WO2023246019A1 - 光模块 - Google Patents

光模块 Download PDF

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Publication number
WO2023246019A1
WO2023246019A1 PCT/CN2022/139701 CN2022139701W WO2023246019A1 WO 2023246019 A1 WO2023246019 A1 WO 2023246019A1 CN 2022139701 W CN2022139701 W CN 2022139701W WO 2023246019 A1 WO2023246019 A1 WO 2023246019A1
Authority
WO
WIPO (PCT)
Prior art keywords
pin
substrate
tube
area
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/139701
Other languages
English (en)
French (fr)
Inventor
张晓磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to CN202280094647.8A priority Critical patent/CN119053893A/zh
Publication of WO2023246019A1 publication Critical patent/WO2023246019A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects

Definitions

  • the present disclosure relates to the field of optical communication technology, and in particular, to an optical module.
  • Optical module is a tool for realizing mutual conversion of optical and electrical signals, and is one of the key components in optical communication equipment.
  • Optical modules usually include light-emitting devices, light-receiving devices, microprocessors and other devices.
  • Optical modules there are some optical modules in which separate light-emitting devices and light-receiving devices are packaged together in a metal casing to form an optical transceiver assembly.
  • Optical emitters usually include a tube cap and a tube base.
  • the tube cap is placed on the tube base.
  • the tube base is provided with a metal boss and several through holes for the pins to pass through.
  • the bottom surface of the metal boss is fixed on the tube seat.
  • a laser chip is fixed on the side of the metal boss, and the pins are connected to the laser chip. The capacitive effect caused by the interaction between the metal boss and the pin causes the impedance mismatch of the high-frequency signal line connected to the pin, thereby affecting the bandwidth of the high-frequency signal line.
  • the present disclosure provides an optical module, which includes: a light emitting device, including a tube base and a pin; a first substrate provided on the tube base; and a pin, including a first pin and a second pin extending into and out of the tube base.
  • the first substrate is a ceramic substrate, and is provided with a first notch area, a second notch area, a first signal transmission area and a second signal transmission area; the first notch area is formed by the first side of the first substrate and the second notch area.
  • the bottom surface of the first substrate is recessed inward, and the first pin is provided therein; the second gap area is formed by the first side surface of the first substrate and the bottom surface of the first substrate being recessed inward, and the second tube is provided therein.
  • the first signal transmission area extends downward from the first side of the first substrate to the top surface of the first notch area, and the first high-frequency signal line is laid on the surface to form a first signal line transmission layer;
  • the second signal transmission The area is not connected to the first signal transmission area, extending downward from the first side of the first substrate to the top surface of the second notch area, and a second high-frequency signal line is laid on the surface to form a second signal line transmission layer;
  • One pin is connected to the first signal line transmission layer located in the first notch area; the second pin is connected to the second signal line transmission layer located in the second notch area; the second signal line transmission layer is provided on the surface
  • There is a laser chip; the laser chip has a negative pin connected to the surface of the second signal line transmission layer, and an anode pin connected to the surface of the first signal line transmission layer.
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Figure 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • Figure 5 is a schematic structural diagram of an optical transceiver component according to some embodiments.
  • Figure 6 is an exploded view of an optical transceiver assembly according to some embodiments.
  • Figure 7 is a structural diagram of a light emitting device according to some embodiments.
  • Figure 8 is a structural diagram of a light emitting device excluding a tube cap according to some embodiments.
  • Figure 9 is an exploded structural view of a light emitting device according to some embodiments.
  • Figure 10 is a first angle cross-sectional view of a light emitting device according to some embodiments.
  • Figure 11 is a partial enlarged view of Figure 10;
  • Figure 12 is a second angle cross-sectional view of a light emitting device according to some embodiments.
  • Figure 13 is a third angle cross-sectional view of a light emitting device according to some embodiments.
  • Figure 14 is a first angle structural view of a pipe cap according to some embodiments.
  • Figure 15 is a second angle structural view of a pipe cap according to some embodiments.
  • Figure 16 is a first angle structural view of the tube housing according to some embodiments.
  • Figure 17 is a second angle structural view of the tube housing according to some embodiments.
  • Figure 18 is a first angle structural view of the first substrate, laser chip and pins according to some embodiments.
  • Figure 19 is a second angle structural view of the first substrate, laser chip and pins according to some embodiments.
  • Figure 20 is a first angle structural view of the first substrate and the laser chip according to some embodiments.
  • Figure 21 is a second angle structural view of the first substrate and the laser chip according to some embodiments.
  • Figure 22 is a first angle structural view of the first substrate according to some embodiments.
  • Figure 23 is a second angle structural view of the first substrate according to some embodiments.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and includes the following combinations of A, B and C: A only, B only, C only, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • optical communication technology light is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by computers and other information processing equipment are electrical signals. Therefore, in order to distinguish between information transmission equipment such as optical fibers or optical waveguides and computers and other information processing equipment To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • Optical modules realize the mutual conversion function of the above-mentioned optical signals and electrical signals in the field of optical fiber communication technology.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (for example, optical modem) through the electrical port.
  • the electrical connection It is mainly configured to realize power supply, I2C signal transmission, data signal transmission, grounding, etc.; the optical network terminal transmits electrical signals to computers and other information processing equipment through network cables or wireless fidelity technology (Wi-Fi).
  • Figure 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000, local information processing equipment 2000, optical network terminal 100, optical module 200, optical fiber 101 and network cable 103;
  • the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200.
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of thousands of meters (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long-distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers, or hundreds of kilometers.
  • the local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection;
  • the electrical port is configured to be connected to the optical network terminal 100, so that the optical module 200 and the optical network terminal 100 establish a bidirectional connection. electrical signal connection.
  • the optical module 200 realizes mutual conversion between optical signals and electrical signals, thereby establishing a connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100.
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then is input into the optical network terminal 100. to fiber 101.
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing, and an optical module interface 102 and a network cable interface 104 provided on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 Establish a two-way electrical signal connection.
