WO2024004324A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2024004324A1
WO2024004324A1 PCT/JP2023/014871 JP2023014871W WO2024004324A1 WO 2024004324 A1 WO2024004324 A1 WO 2024004324A1 JP 2023014871 W JP2023014871 W JP 2023014871W WO 2024004324 A1 WO2024004324 A1 WO 2024004324A1
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WO
WIPO (PCT)
Prior art keywords
control device
electronic control
wiring
electronic
heat
Prior art date
Application number
PCT/JP2023/014871
Other languages
French (fr)
Japanese (ja)
Inventor
康博 露木
義夫 河合
明博 難波
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Publication of WO2024004324A1 publication Critical patent/WO2024004324A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present disclosure relates to an electronic control device.
  • Patent Document 1 paragraph 0009, summary below.
  • This conventional electronic device consists of a printed circuit board, multiple electronic components of different heights, multiple electronic components mounted on the printed circuit board and of different heights, and a metal material, and multiple electronic components. and a lid that covers the printed circuit board and is grounded to the printed circuit board.
  • this conventional electronic device includes a first heat radiating member provided between the lid and at least one electronic component to be heat radiated out of a plurality of electronic components, and a heat sink provided above the lid. and a second heat radiating member provided between the lid and the heat sink.
  • the top surface of the lid has a step shape corresponding to the height of the plurality of electronic components (Patent Document 1, paragraph 0010, claim 1).
  • the outer edge of the first heat radiating member provided between the electronic component to be heat radiated and the lid is located inside the outer edge of the electronic component to be heat radiated, and the area of the electronic component to be heat radiated is The area of the first heat radiating member is smaller than that of the first heat dissipating member (Patent Document 1, FIGS. 1, 3-5, 7-11, 13-16, and 18).
  • Patent Document 1 FIGS. 1, 3-5, 7-11, 13-16, and 18
  • the heat dissipation surface of two electronic components placed adjacent to each other and connected by wiring is It is conceivable to arrange a heat dissipation member.
  • the present disclosure provides an electronic control device that can improve heat dissipation of electronic components while suppressing radiation noise.
  • One aspect of the present disclosure provides a circuit board including first and second electronic components arranged adjacent to each other and connected by wiring, a housing housing the circuit board, and the first and second electronic components. and a heat radiating member disposed between the heat radiating surface of the electronic component and the housing, the heat radiating member straddling the heat radiating surfaces of the first and second electronic components facing the housing.
  • the electronic control device is characterized in that the wiring is covered with a low dielectric constant medium having a dielectric constant lower than that of the heat dissipating member.
  • radiation noise is suppressed by covering the wiring with a low dielectric constant medium having a lower dielectric constant than that of the heat dissipation member, and the contact area between the heat dissipation member and the housing is increased, so that the electronic component It is possible to provide an electronic control device that can improve heat dissipation.
  • FIG. 1 is an exploded perspective view showing an embodiment of an electronic control device according to the present disclosure.
  • FIG. 2 is an exploded perspective view of the electronic control device shown in FIG. 1 with the top and bottom turned upside down.
  • 3 is an enlarged sectional view of the vicinity of first and second electronic components of the electronic control device shown in FIG. 2.
  • FIG. FIG. 4 is a flow diagram of the method for manufacturing the electronic control device according to the embodiment of FIGS. 1 to 3.
  • FIG. FIG. 4 is an enlarged cross-sectional view of the vicinity of an electronic component showing modification example 1 of the electronic control device of FIG. 3;
  • FIG. 4 is an enlarged cross-sectional view of the vicinity of electronic components showing a second modification of the electronic control device of FIG. 3;
  • FIG. 4 is an enlarged cross-sectional view of the vicinity of electronic components showing a third modification of the electronic control device of FIG. 3;
  • FIG. 4 is an enlarged cross-sectional view of the vicinity of electronic components showing a fourth modification of the electronic control device of FIG. 3;
  • FIG. 4 is an enlarged sectional view of the vicinity of electronic components showing a fifth modification of the electronic control device of FIG. 3;
  • FIG. 1 is an exploded perspective view showing an embodiment of an electronic control device according to the present disclosure.
  • FIG. 2 is an exploded perspective view of the electronic control device 100 shown in FIG. 1, turned upside down.
  • the electronic control device 100 of this embodiment is, for example, an electronic control unit (ECU) that is mounted on a vehicle and controls an engine, electronic equipment, various actuators, and the like.
  • the electronic control device 100 includes a circuit board 110, a housing 120, and a heat dissipation member 130.
  • the circuit board 110 is, for example, a multilayer board made of thermosetting resin and glass cloth, a ceramic board, or a flexible printed circuit board (FPC) made of polyimide.
  • the circuit board 110 includes a plurality of circuits including metal wiring (not shown) and a plurality of elements including first and second electronic components 111 and 112.
  • the first and second electronic components 111 and 112 are electronic components that require heat dissipation, such as a system on a chip (SoC), an integrated circuit (IC), a central processing unit (CPU), or a memory element. be.
  • the circuit board 110 has a connector 113 and a plurality of through holes 114.
  • Connector 113 has, for example, a plurality of connector pins connected to circuits on circuit board 110.
  • the plurality of through holes 114 are provided, for example, at the peripheral edge of the circuit board 110 and allow the plurality of screws 140 for fixing the circuit board 110 to the cover 122 of the housing 120 to be inserted therethrough.
  • the housing 120 is a case that accommodates the circuit board 110.
  • the housing 120 includes, for example, a base portion 121 and a cover 122.
  • the base portion 121 and the cover 122 are, for example, metal members manufactured by forging, pressing, or cutting a metal material.
  • As the metal material for the base portion 121 and the cover 122 for example, aluminum or an alloy containing aluminum as a main component can be used.
  • the base portion 121 and the cover 122 may be, for example, members made of a highly thermally conductive resin manufactured by injection molding a mixture of resin and filler.
  • the thermal conductivity of the highly thermally conductive resin is, for example, within the range of 2 W/(m ⁇ K) to 30 W/(m ⁇ K).
  • the resin material of the highly thermally conductive resin for example, polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyamide (PA6), etc.
  • PBT polybutylene terephthalate
  • PPS polyphenylene sulfide
  • PA6 polyamide
  • the filler of the highly thermally conductive resin for example, glass fiber, carbon fiber, alumina (Al 2 O 3 ), etc. can be used.
  • the base portion 121 is, for example, a rectangular plate-like member.
  • the base portion 121 has, for example, a peripheral wall portion 121a and a through hole 121b.
  • the peripheral wall portion 121 a is provided, for example, at the peripheral edge of the base portion 121 and fits inside the cover 122 .
  • the through holes 121b are provided, for example, at the four corners of the base portion 121, and bolts 150 for fixing the base portion 121 to the cover 122 are inserted therethrough.
  • the cover 122 has, for example, an upper wall portion 122a that covers the upper surface of the circuit board 110, and a peripheral wall portion 122b that surrounds the circuit board 110.
  • the upper wall portion 122a has a plurality of radiation fins 122f on the upper surface, which is the outer surface of the housing 120.
  • the peripheral wall portion 122b extends, for example, from the peripheral edge of the upper wall portion 122a toward the base portion 121, and fits the peripheral wall portion 121a of the base portion 121 inside.
  • the cover 122 has first and second electronic components 111 and 112 of the circuit board 110 on the lower surface of the upper wall portion 122a, which is the inner surface, at a position facing the first and second electronic components 111 and 112 of the circuit board 110. It has convex portions 161 and 162.
  • the first and second convex portions 161 and 162 have, for example, a rectangular trapezoidal shape. Further, the entire top surfaces of the first and second convex portions 161 and 162 are opposed to the entire heat radiation surfaces of the first and second electronic components 111 and 112 that are in contact with the heat radiation member 130 shown in FIG. 1, for example. ing.
  • first and second convex portions 161 and 162 can have any shape, such as a truncated cone shape, a rectangular parallelepiped shape, or a cylindrical shape, for example. Furthermore, the entire top surfaces of the first and second convex portions 161 and 162 do not necessarily have to face the heat dissipation surfaces of the first and second electronic components 111 and 112.
  • the areas of the top surfaces of the first and second convex portions 161 and 162 may be smaller or larger than, for example, the areas of the heat dissipation surfaces of the first and second electronic components 111 and 112. Good too. Further, a portion of the top surface of the first and second convex portions 161 and 162 may be opposed to a portion of the heat dissipation portion of the first and second electronic components 111 and 112. Further, a plurality of electronic components may be opposed to the top surface of either of the first and second convex portions 161 and 162.
  • the heat radiation member 130 is arranged between the heat radiation surfaces of the first and second electronic components 111 and 112 and the housing 120. More specifically, the heat dissipation member 130 includes the heat dissipation surfaces of the first and second electronic components 111 and 112 provided on the circuit board 110 and the first and second convex portions provided on the cover 122 of the housing 120. 161 and 162.
  • the heat dissipation member 130 at least temporarily has viscosity, fluidity, or plasticity that follows the shape of the surface on which it is placed, at least when the electronic control device 100 is assembled.
  • the heat radiation member 130 is, for example, a thermal interface material (TIM) containing thermally conductive grease or thermally conductive adhesive.
  • TIM thermal interface material
  • thermally conductive adhesive for example, a sheet of thermosetting silicone resin containing a filler having high thermal conductivity can be used.
  • filler for example, inorganic materials and ceramics such as silica, alumina, alumina nitride, boron nitride, zinc oxide, yttrium oxide, and magnesium oxide can be used.
  • the heat conductive adhesive for example, one having a shear strength of 0.02 MPa or more can be used.
  • FIG. 3 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112 after the electronic control device 100 shown in FIG. 2 is assembled.
  • the first and second electronic components 111 and 112 are arranged adjacent to each other and connected by one or more wires 115.
  • the first and second electronic components 111 and 112 are connected to the circuit of the circuit board 110 via, for example, an interposer and solder bumps (not shown), and are mounted on the circuit board 110.
  • the heat dissipation member 130 has viscosity, fluidity, or plasticity at least when the electronic control device 100 is assembled. Therefore, the heat dissipation member 130 is separated on the top surfaces 161a, 162a of the first and second convex portions 161, 162, or on the heat dissipation surfaces 111a, 112a of the first and second electronic components 111, 112, respectively. Even when applied or placed, adjacent heat dissipating members 130 come into contact with each other and are integrated.
  • the heat dissipation member 130 dissipates heat from the first and second electronic components 111 and 112 facing the top surfaces 161a and 162a of the first and second convex portions 161 and 162 provided on the cover 122 of the housing 120. It is provided integrally across surfaces 111a and 112a.
  • the wiring 115 is, for example, a high-speed communication wiring that enables high-speed communication between the first and second electronic components 111 and 112 that are adjacent to each other.
  • the wiring 115 is covered with a low dielectric constant medium 170 having a lower dielectric constant than the heat dissipating member 130.
  • the low dielectric constant medium 170 is, for example, air with a relative dielectric constant of approximately 1.
  • a resin material having a relative dielectric constant of about 2 to 3 may be used, such as silicone resin, acrylic resin, or epoxy resin.
  • the cover 122 of the housing 120 has a first protrusion 161 facing the heat radiation surface 111a of the first electronic component 111 and a second projection facing the heat radiation surface 112a of the second electronic component 112. 162.
  • the heat radiation surface 111a of the first electronic component 111 includes, for example, the surface of the central semiconductor chip. Therefore, the height of the first and second electronic components 111 and 112 from the surface of the circuit board 110 is such that the first electronic component 111 is higher than the second electronic component 112.
