposed to the external environment is conductively connected to the ground circuit of the substrate 10 through the conductive component 20, and the electrostatic charge on the target sleeve 31 is conducted to the ground circuit of the substrate 10 to realize electrostatic discharge. Protection to prevent components inside the camera module from being interfered with by static electricity.
  • the camera module in the embodiment of the present application includes a lens assembly, a sleeve assembly, a substrate 10 and a conductive assembly 20; the lens assembly is connected to the substrate 10 through the sleeve assembly; the sleeve assembly includes at least two sleeves nested in sequence. The first sleeve of the two adjacent sleeves is nested in the second sleeve, and the first sleeve can move away from or close to the base plate relative to the axis of the second sleeve; the lens assembly is installed in at least two sleeves.
  • At least one target sleeve 31 is located opposite the photosensitive chip 11 on the substrate 10; the first end of the conductive component 20 is connected to the substrate 10, the second end of the conductive component 20 is connected to the target sleeve 31, and the target sleeve 31 is conductively connected to the ground line of the substrate 10 through the conductive component 20 .
  • the target sleeve 31 that may be exposed to the external environment is passed through the first probe 21 and the second probe.
  • the needle 22 is electrically connected to the ground circuit of the substrate 10, thereby conducting the electrostatic charge on the target sleeve 31 to the ground circuit of the substrate 10 to realize electrostatic discharge and prevent components inside the camera module from being interfered by static electricity.
  • the conductive component 20 includes a first probe 21 and a second probe 22;
  • the first end of the first probe 21 is connected to the substrate 10 , the second end of the first probe 21 is provided with a first guide hole, and the second probe 22 is partially located on the first guide hole. In the hole, one end of the second probe 22 away from the first probe 21 is connected to the target sleeve 31 .
  • the conductive component 20 includes a first probe 21 and a second probe 22.
  • the second end of the first probe 21 is provided with a first conductive hole, and the second probe 22 can extend along the first conductive hole.
  • the hole moves, that is to say, the above-mentioned conductive component 20 is a telescopic conductive component 20, and the conductive component 20 expands and contracts following the movement of the sleeve component.
  • the above-mentioned first probe 21 and the substrate 10 may be fixedly connected or abutted.
  • the above fixed connection method may be welding; when the first probe 21 is in contact with the substrate 10, a limiting hole may be provided on the substrate 10, and the first end of the first probe 21 may be disposed in the limiting hole. middle.
  • the above-mentioned second probe 22 and the target sleeve 31 may be fixedly connected or abutted.
  • the above-mentioned fixed connection method can be welding; when the second probe 22 and the target sleeve 31 are in contact, a limit hole can be provided on the target sleeve 31, and one end of the second probe 22 can be set on the limit. in the hole.
  • first probe 21 and the second probe 22 are both made of conductive materials, such as copper and aluminum.
  • the conductive component 20 further includes a first elastic member 23.
  • the first elastic member 23 is connected to the first probe 21 and the second probe 22 respectively, and is used to provide drive for the first probe 21 and the second probe 22.
  • the two probes 22 move toward the target sleeve 31 by elastic force.
  • the conductive component 20 includes a first probe 21, a second probe 22 and a first elastic member 23.
  • the first elastic member 23 is connected to the first probe respectively.
  • 21 is connected to the second probe 22.
  • the first elastic member 23 When the first elastic member 23 is in the extended state, it provides elastic force to drive the second probe 22 to move toward the target sleeve 31; when the first elastic member 23 is in the contracted state, the target sleeve 31 moves toward the second probe. 22 exerts force to drive the second probe 22 to move toward the substrate 10 .
  • the first elastic member 23 is made of conductive material, such as copper and aluminum.
  • the first elastic member 23 is a first spring, the first spring is located in the first guide hole, and the first end of the first spring is in contact with the inner wall of the first probe 21 connection, the first bomb The second end of the spring is connected to an end of the second probe 22 away from the substrate 10 .
  • the first elastic member 23 is a spring.
  • the first spring is not connected to the second probe 22.
  • the first end of the first spring is connected to the inner wall of the first probe 21, the second end of the first spring is connected to an end of the second probe 22 away from the substrate 10, and the first spring is located in the first guide hole.
  • the conductive component 20 also includes a connecting sleeve 24 and a second elastic member 25.
  • the connecting sleeve 24 is a hollow structure with openings at both ends.
