WO2024017133A1 - 线路板结构及其制作方法、摄像头模组和电子设备 - Google Patents

线路板结构及其制作方法、摄像头模组和电子设备 Download PDF

Info

Publication number
WO2024017133A1
WO2024017133A1 PCT/CN2023/107240 CN2023107240W WO2024017133A1 WO 2024017133 A1 WO2024017133 A1 WO 2024017133A1 CN 2023107240 W CN2023107240 W CN 2023107240W WO 2024017133 A1 WO2024017133 A1 WO 2024017133A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
via hole
pins
board structure
camera module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/107240
Other languages
English (en)
French (fr)
Inventor
刘庆
刘峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2024017133A1 publication Critical patent/WO2024017133A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Definitions

  • This application belongs to the technical field of electronic equipment, and specifically relates to a circuit board structure and its production method, a camera module and electronic equipment.
  • the PIN inside the driver IC (the PIN in the dotted box in the figure) ) requires leads to the outside, and the industry usually adopts a blind and buried hole design, in which the driver IC can drive the motor movement.
  • the design of the blind and buried via circuit board is relatively complex, which involves the blind hole a between the first layer circuit (board) L1 and the second layer circuit L2, the second layer circuit L2 and the third layer circuit L3
  • the blind hole b between the third layer circuit L3 and the fourth layer circuit L4 is the blind hole c between the third layer circuit L3 and the fourth layer circuit L4.
  • the production process needs to first make the inner layer circuit and process the inner layer hole. Then the laminate is pressed, and then the outer layer circuit is made. The outer layer blind hole also needs to be processed, and finally the hole plating process is performed; this results in a long process for making vias between each layer and a high risk of quality failure. , the cost is also higher; in the end, the product cost is high, and the product cannot maintain a better price/performance ratio.
  • circuit board structure in the prior art has problems such as complicated production processes due to the provision of blind holes.
  • the purpose of the embodiments of the present application is to provide a circuit board structure and its manufacturing method, camera module and electronic equipment, which can solve the problem in the prior art that the production process of the circuit board structure is complicated due to the provision of blind holes.
  • circuit board structure which includes:
  • a first circuit board and a second circuit board are connected, a first via hole is provided in at least one first location area on the first circuit board, and a first via hole is provided in at least one second location area on the second circuit board.
  • a second via hole is provided; the first via hole and the second via hole are connected;
  • a first conductive material is disposed in the first via hole and the second via hole respectively, and the first conductive material is used to conduct the first circuit board and the second circuit board.
  • embodiments of the present application provide a camera module, including: a circuit board structure as described in the first aspect.
  • an embodiment of the present application provides an electronic device, including: a camera module as described in the second aspect.
  • embodiments of the present application provide a circuit board structure manufacturing method, which is applied to the circuit board structure described in the first aspect.
  • the method includes:
  • drilling through holes is performed on the first circuit board and the second circuit board;
  • the openings on the first circuit board and the second circuit board are connected.
  • the circuit board structure is configured by: a connected first circuit board and a second circuit board, and a first via hole is provided in at least a first location area on the first circuit board, A second via hole is provided in at least a second position area on the second circuit board; the first via hole and the second via hole are connected; wherein, the first via hole and the second via hole are connected to each other;
  • the two via holes are respectively provided with a third A conductive material, the first conductive material is used to conduct the first circuit board and the second circuit board; it is possible to use a through-hole structure to connect the circuit boards without the need to provide blind holes, thereby
  • the production process of the circuit board is simplified, the difficulty of the production process of the circuit board is reduced, the production cycle of the circuit board is shorter, and the stability of the circuit board is also improved; it is a good solution to the problem of blind holes in the circuit board structure in the existing technology. Problems that lead to complex production processes.
  • Figure 1 is a schematic diagram of driver IC pin definition in the prior art
  • Figure 2 is a schematic diagram of a conventional 4-layer blind and buried via design in the prior art
  • Figure 3 is a production flow chart of a conventional 4-layer blind and buried via substrate in the prior art
  • Figure 4 is a schematic structural diagram of the circuit board in the embodiment of the present application.
  • Figure 5 is a schematic diagram of the circuit board structure manufacturing method in the embodiment of the present application.
  • FIG. 6 is a schematic diagram of the camera module in the embodiment of the present application.
  • Figure 7 is a schematic diagram of the wiring near the IC in the circuit board in the embodiment of the present application.
  • Figure 8 is a schematic diagram of the pad position of the camera module circuit board in the embodiment of the present application.
  • Figure 9 is a schematic diagram of the specific implementation flow of the circuit board structure manufacturing method in the embodiment of the present application.
  • Figure 10 is a schematic structural diagram of the camera module IC in the embodiment of the present application.
  • Figure 11 is an example of the pad position of the camera module circuit board in the embodiment of the present application.
  • Figure 12 is an example 2 of the pad position of the camera module circuit board in the embodiment of the present application.
  • Figure 13 is a schematic diagram of the position of the pads on the circuit board of the camera module in the embodiment of the present application.
  • first”, second, etc. in the description and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that data so used are interchangeable under appropriate circumstances so that embodiments of the present application can be used in other ways than as illustrated or described herein.
  • the objects distinguished by “first”, “second”, etc. are usually of the same type, and the number of objects is not limited.
  • the first object may be one or multiple.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the related objects are in an "or” relationship.
  • circuit board structure provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios.
