JP2018182162A - Heat radiation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology that enables improvement in reliability of heat radiation for an electronic component.SOLUTION: A heat radiation structure 1 includes: an electronic substrate 2; an electronic component 3 mounted on the electronic substrate 2; a cover member 4 being a heat radiation member which emits heat generated by the electronic component 3; and heat conductor members 6 which are provided between the electronic component 3 and the cover member 4 while contacting with each of the electronic component 3 and the cover member 4 and conduct heat generated by the electronic component 3 to the cover member 4. Further, in the heat radiation structure 1, at least one of the electronic substrate 2, the electronic component 3, and the cover member 4 has a moving prevention part 11 which prevents the heat transmission members 6 from falling from a space S between the electronic component 3 and the cover member 4.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a heat dissipation structure of an electronic component.

  Electronic devices generally have an electronic substrate on which electronic components are mounted inside a casing that covers the periphery. Furthermore, some electronic components require heat dissipation, and for example, a heat dissipation structure using a heat sink or the like may be provided in the electronic device. An example of the prior art of the heat dissipation structure of such an electronic component is disclosed by patent document 1. FIG.

  The conventional on-vehicle electronic device described in Patent Document 1 has a housing, a circuit board on which the electronic component is mounted, and a pedestal protruding from the inner surface of the housing toward one surface of the circuit board corresponding to the mounting position of the electronic component. And a heat conducting member provided to be in contact with each of the pedestal and the circuit board. Thereby, the heat generated by the electronic component can be released to the housing through the circuit board, the heat conducting member and the pedestal portion.

JP, 2017-41602, A

  However, in the prior art described in Patent Document 1, the heat conduction member drops out from between the circuit board and the pedestal portion due to the installation state and vibration of the on-vehicle electronic device, acceleration and deceleration of the vehicle, and expansion and contraction due to temperature and humidity environmental load. It was an issue that there was a risk. As a result, there is a concern that the heat radiation path to the electronic component can not be maintained.

  This invention is made in view of said subject, and it aims at providing the technique which can improve the reliability of the thermal radiation with respect to an electronic component.

  A heat dissipation structure according to the present invention is a heat dissipation structure of an electronic component, and includes an electronic substrate, an electronic component mounted on the electronic substrate, a heat dissipation member for releasing heat generated by the electronic component, the electronic component, and And a heat transfer member provided in contact with the heat release member to transfer heat generated by the electronic component to the heat release member, at least one of the electronic substrate, the electronic component, and the heat release member being A configuration (first configuration) including a movement blocking portion that prevents the heat transfer member from falling out of the space between the electronic component and the heat dissipation member.

  Further, in the heat dissipation structure of the first configuration, the movement preventing portion is a configuration (second configuration) configured of a convex portion protruding from at least one of the electronic substrate or the heat dissipation member toward the other. It is good.

  In the heat dissipation structure of the second configuration, the convex portion may be a rib (third configuration) which is a rib provided at an outer edge portion of the space in a direction in which the space extends.

  Further, in the heat dissipation structure of the second configuration, the protrusion has a configuration (fourth configuration) in which the protrusion length becomes longer toward the outer edge portion of the heat transfer member in the direction in which the space extends. Also good.

  Further, in the heat dissipation structure of the fourth configuration, the convex portion may have a configuration (fifth configuration) in which a contact portion with the heat transfer member is a conical circumferential surface.

  In the heat dissipation structure of the fourth configuration, the convex portion may have a dome-shaped contact portion with the heat transfer member (sixth configuration).

  Further, in the heat dissipation structure of the fourth to sixth configurations, a configuration in which a predetermined distance is predetermined between the electronic component and the heat dissipation member at the outer edge portion of the heat transfer member in the direction in which the space extends It may be the seventh configuration).

  Further, in the heat dissipation structure of the second to seventh configurations, the convex portion is provided to surround the entire periphery of either the outer edge portion of the heat transfer member or the outer edge portion of the space in the direction in which the space extends. It may be a configuration (eighth configuration).

