WO2024000321A1 - 显示模组及显示装置 - Google Patents

显示模组及显示装置 Download PDF

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Publication number
WO2024000321A1
WO2024000321A1 PCT/CN2022/102530 CN2022102530W WO2024000321A1 WO 2024000321 A1 WO2024000321 A1 WO 2024000321A1 CN 2022102530 W CN2022102530 W CN 2022102530W WO 2024000321 A1 WO2024000321 A1 WO 2024000321A1
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WO
WIPO (PCT)
Prior art keywords
display
support plate
grooves
reinforcing plate
recessed structure
Prior art date
Application number
PCT/CN2022/102530
Other languages
English (en)
French (fr)
Inventor
李飞
冯彬峰
许志财
王吉喆
张英
肖博文
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2022/102530 priority Critical patent/WO2024000321A1/zh
Priority to CN202280002026.2A priority patent/CN117642791A/zh
Publication of WO2024000321A1 publication Critical patent/WO2024000321A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display module and a display device.
  • OLED Organic Light-Emitting Diode
  • the display module includes a display panel, a driver chip, a support plate and a reinforcement plate.
  • the display panel includes a display part, a bending part and a lead-out part.
  • the curved portion connects the display portion and the lead-out portion.
  • the display part has a display side and a non-display side, the non-display side being an opposite side to the display side.
  • the lead-out portion is located on the non-display side of the display portion.
  • the at least one driver chip is installed on a side of the lead-out part away from the display part.
  • the support plate is located on the non-display side of the display part.
  • the reinforcing plate is located between the support plate and the lead-out part.
  • At least one of the two opposing surfaces of the reinforcing plate and the support plate is provided with a recessed structure, and the orthographic projection of the recessed structure on at least one surface on the lead-out part is different from that of the at least one surface. Orthographic projections of one driver chip on the lead-out portion at least partially overlap.
  • the number of driver chips is two or more.
  • the orthographic projection of the recessed structure on at least one surface on the lead-out portion at least partially overlaps the orthographic projection of each of the driving chips on the lead-out portion.
  • the first recessed structure is provided on a surface of the reinforcing plate close to the supporting plate.
  • a first of said recessed structures includes a plurality of first grooves. The plurality of first grooves extend along the first direction and are spaced apart along the second direction. The first direction and the second direction intersect and are parallel to the reinforcing plate.
  • the first recessed structure is provided on a surface of the reinforcing plate close to the supporting plate.
  • the first recessed structure includes a plurality of first grooves, the plurality of first grooves extend along the second direction and are spaced apart along the second direction.
  • the number of the first grooves in the first recessed structure is greater than or equal to the number of the driving chips.
  • the orthographic projection of each driver chip on the lead-out portion at least partially overlaps the orthographic projection of at least one first groove on the lead-out portion.
  • the plurality of first grooves are further spaced apart along the first direction.
  • the first direction and the second direction intersect and are parallel to the reinforcing plate.
  • At least one first groove among the plurality of first grooves penetrates at least one of two opposite side surfaces of the reinforcing plate along the first direction.
  • the reinforcing plate is provided with a second recessed structure.
  • the second recessed structure includes a plurality of first holes arranged at intervals.
  • the first hole extends in a direction perpendicular to the reinforcing plate and at least penetrates the surface of the reinforcing plate close to the supporting plate.
  • the first hole also penetrates a surface of the reinforcement plate away from the support plate.
  • the third recessed structure is provided on a surface of the support plate close to the reinforcing plate.
  • the third said recessed structure includes a plurality of second grooves.
  • the plurality of second grooves extend along the third direction and are spaced apart along the fourth direction.
  • the third direction and the fourth direction intersect and are parallel to the support plate.
  • At least one end of at least one second groove among the plurality of second grooves along the third direction extends beyond an edge of the reinforcing plate.
  • At least one second groove among the plurality of second grooves penetrates at least one of two opposite side surfaces of the support plate along the third direction.
  • the first recessed structure when the first recessed structure is provided on the surface of the reinforcing plate close to the support plate, and the first recessed structure includes a plurality of first grooves: The extending direction of each second groove intersects the extending direction of the plurality of first grooves.
  • the second plurality of grooves extend in a direction parallel to a bending axis of the curved portion and the first plurality of grooves extend in a direction perpendicular to the bending axis.
  • the support plate is provided with a fourth recessed structure.
  • the fourth recessed structure includes a plurality of second holes arranged at intervals. The second hole extends in a direction perpendicular to the support plate and at least penetrates the surface of the support plate close to the reinforcing plate.
  • the second hole also penetrates a surface of the support plate away from the reinforcing plate.
  • a second recessed structure is provided on the surface of the reinforcing plate close to the support plate, and when the second recessed structure includes a plurality of first holes: the plurality of first holes: the plurality of first holes.
  • the second holes are arranged in multiple rows, and the plurality of first holes are arranged in multiple rows. In the column direction, a row of first holes and a row of second holes are alternately arranged, and an adjacent row of first holes and a row of second holes are staggered.
  • the area of the overlapping area between the orthographic projection of the reinforcing plate on the display part and the orthographic projection of the supporting plate on the display part is greater than or equal to the area where the supporting plate is located. 1/4 of the orthographic projection area on the display part.
  • the display module further includes a first glue layer.
  • the first glue layer is located between the support plate and the reinforcing plate.
  • the first glue layer includes a hollow area. The orthographic projection of the driver chip on the first adhesive layer is located in the hollow area.
  • the display module further includes a second glue layer and a third glue layer.
  • a second glue layer is located between the support plate and the display part.
  • a third adhesive layer is located between the reinforcing plate and the lead-out portion of the display panel.
  • the display module further includes a flexible circuit board and a fourth adhesive layer.
  • the flexible circuit board is located on a side of the reinforcing plate away from the display part. And the flexible circuit board is bound and connected to the edge of the lead-out part away from the bending part.
  • the fourth adhesive layer is located between the flexible circuit board and the reinforcement board.
  • the display module further includes a polarizer, a protective cover, and a fifth adhesive layer.
  • the polarizer is disposed on the display side of the display portion of the display panel.
  • the protective cover is located on the side of the polarizer away from the display part.
  • a fifth adhesive layer is located between the polarizer and the protective cover.
  • the display device includes the display module as described in any of the above embodiments.
  • Figure 1A is a schematic diagram of a display device according to some embodiments.
  • FIG. 1B is a schematic diagram showing that the display area of another display device is burned according to some embodiments.
  • Figure 2 is a structural diagram of a display module according to some embodiments.
  • Figure 3A is a schematic diagram of a display module according to some embodiments.
  • Figure 3B is a schematic diagram of another display module according to some embodiments.
  • Figure 3C is a schematic diagram of another display module according to some embodiments.
  • Figure 4 is a structural diagram of a reinforcing plate according to some embodiments.
  • Figure 5 is a structural diagram of yet another display module according to some embodiments.
  • Figure 6 is a structural diagram of yet another display module according to some embodiments.
  • Figure 7 is a structural diagram of another reinforcing plate according to some embodiments.
  • Figure 8 is a structural diagram of yet another reinforcing plate according to some embodiments.
  • Figure 9 is a structural diagram of yet another reinforcing plate according to some embodiments.
  • Figure 10 is a structural diagram of yet another reinforcing plate according to some embodiments.
  • Figure 11 is a structural diagram of a support plate according to some embodiments.
  • Figure 12 is a structural diagram of another support plate according to some embodiments.
  • Figure 13 is a structural diagram of yet another support plate according to some embodiments.
  • Figure 14 is a structural diagram of yet another support plate according to some embodiments.
  • Figure 15 is a structural diagram of yet another support plate according to some embodiments.
  • Figure 16 is a structural diagram of yet another support plate according to some embodiments.
  • Figure 17 is a structural diagram of yet another support plate according to some embodiments.
  • Figure 18 is a front view of a support plate and a reinforcing plate in a combined state according to some embodiments
  • Figure 19 is a front view of another combined state of a support plate and a reinforcing plate according to some embodiments.
  • Figure 20 is a right view of the combined state of the support plate and the reinforcing plate in Figure 19;
  • Figure 21 is a bottom view of the combined state of the support plate and the reinforcing plate in Figure 19;
  • Figure 22 is a front view of another combined state of a support plate and a reinforcing plate according to some embodiments.
  • Figure 23 is a front view of yet another combined state of a support plate and a reinforcing plate according to some embodiments.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.
  • parallel and perpendicular include the stated situation and situations that are approximate to the stated situation, and the range of the approximate situation is within an acceptable deviation range, where the acceptable deviation Ranges are as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (ie, the limitations of the measurement system).
  • the acceptable deviation Ranges are as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (ie, the limitations of the measurement system).
  • parallel includes absolutely parallel and approximately parallel, and the acceptable deviation range of approximately parallel may be, for example, a deviation within 5°
  • perpendicular includes absolutely vertical and approximately vertical, and the acceptable deviation range of approximately vertical may also be, for example, Deviation within 5°.
  • Example embodiments are described herein with reference to cross-sectional illustrations and/or plan views that are idealized illustrations.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes in the drawings due, for example, to manufacturing techniques and/or tolerances are contemplated.
  • example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result from, for example, manufacturing. For example, an etched area shown as a rectangle will typically have curved features. Accordingly, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the actual shapes of regions of the device and are not intended to limit the scope of the exemplary embodiments.
  • FIG. 1A is a schematic diagram of a display device according to some embodiments
  • FIG. 2 is a structural diagram of a display module according to some embodiments.
  • the display device 200 includes a display module 100 .
  • the display module 100 includes a flexible display panel 1 and a driver chip 2 .
  • the driving chip 2 is used to drive the flexible display panel 1 for display.
  • the flexible display panel 1 may be an electroluminescent display panel or a photoluminescent display panel.
  • the electroluminescent display panel may be an organic electroluminescent display panel (Organic Light-Emitting Diode, OLED for short) or a quantum dot electroluminescent display panel (Quantum Dot Light). Emitting Diodes (QLED for short).
  • the photoluminescence display panel may be a quantum dot photoluminescence display panel.
  • the above-mentioned display device 200 can be any device that displays text or images, whether moving (eg, video) or fixed (eg, still images).
  • the display device 200 is expected to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants ( Personal Digital Assistant (PDA), handheld or portable computer, Global Positioning System (GPS) receiver/navigator, camera, Moving Picture Experts Group 4 (MP4) video player , video cameras, game consoles, watches, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and/or displays, camera view displays (e.g., , displays for rear-view cameras in vehicles), electronic photos, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (for example, displays for images of a piece of jewelry), etc.
  • PDA Personal Digital Assistant
  • GPS Global Positioning System
  • MP4 Moving Picture Experts Group 4
  • FIG. 1B is a schematic diagram showing that the display area of another display device is burned according to some embodiments.
  • the display device 200A includes a display module 100A
  • the display module 100A includes a flexible display panel and a driver chip.
  • the driver chip of the display module 100A will generate heat when working. Affected by temperature, in the display area 101 of the flexible display panel corresponding to the driver chip, the life of the blue sub-pixels decays faster than the sub-pixels of other colors, the luminous efficiency decreases, and the brightness decreases. This causes a color shift in the display of the display area 101, changes the display effect from normal to yellowing, and even causes burns. In severe cases, it may even cause the entire flexible display panel to fail.
  • the display module 100 includes a flexible display panel 1 , at least one driver chip 2 , a support plate 3 and a reinforcement plate 4 . It can be understood that the display module 100 can be applied to any of the above display devices.
  • the flexible display panel 1 includes a display part 11 , a lead-out part 12 and a bending part 13 .
  • the curved portion 13 connects the display portion 11 and the lead-out portion 12 .
  • the display part 11 has a display side c2 for displaying images and a non-display side c1 which is the opposite side to the display side c2.
  • the lead-out portion 12 is located on the non-display side c1 of the display portion 11 .
  • the driver chip 2 is installed on the side of the lead-out portion 12 away from the display portion 11 , and the driver chip 2 is used to drive the display portion 11 of the flexible display panel 1 for display.
  • the support plate 3 is located on the non-display side c1 of the display part 11 , and is used to support the display part 11 of the flexible display panel 1 .
  • the material of the support plate 3 includes stainless steel (SUS) or titanium alloy.
  • SUS stainless steel
  • titanium alloy titanium alloy
  • the support plate 3 can also be made of other materials with support functions, without excessive restrictions here.
  • the reinforcing plate 4 is located between the supporting plate 3 and the lead-out part 12 , and is used to support the lead-out part 12 of the flexible display panel 1 .
  • the material of the reinforcing plate 4 includes aluminum alloy, copper, stainless steel, silver or titanium alloy.
  • the reinforcing plate 4 can also be made of other materials with enhanced support functions, and there are no excessive restrictions here.
  • the heat generated by the driving chip 2 can propagate along the Z direction to the area on the display part 11 corresponding to the driving chip 2 , and can also be transferred to the reinforcing plate 4 and the supporting plate 3 Spread along the X and Y directions. Since the actual contact area between the support plate 3 and the reinforcing plate 4 is large and the Z-direction distance of the display module 100 is short, the heat generated by the driver chip 2 is transferred more efficiently along the Z-direction. It is easy for the sub-pixels (especially the blue sub-pixels) in the area corresponding to the display part 11 and the driver chip 2 to decrease in brightness due to temperature, causing the display in this area to have a color shift or even turn yellow.
  • the display module 100 provided by some embodiments of the present disclosure is provided with a recessed structure 5 on at least one of the two opposing surfaces of the reinforcement plate 4 and the support plate 3 .
  • the orthographic projection of the recessed structure 5 on at least one surface on the lead-out portion 12 at least partially overlaps with the orthographic projection of the at least one driver chip 2 on the lead-out portion 12 .
  • the recessed structure 5 is provided on the surface of the reinforcing plate 4 facing the supporting plate 3 . In other examples, the recessed structure 5 is provided on the surface of the support plate 3 facing the reinforcing plate 4 . In some examples, recessed structures 5 may be provided on both opposite surfaces of the reinforcing plate 4 and the supporting plate 3 .
