WO2024037080A1

WO2024037080A1 - Optical module

Info

Publication number: WO2024037080A1
Application number: PCT/CN2023/094995
Authority: WO
Inventors: 崔峰; 金虎山; 刘维伟; 慕建伟; 傅钦豪; 李丹
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2022-08-18
Filing date: 2023-05-18
Publication date: 2024-02-22

Abstract

An optical module (200). A laser box (500) thereof comprises a top opening (570A), a box body bottom surface (570), and a plurality of side walls; a side wall light exit opening (5131), a side wall insertion port (511), and a side wall electrical connection port (540) are respectively formed in the side walls; the side wall light exit opening (5131) and the side wall electrical connection port (540) are located on different side walls; a first cover plate groove (5132) is provided on different side walls from the side wall insertion port (511), and is communicated with the side wall insertion port (511); a first cover plate (530) is inserted into the first cover plate groove (5132) from the side wall insertion port (511), and is located above the side wall light exit opening (5131) to block the top opening (570A); a second light window (520) blocks the side wall light exit opening (5131); an inner wall layer (519) and a limiting plate (518) are respectively connected to the side walls of the box body and separated from each other, and a gap between the inner wall layer (519) and the limiting plate (518) forms a second cover plate groove (5133); the inner wall layer (519) extends to the box body bottom surface (570), and the limiting plate (518) is located below the first cover plate (530); and a second cover plate (550) is inserted into the second cover plate groove (5133) to separate the first cover plate (530) from the box body bottom surface (570).

Description

Optical module

This application claims priority to the Chinese patent application submitted to the China Patent Office with application number 202210994321.2 on August 18, 2022 and the Chinese patent application submitted to the China Patent Office with application number 202210993751.2 on August 18, 2022. All its contents are approved by This reference is incorporated into this application.

Technical field

The present disclosure relates to the field of optical communication technology, and in particular, to an optical module.

Background technique

Optical communication technology will be used in new business models and application models such as cloud computing, mobile Internet, and video. In optical communications, optical modules are tools for realizing mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communications, have made great progress.

Contents of the invention

The present disclosure provides an optical module, including: a circuit board, a laser box and a silicon optical chip. The laser box is electrically connected to the circuit board, and the laser box emits emission light that does not carry signals. The silicon photonic chip receives the emitted light from the laser box. Wherein, the laser box includes: an open box body, a first cover plate and a second cover plate. The open box body includes a top opening, a bottom surface of the box body and a plurality of side walls. The side walls are respectively provided with a side wall light-emitting opening, a side wall insertion port and a side wall electrical connection port. The side wall light-emitting opening and the side wall electrical connection port are located at Different side walls. The first cover plate groove and the side wall insertion opening are arranged on different side walls, and the first cover plate groove and the side wall insertion opening are connected. The first cover plate is inserted into the first cover plate groove from the side wall insertion opening, and the first cover plate is located above the light exit opening of the side wall to block the top opening. The second light window blocks the light-emitting opening on the side wall. The inner wall layer is connected to the side wall of the box. The limit plate is connected to the side wall of the box, the inner wall layer and the limit plate are separated from each other, the gap between the inner wall layer and the limit plate forms a second cover plate slot, the inner wall layer extends to the bottom of the box, and the limit plate Located under the first cover. The second cover plate is inserted into the second cover plate groove, and the second cover plate separates the first cover plate from the bottom surface of the box body. The side of the inner wall layer facing the light-emitting opening of the side wall is connected to the first light window, and a light-emitting chip is disposed between the first light window and the electrical connection port of the side wall.

Description of drawings

In order to explain the technical solutions in the present disclosure more clearly, the drawings required to be used in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only appendices of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of the present disclosure.

Figure 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure;

Figure 5 is a schematic structural diagram of a light emitting component connected to a circuit board according to some embodiments of the present disclosure;

Figure 6 is a schematic structural diagram of a laser box provided according to some embodiments of the present disclosure;

Figure 7 is a schematic structural diagram 2 of a laser box provided according to some embodiments of the present disclosure;

Figure 8 is a schematic diagram of an exploded structure of a laser box according to some embodiments of the present disclosure;

Figure 9 is a schematic diagram 2 of the exploded structure of a laser box provided according to some embodiments of the present disclosure;

Figure 10 is a schematic structural diagram of an open box provided according to some embodiments of the present disclosure;

Figure 11 is a schematic cross-sectional view of a laser box provided according to some embodiments of the present disclosure;

Figure 12 is a first angle cross-sectional view of an open box provided according to some embodiments of the present disclosure;

Figure 13 is a schematic cross-sectional view from a second angle of an open box provided according to some embodiments of the present disclosure;

Figure 14 is a schematic cross-sectional view of a laser box at a second angle according to some embodiments of the present disclosure;

Figure 15 is a third angle cross-sectional view of an open box provided according to some embodiments of the present disclosure;

Figure 16 is a third angle cross-sectional view of a laser box provided according to some embodiments of the present disclosure;

Figure 17 is a schematic diagram of an optical path of a transmitting component according to some embodiments of the present disclosure.