  • the optical module 200 and the network cable 103 are connected through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200.
  • the optical network terminal 100 serves as the superior of the optical module 200.
  • the machine can monitor the work of the optical module 200.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT), etc.
  • OLT optical Line Terminal
  • the remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.
  • Figure 2 is a structural diagram of an optical network terminal according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, Figure 2 only shows the parts of the optical network terminal 100 related to the optical module 200. structure. As shown in FIG. 2 , the optical network terminal 100 also includes a PCB circuit board 105 provided in the housing, a cage 106 provided on the surface of the PCB circuit board 105 , and an electrical connector provided inside the cage 106 . The electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other protrusions that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the optical module 200 is fixed by the cage 106.
  • the heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100.
  • the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.
  • Figure 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded structural diagram of an optical module according to some embodiments.
  • the optical module 200 includes a shell, a circuit board 300 and an optical transceiver component 400 disposed in the shell.
  • the housing includes an upper housing 201 and a lower housing 202.
  • the upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings; the outer contour of the housing generally presents a square body.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and the cover plate 2011 is closed On the two lower side plates 2022 of the lower housing 202, the above-mentioned housing is formed.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021;
  • the upper case 201 includes a cover plate 2011 and two lower side plates 2022 located on both sides of the cover plate 2011.
  • the two upper side plates of the cover plate 2011 are vertically arranged, and are combined with the two lower side plates 2022 to realize that the upper housing 201 is covered on the lower housing 202 .
  • the direction of the connection line between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at an end of the optical module 200 and the opening 205 is located at a side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger 301 of the circuit board 300 extends from the electrical port 204 and is inserted into the host computer (for example, the optical network terminal 100); the opening 205 is an optical port, configured to access the external optical fiber 101, so that The external optical fiber 101 is connected to the optical transceiver component 400 inside the optical module 200.
  • the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the optical transceiver assembly 400 and other components into the housing, and the upper housing 201 and the lower housing 202 form packaging protection for these components.
  • the upper housing 201 and the lower housing 202 form packaging protection for these components.
  • the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
  • the optical module 200 also includes an unlocking component located outside its housing.
  • the unlocking component is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixation between the optical module 200 and the host computer. connect.
  • the unlocking component is located on the outer walls of the two lower side plates 2022 of the lower housing 202 and has a snap component that matches the upper computer cage (for example, the cage 106 of the optical network terminal 100).
  • the optical module 200 is inserted into the cage of the host computer, the optical module 200 is fixed in the cage of the host computer by the engaging parts of the unlocking part.
  • the engaging parts of the unlocking part move accordingly, thereby changing the engaging parts.
  • the connection relationship with the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit wiring, electronic components and chips.
  • the electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding.
  • Electronic components include, for example, capacitors, resistors, triodes, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Fie Laser Chip-Effect Transistor, MOSFET).
  • Chips include, for example, Microcontroller Unit (MCU), laser driver chip, limiting amplifier (limiting amplifier), clock and data recovery (Clock and Data Recovery, CDR) chip, power management chip, digital signal processing (Digital Signal Processing, DSP) chip.
  • MCU Microcontroller Unit
  • CDR clock and Data Recovery
  • DSP digital signal processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can smoothly carry the above-mentioned electronic components and chips; when the optical transceiver component is located on the circuit board, the rigid circuit board The circuit board can also provide smooth loading; the rigid circuit board can also be inserted into the electrical connector in the host computer cage.
  • the circuit board 300 also includes a gold finger 301 formed on an end surface thereof, and the gold finger 301 is composed of a plurality of mutually independent pins.
  • the circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connector in the cage 106 by the gold finger 301 .
  • the gold finger 301 can be disposed only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or can be disposed on the upper and lower surfaces of the circuit board 300 to adapt to situations where a large number of pins are required.
  • the golden finger 301 is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules.
  • Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • a flexible circuit board can be used to connect the rigid circuit board and the optical transceiver component.
  • the optical transceiver component 400 includes a light emitting device and a light receiving device.
  • the light emitting device is configured to transmit an optical signal
  • the light receiving device is configured to receive an optical signal.
  • a light emitting device and a light receiving device are combined together to form an integrated optical transceiver assembly.
  • Figure 5 is a schematic structural diagram of an optical transceiver component according to some embodiments.
  • Figure 6 is an exploded view of an optical transceiver assembly according to some embodiments.
  • the optical transceiver assembly 400 includes a round and square tube body 401, a light emitting device 402, a light receiving device 403, an optical component 404 and an optical fiber adapter 405.
  • the round and square tube body 401 is provided with a first nozzle, a second nozzle and a third nozzle, and is configured to carry a fixed light emitting device 402, a light receiving device 403, an optical Assembly 404 and fiber optic adapter 405.
  • the light emitting device 402 is embedded in the first tube opening
  • the light receiving device 403 is embedded in the second tube opening
  • the optical component 404 is arranged in the inner cavity of the round and square tube body 401
  • the optical fiber adapter 405 is embedded in the inner cavity of the round and square tube body 401. at the third nozzle.
  • the first nozzle and the second nozzle are respectively arranged on adjacent side walls of the round and square tube body 401, and the first and third nozzles are respectively arranged on the side walls of the round and square tube body 401 in the length direction.
  • the second nozzle is provided on the side wall of the round and square tube body 401 in the width direction.
  • the round and square tube body 401 is generally made of metal material, which is beneficial to electromagnetic shielding and heat dissipation.
  • the light emitting device 402 thermally contacts the round square tube body 401 through the first tube opening
  • the light receiving device 403 thermally contacts the round square tube body 401 through the second tube opening.
  • the light-emitting device 402 and the light-receiving device 403 are directly press-fitted into the round-square tube body 401, and the round-square tube body 401 is in contact with the light-emitting device 402 and the light-receiving device 403 respectively, either directly or through a thermally conductive medium.
  • the round and square tube body 401 can be configured to dissipate heat of the light emitting device 402 and the light receiving device 403, ensuring the heat dissipation effect of the light emitting device 402 and the light receiving device 403.
