WO2024011945A1 - 半导体隐形切割用粘黏剂涂抹装置 - Google Patents

半导体隐形切割用粘黏剂涂抹装置 Download PDF

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Publication number
WO2024011945A1
WO2024011945A1 PCT/CN2023/082878 CN2023082878W WO2024011945A1 WO 2024011945 A1 WO2024011945 A1 WO 2024011945A1 CN 2023082878 W CN2023082878 W CN 2023082878W WO 2024011945 A1 WO2024011945 A1 WO 2024011945A1
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Prior art keywords
storage box
fixedly connected
slider
rear side
spring
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PCT/CN2023/082878
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English (en)
French (fr)
Inventor
蒋习锋
崔梦晨
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济南金威刻激光科技股份有限公司
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Priority to KR1020237028586A priority Critical patent/KR102620324B1/ko
Publication of WO2024011945A1 publication Critical patent/WO2024011945A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet

Definitions

  • the present invention relates to the technical field of adhesive application devices, and in particular to an adhesive application device for invisible cutting of semiconductors.
  • Semiconductor invisible cutting can avoid damage to the surface of the cutting object, and has the characteristics of high processing precision and high processing efficiency, which can greatly improve the quality, efficiency and benefit of chip production and manufacturing.
  • an adhesive applicator needs to be used to adhere the semiconductor.
  • the amount of adhesive used in most adhesive applicators is the same.
  • the adhesive application device with the same output is used to apply adhesive to semiconductor materials of different types and sizes, it may use excessive adhesive on smaller types of semiconductors, which in turn may cause damage to the semiconductor materials.
  • less adhesive will be used, which will make the adhesive effect unreliable and affect the use of semiconductor materials.
  • the adhesive applicator does not have the ability to apply according to the semiconductor Adjusting the amount of adhesive used according to different models will cause the above problems, which will be detrimental to the widespread use of the overall device, and in turn will reduce the effectiveness of the overall device.
  • the purpose of the present invention is to solve at least one of the technical problems existing in the prior art, to provide a method that can accurately adjust the output of adhesive, to quickly block the discharge port, and to solve the problem of adhesive application with the same output.
  • Devices using excessive amounts of adhesive on smaller semiconductors can cause Causes damage to semiconductor materials.
  • less adhesive is used, which affects the use of semiconductor materials.
  • an adhesive application device for invisible cutting of semiconductors including a storage box.
  • the bottom of the storage box is connected with a discharge pipe, and a discharge pipe is provided on the right side of the discharge pipe. mouth, the bottom of the storage box is inclined, a chute is provided on the right side of the discharge pipe, and a quick blocking device is provided in the chute.
  • a groove is provided on the right wall of the storage box, and a discharge pipe is provided in the groove. regulating device;
  • the discharge adjustment device includes a baffle, which is slidingly connected inside the groove.
  • a first spring is fixedly connected between the right side of the baffle and the right wall of the groove.
  • a connecting rod is fixedly connected to the rear side of the baffle, and the connecting rod is fixedly connected to the back side of the baffle. The rod extends through the storage box to the rear side of the storage box.
  • a push plate is fixedly connected to the bottom of the storage box.
  • the shape of the push plate is an inverted "7" shape and the left bottom is inclined.
  • a first channel is provided on the rear side of the storage box, the connecting rod is slidably connected in the first channel, and a connecting plate is fixedly connected to the surface of the connecting rod located on the rear side of the storage box.
  • the inner wall of the connecting plate slides through the limiting rod, and the surface of the limiting rod is movablely sleeved with a second spring.
  • the front side of the second spring is fixedly connected to the rear side of the connecting plate, and the rear side of the second spring is fixed. It is connected to the surface of the limit rod, a slot is provided on the rear side of the storage box, and the limit rod is slidably connected in the slot.
  • the quick blocking device includes a slider, the slider is slidingly connected in the chute, and the shapes of the slider and the chute are both "T" shaped and consistent.
  • a third spring is fixedly connected between the bottom of the slider and the bottom wall of the chute, a moving plate is fixedly connected to the right side of the slider, and the moving plate is slidingly connected to the right side of the discharge pipe.
  • a limited groove is provided on the left side of the slide block
  • a connecting groove is provided on the left wall of the slide block
  • a clamping block is slidingly connected to the inside of the connecting slot, and the left side of the clamping block is fixedly connected to the left wall of the connecting slot.
  • a movable rod is fixedly connected to the rear side of the clamping block, a second channel is provided at the rear side of the discharge pipe, and the movable rod is slidably connected in the second channel.
  • the adhesive application device for invisible cutting of semiconductors moves the limit rod backward and then moves the connecting rod to the right.
  • the connecting rod moves to the right to drive the push plate to move to the right, thereby effectively adjusting the storage box into
  • the amount of adhesive in the discharge pipe will then stop moving the limit rod.
