WO2024006449A4 - Compliant probes including dual independently operable probe contact elements including at least one spring - Google Patents
Compliant probes including dual independently operable probe contact elements including at least one spring Download PDFInfo
- Publication number
- WO2024006449A4 WO2024006449A4 PCT/US2023/026593 US2023026593W WO2024006449A4 WO 2024006449 A4 WO2024006449 A4 WO 2024006449A4 US 2023026593 W US2023026593 W US 2023026593W WO 2024006449 A4 WO2024006449 A4 WO 2024006449A4
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- elements
- probe contact
- contact elements
- spring
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract 77
- 230000009977 dual effect Effects 0.000 title 1
- 230000004888 barrier function Effects 0.000 claims 13
- 239000003989 dielectric material Substances 0.000 claims 8
- 230000006835 compression Effects 0.000 claims 3
- 238000007906 compression Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 3
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
Abstract
Probe structures including at least one flat tensional spring and movable frame structures or barrels and plungers and/or pairs of joined probe contact elements with independently compressible tips.
Claims
1. A Kelvin probe comprising a pair of laterally j oined independently compressible probe contact elements (2000(UP), 2000(LP)) for contacting at least an electrical contact on a first circuit element, wherein:
(a) the first probe contact element (2000(UP)) comprises a first compliant structure including at least one spring (2001 (UP)), a first frame structure (2061 (UP)) having at least an arm and a second frame structure (2063(UP)) having longitudinal elements defining a space, the at least one spring (2001 (UP)) elastically joining the first frame structure (2061(UP)) to the second frame structure (2063(UP)), so that the arm of the first frame structure (2061 (UP)) slides in the space defined by the second frame structure (2063(UP)), the first and second frame structures (2061(UP); 2063(UP)) respectively connecting directly or indirectly to respective first and second tips (2011T(UP), 2012T(UP)) of the first probe contact element (2000(UP)) for making electrical contact to respective first and second electrical circuit elements; and
(b) the second probe contact element (2000(UP)) comprises a second compliant structure including at least one spring (2001 (UP)), a first frame structure (2061 (UP)) having at least an arm and a second frame structure (2063 (UP)) having longitudinal elements defining a space, the at least one spring (2001 (UP)) elastically joining the first frame structure (2061 (UP)) to the second frame structure (2063 (UP)), so that the arm of the first frame structure (2061 (UP)) slides in the space defined by the second frame structure (2063(UP)), the first and second frame structures (2061(UP); 2063(UP)) respectively connecting directly or indirectly to respective first and second tips (2011T(UP), 2012T(UP)) of the second probe contact element (2000(UP)) for making electrical contact to the first and second electrical circuit elements, wherein the first probe contact element (2000(UP)) is physically joined to the second probe contact element (2000(UP) in such a way that the first and second probe contact elements (2000(UP), 2000(UP)) are electrically isolated from one another by at least one interface feature (2095), and
35
AMENDED SHEET (ARTICLE 19)
wherein the first and second tips (2011T(UP), 2012T(UP); 2011T(LP), 2012T(LP)) of each of the first and second probe contact elements (2000(UP), 2000(LP)) are longitudinally movable relative to one another under elastic forces provided by the respect springs (2001 (UP), 2001(LP)) connected thereto.
