WO2023272642A1 - Boîtier de composant électronique, composant électronique, module régulateur de tension et dispositif de stabilisation de tension - Google Patents

Boîtier de composant électronique, composant électronique, module régulateur de tension et dispositif de stabilisation de tension Download PDF

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Publication number
WO2023272642A1
WO2023272642A1 PCT/CN2021/103809 CN2021103809W WO2023272642A1 WO 2023272642 A1 WO2023272642 A1 WO 2023272642A1 CN 2021103809 W CN2021103809 W CN 2021103809W WO 2023272642 A1 WO2023272642 A1 WO 2023272642A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
electrical connection
connection terminal
substrate
conductive
Prior art date
Application number
PCT/CN2021/103809
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English (en)
Chinese (zh)
Inventor
黄立湘
缪桦
董晋
Original Assignee
深南电路股份有限公司
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Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Priority to PCT/CN2021/103809 priority Critical patent/WO2023272642A1/fr
Priority to US17/565,470 priority patent/US11737212B2/en
Publication of WO2023272642A1 publication Critical patent/WO2023272642A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between

Definitions

  • the present application relates to the technical field of electronic component production technology, in particular to an electronic component package, an electronic component, a voltage regulation module and a voltage stabilizing device.
  • the electronic components are composed of electronic components
  • the electronic components are often exposed to the air, and the electronic components are separated by a corresponding distance, so that the space between the electronic components can be arranged reasonably, and the electronic components can be separated. work in cooperation with each other.
  • the inventors of the present application have found through long-term research that, in the prior related art, the electronic components are usually exposed to the air, and the impurities in the air corrode the electronic components to a certain extent, thereby causing the electrical performance of the electronic components to decline.
  • Electronic components are installed in combination, resulting in excessive volume, which is also a problem for installation and transportation.
  • the present application provides an electronic component packaging body, an electronic component, a voltage regulation module and a voltage stabilizing device, so as to solve the above-mentioned problems existing in the electronic components in the prior art.
  • the first technical solution adopted by this application provides an electronic component package, which includes: a substrate with a first surface and a second surface opposite to each other; the first surface of the substrate is provided with There is a first conductive layer, the second surface of the substrate is provided with a second conductive layer, the substrate is also provided with a first conductive hole connected to the first conductive layer, and a second conductive hole connected to the second conductive layer; the first electron
  • the component is embedded in the substrate, and is provided with a first electrical connection terminal and a second electrical connection terminal, the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the first conductive layer through the second conductive hole to the second conductive layer; wherein, the first electronic component is a passive electronic component.
  • the present application can provide an electronic component packaging body, which embeds passive electronic components in the substrate, so that the passive electronic components are isolated from the outside world, so as to realize the packaging of passive electronic components and prevent impurities in the air from affecting the passive electronic components.
  • the electrical performance is reduced due to corrosion, and the packaged chip is also easier to install and transport; and the first electrical connection terminal of the passive electronic component is connected to the first conductive layer on the first surface of the substrate through the first conductive hole, and the second electrical connection terminal The connection terminal is connected to the second conductive layer on the second surface of the substrate through the second conductive hole, so as to realize the connection between the passive electronic component and the external circuit.
  • the first electronic component is an inductance component.
  • the substrate includes a frame and an accommodating groove provided in the frame, the first electronic component is placed in the accommodating groove, and is electrically connected to the outside through the first electrical connection terminal.
  • first electrical connection terminal and the second electrical connection terminal are respectively arranged on the opposite sides of the first electronic component along the first direction, the first conductive hole and the second conductive hole are opened along the first direction, and are respectively connected to The first electrical connection terminal and the second electrical connection terminal are electrically connected.
  • both the first conductive hole and the second conductive hole are blind holes.
  • first conductive hole and the second conductive hole are opened facing the first electrical connection terminal and the second electrical connection terminal respectively.
  • the electronic component package is also provided with a first through hole and a second through hole penetrating the substrate, the first through hole and the second through hole are arranged on both sides of the first electronic component in the second direction, and the second direction and the second through hole One direction intersects and both are used for through connection to the first surface and the second surface.
  • the second technical solution adopted by the present application provides an electronic component, which includes: a substrate with a first surface and a second surface opposite to each other; a first electronic component embedded in the substrate, It is also provided with a first electrical connection terminal connected to the first surface of the substrate and a second electrical connection terminal connected to the second surface; the second electronic component is arranged on the second surface of the substrate, and is electrically connected to the second electrical connection terminal connection; wherein, the second electronic component and the first electronic component form a stack in a first direction, and the first direction intersects both the first surface and the second surface of the substrate; wherein, the first electronic component is a passive electronic component .
