WO2023274032A1 - Storage access circuit, integrated chip, electronic device and storage access method - Google Patents

Storage access circuit, integrated chip, electronic device and storage access method Download PDF

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Publication number
WO2023274032A1
WO2023274032A1 PCT/CN2022/100807 CN2022100807W WO2023274032A1 WO 2023274032 A1 WO2023274032 A1 WO 2023274032A1 CN 2022100807 W CN2022100807 W CN 2022100807W WO 2023274032 A1 WO2023274032 A1 WO 2023274032A1
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Prior art keywords
storage
data
routing node
multiplexer
routing
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PCT/CN2022/100807
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French (fr)
Chinese (zh)
Inventor
刘琦
左丰国
江喜平
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西安紫光国芯半导体有限公司
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Publication of WO2023274032A1 publication Critical patent/WO2023274032A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00Digital computers in general; Data processing equipment in general
    • G06F15/76Architectures of general purpose stored program computers
    • G06F15/78Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7807System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package
    • G06F15/7825Globally asynchronous, locally synchronous, e.g. network on chip
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00Digital computers in general; Data processing equipment in general
    • G06F15/76Architectures of general purpose stored program computers
    • G06F15/78Architectures of general purpose stored program computers comprising a single central processing unit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the application relates to the technical field of electronic circuits, in particular to storage access circuits, integrated chips, electronic equipment and storage access methods.
  • the technical problem mainly solved by this application is to provide storage access circuit, integrated chip, electronic equipment and storage access method, which can realize high-bandwidth storage access to large-capacity storage units.
  • the first technical solution adopted by the present application is to provide a storage access circuit
  • the storage access circuit includes: a network unit, the network unit includes at least one routing node; a multiplexer; a storage control module, For connecting storage units; wherein, each routing node is connected to at least one multiplexer, and each multiplexer is connected to at least two storage control modules to multiplex at least two storage control modules, Further, storage access is performed to the storage unit connected to the storage control module.
  • each routing node is connected to at most 4 other routing nodes.
  • At least two routing nodes are distributed in an array in the form of M rows*N columns, and each routing node is connected to other routing nodes adjacent in the row or column direction, wherein M and N are positive integers.
  • M is 3, and N is 3; each routing node is connected to 2 multiplexers, and each multiplexer is connected to 8 storage control modules.
  • M is 4, and N is 4; each routing node is connected to 4 multiplexers, and each multiplexer is connected to 16 storage control modules.
  • the storage control module includes: a first interface unit connected to the multiplexer; a read control unit connected to the first interface unit for controlling the reading of data in the storage unit; a write control unit connected to the first interface unit, It is used to control writing data to the storage unit; the second interface unit is connected to the read control unit, the write control unit and the storage unit.
  • the storage control module further includes a refresh unit connected to the second interface unit, and the refresh unit is used for refreshing the storage unit.
  • the data bit width of the storage control module is 128bit, and the frequency is 400MHz.
  • the storage access circuit also includes: computing engines, and each routing node is connected to at least one computing engine.
  • the distance between the routing node and other routing nodes connected to the routing node is the same.
  • the data transmission time between the routing node and other routing nodes connected to the routing node is the same.
  • the second technical solution adopted by this application is to provide an integrated chip, which includes: a logic module and a storage array module; a storage access circuit is integrated on the logic module; the storage access circuit includes: a network unit , the network unit includes at least one routing node; a multiplexer; a storage control module for connecting the storage unit; wherein, each routing node is connected to at least one multiplexer, and each multiplexer is connected to at least two A storage control module, to multiplex at least two storage control modules, and then perform storage access to the storage unit connected to the storage control module; the storage array module is integrated with the storage unit, and the logic module and the storage array module are laminated and bonded connect.
  • the storage array module is a dynamic random storage array module.
  • each routing node is connected to at most 4 other routing nodes; wherein, the distance between the routing node and other routing nodes connected with the routing node is the same; and/or the distance between the routing node and other routing nodes connected with the routing node Data transfer times are the same.
  • At least two routing nodes are distributed in an array in the form of M rows*N columns, and each routing node is connected to other routing nodes adjacent in the row or column direction, wherein M and N are positive integers.
  • the third technical solution adopted by the present application is to provide a storage access method, the method includes: a routing node receives a data access instruction, and determines at least one corresponding multiplexer according to the data access instruction; The multiplexer determines at least one corresponding storage control module according to the data access instruction; the storage control module obtains data from the correspondingly connected storage unit according to the data access instruction and sends it to the multiplexer; the multiplexer sends the data to the routing node.
  • the step of the multiplexer sending the data to the routing node includes: the multiplexer synthesizes the data, and sends the synthesized data to the routing node.
  • the multiplexer after the multiplexer sends the data to the routing node, it also includes: the routing node sends the synthesized data to the calculation engine; the calculation engine decodes the synthesized data, and performs corresponding processing based on the decoded data operation.
  • the method further includes: the routing node receives the data write instruction, and determines at least one corresponding multiplexer according to the data write instruction; the multiplexer determines the corresponding at least one storage control module according to the data write instruction ; The storage control module obtains the data to be written according to the data writing instruction, and writes the data to be written into the storage unit connected to the storage control module.
  • the computing engine before the step of the routing node receiving the data writing instruction, it includes: the computing engine generates the writing instruction, and sends the writing instruction to the routing node.
  • the beneficial effect of the application is: different from the situation of the prior art, the storage access circuit, integrated chip, electronic equipment and storage access method provided by the application.
  • the storage access circuit utilizes each routing node to connect at least one multiplexer, and each multiplexer is connected to at least two storage control modules, so that at least two storage control modules can be multiplexed, and then Perform storage access to the storage unit connected to the storage control module.
  • at least two storage control modules connected to each multiplexer can provide higher bandwidth, so as to realize high-capacity storage unit Bandwidth storage access.
  • FIG. 1 is a schematic structural diagram of an embodiment of a storage access circuit provided by the present application
  • FIG. 2 is a schematic structural diagram of another embodiment of the storage access circuit provided by the present application.
  • FIG. 3 is a schematic structural diagram of an embodiment of a plurality of routing nodes provided by the present application.
  • FIG. 4 is a schematic structural diagram of another embodiment of the storage access circuit provided by the present application.
  • FIG. 5 is a schematic structural diagram of an embodiment of a storage control module provided by the present application.
  • FIG. 6 is a schematic structural diagram of another embodiment of the storage control module provided by the present application.
  • FIG. 7 is a schematic structural diagram of an embodiment of an integrated chip provided by the present application.
  • FIG. 8 is a schematic structural diagram of an embodiment of an electronic device provided by the present application.
  • FIG. 9 is a schematic flowchart of an embodiment of a storage access method provided by the present application.
  • Fig. 10 is a schematic flowchart of another embodiment of the storage access method provided by the present application.
  • FIG. 1 is a schematic structural diagram of an embodiment of a storage access circuit provided in the present application.
  • the storage access circuit 100 includes a network unit 10 , a multiplexer 30 and a storage control module 40 .
  • the network unit 10 includes at least one routing node 101, and each routing node 101 is connected with at least one multiplexer 30, and each multiplexer 30 is connected with at least two storage control modules 40, so as to control at least two storage
  • the control module 40 performs multiplexing, and then performs storage access to the storage units connected to the storage control module 40 .
  • network unit 10 may be a network-on-chip.
  • network on chip is a new communication method for System on chip (SoC). It is the main component of multi-core technology.
  • SoC System on chip
  • the NoC approach brings a new on-chip communication method that significantly outperforms the performance of traditional bus-based systems (bus).
  • bus bus-based systems
  • NoC-based systems are better suited to globally asynchronous and partially synchronous clocking mechanisms used in future complex multi-core SoC designs.
  • the multiplexer 30 can receive multiple input signals, synthesize a single output signal in a recoverable manner for each input signal, and select to read or write data from the corresponding channel.
  • the storage control module 40 is used to connect the storage unit to control the storage unit, such as reading data from the storage unit or writing data to the storage unit.
  • the numbers of routing nodes 101, multiplexers 30 and storage control modules 40 may be set according to actual needs. Further, the number of multiplexers 30 connected to each routing node 101 may be the same, for example, each routing node 101 is connected to 1, 2, 3, 4, 5 or 6 multiplexers 30 . In another application scenario, the number of multiplexers 30 connected to each routing node 101 may be different, for example, the first routing node 101 is connected to two multiplexers 30, and the second routing node 101 Three multiplexers 30 are connected, the third routing node 101 is connected to four multiplexers 30 , and the fourth routing node 101 is connected to two multiplexers 30 .
  • each multiplexer 30 may be the same, for example, each multiplexer 30 is connected to 2, 4, 8 or 16 storage control modules 40 .
  • the number of storage control modules 40 connected to each multiplexer 30 can also be different, such as the first multiplexer 30 is connected to 4 storage control modules 40, and the second multiplexer 30 is connected to 8 storage control modules 40, the third multiplexer 30 is connected to 16 storage control modules 40, and the fourth multiplexer 30 is connected to 32 storage control modules 40.
  • the routing node 101 in the storage access circuit 100 is connected to an external processing module. Based on this, the reading process of the entire storage access circuit 100 is described:
  • the external processing module can generate a data access instruction and send it to the routing node 101, and the routing node 101 determines corresponding multiple or single multiplexers 30 according to the data access instruction, and sends the data access instruction to the multiplexer 30 .
  • the multiplexer 30 allocates according to the data access instruction to determine corresponding multiple or single storage control modules 40 , and sends the data access instruction to the storage control module 40 .
  • the storage control module 40 acquires data from the correspondingly connected storage units according to the data access instruction, and sends the data to the multiplexer 30 .
  • the multiplexer 30 synthesizes the data sent by multiple or single storage control modules 40, and sends the synthesized data to the routing node 101, and the routing node 101 sends the synthesized data to the external processing module. After obtaining the synthesized data, the external processing module decodes the synthesized data to obtain the data before synthesis. Then perform calculations on these data.
  • the writing process of the entire storage access circuit 100 is described as follows:
  • the external processing module can generate a data writing instruction and send it to the routing node 101, and the routing node 101 determines corresponding multiple or single multiplexers 30 according to the data writing instruction, and sends the data writing instruction to the multiplexer 30.
  • Use device 30 The multiplexer 30 distributes according to the data write instruction to determine corresponding multiple or single storage control modules 40 , and sends the data write instruction to the storage control module 40 .
  • the storage control module 40 obtains the data to be written according to the data writing instruction, and writes the data to be written into the correspondingly connected storage unit.
  • the storage access circuit 100 utilizes the way that each routing node is connected to at least one multiplexer 30, and each multiplexer 30 is connected to at least two storage control modules 40, so that at least two The storage control module 40 performs multiplexing.
  • at least two storage control modules 40 connected to each multiplexer 30 can provide higher bandwidth, thereby enabling high-bandwidth storage access to large-capacity storage units.
  • FIG. 2 is a schematic structural diagram of another embodiment of a storage access circuit provided in the present application. Compared with the above-mentioned first embodiment shown in FIG. 1 , the difference of this embodiment is that a computing engine 20 is also included.
  • the computing engine 20 may include at least one of a CPU (central processing unit, central processing unit), a DSP (Digital Signal Processor, digital signal processor), and a GPU (graphics processing unit, graphics processor).
  • a CPU central processing unit, central processing unit
  • DSP Digital Signal Processor, digital signal processor
  • GPU graphics processing unit, graphics processor
  • each routing node is connected to at least one computing engine 20 and at least one multiplexer 30, and each multiplexer 30 is connected to multiple storage control modules 40 to multiplex multiple storage control modules 40 use.
