WO2024029722A1

WO2024029722A1 - Small-parts transport apparatus and manufacturing method therefor

Info

Publication number: WO2024029722A1
Application number: PCT/KR2023/007838
Authority: WO
Inventors: 안승배; 박진성
Original assignee: 안승배; 박진성
Priority date: 2022-08-04
Filing date: 2023-06-08
Publication date: 2024-02-08
Also published as: TW202406818A; TWI835670B; CN117550234A; KR102565999B1

Abstract

Disclosed are a small-parts transport apparatus and a manufacturing method therefor. A small-parts transport apparatus is manufactured by forming an adhesive layer on the lower surface of a transport tape, forming a small-parts accommodation space by perforating the transport tape and the adhesive layer along with each other, and attaching a lower cover tape to the lower surface of the adhesive layer to block the small-parts accommodation space. Also, the transport tape having the adhesive layer on the lower surface thereof can be manufactured by forming an adhesive layer on the lower surface of a transport tape original plate having a certain area and cutting the transport tape original plate to a certain width. Because the transport tape and the adhesive layer are perforated at once along with each other, the small parts do not stick to the adhesive layer when the small parts are embedded in the accommodation space formed through the perforation.

Description

Micro parts transportation device and manufacturing method thereof

Embodiments of the present invention relate to a small parts transportation device that transports small parts of several to tens of mm or less and a manufacturing method thereof.

In order to transport microcomponents such as integrated circuit (IC) chips, modules, or other precision electronic components, a transport device with a space to accommodate them is required. Conventional transportation devices generally use a molding process to form spaces. For example, as shown in FIG. 8, heat and pressure are applied to the plastic 500 using a bar 510 of a certain size to form a space 520 in which micro-parts can be embedded. However, with the advancement of technology, the size of micro-components is becoming smaller and smaller, and there are limits to creating a transportation device with a small accommodation space suitable for the size of these micro-components through the molding process.

The technical problem to be achieved by the embodiments of the present invention is to provide a micro-part transportation device and a manufacturing method thereof that can accommodate micro-parts of various sizes through perforations and solve the problem of the micro-components sticking to each other by an adhesive.

An example of a method of manufacturing a small parts transport device according to an embodiment of the present invention to achieve the above technical problem includes forming an adhesive layer on the lower surface of a transport tape; Forming a micropart receiving space by perforating the transport tape and the adhesive layer together; and attaching a lower cover tape to the lower surface of the adhesive layer to block the small component accommodation space.

An example of a small parts transport device according to an embodiment of the present invention to achieve the above technical problem includes a transport tape; an adhesive layer located below the transport tape; a lower cover tape located below the adhesive layer; and a micro-component receiving space formed by perforating the transport tape and the adhesive layer together.

According to an embodiment of the present invention, a transportation tape capable of accommodating micro-parts can be formed through perforations. In addition, since the transportation tape and the adhesive layer are perforated together at the same time, the micro-parts do not stick to the adhesive layer when embedded in the receiving space formed through the perforations.

1 is a diagram showing an example of a small parts transportation device according to an embodiment of the present invention;

Figure 2 is a diagram showing an example of the detailed configuration of a small parts transportation device according to an embodiment of the present invention;

3 to 6 are diagrams showing an example of a method of manufacturing a small parts transportation device according to an embodiment of the present invention;

7 is a diagram showing an example of another method of forming an adhesive layer according to an embodiment of the present invention, and

Figure 8 is a diagram showing an example of a method of producing a transport tape using a conventional forming method.

Hereinafter, with reference to the attached drawings, a detailed description will be given of the microparts transportation device and its manufacturing method according to an embodiment of the present invention.

1 is a diagram illustrating an example of a small parts transport device according to an embodiment of the present invention.

Referring to FIG. 1, the small parts transport device 100 is in the form of a tape that accommodates small parts of several millimeters in size in grooves 102 formed at regular intervals along the longitudinal direction. In the micro-part transport device 100, the size of the accommodation space 102 is determined according to the size of the micro-part. The micro-part transport device 100 is made of a bendable material and can be transported by being wound on a reel 110.

Figure 2 is a diagram showing an example of the detailed configuration of a small parts transportation device according to an embodiment of the present invention.

