WO2024019197A1 - 라인 레이저빔을 사용하여 피절단물을 선형으로 절단하는 방법 - Google Patents

라인 레이저빔을 사용하여 피절단물을 선형으로 절단하는 방법 Download PDF

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Publication number
WO2024019197A1
WO2024019197A1 PCT/KR2022/010848 KR2022010848W WO2024019197A1 WO 2024019197 A1 WO2024019197 A1 WO 2024019197A1 KR 2022010848 W KR2022010848 W KR 2022010848W WO 2024019197 A1 WO2024019197 A1 WO 2024019197A1
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Prior art keywords
laser beam
cut
line
cutting
line laser
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Application number
PCT/KR2022/010848
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English (en)
French (fr)
Korean (ko)
Inventor
김보겸
김선주
박재웅
Original Assignee
주식회사 코윈디에스티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN202280009545.1A priority Critical patent/CN117769476A/zh
Publication of WO2024019197A1 publication Critical patent/WO2024019197A1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Definitions

  • the present invention relates to a method of cutting a cut object using a laser beam, and more specifically, to a method of linearly cutting a cut object made of a brittle material using a line laser beam.
  • Brittle materials such as glass and ceramics are used in various fields such as displays due to their material properties. Accordingly, technology for cutting brittle materials without damaging them is required. Technologies related to the cutting process of brittle materials include a method using a cutting wheel and a method of cutting by generating mechanical cracks through thermal stress induced by a laser.
  • the conventional cutting method had a problem in that a breaking process was necessarily required after the laser process.
  • the conventional cutting method used a spot-based laser, which had the problem that the time required for the cutting process was relatively long.
  • Embodiments of the present invention were devised to solve the above problems, and are intended to provide a method of linearly cutting a cut object made of a brittle material using a laser beam in line units.
  • the aim is to provide a method of cutting objects to be cut using a line laser beam that can control the propagation direction of cracks within a controllable range.
  • it is intended to provide a method of cutting a workpiece using a line laser beam with improved quality of the surface and cutting surface of the workpiece.
  • One embodiment of the present invention in order to solve the above problems, includes a first step of loading and placing a cut object made of a brittle material under the laser unit; A second step of forming a crack by irradiating a line laser beam having a certain long/short ratio generated by the laser unit to the workpiece to be cut; A third step of forming a linear cutting line by connecting the cracks while moving the line laser beam in a straight line along the direction of the intended cutting line of the object to be cut; and a fourth step of cutting the object to be cut using the cutting line. It provides a method of linearly cutting the object to be cut using a line laser beam including a.
  • Another embodiment of the present invention in order to solve the above problems, includes a first step of loading and disposing an object to be cut made of a brittle material on the lower side of the laser unit, where edge cracks are formed at both ends of the cutting line; A second step of additionally forming a crack connected to the edge crack by irradiating a line laser beam generated by the laser unit to one of the edge cracks; A third step of connecting the cracks while moving the line laser beam straight toward another one of the edge cracks; And a fourth step of cutting the object to be cut by a linear cutting line formed by connecting the edge crack and the crack. It provides a method of linearly cutting the object to be cut using a line laser beam including a. .
  • the laser unit preferably further includes a cooling spray unit that cools the area heated by the line laser beam.
  • the line laser beam is preferably irradiated so that the long axis of the line laser beam coincides with the linear movement direction of the line laser beam.
  • the spray area by the cooling spray unit formed on the surface of the object to be cut preferably includes an irradiation area by the line laser beam.
  • the wavelength of the line laser beam is preferably 500 to 1100 nm.
  • the edge crack is preferably a linear groove disposed in the extending direction of the cutting line.
  • the method of linearly cutting an object to be cut using a line laser beam according to an embodiment of the present invention can control the propagation direction of the crack within a controllable range.
  • the quality of the surface and cut surface of the workpiece can be improved. Additionally, in one embodiment, energy efficiency can be improved. In addition, in the case of one embodiment, thermal deformation, tissue deformation, etc. of the cut object can be extremely small. Additionally, in one embodiment, cutting speed may be improved.