  • the second end of the first probe 21 is located in the connecting sleeve. 24 and can move along the axis of the connecting sleeve 24.
  • the second elastic member 25 is connected to the first probe 21 and the connecting sleeve 24 respectively, and is used to provide driving of the first probe 21. The elastic force moves toward the substrate 10 .
  • the conductive component 20 includes a first probe 21 , a second probe 22 , a connecting sleeve 24 , a first elastic member 23 and a second elastic member 25 .
  • the first elastic member 23 is located in the first guide hole of the first probe 21, and the first elastic member 23 is connected to the first probe 21 and the second probe 22 respectively; the above-mentioned second elastic member 25 is respectively Connected to the first probe 21 and the connecting sleeve 24.
  • the second elastic member 25 When the second elastic member 25 is in the extended state, it provides elastic force to drive the first probe 21 to move toward the substrate 10 ; when the second elastic member 25 is in the contracted state, it indicates that the target sleeve 31 moves toward the second probe 22 Applying force, the second probe 22 is driven to move toward the substrate 10 .
  • the above-mentioned second elastic member 25 and the connecting sleeve 24 are made of conductive materials, such as copper and aluminum.
  • the telescopic range of the conductive component 20 is increased, thereby increasing the optical path distance between the lens 42 and the photosensitive chip 11, and improving the film-making effect.
  • the second elastic member 25 is a second spring, the second spring is sleeved on the second probe 22, and the first end of the second spring is in contact with the first probe.
  • the second end of the second spring is connected to the inner wall of the connecting sleeve 24 .
  • the second elastic member 25 is a spring.
  • the second spring is also located in the connecting sleeve 24; the second spring The first end is connected to the second end of the first probe 21 , and the second end of the second spring is connected to the inner wall of the connecting sleeve 24 .
  • the first probe 21 and the second probe 22 are located outside the optical path area formed between the lens assembly and the photosensitive chip 11 .
  • An optical path area is formed between the lens assembly and the photosensitive chip 11, and the photosensitive chip 11 obtains the amount of incident light through the optical path area, thereby realizing the shooting function.
  • the first probe 21 and the second probe 22 are arranged outside the optical path area to avoid affecting the amount of incident light obtained by the photosensitive chip 11 and reduce stray light crosstalk.
  • the sleeve assembly includes a first-level sleeve 32, a second-level sleeve 33 and a third-level sleeve nested in sequence;
  • the secondary sleeve 33 is nested in the primary sleeve 32
  • the third-level sleeve is nested in the secondary sleeve 33
  • the third-level sleeve is the target sleeve 31 .
  • the sleeve assembly may include three sleeves, namely a first-level sleeve 32 , a second-level sleeve 33 and a third-level sleeve that are nested in sequence.
  • the first-level sleeve 32 is fixedly connected to the base plate 10
  • the three-stage sleeve is set on the lens assembly.
  • FIG. 1 shows a schematic structural diagram of the camera module when the sleeve assembly is in an extended state.
  • the above-mentioned second sleeve can move away from the base plate 10 along the axis of the primary sleeve 32, and the above-mentioned third-level sleeve can move away from the base plate 10 along the axis of the secondary sleeve 33, thereby achieving telescopicity of the sleeve assembly.
  • the distance between the lens 42 and the photosensitive chip 11 in the lens assembly is changed to achieve focusing and zooming.
  • the first-level sleeve 32 and the third-level sleeve are made of metal, and the second-level sleeve 33 is made of plastic.
  • the lens assembly includes a voice coil motor 41 and a lens 42;
  • the lens 42 is nested in the voice coil motor 41 , and the voice coil motor 41 is nested in the target sleeve 31 .
  • the lens assembly includes a voice coil motor 41 and a lens 42.
  • the voice coil motor 41 is used to provide a force that drives the lens 42 away from the movement, thereby adjusting the lens 42 and the photosensitive chip 11. distance between them to achieve focus and zoom and improve the film effect.
  • the camera assembly also includes a flexible circuit board 50;
  • the first end of the flexible circuit board 50 is connected to the voice coil motor 41 , and the second end of the flexible circuit board 50 is connected to the substrate 10 .
  • a flexible circuit board 50 is provided in the camera assembly to power the voice coil motor 41 so that the voice coil motor 41 can drive the lens 42 to move. It should be understood that the above-mentioned flexible circuit board 50 is located outside the optical path area formed between the lens assembly and the photosensitive chip 11 .
  • An embodiment of the present application also provides an electronic device, the electronic device includes the camera components.