Detailed ways

The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by this disclosure, all other embodiments obtained by those of ordinary skill in the art fall within the scope of protection of this disclosure.

Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms such as the third person singular "comprises" and the present participle "comprising" are used. Interpreted as open and inclusive, it means "including, but not limited to." In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific "example" or "some examples" and the like are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

Hereinafter, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

In describing some embodiments, expressions "coupled" and "connected" and their derivatives may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integrated connection; it can be a direct connection or an indirect connection through an intermediate medium. For example, some embodiments may be described using the term "connected" to indicate that two or more components are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used when describing some embodiments to indicate that two or more components are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited by the content herein.

"At least one of A, B and C" has the same meaning as "at least one of A, B or C" and both include The following combinations of A, B, and C: A only, B only, C only, combination of A and B, combination of A and C, combination of B and C, and combination of A, B and C.

"A and/or B" includes the following three combinations: A only, B only, and a combination of A and B.

The use of "suitable for" or "configured to" in this document means open and inclusive language that does not exclude devices that are suitable for or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated value as well as an average within an acceptable range of deviations from the particular value, as determined by one of ordinary skill in the art. Determined taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system).

As used herein, "parallel," "perpendicular," and "equal" include the stated situation as well as situations that are approximate to the stated situation within an acceptable deviation range, where Such acceptable deviation ranges are as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (ie, the limitations of the measurement system). For example, "parallel" includes absolutely parallel and approximately parallel, and the acceptable deviation range of approximately parallel may be, for example, a deviation within 5°; "perpendicular" includes absolutely vertical and approximately vertical, and the acceptable deviation range of approximately vertical may also be, for example, Deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the difference between the two that may be equal within the acceptable deviation range of approximately equal is less than or equal to 5% of either one, for example.

Optical communication technology establishes information transmission between information processing equipment. Optical communication technology loads information onto light and uses the propagation of light to realize the transmission of information. Light loaded with information is an optical signal. The propagation of optical signals in information transmission equipment can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. The information that information processing equipment can process exists in the form of electrical signals. Optical network terminals/gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing equipment. Optical fibers and optical waveguides are common information processing equipment. transmission device.

The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and/or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and/or the electrical signal output end of the optical module; the first optical signal transmission from the optical fiber Entering the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module transmits the second electrical signal into the optical module. The electrical signal is converted into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing equipment can be connected to each other through electrical signal networks, at least one type of information processing equipment needs to be directly connected to the optical module. It is not required that all types of information processing equipment are directly connected to the optical module. The information of the optical module is directly connected. The processing equipment is called the host computer of the optical module.

Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system is partially represented by a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101 and a network cable 103.

One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can undergo total reflection in the optical fiber 101. The propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes total reflection multiple times in the optical fiber 101 and will come from the direction of the remote information processing device 1000. The optical signal is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000 to realize long-distance information transmission with low power loss.

The number of optical fibers 101 may be one or multiple (two or more); the optical fibers 101 and the optical module 200 may be pluggable or fixedly connected.

The host computer 100 has an optical module interface 102, and the optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a one-way/bi-directional electrical signal connection; the host computer 100 is configured to connect to the optical module 200. 200 provides data signals, or receives data signals from the optical module 200, or monitors and controls the working status of the optical module 200.

The host computer 100 has an external electrical interface, such as a Universal Serial Bus interface (Universal Serial Bus, USB) and a network cable interface 104. The external electrical interface can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103 so that the host computer 100 and the network cable 103 establish a one-way/bi-directional electrical signal connection.

Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (Optical Network Terminal, ONT) and data center servers are common host computers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal, and the second electrical signal from the host computer 100 is transmitted into the optical module. 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

For example, the first optical signal from the direction of the remote information processing device 1000 is propagated through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

The optical module is a tool that realizes the mutual conversion of optical signals and electrical signals. During the above-mentioned conversion process of optical signals and electrical signals, the information does not change, and the encoding and decoding method of the information can change.

Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG. 2 only shows the structures related to the host computer 100 and the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 provided in the housing, a cage 106 provided on the surface of the PCB circuit board 105, a radiator 107 provided on the cage 106, and a heat sink 107 provided inside the cage 106. In the electrical connector (not shown in the figure), the heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-like structure is a common protruding structure.

The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in FIGS. 3 and 4 , the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and a light receiving component and/or a light emitting component.

The housing includes an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form a housing with two openings; the outer contour of the housing generally presents a square body.

In some embodiments of the present disclosure, the lower housing 202 includes a base plate and a base plate located on both sides of the base plate, perpendicular to the base plate. Two lower side plates are provided; the upper housing 201 includes a cover plate, and the cover plate is covered with the two lower side plates of the lower housing 202 to form the above-mentioned housing.

In some embodiments, the lower shell 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate; the upper shell 201 includes a cover plate and two lower side plates located on both sides of the cover plate and perpendicular to the cover plate. The two upper side plates are combined with the two lower side plates to realize that the upper housing 201 is covered on the lower housing 202 .

