WO2024027524A1 - 显示面板、显示面板制备方法及显示装置 - Google Patents

显示面板、显示面板制备方法及显示装置 Download PDF

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Publication number
WO2024027524A1
WO2024027524A1 PCT/CN2023/108839 CN2023108839W WO2024027524A1 WO 2024027524 A1 WO2024027524 A1 WO 2024027524A1 CN 2023108839 W CN2023108839 W CN 2023108839W WO 2024027524 A1 WO2024027524 A1 WO 2024027524A1
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Prior art keywords
layer
display panel
organic
pixel
array substrate
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PCT/CN2023/108839
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English (en)
French (fr)
Inventor
杨博文
肖一鸣
姚远
张浩瀚
朱雪婧
倪柳松
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维信诺科技股份有限公司
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Priority to KR1020247006694A priority Critical patent/KR20240035624A/ko
Publication of WO2024027524A1 publication Critical patent/WO2024027524A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates

Definitions

  • the present application belongs to the technical field of electronic products, and in particular relates to a display panel, a display panel preparation method and a display device.
  • Display panels such as Organic Light Emitting Diode (OLED) have the advantages of self-illumination, energy saving and consumption reduction, bendability, and good flexibility.
  • OLED Organic Light Emitting Diode
  • the display device that realizes display does not require a backlight and has a fast response speed. With the characteristics of good display effect, it has attracted the attention of users and is widely used in terminal products such as smartphones and tablet computers.
  • part of the film layer will generate water vapor during reliability experiments and ultraviolet irradiation conditions, affecting the reliability of the display panel.
  • Embodiments of the present application provide a display panel, a display panel preparation method and a display device.
  • the organic encapsulation layer of the encapsulation layer and the organic layer are connected through slots, so that the gas generated by the organic layer passes through the organic encapsulation layer.
  • the encapsulation layer is released, that is, excess water vapor in the organic layer is introduced into the organic encapsulation layer of the encapsulation layer to prevent film layer peeling or bubbling problems and improve the display Panel reliability and longevity.
  • embodiments of the present application provide a display panel, including: an array substrate; an organic layer disposed on one side of the array substrate; a pixel definition layer disposed on a side of the organic layer facing away from the array substrate; An encapsulation layer is provided on the side of the pixel definition layer facing away from the array substrate.
  • the encapsulation layer includes an organic encapsulation layer. The organic encapsulation layer and the organic layer are connected through a slot that penetrates the pixel definition layer. .
  • the present invention provides a display panel preparation method, including the following steps: providing an array substrate; forming an organic layer on one side of the array substrate; forming a pixel definition layer on the side of the organic layer facing away from the array substrate. , the pixel definition layer is provided with a slot penetrating the pixel definition layer; an encapsulation layer is formed on the side of the pixel definition layer facing away from the array substrate, the encapsulation layer includes an organic encapsulation layer, and the organic encapsulation layer The layer and the organic layer are communicated through the groove.
  • the present invention provides a display device, including: a display panel, where the display panel is the display panel described in any of the above embodiments.
  • the display panel provided by the embodiment of the present invention includes an array substrate, an organic layer, and a pixel definition layer. Since the organic layer is formed of organic resin and other materials, in order to ensure product cleanliness before evaporation of the array substrate, it is necessary to Array substrates that already have an organic layer undergo a cleaning process before evaporation. The organic layer will also absorb water during the cleaning process, and under conditions of reliability experiments and ultraviolet irradiation, the organic layer will release the absorbed water vapor and small molecule organic matter. , but because the organic layer is covered by the pixel definition layer and the first electrode layer, the gas generated by the organic layer cannot be released, causing problems such as bubbling and peeling of the film layer.
  • this embodiment connects the organic encapsulation layer of the encapsulation layer with the organic layer through a slot that penetrates the pixel definition layer, so that the gas generated by the organic layer is released through the organic encapsulation layer of the encapsulation layer, that is, Excessive water vapor in the organic layer is introduced into the organic encapsulation layer of the encapsulation layer to prevent peeling or bubbling of the film layer and improve the reliability and service life of the display panel.
  • Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • Figure 2 is a film structure diagram provided by an embodiment at BB in Figure 1;
  • Figure 3 is a film structure diagram provided by another embodiment at B-B in Figure 1;
  • Figure 4 is a pixel arrangement diagram of a display panel provided by an embodiment of the present application.
  • Figure 5 is a film structure diagram provided by an embodiment at C-C in Figure 4.
  • Figure 6 is a film structure diagram provided by an embodiment at D-D in Figure 4.
  • Figure 7 is a pixel arrangement diagram of a display panel provided by another embodiment of the present application.
  • Figure 8 is a flow chart of a display panel preparation method provided by an embodiment of the present application.
  • Figure 9 is a schematic structural diagram of a display panel during the preparation process according to an embodiment of the present application.
  • Figure 10 is a schematic structural diagram of a display panel during the preparation process provided by another embodiment of the present application.
  • Figure 11 is a schematic structural diagram of a display panel during preparation according to another embodiment of the present application.
  • Figure 12 is a schematic structural diagram of a display panel during preparation according to another embodiment of the present application.
  • Figure 13 is a schematic structural diagram of a display panel during preparation according to another embodiment of the present application.
  • Figure 14 is a schematic structural diagram of a display panel during preparation according to another embodiment of the present application.
  • Figure 15 is a schematic structural diagram of a display panel during preparation according to another embodiment of the present application.
  • Figure 16 is a schematic structural diagram of a display panel during preparation according to another embodiment of the present application.
  • FIG. 17 is a schematic structural diagram of a display panel during preparation according to another embodiment of the present application.
  • FIGS. 1 to 17 Various embodiments of the display panel, the display panel preparation method and the display device will be described below with reference to FIGS. 1 to 17 .
  • a display panel provided by an embodiment of the present application includes: an array substrate 1; an organic layer located on one side of the array substrate 1; and a pixel definition layer 4 located on one side of the organic layer facing away from the array substrate 1. side; encapsulation layer 5, the encapsulation layer 5 is provided on the side of the pixel definition layer 4 facing away from the array substrate 1, and the encapsulation layer 5 and the organic layer are connected through a groove that penetrates the pixel definition layer 4.
  • the display panel provided by the embodiment of the present invention includes an array substrate 1, an organic layer, and a pixel definition layer 4. Since the organic layer is formed of organic resin and other materials, in order to ensure product cleanliness before evaporation of the array substrate, it is necessary to The array substrate undergoes a cleaning process before evaporation, and the organic layer will also absorb water during the cleaning process. Under reliability experiments and ultraviolet irradiation conditions, the organic layer will release absorbed water vapor and small molecule organic matter. However, due to the pixel definition layer 4 and the first electrode Film layers such as polar layer 3 cover the organic layer, which will cause the gas generated by the organic layer to be unable to be released, causing problems such as bubbling and film peeling.
  • this embodiment connects the organic encapsulation layer 52 of the encapsulation layer 5 and the organic layer through a slot that penetrates the pixel definition layer 4 so that the gas generated by the organic layer passes through the organic encapsulation layer of the encapsulation layer 5 52 is released, that is, excessive water vapor in the organic layer is introduced into the organic encapsulation layer 52 of the encapsulation layer 5 to prevent film layer peeling or bubbling problems, thereby improving the reliability and service life of the display panel.
  • the organic encapsulation layer 52 is also made of organic materials, in this embodiment, the organic encapsulation layer 52 and the organic layer are connected through slots, so that the gas generated by the organic layer is released through the organic encapsulation layer 52 , that is, the organic layer Excessive water vapor is introduced into the organic encapsulation layer 52 to prevent film layer peeling or bubbling problems.