  Further, in the heat dissipation structure of the first to eighth configurations, the heat dissipation member has a non-slip portion which suppresses movement of the heat transfer member on a contact surface with the heat transfer member (ninth configuration) It may be

  Further, in the heat dissipation structure of the first configuration, the movement preventing portion is provided on at least one of the electronic component or the heat dissipation member, and is recessed on one surface facing the heat transfer member and accommodates the heat transfer member. The configuration (tenth configuration) configured by the recess may be employed.

  Further, in the heat dissipation structure of the tenth configuration, the recess may be configured to house substantially the entire heat transfer member (an eleventh configuration).

  In the heat dissipation structure of the first to eleventh configurations, the heat transfer member may be provided at a plurality of locations between the electronic component and the heat dissipation member (a twelfth configuration).

  Furthermore, the heat dissipation structure according to the present invention is a heat dissipation structure of an electronic component, and the electronic substrate, the electronic component mounted on the electronic substrate, the heat dissipation member emitting heat generated by the electronic component, and the electronic component And a heat transfer member provided in contact with each other between the heat release member and the heat transfer member for transferring heat generated by the electronic component to the heat release member, the heat transfer member comprising one of the electronic component and the heat transfer member. It is the structure (13th structure) provided in multiple places between heat dissipation members.

  Further, in the heat dissipation structure of the thirteenth configuration, an outer edge portion of the space protrudes from at least one of the electronic substrate or the heat dissipation member toward the other, and extends a space between the electronic component and the heat dissipation member. (14th structure) provided with the rib provided in the said, and the said rib is provided between the said heat transfer members of several places.

  Further, in the heat dissipation structure of the first to fourteenth configurations, the electronic substrate and the electronic component may be arranged to be inclined with respect to a horizontal surface (a fifteenth configuration).

  According to the configuration of the present invention, the movement preventing portion prevents the heat transfer member from falling off between the electronic component and the heat dissipation member, and maintains the heat dissipation path. Therefore, it is possible to improve the reliability of the heat radiation to the electronic component.

It is a disassembled perspective view which shows the whole structure of the thermal radiation structure of 1st Embodiment. It is a side view which shows the installation state of the electronic device which has a thermal radiation structure of 1st Embodiment. It is a top view which shows the electronic component and heat transfer member of the thermal radiation structure of 1st Embodiment. It is a vertical cutting part partial end elevation view of the heat dissipation structure of a 1st embodiment. It is a vertical cutting part partial end elevation view of the 1st modification of the heat dissipation structure of a 1st embodiment. It is a vertical cutting part partial end elevation view of the 2nd modification of the heat dissipation structure of a 1st embodiment. It is a vertical cutting part partial end elevation view of the heat dissipation structure of a 2nd embodiment. It is a vertical cutting part partial end elevation view of the 1st modification of the heat dissipation structure of a 2nd embodiment. It is a vertical cutting part partial end elevation view of the 2nd modification of the heat dissipation structure of a 2nd embodiment. It is a vertical cutting part partial end elevation view of the heat dissipation structure of a 3rd embodiment. It is a vertical cutting part partial end elevation view of the heat dissipation structure of a 4th embodiment. It is a vertical cutting part partial end elevation view of the heat dissipation structure of a 5th embodiment. It is a vertical cutting part partial end elevation view of the heat dissipation structure of a 6th embodiment. It is a top view which shows the electronic component and heat transfer member of the thermal radiation structure of 6th Embodiment. It is a vertical cutting part partial end elevation view of the modification of the heat dissipation structure of a 6th embodiment.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following contents.

<1. First embodiment>
<1-1. Overall configuration of heat dissipation structure>
FIG. 1 is an exploded perspective view showing the entire configuration of the heat dissipation structure 1 of the first embodiment. FIG. 2 is a side view showing the installation state of the electronic device E having the heat dissipation structure 1. FIG. 3 is a plan view showing the electronic component 3 and the heat transfer member 6 of the heat dissipation structure 1. The vertical direction in FIG. 2 is the vertical direction of the electronic device E (heat dissipation structure 1) in the installed state. Moreover, FIG. 3 is the figure which faced the electronic substrate 2 and looked at the electronic component 3 and the heat transfer member 6, Comprising: The drawing of the electronic substrate 2 was abbreviate | omitted.

  The heat dissipation structure 1 includes the electronic substrate 2, the electronic component 3, the cover member 4, the chassis 5 and the heat transfer member 6 shown in FIGS. 1, 2 and 3.