  • Routing node 101 is used to control data transmission. The data output by the multiplexer 30 is transmitted to the calculation engine 20 through the routing node 101, so that the calculation engine 20 performs corresponding calculations based on these data.
  • the numbers of routing nodes 101 , computing engines 20 , multiplexers 30 and storage control modules 40 can be set according to actual needs.
  • the number of computing engines 20 connected to each routing node 101 may be the same, for example, 2, 3, 4, 5 or 6 computing engines 20 connected to each routing node 101 .
  • the number of computing engines 20 connected to each routing node 101 may be different, for example, the first routing node 101 is connected to 2 computing engines 20, and the second routing node 101 is connected to 3 computing engines 20 , the third routing node 101 is connected to four computing engines 20 , and the fourth routing node 101 is connected to two computing engines 20 .
  • the corresponding functional modules in the computing engine 20 can generate data access instructions and send them to the routing node 101.
  • the routing node 101 determines the corresponding multiple or single multiplexers 30 according to the data access instructions, and sends the data access instructions to the multiplexers 30.
  • Multiplexer 30 The multiplexer 30 allocates according to the data access instruction to determine corresponding multiple or single storage control modules 40 , and sends the data access instruction to the storage control module 40 .
  • the storage control module 40 acquires data from the correspondingly connected storage units according to the data access instruction, and sends the data to the multiplexer 30 .
  • the multiplexer 30 synthesizes the data sent by multiple or single storage control modules 40 , and sends the synthesized data to the routing node, and the routing node sends the synthesized data to the computing engine 20 .
  • the corresponding functional modules in the calculation engine 20 decode the synthesized data to obtain the data before synthesis. Then perform calculations on these data.
  • the corresponding functional modules in the computing engine 20 can generate a data write instruction and send it to the routing node 101, and the routing node 101 determines corresponding multiple or single multiplexers 30 according to the data writing instruction, and sends the data writing instruction to to the multiplexer 30.
  • the multiplexer 30 distributes according to the data write instruction to determine corresponding multiple or single storage control modules 40 , and sends the data write instruction to the storage control module 40 .
  • the storage control module 40 acquires the data to be written according to the data writing instruction, and writes the data to be written into the correspondingly connected storage unit.
  • the storage access circuit 100 utilizes the way that each routing node 101 is connected to at least one multiplexer 30, and each multiplexer 30 is connected to at least two storage control modules 40, so that at least two A storage control module 40 performs multiplexing.
  • at least two storage control 40 modules connected to each multiplexer 30 can provide higher bandwidth, thereby enabling high-bandwidth storage access to large-capacity storage units, so that the multiplexer 30 can output high-bandwidth storage access data to routing node 101, and routing node 101 can reasonably allocate storage access data to any one or more computing engines 20 on routing node 101, thereby improving computing performance.
  • FIG. 3 is a schematic structural diagram of an embodiment of multiple routing nodes provided by the present application. Take the nine routing nodes in Figure 3 as an example for illustration:
  • Routing nodes include A, B, C, D, E, F, G, H, and I. Among them, routing node A is connected with routing node B and routing node D, routing node B is connected with routing node A, routing node C and routing node E, routing node C is connected with routing node B and routing node F, routing node E is connected with routing node Node A, routing node E and routing node G are connected, routing node E is connected with routing node B, routing node D, routing node F and routing node H, routing node F is connected with routing node C, routing node E and routing node I, Routing node G is connected to routing node D and routing node H, routing node H is connected to routing node E, routing node G and routing node I, and routing node I is connected to routing node H and routing node F.
  • routing node is connected to 2 other routing nodes, 3 other routing nodes or 4 other routing nodes. It can be understood that due to the positional relationship of the routing nodes, since there are other routing nodes in only some directions of the edge routing nodes, the number of other routing nodes connected to the routing nodes at different positions is different.
  • each routing node is connected to at most 4 other routing nodes 101 .
  • the at least two routing nodes 101 are distributed in an array in the form of M rows*N columns, and each routing node 101 is connected to other routing nodes 101 adjacent in the row or column direction , where M and N are positive integers. It can be understood that if a plurality of routing nodes 101 are distributed in an array of M rows*N columns, each routing node 101 is connected to at most 4 other routing nodes 101, which is more in line with the efficiency of data transmission between routing nodes 101 and routing nodes 101.
  • routing node E The distances from routing node E to routing node B, routing node D, routing node F, and routing node H are the same, and the data transmission time is the same when the wiring materials are consistent.
  • routing node E is also connected to routing node A, the distance between routing node E and routing node A is greater than the distance from routing node E to routing node B, routing node D, routing node F and routing node H, which affects the network unit 10 on the contrary. Global adjustments.
  • At least two routing nodes are arranged in an array of M rows*N columns, so that the distance between every two routing nodes is the same, which can not only reduce the process in the manufacturing process, but also improve the performance of the network unit 10 .
  • FIG. 4 is a schematic structural diagram of another embodiment of the storage access circuit provided by the present application.
  • the network unit includes 9 routing nodes, arrayed in the form of M rows*N columns, where M can be 3, and N can be 3. Routing nodes include A, B, C, D, E, F, G, H, and I.
  • Each routing node is connected to two multiplexers 30 , and each multiplexer 30 is connected to eight storage control modules 40 .
  • Each routing node is connected to two computing engines 20 . Then the number of storage control modules 40 in the storage access circuit 100 is 144. The number of multiplexers 30 is 18, and the number of computing engines 20 is 18.
  • 144 storage control modules 40 can provide a bandwidth of 921.6GB/s, so that the storage access circuit 100 can realize high-bandwidth storage access to large-capacity storage units, so that the multiplexer 30 can output high-bandwidth
  • the stored and accessed data is sent to the routing node, and the routing node can reasonably distribute the stored and accessed data to any one or more computing engines 20 on the routing node, thereby improving computing performance.
  • the network unit includes 16 routing nodes, arrayed in the form of M rows*N columns, M may be 4, and N may be 4. Or M can be 2 and N can be 8.
  • Each routing node is connected to 4 multiplexers 30, and each multiplexer 30 is connected to 16 storage control modules. Each routing node is connected to 4 computing engines 20 . Then the number of storage control modules 40 in the storage access circuit 100 is 1024. The number of multiplexers 30 is 64, and the number of computing engines 20 is 64.
  • 1024 storage control modules 40 can provide a bandwidth of 6553.6GB/s, so that the storage access circuit 100 can realize high-bandwidth storage access to large-capacity storage units, so that the multiplexer 30 can output high-bandwidth
  • the stored and accessed data is sent to the routing node, and the routing node can reasonably distribute the stored and accessed data to any one or more computing engines 20 on the routing node, thereby improving computing performance.
  • the data bit width of the storage control module 40 may be 64 bits, and the frequency may be 900 MHz.
  • FIG. 5 is a schematic structural diagram of an embodiment of a storage control module provided by the present application.
  • the storage control module 40 includes a first interface unit 41 , a read control unit 42 , a write control unit 43 and a second interface unit 44 .
  • the first interface unit 41 is connected to the multiplexer 30; the read control unit 42 is connected to the first interface unit 41 for controlling the reading of data in the storage unit; the write control unit 43 is connected to the first interface unit 41 for Control writing data to the storage unit; the second interface unit 44 connects the read control unit 42 , the write control unit 43 and the storage unit.
  • the multiple storage control modules 40 are connected to a multiplexer 30, which can provide higher bandwidth during storage access, and achieve large High-bandwidth storage access for capacity storage units.
  • the multiplexer 30 can output high-bandwidth storage access data to the routing node, and the routing node can reasonably distribute the storage access data to any one or more computing engines on the routing node 20, thereby improving computing performance.
  • the storage unit may be a dynamic storage unit, then refer to FIG. 6 , which is a schematic structural diagram of another embodiment of the storage control module provided by the present application.
  • the storage control module 40 includes a first interface unit 41 , a read control unit 42 , a write control unit 43 , a second interface unit 44 and a refresh unit 45 .
  • the refresh unit 45 is connected to the second interface unit 44, and the refresh unit 45 is used for refreshing the storage unit.
  • the dynamic storage unit may be a DRAM (Dynamic Random Access Memory, dynamic random access memory) unit.
  • a dynamic memory cell temporarily stores information by storing charges through a gate capacitance. Because the stored information charge leaks after all, and the charge amount cannot be supplemented by the power supply through the load tube like the static storage element, the information will be lost after a long time. For this reason, the refresh unit 45 is required to refresh the storage unit. That is to charge the gate according to a certain rule, and replenish the information charge of the gate capacitance as needed.
  • multiple storage control modules 40 are applied to the storage access circuit 100 in any of the above-mentioned embodiments, multiple storage control modules 40 are connected to a multiplexer 30, which can provide higher bandwidth during storage access, and then storage access
  • the circuit 100 can realize high-bandwidth storage access to large-capacity DRAM units.
  • the multiplexer 30 can output high-bandwidth storage access data to the routing node, and the routing node 101 can reasonably distribute the storage access data to at least one computing engine 20 on the routing node, Thereby improving computing performance.
  • FIG. 7 is a schematic structural diagram of an embodiment of an integrated chip provided by the present application.
  • the integrated chip 200 includes a logic module 201 and a storage array module 202 .
  • the logic module 201 is integrated with a storage access circuit.
  • the storage access circuit may be the storage access circuit 100 in any of the foregoing embodiments.
  • the logic module 201 is connected to the storage array module 202; wherein, the storage array module 202 is integrated with a storage unit.
  • the memory array module 202 may be a dynamic random memory array module.
  • the storage control module 40 in the storage access circuit 100 is connected to the storage unit, and is used for reading and writing operations on the storage unit.
  • the logic module 201 and the storage array module 202 are stacked, and the storage control module 40 of the storage access circuit 100 is connected to the storage unit integrated on the storage array module 202, so that the wiring between the storage control module 40 and the storage unit is shortened, and the storage capacity can be improved. unit access speed, reducing power consumption and improving overall performance.
  • the stacking manner may be set according to actual sizes of the logic module 201 and the storage array module 202 .
  • the logic modules 201 and the storage array modules 202 may be stacked on each other.
  • a storage array module 202 is arranged between two logic modules 201 .
  • a logic module 201 is arranged between two storage array modules 202 .
  • the logic module 201 and the storage array module 202 are bonded and connected by 3-dimensional bonding technology, so that the storage access circuit in the logic module 201 can be directly connected with the storage unit in the storage array module 202, realizing high bandwidth, low Power memory access structure.
  • the above-mentioned logic module 201 and storage array module 202 may be made of a wafer (Wafer) or a die (Die) or a chip (chip).
  • the storage access circuit 100 in the integrated chip 200 when the storage access circuit 100 in the integrated chip 200 is accessing storage, at least two storage control 40 modules connected to each multiplexer 30 can provide higher bandwidth, thereby enabling large-scale High-bandwidth memory access for capacity dynamic random access memory units.
  • the multiplexer 30 can output high-bandwidth storage access data to the routing node, and the routing node can reasonably distribute the storage access data to at least one computing engine 20 on the routing node, thereby Improve computing performance.
  • the integrated chip 200 can be used as a storage device such as a memory stick or a hard disk.
  • FIG. 8 is a schematic structural diagram of an embodiment of an electronic device provided by the present application.
  • the electronic device 300 includes an integrated chip 200 .
  • the integrated chip 200 is like the integrated chip 200 in any of the above-mentioned embodiments.