  • the limit rod Under the elastic force of the second spring, the limit rod will move forward and reset into the slot, and finally the push plate will complete the movement of the storage box.
  • the amount of adhesive entering the discharge tube is accurately adjusted and the push plate is fixed, so that the overall device can better adjust the amount of adhesive used in different semiconductors when applying adhesive to semiconductors. Precise adjustment makes the overall device better suitable for applying different semiconductors, which is more conducive to improving the use effect of the overall device.
  • the adhesive applicator for invisible cutting of semiconductors has an inverted "7" shape and an inclined bottom on the left side of the push plate, so that the push plate can move more accurately when following the storage box to move to the left. Smoothly push the adhesive output from the discharge port so that the adhesive can be spread evenly on the surface of the semiconductor, making the adhesive evenly spread and easier to use.
  • the shapes of the slider and the chute are both "T" shaped and consistent.
  • the chute effectively limits the movement range of the slider so that the slider can only It slides up and down in the chute while preventing the slider from slipping out of the chute to ensure the stability of the slider's movement.
  • the adhesive application device for invisible cutting of semiconductors moves the storage box to the left and drives the push plate to move to the left.
  • the push plate moves to the left to push and smooth the adhesive output from the discharge port, and then This effectively enables the adhesive to be spread more evenly on the surface of the semiconductor after application, which is more conducive to the use of the overall device.
  • This adhesive application device for invisible cutting of semiconductors moves the movable rod to the left to disengage the slider from the limit groove, so that the movable plate can quickly move downward and reset under the elastic force of the third spring. , and then restore the blocking of the discharge port to avoid being unable to quickly remove the adhesive when not using adhesive. Closing the discharge port allows the adhesive to be discharged from the discharge port when not in use, further improving the use effect of the overall device and making the use of the overall device more flexible.
  • Figure 1 is a schematic structural diagram of an adhesive application device for semiconductor invisible cutting according to the present invention
  • Figure 2 is a schematic diagram of the interior of the storage box of the present invention.
  • Figure 3 is an enlarged schematic diagram of position A in Figure 1 of the present invention.
  • Figure 4 is an enlarged schematic diagram of B in Figure 1 of the present invention.
  • FIG. 5 is an enlarged schematic diagram of C in Figure 2 of the present invention.
  • FIG. 6 is a schematic diagram of the chute of the present invention.
  • an adhesive application device for invisible cutting of semiconductors including a storage box 1.
  • Adhesive is stored in the storage box 1, and the bottom of the storage box 1 is connected.
  • the specific number is determined according to the actual situation.
  • the bottom of the storage box 1 is inclined, thereby making the sticky material in the storage box 1
  • the adhesive can more smoothly flow into the discharge pipe 2 through the bottom of the storage box 1 in an inclined manner.
  • the bottom of the storage box 1 is fixedly connected with a push plate 3.
  • the push plate 3 is in the shape of an inverted "7" and has a left The side bottom is inclined, and a groove 4 is provided on the right wall of the storage box 1.
  • a baffle 5 is slidingly connected to the inside of the groove 4.
  • the baffle 5 slides left and right in the groove 4.
  • the baffle 5 can face the discharge pipe. 2 to block, a first spring 6 is fixedly connected between the right side of the baffle 5 and the right wall of the groove 4, a connecting rod 7 is fixedly connected to the rear side of the baffle 5, and the connecting rod 7 extends through the storage box 1 Extending to the rear side of the storage box 1, a first channel 8 is provided on the rear side of the storage box 1.
  • the connecting rod 7 is slidably connected in the first channel 8, and the connecting rod 7 slides left and right in the first channel 8.
  • a connecting plate 9 is fixedly connected to the surface of the connecting rod 7 located at the rear side of the storage box 1.
  • the inner wall of the connecting plate 9 slides through the limiting rod 10.
  • a second spring 12 is movably connected to the surface of the limiting rod 10.
  • the front side of the spring 12 is fixedly connected to the rear side of the connecting plate 9, the rear side of the second spring 12 is fixedly connected to the surface of the limiting rod 10, and a plurality of slots 11 are provided on the rear side of the storage box 1.
  • the specific number is according to Depending on the actual situation, the distances between the plurality of clamping slots 11 are all the same, the limiting rod 10 is slidingly connected in the clamping slot 11, and the limiting rod 10 slides back and forth in the clamping slot 11.
  • the baffle 5 protrudes from the left side of the groove 4 and blocks the discharge pipe 2.
  • the limiting rod 10 is located in the slot 11 Inside, when it is necessary to apply semiconductor, the limit rod 10 is moved backward, and the limit rod 10 moves backward to drive the second spring 12 to move backward. At the same time, the limit rod 10 moves backward and is disengaged from the slot 11. Then move the connecting rod 7 to the right, and the connecting rod 7 moves to the right to drive the push plate 3 to move backward. At this time, the push plate 3 no longer completely blocks the inside of the discharge pipe 2, and the connecting rod 7 moves to the right to drive the connecting plate 9 to the right.