  • FIG. 1 is a flowchart of a method of linearly cutting an object to be cut using a line laser beam according to an embodiment of the present invention.
  • Figure 2 is a flowchart of a method of linearly cutting an object to be cut using a line laser beam according to another embodiment of the present invention.
  • Figure 3 is a photograph showing the energy profile of the line laser beam of Figures 1 and 2.
  • FIGS 4a and 4b are schematic diagrams showing part of the process according to Figure 1;
  • FIGS 5a and 5b are schematic diagrams showing part of the process according to Figure 2;
  • Figure 6 is a photograph showing a comparison of cut surfaces cut according to a conventional technique and an embodiment of the present invention.
  • first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms may be used only for the purpose of distinguishing one component from another. For example, a first component may be referred to as a second component, and similarly, the second component may be referred to as a first component without departing from the scope of the present disclosure.
  • FIG. 1 is a flowchart of a method of linearly cutting an object (P) to be cut using a line laser beam (L) according to an embodiment of the present invention
  • Figure 3 is a flowchart of the line laser beam of Figures 1 and 2 ( L) is a photograph showing the energy profile
  • FIGS. 4A and 4B are schematic diagrams showing part of the process according to FIG. 1.
  • the method of linearly cutting the object to be cut (P) using a line laser beam includes first to fourth steps. It can be included.
  • the first step is to load and place the object to be cut (P) made of a brittle material on the lower side of the laser unit 100 (S10).
  • the object P to be cut is preferably a flat plate with a certain thickness.
  • the object to be cut (P) has the property of breaking above a certain level when heat energy is applied due to the material characteristics of the brittle material.
  • the object to be cut (P) may be placed horizontally with the ground through a work table or the like.
  • the laser unit 100 provides (oscillates) a laser beam in line units rather than in spot units. That is, in one embodiment, the laser unit 100 can generate a line laser beam L having a certain long/short ratio.
  • the line laser beam L refers to a laser beam in the shape of a line unit having a certain length in the longitudinal direction (long axis (d1)) and the width direction (short axis (d2)).
  • the length of the minor axis d2 of the line laser beam L is preferably in the tens of micrometers.
  • the long/short axis ratio may vary depending on the thickness of the workpiece, the moving speed of the laser unit 100, etc.
  • the long axis ratio (d1) to the short axis (d2) may be set to within 20:1 to 500:1.
  • the ratio between the major axis (d1) and the minor axis (d2) of the line laser beam (L) is preferably 350:1.
  • the ratio of the major axis (d1) and the minor axis (d2) is less than 20:1, for example, 15:1, there is a problem that the cutting speed is excessively slow.
  • the long/short axis ratio is greater than 500:1, for example, 600:1, the cutting speed increases, but there is a problem in that the output of the laser unit 100 must increase.
  • the line laser beam L preferably has a Gaussian energy profile.
  • the energy level of the line laser beam (L) is highest at the center where the long and short axes intersect.
  • the laser unit 100 may provide a CW laser capable of continuous oscillation through constant output. This allows continuous temperature change within the irradiation area of the line laser beam (L).
  • the wavelength of the line laser beam L is preferably 500 to 1100 nm. This enables a linear cutting process for the workpiece through rapid heating through the line laser beam (L).
  • the second step is a step of forming a crack by irradiating the line laser beam (L) having a certain long/short axis ratio generated by the laser unit 100 to the object to be cut (P) (S11).
  • the laser unit 100 can be placed at a point above one end of the cutting line of the object P to be cut.
  • the line laser beam (L) is oscillated through the laser unit 100, the line laser beam (L) is absorbed by the surface of the object to be cut (P).
  • the line laser beam (L) is irradiated so that the long axis (d1) of the line laser beam (L) coincides with the cutting line. At this time, cracks may occur at the cutting line.
  • the third step is to form a linear cutting line (B) by connecting cracks while moving the line laser beam (L) in a straight line along the direction of the cutting line of the object (P) (S12).
  • the line laser beam (L) is irradiated so that the long axis (d1) of the line laser beam (L) coincides with the straight-line movement direction of the line laser beam (L).
  • the energy distribution of the line laser beam (L) continuously changes based on the center where the long and short axes intersect. As a result, when the line laser beam (L) moves in a straight line, the temperature of the line to be cut and its surroundings may rapidly rise and fall. This causes a change in the thermal stress state due to the temperature difference, strengthening the propagation of cracks and connecting cracks.