The above two openings are the first opening 204 and the second opening 205 respectively. The direction of the connecting line of the first opening 204 and the second opening 205 may be consistent with the length direction of the optical module 200 , or may be consistent with the length direction of the optical module 200 . Inconsistent. For example, the first opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the second opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ). Alternatively, the first opening 204 is located at an end of the optical module 200 , and the second opening 205 is located at a side of the optical module 200 .

The first opening 204 is an electrical port, and the golden finger of the circuit board 300 extends from the electrical port and is inserted into a host computer (for example, an optical network terminal). The second opening 205 is an optical port configured to access the external optical fiber 101 so that the external optical fiber 101 is connected to the light receiving component and/or the light emitting component inside the optical module 200 .

The assembly method of combining the upper housing 201 and the lower housing 202 is used to facilitate the installation of the circuit board 300, the light receiving component and/or the light emitting component and other devices into the housing. The upper housing 201 and the lower housing 202 connect these components. The device forms a package for protection. In addition, when assembling components such as the circuit board 300, light emitting components, and light receiving components, the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components of these components. , which is conducive to automated production.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 also includes an unlocking component located outside its housing. The unlocking component is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixation between the optical module 200 and the host computer. connect.

For example, the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 and has a snap component that matches the host computer cage (for example, the cage 106 of the optical network terminal). When the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging parts of the unlocking part. When the unlocking part is pulled, the engaging parts of the unlocking part move accordingly, thereby changing the engaging parts. The connection relationship with the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit wiring, electronic components and chips. The electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). Chips include, for example, microcontroller units (MCU), laser driver chips, limiting amplifiers, clock and data recovery (Clock and Data Recovery, CDR) chips, power management chips, and digital signal processing (Digital Signal Processing, DSP) chips.

The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can smoothly carry the above-mentioned electronic components and chips; when the light receiving component and/or the light emitting component are located When placed on the circuit board, the rigid circuit board can also provide smooth bearing; the rigid circuit board can also be inserted into the electrical connector in the host computer cage.

The circuit board 300 also includes gold fingers formed on its end surface, and the gold fingers are composed of a plurality of mutually independent pin groups. become. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by the gold finger. The golden fingers can be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or can be provided on the upper and lower surfaces of the circuit board 300 to adapt to situations where a large number of pins are required. The golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.

Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards. For example, a flexible circuit board can be used to connect the rigid circuit board to the light receiving component and/or the light emitting component.

The light emitting component and/or the light receiving component are located on the side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component and the light receiving component are physically separated from the circuit board 300 and then passed through the corresponding flexible circuit board. Or the electrical connector is electrically connected to the circuit board 300; in some embodiments, the light emitting component and/or the light receiving component can be directly disposed on the circuit board 300, can be disposed on the surface of the circuit board, or can be disposed on the circuit board. side.

Figure 5 is a schematic structural diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure. Figure 6 is a schematic structural diagram of a laser box according to some embodiments of the present disclosure. Figure 7 is a schematic second structural diagram of a laser box provided according to some embodiments of the present disclosure. Figures 6 and 7 are schematic diagrams of laser boxes in different directions.

The light emitting component includes: a laser box 500 and a main emitting base plate 5400. The lower surface of the laser box 500 and the lower surface of the main emitting base plate 5400 are flush with each other. The main emitting base plate 5400 is located on one side of the laser box 500. The upper surface of the main emitting base plate 5400 is provided with a silicon photonic chip 400 and a silicon photonic driver chip 5300.

An optical fiber coupler 5200 is also provided on the other side of the laser box 500. The light input port of the optical fiber coupler 5200 corresponds to the light output port of the silicon optical chip 400. The optical fiber coupler 5200 couples the modulated signal light into the single-mode optical fiber. One end of the single-mode optical fiber is connected to the optical fiber coupler, and the other end is connected to the first optical fiber adapter to emit signal light.

There is a fiber optic support plate below the fiber optic coupler, which is connected to the launch main chassis 5400 and is used to carry the fiber optic coupler.

The optical fiber support plate and the launch main chassis 5400 are integrated structures to facilitate the positioning and installation of optoelectronic devices during the period.

In order to fix the optical fiber coupler, the laser box 500 is also provided with an installation bearing portion, which is located on the adjacent side of the main emission base plate 5400 . In order to realize that the upper surface of the silicon optical chip 400 and the silicon optical driver chip 5300 is flush with the upper surface of the circuit board, and to facilitate the connection of circuit wiring on the circuit board, the emission main base plate 5400 is provided with a first bearing platform and a second bearing platform, wherein The first carrying platform is used to carry the silicon photonic driver chip 5300, and the second carrying platform is used to carry the silicon photonic chip 400. The upper surfaces of the first bearing platform and the second bearing platform protrude from the bottom surface of the box, and the upper surface of the main launch base plate 5400 is connected to the lower surface of the circuit board 300 .

To facilitate installation, the laser box 500 and the main emission base plate 5400 may be an integral structure, and the installation bearing part is integrally formed with the laser box 500 and the main emission base plate 5400 .

