WO2024022287A1 - 一种焊盘修复设备及焊盘修复方法 - Google Patents

一种焊盘修复设备及焊盘修复方法 Download PDF

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Publication number
WO2024022287A1
WO2024022287A1 PCT/CN2023/108875 CN2023108875W WO2024022287A1 WO 2024022287 A1 WO2024022287 A1 WO 2024022287A1 CN 2023108875 W CN2023108875 W CN 2023108875W WO 2024022287 A1 WO2024022287 A1 WO 2024022287A1
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WO
WIPO (PCT)
Prior art keywords
pad
initial
repaired
area
pads
Prior art date
Application number
PCT/CN2023/108875
Other languages
English (en)
French (fr)
Inventor
张伟
胡鹏举
于洋
卢俊超
Original Assignee
京东方科技集团股份有限公司
京东方晶芯科技有限公司
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Application filed by 京东方科技集团股份有限公司, 京东方晶芯科技有限公司 filed Critical 京东方科技集团股份有限公司
Publication of WO2024022287A1 publication Critical patent/WO2024022287A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a pad repairing equipment and a pad repairing method.
  • SMT surface mounting technology (abbreviation for Surface Mounted Technology). It is a popular technology and process in the electronic assembly industry. It is a way to place electronic components with pins on a surface with circuits and pads. The technology of soldering and assembling the surface of the base substrate through reflow soldering or dip soldering.
  • Embodiments of the present disclosure provide a pad repair equipment and a pad repair method, which can effectively repair defective pads before and after die bonding, so as to solve the problems of low product yield and high cost caused by defective pads.
  • an embodiment of the present disclosure provides a pad repairing device for repairing a pad to be repaired on a circuit board; the pad repairing device includes:
  • a pad pre-processing mechanism is used to perform pre-processing operations on the pad to be repaired and its adjacent pads to obtain the area to be repaired;
  • a pad coating mechanism is used to form an initial pad, the pad coating mechanism includes a coating component and a curing component, wherein the coating component is used to coat conductive material in the area to be repaired, the The curing component is used to cure the coated conductive material to form the initial pad; and
  • a pad encapsulation mechanism is used to encapsulate at least the area where the initial pad is located to form a specific New pads with predetermined exposure patterns;
  • the pad pretreatment mechanism includes:
  • a desoldering component used to perform desoldering processing on the pads in the initial area, where the initial area includes the pads to be repaired and the pads adjacent to the pads to be repaired;
  • An insulation layer removal component is used to remove part of the insulation layer adjacent to the wiring position on the periphery of the initial area to expose part of the wiring to form an area to be repaired;
  • a cleaning component is used to clean the area to be repaired.
  • the workbench includes different working positions, and the pad preprocessing mechanism, the pad coating mechanism and the pad packaging mechanism are located at the different working positions in sequence; or
  • the workbench has at least one working position, and the pad pretreatment mechanism, the pad coating mechanism and the pad packaging mechanism can respectively move to the working position to perform corresponding operations.
  • the pad coating mechanism further includes: a pad trimming component for trimming the initial pad so that the initial pad reaches a predetermined standard
  • the predetermined standard includes: the initial pad The pads have a predetermined thickness, a predetermined shape, and a predetermined flatness.
  • the pad trimming assembly includes a laser repair assembly for trimming at least one of the thickness, shape and flatness of the initial pad using a laser.
  • the pad packaging mechanism includes:
  • the trimming component is used to trim the outer packaging layer of the encapsulated pad to obtain a new pad with a predetermined exposed shape.
  • the packaging component includes a coating needle for coating the insulating resin material around the initial pad; and/or the trimming component includes a laser trimmer for cutting the packaging material by laser.
  • the desoldering assembly includes a welding laser for welding by emitting laser light, and/or an infrared welder for welding by infrared rays;
  • the insulation layer removal assembly includes an insulation layer removal laser for removing the insulation layer by emitting laser light, and/or a scraper for mechanical cutting to remove the insulation layer;
  • the cleaning assembly includes a cleaning laser for cleaning foreign matter by emitting laser light, and/or a surface cleaning unit for blowing air to the area to be repaired to clean foreign matter.
  • the welding laser, the insulation layer removing laser and the cleaning laser respectively emit laser light of different wavelengths.
  • the surface cleaning unit includes:
  • At least one blowing pipe located on one side of the area to be repaired and used to blow air to the surface of the area to be repaired;
  • At least one air suction duct located on the other side of the area to be repaired and used to suck air from the surface of the area to be repaired;
  • the blowing port of at least one of the blowing tubes is opposite to the suction port of at least one of the suction tubes.
  • the blowing port is in the shape of a constriction, and its inner diameter gradually shrinks from the side away from the air outlet to the side close to the air outlet; and/or the air suction port is in the shape of a flare, and its inner diameter is gradually narrowed from the side away from the air outlet to the side close to the air outlet.
  • One side gradually expands.
  • the blow pipe is provided with a shielding member for blocking the blow port to prevent foreign matter from splashing.
  • the shielding member includes a semi-enclosed cover arranged around the outer circumference of the blow pipe, and is disposed above the blowing port.
  • At least two desoldering components there are at least two desoldering components, and during welding, at least two desoldering components are located on opposite sides of the pad to be repaired and its adjacent pads. Or at least one of the desoldering components is movable around the periphery of the pad to be repaired and its adjacent pads.
  • the pad coating mechanism further includes: an electrical measuring component for testing the electrical performance of the initial pad.
  • the electrical measurement component includes an electrical measurement probe configured to conduct electricity in contact with the initial pad.
  • the curing component includes a laser curing device.
  • embodiments of the present disclosure provide a pad repair method, using the soldering method as described above.
  • the disk repair equipment repairs the pads to be repaired on the circuit board.
  • the method includes the following steps performed in sequence:
  • the step of preprocessing the pad to be repaired and its adjacent pads specifically includes: performing a desoldering process on the pads in the initial area, where the initial area includes the pad to be repaired and the soldering pads adjacent to the pad to be repaired. disk; remove part of the insulation layer adjacent to the wiring position on the periphery of the initial area to expose part of the wiring to form an area to be repaired; clean the area to be repaired;
  • the step of forming an initial bonding pad in the area to be repaired specifically includes: coating a conductive material in the area to be repaired; solidifying the coated conductive material to form the initial bonding pad;
  • desoldering the pad to be repaired and its adjacent pads specifically includes: melting by emitting laser and/or infrared rays to the pad to be repaired and its adjacent pads. weld;
  • the step of removing part of the insulation layer adjacent to the wiring position on the periphery of the initial area to expose part of the wiring to form an area to be repaired specifically includes: removing the insulation layer by emitting laser and/or mechanical cutting;
  • Cleaning the area to be repaired specifically includes: cleaning foreign matter by emitting laser and/or blowing air to the area to be repaired;
  • the step of forming an initial bonding pad in the area to be repaired further includes: after curing the coated conductive material to form the initial bonding pad, trimming the initial bonding pad to A pad trimming component that enables the initial pad to reach a predetermined standard, and the predetermined standard includes: the initial pad has a predetermined thickness, a predetermined shape, and a predetermined flatness;
  • the step of forming an initial bonding pad in the area to be repaired further includes: after curing the coated conductive material to form the initial bonding pad, performing electrical testing on the electrical properties of the initial bonding pad. Test, and determine whether the electrical performance of the initial pad reaches a predetermined parameter; if not, trim the initial pad until the electrical performance of the initial pad reaches a predetermined parameter;
  • the trimming of the initial bonding pad until the electrical performance of the initial bonding pad reaches predetermined parameters specifically includes:
  • Adjust at least one of the size, shape or flatness of the initial pad test the electrical performance of the adjusted initial pad, and determine whether the electrical performance of the initial pad is Whether the predetermined parameters are reached; if not, repeat the steps of preprocessing the pad to be repaired and its adjacent pads, and the step of forming an initial pad in the area to be repaired until the initial pad The electrical performance reaches predetermined parameters;
  • the step of encapsulating at least the area where the initial pad is located to form a new pad with a predetermined exposure pattern specifically includes:
  • the outer packaging layer of the encapsulated pad is trimmed to obtain a new pad with a predetermined exposed shape.
  • the pad repair equipment mainly includes a pad pre-treatment mechanism, a pad coating mechanism and a pad packaging mechanism.
  • the pads in the initial area can be desoldered through the desoldering assembly in the pad pretreatment mechanism.
