WO2022257486A1

WO2022257486A1 - Optical module

Info

Publication number: WO2022257486A1
Application number: PCT/CN2022/075055
Authority: WO
Inventors: 郑龙; 孙万菊; 曹亮; 杨思更
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2021-06-08
Filing date: 2022-01-29
Publication date: 2022-12-15

Abstract

An optical module (200), comprising a circuit board (300), a light source (600), a silicon optical chip (400), an optical fiber ribbon (500), and an optical fiber connector (700). The light source (600) is configured to generate a light beam. The silicon optical chip (400) is disposed on the circuit board (300), comprises a light output waveguide (4330), and is configured to modulate the light beam into signal light. The optical fiber ribbon (500) comprises a first optical fiber (510), a second optical fiber (520) and a third optical fiber (530). The light source (600) is connected to the silicon optical chip (400) by means of the third optical fiber (530), and the silicon optical chip (400) is connected to the optical fiber connector (700) by means of the first optical fiber (510), and the second optical fiber (520) to transmit and receive light.

Description

optical module

This disclosure is required to be submitted to the Chinese Patent Office on June 8, 2021, with the application number 202110637526.0, and submitted to the Chinese Patent Office on June 8, 2021, with the application number 202121278360.X, and submitted to China on June 8, 2021 Patent Office, Patent Priority Application No. 202121279007.3, the entire contents of which are incorporated in this disclosure by reference.

technical field

The present disclosure relates to the technical field of optical communication, in particular to an optical module.

Background technique

With the development of cloud computing, mobile Internet, video and other new business and application models, the development and progress of optical communication technology has become more and more important. In optical communication technology, the optical module is a tool to realize the mutual conversion of photoelectric signals, and it is one of the key components in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules continues to increase.

Contents of the invention

In a first aspect, an optical module provided by some embodiments of the present disclosure includes: a circuit board, a light source, a silicon optical chip, an optical fiber ribbon, and an optical fiber connector. The light source is configured to generate light beams; the silicon photonic chip is disposed on the circuit board, the silicon photonic chip includes a light output waveguide; the silicon photonic chip is configured to modulate the light beams into signal light, and The signal light is emitted through the optical output waveguide; the optical fiber ribbon includes a first optical fiber, a second optical fiber, and a third optical fiber, and one end of the first optical fiber is coupled to the light exit surface of the optical output waveguide, There is a gap between the light output surface of the light output waveguide and the fiber end face of the first optical fiber, and an acute angle is formed between the light output surface of the light output waveguide and the fiber end face of the first optical fiber; the second optical fiber One end of the silicon photonic chip is coupled with the light entrance to realize light reception; the light source is connected to the silicon photonic chip through the third optical fiber; the optical fiber connector is connected to the first optical fiber The other end is connected to the other end of the second optical fiber.

In a second aspect, an optical module provided by some embodiments of the present disclosure includes: a circuit board, a light source, a silicon optical chip, an optical fiber ribbon, and an optical fiber connector. The light source is configured to generate light beams; the silicon photonic chip is disposed on the circuit board, the silicon photonic chip includes an optical input waveguide; the silicon photonic chip is configured to convert optical signals into electrical signals; the silicon photonic chip is configured to convert optical signals into electrical signals; The optical fiber ribbon includes a first optical fiber, a second optical fiber and a third optical fiber, one end of the first optical fiber is coupled to the light outlet of the silicon optical chip to realize light emission; one end of the second optical fiber is connected to the optical fiber The light incident surface of the light input waveguide is coupled and connected, there is a gap between the light incident surface of the light input waveguide and the fiber end face of the second optical fiber, and the light incident surface of the light input waveguide is connected to the end surface of the second optical fiber An acute angle is formed between the end faces of the optical fibers; the light source is connected to the silicon optical chip through the third optical fiber; the optical fiber connector is connected to the other end of the first optical fiber and the other end of the second optical fiber.

In a third aspect, an optical module provided by some embodiments of the present disclosure includes: a circuit board, a light source, a silicon optical chip, an optical fiber ribbon, and an optical fiber connector. The light source is configured to generate light beams; the silicon photonic chip is disposed on the circuit board, the silicon photonic chip includes a light output waveguide; the silicon photonic chip is configured to modulate the light beams into signal light, and The signal light is emitted through the optical output waveguide; the optical fiber ribbon includes a first optical fiber, a second optical fiber, and a third optical fiber, and one end of the first optical fiber is coupled to the light exit surface of the optical output waveguide, There is a gap between the light output surface of the light output waveguide and the fiber end face of the first optical fiber, and the fiber end face of the first optical fiber is provided with an anti-reflection film on the side facing the light output surface; the second optical fiber One end of the silicon photonic chip is coupled with the light entrance to realize light reception; the light source is connected to the silicon photonic chip through the third optical fiber; the optical fiber connector is connected to the first optical fiber The other end is connected to the other end of the second optical fiber.

In a fourth aspect, an optical module provided by some embodiments of the present disclosure includes: a circuit board, a light source, a silicon optical chip, an optical fiber ribbon, and an optical fiber connector. The light source is configured to generate light beams; the silicon photonic chip is disposed on the circuit board, the silicon photonic chip includes a light output waveguide; the silicon photonic chip is configured to modulate the light beams into signal light, and The signal light is emitted through the optical output waveguide; the optical fiber ribbon includes a first optical fiber, a second optical fiber, and a third optical fiber, and one end of the first optical fiber is coupled to the light exit surface of the optical output waveguide, There is a gap between the light output surface of the light output waveguide and the fiber end face of the first optical fiber, an acute angle is formed between the light output surface of the light output waveguide and the fiber end face of the first optical fiber, and the fiber end face faces One side of the light-emitting surface is provided with an anti-reflection film; one end of the second optical fiber is coupled to the light entrance of the silicon optical chip to realize light reception; the light source is connected to the third optical fiber through the third optical fiber. The silicon optical chip is connected; the optical fiber connector is connected to the other end of the first optical fiber and the other end of the second optical fiber.