  • the specific implementation of the camera assembly can refer to the above description and can achieve the same technical effect. To avoid repetition, no further description will be given.
  • the above-mentioned electronic device may be a computer (Computer), a mobile phone, a Tablet Personal Computer, a Laptop Computer (Laptop Computer), a Personal Digital Assistant (Personal Digital Assistant, PDA), or a mobile Internet access electronic device.
  • a computer Computer
  • a mobile phone Tablet Personal Computer
  • Laptop Computer Laptop Computer
  • PDA Personal Digital Assistant
  • Mobile Internet access electronic device Mobile Internet Device, MID
  • wearable device Wearable Device
  • e-reader navigator, digital camera, etc.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)

Abstract

本申请提供了一种摄像头模组和电子设备,属于电子设备技术领域,其中,摄像头模组包括镜头组件、套筒组件、基板和导电组件;镜头组件通过套筒组件与基板连接;套筒组件包括依次嵌套的至少两个套筒,相邻的两个套筒中第一套筒嵌套在第二套筒内,且第一套筒可相对第二套筒的轴线远离或靠近基板移动;镜头组件安装在至少两个套筒中的至少一个目标套筒内,且与基板上的感光芯片相对设置;导电组件的第一端与基板连接,导电组件的第二端与目标套筒连接,且目标套筒通过导电组件与基板的接地线路导电连接。

Description

摄像头模组和电子设备
相关申请的交叉引用
本申请主张在2022年08月15日在中国提交的中国专利申请No.202210975768.5的优先权,其全部内容通过引用包含于此。
技术领域
本申请属于电子设备技术领域,具体涉及一种摄像头模组和电子设备。
背景技术
相关技术中大多数电子设备的摄像头模组为可伸缩的摄像头模组,将镜头嵌套在套筒内,通过镜头和套筒的移动,控制镜头与感光芯片之间的距离,以此使用与拍摄场景更为匹配的光圈进行拍摄,提高成片效果。
然而,摄像头模组中的套筒可能与外界接触,受到外界静电的影响,对摄像头模组内部的元器件产生电磁干扰,导致摄像头模组故障。
发明内容
本申请实施例的目的是提供一种摄像头模组和电子设备,能够解决摄像头模组受到外界静电的影响,可能导致摄像头模组故障的技术问题。
为了解决上述技术问题,本申请是这样实现的:
第一方面,本申请实施例提供了一种摄像头模组,包括镜头组件、套筒组件、基板和导电组件;
所述镜头组件通过所述套筒组件与所述基板连接;
所述套筒组件包括依次嵌套的至少两个套筒,相邻的两个套筒中第一套筒嵌套在第二套筒内,且所述第一套筒可相对第二套筒的轴线远离或靠近所述基板移动;
所述镜头组件安装在所述至少两个套筒中的至少一个目标套筒内,且与所述基板上的感光芯片相对设置;
所述导电组件的第一端与所述基板连接,所述导电组件的第二端与所述 目标套筒连接,且所述目标套筒通过所述导电组件与所述基板的接地线路导电连接。
第二方面,本申请实施例提供了一种电子设备,包括如第一方面所述的摄像头模组。
本申请实施例中的摄像头模组包括镜头组件、套筒组件、基板和导电组件;镜头组件通过套筒组件与基板连接;套筒组件包括依次嵌套的至少两个套筒,相邻的两个套筒中第一套筒嵌套在第二套筒内,且第一套筒可相对第二套筒的轴线远离或靠近基板移动;镜头组件安装在至少两个套筒中的至少一个目标套筒内,且与基板上的感光芯片相对设置;导电组件的第一端与基板连接,导电组件的第二端与目标套筒连接,且目标套筒通过导电组件与基板的接地线路导电连接。本申请实施例中,上述可能暴露在外部环境中的目标套筒通过第一探针和第二探针与基板的接地线路导电连接,以此将目标套筒上的静电荷传导至基板的接地线路,实现静电释放,防止摄像头模组内部的元器件被静电干扰。