  • the circuit board structure provided by the embodiment of the present application, as shown in Figure 4, includes:
  • a first via hole 3 is provided in at least one first location area on the first circuit board 1. At least one first via hole 3 is provided on the second circuit board 2.
  • a second via hole 4 is provided in the second position area; the first via hole 3 and the second via hole 4 are connected; wherein, the first via hole 3 and the second via hole 4 are respectively A first conductive material is provided, and the first conductive material is used to conduct the first circuit board 1 and the second circuit board 2 .
  • Figure 4 takes a four-layer circuit board as an example. It may include: two first circuit boards 1 and two second circuit boards 2.
  • the first circuit board 1 includes: a first circuit layer L1 and a fourth layer of circuits.
  • Layer L4 the second circuit board 2 includes: a second circuit layer L2 and a third circuit layer L3, but is not limited thereto.
  • the conductive materials in the first via hole and the second via hole may be the same or different, and are not limited here.
  • the circuit board structure is provided with: a connected first circuit board and a second circuit board, and a first via hole is provided in at least a first position area on the first circuit board, A second via hole is provided in at least a second position area on the second circuit board; the first via hole and the second via hole are connected; wherein, the first via hole and the third via hole are connected to each other; A first conductive material is respectively provided in the two via holes, and the first conductive material is used to conduct the first circuit board and the second circuit board; it is possible to use a through-hole structure to connect the circuit boards, and It is no longer necessary to set up blind holes, thereby simplifying the production process of the circuit board, reducing the difficulty of the circuit board production process, making the production cycle of the circuit board shorter, and also improving the stability of the circuit board; it is a good solution to the problems in the existing technology.
  • the circuit board structure has complicated production processes due to blind holes.
  • a first insulating layer is provided between the first circuit board and the second circuit board, a third via hole is provided on the first insulating layer, and the third via hole is connected to the first The via hole is connected to the second via hole; wherein, a second conductive material is provided in the third via hole, and the second conductive material conducts the circuit boards on both sides of the first insulating layer.
  • the second conductive material conducts the circuit boards on both sides of the first insulating layer
  • it can be: the second conductive material and the first via hole
  • the first conductive material in the second via hole is connected to the first conductive material; the second conductive material is the same as or different from the first conductive material.
  • the first circuit board is provided with at least one chip pin, and the chip pin is connected to the first conductive material.
  • the first circuit board can be used as the outer circuit board, but it is not limited to this.
  • the number of pins of the chip is less than the total number of pins of the chip; specifically, the pins provided on the circuit board are necessary pins; this can increase the number of via holes and wiring Space.
  • the first circuit board is provided with a blank area corresponding to the optional chip pins; wherein the wiring of the at least one chip pin is provided in the space between the pads and the space between the pads. /or within the blank area.
  • the number of pins of the chip is less than the total number of pins of the chip
  • the chip has more than one pin, and some of the pins are in a suspended or floating state. This means that the chip has more than one pin.
  • the circuit board in the projection area directly below this part of the pins has no corresponding pad structure; further, the circuit board in the projection area directly below this part of the pins It is possible to have vias or traces and use ink to cover the vias or traces, but is not limited to this.
  • the necessary pins may be determined based on the pin definition of the chip and the first rule; wherein the first rule includes at least one of the following: the probability of being used is greater than the first threshold; the replaced The probability is less than the second threshold, but is not limited to this.
  • At least one of the chip pins is a first type pin
  • the pad of the first type pin is circular and has a diameter of less than 0.3mm; or, the first type pin has a
  • There is an avoidance part on the pad which can be reflected as a concave structure. For example, cutting off the edge of the pad makes the pad appear a non-complete circle, ensuring that the shape is ⁇ 0.5 complete circles.
  • At least one of the chip pins is a second type pin, and the ink window size of the second type pin is smaller than or equal to the pad size of the second type pin.
  • the chip pins may be both first type pins and second type pins, which are not limited here.
  • reducing the ink window is beneficial to wiring (there needs to be a safe distance between the edge of the ink window and the line edge, and reducing the size of the ink window actually increases the safety distance).
  • An embodiment of the present application also provides a camera module, including: the above-mentioned circuit board structure.
  • the camera module provided by the embodiment of the present application can implement each process implemented by the circuit board structure embodiment mentioned above. To avoid repetition, the details will not be described here.
  • An embodiment of the present application also provides an electronic device, including: the above-mentioned camera module.
  • the electronic device provided by the embodiment of the present application can implement each process implemented by the above-mentioned camera module embodiment. To avoid duplication, the details will not be described here.
  • the embodiment of the present application also provides a method for manufacturing a circuit board structure, which is applied to the above-mentioned circuit board structure. As shown in Figure 5, the manufacturing method includes:
  • Step 51 Obtain the second circuit board in the circuit board structure, and etch inner circuits on the second circuit board;
  • Step 52 Superimpose the first circuit board on the first side of the etched second circuit board
  • Step 53 Laminate the stacked first circuit board and second circuit board
  • Step 54 Etch the outer circuit on the laminated first circuit board
  • Step 55 After etching the outer layer circuit, drill through holes on the first circuit board and the second circuit board;
  • Step 56 Electroplating the openings on the drilled first circuit board and the second circuit board; wherein the openings on the first circuit board and the second circuit board are connected.