Referring to FIG. 2, the small parts transport device 100 includes a transport tape 200, an adhesive layer 210, and a lower cover tape 220. The micro-part transport device 100 may further include an upper cover tape 230. This embodiment shows an example in which the small parts transport device 100 includes an upper cover tape 230, but the upper cover tape 230 is attached to seal the receiving space 202 containing the small parts. Since it is a tape, the micropart transport device 100 may not include the upper cover tape 230. Alternatively, the microparts transport device 100 may not include the lower cover tape 220. However, hereinafter, for convenience of explanation, a case where both the lower cover tape 220 and the upper cover tape 230 are included will be described.

The transport tape 200 is formed through a punching method. The size of the perforated area of the transport tape 200 is determined depending on the size of the micropart to be transported. When forming a space to accommodate micro-parts through a molding process as shown in Figure 8, there is difficulty in molding a space as small as a few mm or less. In order to create accommodating spaces of various sizes, a molding process appropriate for the size of each accommodating space is required. Since it has to be performed, the manufacturing process time increases and the manufacturing cost increases.

Therefore, in this embodiment, the space 202 for receiving micro-parts is formed in the transport tape 200 using a perforation method rather than a molding process. Since the receiving space 202 of the transport tape 200 is a process of simply piercing the transport tape 200 using a punching machine, not only can the perforated area 202 of the desired size or shape be freely created, but it can also be made as small as a few millimeters or less. It can also be made easily. The shape of the accommodation space can be of various shapes, such as square or circular.

The thickness of the transport tape 200 may vary depending on the embodiment, and may be formed to a very thin thickness of 1 mm or less. Transport tape 200 may be formed of a flexible solid film. Examples of solid films include polyethylene (PE), polycarbonate (PC), polystyrene (PS), paper, and polyethylene terephthalate (PET). In addition, the transportation tape 200 may be implemented with various materials other than those mentioned in this embodiment.

The transport tape 200 may include a transfer hole 204 so that the transport tape 200 can be automatically supplied to SMT (Surface Mounter Technology) devices. For example, the transport tape 200 can be automatically supplied to the device as the transfer hole 204 engages with the gear located in the SMT device and rotates.

An adhesive layer 210 is present on the lower surface of the transport tape 200. The adhesive layer 210 may be formed of adhesive or thermoplastic resin. For example, the adhesive layer 210 may be formed of a thermoplastic resin such as polyethylene (PE), polypropylene, ethylene vinyl acetate, or polyolefin-based copolymer. The adhesive layer 210 may be formed on the lower surface of the transport tape 200 by laminating (i.e., coating). When the adhesive layer 210 is made of a thermoplastic resin, the adhesive layer 210 can be attached to the lower surface of the transportation tape 200 by applying a certain temperature and pressure to the adhesive layer 210. The width W1 of the transport tape 200 may vary depending on the size of the micropart, such as less than 1cm (eg, 8mm).

3 to 6, the receiving space 202 of the transport tape 200 is formed after the adhesive layer 210 is attached to the transport tape 200. In other words, once the adhesive layer 210 is formed on the lower surface of the transportation tape 200, the transportation tape 200 and the adhesive layer 210 are punched together using a punching machine to form a receiving space. Since the transportation tape 200 and the adhesive layer 210 are simultaneously perforated through the perforations, the adhesive layer 210 does not exist at all in the receiving space 202 formed through the perforations, solving the problem of micro-components sticking to the adhesive layer 210. do.

The width of the adhesive layer 210 may be the same as the width W1 of the transportation tape 200, or, as in this embodiment, may be formed with a width W2 narrower than the width W1 of the transportation tape. In another embodiment, the adhesive layer 210 may be formed of a plurality of vertical lines formed along the longitudinal direction of the transport tape 200, an example of which is shown in FIG. 7.

A bottom cover tape 220 and a top cover tape that cover the lower and upper parts of the accommodation space 202 so as to accommodate micro-parts in the accommodation space 202 of the transport tape 200. (230) exists. The lower cover tape 220 and the lower cover tape 230 may be made of various materials such as polyester, nylon, and PET.

Since the adhesive layer 210 is pre-formed on the lower surface of the transport tape 200, the lower cover tape 220 does not require an adhesive. If the adhesive layer 210 does not exist on the lower surface of the transport tape 200 and the adhesive layer exists in the lower cover tape 220, the adhesive layer of the lower cover tape 220 is in the receiving space 202 of the transport tape 200. It should be placed so that it does not overlap. However, when the lower cover tape 220 is attached to the transport tape 200, if there is an error in the attachment position, a portion of the adhesive layer formed on the lower cover tape 220 may be exposed to the receiving space 202, and in this case, a small amount of Problems may arise where parts stick to the adhesive layer. Moreover, in order to form an adhesive layer on the lower cover tape 220, the adhesive layer must be accurately formed on one side of the lower cover tape 220 so as not to obscure the receiving space 202, so there are many difficulties in forming the adhesive layer. Additionally, if the width of the adhesive layer is thinned so that it does not overlap in the receiving space, problems with adhesive strength may occur.