  The electronic device E having the heat dissipation structure 1 is, for example, an electronic control unit (ECU) of a vehicle, and is attached to a wall W of the vehicle via a bracket B as shown in FIG. In the heat dissipation structure 1, the electronic substrate 2 and the electronic component 3 are installed at an inclination with respect to the horizontal plane, in particular, as shown in FIG. Thereby, the installation space in the lateral direction (horizontal direction) can be reduced.

  The electronic substrate 2 is made of, for example, a synthetic resin such as an epoxy resin as a material, and has a plate shape. A component (not shown) including the electronic component 3 is mounted on one surface 2 a of the electronic substrate 2. In addition, components may be mounted also on the back surface 2 b opposite to the one surface 2 a of the electronic substrate 2.

  The electronic component 3 is a component requiring heat radiation, and corresponds to, for example, a microcomputer, a memory, an application specific integrated circuit (ASIC), a switching element, or the like.

  The cover member 4 is provided to face the one surface 2 a of the electronic substrate 2. The cover member 4 is, for example, an aluminum die-cast, and is formed of a substantially rectangular parallelepiped box body whose surface facing the one surface 2 a of the electronic substrate 2 is open. In the internal space of the cover member 4, the electronic component 3 and the like mounted on the one surface 2 a of the electronic substrate 2 are accommodated.

  The cover member 4 is provided with four bosses 4a on the outside. A bracket B is connected to the boss portion 4a using a screw 7 as shown in FIG.

  The cover member 4 includes a heat radiating portion 4 b. The heat radiating portion 4 b is provided on the outer surface 4 c of the wall portion of the cover member 4 facing the one surface 2 a of the electronic substrate 2. The heat dissipating portion 4 b has a heat dissipating fin that protrudes outward in the normal direction of the outer surface 4 c and a plurality of heat dissipating fins extend in parallel. The cover member 4 functions as a heat dissipating member for releasing the heat generated by the electronic component 3 to the atmosphere via the heat transfer member 6.

  The chassis 5 is provided to face the back surface 2 b of the electronic substrate 2. The chassis 5 is formed of a substantially rectangular parallelepiped box whose surface facing the back surface 2 b of the electronic substrate 2 is open. The chassis 5 is coupled at its four corners to the cover member 4 by screws 8. At this time, the electronic substrate 2 is sandwiched and fixed between the cover member 4 and the chassis 5.

  The heat transfer members 6 are provided in contact with each other between the electronic component 3 and the cover member 4 which is a heat dissipation member. When assembling the electronic device E, the heat transfer member 6 has, for example, a gel-like shape, and is applied onto the one surface 3 a of the electronic component 3 or the cover member 4 using a dispenser or the like.

  The heat transfer members 6 are provided at a plurality of places, for example, four places, with respect to one electronic component 3 as shown in FIGS. 1 and 3. The four heat transfer members 6 are arranged, for example, in a positional relationship corresponding to an intersection of a square grid. The four heat transfer members 6 are separated from one another. The heat transfer member 6 transfers the heat generated by the electronic component 3 to the cover member 4.

  In addition, the installation location of the heat transfer member 6 with respect to one electronic component 3 is not necessarily limited to four places, for example, two places, six places, nine places etc. may be sufficient. Further, the heat transfer members 6 at four places may be arranged in a staggered arrangement. Further, in this embodiment, the heat transfer member 6 is provided in a circular shape in plan view as shown in FIGS. 1 and 3, but may be provided in another shape such as a rectangular shape in plan view, for example.

<1-2. Detailed configuration of heat dissipation structure>
Subsequently, the detailed configuration of the heat dissipation structure 1 will be described. FIG. 4 is a partial cutaway end view of the heat dissipation structure 1. As in FIG. 2, the vertical direction in FIG. 4 is the vertical direction of the heat dissipation structure 1 in the installed state.

  The gel-like heat transfer member 6 may be solidified in a semi-solid state as time passes. In addition, the time-dependent change said here is that the oil component in a gel exudes and passes out when the heat transfer member 6 is expose | bleached to a high temperature environment, or a vibration is repeatedly added. It is assumed that the heat transfer member 6 slides downward from the initial state of application shown in FIG. Therefore, the heat dissipation structure 1 has the movement preventing portion 11 with respect to the heat transfer member 6. The movement blocking portion 11 prevents the heat transfer member 6 from falling out of the space S between the electronic component 3 and the cover member 4 by the action of gravity. The movement preventing portion 11 is provided below the space S between the electronic component 3 and the cover member 4 which is the movement destination when the heat transfer member 6 slides down.