  • the light emitting device 402 is connected to the circuit board 300 through a flexible circuit board and is configured to emit data light.
  • the light receiving device 403 is connected to the circuit board 300 through a flexible circuit board, has a light receiving chip installed therein, and is configured to receive data light.
  • the light receiving device 403 includes a tube base and a tube cap.
  • the tube cap is mounted on the tube base, and the tube cap and the tube base enclose a cavity.
  • the tube base is provided with a light receiving chip and a second lens.
  • the data light emitted by the optical fiber adapter 405 is reflected by the optical component 404 to the second lens in the light receiving device 403, and is converged to the light receiving chip through the second lens.
  • the optical component 404 is disposed in the inner cavity of the round tube body 401 and is configured to adjust the data light emitted by the light emitting device 402 and adjust the data light incident on the light receiving device 403 .
  • Fiber optic adapter 405 is configured to connect optical fibers.
  • the light emitting device 402 is embedded in the first opening of the round square tube
  • the light receiving device 403 is embedded in the second opening of the round square tube
  • the optical fiber adapter 405 is embedded in the round square tube.
  • the light emitting device 402 and the light receiving device 403 establish optical connections with the optical fiber adapter 405 respectively.
  • the data light emitted by the optical transmitting device 402 and the light received by the optical receiving device 403 are both transmitted through the same optical fiber in the optical fiber adapter 405. That is, the same optical fiber in the optical fiber adapter 405 is the transmission channel for the incoming and outgoing light of the optical transceiver component.
  • the optical transceiver The component implements single-fiber bidirectional optical transmission mode.
  • Figure 7 is a structural diagram of a light emitting device according to some embodiments.
  • Figure 8 is a structural diagram of a light emitting device excluding a tube cap according to some embodiments.
  • Figure 9 is an exploded structural view of a light emitting device according to some embodiments.
  • Figure 10 is a first angle cross-sectional view of a light emitting device according to some embodiments.
  • Figure 11 is a partial enlarged view of Figure 10.
  • Figure 12 is a second angle cross-sectional view of a light emitting device according to some embodiments.
  • Figure 13 is a third angle cross-sectional view of a light emitting device according to some embodiments.
  • Figure 14 is a first angle structural view of a pipe cap according to some embodiments.
  • Figure 15 is a second angle structural view of a tube cap according to some embodiments.
  • the light emitting device 402 includes a tube base 4021 and a tube cap 4022.
  • the tube cap 4022 is covered on the tube base 4021, and the tube cap 4022 and the tube base 4021 enclose a cavity.
  • the first substrate 4025 is disposed in the cavity surrounded by the tube cap 4022 and the tube base 4021.
  • a laser chip 4026 is provided on the first substrate 4025.
  • the anode pin of the laser chip 4026 is connected to the laser driver chip on the circuit board 300
  • the cathode pin of the laser chip 4026 is connected to the laser driver chip on the circuit board 300 .
  • the laser chip 4026 generates data light and monitoring light under the action of the driving current and modulation current provided by the laser driver chip.
  • the tube cap 4022 is provided with a through hole 40221, and the first lens 4024 is bonded to the through hole 40221.
  • the first lens 4024 is a collimating lens.
  • the data light emitted by the laser chip 4026 is collimated by the first lens 4024 on the tube cap 4022 and then injected into the round and square tube body 401, and is condensed by the optical component 404 in the round and square tube body 401 and then coupled to the optical fiber adapter 405.
  • a light detector 4027 is also provided in the cavity surrounded by the tube cap 4022 and the tube base 4021.
  • the photodetector 4027 is located on the back side of the laser chip 4026.
  • the light detector 4027 is configured to receive the monitoring light emitted by the laser chip 4026 to generate a monitoring current.
  • connection relationship between the positive and negative pins of the photodetector 4027 and other devices is: the positive pin of the photodetector 4027 is connected to ground, and the negative pin of the photodetector 4027 is directly connected to the MCU; or, the positive tube of the photodetector 4027 The pin is directly connected to the MCU, and the negative pin of the photodetector 4027 is wired to the positive pin of the laser chip.
  • Figure 16 is a first angle structural view of a tube housing according to some embodiments.
  • Figure 17 is a second angle structural view of the tube housing according to some embodiments.
  • the light emitting device 402 includes a pin 4023.
  • the first end of the pin 4023 is connected to the circuit board 300 through a flexible circuit board, and the second end of the pin 4023 extends into the tube base 4021 and extends into the cavity surrounded by the tube base 4021 and the tube cap 4022 and into the cavity on the tube base 4021.
  • Each component is connected; or, the second end of the pin 4023 extends into the tube base 4021, but does not extend into the cavity surrounded by the tube base 4021 and the tube cap 4022.
  • the pin 4023 includes a first pin 40231, a second pin 40232, a third pin 40233 and a fourth pin 40234.
  • the first pin 40231 has a first end connected to the laser driver chip on the circuit board 300 through a flexible circuit board, and a second end connected to the anode pin of the laser chip 4026 through a signal line.
  • the first end of the second pin 40232 is connected to the laser driver chip on the circuit board 300 through the flexible circuit board, and the second end is connected to the negative pin of the laser chip 4026 through a signal line.
  • the first end of the third pin 40233 is connected to the MCU on the circuit board 300 through the flexible circuit board, and the second end is connected to a pin of the photodetector 4027 via a wire.
  • the fourth pin 40234 has a first end connected to ground and a second end connected to the tube base 4021.
  • the tube base 4021 is the ground
  • the negative pin of the photodetector 4027 is connected to the ground.
  • its negative pin cannot be connected to ground. It can only be connected to the positive pin of the laser chip or to the MCU through the third pin 40233. Therefore, the first substrate on which the photodetector 4027 is placed is provided on the stem 4021 . A bonding pad area is provided on the first substrate, and the negative electrode pin of the photodetector 4027 is connected to the bonding pad area.
  • the pad area is not only connected to the negative pin of the photodetector 4027, but also connected to the positive tube of the laser chip. Pin wire connection, or wire connection with the third pin 40233.