  • the initial area can include the pad to be repaired and its adjacent pads. ;
  • part of the insulation layer adjacent to the wiring position on the periphery of the initial area can be removed through the insulation layer removal component to expose part of the wiring. In this way, the subsequent coating of the pad can be compared with the original wiring.
  • the contact area is increased to avoid the problem of excessive resistance.
  • an area to be repaired is formed; then, the area to be repaired can be cleaned by the cleaning component to clean the area to be repaired. Clean and smooth the residues, impurities and foreign matter in the area to do pretreatment work for the coating of the new pad; then, use the coating component in the pad coating mechanism to re-apply to the area to be repaired. Coating a conductive material, and then curing the coated conductive material through the curing component to obtain a conductive initial pad; then, encapsulating the peripheral exposed pads and traces of the initial pad to obtain a predetermined Expose patterned new pads.
  • circuit boards with defective soldering pads can be effectively repaired, improving circuit board yield and reducing losses caused by product scrapping.
  • Figure 1 shows a schematic cross-sectional view of a circuit board with electronic components and pads
  • Figure 2 shows a top view of a circuit board with electronic components and pads
  • FIG. 3 shows the structure of the pad pretreatment mechanism in the pad repair equipment provided by the embodiment of the present disclosure. intention
  • Figure 4 shows a schematic structural diagram of the initial area formed after desoldering of the pad to be repaired and its adjacent pads
  • Figure 5 shows a schematic diagram of the area to be repaired after the insulation layer removal component removes part of the insulation layer in the pad repair equipment provided by an embodiment of the present disclosure
  • Figure 6 shows a schematic structural diagram of the pad coating mechanism in the pad repair equipment provided by an embodiment of the present disclosure
  • FIG. 7 shows a schematic diagram of re-coating conductive material on a circuit board to form an initial pad in the pad repair equipment provided by an embodiment of the present disclosure
  • Figure 8 shows a schematic structural diagram of the pad packaging mechanism encapsulating the exposed pads and circuits around the initial pad in the pad repair equipment provided by the embodiment of the present disclosure
  • FIG. 9 shows a flow chart of a pad repair method provided by an embodiment of the present disclosure.
  • solder In the SMT process, in order to complete the fixed connection between the electronic components and the pads, solder needs to be placed on the pads to be electrically connected to the electronic components on the substrate, or solder is placed on the pins of the electronic components, and then the electronic components are Aligned with and placed in contact with the solder pad, for example, at a high temperature of 230°C to 260°C, the solder is melted and well moistened, and then quickly cooled down to achieve a fixed connection between the electronic component and the solder pad.
  • the material of the welding pad is generally copper, but copper is easy to oxidize, so the surface of the welding pad needs to be treated with anti-oxidation.
  • Surface treatment methods for the pads include nickel-gold coating or silver paste coating. In this way, the electronic components are directly soldered to the anti-oxidation treated pad surface using solder (the solder is a metal including tin) through a reflow soldering process.
  • intermetallic compound During the reflow soldering process, the solder, copper alloy layer and pad will form an intermetallic compound (IMC).
  • the thickness and composition of the intermetallic compound are functionally related to the time, temperature and application conditions of the soldering process, and It will cause the internal stress at the joint of the materials to change. Usually as the thickness of the intermetallic compound increases, the internal stress gradually increases, causing the contact part (welding point) between the electronic component and the pad to become brittle or even broken. This in turn affects the connection strength and reliability of the two.
  • a soldering pad repairing equipment and a soldering pad repairing method provided in embodiments of the present disclosure can repair soldering pads on circuit boards.
  • the pads to be repaired are repaired to solve the problems of low product yield and high cost caused by poor pads.
  • the pad repair equipment provided by the embodiment of the present disclosure includes: a pad pretreatment mechanism 10 , a pad coating mechanism 20 and a pad packaging mechanism 30 .
  • the pad preprocessing mechanism 10 is used to perform preprocessing operations on the pad 1a to be repaired and its adjacent pads 1b to obtain the area B to be repaired.
  • the pad pretreatment mechanism 10 includes: a desoldering component 11 , an insulation layer removal component 12 and a cleaning component 13 .
  • the desoldering component 11 is used to perform desoldering processing on the pads in the initial area A.
  • the initial area A includes the pad 1a to be repaired and the pad 1b adjacent to the pad 1a to be repaired (as shown in Figure 4 shown).
  • the desoldering component 11 is set up to desolder the initial area A where the pad 1a to be repaired and its adjacent pad 1b are located.
  • the electrodes and pads of electronic components become more precise and smaller, and the gaps between adjacent electronic components become smaller and smaller. The distance is getting smaller and smaller.
  • the inventor of the present disclosure has discovered through research that when a problem occurs with the pad of a certain electronic component, due to the limitation of the pad size, if only the pad is repaired, the coating and trimming of the new pad will be affected. Therefore, , the pads of adjacent electronic components can also be repaired to avoid affecting the subsequent coating and trimming of new pads.
  • the electronic components may be light-emitting diodes, and each light-emitting diode has two pins corresponding to the two pads 1 one-to-one.
  • different colors of light-emitting diodes may be included, such as red light-emitting diodes R, green light-emitting diodes G, and blue light-emitting diodes B.
  • R red light-emitting diodes
  • G green light-emitting diodes
  • B blue light-emitting diodes
  • a pixel unit includes a red light-emitting diode R, a green light-emitting diode G, and a blue light-emitting diode B.
  • Each light-emitting diode can be connected to a plurality of pads. All pads in a pixel unit can be regarded as a pad group. When any pad in the pad group is defective, all pads in the pad group can be desoldered and repaired.
  • the spacing between electronic components on the circuit board is large, correspondingly, the spacing between the pads corresponding to the electronic components is large, and when a certain pad is defective, it can only be The adjacent pads whose distance from the pad is less than a certain numerical range are desoldered and repaired, and the distance between the pad and the pad is Other adjacent pads whose distance is greater than this value range do not need to be desoldered and repaired.
  • the insulation layer removal component 12 is used to remove part of the insulation layer adjacent to the wiring 4 on the periphery of the initial area A to expose a part of the wiring 4 close to the initial area A. After part of the insulation layer is removed in the initial area A That is, the area B to be repaired is formed (as shown in Figure 5).
  • the reason for setting up the insulation layer removal component 12 is:
  • the number of pads of the electronic component 2 on the circuit board corresponds to the number of pins of the electronic component 2.
  • the electronic component 2 as a light-emitting diode as an example, the light-emitting diode has two pins, and the number of corresponding pads 1 is two, and one pin is connected to one pad 1 correspondingly.
  • the circuit board usually includes a base substrate 3, traces 4 located on the base substrate 3, and an insulating layer 5 located above the traces 4.
  • the insulating layer 5 is provided with an opening 5a, and the portion of each trace 4 exposed by the opening 5a is for pad 1.
  • the peripheral adjacent wiring 4 of the initial area A is removed through the insulation layer removal component 12
  • the area of the new pad to be subsequently coated can be large enough, and the contact area with the peripheral wiring 4 can be increased to avoid the problem of excessive resistance.
  • an area to be repaired B is formed (as shown in FIG. 5).
  • the cleaning component 13 is used to clean the area B to be repaired and remove residues, impurities, and foreign matter in the area B to be repaired, so as to ensure the smoothness of the area B to be repaired and to prepare the coating for the new pad. Good preprocessing job.
  • the pad coating mechanism 20 is used to form the initial pad C, and the pad coating mechanism 20 includes a coating component 21 and a curing component 22 .
  • the coating assembly 21 is used to coat conductive material in the area B to be repaired, where the conductive material may include silver paste, copper paste, etc.
  • the curing component 22 is used to cure the coated conductive material to form the initial pad C.
  • the curing assembly 22 may include any suitable device such as a laser curing device.
  • the pad encapsulation mechanism 30 is used to encapsulate at least the area where the initial pad C is located to form a new pad with a predetermined exposure pattern.
  • the purpose of providing the pad packaging mechanism 30 is to prevent oxygen by packaging the exposed parts and circuits around the initial pad C. chemical and corrosion.
  • the predetermined exposure pattern refers to the pattern of the area where the new pad to be formed is exposed outside the insulating layer.
  • the area of the initial pad C will be larger than the area of the new pad that will eventually be formed, and its shape will also be different from the shape of the new pad that will eventually be formed. That is to say, the current exposure pattern of the initial pad C will be different from that of the new pad that will eventually be formed.