In order to facilitate the connection between the light emitting component and the circuit board, the circuit board is provided with a housing avoidance part. The upper surfaces of the first bearing platform and the second bearing platform are higher than the lower surface of the circuit board. The first bearing platform, the second bearing platform and The laser box 500 is embedded in the avoidance part of the casing so that the light emitting component is flush with the circuit board space, thereby reducing the space above the circuit board occupied by the light emitting component.

The laser box 500 is provided with an open box body 510. The open box body 510 is a rectangular tube structure with an open end. The open box body 510 is equipped with an optoelectronic device. The open box body 510 receives the electrical signal from the circuit board and converts it into a non-conducting signal. of light. The laser box 500 is located on the circuit board 300, and the laser box 500 is electrically connected to the circuit board through a flexible circuit board. exciting A second light window 520 is provided on one side of the light box 500, and the second light window 520 is used for transmitting light. The other side of the laser box 500 is provided with a side wall electrical connection port 540. One end of the flexible circuit board 5100 is connected to the circuit board 300, and the other end extends into the rectangular tube body through the side wall electrical connection port 540. The flexible circuit board 5100 is Power supply for lasers, semiconductor refrigerators and other electrical devices. The first cover 530 covers the opening side of the open box body to seal the opening.

The first cover 530 covers the opening side of the open box to form a first sealed cavity 531 .

FIG. 8 is a schematic diagram 1 of the exploded structure of a laser box according to some embodiments of the present disclosure. FIG. 9 is a schematic diagram 2 of the exploded structure of a laser box provided according to some embodiments of the present disclosure. Figure 10 is a schematic structural diagram of an open box provided according to some embodiments of the present disclosure. As shown in Figures 8, 9 and 10, the open box includes: a top opening 570A, a bottom surface of the box 570, and a first side wall 512, a third side wall 514, a third side wall 514, and a first side wall 512 and a third side wall 514 that are vertically arranged on the bottom surface of the box and connected end to end. two side walls 513 and a fourth side wall 515. A first cover plate 530 is provided on the opposite side of the bottom surface of the box body, and the first cover plate 530 is sealingly connected to the open box body.

A side wall electrical connection port 540 is provided adjacent to the top opening 570A. One end of the flexible circuit board 5100 is connected to the circuit board 300, and the other end extends into the rectangular tube through the side wall electrical connection port 540 to supply power to electrical devices such as lasers and semiconductor refrigerators. For the convenience of description, the following discussion will be introduced in the direction shown in the figure. The upper housing of the optical module is located upward, the lower housing is located downward, the optical port is located to the left, and the electrical port is located to the right. The end surface with the side wall electrical connection port 540 is called the first side wall 512, the side opposite the first side wall is the second side wall 513, and the side opposite the top opening 570A is the bottom surface 570 of the box.

The first sealed cavity can be formed by covering the top opening 570A of the open box with the first cover plate. In order to increase the path length for water vapor to enter the interior of the laser box and increase the firmness of the connection between the first cover plate and the open box body, the present disclosure adopts a plug-in method between the first cover plate and the open box body. Compared with the cover connection method, the contact surface between the first cover plate and the open box body is changed from the bottom edge of the first cover plate to the upper surface of the open shell body to the upper surface edge and lower surface edge of the first cover plate. And the side contact connection with the open housing increases the contact area between the first cover and the open box, and extends the path for water vapor to enter the inside of the laser box.

The second side wall 513 is provided with a side wall insertion opening 511, and the first cover 530 is inserted into the open box through the side wall insertion opening 511. The second side wall 513 is provided with a side wall light opening 5131, and the side wall light opening 5131 is located below the side wall insertion opening 511. The second light window 520 is installed in the light exit opening 5131 of the side wall to facilitate the emission of light inside the laser box. To facilitate installation, the side wall insertion opening 511 is connected to the side wall light opening 5131 to facilitate the connection of the second light window 520 with the side wall of the side wall light opening 5131. The upper surface of the second light window 520 is flush with the lower surface of the side wall insertion opening 511 , and the lower surface of the second cover is in contact with the upper surface of the second light window 520 . In order to improve the coupling efficiency of light, the solid glue between the second cover plate and the second light window 520 is optical glue.

The width of the side wall insertion opening 511 is greater than the width of the side wall light exit opening 5131, and the width of the side wall light exit opening 5131 is set according to the actual width of the light path inside the laser box.

Figure 11 is a schematic cross-sectional view of a laser box according to some embodiments of the present disclosure. As shown in FIG. 11 , the inner wall of the laser box 500 is provided with a first cover groove 5132 and a second cover groove 5133 , where the first cover groove 5132 is located above the second cover groove 5133 . A side wall insertion port 511 is provided on the opposite side of the side wall electrical connection port 540, and the inner wall of the rectangular tube body is recessed to form a first cover groove 5132. The side wall insertion opening 511 is connected with the first cover plate groove 5132, and the first cover plate 530 extends into the first cover plate groove 5132 through the side wall insertion opening 511. In order to increase the sealing between the first cover plate 530 and the box body, solid glue is filled between the first cover plate groove 5132 and the first cover plate 530 .

