WO2024022217A1

WO2024022217A1 - Camera module and manufacturing method therefor

Info

Publication number: WO2024022217A1
Application number: PCT/CN2023/108372
Authority: WO
Inventors: 陆锡松; 俞杰; 赵炘沂; 管敏; 王洋荣
Original assignee: 宁波舜宇光电信息有限公司
Priority date: 2022-07-27
Filing date: 2023-07-20
Publication date: 2024-02-01

Abstract

Disclosed in the present application is a camera module. The camera module comprises: a wafer-level lens; a photosensitive assembly, wherein the wafer-level lens is arranged on a photosensitive path of the photosensitive assembly, and the photosensitive assembly comprises a photosensitive chip and a protective cover plate covering the photosensitive chip; and a packaging body, which is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover plate. In addition, further disclosed is a manufacturing method for a camera module. The camera module and the manufacturing method disclosed in the present application can reduce the size of the camera module and simplify a manufacturing process.

Description

A camera module and its manufacturing method

Technical field

The present application relates to the technical field of camera modules, and in particular to a camera module using a wafer-level lens and a manufacturing method thereof.

Background technique

With the development of camera technology, camera modules are increasingly used in a variety of electronic devices, such as mobile phones, tablets, AR/VR, etc. Among them, some electronic devices have higher volume requirements for camera modules. How to make the size of the camera module smaller so that the camera module can be used in electronic devices with smaller installation space has become particularly important. .

Therefore, this application provides a camera module using a wafer-level lens and a manufacturing method thereof, so as to reduce the size of the camera module and improve the manufacturing efficiency of the camera module.

Contents of the invention

An object of the present application is to provide a camera module that overcomes the shortcomings of the existing technology, reduces the size of the camera module, and simplifies the manufacturing process.

According to one aspect of this application, a camera module is provided, including:

Wafer-level lenses;

Photosensitive component, the wafer-level lens is disposed on the photosensitive path of the photosensitive component, the photosensitive component includes a photosensitive chip and a protective cover covered above the photosensitive chip;

An encapsulation body, the encapsulation body is integrally formed on the circumferential side of the wafer-level lens and the circumferential side of the protective cover.

In some embodiments, the lateral size of the protective cover is smaller than the lateral size of the photosensitive chip, and the package is integrally formed on at least a portion of the front surface of the photosensitive chip.

In some embodiments, the photosensitive component further includes a side connecting portion, the side connecting portion is integrally formed on the peripheral side of the photosensitive chip, and the lateral size of the side connecting portion is larger than the lateral size of the protective cover, The package body is integrally formed on at least a part of the front surface of the side connecting portion.

In some embodiments, the camera module further includes a filter element disposed between the wafer-level lens and the photosensitive component, and the package is integrally formed on the peripheral side of the filter element.

In some embodiments, the photosensitive chip further includes an electrical connection portion disposed on the back side of the photosensitive chip.

In some embodiments, the photosensitive component further includes a circuit board and electronic components. The circuit board is disposed on the back of the photosensitive chip. The circuit board includes a circuit board body and a bottom packaging part. The photosensitive chip is The electronic component is disposed on the front side of the circuit board body and is electrically connected to the circuit board body through the electrical connection part. The electronic component is disposed on the back side of the circuit board body. The bottom packaging part is integrated through a molding process. Molded on the back side of the circuit board body, the electronic component is molded inside the bottom package part.

According to another aspect of the present application, a method of manufacturing a camera module is provided, including:

Stack and fix a lens panel, a protective layer and a chip panel along the height direction to form a module panel;

Divide the lens panel and the protective layer in the module panel along the height direction to form a plurality of wafer-level lenses and a plurality of protective cover plates, two adjacent wafer-level lenses and phase An upper dividing groove is formed between two adjacent protective covers;

Filling the upper dividing groove with packaging material, and curing the packaging material to form a packaging conjoined part, the packaging conjoined part is integrally formed on the peripheral side of the wafer-level lens and the protective cover;

The module panel is divided along the height direction, and the package conjoined portion and the chip panel are divided to form multiple camera modules.

In some embodiments, after the step of curing the encapsulation material to form the encapsulation conjoined part, electrical connection parts are provided on the back surfaces of the plurality of photosensitive chips of the chip panel.

In some embodiments, the chip panel includes a plurality of photosensitive chips and a conjoined portion disposed between the plurality of photosensitive chips.

In some embodiments, the encapsulation material is a molding material or glue.

According to another aspect of the present application, a camera module is provided, including:

Wafer-level lenses;

Photosensitive chip, the wafer-level lens is arranged on the photosensitive path of the photosensitive chip;

A circuit board, the photosensitive chip is disposed on the circuit board;

A package body, which is integrally formed on the wafer-level lens, the photosensitive chip and the circuit board.

In some embodiments, the camera module further includes at least one lead, at least one lead is disposed between the photosensitive chip and the circuit board, and at least one lead is wrapped by the package.

In some embodiments, the package covers at least a portion of the front side of the circuit board, at least a portion of the peripheral side and the front side of the photosensitive chip, and the peripheral side of the wafer-level lens.

In some embodiments, the photosensitive chip includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the package body extends along a horizontal direction to the non-photosensitive area of the photosensitive chip, and the package body extends along a height The direction extends to the top of the wafer-level lens, and the package is integrally formed on the peripheral side of the photosensitive chip and the peripheral side of the wafer-level lens.

In some embodiments, the package has vertical outer sides, and the lateral dimensions of the upper portion of the package are equal to the lateral dimensions of the bottom of the package.

In some embodiments, the outer side of the package is inclined, the outer diameter of the package increases from top to bottom, and the lateral size of the bottom of the package is larger than the lateral size of the upper part of the package. .

Provide a circuit board panel;

A plurality of photosensitive chips are provided on the circuit board panel, and the plurality of photosensitive chips are electrically connected to the circuit board panel;

A plurality of wafer-level lenses are provided on a plurality of the photosensitive chips, and the plurality of wafer-level lenses are respectively located on the photosensitive paths of a plurality of the photosensitive chips;

Filling packaging material between two adjacent wafer-level lenses and two adjacent photosensitive chips, curing the packaging material to form a packaging conjoined part, the packaging conjoined part is integrally combined with the The wafer-level lens, the photosensitive chip and the circuit board are assembled to form a module assembly;

The module panels are divided along the height direction to form multiple camera modules.

In some embodiments, the packaging material is a molding material, and the packaging conjoined portion is integrally formed on the wafer-level lens, the photosensitive chip and the circuit board panel through a molding process.

In some embodiments, the package conjoined portion is cut to form a package body, and the circuit board panel is cut to form a plurality of circuit boards. The package body covers at least part of the front surface of the circuit board, the At least part of the peripheral side and the front side of the photosensitive chip, and the peripheral side of the wafer-level lens.

In some embodiments, after the step of forming the module panel, a light-shielding layer is provided on the object side of the module panel, and the light-shielding layer is provided on the top surface of the package conjoined portion, facing toward The wafer-level lens direction extends.

Wafer-level lenses;

An encapsulation body is integrally formed on the circumferential side of the wafer-level lens, the circumferential side of the protective cover, and the circumferential side of the photosensitive chip.

In some embodiments, the package includes an upper package and a lower package. The upper package is integrally formed on the peripheral side of the wafer-level lens and the protective cover. The lower package The body is integrally formed on the peripheral side of the photosensitive chip.

In some embodiments, the photosensitive component further includes a side connecting portion, the side connecting portion is integrally formed on the peripheral side of the photosensitive chip, and the lower package body is integrally formed on the peripheral side of the side connecting portion.

In some embodiments, the lateral size of the photosensitive chip is smaller than the lateral size of the protective cover.

In some embodiments, the camera module further includes a filter element disposed between the wafer-level lens and the photosensitive component, and the upper package is integrally formed on the peripheral side of the filter element. .

Fill the upper dividing groove with a first packaging material, and solidify the first packaging material to form an upper packaging conjoined part;

Divide the chip panel in the module panel along the height direction to form a plurality of independent photosensitive chips, and form a dividing groove between two adjacent photosensitive chips;

Fill the lower dividing groove with a second packaging material, and solidify the second packaging material to form a lower packaging conjoined part. The lower packaging conjoined part is integrally molded with the upper packaging conjoined part to form a package conjoined part. ;

In some embodiments, after the step of curing the first encapsulation material to form the upper encapsulation conjoined portion, electrical connection portions are provided on the back surfaces of the plurality of photosensitive chips of the chip panel.

In some embodiments, the first packaging material and the second packaging material are made of different materials.

Wafer-level lenses;

A light-transmitting cover plate, the light-transmitting cover plate is fixed on the top surface of the wafer-level lens;

Photosensitive component, the wafer-level lens is disposed on the photosensitive path of the photosensitive component;

A package body, which is integrally formed on a part of the bottom surface of the light-transmitting cover plate, the side surface of the wafer-level lens, and the side surface of the photosensitive component.

In some embodiments, the lateral size of the light-transmitting cover is larger than the lateral size of the wafer-level lens and the photosensitive component, and the top surface of the wafer-level lens is flat.

In some embodiments, the light-transmitting cover has an infrared cutoff function.

In some embodiments, the camera module further includes a light-shielding portion disposed between the wafer-level lens and the light-transmitting cover.

In some embodiments, the photosensitive component includes a photosensitive chip, a protective cover covering the photosensitive chip, and an electrical connection portion disposed on the back of the photosensitive chip.

Provide a cover layer, a plurality of wafer-level lenses and a plurality of photosensitive components, stack and fix a plurality of the wafer-level lenses and a plurality of the photosensitive components on the cover layer along the height direction to form a In a module panel, a plurality of the wafer-level lenses and a plurality of the photosensitive components are placed upside down on the cover layer at a distance from each other;

Filling packaging material between the plurality of wafer-level lenses and the plurality of photosensitive components, so that the packaging material covers the image side of the cover layer, the peripheral side of the wafer-level lens and the On the peripheral side of the photosensitive component, the packaging material is cured to form a packaging conjoined part;

The module panel is divided along the height direction, and the package conjoined part and the cover layer are divided to form multiple camera modules.

In some embodiments, the image side of the cover layer is flat, and the top surface of the wafer-level lens is flat.

In some embodiments, a light-shielding layer is provided on the cover layer by silk-screen printing, ink coating or glue coating, and a plurality of light holes are reserved on the light-shielding layer to provide light for the wafer-level lens to enter. aisle.

In some embodiments, the packaging material is a molding material, the module panel is placed in a molding mold, and the molding material is injected into the molding mold to make the molding material Flow between the plurality of wafer-level lenses and the plurality of photosensitive components, so that the molding material covers the image side of the cover layer, the peripheral side of the wafer-level lens and the The peripheral side of the photosensitive component.

In some embodiments, the encapsulating material is glue, and the glue is filled between the plurality of wafer-level lenses and the plurality of photosensitive components by spraying or dotting glue.

Compared with the existing technology, this application has at least one of the following technical effects:

1. The package is integrally formed on the peripheral side of the wafer-level lens and the protective cover, so that the package can encapsulate and protect the peripheral sides of the wafer-level lens and the protective cover.

2. By filling and encapsulating the conjoined parts to form module panels and then dividing them, the manufacturing process is simplified.

3. The package is integrally formed on the peripheral side of the wafer-level lens, at least part of the peripheral side and front side of the photosensitive chip, and at least part of the front side of the circuit board, so that the package body can encapsulate and protect the wafer-level lens and the photosensitive chip. Peripheral side.

4. The package is integrally formed on the peripheral side of the wafer-level lens, the protective cover and the photosensitive chip, so that the package can be packaged and Protect the wafer-level lens, protective cover and the periphery of the photosensitive chip.

5. By using the cover layer as the assembly reference, multiple separate wafer-level lenses and photosensitive components are fixed upside down on the cover layer, which simplifies the manufacturing process and reduces the requirements for incoming materials for the manufacturing method.

6. The package body is integrally formed on a part of the bottom surface of the light-transmitting cover, the side of the wafer-level lens, and the side of the photosensitive component to encapsulate and protect the wafer-level lens and the photosensitive component.

Additional embodiments and features are set forth in part in the description that follows, and will be apparent to those skilled in the art upon review of the specification, or may be learned by practice of the disclosed subject matter. A further understanding of the features and advantages of the present disclosure can be achieved by reference to the remainder of the specification and drawings, which form a part of this application.

Description of drawings

Figure 1 is a schematic cross-sectional view of a wafer-level lens provided according to the present application;

2A and 2B are schematic diagrams of the manufacturing method of the lens panel provided according to the present application;

Figure 3 is a schematic structural diagram of the lens panel provided according to the present application in the top view direction;

4A, 4B, 4C and 4D are schematic cross-sectional views of four examples of lens panels provided according to the present application;

5A and 5B are two schematic cross-sectional views of a wafer-level lens provided according to the present application;

6A, 6B, 6C and 6D are schematic cross-sectional views of four examples of the first embodiment of the camera module provided according to the present application;

Figure 6E is a schematic top view of the photosensitive component in Figure 6A according to the present application;

7A and 7B are schematic cross-sectional views and top views of the chip panel provided according to the present application;

Figure 7C is a schematic top view of the photosensitive chip after the chip panel is divided according to Figures 7A and 7B of the present application;

Figure 8 is a schematic diagram of a manufacturing method according to the first embodiment of the camera module provided by the present application;

9A, 9B and 9C are schematic cross-sectional views of three examples of the second embodiment of the camera module provided according to the present application;

Figure 10 is a schematic diagram of a manufacturing method according to the second embodiment of the camera module provided by the present application;

11A, 11B and 11C are schematic cross-sectional views of three examples of the third embodiment of the camera module provided according to the present application;

Figure 12 is a schematic diagram of the manufacturing method of the third embodiment of the camera module provided by the present application;

Figure 13 is a schematic cross-sectional view of a fourth embodiment of a camera module provided according to the present application;

Figure 14 is a schematic diagram of a manufacturing method of a fourth embodiment of a camera module provided by this application.

Detailed ways

Below, the present application will be further described with reference to specific implementation modes. It should be noted that, on the premise that there is no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

"Including", the term is open-ended. As used in the appended claims, this term does not exclude additional structures or steps.

In the description of this application, it should be noted that for directional words, such as the terms "center", "transverse", "vertical", "length", "width", "thickness", "upper", "lower" , "Front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inside", "Outside", "Clockwise", "Counterclockwise" ", etc. indicate the orientation and positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation or be in a specific orientation. The construction and operation shall not be construed as limiting the specific scope of protection of this application.

It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

The terms "comprising" and "having" and any variations thereof in the description and claims of this application are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or product that includes a series of steps or units. Apparatus are not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, products or devices.

It should be noted that, as used in this application, the terms "substantially", "approximately" and similar terms are used to indicate approximation, rather than to indicate degree, and are intended to illustrate what would be expected by ordinary skill in the art. Inherent bias in measured or calculated values recognized by personnel.

