WO2023021728A1 - Electronic control device - Google Patents

Electronic control device Download PDF

Info

Publication number
WO2023021728A1
WO2023021728A1 PCT/JP2022/004945 JP2022004945W WO2023021728A1 WO 2023021728 A1 WO2023021728 A1 WO 2023021728A1 JP 2022004945 W JP2022004945 W JP 2022004945W WO 2023021728 A1 WO2023021728 A1 WO 2023021728A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic control
heat
control device
circuit board
heat dissipation
Prior art date
Application number
PCT/JP2022/004945
Other languages
French (fr)
Japanese (ja)
Inventor
康博 露木
利昭 石井
諒 秋葉
義夫 河合
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Publication of WO2023021728A1 publication Critical patent/WO2023021728A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to an electronic control device.
  • An on-board electronic control unit that has electronic components that control the vehicle is installed in the vehicle.
  • the in-vehicle electronic control unit has a heat dissipating structure that thermally connects a heat dissipating block and a heat dissipating member to dissipate heat.
  • Patent Document 1 Technologies related to the heat dissipation of electronic components include those described in Patent Document 1, for example.
  • Patent Document 1 an element module sealed with resin, a heat dissipation block, heat dissipation grease is sandwiched between the module and the heat dissipation block, and the heat dissipation block has a concave structure.
  • a technique for increasing the heat radiation area of the module by applying heat radiation grease to the entire concave area of the heat radiation block having a concave structure is described.
  • the element module and the heat dissipation block are thermally connected with grease on the entire surface, and the boron nitride filler with high thermal conductivity and low dielectric constant is used as the thermal conductive filler, and the heat conduction is anisotropic.
  • the heat dissipation is maintained even if there is, an increase in radiation noise cannot be avoided, and the heat dissipation structure cannot take measures against radiation noise.
  • the object of the present invention is to apply a heat dissipating member with anisotropic heat conduction in a structure that reduces the amount of noise transmitted from electronic parts to the heat dissipating block as a structure of an in-vehicle electronic control device.
  • An object of the present invention is to provide an in-vehicle electronic control device capable of enhancing the heat radiation effect even if the temperature is reduced.
  • the present invention is configured as follows.
  • the distance between the circuit board and the first surface of the heat radiation base which is a planar portion having the center point of the coating area of the heat radiation member, is greater than the first surface. It is shorter than the vertical distance between the second surface, which is the bottom surface of the recess formed on the outer peripheral side, and the circuit board.
  • an in-vehicle electronic control device that has a structure that reduces the amount of noise transmitted from electronic components to a heat dissipation block, and that can enhance the heat dissipation effect even if a heat dissipation member having anisotropic heat conduction is applied. can provide.
  • FIG. 1 is an external perspective view showing an in-vehicle electronic control device according to a first embodiment
  • FIG. 1 is an exploded perspective view of an in-vehicle electronic control device according to a first embodiment
  • FIG. It is the perspective view which looked at the exploded perspective view shown in FIG. 2 from the up-down opposite side.
  • FIG. 2 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the first embodiment is assembled
  • FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the second embodiment is assembled;
  • FIG. 1 is an external perspective view showing an in-vehicle electronic control device according to a first embodiment
  • FIG. 1 is an exploded perspective view of an in-vehicle electronic control device according to a first embodiment
  • FIG. It is the perspective view which looked at the exploded perspective view shown in FIG. 2 from the up-down opposite side
  • FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the third embodiment is assembled;
  • FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the fourth embodiment is assembled;
  • FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the fifth embodiment is assembled;
  • FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the sixth embodiment is assembled;
  • FIG. 1 An embodiment of an in-vehicle electronic control device will be described below with reference to FIGS. 1 to 9.
  • FIG. the same code
  • Example 1 1-1 Configuration of In-Vehicle Electronic Control Device
  • this example the configuration of an in-vehicle electronic control device according to a first embodiment (hereinafter referred to as "this example") will be described with reference to FIGS. 1 to 4.
  • FIG. 1-1 the configuration of an in-vehicle electronic control device according to a first embodiment (hereinafter referred to as "this example") will be described with reference to FIGS. 1 to 4.
  • FIG. 1-1 Configuration of In-Vehicle Electronic Control Device
  • FIG. 1 is an external perspective view of an in-vehicle electronic control device 1.
  • FIG. 2 is an exploded perspective view of the in-vehicle electronic control unit 1
  • FIG. 3 is a perspective view of the exploded perspective view shown in FIG. 2 viewed from the opposite side.
  • 4 is a partial cross-sectional view showing the circuit board 4 and the heat radiation base 10 when the in-vehicle electronic control device 1 is assembled.
  • the in-vehicle electronic control unit 1 shown in FIG. 1 is an in-vehicle electronic control unit 1 that is installed in the interior of a vehicle and has an electronic circuit that controls the vehicle.
  • an in-vehicle electronic control device 1 includes an electronic component 2 such as a semiconductor device that generates heat, a connector 3, a circuit board 4, and a base 5 and a cover 6 that constitute a housing. ing.
  • the base 5 and cover 6 are made of metal.
  • the electronic component 2 and the connector 3 are mounted on the circuit board 4.
  • the connector 3 connects the electronic component 2 mounted on the circuit board 4 and an external device.
  • the connector 3 has a plurality of pin terminals.
  • the connector 3 is mounted on the circuit board 4 by connecting the pin terminals to the circuit board 4 by press-fitting or soldering.
  • the connector 3 is electrically connected to the circuit board 4 via pin terminals.
  • the electronic component 2 is electrically connected (mounted) to, for example, one side or both sides of the circuit board 4 using solder or the like.
  • the electronic component 2 of Example 1 is electrically connected to one surface of the circuit board 4 facing the cover 6 via an interposer 19 and solder bumps 18 .
  • the electronic components 2 may be mounted on both sides of the circuit board 4 .
  • the circuit board 4 is, for example, a general laminated wiring board made of thermosetting resin, glass cloth, and metal wiring on which a circuit pattern is formed, a wiring board made of ceramics and metal wiring, or a flexible board such as polyimide and metal wiring. A wiring board or the like made of is used. Screw holes are formed in the four corners of the circuit board 4 .
  • the circuit board 4 is fixed to a base 5 and a cover 6 to be described later with fixing screws 8 . Further, the detailed configuration of the portion of the circuit board 4 on which the electronic component 2 is mounted will be described later.
  • the base 5 is formed in a substantially flat plate shape.
  • a circuit board 4 is arranged on a base 5, and a plurality of heat dissipation pedestals 10 are formed.
  • the heat dissipation pedestal 10 protrudes from the base 5 toward the circuit board 4 .
  • the heat dissipation pedestal 10 is provided at a position facing the electronic component 2 mounted on the circuit board 4 via the circuit board 4 when the circuit board 4 is mounted on the base 5 .
  • a plurality of electronic components 2 may face one heat dissipation pedestal 10 .
  • the cover 6 is formed in a hollow, substantially rectangular shape with one side open. Screw holes are formed in the four corners of the end of the cover 6 where the opening is formed.
  • the cover 6 is installed on the base 5 so as to cover the circuit board 4 arranged on the base 5 . By fastening the fixing screws 8 to the screw holes of the base 5, the cover 6 and the circuit board 4, the circuit board 4, the base 5 and the cover 6 are integrally fixed.
  • the base 5 and the cover 6 are formed by, for example, casting, pressing, cutting, injection molding, or the like.
  • the base 5 and the cover 6 are made of, for example, a high thermal conductive resin that is a mixture of resin and filler.
  • the thermal conductivity of the high thermal conductive resin is preferably 2 to 30 W/(m ⁇ K).
  • the base 5 and the cover 6 are not limited to the high thermal conductive resin, and the base 5 and the cover 6 may be formed only from a resin or a metal material.
  • the resin forming the base 5 and the cover 6 it is preferable to use polybutylene terephthalate resin (PBT), polyphenylene sulfide resin (PPS), polyamide resin (PA6), or the like.
  • PBT polybutylene terephthalate resin
  • PPS polyphenylene sulfide resin
  • PA6 polyamide resin
  • glass fiber carbon fiber
  • alumina Al2O3
  • metal aluminum (Al) or an alloy containing aluminum as a main component is preferable.
  • a heat dissipating member 15 is filled between the electronic component 2 and the heat dissipating pedestal 10 at a portion of the circuit board 4 where the electronic component 2 is mounted, and a heat dissipating member 15 is filled between the circuit board 4 and the heat dissipating member 15 .
  • the heat dissipation member 15 thermally connects the heat dissipation base 10 and the circuit board 4 and bonds the circuit board 4 and the heat dissipation base 10 together.
  • the heat generated in the electronic component 2 by the heat radiation member 15 is radiated to the outside via the interposer 19, the solder bumps 18, and the circuit board 4, or radiated to the outside via the base 5.
  • a material having a function as an adhesive or grease (lubricant) and containing a high thermal conductive filler 21 in a sheet-like thermosetting silicone resin is used as the heat radiating member 15.
  • the presence of the air layer 22 prevents noise from the electronic component 2 and the circuit board 4 from being transmitted through the heat dissipation member 15, which is the TIM. It may be buried with a material having a low dielectric constant that prevents noise from the electronic component 2 and the circuit board 4 from being transmitted through the TIM.
  • Silicone resin is a synthetic polymer with a main skeleton made up of siloxane bonds (Si-O-Si). Silicone resin exhibits the properties of rubber and is often used as a base material for the heat radiating member 15 because it imparts less stress to electronic devices such as the electronic component 2 .
  • the filler 21 in Example 1 is boron nitride, which is a solid compound composed of nitrogen and boron.
  • Boron nitride includes hexagonal boron nitride (h-BN) and cubic boron nitride (c-BN), and has a scaly or spherical crystal structure.
  • hexagonal boron nitride is used, and when measured by an X-ray diffraction method, peaks of (100) and (002) planes are expressed, the (100) plane is in the thickness direction, and the (002) plane is The peak represents the longitudinal direction.
  • the thermal conductivity of boron nitride in the longitudinal direction is about 200 W/m ⁇ K, and in the thickness direction is about 2 W/m ⁇ K. sexuality arises. That is, the heat dissipation member 15 is an anisotropic heat conductive material. Boron nitride filler is excellent in thermal conductivity, heat resistance, corrosion resistance, electrical insulation, lubricity and releasability, and can be mixed with various resins. Further, since the boron nitride filler has a low relative dielectric constant of 3 to 4, the relative dielectric constant of the mixture with the resin can be lowered, and noise can be reduced.
  • the filler content in the silicone resin is preferably 20 vol % or more, and the content does not matter as long as it adheres to the electronic component 2 and the heat dissipation pedestal 10 .
  • adhesion specifically, a shear strength of 0.02 MPa or more is preferable, but when used as the in-vehicle electronic control device 1, the adhesion area should not be zero.
  • the heat dissipation base 10 is provided with a recess 10-a and a projection 10-b.
  • the filler 21 can be oriented so as to flow into the heat dissipation pedestal 10, and the projection 10-b is arranged on the extension of the orientation of the filler 21.
  • the orientation intensity of (100) around the heat radiation protrusion of the filler 21 is the same as that of the filler 21 located in the area including the center point of the application area of the heat radiation member 15 (more specifically, the projection area of the semiconductor chip 20). Orientation strength or more.