Description of drawings

In order to illustrate the technical solutions in the present disclosure more clearly, the following will briefly introduce the accompanying drawings used in some embodiments of the present disclosure. Apparently, the accompanying drawings in the following description are only appendices to some embodiments of the present disclosure. Figures, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of signals, and the like.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments;

Fig. 3 is a structural diagram of an optical module according to some embodiments;

Figure 4 is an exploded view of an optical module according to some embodiments;

5 is a schematic diagram of assembly of a circuit board, a silicon optical chip, an optical fiber ribbon, and an optical interface in an optical module according to some embodiments;

Fig. 6 is a schematic diagram of another angle assembly of a circuit board, a silicon optical chip, an optical fiber ribbon, and an optical interface in an optical module according to some embodiments;

Fig. 7 is a schematic diagram of the connection of a silicon photonics chip, a light source, an optical fiber ribbon and an optical interface in an optical module according to some embodiments;

8 is a schematic cross-sectional structure diagram of a silicon photonics chip in an optical module according to some embodiments;

Fig. 9 is a schematic diagram of coupling a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments;

Fig. 10 is a side view of the coupling between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments;

Fig. 11 is a first schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber according to some embodiments;

12 is a second schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber according to some embodiments;

Fig. 13 is a structural side view of a silicon optical circuit chip in an optical module according to some embodiments;

14 is a first schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments;

Fig. 15 is a side view of a partial structure of a first optical fiber in an optical module according to some embodiments;

16 is a second schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments;

Fig. 17 is a third schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments;

Fig. 18 is a fourth schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments;

Fig. 19 is a fifth schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments;

Fig. 20 is a schematic diagram of an optical transmission path between a silicon optical circuit chip and a second optical fiber according to some embodiments.

Detailed ways

The technical solutions in some embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments provided in the present disclosure belong to the protection scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the term "comprise" and other forms such as the third person singular "comprises" and the present participle "comprising" are used Interpreted as the meaning of openness and inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific examples" example)" or "some examples (some examples)" etc. are intended to indicate that specific features, structures, materials or characteristics related to the embodiment or examples are included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

Hereinafter, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

In describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited by the context herein.

"At least one of A, B and C" has the same meaning as "at least one of A, B or C" and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: A only, B only, and a combination of A and B.

The use of "suitable for" or "configured to" herein means open and inclusive language that does not exclude devices that are suitable for or configured to perform additional tasks or steps.

As used herein, "about", "approximately" or "approximately" includes the stated value as well as the average within the acceptable deviation range of the specified value, wherein the acceptable deviation range is as determined by one of ordinary skill in the art. Determined taking into account the measurement in question and the errors associated with the measurement of a particular quantity (ie, limitations of the measurement system).

In optical communication technology, light is used to carry information to be transmitted, and the optical signal carrying information is transmitted to information processing equipment such as a computer through optical fiber or optical waveguide and other information transmission equipment to complete the information transmission. Because optical signals have passive transmission characteristics when they are transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved. In addition, the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.

The optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication. The optical module includes an optical port and an electrical port. The optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (such as an optical modem) through the electrical port. It is mainly used to realize power supply, I2C signal transmission, data signal transmission and grounding, etc.; the optical network terminal transmits electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in FIG. 1 , the optical communication system mainly includes a remote server 1000 , a local information processing device 2000 , an optical network terminal 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

One end of the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 . Optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long-distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach thousands of kilometers, tens of kilometers or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the optical network terminal 100 . The local information processing device 2000 may be any one or more of the following devices: routers, switches, computers, mobile phones, tablet computers, televisions, and so on.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 . The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .

The optical module 200 includes an optical port and an electrical port. The optical port is configured to be connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; electrical signal connection. The optical module 200 implements mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100 . For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100 , and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101 .

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 A two-way electrical signal connection is established. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 . For example, the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100, as the host computer of the optical module 200, can monitor the optical module 200 work. In addition to the optical network terminal 100, the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.

The remote server 1000 establishes a two-way signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .

FIG. 2 is a structural diagram of an optical network terminal according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, FIG. 2 only shows the optical network terminal 100 related to the optical module 200. structure. As shown in FIG. 2 , the optical network terminal 100 further includes a PCB circuit board 105 disposed in the casing, a cage 106 disposed on the surface of the PCB circuit board 105 , and an electrical connector disposed inside the cage 106 . The electrical connector is configured to be connected to the electrical port of the optical module 200 ; the heat sink 107 has raised parts such as fins that increase the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 . The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107 . After the optical module 200 is inserted into the cage 106 , the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100 . In addition, the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.

Fig. 3 is a structural diagram of an optical module according to some embodiments, and Fig. 4 is an exploded view of an optical module according to some embodiments. As shown in Figure 3 and Figure 4, the optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking part 203, a circuit board 300, an optical silicon optical chip 400, an optical fiber ribbon 500, a light source 600 and Fiber optic connector 700.

The upper case 201 is closed on the lower case 202 to form the above-mentioned case with two

openings

204 and 205; the outer contour of the case is generally square.

In some embodiments of the present disclosure, the lower case 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate; The two upper side plates are combined by two side walls and two side plates to realize that the upper case 201 is covered on the lower case 202 .

The direction of the line connecting the two

openings

204 and 205 may be consistent with the length direction of the optical module 200 , or may not be consistent with the length direction of the optical module 200 . For example, the opening 204 is located at the end of the optical module 200 (the right end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end in FIG. 3 ). Alternatively, the opening 204 is located at the end of the optical module 200 , while the opening 205 is located at the side of the optical module 200 . Wherein, the opening 204 is an electric port, and the golden finger of the circuit board 300 is extended from the electric port 204, and is inserted into a host computer (such as the optical network terminal 100); the opening 205 is an optical port, configured to be connected to an external optical fiber 101, so that The optical fiber 101 is connected to the inside of the optical module 200 .

The combination of the upper case 201 and the lower case 202 is used to facilitate the installation of components such as the circuit board 300 into the case, and the upper case 201 and the lower case 202 can form packaging protection for these devices. In addition, when assembling components such as the circuit board 300 , it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the implementation of automatic production.

In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realize electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking part 203 located on the outer wall of its housing, and the unlocking part 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or release the connection between the optical module 200 and the host computer. fixed connection.

Exemplarily, the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 , and includes an engaging component matching with a cage of the upper computer (for example, the cage 106 of the optical network terminal 100 ). When the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing The connection relationship between the engaging part and the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, through which the electronic components and chips are connected together according to the circuit design, so as to realize functions such as power supply, electrical signal transmission and grounding. The electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). Chips can include, for example, a Microcontroller Unit (MCU), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip. .

The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function, such as the rigid circuit board can carry the chip stably; the rigid circuit board can also be inserted into the electrical connector in the cage of the upper computer .

The circuit board 300 also includes gold fingers formed on the surface of its end, and the gold fingers are composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106 and electrically connected with the electrical connector in the cage 106 by the gold finger. Gold fingers can be arranged only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or on the upper and lower sides of the circuit board 300, so as to meet the occasions where the number of pins is large. The golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

In order to realize the photoelectric conversion of the optical module, a silicon photonic chip 400 is arranged on the circuit board 300, and the silicon photonic chip 400 can simultaneously modulate the outgoing light generated by the light source 600 according to the power supply circuit and the signal circuit of the circuit board 300 into an outgoing light signal that meets the requirements Send to the optical fiber connector 700, and modulate the optical signal from the optical fiber connector 700 into an electrical signal and send it to the circuit board 300, which can be used as an integrated optical transceiver to realize the conversion of the optical signal.

