WO2024027157A1 - 一种激光气体传感器温控方法及封装结构 - Google Patents
一种激光气体传感器温控方法及封装结构 Download PDFInfo
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- WO2024027157A1 WO2024027157A1 PCT/CN2023/081079 CN2023081079W WO2024027157A1 WO 2024027157 A1 WO2024027157 A1 WO 2024027157A1 CN 2023081079 W CN2023081079 W CN 2023081079W WO 2024027157 A1 WO2024027157 A1 WO 2024027157A1
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- circuit board
- gas sensor
- laser
- laser gas
- packaging structure
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 239000012212 insulator Substances 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 17
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- -1 mining Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
Definitions
- the invention relates to the technical field of gas sensors, and in particular to a temperature control method and packaging structure of a laser gas sensor.
- a common gas concentration detection device is a laser gas sensor, which is designed based on the principle that the target gas absorbs laser light of a specific wavelength.
- the laser chip emits laser light and receives the laser light reflected by the reflector. Within, the laser chip receives power and monitors the target gas concentration.
- the emission wavelength of the laser chip will become longer as the temperature rises, and become shorter as the temperature drops. Therefore, for example, the methane laser industry uses TEC refrigerator chips to control the temperature rise or fall, so that the wavelength can reach the methane absorption wavelength of 1650.9nm to 1653.7 between nm.
- TEC refrigerator chips are very expensive and controlled by suppliers from other countries.
- the purpose of the present invention is to provide a temperature control method and packaging structure of a laser gas sensor to solve the problems mentioned in the background art.
- the present invention provides the following technical solution: a laser gas sensor packaging structure, including a base, two insulators are embedded on the base, connecting posts are installed on the two insulators, and the two rows are connection A heating sheet is installed between the columns, and the heating sheet is connected to the connecting columns on both sides. A circuit board is installed on the heating sheet. A laser chip and a thermistor are installed on the circuit board and are connected to the circuit on the circuit board. , the circuit board is connected to the connecting posts on both sides, the laser chip is provided with an optical element on one side, and the optical element is fixed on the circuit board.
- each insulator is provided with three connecting posts, the upper ends of the six connecting posts have different heights, and the height of the connecting posts corresponds to the height of the structure to which they need to be connected.
- the base is a circular pie-shaped metal base.
- the two insulators are distributed in parallel, and the connecting posts are installed through the insulators.
- the optical element is a right-angle prism.
- a laser gas sensor temperature control method specifically includes the following contents:
- the bottom of the package structure is connected to the PCB board through the connecting column.
- the thermistor detects the ambient temperature outside the laser chip, and transmits the temperature detection signal to the PCB board through the circuit board and the connecting column.
- the chip on the PCB board responds to the signal Control the power output of the power supply to the heating plate and change the amount of heat generated by the heating plate, thereby controlling the external temperature of the laser chip and changing the wavelength of the laser chip.
- a heating plate is used to replace the TEC chip, and the temperature of the heating plate is controlled by controlling the working energy consumption of the heating plate, so that the wavelength of the laser chip is within the required range.
- the heating plate is cheap and reduces the laser gas consumption.
- the manufacturing cost of sensors also breaks the raw material control of foreign suppliers.
- Figure 1 is a schematic structural diagram of the present invention.
- connection should be understood in a broad sense.
- it can be a fixed connection, a detachable connection, an integral connection or a mechanical connection, or an electrical connection; it can be Directly connected, or indirectly connected through an intermediary, or internally connected between two components.
- a laser gas sensor packaging structure includes a base 1. Two insulators 2 are embedded in the base 1. Connecting posts 3 are installed on the two insulators 2. A heating piece 4 is installed between the connecting columns 3. The input end of the heating piece 4 is connected to the connecting columns 3 on both sides. A circuit board 5 is installed on the heating piece 4. A laser chip is installed on the circuit board 5. 6 and thermistor 7, and are connected to the circuit on the circuit board 5. The circuit board 5 is connected to the connecting posts 3 on both sides. The laser chip 6 is provided with an optical element 8 on one side, and the optical element 8 is fixed on on circuit board 5.
- a laser gas sensor packaging structure includes a base 1.
- the base 1 is a round pie-shaped metal base.
- the base 1 is embedded with two parallel-distributed insulators 2.
- the two insulators 2 are installed with connecting columns 3 running through them.
- a heating piece 4 is installed between the two rows of connecting columns 3.
- the input end of the heating piece 4 is connected to the connecting columns 3 on both sides.
- a circuit is installed on the heating piece 4.
- Board 5 the circuit board 5 is equipped with a laser chip 6 and a thermal circuit Resistor 7, and connected to the circuit on the circuit board 5.
- the circuit board 5 is connected to the connecting posts 3 on both sides.
- the laser chip 6 is provided with an optical element 8 on one side.