  • the orientation strength of the (100) orientation of the filler 21 made of boron nitride on the side of the electronic component 2 that is a heat-generating component in the central portion of the heat-dissipating member 15 is the same as that of the protrusion 10 that is a heat-dissipating protrusion of the heat-dissipating member 15. It is less than or equal to the orientation strength on the -b side.
  • the concave portion 10-a is on the side facing the semiconductor chip 20 when viewed from the electronic component 2, the concave portion 10-a may be provided on the semiconductor chip 20 side.
  • the height (the length in the direction of protrusion) of the protrusion 10-b is 0.1 or more to the thickness of the projection area of the semiconductor chip 20 of the heat dissipation member 15 (the distance between the semiconductor chip 20 and the heat dissipation base 10).
  • the length of the projecting portion 10-b, which is a heat-dissipating projection, in the projecting direction is 0.1 or more relative to the thickness of the heat-dissipating member 15). It shall protrude to the side.
  • the shape formed on the upper surface of the heat dissipation base 10 may be rectangular, circular, triangular, or the like from the information of the heat dissipation base 10.
  • the heat dissipation member 15 includes not only the projection area of the electronic component 2, but also a first projection area 15-a of the projection area of the electronic component 2 and a second area 15-b outside the projection area of the electronic component. It is assumed that the third region 15-c on which the heat dissipation member 15 on the heat dissipation base 10 is not applied is provided.
  • the heat radiating member 15 is applied to the first region of the heat radiating base 10 that overlaps the projection region of the electronic component 2, which is a heat generating component, and the second region that does not overlap the projection region of the electronic component 2. be.
  • the flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and smaller than the projected area of the electronic component 2.
  • the heat radiation pedestal 10 has a protrusion 10-b, which is a heat radiation protrusion, on the outer peripheral side of the second region.
  • the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
  • the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is substantially the same as or substantially equal to the vertical distance between the flat surface (first surface) and the circuit board 4. It is short (less than or equal to the vertical distance between the plane portion (first surface) and the circuit board 4) and shorter than the vertical distance between the bottom surface (second surface) and the circuit board 4.
  • the upper recessed portion 10-a of the heat dissipation material base 10 is formed, the orientation of the filler 21 is controlled, and the heat of the electronic component 2 is efficiently transferred to the heat dissipation base 10. can be transmitted.
  • FIG. 5 is a cross-sectional view showing the circuit board 4 and the heat dissipation pedestal 10 where the electronic component 2 is arranged in the vehicle-mounted electronic control device 1 according to the second embodiment.
  • symbol is attached
  • the concave portion 10-a is formed on the inclined surface of the heat radiation base 10 and has a V-shaped cross-section, and the protrusion is formed on the outside thereof. 10-b is provided.
  • the orientation of the filler 21 can be controlled, and the protrusion 10-b can function as a heat radiation portion of the controlled filler 21, thereby efficiently transmitting heat.
  • the flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and the projected area of the electronic component 2.
  • the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
  • the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is equal to the vertical distance between the flat surface (first surface) and the circuit board 4 and the bottom surface ( second surface) and the circuit board 4 in the vertical direction.
  • the concave portion 10-a in the second embodiment has a structure capable of controlling the orientation of the filler 21 as in the first embodiment, the shape formed on the upper surface of the heat dissipation base 10 can be determined from the information of the heat dissipation base 10. It doesn't matter if it's square, round, or triangular.
  • the semicircular chip 20 is also a heat-generating component.
  • FIG. 6 is a cross-sectional view showing the circuit board 4 and the heat radiation pedestal 10 where the electronic component 2 is arranged in the in-vehicle electronic control device 1 according to the third embodiment. Note that portions common to those of the in-vehicle electronic control device 1 according to the first and second embodiments are denoted by the same reference numerals, and overlapping descriptions are omitted.
  • the concave portion 10-a is formed on the inclined surface of the heat radiation base 10, has a V-shaped cross section, and has a protrusion on the outside thereof. 10-b is provided.
  • the orientation of the filler 21 can be controlled, and the protrusion 10-b can function as a heat radiation portion of the controlled filler 21, thereby efficiently transmitting heat.
  • the flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and smaller than the projected area of the electronic component 2.
  • the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
  • the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is equal to the vertical distance between the flat surface (first surface) and the circuit board 4 and the bottom surface ( second surface) and the circuit board 4 in the vertical direction.
  • the concave portion 10-a in the second embodiment has a structure capable of controlling the orientation of the filler 21 as in the first embodiment, the shape formed on the upper surface of the heat dissipation base 10 can be determined from the information of the heat dissipation base 10. It doesn't matter if it's square, round, or triangular.
  • the surface 10-c of the heat dissipation base 10 facing the heat dissipation member 15 is provided narrower than the projected area of the electronic component 2, and the heat dissipation member 15 is applied, the orientation of the filler 21 can be controlled.
  • Example 4 an in-vehicle electronic control device 1 according to a fourth embodiment will be described with reference to FIG.
  • FIG. 7 is a cross-sectional view showing the circuit board 4 and the heat radiation pedestal 10 where the electronic component 2 is arranged in the vehicle-mounted electronic control device 1 according to the fourth embodiment.
  • symbol is attached
  • the in-vehicle electronic control device 1 has a structure of the heat dissipation pedestal 10 that is not provided with the concave portion 10-a, and is provided with only the projection portion 10-b.
  • the plane portion (first surface) of the heat dissipation pedestal 10 is larger than the projection area of the semiconductor chip 20 and the electronic component 2 .
  • the vertical distance between the plane portion (first surface) of the concave portion 10-a of the heat radiating base 10 and the circuit board 4, which has the center point of the application area of the heat radiating member 15, is equal to the upper surface of the protrusion 10-b ( third surface) and the circuit board 4 in the vertical direction.
  • the filler 21 is oriented to efficiently dissipate heat to the protrusion 10-b, and heat can be efficiently transferred.
  • the corners of the heat radiating member 15 are shown as circles, but they may be square.
  • the flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and smaller than the projected area of the electronic component 2.
  • the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
  • the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is equal to the vertical distance between the flat surface (first surface) and the circuit board 4 and the bottom surface ( second surface) and the circuit board 4 in the vertical direction.
  • the heat dissipation pedestal 10 has a protrusion 10-b as a heat dissipation protrusion on the outer peripheral side of the first region of the heat dissipation pedestal 10 that overlaps the projection region of the electronic component 2, which is a heat-generating component. Since other configurations are the same as those of the in-vehicle electronic control device 1 according to the first and second embodiments, description thereof will be omitted.
  • the in-vehicle electronic control unit 1 having such a configuration can also provide the same effects as those of the in-vehicle electronic control units 1 according to the first and second embodiments described above.
  • Example 5 the in-vehicle electronic control device 1 according to the fifth embodiment will be described with reference to FIG.
  • the appearance and disassembled structure of the in-vehicle electronic device 1 are the same as those of the first embodiment shown in FIGS. 1 to 3, so illustration and detailed description are omitted.
  • FIG. 8 is a cross-sectional view showing a substrate and a heat dissipation pedestal 120 where electronic components are arranged in the in-vehicle electronic control device 1 according to the fourth embodiment.
  • symbol is attached
  • the second region 15-b of the heat dissipation member is sloped.
  • the orientation of the filler 21 can be controlled, and the protrusion 10-b can function as a heat radiation portion of the controlled filler 21, thereby efficiently transmitting heat.
  • in-vehicle electronic control unit 1 having such a configuration can also provide the same effects as those of the in-vehicle electronic control units 1 according to the first and second embodiments described above.
  • Example 6 an in-vehicle electronic control device 1 according to a sixth embodiment will be described with reference to FIG.
  • the appearance and disassembled structure of the in-vehicle electronic device 1 are the same as those of the first embodiment shown in FIGS. 1 to 3, so illustration and detailed description are omitted.
  • FIG. 9 is a cross-sectional view showing the circuit board 4 and the heat radiation pedestal 10 where the electronic component 2 is arranged in the vehicle-mounted electronic control device 1 according to the fifth embodiment. Parts common to the in-vehicle electronic control device 1 according to the first embodiment are denoted by the same reference numerals, and overlapping descriptions are omitted.
  • the in-vehicle electronic control device 1 according to the sixth embodiment has the structure of the in-vehicle electronic control device 1 according to the fifth embodiment, and further includes a recess 10-d formed in the heat radiation base 10. is.
  • the concave portion 10-d has a shape formed on the slope of the concave portion 10-a in the fifth embodiment.
  • in-vehicle electronic control unit 1 having such a configuration can also provide the same effects as those of the in-vehicle electronic control units 1 according to the first and second embodiments described above.
  • the electronic control device according to the present invention can be provided not only for in-vehicle use but also for other devices such as inverters and converters.
  • SYMBOLS 1 Vehicle-mounted electronic control apparatus, 2... Electronic components, 3... Connector, 4... Circuit board, 5... Base, 6... Cover, 8... Fixing screw, 10. ..heat radiation pedestal, 10-a, 10-d.. concave portion, 10-b.. projection portion, 10-c.. facing surface, 15.. heat radiation member, 15-a.. electronic First projected area of component 15-b... Second area outside projected area of electronic component 15-c... Third area where heat dissipation member is not applied 18... Solder bump , 19... interposer, 20... semiconductor chip, 21... filler, 22... air layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention provides an onboard electronic control device that can heighten the heat dissipation effect using a structure that reduces the amount of noise made by an electronic component and transmitted to a heat dissipation block, even when a heat dissipation member having anisotropic thermal conduction is applied. This electronic control device 1 comprises: a circuit board 4; a heat generating component 2 mounted on the circuit board 4; metallic housings 5, 6 that accommodate the circuit board 4; and a heat dissipation base 10 in which a heat dissipation member 15 is applied to the surfaces of the housings 5, 6 facing the heat generating component 2. A configuration is adopted such that the vertical distance between the circuit board 4 and a first surface, which is a flat part of the heat dissipation member 15 having the center point of the application region, is less than the vertical distance between the circuit board 4 and a second surface, which is the bottom surface of a recess 10-a formed further toward the outer peripheral side relative to the first surface.