One end of the silicon photonics chip 400 is connected to the signal circuit of the circuit board 300 , and the other end of the silicon photonics chip 400 is connected to the optical fiber connector 700 through the optical fiber ribbon 500 . When performing photoelectric conversion, the silicon photonic chip 400 is used to transmit optical signals through the optical fiber ribbon 500 and the optical fiber connector 700 , and receive optical signals from the optical fiber connector 700 through the optical fiber ribbon 500 .

One end of the optical fiber ribbon 500 is coupled to the silicon optical chip 400, and the other end of the optical fiber ribbon 500 is connected to the optical fiber connector 700 for transmitting and receiving optical signals. To this end, the optical fiber ribbon 500 may include two sets of optical fibers, namely the first optical fiber and the second optical fiber, the first optical fiber realizes the transmission of the optical signal modulated by the silicon photonics chip 400 to the optical fiber connector 700, and the second optical fiber realizes the transmission from the optical fiber The optical signal from the connector 700 is transmitted to the silicon photonics chip 400 , modulated to form an electrical signal and then sent to the circuit board 300 .

5 is a schematic diagram of assembly of a circuit board, a silicon photonic chip, an optical fiber ribbon, and an optical interface in an optical module according to some embodiments, and FIG. 6 is a schematic diagram of a circuit board, a silicon photonic chip, and an optical fiber in an optical module according to some embodiments. Another schematic diagram of the assembly of the ribbon and the optical interface. FIG. 7 is a schematic diagram of the connection of a silicon optical chip, a light source, an optical fiber ribbon, and an optical interface in an optical module according to some embodiments. As shown in Fig. 5, Fig. 6 and Fig. 7, the optical fiber ribbon 500 includes: a first optical fiber 510 and a second optical fiber 520 arranged parallel to each other, one end of the first optical fiber 510 is coupled to the light outlet of the silicon optical chip 400, and the first The other end of the optical fiber 510 is connected to the optical interface 710 , and the first optical fiber 510 is used to receive the outgoing optical signal modulated by the silicon photonic chip 400 and transmit it to the optical interface 710 to realize light emission. One end of the second optical fiber 520 is coupled and connected to the light entrance of the silicon photonics chip 400, and the other end of the second optical fiber 520 is connected to the optical interface 710. The electrical signal obtained after being modulated by the silicon photonics chip 400 is sent to the circuit board 300 to realize light reception.

The silicon photonic chip 400 is used to realize light modulation so that the power of the optical signal meets the requirements of the optical module. However, since the silicon photonic chip 400 cannot emit light, an external light source is required to realize the emission of the optical signal during the light emission process. For this reason, the optical module provided in this embodiment also includes a light source 600, which can be arranged on the circuit board 300 and connected to the power supply circuit of the circuit board 300 to generate light beams; the light source 600 may not be arranged on the circuit board 300, It is connected with the power supply circuit of the circuit board 300 through gold wires, and is used to generate light beams. The light source 600 is connected to the silicon photonics chip 400 through the third optical fiber 530, one end of the third optical fiber 530 is coupled to the silicon photonics chip 400, the other end of the third optical fiber 530 is connected to the light source 600, and the outgoing light generated by the light source 600 enters through the third optical fiber 530 silicon photonics chip 400 .

A laser chip is packaged in the light source 600. During the light emitting process, the circuit board 300 supplies power to the light source 600 to drive the light source 600 to generate outgoing light. The silicon photonic chip 400 receives the outgoing light generated by the light source 600 through the third optical fiber 530, and processes the outgoing light. The outgoing optical signal is obtained through modulation so that the optical power of the outgoing optical signal meets the optical requirement of the optical module, and the modulated optical signal is sent to the optical interface 710 through the first optical fiber 510 .

There can be multiple laser chips installed in the light source 600, and the specific number of them can be determined according to the use requirements of the optical module, that is, according to the optical path setting of the modulated light of the silicon photonic chip 400, if the silicon photonic chip 400 can realize three-way incident light and four-way modulation of outgoing light, then three laser chips need to be provided, and the light emitted by each laser chip enters the corresponding light input waveguide in the silicon photonic chip 400 .

However, when the light beam generated by the light source 600 is transmitted to the silicon photonic chip 400 through the third optical fiber 530, the light beam is likely to be reflected at the coupling end surface of the third optical fiber 530 and the silicon photonic chip 400, causing part of the reflected light signal to pass through the third optical fiber 530 again. Entering the light source 600, causing light return loss. In addition, when the optical signal modulated by the silicon photonic chip 400 is transmitted to the optical interface 710 through the first optical fiber 510, since there is a gap between the light emitting surface of the silicon photonic chip 400 and the fiber end face of the first optical fiber 510, the optical signal is transmitted from the light emitting surface to the optical interface 710. When emitted to the fiber end face of the first optical fiber 510, due to the change of the medium, the optical signal is prone to reflection when it is emitted to the fiber end face of the first optical fiber 510, causing part of the reflected light signal to re-enter the silicon optical chip 400, resulting in light return loss; there is also a gap between the light-emitting surface of the first optical fiber 510 and the light-incoming end surface of the optical interface 710. When reaching the interface end face of the optical interface 710, reflection is likely to occur, causing part of the reflected optical signal to re-enter the first optical fiber 510, resulting in optical return loss. In addition, when the optical signal received by the optical interface 710 is transmitted to the silicon optical chip 400 through the second optical fiber 520, since there is a gap between the light output end surface of the optical interface 710 and the light incident surface of the second optical fiber 520, the optical interface 710 receives the optical signal. When the signal is injected into the light-incident surface of the second optical fiber 520 from the light-emitting end surface, due to the change of the medium, the optical signal is prone to reflection at the light-incident surface of the second optical fiber 520, causing part of the reflected optical signal to re-enter the optical interface 710, Cause optical return loss; there is also a gap between the light-emitting surface of the second optical fiber 520 and the light-incoming surface of the silicon photonic chip 400, when the optical signal is input into the light-entry surface of the silicon photonic chip 400 from the second optical fiber 520, due to the change of the medium, The optical signal is easily reflected at the light-incident surface of the silicon photonics chip 400 , causing part of the reflected optical signal to re-enter the second optical fiber 520 , resulting in optical return loss.

When the return loss index test of the optical module does not meet the requirements, an optical isolator can be used inside the light source 600 to isolate the optical signal reflected back to the light source 600 through the third optical fiber 530, which can improve part of the return loss index. However, there is no good method for improving the optical return loss at the coupling connection between the first optical fiber 510 and the optical interface 710 and the optical return loss at the coupling connection between the second optical fiber 520 and the silicon optical chip 400 .