  • the second circuit board in the circuit board structure is obtained, and the inner circuit is etched on the second circuit board; the first side of the etched second circuit board is superimposed on the first side.
  • the production process of the circuit board reduces the difficulty of the circuit board production process, shortens the production cycle of the circuit board, and also improves the stability of the circuit board; it well solves the problem of production problems caused by blind holes in the circuit board structure in the prior art. Problems with complex processes.
  • superposing the first circuit board on the first side of the etched second circuit board includes: sequentially superposing a first insulating layer and a third layer on the first side of the etched second circuit board.
  • a circuit board sequentially superposing a first insulating layer and a third layer on the first side of the etched second circuit board.
  • the circuit board structure takes the camera module circuit board as an example.
  • embodiments of the present application provide a circuit board structure and a manufacturing method thereof, which can be specifically implemented as a new camera module circuit board design solution to solve the pain points of complex circuit board design for high-end projects; compared with traditional Multi-layer (greater than or equal to 2 layers) circuit board design of the camera module.
  • the design of the circuit board is optimized, making the circuit board manufacturing process simpler, the circuit board performance more stable, and the camera
  • the cost of camera modules is greatly reduced, ultimately making the product more cost-effective. Among them, it involves:
  • Protective film 5 used to protect the lens
  • Lens 6 It is an optical lens, used to admit light to the module;
  • Motor 7 used to push the lens to move and achieve focusing
  • IR8 is the filter
  • Component 9 used to support IR
  • Sensor 10 It is a photosensitive component that converts optical signals into electrical signals
  • Circuit board 11 used for electrical connection and the load-bearing surface of the module
  • IC12 is a driver chip that converts and outputs electrical signals
  • Connector 13 used to connect the electrical signal between the whole machine and the camera module
  • Via 14 used for multi-layer circuit boards, changing layers to connect electrical signals
  • Pad 15 As the contact position with the IC on the circuit board;
  • Ink window 17 No ink is printed at this location, and the pad can be exposed.
  • PINs that are generally unnecessary or easily replaced include: 1 PIN definitions that need to be used to assist detection during the production process of the IC unit itself; 2 PIN definitions that do not need to be used for IC functions, such as: IC units can drive 3-axis anti-shake, But the actual module only requires 2-axis anti-shake; 3 IC special function general-purpose input and output port (General Purpose Input Output, GPIO port), GPIO port is a port that can configure special functions by itself; 4 The PIN function of IC is easily replaced by other ICs (Adding an IC can replace some of the functions of the original IC).
  • the pad size is reduced from a conventional 0.3mm design to less than 0.25mm (this At the same time, you can also cut off the edge of the pad to make the pad appear a non-complete circle, ensuring that the shape is ⁇ 0.5 complete circles); ultimately, the wiring near the IC can be completed smoothly, and as shown in Figure 4, the nearby
  • the via hole is in the form of a through hole (corresponding to the communication between the first via hole 3 and the second via hole 4 mentioned above).
  • the circuit board first manufactures the inner layer circuit (corresponding to the above-mentioned second circuit board), then laminates the boards, and then manufactures the outer layer circuit (corresponding to the above-mentioned first circuit board). Finally, drilling and electroplating are enough, which greatly saves the substrate production process compared to traditional designs.
  • the IC can drive the motor to move in three directions: horizontal, front and back, and up and down.
  • an additional IC18 can be added to drive the motor to move up and down.
  • This IC18 can be placed on the circuit board or inside the motor, so that the PINs for the up and down movement of the A1 and A2 motors inside the IC can be replaced. .
  • A1 and A2 are the networks for motor movement in the up and down direction
  • A6, A7 and C7 are the PIN definitions used for special function configuration. Since the PIN pins of A1, A2, A6 and A7 are in this The functions in the solution are not used.
  • the A1, A2, A6 and A7 pads of the IC are first omitted.
  • the pads are removed during the circuit board design process and individual pads are reduced (remove the round ones). edge), the inner (pin) traces come out of the space between the pads, and the vias are designed as through holes, see the dotted box in Figure 11.
  • the design of this example will not affect the overall dimensions of the module, the reliability of the module will be better, the circuit board production cycle of the module will be shorter, and the overall cost of the module will be lower.
  • the IC can drive the motor to move in three directions: horizontal, front and back, and up and down.
  • the special module due to the special module, there is no need for the IC to control the module to move up and down, so that D2 and D3 are not used for the network functions of the motor moving up and down.
  • B7 and C7 , D7 and B10 are PIN definitions used in special function configuration. Since the PIN pins of B7, C7, D7 and B10 are not used in this solution, as shown in Figure 13, the PIN pins can be used in circuit board design.
  • the D2, D3, B7, C7, D7 and B10 pads of the IC are omitted.
  • the pads are removed during the circuit board design process. Individual pads are reduced (reduce the pad diameter), and the inner wiring is routed from the pads to the pads. The space between them is taken out, and the via hole is designed as a through hole. This design will not affect the overall dimensions of the module, the reliability of the module will be better, the circuit board production cycle of the module will be shorter, and the overall cost of the module will be lower.
  • circuit board structure is not limited to camera modules, but can also be applied to other It has a circuit board structure.
  • the methods of the above embodiments can be implemented by means of software plus the necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases the former is better. implementation.
  • the technical solution of the present application can be embodied in the form of a computer software product that is essentially or contributes to the existing technology.
  • the computer software product is stored in a storage medium (such as ROM/RAM, disk , optical disk), including several instructions to cause a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of this application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本申请公开了一种线路板结构及其制作方法、摄像头模组和电子设备，属于电子设备技术领域。其中，线路板结构，包括：相连接的第一线路板和第二线路板，所述第一线路板上的至少一个第一位置区域内设有第一过孔，所述第二线路板上的至少一个第二位置区域内设有第二过孔；所述第一过孔和所述第二过孔相连通；其中，所述第一过孔和所述第二过孔内分别设有第一导电物质，所述第一导电物质用于导通所述第一线路板和第二线路板。