  • the display module 100 provided in some embodiments of the present disclosure is provided with a recessed structure 5 on at least one of the two opposite surfaces between the reinforcement plate 4 and the support plate 3, which reduces the size of the support plate 3 and the reinforcement plate 4.
  • the actual contact area between them reduces the channel for heat transfer along the Z direction, thereby effectively reducing the heat transfer efficiency along the Z direction.
  • the display module 100 of this embodiment can effectively reduce the impact of the temperature of the driver chip 2 on the flexible display panel 1 and prevent the display part 11 from being burned by the heat of the driver chip 2, thus effectively improving the performance of the display module 100. display performance and extend the service life of the display module 100.
  • the provision of the recessed structure 5 also plays a positive role in solving the problem of excessive weight of the display module 100 .
  • Figure 3A is a schematic diagram of a display module according to some embodiments.
  • Figure 3B is a schematic diagram of another display module according to some embodiments.
  • Figure 3C is a schematic diagram of yet another display module according to some embodiments.
  • the orthographic projection of the recessed structure 5 on at least one surface on the lead-out part 12 at least partially overlaps with the orthographic projection of at least one driving chip 2 on the lead-out part 12. Specifically includes The following situations:
  • the first type As shown in Figure 3A, when the number of driver chips 2 is one, the orthogonal projection of at least one recessed structure 5 on the surface on the lead-out part 12 is the same as the orthogonal projection of one driver chip 2 on the lead-out part 12.
  • the projections overlap at least partially. That is, at the corresponding position of the driving chip 2, at least one of the two opposite surfaces of the reinforcing plate 4 and the supporting plate 3 is provided with a recessed structure 5.
  • the recessed structure 5 is used to prevent the display part 11 from being burned by the heat of the driving chip 2. Extend the service life of the display module 100.
  • the orthographic projection of the recessed structure 5 on at least one surface on the lead-out part 12 is the same as that of one drive chip 2 on the lead-out part. Orthographic projections on 12 at least partially overlap. Or when the number of drive chips 2 is multiple, the orthographic projection of the recessed structure 5 on at least one surface on the lead-out part 12 is at least partially the same as the orthographic projection of two or more drive chips 2 on the lead-out part 12 overlap.
  • a recessed structure 5 is provided on at least one of the two opposing surfaces of the reinforcement plate 4 and the support plate 3. This prevents the heat of this part of the driving chip 2 from burning the display part 11 and extends the service life of the display module 100 to a certain extent.
  • the third type As shown in Figure 3C, when the number of driver chips 2 is two or more, the orthographic projection of the recessed structure 5 on at least one surface on the lead-out part 12 is different from that of each drive chip 2 on the lead-out part. Orthographic projections on 12 at least partially overlap. That is, at the corresponding position of each drive chip 2, a recessed structure 5 is provided on at least one of the two opposing surfaces of the reinforcement plate 4 and the support plate 3. Better use of the recessed structure 5 prevents the display part 11 from being burned by the heat of the driver chip 2 and extends the service life of the display module 100 .
  • Figure 4 is a structural diagram of a reinforcing plate according to some embodiments.
  • a first recessed structure 51 is provided on the surface of the reinforcing plate 4 close to the supporting plate 3 .
  • the first recessed structure 51 includes a plurality of first grooves 51a.
  • the plurality of first grooves 51a extend along the first direction A1 and are arranged at intervals along the second direction A2.
  • the first direction A1 and the second direction A2 intersect and are both parallel to the reinforcing plate.
  • the first direction A1 and the second direction A2 are perpendicular to each other.
  • the first direction A1 may be parallel to the X direction in FIGS. 2 and 4
  • the second direction A2 may be parallel to the Y direction in FIGS. 2 and 4 .
  • the angle between the first direction A1 and the second direction A2 may also be an obtuse angle or an acute angle.
  • a plurality of first grooves 51a arranged at intervals are provided on the reinforcement plate 4, and each first groove 51a forms a cavity between the support plate 3 and the reinforcement plate 4. .
  • Such an arrangement reduces the actual contact area between the reinforcing plate 4 and the supporting plate 3 on the one hand, and blocks the Z-direction conduction path of part of the heat, thereby effectively reducing the Z-direction heat propagation efficiency.
  • providing the first groove 51a on the reinforcing plate 4 can also effectively reduce the weight of the reinforcing plate 4.
  • the orthographic projection of the at least one first groove 51a on the lead-out part 12 at least partially overlaps with the orthographic projection of the drive chip 2 on the lead-out part 12, which is beneficial to reducing the Z-direction heat propagation efficiency.
  • FIG. 5 is a structural diagram of yet another display module according to some embodiments.
  • a first recessed structure 51 is provided on the surface of the reinforcing plate 4 close to the supporting plate 3 .
  • the first recessed structure 51 includes a plurality of first grooves 51a.
  • the plurality of first grooves 51a extend along the second direction A2 and are arranged at intervals along the second direction A2.
  • the number of first grooves 51 a in the first recessed structure 51 is greater than or equal to the number of driving chips 2 .
  • the orthographic projection of each driving chip 2 on the lead-out portion 12 at least partially overlaps the orthographic projection of at least one first groove 51 a on the lead-out portion 12 .
  • FIG. 5 takes as an example that the number of first grooves 51 a in the first recessed structure 51 is greater than the number of driver chips 2 .
  • the first recessed structure 51 includes four first grooves 51a, the number of driver chips 2 is two, and one driver chip 2 corresponds to two first grooves 51a. That is, the orthographic projection of each driver chip 2 on the lead-out portion 12 at least partially overlaps with the orthographic projection of the two first grooves 51 a on the lead-out portion 12 .
  • a cavity is formed between the support plate 3 and the reinforcing plate 4 using the first groove 51a.
  • the actual contact area between the reinforcing plate 4 and the supporting plate 3 is reduced, and the Z-direction conduction path of part of the heat is blocked, thereby effectively reducing the Z-direction heat propagation efficiency. This prevents the display part 11 from being burned by the heat of the driver chip 2 and extends the service life of the display module 100 .
  • the second direction A2 may be parallel to the Y direction in FIGS. 2 and 5 .
  • Figure 6 is a structural diagram of yet another display module according to some embodiments.
  • a plurality of first grooves 51a are also spaced apart along the first direction A1.
  • the first direction A1 and the second direction A2 intersect and are both parallel to the reinforcing plate 4 .
  • FIG. 6 takes as an example that the number of first grooves 51a in the first recessed structure 51 is greater than the number of driver chips 2.
  • the first recessed structure 51 includes eight first grooves 51a, the number of driver chips 2 is two, and one driver chip 2 corresponds to four first grooves 51a.
  • Four first grooves 51a are arranged in an array at positions corresponding to one driver chip 2, and the first grooves 51a are used to form a cavity between the support plate 3 and the reinforcement plate 4.
  • the actual contact area between the reinforcing plate 4 and the supporting plate 3 is reduced, and the Z-direction conduction path of part of the heat is blocked, thereby effectively reducing the Z-direction heat propagation efficiency. This prevents the display part 11 from being burned by the heat of the driver chip 2 and extends the service life of the display module 100 .
  • first direction A1 and the second direction A2 are perpendicular to each other.
  • first direction A1 may be parallel to the X direction in Figures 2 and 6
  • second direction A2 may be parallel to the Y direction in Figures 2 and 6.
  • the angle between the first direction A1 and the second direction A2 may also be an obtuse angle or an acute angle.
  • At least one edge of the first groove 51 a is orthogonally projected on the lead-out portion 12 , and is located outside the orthographic projection of the driver chip 2 on the lead-out portion 12 . It is more conducive to increasing the cavity volume formed by the first groove 51a between the support plate 3 and the reinforcing plate 4 . The actual contact area between the reinforcing plate 4 and the supporting plate 3 is reduced to a greater extent, and the Z-direction conduction path of part of the heat is blocked, thereby more effectively reducing the Z-direction heat propagation efficiency. It can be understood that in other embodiments, the first groove 51 a is orthogonally projected on the lead-out portion 12 and is located within the orthographic projection of the drive chip 2 on the lead-out portion 12 .
  • none of the plurality of first grooves 51 a penetrates the two opposite side surfaces (d1 and d2) of the reinforcing plate 4 along the first direction A1.
  • the plurality of first grooves 51a do not penetrate the two opposite side surfaces (d1 and d2) of the reinforcing plate 4, so that the reinforcing plate 4 has a continuous frame area around it, and the frame area maintains the original thickness. Effectively improve the structural strength of the reinforcing plate 4.
  • Figure 7 is a structural diagram of another reinforcing plate according to some embodiments.
  • at least one first groove 51a among the plurality of first grooves 51a penetrates one of the two opposite side surfaces (d1 and d2) of the reinforcing plate 4 along the first direction A1. side surface.
  • FIG. 7 only illustrates that all the first grooves 51 a only penetrate one side surface d1 of the reinforcing plate 4 along the first direction A1.
  • the embodiments of the present disclosure are not limited to this.
  • all the first grooves 51 a may penetrate only the other side surface d2 of the reinforcing plate 4 along the first direction A1.
  • part of all the first grooves 51a may penetrate one side surface d1 of the reinforcement plate 4 along the first direction A1, and the other part may penetrate the other side surface d2 of the reinforcement plate 4 along the first direction A1.
  • first grooves 51a may penetrate one of the two opposite side surfaces (d1 and d2) of the reinforcing plate 4 along the first direction A1, and the remaining first grooves 51a may not penetrate any side of the reinforcing plate.
  • the surface d1 also does not penetrate the other side surface d2 of the reinforcing plate.
  • At least one first groove 51a can communicate with the outside. This arrangement is conducive to air circulation, so that the heat between the reinforcing plate 4 and the supporting plate 3 can be discharged with the flow of air, which is conducive to heat dissipation and effectively avoids heat concentration.
  • Figure 8 is a structural diagram of yet another reinforcing plate according to some embodiments.
  • a plurality of first grooves 51a simultaneously penetrate two opposite side surfaces (d1 and d2) of the reinforcing plate 4 along the first direction A1.
  • the plurality of first grooves 51a form a plurality of airflow channels along the first direction A1 on the surface of the reinforcement plate 4 facing the support plate 3, which is beneficial to the air circulation between the reinforcement plate 4 and the support plate 3. , so that part of the heat generated by the driver chip 2 can be quickly taken away by the flowing air, so that less heat is transferred to the support plate 3, and the heat is not easily concentrated in the display part 11 of the flexible display panel 1 corresponding to the drive The location of chip 2.
  • Figure 9 is a structural diagram of yet another reinforcing plate according to some embodiments.
  • a second recessed structure 52 is provided on the reinforcing plate.
  • the second recessed structure 52 includes a plurality of first holes 52a arranged at intervals.
  • the first hole 52 a extends in a direction perpendicular to the reinforcing plate 4 and at least penetrates the surface of the reinforcing plate 4 close to the supporting plate 3 .
  • a plurality of first holes 52a are provided on the reinforcing plate 4 to reduce the actual contact area between the reinforcing plate 4 and the supporting plate 3, so as to reduce the heat propagation efficiency in the Z direction, prevent the display part 11 from being burned, and extend the Displays the service life of the module 100.
  • using the first hole 52a as the second recessed structure 52 can improve the structural strength of the reinforcing plate 4.
  • the orthographic projection of the at least one first hole 52a on the lead-out part 12 at least partially overlaps with the orthographic projection of the driver chip 2 on the lead-out part 12, which is beneficial to reducing the Z-direction heat propagation efficiency.
  • the first hole 52 a only penetrates the surface of the reinforcing plate 4 close to the support plate 3 , that is, the first hole 52 a is a blind hole.
  • the shape of the first hole 52a can be a circular hole (as shown in Figure 9) or other polygonal holes or special-shaped holes, which can be selected arbitrarily according to actual needs during use.
  • the first hole 52a is a blind hole, which can not only effectively reduce the actual contact area between the support plate 3 and the reinforcing plate 4, but also improve the structural strength of the reinforcing plate 4.
  • the first hole 52 a also penetrates the surface of the reinforcing plate 4 away from the supporting plate 3 . That is, the first hole 52a in this example is a through hole, penetrating the surface of the reinforcing plate 4 close to the support plate 3 and the surface away from the support plate 3 .
  • This arrangement can not only reduce the actual contact area between the reinforcing plate 4 and the supporting plate 3, but also facilitate heat dissipation.
  • the plurality of first holes 52a may include both blind holes and through holes. Such an arrangement can not only reduce the actual contact area between the reinforcing plate 4 and the supporting plate 3 , but also facilitate heat dissipation, and at the same time ensure the strength of the reinforcing plate 4 .
  • Figure 10 is a structural diagram of yet another reinforcing plate according to some embodiments.
  • a first recessed structure 51 and a second recessed structure 52 are provided on the reinforcing plate.
  • first direction A1 or along the second direction A2 at least one first recessed structure 51 and at least one second recessed structure 52 are alternately arranged.
  • FIG. 10 takes as an example that the first recessed structure 51 and the second recessed structure 52 are alternately arranged along the second direction A2. It can be understood that in other embodiments, at least one first recessed structure 51 and at least one second recessed structure 52 may be alternately arranged along the first direction A1.
  • first direction A1 and the second direction A2 are perpendicular to each other.
  • first direction A1 may be parallel to the X direction in Figures 2 and 10
  • second direction A2 may be parallel to the Y direction in Figures 2 and 10.
  • the angle between the first direction A1 and the second direction A2 may also be an obtuse angle or an acute angle.
  • the reinforcing plate 4 may only include the first recessed structure 51, that is, the reinforcing plate 4 is only provided with a plurality of first grooves 51a.
  • the reinforcing plate 4 may also include only the second recessed structure 52 , that is, the reinforcing plate 4 may only be provided with a plurality of first holes 52 a .
  • the first recessed structure 51 and the second recessed structure 52 may be included at the same time, that is, the reinforcing plate 4 is provided with both a plurality of first grooves 51a and a plurality of first holes 52a.
  • the reinforcing plate 4 has a plurality of first holes 52a disposed between two adjacent first grooves 51a.