  • the present application can provide an electronic component in which the second electronic component and the first electronic component are stacked in the first direction, thereby reducing the distance between the first electronic component and the second electronic component perpendicular to the first direction.
  • the area in the second direction is a part of the second direction.
  • the second electronic component includes an active electronic component.
  • the second electronic component includes at least any one of a switch element, an active chip, and a power management integrated circuit, and the second conductive layer is a conductive pattern layer.
  • first electrical connection terminal and the second electrical connection terminal are respectively arranged on the first surface and the second surface of the first electronic component, and the two sides of the first surface and the second surface of the first electronic component are opposite to each other in the first direction.
  • first conductive hole is opened along one end of the first direction, and is electrically connected to the first electrical connection terminal
  • second conductive hole is opened along the other end of the first direction, and is electrically connected to the second electrical connection terminal.
  • the third technical solution adopted by this application is to provide a voltage regulation module, the voltage regulation module includes: a circuit board, a conductive pattern layer is provided on the surface of the circuit board, and a An electronic component electrically connected to the conductive pattern layer of the board, such as the electronic component provided by the second technical solution; wherein, the second electronic component, the first electronic component and the circuit board are sequentially stacked in the first direction, and the first direction It intersects both the first surface and the second surface of the substrate.
  • the second electronic component is provided with a heat sink, and the heat sink, the second electronic component, the substrate and the circuit board are sequentially stacked in the first direction to solve the heat dissipation of the electronic components.
  • the fourth technical solution adopted by the present application is to further provide a voltage stabilizing device, which includes the above-mentioned electronic components.
  • the present application can provide an electronic component package, which embeds the passive electronic components in the substrate, so that the passive electronic components are isolated from the outside, thereby realizing the protection of the passive electronic components. Encapsulation, to prevent impurities in the air from corroding the passive electronic components and causing electrical performance degradation, the packaged passive electronic components are also easier to install and transport; and the first electrical connection terminal of the passive electronic components passes through the first conductive The hole is connected to the first conductive layer on the first surface of the substrate, and the second electrical connection terminal is connected to the second conductive layer on the second surface of the substrate through the second conductive hole, thereby realizing the connection between the passive electronic component and the external circuit.
  • Fig. 1 is a schematic structural view of an electronic component package in an embodiment of the present application
  • Fig. 2 is a schematic diagram of a specific structure when the electronic component in Fig. 1 is provided with an accommodating groove;
  • Fig. 3 is a schematic diagram of a specific structure when the electronic component in Fig. 1 is provided with a through hole;
  • Fig. 4 is a schematic diagram of a specific structure when the electronic component in Fig. 3 is provided with blind holes;
  • Fig. 5 is a schematic structural diagram of an electronic component in another embodiment of the present application.
  • Fig. 6 is a specific structural schematic diagram of the electronic assembly in Fig. 5;
  • Fig. 7 is another specific structural schematic diagram of the electronic assembly in Fig. 5;
  • Fig. 8 is a schematic diagram of a specific structure when an accommodating groove is arranged in the substrate in Fig. 5;
  • FIG. 9 is a schematic diagram of a specific structure when conductive through holes are provided in the substrate in FIG. 5;
  • FIG. 10 is a schematic structural diagram of a voltage regulation module in another embodiment of the present application.
  • Fig. 11 is a specific structural schematic diagram of the voltage regulation module in Fig. 10;
  • FIG. 12 is a schematic structural diagram of a voltage stabilizing device in another embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application.
  • the first technical solution adopted in the present application provides an electronic component package 100, the electronic component package 100 includes: a substrate 11 , the conductive layer 16 on the surface of the substrate 11 and the first electronic component 14 .
  • the first electronic component 14 is provided with an electrical connection terminal 15 , and the first electronic component 14 can be connected to the conductive layer 16 on the surface of the substrate 11 through the electrical connection terminal 15 .
  • the substrate 11 is provided with opposite first surfaces 12 and second surfaces 13, and a first direction AB is further set according to the opposite first surfaces 12 and second surfaces 13, and the first direction AB can be It is the vertical direction common to those skilled in the art, and it can also be other directions that are specifically set according to needs, wherein A is one end of the first direction AB, and B is the other end of the first direction AB, so as to determine the electronic component package 100
  • the arrangement and planning of each component provide the basis for direction division.
  • the first surface 12 of the substrate 11 is provided with a first conductive layer 161
  • the second surface 13 of the substrate 11 is provided with a second conductive layer 162
  • the substrate 11 is also provided with a first conductive hole 171 connected to the first conductive layer 161, and It is connected to the second conductive hole 172 of the second conductive layer 162 .
  • the first electronic component 14 is embedded in the substrate 11, and is provided with a first electrical connection terminal 151 and a second electrical connection terminal 152.