- the optical element 8 is a right-angle prism, and the optical element 8 is fixed. on circuit board 5;
- each insulator 2 is provided with three connecting posts 3.
- the upper ends of the six connecting posts 3 have different heights.
- the height of the connecting posts 3 corresponds to the height of the structure to be connected, which can avoid large height differences during connection.
- the connection cable is broken.
- a laser gas sensor temperature control method specifically includes the following contents:
- the bottom of the package structure is connected to the pcb board through the connecting post 3.
- the thermistor 7 detects the ambient temperature outside the laser chip 6, and transmits the temperature detection signal to the pcb board through the circuit 5 board and the connecting post 3.
- the pcb board The chip on the controller controls the power output of the power supply to the heating plate 4 according to the received signal, changes the amount of heat generated by the heating plate 4, thereby controlling the external temperature of the laser chip 6 and changing the wavelength of the laser chip 6, for example, so that the wavelength can reach the methane absorption wavelength. Between 1650.9nm and 1653.7nm.
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
本发明公开了一种激光气体传感器封装结构，包括基座，所述基座上嵌有两块绝缘体，两块所述绝缘体上均安装有连接柱，两列所述连接柱之间安装有加热片，所述加热片连接两侧的连接柱，所述加热片上安装有电路板，所述电路板上安装有激光芯片和热敏电阻，激光芯片和热敏电阻与电路板上的电路连接，所述电路板连接两侧的连接柱，所述激光芯片一侧设有光学元件，所述光学元件固定于电路板上。本结构中采用加热片替代TEC芯片，通过控制加热片的工作能耗来控制其温度，使得激光芯片波长在要求范围之内，加热片价格便宜，降低了激光气体传感器的制造成本。
Description
本发明涉及气体传感器技术领域，具体涉及一种激光气体传感器温控方法及封装结构。
当前，随着工业的迅猛发展，其中化工、矿产以及油气开采行业等在生产过程中难免产生易燃易爆、有毒的危险性气体，例如甲烷等。危险气体一旦泄漏并达到一定浓度，会导致爆炸和中毒。为了保障人民群众的生命财产安全，对可燃易爆、有毒目标气体的检测和实时监测是迫在眉睫的。目前，常见的气体浓度检测装置为激光气体传感器，其原理是利用目标气体对特定波长的激光具有吸收作用的原理而设计，激光芯片发射激光，并接受反射镜反射的激光，在固定的光程内，通过激光芯片接受功率，监测目标气体浓度。激光芯片发射波长会随着温度升高而变长，随着温度降温而变短，因此例如甲烷激光业界是采用TEC制冷器芯片控制温度升温或降温，使得波长能达到甲烷吸收波长1650.9nm至1653.7nm之间。但TEC制冷器芯片非常昂贵，且受控于他国供应商。
发明内容
本发明的目的在于提供一种激光气体传感器温控方法及封装结构，以解决背景技术中提到的问题。为实现上述目的，本发明提供如下技术方案：一种激光气体传感器封装结构，包括基座，所述基座上嵌有两块绝缘体，两块所述绝缘体上均安装有连接柱，两列所述连接
柱之间安装有加热片，所述加热片连接两侧的连接柱，所述加热片上安装有电路板，所述电路板上安装有激光芯片和热敏电阻，并与电路板上的电路连接，所述电路板连接两侧的连接柱，所述激光芯片一侧设有光学元件，所述光学元件固定于电路板上。
优选地，每块绝缘体上设有三个连接柱，六个所述连接柱的上端高度不同，所述连接柱的高度与其需要连接的结构高度对应。
优选地，所述基座为圆饼状金属基座。
优选地，两块所述绝缘体平行分布，连接柱贯穿安装在绝缘体上。
优选地，所述光学元件为直角棱镜。
一种激光气体传感器温控方法，具体包括以下内容：
将该封装结构底部通过连接柱连接pcb板，在使用时，热敏电阻检测激光芯片外部的环境温度，并将温度检测信号通过电路板和连接柱传递给pcb板，pcb板上的芯片根据信号控制电源对加热片的功率输出大小，改变加热片的发热量，从而控制激光芯片外部温度，改变激光芯片波长。
本发明的技术效果和优点：本结构中采用加热片替代TEC芯片，通过控制加热片的工作能耗来控制其温度，使得激光芯片波长在要求范围之内，加热片价格便宜，降低了激光气体传感器的制造成本，同时也打破了外国供应商的原料管控。
图1为本发明的结构示意图。
图中：1-基座，2-绝缘体，3-连接柱，4-加热片，5-电路板，6-
激光芯片，7-热敏电阻，8-光学元件。