However, as in the present embodiment, the adhesive layer 210 is formed in advance on the lower surface of the transportation tape 200, and the adhesive layer 210 is perforated together with the transportation tape 200 to form a receiving space, so the receiving space 202 is There is no adhesive layer at all, and the adhesive layer 210 can be formed widely around the receiving space 202, which not only solves the problem of small parts sticking, but also improves the adhesive strength of the lower cover tape 220 to the transportation tape 200. can also be improved.

In another embodiment, the lower cover tape 220 may be composed of multiple layers. For example, the lower cover tape 220 may be composed of a support layer and an anti-static layer. The antistatic layer may be composed of antistatic agents such as surfactants, conductive polymers, tin oxide, zinc oxide, and Hanwha titanium. In another embodiment, the lower cover tape 220 may be made of a conductive material.

The upper cover tape 230 is attached to the upper surface of the transport tape 200 so as to cover the upper part of the small part when it is embedded in the receiving space 202 of the transport tape 200. In one embodiment, the upper cover tape 230 may be made of a transparent material so that the SMT device can determine the location of the accommodation space 202 in which the micropart is embedded in the transport tape 200 through a camera or the like. There is no need to remove the lower cover tape 220 from the transport tape 200 in order to take out the microparts from the receiving space 202, and only the upper cover tape 230 needs to be peeled from the transport tape 200. Therefore, the adhesive force of the upper cover tape 230 and the adhesive layer 210 attaching the lower cover tape 220 may be made to be the same, or the adhesive force of the upper cover tape 230 may be made smaller than that of the adhesive layer 210. You can.

A manufacturer of a small parts transport device may attach the lower cover tape 220 to the transport tape 200 and supply it to a parts manufacturer or packaging company without attaching the upper cover tape 230. Therefore, the microparts transport device 100 of the present embodiment may not include the upper cover tape 230, and the upper cover tape 230 attached to the upper surface of the transport tape 200 may be implemented by various conventional methods. there is.

3 to 6 are diagrams showing an example of a method of manufacturing a small parts transport device according to an embodiment of the present invention.

Referring to Figure 3, an adhesive layer 210 is formed on the lower surface of a transport tape original plate 300 having a certain area. In one embodiment, the adhesive layer 210 may be attached to the lower surface of the transport tape original plate 300 using a laminating method. In another embodiment, when the adhesive layer 210 is made of an adhesive material, the adhesive layer 210 may be attached to the transportation tape original plate 300. As another example, when the adhesive layer 210 is made of a thermoplastic resin, the adhesive layer 210 can be attached to the lower surface of the transportation tape original plate 300 by applying heat or pressure. In addition, various methods of attaching the adhesive layer 210 to the lower surface of the transport tape original plate 300 can be applied to the present embodiment depending on the type of adhesive material constituting the adhesive layer 210, and are not limited to a specific method.

The size of the transport tape disc 300 may vary depending on the embodiment. The transport tape 200 with the adhesive layer 210 on the lower surface can be cut (A-A') at regular intervals to produce the transport tape 200 with a certain width. In another embodiment, the adhesive layer 210 may be formed on the lower surface of the transport tape 200 having a certain width as shown in FIG. 2, rather than on the transport tape original plate 300. However, for convenience of explanation, the description below assumes that the transport tape 200 is produced by cutting the transport tape original plate 300 on which the adhesive layer 210 is formed to a certain width.

Referring to FIG. 4, a transportation tape 200 cut to a certain width is perforated to form a micro-part receiving space 202. Since the adhesive layer 210 is present on the lower surface of the transport tape 200, not only the transport tape 200 but also the adhesive layer 210 is perforated when punching. When the transport tape 200 includes a transfer hole 204, the transfer hole 204 can be made using various conventional methods. For example, after forming the adhesive layer 210 on the entire lower surface of the transport tape 200, the transport hole 204 and the transport space 202 can be formed through perforations.