  • the structure of the reinforcing plate 4 in some embodiments of the present disclosure was introduced with reference to FIGS. 4 to 10 .
  • the structure of the support plate 3 in some embodiments of the present disclosure will be introduced with reference to FIGS. 11 to 17 .
  • the dotted frame 4A indicates the projected position of the reinforcement plate 4 on the support plate 3 when the reinforcement plate 4 and the support plate 3 are combined.
  • FIG. 11 is a structural diagram of a support plate 3 according to some embodiments.
  • a third recessed structure 53 is provided on the surface of the support plate 3 close to the reinforcing plate 4 .
  • the third recessed structure 53 includes a plurality of second grooves 53a.
  • the plurality of second grooves 53a extend along the third direction B1 and are spaced apart along the fourth direction B2.
  • the third direction B1 and the fourth direction B2 intersect and are both parallel to the support plate.
  • the third direction B1 is perpendicular to the fourth direction B2.
  • the third direction B1 may be parallel to the Y direction in FIGS. 2 and 11
  • the fourth direction B2 may be parallel to the X direction in FIGS. 2 and 11 .
  • the angle between the third direction B1 and the fourth direction B2 may be an obtuse angle or an acute angle.
  • a plurality of second grooves 53a arranged at intervals are provided on the support plate 3, and each second groove 53a forms a cavity between the support plate 3 and the reinforcement plate 4.
  • the actual contact area between the support plate 3 and the reinforcing plate 4 is reduced, thereby reducing the heat conduction path along the Z direction, effectively reducing the heat propagation efficiency in the Z direction.
  • providing the second groove 53a on the support plate 3 can effectively reduce the weight of the support plate 3.
  • the orthographic projection of the at least one second groove 53a on the lead-out part 12 at least partially overlaps with the orthographic projection of the drive chip 2 on the lead-out part 12, which is beneficial to reducing the Z-direction heat propagation efficiency.
  • none of the plurality of second grooves 53 a penetrates the two opposite side surfaces f1 and f2 of the support plate 3 along the third direction B1 , and does not exceed the edges of the opposite sides of the reinforcing plate 4 , that is, does not exceed the two edges (e1 and e2) of the dotted box 4A in Figure 11 .
  • the frame area around the support plate 3 retains its original thickness, which can effectively improve the structural strength of the support plate 3 .
  • Figure 12 is a structural diagram of another support plate according to some embodiments.
  • at least one end of at least one second groove 53 a among the plurality of second grooves 53 a along the third direction B1 exceeds the edge of the reinforcing plate 4 , that is, exceeds the dotted line in FIG. 12
  • the frame 4A faces at least one edge of both sides (e1 and e2).
  • FIG. 12 only shows that all the second grooves 53 a extend beyond one side edge of the reinforcing plate 4 along the third direction B1 (that is, beyond the edge e2 of the dotted frame 4A in FIG. 12 ).
  • the embodiments of the present disclosure are not limited to this.
  • all the second grooves 53a may extend beyond the other edge of the reinforcing plate 4 along the third direction B1 (that is, beyond the edge e1 of the dotted frame 4A in FIG. 12).
  • part of all the second grooves 53a may extend beyond one side edge of the reinforcing plate 4 along the third direction B1 (that is, beyond the edge e2 of the dotted frame 4A), and the other part may extend beyond the reinforcing plate along the third direction B1. 4 (that is, beyond the edge e1 of the dotted box 4A).
  • part of all the second grooves 53a may extend beyond one edge of the opposite sides of the reinforcing plate 4 along the third direction B1 (that is, beyond the edge e2 or e1 of the dotted frame 4A), and the other part may It does not exceed the edge e1 of the dotted frame 4A, nor does it exceed the edge e2 of the dotted frame 4A.
  • all the second grooves 53 a can simultaneously exceed the opposite sides of the reinforcing plate 4 along the third direction B1 (that is, simultaneously exceed the opposite sides of the edge e1 of the dotted frame 4A in FIG. 13 and e2).
  • At least one end of the at least one second groove 53a along the third direction B1 exceeds the edge of the reinforcing plate 4. That is, the at least one second groove 53a can communicate with the outside, which is beneficial to air circulation and accelerates heat dissipation. Effectively avoid heat concentration.
  • Figure 14 is a structural diagram of yet another support plate according to some embodiments.
  • at least one end of at least one of the plurality of second grooves 53 a along the third direction B1 penetrates the two opposite side surfaces f1 and f2 of the support plate 3 . at least one side surface of.
  • FIG. 14 only shows that all the second grooves 53a penetrate one side surface f2 of the support plate 3 along the third direction B1.
  • the embodiments of the present disclosure do not limit this.
  • at least one second groove 53a among the plurality of second grooves 53a may pass through one side surface f2 of the support plate 3 along the third direction B1.
  • the remaining second grooves 53a penetrate the other side surface f1 of the support plate 3 along the third direction B1.
  • all the second grooves 53 a can simultaneously penetrate the two opposite side surfaces f1 and f2 of the support plate 3 along the third direction B1 .
  • At least one end of the second groove 53a along the third direction B1 penetrates at least one of the two opposite side surfaces of the support plate 3 .
  • Such an arrangement can, on the one hand, reduce the actual contact area between the support plate 3 and the reinforcing plate 4 and reduce the heat propagation efficiency in the Z direction.
  • at least one airflow channel along the third direction B1 can be formed to facilitate air circulation between the reinforcement plate 4 and the support plate 3 .
  • the weight of the support plate is further reduced.
  • the reinforcing plate 4 may include the first recessed structure 51 and/or the second recessed structure 52 . That is to say, the recessed structures on the support plate 3 and the reinforcing plate 4 in the display module 100 can be arranged in conjunction with each other, and the specific matching method, arrangement method, and number of each recessed structure are not limited.
  • the support plate 3 of the display module 100 may only include the third recessed structure 53 .
  • the reinforcing plate 4 is not provided with a recessed structure.
  • the support plate 3 of the display module 100 may include a third recessed structure 53 .
  • the reinforcing plate 4 includes a first recessed structure 51 .
  • the support plate 3 of the display module 100 may include a third recessed structure 53 .
  • the reinforcing plate 4 includes a second recessed structure 52 .
  • the support plate 3 of the display module 100 may include a first recessed structure 51 .
  • the reinforcing plate 4 includes a second recessed structure and a third recessed structure.
  • the orthographic projection of the recessed structure on the support plate 3 on the lead-out part 12 and the orthographic projection of the reinforcement plate 4 on the lead-out part 12 at least partially overlap.
  • the orthographic projection of the third recessed structure 53 on the lead-out part 12 at least partially overlaps with the orthographic projection of the first recessed structure 51 on the lead-out part 12, that is, the first recessed structure 51 and the third recessed structure 51
  • the recessed structure 53 forms a cavity.
  • the orthographic projection of the third recessed structure 53 on the lead-out portion 12 at least partially overlaps with the orthographic projection of the second recessed structure 52 on the lead-out portion 12 . That is, the second recessed structure 52 and the third recessed structure 53 form a cavity.
  • the orthographic projection of the recessed structure on the support plate 3 on the lead-out part 12 and the orthographic projection of the reinforcing plate 4 on the lead-out part 12 at least partially overlap, which can further increase the volume of the cavity formed by the recessed structure 5 , which is conducive to further reducing the heat propagation efficiency in the Z direction.
  • FIG. 17 is a structural diagram of yet another support plate according to some embodiments.
  • the support plate 3 is provided with a fourth recessed structure 54.
  • the fourth recessed structure 54 includes a plurality of second holes 54a arranged at intervals.
  • the second holes 54a extend in a direction perpendicular to the support plate 3 and at least penetrate the surface of the support plate 3 close to the reinforcing plate 4 .
  • the actual contact area between the support plate 3 and the reinforcing plate 4 can be reduced to reduce the Z-direction heat propagation efficiency, thereby preventing the display part from being burned. , extend the service life of the display module.
  • using the second hole 54a as the fourth recessed structure 54 can improve the structural strength of the support plate 3 .
  • the orthographic projection of the at least one second hole 54a on the lead-out part 12 at least partially overlaps with the orthographic projection of the drive chip 2 on the lead-out part 12. This setting is helpful to reduce the Z-direction heat propagation efficiency.
  • the second hole 54 a only penetrates the surface of the support plate 3 close to the reinforcing plate 4 . That is, the second hole 54a is a blind hole, and its shape can be a round hole (as shown in Figure 17) or other polygonal holes or special-shaped holes, which can be selected according to actual needs during use.
  • the second hole 54a adopts a blind hole, which can not only effectively reduce the actual contact area between the support plate 3 and the reinforcing plate 4, but also improve the strength of the support plate 3.
  • the second hole 54a also penetrates the surface of the support plate 3 away from the reinforcing plate 4 . That is, the second hole 54 a is a through hole that penetrates the surface of the support plate 3 close to the reinforcement plate 4 and the surface of the support plate 3 away from the reinforcement plate 4 .
  • the second holes 54a are through holes, the surface of the reinforcement plate 4 opposite to the support plate 3 can be connected to the outside air, so that the reinforcement plate 4 can directly dissipate heat through the plurality of second holes 54a, thereby improving the heat dissipation effect. .
  • the plurality of second holes 54 a may include both blind holes and through holes. Such an arrangement can not only reduce the actual contact area between the reinforcing plate 4 and the supporting plate 3 , but also facilitate heat dissipation and improve the strength of the supporting plate 3 .
  • the support plate 3 in some of the above embodiments may only include the third recessed structure 53 , that is, the support plate 3 is only provided with a plurality of second grooves 53 a. It is also possible to include only the fourth recessed structure 54 , that is, only a plurality of second holes 54 a are provided on the support plate 3 . Alternatively, the third recessed structure 53 and the fourth recessed structure 54 may also be included at the same time, that is, the support plate 3 is provided with both a plurality of second grooves 53a and a plurality of second holes 54a, for example, a plurality of second recessed structures 53a and a plurality of second holes 54a. The two holes 54a are provided between two adjacent second grooves 53a.
  • the reinforcing plate 4 may include the first recessed structure 51 and/or the fourth recessed structure 54.
  • Two recessed structures 52 That is to say, the recessed structures on the support plate 3 and the reinforcing plate 4 in the display module 100 can be arranged in conjunction with each other, and the specific matching method, arrangement method, and number of each recessed structure are not limited.
  • the support plate 3 includes the third recessed structure 53 and the fourth recessed structure 54, and the reinforcing plate 4 is not provided with a recessed structure.
  • the support plate 3 of the display module 100 includes a third recessed structure 53 and a fourth recessed structure 54 .
  • the reinforcing plate 4 includes a first recessed structure 51 .
  • the support plate 3 of the display module 100 includes a third recessed structure 53 and a fourth recessed structure 54 .
  • the reinforcing plate 4 includes a second recessed structure 52 .
  • the support plate 3 of the display module 100 includes a third recessed structure 53 and a fourth recessed structure 54 .
  • the reinforcing plate 4 includes a first recessed structure 51 and a second recessed structure 52 .
  • the orthographic projection of the recessed structure on the support plate 3 on the lead-out portion 12 and the orthographic projection of the reinforcement plate 4 on the lead-out portion 12 at least partially overlap.
  • the first recessed structure 51 and the second recessed structure 52 on the reinforcing plate 4 and the third recessed structure 53 and the fourth recessed structure 54 on the support plate 3 can be matched and overlapped with each other to form a cavity.
  • the volume of the cavity formed by the recessed structure 5 can be further increased, which is beneficial to further reducing the heat propagation efficiency in the Z direction.
  • the structure of the support plate 3 in some embodiments of the present disclosure is introduced with reference to FIGS. 11 to 17 .
  • the structure of the combined state of the support plate 3 and the reinforcing plate 4 in some embodiments of the present disclosure will be introduced with reference to Figures 19 to 23.
  • FIG. 18 is a front view of a support plate and a reinforcing plate in a combined state according to some embodiments.
  • the reinforcing plate 4 is provided with a plurality of first grooves 51a.
  • the plurality of first grooves 51a extend along the first direction A1 and are arranged at intervals along the second direction A2.
  • the first direction A1 and the second direction A2 intersect and are both parallel to the reinforcing plate 4 .
  • the support plate 3 is provided with a plurality of second grooves 53a.
  • the plurality of second grooves 53a extend along the third direction B1 and are spaced apart along the fourth direction B2.
  • the third direction B1 and the fourth direction B2 intersect and are both parallel to the support plate 3 .
  • the first direction A1 and the third direction B1 cross each other.
  • the first direction A1 and the third direction B1 are perpendicular to each other.
  • the first direction A1 is parallel to the extension direction of the bending axis of the bending portion 12 (ie, the Y direction in FIG. 2 ), and the third direction B1 is perpendicular to the extension direction of the bending axis (ie, the Y direction in FIG. 2 ).
  • the angle between the first direction A1 and the third direction B1 may also be an obtuse angle or an acute angle.
  • the reinforcement plate 4 is provided with a plurality of first grooves 51a
  • the support plate 3 is provided with a plurality of second grooves 53a.
  • Such an arrangement can, on the one hand, minimize the actual contact area between the support plate 3 and the reinforcing plate 4 and reduce the Z-direction heat propagation efficiency.
  • the plurality of first grooves 51a and the plurality of second grooves 53a intersect with each other and form a grid shape, the air that has absorbed heat between the reinforcement plate 4 and the support plate 3 can be evenly distributed among the plurality of spaces. In the grid formed by the first grooves 51a and the plurality of second grooves 53a, heat concentration is avoided.
  • the plurality of first grooves 51a and the plurality of second grooves 53a extend in different directions and intersect with each other, such reinforcement plate 4 and support plate 3 can support each other and improve the structure of the display module 100. Strength and bending resistance.
  • the orthographic projection of the first groove 51 a and/or the second groove 53 a on the lead-out part 12 at least partially overlaps with the orthographic projection of the driver chip 2 on the lead-out part 12 .
  • the orthographic projection of the intersection position between the first groove 51 a and the second groove 53 a on the lead-out part 12 at least partially overlaps with the orthographic projection of the drive chip 2 on the lead-out part 12 .