In the description of this application, it should also be noted that, unless otherwise clearly stated and limited, the terms "setting", "installation", "connecting" and "connecting" should be understood in a broad sense. For example, it can be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection or an indirect connection through an intermediate medium; it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

"Configured as," various units, circuits, or other components may be described or recited as being "configured to" perform one or more tasks. In such contexts, "configured to" is used to imply structure by indicating that the unit/circuit/component includes structure (eg, circuitry) that performs the task or tasks during operation. Additionally, "configured to" may include general-purpose structures (eg, general-purpose circuitry) manipulated by software and/or firmware to operate in a manner capable of performing the task or tasks to be solved. "Configured to" may also include adapting a manufacturing process (eg, a semiconductor fabrication facility) to fabricate a device (eg, an integrated circuit) suitable for implementing or performing one or more tasks.

The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification and the appended claims, the singular forms "a," "an," and "the" are intended to cover the plural forms as well, unless the context clearly dictates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will also be understood that the terms "comprises" and/or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and/or parts, but do not exclude the presence or addition of a or multiple other features, integers, steps, operations, elements, parts, and/or groupings thereof.

As used herein, the term "if" may be interpreted to mean "when" or "in response to" or "in response to determining" or "in response to detecting", depending on the context. Similarly, depending on the context, the phrase "if it is determined..." or "if [the stated condition or event] is detected" may be interpreted to mean "when it is determined..." or "in response to the determination... ” or “on detection of [stated condition or event]” or “in response to detection of [stated condition or event].”

1 to 14 show schematic diagrams of the wafer-level lens 11, the lens panel 21, the lens panel 2111, the camera module 10 and the manufacturing method of the camera module 10 of the present application. As shown in FIG. 1 , a wafer-level lens 11 according to an embodiment of the present application is illustrated, which includes a wafer-level lens assembly 111 , a support member 112 and a light shielding portion 113 . Among them, the support member 112 is disposed on the image side of the wafer-level lens assembly 111, so that the support member 112 supports the wafer-level lens assembly 111 from the image side; the light-shielding portion 113 is disposed on the object side of the wafer-level lens assembly 111 to block light. department 113 can reduce the stray light entering the wafer-level lens 11 on one side of the light incident direction. In some embodiments of the present application, the wafer-level lens 11 may not include the support member 112112 and/or the light shielding part 113, thereby reducing the height or simplifying the manufacturing process.

For the convenience of description, in this application, the side of the wafer-level lens assembly 111 or the wafer-level lens 11 facing the subject is called the object side, and the side opposite to the object side is the image side. In other words, the object side is Refers to the side where the imaging light enters the wafer-level lens assembly 111 or the wafer-level lens 11. The image side refers to the side where the imaging light exits the wafer-level lens assembly 111 or the wafer-level lens 11, that is, the wafer-level lens assembly. 111 or the wafer-level lens 11 faces the side of the image plane. Looking at the direction of the wafer-level lens 11 shown in FIG. 1 , the upper side of the wafer-level lens 11 is the image side, and the lower side of the wafer-level lens 11 is the object side.

The wafer-level lens 11 has an optical axis, and the optical axis of the wafer-level lens 11 is also the optical axis of the wafer-level lens assembly 111. Specifically, the wafer-level lens assembly 111 includes at least one wafer-level lens 1111. The number of wafer-level lenses 1111 in the lens assembly 111 is determined according to the requirements of optical design. The number may be one, two, three, four or more. In one embodiment of the present application, the wafer-level lens assembly 111 includes a wafer-level lens 1111, and the support 112 and the light-shielding portion 113 are respectively fixed on the image side and the object side of the wafer-level lens 1111; in this application In another embodiment, the wafer-level lens assembly 111 includes at least two wafer-level lenses 1111. The at least two wafer-level lenses 1111 are stacked along the optical axis to form a complete optical system. The support member 112 is fixed to at least two wafers. On the image side of the wafer-level lens 1111 closest to the image side among the first-level lenses 1111 , the light shielding portion 113 is fixed on the object side of the wafer-level lens 1111 closest to the object side among at least two wafer-level lenses 1111 . In a specific example, Among them, the wafer-level lens assembly 111 also includes at least one spacer 1113. The spacer 1113 is disposed between adjacent wafer-level lenses 1111. The spacer 1113 supports the adjacent wafer-level lenses 1111 and is suitable for adjusting the crystal. The distance between circular lenses 1111. It is worth mentioning that, in one embodiment of the present application, the support member 112 , the light-shielding portion 113 and the spacer 1113 each have a light hole for light to pass through and avoid interference with the wafer-level lens 1111 .

In one embodiment of the present application, the at least two wafer-level lenses 1111 of the wafer-level lens assembly 111 include a first wafer-level lens 1114, a second wafer-level lens 1115, and a third wafer-level lens 1116. , the first wafer-level lens 1114, the second wafer-level lens 1115 and the third wafer-level lens 1116 are stacked along the direction of light incidence, and the light shielding part 113 is fixed on the object side of the first wafer-level lens 1114 and supported. The member 112 is fixed to the image side of the third wafer level lens 1116 . In a specific example, the wafer-level lens assembly 111 further includes at least one spacer layer 2112. The spacer layer 2112 may be disposed between the first wafer-level lens 1114 and the second wafer-level lens 1115 and/or be disposed between Between the second wafer-level lens 1115 and the third wafer-level lens 1116 assembly, the spacer layer 2112 supports the adjacent wafer-level lenses 1111 and is suitable for adjusting the spacing between the wafer-level lenses 1111 .

In this application, the wafer-level lens assembly 111 further includes an adhesive layer, which can be disposed between adjacent wafer-level lenses 1111 for fixing the adjacent wafer-level lenses 1111; the adhesive layer It can also be disposed between the adjacent wafer-level lenses 1111 and the spacers 1113 for fixing the adjacent wafer-level lenses 1111 and the spacers 1113; the adhesive layer can also be disposed between the adjacent wafer-level lenses 1111 and the spacers 1113. between the lens 1111 and the support 112 for fixing the adjacent wafer-level lens 1111 and the support 112; an adhesive layer can also be provided between the adjacent wafer-level lens 1111 and the light shielding part 113 for fixing The adjacent wafer level lens 1111 and the light shielding part 113 are fixed. It should be noted that the materials of the adhesive layers disposed at different positions may be the same or different, depending on the adhesion requirements, and the present application is not limited thereto. In one example, the adhesive layer may be glue. When setting the adhesive layer, the glue may be applied continuously or at dot-like intervals, so that at least two wafer-level lenses 1111 and spacer layers 2112 are formed. When fixed, the air located inside can escape; in another example, the adhesive layer can also be a solid glue such as double-sided tape.

In this application, the wafer-level lens 1111 includes a light-transmitting substrate 11111 and at least one lens unit 11112. The at least one lens unit 11112 is disposed on one or both sides of the light-transmitting substrate 11111. The at least one lens unit 11112 can focus or To diffuse light, at least one lens unit 11112 can be fixed on one or both sides of the light-transmitting substrate 11111 through methods such as bonding, insert injection molding, and integral molding. In one embodiment of the present application, a wafer-level lens 1111 includes a light-transmitting substrate 11111 and a lens unit 11112 disposed on the object side or image side of the light-transmitting substrate 11111. In other words, the wafer-level lens 1111 One side of the wafer-level lens 1111 is a flat surface, and the other side of the wafer-level lens 1111 is a curved surface. In another embodiment of the present application, a wafer-level lens 1111 includes a light-transmissive substrate 11111 and is disposed on The two lens units 11112 on the object side and image side of the light-transmitting substrate 11111 have curved surfaces on both sides of the wafer-level lens 1111. In this application, the curved surface The shape can be spherical, aspherical or free-form.

In this application, the wafer level lens 11 (wafer level optics) is formed by dividing the lens panel 21. The lens panel 21 includes a plurality of connected wafer level lenses 11. By dividing the lens panel 21, the lens panel 21 can be The wafer-level lens 11 is manufactured in large quantities and at low cost, and the obtained wafer-level lens 11 also has a relatively small size.

Further, a method of manufacturing the lens panel 21 is provided. Referring to FIGS. 2A and 2B , the manufacturing method of the lens panel 21 includes the following steps S110-S130:

Step S110: Provide at least two lens panels 2111. As shown in FIGS. 3 to 4C , the lens panel 2111 includes a substrate layer 21111 and a plurality of lens units 11112 disposed on one side or both sides of the substrate layer 21111 . The plurality of lens units 11112 are arrayed on the substrate. Layer 21111, each lens unit 11112 has an optical axis perpendicular to the substrate layer 21111.

Step S120: Align at least two lens panels 2111 along the height direction. As shown in FIG. 2A , by overlapping the optical axes of the lens units 11112 on adjacent lens panels 2111 , at least two lens panels 2111 are aligned along the height direction, where the height direction refers to perpendicular to the lens panels 2111 (or The direction of the substrate layer 21111).

Step S130: Connect at least two lens panels 2111 to form the lens panel 21. By providing an adhesive layer, at least two aligned lens panels 2111 are fixed in a predetermined position directly or indirectly to form a lens panel 21 , which includes a plurality of wafer-level lenses 11 distributed in an array.

In one embodiment of the present application, step S110 of the manufacturing method of the lens panel 21 may include:

In step S111, at least one spacer layer 2112 is provided, and the spacer layer 2112 is disposed between adjacent lens panels 2111. The spacing layer 2112 is used to adjust the spacing between adjacent groups of lens panels 2111. The spacing layer 2112 has a plurality of light holes corresponding to the lens units 11112 of the adjacent lens panels 2111, so that light passes through the spacing layer 2112. The multiple light holes pass through, and there is no interference between the spacer layer 2112 and the lens panel 2111. In a specific example of this application, the spacer layer 2112 preferably uses an opaque material to reduce stray light from entering the wafer-level lens 11 .

In step S112, a support layer 212 is provided, and the support layer 212 is disposed on the image side of at least two lens panels 2111. The support layer 212 is used to support at least two lens panels 2111. The support layer 212 has a plurality of light holes corresponding to the lens units 11112 of the adjacent lens panels 2111, so that light passes through the multiple light holes of the support layer 212. through, and there will be no interference between the support layer 212 and the lens panel 2111. In a specific example of this application, the support layer 212 preferably uses an opaque material to reduce stray light from entering the wafer-level lens 11 .

In step S113, a light-shielding layer 213 is provided, and the light-shielding layer 213 is disposed on the object side of at least two lens panels 2111. The light-shielding layer 213 is made of an opaque material, which is used to reduce stray light entering from the light incident direction. The light shielding layer 213 has a plurality of light holes corresponding to the lens units 11112 of the adjacent lens panels 2111, so that light passes through the multiple light holes of the light shielding layer 213, and there is a gap between the light shielding layer 213 and the lens panel 2111. No interference will occur. In one embodiment of the present application, the light-shielding layer 213 may be pre-formed on the image side of the lens panel 2111 closest to the object side of at least two lens panels 2111 by silk screen printing, ink coating, or glue coating; in this application, In another embodiment of the application, the light-shielding layer 213 may also be pre-formed and then disposed on the object side of at least two lens panels 2111.

It should be noted that there is no order or correlation between steps S111, S112 and S113, that is, the final lens panel 21 may only include one of the spacer layer 2112, the support layer 212, and the light shielding layer 213. Or two, or may include a spacer layer 2112, a support layer 212 and a light-shielding layer 213 at the same time.

In one embodiment of the present application, when step S110 includes step S111, step S120 of the manufacturing method of the lens panel 21 may include:

Step S121, align the spacer layer 2112 with the adjacent lens panel 2111 along the height direction. Align the spacer layer 2112 and the adjacent lens panel 2111 so that the multiple light holes of the spacer layer 2112 can face the lens units 11112 on the adjacent lens panel 2111, thereby preventing Interference occurs between the spacer layer 2112 and the lens units 11112 on the adjacent lens panel 2111, or the imaging is affected.

In one embodiment of the present application, when step S110 includes step S112, step S120 of the manufacturing method of the lens panel 21 may include:

Step S122, align the support layer 212 with the adjacent lens panel 2111 along the height direction. Align the support layer 212 and the adjacent lens panel 2111 so that the multiple light holes of the support layer 212 can face the lens units 11112 on the adjacent lens panel 2111, thereby preventing the support layer 212 from interfacing with the adjacent lens panel 2111. Interference occurs between the lens units 11112 on the camera or the imaging is affected.

In one embodiment of the present application, when step S110 includes step S113, step S120 of the manufacturing method of the lens panel 21 may include:

Step S123, align the light shielding layer 213 with the adjacent lens panel 2111 along the height direction. Align the light shielding layer 213 and the adjacent lens panel 2111 so that the multiple light holes of the light shielding layer 213 can face the lens units 11112 on the adjacent lens panel 2111, thereby preventing the light shielding layer 213 from interfacing with the adjacent lens panel 2111. Interference occurs between the lens units 11112 on the camera or the imaging is affected.

In one embodiment of the present application, in step S130 of the manufacturing method of the lens panel 21, when the lens panel 21 includes one, two or all of the spacer layer 2112, the support layer 212, and the light shielding layer 213, step S130 can include:

Step S131, connect the spacer layer 2112, the support layer 212 or the light-shielding layer 213 to the adjacent lens panel 2111. In other words, at least two lens panels 2111 and one, two or all of the spacer layer 2112, the support layer 212 and the light shielding layer 213 are sequentially superimposed and fixed. For example, the above adjacent components can be fixed by providing an adhesive layer.

In a specific embodiment, through steps S110-S130, the obtained lens panel 21 includes a lens assembly panel 211, a support layer 212 and a light shielding layer 213. The lens assembly panel 211 includes at least one lens panel 2111. The support layer 212 The light shielding layer 213 and the light shielding layer 213 are respectively fixed on the image side and the object side of the lens panel 2111 . The lens assembly panel 211 may also include at least one spacer layer 2112. The at least one spacer layer 2112 is disposed between adjacent lens panel panels 2111 and may be fixed by providing an adhesive layer between the spacer layer 2112 and the lens panel 2111. On the lens panel 2111.

Furthermore, a manufacturing method of the wafer-level lens 11 is provided. Referring to FIG. 2B , the manufacturing method of the wafer-level lens 11 includes the following steps S210-220:

Step S210: Provide a lens panel 21.

Step S220: Divide the lens panel 21 to obtain multiple wafer-level lenses 11. As shown in FIG. 2B , the solid lines are division lines. After division, multiple independent wafer-level lenses 11 can be obtained. The middle of the two solid lines indicates the part to be removed.

In one embodiment of the present application, the lens panel 21 can be obtained through steps S110-S130 of the manufacturing method of the lens panel 21.

In one embodiment of the present application, in step S220, at least one of sawing, laser cutting, laser grinding, water punch cutting, milling, micromachining, micro slicing, punching and cutting can be used. The lens panel 21 is divided to obtain the wafer-level lens 11 .

In this application, after the lens panel 21 is divided, the lens assembly panel 211 is divided to form a plurality of wafer-level lens assemblies 111, wherein the lens panel 2111 is divided to form a plurality of wafer-level lenses 1111. The lens panel 2111 The substrate layer 21111 is divided into a plurality of light-transmitting substrates 11111, the spacer layer 2112 is divided into a plurality of spacers 1113; the support layer 212 is divided into a plurality of support members 112; the light-shielding layer 213 is divided into a plurality of light-shielding parts 113 . The segmented wafer-level lens 11 has a rectangular parallelepiped outline, which reduces the difficulty of segmentation. In other examples of this application, the outline of the wafer-level lens 11 can also have other shapes, such as a hexagonal prism shape, a cylinder shape, and a cutting cylinder. Shape and other shapes, where a cut cylindrical shape refers to a shape in which at least part of the side of the cylinder is cut.