  • the heights of the first and second convex portions 161 and 162 that protrude toward the circuit board 110 from the inner surface of the upper wall portion 122a of the cover 122 facing the circuit board 110 are the same as those of the first convex portion 161. is lower than the second convex portion 162.
  • the distance between the top surface 161a of the first protrusion 161 and the heat dissipation surface 111a of the first electronic component 111 is greater than when the first and second protrusions 161 and 162 have the same height.
  • the difference between D1 and the distance D2 between the top surface 162a of the second convex portion 162 and the heat radiation surface 112a of the second electronic component 112 is small.
  • the cover 122 of the housing 120 has a recess 163 provided between the first and second protrusions 161 and 162 and facing the wiring 115.
  • the heat dissipation member 130 has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, and together with the circuit board 110, the first electronic component 111, and the second electronic component 112, , a space filled with a low dielectric constant medium 170 is defined around the wiring 115.
  • the edge adjacent to the recess 163 on the top surface 161a of the first convex portion 161 and the edge adjacent to the wiring 115 on the heat dissipation surface 111a of the first electronic component 111 are as follows. It faces the circuit board 110 in a direction perpendicular to it. Furthermore, the edge of the top surface 161a of the first convex portion 161 opposite to the recess 163 and the edge of the heat radiation surface 111a of the first electronic component 111 opposite to the wiring 115 are also perpendicular to the circuit board 110. facing the direction.
  • the edge adjacent to the recess 163 on the top surface 162a of the second convex portion 162 and the edge adjacent to the wiring 115 on the heat dissipation surface 112a of the second electronic component 112 are perpendicular to the circuit board 110. facing the direction. Furthermore, the edge of the top surface 162a of the second convex portion 162 opposite to the recess 163 and the edge of the heat radiation surface 112a of the second electronic component 112 opposite to the wiring 115 are also perpendicular to the circuit board 110. facing the direction.
  • both edges of the top surfaces 161a, 162a of the first and second convex portions 161, 162 are aligned with the edges of the first and second electronic components 111, 112. Both ends of the heat dissipation surfaces 111a and 112a may face each other in a direction perpendicular to the circuit board 110. Further, both edges of the top surfaces 161a and 162a of the first and second convex portions 161 and 162 are located outside both edges of the heat radiation surfaces 111a and 112a of the first and second electronic components 111 and 112. It may also be located inside.
  • FIG. 4 is a flow diagram showing an example of an electronic control device manufacturing method P for manufacturing the electronic control device 100 shown in FIGS. 1 to 3.
  • a step P1 of arranging the cover 122 is performed.
  • the cover 122 is placed with the inner surface of the upper wall portion 122a of the cover 122 facing upward.
  • step P2 of arranging the heat radiating member 130 is performed.
  • the heat dissipating member 130 having viscosity, fluidity, or plasticity is attached to the first and second convex portions 161, 162 of the cover 122. It is coated or placed on the top surfaces 161a, 162a of.
  • the heat radiating member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162 is arranged in the housing 120.
  • step P3 of installing the circuit board 110 is performed.
  • the circuit board 110 is installed on the heat dissipation member 130 disposed in the housing 120 with the wiring 115 covered with the low dielectric constant medium 170.
  • the heat dissipation member 130 straddles and covers the heat dissipation surfaces 111a and 112a of the first and second electronic components 111 and 112.
  • a space filled with a low dielectric constant medium 170 is defined around the wiring 115 by the heat dissipating member 130, the circuit board 110, the first electronic component 111, and the second electronic component 112.
  • the circuit board 110 when the low dielectric constant medium 170 is air, the circuit board 110 is placed on the heat dissipation member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162 in the air. As a result, a space filled with air is defined around the wiring 115. Further, if the low dielectric constant medium 170 is a low dielectric constant resin as described above, the resin is applied to the wiring 115 in advance. In this state, by placing the circuit board 110 on the heat dissipation member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, a resin with a low dielectric constant is placed around the wiring 115. A filled space is defined.
  • the plurality of screws 140 shown in FIGS. 1 and 2 are inserted into the plurality of through holes 114 of the circuit board 110 and screwed into the screw holes 122c of the cover 122 to fix the circuit board 110 to the cover 122. Furthermore, when the heat dissipation member 130 is a conductive adhesive, for example, the heat dissipation member 130 is heated and cured.
  • step P4 of installing the base portion 121 is performed.
  • the bolts 150 shown in FIG. 2 are inserted into the through holes 121b at the four corners of the base part 121 and screwed into the screw holes 122d at the four corners of the cover 122, thereby fixing the base part 121 to the cover 122.
  • a housing 120 that accommodates the circuit board 110 is formed, and the electronic control device 100 is completed.
  • the flow of the electronic control device manufacturing method P shown in FIG. 4 is completed.
  • the electronic control device 100 of this embodiment includes the circuit board 110, the housing 120, and the heat radiation member 130.
  • Circuit board 110 includes first and second electronic components 111 and 112 arranged adjacent to each other and connected by wiring 115.
  • Housing 120 houses circuit board 110.
  • the heat radiation member 130 is disposed between the heat radiation surfaces 111a, 112a of the first and second electronic components 111, 112 and the housing 120, and is arranged to dissipate the heat of the first and second electronic components 111, 112 facing the housing 120. It is provided across surfaces 111a and 112a.
  • the wiring 115 is covered with a low dielectric constant medium 170 having a lower dielectric constant than the heat dissipating member 130.
  • the heat dissipation member 130 is provided across the heat dissipation surfaces 111a, 112a of the first and second electronic components 111, 112, thereby reducing the contact area between the heat dissipation member 130, the heat dissipation surfaces 111a, 112a, and the housing 120. can be increased.
  • the heat transferred from the heat radiation surfaces 111a, 112a of the first and second electronic components 111, 112 to the housing 120 via the heat radiation member 130 is increased, and the heat radiation of the first and second electronic components 111, 112 is increased. can improve sex.
  • the capacitance around the wiring 115 is reduced compared to when the wiring 115 is covered with the heat dissipating member 130. C decreases.
  • the impedance Z around the wiring 115 increases, and the noise intensity N originating from the wiring 115 decreases.
  • the volume of the low dielectric constant medium 170 that covers the wiring 115 increases, the effect of suppressing noise originating from the wiring 115 can be improved.
  • the housing 120 has a first convex portion 161 facing the heat radiation surface 111a of the first electronic component 111 and a first convex portion 161 facing the heat radiation surface 112a of the second electronic component 112. It has a second convex portion 162. Further, the housing 120 has a recess 163 provided between the first and second protrusions 161 and 162 and facing the wiring 115.
  • the heat dissipation member 130 has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, and has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, and the heat dissipation member 130 has a shape that follows the shapes of the first protrusion 161, the concave portion 163, and the second convex portion 162, and is Together with the component 112, a space filled with a low dielectric constant medium 170 is defined around the wiring 115.
  • the electronic control device manufacturing method P of this embodiment is a method of manufacturing the electronic control device 100 described above.
  • the electronic control device manufacturing method P includes the process P2 and the process P3.
  • step P2 the heat dissipation member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162 is arranged in the housing 120.
  • step P3 the circuit board 110 is installed on the heat dissipation member 130 disposed in the housing 120 with the wiring 115 covered with the low dielectric constant medium 170, and the heat dissipation member 130 connects the first and second electronic components 111. , 112 and covers the heat dissipating surfaces 111a and 112a.
  • a space filled with a low dielectric constant medium 170 is defined around the wiring 115 by the heat dissipation member 130, the circuit board 110, the first electronic component 111, and the second electronic component 112.
  • the heat dissipation member 130 has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162. .
  • a recess corresponding to the shape of the recess 163 of the housing 120 is formed on the surface of the heat dissipation member 130 on the opposite side to the first and second projections 161 and 162 of the housing 120, and the recess is opposed to the wiring 115. It can be placed as follows.
  • the wide range of the heat dissipation surfaces 111a, 112a of the first and second electronic components 111, 112 and the wide range of the housing 120 are thermally connected via the heat dissipation member 130 that straddles the heat dissipation surfaces 111a, 112a.
  • a space filled with a low dielectric constant medium 170 is defined around the wiring 115 by the recess of the heat dissipation member 130, the surface of the circuit board 110, and the first and second electronic components 111, 112, and the wiring 115 can be reduced.
  • the low dielectric constant medium 170 is, for example, air.
  • the process of applying the low dielectric constant medium 170 to the wiring 115 is omitted, making it possible to maintain high productivity and suppress production costs.
  • noise originating from the wiring 115 can be reduced by air serving as the low dielectric constant medium 170 covering the wiring 115.
  • the radiation noise originating from the wiring 115 between the first and second electronic components 111, 112 is suppressed, and the It is possible to provide an electronic control device 100 that can improve heat dissipation.
  • the electronic control device according to the present disclosure is not limited to the configuration of the electronic control device 100 according to the above-described embodiment.
  • some modified examples of the electronic control device 100 according to the above-described embodiment will be described with reference to FIGS. 7 to 9.
  • FIG. 5 is a schematic enlarged cross-sectional view of the vicinity of the first and second electronic components 111 and 112, showing a first modification of the electronic control device 100 of FIG.
  • the edge of the top surface 161a of the first convex portion 161 adjacent to the recess 163 is lower than the edge of the heat dissipation surface 111a of the first electronic component 111 adjacent to the wiring 115. It is located on the center side of the heat radiation surface 111a of the electronic component 111.
  • the edge of the top surface 162a of the second convex portion 162 adjacent to the recess 163 is smaller than the edge adjacent to the wiring 115 of the heat dissipation surface 112a of the second electronic component 112. It is located on the center side of the heat radiation surface 112a of the second electronic component 112.
  • the electronic control device 100 according to the first modification in FIG. becomes possible to expand.
  • a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
  • the edge of the top surface 162a of the second convex portion 162 opposite to the recess 163 is the edge opposite to the wiring 115 in the heat dissipation surface 112a of the second electronic component 112. It is located closer to the center of the heat radiation surface 112a of the second electronic component 112 than the edge.
  • the heat dissipation member 130 is connected to the first and second The edges of the top surfaces 161a, 162a of the protrusions 161, 162 on the opposite side to the recess 163 tend to spread outward.
  • a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
  • FIG. 6 is a schematic enlarged cross-sectional view of the vicinity of the first and second electronic components 111 and 112, showing a second modification of the electronic control device 100 of FIG.
  • this modification example 2 only the edges of the top surfaces 161a, 162a of the first and second convex parts 161, 162 on the side opposite to the recessed part 163 are the heat radiation surfaces 111a of the first and second electronic components 111, 112. , 112a are located closer to the center of each of the heat dissipating surfaces 111a, 112a than the edge located on the opposite side to the wiring 115.
  • the heat dissipation member 130 is connected to the recesses 161 in the top surfaces 161a and 162a of the first and second convex portions 161 and 162. It tends to spread to the outside of the opposite edge. As a result, a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
  • FIG. 7 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112, showing a third modification of the electronic control device 100 of FIG.
  • this third modification only the edges of the top surfaces 161a, 162a of the first and second convex parts 161, 162 adjacent to the recessed part 163 are the heat dissipation surfaces 111a, It is located closer to the center of each heat dissipation surface 111a, 112a than the edge adjacent to the wiring 115 in 112a.
  • the electronic control device 100 according to the third modification also makes it possible to expand the width and depth of the recess 163 facing the wiring 115. As a result, a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
  • FIG. 8 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112, showing a fourth modification of the electronic control device 100 of FIG. In the electronic control device 100 according to the above-mentioned modification example 3 shown in FIG. It was defined by the side surfaces of the second convex portions 161 and 162.