Fig. 8 is a schematic cross-sectional structural diagram of a silicon photonics chip in an optical module according to some embodiments, and Fig. 9 is a schematic diagram of a coupling between a silicon photonic circuit chip and a first optical fiber in an optical module according to some embodiments. As shown in Figures 8 and 9, the silicon photonics chip 400 provided by the embodiment of the present application includes a cover plate 410, a substrate 420, and a silicon photonic circuit chip 430. The optical circuit chip 430 and the cover plate 410 are covered on the substrate 420 to place the silicon optical circuit chip 430 in the cavity formed by the cover plate 410 and the substrate 420 .

In the embodiment of the present application, the cover plate 410 and the base plate 420 are provided with openings at one end facing the optical fiber ribbon 500, the openings are provided with a light inlet and a light outlet, and one end of the first optical fiber 510 passes through the light outlet and the silicon optical circuit chip 430 is coupled and connected, so that the optical signal modulated by the silicon optical circuit chip 430 is transmitted to the optical interface 710 through the optical outlet and the first optical fiber 510; one end of the second optical fiber 520 is coupled and connected with the silicon optical circuit chip 430 through the optical entrance, so that the optical signal The photoelectric signal received by the interface 710 is transmitted to the silicon photonic circuit chip 430 through the second optical fiber 520 and the light entrance for photoelectric conversion.

In order to facilitate the coupling connection between the silicon photonic chip 400 and the optical fiber ribbon 500, the end of the optical fiber ribbon 500 facing the silicon photonic chip 400 is provided with a fiber support 540, and the end of the fiber support 540 facing the silicon photonic chip 400 is glued to the silicon photonic circuit chip 430 by optical glue. then fixed. In some embodiments of the present disclosure, the silicon photonics chip 400 further includes a connector 440, one end of the connector 440 is fixedly connected to the upper end surface of the silicon photonics circuit chip 430, and the other end protrudes from the silicon photonics chip 400 and the fiber support 540. The upper end surface of the silicon optical circuit chip 430 is fixedly connected, so that the optical fiber support 540 is suspended near the light-emitting surface of the silicon optical circuit chip 430 through the connector 440, so that the light-emitting surface/light-incoming surface of the silicon optical circuit chip 430 and the optical fiber in the optical fiber support 540 are correspondingly installed. . And when the optical fiber support 540 is installed on the connector 440, there is a preset distance between the end face of the optical fiber in the optical fiber support 540 and the light-emitting surface/light-incoming surface of the silicon optical circuit chip 430, so as to ensure the coupling connection between the silicon optical circuit chip 430 and the optical fiber. .

The fiber holder 540 is provided with a through hole, one end of the through hole faces the silicon photonics chip 400, and the other end faces away from the silicon photonics chip 400, so that the first optical fiber 510 and the second optical fiber 520 are inserted into the through hole, In this way, the first optical fiber 510 is inserted into the fiber holder 540 to couple with the light outlet of the silicon photonic chip 400 , and the second fiber 520 is inserted into the fiber holder 540 to couple with the light inlet of the silicon photonic chip 400 .

Fig. 10 is a side view of a coupling between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments. As shown in Figure 10, the silicon optical circuit chip 430 includes a silicon dioxide layer 4310 and a silicon base layer 4320, the silicon dioxide layer 4310 is arranged on the silicon base layer 4320, and a light output waveguide 4330 is arranged in the silicon dioxide layer 4310, and the light output The light output surface 4340 of the waveguide 4330 facing the first optical fiber 510 is flush with the first end surface of the silicon dioxide layer 4310 facing the first optical fiber 510 , so as to facilitate the signal light emitted from the optical output waveguide 4330 into the first optical fiber 510 .

The first optical fiber 510 includes a core 5110, a cladding 5120 and a cladding cover plate 5130, the cladding 5120 is wrapped around the outside of the core 5110, the cladding cover 5130 is wrapped around the outside of the cladding 5120, and the core 5110 and the light output The light emitting surface 4340 of the waveguide 4330 is correspondingly arranged. In the embodiment of the present application, the fiber end face 5140 of the first optical fiber 510 is the fiber end face of the fiber core 5110 .

FIG. 11 is a first schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber according to some embodiments. As shown in FIG. 11 , the length dimensions of the silicon dioxide layer 4310 and the silicon-based layer 4320 in the left-right direction can be consistent, that is, the first end face of the silicon dioxide layer 4310 facing the first optical fiber 510 is flat with the end face of the silicon-based layer 4320 facing the first optical fiber 510. aligned, and have the same spacing as the fiber end face of the first optical fiber 510. The light exit surface 4340 of the light output waveguide 4330 in the silicon dioxide layer 4310 is parallel to the fiber end face 5140 of the first optical fiber 510, such as the light exit surface 4340 of the light output waveguide 4330 and the fiber end face 5140 of the first optical fiber 510 are vertical planes (vertical On the circuit board 300) or the slopes parallel to each other, the signal light emitted by the light output surface 4340 of the light output waveguide 4330 is vertically incident on the fiber end face 5140 of the first optical fiber 510, because the light output surface 4340 of the light output waveguide 4330 and the first optical fiber 510 There is a gap between the end faces 5140 of the optical fiber. When the signal light is emitted from the light emitting surface 4340 to the end face 5140 of the optical fiber, the medium changes, and the signal light is easily reflected at the end face 5140 of the optical fiber, that is, the vertically incident signal light is reflected at the end face 5140 of the optical fiber , the reflected signal light returns to the optical output waveguide 4330 along the original path, causing optical return loss.

FIG. 12 is a second schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber according to some embodiments. As shown in FIG. 12 , the length dimensions of the silicon dioxide layer 4310 and the silicon-based layer 4320 in the left-right direction may also be inconsistent, that is, the first end face of the silicon dioxide layer 4310 facing the first optical fiber 510 and the end face of the silicon-based layer 4320 facing the first optical fiber 510 Not flush, the distance between the first end face of the silicon optical circuit chip 430 and the fiber end face 5140 of the first optical fiber 510 is greater than the distance between the end face of the silicon base layer 4320 and the fiber end face 5140 of the first optical fiber 510, and the silicon base layer 4320 protrudes A second end surface 4350 is provided on the part of the silicon dioxide layer 4310, the second end surface 4350 is connected to the first end surface, and a reflective surface is provided on the second end surface 4350, since the light output surface 4340 of the light output waveguide 4330 is connected to the first optical fiber There is a distance between the fiber end faces 5140 of 510, when the signal light is emitted from the light exit surface 4340 to the fiber end face 5140, the medium changes, and the signal light is easily reflected at the fiber end face 5140, that is, the light output waveguide 4330 outputs signal light from the light exit surface 4340 When the signal light is transmitted to the second end face 4350, reflection occurs, and the reflected signal light is transmitted to the fiber end face 5140 of the first optical fiber 510, and the reflected signal light may enter the first optical fiber 510 through the fiber end face 5140, causing Optical Return Loss.