2. The probe of claim 1 wherein the least one interface feature is selected from a group consisting of:
(1) a dielectric barrier (2095) joining the first and second probe contact elements (2000(UP), 2000(LP)) to one another;
(2) a dielectric barrier (2095) joining the first and second probe contact elements (2000(UP), 2000(LP)) to one another, wherein the dielectric barrier (2095) is comprised of one or more dielectric elements that when taken as whole are joined to elements of the first and second probe contact elements (2000(UP), 2000(LP)) in a manner that limits stress on a dielectric material of the dielectric barrier (2095) to compressive stress by the configuration substantially eliminating transmission of shear and/or tensional stress through the dielectric material by the presence of elements of the second frame structures (2063(UP), 2063 (LP)) made of a conductive material;
(3) a dielectric barrier (2095) joining the first and second probe contact elements (2000(UP), 2000(LP)) to one another, wherein the dielectric barrier (2095) is comprised of one or more dielectric elements that when taken as whole are joined to elements of the first and second probe contact elements (2000(UP), 2000(LP)) in a manner that inhibits separation of a dielectric material of the dielectric barrier (2095) and a conductive material from interface regions between the first and second probe contact elements (2000(UP), 2000(LP)) by an at least partial encapsulation of the dielectric material by respective portions of the first and second probe contact elements (2000(UP), 2000(LP)) that engages the dielectric barrier (2095) from opposite sides; and
(4) a dielectric barrier (2095) joining the first and second probe contact elements (2000(UP), 2000(LP)) to one another, wherein the dielectric barrier (2095) is comprised of one or more dielectric elements that when taken as whole are joined to elements of the first and second probe contact elements (2000(UP), 2000(LP)) in a manner that inhibits separation of a dielectric material of the dielectric barrier (2095) and a conductive material of the first and second probe contact elements (2000(UP), 2000(LP)) from interface regions by
36
AMENDED SHEET (ARTICLE 19)
an at least partial encapsulation of the dielectric material by respective portions of the first and second probe contact elements (2000(UP), 2000(LP)) that engages the dielectric material from a first interlocking engagement position and from a second interlocking engagement position wherein the first interlocking engagement portion is laterally closer to the first probe contact element (2000(UP)) than is the second interlocking engagement position which is in turn closer to the second probe contact element (2000(LP)) than is the first interlocking engagement portion.
3. The probe of claim 1 wherein the at least one spring element (2001(UP), 2001(LP)) of the first and second probe contact elements (2000(UP), 2000(LP)) comprises a plurality of spring segments.
4. The probe of claim 2 wherein the dielectric material of the dielectric barrier (2095) is associated with at least one or both of the first and second probe contact elements (2000(UP), 2000(LP)).
5. The probe of claim 1 wherein the first and second probe contact elements (2000(UP), 2000(LP)) comprises elastically movable probe plungers as first frame structure (2061(UP), 2061(LP)) and probe barrels as second frame structures (2063(UP), 2063 (LP)), the probe barrel defining respective holes or channels wherein guide arms of the probe plungers extend upon compression of the respective first and second tips (2011T(UP), 2011T(LP); 2012T(UP), 2012T(LP)) of the first and second probe contact elements (2000(UP), 2000(LP)) toward one another, the respective spring (2001 (UP), 2001(LP)) being is placed into tension with a sliding engagement of the plunger guide arms and barrel channels providing movement stability.
6. The probe of claim 5 wherein the probe plungers of the first and second probe contact elements (2000(UP), 2000(LP)) comprise plunger guide tabs (2061(UP), 2061E(LP)) and the probe barrels of the first and second probe contact elements (2000(UP), 2000(LP)) comprise narrower and wider portions (2002N(UP), 2002W(UP); 2002N(LP), 2002W(LP)) provided in the guide hole or channels (2002(UP), 2002(LP)), the plunger guide tabs (2061E(UP); 2061E(LP)) being initially located outside the narrower portions (2002N(UP); 2002N(LP)) of the guide hole or channel (2002(LP)) and sliding into the narrower portions (2002N(UP); 2002N(LP)) when the probe is in a working condition, providing tighter movement tolerance.
37
AMENDED SHEET (ARTICLE 19)
7. The probe of claim 1 further comprising lateral biasing spring elements (2191(UP), 2191(LP)) associated to at least one of the first and second probe contact elements (2000(UP), 2000(LP)) for holding and/or biasing the probe in an array structure.