  • the electronic control device 100 according to the fourth modification in FIG. is defined by a base parallel to .
  • the volume of the recess 163 is enlarged compared to the electronic control device 100 according to the third modification in FIG.
  • the recessed portion of the heat dissipating member 130 can be enlarged. As a result, it becomes possible to expand the space filled with the low dielectric constant medium 170 around the wiring 115 and further reduce the radiation noise caused by the wiring 115.
  • FIG. 9 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112, showing a fifth modification of the electronic control device 100 of FIG.
  • the electronic control device 100 according to this modification differs from the electronic control device 100 according to modification 1 shown in FIG. 5 only in that the recess 163 of the housing 120 is formed by a concave curved surface.
  • the electronic control device 100 according to the present modification not only can the same effects as the electronic control device 100 according to the modification 1 shown in FIG. 5 be achieved, but also the volume of the recess 163 can be expanded. . As a result, it becomes possible to expand the space filled with the low dielectric constant medium 170 around the wiring 115 and further reduce the radiation noise caused by the wiring 115.
  • the electronic control device according to the present disclosure can be provided for devices such as inverters and converters in addition to being mounted on vehicles.
  • Circuit board 111 First electronic component 111a Heat radiation surface 112 Second electronic component 112a Heat radiation surface 115 Wiring 120 Housing 130 Heat radiation member 161 First convex portion 162 Second convex portion 163 Concave portion 170 Low dielectric constant Medium P Electronic control device manufacturing method P2 Step of arranging a heat dissipation member P3 Step of installing a circuit board

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present disclosure provides an electronic control device in which the heat dissipation property of electronic components is improved while suppressing radiation noise. This electronic control device comprises: a circuit board 110 which includes first and second electronic components 111, 112 that are placed adjacently and are connected via a wire 115; a housing 120 that houses the circuit board 110; and a heat-dissipation member 130 which is placed between the housing 120 and heat-dissipation surfaces 111a, 112a of the first and second electronic components 111, 112. The heat-dissipation member 130 is provided astride the heat-dissipation surfaces 111a, 112a of the first and second electronic components 111, 112 that are opposed to the housing 120. The wire 115 is covered with a low-permittivity medium 170 having a lower permittivity than the heat-dissipation member 130.

Description

電子制御装置electronic control unit
　本開示は、電子制御装置に関する。 The present disclosure relates to an electronic control device.
　従来から複数の電子部品からの輻射ノイズを適切に抑制するとともに、放熱性を適切に向上させることができる電子機器が知られている（下記特許文献１、第０００９段落、要約）。この従来の電子機器は、プリント基板と、高さが異なる複数の電子部品と、そのプリント基板上に実装され、高さが異なる複数の電子部品と、金属材料から構成され、複数の電子部品を覆うとともにプリント基板に対して接地されているリッドとを備えている。 Electronic devices that can appropriately suppress radiation noise from a plurality of electronic components and appropriately improve heat dissipation have been known (Patent Document 1, paragraph 0009, summary below). This conventional electronic device consists of a printed circuit board, multiple electronic components of different heights, multiple electronic components mounted on the printed circuit board and of different heights, and a metal material, and multiple electronic components. and a lid that covers the printed circuit board and is grounded to the printed circuit board.
　また、この従来の電子機器は、複数の電子部品のうち少なくとも１つ以上の放熱対象の電子部品とリッドとの間に設けられている第１放熱部材と、リッドの上方に設けられているヒートシンクと、リッドとヒートシンクとの間に設けられている第２放熱部材と、を備えている。この従来の電子機器において、リッドの上面部は、前記複数の電子部品の高さに合わせて段差を有する形状である（特許文献１、第００１０段落、請求項１）。 Further, this conventional electronic device includes a first heat radiating member provided between the lid and at least one electronic component to be heat radiated out of a plurality of electronic components, and a heat sink provided above the lid. and a second heat radiating member provided between the lid and the heat sink. In this conventional electronic device, the top surface of the lid has a step shape corresponding to the height of the plurality of electronic components (Patent Document 1, paragraph 0010, claim 1).
　この従来の電子機器によれば、複数の電子部品から放射された電磁波によりリッドにノイズ電流が誘起されたとしても、その誘起されたノイズ電流が接地部分に排出されることで、輻射ノイズを抑制することができる。また、リッドの上面部が複数の電子部品の高さに合わせて段差を有する形状であるので、放熱対象の電子部品の高さが他の電子部品よりも低い場合でも、その放熱対象の電子部品とリッドとの距離を狭めるように段差を形成することで、第１放熱部材の厚さを抑えることができ、放熱性の悪化を未然に回避することができる。これにより、プリント基板上に高さが異なる複数の電子部品が実装される構成において、複数の電子部品からの輻射ノイズを適切に抑制すると共に、放熱性を適切に向上させることができる（特許文献１、第００１１段落）。 According to this conventional electronic device, even if noise current is induced in the lid by electromagnetic waves radiated from multiple electronic components, the induced noise current is discharged to the grounded part, suppressing radiated noise. can do. In addition, since the top surface of the lid has a step shape that matches the height of multiple electronic components, even if the height of the electronic component to which heat is radiated is lower than other electronic components, the electronic component to which the heat is radiated can be removed. By forming the step so as to narrow the distance between the first heat dissipating member and the lid, the thickness of the first heat dissipating member can be suppressed, and deterioration of heat dissipation performance can be avoided. As a result, in a configuration in which multiple electronic components with different heights are mounted on a printed circuit board, radiation noise from the multiple electronic components can be appropriately suppressed, and heat dissipation performance can be appropriately improved (Patent Document 1, paragraph 0011).
特開２０２１－１７４８４７号公報Japanese Patent Application Publication No. 2021-174847
　上記従来の電子機器は、放熱対象の電子部品とリッドとの間に設けられている第１放熱部材の外縁が放熱対象の電子部品の外縁よりも内側に位置し、放熱対象の電子部品の面積よりも第１放熱部材の面積が小さくなっている（特許文献１、図１、図３－５、図７－１１、図１３－図１６、および図１８）。このような構成において、放熱部材とリッドとの接触面積を増加させて電子部品の放熱性を向上させるために、隣接して配置されて配線で接続された二つの電子部品の放熱面に跨って放熱部材を配置することが考えられる。 In the conventional electronic device described above, the outer edge of the first heat radiating member provided between the electronic component to be heat radiated and the lid is located inside the outer edge of the electronic component to be heat radiated, and the area of the electronic component to be heat radiated is The area of the first heat radiating member is smaller than that of the first heat dissipating member (Patent Document 1, FIGS. 1, 3-5, 7-11, 13-16, and 18). In such a configuration, in order to increase the contact area between the heat dissipation member and the lid and improve the heat dissipation performance of the electronic components, the heat dissipation surface of two electronic components placed adjacent to each other and connected by wiring is It is conceivable to arrange a heat dissipation member.
　しかし、上記従来の電子機器は、隣接して配置された二つの電子部品の放熱面に跨って放熱部材を配置すると、二つの電子部品を接続する配線も放熱部材によって覆われるおそれがある。このように、二つの電子部品とそれらを接続する配線が、一つの連続する放熱部材によって覆われると、放熱部材を介した輻射ノイズが増加するおそれがある。 However, in the above-mentioned conventional electronic equipment, when a heat radiating member is placed across the heat radiating surfaces of two electronic components placed adjacent to each other, there is a risk that the wiring connecting the two electronic components may also be covered by the heat radiating member. In this way, when two electronic components and the wiring connecting them are covered by one continuous heat radiating member, there is a possibility that radiated noise via the heat radiating member increases.
　本開示は、輻射ノイズを抑制しつつ、電子部品の放熱性を向上させることが可能な電子制御装置を提供する。 The present disclosure provides an electronic control device that can improve heat dissipation of electronic components while suppressing radiation noise.
　本開示の一態様は、隣接して配置されて配線で接続された第１および第２の電子部品を含む回路基板と、該回路基板を収容するハウジングと、前記第１および第２の電子部品の放熱面と前記ハウジングとの間に配置される放熱部材とを備える電子制御装置であって、前記放熱部材は、前記ハウジングに対向する前記第１および第２の電子部品の前記放熱面に跨って設けられ、前記配線は、前記放熱部材よりも誘電率が低い低誘電率媒体によって覆われていることを特徴とする電子制御装置である。 One aspect of the present disclosure provides a circuit board including first and second electronic components arranged adjacent to each other and connected by wiring, a housing housing the circuit board, and the first and second electronic components. and a heat radiating member disposed between the heat radiating surface of the electronic component and the housing, the heat radiating member straddling the heat radiating surfaces of the first and second electronic components facing the housing. The electronic control device is characterized in that the wiring is covered with a low dielectric constant medium having a dielectric constant lower than that of the heat dissipating member.
　本開示の上記一態様によれば、放熱部材よりも誘電率が低い低誘電率媒体によって配線を覆うことで輻射ノイズを抑制しつつ、放熱部材とハウジングとの接触面積を増加させて電子部品の放熱性を向上させることが可能な電子制御装置を提供することができる。 According to the above aspect of the present disclosure, radiation noise is suppressed by covering the wiring with a low dielectric constant medium having a lower dielectric constant than that of the heat dissipation member, and the contact area between the heat dissipation member and the housing is increased, so that the electronic component It is possible to provide an electronic control device that can improve heat dissipation.
本開示に係る電子制御装置の実施形態を示す分解斜視図。FIG. 1 is an exploded perspective view showing an embodiment of an electronic control device according to the present disclosure. 図１に示す電子制御装置の上下を反転させた分解斜視図。FIG. 2 is an exploded perspective view of the electronic control device shown in FIG. 1 with the top and bottom turned upside down. 図２に示す電子制御装置の第１および第２の電子部品の近傍の拡大断面図。3 is an enlarged sectional view of the vicinity of first and second electronic components of the electronic control device shown in FIG. 2. FIG. 図１から図３の実施形態に係る電子制御装置の製造方法のフロー図。FIG. 4 is a flow diagram of the method for manufacturing the electronic control device according to the embodiment of FIGS. 1 to 3. FIG. 図３の電子制御装置の変形例１を示す電子部品の近傍の拡大断面図。FIG. 4 is an enlarged cross-sectional view of the vicinity of an electronic component showing modification example 1 of the electronic control device of FIG. 3; 図３の電子制御装置の変形例２を示す電子部品の近傍の拡大断面図。FIG. 4 is an enlarged cross-sectional view of the vicinity of electronic components showing a second modification of the electronic control device of FIG. 3; 図３の電子制御装置の変形例３を示す電子部品の近傍の拡大断面図。FIG. 4 is an enlarged cross-sectional view of the vicinity of electronic components showing a third modification of the electronic control device of FIG. 3; 図３の電子制御装置の変形例４を示す電子部品の近傍の拡大断面図。FIG. 4 is an enlarged cross-sectional view of the vicinity of electronic components showing a fourth modification of the electronic control device of FIG. 3; 図３の電子制御装置の変形例５を示す電子部品の近傍の拡大断面図。FIG. 4 is an enlarged sectional view of the vicinity of electronic components showing a fifth modification of the electronic control device of FIG. 3;
　以下、図面を参照して本開示に係る電子制御装置の実施形態を説明する。 Hereinafter, embodiments of an electronic control device according to the present disclosure will be described with reference to the drawings.