  • encapsulating at least the area where the initial bonding pad C is located refers to encapsulating the area of the periphery of the initial bonding pad C that exceeds its predetermined exposure pattern and the area where the wiring is exposed.
  • the pad repair equipment provided by the embodiments of the present disclosure can effectively repair the pads of circuit boards with defective pads, improve the circuit board yield, and reduce losses caused by product scrapping.
  • the pad repair equipment sequentially performs corresponding operations of the pad pretreatment mechanism 10 , the pad coating mechanism 20 , and the pad packaging mechanism 30 .
  • the pad repair equipment may include a workbench for placing the circuit board; the workbench may include different working positions, and the circuit board may be transferred to different working positions on the workbench. .
  • the pad pretreatment mechanism 10 , the pad coating mechanism 20 and the pad packaging mechanism 30 are sequentially arranged at the different working positions along the transmission path of the workbench. In this way, the operations of pad pretreatment, pad coating, and pad encapsulation can be performed in sequence.
  • the workbench has at least one working position, and the pad preprocessing mechanism 10 , the pad coating mechanism 20 and the pad packaging mechanism 30 can respectively move to the working position. to perform the corresponding action.
  • the desoldering component 11 can select one or both of a welding laser and an infrared welder.
  • the welding laser performs welding by emitting laser.
  • the infrared welder The welder performs welding using infrared rays.
  • the welding laser and the infrared welder can be selected from existing welding products on the market, and their specific working principles will not be described in detail here.
  • the desoldering purpose is achieved by controlling the wavelength of the emitted laser, with high precision and easy operation.
  • the desoldering component 11 may not be limited to a welding laser or an infrared welder.
  • the insulation layer removal component 12 includes one or both of an insulation layer removal laser or a scraper.
  • the insulation layer removal laser can remove the insulation layer by emitting laser light, and the scraper can remove the insulation layer by mechanical cutting.
  • the insulation layer removing laser and the scraper can be selected from existing products on the market, and their specific working principles will not be described in detail here.
  • the insulation layer removing laser achieves the purpose of removing the insulation layer by controlling the wavelength of the emitted laser.
  • This laser cutting method is used to remove the insulation layer. Compared with other methods of removing the insulation layer, the cutting accuracy is higher and the operation is more convenient.
  • the insulation layer removal component 12 may not be limited to a laser or a scraper. In practical applications, the appropriate device can be reasonably selected according to actual needs to achieve the purpose of cutting the insulation layer.
  • the cleaning assembly 13 includes at least one of a cleaning laser 131 and a surface cleaning unit.
  • the cleaning laser 131 is used to clean foreign matter by emitting laser light.
  • the surface cleaning unit is used to blow air to the area B to be repaired to clean foreign matter.
  • the cleaning laser 131 achieves the purpose of cleaning foreign matter by controlling the wavelength of the emitted laser, with high precision and easy operation.
  • the cleaning component 13 may include both a cleaning laser 131 and a surface cleaning unit.
  • the surface cleaning unit can blow away the electronic components 2, molten tin, foreign matter, and impurities to prevent any impact on the coating process of the soldering pad.
  • the welding laser, the insulation layer removing laser and the cleaning laser 131 can achieve different functions by respectively emitting laser light of different wavelengths.
  • the surface cleaning unit includes: at least one blowing pipe 1321 located on one side of the area to be repaired B and used to blow air to the surface of the area to be repaired B. ; and at least one suction pipe 1322 located on the other side of the area to be repaired B and used to suck air from the surface of the area to be repaired B; the blowing port a of at least one blowing pipe 1321 and at least one of the The air suction ports b of the air suction duct 1322 are opposite to each other.
  • the surface cleaning unit uses a blow pipe 1321 and a suction pipe 1322, which are arranged on opposite sides of the surface of the area B to be repaired. After the solder is dissolved, the electronic component 2 and the solder can be blown by the blow pipe 1321. The suction pipe 1322 can be sucked away by the suction pipe 1322. At the same time, the impurities and foreign matter produced by removing the insulation layer and cleaning the pads can be blown away to prevent the impact on the coating process of the pads. ring.
  • only the blowing pipe 1321 or only the suction pipe 1322 may be provided.
  • the blowing port a may be designed to be constricted, and its inner diameter gradually shrinks from the side away from the air port to the side close to the air port.
  • the blow pipe 1321 is in a constricted shape, ensuring sufficient blowing force.
  • the air suction port b may be designed to be in a flared shape, and its inner diameter gradually expands from the side away from the air outlet to the side close to the air outlet.
  • the air suction port b is in a flared shape (that is, a trumpet shape), which is more convenient for absorbing foreign matter and impurities.
  • the blowing pipe 1321 is provided with a blocking member 1323 for blocking the blowing port a to prevent foreign matter from splashing.
  • a blocking member 1323 for blocking the blowing port a to prevent foreign matter from splashing.
  • the shielding member includes a semi-enclosed cover arranged around the outer circumference of the blow pipe 1321, which is disposed above the blowing port a.
  • the blow pipe 1321 can be in the shape of a hat brim at its blowing port a, which facilitates effective shielding of foreign matter. It should be understood that in practical applications, the specific structure of the blow pipe 1321 is not limited to this.
  • the number of the desoldering components 11 is at least two, and when welding is performed, at least two of the desoldering components 11 are respectively located on the Opposite sides of the pad 1a to be repaired and its adjacent pads 1b, or at least one of the desoldering components 11 is movable around the periphery of the pad 1a to be repaired and its adjacent pads 1b.
  • Such an arrangement facilitates emitting laser or infrared rays from the opposite sides or periphery of the pad 1a to be repaired and its adjacent pad 1b for welding, so as to achieve a better desoldering effect.
  • the pad coating mechanism 20 further includes a pad trimming assembly 24 , which is used to trim the initial pad C. , so that the initial pad C (as shown in FIG. 7 ) reaches a predetermined standard, and the predetermined standard includes: the initial pad C has a predetermined thickness, a predetermined shape, and a predetermined flatness.
  • the pad repair equipment may also include a pad trimming component 24 for trimming the thickness, shape, flatness, etc. of the initial pad C to meet predetermined standards.
  • the pad trimming component 24 may be a pad trimming laser, which is used to trim at least one of the thickness, shape and flatness of the initial pad C through laser.
  • the pad trimming component 24 can also be implemented in other ways.
  • the pad coating mechanism 20 may also include: an electrical measuring component 23 for testing the electrical performance of the initial pad C.
  • the electrical measurement component 23 may include an electrical measurement probe for conducting electrical contact with the initial pad C.
  • the initial bonding pad C is trimmed until the electrical performance of the initial bonding pad C reaches a predetermined parameter.
  • trimming the initial pad C means modifying the size and shape of the initial pad C. Or adjust at least one of the flatness, test the electrical performance of the adjusted initial pad C, and determine whether the electrical performance of the initial pad C reaches the predetermined parameters; if it still does not reach the If the predetermined parameters are determined, the initial pad C can be desoldered, coated, and cured again, and the electrical test can be performed again until the electrical performance of the initial pad C reaches the predetermined parameters.
  • the pad coating mechanism 20 may also include a surface treatment component for performing anti-oxidation treatment on the surface of the initial pad.
  • the surface treatment component may be nickel-gold or silver-coated.
  • the pad packaging mechanism 30 may also include: a packaging component 31 and a trimming component 32.
  • the packaging component 31 is used to seal the initial pad C.
  • the packaging material is coated around the exposed pad and circuit for packaging; the trimming component 32 is used to trim the surrounding packaging layer of the packaged pad to obtain a new pad with a predetermined exposed shape (as shown in Figure 2 shown).
  • the trimming component 32 can also be used to trim the package part that exceeds the specification, such as cutting, to prevent it from affecting subsequent processes. Influence.
  • the packaging component 31 can use either a coating needle that can coat the insulating resin material on the periphery of the initial pad C, or a 3D printer that can print the insulating resin material on the periphery of the initial pad C through 3D printing. At least one of them has high packaging precision and is easy to operate.
  • the trimming component 32 can use a laser trimmer that can cut the packaging material with a laser, which has high cutting accuracy and is easy to operate.
  • the packaging component 31 can also include an insulating resin curing component 33.
  • the insulating resin The curing component 33 may use a curing laser.
  • the specific implementation manners of the packaging component 31 and the trimming component 32 are not limited thereto.