As shown in Figures 3 to 4C, a method of manufacturing the lens panel 2111 is further provided. The manufacturing method of the lens panel 2111 includes the following steps S310-S320:

Step S310: Provide a substrate layer 21111.

In step S320, multiple lens units 11112 are formed on one side or both sides of the substrate layer 21111. The plurality of lens units 11112 are arranged in an array to facilitate subsequent cutting. The lens units 11112 are made of light-transmitting material, such as resin material.

The lens panel 2111 includes a substrate layer 21111 and a plurality of lens units 11112 formed on at least one side of the substrate layer 21111. In this application, the lens panel 2111 can be manufactured in a variety of ways. Figures 4A to 4C illustrate this invention. Application for three lens panels 2111.

Figure 4A shows the first embodiment of the lens panel 2111 of the present application. Referring to Figure 4A, the substrate layer 21111 provided in step S310 is flat-shaped. In step S320, multiple lenses are formed on both sides of the substrate layer 21111. Unit 11112, wherein the optical axes of the plurality of lens units 11112 on both sides of the substrate layer 21111 overlap. It should be noted that in this embodiment, the substrate layer 21111 is made of a light-transmitting material suitable for transmitting visible light, such as glass material or resin material.

Figure 4B shows the second embodiment of the lens panel 2111 of the present application. Referring to Figure 4B, the substrate layer 21111 provided in step S310 is flat-shaped. In step S320, multiple lens units are formed on one side of the substrate layer 21111. 11112. It should be noted that in this embodiment, the substrate layer 21111 is made of a light-transmitting material suitable for transmitting visible light, such as glass material or resin material.

In the first and second embodiments of the lens panel 2111, the plurality of lens units 11112 can be disposed on one side or both sides of the substrate layer 21111 through bonding or insert molding. Specifically, in one example, multiple lens units 11112 can be preformed, and then the multiple lens units 11112 can be bonded to one side or both sides of the substrate layer 21111 through optical glue; in another example, the substrate layer 21111 It is arranged in the molding cavity of a lens molding mold, injects liquid lens material (such as resin) from the injection port of the lens molding mold, so that the interior of the molding cavity is filled with lens material, solidifies the lens material, and makes one or both sides of the substrate layer 21111 ( Here one side or both sides refers to the upper surface side and/or the lower surface side of the substrate layer 21111 (which will not be described in detail below) to form a plurality of lens units 11112, thereby obtaining a lens panel 2111,

Figure 4C shows the third embodiment of the lens panel 2111 of the present application. Referring to Figure 4C, the substrate layer 21111 provided in step S310 is flat, and the substrate layer 21111 has a plurality of through holes. In step S320, in the substrate layer A plurality of lens units 11112 are formed on both sides of the substrate layer 21111. The optical axes of the multiple lens units 11112 on both sides of the substrate layer 21111 overlap, and the two opposite lens units 11112 are connected through the through holes of the substrate layer 21111. It should be noted that in this embodiment, the substrate layer 21111 can be made of a light-transmitting material suitable for transmitting visible light, such as a glass material or a resin material; an opaque material can also be used, which is beneficial to reducing stray light. In this embodiment, the plurality of lens units 11112 may be disposed on both sides of the substrate layer 21111 through insert molding.

Figure 5A shows the wafer-level lens 11 made by the present application using the lens panel 2111 described in Figure 4A. The wafer-level lens 1111 includes a light-transmitting substrate 11111 and lens units formed on both sides of the light-transmitting substrate 11111. 11112.

Referring further to FIG. 4D and FIG. 5B, FIG. 4D shows the fourth embodiment of the lens panel 2111 of the present application. The lens unit 11112 formed on one side or both sides of the substrate layer 21111 includes an imaging part 111121 and a structural part 111122. The lens unit The imaging part 111121 of 11112 is adapted to refract incident light, and the structural part 111122 of the lens unit 11112 is adapted to support the lens panel 2111 or adjust the distance between adjacent lens panels 2111. In some embodiments of the present application, the structural part 111122 of the lens unit 11112 can replace the function of the spacer 1113 or the support 112, thereby simplifying the manufacturing process.

Figure 5B shows another embodiment of the wafer-level lens 11 of the present application. As shown in Figure 5B, the wafer-level lens 11 includes a first wafer-level lens 1114, a second wafer-level lens 1115 and a third wafer-level lens 1115. Circle-level lens 1116, wherein the lens unit 11112 located on the image side of the first wafer-level lens 1114, the second wafer-level lens 1115 and the third wafer-level lens 1116 includes an imaging part 111121 and a structural part 111122. The first crystal The round-level lens 1114 is fixed on the image side of the second wafer-level lens 1115 through the structural part 111122, and the second wafer-level lens 1115 is fixed on the image side of the third wafer-level lens 1116 through the structural part 111122, and passes through the first wafer. The structural parts 111122 of the first-level lens 1114 and the second wafer-level lens 1115 respectively adjust the distance between adjacent wafer-level lenses 1111, and the wafer-level lens 11 is supported by the structural part 111122 of the third wafer-level lens 1116. The wafer-level lens 11 also includes a light-shielding portion 113 disposed on the object side of the first wafer-level lens 1114. The light-shielding portion 113 is fixed. On the object side of the first wafer level lens 1114 .

Further, a first embodiment of a camera module 10 of the present application is provided. As shown in FIGS. 6A to 6D , the camera module 10 includes a wafer-level lens 11 , a package 12 and a photosensitive component 13 . The round-level lens 11 is disposed on the photosensitive path of the photosensitive component 13 , and the package 12 is disposed on the peripheral side of the wafer-level lens 11 .

The photosensitive component 13 is used to convert the optical signal of the subject converged by the wafer-level lens 11 into an electrical signal. The photosensitive component 13 has a front and a back, wherein the front of the photosensitive component 13 faces the wafer-level lens 11 and the back of the photosensitive component 13 Opposite to the front of the photosensitive component 13 , the wafer-level lens 11 is fixed on the front of the photosensitive component 13 . In a specific example of this application, the wafer-level lens 11 is bonded to the front of the photosensitive component 13 through the support 112 , and the wafer-level lens component 111 is installed on the front of the photosensitive component 13 under the action of the support 112 .

Specifically, as shown in FIGS. 6A to 6C , in one embodiment of the present application, the photosensitive component 13 includes a photosensitive chip 131 and an electrical connection portion 133 provided on the photosensitive chip 131 , wherein the electrical connection portion 133 can be Other functional components are integrated to further process the electrical signals converted by the photosensitive chip 131 .

The photosensitive chip 131 has a front surface facing the wafer-level lens 11 and a back surface opposite to the front surface. The front side of the photosensitive chip 131 includes a photosensitive area and a non-photosensitive area. The non-photosensitive area surrounds the photosensitive area, and the photosensitive area is used for photosensitivity.

In a specific example of this application, the electrical connection portion 133 is provided on the back side of the photosensitive chip 131 , wherein the electrical connection portion 133 is implemented as a plurality of solder balls, and the plurality of solder balls can be connected electrically by solder bumps, solder pads, or other methods. Component replacement; in another specific example of the present application, the electrical connection portion 133 is provided in the non-photosensitive area on the front side of the photosensitive chip 131, as shown in FIGS. 11A to 11C , in which the electrical connection portion 133 is implemented as a plurality of solder joints. pads, multiple pads may be replaced with solder bumps, solder pads, or other electrical connection components.

More specifically, in one embodiment of the present application, the photosensitive chip 131 is packaged in a wafer-level CSP (Chip Scale Package), also known as a wafer-level chip. The photosensitive component 13 further includes a protective cover 132 , which is disposed above the photosensitive chip 131 to protect the photosensitive chip 131 . In a specific example of this application, the protective cover 132 may be made of glass, and the protective cover 132 is fixed to the non-photosensitive area on the front side of the photosensitive chip 131 by adhesion or other means. That is, the wafer-level CSP packaged photosensitive chip 131 is disposed between the protective cover 132 and the electrical connection portion 133 , and the protective cover 132 and the electrical connection portion 133 are disposed oppositely on both sides of the photosensitive chip 131 . In one embodiment of the present application, the outer side of the wafer-level lens 11 is flush with the outer side of the protective cover 132 .

The photosensitive chip 131 in the wafer-level CSP package adopts the method of directly leading out the electrical connection portion 133 on the bottom surface. The photosensitive chip 131 is directly electrically connected to the motherboard of the external electronic device through the electrical connection portion 133 on the bottom surface, which can effectively shorten the signal transmission distance and reduce the cost. Small attenuation, the anti-interference and anti-noise performance of the photosensitive chip 131 can also be improved, and the lateral size of the photosensitive component 13 can also be reduced, making the structure of the photosensitive component 13 more compact.

As shown in Figure 6B, in one embodiment of the present application, the camera module 10 further includes a filter element 14. The filter element 14 has an infrared cutoff function and is used to filter the incident light entering the photosensitive chip 131. , filtering out stray light such as infrared light that is not needed for imaging in the incident light. In a specific example of this application, the filter element 14 is disposed above the protective cover 132 so that the filter element 14 is located on the photosensitive path of the photosensitive chip 131 , and the filter element 14 is disposed on the wafer-level lens 11 and Between the photosensitive components 13 , that is, along the height direction, the photosensitive component 13 includes a filter element 14 , a protective cover 132 , a photosensitive chip 131 , and an electrical connection part 133 in sequence.

In the embodiment shown in FIG. 6A , the camera module 10 does not have the filter element 14 shown in FIG. 6B . In order to make the camera module 10 shown in FIG. 6A have an infrared cutoff function, in a specific example, The protective cover 132 has an infrared cutoff function, that is, the protective cover 132 is used as a filter element, so that the protective cover 132 can filter the imaging light entering the photosensitive chip 131. This arrangement method eliminates the need to set up a separate filter element. On the one hand, the cost of the camera module 10 can be reduced, and on the other hand, the overall height of the camera module 10 can be reduced. The infrared cutoff function of the protective cover 132 can be achieved by, for example, the material of the protective cover 132 itself having the function of absorbing infrared rays or the surface of the protective cover 132 being coated with an infrared cutoff film. In other words, it can also be considered that in the embodiment shown in FIG. 6A , the filter element is used as the protective cover 132 , so that the filter element and the protective cover 132 are combined into one.

In another specific example, the wafer-level lens 11 has an infrared cutoff function. Specifically, the light-transmitting substrate 11111 of one of the wafer-level lenses 1111 of the wafer-level lens 11 has an infrared cutoff function, so that the wafer-level lens 11 It has an infrared cutoff function to filter the imaging light entering the photosensitive chip 131 . The infrared cutoff function of the light-transmitting substrate 11111 can be achieved by, for example, the material of the light-transmitting substrate 11111 itself having the function of absorbing infrared rays or the surface of the light-transmitting substrate 11111 being coated with an infrared cutoff film. This arrangement method eliminates the need for separate filter elements, which can reduce the cost of the camera module 10 and reduce the overall height of the camera module 10 .

Continuing to refer to FIGS. 6A to 6C , the package 12 is integrally formed on the peripheral side of the wafer-level lens 11 . In one example, the package 12 is arranged around the peripheral side of the wafer-level lens 11 . The entire package is covered by a package 12 to protect the peripheral side of the wafer-level lens 11. The package 12 is made of an opaque material, thereby preventing stray light from entering the wafer-level optical lens.

Further, the package 12 extends toward the image side (downward) and further covers the peripheral side of the protective cover 132. The package 12 is integrally formed on the peripheral sides of the wafer-level lens 11 and the protective cover 132, so that the wafer-level The peripheral sides of the lens 11 and the protective cover 132 are all covered by the package 12 , which can protect the wafer-level lens 11 and the peripheral sides of the protective cover 132 . In this embodiment, the lateral size of the protective cover 132 is smaller than the lateral size of the photosensitive chip 131, so that at least a part of the front surface of the photosensitive chip 131 is exposed, so that the package 12 is integrally formed on at least a part of the front surface of the photosensitive chip 131. The package body 12 covers at least part of the front surface of the photosensitive chip 131. Specifically, the outer annular area 1311 of the front surface of the photosensitive chip 131 is not covered by the protective cover 132, so that the package 12 is integrally formed on the peripheral side of the wafer-level lens 11 and the protective cover. The package 12 covers the peripheral side of the wafer-level lens 11 and the peripheral side of the protective cover 132 and the outer annular area 1311 of the front surface of the photosensitive chip 131 . It should be noted that in this application, the lateral size refers to the size in the direction perpendicular to the optical axis of the wafer-level lens 11; the outer annular area 1311 refers to the outermost annular area on the front surface of the photosensitive chip 131, which is located on the photosensitive The non-photosensitive area of the chip 131 is shown in Figure 6E.

When the wafer-level lens 11 further includes the filter element 14, as shown in FIG. 6B, the package 12 is integrally formed around the wafer-level lens 11, the filter element 14 and the protective cover 132, so that the wafer-level lens 11. The peripheral sides of the filter element 14 and the protective cover 132 are all covered by the package 12 . In this embodiment, the lateral dimensions of the filter element 14 and the protective cover 132 are the same, and the lateral dimensions of the photosensitive chip 131 are larger than those of the filter element 14 and the protective cover 132 , so that at least part of the front surface of the photosensitive chip 131 is exposed. , so that the package body 12 covers a part of the front surface of the photosensitive chip 131. Specifically, the outer annular area 1311 of the front surface of the photosensitive chip 131 is not covered by the protective cover 132, so the package body 12 is integrally formed with the wafer-level lens 11 and the light filter. The peripheral side of the element 14 and the protective cover 132 and the outer annular area 1311 of the front surface of the photosensitive chip 131. The package 12 covers the wafer-level lens 11, the filter element 14 and the peripheral side of the protective cover 132 and the front surface of the photosensitive chip 131. Outer annular area 1311.

The wafer-level CSP packaged photosensitive chip 131 can be directly electrically connected to the motherboard of an external electronic device (such as a mobile phone) through the electrical connection portion 133 to achieve circuit conduction of the camera module 10, as shown in Figures 6A to 6C. In another embodiment of the present application, as shown in FIG. 6D , the photosensitive component 13 further includes a circuit board 135 , the circuit board 135 is disposed on the back of the photosensitive chip 131 , and the electrical connection portion 133 is electrically connected to the circuit board 135 , so that The electrical connection between the photosensitive chip 131 and the circuit board 135 is achieved through the electrical connection portion 133 . Among them, the circuit board 135 includes a circuit board main body 1351, a connecting belt 1352 and a connecting plate 1353. The photosensitive chip 131 is disposed on the front side of the circuit board main body 1351 and is electrically connected to the circuit board main body 1351 through the electrical connection part 133. The connecting belt 1352 is connected to and The circuit board main body 1351 and the connecting plate 1353 are electrically connected, so that the connecting strip 1352 transmits the imaging information obtained by the circuit board main body 1351 from the photosensitive chip 131 to the external electronic device through the connector, so that the photosensitive chip 131 packaged in the wafer level CSP can also be It is indirectly electrically connected to the motherboard of the external electronic device through the circuit board 135 .