  • Such an arrangement can reduce the Z-direction heat propagation efficiency and facilitate heat dissipation.
  • both ends of the plurality of first grooves 51 a do not penetrate the two opposite side surfaces d1 and d2 of the reinforcing plate 4 along the first direction A1 .
  • Both ends of the plurality of second grooves 53a do not exceed the two opposite side surfaces g1 and g2 of the reinforcing plate 4 along the third direction B1.
  • At least one first groove 51a among the plurality of first grooves 51a may penetrate through the two opposite side surfaces d1 and d2 of the reinforcing plate 4 along the first direction A1. at least one side surface of. Both ends of the plurality of second grooves 53 a do not exceed the two opposite side surfaces g1 and g2 of the reinforcing plate 4 .
  • at least one second groove 53a among the plurality of second grooves 53a may extend beyond at least one of the two opposite side surfaces (g1 and g2) of the reinforcing plate 4 along the third direction B1.
  • both ends of the plurality of first grooves 51a do not penetrate the two opposite side surfaces d1 and d2 of the reinforcing plate 4 along the first direction A1. This example does not impose too many restrictions on this.
  • Figure 19 is a front view of another combined state of a support plate and a reinforcing plate according to some embodiments.
  • at least one first groove 51a among the plurality of first grooves 51a penetrates at least one of the two opposite side surfaces (d1 and d2) of the reinforcing plate 4 along the first direction A1.
  • At least one of the plurality of second grooves 53a extends beyond at least one of the two opposite side surfaces (g1 and g2) of the reinforcing plate 4 along the third direction B1.
  • FIG. 19 only shows that all the first grooves 51a penetrate the two opposite side surfaces d1 and d2 of the reinforcing plate 4 along the first direction A1, and all the second grooves 53a are along the third direction B1. Beyond the two opposite side surfaces g1 and g2 of the reinforcing plate 4 .
  • embodiments of the present disclosure are not limited thereto.
  • first grooves 51a among all the first grooves 51a penetrates the two opposite side surfaces d1 and d2 of the reinforcing plate 4 along the first direction A1, and the other part of the first grooves 51a has both ends.
  • the two opposite side surfaces d1 and d2 of the reinforcing plate 4 are not penetrated.
  • a part of the second grooves 53a among all the second grooves 53a extends beyond the two opposite side surfaces g1 and g2 of the reinforcing plate 4 along the third direction B1, and the two ends of the other part of the second grooves 53a do not extend beyond the reinforcing plate 4
  • part of the first grooves 51a among all the first grooves 51a may penetrate one side surface d1 of the reinforcement plate 4 along the first direction A1, and the other part of the first grooves 51a may penetrate through the reinforcement plate 4 along the first direction A1.
  • a part of the second grooves 53a among all the second grooves 53a extends beyond one side surface g1 of the reinforcing plate 4 along the third direction B1, and the other part of the second grooves 53a extends beyond the other side surface g1 of the reinforcing plate 4 along the third direction B1.
  • the plurality of first grooves 51a and the plurality of second grooves 53a intersect with each other, and at least one of the first grooves 51a or the second grooves 53a is in communication with the outside air, that is, the plurality of first grooves 51a and the second grooves 53a are in communication with the outside air.
  • the fluid channel formed by the groove 51a and the plurality of second grooves 53a can communicate with external air. In this way, the heat-carrying air between the reinforcement plate 4 and the support plate 3 can flow to the outside, which is beneficial to heat dissipation and avoids heat concentration.
  • Figure 22 is a front view of yet another combination of a support plate and a reinforcing plate according to some embodiments.
  • at least one first groove 51 a among the plurality of first grooves 51 a penetrates at least one of the two opposite side surfaces (d1 and d2) of the reinforcing plate 4 along the first direction A1.
  • At least one end of at least one second groove 53a among the plurality of second grooves 53a along the third direction B1 penetrates at least one of the two opposite side surfaces (f1 and f2) of the support plate 3.
  • FIG. 22 only shows that all the first grooves 51a simultaneously penetrate the two opposite side surfaces (d1 and d2) of the reinforcing plate 4 along the first direction A1. All the second grooves 53a simultaneously penetrate the two opposite side surfaces (f1 and f2) of the support plate 3 along the third direction B1.
  • embodiments of the present disclosure are not limited thereto.
  • part of the first grooves 51a among all the first grooves 51a may penetrate through one side surface d1 of the reinforcement plate 4 along the first direction A1, and the other part of the first grooves 51a may penetrate through the side surface d1 of the reinforcement plate 4 along the first direction A1.
  • a part of the second grooves 53a among all the second grooves 53a penetrates through one side surface f1 of the support plate 3 along the third direction B1, and the other part of the second grooves 53a penetrates through the other side surface f1 of the support plate 3 along the third direction B1.
  • the cross-sectional shapes of the first groove 51a and the second groove 53a may be rectangular (as shown in Figures 20 and 21, where Figure 20 shows the combined state of the support plate and the reinforcement plate in Figure 19 21 is a bottom view of the combined state of the support plate and the reinforcing plate in Figure 19.), trapezoid, inverted trapezoid, etc., and the cross-sectional shapes of the first groove 51a and the second groove 53a can be the same or different. If the cross-sectional shapes of the first groove 51a and the second groove 53a are rectangular or trapezoidal, it has the advantage of facilitating etching processing.
  • the cross-sectional shapes of the first groove 51a and the second groove 53a are inverted trapezoids, since the opening of the inverted trapezoid is larger, the actual contact area between the support plate 3 and the reinforcing plate 4 can be more effectively reduced to reduce heat loss. Z-direction transfer efficiency.
  • Figure 23 is a front view of yet another combined state of a support plate and a reinforcing plate according to some embodiments.
  • the reinforcing plate 4 is provided with a plurality of first holes 52a.
  • the plurality of first holes 52 a at least penetrate the surface of the reinforcing plate 4 close to the supporting plate 3 .
  • the plurality of first holes 52a are arranged in multiple rows, and the plurality of first holes 52a are arranged in multiple columns.
  • a plurality of second holes 54a are provided on the support plate 3 .
  • the plurality of second holes 54a at least penetrate the surface of the support plate 3 close to the reinforcing plate 4 .
  • the plurality of second holes 54a are arranged in multiple rows, and the plurality of second holes 54a are arranged in multiple columns. In the column direction, a row of first holes 52a and a row of second holes 54a are alternately arranged, and an adjacent row of first holes 52a and a row of second holes 54a are staggered.
  • the orthographic projection of the at least one first hole 52a and/or the at least one second hole 54a on the lead-out part 12 at least partially overlaps with the orthographic projection of the drive chip 2 on the lead-out part 12.
  • both the first hole 52a and the second hole 54a are blind holes.
  • the first hole 52a penetrates the surface of the reinforcing plate 4 close to the supporting plate 3.
  • the second hole 54a penetrates the surface of the support plate 3 close to the reinforcing plate 4 .
  • both the first hole 52a and the second hole 54a are through holes. Both ends of the first hole 52a penetrate respectively through the surface of the reinforcing plate 4 close to the support plate 3 and the surface away from the support plate 3 . Both ends of the second hole 54a penetrate respectively through the surface of the support plate 3 close to the reinforcing plate 4 and the surface far away from the reinforcing plate 4 .
  • the plurality of first holes 52a may include both blind holes and through holes.
  • the plurality of second holes 54a may include both blind holes and through holes.
  • This embodiment reduces the actual contact area between the support plate 3 and the reinforcement plate 4 by arranging the first hole 52a and the second hole 54a, which can not only reduce the heat transfer efficiency in the Z direction, but also help improve the support plate 3 and reinforcement. Structural strength of plate 4.
  • the reinforcing plate 4 may only include the first recessed structure 51 or only the second recessed structure 52 .
  • it includes both the first recessed structure 51 and the second recessed structure 52, that is, the reinforcing plate 4 is provided with both a plurality of first grooves 51a and a plurality of first holes 52a, for example, a plurality of first recessed structures 51a and a plurality of first holes 52a.
  • the hole 52a is provided between two adjacent first grooves 51a.
  • the support plate 3 may include only the third recessed structure 53 or only the fourth recessed structure 54 .
  • the third recessed structure 53 and the fourth recessed structure 54 are included simultaneously, that is, the support plate 3 is provided with both a plurality of second grooves 53a and a plurality of second holes 54a, for example, a plurality of second recessed structures 53a and a plurality of second holes 54a.
  • the hole 54a is provided between two adjacent second grooves 53a.
  • the area of the overlapping area between the orthographic projection of the reinforcing plate 4 on the display part 11 and the orthographic projection of the supporting plate 3 on the display part 11 is greater than or equal to the supporting plate 3 1/4 of the orthographic projection area on the display part.
  • the area of the overlapping area between the orthographic projection of the reinforcing plate 4 on the display part 11 and the orthographic projection of the supporting plate 3 on the display part 11 is approximately equal to the area of the orthographic projection of the supporting plate 3 on the display part 11 1/4, 1/3, 1/2 or 3/4.
  • the heat generated by the driving chip 2 can pass through the reinforcing plate. 4 is evenly distributed to the support plate 3 to avoid heat concentration, improve heat dissipation efficiency, and thereby reduce the impact of the heat generated by the driver chip 2 on the life of the flexible display panel 1.
  • the size of the overlapping area between the orthographic projection of the reinforcing plate 4 on the display part 11 and the orthographic projection of the supporting plate 3 on the display part 11 may not be limited, as long as the entire area is It is sufficient to make the overlapping area as large as possible within the space allowed by the machine.
  • the display module 100 further includes a first glue layer 91 .
  • the first glue layer 91 is located between the support plate 3 and the reinforcing plate 4 .
  • the first glue layer 91 includes a hollow area 91a.
  • the orthographic projection of the driver chip 2 on the first adhesive layer 91 is located in the hollow area 91a.
  • the first adhesive layer 91 is double-sided adhesive tape.
  • the reinforcing plate 4 includes a plurality of first grooves 51a
  • the support plate 3 includes a plurality of second grooves 53a, a plurality of first grooves 51a and a plurality of second grooves 53a. At least part of the orthographic projection on the first glue layer 91 is located in the hollow area 91a.
  • the reinforcing plate 4 includes a plurality of first holes 52a
  • the support plate 3 includes a plurality of second holes 54a
  • the plurality of first holes 52a and the plurality of second holes 54a are on the first glue layer 91 At least part of the orthographic projection is located in the hollow area 91a.
  • the first glue layer 91 is used to connect the support plate 3 and the reinforcement plate 4 of the display module 100.
  • a bridge for heat transfer is formed, so a hollow area 91a is provided on the first glue layer 91.
  • Such an arrangement can tightly connect the support plate 3 and the reinforcement plate 4 without increasing the actual contact area between the support plate 3 and the reinforcement plate 4, which is more conducive to reducing the Z-direction heat propagation efficiency.
  • the display module 100 further includes a second glue layer 92 and a third glue layer 93 .
  • the second glue layer 92 is located between the support plate 3 and the display part 11 .
  • the third glue layer 93 is located between the reinforcing plate 4 and the lead-out portion 12 of the flexible display panel 1 .
  • both the second glue layer 92 and the third glue layer 91 are double-sided tape.
  • the support plate 3 of the display module 100 is connected to the display part 11 through the second glue layer 92, and the reinforcing plate 4 is connected to the lead-out part 12 through the third glue layer 93, thereby improving the performance of the display module. Structural stability of Group 100.
  • the display module 100 further includes a flexible circuit board 6 and a fourth adhesive layer 94 .
  • the flexible circuit board 6 is located on the side of the reinforcing plate 4 away from the display part 11 . And the flexible circuit board 6 is bound and connected to the edge of the lead-out portion 12 away from the bending portion 13 .
  • the fourth adhesive layer 94 is located between the flexible circuit board 6 and the reinforcement board 4 .
  • the fourth adhesive layer 94 is double-sided adhesive tape.
  • the flexible circuit board 6 of the display module 100 is fixed on the reinforcement plate 4 through the fourth adhesive layer 94, which can make the structure of the display module 100 more compact.
  • the display module 100 further includes a polarizer 7 , a protective cover 8 and a fifth adhesive layer 95 .
  • the polarizer 7 is provided on the display side c2 of the display portion 11 of the flexible display panel 1 .
  • the protective cover 8 is located on the side of the polarizer 7 away from the display part 11 .
  • the fifth adhesive layer 95 is located between the polarizer 7 and the protective cover 8 .
  • the fifth glue layer 95 is OCA (Optically Clear Adhesive) optical glue.
  • the polarizer 7 provided on the display side c2 of the display portion 11 of the display module 100 can reduce reflected light, thereby improving the clarity of the display module 100 .
  • the protective cover 8 can protect other devices such as the flexible display panel 1 from being scratched, and can also prevent water vapor and other impurities from entering the display module 100 , thereby extending the service life of the display module 100 .
  • some embodiments of the present disclosure provide a display module 100 and a display device 200 .
  • the display device 200 includes a display module 100
  • the display module 100 includes a flexible display panel 1 , a driver chip 2 , a support plate 3 and a reinforcing plate 4 .
  • the recessed structure 5 By arranging the recessed structure 5 on at least one of the two opposing surfaces of the reinforcement plate 4 and the support plate 3 , the actual contact surface between the support plate 3 and the reinforcement plate 4 is reduced, thereby effectively reducing the risk of the drive chip 2
  • the heat transfer efficiency along the Z direction prevents the display part 11 from being burned by the heat of the driver chip 2, thereby improving the display performance of the display module 100 and extending the service life of the display module 100.
  • the provision of the recessed structure 5 also plays a positive role in solving the problem of excessive weight of the display module 100 .
  • the display device 200 since the display device 200 includes the display module 100 in any of the above embodiments, the display device 200 has all the beneficial effects as described above.