  • the connecting plate 9 moves to the right and drives the limit rod 10 to move to the right.
  • the baffle 5 opens one end of the distance to the inside of the discharge pipe 2.
  • the limit rod 10 finally moves to the rear side of the appropriate slot 11, and then stops moving the limit rod 10.
  • the limit rod 10 moves forward and smoothly enters the slot 11.
  • the connecting plate 9 is no longer moving at this time, and the push plate 3 is finally positioned, thereby completing the different blocking distances of the push plate 3 to the inside of the discharge pipe 2, so that the adhesive in the storage box 1 enters the discharge pipe The amount within 2 can be adjusted accurately.
  • the material entering the discharge pipe 2 is output to the surface of the semiconductor through the discharge port 13.
  • the storage box 1 is moved to the left, and the storage box 1 is moved to the left.
  • the left movement drives the discharge port 13 to move to the left.
  • the storage box 1 moves to the left and drives the push plate 3 to move to the left.
  • the push plate 3 moves to the left to push and smooth the adhesive output from the discharge port 13, thereby effectively sticky
  • the agent can be spread more evenly on the surface of the semiconductor, which is more conducive to the use of the overall device.
  • the connecting rod 7 moves to the right and drives the push plate 3 to move to the right, thereby effectively adjusting the flow of adhesive from the storage box 1 into the discharge pipe 2 amount, and then stop moving the limit rod 10.
  • the limit rod 10 moves forward and resets into the slot 11, and finally the push plate 3 completes the entry into the storage box 1.
  • the amount of adhesive in the discharge tube 2 is accurately adjusted and the push plate 3 is fixed, so that the overall device can better use different adhesives used in different semiconductors when applying adhesive to semiconductors.
  • the precise adjustment of the amount makes the overall device better suitable for the application of different semiconductors, which is more conducive to improving the use effect of the overall device.
  • the push plate 3 Because the shape of the push plate 3 is an inverted "7" shape and the left bottom is inclined, the push plate 3 can more smoothly push the sticky liquid output from the discharge port 13 when following the movement of the storage box 1 to the left.
  • the agent allows the adhesive to be spread evenly on the surface of the semiconductor, making the adhesive evenly spread and easier to use.
  • FIG. 4-6 There is a chute 14 on the right side of the discharge pipe 2.
  • a slider 15 is slidingly connected in the chute 14.
  • the slider 15 slides up and down in the chute 14.
  • the connection between the slider 15 and the chute 14 is The shapes are all "T" shaped and consistent, thereby effectively limiting the movement range of the slider 15 through the chute 14, so that the slider 15 can only slide up and down in the chute 14, while preventing the slider 15 from sliding out of the chute 14. slipping off to ensure the movement stability of the slider 15.
  • a third spring 17 is fixedly connected between the bottom of the slider 15 and the bottom wall of the chute 14.
  • a moving plate 16 is fixedly connected to the right side of the slider 15.
  • the moving plate 16 is slidably connected to the right side of the discharge pipe 2 and moves.
  • the plate 16 slides up and down on the right side of the discharge pipe 2.
  • the moving plate 16 has a blocking effect on the right side of the discharge port 13.
  • a limiting groove 21 is provided on the left side of the slider 15.
  • the left wall of the chute 14 is provided with a connecting groove 18.
  • the inside of the connecting groove 18 is slidingly connected with a clamping block 19.
  • a fourth spring 20 is fixedly connected between the left side of the clamping block 19 and the left wall of the connecting slot 18.
  • the clamping block 19 Limited
  • the clamping block 19 slides left and right in the limiting slot 21.
  • the movable rod 22 is fixedly connected to the rear side of the clamping block 19.
  • a second channel 23 is provided at the rear side of the discharge pipe 2.
  • the movable rod 22 is The second channel 23 is slidingly connected, and the movable rod 22 slides left and right in the second channel 23 .
  • the slider 15 By moving the movable rod 22 to the left, the slider 15 is detached from the limiting groove 21, so that the movable plate 16 can quickly move downward and reset under the elastic force of the third spring 17, thereby restoring the blocking of the discharge port 13. , to avoid being unable to quickly close the discharge port 13 when the adhesive is not in use, so that the adhesive will be discharged from the discharge port 13 after not being used, further improving the use effect of the overall device, and making the overall The use of the device is more flexible.
  • the connecting plate 9 moves to the right to drive the limit rod 10 to move to the right.
  • the baffle 5 opens one end of the distance to the inside of the discharge pipe 2, and finally moves to the back side of the appropriate card slot 11 through the limit rod 10, and then stops limiting the position.
  • the limit rod 10 moves, under the elastic force of the second spring 12, the limit rod 10 moves forward and smoothly enters the inside of the slot 11.