　図１は、本開示に係る電子制御装置の実施形態を示す分解斜視図である。図２は、図１に示す電子制御装置１００の上下を反転させた分解斜視図である。本実施形態の電子制御装置１００は、たとえば、車両に搭載され、エンジン、電子機器、または各種のアクチュエータなどを制御する電子制御ユニット（ＥＣＵ）である。電子制御装置１００は、回路基板１１０と、ハウジング１２０と、放熱部材１３０と、を備えている。 FIG. 1 is an exploded perspective view showing an embodiment of an electronic control device according to the present disclosure. FIG. 2 is an exploded perspective view of the electronic control device 100 shown in FIG. 1, turned upside down. The electronic control device 100 of this embodiment is, for example, an electronic control unit (ECU) that is mounted on a vehicle and controls an engine, electronic equipment, various actuators, and the like. The electronic control device 100 includes a circuit board 110, a housing 120, and a heat dissipation member 130.
　回路基板１１０は、たとえば、熱硬化性樹脂およびガラスクロスを素材とする多層基板、セラミックス基板、または、ポリイミドを素材とするフレキシブルプリント基板（ＦＰＣ）である。回路基板１１０は、図示を省略する金属配線を含む複数の回路と、第１および第２の電子部品１１１，１１２を含む複数の素子とを有している。第１および第２の電子部品１１１，１１２は、たとえば、システム・オン・チップ（ＳｏＣ）、集積回路（ＩＣ）、中央処理装置（ＣＰＵ）、またはメモリ素子など、放熱を必要とする電子部品である。 The circuit board 110 is, for example, a multilayer board made of thermosetting resin and glass cloth, a ceramic board, or a flexible printed circuit board (FPC) made of polyimide. The circuit board 110 includes a plurality of circuits including metal wiring (not shown) and a plurality of elements including first and second electronic components 111 and 112. The first and second electronic components 111 and 112 are electronic components that require heat dissipation, such as a system on a chip (SoC), an integrated circuit (IC), a central processing unit (CPU), or a memory element. be.
　また、回路基板１１０は、コネクタ１１３と、複数の貫通孔１１４と、を有している。コネクタ１１３は、たとえば、回路基板１１０の回路に接続された複数のコネクタピンを有している。電子制御装置１００は、コネクタ１１３にコネクタケーブルを接続することで、コネクタケーブルを介して制御対象の外部の機器に接続される。複数の貫通孔１１４は、たとえば、回路基板１１０の周縁部に設けられ、回路基板１１０をハウジング１２０のカバー１２２に固定するための複数のネジ１４０を挿通させる。 Further, the circuit board 110 has a connector 113 and a plurality of through holes 114. Connector 113 has, for example, a plurality of connector pins connected to circuits on circuit board 110. By connecting a connector cable to the connector 113, the electronic control device 100 is connected to an external device to be controlled via the connector cable. The plurality of through holes 114 are provided, for example, at the peripheral edge of the circuit board 110 and allow the plurality of screws 140 for fixing the circuit board 110 to the cover 122 of the housing 120 to be inserted therethrough.
　ハウジング１２０は、回路基板１１０を収容する筐体である。ハウジング１２０は、たとえば、ベース部１２１と、カバー１２２とを有している。ベース部１２１およびカバー１２２は、たとえば、金属材料を鍛造、プレス加工、または切削加工することによって製造された金属製の部材である。ベース部１２１およびカバー１２２の金属材料としては、たとえば、アルミニウム、または、アルミニウムを主成分とする合金を使用することができる。 The housing 120 is a case that accommodates the circuit board 110. The housing 120 includes, for example, a base portion 121 and a cover 122. The base portion 121 and the cover 122 are, for example, metal members manufactured by forging, pressing, or cutting a metal material. As the metal material for the base portion 121 and the cover 122, for example, aluminum or an alloy containing aluminum as a main component can be used.
　ベース部１２１およびカバー１２２は、たとえば、樹脂とフィラーの混合物を射出成形することによって製造された高熱伝導性樹脂製の部材であってもよい。高熱伝導性樹脂の熱伝導率は、たとえば、２Ｗ／（ｍ・Ｋ）から３０Ｗ／（ｍ・Ｋ）までの範囲に含まれる。高熱伝導性樹脂の樹脂材料としては、たとえば、ポリブチレンテレフタレート（ＰＢＴ）や、ポリフェニレンサルファイド（ＰＰＳ）、ポリアミド（ＰＡ６）などを使用することができる。また、高熱伝導性樹脂のフィラーとしては、たとえば、ガラス繊維、炭素繊維、またはアルミナ（Ａｌ２Ｏ３）などを使用することができる。 The base portion 121 and the cover 122 may be, for example, members made of a highly thermally conductive resin manufactured by injection molding a mixture of resin and filler. The thermal conductivity of the highly thermally conductive resin is, for example, within the range of 2 W/(m·K) to 30 W/(m·K). As the resin material of the highly thermally conductive resin, for example, polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyamide (PA6), etc. can be used. Further, as the filler of the highly thermally conductive resin, for example, glass fiber, carbon fiber, alumina (Al 2 O 3 ), etc. can be used.
　ベース部１２１は、たとえば、矩形の板状の部材である。ベース部１２１は、たとえば、周壁部１２１ａと、貫通孔１２１ｂとを有している。周壁部１２１ａは、たとえば、ベース部１２１の周縁部に設けられ、カバー１２２の内側に嵌合する。貫通孔１２１ｂは、たとえば、ベース部１２１の四隅に設けられ、ベース部１２１をカバー１２２に固定するためのボルト１５０を挿通させる。 The base portion 121 is, for example, a rectangular plate-like member. The base portion 121 has, for example, a peripheral wall portion 121a and a through hole 121b. The peripheral wall portion 121 a is provided, for example, at the peripheral edge of the base portion 121 and fits inside the cover 122 . The through holes 121b are provided, for example, at the four corners of the base portion 121, and bolts 150 for fixing the base portion 121 to the cover 122 are inserted therethrough.
　カバー１２２は、たとえば、回路基板１１０の上面を覆う上壁部１２２ａと、回路基板１１０の周囲を囲む周壁部１２２ｂとを有している。上壁部１２２ａは、図１に示すように、ハウジング１２０の外表面である上面に複数の放熱フィン１２２ｆを有している。周壁部１２２ｂは、たとえば、上壁部１２２ａの周縁部からベース部１２１へ向けて延び、内側にベース部１２１の周壁部１２１ａを嵌合させる。 The cover 122 has, for example, an upper wall portion 122a that covers the upper surface of the circuit board 110, and a peripheral wall portion 122b that surrounds the circuit board 110. As shown in FIG. 1, the upper wall portion 122a has a plurality of radiation fins 122f on the upper surface, which is the outer surface of the housing 120. The peripheral wall portion 122b extends, for example, from the peripheral edge of the upper wall portion 122a toward the base portion 121, and fits the peripheral wall portion 121a of the base portion 121 inside.
　カバー１２２の上壁部１２２ａの周縁部には、たとえば、回路基板１１０をカバー１２２に固定するネジ１４０がねじ込まれる複数のネジ穴１２２ｃが設けられている。また、カバー１２２の四隅の周壁部１２２ｂの内側には、ベース部１２１をカバー１２２に固定するボルト１５０がねじ込まれる複数のネジ穴１２２ｄが設けられている。また、回路基板１１０のコネクタ１１３の位置に対応するカバー１２２の周壁部１２２ｂの一側には、コネクタ１１３の形状に対応する切欠部１２２ｅが設けられている。 A plurality of screw holes 122c, into which screws 140 for fixing the circuit board 110 to the cover 122 are screwed, are provided at the peripheral edge of the upper wall portion 122a of the cover 122, for example. Further, inside the peripheral wall portion 122b at the four corners of the cover 122, a plurality of screw holes 122d are provided into which bolts 150 for fixing the base portion 121 to the cover 122 are screwed. Further, a notch 122e corresponding to the shape of the connector 113 is provided on one side of the peripheral wall 122b of the cover 122 corresponding to the position of the connector 113 of the circuit board 110.
　カバー１２２は、図２に示すように、内表面である上壁部１２２ａの下面において、回路基板１１０の第１および第２の電子部品１１１，１１２に対向する位置に、第１および第２の凸部１６１，１６２を有している。第１および第２の凸部１６１，１６２は、たとえば、四角垂台形状を有している。また、第１および第２の凸部１６１，１６２の頂面の全体は、たとえば、図１に示す放熱部材１３０に接する第１および第２の電子部品１１１，１１２の放熱面の全体に対向している。 As shown in FIG. 2, the cover 122 has first and second electronic components 111 and 112 of the circuit board 110 on the lower surface of the upper wall portion 122a, which is the inner surface, at a position facing the first and second electronic components 111 and 112 of the circuit board 110. It has convex portions 161 and 162. The first and second convex portions 161 and 162 have, for example, a rectangular trapezoidal shape. Further, the entire top surfaces of the first and second convex portions 161 and 162 are opposed to the entire heat radiation surfaces of the first and second electronic components 111 and 112 that are in contact with the heat radiation member 130 shown in FIG. 1, for example. ing.
　なお、第１および第２の凸部１６１，１６２は、たとえば、円錐台形状、直方体形状、または円柱形状など、任意の形状を有することができる。また、第１および第２の凸部１６１，１６２の頂面は、必ずしも全体が第１および第２の電子部品１１１，１１２の放熱面に対向していなくてもよい。 Note that the first and second convex portions 161 and 162 can have any shape, such as a truncated cone shape, a rectangular parallelepiped shape, or a cylindrical shape, for example. Furthermore, the entire top surfaces of the first and second convex portions 161 and 162 do not necessarily have to face the heat dissipation surfaces of the first and second electronic components 111 and 112.
　また、第１および第２の凸部１６１，１６２の頂面の面積は、たとえば、第１および第２の電子部品１１１，１１２の放熱面の面積と比較して、小さくてもよく、大きくてもよい。また、第１および第２の凸部１６１，１６２の頂面の一部と、第１および第２の電子部品１１１，１１２の放熱部の一部が対向していてもよい。また、第１および第２の凸部１６１，１６２のいずれかの頂面に複数の電子部品が対向していてもよい。 Furthermore, the areas of the top surfaces of the first and second convex portions 161 and 162 may be smaller or larger than, for example, the areas of the heat dissipation surfaces of the first and second electronic components 111 and 112. Good too. Further, a portion of the top surface of the first and second convex portions 161 and 162 may be opposed to a portion of the heat dissipation portion of the first and second electronic components 111 and 112. Further, a plurality of electronic components may be opposed to the top surface of either of the first and second convex portions 161 and 162.
　放熱部材１３０は、第１および第２の電子部品１１１，１１２の放熱面とハウジング１２０との間に配置される。より詳細には、放熱部材１３０は、回路基板１１０に設けられた第１および第２の電子部品１１１，１１２の放熱面と、ハウジング１２０のカバー１２２に設けられた第１および第２の凸部１６１，１６２との間に配置される。放熱部材１３０は、少なくとも電子制御装置１００の組み立て時において、配置された面の形状に倣う粘性、流動性、または可塑性を、少なくとも一時的に有している。 The heat radiation member 130 is arranged between the heat radiation surfaces of the first and second electronic components 111 and 112 and the housing 120. More specifically, the heat dissipation member 130 includes the heat dissipation surfaces of the first and second electronic components 111 and 112 provided on the circuit board 110 and the first and second convex portions provided on the cover 122 of the housing 120. 161 and 162. The heat dissipation member 130 at least temporarily has viscosity, fluidity, or plasticity that follows the shape of the surface on which it is placed, at least when the electronic control device 100 is assembled.