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Abstract

公开了一种显示模组，包括显示面板、至少一个驱动芯片、支撑板和加强板。显示面板包括显示部分、弯曲部分和引出部分。显示部分具有显示侧和非显示侧。至少一个驱动芯片安装于引出部分远离显示部分的一侧。支撑板位于显示部分的非显示侧。加强板位于支撑板与引出部分之间。其中，加强板与支撑板的两个相对表面中的至少一个表面上设置有凹陷结构，至少一个表面上的凹陷结构在引出部分上的正投影，与至少一个驱动芯片在引出部分上的正投影至少部分地交叠。

Description

显示模组及显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种显示模组及显示装置。
背景技术
随着显示技术的发展，各种显示装置的屏占比越来越大，为了把显示屏的尺寸做到极致，还出现了全面屏、折叠屏等产品。其中，OLED(有机发光二极管，Organic Light-Emitting Diode)显示装置是当今显示技术领域的热点之一，由于OLED显示装置具备不需背光源、对比度高、厚度薄、视角广、反应速度快、可用于挠曲性面板、构造及制程较简单等优点，所以得到了越来越广泛的应用。
发明内容
一方面，提供一种显示模组。所述显示模组包括显示面板、驱动芯片、支撑板和加强板。所述显示面板包括显示部分、弯曲部分和引出部分。所述弯曲部分连接所述显示部分和所述引出部分。所述显示部分具有显示侧和非显示侧，所述非显示侧为所述显示侧的对侧。所述引出部分位于所述显示部分的非显示侧。所述至少一个驱动芯片安装于所述引出部分远离所述显示部分的一侧。所述支撑板位于所述显示部分的非显示侧。所述加强板位于所述支撑板与所述引出部分之间。其中，所述加强板与所述支撑板的两个相对表面中的至少一个表面上设置有凹陷结构，至少一个表面上的所述凹陷结构在所述引出部分上的正投影，与所述至少一个驱动芯片在所述引出部分上的正投影至少部分地交叠。
在一些实施例中，所述驱动芯片的数量为两个或者两个以上。至少一个表面上的所述凹陷结构在所述引出部分上的正投影，与各个所述驱动芯片在所述引出部分上的正投影至少部分地交叠。
在一些实施例中，所述加强板靠近所述支撑板的表面上设置有第一个所述凹陷结构。第一个所述凹陷结构包括多个第一凹槽。所述多个第一凹槽沿第一方向延伸、且沿第二方向间隔排列。所述第一方向和所述第二方向相交叉，且均平行于所述加强板。
在一些实施例中，所述加强板靠近所述支撑板的表面上设置有第一个所述凹陷结构。第一个所述凹陷结构包括多个第一凹槽，所述多个第一凹槽沿第二方向延伸、且沿所述第二方向间隔排列。第一个所述凹陷结构中的所述第一凹槽的数量大于或等于所述驱动芯片的数量。每个所述驱动芯片在所述 引出部分上的正投影与至少一个所述第一凹槽在所述引出部分上的正投影至少部分交叠。
在一些实施例中，所述多个第一凹槽还沿第一方向间隔排列。所述第一方向和所述第二方向相交叉，且均平行于所述加强板。
在一些实施例中，所述多个第一凹槽中的至少一个第一凹槽沿所述第一方向贯通所述加强板的相对的两个侧表面中的至少一个侧表面。
在一些实施例中，所述加强板上设置有第二个所述凹陷结构。第二个所述凹陷结构包括多个间隔排列的第一孔。第一孔沿垂直于所述加强板的方向延伸，且至少贯穿所述加强板靠近所述支撑板的表面。
在一些实施例中，所述第一孔还贯穿所述加强板远离所述支撑板的表面。
在一些实施例中，所述支撑板靠近所述加强板的表面上设置有第三个所述凹陷结构。第三个所述凹陷结构包括多个第二凹槽。所述多个第二凹槽沿第三方向延伸、且沿第四方向间隔排列。所述第三方向和所述第四方向相交叉，且均平行于所述支撑板。
在一些实施例中，所述多个第二凹槽中的至少一个第二凹槽沿所述第三方向的至少一端，超出所述加强板的边缘。
在一些实施例中，所述多个第二凹槽中的至少一个第二凹槽沿所述第三方向贯通所述支撑板的相对的两个侧表面中的至少一个侧表面。
在一些实施例中，在所述加强板靠近所述支撑板的表面上设置有第一个所述凹陷结构，第一个所述凹陷结构包括多个第一凹槽的情况下：所述多个第二凹槽的延伸方向与所述多个第一凹槽的延伸方向相交叉。
在一些实施例中，所述多个第二凹槽沿平行于所述弯曲部分的弯曲轴线的方向延伸，所述多个第一凹槽沿垂直于所述弯曲轴线的方向延伸。
在一些实施例中，所述支撑板上设置有第四个所述凹陷结构。第四个所述凹陷结构包括多个间隔排列的第二孔。第二孔沿垂直于所述支撑板的方向延伸，且至少贯穿所述支撑板靠近所述加强板的表面。
在一些实施例中，所述第二孔还贯穿所述支撑板远离所述加强板的表面。
在一些实施例中，在所述加强板靠近所述支撑板的表面上设置有第二个所述凹陷结构，第二个所述凹陷结构包括多个第一孔的情况下：所述多个第二孔排列成多行，且所述多个第一孔排列成多行。在列方向上，一行第一孔与一行第二孔交替设置，且相邻的一行第一孔与一行第二孔错开设置。
在一些实施例中，所述加强板在所述显示部分上的正投影与所述支撑板在所述显示部分上的正投影之间的重叠区域的面积，大于或等于所述支撑板 在所述显示部分上的正投影面积的1/4。
在一些实施例中，所述显示模组还包括第一胶层。第一胶层位于所述支撑板与所述加强板之间。其中，所述第一胶层包括镂空区域。所述驱动芯片在所述第一胶层上的正投影位于所述镂空区域。
在一些实施例中，所述显示模组还包括第二胶层和第三胶层。第二胶层位于所述支撑板与所述显示部分之间。第三胶层位于所述加强板与所述显示面板的引出部分之间。
在一些实施例中，所述显示模组还包括柔性电路板和第四胶层。柔性电路板位于所述加强板远离所述显示部分的一侧。且所述柔性电路板与所述引出部分远离所述弯曲部分的边缘绑定连接。第四胶层位于所述柔性电路板与所述加强板之间。
在一些实施例中，所述显示模组还包括偏光片、保护盖板和第五胶层。偏光片设置于所述显示面板的显示部分的显示侧。保护盖板位于所述偏光片远离所述显示部分的一侧。第五胶层位于所述偏光片与所述保护盖板之间。
另一方面，提供一种显示装置。所述显示装置包括如上述任一实施例所述的显示模组。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸的限制。
图1A为根据一些实施例的一种显示装置的示意图；
图1B为根据一些实施例的另一种显示装置的显示区被灼伤的示意图；
图2为根据一些实施例的一种显示模组的结构图；
图3A为根据一些实施例的一种显示模组的示意图；
图3B为根据一些实施例的另一种显示模组的示意图；
图3C为根据一些实施例的又一种显示模组的示意图；
图4为根据一些实施例的一种加强板的结构图；
图5为根据一些实施例的又一种显示模组的结构图；
图6为根据一些实施例的又一种显示模组的结构图；
图7为根据一些实施例的另一种加强板的结构图；
图8为根据一些实施例的又一种加强板的结构图；
图9为根据一些实施例的又一种加强板的结构图；
图10为根据一些实施例的又一种加强板的结构图；
图11为根据一些实施例的一种支撑板的结构图；
图12为根据一些实施例的另一种支撑板的结构图；
图13为根据一些实施例的又一种支撑板的结构图；
图14为根据一些实施例的又一种支撑板的结构图；
图15为根据一些实施例的又一种支撑板的结构图；
图16为根据一些实施例的又一种支撑板的结构图；
图17为根据一些实施例的又一种支撑板的结构图；
图18为根据一些实施例的一种支撑板与加强板组合状态的主视图；
图19为根据一些实施例的另一种支撑板与加强板组合状态的主视图；
图20为图19中支撑板与加强板组合状态的右视图；
图21为图19中支撑板与加强板组合状态的仰视图；
图22为根据一些实施例的又一种支撑板与加强板组合状态的主视图；
图23为根据一些实施例的又一种支撑板与加强板组合状态的主视图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在 本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本文中“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“平行”、“垂直”包括所阐述的情况以及与所阐述的情况相近似的情况，该相近似的情况的范围处于可接受偏差范围内，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。例如，“平行”包括绝对平行和近似平行，其中近似平行的可接受偏差范围例如可以是5°以内偏差；“垂直”包括绝对垂直和近似垂直，其中近似垂直的可接受偏差范围例如也可以是5°以内偏差。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
图1A为根据一些实施例的一种显示装置的示意图，图2为根据一些实施例的一种显示模组的结构图。
本公开的一些实施例提供了一种显示装置200。参阅图1A，显示装置200包括显示模组100。如图2所示，显示模组100包括柔性显示面板1和驱动芯片2。驱动芯片2用于驱动柔性显示面板1进行显示。
示例性的，柔性显示面板1可以为电致发光显示面板或光致发光显示面板。在柔性显示面板1为电致发光显示面板的情况下，电致发光显示面板可以为有机电致发光显示面板(Organic Light-Emitting Diode，简称OLED)或量子点电致发光显示面板(Quantum Dot Light Emitting Diodes，简称QLED)。在柔性显示面板1为光致发光显示面板的情况下，光致发光显示面板可以为量子点光致发光显示面板。
可以理解地，上述显示装置200可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是图像的任何装置。
需要说明的是，预期的所述显示装置200可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、 无线装置、个人数据助理(Personal Digital Assistant，简称PDA)、手持式或便携式计算机、全球定位系统(Global Positioning System，简称GPS)接收器/导航器、相机、动态图像专家组(Moving Picture Experts Group 4，简称MP4)视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
图1B为根据一些实施例的另一种显示装置的显示区被灼伤的示意图。在一些实现方式中，参阅图1B，显示装置200A包括显示模组100A，显示模组100A包括柔性显示面板和驱动芯片。在显示状态时，显示模组100A的驱动芯片工作会产生热量。受温度影响，柔性显示面板的与驱动芯片对应的显示区域101中，蓝色子像素相对其他颜色的子像素，寿命衰减加快，发光效率衰减，进而亮度降低。导致显示区域101的显示产生色偏，显示效果由正常变为发黄，甚至造成灼伤，严重时甚至还会导致柔性显示面板整体失效。
基于此，本公开的一些实施例提供一种显示模组100。参阅图2，显示模组100包括柔性显示面板1、至少一个驱动芯片2、支撑板3和加强板4。可以理解地，该显示模组100可以应用于上述任一种显示装置中。
如图2所示，柔性显示面板1包括显示部分11、引出部分12和弯曲部分13。弯曲部分13连接显示部分11和引出部分12。显示部分11具有显示侧c2和非显示侧c1，显示侧c2用于显示图像，非显示侧c1为显示侧c2的对侧。引出部分12位于显示部分11的非显示侧c1。
驱动芯片2安装于引出部分12远离显示部分11的一侧，驱动芯片2用于驱动柔性显示面板1的显示部分11进行显示。
支撑板3位于显示部分11的非显示侧c1，支撑板3用于支撑柔性显示面板1的显示部分11。
示例性的，支撑板3的材质包括不锈钢(SUS)或钛合金等。当然，支撑板3也可以选择其他具有支撑功能的材质，此处不做过多的限制。
加强板4位于支撑板3与引出部分12之间，加强板4用于支撑柔性显示面板1的引出部分12。
示例性的，加强板4的材质包括铝合金、铜、不锈钢、银或钛合金等。当然，加强板4也可以选择其他具有加强支撑功能的材质，此处也不做过多的限制。
需要说明的是，显示模组100在显示状态时，驱动芯片2产生的热量能够沿Z方向传播至显示部分11上的、与驱动芯片2对应的区域，也能够在加强板4及支撑板3上沿X方向、Y方向扩散。由于支撑板3与加强板4之间的实际接触面积较大，且显示模组100的Z方向距离较短，所以驱动芯片2产生的热量沿Z方向的传递效率较高。容易使显示部分11与驱动芯片2对应区域中的子像素(尤其是蓝色子像素)受温度影响亮度降低，导致这片区域的显示产生色偏甚至发黄。
继续参阅图2，本公开一些实施例提供的显示模组100，在加强板4与支撑板3的两个相对表面中的至少一个表面上设置有凹陷结构5。至少一个表面上的凹陷结构5在引出部分12上的正投影，与至少一个驱动芯片2在引出部分12上的正投影至少部分地交叠。
可以理解地，在一些示例中，凹陷结构5设置在加强板4的朝向支撑板3的表面上。在另一些示例中，凹陷结构5设置在支撑板3的朝向加强板4的表面上。在又一些示例中，加强板4与支撑板3的两个相对表面上均可以设置有凹陷结构5。