  • the pad area is wired to the positive pin of the laser chip, the positive pin of the photodetector 4027 is wired to the MCU through the third pin 40233.
  • the pad area is wired to the third pin 40233, the positive pin of the photodetector 4027 is wired to the tube base 4021.
  • the tube cap is directly mounted on the top surface of the tube base. Since the pipe base and the pipe cap are connected by resistance welding, there will be residue on the surface of the pipe base after the pipe cap is removed, making the surface of the pipe base uneven. When the tube base and the tube cap are connected together again through resistance welding, there may be a gap between the tube cap and the tube base, causing the light-emitting device to have air leakage or optical path deviation.
  • the tube base 4021 includes a tube base body 40211 and a protrusion 40212. The top surface of the tube base body 40211 is provided with a first substrate 4025.
  • the side surface is in contact with the inner surface of the protrusion 40212, the bottom surface of the tube holder body 40211 is connected to the fourth pin 40234, the first pin 40231, the second pin 40232 and the third pin 40233 are all facing from the bottom of the tube holder body 40211
  • the top surface of the tube holder body 40211 extends out of the top surface of the tube holder body 40211.
  • the tube cap 4022 is in contact with the top surface of the protrusion 40212, and the top surface of the protrusion 40212 is higher than the top surface of the tube holder body 40211.
  • the tube cap 4022 Since the top surface of the protrusion 40212 is higher than the top surface of the tube holder body 40211, the tube cap 4022 only contacts the top surface of the protrusion 40212 and not the top surface of the tube holder body 40211. Then the tube cap 4022 only protrudes after being removed. There is residue on the top surface of 40212, but there is no residue on the top surface of tube holder body 40211. Since the top surface height of the first base plate 4025 is higher than the top surface height of the protrusion 40212, before the pipe cap 4022 and the protrusion 40212 are connected again through resistance welding, the first base plate 4025 on the top surface of the tube base body 40211 is first removed. , and then polish the top surface of protrusion 40212.
  • polish the top surface of the protrusion 40212 Before connecting the pipe cap 4022 and the protrusion 40212 through resistance welding again, polish the top surface of the protrusion 40212 to improve the flatness of the top surface of the protrusion 40212 and avoid the existence of gaps between the top surface of the protrusion 40212 and the pipe cap 4022. gap, thereby preventing the light emitting device 402 from air leakage or optical path deviation problems.
  • the top surface of the tube seat body 40211 refers to the side of the tube seat body 40211 close to the tube cap 4022
  • the bottom surface of the tube seat body 40211 refers to the side of the tube seat body 40211 away from the tube cap 4022
  • the top of the protrusion 40212 The side refers to the side of the protrusion 40212 close to the pipe cap 4022.
  • the height of the pin 4023 protruding from the tube base 4021 is lower than the height difference between the top surface of the protrusion 40212 and the top surface of the tube seat body 40211, grinding the top surface of the protrusion 40212 can easily reach the pin 4023, making the protrusion The top surface of 40212 is less flat.
  • the height difference between the top surface of the protrusion 40212 and the top surface of the tube base body 40211 is greater than the height of the pin 4023 protruding from the tube base 4021.
  • the height of the pin 4023 protruding from the tube base 4021 refers to the height difference between the portion of the pin 4023 protruding from the tube base 4021 and the tube base body 40211.
  • the height difference between the top surface of the protrusion 40212 and the top surface of the tube base body 40211 is greater than the height of the pin 4023 protruding from the tube seat 4021.
  • the flatness of the top surface is relatively high, which avoids gaps between the top surface of the protrusion 40212 and the tube cap 4022, thereby avoiding air leakage or optical path deviation problems in the light emitting device 402.
  • the tube base body 40211 and the protrusion 40212 can be two independent structural parts, or they can be an integrally formed structural part.
  • the side surface of the tube seat body 40211 is in contact with part of the inner surface of the protrusion 40212.
  • the protrusion 40212 extends from the edge of the tube seat body 40211 toward the tube cap 4022.
  • the top view shape of the tube base body 40211 is circular, the top view shape of the protrusion 40212 in contact with the tube base body 40211 is annular.
  • Figure 18 is a first angle structural view of the first substrate, laser chip and pins according to some embodiments.
  • Figure 19 is a second angle structural view of the first substrate, laser chip and pins according to some embodiments.
  • Figure 20 is a first angle structural view of the first substrate and the laser chip according to some embodiments.
  • Figure 21 is a second angle structural view of the first substrate and the laser chip according to some embodiments.
  • Figure 22 is a first angle structural view of the first substrate according to some embodiments.
  • Figure 23 is a second angle structural view of the first substrate according to some embodiments.
  • the first substrate 4025 is located on the top surface of the stem body 40211
  • the laser chip 4026 is disposed on the first substrate 4025
  • the first substrate 4025 is a ceramic substrate.
  • the laser chip is located on a metal boss. Due to the capacitance effect caused by the interaction between the metal boss and the protruding pin of the tube base, the impedance of the high-frequency signal line connected to the pin does not match, thereby affecting the bandwidth of the high-frequency signal line.
  • the first substrate 4025 for fixing the laser chip is provided on the top surface of the stem body 40211, and no metal boss is provided, and the first substrate 4025 is a ceramic substrate. Since there is no metal boss to fix the laser chip in the light-emitting device, there is only the first substrate 4025 to fix the laser chip, and the first substrate 4025 is a ceramic substrate, which avoids the capacitive effect caused by the interaction between the metal boss and the pin 4023. Reduce the impedance mismatch between the high-frequency signal lines connected to the pins due to the capacitance effect, thereby reducing the signal reflection caused by the impedance mismatch of the high-frequency signal lines, and improve the bandwidth of the high-frequency signal lines.
  • the end of the first substrate 4025 facing the photodetector 4027 is provided with a first signal transmission area 40251, a second signal transmission area 40252, a first notch area 40253, and a second notch area. 40254 and the third gap area 40255.