  • the line laser beam (L) can connect cracks, and at this time, connection efficiency can be further improved.
  • the crack propagation path coincides with the cutting line.
  • the cutting line is preferably a straight path.
  • the line laser beam (L) generates thermal stress through local heating on the surface of the object to be cut (P), thereby causing further crack growth in the object to be cut (P) at a controllable level. .
  • cracks are connected and a linear cutting line (B) is formed.
  • the length of the minor axis (d2) of the line laser beam (L) may be greater than the width of the cutting line (B). At this time, the cutting line B can be formed very finely.
  • the fourth step is the step of cutting the object (P) to be cut by the cutting line (B) (S13).
  • the cutting width of the object to be cut (P) by the cutting line (B) is formed to be constant. That is, in one embodiment of the present invention, the object to be cut (P) can be cut without a conventional breaking process.
  • the breaking process refers to a process of breaking the cut object (P) along the cutting line (B) by applying additional physical force to the cut object (P) after the laser beam process.
  • One embodiment of the present invention allows a cutting surface to be formed vertically downward from the surface of the workpiece.
  • the laser unit 100 may further include a cooling spray unit 200 that cools the area heated by the line laser beam (L).
  • the cooling spray unit 200 can rapidly cool the area including the heating area of the cutting object (P).
  • the cooling spray unit 200 may spray coolant (water), for example, through a nozzle or the like.
  • the cooling spray unit 200 can spray coolant on the area including the cutting line, its surrounding area, and the cutting line (B) of the surface of the object to be cut (P). At this time, the object to be cut (P) can be rapidly cooled by the heat of vaporization of the cooling water.
  • the laser unit 100 can oscillate a line laser beam (L) of lower energy. Additionally, the propagation of cracks can be further strengthened due to the cooling spray unit 200.
  • this cooling spray unit 200 may operate particularly in the third stage. That is, one embodiment of the present invention is arranged to be spaced apart from the line laser beam (L) in the third step, and the object to be cut (P) is ) may further include a 3-1 step of cooling the surface. The output of the laser unit 100 may be reduced by more than 10% due to cooling by the cooling spray unit 200 (200).
  • the area W preferably includes an area irradiated by the line laser beam L.
  • the spray area W may be formed in a circular or oval shape.
  • the irradiation area may have a linear shape, a long rectangular shape, etc.
  • the spray area W may include a heating area.
  • the heating area is an area where the surface of the object to be cut (P) is heated due to irradiation by the line laser beam (L) and refers to a wider area including the irradiation area. That is, the cooling spray unit 200 can spray cooling water into an area including the irradiation area or the heating area.
  • Figure 6 is a photograph showing a comparison of cut surfaces cut according to a conventional technique and an embodiment of the present invention.
  • step 3-1 by the cooling spray unit 200 it can be seen that when step 3-1 by the cooling spray unit 200 is further included, the surface roughness of the object to be cut (P) is greatly reduced through rapid cooling.
  • step 3-1 using the cooling spray unit 200 it can be confirmed that the quality of the cut surface is significantly improved as there are no streaks on the cut surface through rapid cooling. This makes it unnecessary to perform a separate finishing process after the cutting process using the line laser beam (L).
  • Figure 2 is a flowchart of a method for linearly cutting the object (P) to be cut using the line laser beam (L) according to another embodiment of the present invention
  • Figure 3 is the line laser beam of Figures 1 and 2 ( L) is a photograph showing the energy profile
  • FIGS. 5A and 5B are schematic diagrams showing part of the process according to FIG. 2.
  • the method of linearly cutting the object to be cut (P) using a line laser beam includes first to fourth steps. It can be included.
  • the description of parts that overlap with the description of one embodiment described above will be omitted.
  • edge cracks are formed at both ends of the cutting line, and the object to be cut (P) made of a brittle material is loaded and placed on the lower side of the laser unit 100 (S20).
  • the edge crack E according to another embodiment is preferably a linear groove disposed in the extending direction of the cutting line.
  • the edge crack (E) provides directionality so that the crack can easily propagate in one direction, that is, in the direction of the cutting line.