　放熱部材１３０は、たとえば、熱伝導グリースまたは熱伝導接着剤を含む放熱対策部材（Thermal Interface Material：ＴＩＭ）である。熱伝導接着剤としては、たとえば、シート状の熱硬化性のシリコーン樹脂に高熱伝導率のフィラーを含有させたものを使用することができる。フィラーとしては、たとえば、シリカ、アルミナ、窒化アルミナ、窒化ホウ素、酸化亜鉛、酸化イットリウム、酸化マグネシウムなどの無機材料やセラミックスを使用することができる。熱伝導接着剤は、たとえば、せん断強度が０．０２ＭＰａ以上のものを使用することができる。 The heat radiation member 130 is, for example, a thermal interface material (TIM) containing thermally conductive grease or thermally conductive adhesive. As the thermally conductive adhesive, for example, a sheet of thermosetting silicone resin containing a filler having high thermal conductivity can be used. As the filler, for example, inorganic materials and ceramics such as silica, alumina, alumina nitride, boron nitride, zinc oxide, yttrium oxide, and magnesium oxide can be used. As the heat conductive adhesive, for example, one having a shear strength of 0.02 MPa or more can be used.
　図３は、図２に示す電子制御装置１００の組み立て後における第１および第２の電子部品１１１，１１２の近傍の模式的な拡大断面図である。第１および第２の電子部品１１１，１１２は、互いに隣接して配置され、一つ以上の配線１１５によって接続されている。第１および第２の電子部品１１１，１１２は、たとえば、図示を省略するインターポーザとはんだバンプを介して回路基板１１０の回路に接続され、回路基板１１０に実装されている。 FIG. 3 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112 after the electronic control device 100 shown in FIG. 2 is assembled. The first and second electronic components 111 and 112 are arranged adjacent to each other and connected by one or more wires 115. The first and second electronic components 111 and 112 are connected to the circuit of the circuit board 110 via, for example, an interposer and solder bumps (not shown), and are mounted on the circuit board 110.
　放熱部材１３０は、前述のように、少なくとも電子制御装置１００の組み立て時に粘性、流動性、または可塑性を有している。そのため、放熱部材１３０は、第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａ、または、第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａの上にそれぞれ分離して塗布または配置しても、隣接する放熱部材１３０が互いに接触して一体化する。その結果、放熱部材１３０は、ハウジング１２０のカバー１２２に設けられた第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａに対向する第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａに跨って一体に設けられている。 As described above, the heat dissipation member 130 has viscosity, fluidity, or plasticity at least when the electronic control device 100 is assembled. Therefore, the heat dissipation member 130 is separated on the top surfaces 161a, 162a of the first and second convex portions 161, 162, or on the heat dissipation surfaces 111a, 112a of the first and second electronic components 111, 112, respectively. Even when applied or placed, adjacent heat dissipating members 130 come into contact with each other and are integrated. As a result, the heat dissipation member 130 dissipates heat from the first and second electronic components 111 and 112 facing the top surfaces 161a and 162a of the first and second convex portions 161 and 162 provided on the cover 122 of the housing 120. It is provided integrally across surfaces 111a and 112a.
　配線１１５は、たとえば、互いに隣接する第１および第２の電子部品１１１，１１２間の高速通信を可能にする高速通信配線である。配線１１５は、放熱部材１３０よりも誘電率が低い低誘電率媒体１７０によって覆われている。低誘電率媒体１７０は、たとえば、比誘電率がほぼ１の空気である。また、低誘電率媒体１７０として、たとえば、シリコーン樹脂、アクリル樹脂、またはエポキシ樹脂など、比誘電率が２から３程度の樹脂材料を用いてもよい。 The wiring 115 is, for example, a high-speed communication wiring that enables high-speed communication between the first and second electronic components 111 and 112 that are adjacent to each other. The wiring 115 is covered with a low dielectric constant medium 170 having a lower dielectric constant than the heat dissipating member 130. The low dielectric constant medium 170 is, for example, air with a relative dielectric constant of approximately 1. Further, as the low dielectric constant medium 170, a resin material having a relative dielectric constant of about 2 to 3 may be used, such as silicone resin, acrylic resin, or epoxy resin.
　より詳細には、ハウジング１２０のカバー１２２は、第１の電子部品１１１の放熱面１１１ａに対向する第１の凸部１６１と、第２の電子部品１１２の放熱面１１２ａに対向する第２の凸部１６２と、を有している。図３に示す例において、第１の電子部品１１１の放熱面１１１ａは、たとえば、中央部の半導体チップの表面を含む。そのため、第１および第２の電子部品１１１，１１２の回路基板１１０の表面からの高さは、第１の電子部品１１１の方が第２の電子部品１１２よりも高くなっている。 More specifically, the cover 122 of the housing 120 has a first protrusion 161 facing the heat radiation surface 111a of the first electronic component 111 and a second projection facing the heat radiation surface 112a of the second electronic component 112. 162. In the example shown in FIG. 3, the heat radiation surface 111a of the first electronic component 111 includes, for example, the surface of the central semiconductor chip. Therefore, the height of the first and second electronic components 111 and 112 from the surface of the circuit board 110 is such that the first electronic component 111 is higher than the second electronic component 112.
　一方、回路基板１１０に対向するカバー１２２の上壁部１２２ａの内表面から回路基板１１０へ向けて突出する第１および第２の凸部１６１，１６２の高さは、第１の凸部１６１の方が第２の凸部１６２よりも低くなっている。これにより、第１および第２の凸部１６１，１６２が同じ高さである場合と比較して、第１の凸部１６１の頂面１６１ａと第１の電子部品１１１の放熱面１１１ａとの間隔Ｄ１と、第２の凸部１６２の頂面１６２ａと第２の電子部品１１２の放熱面１１２ａとの間隔Ｄ２との差が小さくなっている。 On the other hand, the heights of the first and second convex portions 161 and 162 that protrude toward the circuit board 110 from the inner surface of the upper wall portion 122a of the cover 122 facing the circuit board 110 are the same as those of the first convex portion 161. is lower than the second convex portion 162. As a result, the distance between the top surface 161a of the first protrusion 161 and the heat dissipation surface 111a of the first electronic component 111 is greater than when the first and second protrusions 161 and 162 have the same height. The difference between D1 and the distance D2 between the top surface 162a of the second convex portion 162 and the heat radiation surface 112a of the second electronic component 112 is small.
　また、ハウジング１２０のカバー１２２は、第１および第２の凸部１６１，１６２の間に設けられて配線１１５に対向する凹部１６３を有している。放熱部材１３０は、第１の凸部１６１、凹部１６３、および第２の凸部１６２の形状に倣う形状を有し、回路基板１１０、第１の電子部品１１１、および第２の電子部品１１２とともに、配線１１５の周囲に低誘電率媒体１７０によって満たされた空間を画定する。 Further, the cover 122 of the housing 120 has a recess 163 provided between the first and second protrusions 161 and 162 and facing the wiring 115. The heat dissipation member 130 has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, and together with the circuit board 110, the first electronic component 111, and the second electronic component 112, , a space filled with a low dielectric constant medium 170 is defined around the wiring 115.
　また、図３に示すように、第１の凸部１６１の頂面１６１ａにおいて凹部１６３に隣接する端縁と、第１の電子部品１１１の放熱面１１１ａにおける配線１１５に隣接する端縁とは、回路基板１１０に垂直な方向に対向している。また、第１の凸部１６１の頂面１６１ａにおいて凹部１６３と反対側の端縁と、第１の電子部品１１１の放熱面１１１ａにおける配線１１５と反対側の端縁も、回路基板１１０に垂直な方向に対向している。 Further, as shown in FIG. 3, the edge adjacent to the recess 163 on the top surface 161a of the first convex portion 161 and the edge adjacent to the wiring 115 on the heat dissipation surface 111a of the first electronic component 111 are as follows. It faces the circuit board 110 in a direction perpendicular to it. Furthermore, the edge of the top surface 161a of the first convex portion 161 opposite to the recess 163 and the edge of the heat radiation surface 111a of the first electronic component 111 opposite to the wiring 115 are also perpendicular to the circuit board 110. facing the direction.
　同様に、第２の凸部１６２の頂面１６２ａにおいて凹部１６３に隣接する端縁と、第２の電子部品１１２の放熱面１１２ａにおける配線１１５に隣接する端縁とは、回路基板１１０に垂直な方向に対向している。また、第２の凸部１６２の頂面１６２ａにおいて凹部１６３と反対側の端縁と、第２の電子部品１１２の放熱面１１２ａにおける配線１１５と反対側の端縁も、回路基板１１０に垂直な方向に対向している。 Similarly, the edge adjacent to the recess 163 on the top surface 162a of the second convex portion 162 and the edge adjacent to the wiring 115 on the heat dissipation surface 112a of the second electronic component 112 are perpendicular to the circuit board 110. facing the direction. Furthermore, the edge of the top surface 162a of the second convex portion 162 opposite to the recess 163 and the edge of the heat radiation surface 112a of the second electronic component 112 opposite to the wiring 115 are also perpendicular to the circuit board 110. facing the direction.
　なお、配線１１５に垂直かつ回路基板１１０に平行な方向において、第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａの両端縁は、第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａの両端縁と、回路基板１１０に垂直な方向に対向していてもよい。また、上記第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａの両端縁は、上記第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａの両端縁の外側に位置してもよく、内側に位置してもよい。 In addition, in the direction perpendicular to the wiring 115 and parallel to the circuit board 110, both edges of the top surfaces 161a, 162a of the first and second convex portions 161, 162 are aligned with the edges of the first and second electronic components 111, 112. Both ends of the heat dissipation surfaces 111a and 112a may face each other in a direction perpendicular to the circuit board 110. Further, both edges of the top surfaces 161a and 162a of the first and second convex portions 161 and 162 are located outside both edges of the heat radiation surfaces 111a and 112a of the first and second electronic components 111 and 112. It may also be located inside.
　図４は、図１から図３に示す電子制御装置１００を製造するための電子制御装置の製造方法Ｐの一例を示すフロー図である。図４に示す電子制御装置の製造方法Ｐのフローが開始されると、まず、カバー１２２を配置する工程Ｐ１が実施される。この工程Ｐ１では、たとえば、図２に示すように、カバー１２２の上壁部１２２ａの内表面を上にした状態で、カバー１２２が配置される。 FIG. 4 is a flow diagram showing an example of an electronic control device manufacturing method P for manufacturing the electronic control device 100 shown in FIGS. 1 to 3. When the flow of the electronic control device manufacturing method P shown in FIG. 4 is started, first, a step P1 of arranging the cover 122 is performed. In this step P1, for example, as shown in FIG. 2, the cover 122 is placed with the inner surface of the upper wall portion 122a of the cover 122 facing upward.
　次に、放熱部材１３０を配置する工程Ｐ２が実施される。この工程Ｐ２では、たとえば、前述のように、少なくとも電子制御装置１００の組み立て時において、粘性、流動性、または可塑性を有する放熱部材１３０を、カバー１２２の第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａに塗布または配置する。これにより、第１の凸部１６１と凹部１６３と第２の凸部１６２の形状に倣う放熱部材１３０をハウジング１２０に配置する。 Next, step P2 of arranging the heat radiating member 130 is performed. In this step P2, for example, as described above, at least when assembling the electronic control device 100, the heat dissipating member 130 having viscosity, fluidity, or plasticity is attached to the first and second convex portions 161, 162 of the cover 122. It is coated or placed on the top surfaces 161a, 162a of. Thereby, the heat radiating member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162 is arranged in the housing 120.