8. The probe of claim 7 wherein the lateral biasing spring elements (2191(UP), 2191(LP)) are chosen in a group consisting of: (a) tapered configurations; (b) tapered attachment arms; and (c) tapered support arms.
9. The probe of claim 5 further comprising lateral biasing spring elements (2191(UP), 2191(LP)) associated to at least one of the probe barrels of the first and second probe contact elements (2000(UP), 2000(LP)).
10. The probe of claim 9 wherein the lateral biasing spring elements (2191(UP), 2191(LP)) protrude from an element of the first and second probe contact elements (2000(UP), 2000(LP)) chosen in a group consisting of: (a) an end portion of the probe barrels comprising the second tips (2112T(UP), 2112T(LP)); (b) longitudinal elements of the probe barrels.
11. The probe of claim 1 wherein the first tips (2111T(UP), 2111T(LP)) of the first and second probe contact elements (2000(UP), 2000(LP)) have a shape chosen in a group of: (a) a tapered configuration that provides for a smooth increase in width from a contact end to a merging location on a tip arm, (b) a configuration with two centralized contact points provided with symmetric slopes on either side of the contact points with backside support provided by secondary recessed support structures; (c) sharp tips; (d) flat tips; (e) diagonally opposed non-symmetric tips; (f) single tip having a similar width to the tip arms and with a contact portion by backside, recessed secondary structures.
12. The probe of claim 1 wherein the first and second probe contact elements (2000(UP), 2000(LP)) comprise respective sheaths (2663 (UP), 2663 (LP)) through which tip arms (2661-1(UP), 2661-1(LP)) move and a dielectric barrier (2095) electrically separating the sheaths.
13. The probe of claim 1 wherein one of the first and second probe contact elements (2000(UP), 2000(LP)) is a force or current probe and the other of the first and second probe contact elements (2000(UP), 2000(LP)) is a sensing or voltage probe for testing the first circuit element.
38
AMENDED SHEET (ARTICLE 19)
14. The probe of claim 1 wherein the probe has a length selected from a group consisting of: (1) less than 2 mm, (2) less than 3 mm, (3) less than 5 mm, (4) less than 8 mm, (5) more than 2 mm, (6) more than 3 mm, (7) more than 5 mm, and (8) more than 8 mm and a width selected from a group consisting of: (1) less than 100 microns, (2) less than 200 microns, (3) less than 300 microns, (4) less than 400 microns, and (5) less than 600 microns.
15. The probe of claim 1 further comprising a feature selected from a group consisting of: (1) at least one shunting element that directs current from one of the first or second tip arms through a non-compliant structure and then through the other of the first or second tip arms; and (2) at least one shunting element that directs current from one of the first or second tip arms through a non-compliant structure and then through the other of the first or second tip arms wherein the at least one shunting element is a surface against which the tip arms slide.
16. The probe of claim 1 wherein the probe is configured in an array for wafer level testing or for socket testing of one or more packaged integrated circuits.
17. A probe, comprising:
(a) a first tip arm (1211) connecting directly or indirectly to an attachment region of a first tip (121 IT) for making electrical contact to a first electrical circuit element;
(b) a second tip arm (1212) connecting directly or indirectly to an attachment region of a second tip (1212T);
(c) a compliant structure comprising at least one spring (1201), wherein a first region (1267) of the compliant structure directly or indirectly joins the first tip arm (1211) and a second region (1268) of the compliant structure directly or indirectly joins the second tip arm (1212), wherein a relative displacement of the first and second tip arms (1211, 1212) results in elastic movement of the at least one spring (1201) of the compliant structure;
(d) a first frame structure (1261) comprising at least one first lateral element (1262-1), a second lateral element (1262-2) and a pair of longitudinal elements (1261-1, 1261-2) extending from the first lateral element (1262-1) to the second lateral
39
AMENDED SHEET (ARTICLE 19)
element (1262-2), the first lateral element (1262-1) being connected directly or indirectly to the first tip arm (1211) and the second lateral element (1262-2) being connected to the first region (1267) of the compliant structure; and
(e) a second frame structure (1263) comprising at least one first lateral element (1264-1), a second lateral element (1264-1) and a pair of longitudinal elements (1263-1, 1263-2) extending from the first lateral element (1264-1) to the second lateral element (1264-2), the first lateral element (1264-1) being connected to the second region (1268) of the compliant structure and the second lateral element (1264-2) being connected directly or indirectly to the second tip arm (1212), wherein the first and second frame structures (1261, 1263) are elastically joined to one another by the at least one spring (1201) of the compliant structure and allowed to slide relative to one another by movement of the longitudinal elements (1261-1, 1261-2; 1263-1, 1263-2).