  • the integrated chip 200 includes a logic module and a storage array module, wherein the above-mentioned storage access circuit is integrated on the logic module, and the storage array module is connected to the logic module.
  • the logic module and the storage array module are stacked and bonded.
  • the logic module and the storage array module are bonded and connected by 3-dimensional bonding technology, so that the storage access circuit in the logic module can be directly connected with the storage unit in the storage array module, realizing high-bandwidth, low-power storage access structure.
  • At least two storage control 40 modules connected to each multiplexer 30 can provide higher bandwidth, and then the storage access circuit 100 can realize High-bandwidth storage access to large-capacity dynamic random storage units, so that the multiplexer can output high-bandwidth storage access data to the routing node, and the routing node can reasonably allocate storage access data to at least one computing engine on the routing node, thereby Improve computing performance.
  • FIG. 9 is a schematic flowchart of an embodiment of a storage access method provided by the present application. The method is implemented based on any of the above storage access circuits 100, and the method includes:
  • Step 91 the routing node receives the data access instruction, and determines at least one corresponding multiplexer according to the data access instruction.
  • the data access instruction is sent by the computing engine or the external processing module.
  • Step 92 The multiplexer determines at least one corresponding storage control module according to the data access instruction.
  • data may be stored in different storage units, so the storage control module corresponding to the connected storage unit needs to be determined before data can be read.
  • Step 93 The storage control module acquires data from the correspondingly connected storage unit according to the data access instruction and sends it to the multiplexer.
  • Step 94 The multiplexer sends the data to the routing node.
  • the multiplexer synthesizes the data sent by each storage control module, and sends the synthesized data to the routing node, and the routing node sends the synthesized data to the computing engine.
  • the corresponding functional modules or external processing modules in the computing engine can generate data access instructions and send them to the routing node.
  • the routing node determines the corresponding multiple or single multiplexers according to the data access instructions and sends the data access instructions to the multiplexers.
  • multiplexer allocates according to the data access instruction to determine corresponding multiple or single storage control modules, and sends the data access instruction to the storage control module.
  • the storage control module acquires data from the correspondingly connected storage unit according to the data access instruction, and sends the data to the multiplexer.
  • the multiplexer synthesizes the data sent by multiple or single storage control modules, and sends the synthesized data to the routing node, and the routing node sends the synthesized data to the computing engine or the external processing module. After the corresponding function module or external processing module in the calculation engine obtains the synthesized data, it decodes the synthesized data to obtain the data before synthesis. Then perform calculations on these data.
  • a multiplexer when performing large-capacity storage access, is used to connect at least two storage control modules to provide higher storage access bandwidth, thereby realizing high-speed access to large-capacity DRAM units.
  • Bandwidth storage access so that the multiplexer can output high-bandwidth storage access data to routing nodes, and routing nodes can reasonably allocate storage access data to computing engines or external processing modules connected to routing nodes, thereby improving computing performance.
  • FIG. 10 is a schematic flowchart of another embodiment of a storage access method provided by the present application. The method is implemented based on any of the above storage access circuits 100, and the method includes:
  • Step 101 the routing node receives a data write instruction, and determines at least one corresponding multiplexer according to the data write instruction.
  • the data writing instruction is sent by the computing engine or the external processing module.
  • Step 102 The multiplexer determines at least one corresponding storage control module according to the data write instruction.
  • Step 103 the storage control module obtains the data to be written according to the data writing instruction, and writes the data to be written into the storage unit connected to the storage control module.
  • data can be written simultaneously through multiple storage control modules, and the data to be written can be written into the storage unit connected to the storage control module, which can shorten the time for writing data. time.
  • the corresponding functional modules or external processing modules in the computing engine can generate data write instructions and send them to the routing node.
  • the routing node determines the corresponding multiple or single multiplexers according to the data write instructions, and sends the data write instructions to to the multiplexer.
  • the multiplexer allocates according to the data writing instruction to determine corresponding multiple or single storage control modules, and sends the data writing instruction to the storage control modules.
  • the storage control module obtains the data to be written according to the data writing instruction, and writes the data to be written into the correspondingly connected storage unit.
  • a multiplexer when large-capacity data is written, a multiplexer is used to connect with at least two storage control modules to provide higher storage access bandwidth, thereby realizing the large-capacity DRAM unit High-bandwidth storage access, so that the multiplexer can output high-bandwidth storage access data to routing nodes, and routing nodes can reasonably allocate storage access data to computing engines or external processing modules connected to routing nodes, thereby improving computing performance .

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Abstract

The present application relates to the technical field of electronic circuits. Disclosed are a storage access circuit, an integrated chip, an electronic device and a storage access method. The storage access circuit comprises a network unit, multiplexers and storage control modules. Each routing node is connected to at least one multiplexer, and each multiplexer is connected to at least two storage control modules, so as to perform multiplexing on the at least two storage control modules, thereby performing storage access on storage units, which are connected to the storage control modules. In this way, high-bandwidth storage access to a high-capacity storage unit can be realized.

Description

存储访问电路、集成芯片、电子设备及存储访问方法Storage access circuit, integrated chip, electronic device and storage access method
本申请要求申请号为202110750108.2的中国专利申请的优先权,其内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with application number 202110750108.2, the contents of which are incorporated in this application by reference.
【技术领域】【Technical field】
本申请涉及电子电路技术领域,特别是涉及存储访问电路、集成芯片、电子设备及存储访问方法。The application relates to the technical field of electronic circuits, in particular to storage access circuits, integrated chips, electronic equipment and storage access methods.
【背景技术】【Background technique】
随着应用计算规模的快速增长,存储访问的带宽和能耗开销成为限制规模性计算电路发展的重要因素。With the rapid growth of application computing scale, storage access bandwidth and energy consumption have become important factors limiting the development of large-scale computing circuits.
【发明内容】【Content of invention】
本申请主要解决的技术问题是提供存储访问电路、集成芯片、电子设备及存储访问方法,能够实现对大容量存储单元的高带宽存储访问。The technical problem mainly solved by this application is to provide storage access circuit, integrated chip, electronic equipment and storage access method, which can realize high-bandwidth storage access to large-capacity storage units.
为了解决上述问题,本申请采用的第一种技术方案是:提供一种存储访问电路,该存储访问电路包括:网络单元,网络单元包括至少一个路由节点;多路复用器;存储控制模块,用于连接存储单元;其中,每一路由节点连接至少一个多路复用器,每一多路复用器连接至少两个存储控制模块,以对至少两个存储控制模块进行多路复用,进而对存储控制模块连接的存储单元进行存储访问。In order to solve the above problems, the first technical solution adopted by the present application is to provide a storage access circuit, the storage access circuit includes: a network unit, the network unit includes at least one routing node; a multiplexer; a storage control module, For connecting storage units; wherein, each routing node is connected to at least one multiplexer, and each multiplexer is connected to at least two storage control modules to multiplex at least two storage control modules, Further, storage access is performed to the storage unit connected to the storage control module.
其中,每个路由节点连接至多4个其他路由节点。Wherein, each routing node is connected to at most 4 other routing nodes.
其中,至少两个路由节点按照M行*N列的形式阵列分布,每一路由节点与行方向或列方向相邻的其他路由节点连接,其中,M和N为正整数。Wherein, at least two routing nodes are distributed in an array in the form of M rows*N columns, and each routing node is connected to other routing nodes adjacent in the row or column direction, wherein M and N are positive integers.
其中,M为3,N为3;每一路由节点连接2个多路复用器,每一多路复用器连接8个存储控制模块。Wherein, M is 3, and N is 3; each routing node is connected to 2 multiplexers, and each multiplexer is connected to 8 storage control modules.
其中,M为4,N为4;每一路由节点连接4个多路复用器,每一多路复用器连接16个存储控制模块。Wherein, M is 4, and N is 4; each routing node is connected to 4 multiplexers, and each multiplexer is connected to 16 storage control modules.
其中,存储控制模块包括:第一接口单元,连接多路复用器;读控制单元,连接第一接口单元,用于控制读取存储单元中的数据;写控制单元,连接第一接口单元,用于控制写入数据至存储单元;第二接口单元,连接读控制单元、写控制单元和存储单元。Wherein, the storage control module includes: a first interface unit connected to the multiplexer; a read control unit connected to the first interface unit for controlling the reading of data in the storage unit; a write control unit connected to the first interface unit, It is used to control writing data to the storage unit; the second interface unit is connected to the read control unit, the write control unit and the storage unit.
其中,存储控制模块还包括刷新单元,连接第二接口单元,刷新单元用于对存储单元进行刷新。Wherein, the storage control module further includes a refresh unit connected to the second interface unit, and the refresh unit is used for refreshing the storage unit.
其中,存储控制模块的数据位宽为128bit,频率为400MHz。Wherein, the data bit width of the storage control module is 128bit, and the frequency is 400MHz.
其中,该存储访问电路还包括:运算引擎,每一路由节点连接至少 一个运算引擎。Wherein, the storage access circuit also includes: computing engines, and each routing node is connected to at least one computing engine.
其中,路由节点到与路由节点连接的其他路由节点之间的距离相同。Wherein, the distance between the routing node and other routing nodes connected to the routing node is the same.
其中,路由节点到与路由节点连接的其他路由节点之间的数据传输时间相同。Wherein, the data transmission time between the routing node and other routing nodes connected to the routing node is the same.
为了解决上述问题,本申请采用的第二种技术方案是:提供一种集成芯片,该集成芯片包括:逻辑模块和存储阵列模块;逻辑模块上集成有存储访问电路;存储访问电路包括:网络单元,网络单元包括至少一个路由节点;多路复用器;存储控制模块,用于连接存储单元;其中,每一路由节点连接至少一个多路复用器,每一多路复用器连接至少两个存储控制模块,以对至少两个存储控制模块进行多路复用,进而对存储控制模块连接的存储单元进行存储访问;存储阵列模块集成有存储单元,且逻辑模块与存储阵列模块层叠键合连接。In order to solve the above problems, the second technical solution adopted by this application is to provide an integrated chip, which includes: a logic module and a storage array module; a storage access circuit is integrated on the logic module; the storage access circuit includes: a network unit , the network unit includes at least one routing node; a multiplexer; a storage control module for connecting the storage unit; wherein, each routing node is connected to at least one multiplexer, and each multiplexer is connected to at least two A storage control module, to multiplex at least two storage control modules, and then perform storage access to the storage unit connected to the storage control module; the storage array module is integrated with the storage unit, and the logic module and the storage array module are laminated and bonded connect.
其中,存储阵列模块为动态随机存储阵列模块。Wherein, the storage array module is a dynamic random storage array module.
其中,每个路由节点连接至多4个其他路由节点;其中,路由节点到与路由节点连接的其他路由节点之间的距离相同;和/或路由节点到与路由节点连接的其他路由节点之间的数据传输时间相同。Wherein, each routing node is connected to at most 4 other routing nodes; wherein, the distance between the routing node and other routing nodes connected with the routing node is the same; and/or the distance between the routing node and other routing nodes connected with the routing node Data transfer times are the same.
其中,至少两个路由节点按照M行*N列的形式阵列分布,每一路由节点与行方向或列方向相邻的其他路由节点连接,其中,M和N为正整数。Wherein, at least two routing nodes are distributed in an array in the form of M rows*N columns, and each routing node is connected to other routing nodes adjacent in the row or column direction, wherein M and N are positive integers.