　次に、回路基板１１０を設置する工程Ｐ３が実施される。この工程Ｐ３では、回路基板１１０を、配線１１５が低誘電率媒体１７０によって覆われた状態で、ハウジング１２０に配置された放熱部材１３０の上に設置する。そして、放熱部材１３０によって第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａを跨いで覆う。同時に、配線１１５の周囲に放熱部材１３０、回路基板１１０、第１の電子部品１１１、および第２の電子部品１１２によって低誘電率媒体１７０で満たされた空間を画定する。 Next, step P3 of installing the circuit board 110 is performed. In this step P3, the circuit board 110 is installed on the heat dissipation member 130 disposed in the housing 120 with the wiring 115 covered with the low dielectric constant medium 170. Then, the heat dissipation member 130 straddles and covers the heat dissipation surfaces 111a and 112a of the first and second electronic components 111 and 112. At the same time, a space filled with a low dielectric constant medium 170 is defined around the wiring 115 by the heat dissipating member 130, the circuit board 110, the first electronic component 111, and the second electronic component 112.
　すなわち、低誘電率媒体１７０が空気である場合には、空気中で第１の凸部１６１と凹部１６３と第２の凸部１６２の形状に倣う放熱部材１３０の上に回路基板１１０を配置することで、配線１１５の周囲に空気で満たされた空間が画定される。また、低誘電率媒体１７０が前述のような低誘電率の樹脂である場合には、あらかじめ配線１１５にその樹脂を塗布しておく。その状態で、第１の凸部１６１と凹部１６３と第２の凸部１６２の形状に倣う放熱部材１３０の上に回路基板１１０を配置することで、配線１１５の周囲に低誘電率の樹脂で満たされた空間が画定される。 That is, when the low dielectric constant medium 170 is air, the circuit board 110 is placed on the heat dissipation member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162 in the air. As a result, a space filled with air is defined around the wiring 115. Further, if the low dielectric constant medium 170 is a low dielectric constant resin as described above, the resin is applied to the wiring 115 in advance. In this state, by placing the circuit board 110 on the heat dissipation member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, a resin with a low dielectric constant is placed around the wiring 115. A filled space is defined.
　その後、図１および図２に示す複数のネジ１４０を回路基板１１０の複数の貫通孔１１４に挿通させてカバー１２２のネジ穴１２２ｃにねじ込んで、回路基板１１０をカバー１２２に固定する。さらに、放熱部材１３０が導電性接着剤である場合には、たとえば、放熱部材１３０を加熱して硬化させる。 Thereafter, the plurality of screws 140 shown in FIGS. 1 and 2 are inserted into the plurality of through holes 114 of the circuit board 110 and screwed into the screw holes 122c of the cover 122 to fix the circuit board 110 to the cover 122. Furthermore, when the heat dissipation member 130 is a conductive adhesive, for example, the heat dissipation member 130 is heated and cured.
　次に、ベース部１２１を設置する工程Ｐ４が実施される。この工程Ｐ４では、たとえば、図２に示すボルト１５０をベース部１２１の四隅の貫通孔１２１ｂに挿通させて、カバー１２２の四隅のネジ穴１２２ｄにねじ込んで、ベース部１２１をカバー１２２に固定する。これにより、回路基板１１０を収容するハウジング１２０が形成され、電子制御装置１００が完成する。以上により、図４に示す電子制御装置の製造方法Ｐのフローが終了する。 Next, step P4 of installing the base portion 121 is performed. In this step P4, for example, the bolts 150 shown in FIG. 2 are inserted into the through holes 121b at the four corners of the base part 121 and screwed into the screw holes 122d at the four corners of the cover 122, thereby fixing the base part 121 to the cover 122. As a result, a housing 120 that accommodates the circuit board 110 is formed, and the electronic control device 100 is completed. With the above steps, the flow of the electronic control device manufacturing method P shown in FIG. 4 is completed.
　以下、本実施形態の電子制御装置１００および電子制御装置の製造方法Ｐの作用を説明する。 Hereinafter, the effects of the electronic control device 100 and the electronic control device manufacturing method P of this embodiment will be explained.
　本実施形態の電子制御装置１００は、前述のように、回路基板１１０と、ハウジング１２０と、放熱部材１３０とを備えている。回路基板１１０は、隣接して配置されて配線１１５で接続された第１および第２の電子部品１１１，１１２を含む。ハウジング１２０は、回路基板１１０を収容する。放熱部材１３０は、第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａとハウジング１２０との間に配置され、ハウジング１２０に対向する第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａに跨って設けられている。配線１１５は、放熱部材１３０よりも誘電率が低い低誘電率媒体１７０によって覆われている。 As described above, the electronic control device 100 of this embodiment includes the circuit board 110, the housing 120, and the heat radiation member 130. Circuit board 110 includes first and second electronic components 111 and 112 arranged adjacent to each other and connected by wiring 115. Housing 120 houses circuit board 110. The heat radiation member 130 is disposed between the heat radiation surfaces 111a, 112a of the first and second electronic components 111, 112 and the housing 120, and is arranged to dissipate the heat of the first and second electronic components 111, 112 facing the housing 120. It is provided across surfaces 111a and 112a. The wiring 115 is covered with a low dielectric constant medium 170 having a lower dielectric constant than the heat dissipating member 130.
　このように、放熱部材１３０が第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａに跨って設けられることで、放熱部材１３０と放熱面１１１ａ，１１２ａおよびハウジング１２０との接触面積を増加させることができる。その結果、第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａから放熱部材１３０を介してハウジング１２０へ移動する熱を増加させ、第１および第２の電子部品１１１，１１２の放熱性を向上させることができる。 In this way, the heat dissipation member 130 is provided across the heat dissipation surfaces 111a, 112a of the first and second electronic components 111, 112, thereby reducing the contact area between the heat dissipation member 130, the heat dissipation surfaces 111a, 112a, and the housing 120. can be increased. As a result, the heat transferred from the heat radiation surfaces 111a, 112a of the first and second electronic components 111, 112 to the housing 120 via the heat radiation member 130 is increased, and the heat radiation of the first and second electronic components 111, 112 is increased. can improve sex.
　また、上記のように、放熱部材１３０よりも誘電率が低い低誘電率媒体１７０によって配線１１５が覆われていることで、ノイズの発生を抑制することができる。すなわち、配線１１５に由来するノイズ強度Ｎは、配線１１５とハウジング１２０との間のインピーダンスＺに反比例する（Ｎ∝１／Ｚ）。また、配線１１５とハウジング１２０との間のインピーダンスＺは、配線１１５とハウジング１２０との間の空間を占める物質の静電容量Ｃおよび周波数ｆに反比例する（Ｚ＝１／（２πｆＣ））。さらに、静電容量Ｃは、真空の誘電率ε０、配線１１５とハウジング１２０との間の空間を占める物質の比誘電率εｓ、および面積Ｓに比例し、距離Ｄに反比例する（Ｃ＝ε０・εｓ・Ｓ／Ｄ）。 Further, as described above, since the wiring 115 is covered with the low dielectric constant medium 170 whose dielectric constant is lower than that of the heat dissipation member 130, the generation of noise can be suppressed. That is, the noise intensity N originating from the wiring 115 is inversely proportional to the impedance Z between the wiring 115 and the housing 120 (N∝1/Z). Further, the impedance Z between the wiring 115 and the housing 120 is inversely proportional to the capacitance C of the material occupying the space between the wiring 115 and the housing 120 and the frequency f (Z=1/(2πfC)). Further, the capacitance C is proportional to the dielectric constant ε 0 of the vacuum, the relative dielectric constant ε s of the material occupying the space between the wiring 115 and the housing 120, and the area S, and is inversely proportional to the distance D (C= ε 0・ε s・S/D).
　したがって、配線１１５が放熱部材１３０よりも誘電率が低い低誘電率媒体１７０によって覆われることで、配線１１５が放熱部材１３０に覆われている場合と比較して、配線１１５の周囲の静電容量Ｃが減少する。その結果、配線１１５の周囲のインピーダンスＺが増加し、配線１１５に由来するノイズ強度Ｎが低下する。また、配線１１５を覆う低誘電率媒体１７０の体積が増加するほど、配線１１５に由来するノイズの抑制効果を向上させることができる。 Therefore, by covering the wiring 115 with the low dielectric constant medium 170 whose dielectric constant is lower than that of the heat dissipating member 130, the capacitance around the wiring 115 is reduced compared to when the wiring 115 is covered with the heat dissipating member 130. C decreases. As a result, the impedance Z around the wiring 115 increases, and the noise intensity N originating from the wiring 115 decreases. Further, as the volume of the low dielectric constant medium 170 that covers the wiring 115 increases, the effect of suppressing noise originating from the wiring 115 can be improved.
　また、本実施形態の電子制御装置１００において、ハウジング１２０は、第１の電子部品１１１の放熱面１１１ａに対向する第１の凸部１６１と、第２の電子部品１１２の放熱面１１２ａに対向する第２の凸部１６２と、を有している。さらに、ハウジング１２０は、第１および第２の凸部１６１，１６２の間に設けられて配線１１５に対向する凹部１６３を有している。そして、放熱部材１３０は、これら第１の凸部１６１、凹部１６３、および第２の凸部１６２の形状に倣う形状を有し、回路基板１１０、第１の電子部品１１１、および第２の電子部品１１２とともに、配線１１５の周囲に低誘電率媒体１７０によって満たされた空間を画定する。 Furthermore, in the electronic control device 100 of the present embodiment, the housing 120 has a first convex portion 161 facing the heat radiation surface 111a of the first electronic component 111 and a first convex portion 161 facing the heat radiation surface 112a of the second electronic component 112. It has a second convex portion 162. Further, the housing 120 has a recess 163 provided between the first and second protrusions 161 and 162 and facing the wiring 115. The heat dissipation member 130 has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, and has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162, and the heat dissipation member 130 has a shape that follows the shapes of the first protrusion 161, the concave portion 163, and the second convex portion 162, and is Together with the component 112, a space filled with a low dielectric constant medium 170 is defined around the wiring 115.
　また、本実施形態の電子制御装置の製造方法Ｐは、上記電子制御装置１００を製造する方法である。電子制御装置の製造方法Ｐは、前述のように、工程Ｐ２と工程Ｐ３を有している。工程Ｐ２では、第１の凸部１６１と凹部１６３と第２の凸部１６２の形状に倣う放熱部材１３０をハウジング１２０に配置する。工程Ｐ３では、回路基板１１０を配線１１５が低誘電率媒体１７０によって覆われた状態でハウジング１２０に配置された放熱部材１３０の上に設置し、放熱部材１３０によって第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａを跨いで覆う。それと同時に、配線１１５の周囲に放熱部材１３０、回路基板１１０、第１の電子部品１１１、および第２の電子部品１１２によって低誘電率媒体１７０で満たされた空間を画定する。 Furthermore, the electronic control device manufacturing method P of this embodiment is a method of manufacturing the electronic control device 100 described above. As described above, the electronic control device manufacturing method P includes the process P2 and the process P3. In step P2, the heat dissipation member 130 that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162 is arranged in the housing 120. In step P3, the circuit board 110 is installed on the heat dissipation member 130 disposed in the housing 120 with the wiring 115 covered with the low dielectric constant medium 170, and the heat dissipation member 130 connects the first and second electronic components 111. , 112 and covers the heat dissipating surfaces 111a and 112a. At the same time, a space filled with a low dielectric constant medium 170 is defined around the wiring 115 by the heat dissipation member 130, the circuit board 110, the first electronic component 111, and the second electronic component 112.