18. The probe of claim 17 further comprising a plurality of guide elements (1202) provided along the longitudinal elements (1261-1, 1261-2; 1263-1, 1263-2) of the first and second frame structures (1261, 1263).
19. The probe of claim 18 further comprising a plurality of expanded width regions (1281) provides along the longitudinal elements (1261-1, 1261-2; 1263-1, 1263-2) of the first and second frame structures (1261, 1263) to reduce a spacing in the guide elements (1202) as the expanded width regions (1281) transition from outside to within the guide elements (1202) and providing an effective narrowing of a clearance between elements that slides that is smaller than an effective clearance prior to the at least one spring (1201) of the compliant structure being biased.
20. The probe of claim 19 wherein the smaller clearance is smaller by an amount selected from a group consisting of (a) at least two microns, (b) at least four microns, (c) at least six microns, (d) at least eight microns, and (e) at least 10 microns, (f) less than 7/8 of the clearance prior to biasing, (g) less than 3/4 of the clearance prior to biasing, (h) less than 3/4 of the clearance prior to biasing, (i) less than 5/8 of the clearance prior to biasing, (j) less than 1/2 of the clearance prior to biasing, (k) less than 3/8 of the clearance prior to biasing, (1) less than 1/4 of the clearance prior to biasing, and (m) less than 1/8 of the clearance prior to biasing.
40
AMENDED SHEET (ARTICLE 19)
21. The probe of claim 7 further comprising gaps (2270-2) between the second frame structure (2263(LP); 2263(LP)) and the lateral biasing spring elements (2291 (UP), 2291(LP)) of at least one of the first and second probe contact elements (2200(UP), 2200(LP)) so as to allow the functional movement of the lateral biasing spring elements (2291 (UP), 2291 (UP))
22. The probe of claim 21 wherein the gaps (2270-2) and the lateral biasing spring elements (2291 (UP), 2291 (UP)) are configured to provide sliding compression against a surface after an initial level of compression is exceeded wherein a spring force is increased non-linearly when contact of the lateral biasing spring elements (2291 (UP), 2291 (UP)) with a sliding surface is made.