  • the main advantage of using organic materials to prepare the organic encapsulation layer 52 is that it has better flatness and can achieve planarization, which is beneficial to subsequent growth of inorganic film layers through methods such as chemical vapor deposition, physical vapor deposition or atomic layer deposition; Organic materials with larger thickness can also be prepared through existing processes. Organic materials have better bending resistance, and the organic encapsulation layer 52 prepared from organic materials can also improve the encapsulation effect and avoid water and oxygen damage to the luminescent materials or wiring of the display panel. Erosion is performed to improve the reliability of the display panel.
  • the organic encapsulation layer 52 can be specifically formed by IJP (Ink-Jet Printing, inkjet printing technology).
  • the display panel further includes a first electrode layer 3.
  • the first electrode layer 3 is provided on the side of the organic layer facing away from the array substrate 1.
  • the first electrode layer 3 includes a plurality of mutually insulated first electrode blocks.
  • the pixel definition layer 4 is provided on the side of the first electrode layer 3 facing away from the array substrate 1 .
  • the pixel definition layer 4 has a pixel opening, and the pixel opening exposes at least part of the first electrode block, so that the sub-pixel unit corresponding to the first electrode block performs light-emitting display through the pixel opening.
  • the sub-pixel unit size is defined by a pixel opening (PDL, Pixel define layer) of the pixel definition layer, and the pixel opening is formed by etching.
  • the pixel definition layer mostly uses organic materials, such as polyimide.
  • the array substrate that already has a pixel definition layer needs to be cleaned before evaporation. This will cause the pixel definition layer made of organic materials to absorb water.
  • the pixel definition layer using organic materials will release absorbed water vapor and small organic molecules. Because it is close to the organic light-emitting material, the water vapor released from the pixel definition layer will cause the organic light-emitting material to fail, causing the pixel light-emitting area to shrink, affecting the reliability of the display panel.
  • the pixel definition layer 4 in the display panel includes at least one inorganic material layer.
  • the inorganic material layer has good water vapor barrier properties, preventing the pixel definition layer 4 made of organic materials from releasing absorbed water vapor and small organic molecules under conditions of reliability testing and ultraviolet irradiation, ensuring the reliability of the display panel.
  • the pixel definition layer 4 in this embodiment includes at least one inorganic material layer, and the inorganic material layer has good water vapor blocking properties. Therefore, when the array substrate 1 already provided with the pixel definition layer 4 is subjected to a pre-evaporation cleaning process, the pixel definition layer 4 including at least one inorganic material layer will not have the problem of water absorption, thus preventing the pixel definition layer 4 from being damaged during the trust process.
  • the absorbed water vapor and small molecular organic matter are released under the conditions of sexual experiments and ultraviolet irradiation to ensure the reliability of the display panel.
  • the organic layer is made of organic materials, the problem of water vapor release will also occur.
  • the pixel definition layer 4 in this embodiment includes at least one inorganic material layer, and the first electrode layer 3 is made of metal.
  • the inorganic material layer can cooperate with the first electrode layer 3 to block water vapor in the organic layer from passing to the organic luminescent material layer and affecting the organic luminescent material of the display panel, effectively avoiding reliability experiments and ultraviolet irradiation.
  • the problem of shrinkage of the pixel light-emitting area appeared, which improved the reliability and service life of the display panel.
  • the pixel definition layer 4 includes at least one inorganic material layer. That is, the pixel definition layer 4 may include only one inorganic material layer or two inorganic material layers. There is no particular limitation.
  • the inorganic material layer may be At least one of silicon nitride, silicon oxynitride, and silicon oxide can be used.
  • the inorganic material layer of the pixel definition layer 4 has better water and oxygen barrier properties, that is, water and oxygen will not enter the inorganic material during the cleaning process. layer. Therefore, the inorganic material layer of the pixel definition layer 4 will not absorb water, thereby avoiding the subsequent problem that the pixel definition layer 4 will release absorbed water vapor and small molecule organic matter under conditions of reliability testing and ultraviolet irradiation.
  • the material of the first electrode layer 3 is generally a material with a high work function in order to improve the hole injection efficiency, and can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), or indium tin oxide (ITO). , zinc tin oxide (IZO) or transparent conductive polymer (such as polyaniline), etc.
  • the first The electrode layer 3 can specifically adopt an ITO-Ag-ITO stack structure.
  • the array substrate 1 includes a pixel circuit
  • the pixel circuit includes a thin film transistor TFT
  • the thin film transistor TFT includes an active layer Y, a gate G, a source S, a drain D, a drain D, a source S, and a gate G.
  • the materials may include one or a combination of molybdenum, titanium, aluminum, copper, etc.
  • the gate G of the thin film transistor TFT is usually used to receive a control signal, so that the thin film transistor TFT is turned on or off under the control of the control signal.
  • One of the source S and the drain D of the thin film transistor TFT is connected to the first electrode layer 3 .
  • the encapsulation layer 5 includes a first inorganic encapsulation layer 51 , an organic encapsulation layer 52 and a second inorganic encapsulation layer 53 that are stacked along the thickness direction of the display panel.
  • the orthographic projection of an inorganic encapsulation layer 51 on the array substrate 1 and the orthographic projection of the slot on the array substrate 1 are staggered.
  • the first inorganic encapsulation layer 51 is made of inorganic materials and has a good water and oxygen barrier effect, in order to simplify the process, the first inorganic encapsulation layer 51 can be avoided from the position where the grooves need to be provided, so that the organic layer can be directly connected to the organic layer.
  • the encapsulation layer 52 is connected.
  • the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 may be made of inorganic materials such as silicon oxide, silicon nitride, aluminum oxide, and titanium oxide.
  • the refractive index (density) of silicon nitride and aluminum oxide is better than that of silicon oxide and titanium oxide, so the water and oxygen barrier properties of silicon nitride and aluminum oxide are better than those of silicon oxide and titanium oxide.
  • the display panel has a display area AA and a frame area BA adjacent to the display area AA, and the organic layer, pixel definition layer 4 and encapsulation layer 5 all extend from the display area AA to the frame area BA; in In the frame area BA, the pixel definition layer 4 is provided with a first slot K1 for communication between the organic encapsulation layer 52 and the organic layer.
  • the display area AA usually also includes other film layers arranged throughout the layer, such as the second electrode layer 8, etc., in order to facilitate the connection between the organic encapsulation layer 52 and the organic layer, in this embodiment, the first slot K1 is provided on the frame of the display panel In area BA, in order to open the first groove K1, the first groove K1 is provided in the pixel definition layer 4.
  • the organic encapsulation layer 52 and the organic layer can be connected.
  • by arranging the first slot K1 part of the organic encapsulation layer 52 partially flows into the first slot K1, thereby blocking the overflow of the organic encapsulation layer 52.
  • the cross section of the first slot K1 along the thickness direction of the display panel can be There are no special restrictions on shapes such as rectangular and zigzag shapes.
  • the organic encapsulation layer 52 is partially filled in the first slot K1.
  • the organic encapsulation layer 52 is formed using IJP (Ink-Jet Printing, inkjet printing technology)
  • the organic encapsulation layer 52 has a certain degree of fluidity, so in When the organic encapsulation layer 52 is formed on the pixel definition layer 4, part of the organic encapsulation layer 52 will automatically fill in the first groove K1 and contact the organic layer.
  • a bank portion Z is also provided in the frame area BA, and the first slot K1 is provided on the side of the first bank portion Z close to the display area AA.
  • the organic layer includes a planarization layer 2.
  • the planarization layer 2 is made of organic materials, such as organic resin, and is used to improve the flatness of the film layer of the display panel and facilitate the pixel definition layer 4, etc. Preparation of film layers.
  • the organic layer includes a planarization layer 2 and a via layer 6 that are stacked along the thickness direction of the display panel.
  • Both the via layer 6 and the planarization layer 2 can be made of organic materials.
  • the via layer 6 is made of It is used for routing signal lines, and on the other hand, it can also play a certain role in improving the flatness of the film layer.