  • the linear groove may be, for example, a rectangular parallelepiped-shaped groove having a depth of 30 to 90 um, a width of 20 to 80 um, and a length of 0.5 to 1.5 mm.
  • the second step is to form an additional crack connected to the edge crack (E) by irradiating the line laser beam (L) generated by the laser unit 100 to one of the edge cracks (E) (S21).
  • a cutting line connecting the edge crack (E) may be disposed on the surface of the object to be cut (P).
  • the line laser beam (L) is irradiated to the area including the edge crack (E) and a portion of the cutting line, thereby forming a crack connected from the edge crack (E) in the direction of the cutting line.
  • the edge crack (E) induces the direction of crack propagation by the line laser beam (L).
  • the laser unit 100 may generate a line laser beam (L) having a certain long/short ratio.
  • the line laser beam (L) refers to a laser beam in the shape of a line (linear, rectilinear) unit having a certain length in the longitudinal direction (long axis (d1)) and the width direction (short axis (d2)).
  • the long/short ratio is the same as that described above in one embodiment and will be omitted hereinafter.
  • other conditions for the line laser beam L are the same as described above, and will be omitted hereinafter.
  • the third step is to connect the cracks while moving the line laser beam (L) straight toward the other edge crack (E) (S22). At this time, the laser unit 100 is driven so that the long axis d1 of the line laser beam L moves along the cutting line. As described above, in the third stage, crack propagation may proceed linearly along the cutting line.
  • the line laser beam (L) is irradiated so that the long axis (d1) of the line laser beam (L) coincides with the straight-line movement direction of the line laser beam (L).
  • the energy distribution of the line laser beam (L) continuously changes based on the center where the long and short axes intersect.
  • the cutting line is preferably a straight path.
  • the fourth step is a step of cutting the object (P) to be cut by a linear cutting line (B) formed by connecting the edge crack (E) and the crack (S23).
  • the crack that starts from one edge crack (E) propagates to the edge crack (E) of the other end and is connected to the edge crack (E) of the other end.
  • other embodiments can more effectively control the propagation direction of the crack at a controllable level with respect to the cutting object (P).
  • the edge crack (E) and the edge crack (E) are connected to each other by crack propagation, and a linear cutting line (B) can be formed.
  • the cutting width of the object to be cut (P) by the cutting line (B) is formed to be constant.
  • the object to be cut (P) can be cut without a conventional breaking process.
  • the laser unit 100 may further include a cooling spray unit 200 that cools the area heated by the line laser beam (L).
  • the cooling spray unit 200 may operate in the fourth step. That is, another embodiment of the present invention is arranged to be spaced apart from the line laser beam (L) in the fourth step and cuts the object (P) through the cooling spray unit 200 that is controlled in conjunction with the movement of the line laser beam (L). ) may further include a 4-1 step of cooling the surface.
  • the area W preferably includes an area irradiated by the line laser beam L.
  • the spray area W may be formed in a circular or oval shape.
  • the spray area W may include a heating area. That is, the cooling spray unit 200 can spray cooling water into an area including the irradiation area or the heating area.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
PCT/KR2022/010848 2022-07-21 2022-07-25 라인 레이저빔을 사용하여 피절단물을 선형으로 절단하는 방법 WO2024019197A1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202280009545.1A CN117769476A (zh) 2022-07-21 2022-07-25 一种利用线激光束对被切割物进行线性切割的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220090244A KR20240012812A (ko) 2022-07-21 2022-07-21 라인 레이저빔을 사용하여 피절단물을 선형으로 절단하는 방법
KR10-2022-0090244 2022-07-21

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WO2024019197A1 true WO2024019197A1 (ko) 2024-01-25

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WO (1) WO2024019197A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09150286A (ja) * 1995-06-26 1997-06-10 Corning Inc 脆弱性材料切断方法および装置
KR20000040562A (ko) * 1998-12-18 2000-07-05 구자홍 레이저빔을 이용한 유리 절단장치
KR20010017690A (ko) * 1999-08-13 2001-03-05 윤종용 레이저 커팅 장치 및 이를 이용한 유리 기판 커팅 방법
KR20100107252A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20150028914A (ko) * 2013-09-06 2015-03-17 주식회사 제우스 강화유리 절단방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09150286A (ja) * 1995-06-26 1997-06-10 Corning Inc 脆弱性材料切断方法および装置
KR20000040562A (ko) * 1998-12-18 2000-07-05 구자홍 레이저빔을 이용한 유리 절단장치
KR20010017690A (ko) * 1999-08-13 2001-03-05 윤종용 레이저 커팅 장치 및 이를 이용한 유리 기판 커팅 방법
KR20100107252A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20150028914A (ko) * 2013-09-06 2015-03-17 주식회사 제우스 강화유리 절단방법

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KR20240012812A (ko) 2024-01-30

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