　このように、本実施形態の電子制御装置１００および電子制御装置の製造方法Ｐでは、放熱部材１３０が第１の凸部１６１、凹部１６３、および第２の凸部１６２の形状に倣う形状を有する。これにより、ハウジング１２０の第１および第２の凸部１６１，１６２と反対側の放熱部材１３０の表面にハウジング１２０の凹部１６３の形状に対応する凹部を形成し、その凹部を配線１１５に対向させて配置することができる。その結果、第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａの広い範囲と、ハウジング１２０の広い範囲を、放熱面１１１ａ，１１２ａを跨ぐ放熱部材１３０を介して熱的に接続することができ、第１および第２の電子部品１１１，１１２の放熱性が向上する。さらに、放熱部材１３０の凹部と、回路基板１１０の表面と、第１および第２の電子部品１１１，１１２とによって、配線１１５の周囲に低誘電率媒体１７０によって満たされた空間を画定し、配線１１５に由来するノイズを低減することができる。 As described above, in the electronic control device 100 and the electronic control device manufacturing method P of the present embodiment, the heat dissipation member 130 has a shape that follows the shapes of the first convex portion 161, the concave portion 163, and the second convex portion 162. . As a result, a recess corresponding to the shape of the recess 163 of the housing 120 is formed on the surface of the heat dissipation member 130 on the opposite side to the first and second projections 161 and 162 of the housing 120, and the recess is opposed to the wiring 115. It can be placed as follows. As a result, the wide range of the heat dissipation surfaces 111a, 112a of the first and second electronic components 111, 112 and the wide range of the housing 120 are thermally connected via the heat dissipation member 130 that straddles the heat dissipation surfaces 111a, 112a. This improves the heat dissipation of the first and second electronic components 111 and 112. Further, a space filled with a low dielectric constant medium 170 is defined around the wiring 115 by the recess of the heat dissipation member 130, the surface of the circuit board 110, and the first and second electronic components 111, 112, and the wiring 115 can be reduced.
　また、本実施形態の電子制御装置１００において、低誘電率媒体１７０は、たとえば、空気である。この場合、電子制御装置１００の製造工程において、配線１１５に低誘電率媒体１７０を塗布する工程を省略して、高い生産性の維持と生産コストの抑制が可能になる。さらに、配線１１５に由来するノイズを、配線１１５を覆う低誘電率媒体１７０としての空気によって低減することができる。 Furthermore, in the electronic control device 100 of this embodiment, the low dielectric constant medium 170 is, for example, air. In this case, in the manufacturing process of the electronic control device 100, the process of applying the low dielectric constant medium 170 to the wiring 115 is omitted, making it possible to maintain high productivity and suppress production costs. Furthermore, noise originating from the wiring 115 can be reduced by air serving as the low dielectric constant medium 170 covering the wiring 115.
　以上説明したように、本実施形態によれば、第１および第２の電子部品１１１，１１２間の配線１１５に由来する輻射ノイズを抑制しつつ、第１および第２の電子部品１１１，１１２の放熱性を向上させることが可能な電子制御装置１００を提供することができる。なお、本開示に係る電子制御装置は、前述の実施形態に係る電子制御装置１００の構成に限定されない。以下、図７から図９までを参照して、前述の実施形態に係る電子制御装置１００のいくつかの変形例を説明する。 As described above, according to the present embodiment, the radiation noise originating from the wiring 115 between the first and second electronic components 111, 112 is suppressed, and the It is possible to provide an electronic control device 100 that can improve heat dissipation. Note that the electronic control device according to the present disclosure is not limited to the configuration of the electronic control device 100 according to the above-described embodiment. Hereinafter, some modified examples of the electronic control device 100 according to the above-described embodiment will be described with reference to FIGS. 7 to 9.
　図５は、図３の電子制御装置１００の変形例１を示す第１および第２の電子部品１１１，１１２の近傍の模式的な拡大断面図である。この変形例１では、第１の凸部１６１の頂面１６１ａにおいて凹部１６３に隣接する端縁が、第１の電子部品１１１の放熱面１１１ａにおいて配線１１５に隣接する端縁よりも、第１の電子部品１１１の放熱面１１１ａの中央側に位置している。同様に、この変形例１では、第２の凸部１６２の頂面１６２ａにおいて凹部１６３に隣接する端縁は、第２の電子部品１１２の放熱面１１２ａにおいて配線１１５に隣接する端縁よりも、第２の電子部品１１２の放熱面１１２ａの中央側に位置している。 FIG. 5 is a schematic enlarged cross-sectional view of the vicinity of the first and second electronic components 111 and 112, showing a first modification of the electronic control device 100 of FIG. In this first modification, the edge of the top surface 161a of the first convex portion 161 adjacent to the recess 163 is lower than the edge of the heat dissipation surface 111a of the first electronic component 111 adjacent to the wiring 115. It is located on the center side of the heat radiation surface 111a of the electronic component 111. Similarly, in Modification 1, the edge of the top surface 162a of the second convex portion 162 adjacent to the recess 163 is smaller than the edge adjacent to the wiring 115 of the heat dissipation surface 112a of the second electronic component 112. It is located on the center side of the heat radiation surface 112a of the second electronic component 112.
　このような構成により、図５の変形例１に係る電子制御装置１００によれば、図３の実施形態に係る電子制御装置１００と比較して、配線１１５に対向する凹部１６３の幅と深さを拡大することが可能になる。その結果、放熱部材１３０の表面の配線１１５に対向する位置により大きな凹部を形成することができ、配線１１５の周囲の低誘電率媒体１７０によって満たされた空間を拡大して、配線１１５に起因する輻射ノイズをより低減することが可能になる。 With such a configuration, the electronic control device 100 according to the first modification in FIG. becomes possible to expand. As a result, a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
　また、図５に示す変形例１の電子制御装置１００では、第１の凸部１６１の頂面１６１ａにおいて凹部１６３と反対側の端縁は、第１の電子部品１１１の放熱面１１１ａにおいて配線１１５と反対側に位置する端縁よりも、第１の電子部品１１１の放熱面１１１ａの中央側に位置している。同様に、この変形例１では、第２の凸部１６２の頂面１６２ａにおいて凹部１６３と反対側の端縁は、第２の電子部品１１２の放熱面１１２ａにおいて配線１１５と反対側に位置する端縁よりも、第２の電子部品１１２の放熱面１１２ａの中央側に位置している。 In addition, in the electronic control device 100 of the first modification shown in FIG. It is located closer to the center of the heat radiation surface 111a of the first electronic component 111 than the edge located on the opposite side. Similarly, in Modification 1, the edge of the top surface 162a of the second convex portion 162 opposite to the recess 163 is the edge opposite to the wiring 115 in the heat dissipation surface 112a of the second electronic component 112. It is located closer to the center of the heat radiation surface 112a of the second electronic component 112 than the edge.
　このような構成により、図５の変形例１に係る電子制御装置１００によれば、図３の前述の実施形態に係る電子制御装置１００と比較して、放熱部材１３０が第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａにおける凹部１６３と反対側の端縁の外側へ広がりやすくなる。その結果、放熱部材１３０の表面の配線１１５に対向する位置により大きな凹部を形成することができ、配線１１５の周囲の低誘電率媒体１７０によって満たされた空間を拡大して、配線１１５に起因する輻射ノイズをより低減することが可能になる。 With such a configuration, according to the electronic control device 100 according to the first modification in FIG. 5, the heat dissipation member 130 is connected to the first and second The edges of the top surfaces 161a, 162a of the protrusions 161, 162 on the opposite side to the recess 163 tend to spread outward. As a result, a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
　図６は、図３の電子制御装置１００の変形例２を示す第１および第２の電子部品１１１，１１２の近傍の模式的な拡大断面図である。この変形例２では、第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａにおける凹部１６３と反対側の端縁だけが、第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａにおいて配線１１５と反対側に位置する端縁よりも、それぞれの放熱面１１１ａ，１１２ａの中央側に位置している。 FIG. 6 is a schematic enlarged cross-sectional view of the vicinity of the first and second electronic components 111 and 112, showing a second modification of the electronic control device 100 of FIG. In this modification example 2, only the edges of the top surfaces 161a, 162a of the first and second convex parts 161, 162 on the side opposite to the recessed part 163 are the heat radiation surfaces 111a of the first and second electronic components 111, 112. , 112a are located closer to the center of each of the heat dissipating surfaces 111a, 112a than the edge located on the opposite side to the wiring 115.
　この変形例２に係る電子制御装置１００によっても、変形例１に係る電子制御装置１００と同様に、放熱部材１３０が第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａにおける凹部１６３と反対側の端縁の外側へ広がりやすくなる。その結果、放熱部材１３０の表面の配線１１５に対向する位置により大きな凹部を形成することができ、配線１１５の周囲の低誘電率媒体１７０によって満たされた空間を拡大して、配線１１５に起因する輻射ノイズをより低減することが可能になる。 Similarly to the electronic control device 100 according to the first modification, in the electronic control device 100 according to the second modification, the heat dissipation member 130 is connected to the recesses 161 in the top surfaces 161a and 162a of the first and second convex portions 161 and 162. It tends to spread to the outside of the opposite edge. As a result, a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
　図７は、図３の電子制御装置１００の変形例３を示す第１および第２の電子部品１１１，１１２の近傍の模式的な拡大断面図である。この変形例３では、第１および第２の凸部１６１，１６２の頂面１６１ａ，１６２ａにおける凹部１６３に隣接する端縁だけが、第１および第２の電子部品１１１，１１２の放熱面１１１ａ，１１２ａにおいて配線１１５に隣接する端縁よりも、それぞれの放熱面１１１ａ，１１２ａの中央側に位置している。 FIG. 7 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112, showing a third modification of the electronic control device 100 of FIG. In this third modification, only the edges of the top surfaces 161a, 162a of the first and second convex parts 161, 162 adjacent to the recessed part 163 are the heat dissipation surfaces 111a, It is located closer to the center of each heat dissipation surface 111a, 112a than the edge adjacent to the wiring 115 in 112a.
　この変形例３に係る電子制御装置１００によっても、変形例１に係る電子制御装置１００と同様に、配線１１５に対向する凹部１６３の幅と深さを拡大することが可能になる。その結果、放熱部材１３０の表面の配線１１５に対向する位置により大きな凹部を形成することができ、配線１１５の周囲の低誘電率媒体１７０によって満たされた空間を拡大して、配線１１５に起因する輻射ノイズをより低減することが可能になる。 Similarly to the electronic control device 100 according to the first modification, the electronic control device 100 according to the third modification also makes it possible to expand the width and depth of the recess 163 facing the wiring 115. As a result, a larger recess can be formed on the surface of the heat dissipation member 130 at a position facing the wiring 115, and the space filled with the low dielectric constant medium 170 around the wiring 115 is expanded, and the space caused by the wiring 115 is expanded. It becomes possible to further reduce radiation noise.
　図８は、図３の電子制御装置１００の変形例４を示す第１および第２の電子部品１１１，１１２の近傍の模式的な拡大断面図である。図７に示す前述の変形例３に係る電子制御装置１００において、ハウジング１２０の第１および第２の凸部１６１，１６２の間の凹部１６３は、四角垂台形状または円錐台形状の第１および第２の凸部１６１，１６２の側面によって画定されていた。 FIG. 8 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112, showing a fourth modification of the electronic control device 100 of FIG. In the electronic control device 100 according to the above-mentioned modification example 3 shown in FIG. It was defined by the side surfaces of the second convex portions 161 and 162.