  • the first slot K1 can also be made to penetrate the via hole layer 6 , so that the organic encapsulation layer 52 can pass through the first groove K1 that penetrates the pixel definition layer 4 and the via hole layer 6 . Slotted K1 is connected.
  • the first slot K1 is arranged around the display area AA, that is, the first slot K1 can be arranged in a circle to increase the contact area between the organic encapsulation layer 52 and the organic layer, improve the water vapor release effect of the organic layer, and also facilitate The organic layers located at different positions are connected to the organic encapsulation layer 52 .
  • the first slot K1 forms a continuous annular structure in the frame area BA, that is, the first slot K1 is arranged around the entire display area AA.
  • a plurality of first slots K1 may be arranged at intervals in the frame area BA, that is, a plurality of individually arranged first slots K1 may be arranged, and the first slots K1 of each may be arranged at intervals and around the display area AA, This is to prevent the first slot K1 from adversely affecting the packaging effect of the display panel.
  • the orthographic projection of the first inorganic encapsulation layer 51 located in the frame area BA on the array substrate 1 and the orthographic projection of the first slot K1 on the array substrate 1 are staggered.
  • the orthographic projection of the first inorganic encapsulation layer 51 located in the frame area BA on the array substrate 1 and the first opening can be adjusted.
  • the orthographic projection of slot K1 on the array substrate 1 is staggered.
  • the first The inorganic encapsulation layer 51 retracts toward the direction of the display area AA, that is, the first inorganic encapsulation layer 51 does not cover the part of the pixel definition layer 4 that needs to be provided with the first slot K1, and the part of the pixel definition layer 4 in the frame area is not covered by the third pixel definition layer 4.
  • An inorganic encapsulation layer 4 covers.
  • the display panel has a display area AA and a frame area BA adjacent to the display area AA.
  • the organic layer, the pixel definition layer 4 and the encapsulation layer 5 are all separated from the display area AA.
  • AA extends to the frame area BA; in the display area AA, the pixel definition layer 4 is provided with a second slot K2 for connecting the organic encapsulation layer 52 and the organic layer.
  • the second slot K2 is between the front projection of the array substrate 1 and the pixel opening.
  • the orthographic projection of the array substrate 1 is staggered.
  • the organic encapsulation layer 52 is partially filled in the second slot K2 to communicate with the organic layer.
  • the second slot K2 can also be arranged in the display area AA to achieve communication between the organic encapsulation layer 52 and the organic layer. Since there are sub-pixel units of different colors in the display area AA, the sub-pixel units need to emit light in the display area AA, so the second slot K2 cannot interfere with the sub-pixel unit, and for the convenience of opening the second slot K2, you can
  • the second electrode layer 8 of the sub-pixel unit and the film layers such as the inorganic encapsulation part corresponding to the sub-pixel unit are patterned so that only the pixel definition layer 4 is provided between adjacent sub-pixel units.
  • an isolation pillar L is provided on the side of the pixel definition layer 4 facing away from the array substrate 1 , and the second groove K2 simultaneously penetrates the isolation pillar L, the pixel definition layer 4 and is connected with the organic layer.
  • the isolation pillar L is provided to isolate the evaporation material when forming the light-emitting layer of the display panel, that is, the formed sub-pixel units are independent of each other, so as to avoid the occurrence of some film layers being evaporated over the entire surface, resulting in the formation of each sub-pixel unit.
  • the second slot K2 penetrates the isolation pillar L and communicates with the organic layer. That is, a slot also needs to be provided on the isolation pillar L to facilitate communication between the organic layer and the organic encapsulation layer 52 .
  • the cross section of the isolation column L is at least one of an I-shape or a T-shape.
  • the cross-section of the isolation column L is not particularly limited, as long as the isolation effect for the evaporation material is ensured.
  • the display panel also includes sub-pixel units of different colors.
  • the sub-pixel units are located in the pixel openings.
  • Each sub-pixel unit includes a stacked first electrode block, a luminescent material layer 7 and a second electrode layer.
  • a second slot K2 is provided between at least some adjacent sub-pixel units.
  • the sub-pixel unit includes a first sub-pixel unit P1, a second sub-pixel unit P2 and a third sub-pixel unit P3.
  • the first sub-pixel unit P1, the second sub-pixel unit P2 and the third sub-pixel unit P3 are respectively It is any one of the three color sub-pixels of red, blue, and green.
  • the material of the luminescent material layer 7 used can be adjusted to achieve different colors of light emission.
  • the first inorganic encapsulation layer 51 includes a plurality of inorganic encapsulation parts arranged at intervals and corresponding to the sub-pixel units, and the orthographic projection of the inorganic encapsulation parts on the array substrate 1 and the second slot K2 The orthographic projection on the array substrate 1 is staggered.
  • the first inorganic encapsulation layer 51 can be patterned through processes such as etching to form a plurality of inorganic encapsulation parts arranged at intervals.
  • the inorganic encapsulation parts are arranged corresponding to the sub-pixel units. It can be understood that the inorganic encapsulation parts are on the array substrate 1
  • the front projection of the sub-pixel unit and the front projection of the sub-pixel unit on the array substrate 1 at least partially overlap, by dividing the first inorganic encapsulation layer 51 into a plurality of inorganic encapsulation parts to avoid mutual interference between the inorganic encapsulation part and the second slot K2.
  • the inorganic encapsulation part is at least partially disposed between two adjacent isolation pillars L, and since the inorganic encapsulation part and the sub-pixel unit are arranged correspondingly, the cooperation of the inorganic encapsulation part and the isolation pillar L can realize that the sub-pixel unit
  • the independent packaging prevents the display panel package from being affected by the provision of the second slot K2, thereby improving the reliability of the display panel package.
  • the entire inorganic encapsulation part can be located between two adjacent isolation pillars L, which facilitates the arrangement.
  • Part of the inorganic encapsulation part can be located between two adjacent isolation pillars L, and Part of the inorganic encapsulation part can extend to the side surface of the isolation pillar L facing away from the array substrate 1 to ensure the encapsulation effect.
  • the second slot K2 is arranged around the entire sub-pixel unit, that is, the second slot K2 is in a continuous ring structure, such as a circular ring or a square ring.
  • the connection area between the organic encapsulation layer 52 and the organic layer can be effectively increased, and the water vapor release effect of the organic layer can be improved.
  • the second slot K2 can also be arranged around part of the edge of the sub-pixel unit, that is, surrounding A plurality of intermittently arranged second slots K2 can be provided around the sub-pixel unit, and each second slot K2 can be arranged opposite to the edge of the sub-pixel unit at different positions to avoid the first slot K1 from causing any disadvantage to the light-emitting display of the sub-pixel unit. Influence.
  • a light modulating layer 9 and a protective layer 10 are also stacked between the second electrode layer 8 and the first inorganic encapsulation layer 51.
  • the light modulating layer 9 can be specifically a CPL (cappling layer, light extraction layer), mainly.
  • the protective layer 10 can be made of LiF (lithium fluoride) material to protect the CPL layer.
  • another embodiment of the present invention also provides a display panel preparation method, including the following steps:
  • S110 Provide array substrate 1;
  • S120 Form an organic layer on one side of the array substrate 1;
  • S130 Form a pixel definition layer 4 on the side of the organic layer facing away from the array substrate 1, and the pixel definition layer 4 is provided with a groove penetrating the pixel definition layer 4;
  • S140 Form an encapsulation layer 5 on the side of the pixel definition layer 4 facing away from the array substrate 1.
  • the encapsulation layer 5 includes an organic encapsulation layer 52, and the organic encapsulation layer 52 and the organic layer are connected through slots.
  • the organic encapsulation layer 52 of the encapsulation layer 5 and the organic layer are connected through slots, so that the gas generated by the organic layer is released through the organic encapsulation layer 52 of the encapsulation layer 5 , that is, excess gas in the organic layer
  • the water vapor is introduced into the organic encapsulation layer 52 of the encapsulation layer 5 to prevent film layer peeling or bubbling problems, thereby improving the reliability and service life of the display panel.