The photosensitive component 13 further includes electronic components, which may be one or more of passive electronic components such as resistors and capacitors, and active electronic components such as drive chips and memory chips. In a specific example of the present application, the electronic components are arranged on the connecting strip 1352 and/or the connecting plate 1353 to avoid occupying the space of the circuit board main body 1351, thereby providing sufficient space for the photosensitive chip 131 placed on the circuit board main body 1351. Installation location.

Continuing to refer to FIG. 6D , in another specific example of the present application, the electronic component 134 is disposed on the back of the circuit board body 1351 , that is, the electronic component 134 and the photosensitive chip 131 are disposed on both sides of the circuit board body 1351 . On the one hand, it can Avoid the placement of the photosensitive chip 131 On the other hand, the lateral size of the circuit board body 1351 can be reduced, making the structure of the camera module 10 more compact. Among them, the front side of the circuit board main body 1351 refers to the side facing the photosensitive chip 131 or the wafer-level lens 11, and the back side of the circuit board main body 1351 refers to the side away from the photosensitive chip 131 or the wafer-level lens 11. The circuit board The back side of the main body 1351 is opposite to the front side. Further, the circuit board 135 also includes a bottom packaging part 1354. The bottom packaging part 1354 is disposed on the back of the circuit board body 1351. The bottom packaging part 1354 encapsulates the electronic components 134 disposed on the back of the circuit board body 1351 inside it. Therefore, the electronic component 134 will not be directly exposed to the air, and the electronic component 134 will not be contaminated with dust and other pollutants. For example, in one embodiment of the present application, the bottom packaging part 1354 is integrally formed on the back of the circuit board body 1351 through a molding process, and the electronic components 134 are molded inside the bottom packaging part 1354 to protect the electronic components 134 .

In this application, the camera module 10 in the first embodiment is formed by dividing the module panel 20 . The module panel 20 includes a plurality of connected camera modules 10 . By dividing the module panel 20 This method can manufacture the camera module 10 in batches and at low cost, and the obtained camera module 10 also has a relatively small size.

The module panel 20 includes a lens panel 21 stacked along the height direction, a protective layer 22 and a chip panel 24. The chip panel 24 includes a plurality of photosensitive chips 131. After cutting, the chip panel 24 can form a plurality of photosensitive chips as described above. The chip 131 and the lens panel 21 can be cut to form multiple wafer-level lenses 11 as mentioned above. The protective layer 22 can be cut to form multiple protective covers 132 as mentioned above. A single wafer-level lens 11 is located on a single photosensitive chip 131 On the photosensitive path, the protective cover 132 is disposed between the wafer-level lens 11 and the photosensitive chip 131 .

Further, a method of manufacturing the camera module 10 in the first embodiment is provided. Referring to FIG. 8 , the manufacturing method of the camera module 10 includes the following steps S410-S440:

Step S410 , stack and fix a lens panel 21 , a protective layer 22 and a chip panel 24 along the height direction to form a module panel 20 . As shown in Figure 8, the module panel 20 includes a lens panel 21, a protective layer 22 and a chip panel 24 along the height direction, providing a lens panel 21, a protective layer 22 and a chip panel 24. The lens panel 21 is provided with a protective layer 22 and a chip panel 24. The board 21, the protective layer 22 and the chip panel 24 are aligned along the height direction. An adhesive layer is provided between the lens panel 21 and the protective layer 22 to bond and fix the lens panel 21 and the protective layer 22. The protective layer 22 and the chip panel are An adhesive layer is provided between the boards 24 to adhere and fix the protective layer 22 and the chip panel 24. The materials of the adhesive layers at the two locations may be the same or different, and this embodiment is not limited thereto.

Step S420, divide the lens panel 21 and the protective layer 22 in the module panel 20 along the height direction to form multiple wafer-level lenses 11 and multiple protective covers 132. Two adjacent wafer-level lenses 11 and An upper dividing groove 26 is formed between two adjacent protective cover plates 132 . The module panel 20 is divided along the height direction from the object side to the image side, and the lens panel 21 and the protective layer 22 are divided to expose the chip panel 24 to form a plurality of upper dividing grooves 26. The upper dividing grooves 26 are formed in adjacent Between the two wafer-level lenses 11 and the two adjacent protective covers 132, the bottom surface of the upper dividing groove 26 is the chip panel 24, and the side surfaces of the upper dividing groove 26 are the wafer-level lenses 11 and the protective covers. 132.

Step S430 , the upward dividing groove 26 is filled with packaging material, and the packaging material is cured to form a packaging conjoined part 23 . The packaging conjoined part 23 is integrally formed on the peripheral side of the wafer-level lens 11 and the protective cover 132 . The packaging material fills the upper dividing groove 26 and connects the two adjacent wafer-level lenses 11 and the two adjacent protective covers 132 to form a packaging conjoined part 23. The packaging conjoined part 23 covers the wafer-level lenses 11 and Protect the peripheral side of the cover 132 .

Step S440 , divide the module panel 20 along the height direction, and divide the package conjoined part 23 and the chip panel 24 to form multiple camera modules 10 . The package conjoined portion 23 is divided to form the package 12 in the camera module 10 , and the chip panel 24 is divided to obtain a plurality of independent photosensitive chips 131 .

The chip panel 24 includes a plurality of connected photosensitive chips 131. In an example of this embodiment, the manufacturing method of the camera module 10 further includes step S450: setting electrical connections on the backs of the multiple photosensitive chips 131 of the chip panel 24. Department 133. An electrical connection portion 133 is provided on the back of the photosensitive chip 131 so that the photosensitive chip 131 can be electrically connected to other components from the back. Step S450 may be located before step S440 or after step S440. In a specific example, when step S450 is located between step S430 and step S440, at this time, the plurality of photosensitive chips 131 are still connected and exist in the form of a chip panel 24. Multiple photosensitizers in the chip panel 24 can be sensitized in batches in the chip panel 24 state. The electrical connection portion 133 is provided on the back of the chip 131, which has higher efficiency; in another specific example, step S450 is located after step S440, and the module panel 20 is first divided along the height direction, and after the division is completed, the independent The electrical connection part 133 is provided on the back of the photosensitive chip 131 of the camera module 10, so as to avoid damage to the electrical connection part 133 caused by division.

In an example of this embodiment, the manufacturing method of the camera module 10 also includes the step of setting the circuit board 135: further setting the circuit board 135 on the back of the photosensitive chip 131, and the photosensitive chip 131 is electrically connected to the circuit board 135 through the electrical connection part 133. . Among them, the circuit board 135 includes a circuit board main body 1351, a connecting belt 1352 and a connecting plate 1353. The circuit board main body 1351 is disposed on the back of the photosensitive chip 131 and is electrically connected to the electrical connection part 133. The connecting belt 1352 connects and electrically conducts the circuit board main body 1351. and the connection board 1353, so that the connection belt 1352 transmits the imaging information obtained by the circuit board body 1351 from the photosensitive chip 131 to the external electronic device through the connector.

In an example of this embodiment, a step of setting the light shielding portion 113 is also included. In a specific example, after the segmentation of the module panel 20 is completed, the light shielding portion 113 is provided on the object side of the wafer-level lens 11 . In another example, the step of arranging the light-shielding portion 113 on the object side of the wafer-level lens 11 can also be performed in step S430. For example, the light-shielding portion 113 is formed on the object side of the wafer-level lens 11 through a packaging material, so that the light-shielding portion 113 and the package connecting portion 23 can be formed integrally, simplifying the manufacturing process. In another example of this embodiment, the light shielding portion 113 can also be directly formed during the manufacturing process of the lens panel 21 , that is, the lens panel 21 provided in step S410 includes the light shielding portion 113 .

In an example of this embodiment, in step S410, the protective layer 22 and the chip panel 24 may be fixed first to form the photosensitive wafer 25, and then the lens panel 21 and the photosensitive wafer 25 may be aligned and fixed; or, The protective layer 22 and the chip panel 24 provided in step S410 have been fixed in advance to form the photosensitive wafer 25.

In an example of this embodiment, in step S410, a filter element 14 is further provided, so that the filter element 14 is disposed between the wafer-level lens 11 and the protective layer 22, and infrared cutoff is achieved through the filter element 14. Function. Due to the arrangement of the filter element 14, in step S420, the filter element 14 is also divided. In step S430, the package conjoined part 23 is integrally formed on the wafer-level lens 11, the filter element 14 and the protective cover. The peripheral side of plate 132.

In an example of this embodiment, in step S420, the segmentation method may be at least one of sawing, laser cutting, laser grinding, waterjet cutting, milling, micromachining, micro-slicing, punching and cutting, etc. The lens panel 21 and the protective layer 22 are divided.

In an example of this embodiment, in step S430, the packaging material filled in the upward dividing groove 26 is a liquid packaging material, and the packaging conjoined portion 23 is formed after the liquid packaging material is solidified. With the fluidity of the liquid packaging material, the packaging material can fully contact the peripheral sides of the wafer-level lens 11 and the protective cover 132. After the liquid packaging material is cured, the formed packaging conjoined portion 23 can also completely cover the wafer-level lens 11 and the protective cover 132. The lens 11 and the peripheral side of the protective cover 132 .

In a specific example, the packaging material can be glue, and the upward dividing groove 26 is filled with glue. After the glue is cured, the packaging conjoined portion 23 formed can be divided to obtain a glue package body, that is, the wafer-level lens 11 is packaged using a glue process or Protect the peripheral side of the cover 132 . Specifically, the glue is opaque, such as black glue, so that the encapsulation material can reduce stray light entering from the side. Furthermore, in order to completely fill the upper dividing groove 26 with glue and avoid the presence of air bubbles in the upper dividing groove 26, the encapsulated conjoined part 23 formed after curing cannot completely cover the wafer-level lens 11 or the peripheral side of the protective cover 132. , the glue can be filled into the upper dividing groove 26 by spraying to avoid the generation of bubbles, or the glue can be filled by dot-like glue drawing.

In another specific example, the packaging material may also be a molding material. The module panel 20 is placed in a molding mold, and the molding material is injected into the molding mold to allow the molding material to form in the upper dividing groove 26 The upper dividing groove 26 is filled with the molding material, and then the molding material is solidified to form the encapsulating conjoined part 23. The molded package can be obtained by dividing the encapsulating conjoined part 23. By molding the mold package module panel 20 , the molded package formed on the side of the wafer-level lens 11 has a flatter top surface. Among them, the molding material can be solidified by cooling or heating, which is determined by the properties of the molding material.

In an example of this embodiment, in step S440, the segmentation may be performed by at least one of sawing, laser cutting, laser grinding, waterjet cutting, milling, micromachining, micro-slicing, punching and other cutting methods. 20 kinds of divided module panels.

It is worth noting that in this embodiment, the dividing method in step S440 can be the same as or different from the dividing method in step S420. When facing different cutting objects, different cutting methods and different cutting widths can be selected.

It is worth noting that there is a dividing part between two adjacent photosensitive chips 131 in the chip panel 24, and the photosensitive chips 131 are separated by cutting the dividing part. However, in the actual manufacturing process, the protective layer 22 is cut using a cutting knife. When the cutting blade has a sharp blade shape, the photosensitive chip 131 will be cut after cutting down the protective layer 22. When the width of the dividing part is small, it is easy to cut the circuits in the photosensitive chip 131, or when cutting the protective layer. 22, the circuit damage to the photosensitive chip 131 will also be caused due to cutting too deep. In one example, when the width of the cutting portion of the chip panel 24 is greater than or equal to the width of the cutting knife, the cutting knife only cuts the dividing portion; in another example, when the width of the dividing portion of the chip panel 24 is smaller than the width of the cutting knife When the width is too high, the cutting knife may cause damage to the photosensitive chip 131 circuit.

In order to avoid circuit damage to the photosensitive chips 131, the distance between adjacent photosensitive chips 131 can be increased. In a specific example, the width of the dividing portion is 80um-300um. On the one hand, it can meet the cutting requirements and avoid the problem of damage during the cutting process. Damaging the photosensitive chip 131 can, on the other hand, make it possible to cut out as many photosensitive chips 131 as possible from one chip panel 24 .

However, in the way of obtaining the chip panel 24 through a conventional chip manufacturing process, the photosensitive chips 131 are formed on a silicon wafer. Increasing the distance between the photosensitive chips 131 will make it possible to produce more photosensitive chips on one silicon wafer. The number of photosensitive chips 131 is reduced, which increases the manufacturing cost of the photosensitive chip 131 and reduces the manufacturing efficiency. Therefore, the present application provides a new chip panel 24. As shown in FIGS. 7A and 7B, the chip panel 24 includes a plurality of photosensitive chips 131 and a conjoined portion 241 disposed between the plurality of photosensitive chips 131. . A plurality of photosensitive chips 131 are laid on the same horizontal plane, and the connecting portion 241 is provided between two adjacent photosensitive chips 131 to connect and support the plurality of photosensitive chips 131 through the connecting portion 241 . The chip panel 24 is divided by dividing the connecting part 241, and the single photosensitive chip 131 is integrally formed with a side connecting part 136 on its peripheral side, and the side connecting part 136 is arranged around the photosensitive chip 131, as shown in FIG. 7C.

In one embodiment of the present application, the conjoined portion 241 is integrally formed between two adjacent photosensitive chips 131 through a molding process. The width of the conjoined portion 241 is greater than or equal to the width of the cutting knife. The distance between adjacent photosensitive chips 131 and the width of the divided portion are adjusted. Therefore, when cutting the panel, the cutting knife only cuts the conjoined portion 241 of the chip panel 24 and does not cut the photosensitive chip 131 , thereby avoiding damage to the photosensitive chip 131 during the cutting process.

In a specific example of this application, the height of the conjoined part 241 is lower than the height of the photosensitive chip 131 , the side connecting part 136 formed after the conjoined part 241 is divided is lower than the height of the photosensitive chip 131 , and the side connecting part 136 covers The chip panel 24 cuts at least part of the peripheral side of the photosensitive chip 131 to protect the cut photosensitive chip 131; in another specific example of this application, the height of the conjoined portion 241 is equal to the height of the photosensitive chip 131 , thereby providing a flatter mounting surface for the lens panel 21. The side connecting portion 136 formed after the conjoined portion 241 is divided is equal to the height of the photosensitive chip 131. The side connecting portion 136 covers the photosensitive chip 131 after cutting the chip panel 24. all the peripheral sides; in another specific example of the present application, the height of the conjoined portion 241 is higher than the height of the photosensitive chip 131, and the side connecting portion 136 formed after the conjoined portion 241 is divided is higher than the height of the photosensitive chip 131 The side connecting portion 136 covers the entire peripheral side of the photosensitive chip 131 cut by the chip panel 24 to protect the cut photosensitive chip 131 . The conjoined portion 241 is higher than the photosensitive chip 131, so when the protective layer 22 is disposed above the photosensitive chip 131, the conjoined portion 241 acts as a support to leave a gap between the protective layer 22 and the photosensitive chip 131. That is, when the side connecting portion 136 is higher than the photosensitive chip 131 and when the protective cover 132 is disposed above the photosensitive chip 131, the side connecting portion 136 plays a supporting role to leave a gap between the protective cover 132 and the photosensitive chip 131. .