  • the first electrical connection terminal 151 is connected to the first conductive layer 161 through the first conductive hole 171.
  • the two electrical connection terminals 152 are connected to the second conductive layer 162 through the second conductive holes 172 .
  • the passive electronic component 141 in the substrate 11 is electrically connected to the first conductive layer 161 through the first electrical connection terminal 151, and the passive electronic component in the substrate 11 141 is electrically connected to the second conductive layer 162 through the second electrical connection terminal 152 .
  • the present application can provide an electronic component package 100, which embeds the passive electronic component 141 in the substrate 11, so that the passive electronic component 141 is isolated from the outside world, thereby realizing the packaging of the passive electronic component 141 to prevent impurities in the air Corrosion of the passive electronic component 141 causes electrical performance to decline, and the packaged passive electronic component 141 is also more convenient for installation and transportation; and the first electrical connection terminal 151 of the passive electronic component 141 is connected to the The first conductive layer 161 of the first surface 12 of the substrate 11, and the second electrical connection terminal 152 are connected to the second conductive layer 162 of the second surface 13 of the substrate 11 through the second conductive hole 172, so as to realize the connection between the passive electronic component 141 and the outside The connection of the circuit provides convenient conditions.
  • the thickness of the electronic component package 100 may be 2-4 mm, such as 2 mm, 3 mm or 4 mm, and the first electronic component 14 of the electronic component package 100 is an inductance component.
  • the first electronic element 14 may also be a capacitive element, a resistive element, or other elements, which are specifically selected according to needs and are not limited here. If an inductive element is chosen, the electronic component can be used as part of a voltage regulator and also as an energy storage element.
  • the selected inductance element may be a choke inductor on the one hand, or a chip inductor on the other hand, which is not limited here. The application of the inductor will be described in detail later when the electronic components form a voltage regulation module.
  • FIG. 2 is a schematic diagram of a specific structure when the electronic components in FIG. 1 are provided with accommodating grooves.
  • the electronic component 14 is placed in the accommodating groove 142 and is electrically connected to the outside through the first electrical connection terminal.
  • the first electronic component 14 can be quickly embedded in the substrate 11 through the accommodating groove 142 and placed in the substrate 11 stably.
  • the first electrical connection terminal 151 of the first electronic component 14 is drawn out at one end of the accommodating groove 142 in the first direction AB, so that the first electrical connection terminal 151 is electrically connected to an external circuit;
  • the other end on the top leads out the second electrical connection terminal 152 of the first electronic component 14 , so that the second electrical connection terminal 152 is electrically connected with the second electronic component 2 .
  • the electrical connection terminal 15 can lead the electrical connection terminal 15 of the first electronic component 14 to or through the first surface 12 and the second surface 13 of the substrate 11 through the surface of the accommodating groove 142 , and can also pass through the surface of the accommodating groove 142 The interior penetrates to the surface of the accommodating groove 142 to lead the electrical connection terminal 15 of the first electronic component 14 to or expose the first surface 12 and the second surface 13 of the substrate 11. Therefore, there are multiple ways to lead the electrical connection terminal 15, so It can be selected as required, and is not specifically limited here.
  • first electrical connection terminal and the second electrical connection terminal of the electronic component package 100 are respectively arranged on opposite sides of the first electronic component along the first direction, and the first conductive hole and the second conductive hole are arranged along the first direction, and are electrically connected to the first electrical connection terminal and the second electrical connection terminal respectively.
  • first conductive hole 171 and the second conductive hole 172 of the electronic component package 100 are respectively opened facing the first electrical connection terminal 151 and the second electrical connection terminal 152 . That is, the first conductive hole 171 is opened directly to the first electrical connection terminal 151 , and the second conductive hole 172 is opened to the second electrical connection terminal 152 .
  • the electronic component package 100 is also provided with a first through hole 181 and a second through hole 182 penetrating the substrate 11.
  • the first through hole 181 and the second through hole 182 are provided on the second Both sides of the direction CD, the second direction CD intersecting the first direction AB, are used for through connection to the first surface 12 and the second surface 13 .
  • FIG. 4 is a schematic diagram of a specific structure when the electronic components in FIG. 1 are provided with through holes. Since there is an insulating layer between the electronic components, when the electronic components between the multi-layer insulating layers need to be electrically connected, the first through hole 181 and the second through hole 182 penetrating the substrate 11 can realize the electronic component package 100. There are multiple electronic components making electrical connections.
  • the second direction CD intersecting the first direction AB is set.
  • the second direction CD may also be set perpendicular to the first direction AB.
  • the specific intersecting manner depends on actual needs, and is not limited here.