  • the connecting plate 9 is no longer moving, and finally the push plate 3 is positioned, thereby completing the push.
  • the plate 3 has different blocking distances inside the discharge pipe 2 and accurately adjusts the amount of adhesive in the storage box 1 entering the discharge pipe 2 .
  • the material entering the discharge pipe 2 is output to the surface of the semiconductor through the discharge port 13.
  • the storage box 1 is moved to the left, and the storage box 1 is moved to the left.
  • the left movement drives the discharge port 13 to move to the left.
  • the storage box 1 moves to the left and drives the push plate 3 to move to the left.
  • the push plate 3 moves to the left to push and smooth the adhesive output from the discharge port 13.

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  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

半导体隐形切割用粘黏剂涂抹装置，包括储料箱（1），储料箱（1）的底部连通有出料管（2），出料管（2）的右侧开设有出料口（13），储料箱（1）内的底部为倾斜状，出料管（2）的右侧开设有滑槽（14），滑槽（14）内设置有快速阻挡装置，储料箱（1）的右壁开设有凹槽（4），凹槽（4）内设置有出料调节装置。该涂抹装置能够根据半导体使用的不同粘黏剂的使用量进行精准的调节。

Description

半导体隐形切割用粘黏剂涂抹装置
本发明要求于2022年7月15日提交中国专利局、申请号为202210837427.1、发明名称为“半导体隐形切割用粘黏剂涂抹装置”的中国专利申请的优先权，其全部内容通过引用结合在本发明中。
技术领域
本发明涉及粘黏剂涂抹装置技术领域，特别涉及半导体隐形切割用粘黏剂涂抹装置。
背景技术
半导体隐形切割可以避免对切割物体的表面造成损伤,并且具有加工精度高、加工效率高等特点,可以大幅提升芯片生产制造的质量、效率、效益。
在半导体隐形切割过程中需要使用到粘黏剂涂抹装置对半导体进行粘黏工作，在粘黏剂涂抹装置的使用中，大多粘黏剂涂抹装置中粘黏剂的使用量均为相同的量，此时输出量相同的粘黏剂涂抹装置在对不同型号不同大小的半导体材料使用涂抹使用粘黏剂时，可能会对较小型号半导体使用过量的粘黏剂，进而则会造成半导体材料的损坏，在当对较大型号的半导体使用时则会产生使用了较少的粘黏剂，则会使粘黏效果不牢靠，影响对半导体材料的使用，进而当粘黏剂涂抹装置不具备根据半导体型号的不同来调节粘黏剂的使用量，则会产生以上的问题，则会不利于对整体装置的广泛使用性，进而则会降低整体装置的使用效果。
发明内容
本发明的目的在于至少解决现有技术中存在的技术问题之一，提供可对粘黏剂的输出量进行精准调节，可快速对出料口进行阻挡，能够解决输出量相同的粘黏剂涂抹装置在对较小型号半导体使用过量的粘黏剂，进而则会造 成半导体材料的损坏，在当对较大型号的半导体使用时则会产生使用了较少的粘黏剂，影响对半导体材料的使用的问题。
为实现上述目的，本发明提供如下技术方案：半导体隐形切割用粘黏剂涂抹装置，包括储料箱，所述储料箱的底部连通有出料管，出料管的右侧开设有出料口，储料箱内的底部为倾斜状，出料管的右侧开设有滑槽，滑槽内设置有快速阻挡装置，储料箱的右壁开设有凹槽，凹槽内设置有出料调节装置；
出料调节装置包括挡板，挡板在凹槽的内部滑动连接，挡板的右侧与凹槽的右壁之间固定连接有第一弹簧,挡板的后侧固定连接有连接杆，连接杆贯穿储料箱延伸至储料箱的后侧。
优选的，所述储料箱的底部固定连接有推板，推板的形状为倒置的“7”字形且左侧底部为倾斜状。