Fig. 13 is a side view of a structure of a silicon optical circuit chip in an optical module according to some embodiments, and Fig. 14 is a schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments one. As shown in Figure 13 and Figure 14, in the embodiment of the present application, in order to prevent the signal light emitted from the optical output waveguide 4330 from being reflected at the fiber end face 5140 of the first optical fiber 510, the reflected signal light re-enters the optical output waveguide 4330, the light output surface 4340 of the light output waveguide 4330 in the silicon optical circuit chip 430 can be set as a slope, while the fiber end surface 5140 of the first optical fiber 510 is still a vertical surface. The slope is inclined away from the first optical fiber 510, that is, it is inclined from the upper left to the lower right, so that the light output surface 4340 forms a certain angle α with the fiber end face 5140 of the first optical fiber 510, so that the signal light output by the optical output waveguide 4330 cannot be vertically emitted to the second optical fiber 510. On the fiber end face 5140 of an optical fiber 510, the signal light emitted from the light emitting surface 4340 is first transmitted to the second end face 4350, and reflected at the second end face 4350, and then the reflected signal light is transmitted to the fiber end face of the first optical fiber 510 5140 , the partially reflected signal light enters the first optical fiber 510 through the optical fiber end face 5140 , and the partially reflected signal light is reflected again at the optical fiber end face 5140 .

Since the light output surface 4340 of the optical output waveguide 4330 is an inclined plane, the light output angle of the signal light emitted by the optical output waveguide 4330 is increased. After the light output angle is increased, the signal light reflected to the fiber end face 5140 is reflected by the second end face 4350 The incident angle is relatively large, and after the signal light with a relatively large incident angle is reflected again by the fiber end face 5140, the re-reflected signal light has a relatively large exit angle, which can ensure that the re-reflected signal light will not re-enter the optical output waveguide 4330, Therefore, the optical return loss of the coupling surface between the silicon photonics chip 400 and the first optical fiber 510 can be reduced.

In the embodiment of the present application, in order to ensure that the signal light emitted from the optical output waveguide 4330 cannot enter the optical output waveguide 4330 after being reflected by the second end face 4350 and reflected again by the optical fiber end face 5140, the light output surface 4340 of the optical output waveguide 4330 and the first The angle α between the fiber end faces 5140 of the optical fiber 510 is 8˜11°.

In some embodiments of the present disclosure, in addition to setting the light output surface 4340 of the light output waveguide 4330 as an inclined plane and the fiber end face 5140 of the first optical fiber 510 as a vertical plane to reduce the optical return loss at the optical interface of the silicon photonics chip 400 In this application, the light output surface 4340 of the optical output waveguide 4330 can be set as a vertical plane, and the fiber end face 5140 of the first optical fiber 510 can be set as a slope to reduce the optical return loss at the optical interface of the silicon photonic chip 400 .

Fig. 15 is a side view of a partial structure of a first optical fiber in an optical module according to some embodiments, and Fig. 16 is a schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments two. As shown in Figure 15 and Figure 16, in order to prevent the signal light emitted from the optical output waveguide 4330 from being reflected at the fiber end face 5140 of the first optical fiber 510, and the reflected signal light re-enter the optical output waveguide 4330, the first The fiber end surface 5140 of the optical fiber 510 is set as a slope, and the light output surface 4340 of the light output waveguide 4330 in the silicon optical circuit chip 430 is set as a vertical surface. The slope of the optical fiber end face 5140 is inclined towards the silicon optical circuit chip 430, that is, it is inclined from the upper left to the lower right, so that the optical fiber end face 5140 forms a certain angle β with the light output surface 4340, so that the signal light output by the optical output waveguide 4330 is transmitted to the second end face 4350 , and reflected at the second end face 4350, the reflected signal light is transmitted to the fiber end face 5140 of the first optical fiber 510, part of the reflected signal light enters the first optical fiber 510 through the fiber end face 5140, and part of the reflected signal light Reflection occurs again at the fiber end face 5140.

Since the fiber end face 5140 of the first optical fiber 510 is an inclined plane, the incident angle at which the signal light enters the fiber end face 5140 is increased, thereby also increasing the output angle at which the signal light is reflected again at the fiber end face 5140, so that the reflected signal The light is reflected at the fiber end face 5140 at a relatively large angle, and the reflected signal light will not enter the optical output waveguide 4330 , thereby reducing the optical return loss of the coupling surface between the silicon photonic chip 400 and the first optical fiber 510 .

In the embodiment of the present application, in order to ensure that the signal light emitted from the optical output waveguide 4330 cannot enter the optical output waveguide 4330 after being reflected by the second end face 4350 and reflected again by the optical fiber end face 5140, the optical fiber end face 5140 of the first optical fiber 510 and the optical output The angle β between the light emitting surfaces 4340 of the waveguides 4330 is 6° to 9°.

In some embodiments of the present disclosure, in addition to setting the light output surface 4340 of the light output waveguide 4330 as a vertical plane and the fiber end face 5140 of the first optical fiber 510 as a slope to reduce the optical return loss at the optical interface of the silicon photonics chip 400 In the present application, both the light output surface 4340 of the light output waveguide 4330 and the fiber end surface 5140 of the first optical fiber 510 can be set as slopes to reduce the optical return loss at the optical interface of the silicon optical chip 400 .

Fig. 17 is a third schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments. As shown in Figure 17, in order to prevent the signal light emitted by the optical output waveguide 4330 from being reflected at the fiber end face 5140 of the first optical fiber 510, and the reflected signal light re-enter the optical output waveguide 4330, the silicon optical circuit chip 430 can also be placed The light output surface 4340 of the middle light output waveguide 4330 is set as a slope, and the fiber end face 5140 of the first optical fiber 510 is also set as a slope, but the slope of the light output surface 4340 is not parallel to the slope of the fiber end face 5140. The light-emitting surface 4340 is inclined away from the first optical fiber 510, that is, it is inclined from the upper left to the lower right, so that the light-emitting surface 4340 and the silicon-based layer 4320 form a certain angle α toward the third end surface 4360 of the first optical fiber 510; the slope of the optical fiber end surface 5140 faces the silicon optical fiber. The circuit chip 430 is inclined, that is, inclined from the upper left to the lower right, so that the optical fiber end face 5140 and the silicon base layer 4320 form a certain angle β towards the third end face 4360 of the first optical fiber 510, so that the signal light output by the optical output waveguide 4330 is transmitted to the second end face 4350, and reflected at the second end face 4350, the reflected signal light is transmitted to the fiber end face 5140 of the first optical fiber 510, the partially reflected signal light enters the first optical fiber 510 through the fiber end face 5140, and the partially reflected signal light The signal light is reflected again at the fiber end face 5140 .