  • the middle part of the first electronic component 14 is provided with a midline A'B'. As shown in FIG. It is disposed at the other end C of the first electronic component 14 along the second direction CD, wherein the distance between the first through hole 181 and the center line A'B' and the distance between the second through hole 182 and the center line A'B' can be equal, so The first through-hole 181 and the second through-hole 182 can be arranged symmetrically on opposite sides of the first electronic component 14 along the second direction AB. Usually, the distance between the through-hole 18 and the first electronic component 14 is greater than 200 um. In order to avoid interlayer interference of various electronic components.
  • FIG. 4 is a specific structural diagram of the electronic component in FIG. 3 when blind holes are provided, wherein the first conductive hole 171 and the second conductive hole 172 of the electronic component package 100 are both blind holes.
  • the first conductive hole 171 may be a first blind hole 1711
  • the second conductive hole 172 may be a second blind hole 1721, that is, the substrate 11 is also provided with a first blind hole connected to the first conductive layer 161 1711 , and the second blind hole 1721 connected to the second conductive layer 162 .
  • the first electrical connection terminal 151 is connected to the first conductive layer 161 through the first blind hole 1711
  • the second electrical connection terminal 152 is connected to the second conductive layer 162 through the second blind hole 1721 .
  • the embodiment of the first conductive hole is the first blind hole 1711
  • the embodiment of the second conductive hole is the second blind hole 1721
  • the first blind hole 1711 is facing the first electrical connection terminal 151 is opened
  • the second blind hole 1721 is opened facing the second electrical connection terminal 152 .
  • the way of opening opposite to each other can save materials and reduce the connection between the first blind hole 1711 and the second blind hole 1721 and the electrical connection terminal 15 as much as possible. There is a risk of degradation of the electrical connection performance of the connection terminal 15.
  • the cross-sections of the first blind hole 1711 and the second blind hole 1721 can be respectively arranged on the first surface and the second surface of the first electronic component 14 along the first direction AB, and are trapezoidal, specifically, the first
  • the blind hole 1711 is in the shape of a trapezoid with a large upper bottom and a smaller bottom, and is set on the first surface of the first electronic component 14, and can be set completely facing the first electrical connection terminal 151, and can also be set facing the first electrical connection terminal 151 partially.
  • the second blind hole 1721 is in the shape of a trapezoid with a large upper bottom and a smaller lower bottom, and is arranged on the second surface of the first electronic component 14, so that it can completely face the second electrical connection terminal 152 It can also be partially arranged facing the second electrical connection terminal 152 so as to be electrically connected to the first electrical connection terminal 151 .
  • the cross-sectional shape of the first blind hole 1711 and the second blind hole 1721 can also be other shapes, for example, as shown in Figure 5, the cross-sectional shape of the first blind hole 1711 and the second blind hole 1721 can also be a rectangle shape or square shape, the size and shape of the first blind hole 1711 and the second blind hole 1721 may be the same or different, which are specifically selected according to needs and are not limited here.
  • FIG. 4 is a schematic structural diagram of an electronic component in another embodiment of the present application.
  • the second technical solution adopted in the present application provides an electronic component 200.
  • the electronic component 200 includes: a substrate 11, a first The electronic component 14 and the second electronic component 2, wherein the first electronic component 14 is embedded in the substrate 11, the first electronic component 14 is provided with an electrical connection terminal 15, and the first electronic component 14 in the substrate 11 is connected to the electronic component through the electrical connection terminal 15.
  • the second electronic component 2 realizes electrical connection.
  • the substrate 11 is a package, and is provided with a first surface 12 and a second surface 13 facing away from each other. According to the first surface 12 and the second surface 13 facing away, a first direction AB is further set.
  • the first direction AB can be The vertical direction common to those skilled in the art can also be other directions that are specifically set according to needs, wherein A is one end of the first direction AB, and B is the other end of the first direction AB, so as to determine the components of the electronic assembly 200 Arrangement and planning provide the basis for directional divisions.
  • the first electronic component 14, embedded in the substrate 11, can be a passive electronic component 141, and is provided with a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection connected to the second surface 13 Terminal 152.
  • the embedding of the first electronic component 14 can be conventionally buried in the substrate 11, then filled with a medium, and then expose the electrical connection terminal 15 to realize the electrical connection of the second electronic component 2 and the electronic assembly 200.
  • the position of the first electronic component 14 in the substrate will be adjusted through the electrical connection terminal 15, so that the first electronic component 14 can be embedded in the substrate 11 smoothly, and then the first electronic component 14 is filled with a medium, and then the electrical connection terminal 15 is exposed to realize the electrical connection of the second electronic component 2 and external circuits other than the electronic component 200.