  • the embodiment of the present disclosure also provides a pad repair method, which is used to repair the pad 1a to be repaired on the circuit board using the pad repair equipment in the embodiment of the present disclosure. As shown in Figure 9, the method Includes the following steps in sequence:
  • Step S01 the steps of preprocessing the pad 1a to be repaired and its adjacent pad 1b, specifically include:
  • Step S011 desoldering the pads in the initial area A, which includes the pad to be repaired 1a and its adjacent pad 1b (as shown in Figure 4);
  • Step S012 Remove part of the insulating layer adjacent to the circuit position on the periphery of the initial area A to expose part of the circuit to form the area to be repaired B (as shown in Figure 5);
  • Step S013 Clean the area B to be repaired
  • Step S02 the step of forming the initial pad C in the area to be repaired B, specifically includes:
  • Step S021 Coat conductive material on the area B to be repaired
  • Step S022 Solidify the coated conductive material to form the initial pad C (as shown in Figure 7);
  • Step S03 Encapsulate at least the area where the initial pad C is located to form a predetermined Steps to expose patterned new pads.
  • the circuit board in each of the above steps, according to the above step sequence, is transported to different working positions of the workbench in sequence; or, the circuit board is placed at the working position, According to the above sequence of steps, the pad pretreatment mechanism 10 , the pad coating mechanism 20 and the pad packaging mechanism 30 are respectively moved to the working position to perform corresponding operations.
  • the above step S011 specifically includes: performing welding by emitting laser and/or infrared rays to the pad to be repaired 1a and its adjacent pad 1b;
  • step S012 specifically includes: removing the insulating layer by emitting laser and/or mechanical cutting;
  • step S013 specifically includes: cleaning foreign matter by emitting laser and/or blowing air to the area B to be repaired.
  • step S022 after step S022, it also includes:
  • Step S023 Trim the initial pad C so that the initial pad C reaches a predetermined standard of pad trimming assembly 3222.
  • the predetermined standard includes: the initial pad C has a predetermined thickness, a predetermined shape, and Predetermined flatness.
  • step S02 after step S022, it also includes:
  • Step S023 Test the electrical performance of the initial pad C, and determine whether the electrical performance of the initial pad C reaches predetermined parameters
  • Step S024 If not, trim the initial pad C until the electrical performance of the initial pad C reaches a predetermined parameter.
  • step S024 specifically includes:
  • Step S0241 Adjust at least one of the size, shape or flatness of the initial pad C, test the electrical performance of the adjusted initial pad C, and determine the electrical properties of the initial pad C. Whether the electrical performance reaches predetermined parameters;
  • Step S0242 If not, repeat steps S01 and S02 until the electrical performance of the initial pad C reaches the predetermined parameter.
  • step S03 specifically includes:
  • At least one of the thickness, shape and flatness of the initial pad C is trimmed by laser.
  • step S03 specifically includes:
  • Step S031 Apply packaging material to the exposed pads and circuits on the periphery of the initial pad C for packaging;
  • Step S032 Trim the outer packaging layer of the encapsulated pad to obtain a new pad with a predetermined exposed shape.

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Abstract