Description

電子制御装置electronic controller
　本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
　自動車には、自動車を制御する電子部品を有する車載電子制御装置が配置されている。電子部品を放熱させるために、車載電子制御装置は、放熱ブロックと、放熱部材とを熱的に接続し、放熱する放熱構造を有している。 An on-board electronic control unit that has electronic components that control the vehicle is installed in the vehicle. In order to dissipate heat from the electronic components, the in-vehicle electronic control unit has a heat dissipating structure that thermally connects a heat dissipating block and a heat dissipating member to dissipate heat.
　しかしながら、近年では、車載電子制御装置の高機能化に伴い、搭載される電子部品の発熱量の増加の対策に加え、低ノイズ対策が必要となっている。発熱量の増加対策として、熱伝導フィラを多く含む放熱部材が適用されているが、主にはアルミナフィラのような高誘電率なフィラが使用されていて、放熱部材の高誘電率化を招いている。 However, in recent years, as the functionality of in-vehicle electronic control units has increased, it has become necessary to take measures to reduce noise in addition to measures to reduce the amount of heat generated by mounted electronic components. As a countermeasure against the increase in the amount of heat generated, heat dissipating materials containing a large amount of thermally conductive fillers are used. are there.
　そのため、放熱ブロックと放熱部材とを熱的に接続している放熱構造では、電子部品から出たノイズが放熱部材を介して放熱ブロックに伝わり、装置外にノイズが漏れる輻射ノイズが増大してしまう。輻射ノイズ対策としては、アルミナフィラに替わる高熱伝導低誘電率フィラとして窒化ホウ素を含む放熱部材が注目されているが、窒化ホウ素を含む放熱部材は、窒化ホウ素の鱗片形状に由来し、熱伝導に異方性があり、放熱ブロックと放熱部材とを層構造で熱的に接続している放熱構造では、放熱を十分に行うことができない。 Therefore, in a heat dissipation structure that thermally connects a heat dissipation block and a heat dissipation member, noise emitted from electronic components is transmitted to the heat dissipation block via the heat dissipation member, and the noise leaks outside the device, increasing radiation noise. . As a countermeasure against radiation noise, attention has been focused on heat-dissipating members containing boron nitride as a high-thermal-conductivity, low-dielectric-constant filler that can replace alumina filler. A heat dissipation structure that is anisotropic and thermally connects a heat dissipation block and a heat dissipation member in a layered structure cannot sufficiently dissipate heat.
　電子部品の放熱に関する技術としては、例えば、特許文献１に記載されているようなものがある。特許文献１には、樹脂で封止されている素子モジュールと、放熱ブロック、モジュールと放熱ブロックの間に放熱グリスを挟んでおり、放熱ブロックが凹構造となっている。凹構造となっている放熱ブロックの凹内全領域に放熱グリスを塗布することで、モジュールの放熱領域を増やしている技術が記載されている。 　Technologies related to the heat dissipation of electronic components include those described in Patent Document 1, for example. In Patent Document 1, an element module sealed with resin, a heat dissipation block, heat dissipation grease is sandwiched between the module and the heat dissipation block, and the heat dissipation block has a concave structure. A technique for increasing the heat radiation area of the module by applying heat radiation grease to the entire concave area of the heat radiation block having a concave structure is described.
特開２０２０－１２９６０１号公報Japanese Patent Application Laid-Open No. 2020-129601
　しかしながら、特許文献１に記載された技術では、素子モジュールと放熱ブロックが全面グリスで熱的に接続されており、高熱伝導低誘電率な窒化ホウ素フィラを熱伝導フィラとし、熱伝導に異方性がある場合でも放熱性は保たれるが、輻射ノイズの増大は避けられず、輻射ノイズ対策ができない放熱構造となっている。 However, in the technique described in Patent Document 1, the element module and the heat dissipation block are thermally connected with grease on the entire surface, and the boron nitride filler with high thermal conductivity and low dielectric constant is used as the thermal conductive filler, and the heat conduction is anisotropic. Although the heat dissipation is maintained even if there is, an increase in radiation noise cannot be avoided, and the heat dissipation structure cannot take measures against radiation noise.
　本発明の目的は、上記の問題点を考慮し、車載電子制御装置の構造として、電子部品のノイズが放熱ブロックに伝わる量を少なくする構造で、熱伝導に異方性がある放熱部材を適用しても、放熱効果を高めることができる車載電子制御装置を提供することにある。 In view of the above problems, the object of the present invention is to apply a heat dissipating member with anisotropic heat conduction in a structure that reduces the amount of noise transmitted from electronic parts to the heat dissipating block as a structure of an in-vehicle electronic control device. An object of the present invention is to provide an in-vehicle electronic control device capable of enhancing the heat radiation effect even if the temperature is reduced.
　本発明は、上記課題を解決し、目的を達成するため、次のように構成される。 In order to solve the above problems and achieve the purpose, the present invention is configured as follows.
　回路基板と、前記回路基板上に実装された発熱部品と、前記回路基板を収容する金属製のハウジングと、前記ハウジングの前記発熱部品との対向面に放熱部材が塗布される放熱台座と、を備える電子制御装置であって、前記放熱台座の、前記放熱部材の塗布領域の中心点を有する平面部である第一の面と前記回路基板との垂直方向の距離は、前記第一の面より外周側に形成される凹部の底面である第二の面と前記回路基板との垂直方向の距離より短い。 A circuit board, a heat-generating component mounted on the circuit board, a metal housing that accommodates the circuit board, and a heat-dissipating base having a heat-dissipating member applied to a surface of the housing facing the heat-generating component. In the electronic control device, the distance between the circuit board and the first surface of the heat radiation base, which is a planar portion having the center point of the coating area of the heat radiation member, is greater than the first surface. It is shorter than the vertical distance between the second surface, which is the bottom surface of the recess formed on the outer peripheral side, and the circuit board.
　本発明によれば、電子部品のノイズが放熱ブロックに伝わる量を少なくする構造で、熱伝導に異方性がある放熱部材を適用しても、放熱効果を高めることができる車載電子制御装置を提供することができる。 According to the present invention, there is provided an in-vehicle electronic control device that has a structure that reduces the amount of noise transmitted from electronic components to a heat dissipation block, and that can enhance the heat dissipation effect even if a heat dissipation member having anisotropic heat conduction is applied. can provide.
実施１にかかる車載電子制御装置を示す外観斜視図である。1 is an external perspective view showing an in-vehicle electronic control device according to a first embodiment; FIG. 実施１にかかる車載電子制御装置の分解斜視図である。1 is an exploded perspective view of an in-vehicle electronic control device according to a first embodiment; FIG. 図２に示した分解斜視図を上下反対側から見た斜視図である。It is the perspective view which looked at the exploded perspective view shown in FIG. 2 from the up-down opposite side. 実施例１にかかる車載電子制御装置が組み立てられた場合における、回路基板及び放熱台座を示す部分断面図である。FIG. 2 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the first embodiment is assembled; 実施例２にかかる車載電子制御装置が組み立てられた場合における、回路基板及び放熱台座を示す部分断面図である。FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the second embodiment is assembled; 実施例３にかかる車載電子制御装置が組み立てられた場合における、回路基板及び放熱台座を示す部分断面図である。FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the third embodiment is assembled; 実施例４にかかる車載電子制御装置が組み立てられた場合における、回路基板及び放熱台座を示す部分断面図である。FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the fourth embodiment is assembled; 実施例５にかかる車載電子制御装置が組み立てられた場合における、回路基板及び放熱台座を示す部分断面図である。FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the fifth embodiment is assembled; 実施例６にかかる車載電子制御装置が組み立てられた場合における、回路基板及び放熱台座を示す部分断面図である。FIG. 11 is a partial cross-sectional view showing a circuit board and a heat radiation pedestal when the in-vehicle electronic control device according to the sixth embodiment is assembled;
　以下、車載電子制御装置の実施の形態例について、図１～図９を参照して説明する。なお、各図において共通の部材には、同一の符号を付している。 An embodiment of an in-vehicle electronic control device will be described below with reference to FIGS. 1 to 9. FIG. In addition, the same code|symbol is attached|subjected to the member which is common in each figure.
　１．実施例１
　１－１．車載電子制御装置の構成
　まず、実施例１（以下、「本例」という。）にかかる車載電子制御装置の構成について図１から図４を参照して説明する。 1. Example 1
1-1. Configuration of In-Vehicle Electronic Control Device First, the configuration of an in-vehicle electronic control device according to a first embodiment (hereinafter referred to as "this example") will be described with reference to FIGS. 1 to 4. FIG.
　図１は、車載電子制御装置１の外観斜視図である。また、図２は、車載電子制御装置１の分解斜視図であり、図３は、図２に示した分解斜視図を上下反対側から見た斜視図である。また、図４は、車載電子制御装置１が組み立てられた場合における、回路基板４及び放熱台座１０を示す部分断面図である。 FIG. 1 is an external perspective view of an in-vehicle electronic control device 1. FIG. 2 is an exploded perspective view of the in-vehicle electronic control unit 1, and FIG. 3 is a perspective view of the exploded perspective view shown in FIG. 2 viewed from the opposite side. 4 is a partial cross-sectional view showing the circuit board 4 and the heat radiation base 10 when the in-vehicle electronic control device 1 is assembled.
　図１に示す車載電子制御装置１は、自動車の室内に設置され、自動車を制御する電子回路を有する車載電子制御装置１である。図２に示すように、車載電子制御装置１は、半導体素子等の発熱する電子部品２と、コネクタ３と、回路基板４と、筐体（ハウジング）を構成するベース５及びカバー６とを備えている。ベース５及びカバー６は金属製である。 The in-vehicle electronic control unit 1 shown in FIG. 1 is an in-vehicle electronic control unit 1 that is installed in the interior of a vehicle and has an electronic circuit that controls the vehicle. As shown in FIG. 2, an in-vehicle electronic control device 1 includes an electronic component 2 such as a semiconductor device that generates heat, a connector 3, a circuit board 4, and a base 5 and a cover 6 that constitute a housing. ing. The base 5 and cover 6 are made of metal.
　電子部品２及びコネクタ３は、回路基板４に搭載されている。コネクタ３は、回路基板４に搭載された電子部品２と外部の機器とを接続する。コネクタ３は、複数本のピン端子を有している。コネクタ３は、ピン端子を回路基板４に圧入やはんだ等により接続することで、回路基板４に搭載される。コネクタ３は、ピン端子を介して回路基板４と電気的に接続される。 The electronic component 2 and the connector 3 are mounted on the circuit board 4. The connector 3 connects the electronic component 2 mounted on the circuit board 4 and an external device. The connector 3 has a plurality of pin terminals. The connector 3 is mounted on the circuit board 4 by connecting the pin terminals to the circuit board 4 by press-fitting or soldering. The connector 3 is electrically connected to the circuit board 4 via pin terminals.
　電子部品２は、例えば、回路基板４の片面又は両面にはんだ等を用いて電気的に接続（実装）される。具体的には、実施例１の電子部品２は、インターポーザ１９を介し、はんだバンプ１８を介して回路基板４におけるカバー６と対向する一面に電気的に接続される。実施例１の車載電子制御装置１では、電子部品２は、回路基板４の両面に実装されていてもよいものである。 The electronic component 2 is electrically connected (mounted) to, for example, one side or both sides of the circuit board 4 using solder or the like. Specifically, the electronic component 2 of Example 1 is electrically connected to one surface of the circuit board 4 facing the cover 6 via an interposer 19 and solder bumps 18 . In the in-vehicle electronic control device 1 of Embodiment 1, the electronic components 2 may be mounted on both sides of the circuit board 4 .