本公开一些实施例中提供的显示模组100，在加强板4与支撑板3之间的两个相对表面中的至少一个表面上设置有凹陷结构5，减小了支撑板3与加强板4之间的实际接触面积，即减小了热量沿Z方向传递的通道，从而有效的降低了热量沿Z方向的传递效率。驱动芯片2产生的热量沿Z方向，向显示部分12传递的过程中，当到达凹陷结构5处时，热传导的路径被阻断，从而进一步降低了热量的Z方向传递效率。
综上，本实施例的显示模组100能够有效的降低驱动芯片2的温度对柔性显示面板1的影响，防止显示部分11被驱动芯片2的热量灼伤，从而有效的提高了显示模组100的显示性能，延长显示模组100的使用寿命。此外，通过设置凹陷结构5还对解决显示模组100重量过大的问题有积极作用。
图3A为根据一些实施例的一种显示模组的示意图。图3B为根据一些实施例的另一种显示模组的示意图。图3C为根据一些实施例的又一种显示模组的示意图。
在本公开的一些实施例中，“至少一个表面上的凹陷结构5在引出部分12上的正投影，与至少一个驱动芯片2在引出部分12上的正投影至少部分地交叠。”具体包括以下几种情况：
第一种：如图3A所示，当驱动芯片2的数量为1个时，至少一个表面上的凹陷结构5在引出部分12上的正投影，与一个驱动芯片2在引出部分12 上的正投影至少部分地交叠。也即驱动芯片2的对应位置处，加强板4与支撑板3的两个相对表面中的至少一个表面上设置有凹陷结构5，利用凹陷结构5防止显示部分11被驱动芯片2的热量灼伤，延长显示模组100的使用寿命。
第二种：如图3B所示，当驱动芯片2的数量为两个或者两个以上时，至少一个表面上的凹陷结构5在引出部分12上的正投影，与一个驱动芯片2在引出部分12上的正投影至少部分地交叠。或当驱动芯片2的数量为多个时，至少一个表面上的凹陷结构5在引出部分12上的正投影，与两个或两个以上驱动芯片2在引出部分12上的正投影至少部分地交叠。该驱动芯片2对应位置处，在加强板4与支撑板3的两个相对表面中的至少一个表面上设置有凹陷结构5。从而防止该部分驱动芯片2的热量灼伤显示部分11，一定程度的延长显示模组100的使用寿命。
第三种：如图3C所示，当驱动芯片2的数量为两个或者两个以上时，至少一个表面上的凹陷结构5在引出部分12上的正投影，与各个驱动芯片2在引出部分12上的正投影至少部分地交叠。也即每个驱动芯片2的对应位置处，均在加强板4与支撑板3的两个相对表面中的至少一个表面上设置有凹陷结构5。更好的利用凹陷结构5防止显示部分11被驱动芯片2的热量灼伤，延长显示模组100的使用寿命。
下面，结合图4～图9，对本公开一些实施例中的加强板4的结构进行介绍。
图4为根据一些实施例的一种加强板的结构图。在本公开的一些实施例中，参阅图4，加强板4靠近支撑板3的表面上设置有第一个凹陷结构51。第一个凹陷结构51包括多个第一凹槽51a。多个第一凹槽51a沿第一方向A1延伸、且沿第二方向A2间隔排列。第一方向A1和第二方向A2相交叉，且均平行于加强板。
在一些示例中，参阅图4，第一方向A1与第二方向A2相互垂直。示例性的，第一方向A1可以为与图2、图4中的X方向平行，第二方向A2可以与图2、图4中的Y方向平行。
可以理解的是，在其他的示例中，第一方向A1与第二方向A2的夹角也可以是钝角或锐角。
本公开一些实施例的显示模组100，在加强板4上设置有多个间隔排列的第一凹槽51a，每个第一凹槽51a在支撑板3与加强板4之间形成一个空腔。如此设置，一方面减小了加强板4与支撑板3的实际接触面积，并阻断了部分热量的Z方向传导的路径，进而有效的降低了热量的Z方向传播效率。另 一方面，在加强板4上设置第一凹槽51a，还能够有效的减轻加强板4的重量。
示例性的，至少一个第一凹槽51a在引出部分12上的正投影与驱动芯片2在引出部分12上的正投影至少部分地交叠，有利于降低热量Z方向传播效率。
图5为根据一些实施例的又一种显示模组的结构图。在本公开的一些实施例中，参阅图5，加强板4靠近支撑板3的表面上设置有第一个凹陷结构51。第一个凹陷结构51包括多个第一凹槽51a。多个第一凹槽51a沿第二方向A2延伸、且沿第二方向A2间隔排列。第一个凹陷结构51中的第一凹槽51a的数量大于或等于驱动芯片2的数量。每个驱动芯片2在引出部分12上的正投影，与至少一个第一凹槽51a在引出部分12上的正投影至少部分交叠。
其中，图5以第一个凹陷结构51中的第一凹槽51a的数量大于驱动芯片2的数量为例进行示意。例如，第一个凹陷结构51中包括4个第一凹槽51a，驱动芯片2的数量为2个，1个驱动芯片2对应2个第一凹槽51a。也即，每个驱动芯片2在引出部分12上的正投影，与2个第一凹槽51a在引出部分12上的正投影至少部分交叠。利用第一凹槽51a在支撑板3与加强板4之间形成空腔。减小加强板4与支撑板3的实际接触面积，并阻断部分热量的Z方向传导的路径，进而有效的降低了热量的Z方向传播效率。防止显示部分11被驱动芯片2的热量灼伤，延长显示模组100的使用寿命。
在一些示例中，参阅图5，第二方向A2可以与图2、图5中的Y方向平行。
图6为根据一些实施例的又一种显示模组的结构图。在本公开的一些实施例中，参阅图6，多个第一凹槽51a还沿第一方向A1间隔排列。第一方向A1和第二方向A2相交叉，且均平行于加强板4。
其中，图6以第一个凹陷结构51中的第一凹槽51a的数量大于驱动芯片2的数量为例进行示意。例如，第一个凹陷结构51中包括8个第一凹槽51a，驱动芯片2的数量为2个，1个驱动芯片2对应4个第一凹槽51a。4个第一凹槽51a阵列排布在1个驱动芯片2对应的位置处，利用第一凹槽51a在支撑板3与加强板4之间形成空腔。减小加强板4与支撑板3的实际接触面积，并阻断部分热量的Z方向传导的路径，进而有效的降低了热量的Z方向传播效率。防止显示部分11被驱动芯片2的热量灼伤，延长显示模组100的使用寿命。
在一些示例中，参阅图6，第一方向A1与第二方向A2相互垂直。示例性的，第一方向A1可以为与图2、图6中的X方向平行，第二方向A2可以 与图2、图6中的Y方向平行。
可以理解的是，在其他的示例中，第一方向A1与第二方向A2的夹角也可以是钝角或锐角。
在一些实施例中，请继续参阅图5和图6所示，第一凹槽51a的至少一个边缘在引出部分12上正投影，位于驱动芯片2在引出部分12上的正投影的外部。更有利于增大第一凹槽51a在支撑板3与加强板4之间形成的空腔容积。更大程度的减小加强板4与支撑板3的实际接触面积，并阻断部分热量的Z方向传导的路径，进而更有效的降低了热量的Z方向传播效率。可以理解的是，在另一些实施例中，第一凹槽51a在引出部分12上正投影，位于驱动芯片2在引出部分12上的正投影的内。
在一些示例中，参阅图4，多个第一凹槽51a均不贯通加强板4沿第一方向A1的两个相对侧表面(d1和d2)。本示例中的多个第一凹槽51a不贯通加强板4的相对的两个侧表面(d1和d2)，使加强板4的四周具有连贯的边框区，且边框区保持了原有厚度，有效的提高加强板4的结构强度。
图7为根据一些实施例的另一种加强板的结构图。在另一些示例中，参阅图7，多个第一凹槽51a中的至少一个第一凹槽51a沿第一方向A1贯通加强板4的相对的两个侧表面(d1和d2)中的一个侧表面。
可以理解的是，图7仅示意出了全部的第一凹槽51a沿第一方向A1仅贯通加强板4的一个侧表面d1。但本公开的实施例对此不作限制。例如，也可以是全部的第一凹槽51a沿第一方向A1仅贯通加强板4的另一个侧表面d2。或者，还可以是全部的第一凹槽51a中一部分沿第一方向A1贯通加强板4的一个侧表面d1，另一部分沿第一方向A1贯通加强板4的一个另一个侧表面d2。或者还可以是一部分第一凹槽51a沿第一方向A1贯通加强板4的相对的两个侧表面(d1和d2)中的一个侧表面，其余第一凹槽51a既不贯通加强板的侧表面d1也不贯通加强板的另一个侧表面d2。
在上述一些示例中的多个第一凹槽51a中，至少一个第一凹槽51a能够与外部连通。如此设置，有利于空气流通，使加强板4与支撑板3之间的热量，能够随空气的流动排出，有利于散热，有效避免热力集中。
图8为根据一些实施例的又一种加强板的结构图。在又一些示例中，参阅图8，多个第一凹槽51a沿第一方向A1同时贯通加强板4的相对的两个侧表面(d1和d2)。本示例中的多个第一凹槽51a在加强板4的朝向支撑板3的表面上形成了多个沿第一方向A1的气流通道，有利于加强板4与支撑板3之间的空气流通，使驱动芯片2产生的部分热量能够较快的被流动的空气所 带走，进而使更少的热量被传递到支撑板3，热量不容易集中到柔性显示面板1的显示部分11中对应驱动芯片2的位置处。
图9为根据一些实施例的又一种加强板的结构图。在本公开的一些实施例中，参阅图9，加强板上设置有第二个凹陷结构52。第二个凹陷结构52包括多个间隔排列的第一孔52a。第一孔52a沿垂直于加强板4的方向延伸，且至少贯穿加强板4靠近支撑板3的表面。本实施例中，通过在加强板4上设置多个第一孔52a来减少加强板4与支撑板3的实际接触面积，以降低热量的Z方向传播效率，防止显示部分11被灼伤，以延长显示模组100的使用寿命。并且采用第一孔52a作为第二个凹陷结构52能够提高加强板4的结构强度。
示例性的，至少一个第一孔52a在引出部分12上的正投影与驱动芯片2在引出部分12上的正投影至少部分的交叠，有利于降低热量的Z方向传播效率。
在一些示例中，参阅图9，第一孔52a仅贯穿加强板4靠近支撑板3的表面，即第一孔52a为盲孔。第一孔52a的形状可以为圆孔(如图9所示)或其他多边形孔以及异形孔，在使用时可以根据实际需求任意选择。在本示例中，第一孔52a采用盲孔，既能有效的减少支撑板3与加强板4之间的实际接触面积，又能够提高加强板4的结构强度。
在另一些示例中，第一孔52a还贯穿加强板4远离支撑板3的表面。即本示例中的第一孔52a为通孔，贯穿加强板4靠近支撑板3的表面及远离支撑板3的表面。这样设置既能实现减小加强板4与支撑板3的实际接触面积，又有利于散热。
需要说明的是，在其他示例中，多个第一孔52a中，可以既包括盲孔又包括通孔。如此设置，既能实现降低加强板4与支撑板3实际接触面积，又有利于散热，同时又能保证加强板4的强度。
图10为根据一些实施例的又一种加强板的结构图。在本公开的一些实施例中，参阅图10，加强板上设置有第一个凹陷结构51和第二个凹陷结构52。沿第一方向A1或沿第二方向A2，至少一个第一个凹陷结构51和至少一个第二个凹陷结构52交替设置。
其中，图10以沿第二方向A2，第一个凹陷结构51和第二个凹陷结构52交替设置为例进行示意。可以理解的是，在另一些实施例中，至少一个第一个凹陷结构51和至少一个第二个凹陷结构52可以沿第一方向A1交替设置。
在一些示例中，参阅图10，第一方向A1与第二方向A2相互垂直。示例 性的，第一方向A1可以为与图2、图10中的X方向平行，第二方向A2可以与图2、图10中的Y方向平行。
可以理解的是，在其他的示例中，第一方向A1与第二方向A2的夹角也可以是钝角或锐角。
上述一些实施例中的加强板4，请参阅图4、图7和图8，加强板4可以仅包括第一个凹陷结构51，即加强板4上仅设有多个第一凹槽51a。请参阅图9，加强板4也可以仅包括第二个凹陷结构52，即加强板4上仅设有多个第一孔52a。或者可以同时包括第一个凹陷结构51和第二个凹陷结构52，即加强板4上既设有多个第一凹槽51a，又设有多个第一孔52a。请参阅图10，加强板4，多个第一孔52a设置于相邻两个第一凹槽51a之间。
上文中，结合图4～图10对本公开一些实施例中的加强板4的结构进行了介绍。下面，结合图11～图17对本公开一些实施例中的支撑板3的结构进行介绍。其中，在图11～图15中，虚线框4A表示：在加强板4与支撑板3组合的情况下，加强板4在支撑板3上的投影位置。
在本公开的一些实施例中，参阅图11，图11为根据一些实施例的一种支撑板3的结构图，支撑板3靠近加强板4的表面上设置有第三个凹陷结构53。第三个凹陷结构53包括多个第二凹槽53a。多个第二凹槽53a沿第三方向B1延伸、且沿第四方向B2间隔排列。第三方向B1和第四方向B2相交叉，且均平行于支撑板。
在一些示例中，如图11所示，第三方向B1与第四方向B2垂直。示例性的，第三方向B1可以为与图2、图11中的Y方向平行，第四方向B2可以与图2、图11中的X方向平行。
可以理解的是，在其他示例中，第三方向B1与第四方向B2的夹角可以是钝角或锐角。
本公开一些实施例的显示模组100，在支撑板3上设置有多个间隔排列的第二凹槽53a，每个第二凹槽53a在支撑板3与加强板4之间形成一个空腔，一方面减小了支撑板3与加强板4的实际接触面积，进而减小了热量沿Z方向的传导路径，有效的降低了热量的Z方向传播效率。另一方面，在支撑板3上设置第二凹槽53a，能够有效的减轻支撑板3的重量。
示例性的，至少一个第二凹槽53a在引出部分12上的正投影与驱动芯片2在引出部分12上的正投影至少部分的交叠，有利于降低热量Z方向传播效率。
在一些示例中，参阅图11，多个第二凹槽53a均不贯通支撑板3的沿第 三方向B1的相对两个侧表面f1和f2，且不超出加强板4的相对两侧的边缘，也即不超出图11中虚线框4A的两个边缘(e1和e2)。如此设置，使支撑板3四周的边框区域保留原有厚度，能够有效的提高支撑板3的结构强度。