Description

线路板结构及其制作方法、摄像头模组和电子设备
相关申请的交叉引用
本申请主张在2022年07月20日在中国提交的中国专利申请No.202210862329.3的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于电子设备技术领域，具体涉及一种线路板结构及其制作方法、摄像头模组和电子设备。
背景技术
目前随着智能手机的发展与普及，人们期待智能手机的拍照效果要求越来越高，促使着摄像头设计越来越复杂。其中，摄像头模组中的线路板是不可或缺的部件，随着摄像头的设计要求提升，对应的线路板设计也越来越复杂，对线路板的制程工艺提出了更高的要求，同时也就大大影响了摄像头模组线路板的生产制作成本。
具体的，如图1所示，由于模组内摄像头模组中驱动芯片(driver IC)的各个引脚功能(PIN)定义等因素的限制，driver IC内部的PIN(图中虚框内的PIN)需要引线到外侧，行业内通常采用盲埋孔设计方案，其中，driver IC可驱动马达运动。如图2所示，盲埋孔线路板的设计较为复杂，其中涉及第1层线路(板)L1与第2层线路L2之间的盲孔a、第2层线路L2与第3层线路L3之间的盲孔b以及第3层线路L3与第4层线路L4之间的盲孔c；基于此，如图3所示，生产流程需要先进行内层线路制作，进行内层孔加工，然后进行叠板压合，再进行外层线路制作，还需要进行外层盲孔的加工，最后进行孔的电镀流程；这导致各层之间的过孔制作工艺流程较长，品质失效风险高，成本也较高；最终是产品成本高，产品不能维持更好的性价比。
由上可知，现有技术中的线路板结构存在由于设置盲孔导致生产流程复杂等问题。
发明内容
本申请实施例的目的是提供一种线路板结构及其制作方法、摄像头模组和电子设备，能够解决现有技术中的线路板结构由于设置盲孔导致生产流程复杂的问题。
第一方面，本申请实施例提供了一种线路板结构，该线路板结构包括：
相连接的第一线路板和第二线路板，所述第一线路板上的至少一个第一位置区域内设有第一过孔，所述第二线路板上的至少一个第二位置区域内设有第二过孔；所述第一过孔和所述第二过孔相连通；
其中，所述第一过孔和所述第二过孔内分别设有第一导电物质，所述第一导电物质用于导通所述第一线路板和第二线路板。
第二方面，本申请实施例提供了一种摄像头模组，包括：如第一方面所述的线路板结构。
第三方面，本申请实施例提供了一种电子设备，包括：如第二方面所述的摄像头模组。
第四方面，本申请实施例提供了一种线路板结构制作方法，应用于第一方面所述的线路板结构，该方法包括：
获取所述线路板结构中的第二线路板，在所述第二线路板上蚀刻内层线路；
在蚀刻后的第二线路板的第一侧叠加所述第一线路板；
将叠加后的第一线路板和第二线路板进行压合；
在压合后的第一线路板上蚀刻外层线路；
在蚀刻所述外层线路后，在所述第一线路板和第二线路板上进行钻通孔操作；
对钻孔得到的第一线路板和第二线路板上的开孔进行电镀；
其中，所述第一线路板和第二线路板上的开孔是连通的。
在本申请实施例中，所述线路板结构通过设置：相连接的第一线路板和第二线路板，所述第一线路板上的至少一个第一位置区域内设有第一过孔，所述第二线路板上的至少一个第二位置区域内设有第二过孔；所述第一过孔和所述第二过孔相连通；其中，所述第一过孔和所述第二过孔内分别设有第 一导电物质，所述第一导电物质用于导通所述第一线路板和第二线路板；能够实现采用通孔结构来进行线路板之间的连接，而不再需要设置盲孔，从而简化了线路板的生产工艺，降低线路板的制作工艺难度，线路板的制作周期更短，同时也提高了线路板稳定性；很好的解决了现有技术中的线路板结构由于设置盲孔导致生产流程复杂的问题。
附图说明
图1是现有技术中的driver IC引脚定义示意图；
图2是现有技术中的常规4层盲埋孔设计示意图；
图3是现有技术中的常规4层盲埋孔基板生产流程图；
图4是本申请实施例中的线路板结构示意图；
图5是本申请实施例中的线路板结构制作方法示意图；
图6是本申请实施例中的摄像头模组示意图；
图7是本申请实施例中的线路板中IC附近走线示意图；
图8是本申请实施例中的摄像头模组线路板焊盘位置示意图一；
图9是本申请实施例中的线路板结构制作方法具体实现流程示意图；
图10是本申请实施例中的摄像头模组IC结构示意图；
图11是本申请实施例中的摄像头模组线路板焊盘位置示例一；
图12是本申请实施例中的摄像头模组线路板焊盘位置示例二；
图13是本申请实施例中的摄像头模组线路板焊盘位置示意图二。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描 述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的线路板结构进行详细地说明。
本申请实施例提供的线路板结构，如图4所示，包括：