The aforementioned chip panel 24 with the conjoined portion 241 can also be applied to a variety of lens panels 21 . For example, when the size of the wafer-level lens 11 increases, the distance between two adjacent photosensitive chips 131 facing two adjacent wafer-level lenses 11 also needs to increase accordingly. In this application, a conjoined portion 241 is provided between two adjacent photosensitive chips 131. By adjusting the width of the conjoined portion 241 and thereby adjusting the distance between the two adjacent photosensitive chips 131, the chip panel 24 can be applied Lens panels 21 of different specifications provide greater applicability and flexibility.

Further, the manufacturing method of the chip panel 24 includes the following steps S510-S530:

S510, provide multiple photosensitive chips 131 so that the multiple photosensitive chips 131 are laid in the chip forming mold, wherein the multiple photosensitive chips 131 are 131 are located on the same horizontal plane, and a molding flow channel is provided between two adjacent photosensitive chips 131 . A plurality of photosensitive chips 131 are arranged at intervals, and a gap is left between adjacent photosensitive chips 131 to form a molding flow channel for the flow of molding materials during the molding process.

S520, inject molding material into the chip molding mold so that the molding material can flow in the molding flow channel and fill the entire molding flow channel.

S530 , after the molding material is cooled, a conjoined portion 241 is formed, wherein the conjoined portion 241 covers at least a part of the peripheral side of the photosensitive chip 131 .

Referring further to FIG. 6C , a modified implementation of the camera module 10 of the first embodiment is provided. The photosensitive component 13 also includes a side connecting portion 136. The side connecting portion 136 is integrally formed on the peripheral side of the photosensitive chip 131 to protect the photosensitive chip 131. The lateral size of the side connecting portion 136 is larger than the lateral size of the protective cover 132. The package body 12 is integrally formed on at least a portion of the front surface of the side connecting portion 136 . In this embodiment, the package body 12 covers at least part of the front surface of the side connecting portion 136 . In a specific example, the lateral size of the photosensitive chip 131 is smaller than the lateral size of the protective cover 132 , and the package body 12 is integrally formed on the side connecting portion 136 . The protective cover 132 covers at least a part of the front surface of the side connecting portion 136 . At this time, the portion of the front surface of the side connecting portion 136 that is not covered by the protective cover 132 is covered by the package 12 . The side connecting portion 136 A part of the front side is covered by the package body 12, as shown in FIG. 6C; in another specific example, the lateral size of the photosensitive chip 131 is equal to the lateral size of the protective cover 132, and the package body 12 is integrally formed on the front side of the side connecting portion 136. , the front side of the side connecting portion 136 is entirely covered by the package body 12; in another specific example, the lateral size of the photosensitive chip 131 is larger than the lateral size of the protective cover 132, and the package body 12 is integrally formed on the front side of the side connecting portion 136. The entire front surface of the connecting portion 136 is covered by the package 12 , and a part of the front surface of the photosensitive chip 131 is covered by the package 12 .

9A to 10 illustrate the second embodiment of the camera module 10 of the present application. The camera module 10 includes a wafer-level lens 11, a package 12 and a photosensitive component 13. The wafer-level lens 11 is provided On the photosensitive path of the photosensitive component 13 , the package 12 is disposed on the peripheral side of the wafer-level lens 11 and the photosensitive component 13 to protect the peripheral sides of the wafer-level lens 11 and the photosensitive component 13 .

Different from the first embodiment of the camera module 10 shown in FIGS. 6A to 6D , in the second embodiment of the camera module 10 of the present application shown in FIG. 9A , the package 12 not only covers the wafer The package 12 also covers the peripheral side of the wafer-level lens 11 and the protective cover 132 and the peripheral side of the photosensitive chip 131. The package 12 is integrally formed on the peripheral side of the wafer-level lens 11 and the photosensitive component 13, making the wafer-level lens 11 and the photosensitive component 13 are all covered by the package 12, which can further protect the peripheral side of the photosensitive chip 131. The lateral size of the photosensitive chip 131 may be greater than, less than, or equal to the lateral size of the protective cover 132 . The specific size is determined by the cutting requirements during the cutting process of the camera module 10 . In the second embodiment of the camera module 10 of the present application, the package 12 may also be a glue package or a molded package formed by glue or molding material.

The package 12 includes an upper package 121 and a lower package 122. The upper package 121 is integrally formed on the peripheral sides of the wafer-level lens 11 and the protective cover 132 and covers the peripheral sides of the wafer-level lens 11 and the protective cover 132. The lower package 122 is integrally formed on the peripheral side of the photosensitive chip 131 and covers the peripheral side of the photosensitive chip 131. The upper package 121 and the lower package 122 are connected and fixed to each other. Specifically, the package body 12 is formed through two solidification processes, and the lower package body 122 is integrally formed on the bottom surface of the upper package body 121 to form the package body 12 .

In one example of this embodiment, the lateral size of the protective cover 132 is smaller than the lateral size of the photosensitive chip 131 , and the upper package 121 is integrally formed on the peripheral side of the wafer-level lens, the peripheral side of the protective cover and the front side of the photosensitive chip. At least part of the lower package body 122 is integrally formed on the bottom surface of the upper package body 121 and the peripheral side of the photosensitive chip; in another example, the lateral size of the protective cover 132 is equal to the lateral size of the photosensitive chip 131, and the upper package body 121 is integrally formed Molded on the peripheral side of the wafer-level lens and the peripheral side of the protective cover, the lower package 122 is integrally formed on the bottom surface of the upper package 121 and the peripheral side of the photosensitive chip; in another example, the lateral dimensions of the protective cover 132 Larger than the lateral size of the photosensitive chip 131, the upper package 121 is integrally formed on the peripheral side of the wafer-level lens and the protective cover, and the lower package 122 is integrally formed on the bottom surface of the upper package 121 and the protective cover 132. at least a portion of the photosensitive chip and the peripheral side of the photosensitive chip.

Continuing to refer to FIGS. 9B to 9C , the photosensitive component 13 further includes a side connecting portion 136 integrally formed on the peripheral side of the photosensitive chip 131 , and the lower package body 122 of the package 12 is integrally formed on the peripheral side of the side connecting portion 136 so that the lower The package body 122 is indirectly integrally formed around the photosensitive chip 131 side. In this embodiment, the protective cover 132 covers at least part of the front surface of the side connecting portion 136 , and the lower package body 122 covers the peripheral side of the side connecting portion 136 . The lateral size of the photosensitive chip 131 is smaller than the lateral size of the protective cover 132, so that the photosensitive chip 131 will not be damaged during the cutting process of the protective cover.

As shown in Figure 9B, in a specific example of this embodiment, the lateral size of the side connecting portion 136 is equal to the lateral size of the protective cover 132, and the outer side of the side connecting portion 136 is flush with the outer side of the protective cover 132; In another specific example of this embodiment, the lateral size of the side connecting portion 136 is smaller than the lateral size of the protective cover 132 , and the lower package body 122 is integrally formed on at least a portion of the bottom surface of the protective cover 132 and covers the protective cover 132 At least a part of the bottom surface of this embodiment; in another specific example of this embodiment, as shown in FIG. 9C , the lateral size of the side connecting portion 136 is larger than the lateral size of the protective cover 132, and the side connecting portion 136 protrudes from the protective cover 132, The upper package body 121 covers a part of the front surface of the side connecting portion 136 .

Further, a method of manufacturing the camera module 10 in the second embodiment is provided. Referring to FIG. 10 , the manufacturing method of the camera module 10 includes the following steps S610-S650:

Step S610 , stack and fix a lens panel 21 , a protective layer 22 and a chip panel 24 along the height direction to form a module panel 20 . As shown in Figure 10, the module panel 20 includes a lens panel 21, a protective layer 22 and a chip panel 24 along the height direction. The lens panel 21, the protective layer 22 and the chip panel 24 are aligned along the height direction. The lens panel 21, the protective layer 22 and the chip panel 24 are aligned along the height direction. An adhesive layer is disposed between the plate 21 and the protective layer 22 to bond and fix the lens panel 21 and the protective layer 22. An adhesive layer is disposed between the protective layer 22 and the chip panel 24 to bond and fix the protective layer 22 and the chip. The materials of the adhesive layers at two positions of the panel 24 can be the same or different, and this embodiment is not limited thereto.

Step S620, divide the lens panel 21 and the protective layer 22 in the module panel 20 along the height direction to form multiple wafer-level lenses 11 and multiple protective covers 132. Two adjacent wafer-level lenses 11 and An upper dividing groove 26 is formed between two adjacent protective cover plates 132 . The module panel 20 is divided along the height direction from the object side to the image side, and the lens panel 21 and the protective layer 22 are divided to expose the chip panel 24 to form a plurality of upper dividing grooves 26. The upper dividing grooves 26 are formed in adjacent Between the two wafer-level lenses 11 and the two adjacent protective covers 132, the bottom surface of the upper dividing groove 26 is the chip panel 24, and the side surfaces of the upper dividing groove 26 are the wafer-level lenses 11 and the protective covers. 132.

Step S630: Fill the upper dividing groove 26 with a first packaging material, and solidify the first packaging material to form an upper packaging conjoined portion 231. The first packaging material fills the upper dividing groove 26 and connects two adjacent wafer-level lenses 11 and two adjacent protective covers 132 .

Step S640: Divide the chip panel 24 in the module panel 20 along the height direction to form multiple independent photosensitive chips 131, and form a dividing groove 27 between two adjacent photosensitive chips 131. The module panel 20 is divided along the height direction from the image side to the object side, and the chip panel 24 is divided to expose the solidified upper package conjoined portion 231 in the upper dividing groove 26 to form a plurality of lower dividing grooves 27 . Formed between two adjacent photosensitive chips 131 , the bottom surface of the lower dividing groove 27 is the upper package conjoined part 231 solidified in the upper dividing groove 26 , and the side surface of the lower dividing groove 27 is the photosensitive chip 131 .

Step S650, the second packaging material is filled into the downward dividing groove 27, and the second packaging material is cured to form a lower packaging conjoined part (not shown in the drawings). The lower package conjoined part is integrally molded on the upper package conjoined part 231 to form a Encapsulate the joint part 23 . The second packaging material fills the lower dividing groove 27 and connects the two adjacent photosensitive chips 131 and the upper packaging connecting part 231 located in the upper dividing groove 26. The lower packaging connecting part is integrally formed on the bottom surface and the upper packaging connecting part 231. A package connected portion 23 is formed on the peripheral side of the photosensitive chip 131. In other words, in this embodiment, the package connected portion 23 is formed through two solidifications. The first packaging material provided in the upper dividing groove 26 and the second packaging material provided in the lower dividing groove 27 may be the same or different, depending on design requirements.

Step S660: Divide the module panel 20 along the height direction to form multiple camera modules 10. Multiple camera modules 10 are formed by dividing the packaged conjoined portion 23 along the height direction, and the packaged bodies 12 of the plurality of camera modules 10 are formed after the packaged conjoined portion 23 is divided.

In this embodiment, the lens panel 21 and the protective layer 22 in the module panel 20 are divided in step S620, the chip panel 24 in the module panel 20 is divided in step S640, and the module panel 20 is divided in step S660. Three different division methods, two different division methods, or the same division method can be used for division. The width of division in the three steps can also be different, and this application is not limited by this.

Compared with the camera module 10 in the first embodiment, in this embodiment, the peripheral side of the photosensitive chip 131 of the camera module 10 obtained by the above method is also covered by the package 12, thereby providing a more complete The protection reduces the possibility of damage to the photosensitive chip 131 of the camera module 10 during impact.

In an example of this embodiment, the manufacturing method of the camera module 10 in the second embodiment further includes step S670: setting the electrical connection portion 133 on the back of the photosensitive chip 131. In a specific example, step S670 may be located between step S630 and step S640, so that the electrical connection portions 133 can be provided in batches on the back surfaces of the plurality of photosensitive chips 131 in the chip panel 24, and at the same time, the electrical connection portions 133 can be set. Not affected by the splitting of the chip panel 24 and the cured upper package conjoined portion 231 , the process of splitting the chip panel 24 and curing the first packaging material may cause the flatness of the backside of the chip to decrease; in another specific example, step S670 may be located between step S650 and step S660. After the second encapsulation material is cured, the electrical connection part 133 is provided on the back of the photosensitive chip 131, so that the back of multiple photosensitive chips 131 in the module panel 20 can be batched. Providing the electrical connection part 133 is efficient and can prevent damage to the electrical connection part 133 caused by the process of dividing the module panel 20 into multiple independent camera modules 10; in another specific example, step S670 may be located in step S660. After that, the module panel 20 is first divided along the height direction. After the division is completed, the electrical connection part 133 is provided on the back of the photosensitive chip 131 of the independent camera module 10. This can avoid damage to the electrical connection part 133 caused by the division. .

Similar to the manufacturing method of the camera module 10 in the first embodiment, in an example of this embodiment, the manufacturing method of the camera module 10 further includes a step of setting the circuit board 135 and a step of setting the light shield 113 . The circuit board 135 setting step is performed after step S660, that is, after the division of the module panel 20 is completed. In a specific example, the step of setting the light shielding portion 113 on the object side of the wafer-level lens 11 can be performed after step S660 is completed, that is, after the segmentation of the module panel 20 is completed; in another specific example, In an example, the step of setting the light-shielding portion 113 can also be performed in step 630. For example, the light-shielding portion 113 can be formed on the object side of the wafer-level lens 11 through packaging materials; in a specific example, the light-shielding portion 113 can also be formed on the lens panel. 21 is formed directly during the manufacturing process.

Similar to the manufacturing method of the camera module 10 in the first embodiment, in an example of this embodiment, in step S610, a filter element 14 is further provided, so that the filter element 14 is disposed at the wafer level. Between the lens 11 and the protective layer 22, the filter element 14 realizes the infrared cutoff function. Due to the arrangement of the filter element 14, in step S620, the filter element 14 is also divided. In step S630, the first packaging material is solidified, and the upper packaging conjoined portion 231 is integrally formed on the wafer-level lens 11, The filter element 14 and the peripheral side of the protective cover 132 .

Similar to the manufacturing method of the camera module 10 in the first embodiment, in an example of this embodiment, in step S630 and step S650, the packaging material filled in the upper dividing groove 26 and/or the lower dividing groove 27 is (The first encapsulation material and the second encapsulation material) are liquid encapsulation materials. After the liquid encapsulation materials are solidified, the encapsulation connected part 23 is finally formed. With the fluidity of the liquid encapsulation material, the encapsulation material (the first encapsulation material and the second encapsulation material) can fully contact the peripheral sides of the wafer-level lens 11, the protective cover 132 and the photosensitive chip 131. After the liquid encapsulation material is cured, The formed package conjoined portion 23 can also completely cover the peripheral sides of the wafer-level lens 11 , the protective cover 132 and the photosensitive chip 131 .