　回路基板４は、例えば、熱硬化性樹脂及びガラスクロス、回路パターンが形成される金属配線からなる一般的な積層配線基板や、セラミクスと金属配線からなる配線基板、ポリイミドなどのフレキシブル基板と金属配線からなる配線基板等が用いられる。回路基板４の四隅には、ねじ孔が形成されている。そして、回路基板４は、固定ねじ８により後述するベース５及びカバー６に固定される。また、回路基板４における電子部品２が搭載された箇所の詳細な構成については、後述する。 The circuit board 4 is, for example, a general laminated wiring board made of thermosetting resin, glass cloth, and metal wiring on which a circuit pattern is formed, a wiring board made of ceramics and metal wiring, or a flexible board such as polyimide and metal wiring. A wiring board or the like made of is used. Screw holes are formed in the four corners of the circuit board 4 . The circuit board 4 is fixed to a base 5 and a cover 6 to be described later with fixing screws 8 . Further, the detailed configuration of the portion of the circuit board 4 on which the electronic component 2 is mounted will be described later.
　ベース５は、略平板状に形成されている。ベース５に回路基板４が配置され、複数の放熱台座１０が形成されている。放熱台座１０は、ベース５から回路基板４に向けて突出している。放熱台座１０は、回路基板４がベース５に載置された際に、回路基板４に搭載された電子部品２と、回路基板４を介して対向する位置に設けられている。また、一つの放熱台座１０に対して複数の電子部品２が対向してもよい。 The base 5 is formed in a substantially flat plate shape. A circuit board 4 is arranged on a base 5, and a plurality of heat dissipation pedestals 10 are formed. The heat dissipation pedestal 10 protrudes from the base 5 toward the circuit board 4 . The heat dissipation pedestal 10 is provided at a position facing the electronic component 2 mounted on the circuit board 4 via the circuit board 4 when the circuit board 4 is mounted on the base 5 . Also, a plurality of electronic components 2 may face one heat dissipation pedestal 10 .
　カバー６は、一面が開口した中空の略矩形状に形成されている。また、カバー６における開口が形成された端部の四隅には、ねじ孔が形成されている。カバー６は、ベース５に配置された回路基板４を覆うようにして、ベース５に設置される。そして、固定ねじ８をベース５、カバー６及び回路基板４のねじ孔に締結することで、回路基板４及びベース５、カバー６が一体に固定される。 The cover 6 is formed in a hollow, substantially rectangular shape with one side open. Screw holes are formed in the four corners of the end of the cover 6 where the opening is formed. The cover 6 is installed on the base 5 so as to cover the circuit board 4 arranged on the base 5 . By fastening the fixing screws 8 to the screw holes of the base 5, the cover 6 and the circuit board 4, the circuit board 4, the base 5 and the cover 6 are integrally fixed.
　なお、ベース５及びカバー６は、例えば、鋳造やプレス、切削加工、射出成形等により形成される。ベース５及びカバー６としては、例えば、樹脂と充填材（フィラ）とを混合する高熱伝導樹脂で形成される。高熱伝導樹脂の熱伝導率は、２～３０Ｗ／（ｍ・Ｋ）であることが好ましい。また、ベース５及びカバー６としては、高熱伝導樹脂に限定されるものではなく、樹脂や金属材料のみでベース５及びカバー６を形成してもよい。 Note that the base 5 and the cover 6 are formed by, for example, casting, pressing, cutting, injection molding, or the like. The base 5 and the cover 6 are made of, for example, a high thermal conductive resin that is a mixture of resin and filler. The thermal conductivity of the high thermal conductive resin is preferably 2 to 30 W/(m·K). Moreover, the base 5 and the cover 6 are not limited to the high thermal conductive resin, and the base 5 and the cover 6 may be formed only from a resin or a metal material.
　なお、ベース５及びカバー６を形成する樹脂としては、ポリブチレンテレフタレート樹脂（ＰＢＴ）や、ポリフェニレンサルファイド樹脂（ＰＰＳ）、ポリアミド樹脂（ＰＡ６）等を用いることが好ましい。また、充填材としては、ガラス繊維や炭素繊維、アルミナ（Ａｌ２Ｏ３）等のいずれかを用いることが好ましい。そして、金属としては、アルミニウム（Ａｌ）やアルミニウムを主成分とする合金が好ましい。 As the resin forming the base 5 and the cover 6, it is preferable to use polybutylene terephthalate resin (PBT), polyphenylene sulfide resin (PPS), polyamide resin (PA6), or the like. As the filler, it is preferable to use glass fiber, carbon fiber, alumina (Al2O3), or the like. As the metal, aluminum (Al) or an alloy containing aluminum as a main component is preferable.
　次に、図４を参照して回路基板４及びベース５における電子部品２が搭載される箇所の詳細な構成について説明する。 Next, with reference to FIG. 4, the detailed configuration of the portions of the circuit board 4 and the base 5 where the electronic component 2 is mounted will be described.
　図４に示すように、回路基板４における電子部品２が搭載される箇所には、電子部品２と放熱台座１０の間に、放熱部材１５が充填され、回路基板４と放熱部材１５の間には空気層２２が設けられている。そして、放熱部材１５は、放熱台座１０と回路基板４とを熱的に接続すると共に回路基板４と放熱台座１０を接着する。 As shown in FIG. 4 , a heat dissipating member 15 is filled between the electronic component 2 and the heat dissipating pedestal 10 at a portion of the circuit board 4 where the electronic component 2 is mounted, and a heat dissipating member 15 is filled between the circuit board 4 and the heat dissipating member 15 . is provided with an air layer 22 . The heat dissipation member 15 thermally connects the heat dissipation base 10 and the circuit board 4 and bonds the circuit board 4 and the heat dissipation base 10 together.
　放熱部材１５により電子部品２で発生する熱が、インターポーザ１９、はんだバンプ１８、回路基板４を介し外部に放熱される、または、ベース５を介して外部に放熱される。放熱部材１５としては、接着材やグリース（潤滑剤）としての機能を有し、かつシート状の熱硬化性のシリコーン樹脂に高熱伝導のフィラ２１を含有させた材料が用いられる。空気層２２の存在により、電子部品２や回路基板４のノイズがＴＩＭである放熱部材１５を介して伝達することを防いでいるが、空気でなく、回路基板４とＴＩＭとが誘電率の高い材料で埋没され、電子部品２や回路基板４のノイズがＴＩＭを介して伝達することを防ぐような低誘電率な材料で埋められていてもよいものとする。 The heat generated in the electronic component 2 by the heat radiation member 15 is radiated to the outside via the interposer 19, the solder bumps 18, and the circuit board 4, or radiated to the outside via the base 5. As the heat radiating member 15, a material having a function as an adhesive or grease (lubricant) and containing a high thermal conductive filler 21 in a sheet-like thermosetting silicone resin is used. The presence of the air layer 22 prevents noise from the electronic component 2 and the circuit board 4 from being transmitted through the heat dissipation member 15, which is the TIM. It may be buried with a material having a low dielectric constant that prevents noise from the electronic component 2 and the circuit board 4 from being transmitted through the TIM.
　シリコーン樹脂は、シロキサン結合（Ｓｉ－Ｏ－Ｓｉ）による主骨格を持つ、合成高分子である。シリコーン樹脂はゴムの性質を示し、電子部品２などの電子機器に与える応力が少ないため、放熱部材１５の母材としてよく使われている。 　Silicone resin is a synthetic polymer with a main skeleton made up of siloxane bonds (Si-O-Si). Silicone resin exhibits the properties of rubber and is often used as a base material for the heat radiating member 15 because it imparts less stress to electronic devices such as the electronic component 2 .
　実施例１におけるフィラ２１は窒化ホウ素であり、窒素とホウ素からなる固体の化合物である。窒化ホウ素には六方晶窒化ホウ素（ｈ－ＢＮ）と立法晶窒化ホウ素（ｃ－ＢＮ）があり、鱗片状や球状などの結晶構造を有する。主には、六法晶窒化ホウ素が用いられており、Ｘ線回折法で測定した際、（１００）と（００２）面のピークが発現し、（１００）面が厚み方向、（００２）面が長手方向を表すピークである。 The filler 21 in Example 1 is boron nitride, which is a solid compound composed of nitrogen and boron. Boron nitride includes hexagonal boron nitride (h-BN) and cubic boron nitride (c-BN), and has a scaly or spherical crystal structure. Mainly, hexagonal boron nitride is used, and when measured by an X-ray diffraction method, peaks of (100) and (002) planes are expressed, the (100) plane is in the thickness direction, and the (002) plane is The peak represents the longitudinal direction.
　尚、窒化ホウ素の長手方向の熱伝導率は約２００Ｗ／ｍ・Ｋであり、厚み方向は約２Ｗ／ｍ・Ｋであるため、窒化ホウ素を混合させた放熱部材１５には熱伝導に異方性が生じる。つまり、放熱部材１５異方性熱伝導材である。窒化ホウ素フィラは、熱伝導性、耐熱性、耐食性、電気絶縁性、潤滑・離型性に優れ、各種の樹脂と混合できる。また、窒化ホウ素フィラの比誘電率が３～４と低いため、樹脂との混合物の比誘電率を低くすることができ、低ノイズ化ができる。 The thermal conductivity of boron nitride in the longitudinal direction is about 200 W/m·K, and in the thickness direction is about 2 W/m·K. sexuality arises. That is, the heat dissipation member 15 is an anisotropic heat conductive material. Boron nitride filler is excellent in thermal conductivity, heat resistance, corrosion resistance, electrical insulation, lubricity and releasability, and can be mixed with various resins. Further, since the boron nitride filler has a low relative dielectric constant of 3 to 4, the relative dielectric constant of the mixture with the resin can be lowered, and noise can be reduced.
　シリコーン樹脂へのフィラ含有率は、２０ｖｏｌ％以上であることが好ましく、電子部品２や放熱台座１０と接着するものであれば、含有率は問わない。接着に関して、具体的には、せん断強度０．０２ＭＰａ以上が好ましいが、車載電子制御装置１として使用する上で、接着面積がゼロにならなければ良いものとする。 The filler content in the silicone resin is preferably 20 vol % or more, and the content does not matter as long as it adheres to the electronic component 2 and the heat dissipation pedestal 10 . Regarding adhesion, specifically, a shear strength of 0.02 MPa or more is preferable, but when used as the in-vehicle electronic control device 1, the adhesion area should not be zero.
　図４に示すように、放熱台座１０には、凹部１０－ａと突起部１０－ｂとが設けられている。凹部１０－ａを設けることで、フィラ２１が放熱台座１０に流れ込むように配向させることができ、フィラ２１の配向の延長線上に、突起部１０－ｂが配置される構造となる。このとき、フィラ２１の放熱突起部周辺の（１００）の配向強度は、放熱部材１５の塗布領域の中心点を含む領域（より具体的には半導体チップ２０の投影領域）に位置するフィラ２１の配向強度以上となっている。つまり、言い換えると、放熱部材１５の中央部であって発熱部品である電子部品２側の窒化ホウ素であるフィラ２１の（１００）の配向強度は放熱部材１５の、放熱突起部である突起部１０－ｂ側の配向強度以下である。 As shown in FIG. 4, the heat dissipation base 10 is provided with a recess 10-a and a projection 10-b. By providing the concave portion 10-a, the filler 21 can be oriented so as to flow into the heat dissipation pedestal 10, and the projection 10-b is arranged on the extension of the orientation of the filler 21. As shown in FIG. At this time, the orientation intensity of (100) around the heat radiation protrusion of the filler 21 is the same as that of the filler 21 located in the area including the center point of the application area of the heat radiation member 15 (more specifically, the projection area of the semiconductor chip 20). Orientation strength or more. In other words, in other words, the orientation strength of the (100) orientation of the filler 21 made of boron nitride on the side of the electronic component 2 that is a heat-generating component in the central portion of the heat-dissipating member 15 is the same as that of the protrusion 10 that is a heat-dissipating protrusion of the heat-dissipating member 15. It is less than or equal to the orientation strength on the -b side.
　尚、凹部１０－ａは電子部品２から見て、半導体チップ２０との対向側にあることが好ましいが、半導体チップ２０側に設けられていても良い。 Although it is preferable that the concave portion 10-a is on the side facing the semiconductor chip 20 when viewed from the electronic component 2, the concave portion 10-a may be provided on the semiconductor chip 20 side.
　突起部１０－ｂの高さ（突出方向の長さ）は、放熱部材１５の、半導体チップ２０の投影領域の厚さ（半導体チップ２０と放熱台座１０との間隔）比で０．１以上である（放熱突起部である突起部１０－ｂの突出方向の長さは、放熱部材１５の厚さ比０．１以上である）ことがより好ましいが、凹部１０－ａの底辺より回路基板４側に突出しているものとする。 The height (the length in the direction of protrusion) of the protrusion 10-b is 0.1 or more to the thickness of the projection area of the semiconductor chip 20 of the heat dissipation member 15 (the distance between the semiconductor chip 20 and the heat dissipation base 10). (The length of the projecting portion 10-b, which is a heat-dissipating projection, in the projecting direction is 0.1 or more relative to the thickness of the heat-dissipating member 15). It shall protrude to the side.
　凹部１０－ａは、上記のフィラ２１の配向を制御できる構造であれば、放熱台座１０の上面に形成される形状は、放熱台座１０の情報から見て、四角や丸、三角など問わないものとする。 As long as the concave portion 10-a has a structure capable of controlling the orientation of the filler 21, the shape formed on the upper surface of the heat dissipation base 10 may be rectangular, circular, triangular, or the like from the information of the heat dissipation base 10. and