Since the light output surface 4340 of the optical output waveguide 4330 is an inclined plane, the light output angle of the signal light emitted by the optical output waveguide 4330 is increased. After the light output angle is increased, the signal light reflected to the fiber end face 5140 is reflected by the second end face 4350 The incident angle is relatively large, and after the signal light with a large incident angle is reflected again by the fiber end face 5140, the signal light exit angle after the re-reflection is relatively large; in addition, since the fiber end face 5140 of the first optical fiber 510 is a slope, the signal The incident angle of the light entering the fiber end face 5140 also increases the output angle of the signal light re-reflected at the fiber end face 5140 , so that the re-reflected signal light is reflected at the fiber end face 5140 at a larger angle. In this way, it can be ensured that the reflected signal light will not re-enter the optical output waveguide 4330 , thereby reducing the optical return loss at the coupling surface between the silicon photonic chip 400 and the first optical fiber 510 .

In the embodiment of the present application, in order to ensure that the signal light emitted by the optical output waveguide 4330 cannot enter the optical output waveguide 4330 after being reflected by the second end face 4350 and reflected again by the optical fiber end face 5140, the light output surface 4340 of the optical output waveguide 4330 and the silicon-based layer The angle α between the third end faces 4360 of the 4320 is 8-11°, and the angle β between the fiber end face 5140 of the first optical fiber 510 and the third end face 4360 of the silicon-based layer 4320 is 6-9°.

In some embodiments of the present disclosure, in addition to setting the light output surface 4340 of the light output waveguide 4330 and the fiber end face 5140 of the first optical fiber 510 as inclined planes to reduce the optical return loss at the optical interface of the silicon photonic chip 400, the present application The light output surface 4340 of the light output waveguide 4330 and the fiber end face 5140 of the first optical fiber 510 can also be set to be vertical, and an anti-reflection film is provided on the side of the fiber end face 5140 facing the silicon photonics chip 400, through the anti-reflection film. The signal light reflected again at the end face 5140 of the optical fiber is absorbed, so as to reduce the optical return loss from the optical interface of the silicon photonic chip 400 .

Fig. 18 is a fourth schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments. As shown in Figure 18, in order to prevent the signal light emitted from the optical output waveguide 4330 from being reflected at the fiber end face 5140 of the first optical fiber 510, the reflected signal light re-enters the optical output waveguide 4330, and the light output waveguide 4330 can also be The light-emitting surface 4340 is set as a vertical plane, the fiber end face 5140 of the first optical fiber 510 is set as a vertical plane, and a first metal antireflection film 5150 is provided on the side of the fiber end face 5140 facing the silicon photonics chip 400, and the antireflection film is pasted on The fiber end face 5140 is facing one side of the silicon photonics chip 400 .

In this way, when the signal light output from the light output surface 4340 of the optical output waveguide 4330 is vertically incident on the fiber end face 5140 of the first optical fiber 510, the vertically incident signal light is directly transmitted through the first metal anti-reflection coating 5150 and input into the first optical fiber 510 without Reflection will occur at the fiber end face 5140, and no reflected light will enter the optical output waveguide 4330; or, the signal light emitted from the light output surface 4340 of the optical output waveguide 4330 is transmitted to the second end face 4350, and then transmitted to the second end face 4350. Reflection occurs at the end face 4350, and the reflected signal light is transmitted to the fiber end face 5140 of the first optical fiber 510. Since the first metal anti-reflection coating 5150 is provided on one side of the fiber end face 5140, the signal light reflected by the second end face 4350 is transmitted to After the fiber end face 5140, the signal light passes through the first metal anti-reflection coating 5150 and the fiber end face 5140 and directly enters the first optical fiber 510 without re-reflection at the fiber end face 5140, and there will be no re-reflected signal light enters into the optical output waveguide 4330, thereby reducing the optical return loss of the coupling surface between the silicon optical chip 400 and the first optical fiber 510.

In the embodiment of the present application, in order to ensure that the signal light emitted from the optical output waveguide 4330 directly enters the core 5110 of the first optical fiber 510 through the first metal anti-reflection coating 5150 and the fiber end face 5140, at the same time, the first metal anti-reflection film cannot be The side surface of the transparent film 5150 is in contact with the third end surface 4360 of the silicon photonic circuit chip 430, and the thickness of the first metal anti-reflection film 5150 is 5-20 microns.

When the first metal anti-reflection film 5150 is provided on one side of the fiber end face 5140, a layer of the first metal anti-reflection film 5150 can be directly coated on the side of the fiber end face 5140 facing the silicon photonics chip 400, and the first metal anti-reflection film The coating thickness of 5150 is a preset thickness, which increases the anti-reflection property of the fiber end face 5140, so that the signal light directly passes through the fiber end face 5140 and enters the first optical fiber 510; the first metal anti-reflection film 5150 with a preset thickness can also be processed, and then One side of the first metal anti-reflection film 5150 and one side of the fiber end face 5140 are glued together, so that the signal light directly enters the first optical fiber 510 through the fiber end face 5140 .

In some embodiments of the present disclosure, in addition to setting the light output surface 4340 of the light output waveguide 4330 and the fiber end face 5140 of the first optical fiber 510 to be vertical, and the side of the fiber end face 5140 facing the silicon optical chip 400 is provided with Anti-reflection coating, the anti-reflection coating is used to prevent the signal light from being reflected again on the fiber end face 5140, so as to reduce the optical return loss from the optical interface of the silicon optical chip 400, the application can also set the light output surface 4340 of the optical output waveguide 4330 As a vertical plane, the fiber end face 5140 of the first optical fiber 510 is set as a slope, and an anti-reflection coating is provided on the slope of the fiber end face 5140, and the anti-reflection film is used to prevent signal light from being reflected again at the fiber end face 5140, thereby reducing silicon light. Optical return loss from the optical interface of chip 400.

Fig. 19 is a fifth schematic diagram of an optical transmission path between a silicon optical circuit chip and a first optical fiber in an optical module according to some embodiments. As shown in Figure 19, in order to prevent the signal light emitted from the optical output waveguide 4330 from being reflected at the fiber end face 5140 of the first optical fiber 510, the reflected signal light re-enters the optical output waveguide 4330, and the light output waveguide 4330 can also be The light emitting surface 4340 is set as a vertical plane, the fiber end face 5140 of the first optical fiber 510 is set as a slope, and a second metal anti-reflection coating 5160 is set on the side of the slope facing the silicon photonics chip 400 . The slope of the optical fiber end face 5140 is inclined towards the silicon optical circuit chip 430, that is, it is inclined from the upper left to the lower right, so that the optical fiber end face 5140 forms a certain angle δ with the light output surface 4340 of the optical output waveguide 4330, so that the signal light output by the optical output waveguide 4330 is transmitted to at the second end face 4350 , and reflection occurs at the second end face 4350 , and the reflected signal light is transmitted to the fiber end face 5140 of the first optical fiber 510 .