The packaging material may be glue or molding material, and the first packaging material and the second packaging material provided in the upper dividing groove 26 and the lower dividing groove 27 may be the same or different, that is, the first packaging material and the second packaging material provided in the upper dividing groove 26 and the lower dividing groove 27 may be The first packaging material and the second packaging material in the lower dividing groove 27 are both glue, so that the finally formed packaging joint part 23 is composed of cured glue; or the packaging materials provided in the upper dividing groove 26 and the lower dividing groove 27 can be Both the first encapsulating material and the second encapsulating material are molding materials, so that the finally formed encapsulating conjoined part 23 is composed of cured molding material; or the first encapsulating material disposed in the upper dividing groove 26 can be made of molding material. material, the second packaging material disposed in the lower dividing groove 27 is glue, and the finally formed packaging connected part 23 is formed by solidifying the upper molding material to form the upper packaging connected part 231 and the lower glue. It is composed of a lower package connected part; or the first packaging material provided in the upper dividing groove 26 can be glue, and the second packaging material provided in the lower dividing groove 27 can be a molding material, so that the final formed package The conjoined part 23 is composed of an upper package conjoined part 231 formed by curing glue and a lower package conjoined part 231 formed by curing molding material below. Different packaging materials can be selected according to the width and depth of the upper dividing groove 26 and the lower dividing groove 27 formed by the divided module panel 20, for example, for the upper dividing groove 26 or the lower dividing groove 27 with a deeper depth or a narrower width. Choose a packaging material with better fluidity, and use a packaging material with poor fluidity for the upper dividing groove 26 or the lower dividing groove 27 with a shallow depth or a wide width, so that the first packaging material and the second packaging material are Different materials.

Similar to the manufacturing method of the camera module 10 in the first embodiment, in an example of this embodiment, the chip panel 24 uses the chip panel 24 as shown in FIGS. 7A and 7b so that the photosensitive chip 131 The distance between them can be adjusted again after the chip manufacturing is completed. The chip panel 24 includes a plurality of photosensitive chips 131 and a conjoined portion 241 disposed between the plurality of photosensitive chips 131. The conjoined portion 241 is integrally formed on the two phases. between adjacent photosensitive chips 131 . Finally, the camera module 10 manufactured using the chip panel 24 with the conjoined portion 241 is shown in FIGS. 9B and 9C . The peripheral side of the photosensitive chip 131 is covered by the side connecting portion 136 , and the peripheral side of the side connecting portion 136 is covered by the side connecting portion 136 . The package body 12 covers, and the package body 12 indirectly covers the circumferential side of the photosensitive chip 131 by covering the circumferential side of the side connecting portion 136 . Specifically, the lower package body in the package body 12 covers the circumferential side of the side connecting portion 136 . The side indirectly covers the peripheral side of the photosensitive chip 131 .

In the first embodiment or the second embodiment of the aforementioned camera module 10, the lens panel 21 and the chip panel 24 are used to manufacture the camera module 10, which requires full consideration of the lens panel 21 and the chip panel 24. The fit between them requires multiple cuts. This application further provides a more convenient manufacturing method and the camera module 10 manufactured by this method. Among them, Figures 11A to 11C show the third embodiment of the camera module 10 of the present application. The camera module 10 uses the COB (Chip On Board) process to manufacture the photosensitive component 13. As shown in the figure, the camera module 10 The group 10 includes a wafer-level lens 11, a photosensitive component 13 and a package 12. The wafer-level lens 11 is disposed on the photosensitive path of the photosensitive component 13, and the package 12 is integrally formed between the wafer-level lens 11 and the photosensitive component 13. The photosensitive component 13 , that is, the package 12 is integrally connected to the wafer-level lens 11 and the photosensitive component 13 .

The photosensitive component 13 includes a circuit board 135 and a photosensitive chip 131 that is electrically connected to the circuit board 135. The photosensitive chip 131 is fixed to the circuit board 135. In a specific example of this application, the back side of the photosensitive chip 131 is bonded to the main body of the circuit board. 1351, so that the photosensitive chip 131 is disposed on the circuit board 135.

Further, the photosensitive component 13 also includes at least one lead 137. At least one lead 137 is combined between the photosensitive chip 131 and the circuit board 135 main board for electrically connecting the photosensitive chip 131 and the circuit board 135 main board. At least one lead 137 can be implemented But not limited to gold wire, copper wire, aluminum wire, silver wire, etc.

In this embodiment, the electrical connection part 133 is disposed in the non-photosensitive area on the front side of the photosensitive chip 131, and the lead 137 electrically connects the circuit board main body 1351 and the electrical connection part 133 to realize the connection between the circuit board main body 1351 and the photosensitive chip 131. The electrical circuit is conducted, wherein the electrical connection 133 may be implemented as a plurality of pads. Specifically, the lead 137 electrically connects the pad on the circuit board body 1351 and the electrical connection portion 133 of the photosensitive chip 131 to achieve electrical connection.

More specifically, the lateral size of the photosensitive chip 131 is no larger than the lateral size of the circuit board main body 1351, that is, along the height direction, the projection of the photosensitive chip 131 falls in the projection of the circuit board main body 1351, so that the structure of the photosensitive component 13 is more compact. Avoid increasing the lateral size of the photosensitive element 13 .

In a specific example of this embodiment, the lateral size of the photosensitive chip 131 is smaller than the lateral size of the circuit board main body 1351 , that is, the photosensitive chip 131 does not completely cover the front side of the circuit board main body 1351 , and the front side of the circuit board main body 1351 is exposed. It can also be said that , the outermost projection of the photosensitive chip 131 in the height direction is located inside the outermost projection of the circuit board body 1351 . One end of the lead 137 is disposed on the front of the photosensitive chip 131, and the other end of the lead 137 is disposed on the front of the circuit board body 1351. This arrangement can leave enough space for the lead 137 to prevent the lead 137 from being bent and damaged.

In another specific example of this embodiment, the lateral size of the photosensitive chip 131 is equal to the lateral size of the circuit board main body 1351 , that is, the photosensitive chip 131 completely covers the front side of the circuit board main body 1351 . It can also be said that the photosensitive chip 131 extends along the height direction. The outermost projection overlaps with the outermost projection of the circuit board body 1351 . One end of the lead 137 is set on the front of the photosensitive chip 131, and the other end of the lead 137 is set on the side or back of the circuit board body 1351. This arrangement can reduce the lateral size of the circuit board 135 and avoid increasing the lateral size of the photosensitive component 13. .

In an example of this embodiment, the wafer-level lens 11 is disposed on the photosensitive chip 131 , the lateral size of the wafer-level lens 11 is smaller than the lateral size of the photosensitive chip 131 , and the wafer-level lens 11 is fixed on the photosensitive chip 131 through the support 112 The non-photosensitive area of chip 131 is fixed in a manner Set on the front side of the photosensitive chip 131. In another example of this embodiment, the camera module 10 further includes a filter element 14. The filter element 14 is disposed between the wafer-level lens 11 and the photosensitive component 13. The filter element 14 is fixed to the photosensitive chip. On the front side of 131, the wafer-level lens 11 is fixed on the object side of the filter element 14, so that the wafer-level lens 11 is indirectly fixed on the front side of the photosensitive chip 131; in another embodiment of the present application, the filter element 14 Designed to be smaller, the non-photosensitive area of the photosensitive chip 131 still leaves a certain area for fixing the wafer-level lens 11; in another embodiment of the present application, the wafer-level lens 11 has an infrared cutoff function as mentioned above. , the camera module 10 directly eliminates the filter element, thereby reducing the height of the camera module 10 .

Continuing to refer to FIGS. 11A to 11C , the package 12 is integrally formed on the wafer-level lens 11 , the photosensitive chip 131 and the circuit board main body 1351 . The package 12 covers at least part of the circuit board main body 1351 , at least part of the photosensitive chip 131 , and At least a part of the wafer-level lens 11. In a specific example, the package 12 covers at least a part of the front surface of the circuit board body 1351, the peripheral side of the photosensitive chip 131 and at least a part of the non-photosensitive area of the front surface of the photosensitive chip 131, and the peripheral side of the wafer-level lens 11 .

It can be understood that the package body 12, the circuit board body 1351, the photosensitive chip 131 and the wafer-level lens 11 are integrated to enhance the structural strength of the camera module 10, making the camera module 10 more compact and miniaturized.

The package 12 extends in the horizontal direction between the non-photosensitive area of the photosensitive chip 131 and the circuit board main body 1351, thereby packaging the photosensitive chip 131 in the circuit board main body 1351. The package 12 extends in the height direction on the peripheral side of the wafer-level lens 11, Therefore, the wafer-level lens 11 is packaged in the photosensitive chip 131, which on the one hand increases the structural strength of the camera module 10, and on the other hand makes the camera module 10 more compact in structure and smaller in lateral size.

Further, the package 12 surrounds the outside of the photosensitive chip 131 and the outside of the wafer-level lens 11. In particular, the package 12 is integrally closed and connected, so that it has good sealing performance, so that the photosensitive chip 131 is in a closed space. within to prevent the photosensitive chip 131 from being contaminated and affecting the imaging effect.

In one example of this embodiment, the package 12 has a vertical outer side, and the lateral size of the upper part of the package 12 is equal to the lateral size of the bottom of the package 12, as shown in FIGS. 11A and 11B; in this embodiment In another example, as shown in FIG. 11C , the outer side of the package 12 is inclined, the outer diameter of the package 12 increases from top to bottom, and the lateral dimension of the bottom of the package 12 is larger than that of the upper part of the package 12 . The lateral size provides enough space for the leads 137 to avoid backlog of the leads 137 and damage to the leads 137 during the molding process of the package 12. At the same time, it provides a smaller head for the camera module 10, so that The camera module 10 is suitable for installation in smaller spaces. The bottom of the package 12 refers to the part of the package 12 located on the side of the photosensitive chip 131 , and the upper part of the package 12 refers to the part located on the side of the wafer-level lens 11 .

Further, the electrical connection portion 133 on the photosensitive chip 131, the pad on the circuit board body 1351 and at least one lead 137 are all wrapped by the package 12. The lead 137 is wrapped by the package 12, and the lead 137 is embedded in the package 12. , so that the lead wire 137 will not be directly exposed to the outside, so that the lead wire 137 will not be easily interfered by external factors, causing problems such as deformation and damage.

Specifically, the peripheral side of the light shielding portion 113 of the wafer-level lens 11 is also covered by the package 12 . As shown in FIG. 11A , the top surface of the package 12 is flush with the plane of the light shielding portion 113 . In another example of this embodiment, the light shielding portion 113 is disposed on the wafer level lens 11 after the package 12 is integrally formed on the peripheral side of the wafer level lens 11 . As shown in FIGS. 11B and 11C , the light shielding portion 113 Being fixed on the top surface of the package 12, the light-shielding portion 113 extends toward the direction of the wafer-level lens 11 to play a light-shielding role. In a specific example, the wafer-level lens assembly 111 of the wafer-level lens 11 is located in the object. The peripheral side of the object side of the first wafer-level lens 1111 is flush with the top surface of the package 12, so that the light-shielding portion 113 can also be fixed to the wafer-level lens assembly 111; in another specific example, the wafer-level lens assembly 111 is In the wafer-level lens assembly 111 of the round-level lens 11, the peripheral side of the object side of the first wafer-level lens 1111 located on the object side is lower than the top surface of the package 12, so that the light shielding portion 113 and the wafer-level lens assembly There is a gap between 111. In another example of this embodiment, the light-shielding portion 113 of the wafer-level lens 11 can be formed while the package body 12 is integrally formed on the side of the wafer-level lens 11 . Specifically, the package body 12 covers the wafer-level lens 11 At least a part of the top surface of the wafer-level lens 11 forms a light-shielding portion 113 , and the light-shielding portion 113 and the package 12 are integrally formed on the top surface and peripheral sides of the wafer-level lens 11 .

In this embodiment, the material of the package 12 can be a molding material, thereby forming a molded package. The package 12 is integrally formed on the wafer-level lens 11, the photosensitive chip 131 and the circuit board main body 1351 through a molding process. The plastic process requires the use of forming molds, which are suitable for making flatter surfaces. The photosensitive chip 131 is moldedly connected to the circuit board body 1351, and the wafer-level lens 11 is moldedly connected to the photosensitive chip 131. In particular, the package 12 is molded on the photosensitive chip 131 (Molding on Chip, MOC). Molded on the photosensitive element 13.

In other implementations of this embodiment, the material of the package 12 may also be glue, thereby forming a glue package.

In an example of this embodiment, the circuit board 135 includes a circuit board body 1351, a connecting strip 1352 and a connecting plate 1353. The photosensitive chip 131 is electrically connected to the circuit board body 1351, and the connecting strip 1352 connects and electrically conducts the circuit board body 1351 and the connection plate 1353. Board 1353, as shown in Figure 11A and Figure 11C; in another example of this embodiment, the circuit board 135 includes a circuit board body 1351 and a pad disposed on the back of the circuit board 135, as shown in Figure 11B, a photosensitive chip 131 is disposed on the front of the circuit board main body 1351. The circuit board 135 is electrically connected to external electronic devices through the pads on the back of the circuit board 135. The soldering pads on the back of the circuit board main body 1351 can also be replaced with solder balls or other electrical devices. Connect the media.

Further, a manufacturing method of the camera module 10 in the third embodiment is provided: a circuit board 135 is provided, the circuit board 135 includes a circuit board main body 1351, a photosensitive chip 131 is disposed on the circuit board main body 1351, and through the leads 137 The photosensitive chip 131 and the circuit board main body 1351 are electrically connected; the wafer level lens 11 is placed above the photosensitive chip 131; the package 12 is set to cover the wafer level lens 11, the photosensitive chip 131 and the circuit board main body 1351.

In an example of this embodiment, the wafer-level lens 11 can also be fixed above the photosensitive chip 131 first, and then electrically connect the photosensitive chip 131 and the circuit board main body 1351 through the lead 137, so as to avoid the need for wafer-level lens 131. The setting process of 11 causes damage to lead 137. The method of setting the lead 137 first and then setting the wafer-level lens 11 can prevent the installation of the lead 137 from being hindered by the presence of the wafer-level lens 11, for example, due to the equipment setting the lead 137 interfering with the wafer-level lens 11. Interference causes the wafer-level lens 11 to be impacted.

In an example of this embodiment, a step of setting a light shielding portion 113 may also be included: setting a light shielding portion 113 on the object side of the camera module 10 to prevent stray light from entering the interior of the camera module 10 .

In the above method of this embodiment, the package body 12 is provided through a molding process, for example, the package body 12 is formed through a molding process (Molding) or an insert molding process (Insert Molding). Specifically, the circuit board main body 1351, the photosensitive chip 131 and the wafer-level lens 11 are placed in a molding mold, the molding material is filled into the molding mold, and then the molding material is solidified to form the package body 12. The package 12 wraps the circuit board body 1351 , the non-photosensitive area of the photosensitive chip 131 and the peripheral side of the wafer level lens 11 , so that the lens package 12 , the circuit board body 1351 , the photosensitive chip 131 and the wafer level lens 11 are integrated. Among them, the molding materials can be resin, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc.

It is worth mentioning that the camera module 10 in the third embodiment can also be mass-manufactured by panel assembly. A method of manufacturing the camera module 10 in the third embodiment is provided. Referring to FIG. 12 , the method of manufacturing the camera module 10 includes the following steps S710-S750:

Step S710: Provide a circuit board panel 28. The circuit board panel 28 includes a plurality of connected circuit boards 135 . The circuit boards 135 include a circuit board main body 1351 . The circuit boards 135 can be connected through the connection between the circuit board main bodies 1351 .