  • this Persons skilled in the art may also use common embedding methods to embed the first electronic component 14 in the substrate 11 , which is not limited here.
  • the first surface 12 of the substrate 11 is provided with a first conductive layer 161
  • the second surface 13 of the substrate 11 is provided with a second conductive layer 162
  • a conductive layer 161 is electrically connected
  • the first electronic component 14 in the substrate 11 is electrically connected to the second conductive layer 162 and the second electronic component 2 through the second electrical connection terminal 152 .
  • the substrate 11 is also provided with a first conductive hole 171 connected to the first conductive layer 161, and a second conductive hole 172 connected to the second conductive layer 162. Therefore, the first electrical connection terminal 151 of the first electronic component 14 The first conductive layer 161 is electrically connected through the first conductive hole 171 , and the second electrical connection terminal 152 of the first electronic component 14 is electrically connected with the second conductive layer 162 and the second electronic component 2 through the second conductive hole 172 .
  • the second electronic component 2 of the electronic assembly 200 is arranged on the second surface 13 of the substrate 11 and is electrically connected to the second electrical connection terminal 152;
  • the second electrical connection terminal 152 realizes the electrical connection with the first electronic component 14, and the second surface 13 on the substrate 11 can also be spot-connected with conductive solder, and the second electrical connection terminal 152 of the first electronic component 14 is connected to the second electrical connection terminal 152 of the first electronic component 14 through the conductive solder.
  • the electrical connection of the second electronic component 2 can also be set according to other specific situations, which is not limited here.
  • the second electronic component 2 and the substrate 11 form a stack in the first direction AB, and the first direction AB intersects the first surface 12 and the second surface 13 of the substrate 11.
  • the first direction AB is perpendicular to the first surface 12 and the second surface 13, of course, the first direction AB can also be set by intersecting the first surface 12 and the second surface 13 of the substrate 11, instead of It needs to intersect perpendicularly, which is not limited here.
  • the present application can provide an electronic assembly 200, in which the second electronic component 2 and the substrate 11 are stacked in the first direction AB, thereby reducing the number of times that the substrate 11 and the second electronic component 2 perpendicularly intersect with the first direction AB.
  • the area in the second direction makes the second electronic component 2 far away from other circuit devices other than the electronic component 200 , so that the heat dissipation efficiency of the second electronic component 2 is improved.
  • FIG. 3 is a schematic structural view of the electronic assembly in FIG. 2; the first electronic component 14 of the electronic assembly 200 is a passive electronic component 141, and the second electronic component 2 includes active electronic components. Element 21.
  • the substrate 11 is a package, which is provided with a first surface 12 and a second surface 13 opposite to each other.
  • the passive electronic component 141 is embedded in the substrate 11 and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13 .
  • the active electronic component 21 is disposed on the second surface 13 of the substrate 11 and is electrically connected to the second electrical connection terminal 152 .
  • the present application can provide an electronic component 200, in which the passive electronic component 141 is embedded in the substrate 11, and the passive electronic component 141 is electrically connected to the active electronic component 21 through the electrical connection terminal 15 and is connected to other components other than the electronic component 200.
  • Other circuits are electrically connected, and make the active electronic components 21 and the passive electronic components 141 form a stack in the first direction AB, thereby reducing the distance between the passive electronic components 141 and the active electronic components 21 intersecting the first direction AB.
  • the area in the second direction CD further keeps the active electronic component 21 away from other circuit devices other than the electronic component 200 , so as to improve the heat dissipation efficiency of the active electronic component 21 .
  • FIG. 5 is another specific structural schematic diagram of the electronic component in FIG.
  • the electronic component 14 can be an inductance component 1411, and the second electronic component 2 includes at least any one of active chips and power management integrated circuits, which are specifically selected according to needs and are not limited here.
  • the substrate 11 is a package, which is provided with a first surface 12 and a second surface 13 opposite to each other.
  • the inductance element 1411 is embedded in the substrate 11 and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13 .
  • the switch element 211 is disposed on the second surface 13 of the substrate 11 and is electrically connected to the second electrical connection terminal 152 .
  • the present application can provide an electronic component 200, in which the inductance element 1411 is embedded in the substrate 11, and the inductance element 1411 is electrically connected to the switching element 211 and electrically connected to other circuits other than the electronic component 200 through the electrical connection terminal 15, And make the switching element 211 and the substrate 11 form a stack in the first direction AB, thereby reducing the area and shape of the substrate 11 and the switching element 211 in the second direction CD intersecting the first direction AB, and then making the switching element 211 away from With other circuit devices other than the electronic component 200 , the heat dissipation efficiency of the switching element 211 is improved.
