WO2024021182A1 - Film adhésif thermofusible auto-cicatrisant en ptu et son procédé de préparation - Google Patents
Film adhésif thermofusible auto-cicatrisant en ptu et son procédé de préparation Download PDFInfo
- Publication number
- WO2024021182A1 WO2024021182A1 PCT/CN2022/112221 CN2022112221W WO2024021182A1 WO 2024021182 A1 WO2024021182 A1 WO 2024021182A1 CN 2022112221 W CN2022112221 W CN 2022112221W WO 2024021182 A1 WO2024021182 A1 WO 2024021182A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- self
- healing
- melt adhesive
- hot melt
- adhesive film
- Prior art date
Links
- 239000004831 Hot glue Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000004611 light stabiliser Substances 0.000 claims abstract 2
- 238000003756 stirring Methods 0.000 claims description 19
- -1 olefin amide Chemical class 0.000 claims description 17
- 238000005266 casting Methods 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 12
- 239000012768 molten material Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 7
- 239000012963 UV stabilizer Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000012943 hotmelt Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 229920000734 polysilsesquioxane polymer Polymers 0.000 claims description 6
- RFSCGDQQLKVJEJ-UHFFFAOYSA-N 2-methylbutan-2-yl benzenecarboperoxoate Chemical compound CCC(C)(C)OOC(=O)C1=CC=CC=C1 RFSCGDQQLKVJEJ-UHFFFAOYSA-N 0.000 claims description 4
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical group CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 3
- CNAILFQALPMJFF-UHFFFAOYSA-N (4-benzoyl-3-hydroxyphenyl) benzoate Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C(O)=CC=1OC(=O)C1=CC=CC=C1 CNAILFQALPMJFF-UHFFFAOYSA-N 0.000 claims description 3
- OMWSZDODENFLSV-UHFFFAOYSA-N (5-chloro-2-hydroxyphenyl)-phenylmethanone Chemical group OC1=CC=C(Cl)C=C1C(=O)C1=CC=CC=C1 OMWSZDODENFLSV-UHFFFAOYSA-N 0.000 claims description 3
- VAQNNXXADMWCTA-UHFFFAOYSA-N 2-methylbutan-2-yl benzoate Chemical group CCC(C)(C)OC(=O)C1=CC=CC=C1 VAQNNXXADMWCTA-UHFFFAOYSA-N 0.000 claims description 3
- SWDDLRSGGCWDPH-UHFFFAOYSA-N 4-triethoxysilylbutan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCCN SWDDLRSGGCWDPH-UHFFFAOYSA-N 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- HARQWLDROVMFJE-UHFFFAOYSA-N ethyl 3,3-bis(tert-butylperoxy)butanoate Chemical compound CCOC(=O)CC(C)(OOC(C)(C)C)OOC(C)(C)C HARQWLDROVMFJE-UHFFFAOYSA-N 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 3
- IQDGOCFFOPHWLN-UHFFFAOYSA-N 2-[4-(4-oxo-3,1-benzoxazin-2-yl)butyl]-3,1-benzoxazin-4-one Chemical compound C1=CC=C2C(=O)OC(CCCCC=3OC(=O)C4=CC=CC=C4N=3)=NC2=C1 IQDGOCFFOPHWLN-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 150000003851 azoles Chemical class 0.000 claims 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical class OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 claims 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 claims 1
- 230000035876 healing Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 239000013036 UV Light Stabilizer Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- CFGDTWRKBRQUFB-UHFFFAOYSA-N 4-(2,4-dihydroxyphenyl)benzene-1,3-diol Chemical group OC1=CC(O)=CC=C1C1=CC=C(O)C=C1O CFGDTWRKBRQUFB-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical class OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Definitions
- the invention relates to the field of hot-melt adhesive film materials, and in particular to a self-healing TPU hot-melt adhesive film and a preparation method thereof.
- Polymer-based composite materials with self-healing function can imitate the self-healing mechanism of biological damage to self-repair material processing or microscopic cracks that are difficult to detect with the naked eye during use.
- Self-healing materials have a wide range of applications, including military equipment, electronic products, automobiles, aircraft, building materials and other fields.
- the ultimate goal is to improve the adhesive force of the adhesive film.