  According to this configuration, even if the heat transfer member 6 is displaced downward from the initial state of application, the movement prevention portion 11 is caught. Accordingly, the heat transfer member 6 remains between the electronic component 3 and the cover member 4 to maintain the heat radiation path. As a result, it is possible to improve the reliability of the heat radiation to the electronic component 3.

  The gel-like heat transfer member 6 is provided by various manufacturers, and there are many grades with different specifications. In order to select the heat transfer member 6 suitable for the structure of the electronic device E and the material of the members, the element evaluation man-hour (period) and the cost may require a large cost. However, according to the configuration of the present embodiment, the heat transfer member 6 does not physically come out of the space S between the electronic component 3 and the cover member 4, so in the selection of the gel heat transfer member 6. It is possible to reduce the period and the cost. Furthermore, according to the configuration of the present embodiment, it is not necessary to strictly manage the application position and the application amount of the heat transfer member 6, and it is possible to reduce the manufacturing cost.

  In addition, the movement prevention unit 11 is provided on the cover member 4. The movement preventing portion 11 is constituted by a convex portion which protrudes from the cover member 4 toward the electronic substrate 2. Thereby, the form for making the heat transfer member 6 stay between the electronic component 3 and the cover member 4 can be obtained with a simple configuration.

  Specifically, the movement preventing portion 11 is a rib inside the cover member 4 that protrudes toward the electronic substrate 2 from the inner surface 4 d facing the electronic component 3. The rib as the movement preventing portion 11 is provided at the lower outer edge of the space S in the direction (vertical direction) in which the space S between the electronic component 3 and the cover member 4 extends. That is, this rib extends in a direction (lateral direction) intersecting the moving direction (vertical direction) when the heat transfer member 6 slides down. Then, the rib closes the lower extension area of the space S between the electronic component 3 and the cover member 4. If the movement preventing portion 11 is configured by such a rib, the movement preventing portion can be easily reduced below the space between the electronic component 3 which is the movement destination when the heat transfer member 6 slides down and the cover member 4. 11 can be provided.

  Moreover, since the heat transfer member 6 is provided in multiple places with respect to one electronic component 3, the weight per heat transfer member 6 can be made as light as possible. Therefore, it is possible to suppress the movement of the heat conducting member 6 itself by the action of gravity, vibration, acceleration / deceleration of the vehicle, and the like.

<1-3. Modification of Heat Dissipation Structure of First Embodiment>
Then, the modification of heat dissipation structure 1 of a 1st embodiment is explained. FIG. 5 is a partial cutaway end elevation view of the first modification of the heat dissipation structure 1. FIG. 6 is a partial cut-away end view of the second modification of the heat dissipation structure 1.

  In the first modification of the heat dissipation structure 1, as shown in FIG. 5, the rib as the movement preventing portion 11 is the entire periphery of the outer edge of the space S in the direction in which the space S between the electronic component 3 and the cover member 4 extends Provided around the That is, in addition to the upper and lower portions of the space S between the electronic component 3 and the cover member 4, the movement preventing portion 11 is provided on the side (the far side and the near side in the depth direction in FIG. 5).

  According to this configuration, in addition to the action of gravity, even when the heat conduction member 6 slides upward or to the side due to vibration, acceleration or deceleration of the vehicle, etc. Accordingly, the heat transfer member 6 remains between the electronic component 3 and the cover member 4. As a result, in the electronic device E, it is possible to improve the reliability of the heat radiation to the electronic component 3.

  In the second modified example of the heat dissipation structure 1, as shown in FIG. 6, ribs as the movement preventing portion 11 are provided between the heat transfer members 6 at four places. That is, the movement preventing portion 11 is provided to surround the entire circumference of the outer edge portion of each heat transfer member 6 in the direction in which the space S between the electronic component 3 and the cover member 4 extends. The movement preventing portions 11 are individually provided above, below, and laterally of the heat transfer members 6. However, the position at which the rib as the movement prevention portion 11 is provided may not be around each of the four heat transfer members 6.