  • the first electronic component placed on the substrate 11 can be a switching element 211, such as a triode, a MOS tube, or other semiconductor component products, such as a capacitor or a power management integrated circuit (Power Management Integrated Circuit, PMIC), specifically here to choose according to needs, not limited.
  • a switching element 211 such as a triode, a MOS tube, or other semiconductor component products, such as a capacitor or a power management integrated circuit (Power Management Integrated Circuit, PMIC), specifically here to choose according to needs, not limited.
  • PMIC Power Management Integrated Circuit
  • FIG. 6 is a schematic diagram of another specific structure when an accommodating groove is provided in the substrate in FIG. 4 ; It is placed in the accommodating groove 142 and electrically connected to the outside through the first electrical connection terminal 151 .
  • the first electronic component 14 When the first electronic component 14 is placed in the accommodating groove 142 , the first electronic component 14 can be quickly embedded in the substrate 11 through the accommodating groove 142 and placed in the substrate 11 stably.
  • the first electrical connection terminal 151 of the first electronic component 14 is drawn out at one end of the accommodating groove 142 in the first direction AB, so that the first electrical connection terminal 151 is electrically connected to an external circuit;
  • the other end on the top leads out the second electrical connection terminal 152 of the first electronic component 14 , so that the second electrical connection terminal 152 is electrically connected with the second electronic component 2 .
  • the electrical connection terminal 15 can lead the electrical connection terminal 15 of the first electronic component 14 to or through the first surface 12 and the second surface 13 of the substrate 11 through the surface of the accommodating groove 142 , and can also pass through the surface of the accommodating groove 142 The interior penetrates to the surface of the accommodating groove 142 to lead the electrical connection terminal 15 of the first electronic component 14 to or expose the first surface 12 and the second surface 13 of the substrate 11. Therefore, there are multiple ways to lead the electrical connection terminal 15, so It can be selected as required, and is not specifically limited here.
  • FIG. 7 is a schematic diagram of a specific structure when a conductive via hole is provided in the substrate in FIG. 7 and FIG.
  • the conductive layer 161 can be a whole metal layer such as a copper layer, an aluminum layer or a gold layer, or a metal layer with a conductive pattern.
  • the second surface 13 of the substrate is provided with a second conductive layer 162.
  • the second conductive layer 162 can be a whole piece of metal layer such as a copper layer, an aluminum layer or a gold layer, or a metal layer with a conductive pattern, specifically
  • the second conductive layer 162 can be a whole piece of metal layer; and when more than one 21 is placed on the second surface 13, the second conductive layer 162 can be a pattern layer .
  • FIG. 8 is a schematic diagram of a specific structure when conductive via holes are provided in the substrate in FIG.
  • the second conductive hole 172 of the second conductive layer 162 the first electrical connection terminal 151 is connected to the first conductive layer 161 through the first conductive hole 171, and the second electrical connection terminal 152 is connected to the second conductive layer 162 through the second conductive hole 172 .
  • the first conductive hole 171 may be a first blind hole 1711
  • the second conductive hole 172 may be a second blind hole 1721, that is, the substrate 11 is also provided with a first blind hole connected to the first conductive layer 161 1711 , and the second blind hole 1721 connected to the second conductive layer 162 .
  • the first electrical connection terminal 151 is connected to the first conductive layer 161 through the first blind hole 1711
  • the second electrical connection terminal 152 is connected to the second conductive layer 162 through the second blind hole 1721 .
  • the first electrical connection terminal 151 and the second electrical connection terminal 152 of the electronic assembly 200 can be respectively arranged on the opposite sides of the first electronic component 14 along the first direction AB, that is, the first electrical connection of the electronic assembly 200 Terminal 151 is arranged on the first surface of one end A of the first electronic component 14 along the first direction AB, and the second electrical connection terminal 152 of the electronic component 200 is arranged on the other end B of the first electronic component 14 along the first direction AB on the second side of .
  • the first surface may be the first surface 12, or a surface intersecting with the first surface 12, and the second surface may be the second surface 13, or a surface intersecting with the second surface 13, specifically according to Need to choose, not limited.
  • the first electrical connection terminal 151 of the electronic component 200 may be disposed on the first surface of the first electronic component 14 along the longitudinal direction perpendicular to the first surface and within the substrate 11 , and the electronic component 200
  • the second electrical connection terminal 152 is disposed on the second surface of the first electronic component 14 along the longitudinal direction and perpendicular to the second surface and inside the substrate 11 .
  • the electrical connection terminal 15 is not necessarily perpendicular to the first surface and the second surface, and the first electrical connection terminal 151 may intersect the first surface, and the second electrical connection terminal 152 may intersect the second surface.