附图说明
图1是本申请实施例提供的摄像头模组的结构示意图;
图2是本申请实施例提供的导电组件的结构示意图之一;
图3是本申请实施例提供的导电组件的结构示意图之二。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象,而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外,说明书以及权利要求中“和/或”表示所连 接对象的至少其中之一,字符“/”,一般表示前后关联对象是一种“或”的关系。
请参阅图1,图1是本申请实施例提供的摄像头模组的结构示意图。如图1所示,摄像头模组包括镜头组件、套筒组件、基板10和导电组件20;
所述镜头组件通过所述套筒组件与所述基板10连接;
所述套筒组件包括依次嵌套的至少两个套筒,相邻的两个套筒中第一套筒嵌套在第二套筒内,且所述第一套筒可相对第二套筒的轴线远离或靠近所述基板10移动;
所述镜头组件安装在所述至少两个套筒中的至少一个目标套筒31内,且与所述基板10上的感光芯片11相对设置;
所述导电组件20的第一端与所述基板10连接,所述导电组件20的第二端与所述目标套筒31连接,且所述目标套筒31通过所述导电组件20与所述基板10的接地线路导电连接。
本实施例中的套筒组件包括依次嵌套的至少两个套筒,相邻的两个套筒中第一套筒嵌套在第二套筒内,且第一套筒可相对第二套筒的轴线移动,也就是说,上述套筒组件可远离或靠近基板10移动。将未嵌套其他套筒的套筒称为目标套筒31,且该目标套筒31套设在镜头组件上,镜头组件中的镜头42与基板10上的感光芯片11相对设置。
本实施例的应用原理为:暴露在外部环境中的目标套筒31通过导电组件20与基板10的接地线路导电连接,将目标套筒31上的静电荷传导至基板10的接地线路,实现静电防护,防止摄像头模组内部的元器件被静电干扰。
本申请实施例中的摄像头模组包括镜头组件、套筒组件、基板10和导电组件20;镜头组件通过套筒组件与基板10连接;套筒组件包括依次嵌套的至少两个套筒,相邻的两个套筒中第一套筒嵌套在第二套筒内,且第一套筒可相对第二套筒的轴线远离或靠近基板移动;镜头组件安装在至少两个套筒中的至少一个目标套筒31内,且与基板10上的感光芯片11相对设置;导电组件20的第一端与基板10连接,导电组件20的第二端与目标套筒31连接,且目标套筒31通过导电组件20与基板10的接地线路导电连接。本申请实施例中,上述可能暴露在外部环境中的目标套筒31通过第一探针21和第二探 针22与基板10的接地线路导电连接,以此将目标套筒31上的静电荷传导至基板10的接地线路,实现静电释放,防止摄像头模组内部的元器件被静电干扰。
可选地,所述导电组件20包括第一探针21和第二探针22;
所述第一探针21的第一端与所述基板10连接,所述第一探针21的第二端设有第一导孔,所述第二探针22部分位于所述第一导孔内,所述第二探针22远离所述第一探针21的一端与所述目标套筒31连接。
本实施例中,导电组件20包括第一探针21和第二探针22,其中,上述第一探针21的第二端设有第一导孔,第二探针22可延第一导孔移动,也就是说,上述导电组件20为可伸缩的导电组件20,导电组件20跟随套筒组件的移动而伸缩。
上述第一探针21和基板10可以固定连接或者抵接。上述固定连接的方式可以为焊接;在第一探针21和基板10抵接的情况下,可以在基板10上设置限位孔,将第一探针21的第一端设置在上述限位孔中。
上述第二探针22和目标套筒31可以固定连接或者抵接。上述固定连接的方式可以为焊接;在第二探针22和目标套筒31抵接的情况下,可以在目标套筒31上设置限位孔,将第二探针22的一端设置在上述限位孔中。
其中,上述第一探针21和第二探针22均为导电材料,例如,铜和铝。
可选地,所述导电组件20还包括第一弹性件23,所述第一弹性件23分别与所述第一探针21和所述第二探针22连接,用于提供驱动所述第二探针22向所述目标套筒31移动的弹性作用力。