相连接的第一线路板1和第二线路板2，所述第一线路板1上的至少一个第一位置区域内设有第一过孔3，所述第二线路板2上的至少一个第二位置区域内设有第二过孔4；所述第一过孔3和所述第二过孔4相连通；其中，所述第一过孔3和所述第二过孔4内分别设有第一导电物质，所述第一导电物质用于导通所述第一线路板1和第二线路板2。
图4中是以四层线路板为例，可以是包括：两个第一线路板1和两个第二线路板2，第一线路板1包括：第一层线路层L1和第四层线路层L4，第二线路板2包括：第二层线路层L2和第三层线路层L3，但并不以此为限。所述第一过孔内和第二过孔内的导电物质具体可相同或不同，在此不作限制。
在本申请实施例中，所述线路板结构通过设置：相连接的第一线路板和第二线路板，所述第一线路板上的至少一个第一位置区域内设有第一过孔，所述第二线路板上的至少一个第二位置区域内设有第二过孔；所述第一过孔和所述第二过孔相连通；其中，所述第一过孔和所述第二过孔内分别设有第一导电物质，所述第一导电物质用于导通所述第一线路板和第二线路板；能够实现采用通孔结构来进行线路板之间的连接，而不再需要设置盲孔，从而简化了线路板的生产工艺，降低线路板的制作工艺难度，线路板的制作周期更短，同时也提高了线路板稳定性；很好的解决了现有技术中的线路板结构由于设置盲孔导致生产流程复杂的问题。
进一步的，所述第一线路板和所述第二线路板之间设有第一绝缘层，所述第一绝缘层上设有第三过孔，所述第三过孔与所述第一过孔和所述第二过孔相连通；其中，所述第三过孔内设有第二导电物质，所述第二导电物质导通所述第一绝缘层两侧的线路板。
这样可以保证线路板之间的绝缘性；关于“所述第二导电物质导通所述第一绝缘层两侧的线路板”，可以是：所述第二导电物质与所述第一过孔内和第二过孔内的第一导电物质相导通；第二导电物质与第一导电物质相同或不同。
其中，所述第一线路板上设有至少一个芯片引脚，所述芯片引脚与所述第一导电物质相连通。
这样可以保证正常实现引脚功能，其中，第一线路板可以作为外层线路板，但并不以此为限。
本申请实施例中，所述芯片引脚的数量小于芯片的总引脚数量；具体可为：设于线路板上的引脚为必备引脚；这样可以增加用于打过孔和走线的空间。本申请实施例中，所述第一线路板上设有非必备芯片引脚对应的空白区域；其中，所述至少一个芯片引脚的走线设于焊盘与焊盘之间的空间和/或所述空白区域内。
其中，“所述芯片引脚的数量小于芯片的总引脚数量”，具体可以体现为：芯片具有大于一个的引脚，所述引脚中的部分引脚处于悬空或浮起的状态，此部分引脚在使用状态及非使用状态均无电流或信号通过，且此部分引脚正下方投影区的线路板无对应焊盘结构；进一步的，该部分引脚正下方的投影区的线路板可具有过孔或走线，并使用油墨覆盖过孔或走线，但并不以此为限。
本申请实施例中，必备引脚可以是根据芯片的引脚定义和第一规则确定的；其中，所述第一规则包括以下至少一项：被使用的概率大于第一阈值；被替代的概率小于第二阈值，但并不以此为限。
本申请实施例中，至少一个所述芯片引脚为第一类型引脚，所述第一类型引脚的焊盘为圆形，且直径小于0.3mm；或者，所述第一类型引脚的焊盘上设有避让部，可体现为凹陷结构，比如：切除焊盘边缘部分使得焊盘呈现非完整的圆形，确保形状≥0.5个完整圆形。
这样可以进一步增加用于打过孔和走线的空间。
本申请实施例中，至少一个所述芯片引脚为第二类型引脚，所述第二类型引脚的油墨开窗尺寸小于或等于所述第二类型引脚的焊盘尺寸。
这样可以进一步增加用于打过孔和走线的空间。芯片引脚可以既为第一类型引脚也为第二类型引脚，在此不作限定。本方案中，减小油墨开窗是有利于布线(油墨开窗边缘距离线路边缘是需要有安全间距的，减小油墨开窗尺寸实际就是增加了安全间距)。
本申请实施例还提供了一种摄像头模组，包括：上述的线路板结构。
本申请实施例提供的摄像头模组能够实现上述的线路板结构实施例实现的各个过程，为避免重复，这里不再赘述。
本申请实施例还提供了一种电子设备，包括：上述的摄像头模组。
本申请实施例提供的电子设备能够实现上述的摄像头模组实施例实现的各个过程，为避免重复，这里不再赘述。
本申请实施例还提供了一种线路板结构制作方法，应用于上述的线路板结构，如图5所示，所述制作方法包括：
步骤51：获取所述线路板结构中的第二线路板，在所述第二线路板上蚀刻内层线路；
步骤52：在蚀刻后的第二线路板的第一侧叠加所述第一线路板；
步骤53：将叠加后的第一线路板和第二线路板进行压合；
步骤54：在压合后的第一线路板上蚀刻外层线路；
步骤55：在蚀刻所述外层线路后，在所述第一线路板和第二线路板上进行钻通孔操作；
步骤56：对钻孔得到的第一线路板和第二线路板上的开孔进行电镀；其中，所述第一线路板和第二线路板上的开孔是连通的。
其中，第二线路板的第一侧具体是第二线路板的哪一侧不作限制。