  • the array substrate 1 may specifically include a substrate and a pixel circuit formed on the substrate.
  • the substrate may be a hard substrate, such as a glass substrate; it may also be a flexible substrate, and its material may be polyamide. imine, polystyrene, polyethylene terephthalate, polyparaxylene, polyethersulfone or polyethylene naphthalate.
  • the active layer Y, gate electrode G, source electrode S, drain electrode D and other film layers of the pixel circuit can be formed through evaporation, photolithography and other processes.
  • an organic layer may be formed on one side of the array substrate 1 through an evaporation process.
  • the material of the organic layer may be hexamethyldisiloxane, epoxy resin or polyimide (Polyimide, PI). It can be other silicone materials with a light transmittance of more than 90%.
  • the material of the pixel definition layer 4 can be first evaporated on the side of the organic layer facing away from the array substrate 1, and then the evaporated material can be patterned through etching or other processes, so that the pixels
  • the definition layer 4 forms pixel openings and grooves.
  • the pixel openings and grooves can be formed through the same process, or they can be formed separately, and there is no special limitation.
  • the encapsulation layer 5 includes a first inorganic encapsulation layer 51, an organic encapsulation layer 52 and a second inorganic encapsulation layer 53, because the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 are made of inorganic materials. Therefore, the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 can be formed using a deposition process, and the organic encapsulation layer 52 can be formed using an inkjet printing technology. Since the pixel definition layer 4 is provided with grooves, the material of the inkjet printed organic encapsulation layer 52 will fill the grooves to achieve communication with the organic layer.
  • a light-emitting layer is also provided on the pixel definition layer 4.
  • the light-emitting layer is at least partially located in the pixel opening, and an isolation pillar L is also provided on the pixel definition layer 4.
  • the isolation pillar L is provided to evaporate to form a luminescent layer.
  • the evaporation material is separated during the layering process, that is, each sub-pixel unit formed is independent of each other, so as to avoid the problem of lateral conduction between each sub-pixel unit caused by partial film layers being formed by evaporation on the entire surface.
  • the isolation pillar L can be made of the same material as the pixel definition layer 4 to reduce production costs.
  • the steps of forming the pixel definition layer 4 on the side of the organic layer facing away from the array substrate 1 and forming the encapsulation layer 5 on the side of the pixel definition layer 4 facing away from the array substrate 1 it also includes: forming a first layer in each pixel opening.
  • This implementation uses photolithography technology to form the first sub-pixel unit P1 and the second sub-pixel unit P2 separately, so as to facilitate the formation of the second groove between the adjacent first sub-pixel unit P1 and the second sub-pixel unit P2.
  • K2 The thickness of each film layer such as the luminescent material layer 7 and the second electrode layer 8 of the first sub-pixel unit P1 and the second sub-pixel unit P2 can be adjusted individually. For example, the thickness of the first sub-pixel unit P1 and the second sub-pixel unit P2 can be adjusted individually.
  • the second electrode layer 8 of P2 may have different thicknesses.
  • the embodiment of the present invention prepares one first sub-pixel unit P1 and one second sub-pixel unit P1 each.
  • a preparation method including:
  • the pixel definition layer 4 has three pixel openings, and a first electrode block is formed in each pixel opening;