本公开提供一种焊盘修复设备及焊盘修复方法，该设备包括：用于对待修复焊盘及其相邻焊盘执行预处理操作的焊盘预处理机构，其包括：解焊组件、绝缘层去除组件、以及清洁组件；用于执行形成初始焊盘操作的焊盘涂覆机构，焊盘涂覆机构包括涂覆组件、以及固化组件；及用于对初始焊盘外围裸露的焊盘和电路执行封装操作，以形成具有预定暴露图案的新焊盘的焊盘封装机构。本公开实施例提供了一种焊盘修复设备及焊盘修复方法，能够对固晶前后焊盘不良进行有效修复，以解决焊盘不良导致的产品良率低、成本高的问题。

Description

一种焊盘修复设备及焊盘修复方法
相关申请的交叉引用
本申请主张在2022年7月26日在中国提交的中国专利申请号No.202210885460.1的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种焊盘修复设备及焊盘修复方法。
背景技术
SMT是表面组装技术(表面贴装技术，Surface Mounted Technology的缩写)，是电子组装行业里较为流行的一种技术和工艺，是一种将具有引脚的电子元件放置在具有电路以及焊盘的衬底基板的表面上，通过回流焊或浸焊等方法加以焊接组装的技术。
发明内容
本公开实施例提供了一种焊盘修复设备及焊盘修复方法，能够对固晶前后焊盘不良进行有效修复，以解决焊盘不良导致的产品良率低、成本高的问题。
本公开实施例所提供的技术方案如下：
第一方面，本公开实施例提供了一种焊盘修复设备，用于对线路板上待修复焊盘进行修复；所述焊盘修复设备包括：
焊盘预处理机构，用于对待修复焊盘及其相邻焊盘执行预处理操作，以得到待修复区；
焊盘涂覆机构，用于形成初始焊盘，所述焊盘涂覆机构包括涂覆组件和固化组件，其中，所述涂覆组件用于在所述待修复区涂覆导电材料，所述固化组件用于将涂覆后的导电材料进行固化以形成所述初始焊盘；以及
焊盘封装机构，用于至少对所述初始焊盘所在区域进行封装，以形成具 有预定暴露图案的新焊盘；
其中，所述焊盘预处理机构包括：
解焊组件，用于对初始区的焊盘执行解焊处理，所述初始区包括待修复焊盘及与所述待修复焊盘相邻焊盘；
绝缘层去除组件，用于去除所述初始区外围邻近走线位置的部分绝缘层，以暴露部分走线，形成待修复区；以及，
清洁组件，用于对所述待修复区进行清洁。
示例性的，用于放置所述线路板的工作台；
所述工作台包括不同作业位置，所述焊盘预处理机构、所述焊盘涂覆机构和所述焊盘封装机构依次位于所述不同作业位置处；或者
所述工作台具有至少一个作业位置，所述焊盘预处理机构、所述焊盘涂覆机构和所述焊盘封装机构能够分别移动至所述作业位置处，以执行相应操作。
示例性的，所述焊盘涂覆机构还包括：用于对所述初始焊盘进行修整，以使所述初始焊盘达到预定标准的焊盘修整组件，所述预定标准包括：所述初始焊盘为预定厚度、预定形状及预定平整度。
示例性的，所述焊盘修整组件包括用于通过激光对所述初始焊盘的厚度、形状及平整度中至少一种进行修整的激光修复组件。
示例性的，所述焊盘封装机构包括：
封装组件，用于对所述初始焊盘外围裸露的焊盘和走线上涂覆封装材料，以进行封装；及
修整组件，用于对封装后的焊盘外围封装层进行修整，以得到具有预定暴露形状的新焊盘。
示例性的，所述封装组件包括用于在所述初始焊盘外围涂覆绝缘树脂材料的涂覆针管；和/或所述修整组件包括用于通过激光切割所述封装材料的激光修整器。
示例性的，所述解焊组件包括用于通过发射激光以进行熔焊的熔焊激光器、和/或用于通过红外线进行熔焊的红外线熔焊器；
所述绝缘层去除组件包括用于通过发射激光以去除绝缘层的除绝缘层激光器、和/或用于机械切割去除所述绝缘层的刮刀；
所述清洁组件包括用于通过发射激光以清理异物的清洁激光器、和/或用于向所述待修复区吹风以清理异物的表面清理单元。
所述熔焊激光器、所述除绝缘层激光器和所述清洁激光器分别发射不同波长的激光。
示例性的，所述表面清理单元包括：
位于所述待修复区的一侧且用于向所述待修复区表面吹风的至少一个吹风管；和/或
位于所述待修复区的另一侧且用于从所述待修复区表面吸风的至少一个吸风管；
所述表面清理单元包括所述吹风管和所述吸风管时，至少一个所述吹风管的吹风口和至少一个所述吸风管的吸风口相对。
示例性的，所述吹风口呈缩口状，其内径从远离风口一侧向靠近风口一侧逐渐收缩；和/或所述吸风口呈扩口状，其内径从远离风口一侧向靠近风口一侧逐渐扩大。
示例性的，所述吹风管上设有用于遮挡所述吹风口以防止异物飞溅的遮挡件。
示例性的，所述遮挡件包括沿所述吹风管外周面环绕设置的半包围罩，其罩设于所述吹风口的上方。
示例性的，所述解焊组件的数量至少有两个，且在进行熔焊时，至少两个所述解焊组件分别位于所述待修复焊盘及其相邻焊盘的相对两侧、或者至少一个所述解焊组件绕所述待修复焊盘及其相邻焊盘的外围可移动。
示例性的，所述焊盘涂覆机构还包括：用于对所述初始焊盘的电学性能进行测试的电测组件。
示例性的，所述电测组件包括用于与所述初始焊盘接触导电的电测探针。
示例性的，所述固化组件包括激光固化器。
第二方面，本公开实施例提供了一种焊盘修复方法，采用如上所述的焊 盘修复设备对线路板上待修复焊盘进行修复，所述方法包括依次执行的以下步骤：
对待修复焊盘及其相邻焊盘进行预处理的步骤，具体包括：对初始区的焊盘执行解焊处理，所述初始区包括待修复焊盘及与所述待修复焊盘相邻焊盘；去除所述初始区外围邻近走线位置的部分绝缘层，以暴露部分走线而形成待修复区；对所述待修复区进行清洁；
在所述待修复区形成初始焊盘的步骤，具体包括：在所述待修复区涂覆导电材料；将涂覆后的导电材料进行固化，以形成所述初始焊盘；
至少对所述初始焊盘所在区域进行封装，以形成具有预定暴露图案的新焊盘的步骤。
示例性的，所述对所述待修复焊盘及其相邻焊盘进行解焊处理，具体包括：通过向所述待修复焊盘及其相邻焊盘发射激光和/或红外线以进行熔焊；
所述去除所述初始区外围邻近走线位置的部分绝缘层，以暴露部分走线，形成待修复区，具体包括：通过发射激光和/或机械切割去除所述绝缘层；
所述对所述待修复区进行清洁，具体包括：通过发射激光和/或向所述待修复区吹风，以清理异物；
所述在所述待修复区形成初始焊盘的步骤，还包括：在所述将涂覆后的导电材料进行固化，以形成所述初始焊盘之后，对所述初始焊盘进行修整，以使所述初始焊盘达到预定标准的焊盘修整组件，所述预定标准包括：所述初始焊盘为预定厚度、预定形状及预定平整度；
所述在所述待修复区形成初始焊盘的步骤，还包括：在所述将涂覆后的导电材料进行固化，以形成所述初始焊盘之后，对所述初始焊盘的电学性能进行测试，并判断所述初始焊盘的电学性能是否达到预定参数，若否，则对所述初始焊盘进行修整，直到所述初始焊盘的电学性能达到预定参数；
所述对所述初始焊盘进行修整，直到所述初始焊盘的电学性能达到预定参数，具体包括：
对所述初始焊盘的尺寸、形状或平整度中至少一者进行调整，并对调整后的所述初始焊盘的电学性能进行测试，并判断所述初始焊盘的电学性能是 否达到预定参数；若否，则重复所述对待修复焊盘及其相邻焊盘进行预处理的步骤，和所述在所述待修复区形成初始焊盘的步骤，直至所述初始焊盘的电学性能达到预定参数；
所述至少对所述初始焊盘所在区域进行封装，以形成具有预定暴露图案的新焊盘的步骤，具体包括：
至少对所述初始焊盘所在区域涂覆封装材料，以进行封装；
对封装后的焊盘外围封装层进行修整，以得到具有预定暴露形状的新焊盘。
本公开实施例所带来的有益效果如下：
上述方案中，所述焊盘修复设备主要包括焊盘预处理机构、焊盘涂覆机构和焊盘封装机构。在对焊盘进行修复时，首先，可通过所述焊盘预处理机构中的解焊组件对初始区的焊盘进行解焊处理，该初始区可包括待修复焊盘及其相邻焊盘；然后，可通过所述绝缘层去除组件将所述初始区外围邻近走线位置的部分绝缘层去除掉，以暴露部分走线，这样，可使后续涂覆焊盘后与原有走线的接触面积增大，以避免电阻过大问题，所述初始区去除绝缘层之后即形成待修复区；然后，可通过所述清洁组件对所述待修复区进行清洁，以对所述待修复区处的残留物、杂质、异物进行清理和平整，为新焊盘的涂覆做好预处理工作；然后，通过所述焊盘涂覆机构中的所述涂覆组件在所述待修复区重新涂覆导电材料，再通过所述固化组件对涂覆的导电材料进行固化以得到导电的初始焊盘；然后，对所述初始焊盘的外围裸露的焊盘和走线进行封装，得到具有预定暴露图案的新焊盘。
通过以上方案，可对存在焊盘不良的线路板进行有效地焊盘修复，提升线路板良率，减少产品报废造成的损失。
附图说明
图1表示具有电子元件及焊盘的线路板的截面示意图；
图2表示具有电子元件及焊盘的线路板的俯视图；
图3表示本公开实施例提供的焊盘修复设备中焊盘预处理机构的结构示 意图；