  According to this configuration, it is possible to maintain the initial position of the heat transfer member 6 as much as possible for each of the four heat transfer members 6 individually. That is, it is possible to suppress uneven distribution when the heat transfer member 6 slips. Therefore, it is possible to improve the heat radiation performance of the electronic component 3.

<2. Second embodiment>
<2-1. Detailed configuration of heat dissipation structure>
Next, a second embodiment will be described. FIG. 7 is a partial cutaway end view of the heat dissipation structure 1. The basic configuration of the second embodiment is the same as that of the first embodiment described above, so the components different from the first embodiment will be described below, and the components common to the first embodiment The detailed description is omitted.

  The heat dissipation structure 1 according to the second embodiment includes the movement prevention unit 12 shown in FIG. The movement preventing portion 12 is constituted by a convex portion which protrudes toward the electronic substrate 2 from the inner surface 4 d of the cover member 4.

  The protrusion length of the movement preventing portion 12 becomes longer as it goes to the outer edge portion of the heat transfer member 6 in the direction (vertical direction) in which the space S between the electronic component 3 and the cover member 4 extends. Specifically, when the heat transfer member 6 slides downward, the movement preventing portion 12 moves from the inner surface 4 d of the cover member 4 toward the lower outer edge of the heat transfer member 6 in the moving direction (vertical direction) Protruding length of is longer. That is, the movement preventing portion 12 is formed by an inclined surface in which the contact surface 12 a with the heat transfer member 6 approaches the electronic component 3 as it goes from the upper end side to the lower end side of the heat transfer member 6. In addition, the contact surface 12a with the heat transfer member 6 of the movement prevention part 12 is a plane.

  According to this configuration, in the space S between the electronic component 3 and the cover member 4, the distance between the electronic component 3 and the cover member 4 becomes narrower as it goes downward in the application region of the heat transfer member 6. Thus, the heat transfer member 6 can be caught by the movement prevention unit 12 at the initial position of application. Therefore, in the electronic device E, it is possible to improve the reliability of the heat radiation to the electronic component 3.

2-2. Modification of Heat Dissipation Structure According to Second Embodiment>
Then, the modification of heat dissipation structure 1 of a 2nd embodiment is explained. FIG. 8 is a partial cutaway end elevation view of the first modification of the heat dissipation structure 1. FIG. 9 is a partial cut-away end view of the second modification of the heat dissipation structure 1.

  In the first modification of the heat dissipation structure 1, as shown in FIG. 8, the cover member 4 which is a heat dissipation member has a non-slip portion 12 b in the movement prevention portion 12. The anti-slip portion 12 b is provided on the contact surface 12 a of the movement preventing portion 12 with the heat transfer member 6, and is configured by a plurality of depressions that suppress the movement of the heat transfer member 6. According to this configuration, it is possible to effectively enhance the action of holding the heat transfer member 6 at the initial position of application.

  In the second modification of the heat dissipation structure 1, as shown in FIG. 9, the convex portion as the movement preventing portion 12 is from the central portion of the heat transfer member 6 in the direction in which the space S between the electronic component 3 and the cover member 4 extends. The protrusion length becomes longer toward the outer edge. Specifically, the movement preventing portion 12 is an inner surface of the cover member 4 as it goes from the center of the circle to the radially outer side of the heat transfer member 6 with respect to the heat transfer member 6 having a circular plan view (see FIG. 3) Protruding length from 4d becomes longer. The contact surface 12a of the movement preventing portion 12 with the heat transfer member 6 is an inclined surface which approaches the electronic component 3 as it goes radially outward from the center of the circle over the entire circumference of the circle of the heat transfer member 6 Be done. That is, in the movement preventing portion 12, the contact portion with the heat transfer member 6 is a conical circumferential surface.

  According to this configuration, even if the heat transfer member 6 slides upward or sideways due to vibration, acceleration / deceleration of the vehicle, etc. in addition to the action of gravity, the heat transfer member 6 is moved at the initial position of application It can be in the state of being caught at 12. Therefore, in the electronic device E, it is possible to improve the reliability of the heat radiation to the electronic component 3.