优选的，所述储料箱的后侧开设有第一通道，连接杆在第一通道内滑动连接，位于储料箱后侧的连接杆的表面固定套接有连接板。
优选的，所述连接板的内壁滑动贯穿有限位杆，限位杆的表面活动套接有第二弹簧，第二弹簧的前侧固定连接在连接板的后侧，第二弹簧的后侧固定连接在限位杆的表面，储料箱的后侧开设有卡槽，限位杆在卡槽内滑动连接。
优选的，所述快速阻挡装置包括滑块，滑块在滑槽内滑动连接，滑块与滑槽的形状均为“T”字形且相吻合。
优选的，所述滑块的底部与滑槽的底壁之间固定连接有第三弹簧，滑块的右侧固定连接有移动板，移动板在出料管的右侧滑动连接。
优选的，所述滑块的左侧开设有限位槽，滑槽的左壁开设有连接槽，连接槽的内部滑动连接有卡块，卡块的左侧与连接槽的左壁之间固定连接有第四弹簧，卡块在限位槽内滑动连接。
优选的，所述卡块的后侧固定连接有活动杆，出料管的后侧开设有第二通道，活动杆在第二通道内滑动连接。
与现有技术相比，本发明的有益效果是：
(1)、该半导体隐形切割用粘黏剂涂抹装置，通过向后移动限位杆之后向右移动连接杆，连接杆向右移动带动推板向右移动，进而有效的调节储料箱进入到出料管内的粘黏剂的量，之后停止对限位杆的移动，在第二弹簧的弹力作用下使限位杆向前移动复位进入到卡槽内，最终使推板完成对储料箱进入到出料管内的粘黏剂量的精准量调节并对推板进行固定，进而使整体装置在对半导体进行粘黏剂涂抹时能够更好的根据不同半导体所使用的不同粘黏剂的使用量进行精准的调节作用，使整体装置能够更好的适用于不同的半导体的涂抹工作，进而更有利于提高整体装置的使用效果。
(2)、该半导体隐形切割用粘黏剂涂抹装置，通过推板的形状为倒置的“7”字形且左侧底部为倾斜状，进而使推板在跟随储料箱向左移动时能够更流畅的推动出料口内输出的粘黏剂，使粘黏剂能够更均匀的平铺到半导体的表面，使粘黏剂均匀平铺更便于进行使用。
(3)、该半导体隐形切割用粘黏剂涂抹装置，滑块与滑槽的形状均为“T”字形且相吻合，进而通过滑槽有效的限制滑块的移动范围，使滑块只能在滑槽内上下滑动，同时防止滑块从滑槽内滑脱，保证滑块的移动稳定性。
(4)、该半导体隐形切割用粘黏剂涂抹装置，通过储料箱向左移动同时带动推板向左移动，推板向左移动对出料口输出的粘黏剂进行推动铺平，进而有效的使粘黏剂在涂抹之后能够进行更均匀的铺在半导体的表面，进而更有利于整体装置的使用。
(5)、该半导体隐形切割用粘黏剂涂抹装置，通过向左移动活动杆进而使滑块从限位槽内脱离，使移动板在第三弹簧的弹力作用下能够快速的向下移动复位，进而恢复对出料口的阻挡，避免在不使用粘黏剂时不能够快速的 对出料口进行关闭，使粘黏剂在不使用后还会从出料口内排出，进一步完善了整体装置的使用效果，使整体装置的使用更加的灵活。
附图说明
下面结合附图和实施例对本发明进一步地说明：
图1为本发明半导体隐形切割用粘黏剂涂抹装置的结构示意图；
图2为本发明储料箱内部的示意图；
图3为本发明图1中A处放大的示意图；
图4为本发明图1中B处放大的示意图；
图5为本发明图2中C处放大的示意图；
图6为本发明滑槽的示意图。
附图标记：1、储料箱；2、出料管；3、推板；4、凹槽；5、挡板；6、第一弹簧；7、连接杆；8、第一通道；9、连接板；10、限位杆；11、卡槽；12、第二弹簧；13、出料口；14、滑槽；15、滑块；16、移动板；17、第三弹簧；18、连接槽；19、卡块；20、第四弹簧；21、限位槽；22、活动杆；23、第二通道。
具体实施方式
请参阅图1-3，本发明提供一种技术方案：半导体隐形切割用粘黏剂涂抹装置，包括储料箱1，储料箱1内出储存有粘黏剂，储料箱1的底部连通有出料管2，出料管2的右侧开设有多个出料口13，具体数量根据实际情况来定，储料箱1内的底部为倾斜状，进而使储料箱1内的粘黏剂能够更顺利的通过储料箱1内的底部倾斜状流入出料管2内，储料箱1的底部固定连接有推板3，推板3的形状为倒置的“7”字形且左侧底部为倾斜状，储料箱1的右壁开设有凹槽4，凹槽4的内部滑动连接有挡板5，挡板5在凹槽4内左右滑动，挡板5能够对出料管2进行阻挡，挡板5的右侧与凹槽4的右壁之间固定连接有第一弹簧6,挡板5的后侧固定连接有连接杆7，连接杆7贯穿储料箱1延 伸至储料箱1的后侧，储料箱1的后侧开设有第一通道8，连接杆7在第一通道8内滑动连接，连接杆7在第一通道8内左右滑动。
位于储料箱1后侧的连接杆7的表面固定套接有连接板9，连接板9的内壁滑动贯穿有限位杆10，限位杆10的表面活动套接有第二弹簧12，第二弹簧12的前侧固定连接在连接板9的后侧，第二弹簧12的后侧固定连接在限位杆10的表面，储料箱1的后侧开设有多个卡槽11，具体数量根据实际情况来定，多个卡槽11之间的距离均相同，限位杆10在卡槽11内滑动连接，限位杆10在卡槽11内前后滑动。