- the adhesive film itself is damaged, such as cracks or breaks, on the one hand, it will cause a rapid decrease in the adhesive peeling force.
- Existing repair technology can be used to online Repairing defects such as damage or cracks in the packaging film is complicated and cumbersome, and the repair cost is high.
- the present invention provides a self-healing TPU hot-melt adhesive film that realizes rapid repair of products.
- the invention also provides a method for preparing a self-repairing TPU hot-melt adhesive film with a simple and convenient process.
- a self-healing TPU hot-melt adhesive film includes the following raw materials in parts by weight: 80-100 parts of TPU particles; 20-43 parts of nitrile rubber; 5-8 parts of self-healing supramolecular compounds; 2-4 parts of cross-linking agent; 1-2 parts of UV stabilizer; 0.5-2 parts of tackifier.
- melt flow index of the TPU particles is 0.5-40g/10min.
- nitrile rubber is one or more mixtures of nitrile rubber, hydrogenated nitrile rubber or carboxyl nitrile rubber without special treatment.
- the self-healing supramolecular compound is an olefin amide-containing polysiloxane or a self-polymer of a polysilsesquioxane monomer.
- cross-linking agent is tert-amyl benzoate, tert-butyl peroxybenzoate, tert-amyl peroxybenzoate, n-butyl-4,4-di(tert-amyl peroxybenzoate)
- the cross-linking agent is tert-amyl benzoate, tert-butyl peroxybenzoate, tert-amyl peroxybenzoate, n-butyl-4,4-di(tert-amyl peroxybenzoate)
- the cross-linking agent is tert-amyl benzoate, tert-butyl peroxybenzoate, tert-amyl peroxybenzoate, n-butyl-4,4-di(tert-amyl peroxybenzoate)
- UV light stabilizer is 2-hydroxy-5-chlorobenzophenone, 2,2′-tetramethylenebis(3,1-benzoxazine-4- ketone), 2-hydroxy-4-benzoyloxybenzophenone, 2-(2-hydroxy-3,5-di-tert-amylphenyl)benzotriazole, 2,2′,4,4 ′-One or a mixture of two or more tetrahydroxybenzophenones.
- tackifier is 3-aminopropyltriethoxysilane, 4-aminobutyltriethoxysilane, vinyltris( ⁇ -methoxyethoxy) One of the silane and vinyltriethoxysilane.
- a method for preparing a self-healing TPU hot melt adhesive film including the following steps:
- step S2 Add the molten material obtained in step S1 to a twin-screw extruder for extrusion to obtain hot melt rubber pellets;
- step S3 Add the hot melt adhesive particles obtained in step S2 to a casting machine and cast them to obtain a hot melt adhesive film.
- the casting temperature is 120-140°C.
- a further improvement to the above technical solution is that in the S1 step, the melting temperature is 135-150°C, the stirring speed is 150-200r/min, and the stirring time is 5-8 minutes.
- a further improvement to the above technical solution is that in the S2 step, the extrusion temperature is 150-170°C and the stirring speed is 660-850r/min.
- the present invention uses self-repairing supramolecular compounds to introduce into the TPU polymer molecular chain. Due to the self-polymerization of polysiloxane or polysilsesquioxane monomers of olefin amide, a hydrogen bond cross-linked network is formed in the TPU polymer. Through the breaking and healing of hydrogen bonds, the material has good self-healing ability and special properties such as repeatable processing and active self-healing, thereby reducing the tediousness of online repair operations, reducing repair costs, and improving products. service life and efficiency.
- a self-healing TPU hot-melt adhesive film includes the following raw materials in parts by weight: 80-100 parts of TPU particles; 20-43 parts of nitrile rubber; 5-8 parts of self-healing supramolecular compounds; 2-4 parts of cross-linking agent; 1-2 parts of UV stabilizer; 0.5-2 parts of tackifier.
- melt flow index of the TPU particles is 0.5-40g/10min.
- nitrile rubber is a mixture of one or more of nitrile rubber, hydrogenated nitrile rubber or carboxyl nitrile rubber without special treatment.
- the self-healing supramolecular compound is an olefin amide-containing polysiloxane or a self-polymer of a polysilsesquioxane monomer.