本申请实施例中，通过获取所述线路板结构中的第二线路板，在所述第二线路板上蚀刻内层线路；在蚀刻后的第二线路板的第一侧叠加所述第一线路板；将叠加后的第一线路板和第二线路板进行压合；在压合后的第一线路板上蚀刻外层线路；在蚀刻所述外层线路后，在所述第一线路板和第二线路板上进行钻通孔操作；对钻孔得到的第一线路板和第二线路板上的开孔进行电镀；其中，所述第一线路板和第二线路板上的开孔是连通的；能够实现采用通孔结构来进行线路板之间的连接，而不再需要设置盲孔，从而简化了线 路板的生产工艺，降低线路板的制作工艺难度，线路板的制作周期更短，同时也提高了线路板稳定性；很好的解决了现有技术中的线路板结构由于设置盲孔导致生产流程复杂的问题。
本申请实施例中，所述在蚀刻后的第二线路板的第一侧叠加所述第一线路板，包括：在蚀刻后的第二线路板的第一侧依次叠加第一绝缘层和第一线路板。
这样可以保证线路板之间的绝缘性。
下面对本申请实施例提供的线路板结构及其制作方法进行举例说明，线路板结构以摄像头模组线路板为例。
针对上述技术问题，本申请实施例提供了一种线路板结构及其制作方法，具体可实现为一种新型摄像头模组线路板设计方案，以解决高端项目线路板设计复杂的痛点；相比传统的摄像头模组多层(大于或等于2层)线路板设计，经过对芯片和摄像头模组功能的分析，优化线路板的设计，使得线路板的制程工艺更加简单，线路板性能更加稳定，摄摄像头模组的成本大大降低，最终使得产品的性价比更高。其中，涉及：
1、结合驱动芯片(driver IC)和摄像头模组的引脚(PIN)定义特点，识别出可以删减的PIN定义(即非必要引脚)，在线路板上不进行设计焊盘，节约出空间，用于线路板走线设计；
2、对线路板的焊盘进行优化，通过削小焊盘、减小油墨开窗大小，从而节约出空间，用于线路板走线设计；
3、基于以上两点，可以确保模组线路板设计空间充裕，从而避免使用盲孔设计，直接选用通孔设计，简化了线路板的生产工艺，降低线路板的制作工艺难度，线路板的制作周期更短，同时也提高了线路板稳定性。
首先，对本方案涉及的相关部件等进行说明，如图6、图7、图11和图13所示，其中：
保护膜5：用于保护镜头；
镜头6：为光学镜头，用于模组进光；
马达7：用于推动镜头移动，实现对焦；
IR8：为滤光片；
组件9：用于支撑IR；
传感器10(sensor10)：为感光元器件，将光信号转化为电信号；
线路板11：用于电性连接，模组的承载台面；
IC12：为驱动芯片，转换和输出电信号；
连接器13：用于连接整机与摄像头模组的电信号；
过孔14：用于多层线路板，换层连接电信号；
焊盘15：作为线路板中与IC接触位置；
走线16：线路板中的电信号连接作用；
油墨开窗17：该处位置不印刷油墨，可露出焊盘。
如图8所示，在模组设计过程中，IC内部有部分PIN定义是可以不被用到或者容易被替代。其中，一般不需要或者容易被替代的PIN有：①IC单体自身生产过程中需要用来辅助检测的PIN定义；②IC功能无需被使用的PIN定义，如：IC单体可以驱动3轴防抖，但实际模组只需要2轴防抖；③IC特殊功能通用型之输入输出端口(General Purpose Input Output，GPIO端口)，GPIO端口是可以自行配置特殊功能的端口；④IC的PIN功能容易被其他IC替代(增加一个IC，可以替代原始IC的部分功能)。此时，可以进行对IC个别PIN脚省略，线路板设计过程中将不设计该地方的线路或者焊盘。如图7所示，在线路板设计时，减少了不被需要的PIN后，对应线路板上可以不进行焊盘15的设计，此时，可以用于打过孔14和走线的空间随之增多。此外，可通过缩小个别焊盘大小，从而加大焊盘15之间的间距，从而使得焊盘之间可以进行走线，比如：焊盘大小由常规0.3mm设计，缩小到小于0.25mm(此时，也可以切除焊盘边缘部分使得焊盘呈现非完整的圆形，确保形状≥0.5个完整圆形即可)；最终使得IC附近走线可以顺利完成，并且如图4所示，附近的过孔使用通孔形式(对应于上述第一过孔3和第二过孔4相连通)。对应的，如图9所示，线路板先进行内层线路(对应于上述第二线路板)制作，然后进行叠板压合，再进行外层线路(对应于上述第一线路板)制作，最后进行钻孔和电镀即可，相对传统设计，大大节约了基板生产流程。
此外，摄像头模组中IC的种类非常多，线路板的层数种类有多种，如4层、5层、6层、7层等，在此不进行一一列举。
下面对本申请实施例提供的方案进行具体举例。
举例1
假设摄像头模组线路板为4层，IC可以驱动马达实现水平、前后、上下三个方向运动。如图10所示，可以额外增加一个驱动马达上下方向运动的IC18，该IC18可以放置在线路板中，也可以放置在马达内部，使得IC内部的A1和A2马达上下方向运动的PIN可以被替代。此时进行模组线路板设计时，A1和A2为马达上下方向运动的网络，A6、A7和C7为特殊功能配置时用到的PIN定义，由于A1、A2、A6以及A7的PIN脚在该方案中功能未被使用到，如图11所示，先将IC的A1、A2、A6以及A7焊盘省略处理，在线路板设计过程中去掉焊盘，个别焊盘减小处理(削除圆的边缘)，内侧(引脚的)走线从焊盘与焊盘之间空间走出，过孔设计为通孔，参见图11中虚线方框。本举例的设计不会影响模组的外形尺寸，模组的可靠性会更优，模组的线路板生产周期会更短，模组的综合成本会更低。