为了解决上述问题,本申请采用的第三种技术方案是:提供一种存储访问方法,该方法包括:路由节点接收数据访问指令,并根据数据访问指令确定对应的至少一个多路复用器;多路复用器根据数据访问指令确定对应的至少一个存储控制模块;存储控制模块根据数据访问指令从对应连接的存储单元中获取数据并发送至多路复用器;多路复用器将数据发送至路由节点。In order to solve the above problems, the third technical solution adopted by the present application is to provide a storage access method, the method includes: a routing node receives a data access instruction, and determines at least one corresponding multiplexer according to the data access instruction; The multiplexer determines at least one corresponding storage control module according to the data access instruction; the storage control module obtains data from the correspondingly connected storage unit according to the data access instruction and sends it to the multiplexer; the multiplexer sends the data to the routing node.
其中,多路复用器将数据发送至路由节点的步骤,包括:多路复用器将数据进行合成,并将合成后的数据发送至路由节点。Wherein, the step of the multiplexer sending the data to the routing node includes: the multiplexer synthesizes the data, and sends the synthesized data to the routing node.
其中,多路复用器将数据发送至路由节点的步骤之后,还包括:路由节点将合成后的数据发送至运算引擎;运算引擎对合成后的数据进行解码,基于解码后的数据进行对应的运算。Wherein, after the multiplexer sends the data to the routing node, it also includes: the routing node sends the synthesized data to the calculation engine; the calculation engine decodes the synthesized data, and performs corresponding processing based on the decoded data operation.
其中,该方法还包括:路由节点接收数据写入指令,并根据数据写入指令确定对应的至少一个多路复用器;多路复用器根据数据写入指令确定对应的至少一个存储控制模块;存储控制模块根据数据写入指令获取待写入数据,并将待写入数据写入与存储控制模块连接的存储单元中。Wherein, the method further includes: the routing node receives the data write instruction, and determines at least one corresponding multiplexer according to the data write instruction; the multiplexer determines the corresponding at least one storage control module according to the data write instruction ; The storage control module obtains the data to be written according to the data writing instruction, and writes the data to be written into the storage unit connected to the storage control module.
其中,路由节点接收数据写入指令的步骤之前,包括:运算引擎产生写入指令,并将写入指令发送至路由节点。Wherein, before the step of the routing node receiving the data writing instruction, it includes: the computing engine generates the writing instruction, and sends the writing instruction to the routing node.
本申请的有益效果是:区别于现有技术的情况,本申请提供的存储访问电路、集成芯片、电子设备及存储访问方法。该存储访问电路利用每一路由节点连接至少一个多路复用器,每一多路复用器连接至少两个存储控制模块的方式,能够对至少两个存储控制模块进行多路复用,进而对存储控制模块连接的存储单元进行存储访问,在存储访问时,每一多路复用器连接的至少两个存储控制模块能够提供更高的带宽,以此能够实现对大容量存储单元的高带宽存储访问。The beneficial effect of the application is: different from the situation of the prior art, the storage access circuit, integrated chip, electronic equipment and storage access method provided by the application. The storage access circuit utilizes each routing node to connect at least one multiplexer, and each multiplexer is connected to at least two storage control modules, so that at least two storage control modules can be multiplexed, and then Perform storage access to the storage unit connected to the storage control module. During storage access, at least two storage control modules connected to each multiplexer can provide higher bandwidth, so as to realize high-capacity storage unit Bandwidth storage access.
【附图说明】【Description of drawings】
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。其中:In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort. in:
图1是本申请提供的存储访问电路一实施例的结构示意图;FIG. 1 is a schematic structural diagram of an embodiment of a storage access circuit provided by the present application;
图2是本申请提供的存储访问电路另一实施例的结构示意图;FIG. 2 is a schematic structural diagram of another embodiment of the storage access circuit provided by the present application;
图3是本申请提供的多个路由节点一实施例的结构示意图;FIG. 3 is a schematic structural diagram of an embodiment of a plurality of routing nodes provided by the present application;
图4是本申请提供的存储访问电路另一实施例的结构示意图;FIG. 4 is a schematic structural diagram of another embodiment of the storage access circuit provided by the present application;
图5是本申请提供的存储控制模块一实施例的结构示意图;FIG. 5 is a schematic structural diagram of an embodiment of a storage control module provided by the present application;
图6是本申请提供的存储控制模块另一实施例的结构示意图;FIG. 6 is a schematic structural diagram of another embodiment of the storage control module provided by the present application;
图7是本申请提供的集成芯片一实施例的结构示意图;FIG. 7 is a schematic structural diagram of an embodiment of an integrated chip provided by the present application;
图8是本申请提供的电子设备一实施例的结构示意图;FIG. 8 is a schematic structural diagram of an embodiment of an electronic device provided by the present application;
图9是本申请提供的存储访问方法一实施例的流程示意图;FIG. 9 is a schematic flowchart of an embodiment of a storage access method provided by the present application;
图10是本申请提供的存储访问方法另一实施例的流程示意图。Fig. 10 is a schematic flowchart of another embodiment of the storage access method provided by the present application.
【具体实施方式】【detailed description】
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。可以理解的是,此处所描述的具体实施例仅用于解释本申请,而非对本申请的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本申请相关的部分而非全部结构。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
本申请中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结 构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.
参阅图1,图1是本申请提供的存储访问电路一实施例的结构示意图。该存储访问电路100包括网络单元10、多路复用器30和存储控制模块40。Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of an embodiment of a storage access circuit provided in the present application. The storage access circuit 100 includes a network unit 10 , a multiplexer 30 and a storage control module 40 .
其中,网络单元10包括至少一个路由节点101,每一路由节点101连接至少一个多路复用器30,每一多路复用器30连接至少两个存储控制模块40,以对至少两个存储控制模块40进行多路复用,进而对存储控制模块40连接的存储单元进行存储访问。Wherein, the network unit 10 includes at least one routing node 101, and each routing node 101 is connected with at least one multiplexer 30, and each multiplexer 30 is connected with at least two storage control modules 40, so as to control at least two storage The control module 40 performs multiplexing, and then performs storage access to the storage units connected to the storage control module 40 .
在一些实施例中,网络单元10可以是片上网络。如二维网格片上网络。片上网络(Network on chip,NoC)是片上系统(System on chip,SoC)的一种新的通信方法。它是多核技术的主要组成部分。NoC方法带来了一种全新的片上通信方法,显著优于传统总线式系统(bus)的性能。基于NoC的系统能更好地适应在未来复杂多核SoC设计中使用的全局异步局部同步的时钟机制。In some embodiments, network unit 10 may be a network-on-chip. Such as two-dimensional mesh network on chip. Network on chip (NoC) is a new communication method for System on chip (SoC). It is the main component of multi-core technology. The NoC approach brings a new on-chip communication method that significantly outperforms the performance of traditional bus-based systems (bus). NoC-based systems are better suited to globally asynchronous and partially synchronous clocking mechanisms used in future complex multi-core SoC designs.
多路复用器30能接收多个输入信号,按每个输入信号可恢复方式合成单个输出信号,选择从相应的通道进行数据读取或者写入。The multiplexer 30 can receive multiple input signals, synthesize a single output signal in a recoverable manner for each input signal, and select to read or write data from the corresponding channel.
存储控制模块40用于连接存储单元,以控制存储单元,如从存储单元中读取数据或者向存储单元中写入数据。The storage control module 40 is used to connect the storage unit to control the storage unit, such as reading data from the storage unit or writing data to the storage unit.
在一些实施例中,可以根据实际需要对路由节点101、多路复用器30和存储控制模块40的数量进行设置。进一步,每一路由节点101连接的多路复用器30的数量可以相同,如每一路由节点101连接1、2、3、4、5或6个多路复用器30。在另一应用场景中,每一路由节点101连接的多路复用器30的数量可以不相同,如,第一个路由节点101连接2个多路复用器30,第二个路由节点101连接3个多路复用器30,第三个路由节点101连接4个多路复用器30,第四个路由节点101连接2个多路复用器30。In some embodiments, the numbers of routing nodes 101, multiplexers 30 and storage control modules 40 may be set according to actual needs. Further, the number of multiplexers 30 connected to each routing node 101 may be the same, for example, each routing node 101 is connected to 1, 2, 3, 4, 5 or 6 multiplexers 30 . In another application scenario, the number of multiplexers 30 connected to each routing node 101 may be different, for example, the first routing node 101 is connected to two multiplexers 30, and the second routing node 101 Three multiplexers 30 are connected, the third routing node 101 is connected to four multiplexers 30 , and the fourth routing node 101 is connected to two multiplexers 30 .
进一步,每一多路复用器30连接的存储控制模块40的数量可以相同,如每一多路复用器30连2、4、8或16个存储控制模块40。每一多路复用器30连接的存储控制模块40的数量也可以不相同,如第一个多路复用器30连接4个存储控制模块40,第二个多路复用器30连接8个存储控制模块40,第三个多路复用器30连接16个存储控制模块40,第四个多路复用器30连接32个存储控制模块40。Further, the number of storage control modules 40 connected to each multiplexer 30 may be the same, for example, each multiplexer 30 is connected to 2, 4, 8 or 16 storage control modules 40 . The number of storage control modules 40 connected to each multiplexer 30 can also be different, such as the first multiplexer 30 is connected to 4 storage control modules 40, and the second multiplexer 30 is connected to 8 storage control modules 40, the third multiplexer 30 is connected to 16 storage control modules 40, and the fourth multiplexer 30 is connected to 32 storage control modules 40.
其中,存储访问电路100中的路由节点101连接外部处理模块,基于此,对整个存储访问电路100的读取流程进行说明:Wherein, the routing node 101 in the storage access circuit 100 is connected to an external processing module. Based on this, the reading process of the entire storage access circuit 100 is described:
外部处理模块可以产生数据访问指令,并发送至路由节点101,路 由节点101根据数据访问指令确定对应的多个或单个多路复用器30,将数据访问指令发送至该多路复用器30。多路复用器30根据该数据访问指令进行分配,以确定对应的多个或单个存储控制模块40,并向存储控制模块40发送数据访问指令。存储控制模块40根据数据访问指令从对应连接的存储单元中获取数据,并发送至多路复用器30。多路复用器30将多个或单个存储控制模块40发送的数据进行合成,并将合成后的数据发送至路由节点101,路由节点101将该合成数据发送至外部处理模块中。外部处理模块在获取到合成数据后,将合成数据进行解码,得到合成前的数据。然后根据这些数据进行运算。The external processing module can generate a data access instruction and send it to the routing node 101, and the routing node 101 determines corresponding multiple or single multiplexers 30 according to the data access instruction, and sends the data access instruction to the multiplexer 30 . The multiplexer 30 allocates according to the data access instruction to determine corresponding multiple or single storage control modules 40 , and sends the data access instruction to the storage control module 40 . The storage control module 40 acquires data from the correspondingly connected storage units according to the data access instruction, and sends the data to the multiplexer 30 . The multiplexer 30 synthesizes the data sent by multiple or single storage control modules 40, and sends the synthesized data to the routing node 101, and the routing node 101 sends the synthesized data to the external processing module. After obtaining the synthesized data, the external processing module decodes the synthesized data to obtain the data before synthesis. Then perform calculations on these data.