In order to increase the sealing performance of the laser box, the first cover groove includes a first chute 51321 and a second chute 51321 that are connected in sequence. 51322 and the third chute 51323, where the first chute 51321 is located on the inner surface of the fourth side wall 515, the second chute 51322 is located on the inner surface of the first side wall 512, and the third chute 51323 is located on the third side wall 514 the inner surface. One end of the first cover 530 passes through the side wall insertion opening 511, and then is inserted into the second slide groove 51322 along the first slide groove 51321 and the third slide groove 51323. The width of the first cover plate 530 is greater than the distance between the inner wall of the third side wall 514 and the inner wall of the fourth side wall 515, so that the first cover plate 530 is embedded into the inside of the first cover plate groove 5132 for easy installation. The length of the first cover plate 530 is greater than the distance between the inner wall of the first side wall and the inner wall of the second side wall 513, so that the first cover plate 530 is embedded inside the first cover plate groove 5132 for easy installation.

In order to reduce the occupied space and prevent one end of the first cover 530 from protruding from the outer wall of the second side wall 513, the length of the first cover 530 is shorter than the distance between the outer walls of the first side wall 512 and the second side wall 513. distance.

In order to reduce the variation of the first cover plate 530 with environmental changes and cracks caused by temperature changes between the first cover plate 530 and the first cover plate groove 5132, the first cover plate 530 can be made of glass or raftable alloy.

The inner wall of the rectangular tube body is protruded to form a first cover bracket 5134 and a second cover bracket 5135. The first cover bracket 5134 is located above the second cover bracket 5135. Between the first cover bracket 5134 and the second cover bracket 5135 is a second cover slot 5133. The second cover is embedded in the second cover slot 5133. The second cover is connected to the second cover slot 5133 through solid glue. Fixed connections all around.

To facilitate installation, the first cover bracket 5134 and the second cover bracket 5135 protrude from the inner wall of the open box, and the width of the second cover 550 is smaller than the width of the inner wall of the third side wall 514 and the fourth side wall 515 . such that the second cover 550 can extend between the third side wall and the fourth side wall. The first light window 560 is perpendicular to the upper surface of the bottom surface of the box, and the first light window 560 is in contact with the side wall of the second cover 550 . The first light window 560, the second cover 550, the first side wall, the third side wall, the fourth side wall, and the bottom surface of the box are combined to form a second sealed cavity 551. The second sealed cavity 551 is provided with a light emitting chip and a first lens located on the light emitting path of the light emitting chip.

The first cover bracket 5134 is located above the second cover bracket 5135 . The first cover bracket 5134 includes: a first arm, a second arm and a third arm connected in sequence, wherein the first arm protrudes from the inner wall of the third side wall. The second arm protrudes from the inner wall of the first side wall, and the third arm protrudes from the inner wall of the fourth side wall. One end of the second arm is connected to the first arm, and the other end of the second arm is connected to the third arm. To facilitate the installation of the second cover 550, the lower surfaces of the first arm, the second arm and the third arm are flush.

The second cover bracket 5135 includes: a fourth arm, a fifth arm and a sixth arm connected in sequence, wherein the fourth arm protrudes from the inner wall of the third side wall. The fifth arm protrudes from the inner wall of the first side wall, and the sixth arm protrudes from the inner wall of the fourth side wall. One end of the fifth arm is connected to the fourth arm, and the other end of the fifth arm is connected to the sixth arm. In order to facilitate the installation of the second cover 550, the upper surfaces of the fourth arm, the fifth arm and the sixth arm are arranged flush.

Between the first cover bracket 5134 and the second cover bracket 5135 is a second cover slot 5133. The second cover 550 is embedded in the second cover slot 5133. The second cover 550 is connected to the second cover through solid glue. The groove 5133 is fixedly connected around it. In order to facilitate the installation of the second cover plate 550, the width of the second cover plate groove 5133 is greater than the thickness of the second cover plate 550, that is, the width between the lower surface of the first cover plate bracket 5134 and the upper surface of the second cover plate bracket 5135 The distance is greater than or equal to the thickness of the second cover 550 .

FIG. 12 is a first angle cross-sectional view of an open box provided according to some embodiments of the present disclosure, and FIG. 13 is a second angle cross-sectional view of an open box provided by the present disclosure. Figure 14 is a schematic cross-sectional view of a laser box provided by the present disclosure at a second angle. As shown in Figure 12, Figure 13 and Figure 14, in order to add a second cover 550 To improve the sealing performance, the distance between the lower surface of the first cover bracket 5134 and the upper surface of the second cover bracket 5135 is equal to the thickness of the second cover 550 . The width of the second cover 550 is equal to the distance between the inner wall of the third side wall and the inner wall of the fourth side wall.

The side wall electrical connection port 540 is located below the second cover slot 5133. One end of the flexible circuit board or cermet substrate extends into the second sealed cavity through the side wall electrical connection port 540. The flexible circuit board or cermet substrate is in contact with the light emitting Chip electrical connections.