In step S720, multiple photosensitive chips 131 are arranged on the circuit board panel 28, and the multiple photosensitive chips 131 are electrically connected to the circuit board panel 28. Among them, a plurality of photosensitive chips 131 are electrically connected to the circuit board panel 28 through leads 137 . Specifically, the plurality of photosensitive chips 131 are respectively fixed on the plurality of circuit board bodies 1351 in the circuit board panel 28 , and the plurality of photosensitive chips 131 and the plurality of circuit board bodies 1351 are electrically connected through the leads 137 .

In step S730, the plurality of wafer-level lenses 11 are respectively arranged on the plurality of photosensitive chips 131, so that the plurality of wafer-level lenses 11 are respectively located on the photosensitive paths of the plurality of photosensitive chips 131. In one example, the plurality of wafer-level lenses 11 are respectively fixed to the non-photosensitive areas of the plurality of photosensitive chips 131 through adhesive media.

Step S740: Fill the space between the two adjacent wafer-level lenses 11 and the two adjacent photosensitive chips 131 with packaging material, and solidify the packaging material to form a packaging conjoined part 23. The packaging conjoined part 23 is integrated with the wafer. The lens 11, the photosensitive chip 131 and the circuit board panel 28 form a module panel 20. In this embodiment, the packaging material may be a liquid packaging material. The packaging material covers the wafer-level lens 11, the photosensitive chip 131 and the circuit board panel 28, and is integrated with the wafer-level lens 11, the photosensitive chip 131 and the circuit board panel 28 after solidification. Circuit board puzzle 28.

Step S750: Divide the module panel 20 along the height direction to form multiple camera modules 10. The package conjoined part 23 and the circuit board panel 28 are divided along the height direction to obtain multiple independent camera modules 10. The package conjoined part 23 is divided to form a plurality of independent packages 12, and the circuit board panel 28 is divided. Finally, multiple independent circuit boards 135 are formed. Among them, the dotted line shown in Figure 12 is the position of division.

In one example of this embodiment, the packaging material is a molding material, and the packaging conjoined portion 23 is integrated with the wafer-level lens 11 , the photosensitive chip 131 and the circuit board panel 28 through a molding process. Specifically, in step S740, the circuit board panel 28, the plurality of photosensitive chips 131 fixed on the circuit board panel 28, and the plurality of wafer-level lenses 11 respectively fixed on the plurality of photosensitive chips 131 are placed. In the molding mold, the molding material is injected into the molding mold, and the molding material solidifies to form the encapsulating conjoined part 23. The encapsulating conjoined part 23 is integrated with the wafer-level lens 11, the photosensitive chip 131 and the circuit board assembly. The panels 28 form a modular panel 20 . The package 12 obtained by curing and cutting the packaging material composed of the molding material may be called a molded package.

In an example of this embodiment, step S740 may further include the step of setting a light-shielding layer 213 on the object side of the module panel 20, so that after the module panel 20 is divided, a light-shielding layer 213 including the light-shielding portion 113 can be obtained. In the camera module 10, the light shielding layer 213 is divided into a plurality of independent light shielding portions 113.

In an example of this embodiment, the plurality of wafer-level lenses 11 provided in step S730 include light-shielding portions 113 , and the light-shielding portions 113 are disposed on the object side of the wafer-level lens assembly 111 .

It is worth mentioning that there is no sequence or correlation between steps S710, S720 and S730. For example, the wafer-level lens 11 can be fixed on the non-photosensitive area of the photosensitive chip 131 first, and then the photosensitive chip can be 131 is fixed on the circuit board panel 28 to form a semi-finished product integrating the circuit board panel 28, the photosensitive chip 131 and the wafer level lens 11.

Further, as shown in Figures 13 and 14, a fourth embodiment of the camera module 10 of the present application is provided. In this embodiment, a cover layer 29 is further introduced as a basis for manufacturing the module panel 20 , and a single wafer-level lens 11 and a single photosensitive component 13 are flipped onto the cover layer 29 . The manufacturing method is the same as that described above. The first, second and third embodiments of the camera module 10 are all different. It is not necessary to specifically adjust the distance between the multiple wafer-level lenses 11 in the lens panel 21, nor to specifically adjust the chip. The distance between the plurality of photosensitive chips 131 in the panel 24 is suitable for reducing the manufacturing cost.

Figure 13 shows a schematic structural diagram of the fourth embodiment of the camera module 10 of the present application. As shown in the figure, the camera module 10 includes a wafer-level lens 11, a photosensitive component 13, a package 12 and a The light-transmitting cover 15 and the wafer-level lens 11 are arranged on the photosensitive path of the photosensitive component 13. The light-transmitting cover 15 is arranged on the top surface (object side) of the wafer-level lens 11. The package 12 is integrated with the transparent cover 15. Optical cover 15, wafer-level lens 11 and photosensitive component 13.

The photosensitive component 13 includes a photosensitive chip 131 and an electrical connection part 133 provided on the photosensitive chip 131. The photosensitive chip 131 is electrically connected to an external electronic device through the electrical connection part 133. In a specific example, the photosensitive component 13 further includes a protective cover 132. The electrical connection portion 133 is provided on the back of the photosensitive chip 131. The protective cover 132 is covered on the photosensitive chip 131. The protective cover 132 is provided on the photosensitive chip 131. The top of the chip 131 is used to protect the photosensitive chip 131. That is, in this specific example, the photosensitive chip 131 is packaged in a wafer-level CSP. The photosensitive chip 131 is disposed between the protective cover 132 and the electrical connection part 133. The protective cover The board 132 and the electrical connection portion 133 are disposed oppositely on both sides of the photosensitive chip 131 . In this specific example, the wafer-level lens 11 is fixed to the protective cover 132 of the photosensitive component 13 so as to be disposed on the photosensitive path of the photosensitive component 13 . The wafer-level lens 11 is fixed to the photosensitive component 13 . In other examples of this embodiment, the photosensitive chip 131 can also be packaged using the COB process. The photosensitive component 13 includes a circuit board 135 , a photosensitive chip 131 electrically connected to the circuit board 135 , and a non-conductor chip disposed on the front side of the photosensitive chip 131 . The electrical connection part 133 of the photosensitive area and at least one lead 137 for electrically connecting the photosensitive chip 131 and the circuit board 135, The lead 137 electrically connects the circuit board 135 and the electrical connection portion 133 to electrically conduct the photosensitive chip 131 and the circuit board 135 .

The light-transmitting cover 15 is fixed on the top surface of the wafer-level lens 11. The light-transmitting cover 15 is flat-shaped, and the image side of the light-transmitting cover 15 is flat. In an example of this embodiment, the wafer-level lens The top surface of 11 is flat, so that the light-transmitting cover 15 can be stably attached to the top surface of the wafer-level lens 11 . Specifically, the wafer-level lens 11 includes a first wafer-level lens 1114, a second wafer-level lens 1115, and a third wafer-level lens 1116, wherein the first wafer-level lens 1114, the second wafer-level lens 1115 and the third wafer-level lens 1116. Each of the three wafer-level lenses 1111 includes a light-transmitting substrate 11111 and a lens unit 11112 disposed on one side of the light-transmitting substrate 11111. The lens unit 11112 of the first wafer-level lens 1114 is located on On the image side of the light-transmitting substrate 11111, the lens unit 11112 of the second wafer-level lens 1115 is located on the object side of the light-transmitting substrate 11111, and the lens unit 11112 of the third wafer-level lens 1116 is located on the image side of the light-transmitting substrate 11111. The first wafer-level lens 1114 and the second wafer-level lens 1115 are fixed so that the lens unit 11112 of the first wafer-level lens 1114 faces the lens unit 11112 of the second wafer-level lens 1115. 1115 and the third wafer-level lens 1116 are fixed to each other and the lens unit 11112 of the second wafer-level lens 1115 is opposite to the lens unit 11112 of the third wafer-level lens 1116, wherein the second wafer-level lens 1115 and the third wafer-level lens 1116 are fixed to each other. The wafer-level lens 1116 is fixed by bonding between the light-transmitting substrates 11111. In this embodiment, the fixation between the first wafer-level lens 1114, the second wafer-level lens 1115 and the third wafer-level lens 1116 can be completed by an adhesive layer disposed therebetween, wherein the second wafer-level lens 1116 is disposed on the second wafer-level lens 1116. The adhesive layer 1112 provided between the light-transmitting substrate 11111 of the circular-level lens 1115 and the light-transmitting substrate 11111 of the third wafer-level lens 1116 may be formed of optical glue. The first wafer level lens 1114, the second wafer level lens 1115, and the third wafer level lens 1116 form the wafer level lens assembly 111 described herein.

The light-transmitting cover 15 can be made of light-transmitting material such as glass, and the light-transmitting cover 15 is suitable for transmitting light. In this embodiment, the lateral size of the light-transmitting cover 15 is larger than the lateral size of the wafer-level lens 11 and the photosensitive component 13 , so that along the height direction, from the image side (bottom) of the camera module 10 to the object side (top) See, the light-transmitting cover 15 is exposed, so when the package 12 is installed in the camera module 10 , the package 12 is integrally formed on a part of the bottom surface (image side) of the light-transmitting cover 15 and the periphery of the wafer-level lens 11 side and the peripheral side of the photosensitive element 13 . The package 12 provides circumferential protection for the wafer-level lens 11 and the photosensitive component 13 .

In this embodiment, the camera module 10 may further have an infrared cutoff function. Specifically, the light-transmitting cover 15 can be used as a filter element of the camera module 10 by providing the light-transmitting cover 15 with an infrared cutoff function to filter out incident light such as infrared light and other unwanted stray light for imaging; or, The light-transmitting substrate 11111 of any wafer-level lens 1111 in the wafer-level lens 11 can be made to have an infrared cut-off function, so that the wafer-level lens 11 has an infrared cut-off function, thereby filtering the imaging light entering the photosensitive chip 131; Alternatively, the protective cover 132 in the photosensitive assembly 13 can be provided with an infrared cutoff function, that is, the protective cover 132 can be used as a filter element, so that the protective cover 132 can filter the imaging light entering the photosensitive chip 131; or, the protective cover 132 can be used as a filter element. A filter element 14 is further added. The filter element 14 has an infrared cutoff function. In a specific example, the filter element 14 is disposed above the protective cover 132 so that the filter element 14 is located on the photosensitive path of the photosensitive chip 131 .

Furthermore, the camera module 10 further includes a light-shielding portion 113 , which is used to reduce stray light incident from the object side of the wafer-level lens 11 . The light-shielding portion 113 is disposed between the wafer-level lens 11 and the light-transmitting cover 15 . The light-shielding portion 113 can be the first wafer-level lens preformed on the wafer-level lens 11 by silk printing, ink coating, or glue coating. On the object side of 1114 or the image side of the protective cover 132 , the light-shielding portion 113 can also be pre-formed and then disposed between the wafer-level lens 11 and the light-transmitting cover 15 .

In this embodiment, the camera module 10 can be constructed by stacking a single wafer-level lens 11 and a single photosensitive component 13 on the protective cover 132 and integrating the package 12 with the protective cover 132 and the wafer-level lens 13 . The optical lens and the photosensitive component 13 are formed; the camera module 10 can also be manufactured in batches using a panelization method.

Referring to FIG. 14 , the manufacturing method of the fourth embodiment of the camera module 10 manufactured in batches using the panelization method includes the following steps S810-S830:

Step S810, provide a cover layer 29, multiple wafer-level lenses 11 and multiple photosensitive components 13, stack and fix the multiple wafer-level lenses 11 and multiple photosensitive components 13 on the cover layer 29 along the height direction, To form a module panel 20 , a plurality of wafer-level lenses 11 and a plurality of photosensitive components 13 are placed upside down on the cover layer 29 and spaced apart from each other. Multiple wafer-level lenses 11 and multiple photosensitive components 13 are respectively aligned, so that the wafer-level The image plane of the lens 11 overlaps or nearly overlaps with the photosensitive area of the photosensitive chip 131 of the photosensitive component 13. The cover layer 29, the multiple wafer-level lenses 11 and the multiple photosensitive components 13 can be fixed by providing an adhesive layer. The materials of the adhesive layers at the locations can be the same or different. The plurality of wafer-level lenses 11 are spaced apart from each other, the plurality of photosensitive components 13 are spaced apart from each other, and the plurality of wafer-level lenses 11 are not in contact with each other, so that there is a gap (gap) between the plurality of wafer-level lenses 11 , in one example, a plurality of wafer-level lenses 11 are fixed to the cover layer 29 at equal intervals.

Step S820: Fill packaging material between the plurality of wafer-level lenses 11 and the plurality of photosensitive components 13, so that the packaging material covers the image side (bottom side) of the plate layer 29, the peripheral side of the wafer-level lenses 11 and the photosensitive components. On the peripheral side of the component 13, the cured packaging material forms a packaging connected portion 23. The cured package joint portion 23 is integrally coupled to the image side of the cover layer 29 and the peripheral side of the wafer-level lens 11 and the photosensitive component 13 . The image side of the cover layer 29 refers to the side of the cover layer 29 facing the wafer-level lens 11 , that is, the bottom side of the cover layer 29 .

Step S830 , divide the module panel 20 along the height direction, and divide the encapsulation conjoined part 23 and the cover layer 29 to form multiple camera modules 10 . The package conjoined portion 23 is divided to form the package body 12 in the camera module 10 , and the cover layer 29 is divided to obtain a plurality of independent light-transmitting cover plates 15 .

In step S810 , during the process of stacking and fixing multiple wafer-level lenses 11 and multiple photosensitive components 13 on the cover layer 29 along the height direction, the multiple wafer-level lenses 11 may first be fixed on the cover upside down. On the plate layer 29, the plurality of photosensitive components 13 are respectively aligned with the plurality of wafer-level lenses 11 and fixed upside down on the image side of the plurality of wafer-level lenses 11; The photosensitive components 13 are respectively fixed to form a module semi-finished product, and then the module semi-finished product is fixed upside down to the cover layer 29, thereby reducing the difficulty of alignment between the wafer-level lens 11 and the photosensitive components 13.

In an example of this embodiment, the top surface of the wafer-level lens 11 matches the image side of the cover layer 29 , the cover layer 29 is flat, and the image side of the cover layer 29 is flat, so that the top surface is The flat wafer-level lens 11 can be stably attached to the image side of the cover layer 29 .

In an example of this embodiment, the module panel 20 also includes a light-shielding layer 213 disposed between the wafer-level lens component 111 of the wafer-level lens 11 and the cover layer 29 , which is screen-printed, A light-shielding layer 213 is provided by applying ink or glue, and a plurality of light holes are reserved on the light-shielding layer 213 to provide a channel for light to enter the wafer-level lens 11 .

In this embodiment, since the wafer-level lens 11 and the photosensitive component 13 are fixed to the cover layer 29 in an inverted manner, the electrical connection portion 133 of the photosensitive component 13 is less susceptible to damage during the manufacturing process. Therefore, in one example, , the photosensitive component 13 provided in step S810 includes a photosensitive chip 131 and an electrical connection portion 133 provided on the back of the photosensitive chip 131 .

In an example of this embodiment, in step S810 , a plurality of filter elements 14 are further provided, so that the plurality of filter elements 14 are respectively disposed between the plurality of wafer-level lenses 11 and the protective layer 22 .