- the preparation method of self-healing supramolecular compounds includes the following steps: under room temperature stirring conditions, dissolve polysiloxane or polysilsesquioxane with an active amino structure in a methylene chloride solution, and add olefin acyl chloride compounds in sequence , Activator, synthesis reaction at room temperature for 10-20 hours, in which the molar ratio of amino-structured polysiloxane or polysilsesquioxane to olefin acyl chloride-based compounds is 10:11-15, and the activator and olefin acyl chloride-based compounds are The mass ratio of the compounds is 1:5-10.
- the material is added to 0.1-1mol/L sodium hydroxide solution for alkaline washing, and then added to 0.5-1mol/L dilute hydrochloric acid solution for acid washing and 0.5-1mol/L.
- L magnesium chloride solution is washed with salt, then separated into layers, the organic phase is dried, and the solvent is removed to obtain a self-healing supramolecular compound.
- the cross-linking agent is tert-amyl benzoate, tert-butyl peroxybenzoate, tert-amyl peroxybenzoate, n-butyl-4,4-di(tert-butylperoxy)pentyl
- tert-amyl benzoate tert-butyl peroxybenzoate
- tert-amyl peroxybenzoate tert-amyl peroxybenzoate
- n-butyl-4,4-di(tert-butylperoxy)pentyl One or a mixture of acid esters and ethyl-3,3-di(tert-butyl peroxy)butyrate.
- the UV light stabilizer is 2-hydroxy-5-chlorobenzophenone, 2,2′-tetramethylene bis(3,1-benzoxazin-4-one), 2-hydroxy ⁇ 4 ⁇ benzoyloxybenzophenone, 2 ⁇ (2 ⁇ hydroxy ⁇ 3,5 ⁇ di ⁇ tert ⁇ pentylphenyl)benzotriazole, 2,2′,4,4′ ⁇ tetrahydroxydiphenyl One or a mixture of two or more ketones.
- the tackifier is 3-aminopropyltriethoxysilane, 4-aminobutyltriethoxysilane, vinyltris( ⁇ -methoxyethoxy)silane, vinyltriethoxysilane One of the oxysilanes.
- a method for preparing a self-healing TPU hot melt adhesive film including the following steps:
- step S2 Add the molten material obtained in step S1 to a twin-screw extruder for extrusion to obtain hot melt rubber pellets;
- step S3 Add the hot melt adhesive particles obtained in step S2 to a casting machine and cast them to obtain a hot melt adhesive film.
- the casting temperature is 120-140°C.
- the melting temperature is 135-150°C
- the stirring speed is 150-200r/min
- the stirring time is 5-8 minutes.
- the extrusion temperature is 150-170°C
- the stirring speed is 660-850r/min.
- a method for preparing a self-healing TPU hot melt adhesive film including the following steps:
- step S2 Add the molten material obtained in step S1 to a twin-screw extruder for extrusion to obtain hot melt rubber pellets; the extrusion temperature is 150-170°C, and the stirring speed is 660-850r/min;
- step S3 Add the hot melt adhesive particles obtained in step S2 to a casting machine and cast them to obtain a hot melt adhesive film.
- the casting temperature is 120-140°C.
- a method for preparing a self-healing TPU hot melt adhesive film including the following steps:
- step S2 Add the molten material obtained in step S1 to a twin-screw extruder for extrusion to obtain hot melt rubber pellets; the extrusion temperature is 150-170°C, and the stirring speed is 660-850r/min;
- step S3 Add the hot melt adhesive particles obtained in step S2 to a casting machine and cast them to obtain a hot melt adhesive film.
- the casting temperature is 120-140°C.
- a method for preparing a self-healing TPU hot melt adhesive film including the following steps:
- step S2 Add the molten material obtained in step S1 to a twin-screw extruder for extrusion to obtain hot melt rubber pellets; the extrusion temperature is 150-170°C, and the stirring speed is 660-850r/min;
- step S3 Add the hot melt adhesive particles obtained in step S2 to a casting machine and cast them to obtain a hot melt adhesive film.
- the casting temperature is 120-140°C.
- Example 1 Repeat the preparation method of Example 1 according to the specified proportions of each component, but do not add or use the self-healing supramolecular compound.
- Example 2 Repeat the preparation method of Example 2 according to the specified proportions of each component, but do not add or use the self-healing supramolecular compound.