  • the luminescent material layer 7, the second electrode layer 8, the light modulation layer 9, the protective layer 10 and the inorganic encapsulation part of the first sub-pixel unit P1 are sequentially formed in each pixel opening, as shown in Figure 9; of course, depending on the actual situation, It is also possible to form the inorganic encapsulation part directly on the side of the second electrode layer 8 without forming the light modulation layer 9 and the protective layer 10 first. After the inorganic encapsulation part is formed, the light modulation part can be formed on the side of the inorganic encapsulation part away from the array substrate 1. Layer 9 and protective layer 10.
  • a second photoresist J2 is formed on the side of the inorganic encapsulation part facing away from the luminescent material layer 7 in any pixel opening where only the second sub-pixel unit P2 is provided, as shown in Figure 13;
  • the pixel definition layer 4 between at least partially adjacent first sub-pixel unit P1, second sub-pixel unit P2 and third sub-pixel unit P3 forms a second groove K2;
  • An organic encapsulation layer 52 is formed on the side of each inorganic encapsulation part away from the luminescent material layer 7 , and part of the organic encapsulation layer 52 is filled in the second slot K2 to communicate with the organic layer.
  • the present invention also provides a display device, including: a display panel; the display panel is the display panel in any of the above embodiments.
  • the display device provided by the embodiments of the present invention has the technical effects of the technical solution of the display panel in any of the above embodiments, and the explanation of the structures and terminology that are the same as or corresponding to the above embodiments will not be repeated here.
  • the display device provided by the embodiment of the present application can be applied to mobile phones or any electronic product with a display function, including but not limited to the following categories: televisions, notebook computers, desktop monitors, tablet computers, digital cameras, smart phones Rings, smart glasses, vehicle-mounted displays, medical equipment, industrial control equipment, touch interactive terminals, etc.
  • the embodiments of this application do not specifically limit this.

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Abstract

本申请公开了一种显示面板、显示面板制备方法及显示装置，一种显示面板，包括：阵列基板；有机层，设于阵列基板一侧；像素定义层，设于有机层背离阵列基板一侧；封装层，设于像素定义层背离阵列基板一侧，封装层包括有机封装层，有机封装层和有机层之间通过贯穿像素定义层的开槽连通。本实施例通过使封装层的有机封装层和有机层之间通过开槽连通，以使有机层所产生的气体通过封装层的有机封装层进行释放，即将有机层中过多的水汽导入封装层的有机封装层中，防止膜层剥离或鼓泡问题的产生，提高了显示面板的可靠性和使用寿命。

Description

显示面板、显示面板制备方法及显示装置
相关申请的交叉引用
本申请要求享有于2022年08月02日提交的名称为“显示面板、显示面板制备方法及显示装置”的中国专利申请第202210922415.9号的优先权，上述申请的全部内容通过引用并入本文中。
技术领域
本申请属于电子产品技术领域，尤其涉及一种显示面板、显示面板制备方法及显示装置。
背景技术
随着科技的进步，智能手机、平板电脑等数字化显示装置得到广泛的应用，其中，显示面板是这些显示装置中不可或缺的人际沟通界面。诸如有机发光二极管(Organic Light Emitting Diode，OLED)显示面板，具有自发光、节能降耗、可弯曲、柔韧性佳等优点，且该实现显示的显示装置，其不需要背光源，具有反应速度快和显示效果好的特点，受到用户的关注，被广泛应用于智能手机、平板电脑等终端产品中。
受到现有显示面板的膜层结构以及材料限制，显示面板在信赖性实验以及是紫外线照射的条件下，部分膜层会产生水汽，影响显示面板的可信赖性。
因此，亟需一种新的显示面板、显示面板制备方法及显示装置。
发明内容
本申请实施例提供了一种显示面板、显示面板制备方法及显示装置，通过使封装层的有机封装层和有机层之间通过开槽连通，以使有机层所产生的气体通过封装层的有机封装层进行释放，即将有机层中过多的水汽导入封装层的有机封装层中，防止膜层剥离或鼓泡问题的产生，提高了显示 面板的可靠性和使用寿命。
第一方面，本申请实施例提供了一种显示面板，包括：阵列基板；有机层，设于所述阵列基板一侧；像素定义层，设于所述有机层背离所述阵列基板一侧；封装层，设于所述像素定义层背离所述阵列基板一侧，所述封装层包括有机封装层，所述有机封装层和所述有机层之间通过贯穿所述像素定义层的开槽连通。
第二方面，本发明提供了一种显示面板制备方法，包括以下步骤：提供阵列基板；在所述阵列基板一侧形成有机层；在所述有机层背离所述阵列基板一侧形成像素定义层，所述像素定义层设有贯穿所述像素定义层的开槽；在所述像素定义层背离所述阵列基板一侧形成封装层，所述封装层包括有机封装层，并使所述有机封装层和所述有机层之间通过所述开槽连通。
第三方面，本发明提供了一种显示装置，包括：显示面板，所述显示面板为上述任一实施例中所述的显示面板。
与现有技术相比，本发明实施例所提供的显示面板包括阵列基板、有机层、像素定义层，由于有机层采用有机树脂等材料形成，阵列基板蒸镀前为保证产品清洁度，需对已经设有有机层的阵列基板进行蒸镀前清洗工艺，有机层在清洗工艺中也会吸水，而在信赖性实验以及是紫外线照射的条件下有机层会将吸收的水汽、小分子有机物释放出来，但由于像素定义层和第一电极层等膜层将有机层遮盖，会导致有机层产生的气体无法释放，产生鼓泡、膜层剥离的问题。为了解决上述问题，本实施例通过使封装层的有机封装层和有机层之间通过贯穿像素定义层的开槽连通，以使有机层所产生的气体通过封装层的有机封装层进行释放，即将有机层中过多的水汽导入封装层的有机封装层中，防止膜层剥离或鼓泡问题的产生，提高了显示面板的可靠性和使用寿命。