  • the first signal transmission area 40251 extends downward from the surface of the first substrate 4025 facing the photodetector 4027 to the bottom surface of the first substrate 4025 . Since the first substrate 4025 is a ceramic substrate, high-frequency signal lines can be laid on the surface to form a circuit pattern. The first high-frequency signal lines are laid in the first signal transmission area 40251 on the first substrate 4025 to form the first signal line transmission. layer.
  • the first signal line transmission layer has a first end welded to the first pin 40231, a second end wired to the anode pin of the laser chip 4026, and is configured to transmit the first high-frequency signal.
  • the second signal transmission area 40252 extends downward from the surface of the first substrate 4025 facing the photodetector 4027 to the bottom surface of the first substrate 4025 . Since the first substrate 4025 is a ceramic substrate, high-frequency signal lines can be laid on the surface to form a circuit pattern. Then, a second high-frequency signal line is laid in the second signal transmission area 40252 on the first substrate 4025 to form a second signal line transmission. layer.
  • the surface of the first substrate 4025 facing the photodetector 4027 is the first side surface of the first substrate 4025 .
  • the second signal line transmission layer has a first end welded to the second pin 40232, a second end wired to the negative pin of the laser chip 4026, and is configured to transmit the second high-frequency signal.
  • the cathode pin of the laser chip 4026 is connected to the surface of the second signal line transmission layer, and the anode pin of the laser chip 4026 is wired to the surface of the first signal line transmission layer.
  • the laser chip 4026 generates data light under the action of the first high-frequency signal and the second high-frequency signal.
  • the first high-frequency signal is a first driving current and a first modulation current
  • the second high-frequency signal is a second driving current and a second modulation current
  • the first driving current and the second driving current are in opposite phases
  • the first modulation current inverse phase with the second modulation current.
  • the first notch area 40253 is formed by both the side of the first substrate 4025 facing the photodetector 4027 and the bottom surface of the first substrate 4025 being indented inwards.
  • the first pin 40231 is provided in the first notch area 40253. Since the first signal line transmission layer extends downward from the first substrate 4025 toward the light detector 4027 to the bottom surface of the first substrate 4025, the first signal line transmission layer extends downward from the first substrate 4025 toward the light detector 4027. to the top surface of the first notch area 40253 of the first substrate 4025.
  • the first signal line transmission layer extends downward from the surface of the first substrate 4025 toward the photodetector 4027 to the top surface of the first notch area 40253 of the first substrate 4025, the first end of the first pin 40231 is located at the first The first signal line transmission layer on the top surface of the notch area 40253 is connected, and the second end of the first pin 40231 is connected to the laser driver chip through the flexible circuit board.
  • the second notch area 40254 is formed by both the side of the first substrate 4025 facing the photodetector 4027 and the bottom surface of the first substrate 4025 being indented inwards.
  • the second pin 40232 is provided in the second notch area 40254. Since the first signal line transmission layer extends downward from the first substrate 4025 toward the light detector 4027 to the bottom surface of the first substrate 4025, the first signal line transmission layer extends downward from the first substrate 4025 toward the light detector 4027. to the top surface of the second notch area 40254 of the first substrate 4025.
  • the first end of the second pin 40232 is located at the second The second signal line transmission layer on the top surface of the notch area 40254 is connected, and the second end of the second pin 40232 is connected to the laser driver chip through the flexible circuit board.
  • first pin 40231 is placed in the first notch area 40253 and the second pin 40232 is placed in the second notch area 40254, when placing the first substrate 4025 on the top surface of the tube base 4021, only the first pin 40231 is placed in the first notch area 40254.
  • the positions of 40231 and the second pin 40232 can determine the placement position of the first substrate 4025 on the top surface of the tube base 4021. That is, the first pin 40231 is placed in the first notch area 40253, and the second pin 40232 is placed in the second notch area 40254, so as to facilitate the determination of the placement position of the first substrate 4025 on the tube base 4021, thereby ensuring the concentricity of the tube cap 4022.
  • the concentricity of the tube cap meets the production requirements means that there is a partial deviation between the optical axis of the light emitted by the laser chip on the first substrate and the central axis of the first lens on the tube cap, but the deviation is within the preset within the deviation), thereby improving coupling efficiency.
  • the first pin 40231 is connected to the first signal line transmission layer located in the first notch area 40253, the contact area between the first pin and the first signal line transmission layer is increased, thereby increasing the transmission rate of high-frequency signals.
  • the second pin is connected to the second signal line transmission layer located in the second notch area, thereby increasing the contact area between the second pin and the second signal line transmission layer, thereby increasing the transmission rate of high-frequency signals.
  • the first pin 40231 is welded to the first signal line transmission layer located on the top surface of the first notch area 40253 through solder
  • the second pin 40232 is welded to the second signal line transmission layer located on the top surface of the second notch area 40254 through solder. welding.
  • the second pin 40232 is welded to the second signal line transmission layer located on the top surface of the second notch area 40254 through solder.
  • the shape of the top surface of the first notch area 40253 can be changed to adapt to the solder between the top surface of the first notch area 40253 and the first pin 40231, so that the solder The impedance is closer to the impedance of the first signal line transmission layer or the first pin; the shape of the top surface of the second notch area 40254 can also be changed to adapt to the situation between the top surface of the second notch area 40254 and the second pin 40232 The solder between them makes the impedance of the solder closer to the impedance of the second signal line transmission layer or the second pin.
  • the first pin 40231 is placed in the first notch area 40253, and the second pin 40232 is placed in the second notch area 40254.
  • the first pin 40232 can also be realized by controlling the shapes of the first notch area 40253 and the second notch area 40254.
  • the second pin is matched with the impedance of the first signal line transmission layer, and the second pin is matched with the impedance of the second signal line transmission layer.
  • the third notch area 40255 is formed by both the side of the first substrate 4025 facing the photodetector 4027 and the bottom surface of the first substrate 4025 being indented inwards.
  • the third gap area 40255 is located between the first gap area 40253 and the second gap area 40254, and the light detector 4027 is located in the cavity surrounded by the third gap area 40255 and the top surface of the stem body 40211.