The third side wall is provided with a limiting plate 518 and an inner wall layer 519, wherein an opening is provided between the limiting plate 518 and the inner wall layer 519. The limiting plate 518 is arranged perpendicular to the third side wall 514. The inner wall layer 519 is located below the limiting plate 518, and one side of the inner wall layer 519 is connected to the third side wall 514, and its adjacent side is connected to the bottom surface 570 of the box. . The second cover plate 550 is disposed between the limiting plate 518 and the inner wall layer 519, which increases the connection area between the second cover plate 550 and the side wall, and increases the stability of the second sealed cavity.

The limiting plate 518 is perpendicular to the inner wall of the third side wall, and the limiting plate 518 is vertically connected to the first arm. The inner wall layer 519 is located below the limiting plate 518. One side of the inner wall layer is connected to the third side wall, and the other side of the inner wall layer is connected to the bottom surface of the box. The second cover plate 550 is disposed between the limiting plate 518 and the inner wall layer 519, which increases the connection area between the second cover plate 550 and the side wall of the box, and increases the stability of the second sealed cavity.

The fourth side wall is provided with a third limiting support plate 516 and a fourth limiting support plate 517, wherein an opening is provided between the third limiting support plate 516 and the fourth limiting support plate 517. The third limiting support plate 516 is arranged perpendicular to the fourth side wall, the fourth limiting support plate 517 is located below the third limiting support plate 516, and one side of the fourth limiting support plate 517 is connected to the fourth side wall. , the other side of the fourth limiting support plate 517 is connected to the bottom surface of the box. The second cover plate 550 is disposed between the third limiting support plate 516 and the fourth limiting support plate 517, which increases the connection area between the second cover plate 550 and the side wall, and increases the stability of the second sealed cavity. sex.

The limiting plate 518 is arranged perpendicularly to the inner wall of the third side wall, and the limiting plate 518 is vertically connected to the first arm. The inner wall layer 519 is located below the limiting plate 518, and one side of the inner wall layer is connected to the third side wall, and the other side of the inner wall layer is connected to the bottom surface of the box. The second cover plate 550 is disposed between the limiting plate 518 and the inner wall layer 519, which increases the connection area between the second cover plate 550 and the side wall, and increases the stability of the second sealed cavity.

The upper surface of the first light window is not lower than the lower surface of the limiting plate 518, and the upper surface of the first light window is not lower than the lower surface of the third limiting support plate 516, so that the first light window abuts the limiting plate 518. The positioning plate 518 and one side of the third limiting support plate 516 . The minimum distance between the inner wall layer 519 and the fourth limiting support plate 517 is greater than the maximum width of the light path of the light emitting component. All the light emitted by the light emitting component passes through the gap between the inner wall layer 519 and the fourth limiting support plate 517 .

A first substrate 630 is disposed in the second sealed cavity, a semiconductor refrigerator 610 is disposed above the first substrate, and a second substrate 620 is disposed above the semiconductor refrigerator. One or more COC structural members 600 are disposed above the second substrate 620 , and light-emitting chips are disposed on the COC structural members. One or more first lenses 700 are disposed above the second substrate 620 . The number of the first lenses 700 corresponds to the number of the light-emitting chips. The first lenses 700 are disposed on the light emitting path of the light-emitting chips and are used to convert the light emitted by the light-emitting chips into parallel light.

The first substrate is also provided with a conductive stake 640. One end of the conductive stake 640 is connected to the first substrate, and the other end of the conductive stake 640 is connected to the flexible circuit board to realize power supply to the semiconductor refrigerator 610. The conductive pile can be made of conductive metal, or it can be a conductive layer laid on the surface of a ceramic plate. Conductive piles include positive conductive piles and negative conductive piles. The upper surface of the conductive pile is connected to the lower surface of the flexible circuit board. In order to facilitate the installation of the flexible circuit board, the upper surface of the conductive pile is flush with the upper surface of the COC structure. The flexible circuit board is electrically connected to the conductive pile and the COC structure.

Since the focal length of the light-emitting chip is between 100 μm and 200 μm, the first light window cannot be disposed between the light-emitting chip and the first lens.

The open box body and the first cover plate 530 are enclosed to form a first sealed cavity, and the second cover plate 550 is embedded in the second cover plate groove 5133 . The second cover 550 is enclosed with the first side wall, the third side wall, the fourth side wall, and the first light window to form a second sealed cavity. The light emitting chip is disposed inside the second sealed cavity to extend the passage of water vapor. The length of the path from the outside into the light-emitting chip can improve the service life of the optical module. In the present disclosure, conventional metal shell materials are used to achieve airtight packaging and reduce the consumption of raw materials.

COC structural parts include: first sub-substrate, selected from alumina ceramics, aluminum nitride ceramics, etc. The functional circuit of the laser chip is engraved on the surface of the first sub-substrate for signal transmission, such as a transmission line. A light emitting chip is provided on the upper surface of the first substrate and is connected to the transmission line. The other end of the transmission line is soldered to the flexible circuit board.