举例2
假设摄像头模组线路板为6层，IC可以驱动马达实现水平、前后、上下三个方向运动。如图12所示，此时进行模组线路板设计时，由于模组特殊，无需IC控制模组进行上下方向移动，使得D2和D3为马达上下方向运动的网络功能不被使用，B7、C7、D7和B10为特殊功能配置时用到的PIN定义，由于B7、C7、D7和B10的PIN脚在该方案中功能未被使用到；从而如图13所示，在线路板设计时可以将IC的D2、D3、B7、C7、D7和B10焊盘省略处理，在线路板设计过程中去掉焊盘，个别焊盘减小处理(缩小焊盘直径)，内侧走线从焊盘与焊盘之间空间走出，过孔设计为通孔。该设计不会影响模组的外形尺寸，模组的可靠性会更优，模组的线路板生产周期会更短，模组的综合成本会更低。
由上，本申请实施例提供的方案：
1、简化了摄像头模组线路板的生产工艺，使得线路板成本更低；
2、减少了线路板潜在的失效点，使得线路板品质更加可靠；
3、缩短了线路板的生产周期，使得产品开发周期更短。
在此说明，上述线路板结构不局限于摄像头模组上，还可以应用于其他 具备线路板的结构上。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以计算机软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机，计算机，服务器，或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种线路板结构，包括：
    相连接的第一线路板和第二线路板，所述第一线路板上的至少一个第一位置区域内设有第一过孔，所述第二线路板上的至少一个第二位置区域内设有第二过孔；所述第一过孔和所述第二过孔相连通；
    其中，所述第一过孔和所述第二过孔内分别设有第一导电物质，所述第一导电物质用于导通所述第一线路板和第二线路板。
  2. 根据权利要求1所述的线路板结构，其中，所述第一线路板和所述第二线路板之间设有第一绝缘层，所述第一绝缘层上设有第三过孔，所述第三过孔与所述第一过孔和所述第二过孔相连通；
    其中，所述第三过孔内设有第二导电物质，所述第二导电物质导通所述第一绝缘层两侧的线路板。
  3. 根据权利要求1所述的线路板结构，其中，所述第一线路板上设有至少一个芯片引脚，所述芯片引脚与所述第一导电物质相连通。
  4. 根据权利要求3所述的线路板结构，其中，所述芯片引脚的数量小于芯片的总引脚数量。
  5. 根据权利要求3所述的线路板结构，其中，至少一个所述芯片引脚为第一类型引脚，所述第一类型引脚的焊盘为圆形，且直径小于0.3mm；或者，所述第一类型引脚的焊盘上设有避让部。
  6. 根据权利要求3至5任一项所述的线路板结构，其中，至少一个所述芯片引脚为第二类型引脚，所述第二类型引脚的油墨开窗尺寸小于或等于所述第二类型引脚的焊盘尺寸。
  7. 一种摄像头模组，包括：如权利要求1至6任一项所述的线路板结构。
  8. 一种电子设备，包括：如权利要求7所述的摄像头模组。
  9. 一种线路板结构制作方法，应用于如权利要求1至6任一项所述的线路板结构，其中，所述制作方法包括：
    获取所述线路板结构中的第二线路板，在所述第二线路板上蚀刻内层线路；
    在蚀刻后的第二线路板的第一侧叠加所述第一线路板；
    将叠加后的第一线路板和第二线路板进行压合；
    在压合后的第一线路板上蚀刻外层线路；
    在蚀刻所述外层线路后，在所述第一线路板和第二线路板上进行钻通孔操作；
    对钻孔得到的第一线路板和第二线路板上的开孔进行电镀；
    其中，所述第一线路板和第二线路板上的开孔是连通的。
  10. 根据权利要求9所述的线路板结构制作方法，其中，所述在蚀刻后的第二线路板的第一侧叠加所述第一线路板，包括：
    在蚀刻后的第二线路板的第一侧依次叠加第一绝缘层和第一线路板。
PCT/CN2023/107240 2022-07-20 2023-07-13 线路板结构及其制作方法、摄像头模组和电子设备 Ceased WO2024017133A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210862329.3A CN115209617A (zh) 2022-07-20 2022-07-20 线路板结构及其制作方法、摄像头模组和电子设备
CN202210862329.3 2022-07-20