对整个存储访问电路100的写入流程进行说明:The writing process of the entire storage access circuit 100 is described as follows:
外部处理模块可以产生数据写入指令,并发送至路由节点101,路由节点101根据数据写入指令确定对应的多个或单个多路复用器30,将数据写入指令发送至该多路复用器30。多路复用器30根据该数据写入指令进行分配,以确定对应的多个或单个存储控制模块40,并向存储控制模块40发送数据写入指令。存储控制模块40根据数据写入指令获取待写入数据,并将待写入数据写入对应连接的存储单元中。The external processing module can generate a data writing instruction and send it to the routing node 101, and the routing node 101 determines corresponding multiple or single multiplexers 30 according to the data writing instruction, and sends the data writing instruction to the multiplexer 30. Use device 30. The multiplexer 30 distributes according to the data write instruction to determine corresponding multiple or single storage control modules 40 , and sends the data write instruction to the storage control module 40 . The storage control module 40 obtains the data to be written according to the data writing instruction, and writes the data to be written into the correspondingly connected storage unit.
在本实施例中,该存储访问电路100利用每一路由节点连接至少一个多路复用器30,每一多路复用器30连接至少两个存储控制模块40的方式,能够对至少两个存储控制模块40进行多路复用。在存储访问时,每一多路复用器30连接的至少两个存储控制模块40能够提供更高的带宽,以此能够实现对大容量存储单元的高带宽存储访问。In this embodiment, the storage access circuit 100 utilizes the way that each routing node is connected to at least one multiplexer 30, and each multiplexer 30 is connected to at least two storage control modules 40, so that at least two The storage control module 40 performs multiplexing. During storage access, at least two storage control modules 40 connected to each multiplexer 30 can provide higher bandwidth, thereby enabling high-bandwidth storage access to large-capacity storage units.
参阅图2,图2是本申请提供的存储访问电路另一实施例的结构示意图。与上述图1所示的第一实施例相比,本实施例的区别在于,还包括运算引擎20。Referring to FIG. 2 , FIG. 2 is a schematic structural diagram of another embodiment of a storage access circuit provided in the present application. Compared with the above-mentioned first embodiment shown in FIG. 1 , the difference of this embodiment is that a computing engine 20 is also included.
运算引擎20可以包括CPU(central processing unit,中央处理器)、DSP(Digital Signal Processor,数字信号处理器)、GPU(graphics processing unit,图形处理器)中的至少一种。The computing engine 20 may include at least one of a CPU (central processing unit, central processing unit), a DSP (Digital Signal Processor, digital signal processor), and a GPU (graphics processing unit, graphics processor).
其中,每一路由节点连接至少一个运算引擎20和至少一个多路复用器30,每一多路复用器30连接多个存储控制模块40,以对多个存储控制模块40进行多路复用。路由节点101用于控制数据传输。如多路复用器30输出的数据通过路由节点101传输至运算引擎20,以使运算引擎20基于这些数据进行对应的运算。Wherein, each routing node is connected to at least one computing engine 20 and at least one multiplexer 30, and each multiplexer 30 is connected to multiple storage control modules 40 to multiplex multiple storage control modules 40 use. Routing node 101 is used to control data transmission. The data output by the multiplexer 30 is transmitted to the calculation engine 20 through the routing node 101, so that the calculation engine 20 performs corresponding calculations based on these data.
在一些实施例中,可以根据实际需要对路由节点101、运算引擎20、多路复用器30和存储控制模块40的数量进行设置。在一应用场景中,每一路由节点101连接的运算引擎20的数量可以相同,如每一路由节点101连接2、3、4、5或6个运算引擎20。在另一应用场景中,每一路由节点101连接的运算引擎20的数量可以不相同,如,第一个路由节点101连接2个运算引擎20,第二个路由节点101连接3个运算引擎 20,第三个路由节点101连接4个运算引擎20,第四个路由节点101连接2个运算引擎20。In some embodiments, the numbers of routing nodes 101 , computing engines 20 , multiplexers 30 and storage control modules 40 can be set according to actual needs. In an application scenario, the number of computing engines 20 connected to each routing node 101 may be the same, for example, 2, 3, 4, 5 or 6 computing engines 20 connected to each routing node 101 . In another application scenario, the number of computing engines 20 connected to each routing node 101 may be different, for example, the first routing node 101 is connected to 2 computing engines 20, and the second routing node 101 is connected to 3 computing engines 20 , the third routing node 101 is connected to four computing engines 20 , and the fourth routing node 101 is connected to two computing engines 20 .
在一应用场景中,对整个存储访问电路100的读取流程进行说明:In an application scenario, the reading process of the entire storage access circuit 100 is described as follows:
运算引擎20中相应的功能模块可以产生数据访问指令,并发送至路由节点101,路由节点101根据数据访问指令确定对应的多个或单个多路复用器30,将数据访问指令发送至该多路复用器30。多路复用器30根据该数据访问指令进行分配,以确定对应的多个或单个存储控制模块40,并向存储控制模块40发送数据访问指令。存储控制模块40根据数据访问指令从对应连接的存储单元中获取数据,并发送至多路复用器30。多路复用器30将多个或单个存储控制模块40发送的数据进行合成,并将合成后的数据发送至路由节点,路由节点将该合成数据发送至运算引擎20中。运算引擎20中相应的功能模块在获取到合成数据后,将合成数据进行解码,得到合成前的数据。然后根据这些数据进行运算。The corresponding functional modules in the computing engine 20 can generate data access instructions and send them to the routing node 101. The routing node 101 determines the corresponding multiple or single multiplexers 30 according to the data access instructions, and sends the data access instructions to the multiplexers 30. Multiplexer 30. The multiplexer 30 allocates according to the data access instruction to determine corresponding multiple or single storage control modules 40 , and sends the data access instruction to the storage control module 40 . The storage control module 40 acquires data from the correspondingly connected storage units according to the data access instruction, and sends the data to the multiplexer 30 . The multiplexer 30 synthesizes the data sent by multiple or single storage control modules 40 , and sends the synthesized data to the routing node, and the routing node sends the synthesized data to the computing engine 20 . After obtaining the synthesized data, the corresponding functional modules in the calculation engine 20 decode the synthesized data to obtain the data before synthesis. Then perform calculations on these data.
在一应用场景中,对整个存储访问电路100的写入流程进行说明:In an application scenario, the writing process of the entire storage access circuit 100 is described as follows:
运算引擎20中相应的功能模块可以产生数据写入指令,并发送至路由节点101,路由节点101根据数据写入指令确定对应的多个或单个多路复用器30,将数据写入指令发送至该多路复用器30。多路复用器30根据该数据写入指令进行分配,以确定对应的多个或单个存储控制模块40,并向存储控制模块40发送数据写入指令。存储控制模块40根据数据写入指令将获取待写入数据,并将待写入数据写入对应连接的存储单元中。The corresponding functional modules in the computing engine 20 can generate a data write instruction and send it to the routing node 101, and the routing node 101 determines corresponding multiple or single multiplexers 30 according to the data writing instruction, and sends the data writing instruction to to the multiplexer 30. The multiplexer 30 distributes according to the data write instruction to determine corresponding multiple or single storage control modules 40 , and sends the data write instruction to the storage control module 40 . The storage control module 40 acquires the data to be written according to the data writing instruction, and writes the data to be written into the correspondingly connected storage unit.
在本实施例中,该存储访问电路100利用每一路由节点101连接至少一个多路复用器30,每一多路复用器30连接至少两个存储控制模块40的方式,能够对至少两个存储控制模块40进行多路复用。在存储访问时,每一多路复用器30连接的至少两个存储控制40模块能够提供更高的带宽,以此能够实现对大容量存储单元的高带宽存储访问,从而多路复用器30能够输出高带宽的存储访问数据至路由节点101,路由节点101能够合理分配存储访问数据给路由节点101上的任意一个或多个运算引擎20,从而提升运算性能。In this embodiment, the storage access circuit 100 utilizes the way that each routing node 101 is connected to at least one multiplexer 30, and each multiplexer 30 is connected to at least two storage control modules 40, so that at least two A storage control module 40 performs multiplexing. During storage access, at least two storage control 40 modules connected to each multiplexer 30 can provide higher bandwidth, thereby enabling high-bandwidth storage access to large-capacity storage units, so that the multiplexer 30 can output high-bandwidth storage access data to routing node 101, and routing node 101 can reasonably allocate storage access data to any one or more computing engines 20 on routing node 101, thereby improving computing performance.
参阅图3,图3是本申请提供的多个路由节点一实施例的结构示意图。以图3中9个路由节点为例进行说明:Referring to FIG. 3 , FIG. 3 is a schematic structural diagram of an embodiment of multiple routing nodes provided by the present application. Take the nine routing nodes in Figure 3 as an example for illustration:
路由节点包括A、B、C、D、E、F、G、H和I。其中,路由节点A与路由节点B和路由节点D连接,路由节点B与路由节点A、路由节点C和路由节点E连接,路由节点C与路由节点B和路由节点F连接,路由节点E与路由节点A、路由节点E和路由节点G连接,路由节点E与路由节点B、路由节点D、路由节点F和路由节点H连接,路由节点F与路由节点C、路由节点E和路由节点I连接,路由节点G与路由节点D和路由节点H连接,路由节点H与路由节点E、路由节点G和路 由节点I连接,路由节点I与路由节点H和路由节点F连接。Routing nodes include A, B, C, D, E, F, G, H, and I. Among them, routing node A is connected with routing node B and routing node D, routing node B is connected with routing node A, routing node C and routing node E, routing node C is connected with routing node B and routing node F, routing node E is connected with routing node Node A, routing node E and routing node G are connected, routing node E is connected with routing node B, routing node D, routing node F and routing node H, routing node F is connected with routing node C, routing node E and routing node I, Routing node G is connected to routing node D and routing node H, routing node H is connected to routing node E, routing node G and routing node I, and routing node I is connected to routing node H and routing node F.
其中,可以看到,存在路由节点连接2个其他路由节点、3个其他路由节点或4个其他路由节点的情况。可以理解,因路由节点的位置关系,边缘的路由节点因只有部分方向存在其他路由节点,则不同位置的路由节点连接的其他路由节点的数量不同。Wherein, it can be seen that the routing node is connected to 2 other routing nodes, 3 other routing nodes or 4 other routing nodes. It can be understood that due to the positional relationship of the routing nodes, since there are other routing nodes in only some directions of the edge routing nodes, the number of other routing nodes connected to the routing nodes at different positions is different.
因此,每个路由节点连接至多4个其他路由节点101。Thus, each routing node is connected to at most 4 other routing nodes 101 .
进一步,在网络单元包括至少两个路由节点101时,至少两个路由节点101按照M行*N列的形式阵列分布,每一路由节点101与行方向或列方向相邻的其他路由节点101连接,其中,M和N为正整数。可以理解,若多个路由节点101按照M行*N列的形式阵列分布,则每个路由节点101连接至多4个其他路由节点101更加符合路由节点101与路由节点101之间的数据传输效率。Further, when the network unit includes at least two routing nodes 101, the at least two routing nodes 101 are distributed in an array in the form of M rows*N columns, and each routing node 101 is connected to other routing nodes 101 adjacent in the row or column direction , where M and N are positive integers. It can be understood that if a plurality of routing nodes 101 are distributed in an array of M rows*N columns, each routing node 101 is connected to at most 4 other routing nodes 101, which is more in line with the efficiency of data transmission between routing nodes 101 and routing nodes 101.
结合图3进行说明:Combined with Figure 3 for illustration:
路由节点E到路由节点B、路由节点D、路由节点F和路由节点H的距离相同的,在布线材料一致的情况下,数据传输的时间是相同的。The distances from routing node E to routing node B, routing node D, routing node F, and routing node H are the same, and the data transmission time is the same when the wiring materials are consistent.
若路由节点E还与路由节点A连接,则路由节点E与路由节点A距离大于路由节点E到路由节点B、路由节点D、路由节点F和路由节点H的距离,这样反而影响网络单元10的全局调整。If routing node E is also connected to routing node A, the distance between routing node E and routing node A is greater than the distance from routing node E to routing node B, routing node D, routing node F and routing node H, which affects the network unit 10 on the contrary. Global adjustments.