  • first conductive hole 171 and the second conductive hole 172 are opened along the first direction AB, and are electrically connected to the first electrical connection terminal 151 and the second electrical connection terminal 152 respectively. That is, the first conductive hole 171 is opened along one end A of the first direction AB, and is electrically connected to the first electrical connection terminal 151; the second conductive hole 172 is opened along the other end B of the first direction AB, and is electrically connected to the second Terminal 152 is electrically connected.
  • the first conductive hole 171 is opened along the interior of the substrate 11 at the bottom of the longitudinal direction, so that the first conductive hole 171 is connected to the first electrical connection terminal at the lower end of the first electronic component 14 at the bottom of the vertical direction.
  • the second conductive hole 172 is opened along the interior of the substrate 11 at the upper end of the longitudinal direction to realize the electrical connection of the second conductive hole 172 with the second electrical connection terminal 152 at the upper end of the first electronic component 14 at the upper end of the longitudinal direction.
  • FIG. 9 is a schematic structural diagram of a voltage regulation module in another embodiment of the present application; the The voltage regulation module 300 includes a circuit board 3 and the above-mentioned electronic assembly 200 , wherein the electronic assembly 200 is electrically connected to the circuit board 3 .
  • a conductive pattern layer 31 is provided on the surface of the circuit board 3 , and the conductive pattern layer 31 is electrically connected to the electronic component 200 through the electrical connection terminal 15 .
  • the electronic component 200 is disposed on the circuit board 3 and is electrically connected to the conductive pattern layer 31 of the circuit board 3 , and the electronic component 200 may be the electronic component as described above.
  • the second electronic component 2 , the substrate 11 and the circuit board 3 are sequentially stacked in a first direction AB, and the first direction AB intersects the first surface 12 and the second surface 13 of the substrate 11 .
  • the first direction AB may perpendicularly intersect both the first surface 12 and the second surface 13 of the substrate 11 .
  • the present application can provide a voltage regulation module 300, in which the second electronic component 2, the substrate 11 and the circuit board 3 are sequentially stacked in the first direction AB, thereby reducing the size of the second electronic component 2, the substrate 11 and the circuit board. 3
  • the first electronic component 14 placed on the substrate 11 may be an inductance element 1411, and a switch element 211 may be provided on the inductance element 1411, such as a triode, a MOS transistor, or other semiconductor components.
  • a switch element 211 may be provided on the inductance element 1411, such as a triode, a MOS transistor, or other semiconductor components.
  • capacitors or PMICs when the circuit board is a PCB motherboard, the inductance element 1411 is sunk onto the printed circuit board (Printed Circuit Board, PCB) motherboard, and the PMIC, resistors, and capacitors are attached to the inductor unit. And heat dissipation treatment is performed on the outer surfaces of the PMIC, resistors, and capacitors. Wherein, if the PMIC is a plastic package, the PMIC does not need to be packaged twice.
  • the second electronic component 2 is provided with a heat sink, and the heat sink, the second electronic component 2, the first electronic component 14 and the circuit board are sequentially stacked in the first direction AB to solve the problem of the electronic assembly 200 heat dissipation.
  • FIG. 10 is a schematic structural diagram of the voltage regulation module in FIG. Substrate 11. Specifically, the bottom surface of the groove 32 is provided with a conductive pattern layer 31 , which can be used for electrical connection with the first electrical connection terminal 151 .
  • the plurality of electronic components 200 can be arranged on the circuit board 3, and the groove 32 arranged on the circuit board 3 can be used to partially accommodate the substrate 11 of an electronic component 200,
  • the substrates 11 of multiple electronic components 200 can also be accommodated in the circuit board 3, and the substrates 11 of all the electronic components 200 can also be accommodated in the circuit board 3. Specifically, it is selected according to the needs, and will not be described here. limited.
  • the first electronic component 14 of the electronic component 200 may be an inductance component 1411
  • the second electronic component 2 includes a switch component 211 .
  • the inductance element 1411 can be a part of the electronic component 200 used as the voltage regulation module 300, and can also be used as an energy storage component.
  • the inductance element 1411 selected for it may be a choke inductor on the one hand, or a chip inductor on the other hand.
  • the inductance element 1411 is a choke inductor
  • the inductance element 1411 is integrally formed and is a packaged shielded inductor.
  • the voltage regulation module 300 is electrically connected to the external power supply and the load, and the voltage across the load decreases, the external power supply charges the choke inductor through the switching element 211 so that the load reaches the required rated voltage.
  • the switching action of the switching element 211 causes the external power supply to disconnect the choke inductance, so as to release energy and continue to supply power to the load.