Publications (1)

Publication Number Publication Date
WO2024017133A1 true WO2024017133A1 (zh) 2024-01-25

Family

ID=83584073

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/107240 Ceased WO2024017133A1 (zh) 2022-07-20 2023-07-13 线路板结构及其制作方法、摄像头模组和电子设备

Country Status (2)

Country Link
CN (1) CN115209617A (zh)
WO (1) WO2024017133A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118709631A (zh) * 2024-08-28 2024-09-27 珠海妙存科技有限公司 一种pad结构版图及其设计方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115209617A (zh) * 2022-07-20 2022-10-18 维沃移动通信有限公司 线路板结构及其制作方法、摄像头模组和电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101583250A (zh) * 2008-05-15 2009-11-18 华为技术有限公司 印刷线路板过孔加工方法及印刷线路板、通信设备
US20210273061A1 (en) * 2020-02-27 2021-09-02 Globalfoundries U.S. Inc. Lateral bipolar junction transistor device and method of making such a device
CN214959809U (zh) * 2021-07-13 2021-11-30 维沃移动通信有限公司 摄像头模组及电子设备
CN115209617A (zh) * 2022-07-20 2022-10-18 维沃移动通信有限公司 线路板结构及其制作方法、摄像头模组和电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103037636A (zh) * 2011-09-30 2013-04-10 富葵精密组件(深圳)有限公司 多层电路板及多层电路板的制作方法
CN102802351A (zh) * 2012-08-13 2012-11-28 深圳英飞拓科技股份有限公司 一种用于pcb设计的过孔削减焊盘及其方法
CN105101685B (zh) * 2015-09-02 2018-01-23 广东欧珀移动通信有限公司 一种多层pcb的制作方法及多层pcb
CN105357892B (zh) * 2015-10-29 2018-10-19 广州兴森快捷电路科技有限公司 印制线路板及其制作方法
CN211457493U (zh) * 2019-08-16 2020-09-08 临安盛浙电子有限公司 一种具有新型过孔的pcb板结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101583250A (zh) * 2008-05-15 2009-11-18 华为技术有限公司 印刷线路板过孔加工方法及印刷线路板、通信设备
US20210273061A1 (en) * 2020-02-27 2021-09-02 Globalfoundries U.S. Inc. Lateral bipolar junction transistor device and method of making such a device
CN214959809U (zh) * 2021-07-13 2021-11-30 维沃移动通信有限公司 摄像头模组及电子设备
CN115209617A (zh) * 2022-07-20 2022-10-18 维沃移动通信有限公司 线路板结构及其制作方法、摄像头模组和电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118709631A (zh) * 2024-08-28 2024-09-27 珠海妙存科技有限公司 一种pad结构版图及其设计方法

Also Published As

Publication number Publication date
CN115209617A (zh) 2022-10-18

Similar Documents

Publication Publication Date Title
WO2024017133A1 (zh) 线路板结构及其制作方法、摄像头模组和电子设备
TWI223972B (en) Double-sided printed circuit board without via holes and method of fabricating the same
US11641072B2 (en) PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module
EP4185079A1 (en) Circuit board assembly, manufacturing method and electronic device
WO2023124918A1 (zh) 显示模组及电子设备
CN103096646B (zh) 内埋元件的多层基板的制造方法
CN109905964B (zh) 一种实现高密互连的电路板的制作方法
CN108882558A (zh) 金手指的镀金方法及金手指电路板
WO2021256790A1 (ko) 연성인쇄회로기판의 제조 방법
TWI246384B (en) Multi-layer printed circuit board layout and manufacturing method thereof
CN112130052B (zh) 一种终端及其检测不良的方法
CN105636338B (zh) 柔性电路板走线结构及移动终端
CN106793566A (zh) 一种印刷电路板装配板的制作方法及移动终端
CN108156764A (zh) 透明壳体上的金属线路制作方法、透明壳体及移动终端
WO2024140509A1 (zh) 电路板及电子设备
CN102413646A (zh) 电路板制作方法
CN115460781A (zh) 一种阻抗控制的pcb设计制作方法及pcb板
CN104468871B (zh) 一种电子设备
WO2023109048A1 (zh) Pcb及其制作方法
KR101037544B1 (ko) 측면 컨택홀 패드를 갖는 인쇄회로기판의 제조방법
KR20100072790A (ko) 휴대폰용 루프 안테나 제조 방법
CN114391304A (zh) 板对板连接结构及其制作方法
CN114430609B (zh) 一种电池保护板、加工方法及电子设备
CN116193735B (zh) 一种阶梯槽底部图形的制作方法
CN113690662B (zh) 一种连接器和印刷线路板总成

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23842197

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 27/05/2025)

122 Ep: pct application non-entry in european phase

Ref document number: 23842197

Country of ref document: EP

Kind code of ref document: A1