  • the laser chip 4026 is located on the first side of the first substrate 4025, and the distance between the laser chip 4026 and the first side of the first substrate 4025 is relatively close.
  • the photodetector 4027 is not located in the cavity (that is, no third party is provided) (notch area)
  • part of the monitoring light will be reflected by the first side of the first substrate 4025, so that the received monitoring light is limited, which may result in lower monitoring accuracy.
  • the light detector 4027 is placed in the cavity surrounded by the third gap area 40255 and the top surface of the tube base body 40211. The light detector 4027 is located in the cavity and can receive more monitoring light to improve monitoring accuracy.
  • the distance between the top surface of the third notch area 40255 and the laser chip 4026 is 200 ⁇ m-400 ⁇ m.
  • the distance between the top surface of the third notch area 40255 and the laser chip 4026 refers to the distance between the top surface of the third notch area 40255 and the bottom surface of the laser chip.
  • the bottom surface of the laser chip refers to the side of the laser chip close to the third notch area, not the side connected to the first side of the first substrate, nor the side away from the first side of the first substrate.
  • the present disclosure provides an optical module including a light emitting device.
  • the light-emitting device includes a tube base and pins.
  • a first substrate is provided on the tube base.
  • the pins include first pins and second pins extending into and out of the tube base.
  • a first notch area, a second notch area, a first signal transmission area and a second signal transmission area are provided on the first substrate.
  • the first notch area and the second notch area are both formed by inward recesses of the first side surface of the first substrate and the bottom surface of the first substrate.
  • a first pin is provided in the first notch area.
  • a second pin is provided in the second notch area.
  • the first pin is placed in the first notch area, and the second pin is placed in the second notch area, so as to facilitate the determination of the placement position of the first substrate on the tube base, thereby improving the coupling efficiency.
  • the first signal transmission area extends downward from the first side of the first substrate to the top surface of the first notch area.
  • a first high-frequency signal line is laid on the surface of the first signal transmission area to form a first signal line transmission layer.
  • the second signal transmission area extends downward from the first side of the first substrate to the top surface of the second notch area.
  • a second high-frequency signal line is laid on the surface of the second signal transmission area to form a second signal line transmission layer.
  • the first pin is connected to the first signal line transmission layer located in the first gap area.
  • the second pin is connected to the second signal line transmission layer located in the second gap area.
  • the first pin is connected to the first signal line transmission layer located in the first notch area, thereby increasing the contact area between the first pin and the first signal line transmission layer, thereby increasing the transmission rate of high-frequency signals.
  • the second pin is connected to the second signal line transmission layer located in the second notch area, thereby increasing the contact area between the second pin and the second signal line transmission layer, thereby increasing the transmission rate of high-frequency signals.
  • a laser chip is provided on the surface of the second signal line transmission layer. In the laser chip, the negative electrode pin is connected to the surface of the second signal line transmission layer, and the positive electrode pin is connected to the surface of the first signal line transmission layer.