In addition, since the fiber end face 5140 is provided with a second metal anti-reflection film 5160 on the side facing the silicon photonics chip 400, the signal light reflected by the second end face 4350 is transmitted to the fiber end face 5140, and the signal light passes through the second metal anti-reflection film 5160 directly enter the first optical fiber 510 with the fiber end face 5140, without re-reflection at the fiber end face 5140, and there will be no re-reflected signal light entering the optical output waveguide 4330, so that some In the embodiment, the optical return loss of the coupling surface between the silicon photonics chip 400 and the first optical fiber 510 is reduced.

In the embodiment of the present application, in order to ensure that the signal light emitted from the optical output waveguide 4330 cannot enter the optical output waveguide 4330 after being reflected by the second end face 4350 and reflected again by the optical fiber end face 5140, the optical fiber end face 5140 of the first optical fiber 510 and the optical output The angle δ between the light emitting surfaces 4340 of the waveguides 4330 is 6° to 9°. Meanwhile, in order to prevent the side surface of the second metal anti-reflection film 5160 from contacting the third end surface 4360 of the silicon optical circuit chip 430, the thickness of the second metal anti-reflection film 5160 is 5-20 microns.

When the second metal anti-reflection film 5160 is provided on one side of the fiber end face 5140, a second metal anti-reflection film 5160 can be directly coated on the slope of the fiber end face 5140 facing the silicon photonics chip 400, and the second metal anti-reflection film 5160 The coating thickness of the transparent film 5160 is a preset thickness, which increases the anti-reflection property of the fiber end face 5140, so that the signal light directly passes through the fiber end face 5140 and enters the first optical fiber 510; a second metal anti-reflection film 5160 with a preset thickness can also be processed , and then glue one side of the second metal anti-reflection film 5160 and one side of the fiber end face 5140 together, so that the signal light directly passes through the fiber end face 5140 and enters the first optical fiber 510 .

Fig. 20 is a schematic diagram of an optical transmission path between a silicon optical circuit chip and a second optical fiber according to some embodiments. As shown in FIG. 20 , in the optical module provided by the embodiment of the present application, not only is the optical return loss easily generated at the coupling end face of the silicon optical chip 400 and the first optical fiber 510, but also at the coupling end face of the silicon optical chip 400 and the second optical fiber 520. It is also prone to optical return loss. When the light entrance of the silicon photonic chip 400 is coupled to the second optical fiber 520, the signal light received by the optical interface 710 is transmitted in the second optical fiber 520, and the signal light is transmitted to the fiber end face 5240 of the second optical fiber 520 close to the silicon photonic chip 400 , because there is a gap between the fiber end face 5240 of the second optical fiber 520 and the light entrance of the silicon photonic chip 400, when the signal light is incident from the fiber end face 5240 to the light entrance of the silicon photonic chip 400, the signal light may be vertically incident on the silicon light The light in the chip 400 is input to the light incident surface 4380 of the waveguide 4370. Due to the change of the medium, the signal light is prone to reflection when the light incident surface 4380 is set, causing the reflected signal light to return to the second optical fiber 520 along the original path, resulting in optical return loss.

To solve this problem, the present application can avoid the optical return loss at the coupling end face of the silicon photonic chip 400 and the first optical fiber 510 by avoiding the optical return loss at the coupling end face of the silicon photonic chip 400 and the second optical fiber 520, thereby improving the optical return loss of the first optical fiber 510. The light-receiving performance of the two optical fibers 520 and the silicon photonics chip 400 .

The optical module provided in the embodiment of the present application includes a circuit board, a silicon optical chip, an optical fiber ribbon, a light source, and an optical interface. The silicon photonics chip is arranged on the circuit board, and the light source is electrically connected to the power supply circuit of the circuit board to generate light beams; the optical fiber ribbon includes a first optical fiber, a second optical fiber and a third optical fiber, and the light beam generated by the light source is transmitted to the silicon photonics through the third optical fiber. chip; the silicon light chip modulates the light beam according to the power supply circuit and signal circuit of the circuit board, and the modulated signal light is transmitted to the optical interface through the first optical fiber to realize light emission; the signal light received by the optical interface is transmitted to the optical interface through the second optical fiber The silicon photonic chip is converted into an electrical signal by the silicon photonic chip to realize light reception. When the silicon photonic chip is coupled with the first optical fiber, there is a gap between the light output surface of the optical output waveguide in the silicon photonic chip and the fiber end face of the first optical fiber. Light is prone to reflection at the end face of the optical fiber, and the reflected signal light enters the optical output waveguide to cause optical return loss. In order to reduce the optical return loss of the optical output interface of the silicon photonic chip, the application sets the light output surface of the optical output waveguide in the silicon photonic chip as an inclined plane, the fiber end face of the first optical fiber as a vertical plane, and the light output surface of the optical output waveguide as The vertical plane, the fiber end face of the first optical fiber are set as inclined planes, the light output surface of the light output waveguide and the fiber end face of the first optical fiber are both set as inclined planes, the light output surface of the light output waveguide and the fiber end face of the first optical fiber are both set as vertical planes, And the first metal antireflection film is set on the side of the optical fiber end facing the silicon photonic chip, the light output surface of the light output waveguide is set as a vertical plane, the fiber end face of the first optical fiber is set as a slope, and the side of the slope facing the silicon photonic chip Set the second metal anti-reflection coating to prevent the signal light reflected on the end face of the optical fiber from re-entering the optical output waveguide, thereby effectively reducing the optical return loss at the coupling connection between the silicon optical chip and the first optical fiber, and ensuring the optical emission of the optical module performance.

Similarly, when the silicon photonic chip is coupled to the second optical fiber, there is a gap between the light incident surface of the light input waveguide in the silicon photonic chip and the fiber end face of the second optical fiber, and the signal light is emitted from the fiber end face of the second optical fiber to the light incident surface. When the optical fiber is connected to the second optical fiber, the signal light is likely to be reflected at the light incident surface due to the change of the medium, and the reflected signal light enters the second optical fiber to cause optical return loss. In order to reduce the optical return loss of the optical input interface of the silicon optical chip, this application can avoid the optical return loss at the coupling end face of the silicon optical chip and the first optical fiber by avoiding the optical return loss at the coupling end face of the silicon optical chip and the second optical fiber , if the fiber end face of the second optical fiber is set as an inclined plane, the light incident surface of the light input waveguide is set as a vertical plane, the fiber end face of the second optical fiber is set as a vertical plane, and the light incident surface of the light input waveguide is set as a beveled plane, the second optical fiber The end face of the optical fiber and the light incident surface of the light input waveguide are set as vertical planes, and a metal anti-reflection coating is set on the side of the light incident surface facing the second optical fiber, the light incident surface of the light input waveguide is set as a slope, and the second optical fiber The end face of the optical fiber is set as a vertical plane, and a metal anti-reflection film is set on the side of the inclined plane facing the second optical fiber, thereby improving the light receiving performance of the optical module.