附图说明
图1是本申请一种实施例提供的显示面板的结构示意图；
图2是图1中B-B处一种实施例提供的膜层结构图；
图3是图1中B-B处另一种实施例提供的膜层结构图；
图4是本申请一种实施例提供的显示面板的像素排布图；
图5是图4中C-C处一种实施例提供的膜层结构图；
图6是图4中D-D处一种实施例提供的膜层结构图；
图7是本申请另一种实施例提供的显示面板的像素排布图；
图8是本申请一种实施例提供的显示面板制备方法的流程图；
图9是本申请一种实施例提供的显示面板制备过程中的结构示意图；
图10是本申请另一种实施例提供的显示面板制备过程中的结构示意图；
图11是本申请又一种实施例提供的显示面板制备过程中的结构示意图；
图12是本申请又一种实施例提供的显示面板制备过程中的结构示意图；
图13是本申请又一种实施例提供的显示面板制备过程中的结构示意图；
图14是本申请又一种实施例提供的显示面板制备过程中的结构示意图；
图15是本申请又一种实施例提供的显示面板制备过程中的结构示意图；
图16是本申请又一种实施例提供的显示面板制备过程中的结构示意图；
图17是本申请又一种实施例提供的显示面板制备过程中的结构示意图。
具体实施方式
以下结合附图及具体实施例，对本申请进行进一步详细描述。
以下将结合附图1至图17对显示面板、显示面板制备方法及显示装置的各实施例进行说明。
请参阅图1至图2，本申请实施例提供的一种显示面板，包括：阵列基板1；有机层，设于阵列基板1一侧；像素定义层4，设于有机层背离阵列基板1一侧；封装层5，封装层5设于像素定义层4背离阵列基板1一侧，封装层5和有机层之间通过贯穿像素定义层4的开槽连通。
本发明实施例所提供的显示面板包括阵列基板1、有机层、像素定义层4，由于有机层采用有机树脂等材料形成，阵列基板蒸镀前为保证产品清洁度，需对已经设有有机层的阵列基板进行蒸镀前清洗工艺，有机层在清洗工艺中也会吸水。而在信赖性实验以及是紫外线照射的条件下有机层会将吸收的水汽、小分子有机物释放出来，但由于像素定义层4和第一电 极层3等膜层将有机层遮盖，会导致有机层产生的气体无法释放，产生鼓泡、膜层剥离的问题。为了解决上述问题，本实施例通过使封装层5的有机封装层52和有机层之间通过贯穿像素定义层4的开槽连通，以使有机层所产生的气体通过封装层5的有机封装层52进行释放，即将有机层中过多的水汽导入封装层5的有机封装层52中，防止膜层剥离或鼓泡问题的产生，提高了显示面板的可靠性和使用寿命。
由于有机封装层52也采用有机材料制成，本实施例通过使有机封装层52和有机层之间通过开槽连通，以使有机层所产生的气体通过有机封装层52进行释放，即将有机层中过多的水汽导入有机封装层52中，防止膜层剥离或鼓泡问题的产生。
在本实施例中，有机材料制备有机封装层52的优点主要在于平整度较佳，可以实现平坦化，有利于后续通过诸如化学气相沉积、物理气相沉积或原子层沉积的方法生长无机膜层；也可以通过现有工艺制备厚度较大的有机材料，有机材料的抗弯折性能较好，且有机材料制备有机封装层52也能提高封装效果，避免水氧对显示面板的发光材料或者走线进行侵蚀，提高了显示面板的可靠性。
有机封装层52具体可以通过IJP(Ink-Jet Printing，喷墨打印技术)成型。
可选的，显示面板还包括第一电极层3，第一电极层3设于有机层背离阵列基板1一侧，第一电极层3包括多个相互绝缘的第一电极块。具体的，像素定义层4设置在第一电极层3背离所述阵列基板1的一侧。其中像素定义层4具有像素开口，像素开口暴露至少部分第一电极块，以便于第一电极块所对应的子像素单元通过像素开口进行发光显示。
在相关技术中，子像素单元大小由像素定义层的像素开口(PDL，Pixel define layer)限定，所述像素开口由刻蚀形成。为方便刻蚀和剥离，像素定义层多使用有机材质，例如聚酰亚胺。当阵列基板蒸镀前为保证产品清洁度，需对已经设有像素定义层的阵列基板进行蒸镀前清洗工艺，会造成采用有机材料的像素定义层吸水，在信赖性实验以及是紫外线照射的条件下，采用有机材料的像素定义层会将吸收的水汽、小分子有机物释放 出来，又因其贴近有机发光材料，像素定义层释放出来的水汽会造成有机发光材料的失效，造成像素发光面积收缩，影响显示面板的信赖性能力。
为了解决上述问题，在一些可选的实施例中，本发明实施例所提供的显示面板中的像素定义层4包括至少一层无机材料层。无机材料层具有良好的水汽阻挡性能，避免有机材料制成的像素定义层4在信赖性实验以及是紫外线照射的条件下将吸收的水汽、小分子有机物释放出来，保证显示面板的可靠性。
本实施例中的像素定义层4包括至少一层无机材料层，无机材料层具有良好的水汽阻挡性能。因而，在对已经设有像素定义层4的阵列基板1进行蒸镀前清洗工艺时，包括至少一层无机材料层的像素定义层4不会出现吸水的问题，进而避免像素定义层4在信赖性实验以及是紫外线照射的条件下将吸收的水汽、小分子有机物释放出来，保证显示面板的可靠性。同时，由于有机层采用有机材料制成，也会出现水汽释放的问题，为了解决上述问题，本实施例中的像素定义层4包括至少一层无机材料层，且在第一电极层3采用金属制成时，无机材料层可以和第一电极层3相配合，以实现阻隔有机层的水汽传递至有机发光材料层，影响显示面板的有机发光材料，有效避免了在信赖性实验以及是紫外线照射测试后出现像素发光面积收缩的问题，提高了显示面板的可靠性和使用寿命。
在本实施例中，像素定义层4包括至少一层无机材料层，即像素定义层4可以仅包括一层无机材料层，也可以包括两层无机材料层，并无特殊限定，无机材料层具体可以采用氮化硅、氮氧化硅、氧化硅中的至少一者。相比于现有技术中像素定义层4采用聚酰亚胺等有机材料的情况，像素定义层4的无机材料层的水氧阻隔性能更好，即水氧在清洗工艺中不会进入无机材料层中。因而，像素定义层4的无机材料层也就不会吸水，避免后续出现像素定义层4在信赖性实验以及是紫外线照射的条件下会将吸收的水汽、小分子有机物释放的问题。
第一电极层3的材料一般为功函数高的材料，以便提高空穴注入效率，可为金(Au)、铂(Pt)、钛(Ti)、银(Ag)、氧化铟锡(ITO)、氧化锌锡(IZO)或透明导电聚合物(如聚苯胺)等。在本实施例中，第一 电极层3具体可以采用ITO-Ag-ITO叠层结构。
可选的，阵列基板1包括像素电路，像素电路包括薄膜晶体管TFT，薄膜晶体管TFT包括有源层Y、栅极G、源极S、漏极D，漏极D、源极S和栅极G的材料可以包括钼、钛、铝、铜等中的一种或多种的组合。薄膜晶体管TFT的栅极G通常用于接收控制信号，使薄膜晶体管TFT在控制信号的控制下导通或截止。薄膜晶体管TFT的源极S和漏极D中的一者连接第一电极层3。
请参阅图2至图3，在一些可选的实施例中，封装层5包括沿显示面板的厚度方向层叠设置的第一无机封装层51、有机封装层52和第二无机封装层53，第一无机封装层51在阵列基板1上的正投影和开槽在阵列基板1上的正投影错开。
由于第一无机封装层51采用无机材料制成，具有较好的水氧阻隔效果，为了简化工艺，可以使第一无机封装层51避开需要设置开槽的位置，以便于有机层直接和有机封装层52连通。
第一无机封装层51和第二无机封装层53具体可以采用氧化硅、氮化硅、氧化铝、氧化钛等无机材料。其中，氮化硅与氧化铝的折射率(致密性)优于氧化硅和氧化钛，故而氮化硅与氧化铝的水氧阻隔性能优于氧化硅和氧化钛。
在一些可选的实施例中，显示面板具有显示区AA以及和显示区AA相邻的边框区BA，有机层、像素定义层4以及封装层5均从显示区AA延伸至边框区BA；在边框区BA，像素定义层4设有第一开槽K1以供有机封装层52和有机层连通。
由于在显示区AA通常还包括整层设置的其他膜层，例如第二电极层8等，为了便于有机封装层52和有机层连通，本实施例将第一开槽K1设置于显示面板的边框区BA，以便于开设第一开槽K1，通过在像素定义层4设置第一开槽K1。一方面可以使有机封装层52和有机层连通。另一方面，通过设置第一开槽K1以使部分有机封装层52部分流入第一开槽K1，以起到阻挡有机封装层52溢流的作用。
如图3所示，可选的，第一开槽K1沿显示面板的厚度方向的横截面可 以呈矩形、锯齿形等形状，并无特殊限定。
可选的，有机封装层52部分填充于第一开槽K1，当有机封装层52采用IJP(Ink-Jet Printing，喷墨打印技术)成型时，有机封装层52具有一定的流动性，因而在像素定义层4上形成有机封装层52时，部分有机封装层52会自动填充于第一开槽K1，并和有机层接触。
可选的，在边框区BA还设有堤坝部Z，第一开槽K1设于靠近显示区AA的第一个堤坝部Z的靠近显示区AA一侧。
在一些可选的实施例中，有机层包括平坦化层2，平坦化层2采用有机材料制成，例如有机树脂等材料，用于提高显示面板的膜层平坦性，便于像素定义层4等膜层的制备。
可选的，有机层包括沿显示面板的厚度方向层叠设置的平坦化层2和过孔层6，过孔层6和平坦化层2均可以采用有机材料制成，过孔层6一方面用于供信号线进行走线，另一方面也能起到一定的提高膜层平坦性的作用。为了便于将平坦化层2的水汽释放，在本实施例中也可以使第一开槽K1贯穿过孔层6，以使有机封装层52通过贯穿像素定义层4和过孔层6的第一开槽K1连通。
可选的，第一开槽K1围绕显示区AA设置，即第一开槽K1可以设置一周，以提高有机封装层52和有机层的接触面积，改善有机层的水汽释放效果，同时也能便于位于不同位置的有机层和有机封装层52连通。