<3. Third embodiment>
Next, a third embodiment will be described. FIG. 10 is a partial cutaway end view of the heat dissipation structure 1. The basic configuration of the third embodiment is the same as the first and second embodiments described above, so components different from those of the first embodiment will be described below, and those embodiments and Detailed description of the common components is omitted.

  The heat dissipation structure 1 according to the third embodiment includes the movement prevention unit 13 shown in FIG. The movement preventing portion 13 is formed of a convex portion which protrudes from the inner surface 4 d of the cover member 4 toward the electronic substrate 2.

  The protrusion length of the movement preventing portion 13 becomes longer as it goes from the central portion of the heat transfer member 6 to the outer edge portion in the direction in which the space S between the electronic component 3 and the cover member 4 extends. Specifically, the movement preventing portion 13 is an inner surface of the cover member 4 as the heat transfer member 6 (see FIG. 3) having a circular shape in plan view is directed radially outward of the heat transfer member 6 from the center of the circle. Protruding length from 4d becomes longer. The movement preventing portion 13 has a dome-shaped contact portion with the heat transfer member 6.

  According to this configuration, even if the heat transfer member 6 slides upward or sideways due to vibration, acceleration / deceleration of the vehicle, etc. in addition to the action of gravity, the heat transfer member 6 is moved at the initial position of application It is possible to get stuck in 13. Therefore, in the electronic device E, it is possible to improve the reliability of the heat radiation to the electronic component 3.

  In the outer edge portion of the heat transfer member 6 in the direction in which the space S between the electronic component 3 and the cover member 4 extends, the predetermined distance L1 between the electronic component 3 and the cover member 4 is predetermined. For this interval L1, by making the thickness of the outer edge of the gel-like heat transfer member 6 thinner than the thickness of the central portion, a distance at which the outer peripheral portion easily solidifies earlier than the central portion is derived in advance and set. Ru. The heat transfer member 6 becomes difficult to move when the outer edge portion solidifies before the central portion.

  According to this configuration, it is possible to make the heat transfer member 6 stay between the electronic component 3 and the cover member 4 by utilizing the characteristic that the gel heat transfer member 6 solidifies in a semi-solid state as it changes with time. Therefore, it is possible to maintain the heat radiation path for the electronic component 3.

  In addition, the structure which concerns on the space | interval L1 of the electronic component 3 in the outer edge part of the heat transfer member 6, and the cover member 4 is applicable also to 2nd Embodiment.

<4. Fourth embodiment>
Next, a fourth embodiment will be described. FIG. 11 is a partial cutaway end view of the heat dissipation structure 1. The basic configuration of the fourth embodiment is the same as that of the first embodiment described above, so components different from the first embodiment will be described below, and components common to the first embodiment The detailed description is omitted.

  The heat dissipation structure 1 of the fourth embodiment includes the movement inhibiting portion 14 shown in FIG. The movement prevention unit 14 is provided on the cover member 4. The movement preventing portion 14 is formed of a concave portion recessed on the inner surface 4 d of the cover member 4 facing the heat transfer member 6. The recessed part as the movement prevention part 14 is comprised by the substantially rectangular parallelepiped box by which the surface opposite to the heat transfer member 6 was open | released. The movement preventing portion 14 has a shape slightly larger than the outer shape of the heat transfer member 6. The movement prevention unit 14 accommodates the heat transfer member 6.

  According to this configuration, a wall that prevents movement of the heat transfer member 6 can be provided adjacent to the periphery of the heat transfer member 6. Therefore, it is possible to more effectively enhance the action of holding the heat transfer member 6 at the initial position of application.

  Further, the recess as the movement preventing portion 14 accommodates substantially the entire heat transfer member 6. That is, the inner surface 4 d of the cover member 4 on the outer side of the movement preventing portion 14 closely opposes the one surface 3 a of the electronic component 3 with a slight gap.

  According to this configuration, it is possible to provide a wall that prevents movement of the heat transfer member 6 so as to cover the entire periphery of the heat transfer member 6. Therefore, the heat transfer member 6 can be held at the initial position of application.