图4表示待修复焊盘及其相邻的焊盘解焊后形成初始区的结构示意图；
图5表示本公开实施例提供的焊盘修复设备中绝缘层去除组件去除掉部分绝缘层之后形成的待修复区的示意图；
图6表示本公开实施例提供的焊盘修复设备中焊盘涂覆机构的结构示意图；
图7表示本公开实施例提供的焊盘修复设备中在线路板上重新涂覆导电材料而形成初始焊盘的示意图；
图8表示本公开实施例提供的焊盘修复设备中焊盘封装机构对初始焊盘周围暴露焊盘及电路进行封装的结构示意图；
图9表示本公开实施例提供的焊盘修复方法的流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
在对本公开实施例提供的焊盘修复设备及焊盘修复方法进行详细说明之前，有必要对于相关技术进行以下说明：
在SMT工艺中，为了完成电子元件与焊盘的固定连接，需要在衬底基板上待与电子元件电气连接的焊盘上设置焊料，或者将电子元件的引脚上设置焊料，接着将电子元件与焊盘对位并接触设置，例如在230℃～260℃的高温下，使焊料熔融并获得良好的湿润，再迅速冷却降温，实现电子元件与焊盘的固定连接。焊盘的材料一般为铜，但是铜较易氧化，因此需要对焊盘的表面进行防氧化的处理。对焊盘的表面处理方式包括化镍金等或涂银浆等。这样，电子元件利用焊料(焊料为包括锡的金属)通过回流焊工艺直接焊接在经过防氧化处理的焊盘表面。
在回流焊过程中，焊料与铜合金层和焊盘会形成金属间化合物(Intermetallic Compound，简称IMC)，金属间化合物的厚度和组成与焊接工艺的时间、温度和应用条件等呈函数关系，并且会使材料结合处的内应力变化，通常是随着金属间化合物的厚度增加，内应力逐渐增大，使电子元件与焊盘的接触的部位(焊接点)产生脆裂、甚至断裂的现象，进而影响二者的连接强度和可靠性。
若在制程中，焊盘表面出现损伤、存在异物等情况，或者在回流焊过程中电子元件出现虚焊或焊接位置偏移的情况下，都需要通过解焊去除电子元件，并重新将电子元件牢固焊接在正确的位置。但是在去除电子元件的过程中，不可避免地会将电子元件与焊盘之间的焊料去掉，而焊料又与焊盘形成了金属间化合物，从而可能会损坏焊盘，导致该焊盘无法再次实现与电子元件的可靠连接，从而严重影响产品良率，造成产品报废。
针对相关技术中线路板制造过程中焊盘相关不良导致产品报废，对生产造成较大损失的问题，本公开实施例中提供的一种焊盘修复设备及焊盘修复方法，能够对线路板上待修复焊盘进行修复，以解决焊盘不良导致的产品良率低、成本高的问题。
如图3至图8所示，本公开实施例提供的焊盘修复设备包括：焊盘预处理机构10、焊盘涂覆机构20和焊盘封装机构30。
所述焊盘预处理机构10用于对待修复焊盘1a及其相邻焊盘1b执行预处理操作，以得到待修复区B。
具体的，所述焊盘预处理机构10包括：解焊组件11、绝缘层去除组件12和清洁组件13。所述解焊组件11用于对初始区A的焊盘执行解焊处理，所述初始区A包括待修复焊盘1a及与所述待修复焊盘1a相邻的焊盘1b(如图4所示)。
上述方案中，所述解焊组件11的设置目的为对待修复焊盘1a及其相邻的焊盘1b所在的初始区A进行解焊。针对一些线路板，尤其是具有微型电子元件的线路板，随着产品分辨率的增高，电子元件的电极及焊盘精密度越来越高，尺寸越来越小，相邻电子元件之间的距离也越来越小。本公开的发明人经研究发现，当某一个电子元件的焊盘出现问题，由于焊盘尺寸的限制，若仅针对该焊盘进行修复时，会影响厚度新焊盘的涂覆和修整，因此，可将其相邻电子元件的焊盘也进行修复，以免影响后续新焊盘的涂覆和修整。
电子元件可以为发光二极管，每个发光二极管具有两个引脚，与两个焊盘1一一对应。在一些实施例中，可以包括不同颜色的发光二极管，例如红色发光二极管R，绿色发光二极管G，蓝色发光二极管B。这里需要说明的是，上述待修复焊盘1a及其相邻的焊盘1b，具体是指：如图1和图2所示，与该焊盘1距离小于一定数值范围内的其他焊盘，即为与该待修复焊盘1a所相邻的焊盘1b。其中，在实际应用中，所述数值范围可以是根据解焊组件、涂覆组件等设备精度及线路板自身产品精度等来确定。
例如，在一些实施例中，以电子元件为发光二极管为例，一个像素单元包括红色发光二极管R，绿色发光二极管G，蓝色发光二极管B，每个发光二极管可对应连接至若干焊盘上，可将一个像素单元内所有焊盘视为一个焊盘组，当焊盘组中任一焊盘出现不良时，则可对该焊盘组内所有焊盘进行解焊修复。
当然可以理解的是，若线路板上电子元件之间的间距较大时，相应的，电子元件所对应的焊盘之间间距较大，则当某一焊盘出现不良时，则可仅将与该焊盘之间距离小于一定数值范围的相邻焊盘进行解焊修复，而与该焊盘 相邻但距离大于该数值范围的其他焊盘则可不进行解焊修复。
所述绝缘层去除组件12用于去除所述初始区A外围邻近走线4位置的部分绝缘层，以暴露靠近所述初始区A的一部分走线4，所述初始区A去除部分绝缘层之后即形成待修复区B(如图5所示)。
上述方案中，设置所述绝缘层去除组件12的原因为：
如图1和图2所示，线路板上电子元件2的焊盘1个数与电子元件2的引脚数目相对应。以电子元件2为发光二极管为例，发光二极管有两个引脚，其对应的焊盘1数量则为两个，一个引脚对应地连接至一个焊盘1上。线路板通常包括衬底基板3、位于衬底基板3上的走线4以及位于走线4上方的绝缘层5，绝缘层5上设开口5a，各走线4被开口5a暴露出来的部分即为焊盘1。当待修复焊盘1a及其相邻焊盘1b在解焊后，需在所述初始区A重新形成新焊盘，为了进一步地保证用于与原焊盘连接的走线和该新焊盘之间的绑定可靠性，降低走线与新焊盘之间的接触电阻，保证电子元件2的功能，上述方案中，通过所述绝缘层去除组件12将初始区A的外围邻近走线4的一侧部分绝缘层5去除掉，可使后续涂覆的新焊盘面积足够大，与外围走线4的接触面积可增大，以避免电阻过大的问题。其中，所述初始区A去除绝缘层之后即形成待修复区B(如图5所示)。
所述清洁组件13用于对所述待修复区B进行清洁，用于该待修复区B内的残留物、杂质、异物，以保证待修复区B的平整，为新焊盘的涂覆做好预处理工作。
所述焊盘涂覆机构20用于形成初始焊盘C，所述焊盘涂覆机构20包括涂覆组件21和固化组件22。所述涂覆组件21用于在所述待修复区B涂覆导电材料，其中所述导电材料可以包括银浆、铜浆等。所述固化组件22用于将涂覆后的导电材料进行固化，以形成所述初始焊盘C。所述固化组件22可以包括激光固化器等任意合适的装置。
所述焊盘封装机构30用于至少对所述初始焊盘C所在区域进行封装，以形成具有预定暴露图案的新焊盘。上述方案中，设置所述焊盘封装机构30的目的是，可通过对所述初始焊盘C的周围裸露部分和电路进行封装，防止氧 化和腐蚀。需要说明的是，所述预定暴露图案是指，最终要形成的新焊盘暴露于绝缘层之外的区域的图案。所述初始焊盘C的面积会大于最终要形成的新焊盘面积，其形状也与最终要形成的新焊盘的形状不同，也就是说，所述初始焊盘C的当前暴露图案不同于预定暴露图案，因此，需要说所述初始焊盘C进行封装，以使其最终暴露图案满足预定暴露图案。其中，至少对所述初始焊盘C所在区域进行封装，所指的是，对所述初始焊盘C的外围超出其预定暴露图案的区域以及走线暴露出来的区域进行封装。
由此可见，本公开实施例提供的焊盘修复设备可对焊盘不良的线路板进行有效地焊盘修复，提升线路板良率，减少产品报废造成的损失。
所述焊盘修复设备在作业时，依次执行所述焊盘预处理机构10、所述焊盘涂覆机构20、以及所述焊盘封装机构30的相应操作。
一些实施例中，该焊盘修复设备可包括一用于放置所述线路板的工作台；所述工作台可包括不同作业位置，所述线路板可在所述工作台上传输至不同作业位置。所述焊盘预处理机构10、所述焊盘涂覆机构20和所述焊盘封装机构30沿所述工作台的传输路径依次设置在所述不同作业位置处。这样，可实现依次执行焊盘预处理、焊盘涂覆和焊盘封装的操作。
在另一些实施例中，所述工作台具有至少一个作业位置，所述焊盘预处理机构10、所述焊盘涂覆机构20和所述焊盘封装机构30能够分别移动至所述作业位置处，以执行相应操作。
应当理解的是，所述焊盘修复设备的各机构的具体位置等不限于以上示例。
此外，作为一种示例性的实施例，所述解焊组件11可选用熔焊激光器、红外线熔焊器中的一种或两种，所述熔焊激光器通过发射激光进行熔焊，所述红外线熔焊器通过红外线进行熔焊。所述熔焊激光器和所述红外线熔焊器可选用市场上已有的熔焊产品，对其具体工作原理在此不再进行详述。
所述解焊组件11选用熔焊激光器时，其通过控制发射激光的波长，实现解焊目的，精度高，操作方便。当然可以理解的是，所述解焊组件11也可以不限于熔焊激光器、红外线熔焊器。