  • the first substrate is a ceramic substrate, which avoids the capacitance effect caused by the interaction between the metal boss and the pin, and reduces It eliminates the impedance mismatch of the high-frequency signal line connected to the pin due to the capacitive effect, thereby reducing the signal reflection phenomenon caused by the impedance mismatch of the high-frequency signal line and improving the bandwidth of the high-frequency signal line.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一种光模块（200），包括第一基板（4025），第一基板（4025）上设有第一缺口区域（40253）、第二缺口区域（40254）、第一信号传输区域（40251）、第二信号传输区域（40252）；第一、第二缺口区域（40253，40254）均由第一基板（4025）的第一侧面及底面向内凹陷形成；第一缺口区域（40253）内设有第一管脚（40231）；第二缺口区域（40254）内设有第二管脚（40232）；第一信号传输区域（40251）和第二信号传输区域（40252）均由第一基板（4025）的第一侧面向下延伸至对应缺口区域的顶面；第一、第二信号传输区域（40251，40252）表面分别设置第一、第二信号线传输层；第一管脚（40231）与第一信号线传输层连接；第二管脚（40232）与第二信号线传输层连接；第二信号线传输层表面设置有激光芯片（4026）。

Description

光模块
相关申请的交叉引用
本公开要求在2022年06月23日提交中国专利局、申请号为202210725834.3的专利优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一。光模块通常包括光发射器件、光接收器件、微处理器等器件，另外，还有一些光模块中将单独的光发射器件和光接收器件一起封装在金属外壳中制成光收发组件。
基于同轴封装技术相对于其它封装技术，具有寄生参数小、工艺成本低等优点，因此，光收发组件中的光发射器常会采用同轴TO封装方式。光发射器通常包括管帽和管座，管帽罩设于管座上，管座上设置有金属凸台和若干个供管脚穿过的通孔，金属凸台底面固定于管座上，金属凸台侧面固定有激光芯片，管脚与激光芯片连接。金属凸台与管脚相互作用产生的电容效应，使得与管脚连接的高频信号线阻抗不匹配，进而影响高频信号线的带宽。
发明内容
本公开提供一种光模块，包括：光发射器件，包括管座和管脚；管座，上设置有第一基板；管脚，包括伸入并延伸出管座的第一管脚和第二管脚；第一基板，为陶瓷基板，上设置有第一缺口区域、第二缺口区域、第一信号传输区域和第二信号传输区域；第一缺口区域，由第一基板的第一侧面和第一基板的底面均向内凹陷形成，内设置有第一管脚；第二缺口区域，由第一基板的第一侧面和第一基板的底面均向内凹陷形成，内设置有第二管脚；第一信号传输区域，由第一基板的第一侧面向下延伸至第一缺口区域的顶面，表面铺设第一高频信号线，以形成第一信号线传输层；第二信号传输区域，与第一信号传输区域不连接，由第一基板的第一侧面向下延伸至第二缺口区域的顶面，表面铺设第二高频信号线，以形成第二信号线传输层；第一管脚，与位于第一缺口区域内的第一信号线传输层连接；第二管脚，与位于第二缺口区域内的第二信号线传输层连接；第二信号线传输层，表面设置有激光芯片；激光芯片，负极管脚与第二信号线传输层表面连接，正极管脚与第一信号线传输层表面打线连接。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图， 对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的一种光通信系统的连接关系图；
图2为根据一些实施例的一种光网络终端的结构图；
图3为根据一些实施例的一种光模块的结构图；
图4为根据一些实施例的一种光模块的分解图；
图5为根据一些实施例的光收发组件的结构示意图；
图6为根据一些实施例的光收发组件的分解图；
图7为根据一些实施例的光发射器件的结构图；
图8为根据一些实施例的除管帽外的光发射器件的结构图；
图9为根据一些实施例的光发射器件的分解结构图；
图10为根据一些实施例的光发射器件的第一角度截面图；
图11为图10的部分放大图；
图12为根据一些实施例的光发射器件的第二角度截面图；
图13为根据一些实施例的光发射器件的第三角度截面图；
图14为根据一些实施例的管帽的第一角度结构图；
图15为根据一些实施例的管帽的第二角度结构图；
图16为根据一些实施例的管壳的第一角度结构图；
图17为根据一些实施例的管壳的第二角度结构图；
图18为根据一些实施例的第一基板、激光芯片和管脚的第一角度结构图；
图19为根据一些实施例的第一基板、激光芯片和管脚的第二角度结构图；
图20为根据一些实施例的第一基板与激光芯片的第一角度结构图；
图21为根据一些实施例的第一基板与激光芯片的第二角度结构图；
图22为根据一些实施例的第一基板的第一角度结构图；
图23为根据一些实施例的第一基板的第二角度结构图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、 材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“被配置为”的使用意味着开放和包容性的语言，其不排除被配置为执行额外任务或步骤的设备。
如本文所使用的那样，“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
光通信技术中，使用光携带待传输的信息，并使携带有信息的光信号通过光纤或光波导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光信号通过光纤或光波导中传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要被配置为实现供电、I2C信号传输、数据信号传输以及接地等；光网络终端通过网线或无线保真技术(Wi-Fi)将电信号传输给计算机等信息处理设备。
图1为根据一些实施例的一种光通信系统的连接关系图。如图1所示，光通信系统主要包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103；
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。 光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现超长距离传输。因此在通常的光通信系统中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平板电脑、电视机等。
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。
光模块200包括光口和电口。光口被配置为与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立连接。在本公开的某一实施例中，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。
光网络终端100包括大致呈长方体的壳体(housing)，以及设置在壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。在本公开的某一实施例中，光网络终端100将来自光模块200的电信号传递给网线103，将来自网线103的信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立了双向的信号传递通道。
图2为根据一些实施例的一种光网络终端的结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100的与光模块200相关的结构。如图2所示，光网络终端100中还包括设置于壳体内的PCB电路板105，设置在PCB电路板105的表面的笼子106，以及设置在笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而光模块200与光纤101建立双向的电信号连接。
图3为根据一些实施例的一种光模块的结构图。图4为根据一些实施例的光模块分解 结构图。如图3和4所示，光模块200包括壳体(shell)，设置于壳体内的电路板300及光收发组件400。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口的上述壳体；壳体的外轮廓一般呈现方形体。
在本公开的一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，盖板2011盖合在下壳体202的两个下侧板2022上，以形成上述壳体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011以及位于盖板2011两侧、与盖板2011垂直设置的两个上侧板，由两个上侧板与两个下侧板2022结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在的方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。例如，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。开口204为电口，电路板300的金手指301从电口204伸出，插入上位机(例如，光网络终端100)中；开口205为光口，被配置为接入外部光纤101，以使外部光纤101连接光模块200内部的光收发组件400。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光收发组件400等器件安装到壳体中，由上壳体201、下壳体202对这些器件形成封装保护。此外，在装配电路板300和光收发组件400等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化地实施生产。