因此,至少两个路由节点按照M行*N列的形式阵列分布,使每两个路由节点之间的距离相同,不仅在制作工艺上能够减少流程,而且还能提升网络单元10的性能。Therefore, at least two routing nodes are arranged in an array of M rows*N columns, so that the distance between every two routing nodes is the same, which can not only reduce the process in the manufacturing process, but also improve the performance of the network unit 10 .
基于此,参阅图4,图4是本申请提供的存储访问电路另一实施例的结构示意图。网络单元包括9个路由节点,按照M行*N列的形式阵列,M可以为3,N可以为3。路由节点包括A、B、C、D、E、F、G、H和I。Based on this, please refer to FIG. 4 , which is a schematic structural diagram of another embodiment of the storage access circuit provided by the present application. The network unit includes 9 routing nodes, arrayed in the form of M rows*N columns, where M can be 3, and N can be 3. Routing nodes include A, B, C, D, E, F, G, H, and I.
每一路由节点连接2个多路复用器30,每一多路复用器30连接8个存储控制模块40。每一路由节点连接2个运算引擎20。则存储访问电路100中存储控制模块40的数量为144个。多路复用器30的数量为18个,运算引擎20的数量为18个。Each routing node is connected to two multiplexers 30 , and each multiplexer 30 is connected to eight storage control modules 40 . Each routing node is connected to two computing engines 20 . Then the number of storage control modules 40 in the storage access circuit 100 is 144. The number of multiplexers 30 is 18, and the number of computing engines 20 is 18.
以存储控制模块40的数据位宽为128bit,频率为400MHz为例,单个存储控制模块40的带宽为(128*400/8)MBps=6.4GB/s。则存储访问电路100的总带宽为144*6.4GB/s=921.6GB/s。Taking the data bit width of the storage control module 40 as 128bit and the frequency as 400MHz as an example, the bandwidth of a single storage control module 40 is (128*400/8)MBps=6.4GB/s. Then the total bandwidth of the storage access circuit 100 is 144*6.4GB/s=921.6GB/s.
在本实施例中,144个存储控制模块40能够提供921.6GB/s的带宽,从而存储访问电路100可以实现对大容量存储单元的高带宽存储访问,从而多路复用器30能够输出高带宽的存储访问数据至路由节点,路由节点能够合理分配存储访问数据给路由节点上的任意一个或多个运算引擎20,从而提升运算性能。In this embodiment, 144 storage control modules 40 can provide a bandwidth of 921.6GB/s, so that the storage access circuit 100 can realize high-bandwidth storage access to large-capacity storage units, so that the multiplexer 30 can output high-bandwidth The stored and accessed data is sent to the routing node, and the routing node can reasonably distribute the stored and accessed data to any one or more computing engines 20 on the routing node, thereby improving computing performance.
在其他实施例中,网络单元包括16个路由节点,按照M行*N列的 形式阵列,M可以为4,N可以为4。或者M可以为2,N可以为8。In other embodiments, the network unit includes 16 routing nodes, arrayed in the form of M rows*N columns, M may be 4, and N may be 4. Or M can be 2 and N can be 8.
以M为4,N为4为例进行说明:Take M as 4 and N as 4 as an example for illustration:
每一路由节点连接4个多路复用器30,每一多路复用器30连接16个存储控制模块。每一路由节点连接4个运算引擎20。则存储访问电路100中存储控制模块40的数量为1024个。多路复用器30的数量为64个,运算引擎20的数量为64个。Each routing node is connected to 4 multiplexers 30, and each multiplexer 30 is connected to 16 storage control modules. Each routing node is connected to 4 computing engines 20 . Then the number of storage control modules 40 in the storage access circuit 100 is 1024. The number of multiplexers 30 is 64, and the number of computing engines 20 is 64.
以存储控制模块40的数据位宽为128bit,频率为400MHz为例,单个存储控制模块40的带宽为(128*400/8)MBps=6.4GB/s。则存储访问电路100的总带宽为1024*6.4GB/s=6553.6GB/s。Taking the data bit width of the storage control module 40 as 128bit and the frequency as 400MHz as an example, the bandwidth of a single storage control module 40 is (128*400/8)MBps=6.4GB/s. Then the total bandwidth of the storage access circuit 100 is 1024*6.4GB/s=6553.6GB/s.
在本实施例中,1024个存储控制模块40能够提供6553.6GB/s的带宽,从而存储访问电路100可以实现对大容量存储单元的高带宽存储访问,从而多路复用器30能够输出高带宽的存储访问数据至路由节点,路由节点能够合理分配存储访问数据给路由节点上的任意一个或多个运算引擎20,从而提升运算性能。In this embodiment, 1024 storage control modules 40 can provide a bandwidth of 6553.6GB/s, so that the storage access circuit 100 can realize high-bandwidth storage access to large-capacity storage units, so that the multiplexer 30 can output high-bandwidth The stored and accessed data is sent to the routing node, and the routing node can reasonably distribute the stored and accessed data to any one or more computing engines 20 on the routing node, thereby improving computing performance.
在其他实施例中,存储控制模块40的数据位宽可以为64bit,频率为900MHz。In other embodiments, the data bit width of the storage control module 40 may be 64 bits, and the frequency may be 900 MHz.
参阅图5,图5是本申请提供的存储控制模块一实施例的结构示意图。存储控制模块40包括第一接口单元41、读控制单元42、写控制单元43和第二接口单元44。Referring to FIG. 5 , FIG. 5 is a schematic structural diagram of an embodiment of a storage control module provided by the present application. The storage control module 40 includes a first interface unit 41 , a read control unit 42 , a write control unit 43 and a second interface unit 44 .
其中,第一接口单元41连接多路复用器30;读控制单元42连接第一接口单元41,用于控制读取存储单元中的数据;写控制单元43连接第一接口单元41,用于控制写入数据至存储单元;第二接口单元44连接读控制单元42、写控制单元43和存储单元。Wherein, the first interface unit 41 is connected to the multiplexer 30; the read control unit 42 is connected to the first interface unit 41 for controlling the reading of data in the storage unit; the write control unit 43 is connected to the first interface unit 41 for Control writing data to the storage unit; the second interface unit 44 connects the read control unit 42 , the write control unit 43 and the storage unit.
当多个存储控制模块40应用于上述任一实施例中存储访问电路100时,多个存储控制模块40连接一多路复用器30,在存储访问时能够提供更高的带宽,实现对大容量存储单元的高带宽存储访问。在存储访问电路100中存在运算引擎20时,多路复用器30能够输出高带宽的存储访问数据至路由节点,路由节点能够合理分配存储访问数据给路由节点上的任意一个或多个运算引擎20,从而提升运算性能。When multiple storage control modules 40 are applied to the storage access circuit 100 in any of the above-mentioned embodiments, the multiple storage control modules 40 are connected to a multiplexer 30, which can provide higher bandwidth during storage access, and achieve large High-bandwidth storage access for capacity storage units. When there is a computing engine 20 in the storage access circuit 100, the multiplexer 30 can output high-bandwidth storage access data to the routing node, and the routing node can reasonably distribute the storage access data to any one or more computing engines on the routing node 20, thereby improving computing performance.
进一步,存储单元可能是动态存储单元,则参阅图6,图6是本申请提供的存储控制模块另一实施例的结构示意图。存储控制模块40包括第一接口单元41、读控制单元42、写控制单元43、第二接口单元44和刷新单元45。其中,刷新单元45连接第二接口单元44,刷新单元45用于对存储单元进行刷新。动态存储单元可以是DRAM(Dynamic Random Access Memory,动态随机存取存储器)单元。Further, the storage unit may be a dynamic storage unit, then refer to FIG. 6 , which is a schematic structural diagram of another embodiment of the storage control module provided by the present application. The storage control module 40 includes a first interface unit 41 , a read control unit 42 , a write control unit 43 , a second interface unit 44 and a refresh unit 45 . Wherein, the refresh unit 45 is connected to the second interface unit 44, and the refresh unit 45 is used for refreshing the storage unit. The dynamic storage unit may be a DRAM (Dynamic Random Access Memory, dynamic random access memory) unit.
可以理解,动态存储单元是通过栅极电容存储电荷来暂存信息。由于存储的信息电荷终究是有泄漏的,电荷数又不能像静态存储元那样由电源经负载管来补充,时间一长,信息就会丢失,为此则需要刷新单元 45对存储单元进行刷新,即按一定规律给栅极充电,按需要补给栅极电容的信息电荷。It can be understood that a dynamic memory cell temporarily stores information by storing charges through a gate capacitance. Because the stored information charge leaks after all, and the charge amount cannot be supplemented by the power supply through the load tube like the static storage element, the information will be lost after a long time. For this reason, the refresh unit 45 is required to refresh the storage unit. That is to charge the gate according to a certain rule, and replenish the information charge of the gate capacitance as needed.
当多个存储控制模块40应用于上述任一实施例中存储访问电路100时,多个存储控制模块40连接一多路复用器30,在存储访问时能够提供更高的带宽,进而存储访问电路100能够实现对大容量动态随机存储单元的高带宽存储访问。在存储访问电路100中存在运算引擎20时,多路复用器30能够输出高带宽的存储访问数据至路由节点,路由节点101能够合理分配存储访问数据给路由节点上的至少一个运算引擎20,从而提升运算性能。When multiple storage control modules 40 are applied to the storage access circuit 100 in any of the above-mentioned embodiments, multiple storage control modules 40 are connected to a multiplexer 30, which can provide higher bandwidth during storage access, and then storage access The circuit 100 can realize high-bandwidth storage access to large-capacity DRAM units. When there is a computing engine 20 in the storage access circuit 100, the multiplexer 30 can output high-bandwidth storage access data to the routing node, and the routing node 101 can reasonably distribute the storage access data to at least one computing engine 20 on the routing node, Thereby improving computing performance.
参阅图7,图7是本申请提供的集成芯片一实施例的结构示意图。该集成芯片200包括逻辑模块201和存储阵列模块202。Referring to FIG. 7 , FIG. 7 is a schematic structural diagram of an embodiment of an integrated chip provided by the present application. The integrated chip 200 includes a logic module 201 and a storage array module 202 .
其中,逻辑模块201上集成有存储访问电路。该存储访问电路可以是上述任一实施例中的存储访问电路100。Wherein, the logic module 201 is integrated with a storage access circuit. The storage access circuit may be the storage access circuit 100 in any of the foregoing embodiments.
逻辑模块201与存储阵列模块202连接;其中,存储阵列模块202上集成有存储单元。The logic module 201 is connected to the storage array module 202; wherein, the storage array module 202 is integrated with a storage unit.
在一些实施例中,存储阵列模块202可以为动态随机存储阵列模块。In some embodiments, the memory array module 202 may be a dynamic random memory array module.
存储访问电路100中的存储控制模块40与存储单元连接,用于对存储单元进行读写操作。The storage control module 40 in the storage access circuit 100 is connected to the storage unit, and is used for reading and writing operations on the storage unit.
逻辑模块201和存储阵列模块202层叠设置,存储访问电路100的存储控制模块40连接存储阵列模块202上集成的存储单元,使存储控制模块40与存储单元之间的布线缩短,能够提升的对存储单元的访问速度,降低功耗,提升整体性能。The logic module 201 and the storage array module 202 are stacked, and the storage control module 40 of the storage access circuit 100 is connected to the storage unit integrated on the storage array module 202, so that the wiring between the storage control module 40 and the storage unit is shortened, and the storage capacity can be improved. unit access speed, reducing power consumption and improving overall performance.