In an example of this embodiment, the packaging material filled in step S820 is a liquid packaging material. After the liquid packaging material is cured, the packaging conjoined portion 23 is formed. With the fluidity of the liquid encapsulating material, the liquid encapsulating material can fully contact the bottom surface of the cover layer 29 and the peripheral sides of the wafer-level lens 11 and the photosensitive component 13. After the liquid encapsulating material is cured, the formed encapsulating conjoined portion 23 is also It can completely cover the bottom surface of the plate layer 29 and the peripheral sides of the wafer-level lens 11 and the photosensitive component 13 . The packaging material is preferably a material that turns black after curing, so that the package body 12 in the camera module 10 turns black and has a better anti-stray light effect.

In a specific example, the packaging material may be glue. The glue is filled between the multiple wafer-level lenses 11 and the multiple photosensitive components 13 . After the glue is cured, the encapsulation conjoined portion 23 formed can be divided to obtain a glue encapsulation body. That is, a glue process is used to encapsulate the peripheral sides of the wafer-level lens 11 and the photosensitive component 13 . Specifically, the glue is opaque, such as black glue, so that the encapsulation material can reduce stray light entering from the side. Furthermore, in order to avoid the existence of bubbles in the glue and prevent the encapsulation conjoined portion 23 formed after curing from completely covering the sides of the wafer-level lens 11 and the photosensitive component 13 , multiple wafer-level lenses 11 can be sprayed Glue is filled between the multiple wafer-level lenses 11 and the multiple photosensitive components 13 to avoid the generation of air bubbles, or glue can be filled between the multiple wafer-level lenses 11 and the multiple photosensitive components 13 in a dot-like manner.

In another specific example, the encapsulation material may also be a molding material, and the module panel 20 is placed in the molding mold and toward the mold. The molding material is injected into the component mold, causing the molding material to flow between the plurality of wafer-level lenses 11 and the plurality of photosensitive components 13, thereby covering the image side (bottom side) of the plate layer 29 with the molding material. The peripheral sides of the wafer-level lens 11 and the peripheral side of the photosensitive component 13 are further solidified to form a package conjoined part 23. The package conjoined part 23 can be divided to obtain a molded package. Among them, the molding material can be solidified by cooling or heating, which is determined by the properties of the molding material.

Different packaging materials can be selected according to the depth and width of the gaps between the multiple wafer-level lenses 11 and the multiple photosensitive components 13. For example, for a gap with a deeper depth or a narrower width, a packaging material with better fluidity is selected. For gaps that are shallower in depth or wider in width, less fluid encapsulation materials can be used.

In this application, the third and fourth embodiments of the camera module 10 do not use the lens panel 21 or the chip panel 24 in a paneled state for direct manufacturing, so that the wafer-level lens 11 and the photosensitive chip 131 They can be individually aligned, which reduces assembly tolerances, thereby improving the imaging quality of the camera module 10 .

It is worth noting that in this application, the packaging material is preferably a material that turns black after curing, so that the package 12 in the camera module 10 turns black and has a better anti-stray light effect.

It is worth noting that in this application, adjacent wafer-level lenses 1111 are fixed to each other and form a space filled with air. Since the wafer-level lens 11 or the camera module 10 using the wafer-level lens 11 has to pass through During the baking process, at high temperatures, the air between adjacent wafer-level lenses 1111 expands, which risks causing the relative position between adjacent wafer-level lenses 1111 to change. In order to reduce the above risk, the air between adjacent wafer-level lenses 1111 can be reduced. In one embodiment, the surface shapes of the opposite surfaces of adjacent wafer-level lenses 1111 are opposite, such as the imaging shown in Figure 13 In the module 10, the image side surface of the first wafer level lens 1114 is concave, and the object side surface of the second wafer level lens 1115 is convex. The two cooperate with each other to make the first wafer level lens 1115 concave. The average gap between the lens 1114 and the second wafer-level lens 1115 becomes smaller, thereby reducing the air between the first wafer-level lens 1114 and the second wafer-level lens 1115, reducing the risk of image quality degradation at high temperatures. risk.

The above describes the basic principles, main features and advantages of the present application. Those skilled in the industry should understand that the present application is not limited by the above-mentioned embodiments. What is described in the above-mentioned embodiments and descriptions is only the principle of the present application. The present application will have various applications without departing from the spirit and scope of the present application. changes and improvements that fall within the scope of the claimed application. The scope of protection claimed in this application is defined by the appended claims and their equivalents.

Claims

A camera module, characterized by including:

Wafer-level lenses;

Photosensitive component, the wafer-level lens is disposed on the photosensitive path of the photosensitive component, the photosensitive component includes a photosensitive chip and a protective cover covered above the photosensitive chip;

An encapsulation body, the encapsulation body is integrally formed on the circumferential side of the wafer-level lens and the circumferential side of the protective cover.
The camera module according to claim 1, wherein the lateral size of the protective cover is smaller than the lateral size of the photosensitive chip, and the package is integrally formed on at least a part of the front surface of the photosensitive chip.
The camera module according to claim 1, wherein the photosensitive component further includes a side connecting portion, the side connecting portion is integrally formed on the peripheral side of the photosensitive chip, and the lateral size of the side connecting portion is larger than the side connecting portion. The lateral dimension of the protective cover is protected, and the package body is integrally formed on at least a part of the front surface of the side connecting portion.
The camera module according to any one of claims 1 to 3, wherein the camera module further includes a filter element disposed between the wafer-level lens and the photosensitive component, and the package is integrated Molded on the peripheral side of the filter element.
The camera module according to any one of claims 1 to 3, wherein the photosensitive chip further includes an electrical connection portion provided on the back side of the photosensitive chip.
The camera module according to claim 5, wherein the photosensitive component further includes a circuit board and electronic components, the circuit board is disposed on the back of the photosensitive chip, the circuit board includes a circuit board body and a bottom package part, the photosensitive chip is disposed on the front surface of the circuit board main body and is electrically connected to the circuit board main body through the electrical connection part, the electronic component is disposed on the back surface of the circuit board main body, and the bottom The packaging part is integrally formed on the back side of the circuit board body through a molding process, and the electronic components are molded inside the bottom packaging part.
A method of manufacturing a camera module, which is characterized by including:

Stack and fix a lens panel, a protective layer and a chip panel along the height direction to form a module panel;

Divide the lens panel and the protective layer in the module panel along the height direction to form a plurality of wafer-level lenses and a plurality of protective cover plates, two adjacent wafer-level lenses and phase An upper dividing groove is formed between two adjacent protective covers;

Filling the upper dividing groove with packaging material, and solidifying the packaging material to form a packaging conjoined part, the packaging conjoined part is integrally formed on the peripheral side of the wafer-level lens and the protective cover;

The module panel is divided along the height direction, and the package conjoined portion and the chip panel are divided to form multiple camera modules.
The manufacturing method of a camera module according to claim 7, wherein after the step of curing the packaging material to form the packaging conjoined portion, electrical circuits are provided on the backs of the plurality of photosensitive chips of the chip panel. Connector.
The method of manufacturing a camera module according to claim 7, wherein the chip panel includes a plurality of photosensitive chips and a conjoined portion disposed between the plurality of photosensitive chips.
The manufacturing method of a camera module according to any one of claims 7 to 9, wherein the packaging material is a molding material or glue.
A camera module, characterized by including:

Wafer-level lenses;

Photosensitive chip, the wafer-level lens is arranged on the photosensitive path of the photosensitive chip;

A circuit board, the photosensitive chip is disposed on the circuit board;

A package body, which is integrally formed on the wafer-level lens, the photosensitive chip and the circuit board.
The camera module of claim 11, wherein the camera module further includes at least one lead, at least one of the leads is disposed between the photosensitive chip and the circuit board, and at least one of the leads is The package is wrapped.
The camera module according to claim 11, wherein the package covers at least part of the front surface of the circuit board, at least part of the peripheral side and front surface of the photosensitive chip, and the wafer-level lens. Peripheral side.
The camera module according to claim 13, wherein the photosensitive chip includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the package extends in a horizontal direction to the non-photosensitive area of the photosensitive chip , the package extends along the height direction to the top of the wafer-level lens, and the package is integrally formed on the peripheral side of the photosensitive chip and the peripheral side of the wafer-level lens.
The camera module according to claim 14, wherein the package body has a vertical outer side, and the lateral size of the upper part of the package body is equal to the lateral size of the bottom part of the package body.
The camera module according to claim 14, wherein the outer surface of the package is inclined, the outer diameter of the package increases from top to bottom, and the lateral dimension of the bottom of the package is larger than the The lateral dimension of the upper part of the package.
A method of assembling a camera module, which is characterized by including:

Provide a circuit board panel;

A plurality of photosensitive chips are provided on the circuit board panel, and the plurality of photosensitive chips are electrically connected to the circuit board panel;

A plurality of wafer-level lenses are provided on a plurality of the photosensitive chips, and the plurality of wafer-level lenses are respectively located on the photosensitive paths of a plurality of the photosensitive chips;

Filling packaging material between two adjacent wafer-level lenses and two adjacent photosensitive chips, curing the packaging material to form a packaging conjoined part, the packaging conjoined part is integrally combined with the The wafer-level lens, the photosensitive chip and the circuit board are assembled to form a module assembly;

The module panels are divided along the height direction to form multiple camera modules.
The assembly method of a camera module according to claim 17, wherein the packaging material is a molding material, and the packaging conjoined part is integrally formed on the wafer-level lens, the photosensitive chip and the The circuit board is assembled into panels.
The assembly method of a camera module according to claim 18, wherein the package conjoined portion is cut to form a package body, the circuit board panel is cut to form a plurality of circuit boards, and the package body covers the At least part of the front side of the circuit board, at least part of the peripheral side and the front side of the photosensitive chip, and the peripheral side of the wafer-level lens.
The method of assembling a camera module according to claim 19, wherein after the step of forming the module panel, a light-shielding layer is provided on the object side of the module panel, and the light-shielding layer is provided on the object side of the module panel. The top surface of the package joint portion extends toward the wafer-level lens.
A camera module, characterized by including:

Wafer-level lenses;

Photosensitive component, the wafer-level lens is disposed on the photosensitive path of the photosensitive component, the photosensitive component includes a photosensitive chip and a protective cover covered above the photosensitive chip;

An encapsulation body is integrally formed on the circumferential side of the wafer-level lens, the circumferential side of the protective cover, and the circumferential side of the photosensitive chip.
The camera module according to claim 21, wherein the package includes an upper package and a lower package, and the upper package is integrally formed on the peripheral side of the wafer-level lens and the protective cover. On the peripheral side, the lower package body is integrally formed on the peripheral side of the photosensitive chip.
The camera module according to claim 22, wherein the photosensitive component further includes a side connecting portion, the side connecting portion is integrally formed on the peripheral side of the photosensitive chip, and the lower package body is integrally formed on the side. The surrounding side of the company headquarters.
The camera module according to claim 23, wherein the lateral size of the photosensitive chip is smaller than the lateral size of the protective cover.
The camera module according to any one of claims 21 to 24, wherein the photosensitive chip further includes an electrical connection portion provided on the back side of the photosensitive chip.
The camera module according to any one of claims 21 to 24, wherein the camera module further includes a filter element disposed between the wafer-level lens and the photosensitive component, and the upper package body It is integrally formed on the peripheral side of the filter element.
A method of manufacturing a camera module, which is characterized by including:

Stack and fix a lens panel, a protective layer and a chip panel along the height direction to form a module panel;

Divide the lens panel and the protective layer in the module panel along the height direction to form a plurality of wafer-level lenses and a plurality of protective cover plates, two adjacent wafer-level lenses and phase An upper dividing groove is formed between two adjacent protective covers;

Fill the upper dividing groove with a first packaging material, and solidify the first packaging material to form an upper packaging conjoined part;

Divide the chip panel in the module panel along the height direction to form a plurality of independent photosensitive chips, and form a dividing groove between two adjacent photosensitive chips;

Fill the lower dividing groove with a second packaging material, and solidify the second packaging material to form a lower packaging conjoined part. The lower packaging conjoined part is integrally molded with the upper packaging conjoined part to form a package conjoined part. ;

The module panels are divided along the height direction to form multiple camera modules.
The manufacturing method of a camera module according to claim 27, wherein after the step of curing the first packaging material to form the upper packaging conjoined portion, the plurality of photosensitive chips of the chip panel are An electrical connection part is provided on the back.
The manufacturing method of a camera module according to claim 27, wherein the chip panel includes a plurality of photosensitive chips and a conjoined portion disposed between the plurality of photosensitive chips.
The manufacturing method of a camera module according to any one of claims 27 to 29, wherein the first packaging material and the second packaging material are made of different materials.
A camera module, characterized by including:

Wafer-level lenses;

A light-transmitting cover plate, the light-transmitting cover plate is fixed on the top surface of the wafer-level lens;

Photosensitive component, the wafer-level lens is disposed on the photosensitive path of the photosensitive component;

A package body, which is integrally formed on a part of the bottom surface of the light-transmitting cover plate, the side surface of the wafer-level lens, and the side surface of the photosensitive component.
The camera module according to claim 31, wherein the transverse size of the transparent cover is larger than that of the wafer-level lens and the sensor. The lateral dimensions of the optical component, the top surface of the wafer-level lens is flat.
The camera module according to claim 31, wherein the light-transmitting cover has an infrared cutoff function.
The camera module according to any one of claims 31 to 33, wherein the camera module further includes a light-shielding portion, the light-shielding portion being disposed between the wafer-level lens and the light-transmitting cover.
The camera module according to any one of claims 31 to 33, wherein the photosensitive component includes a photosensitive chip, a protective cover disposed above the photosensitive chip, and a circuit disposed on the back of the photosensitive chip. Connector.
A method of manufacturing a camera module, which is characterized by including:

Provide a cover layer, a plurality of wafer-level lenses and a plurality of photosensitive components, stack and fix a plurality of the wafer-level lenses and a plurality of the photosensitive components on the cover layer along the height direction to form a In a module panel, a plurality of the wafer-level lenses and a plurality of the photosensitive components are placed upside down on the cover layer at a distance from each other;

Filling packaging material between the plurality of wafer-level lenses and the plurality of photosensitive components, so that the packaging material covers the image side of the cover layer, the peripheral side of the wafer-level lens and the On the peripheral side of the photosensitive component, the packaging material is cured to form a packaging conjoined part;

The module panel is divided along the height direction, and the package conjoined part and the cover layer are divided to form multiple camera modules.
The manufacturing method of a camera module according to claim 36, wherein the image side of the cover layer is a flat surface, and the top surface of the wafer-level lens is a flat surface.
The manufacturing method of a camera module according to claim 36, wherein a light-shielding layer is provided on the cover layer by silk screen printing, ink coating or glue coating, and a plurality of light holes are reserved on the light-shielding layer. Provide a channel for light from the wafer-level lens to enter.
The manufacturing method of a camera module according to any one of claims 36 to 39, wherein the packaging material is a molding material, the module panel is placed in a molding mold, and the module is molded The mold is injected with the molding material, causing the molding material to flow between the plurality of wafer-level lenses and the plurality of photosensitive components, thereby covering the image of the cover layer with the molding material. side, the peripheral side of the wafer-level lens and the peripheral side of the photosensitive component.
The manufacturing method of a camera module according to any one of claims 36 to 39, wherein the packaging material is glue, and the plurality of wafer-level lenses and the plurality of The glue is filled between the photosensitive components.