AMENDED SHEET (ARTICLE 19)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/854,756 | 2022-06-30 | ||
US17/854,756 US20240094249A1 (en) | 2019-12-31 | 2022-06-30 | Compliant Pin Probes with Extension Springs, Methods for Making, and Methods for Using |
US17/898,400 | 2022-08-29 | ||
US17/898,446 US20240094250A1 (en) | 2018-10-26 | 2022-08-29 | Compliant Probes Including Dual Independently Operable Probe Contact Elements Including At Least One Flat Extension Spring, Methods for Making, and Methods for Using |
US17/898,400 US20240103038A1 (en) | 2018-10-26 | 2022-08-29 | Compliant Probes with Enhanced Pointing Stability and Including At Least One Flat Extension Spring, Methods for Making, and Methods for Using |
US17/898,446 | 2022-08-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2024006449A1 WO2024006449A1 (en) | 2024-01-04 |
WO2024006449A4 true WO2024006449A4 (en) | 2024-03-07 |
Family
ID=87426692
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2023/026590 WO2024006446A1 (en) | 2022-06-30 | 2023-06-29 | Compliant pin probes with extension springs or spring segments and ratcheting elements |
PCT/US2023/026588 WO2024025700A1 (en) | 2022-06-30 | 2023-06-29 | Compliant probes with enhanced pointing stability and including at least one extension spring or spring segment |
PCT/US2023/026593 WO2024006449A1 (en) | 2022-06-30 | 2023-06-29 | Compliant probes including dual independently operable probe contact elements including at least one spring |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2023/026590 WO2024006446A1 (en) | 2022-06-30 | 2023-06-29 | Compliant pin probes with extension springs or spring segments and ratcheting elements |
PCT/US2023/026588 WO2024025700A1 (en) | 2022-06-30 | 2023-06-29 | Compliant probes with enhanced pointing stability and including at least one extension spring or spring segment |
Country Status (1)
Country | Link |
---|---|
WO (3) | WO2024006446A1 (en) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH627282A5 (en) * | 1978-05-02 | 1981-12-31 | Feinmetall Gmbh | Spring-loaded contact module for measuring and test purposes |
EP0256541A3 (en) * | 1986-08-19 | 1990-03-14 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Contacting device |
DE3906691A1 (en) * | 1988-03-04 | 1989-09-14 | Manfred Prokopp | Contact-making device for testing devices for testing printed circuit boards or the like |
US5190637A (en) | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
CA2572499A1 (en) | 1997-04-04 | 1998-10-15 | University Of Southern California | Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials |
US7252861B2 (en) | 2002-05-07 | 2007-08-07 | Microfabrica Inc. | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids |
US20060238209A1 (en) * | 2002-05-07 | 2006-10-26 | Microfabrica Inc. | Vertical microprobes for contacting electronic components and method for making such probes |
US10416192B2 (en) * | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
EP1889080A2 (en) * | 2005-06-10 | 2008-02-20 | Delaware Capital Formation, Inc. | Electrical contact probe with compliant internal interconnect |
EP2646839B1 (en) * | 2010-12-03 | 2017-08-16 | Ardent Concepts, Inc. | Compliant electrical contact and assembly |
JP5842528B2 (en) * | 2011-10-14 | 2016-01-13 | オムロン株式会社 | Contact |
JP6009544B2 (en) * | 2012-04-17 | 2016-10-19 | ユニテクノ株式会社 | Kelvin contact probe and kelvin inspection jig provided with the same |
US9000793B2 (en) * | 2012-11-15 | 2015-04-07 | Advantest America, Inc. | Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same |
WO2018112166A1 (en) * | 2016-12-16 | 2018-06-21 | Xcerra Corporation | Spring-loaded probe having folded portions and probe assembly |
KR101901395B1 (en) * | 2017-02-17 | 2018-09-28 | (주) 루켄테크놀러지스 | Probe pin and manufacturing method thereof |
KR20190112965A (en) * | 2018-03-27 | 2019-10-08 | 주식회사 기가레인 | MEMS vertical pin for probe card with improved stress dispersion |
EP3807656A4 (en) * | 2018-06-14 | 2022-03-02 | FormFactor, Inc. | Electrical test probes having decoupled electrical and mechanical design |
KR102232789B1 (en) * | 2019-04-15 | 2021-03-26 | 주식회사 오킨스전자 | Multi-layer MEMS spring pin |
-
2023
- 2023-06-29 WO PCT/US2023/026590 patent/WO2024006446A1/en unknown
- 2023-06-29 WO PCT/US2023/026588 patent/WO2024025700A1/en unknown
- 2023-06-29 WO PCT/US2023/026593 patent/WO2024006449A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2024006446A1 (en) | 2024-01-04 |
WO2024025700A1 (en) | 2024-02-01 |
WO2024025700A9 (en) | 2024-02-29 |
WO2024006449A1 (en) | 2024-01-04 |
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