　放熱部材１５には、電子部品２の投影領域のみならず、電子部品２の投影領域の第１の投影領域１５－ａと、電子部品の投影領域外の第２の領域１５－ｂの領域を持っていても良いものとし、放熱台座１０上の放熱部材１５が塗布されていない第３の領域１５－ｃを持っているものとする。 The heat dissipation member 15 includes not only the projection area of the electronic component 2, but also a first projection area 15-a of the projection area of the electronic component 2 and a second area 15-b outside the projection area of the electronic component. It is assumed that the third region 15-c on which the heat dissipation member 15 on the heat dissipation base 10 is not applied is provided.
　つまり、放熱部材１５は、放熱台座１０のうち、発熱部品である電子部品２の投影領域と重なる第一の領域上と、電子部品２の投影領域と重ならない第二の領域上とに塗布される。 That is, the heat radiating member 15 is applied to the first region of the heat radiating base 10 that overlaps the projection region of the electronic component 2, which is a heat generating component, and the second region that does not overlap the projection region of the electronic component 2. be.
　放熱台座１０の凹部１０－ａが形成されている部分の内側の平面部（第一の面）は、半導体チップ２０の投影領域より大きく、電子部品２の投影領域よりも小さい。 The flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and smaller than the projected area of the electronic component 2. FIG.
　放熱台座１０は、上記第二の領域の外周側に放熱突起部である突起部１０－ｂを備える。 The heat radiation pedestal 10 has a protrusion 10-b, which is a heat radiation protrusion, on the outer peripheral side of the second region.
　また、放熱部材１５の塗布領域の中心点を有する放熱台座１０の凹部１０－ａの内側の平面部（第一の面）と回路基板４との垂直方向の距離は、平面部（第一の面）より外周側に形成される凹部１０－ａの底面（第二の面）と回路基板４との垂直方向の距離より短い。 In addition, the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
　また、突起部１０－ｂの上面（第三の面）と回路基板４との垂直方向の距離は、上記平面部（第一の面）と回路基板４との垂直方向の距離と略同一又は短く（平面部（第一の面）と回路基板４との垂直方向の距離以下）、上記底面（第二の面）と回路基板４との垂直方向の距離よりも短い。 
　以上のように、本発明の実施例１によれば、放熱材台座１０の上面凹部１０－ａを形成し、フィラ２１の配向を制御して、電子部品２の熱が放熱台座１０に効率よく伝達することができる。 In addition, the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is substantially the same as or substantially equal to the vertical distance between the flat surface (first surface) and the circuit board 4. It is short (less than or equal to the vertical distance between the plane portion (first surface) and the circuit board 4) and shorter than the vertical distance between the bottom surface (second surface) and the circuit board 4.
As described above, according to the first embodiment of the present invention, the upper recessed portion 10-a of the heat dissipation material base 10 is formed, the orientation of the filler 21 is controlled, and the heat of the electronic component 2 is efficiently transferred to the heat dissipation base 10. can be transmitted.
　よって、電子部品のノイズが放熱ブロックに伝わる量を少なくする構造で、熱伝導に異方性がある放熱部材を適用しても、放熱効果を高めることができる車載電子制御装置を提供することができる。
２．実施例２
　次に、図５を参照して実施例２にかかる車載電子制御装置１について説明する。 Therefore, it is possible to provide an in-vehicle electronic control device that has a structure that reduces the amount of noise transmitted from electronic components to the heat dissipation block, and that can enhance the heat dissipation effect even if a heat dissipation member having anisotropic heat conduction is applied. can.
2. Example 2
Next, the in-vehicle electronic control device 1 according to the second embodiment will be described with reference to FIG.
　車載電子装置１の外観及び分解構造は、図１～図３に示した実施例１と同様となるので、図示及び詳細な説明は省略する。 
　図５は、実施例２にかかる車載電子制御装置１における電子部品２が配置された箇所の回路基板４及び放熱台座１０を示す断面図である。なお、実施例１にかかる車載電子制御装置１と共通する部分には、同一の符号を付して重複した説明を省略する。 The appearance and disassembled structure of the in-vehicle electronic device 1 are the same as those of the first embodiment shown in FIGS. 1 to 3, so illustration and detailed description are omitted.
FIG. 5 is a cross-sectional view showing the circuit board 4 and the heat dissipation pedestal 10 where the electronic component 2 is arranged in the vehicle-mounted electronic control device 1 according to the second embodiment. In addition, the same code|symbol is attached|subjected to the part which is common in the vehicle-mounted electronic control apparatus 1 concerning Example 1, and the overlapping description is abbreviate|omitted.
　図５に示すように、実施例２にかかる車載電子制御装置１では、凹部１０－ａが、放熱台座１０の斜面に形成され、断面形状がＶ字状となっており、その外側に突起部１０－ｂが設けられているものである。これにより、フィラ２１の配向を制御でき、制御したフィラ２１の放熱部として突起部１０－ｂが機能することができ、熱を効率よく伝達することができる。 As shown in FIG. 5, in the in-vehicle electronic control device 1 according to the second embodiment, the concave portion 10-a is formed on the inclined surface of the heat radiation base 10 and has a V-shaped cross-section, and the protrusion is formed on the outside thereof. 10-b is provided. As a result, the orientation of the filler 21 can be controlled, and the protrusion 10-b can function as a heat radiation portion of the controlled filler 21, thereby efficiently transmitting heat.
　放熱台座１０の凹部１０－ａが形成されている部分の内側の平面部（第一の面）は、半導体チップ２０の投影領域及び電子部品２の投影領域よりも大きい。 The flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and the projected area of the electronic component 2. FIG.
　また、放熱部材１５の塗布領域の中心点を有する放熱台座１０の凹部１０－ａの内側の平面部（第一の面）と回路基板４との垂直方向の距離は、平面部（第一の面）より外周側に形成される凹部１０－ａの底面（第二の面）と回路基板４との垂直方向の距離より短い。 In addition, the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
　また、突起部１０－ｂの上面（第三の面）と回路基板４との垂直方向の距離は、上記平面部（第一の面）と回路基板４との垂直方向の距離及び上記底面（第二の面）と回路基板４との垂直方向の距離よりも短い。 
　実施例２における凹部１０－ａも、実施例１と同様に、上記のフィラ２１の配向を制御できる構造であれば、放熱台座１０の上面に形成される形状は、放熱台座１０の情報から見て、四角や丸、三角など問わないものとする。 Further, the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is equal to the vertical distance between the flat surface (first surface) and the circuit board 4 and the bottom surface ( second surface) and the circuit board 4 in the vertical direction.
If the concave portion 10-a in the second embodiment has a structure capable of controlling the orientation of the filler 21 as in the first embodiment, the shape formed on the upper surface of the heat dissipation base 10 can be determined from the information of the heat dissipation base 10. It doesn't matter if it's square, round, or triangular.
　なお、半道体チップ２０も発熱部品である。 It should be noted that the semicircular chip 20 is also a heat-generating component.
　その他の構成は、実施例１にかかる車載電子制御装置１と同様であるため、それらの説明は省略する。このような構成を有する車載電子制御装置によっても、上述した実施例１にかかる車載電子制御装置１と同様の作用効果を得ることができる。 Other configurations are the same as those of the in-vehicle electronic control device 1 according to the first embodiment, so description thereof will be omitted. The in-vehicle electronic control device having such a configuration can also obtain the same effects as the in-vehicle electronic control device 1 according to the first embodiment described above.
　３．実施例３
　次に、図６を参照して実施例３にかかる車載電子制御装置１について説明する。　
　車載電子装置１の外観及び分解構造は、図１～図３に示した実施例１と同様となるので、図示及び詳細な説明は省略する。 
　図６は、実施例３にかかる車載電子制御装置１における電子部品２が配置された箇所の回路基板４及び放熱台座１０を示す断面図である。なお、実施例１及び実施例２にかかる車載電子制御装置１と共通する部分には、同一の符号を付して重複した説明を省略する。 3. Example 3
Next, the in-vehicle electronic control device 1 according to the third embodiment will be described with reference to FIG.
The appearance and disassembled structure of the in-vehicle electronic device 1 are the same as those of the first embodiment shown in FIGS. 1 to 3, so illustration and detailed description are omitted.
FIG. 6 is a cross-sectional view showing the circuit board 4 and the heat radiation pedestal 10 where the electronic component 2 is arranged in the in-vehicle electronic control device 1 according to the third embodiment. Note that portions common to those of the in-vehicle electronic control device 1 according to the first and second embodiments are denoted by the same reference numerals, and overlapping descriptions are omitted.
　図６に示すように、実施例３にかかる車載電子制御装置１では、凹部１０－ａが、放熱台座１０の斜面に形成され、断面形状がＶ字状となっており、その外側に突起部１０－ｂが設けられているものである。これにより、フィラ２１の配向を制御でき、制御したフィラ２１の放熱部として突起部１０－ｂが機能することができ、熱を効率よく伝達することができる。 As shown in FIG. 6, in the in-vehicle electronic control device 1 according to the third embodiment, the concave portion 10-a is formed on the inclined surface of the heat radiation base 10, has a V-shaped cross section, and has a protrusion on the outside thereof. 10-b is provided. As a result, the orientation of the filler 21 can be controlled, and the protrusion 10-b can function as a heat radiation portion of the controlled filler 21, thereby efficiently transmitting heat.
　放熱台座１０の凹部１０－ａが形成されている部分の内側の平面部（第一の面）は、半導体チップ２０の投影領域より大きく、電子部品２の投影領域よりも小さい。 The flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and smaller than the projected area of the electronic component 2. FIG.
　また、放熱部材１５の塗布領域の中心点を有する放熱台座１０の凹部１０－ａの内側の平面部（第一の面）と回路基板４との垂直方向の距離は、平面部（第一の面）より外周側に形成される凹部１０－ａの底面（第二の面）と回路基板４との垂直方向の距離より短い。 In addition, the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
　また、突起部１０－ｂの上面（第三の面）と回路基板４との垂直方向の距離は、上記平面部（第一の面）と回路基板４との垂直方向の距離及び上記底面（第二の面）と回路基板４との垂直方向の距離よりも短い。 
　実施例２における凹部１０－ａも、実施例１と同様に、上記のフィラ２１の配向を制御できる構造であれば、放熱台座１０の上面に形成される形状は、放熱台座１０の情報から見て、四角や丸、三角など問わないものとする。 Further, the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is equal to the vertical distance between the flat surface (first surface) and the circuit board 4 and the bottom surface ( second surface) and the circuit board 4 in the vertical direction.
If the concave portion 10-a in the second embodiment has a structure capable of controlling the orientation of the filler 21 as in the first embodiment, the shape formed on the upper surface of the heat dissipation base 10 can be determined from the information of the heat dissipation base 10. It doesn't matter if it's square, round, or triangular.
　図６に示すように、実施例３にかかる車載電子制御装置１では、放熱台座１０の放熱部材１５と対向する面１０－ｃが電子部品２の投影領域より狭く設けられており、放熱部材１５を塗布した際に、フィラ２１の配向を制御できるものである。 As shown in FIG. 6, in the in-vehicle electronic control device 1 according to the third embodiment, the surface 10-c of the heat dissipation base 10 facing the heat dissipation member 15 is provided narrower than the projected area of the electronic component 2, and the heat dissipation member 15 is applied, the orientation of the filler 21 can be controlled.
　その他の構成は、実施例１及び実施例２にかかる車載電子制御装置１と同様であるため、それらの説明は省略する。このような構成を有する車載電子制御装置によっても、上述した実施例１及び実施例２にかかる車載電子制御装置１と同様の作用効果を得ることができる。 Other configurations are the same as those of the in-vehicle electronic control device 1 according to the first and second embodiments, so description thereof will be omitted. The in-vehicle electronic control device having such a configuration can also obtain the same effects as those of the in-vehicle electronic control device 1 according to the first and second embodiments described above.