此外，作为一种示例性的实施例，所述绝缘层去除组件12包括除绝缘层激光器、或者刮刀中的一种或两种。所述除绝缘层激光器可通过发射激光去除绝缘层，所述刮刀通过机械切割去除所述绝缘层。所述除绝缘层激光器和所述刮刀可选用市场上已有产品，对其具体工作原理在此不再进行详述。
其中所述除绝缘层激光器通过控制发射激光的波长，实现去除绝缘层目的。采用这种激光切割方式去除绝缘层，相较于其他去除绝缘层的方式，切割精度更高，操作更方便。当然可以理解的是，所述绝缘层去除组件12也可以不限于激光器或刮刀。在实际应用中，可根据实际需求，合理选择合适的装置实现切割绝缘层目的。
此外，作为一种示例性的实施例，所述清洁组件13包括清洁激光器131和表面清理单元中的至少一种。所述清洁激光器131用于通过发射激光清理异物。所述表面清洁单元用于向所述待修复区B吹风清理异物。其中所述清洁激光器131通过控制发射激光的波长，实现清洁异物目的，精度高，操作方便。
作为一种优选的实施例，如图3所示，所述清洁组件13可既包括清洁激光器131，又包括表面清理单元。这样，所述表面清理单元可将电子元件2、熔化的锡及异物、杂质吹走，防止对焊盘的涂覆过程产生影响。
需要说明的是，所述熔焊激光器、所述除绝缘层激光器和所述清洁激光器131可通过分别发射不同波长的激光，实现不同的功能。
作为一种示例性的实施例，如图3所示，所述表面清理单元包括：位于所述待修复区B的一侧且用于向所述待修复区B表面吹风的至少一个吹风管1321；以及位于所述待修复区B的另一侧且用于从所述待修复区B表面吸风的至少一个吸风管1322；至少一个所述吹风管1321的吹风口a和至少一个所述吸风管1322的吸风口b相对。
采用上述方案，所述表面清理单元采用吹风管1321和吸风管1322，相对地设置在待修复区B表面的相对两侧，可在焊锡溶解后由吹风管1321将电子元件2和焊锡吹向吸风管1322，以被吸风管1322吸走，同时，还可将去除绝缘层和清洁焊盘产生的杂质和异物吹掉，防止对焊盘的涂覆过程产生影 响。
需要说明的是，在一些实施例中，也可以仅设置所述吹风管1321，或者仅设置所述吸风管1322。
此外，作为一些示例性的实施例，如图3所示，所述吹风口a可设计为呈缩口状，其内径从远离风口一侧向靠近风口一侧逐渐收缩。这样的设置，所述吹风管1321呈缩口状，保证足够的吹力。
作为一些示例性的实施例，如图3所示，所述吸风口b可设计为呈扩口状，其内径从远离风口一侧向靠近风口一侧逐渐扩大。这样的设置，所述吸风口b呈扩口状(即喇叭状)，更方便吸取异物和杂质等。
此外，如图3所示，作为一些示例性的实施例，所述吹风管1321上设有用于遮挡所述吹风口a以防止异物飞溅的遮挡件1323。通过设置所述遮挡件1323，可防止待修复区B的异物飞溅。
示例性的，所述遮挡件包括沿所述吹风管1321外周面环绕设置的半包围罩，其罩设于所述吹风口a的上方。这样的设置，所述吹风管1321在其吹风口a处可呈帽檐状，便于对异物进行有效遮挡。应当理解的是，在实际应用中，所述吹风管1321的具体结构不限于此。
此外，作为一些示例性的实施例中，如图3所示，所述解焊组件11的数量至少有两个，且在进行熔焊时，至少两个所述解焊组件11分别位于所述待修复焊盘1a及其相邻焊盘1b的相对两侧、或者至少一个所述解焊组件11绕所述待修复焊盘1a及其相邻焊盘1b的外围可移动。这样的设置，便于从待修复焊盘1a及其相邻焊盘1b的相对两侧或外周发射激光或红外线进行熔焊，以实现更佳的解焊效果。
当然可以理解的是，所述解焊组件11的具体数量不限定，也可以仅设置一个，还可以不移动。
此外，在一些示例性的实施例中，如图6所示，所述焊盘涂覆机构20还包括焊盘修整组件24，该焊盘修整组件24用于对所述初始焊盘C进行修整，以使所述初始焊盘C(如图7所示)达到预定标准，所述预定标准包括：所述初始焊盘C为预定厚度、预定形状及预定平整度。
采用上述方案，当在所述待修复区B重新涂覆导电材料，得到初始焊盘C之后，所述初始焊盘C的形貌可能不符合精度和后续对位的需求，因此本实施例中，所述焊盘修复设备还可以包括焊盘修整组件24，用于对初始焊盘C的厚度、形状及平整度等进行修整，以达到预定标准。
其中所述焊盘修整组件24可以选用焊盘修整激光器，用于通过激光对所述初始焊盘C的厚度、形状及平整度中至少一种进行修整。
当然可以理解的是，所述焊盘修整组件24也可以选用其他方式实现。此外，作为一些示例性的实施例，如图6所示，所述焊盘涂覆机构20还可以包括：用于对所述初始焊盘C的电学性能进行测试的电测组件23。
采用上述方案，通过设置所述电测组件23，对修整后的初始焊盘C的导通性和电阻等电学性能进行测试，能够测试该初始焊盘C的电学性能是否合格，防止将不合格(NG)的产品流到下一工序。例如，所述电测组件23可以包括用于与所述初始焊盘C接触导电的电测探针。
具体地，对所述初始焊盘C的电学性能进行测试时，可判断所述初始焊盘C的电学性能是否达到预定参数；当判断所述初始焊盘C的电学性能未达到预定参数时，则对所述初始焊盘C进行修整，直到所述初始焊盘C的电学性能达到预定参数。
作为一种示例性的实施例，当判断所述初始焊盘C的电学性能未达到预定参数时，则对所述初始焊盘C进行修整是指，对所述初始焊盘C的尺寸、形状或平整度中的至少一者进行调整，并对调整后的所述初始焊盘C的电学性能进行测试，并判断所述初始焊盘C的电学性能是否达到预定参数；若仍未达到所述预定参数，则可将所述初始焊盘C重新进行解焊、涂覆和固化，再次进行电学测试，直至所述初始焊盘C的电学性能达到预定参数。
此外，所述焊盘涂覆机构20还可以包括用于对初始焊盘的表面进行防氧化处理的表面处理组件，例如，所述表面处理组件可进行化镍金或涂银浆处理。
如图8所示，作为一些示例性的实施例，所述焊盘封装机构30还可以包括：封装组件31和修整组件32，所述封装组件31用于对所述初始焊盘C外 围裸露的焊盘和电路上涂覆封装材料，以进行封装；所述修整组件32用于对封装后的焊盘外围封装层进行修整，以得到具有预定暴露形状的新焊盘(如图2所示)。
采用上述方案，对初始焊盘C封装后，若封装材料的涂覆范围超出精度规格，还可以通过设置的修整组件32，对超出规格的封装部分进行例如切割等修整，防止其对后续工序产生影响。
其中，所述封装组件31可以选用可在所述初始焊盘C外围涂覆绝缘树脂材料的涂覆针管、可通过3D打印方式在所述初始焊盘C外围打印绝缘树脂材料的3D打印机两者中的至少一种，封装精度高，且操作方便。所述修整组件32可以选用可通过激光切割所述封装材料的激光修整器，切割精度高，且操作方便，此时，所述封装组件31还可以包括一绝缘树脂固化组件33，所述绝缘树脂固化组件33可以选用固化激光器。当然可以理解的是，所述封装组件31和所述修整组件32的具体实现方式不限于此。
此外，本公开实施例还提供了一种焊盘修复方法，用于采用本公开实施例中的焊盘修复设备对线路板上待修复焊盘1a进行修复，如图9所示，所述方法包括依次执行的以下步骤：
步骤S01、对待修复焊盘1a及其相邻焊盘1b进行预处理的步骤，具体包括：
步骤S011、对初始区A的焊盘进行解焊处理，所述初始区包括待修复焊盘1a及其相邻焊盘1b(如图4所示)；
步骤S012、去除所述初始区A外围邻近电路位置的部分绝缘层，以暴露部分电路，而形成待修复区B(如图5所示)；
步骤S013、对所述待修复区B进行清洁；
步骤S02、在所述待修复区B形成初始焊盘C的步骤，具体包括：
步骤S021、在所述待修复区B涂覆导电材料；
步骤S022、将涂覆后的导电材料进行固化，以形成所述初始焊盘C(如图7所示)；
步骤S03、至少对所述初始焊盘C所在区域进行封装，以形成具有预定 暴露图案的新焊盘的步骤。
作为一种示例性的实施例，上述各步骤中，根据以上步骤顺序，将所述线路板依次输送至所述工作台的不同作业位置处；或者，将所述线路板置于作业位置处，根据以上步骤顺序，分别移动所述焊盘预处理机构10、所述焊盘涂覆机构20和所述焊盘封装机构30至所述作业位置处，以执行相应操作。
作为一种示例性的实施例，上述步骤S011具体包括：通过向所述待修复焊盘1a及其相邻焊盘1b发射激光和/或红外线以进行熔焊；
上述步骤S012具体包括：通过发射激光和/或机械切割去除所述绝缘层；
上述步骤S013具体包括：通过发射激光和/或向所述待修复区B吹风，以清理异物。
作为一种示例性的实施例，上述步骤S02中，在步骤S022之后，还包括：
步骤S023、对所述初始焊盘C进行修整，以使所述初始焊盘C达到预定标准的焊盘修整组件3222，所述预定标准包括：所述初始焊盘C为预定厚度、预定形状及预定平整度。
作为一种示例性的实施例，步骤S02中，在步骤S022之后，还包括：