　これに対し、図８の変形例４に係る電子制御装置１００において、ハウジング１２０の第１および第２の凸部１６１，１６２の間の凹部１６３は、回路基板１１０に垂直な側面と回路基板１１０に平行な底面によって画定されている。このような構成により、変形例４に係る電子制御装置１００によれば、図７の変形例３に係る電子制御装置１００と比較して、凹部１６３の容積を拡大して、配線１１５に対向する放熱部材１３０の凹部を拡大することができる。その結果、配線１１５の周囲の低誘電率媒体１７０によって満たされた空間を拡大して、配線１１５に起因する輻射ノイズをより低減することが可能になる。 On the other hand, in the electronic control device 100 according to the fourth modification in FIG. is defined by a base parallel to . With such a configuration, according to the electronic control device 100 according to the fourth modification, the volume of the recess 163 is enlarged compared to the electronic control device 100 according to the third modification in FIG. The recessed portion of the heat dissipating member 130 can be enlarged. As a result, it becomes possible to expand the space filled with the low dielectric constant medium 170 around the wiring 115 and further reduce the radiation noise caused by the wiring 115.
　図９は、図３の電子制御装置１００の変形例５を示す第１および第２の電子部品１１１，１１２の近傍の模式的な拡大断面図である。本変形例に係る電子制御装置１００は、ハウジング１２０の凹部１６３が凹曲面によって形成されている点のみが、図５に示す変形例１に係る電子制御装置１００と異なっている。本変形例に係る電子制御装置１００によれば、図５に示す変形例１に係る電子制御装置１００と同様の効果を奏することができるだけでなく、凹部１６３の容積を拡大することが可能になる。その結果、配線１１５の周囲の低誘電率媒体１７０によって満たされた空間を拡大して、配線１１５に起因する輻射ノイズをより低減することが可能になる。 FIG. 9 is a schematic enlarged sectional view of the vicinity of the first and second electronic components 111 and 112, showing a fifth modification of the electronic control device 100 of FIG. The electronic control device 100 according to this modification differs from the electronic control device 100 according to modification 1 shown in FIG. 5 only in that the recess 163 of the housing 120 is formed by a concave curved surface. According to the electronic control device 100 according to the present modification, not only can the same effects as the electronic control device 100 according to the modification 1 shown in FIG. 5 be achieved, but also the volume of the recess 163 can be expanded. . As a result, it becomes possible to expand the space filled with the low dielectric constant medium 170 around the wiring 115 and further reduce the radiation noise caused by the wiring 115.
　以上、図面を用いて本開示に係る電子制御装置の実施形態とその変形例を詳述してきたが、具体的な構成はこれらの実施形態およびその変形例に限定されるものではなく、本開示の要旨を逸脱しない範囲における設計変更等があっても、それらは本開示に含まれるものである。たとえば、本開示に係る電子制御装置は、車載用以外にもインバータやコンバータなどの機器用に提供することも可能である。 Although the embodiments and variations thereof of the electronic control device according to the present disclosure have been described above in detail using the drawings, the specific configuration is not limited to these embodiments and variations thereof, and the embodiments of the electronic control device according to the present disclosure are not limited to the embodiments and variations thereof. Even if there are design changes within the scope of the invention, they are included in the present disclosure. For example, the electronic control device according to the present disclosure can be provided for devices such as inverters and converters in addition to being mounted on vehicles.
１００　　電子制御装置
１１０　　回路基板
１１１　　第１の電子部品
１１１ａ　放熱面
１１２　　第２の電子部品
１１２ａ　放熱面
１１５　　配線
１２０　　ハウジング
１３０　　放熱部材
１６１　　第１の凸部
１６２　　第２の凸部
１６３　　凹部
１７０　　低誘電率媒体
Ｐ　　　　電子制御装置の製造方法
Ｐ２　　　放熱部材を配置する工程
Ｐ３　　　回路基板を設置する工程 100 Electronic control device 110 Circuit board 111 First electronic component 111a Heat radiation surface 112 Second electronic component 112a Heat radiation surface 115 Wiring 120 Housing 130 Heat radiation member 161 First convex portion 162 Second convex portion 163 Concave portion 170 Low dielectric constant Medium P Electronic control device manufacturing method P2 Step of arranging a heat dissipation member P3 Step of installing a circuit board

Claims (8)

  1. 　隣接して配置されて配線で接続された第１および第２の電子部品を含む回路基板と、該回路基板を収容するハウジングと、前記第１および第２の電子部品の放熱面と前記ハウジングとの間に配置される放熱部材とを備える電子制御装置であって、
    　前記放熱部材は、前記ハウジングに対向する前記第１および第２の電子部品の前記放熱面に跨って設けられ、
    　前記配線は、前記放熱部材よりも誘電率が低い低誘電率媒体によって覆われていることを特徴とする電子制御装置。     a circuit board including first and second electronic components arranged adjacent to each other and connected by wiring; a housing accommodating the circuit board; a heat dissipation surface of the first and second electronic components; and the housing. An electronic control device comprising: a heat dissipation member disposed between the
    The heat radiating member is provided across the heat radiating surfaces of the first and second electronic components facing the housing,
    The electronic control device is characterized in that the wiring is covered with a low dielectric constant medium having a dielectric constant lower than that of the heat dissipating member.
  2. 　前記ハウジングは、前記第１の電子部品の前記放熱面に対向する第１の凸部と、前記第２の電子部品の前記放熱面に対向する第２の凸部と、前記第１および第２の凸部の間に設けられて前記配線に対向する凹部と、を有し、
    　前記放熱部材は、前記第１の凸部、前記凹部、および前記第２の凸部の形状に倣う形状を有し、前記回路基板、前記第１の電子部品、および前記第２の電子部品とともに、前記配線の周囲に前記低誘電率媒体によって満たされた空間を画定することを特徴とする請求項１に記載の電子制御装置。     The housing includes a first convex portion facing the heat radiation surface of the first electronic component, a second convex portion facing the heat radiation surface of the second electronic component, and the first and second convex portions. a concave portion provided between the convex portions and facing the wiring,
    The heat dissipation member has a shape that follows the shapes of the first convex portion, the concave portion, and the second convex portion, and together with the circuit board, the first electronic component, and the second electronic component. 2. The electronic control device according to claim 1, further comprising a space filled with the low dielectric constant medium around the wiring.
  3. 　前記第１の凸部の頂面において前記凹部に隣接する端縁は、前記第１の電子部品の前記放熱面において前記配線に隣接する端縁よりも、前記第１の電子部品の前記放熱面の中央側に位置していることを特徴とする請求項２に記載の電子制御装置。 The edge adjacent to the recess on the top surface of the first convex portion is closer to the heat radiation surface of the first electronic component than the edge adjacent to the wiring on the heat radiation surface of the first electronic component. 3. The electronic control device according to claim 2, wherein the electronic control device is located at the center of the electronic control device.
  4. 　前記第２の凸部の頂面において前記凹部に隣接する端縁は、前記第２の電子部品の前記放熱面において前記配線に隣接する端縁よりも、前記第２の電子部品の前記放熱面の中央側に位置していることを特徴とする請求項２に記載の電子制御装置。 The edge adjacent to the recess on the top surface of the second convex portion is closer to the heat radiation surface of the second electronic component than the edge adjacent to the wiring on the heat radiation surface of the second electronic component. 3. The electronic control device according to claim 2, wherein the electronic control device is located at the center of the electronic control device.
  5. 　前記第１の凸部の頂面において前記凹部と反対側の端縁は、前記第１の電子部品の前記放熱面において前記配線と反対側に位置する端縁よりも、前記第１の電子部品の前記放熱面の中央側に位置していることを特徴とする請求項２に記載の電子制御装置。 The edge of the top surface of the first convex portion on the side opposite to the concave portion is closer to the first electronic component than the edge located on the side opposite to the wiring on the heat dissipation surface of the first electronic component. 3. The electronic control device according to claim 2, wherein the electronic control device is located at the center of the heat radiation surface.
  6. 　前記第２の凸部の頂面において前記凹部と反対側の端縁は、前記第２の電子部品の前記放熱面において前記配線と反対側に位置する端縁よりも、前記第２の電子部品の前記放熱面の中央側に位置していることを特徴とする請求項２に記載の電子制御装置。 The edge of the top surface of the second convex portion on the side opposite to the concave portion is more sensitive to the second electronic component than the edge located on the side opposite to the wiring on the heat dissipation surface of the second electronic component. 3. The electronic control device according to claim 2, wherein the electronic control device is located at the center of the heat radiation surface.
  7. 　前記低誘電率媒体は、空気であることを特徴とする請求項１に記載の電子制御装置。 The electronic control device according to claim 1, wherein the low dielectric constant medium is air.
  8. 　請求項２に記載の電子制御装置の製造方法であって、
    　前記第１の凸部と前記凹部と前記第２の凸部の形状に倣う前記放熱部材を前記ハウジングに配置する工程と、
    　前記回路基板を前記配線が前記低誘電率媒体によって覆われた状態で前記ハウジングに配置された前記放熱部材の上に設置し、前記放熱部材によって前記第１および第２の電子部品の前記放熱面を跨いで覆うとともに、前記配線の周囲に前記放熱部材、前記回路基板、前記第１の電子部品、および前記第２の電子部品によって前記低誘電率媒体で満たされた空間を画定する工程と、
    　を有することを特徴とする電子制御装置の製造方法。     A method for manufacturing an electronic control device according to claim 2, comprising:
    arranging in the housing the heat dissipation member that follows the shapes of the first convex portion, the concave portion, and the second convex portion;
    The circuit board is installed on the heat radiating member disposed in the housing with the wiring covered by the low dielectric constant medium, and the heat radiating surface of the first and second electronic components is disposed by the heat radiating member. and defining a space filled with the low dielectric constant medium around the wiring by the heat dissipation member, the circuit board, the first electronic component, and the second electronic component;
    A method of manufacturing an electronic control device, comprising:
PCT/JP2023/014871 2022-07-01 2023-04-12 Electronic control device WO2024004324A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217343A (en) * 2001-01-16 2002-08-02 Denso Corp Electronic device
JP2003069263A (en) * 2001-08-28 2003-03-07 Nec Saitama Ltd Electronic circuit package with heat sink and its manufacturing method
JP2017536693A (en) * 2014-10-17 2017-12-07 スリーエム イノベイティブ プロパティズ カンパニー Electronic circuit board assembly comprising an EMI shield structure and a heat dissipation pad
JP2019186375A (en) * 2018-04-10 2019-10-24 富士通コンポーネント株式会社 Communication module
JP2019192755A (en) * 2018-04-24 2019-10-31 株式会社ジェイテクト Substrate heat radiation structure
JP2022086203A (en) * 2020-11-30 2022-06-09 セイコーエプソン株式会社 Head unit, and liquid discharge device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217343A (en) * 2001-01-16 2002-08-02 Denso Corp Electronic device
JP2003069263A (en) * 2001-08-28 2003-03-07 Nec Saitama Ltd Electronic circuit package with heat sink and its manufacturing method
JP2017536693A (en) * 2014-10-17 2017-12-07 スリーエム イノベイティブ プロパティズ カンパニー Electronic circuit board assembly comprising an EMI shield structure and a heat dissipation pad
JP2019186375A (en) * 2018-04-10 2019-10-24 富士通コンポーネント株式会社 Communication module
JP2019192755A (en) * 2018-04-24 2019-10-31 株式会社ジェイテクト Substrate heat radiation structure
JP2022086203A (en) * 2020-11-30 2022-06-09 セイコーエプソン株式会社 Head unit, and liquid discharge device

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