　４．実施例４
　次に、図７を参照して実施例４にかかる車載電子制御装置１について説明する。 4. Example 4
Next, an in-vehicle electronic control device 1 according to a fourth embodiment will be described with reference to FIG.
　車載電子装置１の外観及び分解構造は、図１～図３に示した実施例１と同様となるので、図示及び詳細な説明は省略する。 
　図７は、実施例４にかかる車載電子制御装置１における電子部品２が配置された箇所の回路基板４及び放熱台座１０を示す断面図である。なお、実施例１にかかる車載電子制御装置１と共通する部分には、同一の符号を付して重複した説明を省略する。 The appearance and disassembled structure of the in-vehicle electronic device 1 are the same as those of the first embodiment shown in FIGS. 1 to 3, so illustration and detailed description are omitted.
FIG. 7 is a cross-sectional view showing the circuit board 4 and the heat radiation pedestal 10 where the electronic component 2 is arranged in the vehicle-mounted electronic control device 1 according to the fourth embodiment. In addition, the same code|symbol is attached|subjected to the part which is common in the vehicle-mounted electronic control apparatus 1 concerning Example 1, and the overlapping description is abbreviate|omitted.
　図７に示すように、実施例４にかかる車載電子制御装置１では、凹部１０－ａが設けられていない放熱台座１０の構造であり、突起部１０－ｂのみ設けられている構造である。 As shown in FIG. 7, the in-vehicle electronic control device 1 according to the fourth embodiment has a structure of the heat dissipation pedestal 10 that is not provided with the concave portion 10-a, and is provided with only the projection portion 10-b.
　放熱台座１０の平面部（第一の面）は、半導体チップ２０及び電子部品２の投影領域よりも大きい。 The plane portion (first surface) of the heat dissipation pedestal 10 is larger than the projection area of the semiconductor chip 20 and the electronic component 2 .
　また、放熱部材１５の塗布領域の中心点を有する放熱台座１０の凹部１０－ａの平面部（第一の面）と回路基板４との垂直方向の距離は、突起部１０－ｂの上面（第三の面）と回路基板４との垂直方向の距離より大きい。 In addition, the vertical distance between the plane portion (first surface) of the concave portion 10-a of the heat radiating base 10 and the circuit board 4, which has the center point of the application area of the heat radiating member 15, is equal to the upper surface of the protrusion 10-b ( third surface) and the circuit board 4 in the vertical direction.
　これにより、第４の実施の形態例にかかる車載電子制御装置では、突起部１０－ｂに効率的に放熱できるフィラ２１の配向となり、熱を効率よく伝達することができる。 As a result, in the in-vehicle electronic control device according to the fourth embodiment, the filler 21 is oriented to efficiently dissipate heat to the protrusion 10-b, and heat can be efficiently transferred.
　図７において、放熱部材１５の角は丸で示されているが、四角でも構わないものとする。 In FIG. 7, the corners of the heat radiating member 15 are shown as circles, but they may be square.
　放熱台座１０の凹部１０－ａが形成されている部分の内側の平面部（第一の面）は、半導体チップ２０の投影領域より大きく、電子部品２の投影領域よりも小さい。 The flat portion (first surface) inside the portion of the heat sink 10 where the concave portion 10-a is formed is larger than the projected area of the semiconductor chip 20 and smaller than the projected area of the electronic component 2. FIG.
　また、放熱部材１５の塗布領域の中心点を有する放熱台座１０の凹部１０－ａの内側の平面部（第一の面）と回路基板４との垂直方向の距離は、平面部（第一の面）より外周側に形成される凹部１０－ａの底面（第二の面）と回路基板４との垂直方向の距離より短い。 In addition, the vertical distance between the circuit board 4 and the flat portion (first surface) inside the concave portion 10-a of the heat radiating base 10, which has the center point of the application area of the heat radiating member 15, is (second surface) of the recess 10-a formed on the outer peripheral side of the surface) and the circuit board 4 in the vertical direction.
　また、突起部１０－ｂの上面（第三の面）と回路基板４との垂直方向の距離は、上記平面部（第一の面）と回路基板４との垂直方向の距離及び上記底面（第二の面）と回路基板４との垂直方向の距離よりも短い。 Further, the vertical distance between the upper surface (third surface) of the protrusion 10-b and the circuit board 4 is equal to the vertical distance between the flat surface (first surface) and the circuit board 4 and the bottom surface ( second surface) and the circuit board 4 in the vertical direction.
　放熱台座１０は、放熱台座１０のうち、発熱部品である電子部品２の投影領域と重なる第一の領域の外周側に放熱突起部である突起部１０－ｂを備える。
 その他の構成は、実施例１及び実施例２にかかる車載電子制御装置１と同様であるため、それらの説明は省略する。このような構成を有する車載電子制御装置１によっても、上述した実施例１及び実施例２にかかる車載電子制御装置１と同様の作用効果を得ることができる。 The heat dissipation pedestal 10 has a protrusion 10-b as a heat dissipation protrusion on the outer peripheral side of the first region of the heat dissipation pedestal 10 that overlaps the projection region of the electronic component 2, which is a heat-generating component.
Since other configurations are the same as those of the in-vehicle electronic control device 1 according to the first and second embodiments, description thereof will be omitted. The in-vehicle electronic control unit 1 having such a configuration can also provide the same effects as those of the in-vehicle electronic control units 1 according to the first and second embodiments described above.
　５．実施例５
　次に、図８を参照して実施例５にかかる車載電子制御装置１について説明する。 5. Example 5
Next, the in-vehicle electronic control device 1 according to the fifth embodiment will be described with reference to FIG.
　車載電子装置１の外観及び分解構造は、図１～図３に示した実施例１と同様となるので、図示及び詳細な説明は省略する。 The appearance and disassembled structure of the in-vehicle electronic device 1 are the same as those of the first embodiment shown in FIGS. 1 to 3, so illustration and detailed description are omitted.
　図８は、実施例４にかかる車載電子制御装置１における電子部品が配置された箇所の基板及び放熱台座１２０を示す断面図である。なお、実施例１にかかる車載電子制御装置１と共通する部分には、同一符号を付して重複した説明を省略する。 FIG. 8 is a cross-sectional view showing a substrate and a heat dissipation pedestal 120 where electronic components are arranged in the in-vehicle electronic control device 1 according to the fourth embodiment. In addition, the same code|symbol is attached|subjected to the part which is common in the vehicle-mounted electronic control apparatus 1 concerning Example 1, and the overlapping description is abbreviate|omitted.
　図８に示すように、実施例５にかかる車載電子制御装置１は、放熱部材の第２の領域１５－ｂが斜面になっているものである。これにより、フィラ２１の配向を制御でき、制御したフィラ２１の放熱部として突起部１０－ｂが機能することができ、熱を効率よく伝達することができる。 As shown in FIG. 8, in the vehicle-mounted electronic control device 1 according to the fifth embodiment, the second region 15-b of the heat dissipation member is sloped. As a result, the orientation of the filler 21 can be controlled, and the protrusion 10-b can function as a heat radiation portion of the controlled filler 21, thereby efficiently transmitting heat.
　他の構成は、図６に示した実施例３と同様な構成となっている。 Other configurations are similar to those of the third embodiment shown in FIG.
　さらにその他の構成は、実施例１にかかる車載電子制御装置１と同様であるため、それらの説明は省略する。このような構成を有する車載電子制御装置１によっても、上述した実施例１及び実施例２にかかる車載電子制御装置１と同様の作用効果を得ることができる。 Further, other configurations are the same as those of the in-vehicle electronic control device 1 according to the first embodiment, so description thereof will be omitted. The in-vehicle electronic control unit 1 having such a configuration can also provide the same effects as those of the in-vehicle electronic control units 1 according to the first and second embodiments described above.
　６．実施例６
　次に、図９を参照して実施例６にかかる車載電子制御装置１について説明する。 6. Example 6
Next, an in-vehicle electronic control device 1 according to a sixth embodiment will be described with reference to FIG.
　車載電子装置１の外観及び分解構造は、図１～図３に示した実施例１と同様となるので、図示及び詳細な説明は省略する。 The appearance and disassembled structure of the in-vehicle electronic device 1 are the same as those of the first embodiment shown in FIGS. 1 to 3, so illustration and detailed description are omitted.
　図９は、実施例５にかかる車載電子制御装置１における電子部品２が配置された箇所の回路基板４及び放熱台座１０を示す断面図である。なお、実施例１にかかる車載電子制御装置１と共通する部分には、一の符号を付して重複した説明を省略する。 FIG. 9 is a cross-sectional view showing the circuit board 4 and the heat radiation pedestal 10 where the electronic component 2 is arranged in the vehicle-mounted electronic control device 1 according to the fifth embodiment. Parts common to the in-vehicle electronic control device 1 according to the first embodiment are denoted by the same reference numerals, and overlapping descriptions are omitted.
　図９に示すように、実施例６にかかる車載電子制御装置１は、実施例５にかかる車載電子制御装置１の構造に加え、放熱台座１０に凹部１０－ｄが、さらに形成されているものである。凹部１０－ｄは、実施例５における凹部１０－ａの斜面に形成された形状となっている。凹部１０－ａで、配向制御したフィラ２１を、凹部１０－ｄで、さらに配向を制御することで、放熱台座１０へ熱を効率よく伝達することができる。 As shown in FIG. 9, the in-vehicle electronic control device 1 according to the sixth embodiment has the structure of the in-vehicle electronic control device 1 according to the fifth embodiment, and further includes a recess 10-d formed in the heat radiation base 10. is. The concave portion 10-d has a shape formed on the slope of the concave portion 10-a in the fifth embodiment. By controlling the alignment of the filler 21 with the concave portion 10-a and the orientation of the filler 21 with the concave portion 10-d, heat can be efficiently transferred to the heat radiating base 10. FIG.
　他の構成は、図８に示した実施例５と同様な構成となっている。 Other configurations are similar to those of the fifth embodiment shown in FIG.
　さらにその他の構成は、実施例１にかかる車載電子制御装置１と同様であるため、それらの説明は省略する。このような構成を有する車載電子制御装置１によっても、上述した実施例１及び実施例２にかかる車載電子制御装置１と同様の作用効果を得ることができる。 Further, other configurations are the same as those of the in-vehicle electronic control device 1 according to the first embodiment, so description thereof will be omitted. The in-vehicle electronic control unit 1 having such a configuration can also provide the same effects as those of the in-vehicle electronic control units 1 according to the first and second embodiments described above.
　なお、上述した実施例１～６において、フィラ２１は、窒化ホウ素のみならず、高熱伝導低誘電率のシリカやＳｉＯ２も適用することができる。 In Examples 1 to 6 described above, not only boron nitride but also silica or SiO2 with high thermal conductivity and low dielectric constant can be applied to the filler 21 .
　また、本発明による電子制御装置は、車載用のみならず、インバータやコンバータ等のその他の機器に提供可能である。 Also, the electronic control device according to the present invention can be provided not only for in-vehicle use but also for other devices such as inverters and converters.
　１・・・車載電子制御装置、２・・・電子部品、３・・・コネクタ、４・・・回路基板、５・・・ベース、６・・・カバー、８・・・固定ねじ、１０・・・放熱台座、１０－ａ、１０－ｄ・・・凹部、１０－ｂ・・・突起部、１０－ｃ・・・対向する面、１５・・・放熱部材、１５－ａ・・・電子部品の第１の投影領域、１５－ｂ・・・電子部品の投影領域外の第２の領域、１５－ｃ・・・放熱部材が塗布されていない第３の領域、１８・・・はんだバンプ、１９・・・インターポーザ、２０・・・半導体チップ、２１・・・フィラ、２２・・・空気層 DESCRIPTION OF SYMBOLS 1... Vehicle-mounted electronic control apparatus, 2... Electronic components, 3... Connector, 4... Circuit board, 5... Base, 6... Cover, 8... Fixing screw, 10. ..heat radiation pedestal, 10-a, 10-d.. concave portion, 10-b.. projection portion, 10-c.. facing surface, 15.. heat radiation member, 15-a.. electronic First projected area of component 15-b... Second area outside projected area of electronic component 15-c... Third area where heat dissipation member is not applied 18... Solder bump , 19... interposer, 20... semiconductor chip, 21... filler, 22... air layer