静止状态下，在第一弹簧6的弹力作用下，挡板5突出凹槽4左侧并对出料管2进行阻挡，在第二弹簧12的弹力作用下，限位杆10位于卡槽11的内部，当需要对半导体进行涂抹时，向后移动限位杆10，限位杆10向后移动带动第二弹簧12向后移动，同时限位杆10向后移动从卡槽11内脱离，之后向右移动连接杆7，连接杆7向右移动带动推板3向后移动，此时推板3不在完全对出料管2内部进行阻挡，连接杆7向右移动带动连接板9向右移动，连接板9向右移动带动限位杆10向右移动，当限位杆10移动至有一个卡槽11的后侧时，此时挡板5对出料管2的内部开启一端距离，通过限位杆10最终移动到合适的卡槽11的后侧，之后停止对限位杆10的移动，在第二弹簧12的弹力作用下，限位杆10向前移动顺利进入到卡槽11的内部，此时连接板9不在移动，最终使推板3进行定位，进而完成推板3对出料管2内部不同的阻挡距离，对储料箱1内的粘黏剂进入到出料管2内的量进行精准量的调节作用。
对进入出料管2内的粘黏剂的量调节完毕之后，进入出料管2内的物料通过出料口13输出至半导体的表面，同时向左移动储料箱1，储料箱1向左移动带动出料口13向左移动，储料箱1向左移动同时带动推板3向左移动，推板3向左移动对出料口13输出的粘黏剂进行推动铺平，进而有效的使粘黏 剂在涂抹之后能够进行更均匀的铺在半导体的表面，进而更有利于整体装置的使用。
通过向后移动限位杆10之后向右移动连接杆7，连接杆7向右移动带动推板3向右移动，进而有效的调节储料箱1进入到出料管2内的粘黏剂的量，之后停止对限位杆10的移动，在第二弹簧12的弹力作用下使限位杆10向前移动复位进入到卡槽11内，最终使推板3完成对储料箱1进入到出料管2内的粘黏剂量的精准量调节并对推板3进行固定，进而使整体装置在对半导体进行粘黏剂涂抹时能够更好的根据不同半导体所使用的不同粘黏剂的使用量进行精准的调节作用，使整体装置能够更好的适用于不同的半导体的涂抹工作，进而更有利于提高整体装置的使用效果。
通过推板3的形状为倒置的“7”字形且左侧底部为倾斜状，进而使推板3在跟随储料箱1向左移动时能够更流畅的推动出料口13内输出的粘黏剂，使粘黏剂能够更均匀的平铺到半导体的表面，使粘黏剂均匀平铺更便于进行使用。
请参阅图4-6，出料管2的右侧开设有滑槽14，滑槽14内滑动连接有滑块15，滑块15在滑槽14内上下滑动，滑块15与滑槽14的形状均为“T”字形且相吻合，进而通过滑槽14有效的限制滑块15的移动范围，使滑块15只能在滑槽14内上下滑动，同时防止滑块15从滑槽14内滑脱，保证滑块15的移动稳定性。
滑块15的底部与滑槽14的底壁之间固定连接有第三弹簧17，滑块15的右侧固定连接有移动板16，移动板16在出料管2的右侧滑动连接，移动板16在出料管2的右侧上下滑动，移动板16对出料口13的右侧具有阻挡作用，滑块15的左侧开设有限位槽21。
滑槽14的左壁开设有连接槽18，连接槽18的内部滑动连接有卡块19，卡块19的左侧与连接槽18的左壁之间固定连接有第四弹簧20，卡块19在限 位槽21内滑动连接，卡块19在限位槽21内左右滑动，卡块19的后侧固定连接有活动杆22，出料管2的后侧开设有第二通道23，活动杆22在第二通道23内滑动连接，活动杆22在第二通道23内左右滑动。
静止状态下，在第三弹簧17的弹力作用下，移动板16对出料口13的右侧进行阻挡，此时卡块19位于连接槽18的内部，同时第四弹簧20处于挤压状态，当需要使用出料口13时，向上移动移动板16，移动板16向上移动带动滑块15在滑槽14内向上移动，滑块15向上移动带动限位槽21向上移动，当滑块15带动限位槽21移动至滑块15的右侧时，在第四弹簧20的弹力作用下，滑块15右侧不在受到移动板16左侧的阻挡，此时滑块15开始向右移动，滑块15向右移动进入到限位槽21的内部，此时滑块15与限位槽21的内壁完成相互阻挡，此时移动板16完成定位，同时不在对出料口13进行阻挡。
当不需要再使用出料口13时，只需要向左移动活动杆22，活动杆22向左移动带动卡块19向左移动，卡块19向左移动开始压缩第四弹簧20并进入到连接槽18内部，此时卡块19从限位槽21内脱离，之后在第三弹簧17的弹力作用下，移动板16向下移动复位恢复对出料口13的阻挡，使出料口13在不使用时能够快速的完成关闭。
通过向左移动活动杆22进而使滑块15从限位槽21内脱离，使移动板16在第三弹簧17的弹力作用下能够快速的向下移动复位，进而恢复对出料口13的阻挡，避免在不使用粘黏剂时不能够快速的对出料口13进行关闭，使粘黏剂在不使用后还会从出料口13内排出，进一步完善了整体装置的使用效果，使整体装置的使用更加的灵活。