请参阅图2,如图2所示,本实施例中,导电组件20包括第一探针21、第二探针22和第一弹性件23,上述第一弹性件23分别与第一探针21和第二探针22连接。当第一弹性件23处于伸出状态时,提供驱动第二探针22向目标套筒31移动的弹性作用力;当第一弹性件23处于收缩状态时,目标套筒31向第二探针22施加作用力,驱动第二探针22向基板10移动。
可选地,上述第一弹性件23为导电材质,例如,铜和铝。
可选地,所述第一弹性件23为第一弹簧,所述第一弹簧位于所述第一导孔内,且所述第一弹簧的第一端与所述第一探针21的内壁连接,所述第一弹 簧的第二端与所述第二探针22远离所述基板10的一端连接。
本实施例中,上述第一弹性件23为弹簧,如上所述,由于第二探针22部分位于第一探针21的第一导孔内,因此第一弹簧不与第二探针22连接的第一端与第一探针21的内壁连接,第一弹簧的第二端与第二探针22远离基板10的一端连接,且第一弹簧位于第一导孔内。
可选地,所述导电组件20还包括连接套24和第二弹性件25,所述连接套24为两端开口的中空结构,所述第一探针21的第二端位于所述连接套24内,且可沿所述连接套24的轴线移动,所述第二弹性件25分别与所述第一探针21和所述连接套24连接,用于提供驱动所述第一探针21向所述基板10移动的弹性作用力。
请参阅图3,如图3所示,本实施例中,导电组件20包括第一探针21、第二探针22、连接套24、第一弹性件23和第二弹性件25。如上所述,第一弹性件23位于第一探针21的第一导孔内,且第一弹性件23分别与第一探针21和第二探针22连接;上述第二弹性件25分别与第一探针21和连接套24连接。当第二弹性件25处于伸出状态时,提供驱动第一探针21向基板10移动的弹性作用力;当第二弹性件25处于收缩状态时,表示目标套筒31向第二探针22施加作用力,驱动第二探针22向基板10移动。
可选地,上述第二弹性件25和连接套24为导电材质,例如,铜和铝。
本实施例中,通过增加第二弹性件25和连接套24,挺高导电组件20的伸缩范围,以此增加镜头42和感光芯片11之间的光路距离,提高成片效果。
可选地,所述第二弹性件25为第二弹簧,所述第二弹簧套设在所述第二探针22上,且所述第二弹簧的第一端与所述第一探针21的第二端连接,所述第二弹簧的第二端与所述连接套24的内壁连接。
本实施例中,上述第二弹性件25为弹簧,如上所述,由于第一探针21的第二端位于连接套24内,因此第二弹簧也位于连接套24内;该第二弹簧的第一端与第一探针21的第二端连接,第二弹簧的第二端与连接套24的内壁连接。
可选地,所述第一探针21和所述第二探针22位于所述镜头组件和所述感光芯片11之间形成的光路区域外。
镜头组件和感光芯片11之间形成有光路区域,感光芯片11通过该光路区域获取进光量,进而实现拍摄功能。本实施例中,将第一探针21和第二探针22设置在光路区域外,避免影响感光芯片11获取进光量,降低杂光串扰。
可选地,所述套筒组件包括依次嵌套的一级套筒32、二级套筒33和三级套筒;
所述二级套筒33嵌套在所述一级套筒32内,所述三级套筒嵌套在所述二级套筒33内,所述三级套筒为所述目标套筒31。
如图1所示,套筒组件可以包括三个套筒,分别为依次嵌套的一级套筒32、二级套筒33和三级套筒,该一级套筒32与基板10固定连接,该三级套筒套设在镜头组件上。应理解,图1示出的是套筒组件处于伸出状态时摄像头模组的结构示意图。
应理解,上述第二套筒可沿一级套筒32的轴线远离基板10移动,上述三级套筒可沿二级套筒33的轴线远离基板10移动,以此实现套筒组件的伸缩,改变镜头组件中的镜头42与感光芯片11之间的距离,实现对焦和变焦。
可选地,上述一级套筒32和三级套筒为金属材质,上述二级套筒33为塑料材质。
可选地,所述镜头组件包括音圈马达41和镜头42;
所述镜头42嵌套在所述音圈马达41内,所述音圈马达41嵌套在所述目标套筒31内。
请参阅图1,本实施例中,镜头组件包括音圈马达41和镜头42,其中,音圈马达41用于提供驱动镜头42远离所述移动的作用力,以此调节镜头42与感光芯片11之间的距离,实现对焦和变焦,提高成片效果。
可选地,所述摄像头组件还包括柔性电路板50;
请参阅图1,所述柔性电路板50的第一端与所述音圈马达41连接,所述柔性电路板50的第二端与所述基板10连接。
本实施例中,在摄像头组件中设置柔性电路板50为音圈马达41供电,以使得音圈马达41可以驱动镜头42移动。应理解,上述柔性电路板50位于镜头组件和感光芯片11之间形成的光路区域外。