<5. Fifth embodiment>
Next, a fifth embodiment will be described. FIG. 12 is a partial end view of the vertical cutting portion of the heat dissipation structure 1. In addition, since the basic configuration of the fifth embodiment is the same as the first and fourth embodiments described above, the components different from those of the embodiments will be described below, and those embodiments and Detailed description of the common components is omitted.

  The heat dissipation structure 1 of the fifth embodiment includes the movement preventing portion 15 shown in FIG. The movement prevention unit 15 is provided to the electronic component 3. The movement preventing portion 15 is constituted by a concave portion which is recessed in one surface 3 a of the electronic component 3 facing the heat transfer member 6. The recessed part as the movement prevention part 15 is comprised by the box body of the substantially rectangular parallelepiped in which the surface facing the heat transfer member 6 was open | released. The movement preventing portion 15 has a shape slightly larger than the outer shape of the heat transfer member 6.

  Further, the recess as the movement preventing portion 15 accommodates substantially the entire heat transfer member 6. That is, one surface 3 a of the electronic component 3 on the outer side of the movement preventing portion 15 closely opposes the inner surface 4 d of the cover member 4 with a slight gap.

  According to this configuration, it is possible to provide a wall that prevents movement of the heat transfer member 6 so as to cover the entire periphery of the heat transfer member 6. Therefore, the heat transfer member 6 can be held at the initial position of application.

<6. Sixth embodiment>
<6-1. Detailed configuration of heat dissipation structure>
Next, a sixth embodiment will be described. FIG. 13 is a partial cutaway end view of the heat dissipation structure 1. FIG. 14 is a plan view showing the electronic component 3 and the heat transfer member 6 of the heat dissipation structure 1. The basic configuration of the sixth embodiment is the same as that of the first embodiment described above, so components different from the first embodiment will be described below, and components common to the first embodiment The detailed description is omitted.

  The heat dissipation structure 1 of the sixth embodiment includes the heat transfer member 6 shown in FIGS. 13 and 14. The heat transfer members 6 are provided in contact with each other between the electronic component 3 and the cover member 4 which is a heat dissipation member. The heat transfer members 6 are provided at a plurality of places, for example, four places, with respect to one electronic component 3. The four heat transfer members 6 are arranged, for example, in a positional relationship corresponding to an intersection of a square grid. The four heat transfer members 6 are separated from one another.

  In addition, in the said structure of 6th Embodiment, the movement prevention part comprised with the convex part (rib) seen in 1st Embodiment is not provided.

  According to this configuration, since the plurality of heat transfer members 6 are separated from each other, the weight per heat transfer member 6 can be reduced as much as possible. Therefore, it is possible to suppress the movement of the heat conducting member 6 itself by the action of gravity, vibration, acceleration / deceleration of the vehicle, and the like. That is, the initial position of the heat transfer member 6 can be maintained. As a result, the heat transfer member 6 remains between the electronic component 3 and the cover member 4, and the heat radiation path is maintained. As a result, in the electronic device E, it is possible to improve the reliability of the heat radiation to the electronic component 3.

  Further, by dividing the heat conducting member 6 into a plurality for one electronic component 3, it is possible to disperse the risk when the heat conducting member 6 is detached. That is, even when one heat conducting member 6 is detached, it is possible to prevent all of the heat conducting members 6 provided in a certain electronic component 3 from being lost.

6-2. Modification of Heat Dissipation Structure of Sixth Embodiment>
Then, the modification of heat dissipation structure 1 of a 6th embodiment is explained. FIG. 15 is a partial cutaway end view of a vertical cutting portion of a modification of the heat dissipation structure 1.

  In the modification of the heat dissipation structure 1, as shown in FIG. 15, ribs 16 are provided between the heat transfer members 6 at four places. The rib 16 is provided at the outer edge of the space S in the direction in which the space S between the electronic component 3 and the cover member 4 extends. Furthermore, the ribs 16 are provided around the entire circumference of the outer edge of each heat transfer member 6. That is, the ribs 16 are individually provided above, below and to the side of each heat transfer member 6. The configuration is not limited to the configuration in which the rib 16 is provided so as to surround the entire periphery of the heat conducting member 6, as long as the rib 16 is provided between the plurality of heat conducting members 6.