工作原理：静止状态下，在第一弹簧6的弹力作用下，挡板5突出凹槽4左侧并对出料管2进行阻挡，在第二弹簧12的弹力作用下，限位杆10位于卡槽11的内部，当需要对半导体进行涂抹时，向后移动限位杆10，限位杆 10向后移动带动第二弹簧12向后移动，同时限位杆10向后移动从卡槽11内脱离，之后向右移动连接杆7，连接杆7向右移动带动推板3向后移动，此时推板3不在完全对出料管2内部进行阻挡，连接杆7向右移动带动连接板9向右移动，连接板9向右移动带动限位杆10向右移动，当限位杆10移动至有一个卡槽11的后侧时，此时挡板5对出料管2的内部开启一端距离，通过限位杆10最终移动到合适的卡槽11的后侧，之后停止对限位杆10的移动，在第二弹簧12的弹力作用下，限位杆10向前移动顺利进入到卡槽11的内部，此时连接板9不在移动，最终使推板3进行定位，进而完成推板3对出料管2内部不同的阻挡距离，对储料箱1内的粘黏剂进入到出料管2内的量进行精准量的调节作用。
对进入出料管2内的粘黏剂的量调节完毕之后，进入出料管2内的物料通过出料口13输出至半导体的表面，同时向左移动储料箱1，储料箱1向左移动带动出料口13向左移动，储料箱1向左移动同时带动推板3向左移动，推板3向左移动对出料口13输出的粘黏剂进行推动铺平。
上面结合附图对本发明实施例作了详细说明，但是本发明不限于上述实施例，在所述技术领域普通技术人员所具备的知识范围内，还可以在不脱离本发明宗旨的前提下作出各种变化。

Claims (8)

  1. 半导体隐形切割用粘黏剂涂抹装置，其特征在于：包括储料箱(1)，所述储料箱(1)的底部连通有出料管(2)，出料管(2)的右侧开设有出料口(13)，储料箱(1)内的底部为倾斜状，出料管(2)的右侧开设有滑槽(14)，滑槽(14)内设置有快速阻挡装置，储料箱(1)的右壁开设有凹槽(4)，凹槽(4)内设置有出料调节装置；
    出料调节装置包括挡板(5)，挡板(5)在凹槽(4)的内部滑动连接，挡板(5)的右侧与凹槽(4)的右壁之间固定连接有第一弹簧(6),挡板(5)的后侧固定连接有连接杆(7)，连接杆(7)贯穿储料箱(1)延伸至储料箱(1)的后侧。
  2. 根据权利要求1所述的半导体隐形切割用粘黏剂涂抹装置，其特征在于：所述储料箱(1)的底部固定连接有推板(3)，推板(3)的形状为倒置的“7”字形且左侧底部为倾斜状。
  3. 根据权利要求2所述的半导体隐形切割用粘黏剂涂抹装置，其特征在于：所述储料箱(1)的后侧开设有第一通道(8)，连接杆(7)在第一通道(8)内滑动连接，位于储料箱(1)后侧的连接杆(7)的表面固定套接有连接板(9)。
  4. 根据权利要求3所述的半导体隐形切割用粘黏剂涂抹装置，其特征在于：所述连接板(9)的内壁滑动贯穿有限位杆(10)，限位杆(10)的表面活动套接有第二弹簧(12)，第二弹簧(12)的前侧固定连接在连接板(9)的后侧，第二弹簧(12)的后侧固定连接在限位杆(10)的表面，储料箱(1)的后侧开设有卡槽(11)，限位杆(10)在卡槽(11)内滑动连接。
  5. 根据权利要求4所述的半导体隐形切割用粘黏剂涂抹装置，其特征在于：所述快速阻挡装置包括滑块(15)，滑块(15)在滑槽(14)内滑动连接，滑块(15)与滑槽(14)的形状均为“T”字形且相吻合。
  6. 根据权利要求5所述的半导体隐形切割用粘黏剂涂抹装置，其特征在 于：所述滑块(15)的底部与滑槽(14)的底壁之间固定连接有第三弹簧(17)，滑块(15)的右侧固定连接有移动板(16)，移动板(16)在出料管(2)的右侧滑动连接。
  7. 根据权利要求6所述的半导体隐形切割用粘黏剂涂抹装置，其特征在于：所述滑块(15)的左侧开设有限位槽(21)，滑槽(14)的左壁开设有连接槽(18)，连接槽(18)的内部滑动连接有卡块(19)，卡块(19)的左侧与连接槽(18)的左壁之间固定连接有第四弹簧(20)，卡块(19)在限位槽(21)内滑动连接。
  8. 根据权利要求7所述的半导体隐形切割用粘黏剂涂抹装置，其特征在于：所述卡块(19)的后侧固定连接有活动杆(22)，出料管(2)的后侧开设有第二通道(23)，活动杆(22)在第二通道(23)内滑动连接。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010191228A (ja) * 2009-02-19 2010-09-02 Seiko Epson Corp 圧力調整弁および液滴吐出装置
US20180085776A1 (en) * 2016-09-27 2018-03-29 Nordson Corporation Melter for supplying liquid adhesive
CN210230447U (zh) * 2019-05-14 2020-04-03 沭阳县牡丹木业有限公司 一种板面涂胶装置