- Example 3 Repeat the preparation method of Example 3 according to the specified proportions of each component, but do not add or use the self-healing supramolecular compound.
- the properties of the hot melt adhesive film in the embodiment are shown in Table 1, in which the self-healing ability refers to the self-healing ability after being scratched by a knife and the recovery ability after deformation after bending.
- the self-healing ability is the adhesive film after being scratched or deformed.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
La présente invention concerne un film adhésif thermofusible auto-cicatrisant en PTU, comprenant les matières premières suivantes en parts de poids : 80 à 100 parts de particules de PTU ; 20 à 43 parts de caoutchouc nitrile ; 5 à 8 parts d'un composé supramoléculaire auto-cicatrisant ; 2 à 4 parts d'un agent de réticulation ; 1 à 2 parts d'un stabilisateur de lumière ultraviolette ; et 0,5 à 2 parts d'un agent collant. En outre, La présente invention concerne un film adhésif thermofusible en PTU auto-cicatrisant permettant la cicatrisation rapide d'un produit, ainsi qu'un procédé de préparation d'un film adhésif thermofusible en PTU auto-cicatrisant. Selon le procédé, le processus est simple et pratique.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN202210912188.1 | 2022-07-29 | ||
CN202210912188.1A CN115260967A (zh) | 2022-07-29 | 2022-07-29 | 一种自修复tpu热熔胶膜及其制备方法 |
Publications (1)
Publication Number | Publication Date |
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WO2024021182A1 true WO2024021182A1 (fr) | 2024-02-01 |
Family
ID=83747366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2022/112221 WO2024021182A1 (fr) | 2022-07-29 | 2022-08-12 | Film adhésif thermofusible auto-cicatrisant en ptu et son procédé de préparation |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115260967A (fr) |
WO (1) | WO2024021182A1 (fr) |
Citations (6)
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CN106349685A (zh) * | 2016-08-26 | 2017-01-25 | 宁波市青湖弹性体科技有限公司 | 一种高耐油的充电桩无卤阻燃tpu线缆料及其制备方法 |
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WO2020105677A1 (fr) * | 2018-11-22 | 2020-05-28 | リンテック株式会社 | Film pour former un film protecteur thermodurcissable, feuille composite pour former un film protecteur, et procédé de fabrication de puce |
CN114163966A (zh) * | 2021-12-30 | 2022-03-11 | 广东汇齐新材料有限公司 | 一种耐水解tpu热熔胶膜及其制备方法 |
CN114605813A (zh) * | 2022-03-29 | 2022-06-10 | 广东汇齐新材料有限公司 | 一种耐紫外光老化tpu热熔胶膜及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114292598A (zh) * | 2021-12-30 | 2022-04-08 | 广东汇齐新材料有限公司 | 一种高粘着强度的tpu热熔胶膜及其制备方法 |
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2022
- 2022-07-29 CN CN202210912188.1A patent/CN115260967A/zh active Pending
- 2022-08-12 WO PCT/CN2022/112221 patent/WO2024021182A1/fr unknown
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CN106349685A (zh) * | 2016-08-26 | 2017-01-25 | 宁波市青湖弹性体科技有限公司 | 一种高耐油的充电桩无卤阻燃tpu线缆料及其制备方法 |
CN109971016A (zh) * | 2017-12-28 | 2019-07-05 | 科思创德国股份有限公司 | 涂覆产品或制品及其制造方法 |
CN108822750A (zh) * | 2018-04-12 | 2018-11-16 | 中天光伏材料有限公司 | 一种具有自修复功能的聚烯烃封装胶膜 |
WO2020105677A1 (fr) * | 2018-11-22 | 2020-05-28 | リンテック株式会社 | Film pour former un film protecteur thermodurcissable, feuille composite pour former un film protecteur, et procédé de fabrication de puce |
CN114163966A (zh) * | 2021-12-30 | 2022-03-11 | 广东汇齐新材料有限公司 | 一种耐水解tpu热熔胶膜及其制备方法 |
CN114605813A (zh) * | 2022-03-29 | 2022-06-10 | 广东汇齐新材料有限公司 | 一种耐紫外光老化tpu热熔胶膜及其制备方法 |
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