  • the inductance element 1411 is a chip inductor
  • the voltage regulation module 300 when the voltage regulation module 300 is electrically connected to the external power supply and the load, and the voltage across the load decreases, the external power supply charges the chip inductor through the switching element 211, so that the load reaches the required rated voltage .
  • the switching action of the switching element 211 causes the external power supply to disconnect the chip inductor, so as to release energy and continue to supply power to the load.
  • the present application embeds the inductance element 1411 in the PCB board.
  • the chip containing the triode When the chip containing the triode is exposed outside the PCB, it is arranged above the inductance element 1411.
  • the longitudinal stacking method is used to design and construct the second time, and the chip A heat sink or heat dissipating component is arranged on it, so as to solve the heat dissipation effect of the voltage regulation module 300.
  • the thickness of the voltage regulation module 300 in the first direction AB is increased, the manufacturing area in the second direction CD is reduced, and Considering that the thickness of the blind hole is limited, the increased thickness of the voltage regulation module 300 in the first direction AB is beneficial to better arrange the blind hole.
  • the computational power of the module 300 that is, the number of on-offs in the insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) in the second electronic component 2 increases, and the IGBT is a bipolar transistor (BJT) and an insulated gate type transistor.
  • IGBT Insulated Gate Bipolar Transistor
  • the composite fully-controlled voltage-driven power semiconductor device composed of field effect transistors (MOS) has both the advantages of both, which can greatly increase the power density of the voltage regulation module 300 and improve the working performance of the voltage regulation module 300, thus making it It has a wide range of applications in the fields of CPU and GPU.
  • MOS field effect transistors
  • Fig. 11 is a schematic structural diagram of a voltage stabilizing device in another embodiment of the present application; the voltage stabilizing The device 400 includes the electronic assembly 200 described above.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente demande divulgue un boîtier de composant électronique, un composant électronique, un module régulateur de tension et un dispositif de stabilisation de tension. Le boîtier de composant électronique comprend un substrat pourvu d'une première surface et d'une seconde surface opposées l'une à l'autre, une première couche conductrice étant disposée sur la première surface du substrat; une seconde couche conductrice est disposée sur la seconde surface du substrat; le substrat est en outre pourvu d'un premier trou conducteur en communication avec la première couche conductrice et d'un second trou conducteur en communication avec la seconde couche conductrice; et un premier composant électronique enfoui dans le substrat et pourvu d'une première borne de connexion électrique et d'une seconde borne de connexion électrique, la première borne de connexion électrique étant connectée à la première couche conductrice au moyen du premier trou conducteur, et la seconde borne de connexion électrique étant connectée à la seconde couche conductrice au moyen du second trou conducteur; le premier composant électronique est un composant électronique passif. De cette manière, la présente demande concerne un boîtier de composant électronique, qui peut éviter de diminuer les performances électriques provoquées par la corrosion d'impuretés dans l'air sur le composant électronique passif, améliorer le niveau d'intégration, et faciliter le montage et le transport.
PCT/CN2021/103809 2021-06-30 2021-06-30 Boîtier de composant électronique, composant électronique, module régulateur de tension et dispositif de stabilisation de tension WO2023272642A1 (fr)

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PCT/CN2021/103809 WO2023272642A1 (fr) 2021-06-30 2021-06-30 Boîtier de composant électronique, composant électronique, module régulateur de tension et dispositif de stabilisation de tension
US17/565,470 US11737212B2 (en) 2021-06-30 2021-12-30 Electronic component package, electronic assembly, voltage regulation module, and voltage regulator member

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PCT/CN2021/103809 WO2023272642A1 (fr) 2021-06-30 2021-06-30 Boîtier de composant électronique, composant électronique, module régulateur de tension et dispositif de stabilisation de tension

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TW200840430A (en) * 2007-03-19 2008-10-01 Kinsus Interconnect Tech Corp The structure of electric part inserted into electric circuit board and the insertion method
TW200922429A (en) * 2007-11-14 2009-05-16 Advanced Semiconductor Eng Structure and manufacturing method of (with embedded component) multilayer circuit board
CN103906370A (zh) * 2012-12-27 2014-07-02 宏启胜精密电子(秦皇岛)有限公司 芯片封装结构、具有内埋元件的电路板及其制作方法
CN105530765A (zh) * 2014-09-29 2016-04-27 富葵精密组件(深圳)有限公司 具有内埋元件的电路板及其制作方法
CN108987371A (zh) * 2017-06-02 2018-12-11 旭德科技股份有限公司 元件内埋式封装载板及其制作方法
WO2019198241A1 (fr) * 2018-04-13 2019-10-17 株式会社メイコー Procédé permettant de fabriquer une carte ayant des composants intégrés et carte ayant des composants intégrés
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US20230007772A1 (en) 2023-01-05

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