可选的，在边框区BA内第一开槽K1呈连续的环状结构，即第一开槽K1围绕整个显示区AA设置。或者，也可以在边框区BA内间隔设置有多个第一开槽K1，即设置多个单独设置的第一开槽K1，各的第一开槽K1间隔设置，且围绕显示区AA设置，以避免第一开槽K1对显示面板的封装效果造成不利影响。
在一些可选的实施例中，位于边框区BA的第一无机封装层51在阵列基板1上的正投影和第一开槽K1在阵列基板1上的正投影错开。
为了便于设置第一开槽K1，避免第一无机封装层51对第一开槽K1造成影响，可以使位于边框区BA的第一无机封装层51在阵列基板1上的正投影和第一开槽K1在阵列基板1上的正投影错开，具体可以通过让第一无 机封装层51向显示区AA所在方向内缩，即让第一无机封装层51不覆盖需要设置第一开槽K1的部分像素定义层4，边框区的部分像素定义层4不被所述第一无机封装层4覆盖。当然，也可以通过其他方式，例如设置开槽的形式以使得第一无机封装层51在阵列基板1上的正投影和第一开槽K1在阵列基板1上的正投影错开，并无特殊限定。
请参阅图4至图6，在一些可选的实施例中，显示面板具有显示区AA以及和显示区AA相邻的边框区BA，有机层、像素定义层4以及封装层5均从显示区AA延伸至边框区BA；在显示区AA，像素定义层4设有第二开槽K2以供有机封装层52和有机层连通，第二开槽K2在阵列基板1的正投影和像素开口在阵列基板1的正投影错开。可选的，有机封装层52部分填充于第二开槽K2，以和有机层连通。
除了在边框区BA设置第一开槽K1的方式外，还可以通过在显示区AA设置第二开槽K2以实现有机封装层52和有机层连通。由于在显示区AA设有颜色不同的子像素单元，子像素单元需要进行发光显示区AA，因而第二开槽K2不能对子像素单元进行干扰，且为了方便开设第二开槽K2，可以对子像素单元的第二电极层8以及子像素单元对应的无机封装部等膜层进行图案化处理，以使相邻的子像素单元之间仅设置像素定义层4。通过使第二开槽K2在阵列基板1的正投影和像素开口在阵列基板1的正投影错开，以避免第二开槽K2对像素开口内的子像素单元的出光造成影响。
在一些可选的实施例中，在像素定义层4背离阵列基板1一侧设有隔离柱L，第二开槽K2同时贯穿隔离柱L、像素定义层4和有机层连通。
通过设置隔离柱L以将显示面板的发光层形成时的蒸镀材料隔断，即所形成的各个子像素单元之间相互独立，以避免出现部分膜层采用整面蒸镀成型，而导致各子像素单元之间出现侧向导通的问题。第二开槽K2贯穿隔离柱L和有机层连通，即在隔离柱L上也需要设置开槽，以便于有机层和有机封装层52连通。
可选的，沿显示面板的厚度方向上，隔离柱L的横截面呈工字型、T型中的至少一者。隔离柱L的横截面并无特殊限定，只要保证对于蒸镀材料的隔断效果即可。
如图4至图6所示，显示面板还包括颜色不同的子像素单元，子像素单元位于像素开口中，各子像素单元包括层叠设置的第一电极块、发光材料层7和第二电极层8，至少部分相邻的子像素单元之间设有第二开槽K2。可选的，子像素单元包括第一子像素单元P1、第二子像素单元P2和第三子像素单元P3，第一子像素单元P1、第二子像素单元P2和第三子像素单元P3分别为红、蓝、绿三种颜色的子像素中任一者，具体可以通过调整所采用的发光材料层7的材料以实现不同颜色的发光。通过使第二开槽K2设置于相邻的子像素单元之间，以避免第二开槽K2对子像素单元的发光显示造成不利影响。
可选的，至少在显示区AA，第一无机封装层51包括多个间隔设置、且和子像素单元对应设置的无机封装部，无机封装部在阵列基板1上的正投影和第二开槽K2在阵列基板1上的正投影错开。
第一无机封装层51可以通过刻蚀等工艺进行图案化处理，以形成多个间隔设置的无机封装部，无机封装部是和子像素单元对应设置的，可以理解为无机封装部在阵列基板1上的正投影和子像素单元在阵列基板1上的正投影至少部分重叠，通过将第一无机封装层51分成多个无机封装部，以避免无机封装部和第二开槽K2相互干扰。
可选的，无机封装部至少部分设置在相邻的两个隔离柱L之间，且由于无机封装部和子像素单元对应设置，因而通过无机封装部以及隔离柱L相配合能够实现对于子像素单元的独立封装，避免显示面板的封装因设置第二开槽K2而受到影响，提高了显示面板封装的可靠性。可选的，在本实施例中，无机封装部可以整体均位于相邻的两个隔离柱L之间，便于设置，可以使部分无机封装部位于相邻的两个隔离柱L之间，而部分无机封装部可以延伸至隔离柱L背离阵列基板1的一侧表面，以保证封装效果。
可选的，如图7所示，第二开槽K2围绕整个子像素单元设置，即第二开槽K2呈连续的环状结构，例如圆环形或者方形环等，当第二开槽K2围绕整个子像素单元设置时，能够有效增大有机封装层52和有机层的连通面积，提高有机层的水汽释放效果。
当然，也可以使第二开槽K2围绕子像素单元的部分边缘设置，即围 绕子像素单元可以设置多个间断设置的第二开槽K2，各第二开槽K2可以分别和子像素单元不同位置的边缘相对设置，避免第一开槽K1对子像素单元的发光显示造成不利影响。
可选的，在第二电极层8和第一无机封装层51之间还层叠设有调光层9和保护层10，调光层9具体可以为CPL(cappling layer，光取出层)，主要为了降低光波导效应，提升器件整体出光性能，而保护层10可以采用LiF(氟化锂)材料制成，起到保护CPL层的作用。
请参阅图8，本发明另一实施例还提供了一种显示面板制备方法，包括以下步骤：
S110：提供阵列基板1；
S120：在阵列基板1一侧形成有机层；
S130：在有机层背离阵列基板1一侧形成像素定义层4，像素定义层4设有贯穿像素定义层4的开槽；
S140：在像素定义层4背离阵列基板1一侧形成封装层5，封装层5包括有机封装层52，并使有机封装层52和有机层之间通过开槽连通。
本实施例通过使封装层5的有机封装层52和有机层之间通过开槽连通，以使有机层所产生的气体通过封装层5的有机封装层52进行释放，即将有机层中过多的水汽导入封装层5的有机封装层52中，防止膜层剥离或鼓泡问题的产生，提高了显示面板的可靠性和使用寿命。
在步骤S110中，阵列基板1具体可以包括衬底以及形成于衬底上的像素电路，衬底可以为硬质衬底，如玻璃衬底；也可以为柔性衬底，其材质可以为聚酰亚胺、聚苯乙烯、聚对苯二甲酸乙二醇酯、聚对二甲苯、聚醚砜或聚萘二甲酸乙二醇酯。而像素电路的有源层Y、栅极G、源极S、漏极D等膜层具体可以通过蒸镀、光刻等工艺成型。
在步骤S120中，具体可以通过蒸镀工艺在阵列基板1一侧形成有机层，有机层的材质可以为六甲基二甲硅醚、环氧树脂或者聚酰亚胺(Polyimide，PI)，还可以为其它透光率在90％以上的硅系胶材料。
在步骤S130中，可以先在有机层背离阵列基板1一侧蒸镀像素定义层4的材料，之后再通过刻蚀等工艺对蒸镀材料进行图案化处理，以使像素 定义层4形成像素开口以及开槽，像素开口和开槽可以通过同一道工艺成型，也可以分别成型，并无特殊限定。
在步骤S140中，封装层5包括第一无机封装层51、有机封装层52和第二无机封装层53，由于第一无机封装层51、第二无机封装层53采用无机材料制成。因而第一无机封装层51、第二无机封装层53可以采用沉积工艺成型，而有机封装层52可以采用喷墨打印技术成型。由于像素定义层4设有开槽，因而喷墨打印的有机封装层52的材料会填充于开槽，实现和有机层的连通。
可选的，在像素定义层4上还设有发光层，发光层至少部分位于像素开口内，且在像素定义层4上还设有隔离柱L，通过设置隔离柱L以将蒸镀形成发光层时的蒸镀材料隔断，即所形成的各个子像素单元之间相互独立，以避免出现部分膜层采用整面蒸镀成型，而导致各子像素单元之间出现侧向导通的问题。
隔离柱L具体可以采用和像素定义层4相同的材料制成，以降低生产成本。
可选的，在有机层背离阵列基板1一侧形成像素定义层4和在像素定义层4背离阵列基板1一侧形成封装层5的步骤之间，还包括：在各个像素开口内形成第一子像素单元P1；在至少一个第一子像素单元P1背离阵列基板1一侧形成第一光刻胶J1；对未覆盖第一光刻胶J1的第一子像素单元P1进行刻蚀；在未被刻蚀的第一子像素单元P2背离阵列基板1一侧以及刻蚀掉第一子像素单元P1的像素开口内形成第二子像素单元P2；在位于像素开口内的至少一个第二子像素单元P2背离阵列基板1一侧形成第二光刻胶J2；对未覆盖第二光刻胶J2的第二子像素单元P2进行刻蚀。
本实施利用光刻技术，能够使第一子像素单元P1和第二子像素单元P2单独成型，便于在相邻的第一子像素单元P1和第二子像素单元P2之间形成第二开槽K2。第一子像素单元P1和第二子像素单元P2的各个膜层例如发光材料层7、第二电极层8等膜层的厚度可以单独调整，例如第一子像素单元P1和第二子像素单元P2的第二电极层8厚度可以不同。
具体的，本发明实施例以制备各一个第一子像素单元P1、第二子像素 单元P2和第三子像素单元P3为例，提供了一种制备方法，包括：
提供层叠设置的有机层和像素定义层4，像素定义层4具有三个像素开口，且在各像素开口内形成有第一电极块；
在各个像素开口内依次形成第一子像素单元P1的发光材料层7、第二电极层8、调光层9、保护层10以及无机封装部，如图9所示；当然，根据实际情况，也可以先不形成调光层9和保护层10，直接在第二电极层8一侧形成无机封装部，在形成无机封装部后，可以再在无机封装部背离阵列基板1一侧形成调光层9和保护层10。