CN211831857U (zh) * 2020-03-06 2020-11-03 李湘华 一种苗圃用精准施肥器
CN215918199U (zh) * 2021-10-29 2022-03-01 常州彬杨塑业有限公司 一种pvc塑料颗粒的筛选装置
CN115318552A (zh) * 2022-07-15 2022-11-11 济南金威刻科技发展有限公司 半导体隐形切割用粘黏剂涂抹装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY162038A (en) * 2012-12-04 2017-05-31 Ueno Seiki Co Ltd Die bonding apparatus
CN203513971U (zh) * 2013-08-20 2014-04-02 恒烨（福建）卫生用品有限公司 一种新型的胶水添加装置
CN105903601A (zh) * 2016-06-17 2016-08-31 佛山市联智新创科技有限公司 一种防火材料喷涂装置
CN206297024U (zh) * 2016-12-07 2017-07-04 合肥晨乐塑胶有限公司 一种简易流量可控、防堵塞拌料机
CN206325795U (zh) * 2016-12-27 2017-07-14 宁波金雨科技实业有限公司 瓶盖加工的涂胶装置
CN206538659U (zh) * 2017-03-01 2017-10-03 长安大学 沥青路面防滑胶喷涂装置
CN106638232A (zh) * 2017-03-01 2017-05-10 长安大学 一种沥青路面防滑胶喷涂装置
CN207430633U (zh) * 2017-11-06 2018-06-01 江西若邦科技股份有限公司 一种用于制作上盖带的自动送胶装置
CN207574627U (zh) * 2017-12-06 2018-07-06 候宗兵 一种全封闭式刷胶系统
CN208437136U (zh) * 2018-03-27 2019-01-29 南京力旷机电科技有限公司 一种流量可调节的点胶机胶嘴
CN108855761A (zh) * 2018-06-27 2018-11-23 芜湖韩大防伪科技有限公司 一种证卷纸生产加工用表面涂胶装置
CN210449720U (zh) * 2019-08-08 2020-05-05 天津市华乐塑料包装有限公司 一种胶粘带加工用喷胶头
CN212189853U (zh) * 2020-04-24 2020-12-22 沧州庆昭五金制品有限公司 一种用于汽车配件冲压成型的涂油装置
CN213000925U (zh) * 2020-08-04 2021-04-20 吴江华威净化设备有限公司 一种彩钢板滴胶装置
CN213762651U (zh) * 2020-10-21 2021-07-23 浙江好时加卫生用品有限公司 一种卫生巾生产用补胶、上胶一体式滚轮上胶机
CN214132560U (zh) * 2020-12-02 2021-09-07 淮安市康诺克彩印有限公司 一种用于胶槽胶液添加装置
CN215744497U (zh) * 2021-07-29 2022-02-08 福建宏科新材料科技有限公司 一种用于涂布复合机的胶量调节装置
CN215784533U (zh) * 2021-08-18 2022-02-11 江阴顺源电工钢材料有限公司 隔热型太阳能铝边框组装用打胶装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010191228A (ja) * 2009-02-19 2010-09-02 Seiko Epson Corp 圧力調整弁および液滴吐出装置
US20180085776A1 (en) * 2016-09-27 2018-03-29 Nordson Corporation Melter for supplying liquid adhesive
CN210230447U (zh) * 2019-05-14 2020-04-03 沭阳县牡丹木业有限公司 一种板面涂胶装置
CN211831857U (zh) * 2020-03-06 2020-11-03 李湘华 一种苗圃用精准施肥器
CN215918199U (zh) * 2021-10-29 2022-03-01 常州彬杨塑业有限公司 一种pvc塑料颗粒的筛选装置
CN115318552A (zh) * 2022-07-15 2022-11-11 济南金威刻科技发展有限公司 半导体隐形切割用粘黏剂涂抹装置

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