An optical isolator 800 and a second lens 900 are also provided above the bottom surface of the box. The optical isolator 800 is disposed between the first light window 560 and the second lens 900 . The optical isolator 800 allows the path of light emitted by the light-emitting chip to be transmitted while blocking reverse propagation. The second lens is used to convert parallel light into condensed light.

Figure 15 is a third angle sectional view of an open box provided according to some embodiments of the present disclosure, and Figure 16 is a third angle sectional view of a laser box provided according to some embodiments of the present disclosure. In order to realize the transmission of light and ensure that the optical axis of each optical device in the laser box and the optical axis of the light-emitting chip are on the same horizontal line, the upper surface of the bottom surface of the box is provided with platform planes of different heights.

The upper surface of the bottom surface of the box is provided with platform planes of different heights. The height of the first platform 5161 is lower than the height of the second platform 5162 . A semiconductor refrigerator 610 is arranged above the first platform 5161 . The side wall of the inner wall layer is against the junction of the first bearing platform and the second bearing platform, and the side wall of the fourth limiting support plate 517 is against the junction of the first bearing platform and the second bearing platform. The first bearing platform and the second bearing platform form a first step surface due to different heights, and the inner wall layer and the fourth limiting support plate 517 are against the first step surface.

The second bearing platform 5162 is located between the first bearing platform 5161 and the third bearing platform 5163. The upper surface of the third bearing platform 5163 is higher than the upper surface of the second bearing platform 5162. The third bearing platform 5163 and the second bearing platform 5162 form a second step surface due to different heights. The first light window 560 is arranged vertically above the second bearing platform, and one side thereof is connected to the inner wall layer and the fourth limiting support plate 517 , the other side is connected to the second step surface to facilitate positioning and restriction of the first light window 560 . The optical isolator is arranged on the upper surface of the third bearing platform.

A fourth bearing platform 5164 is also provided on the upper surface of the bottom surface of the box, and a second lens 900 is provided above it. To ensure that the optical axes of the second lens, the isolator and the first lens are on the same horizontal line, the upper surface of the fourth bearing platform 5164 is higher than the upper surface of the third bearing platform.

The fixing glue is filled between the flexible circuit board and the inner wall of the side wall electrical connection port 540 to form a seal, which isolates the light emitting chip from the external environment and prevents water vapor outside the laser box from entering the inside of the laser box through the side wall electrical connection port 540, thereby improving shorten the service life of the light-emitting chip.

The bottom plate and side walls of the laser box can be made of metal structural parts, such as die-cast or milled metal parts. Through the arrangement of the two-layer cover plate, the light-emitting chip is sealed in the double-layer casing, thereby achieving airtight packaging of the light-emitting chip in the optical module with a silicon optical structure and improving the service life of the light-emitting chip.

In order to facilitate light coupling, the lower surface of the side wall light opening 5131 is lower than the upper surface of the fourth bearing platform 5164, so that the lower surface of the second light window 520 is lower than the lower surface of the second lens 900 to avoid the second side wall 513 Block the light from the second lens.

In order to reduce the opening size of the laser box and reduce the path for water vapor from outside the laser box to enter the inside, the second light window 520 should be as small as possible. The width of the second light window 520 is smaller than the width of the first cover 530 , and the width of the second light window 520 is smaller than the width of the first light window.

Figure 17 is a schematic diagram of an optical path of a transmitting component according to some embodiments of the present disclosure. The electrical signal received by the light-emitting chip is converted into emitted light that does not carry a signal, and the emitted light is a divergent beam. The first lens is disposed on the initial optical path of the light emitting chip to convert the divergent light beam into a parallel light beam. The parallel light beam is projected through the first light window, then passes through the optical isolator, reaches the second lens, and forms converged light through the converging effect of the second lens. The incident port of the silicon photonic chip is against the outside of the second light window 520 to transmit the light concentrated at the light spot to the silicon photonic chip. The silicon photonic chip performs signal modulation on the received light to form signal light.

Since the above embodiments are described by reference and combination with other methods, different embodiments all have the same parts, and the same and similar parts between the various embodiments in this specification can be referred to each other. No further details will be given here.

Other embodiments of the disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the disclosure that follow the general principles of the disclosure and include common common sense or customary technical means in the technical field that are not disclosed in the disclosure. . It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

The above-described embodiments of the present disclosure do not constitute a limitation on the scope of the present disclosure.