在形成第一子像素单元P1的任一像素开口的无机封装部背离发光材料层7一侧形成第一光刻胶J1，如图10所示；
刻蚀去除未覆盖第一光刻胶J1的像素开口内的第一子像素的发光材料层7、第二电极层8、调光层9、保护层10以及无机封装部，如图11所示；
去除第一光刻胶J1，并在第一子像素单元P1的无机封装部背离发光材料层7一侧以及另外两个像素开口内形成第二子像素单元P2的发光材料层7、第二电极层8、调光层9、保护层10以及无机封装部，如图12所示；
在仅设有第二子像素单元P2的任一像素开口内的无机封装部背离发光材料层7一侧形成第二光刻胶J2，如图13所示；
刻蚀去除未覆盖第二光刻胶J2的像素开口内的第二子像素单元P2的发光材料层7、第二电极层8、调光层9、保护层10以及无机封装部，如图14所示；
去除第二光刻胶J2，并在第一子像素的无机封装部背离发光材料层7一侧、第二子像素的无机封装部背离发光材料层7一侧以及另一像素开口内形成第三子像素单元P3的发光材料层7、第二电极层8、调光层9、保护层10以及无机封装部，如图15所示；
在仅设有第三子像素单元P3的像素开口内的无机封装部背离发光材料层7一侧形成第三光刻胶J3，如图16所示；
刻蚀去除未覆盖第三光刻胶J3的像素开口内的第三子像素单元P3的发光材料层7、第二电极层8、调光层9、保护层10以及无机封装部，并去除第三光刻胶J3，如图17所示；
在至少部分相邻的第一子像素单元P1、第二子像素单元P2和第三子像素单元P3之间的像素定义层4形成第二开槽K2；
在各无机封装部背离发光材料层7一侧形成有机封装层52，部分有机封装层52填充于第二开槽K2以和有机层连通。
本发明还提供了一种显示装置，包括：显示面板；显示面板为上述任一实施例中的显示面板。
因此，本发明实施例提供的显示装置具有上述任一实施例中显示面板的技术方案所具有的技术效果，与上述实施例相同或相应的结构以及术语的解释在此不再赘述。
本申请实施例提供的显示装置可以应用于手机，也可以为任何具有显示功能的电子产品，包括但不限于以下类别：电视机、笔记本电脑、桌上型显示器、平板电脑、数码相机、智能手环、智能眼镜、车载显示器、医疗设备、工控设备、触摸交互终端等，本申请实施例对此不作特殊限定。
还需要说明的是，本申请中提及的示例性实施例，基于一系列的步骤或者装置描述一些方法或系统。但是，本申请不局限于上述步骤的顺序，也就是说，可以按照实施例中提及的顺序执行步骤，也可以不同于实施例中的顺序，或者若干步骤同时执行。

Claims (20)

  1. 一种显示面板，包括：
    阵列基板；
    有机层，设于所述阵列基板一侧；
    像素定义层，设于所述有机层背离所述阵列基板一侧；
    封装层，设于所述像素定义层背离所述阵列基板一侧，所述封装层包括有机封装层，所述有机封装层和所述有机层之间通过贯穿所述像素定义层的开槽连通。
  2. 根据权利要求1所述的显示面板，其中，所述封装层包括沿所述显示面板的厚度方向层叠设置的第一无机封装层、所述有机封装层和第二无机封装层，所述第一无机封装层相对于所述第二无机封装层靠近所述有机层设置；
    所述第一无机封装层在所述阵列基板上的正投影和所述开槽在所述阵列基板上的正投影错开。
  3. 根据权利要求1所述的显示面板，其中，所述像素定义层包括至少一层无机材料层。
  4. 根据权利要求2所述的显示面板，其中，所述显示面板还包括第一电极层，设于所述有机层背离所述阵列基板一侧，所述第一电极层包括多个相互绝缘的第一电极块。
  5. 根据权利要求4所述的显示面板，其中，所述像素定义层具有像素开口，所述像素开口暴露至少部分所述第一电极块。
  6. 根据权利要求2所述的显示面板，其中，所述显示面板具有显示区以及和所述显示区相邻的边框区，所述有机层、所述像素定义层以及所述封装层均从所述显示区延伸至所述边框区；
    在所述边框区，所述像素定义层设有第一开槽以供所述有机封装层和所述有机层连通；
    所述有机封装层部分填充于所述第一开槽。
  7. 根据权利要求6所述的显示面板，其中，所述有机层包括平坦化层； 或，所述有机层包括沿所述显示面板的厚度方向层叠设置的平坦化层和过孔层。
  8. 根据权利要求6所述的显示面板，其中，所述第一开槽围绕所述显示区设置。
  9. 根据权利要求8所述的显示面板，其中，在所述边框区内所述第一开槽呈连续的环状结构；或，在所述边框区内具有多个间隔设置的所述第一开槽。
  10. 根据权利要求6所述的显示面板，其中，位于所述边框区的所述第一无机封装层在所述阵列基板上的正投影和所述第一开槽在所述阵列基板上的正投影错开。
  11. 根据权利要求4所述的显示面板，其中，所述显示面板具有显示区以及和所述显示区相邻的边框区；
    在所述显示区，所述像素定义层设有第二开槽以供所述有机封装层和所述有机层连通，所述第二开槽在所述阵列基板的正投影和所述像素开口在所述阵列基板的正投影错开；
    所述有机封装层部分填充于所述第二开槽。
  12. 根据权利要求11所述的显示面板，其中，所述显示面板具有显示区以及和所述显示区相邻的边框区；
    在所述像素定义层有机层背离所述阵列基板一侧设有隔离柱，所述第二开槽贯穿所述隔离柱和所述有机层连通。
  13. 根据权利要求12所述的显示面板，其中，沿所述显示面板的厚度方向上，所述隔离柱的横截面呈工字型、T型中的至少一者。
  14. 根据权利要求11所述的显示面板，其中，所述显示面板还包括颜色不同的子像素单元，所述子像素单元位于所述像素开口中，各所述子像素单元包括层叠设置的所述第一电极块、发光材料层和第二电极层，至少部分相邻的所述子像素单元之间设有所述第二开槽。
  15. 根据权利要求14所述的显示面板，其中，至少在所述显示区，所述第一无机封装层包括多个间隔设置、且和所述子像素单元对应设置的无机封装部，所述无机封装部在所述阵列基板上的正投影和所述第二开槽在 所述阵列基板上的正投影错开。
  16. 根据权利要求15所述的显示面板，其中，所述无机封装部至少部分设置在相邻的两个隔离柱之间。
  17. 根据权利要求15所述的显示面板，其中，至少部分所述第二开槽围绕整个所述子像素单元设置；或，至少部分所述第二开槽围绕所述子像素单元的部分边缘设置。
  18. 一种显示面板制备方法，包括以下步骤：
    提供阵列基板；
    在所述阵列基板一侧形成有机层；
    在所述有机层背离所述阵列基板一侧形成像素定义层，所述像素定义层设有贯穿所述像素定义层的开槽；
    在所述像素定义层背离所述阵列基板一侧形成封装层，所述封装层包括有机封装层，并使所述有机封装层和所述有机层之间通过所述开槽连通。
  19. 根据权利要求18所述的显示面板制备方法，其中，所述像素定义层具有像素开口，在所述有机层背离所述阵列基板一侧形成像素定义层和所述在所述像素定义层背离所述阵列基板一侧形成封装层的步骤之间，还包括：
    在各个所述像素开口内形成第一子像素单元；
    在至少一个所述第一子像素单元背离所述阵列基板一侧形成第一光刻胶；
    对未覆盖所述第一光刻胶的第一子像素单元进行刻蚀；
    在未被刻蚀的所述第一子像素单元背离所述阵列基板一侧以及刻蚀掉所述第一子像素单元的所述像素开口内形成第二子像素单元；
    在位于所述像素开口内的至少一个所述第二子像素单元背离所述阵列基板一侧形成第二光刻胶；
    对未覆盖所述第二光刻胶的第二子像素单元进行刻蚀。
  20. 一种显示装置，包括：显示面板，所述显示面板为权利要求1至17任一项所述的显示面板。
PCT/CN2023/108839 2022-08-02 2023-07-24 显示面板、显示面板制备方法及显示装置 WO2024027524A1 (zh)

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CN108538901A (zh) * 2018-05-14 2018-09-14 云谷（固安）科技有限公司 显示面板及其制作方法和显示装置
CN111446381A (zh) * 2020-04-13 2020-07-24 武汉华星光电半导体显示技术有限公司 显示面板及显示终端
CN115224219A (zh) * 2022-08-02 2022-10-21 维信诺科技股份有限公司 显示面板、显示面板制备方法及显示装置

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Publication number Priority date Publication date Assignee Title
CN108538901A (zh) * 2018-05-14 2018-09-14 云谷（固安）科技有限公司 显示面板及其制作方法和显示装置
CN111446381A (zh) * 2020-04-13 2020-07-24 武汉华星光电半导体显示技术有限公司 显示面板及显示终端
CN115224219A (zh) * 2022-08-02 2022-10-21 维信诺科技股份有限公司 显示面板、显示面板制备方法及显示装置

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