本申请实施例还提供一种电子设备,所述电子设备包括上述实施例提供 的摄像头组件。其中,摄像头组件的具体实施方式可以参照上述说明,并能够达到相同的技术效果,为避免重复,对此不作赘述。
本申请实施例中,上述电子设备可为计算机(Computer)、手机、平板电脑(Tablet Personal Computer)、膝上型电脑(Laptop Computer)、个人数字助理(Personal Digital Assistant,PDA)、移动上网电子设备(Mobile Internet Device,MID)、可穿戴式设备(Wearable Device)、电子阅读器、导航仪、数码相机等。
上面结合附图对本申请的实施例进行了描述,但是本申请并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本申请的启示下,在不脱离本申请宗旨和权利要求所保护的范围情况下,还可做出很多形式,均属于本申请的保护之内。

Claims (11)

  1. 一种摄像头模组,包括镜头组件、套筒组件、基板和导电组件;
    所述镜头组件通过所述套筒组件与所述基板连接;
    所述套筒组件包括依次嵌套的至少两个套筒,相邻的两个套筒中第一套筒嵌套在第二套筒内,且所述第一套筒可相对第二套筒的轴线远离或靠近所述基板移动;
    所述镜头组件安装在所述至少两个套筒中的至少一个目标套筒内,且与所述基板上的感光芯片相对设置;
    所述导电组件的第一端与所述基板连接,所述导电组件的第二端与所述目标套筒连接,且所述目标套筒通过所述导电组件与所述基板的接地线路导电连接。
  2. 根据权利要求1所述的摄像头模组,其中,所述导电组件包括第一探针和第二探针;
    所述第一探针的第一端与所述基板连接,所述第一探针的第二端设有第一导孔,所述第二探针部分位于所述第一导孔内,所述第二探针远离所述第一探针的一端与所述目标套筒连接;
    其中,在所述第一套筒相对所述第二套筒的轴线远离所述基板移动的情况下,所述第二探针延第一导孔移动远离所述基板移动;
    在所述第一套筒相对所述第二套筒的轴线靠近所述基板移动的情况下,所述第二探针延第一导孔移动靠近所述基板移动。
  3. 根据权利要求2所述的摄像头模组,其中,所述导电组件还包括第一弹性件,所述第一弹性件分别与所述第一探针和所述第二探针连接,用于提供驱动所述第二探针向所述目标套筒移动的弹性作用力。
  4. 根据权利要求3所述的摄像头模组,其中,所述第一弹性件为第一弹簧,所述第一弹簧位于所述第一导孔内,且所述第一弹簧的第一端与所述第一探针的内壁连接,所述第一弹簧的第二端与所述第二探针远离所述基板的一端连接。
  5. 根据权利要求3所述的摄像头模组,其中,所述导电组件还包括连接 套和第二弹性件,所述连接套为两端开口的中空结构,所述第一探针的第二端位于所述连接套内,且可沿所述连接套的轴线移动,所述第二弹性件分别与所述第一探针和所述连接套连接,用于提供驱动所述第一探针向所述基板移动的弹性作用力。
  6. 根据权利要求5所述的摄像头模组,其中,所述第二弹性件为第二弹簧,所述第二弹簧套设在所述第二探针上,且所述第二弹簧的第一端与所述第一探针的第二端连接,所述第二弹簧的第二端与所述连接套的内壁连接。
  7. 根据权利要求2-6中任一项所述的摄像头模组,其中,所述第一探针和所述第二探针位于所述镜头组件和所述感光芯片之间形成的光路区域外。
  8. 根据权利要求1-6中任一项所述的摄像头模组,其中,所述套筒组件包括依次嵌套的一级套筒、二级套筒和三级套筒;
    所述二级套筒嵌套在所述一级套筒内,所述三级套筒嵌套在所述二级套筒内,所述三级套筒为所述目标套筒。
  9. 根据权利要求1-6中任一项所述的摄像头模组,其中,所述镜头组件包括音圈马达和镜头;
    所述镜头嵌套在所述音圈马达内,所述音圈马达嵌套在所述目标套筒内。
  10. 根据权利要求9所述的摄像头模组,其中,所述摄像头组件还包括柔性电路板;
    所述柔性电路板的第一端与所述音圈马达连接,所述柔性电路板的第二端与所述基板连接。
  11. 一种电子设备,所述电子设备包括如权利要求1至10中任一项所述的摄像头模组。
PCT/CN2023/112144 2022-08-15 2023-08-10 摄像头模组和电子设备 WO2024037406A1 (zh)

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