图12为根据一些实施例的另一种支撑板的结构图。在另一些示例中，参阅图12，多个第二凹槽53a中的至少一个第二凹槽53a沿第三方向B1的至少一端，超出加强板4的边缘，也即超出了图12中虚线框4A相对两侧边缘(e1和e2)中的至少一侧边缘。
可以理解的是，图12仅示出了全部第二凹槽53a均沿第三方向B1超出了加强板4的一侧边缘(也即超出了图12中虚线框4A的边缘e2)。但本公开的实施例对此不作限制。
例如，也可以是全部第二凹槽53a均沿第三方向B1超出加强板4的另一侧边缘(也即超出了图12中虚线框4A的边缘e1)。
或者，还可以是全部第二凹槽53a中，一部分沿第三方向B1超出加强板4的一侧边缘(也即超出了虚线框4A的边缘e2)，另一部分沿第三方向B1超出加强板4的另一侧边缘(也即超出了虚线框4A的边缘e1)。
或者，又可以是全部第二凹槽53a中，一部分沿第三方向B1超出加强板4的相对两侧中的一侧边缘(也即超出了虚线框4A的边缘e2或e1)，另一部分既不超出虚线框4A的边缘e1，也不超虚线框4A的边缘e2。
另外，还可以如图13所示，全部第二凹槽53a均沿第三方向B1同时超出加强板4的相对两侧边缘(也即同时超出了图13中虚线框4A相对两侧的边缘e1和e2)。
本示例中，至少一个第二凹槽53a沿第三方向B1的至少一端，超出加强板4的边缘，即，至少一个第二凹槽53a能够与外部连通，有利于空气流通，加速散热，以有效避免热力集中。
图14为根据一些实施例的又一种支撑板的结构图。在又一些示例中，参阅图14，多个第二凹槽53a中的至少一个第二凹槽53a沿第三方向B1的至少一端，贯通支撑板3的相对的两个侧表面f1和f2中的至少一个侧表面。
可以理解的是，图14仅示出了全部第二凹槽53a均沿第三方向B1贯通支撑板3的一个侧表面f2。但本公开的实施例对此也不做限制。例如还可以是，参阅图15，多个第二凹槽53a中的至少一个第二凹槽53a沿第三方向B1贯通支撑板3的一个侧表面f2。其余的第二凹槽53a沿第三方向B1贯通支撑板3的另一个侧表面f1。例如又可以是，参阅图16，全部第二凹槽53a均沿第三方向B1同时贯通支撑板3的相对的两个侧表面f1和f2。
在本示例中，至少一个第二凹槽53a沿第三方向B1的至少一端，贯通支撑板3的相对的两个侧表面中的至少一个侧表面。如此设置，一方面能够减小支撑板3与加强板4的实际接触面积，降低热量Z方向传播效率。另一方面能形成了至少一个沿第三方向B1的气流通道，利于加强板4与支撑板3之间的空气流通。再一方面，进一步地减轻了支撑板的重量。
在一些实施例中，在显示模组100中的支撑板3包括第三个凹陷结构53的情况下，加强板4可以包括第一个凹陷结构51和/或第二个凹陷结构52。也即显示模组100中支撑板3和加强板4上的各个凹陷结构之间可以相互搭配设置，对于具体的搭配方式、排布方式以及各个凹陷结构的数量不做限定。
在一些示例中，显示模组100的支撑板3可以仅包括第三个凹陷结构53。加强板4不设置凹陷结构。在一些示例中，显示模组100的支撑板3可以包括第三个凹陷结构53。加强板4包括第一个凹陷结构51。在一些示例中，显示模组100的支撑板3可以包括第三个凹陷结构53。加强板4包括第二个凹陷结构52。在一些示例中，显示模组100的支撑板3可以包括第一个凹陷结构51。加强板4包括第二个凹陷结构和第三个凹陷结构。
在一些示例中，支撑板3上的凹陷结构在引出部分12上的正投影，加强板4在引出部分12上的正投影至少部分交叠。示例性的，第三个凹陷结构53在引出部分12上的正投影，与第一个凹陷结构51在引出部分12上的正投影至少部分交叠，即第一个凹陷结构51和第三个凹陷结构53形成一个空腔。或者，第三个凹陷结构53在引出部分12上的正投影，与第二个凹陷结构52在引出部分12上的正投影至少部分交叠。即第二个凹陷结构52和第三个凹陷结构53形成一个空腔。在该示例中，支撑板3上的凹陷结构在引出部分12上的正投影，加强板4在引出部分12上的正投影至少部分交叠，可以进一步增大凹陷结构5形成的空腔的容积，有利于进一步降低热量Z方向传播效率。
在本公开的一些实施例中，参阅图17，图17为根据一些实施例的又一种支撑板的结构图。如图17所示，支撑板3上设置有第四个凹陷结构54。第四个凹陷结构54包括多个间隔排列的第二孔54a，第二孔54a沿垂直于支撑板3的方向延伸，且至少贯穿支撑板3靠近加强板4的表面。本实施例中，由于在支撑板3上设置多个第二孔54a，一方面能够减少支撑板3与加强板4的实际接触面积，以降低热量的Z方向传播效率，进而防止显示部分被灼伤，延长显示模组的使用寿命。另一方面，采用第二孔54a作为第四个凹陷结构54能够提高支撑板3的结构强度。
示例性的，至少一个第二孔54a在引出部分12上的正投影与驱动芯片2 在引出部分12上的正投影至少部分的交叠。如此设置，有利于降低热量的Z方向传播效率。
在一些示例中，参阅图17，第二孔54a仅贯穿支撑板3靠近加强板4的表面。即第二孔54a为盲孔，且形状可以为圆孔(如图17所示)或其他多边形孔以及异形孔，在使用时可以根据实际需求任意选择。第二孔54a采用盲孔，既能有效的减少支撑板3与加强板4之间的实际接触面积，又能够提高支撑板3的强度。
在另一些示例中，第二孔54a还贯穿支撑板3远离加强板4的表面。即第二孔54a为通孔，贯穿支撑板3的靠近加强板4的表面及支撑板3的远离加强板4的表面。本示例中，由于第二孔54a采用通孔，能够将加强板4的与支撑板3相对的表面与外部空气连通，使加强板4能够直接通过多个第二孔54a散热，提高了散热效果。
需要说明的是，参阅图17，在其他的示例中，多个第二孔54a中，可以既包括盲孔又包括通孔。如此设置，既能降低加强板4与支撑板3之间的实际接触面积，又有利于散热，还有利于提高了支撑板3的强度。
上述一些实施例中的支撑板3，可以仅包括第三个凹陷结构53，即支撑板3上仅设有多个第二凹槽53a。也可以仅包括第四个凹陷结构54，即支撑板3上仅设有多个第二孔54a。或者也可以同时包括第三个凹陷结构53和第四个凹陷结构54，即支撑板3上既设有多个第二凹槽53a，又设有多个第二孔54a，例如，多个第二孔54a设置于相邻两个第二凹槽53a之间。
在一些实施例中，在显示模组100中的支撑板3包括第三个凹陷结构53和/或第四凹陷结构54的情况下，加强板4可以包括第一个凹陷结构51和/或第二个凹陷结构52。也即显示模组100中支撑板3和加强板4上的各个凹陷结构之间可以相互搭配设置，对于具体的搭配方式、排布方式以及各个凹陷结构的数量不做限定。
在一些示例中，支撑板3包括第三个凹陷结构53和第四凹陷结构54，加强板4不设置凹陷结构。在一些示例中，显示模组100的支撑板3包括第三个凹陷结构53和第四凹陷结构54。加强板4包括第一个凹陷结构51。在一些示例中，显示模组100的支撑板3包括第三个凹陷结构53和第四凹陷结构54。加强板4包括第二个凹陷结构52。在一些示例中，显示模组100的支撑板3包括第三个凹陷结构53和第四凹陷结构54。加强板4包括第一个凹陷结构51和第二个凹陷结构52。
在一些示例中，支撑板3上的凹陷结构在引出部分12上的正投影，加强 板4在引出部分12上的正投影至少部分交叠。对于加强板4上的第一个凹陷结构51和第二个凹陷结构52，以及支撑板3上的第三个凹陷结构53和第四个凹陷结构54可以相互搭配交叠，形成空腔。在本示例中，可以进一步增大凹陷结构5形成的空腔的容积，有利于进一步降低热量Z方向传播效率。
上文中，结合图11～图17对本公开一些实施例中的支撑板3的结构进行介绍。下面，结合图19～图23对本公开一些实施例中支撑板3与加强板4组合状态的结构进行介绍。
在本公开的一些实施例中，参阅图18，图18为根据一些实施例的一种支撑板与加强板组合状态的主视图。如图18所示，加强板4上设有多个第一凹槽51a。多个第一凹槽51a沿第一方向A1延伸、且沿第二方向A2间隔排列。第一方向A1和第二方向A2相交叉，且均平行于加强板4。支撑板3上设有多个第二凹槽53a。多个第二凹槽53a沿第三方向B1延伸、且沿第四方向B2间隔排列。第三方向B1和第四方向B2相交叉，且均平行于支撑板3。第一方向A1与第三方向B1相互交叉。
在一些示例中，如图18所示，第一方向A1与第三方向B1相互垂直。
示例性的，第一方向A1平行于弯曲部分12的弯曲轴线的延伸方向(即图2中的Y方向)，第三方向B1垂直于弯曲轴线的延伸方向(即图2中的Y方向)。
可以理解的是，在其他示例中，第一方向A1与第三方向B1的夹角也可以为钝角或锐角。
本公开一些实施例的显示模组100中，加强板4上设有多个第一凹槽51a，支撑板3上设有多个第二凹槽53a。如此设置，一方面能够最大程度的减小支撑板3与加强板4之间的实际接触面积，减小热量的Z方向传播效率。另一方面，由于多个第一凹槽51a与多个第二凹槽53a相互交叉，呈网格状，能够使加强板4与支撑板3之间的吸收了热量的空气均的分布于多个第一凹槽51a与多个第二凹槽53a形成的网格中，避免热力集中。再一方面，由于多个第一凹槽51a与多个第二凹槽53a延伸方向不同且相互交叉，这样的加强板4与支撑板3配合使用，能够相互支撑，提高显示模组100的结构强度及抗弯曲能力。
在一些示例中，第一凹槽51a和/或第二凹槽53a，在引出部分12上的正投影与驱动芯片2在引出部分12上的正投影至少部分的交叠。
示例性的，第一凹槽51a与第二凹槽53a之间的交叉位置处在引出部分12上的正投影，与驱动芯片2在引出部分12上的正投影至少部分地交叠。如 此设置，能够减少热量的Z方向传播效率，且有利于散热。
在一些示例中，参阅图18，多个第一凹槽51a的两端均不贯通加强板4的沿第一方向A1的相对两个侧表面d1和d2。多个第二凹槽53a的两端均不超出加强板4的沿第三方向B1的相对两个侧表面g1和g2。
可以理解的是，在其他的示例中，也可以是多个第一凹槽51a中的至少一个第一凹槽51a沿第一方向A1贯通加强板4的相对的两个侧表面d1和d2中的至少一个侧表面。而多个第二凹槽53a的两端均不超出加强板4的相对两个侧表面g1和g2。或者，还可以是多个第二凹槽53a中的至少一个第二凹槽53a沿第三方向B1超出加强板4的相对的两个侧表面(g1和g2)中的至少一个侧表面。而多个第一凹槽51a两端均不贯通加强板4的沿第一方向A1的相对两个侧表面d1和d2。本示例对此均不作过多的限制。
图19为根据一些实施例的另一种支撑板与加强板组合状态的主视图。在另一些示例中，参阅图19，多个第一凹槽51a中的至少一个第一凹槽51a沿第一方向A1贯通加强板4的相对的两个侧表面(d1和d2)中的至少一个侧表面。多个第二凹槽53a中的至少一个第二凹槽53a沿第三方向B1超出加强板4相对的两个侧表面(g1和g2)中的至少一个侧表面。
可以理解的是，图19仅示出了全部第一凹槽51a均沿第一方向A1贯通加强板4的相对的两个侧表面d1和d2，全部第二凹槽53a均沿第三方向B1超出加强板4相对的两个侧表面g1和g2。但本公开的实施例并不限制于此。
例如还可以是，全部第一凹槽51a中的一部分第一凹槽51a沿第一方向A1贯通加强板4的相对的两个侧表面d1和d2，另一部分第一凹槽51a的两端均不贯通加强板4的相对的两个侧表面d1和d2。全部第二凹槽53a中的一部分第二凹槽53a沿第三方向B1超出加强板4的相对的两个侧表面g1和g2，另一部分第二凹槽53a的两端均不超出加强板4的相对的两个侧表面g1和g2。
例如又可以是，全部第一凹槽51a中的一部分第一凹槽51a沿第一方向A1贯通加强板4的一个侧表面d1，另一部分第一凹槽51a沿第一方向A1贯通加强板4的另一个侧表面d2。全部第二凹槽53a中的一部分第二凹槽53a沿第三方向B1超出加强板4的一侧表面g1，另一部分第二凹槽53a沿第三方向B1超出加强板4的另一侧表面g2。
在本示例中，在多个第一凹槽51a和多个第二凹槽53a相互且交叉，且至少一个第一凹槽51a或第二凹槽53a与外部空气联通，即多个第一凹槽51a与多个第二凹槽53a形成的流体通道能够与外部空气连通。这样一来，加强板4与支撑板3之间的携带热量的空气能够流通至外部，有利于散热，避免 热力集中。
图22为根据一些实施例的又一种支撑板与加强板组合状态的主视图。在又一些示例中，参阅图22，多个第一凹槽51a中的至少一个第一凹槽51a沿第一方向A1贯通加强板4的相对的两个侧表面(d1和d2)中的至少一个侧表面。多个第二凹槽53a中的至少一个第二凹槽53a沿第三方向B1的至少一端，贯通支撑板3的相对的两个侧表面(f1和f2)中的至少一个侧表面。
可以理解的是，图22仅示出了全部第一凹槽51a均沿第一方向A1同时贯通加强板4的相对的两个侧表面(d1和d2)。全部第二凹槽53a均沿第三方向B1同时贯通支撑板3的相对的两个侧表面(f1和f2)。但本公开的实施例并不限制于此。
例如可以是，全部第一凹槽51a中的一部分第一凹槽51a沿第一方向A1贯通加强板4的一个侧表面d1，另一部分第一凹槽51a沿第一方向A1贯通加强板4的另一个侧表面d2。全部第二凹槽53a中的一部分第二凹槽53a沿第三方向B1贯通支撑板3的一个侧表面f1，另一部分第二凹槽53a沿第三方向B1贯通支撑板3的另一个侧表面f2。