可以理解,具体地层叠方式可以根据逻辑模块201和存储阵列模块202的实际尺寸进行设置。在集成芯片200中包括多个逻辑模块201和多个存储阵列模块202时,可以将逻辑模块201和存储阵列模块202相互层叠设置。如,两个逻辑模块201之间设置一存储阵列模块202。如,两个存储阵列模块202之间设置一逻辑模块201。具体的,逻辑模块201与存储阵列模块202通过3维键合技术键合连接,以此可以使得逻辑模块201中的存储访问电路与存储阵列模块202中的存储单元直接连接,实现高带宽、低功耗的存储访问结构。It can be understood that, specifically, the stacking manner may be set according to actual sizes of the logic module 201 and the storage array module 202 . When the integrated chip 200 includes a plurality of logic modules 201 and a plurality of storage array modules 202, the logic modules 201 and the storage array modules 202 may be stacked on each other. For example, a storage array module 202 is arranged between two logic modules 201 . For example, a logic module 201 is arranged between two storage array modules 202 . Specifically, the logic module 201 and the storage array module 202 are bonded and connected by 3-dimensional bonding technology, so that the storage access circuit in the logic module 201 can be directly connected with the storage unit in the storage array module 202, realizing high bandwidth, low Power memory access structure.
上述逻辑模块201和存储阵列模块202可以是由晶圆(Wafer)或者晶粒(Die)或者芯片(chip)制作而成。The above-mentioned logic module 201 and storage array module 202 may be made of a wafer (Wafer) or a die (Die) or a chip (chip).
在本实施例中,集成芯片200中的存储访问电路100在存储访问时,每一多路复用器30连接的至少两个存储控制40模块能够提供更高的带宽,以此能够实现对大容量动态随机存储单元的高带宽存储访问。在存储访问电路100中存在运算引擎20时,多路复用器30能够输出高带宽的存储访问数据至路由节点,路由节点能够合理分配存储访问数据给路由节点上的至少一个运算引擎20,从而提升运算性能。In this embodiment, when the storage access circuit 100 in the integrated chip 200 is accessing storage, at least two storage control 40 modules connected to each multiplexer 30 can provide higher bandwidth, thereby enabling large-scale High-bandwidth memory access for capacity dynamic random access memory units. When there is a computing engine 20 in the storage access circuit 100, the multiplexer 30 can output high-bandwidth storage access data to the routing node, and the routing node can reasonably distribute the storage access data to at least one computing engine 20 on the routing node, thereby Improve computing performance.
在一些实施例中,集成芯片200可以作为内存条、硬盘等存储装置进行应用。In some embodiments, the integrated chip 200 can be used as a storage device such as a memory stick or a hard disk.
参阅图8,图8是本申请提供的电子设备一实施例的结构示意图。该电子设备300包括集成芯片200。该集成芯片200如上述任一实施例中的集成芯片200。Referring to FIG. 8 , FIG. 8 is a schematic structural diagram of an embodiment of an electronic device provided by the present application. The electronic device 300 includes an integrated chip 200 . The integrated chip 200 is like the integrated chip 200 in any of the above-mentioned embodiments.
集成芯片200包括逻辑模块以及存储阵列模块,其中逻辑模块上集成有上述的存储访问电路,存储阵列模块与逻辑模块连接。在一具体实施例中,逻辑模块与存储阵列模块层叠键合设置。具体的,逻辑模块与存储阵列模块通过3维键合技术键合连接,以此可以使得逻辑模块中的存储访问电路与存储阵列模块中的存储单元直接连接,实现高带宽、低功耗的存储访问结构。The integrated chip 200 includes a logic module and a storage array module, wherein the above-mentioned storage access circuit is integrated on the logic module, and the storage array module is connected to the logic module. In a specific embodiment, the logic module and the storage array module are stacked and bonded. Specifically, the logic module and the storage array module are bonded and connected by 3-dimensional bonding technology, so that the storage access circuit in the logic module can be directly connected with the storage unit in the storage array module, realizing high-bandwidth, low-power storage access structure.
在本实施例中,电子设备300中的集成芯片200在存储访问时,每一多路复用器30连接的至少两个存储控制40模块能够提供更高的带宽,进而存储访问电路100能够实现对大容量动态随机存储单元的高带宽存储访问,从而多路复用器能够输出高带宽的存储访问数据至路由节点,路由节点能够合理分配存储访问数据给路由节点上的至少一个运算引擎,从而提升运算性能。In this embodiment, when the integrated chip 200 in the electronic device 300 is accessing storage, at least two storage control 40 modules connected to each multiplexer 30 can provide higher bandwidth, and then the storage access circuit 100 can realize High-bandwidth storage access to large-capacity dynamic random storage units, so that the multiplexer can output high-bandwidth storage access data to the routing node, and the routing node can reasonably allocate storage access data to at least one computing engine on the routing node, thereby Improve computing performance.
参阅图9,图9是本申请提供的存储访问方法一实施例的流程示意图。该方法基于上述任一存储访问电路100实现,该方法包括:Referring to FIG. 9 , FIG. 9 is a schematic flowchart of an embodiment of a storage access method provided by the present application. The method is implemented based on any of the above storage access circuits 100, and the method includes:
步骤91:路由节点接收数据访问指令,并根据数据访问指令确定对应的至少一个多路复用器。Step 91: the routing node receives the data access instruction, and determines at least one corresponding multiplexer according to the data access instruction.
其中,数据访问指令由运算引擎或外部处理模块发送。Wherein, the data access instruction is sent by the computing engine or the external processing module.
步骤92:多路复用器根据数据访问指令确定对应的至少一个存储控制模块。Step 92: The multiplexer determines at least one corresponding storage control module according to the data access instruction.
可以理解,数据可能存储于不同的存储单元中,所以需要确定对应连接存储单元的存储控制模块,才可以进行数据的读取。It can be understood that data may be stored in different storage units, so the storage control module corresponding to the connected storage unit needs to be determined before data can be read.
步骤93:存储控制模块根据数据访问指令从对应连接的存储单元中获取数据并发送至多路复用器。Step 93: The storage control module acquires data from the correspondingly connected storage unit according to the data access instruction and sends it to the multiplexer.
步骤94:多路复用器将数据发送至路由节点。Step 94: The multiplexer sends the data to the routing node.
多路复用器将每一存储控制模块发送的数据进行合成,并将合成后的数据发送至路由节点,路由节点将该合成数据发送至运算引擎中。The multiplexer synthesizes the data sent by each storage control module, and sends the synthesized data to the routing node, and the routing node sends the synthesized data to the computing engine.
结合上述任一实施例中的存储访问电路100进行说明:Description will be made in conjunction with the storage access circuit 100 in any of the above-mentioned embodiments:
运算引擎中相应的功能模块或外部处理模块可以产生数据访问指令,并发送至路由节点,路由节点根据数据访问指令确定对应的多个或单个多路复用器,将数据访问指令发送至该多路复用器。多路复用器根据该数据访问指令进行分配,以确定对应的多个或单个存储控制模块,并向存储控制模块发送数据访问指令。存储控制模块根据数据访问指令从对应连接的存储单元中获取数据,并发送至多路复用器。多路复用器 将多个或单个存储控制模块发送的数据进行合成,并将合成后的数据发送至路由节点,路由节点将该合成数据发送至运算引擎或外部处理模块中。运算引擎中相应的功能模块或外部处理模块在获取到合成数据后,将合成数据进行解码,得到合成前的数据。然后根据这些数据进行运算。The corresponding functional modules or external processing modules in the computing engine can generate data access instructions and send them to the routing node. The routing node determines the corresponding multiple or single multiplexers according to the data access instructions and sends the data access instructions to the multiplexers. multiplexer. The multiplexer allocates according to the data access instruction to determine corresponding multiple or single storage control modules, and sends the data access instruction to the storage control module. The storage control module acquires data from the correspondingly connected storage unit according to the data access instruction, and sends the data to the multiplexer. The multiplexer synthesizes the data sent by multiple or single storage control modules, and sends the synthesized data to the routing node, and the routing node sends the synthesized data to the computing engine or the external processing module. After the corresponding function module or external processing module in the calculation engine obtains the synthesized data, it decodes the synthesized data to obtain the data before synthesis. Then perform calculations on these data.
在本实施例中,在进行大容量存储访问时,利用多路复用器与至少两个存储控制模块连接的方式来提供更高的存储访问带宽,进而实现对大容量动态随机存储单元的高带宽存储访问,从而多路复用器能够输出高带宽的存储访问数据至路由节点,路由节点能够合理分配存储访问数据给与路由节点上连接的运算引擎或外部处理模块,从而提升运算性能。In this embodiment, when performing large-capacity storage access, a multiplexer is used to connect at least two storage control modules to provide higher storage access bandwidth, thereby realizing high-speed access to large-capacity DRAM units. Bandwidth storage access, so that the multiplexer can output high-bandwidth storage access data to routing nodes, and routing nodes can reasonably allocate storage access data to computing engines or external processing modules connected to routing nodes, thereby improving computing performance.
参阅图10,图10是本申请提供的存储访问方法另一实施例的流程示意图。该方法基于上述任一存储访问电路100实现,该方法包括:Referring to FIG. 10 , FIG. 10 is a schematic flowchart of another embodiment of a storage access method provided by the present application. The method is implemented based on any of the above storage access circuits 100, and the method includes:
步骤101:路由节点接收数据写入指令,并根据数据写入指令确定对应的至少一个多路复用器。Step 101: the routing node receives a data write instruction, and determines at least one corresponding multiplexer according to the data write instruction.
其中,数据写入指令由运算引擎或外部处理模块发送。Wherein, the data writing instruction is sent by the computing engine or the external processing module.
步骤102:多路复用器根据数据写入指令确定对应的至少一个存储控制模块。Step 102: The multiplexer determines at least one corresponding storage control module according to the data write instruction.
可以理解,数据可能需要写入不同的存储单元中,所以需要确定对应连接存储单元的存储控制模块,才可以进行数据的对应写入。It can be understood that data may need to be written into different storage units, so it is necessary to determine the storage control module correspondingly connected to the storage unit before corresponding writing of data can be performed.
如,大容量的数据写入时,单个存储单元并不能完全存储,则需要多个存储单元,因此需要根据写入数据的容量来确定具体的存储单元。For example, when large-capacity data is written, a single storage unit cannot fully store it, and multiple storage units are needed, so the specific storage unit needs to be determined according to the capacity of the written data.
步骤103:存储控制模块根据数据写入指令获取待写入数据,并将待写入数据写入与存储控制模块连接的存储单元中。Step 103: the storage control module obtains the data to be written according to the data writing instruction, and writes the data to be written into the storage unit connected to the storage control module.
此时,在大容量的数据写入时,则可通过多个存储控制模块同时进行数据写入,将待写入数据写入与存储控制模块连接的存储单元中,这要可以缩短写入数据的时间。At this time, when large-capacity data is written, data can be written simultaneously through multiple storage control modules, and the data to be written can be written into the storage unit connected to the storage control module, which can shorten the time for writing data. time.