Claims (12)

  1. 　回路基板と、
    　前記回路基板上に実装された発熱部品と、
    　前記回路基板を収容する金属製のハウジングと、
    　前記ハウジングの前記発熱部品との対向面に放熱部材が塗布される放熱台座と、を備える電子制御装置であって、
    　前記放熱台座の
    　前記放熱部材の塗布領域の中心点を有する平面部である第一の面と前記回路基板との垂直方向の距離は、前記第一の面より外周側に形成される凹部の底面である第二の面と前記回路基板との垂直方向の距離より短いことを特徴とする電子制御装置。     a circuit board;
    a heat-generating component mounted on the circuit board;
    a metal housing that accommodates the circuit board;
    a heat dissipating base on which a heat dissipating member is applied to a surface of the housing facing the heat generating component, the electronic control device comprising:
    The vertical distance between the circuit board and the first surface of the heat radiation pedestal, which is a plane portion having the center point of the application area of the heat radiation member, is the bottom surface of a recess formed on the outer peripheral side of the first surface. is shorter than the vertical distance between the second surface and the circuit board.
  2. 　請求項１に記載の電子制御装置であって、
    　前記放熱台座は、前記第二の面よりも外周側に形成される突起部を有し、前記突起部の上面である第三の面と前記回路基板との垂直方向の距離は、前記第一の面及び前記第二の面と前記回路基板との垂直方向の距離以下であることを特徴とする電子制御装置。     The electronic control device according to claim 1,
    The heat dissipation pedestal has a projection formed on the outer peripheral side of the second surface, and the vertical distance between the third surface, which is the upper surface of the projection, and the circuit board is equal to the first surface. and a vertical distance between the second surface and the circuit board.
  3. 　請求項２に記載の電子制御装置であって、
    　前記放熱部材は高熱伝導低誘電率のフィラを含有することを特徴とする電子制御装置。     The electronic control device according to claim 2,
    The electronic control device, wherein the heat dissipating member contains a filler having a high thermal conductivity and a low dielectric constant.
  4. 　請求項３に記載の電子制御装置であって、
    　前記放熱部材は異方性熱伝導材であることを特徴とする電子制御装置。     The electronic control device according to claim 3,
    The electronic control device, wherein the heat radiating member is an anisotropic heat conductive material.
  5. 　請求項４に記載の電子制御装置であって、
    　前記放熱部に含有される前記フィラは鱗片状の結晶構造を有することを特徴とする電子制御装置。     The electronic control device according to claim 4,
    The electronic control device, wherein the filler contained in the heat radiation part has a scale-like crystal structure.
  6. 　請求項５に記載の電子制御装置であって、
    　前記放熱部材に含まれる前記フィラは窒化ホウ素であることを特徴とする電子制御装置。     The electronic control device according to claim 5,
    The electronic control device, wherein the filler contained in the heat radiating member is boron nitride.
  7. 　請求項６に記載の電子制御装置であって、
    　前記放熱部材は、前記放熱台座のうち、
    　前記発熱部品の投影領域と重なる第一の領域上と、
    　前記発熱部品の投影領域と重ならない第二の領域上とに塗布されること
    を特徴とする電子制御装置。     The electronic control device according to claim 6,
    The heat radiating member, of the heat radiating base,
    on a first area that overlaps the projected area of the heat-generating component;
    An electronic control device, wherein the second area which does not overlap with the projection area of the heat-generating component is coated.
  8. 　請求項７に記載の電子制御装置であって、
    　前記放熱台座は、前記第一の領域の外周側に放熱突起部を備えることを特徴とする電子制御装置。     The electronic control device according to claim 7,
    The electronic control device, wherein the heat radiation pedestal has a heat radiation protrusion on the outer peripheral side of the first area.
  9. 　請求項７に記載の電子制御装置であって、
    　前記放熱台座は、前記第二の領域の外周側に放熱突起部を備えることを特徴とする電子制御装置。     The electronic control device according to claim 7,
    The electronic control device, wherein the heat radiation pedestal has a heat radiation protrusion on the outer peripheral side of the second region.
  10. 　請求項８または９に記載の電子制御装置であって、
    　前記放熱部材の中央部であって前記発熱部品側の前記フィラの（１００）の配向強度は、前記放熱部材の、前記放熱突起部側の配向強度以下であることを特徴とする電子制御装置。     The electronic control device according to claim 8 or 9,
    The electronic control device according to claim 1, wherein the orientation strength of the filler (100) on the side of the heat-generating component in the central portion of the heat-dissipating member is equal to or less than the orientation strength on the side of the heat-dissipating protrusion of the heat-dissipating member.
  11. 　請求項８または９に記載の電子制御装置であって、
    　前記放熱突起部の突出方向の長さは、前記放熱部材の厚さ比で０．１以上であることを特徴とする電子制御装置。     The electronic control device according to claim 8 or 9,
    The electronic control device, wherein the length of the heat-dissipating protrusion in the projecting direction is 0.1 or more in relation to the thickness of the heat-dissipating member.
  12. 　請求項７に記載の電子制御装置であって、
    　前記第二の領域と前記回路基板との間には空気層が形成されることを特徴とする電子制御装置。     The electronic control device according to claim 7,
    An electronic control device, wherein an air layer is formed between the second region and the circuit board.
PCT/JP2022/004945 2021-08-19 2022-02-08 Electronic control device WO2023021728A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021133945A JP2023028314A (en) 2021-08-19 2021-08-19 Electronic control device
JP2021-133945 2021-08-19