在本公开的一些实施例中，第一凹槽51a与第二凹槽53a的截面形状可选择长方形(如图20和图21所示，其中图20为图19中支撑板与加强板组合状态的右视图，图21为图19中支撑板与加强板组合状态的仰视图。)、梯形、倒梯形等，且第一凹槽51a与第二凹槽53a的截面形状可以相同也可以不同。若第一凹槽51a与第二凹槽53a的截面形状为长方形、梯形，则具有便于蚀刻加工的优点。若第一凹槽51a与第二凹槽53a的截面形状为倒梯形，由于倒梯形的开口较大，所以能够更有效的减小支撑板3与加强板4的实际接触面积，以降低热量的Z方向传递效率。
图23为根据一些实施例的又一种支撑板与加强板组合状态的主视图。
在本公开的一些实施例中，参阅图23，加强板4上设置有多个第一孔52a。多个第一孔52a至少贯穿加强板4靠近支撑板3的表面。多个第一孔52a排列成多行，且多个第一孔52a排列成多列。支撑板3上设置有多个第二孔54a。多个第二孔54a至少贯穿支撑板3靠近加强板4的表面。多个第二孔54a排列成多行，且多个第二孔54a排列成多列。在列方向上，一行第一孔52a与一行第二孔54a交替设置，且相邻的一行第一孔52a与一行第二孔54a错开设置。
示例性的，至少一个第一孔52a和/或至少一个第二孔54a在引出部分12上的正投影，与驱动芯片2在引出部分12上的正投影至少部分的交叠。
在一些示例中，参阅图23，第一孔52a和第二孔54a均为盲孔。第一孔 52a贯穿加强板4靠近支撑板3的表面。第二孔54a贯穿支撑板3靠近加强板4的表面。
在另一些示例中，第一孔52a和第二孔54a均为通孔。第一孔52a的两端分别贯穿加强板4靠近支撑板3的表面及远离支撑板3的表面。第二孔54a的两端分别贯穿支撑板3靠近加强板4的表面及远离加强板4的表面。
在又一些示例中，多个第一孔52a中可以既包括盲孔又包括通孔。多个第二孔54a中也可以既包括盲孔又包括通孔。
本实施例通过设置第一孔52a和第二孔54a来减小支撑板3与加强板4之间的实际接触面积，既能够降低热量的Z方向传递效率，又有利于提高支撑板3和加强板4的结构强度。
需要说明的是，上述一些实施例的加强板4与支撑板3组合状态的结构中，加强板4上可以仅包括第一个凹陷结构51，也可以仅包括第二个凹陷结构52。或者，同时包括第一个凹陷结构51和第二个凹陷结构52，即加强板4上既设有多个第一凹槽51a，又设有多个第一孔52a，例如，多个第一孔52a设置于相邻两个第一凹槽51a之间。支撑板3上可以仅包括第三个凹陷结构53，也可以仅包括第四个凹陷结构54。或者，同时包括第三个凹陷结构53和第四个凹陷结构54，即支撑板3上既设有多个第二凹槽53a，又设有多个第二孔54a，例如，多个第二孔54a设置于相邻两个第二凹槽53a之间。
在本公开的一些实施例中，参阅图2，加强板4在显示部分11上的正投影与支撑板3在显示部分11上的正投影之间的重叠区域的面积，大于或等于支撑板3在显示部分上的正投影面积的1/4。
示例性的，加强板4在显示部分11上的正投影与支撑板3在显示部分11上的正投影之间的重叠区域的面积，大致等于支撑板3在显示部分11上的正投影面积的1/4、1/3、1/2或3/4。
本实施例中，通过加大加强板4在显示部分11上的正投影与支撑板3在显示部分11上的正投影之间的重叠区域的面积，使驱动芯片2产生的热量能够经加强板4被更大的均摊至支撑板3上，避免热量集中，提高了散热效率，进而降低了驱动芯片2发热对柔性显示面板1的寿命影响。
需要说明的是，在其他示例中，也可以不对加强板4在显示部分11上的正投影与支撑板3在显示部分11上的正投影之间的重叠区域的面积大小进行限制，只要在整机允许的空间内，使所述重叠区域的面积尽量大即可。
在本公开的一些实施例中，参阅图2，显示模组100还包括第一胶层91。第一胶层91位于支撑板3与加强板4之间。其中，第一胶层91包括镂空区 域91a。驱动芯片2在第一胶层91上的正投影位于镂空区域91a内。
示例性的，第一胶层91为双面胶。
在一些示例中，参阅图2，加强板4上包括多个第一凹槽51a，支撑板3上包括多个第二凹槽53a，多个第一凹槽51a和多个第二凹槽53a在第一胶层91上的正投影的至少部分位于镂空区域91a内。
在另一些示例中，加强板4上包括多个第一孔52a，支撑板3上包括多个第二孔54a，多个第一孔52a和多个第二孔54a在第一胶层91上的正投影的至少部分位于镂空区域91a内。
本公开的一些实施例中，显示模组100的支撑板3与加强板4之间采用第一胶层91连接，为了避免第一胶层91填充于支撑板3与加强板4之间的凹陷结构5中，形成热量传递的桥梁，故在第一胶层91上设置镂空区域91a。如此设置，既能够使支撑板3与加强板4紧密的连接在一起，又不会增大支撑板3与加强板4之间的实际接触面积，更有利于降低热量的Z方向传播效率。
在本公开的一些实施例中，参阅图2，显示模组100还包括第二胶层92和第三胶层93。第二胶层92位于支撑板3与显示部分11之间。第三胶层93位于加强板4与柔性显示面板1的引出部分12之间。
示例性的，第二胶层92和第三胶层91均为双面胶。
本公开一些实施例中，显示模组100的支撑板3通过第二胶层92与显示部分11连接在一起，加强板4通过第三胶层93与引出部分12连接在一起，提高了显示模组100的结构稳定性。
在本开的一些实施例中，参阅图2，显示模组100还包括柔性电路板6和第四胶层94。柔性电路板6位于加强板4远离显示部分11的一侧。且柔性电路板6与引出部分12远离弯曲部分13的边缘绑定连接。第四胶层94位于柔性电路板6与加强板4之间。
示例性的，第四胶层94为双面胶。
本公开的一些实施例中，显示模组100的柔性电路板6通过第四胶层94固定于加强板4上，能够使显示模组100的结构更加紧凑。
在本公开的一些实施例中，参阅图2，显示模组100还包括偏光片7、保护盖板8以及第五胶层95。偏光片7设置于柔性显示面板1的显示部分11的显示侧c2。保护盖板8位于偏光片7远离显示部分11的一侧。第五胶层95位于偏光片7与保护盖板8之间。
示例性的，第五胶层95为OCA(Optically Clear Adhesive)光学胶。
本公开的一些实施例中，显示模组100的显示部分11的显示侧c2设置偏光片7能够减少反射光，从而提高显示模组100的清晰度。设置保护盖板8能够对柔性显示面板1等其他器件起到保护作用防止磕伤，又能防止水汽等其他杂质进入显示模组100内部，延长显示模组100的使用寿命。
综上所述，本公开一些实施例提供了一种显示模组100及显示装置200。显示装置200中包括显示模组100，显示模组100包括柔性显示面板1、驱动芯片2、支撑板3和加强板4。通过在加强板4与支撑板3的两个相对表面中的至少一个表面上设置凹陷结构5，减小了支撑板3与加强板4之间的实际接触面接，从而有效的降低驱动芯片2的热量沿Z方向的传递效率，防止显示部分11被驱动芯片2的热量灼伤，进而提高了显示模组100的显示性能，并延长显示模组100的使用寿命。此外，通过设置凹陷结构5还对解决显示模组100重量过大的问题有积极作用。在此基础上，由于显示装置200包括上述任一实施例中的显示模组100，因此显示装置200具有如上所述的全部有益效果。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (22)

  1. 一种显示模组，包括：
    显示面板，包括显示部分、弯曲部分和引出部分；所述弯曲部分连接所述显示部分和所述引出部分；所述显示部分具有显示侧和非显示侧，所述非显示侧为所述显示侧的对侧；所述引出部分位于所述显示部分的非显示侧；
    至少一个驱动芯片，安装于所述引出部分远离所述显示部分的一侧；
    支撑板，位于所述显示部分的非显示侧；以及，
    加强板，位于所述支撑板与所述引出部分之间；
    其中，所述加强板与所述支撑板的两个相对表面中的至少一个表面上设置有凹陷结构，至少一个表面上的所述凹陷结构在所述引出部分上的正投影，与所述至少一个驱动芯片在所述引出部分上的正投影至少部分地交叠。
  2. 根据权利要求1所述的显示模组，其中，
    所述驱动芯片的数量为两个或者两个以上；至少一个表面上的所述凹陷结构在所述引出部分上的正投影，与各个所述驱动芯片在所述引出部分上的正投影至少部分地交叠。
  3. 根据权利要求1或2所述的显示模组，其中，
    所述加强板靠近所述支撑板的表面上设置有第一个所述凹陷结构；第一个所述凹陷结构包括多个第一凹槽；所述多个第一凹槽沿第一方向延伸、且沿第二方向间隔排列；所述第一方向和所述第二方向相交叉，且均平行于所述加强板。
  4. 根据权利要求1或2所述的显示模组，其中，所述加强板靠近所述支撑板的表面上设置有第一个所述凹陷结构；第一个所述凹陷结构包括多个第一凹槽；所述多个第一凹槽沿第二方向延伸、且沿所述第二方向间隔排列；
    第一个所述凹陷结构中的所述第一凹槽的数量大于或等于所述驱动芯片的数量；每个所述驱动芯片在所述引出部分上的正投影，与至少一个所述第一凹槽在所述引出部分上的正投影至少部分交叠。
  5. 根据权利要求4所述的显示模组，其中，所述多个第一凹槽还沿第一方向间隔排列；所述第一方向和所述第二方向相交叉，且均平行于所述加强板。
  6. 根据权利要求3～5中任一项所述的显示模组，其中，
    所述多个第一凹槽中的至少一个第一凹槽沿所述第一方向贯通所述加强板的相对的两个侧表面中的至少一个侧表面。
  7. 根据权利要求1～6中任一项所述的显示模组，其中，
    所述加强板上设置有第二个所述凹陷结构；第二个所述凹陷结构包括多个间隔排列的第一孔，第一孔沿垂直于所述加强板的方向延伸，且至少贯穿所述加强板靠近所述支撑板的表面。
  8. 根据权利要求7所述的显示模组，其中，
    所述第一孔还贯穿所述加强板远离所述支撑板的表面。
  9. 根据权利要求1～8中任一项所述的显示模组，其中，
    所述支撑板靠近所述加强板的表面上设置有第三个所述凹陷结构；第三个所述凹陷结构包括多个第二凹槽；所述多个第二凹槽沿第三方向延伸、且沿第四方向间隔排列；所述第三方向和所述第四方向相交叉，且均平行于所述支撑板。
  10. 根据权利要求9所述的显示模组，其中，
    所述多个第二凹槽中的至少一个第二凹槽沿所述第三方向的至少一端，超出所述加强板的边缘。
  11. 根据权利要求9或10所述的显示模组，其中，
    所述多个第二凹槽中的至少一个第二凹槽沿所述第三方向贯通所述支撑板的相对的两个侧表面中的至少一个侧表面。
  12. 根据权利要求9～11中任一项所述的显示模组，其中，
    在所述加强板靠近所述支撑板的表面上设置有第一个所述凹陷结构；第一个所述凹陷结构包括多个第一凹槽的情况下：
    所述多个第二凹槽的延伸方向与所述多个第一凹槽的延伸方向相交叉。
  13. 根据权利要求12所述的显示模组，其中，
    所述多个第二凹槽沿平行于所述弯曲部分的弯曲轴线的方向延伸，所述多个第一凹槽沿垂直于所述弯曲轴线的方向延伸。
  14. 根据权利要求1～13中任一项所述的显示模组，其中，
    所述支撑板上设置有第四个所述凹陷结构；第四个所述凹陷结构包括多个间隔排列的第二孔，第二孔沿垂直于所述支撑板的方向延伸，且至少贯穿所述支撑板靠近所述加强板的表面。
  15. 根据权利要求14所述的显示模组，其中，
    所述第二孔还贯穿所述支撑板远离所述加强板的表面。
  16. 根据权利要求14或15所述的显示模组，其中，
    在所述加强板靠近所述支撑板的表面上设置有第二个所述凹陷结构；第二个所述凹陷结构包括多个第一孔的情况下：
    所述多个第二孔排列成多行，且所述多个第一孔排列成多行；在列方向 上，一行第一孔与一行第二孔交替设置，且相邻的一行第一孔与一行第二孔错开设置。
  17. 根据权利要求1～16中任一项所述的显示模组，其中，
    所述加强板在所述显示部分上的正投影与所述支撑板在所述显示部分上的正投影之间的重叠区域的面积，大于或等于所述支撑板在所述显示部分上的正投影面积的1/4。
  18. 根据权利要求1～17中任一项所述的显示模组，还包括：
    第一胶层，位于所述支撑板与所述加强板之间；
    其中，所述第一胶层包括镂空区域；所述驱动芯片在所述第一胶层上的正投影位于所述镂空区域。
  19. 根据权利要求1～18中任一项所述的显示模组，还包括：
    第二胶层，位于所述支撑板与所述显示部分之间；以及，
    第三胶层，位于所述加强板与所述显示面板的引出部分之间。
  20. 根据权利要求1～19中任一项所述的显示模组，还包括：
    柔性电路板，位于所述加强板远离所述显示部分的一侧；且所述柔性电路板与所述引出部分远离所述弯曲部分的边缘绑定连接；
    第四胶层，位于所述柔性电路板与所述加强板之间。
  21. 根据权利要求1～20中任一项所述的显示模组，还包括：
    偏光片，设置于所述显示面板的显示部分的显示侧；
    保护盖板，位于所述偏光片远离所述显示部分的一侧；以及，
    第五胶层，位于所述偏光片与所述保护盖板之间。
  22. 一种显示装置，包括：
    如权利要求1～21中任一项所述的显示模组。
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