在一应用场景中,对整个存储访问电路100的写入流程进行说明:In an application scenario, the writing process of the entire storage access circuit 100 is described as follows:
运算引擎中相应的功能模块或外部处理模块可以产生数据写入指令,并发送至路由节点,路由节点根据数据写入指令确定对应的多个或单个多路复用器,将数据写入指令发送至该多路复用器。多路复用器根据该数据写入指令进行分配,以确定对应的多个或单个存储控制模块,并向存储控制模块发送数据写入指令。存储控制模块根据数据写入指令获取待写入数据,并将待写入数据写入对应连接的存储单元中。The corresponding functional modules or external processing modules in the computing engine can generate data write instructions and send them to the routing node. The routing node determines the corresponding multiple or single multiplexers according to the data write instructions, and sends the data write instructions to to the multiplexer. The multiplexer allocates according to the data writing instruction to determine corresponding multiple or single storage control modules, and sends the data writing instruction to the storage control modules. The storage control module obtains the data to be written according to the data writing instruction, and writes the data to be written into the correspondingly connected storage unit.
在本实施例中,在进行大容量的数据写入时,利用多路复用器与至少两个存储控制模块连接的方式来提供更高的存储访问带宽,进而实现对大容量动态随机存储单元的高带宽存储访问,从而多路复用器能够输出高带宽的存储访问数据至路由节点,路由节点能够合理分配存储访问数据给与路由节点上连接的运算引擎或外部处理模块,从而提升运算性 能。In this embodiment, when large-capacity data is written, a multiplexer is used to connect with at least two storage control modules to provide higher storage access bandwidth, thereby realizing the large-capacity DRAM unit High-bandwidth storage access, so that the multiplexer can output high-bandwidth storage access data to routing nodes, and routing nodes can reasonably allocate storage access data to computing engines or external processing modules connected to routing nodes, thereby improving computing performance .
以上仅为本申请的实施方式,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。The above is only the implementation mode of this application, and does not limit the scope of patents of this application. Any equivalent structure or equivalent process transformation made by using the description of this application and the contents of the accompanying drawings, or directly or indirectly used in other related technical fields, All are included in the scope of patent protection of the present application in the same way.

Claims (20)

  1. 一种存储访问电路,其特征在于,所述存储访问电路包括:A storage access circuit, characterized in that the storage access circuit includes:
    网络单元,所述网络单元包括至少一个路由节点;a network element comprising at least one routing node;
    多路复用器;multiplexer;
    存储控制模块,用于连接存储单元;A storage control module, used for connecting the storage unit;
    其中,每一所述路由节点连接至少一个所述多路复用器,每一所述多路复用器连接至少两个所述存储控制模块,以对至少两个所述存储控制模块进行多路复用,进而对所述存储控制模块连接的所述存储单元进行存储访问。Wherein, each of the routing nodes is connected to at least one of the multiplexers, and each of the multiplexers is connected to at least two of the storage control modules, so as to perform multiplexing on at least two of the storage control modules. multiplexing, and then perform storage access to the storage unit connected to the storage control module.
  2. 根据权利要求1所述的存储访问电路,其特征在于,The storage access circuit according to claim 1, characterized in that,
    每个所述路由节点连接至多4个其他路由节点。Each of said routing nodes is connected to at most 4 other routing nodes.
  3. 根据权利要求1所述的存储访问电路,其特征在于,The storage access circuit according to claim 1, characterized in that,
    至少两个所述路由节点按照M行*N列的形式阵列分布,每一所述路由节点与行方向或列方向相邻的其他路由节点连接,其中,M和N为正整数。At least two routing nodes are distributed in an array in the form of M rows*N columns, and each routing node is connected to other routing nodes adjacent in the row or column direction, wherein M and N are positive integers.
  4. 根据权利要求3所述的存储访问电路,其特征在于,The storage access circuit according to claim 3, characterized in that,
    M为3,N为3;M is 3, N is 3;
    每一所述路由节点连接2个所述多路复用器,每一所述多路复用器连接8个所述存储控制模块。Each of the routing nodes is connected to 2 of the multiplexers, and each of the multiplexers is connected to 8 of the storage control modules.
  5. 根据权利要求3所述的存储访问电路,其特征在于,The storage access circuit according to claim 3, characterized in that,
    M为4,N为4;M is 4, N is 4;
    每一所述路由节点连接4个所述多路复用器,每一所述多路复用器连接16个所述存储控制模块。Each of the routing nodes is connected to 4 of the multiplexers, and each of the multiplexers is connected to 16 of the storage control modules.
  6. 根据权利要求1所述的存储访问电路,其特征在于,The storage access circuit according to claim 1, characterized in that,
    所述存储控制模块包括:The storage control module includes:
    第一接口单元,连接所述多路复用器;a first interface unit, connected to the multiplexer;
    读控制单元,连接所述第一接口单元,用于控制读取所述存储单元中的数据;A read control unit, connected to the first interface unit, for controlling the reading of data in the storage unit;
    写控制单元,连接所述第一接口单元,用于控制写入数据至所述存储单元;A write control unit, connected to the first interface unit, for controlling writing data to the storage unit;
    第二接口单元,连接所述读控制单元、所述写控制单元和所述存储单元。The second interface unit is connected to the read control unit, the write control unit and the storage unit.
  7. 根据权利要求6所述的存储访问电路,其特征在于,The storage access circuit according to claim 6, characterized in that,
    所述存储控制模块还包括刷新单元,连接所述第二接口单元,所述刷新单元用于对所述存储单元进行刷新。The storage control module further includes a refresh unit connected to the second interface unit, and the refresh unit is used to refresh the storage unit.
  8. 根据权利要求1所述的存储访问电路,其特征在于,The storage access circuit according to claim 1, characterized in that,
    所述存储控制模块的数据位宽为128bit,频率为400MHz。The data bit width of the storage control module is 128bit, and the frequency is 400MHz.
  9. 根据权利要求1所述的存储访问电路,其特征在于,所述存储访问电路还包括:运算引擎,每一所述路由节点连接至少一个所述运算引擎。The storage access circuit according to claim 1, further comprising: a computing engine, each of the routing nodes is connected to at least one computing engine.
  10. 根据权利要求2所述的存储访问电路,其特征在于,所述路由节点到与所述路由节点连接的其他路由节点之间的距离相同。The storage access circuit according to claim 2, wherein the distance between the routing node and other routing nodes connected to the routing node is the same.
  11. 根据权利要求2所述的存储访问电路,其特征在于,所述路由节点到与所述路由节点连接的其他路由节点之间的数据传输时间相同。The storage access circuit according to claim 2, wherein the data transmission time between the routing node and other routing nodes connected to the routing node is the same.
  12. 一种集成芯片,其特征在于,所述集成芯片包括:逻辑模块和存储阵列模块;An integrated chip, characterized in that the integrated chip includes: a logic module and a storage array module;
    所述逻辑模块上集成有存储访问电路;所述存储访问电路包括:网络单元,所述网络单元包括至少一个路由节点;The logic module is integrated with a storage access circuit; the storage access circuit includes: a network unit, and the network unit includes at least one routing node;
    多路复用器;multiplexer;
    存储控制模块,用于连接存储单元;A storage control module, used for connecting the storage unit;
    其中,每一所述路由节点连接至少一个所述多路复用器,每一所述多路复用器连接至少两个所述存储控制模块,以对至少两个所述存储控制模块进行多路复用,进而对所述存储控制模块连接的所述存储单元进行存储访问;Wherein, each of the routing nodes is connected to at least one of the multiplexers, and each of the multiplexers is connected to at least two of the storage control modules, so as to perform multiplexing on at least two of the storage control modules. Multiplexing, and then performing storage access to the storage unit connected to the storage control module;
    所述存储阵列模块集成有所述存储单元,且所述逻辑模块与所述存储阵列模块层叠键合连接。The storage array module is integrated with the storage unit, and the logic module is connected to the storage array module by stacking and bonding.
  13. 根据权利要求12所述的集成芯片,其特征在于,The integrated chip according to claim 12, characterized in that,
    所述存储阵列模块为动态随机存储阵列模块。The storage array module is a dynamic random storage array module.
  14. 根据权利要求12所述的集成芯片,其特征在于,The integrated chip according to claim 12, characterized in that,
    每个所述路由节点连接至多4个其他路由节点;each of said routing nodes is connected to at most 4 other routing nodes;
    其中,所述路由节点到与所述路由节点连接的其他路由节点之间的距离相同;和/或Wherein, the distance between the routing node and other routing nodes connected to the routing node is the same; and/or
    所述路由节点到与所述路由节点连接的其他路由节点之间的数据传输时间相同。The data transmission time between the routing node and other routing nodes connected to the routing node is the same.
  15. 根据权利要求12所述的集成芯片,其特征在于,至少两个所述路由节点按照M行*N列的形式阵列分布,每一所述路由节点与行方向或列方向相邻的其他路由节点连接,其中,M和N为正整数。The integrated chip according to claim 12, wherein at least two of the routing nodes are distributed in an array in the form of M rows*N columns, and each of the routing nodes is adjacent to other routing nodes in the row direction or column direction Connection, where M and N are positive integers.
  16. 一种存储访问方法,其特征在于,所述方法包括:A storage access method, characterized in that the method comprises:
    路由节点接收数据访问指令,并根据所述数据访问指令确定对应的至少一个多路复用器;The routing node receives the data access instruction, and determines at least one corresponding multiplexer according to the data access instruction;
    所述多路复用器根据所述数据访问指令确定对应的至少一个存储控制模块;The multiplexer determines at least one corresponding storage control module according to the data access instruction;
    所述存储控制模块根据所述数据访问指令从对应连接的存储单元中获取数据并发送至所述多路复用器;The storage control module acquires data from the correspondingly connected storage unit according to the data access instruction and sends it to the multiplexer;
    所述多路复用器将所述数据发送至所述路由节点。The multiplexer sends the data to the routing node.
  17. 根据权利要求16所述的方法,其特征在于,所述多路复用器将所述数据发送至所述路由节点的步骤,包括:The method according to claim 16, wherein the step of the multiplexer sending the data to the routing node comprises:
    所述多路复用器将所述数据进行合成,并将合成后的数据发送至所述路由节点。The multiplexer synthesizes the data, and sends the synthesized data to the routing node.
  18. 根据权利要求17所述的方法,其特征在于,所述多路复用器将所述数据发送至所述路由节点的步骤之后,还包括:The method according to claim 17, wherein after the step of sending the data to the routing node by the multiplexer, further comprising:
    所述路由节点将合成后的数据发送至运算引擎;The routing node sends the synthesized data to the computing engine;
    所述运算引擎对合成后的数据进行解码,基于解码后的数据进行对应的运算。The calculation engine decodes the synthesized data, and performs corresponding calculations based on the decoded data.
  19. 根据权利要求16所述的方法,其特征在于,所述方法还包括:The method according to claim 16, further comprising:
    路由节点接收数据写入指令,并根据所述数据写入指令确定对应的至少一个所述多路复用器;The routing node receives a data write instruction, and determines at least one corresponding multiplexer according to the data write instruction;
    所述多路复用器根据所述数据写入指令确定对应的至少一个所述存储控制模块;The multiplexer determines at least one corresponding storage control module according to the data write instruction;
    所述存储控制模块根据所述数据写入指令获取待写入数据,并将所述待写入数据写入与所述存储控制模块连接的所述存储单元中。The storage control module acquires data to be written according to the data write instruction, and writes the data to be written into the storage unit connected to the storage control module.
  20. 根据权利要求19所述的方法其特征在于,所述路由节点接收数据写入指令的步骤之前,包括:The method according to claim 19 is characterized in that, before the step of the routing node receiving the data writing instruction, comprising:
    运算引擎产生所述写入指令,并将所述写入指令发送至所述路由节点。The computing engine generates the write instruction and sends the write instruction to the routing node.
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