Claims

An optical module including

circuit board;

A laser box, electrically connected to the circuit board, the laser box emits emitted light that does not carry a signal;

A silicon photonic chip is optically connected to the laser box, and the silicon photonic chip receives the emitted light from the laser box;

Wherein, the laser box includes:

The open box includes a top opening, a bottom surface of the box and a plurality of side walls. The side walls are respectively provided with a side wall light-emitting opening, a side wall insertion port and a side wall electrical connection port. The side wall light-emitting opening is connected to the side wall. The side wall electrical connection ports are located on different side walls;

A first cover slot is provided on a different side wall from the side wall insertion opening, and the first cover slot is connected with the side wall insertion opening;

A first cover plate is inserted into the first cover plate groove from the side wall insertion opening, and the first cover plate is located above the light exit opening of the side wall to block the top opening;

The second light window blocks the light-emitting opening of the side wall; the first cover plate, the second light window and the opening box are sealed to form a first sealed cavity;

The inner wall layer is connected to the side wall;

A limiting plate is connected to the side wall, the inner wall layer and the limiting plate are separated from each other, and the gap between the inner wall layer and the limiting plate forms a second cover plate groove, and the inner wall layer and the limiting plate are separated from each other. The wall layer extends to the bottom surface of the box body, and the limiting plate is located below the first cover plate;

A second cover plate is inserted into the second cover plate slot. The second cover plate separates the first cover plate from the bottom surface of the box body. The width of the second cover plate is smaller than that of the first cover plate. the width of the board; and

The first light window is connected to the side of the inner wall layer facing the light exit opening of the side wall. A light emitting chip is provided between the first light window and the electrical connection port of the side wall. The second cover plate One side of the first light window is against the side wall of the first light window, and the second cover, the opening box and the first light window are sealed to form a second sealed cavity.
The optical module according to claim 1, wherein,

The bottom surface of the open box body forms a raised platform platform, the platform platform contacting the inner wall layer, the platform platform forming a step-shaped second platform near the edge of the inner wall layer, so One end of the first light window is arranged on the second bearing platform, and the other end is in contact with the second cover plate.
The optical module according to claim 1, wherein,

The light exit opening and the side wall insertion opening are located on the same side wall, and the light exit opening and the side wall insertion opening are connected with each other. The second light window is in contact with the first cover plate.
The optical module according to claim 1, wherein the inner wall of the opening box is recessed to form the first cover groove;

A first cover bracket protrudes from the inner wall of the open box body;

A second cover bracket is located below the first cover bracket, and the second cover bracket protrudes from the inner wall of the side wall electrical connection port box;

Between the first cover bracket and the second cover bracket is the second cover slot;

The width of the second cover plate is smaller than the width of the first cover plate.
The optical module according to claim 1, wherein the side walls comprise: first sides connected end to end in sequence. wall, third side wall, second side wall and fourth side wall;

The side wall electrical connection port is provided on the first side wall, and the side wall electrical connection port is located below the second cover plate slot;

The flexible circuit board extends into the second sealed cavity through the electrical connection port on the side wall.

The second light window is located on the second side wall;

The second side wall is also provided with the side wall insertion opening, and the first cover plate is embedded in the side wall insertion opening.
The optical module according to claim 5, wherein the bottom surface of the box includes a first bearing platform, a second bearing platform, a third bearing platform and a fourth bearing platform whose upper surfaces are raised in sequence;

The first carrying platform carries a semiconductor refrigerator, a light emitting chip and a first lens;

The first light window is disposed on the second bearing platform, and the end of the second cover plate is against one side of the first light window;

Optical isolator, arranged on the third carrying platform;

The second lens is arranged on the fourth bearing platform,

The light emitted by the light-emitting chip passes through the first lens, the first light window, the optical isolator, the second lens and the second light window in sequence;

The upper surface of the second light window is higher than the upper surface of the second cover.
The optical module according to claim 6, wherein a lower surface of the second light window is disposed lower than an upper surface of the fourth bearing platform.
The optical module according to claim 6, wherein the laser box further includes:

A third limiting support plate is perpendicular to the fourth side wall, and the third limiting support plate is connected to the first cover bracket; and

A fourth limiting support plate is connected to the fourth side wall, and the fourth limiting support plate is perpendicular to the bottom surface of the box; wherein the limiting plate is perpendicular to the third side wall, and The limiting plate is connected to the first cover bracket;

The inner wall layer is connected to the second cover bracket, and the inner wall layer is perpendicular to the bottom surface of the box;

The second cover plate is embedded between the limiting plate and the inner wall layer;

The second cover plate is embedded between the third limiting support plate and the fourth limiting support plate.
The optical module according to claim 8, wherein the first light window is against one side of the third limiting support plate and the fourth limiting support plate;

The width of the first light window is greater than the distance between the third limiting support plate and the fourth limiting support plate.
The optical module according to claim 8, wherein the width of the second cover is less than a gap distance between the inner wall of the third side wall and the inner wall of the fourth side wall.
The optical module according to claim 1, wherein,

The first light window is located inside the first sealed cavity, and the first light window is vertically disposed at the bottom of the open box;

The light-emitting chip is disposed in the second sealed cavity, and the first light window and the second light window are located on the light emitting path of the light-emitting chip.
The optical module according to claim 11, further comprising: a main emission base plate, disposed on one side of the laser box and used to carry silicon photonic chips and silicon photonic driver chips;

The main bottom plate of the launcher and the opening box are of an integrated structure.
The optical module according to claim 6, wherein a lower surface of the second light window is disposed lower than an upper surface of the fourth bearing platform.
The optical module according to claim 1, further comprising a silicon optical chip that receives the emitted light from the laser box and modulates the emitted light to generate signal light.