Referring to Figure 5, the lower cover tape 220 is attached to the lower surface of the perforated transport tape 200. The lower cover tape 220 has a width wider than the width of the transportation space 202 so as to cover the transportation space 202. The lower cover tape 220 is attached through the adhesive layer 210 present on the lower surface of the transport tape 200. For example, when the adhesive layer 210 is made of a thermoplastic resin, the lower cover tape 220 can be attached to the adhesive layer 210 by applying heat or pressure. In addition, various methods of attaching the lower cover tape 220 to the adhesive layer may be applied to the present embodiment depending on the material of the adhesive layer 210. When the transfer hole 204 exists, the width of the lower cover tape 220 may be formed to a width that does not cover the transfer hole.

In another embodiment, the transport tape 200 and the adhesive layer 210 are perforated to form the transport space 202, and then the lower cover tape 220 is attached to the lower surface of the adhesive layer 210, and then the transport hole 204 ) can be formed by perforating. In this case, when the transfer hole 204 is perforated, the lower cover tape 220 is also perforated, so the lower cover tape 220 may be the same as the width of the transport tape 200 or may be wide enough to cover the transfer hole area. .

Referring to FIG. 6, when minute parts are embedded in the receiving space 202 of the transport tape 200, an upper cover tape 230 is attached to the upper surface of the transport tape 200 to seal the receiving space 202. . Since the top cover tape 230 is a process performed after embedding the small parts, the process of attaching the top cover tape can be excluded from the manufacturing process of the small parts transport device. That is, the microparts transport device 100 of this embodiment is composed of a transport tape 200, an adhesive layer 210, and a lower cover tape 220, and may not include the upper cover tape 230.

Figure 7 is a diagram showing an example of another method of forming an adhesive layer according to an embodiment of the present invention.

Referring to FIG. 7, the adhesive layer 210 may be formed on the lower surface of the transport tape 200 in at least two or more vertical lines along the longitudinal direction of the transport tape. In the example of FIG. 3, the adhesive layer 210 is formed on the entire lower surface of the transport tape original plate 300. However, the adhesive layer 210 may be present on the lower surface of the transport tape original plate 300 in a plurality of vertical lines spaced at regular intervals.

The transport tape original plate 300 on which the adhesive layer 210 is formed on the lower surface is cut to a certain width to create the transport tape 200, and the transport tape 200 is perforated to form the receiving space 202. Therefore, even if the adhesive layer 210 is present in the lower part of the transport tape 200 where the receiving space 202 is to be formed, when the receiving space 202 is formed through a perforation, the adhesive layer 210 located in the lower part of the receiving space 202 ) are also perforated, so the spacing of the adhesive layer 210 formed in vertical lines can be arbitrarily determined regardless of the location of the receiving space 202. Even when the adhesive layer 210 is formed in a plurality of vertical lines on the transportation tape 200 rather than the original transportation tape 300, the adhesive layer 210 below the receiving space 202 is removed through the perforation, so the adhesive layer 210 is removed. Placement spacing and location can be freely selected.

So far, the present invention has been examined focusing on its preferred embodiments. A person skilled in the art to which the present invention pertains will understand that the present invention may be implemented in a modified form without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered from an illustrative rather than a restrictive perspective. The scope of the present invention is indicated in the claims rather than the foregoing description, and all differences within the equivalent scope should be construed as being included in the present invention.

Claims

Forming an adhesive layer on the lower surface of the transport tape; and

A method of manufacturing a small parts transport device comprising a step of forming a space for receiving small parts by perforating the transport tape and the adhesive layer together.
According to clause 1,

A method of manufacturing a small parts transport device, further comprising attaching a lower cover tape to the lower surface of the adhesive layer to block the small part accommodation space.
The method of claim 1, wherein forming the adhesive layer comprises:

Forming an adhesive layer on the lower surface of a transport tape original having a certain area; and

A method of manufacturing a micro-component transport device comprising a step of cutting the transport tape original plate to which the adhesive layer is attached to a predetermined width to produce a transport tape with the adhesive layer present on a lower surface.
The method of claim 1, wherein forming the adhesive layer comprises:

A method of manufacturing a micro-component transport device comprising: forming the adhesive layer on a lower surface of the transport tape in at least two vertical lines along the longitudinal direction of the transport tape.
shipping tape;

an adhesive layer located below the transport tape; and

A micro-part transport device comprising: a micro-part receiving space formed by perforating the transport tape and the adhesive layer together.
According to clause 1,

A micro-component transport device further comprising a lower cover tape located below the adhesive layer.
According to clause 5,

A small parts transport device further comprising an upper cover tape located on top of the transport tape.
According to clause 6,

The adhesive layer includes an adhesive or a thermoplastic resin,

A micro parts transport device, characterized in that the lower cover tape is composed of at least one layer.