The above is only a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Anyone familiar with the technical field who thinks of changes or substitutions within the technical scope of the present disclosure should cover all within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be determined by the protection scope of the claims.

Claims

An optical module, comprising:

circuit board;

a light source configured to generate a light beam;

A silicon photonic chip, disposed on the circuit board, including an optical output waveguide; the silicon photonic chip is configured to modulate the light beam into signal light, and emit the signal light through the optical output waveguide;

An optical fiber ribbon, including a first optical fiber, a second optical fiber and a third optical fiber, one end of the first optical fiber is coupled and connected to the light output surface of the light output waveguide, and the light output surface of the optical output waveguide is connected to the light output surface of the first optical fiber There is a gap between the end faces of the optical fibers, and an acute angle is formed between the light output surface of the optical output waveguide and the optical fiber end face of the first optical fiber; one end of the second optical fiber is coupled to the optical entrance of the silicon optical chip, To realize light reception; the light source is connected to the silicon optical chip through the third optical fiber;

an optical fiber connector connected to the other end of the first optical fiber and the other end of the second optical fiber.
The optical module according to claim 1, wherein the light output surface of the optical output waveguide is set as a slope, and the slope faces away from the first optical fiber; the fiber end face of the first optical fiber is set as a vertical surface, the The vertical plane is perpendicular to the circuit board; the angle between the light emitting plane and the end face of the optical fiber is a first angle.
The optical module according to claim 1, wherein the light output surface of the optical output waveguide is set as a vertical plane, and the vertical plane is perpendicular to the circuit board; the fiber end face of the first optical fiber is set as an inclined plane, the The slope faces the light output waveguide; the angle between the light output surface and the end surface of the optical fiber is a second angle.
The optical module according to claim 1, wherein the light output surface of the optical output waveguide is set as a slope, and the slope faces away from the first optical fiber; the fiber end face of the first optical fiber is set as a slope, and the slope toward said light output waveguide;

The angle between the light emitting surface and the vertical surface of the circuit board is a first angle, and the angle between the optical fiber end surface and the vertical surface of the circuit board is a second angle.
The optical module according to claim 2 or 4, wherein the first angle is 8-11°.
The optical module according to claim 3 or 4, wherein the second angle is 6-9°.
The optical module according to claim 1, wherein the silicon optical chip comprises a silicon optical circuit chip, the silicon optical circuit chip comprises a silicon dioxide layer and a silicon base layer, and the silicon dioxide layer is disposed on the silicon base layer above, the light output waveguide is disposed in the silicon dioxide layer;

The distance between the silicon dioxide layer and the end face of the optical fiber is greater than the distance between the silicon base layer and the end face of the optical fiber, and the silicon base layer protrudes from the second end face of the silicon dioxide layer to provide a reflection Floor.
The optical module according to claim 7, wherein the first optical fiber comprises a core, a cladding wrapped around the core, and a cover plate wrapped around the cladding, and the fiber end face of the core is in contact with the cladding The light output surface of the light output waveguide is set correspondingly.
The optical module according to claim 7, further comprising an optical fiber support and a connector, the optical fiber support is suspended at the end face of the silicon optical circuit chip through the connector; the first optical fiber and the second Both optical fibers are inserted into the optical fiber holder.
An optical module, comprising:

circuit board;

a light source configured to generate a light beam;

a silicon photonic chip, disposed on the circuit board, including an optical input waveguide; the silicon photonic chip is configured to convert an optical signal into an electrical signal;

An optical fiber ribbon, including a first optical fiber, a second optical fiber and a third optical fiber, one end of the first optical fiber is coupled to the light outlet of the silicon photonic chip to realize light emission; one end of the second optical fiber is connected to the optical fiber The light incident surface of the light input waveguide is coupled and connected, there is a gap between the light incident surface of the light input waveguide and the fiber end face of the second optical fiber, and the light incident surface of the light input waveguide is connected to the second optical fiber An acute angle is formed between the end faces of the optical fibers; the light source is connected to the silicon optical chip through the third optical fiber;

an optical fiber connector connected to the other end of the first optical fiber and the other end of the second optical fiber.
An optical module, comprising:

circuit board;

a light source configured to generate a light beam;

A silicon photonic chip, disposed on the circuit board, including an optical output waveguide; the silicon photonic chip is configured to modulate the light beam into signal light, and emit the signal light through the optical output waveguide;

An optical fiber ribbon, including a first optical fiber, a second optical fiber and a third optical fiber, one end of the first optical fiber is coupled and connected to the light output surface of the light output waveguide, and the light output surface of the optical output waveguide is connected to the light output surface of the first optical fiber There is a gap between the end faces of the optical fibers, and the fiber end face of the first optical fiber is provided with an anti-reflection film on the side facing the light-emitting surface; one end of the second optical fiber is coupled to the light entrance of the silicon optical chip, To realize light reception; the light source is connected to the silicon optical chip through the third optical fiber;

an optical fiber connector connected to the other end of the first optical fiber and the other end of the second optical fiber.
The optical module according to claim 11, wherein the light output surface of the optical output waveguide, the end surface of the optical fiber and the anti-reflection coating are all perpendicular to the circuit board.
The optical module according to claim 11, wherein the antireflection film has a thickness of 5-20 microns.
The optical module according to claim 11, wherein the anti-reflection film is a metal anti-reflection film.
The optical module according to claim 14, wherein the metal anti-reflection film is coated on a side of the fiber end face of the first optical fiber facing the light-emitting surface.
The optical module according to claim 15, wherein the diameter of the anti-reflection coating is consistent with the diameter of the first optical fiber.
The optical module according to claim 15, wherein a diameter of the anti-reflection coating is larger than a diameter of a core in the first optical fiber.
An optical module, comprising:

circuit board;

a light source configured to generate a light beam;

A silicon photonic chip, disposed on the circuit board, including an optical output waveguide; the silicon photonic chip is configured to modulate the light beam into signal light, and emit the signal light through the optical output waveguide;

An optical fiber ribbon, including a first optical fiber, a second optical fiber and a third optical fiber, one end of the first optical fiber is coupled and connected to the light output surface of the light output waveguide, and the light output surface of the optical output waveguide is connected to the light output surface of the first optical fiber There is a gap between the end faces of the optical fibers, an acute angle is formed between the light output surface of the optical output waveguide and the fiber end face of the first optical fiber, and an anti-reflection film is provided on the side of the optical fiber end face facing the light output surface; One end of the second optical fiber is coupled and connected to the light entrance of the silicon photonic chip to realize light reception; the light source is connected to the silicon photonic chip through the third optical fiber;

an optical fiber connector connected to the other end of the first optical fiber and the other end of the second optical fiber.