Publications (1)

Publication Number Publication Date
WO2023021728A1 true WO2023021728A1 (en) 2023-02-23

Family

ID=85240409

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/004945 WO2023021728A1 (en) 2021-08-19 2022-02-08 Electronic control device

Country Status (2)

Country Link
JP (1) JP2023028314A (en)
WO (1) WO2023021728A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017162860A (en) * 2016-03-07 2017-09-14 日立オートモティブシステムズ株式会社 Electronic control device
JP2018182162A (en) * 2017-04-18 2018-11-15 株式会社デンソーテン Heat radiation structure
JP2019102738A (en) * 2017-12-06 2019-06-24 株式会社デンソーウェーブ Heat dissipation structure of electronic component
JP2020074430A (en) * 2018-06-22 2020-05-14 積水ポリマテック株式会社 Thermally conductive sheet
JP2021005581A (en) * 2019-06-25 2021-01-14 日立オートモティブシステムズ株式会社 Electronic control device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017162860A (en) * 2016-03-07 2017-09-14 日立オートモティブシステムズ株式会社 Electronic control device
JP2018182162A (en) * 2017-04-18 2018-11-15 株式会社デンソーテン Heat radiation structure
JP2019102738A (en) * 2017-12-06 2019-06-24 株式会社デンソーウェーブ Heat dissipation structure of electronic component
JP2020074430A (en) * 2018-06-22 2020-05-14 積水ポリマテック株式会社 Thermally conductive sheet
JP2021005581A (en) * 2019-06-25 2021-01-14 日立オートモティブシステムズ株式会社 Electronic control device

Also Published As

Publication number Publication date
JP2023028314A (en) 2023-03-03

Similar Documents

Publication Publication Date Title
KR100208039B1 (en) Integrated circuit package with heat dissipation for high current load
TWI244740B (en) Electronic module heat sink mounting arrangement
US5926371A (en) Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device
US20090103267A1 (en) Electronic assembly and method for making the electronic assembly
JP6141064B2 (en) Connection method of circuit board and housing
US20070268671A1 (en) Heat sink electronic package having compliant pedestal
WO2016098332A1 (en) Electronic device
JP2004166413A (en) Case structure of onboard electronic apparatus
JPWO2019146402A1 (en) Power converter and manufacturing method of power converter
CN105742268B (en) Circuit board and semiconductor packages comprising circuit board
WO2019116828A1 (en) Electronic control device
US11778729B2 (en) Electronic control device
WO2023021728A1 (en) Electronic control device
US20100102431A1 (en) Power module and inverter for vehicles
JP2004104115A (en) Power module and its manufacturing method
JP2012076421A (en) Bonded object
JP2019125730A (en) Semiconductor device
JP3903745B2 (en) In-vehicle discharge lamp lighting device
WO2021111895A1 (en) On-vehicle electronic control device
EP3002795B1 (en) Lighting system for a vehicle
WO2023021727A1 (en) Vehicle-mounted electronic control device
JP2009135372A (en) Circuit module and method of manufacturing the same
WO2021245983A1 (en) Vehicle-mounted electronic control device
WO2024004324A1 (en) Electronic control device
WO2023067982A1 (en) Heat dissipation material and electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22858053

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22858053

Country of ref document: EP

Kind code of ref document: A1