为了使本发明的实现技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本发明，在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接或是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以两个元件内部的连通。
实施例1
如图1图所示的一种激光气体传感器封装结构，包括基座1，所述基座1上嵌有两块绝缘体2，两块所述绝缘体2上均安装有连接柱3，两列所述连接柱3之间安装有加热片4，所述加热片4的输入端连接两侧的连接柱3，所述加热片4上安装有电路板5，所述电路板5上安装有激光芯片6和热敏电阻7，并与电路板5上的电路连接，所述电路板5连接两侧的连接柱3，所述激光芯片6一侧设有光学元件8，所述光学元件8固定于电路板5上。
实施例2
如图1图所示的一种激光气体传感器封装结构，包括基座1，基座1为圆饼状金属基座，所述基座1上嵌有两块平行分布的绝缘体2，两块绝缘体2上均贯穿安装有连接柱3，两列所述连接柱3之间安装有加热片4，所述加热片4的输入端连接两侧的连接柱3，所述加热片4上安装有电路板5，所述电路板5上安装有激光芯片6和热敏电
阻7，并与电路板5上的电路连接，所述电路板5连接两侧的连接柱3，所述激光芯片6一侧设有光学元件8，光学元件8为直角棱镜，光学元件8固定于电路板5上；
其中，每块绝缘体2上设有三个连接柱3，六个所述连接柱3的上端高度不同，连接柱3的高度与其需要连接的结构高度对应，可以避免连接时产生较大高度差，避免连接线发生断裂。
一种激光气体传感器温控方法，具体包括以下内容：
将该封装结构底部通过连接柱3连接pcb板，在使用时，热敏电阻7检测激光芯片6外部的环境温度，并将温度检测信号通过电路5板和连接柱3传递给pcb板，pcb板上的芯片根据接收到的信号控制电源对加热片4的功率输出大小，改变加热片4的发热量，从而控制激光芯片6外部温度，改变激光芯片6波长，例如，使波长能达到甲烷吸收波长1650.9nm至1653.7nm之间。
最后应说明的是：以上所述仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (6)
- 一种激光气体传感器封装结构，包括基座，其特征在于：所述基座上嵌有两块绝缘体，两块所述绝缘体上均安装有连接柱，两列所述连接柱之间安装有加热片，所述加热片连接两侧的连接柱，所述加热片上安装有电路板，所述电路板上安装有激光芯片和热敏电阻，并与电路板上的电路连接，所述电路板连接两侧的连接柱，所述激光芯片一侧设有光学元件，所述光学元件固定于电路板上。
- 根据权利要求1所述的一种激光气体传感器温控方法及封装结构，其特征在于：每块绝缘体上设有三个连接柱，六个所述连接柱的上端高度不同，所述连接柱的高度与其需要连接的结构高度对应。
- 根据权利要求1所述的一种激光气体传感器温控方法及封装结构，其特征在于：所述基座为圆饼状金属基座。
- 根据权利要求1所述的一种激光气体传感器温控方法及封装结构，其特征在于：两块所述绝缘体平行分布，连接柱贯穿安装在绝缘体上。
- 根据权利要求1所述的一种激光气体传感器温控方法及封装结构，其特征在于：所述光学元件为直角棱镜。
- 一种激光气体传感器温控方法，其特征在于，具体包括以下内容：将该封装结构底部通过连接柱连接pcb板，在使用时，热敏电阻检测激光芯片外部的环境温度，并将温度检测信号通过电路板和连接柱传递给pcb板，pcb板上的芯片根据信号控制电源对加热片的功率输出大小，改变加热片的发热量，从而控制激光芯片外部温度，改变激光芯片波长。
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| CN202210937237.7 | 2022-08-05 | ||
| CN202210937237.7A CN115656059A (zh) | 2022-08-05 | 2022-08-05 | 一种激光气体传感器温控方法及封装结构 |
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| CN118688405A (zh) * | 2024-08-22 | 2024-09-24 | 启思半导体(杭州)有限责任公司 | 一种应用在mems气体传感器的控温模块 |
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| CN115656059A (zh) * | 2022-08-05 | 2023-01-31 | 首传激光科技(上海)有限公司 | 一种激光气体传感器温控方法及封装结构 |
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| US20150037043A1 (en) * | 2011-11-01 | 2015-02-05 | Lightron Fiber-Optic Devices Inc. | Optical Transceiver Capable of Controlling Self-Heating According to Temperature |
| CN107994456A (zh) * | 2017-11-20 | 2018-05-04 | 大连艾科科技开发有限公司 | To封装激光器及气体传感器 |
| CN109768469A (zh) * | 2019-01-22 | 2019-05-17 | 大连艾科科技开发有限公司 | 封装方法、激光器和气体检测装置 |
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| CN218102022U (zh) * | 2022-09-06 | 2022-12-20 | 瑞泰(威海)电子科技有限公司 | 一种带温度控制的光学发射次组件 |
| CN115656059A (zh) * | 2022-08-05 | 2023-01-31 | 首传激光科技(上海)有限公司 | 一种激光气体传感器温控方法及封装结构 |
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