步骤S023、对所述初始焊盘C的电学性能进行测试，并判断所述初始焊盘C的电学性能是否达到预定参数；
步骤S024、若否，则对所述初始焊盘C进行修整，直到所述初始焊盘C的电学性能达到预定参数。
作为一种示例性的实施例，上述步骤S024具体包括：
步骤S0241、对所述初始焊盘C的尺寸、形状或平整度中至少一者进行调整，并对调整后的所述初始焊盘C的电学性能进行测试，并判断所述初始焊盘C的电学性能是否达到预定参数；
步骤S0242、若否，则重复步骤S01和步骤S02，直至所述初始焊盘C的电学性能达到预定参数。
作为一种示例性的实施例，上述步骤S03具体包括：
通过激光对所述初始焊盘C的厚度、形状及平整度中至少一种进行修整。
作为一种示例性的实施例，上述步骤S03具体包括：
步骤S031、对所述初始焊盘C外围裸露的焊盘和电路上涂覆封装材料，以进行封装；
步骤S032、对封装后的焊盘外围封装层进行修整，以得到具有预定暴露形状的新焊盘。
有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”或者可以存在中间元件。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (17)

  1. 一种焊盘修复设备，用于对线路板上待修复焊盘进行修复；其特征在于，所述焊盘修复设备包括：
    焊盘预处理机构，用于对待修复焊盘及其相邻焊盘执行预处理操作，以得到待修复区；
    焊盘涂覆机构，用于形成初始焊盘，所述焊盘涂覆机构包括涂覆组件和固化组件，其中，所述涂覆组件用于在所述待修复区涂覆导电材料，所述固化组件用于将涂覆后的导电材料进行固化以形成所述初始焊盘；以及
    焊盘封装机构，用于至少对所述初始焊盘所在区域进行封装，以形成具有预定暴露图案的新焊盘；
    其中，所述焊盘预处理机构包括：
    解焊组件，用于对初始区的焊盘执行解焊处理，所述初始区包括待修复焊盘及与所述待修复焊盘相邻的焊盘；
    绝缘层去除组件，用于去除所述初始区外围邻近走线位置的部分绝缘层，以暴露部分走线，形成待修复区；以及，
    清洁组件，用于对所述待修复区进行清洁。
  2. 根据权利要求1所述的焊盘修复设备，其特征在于，
    用于放置所述线路板的工作台；
    所述工作台包括不同作业位置，所述焊盘预处理机构、所述焊盘涂覆机构和所述焊盘封装机构依次位于所述不同作业位置处；或者
    所述工作台具有至少一个作业位置，所述焊盘预处理机构、所述焊盘涂覆机构和所述焊盘封装机构能够分别移动至所述作业位置处，以执行相应操作。
  3. 根据权利要求1所述的焊盘修复设备，其特征在于，
    所述焊盘涂覆机构还包括：用于对所述初始焊盘进行修整，以使所述初始焊盘达到预定标准的焊盘修整组件，所述预定标准包括：所述初始焊盘为预定厚度、预定形状及预定平整度。
  4. 根据权利要求3所述的焊盘修复设备，其特征在于，
    所述焊盘修整组件包括用于通过激光对所述初始焊盘的厚度、形状及平整度中至少一种进行修整的激光修复组件。
  5. 根据权利要求1所述的焊盘修复设备，其特征在于，
    所述焊盘封装机构包括：
    封装组件，用于至少对所述初始焊盘所在区域涂覆封装材料，以进行封装；及
    修整组件，用于对封装后的焊盘外围封装层进行修整，以得到具有预定暴露形状的新焊盘。
  6. 根据权利要求5所述的焊盘修复设备，其特征在于，
    所述封装组件包括用于在所述初始焊盘外围涂覆绝缘树脂材料的涂覆针管、和/或用于通过3D打印方式在所述初始焊盘外围打印绝缘树脂材料的3D打印机；和/或
    所述修整组件包括用于通过激光切割所述封装材料的激光修整器。
  7. 根据权利要求1所述的焊盘修复设备，其特征在于，
    所述解焊组件包括用于通过发射激光以进行熔焊的熔焊激光器、和/或用于通过红外线进行熔焊的红外线熔焊器；
    所述绝缘层去除组件包括用于通过发射激光以去除绝缘层的除绝缘层激光器、和/或用于机械切割去除所述绝缘层的刮刀；
    所述清洁组件包括用于通过发射激光以清理异物的清洁激光器、和/或用于向所述待修复区吹风以清理异物的表面清理单元。
    所述熔焊激光器、所述除绝缘层激光器和所述清洁激光器分别发射不同波长的激光。
  8. 根据权利要求7所述的焊盘修复设备，其特征在于，
    所述表面清理单元包括：
    位于所述待修复区的一侧且用于向所述待修复区表面吹风的至少一个吹风管；和/或
    位于所述待修复区的另一侧且用于从所述待修复区表面吸风的至少一个 吸风管；
    所述表面清理单元包括所述吹风管和所述吸风管时，至少一个所述吹风管的吹风口和至少一个所述吸风管的吸风口相对。
  9. 根据权利要求8所述的焊盘修复设备，其特征在于，
    所述吹风口呈缩口状，其内径从远离风口一侧向靠近风口一侧逐渐收缩；和/或所述吸风口呈扩口状，其内径从远离风口一侧向靠近风口一侧逐渐扩大。
  10. 根据权利要求8所述的焊盘修复设备，其特征在于，
    所述吹风管上设有用于遮挡所述吹风口以防止异物飞溅的遮挡件。
  11. 根据权利要求10所述的焊盘修复设备，其特征在于，
    所述遮挡件包括沿所述吹风管外周面环绕设置的半包围罩，其罩设于所述吹风口的上方。
  12. 根据权利要求7所述的焊盘修复设备，其特征在于，
    所述解焊组件的数量至少有两个，且在进行熔焊时，至少两个所述解焊组件分别位于所述待修复焊盘及其相邻焊盘的相对两侧、或者至少一个所述解焊组件绕所述待修复焊盘及其相邻焊盘的外围可移动。
  13. 根据权利要求1所述的焊盘修复设备，其特征在于，
    所述焊盘涂覆机构还包括：用于对所述初始焊盘的电学性能进行测试的电测组件。
  14. 根据权利要求13所述的焊盘修复设备，其特征在于，所述电测组件包括用于与所述初始焊盘接触导电的电测探针。
  15. 根据权利要求1所述的焊盘修复设备，其特征在于，
    所述固化组件包括激光固化器。
  16. 一种焊盘修复方法，其特征在于，采用如权利要求1至15任一项所述的焊盘修复设备对线路板上待修复焊盘进行修复，所述方法包括依次执行的以下步骤：
    对待修复焊盘及其相邻焊盘进行预处理的步骤，具体包括：对初始区的焊盘执行解焊处理，所述初始区包括待修复焊盘及与所述待修复焊盘相邻焊盘；去除所述初始区外围邻近走线位置的部分绝缘层，以暴露部分走线，形 成待修复区；对所述待修复区进行清洁；
    在所述待修复区形成初始焊盘的步骤，具体包括：在所述待修复区涂覆导电材料；将涂覆后的导电材料进行固化，以形成所述初始焊盘；
    至少对所述初始焊盘所在区域进行封装，以形成具有预定暴露图案的新焊盘的步骤。
  17. 根据权利要求16所述的方法，其特征在于，
    所述对初始区的焊盘执行解焊处理，具体包括：通过向所述待修复焊盘及其相邻焊盘发射激光和/或红外线以进行熔焊；
    所述去除所述初始区外围邻近走线位置的部分绝缘层，以暴露部分走线，形成待修复区，具体包括：通过发射激光和/或机械切割去除所述绝缘层；
    所述对所述待修复区进行清洁，具体包括：通过发射激光和/或向所述待修复区吹风，以清理异物；
    所述在所述待修复区形成初始焊盘的步骤，还包括：在所述将涂覆后的导电材料进行固化，以形成所述初始焊盘之后，对所述初始焊盘进行修整，以使所述初始焊盘达到预定标准的焊盘修整组件，所述预定标准包括：所述初始焊盘为预定厚度、预定形状及预定平整度；
    所述在所述待修复区形成初始焊盘的步骤，还包括：在所述将涂覆后的导电材料进行固化，以形成所述初始焊盘之后，对所述初始焊盘的电学性能进行测试，并判断所述初始焊盘的电学性能是否达到预定参数，若否，则对所述初始焊盘进行修整，直到所述初始焊盘的电学性能达到预定参数；
    所述对所述初始焊盘进行修整，直到所述初始焊盘的电学性能达到预定参数，具体包括：对所述初始焊盘的尺寸、形状或平整度中至少一者进行调整，并对调整后的所述初始焊盘的电学性能进行测试，并判断所述初始焊盘的电学性能是否达到预定参数；若否，则重复所述对待修复焊盘及其相邻焊盘进行预处理的步骤，和所述在所述待修复区形成初始焊盘的步骤，直至所述初始焊盘的电学性能达到预定参数；
    所述至少对所述初始焊盘所在区域进行封装，以形成具有预定暴露图案的新焊盘的步骤，具体包括：
    至少对所述初始焊盘所在区域涂覆封装材料，以进行封装；
    对封装后的焊盘外围封装层进行修整，以得到具有预定暴露形状的新焊盘。
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