  According to this configuration, it is possible to maintain the initial position of the heat transfer member 6 as much as possible for each of the four heat transfer members 6 individually. That is, it is possible to suppress uneven distribution when the heat transfer member 6 slips. Therefore, it is possible to improve the heat radiation performance of the electronic component 3.

<7. Modified example>
As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment, A various deformation | transformation is possible. Below, the modification concerning the whole of the above-mentioned embodiment is explained. In addition, all the elements of the said embodiment and all the elements of the form demonstrated below can be implemented in combination as appropriate.

  For example, although the heat dissipation structure 1 is applied to the on-vehicle electronic device E in the above embodiment, the heat dissipation structure may be applied to devices used in homes, offices, shops, and the like.

1 Heat Dissipation Structure 2 Electronic Substrate 2a One Side 2b Back Side 3 Electronic Component 3a One Side 4 Cover Member (Heat Dissipation Member)
4b Heat dissipation part 4c Outer surface 4d Inner surface 5 Chassis 6 Heat transfer member 11 Movement prevention part (convex part, rib)
12, 13 Movement prevention part (convex part)
12a contact surface 12b non-slip portion 14, 15 movement blocking portion (recess)
16 ribs

Claims (15)

It is a heat dissipation structure of electronic parts,
An electronic substrate,
An electronic component mounted on the electronic substrate;
A heat dissipation member that emits heat generated by the electronic component;
A heat transfer member provided in contact with each of the electronic component and the heat dissipation member to transfer heat generated by the electronic component to the heat dissipation member;
Equipped with
At least one of the electronic substrate, the electronic component, and the heat dissipation member includes a movement blocking portion that prevents the heat transfer member from falling out of the space between the electronic component and the heat dissipation member. Heat dissipation structure.   The heat dissipation structure according to claim 1, wherein the movement preventing portion is configured by a convex portion that protrudes from at least one of the electronic substrate or the heat dissipation member toward the other.   The heat dissipation structure according to claim 2, wherein the convex portion is a rib provided at an outer edge portion of the space in a direction in which the space extends.   The heat dissipation structure according to claim 2, wherein the protrusion length is extended as it goes to an outer edge portion of the heat transfer member in a direction in which the space extends.   The heat dissipation structure according to claim 4, wherein the convex portion has a conical circumferential surface in contact with the heat transfer member.   The heat dissipation structure according to claim 4, wherein the convex portion has a dome-shaped contact portion with the heat transfer member.   The space between the electronic component and the heat dissipating member at the outer edge of the heat transfer member in the direction in which the space extends is a predetermined distance defined in advance. Heat dissipation structure.   The said convex part is provided so that the outer periphery of the said heat transfer member in the direction in which the said space is extended, or the outer periphery of the said space may surround all the circumferences either. Heat dissipation structure as described in.   The heat dissipation structure according to any one of claims 1 to 8, wherein the heat dissipation member has a non-slip portion for suppressing movement of the heat transfer member on a contact surface with the heat transfer member.   The said movement prevention part is provided in at least one of the said electronic component or the said thermal radiation member, It comprises in the recessed part which accommodates the said heat transfer member while being depressed in one surface facing the said heat transfer member. The heat dissipation structure according to 1.   The heat dissipation structure according to claim 10, wherein the recess accommodates substantially the entire heat transfer member.   The heat dissipation structure according to any one of claims 1 to 11, wherein the heat transfer member is provided at a plurality of places between the electronic component and the heat dissipation member. It is a heat dissipation structure of electronic parts,
An electronic substrate,
An electronic component mounted on the electronic substrate;
A heat dissipation member that emits heat generated by the electronic component;
A heat transfer member provided in contact with each of the electronic component and the heat dissipation member to transfer heat generated by the electronic component to the heat dissipation member;
Equipped with
A heat dissipation structure, wherein the heat transfer member is provided at a plurality of locations between one of the electronic component and the heat dissipation member. It has a rib which protrudes toward the other from at least one of the electronic substrate or the heat dissipation member, and is provided at an outer edge of the space in a direction in which the space between the electronic component and the heat dissipation member extends.
The heat dissipation structure according to claim 13, wherein the rib is provided between the heat transfer members at the plurality of places.   The heat dissipation structure according to any one of claims 1 to 14, wherein the electronic substrate and the electronic component are installed at an inclination with respect to a horizontal plane.

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