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外部的解锁部件，解锁部件被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
在本公开的某一实施例中，解锁部件位于下壳体202的两个下侧板2022的外壁上，具有与上位机笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200插入上位机的笼子里，由解锁部件的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件时，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Fie激光芯片-Effect Transistor，MOSFET)。芯片例如包括微控制单元(Microcontroller Unit，MCU)、激光驱动芯片、限幅放大器(limiting amplifier)、时钟数据恢复(Clock and Data Recovery，CDR)芯片、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载 作用，如硬性电路板可以平稳地承载上述电子元件和芯片；当光收发组件位于电路板上时，硬性电路板也可以提供平稳地承载；硬性电路板还可以插入上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指301，金手指301由相互独立的多个引脚组成。电路板300插入笼子106中，由金手指301与笼子106内的电连接器导通连接。金手指301可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指301被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。
当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。例如，硬性电路板与光收发组件之间可以采用柔性电路板连接。
光收发组件400包括光发射器件及光接收器件，光发射器件被配置为实现光信号的发射，光接收器件被配置为实现光信号的接收。在本公开的某一实施例中，光发射器件及光接收器件结合在一起，形成一体地光收发组件。
图5为根据一些实施例的光收发组件的结构示意图。图6为根据一些实施例的光收发组件的分解图。如图5-6可知，本公开实施例中，光收发组件400包括圆方管体401、光发射器件402、光接收器件403、光学组件404和光纤适配器405。
在本公开的某一些实施例中，圆方管体401，上设置有第一管口、第二管口和第三管口，被配置为承载固定光发射器件402、光接收器件403、光学组件404和光纤适配器405。在本公开的某一些实施例中，光发射器件402镶嵌于第一管口，光接收器件403镶嵌于第二管口，光学组件404设置于圆方管体401的内腔，光纤适配器405镶嵌于第三管口。
通常，第一管口和第二管口分别设置在圆方管体401上相邻的侧壁上，第一管口和第三管口分别设置在圆方管体401长度方向的侧壁上，第二管口设置在圆方管体401宽度方向的侧壁上。
圆方管体401一般采用金属材料，利于实现电磁屏蔽以及散热。在本公开的某一些实施例中，光发射器件402通过第一管口导热接触圆方管体401，光接收器件403通过第二管口导热接触圆方管体401。光发射器件402和光接收器件403直接压配到圆方管体401中，圆方管体401分别与光发射器件402和光接收器件403直接或通过导热介质接触。如此圆方管体401可被配置为光发射器件402和光接收器件403的散热，保证光发射器件402和光接收器件403的散热效果。
光发射器件402，与电路板300通过柔性电路板连接，被配置为发射数据光。
光接收器件403，与电路板300通过柔性电路板连接，内设置有光接收芯片，被配置为接收数据光。在本公开的某一些实施例中，光接收器件403包括管座和管帽，管帽罩设于管座上，管帽与管座围城一个空腔。管座上设置有光接收芯片和第二透镜。光纤适配器405发射的数据光经光学组件404反射至光接收器件403内的第二透镜，并经第二透镜汇聚到光接收芯片。
光学组件404，设置于圆方管体401的内腔，被配置为调整光发射器件402发射的数据光以及调整入射至光接收器件403的数据光。
光纤适配器405，被配置为连接光纤。在本公开的某一些实施例中，光发射器件402 镶嵌于圆方管体的第一管口，光接收器件403镶嵌于圆方管体的第二管口，光纤适配器405镶嵌于圆方管体的第三管口，光发射器件402和光接收器件403分别与光纤适配器405建立光连接。光发射器件402发出的数据光及光接收器件403接收的光均经光纤适配器405中的同一根光纤进行传输，即光纤适配器405中的同一根光纤是光收发组件进出光的传输通道，光收发组件实现单纤双向的光传输模式。
图7为根据一些实施例的光发射器件的结构图。图8为根据一些实施例的除管帽外的光发射器件的结构图。图9为根据一些实施例的光发射器件的分解结构图。图10为根据一些实施例的光发射器件的第一角度截面图。图11为图10的部分放大图。图12为根据一些实施例的光发射器件的第二角度截面图。图13为根据一些实施例的光发射器件的第三角度截面图。图14为根据一些实施例的管帽的第一角度结构图。图15为根据一些实施例的管帽的第二角度结构图。如图7-15可知，在一些实施例中，光发射器件402包括管座4021和管帽4022，管帽4022罩设于管座4021上，管帽4022与管座4021围城一个空腔。管帽4022与管座4021围城的空腔内设置有第一基板4025。第一基板4025上设置有激光芯片4026。激光芯片4026的正极管脚与电路板300上的激光驱动芯片连接，激光芯片4026的负极管脚与电路板300上的激光驱动芯片连接。激光芯片4026在激光驱动芯片提供的驱动电流和调制电流的作用下生成数据光和监控光。管帽4022上设置有一通孔40221，该通孔40221上粘接有第一透镜4024。第一透镜4024为准直透镜。激光芯片4026发射的数据光经管帽4022上的第一透镜4024准直后射入圆方管体401内，并经过圆方管体401内的光学组件404汇聚后耦合至光纤适配器405中。
如图7-15可知，在一些实施例中，管帽4022与管座4021围城的空腔内还设置有光探测器4027。光探测器4027位于激光芯片4026的背面。光探测器4027被配置为接收激光芯片4026发射的监控光以产生监控电流。光探测器4027的正、负极管脚与其他器件的连接关系为：光探测器4027的正极管脚接地，光探测器4027的负极管脚与MCU直接连接；或者，光探测器4027的正极管脚与MCU直接连接，光探测器4027的负极管脚与激光芯片的正极管脚打线连接。
图16为根据一些实施例的管壳的第一角度结构图。图17为根据一些实施例的管壳的第二角度结构图。如图7-17可知，在一些实施例中，光发射器件402包括管脚4023。管脚4023的第一端与电路板300通过柔性电路板连接，管脚4023的第二端伸入管座4021，延伸至管座4021与管帽4022围城的空腔内与管座4021上的各个器件连接；或者，管脚4023的第二端伸入管座4021，但未延伸至管座4021与管帽4022围城的空腔内。管脚4023包括第一管脚40231、第二管脚40232、第三管脚40233和第四管脚40234。第一管脚40231，第一端与电路板300上的激光驱动芯片通过柔性电路板连接，第二端与激光芯片4026的正极管脚通过信号线连接。第二管脚40232，第一端与电路板300上的激光驱动芯片通过柔性电路板连接，第二端与激光芯片4026的负极管脚通过信号线连接。第三管脚40233，第一端与电路板300上的MCU通过柔性电路板连接，第二端与光探测器4027的一个管脚打线连接。第四管脚40234，第一端接地，第二端与管座4021连接。
由于管座4021为地，光探测器4027直接放置于管座4021上时，光探测器4027的负 极管脚接地。而对于这种类型的光探测器4027，其负极管脚不能接地，只能是接激光芯片的正极管脚或者通过第三管脚40233接MCU。因此，在管座4021上设置有放置光探测器4027的第一基板。该第一基板上设置有焊盘区域，光探测器4027的负极管脚与该焊盘区域连接。由于该光探测器4027只能接激光芯片的正极管脚或者通过第三管脚40233接MCU，那么该焊盘区域除了与光探测器4027的负极管脚连接外，还与激光芯片的正极管脚打线连接，或者与第三管脚40233打线连接。当该焊盘区域与激光芯片的正极管脚打线连接时，光探测器4027的正极管脚与MCU通过第三管脚40233打线连接。当该焊盘区域与第三管脚40233打线连接时，光探测器4027的正极管脚与管座4021打线连接。
传统光模块中，管帽直接罩设于管座的顶面。由于管座与管帽通过电阻焊连接，管帽拆下后管座表面会有残留物，使得管座表面凹凸不平。当再次将管座与管帽通过电阻焊连接在一起时，管帽与管座之间可能存在缝隙，使得光发射器件存在漏气或者光路偏移的问题。为了解决这个问题，如图7-17可知，在一些实施例中，管座4021包括管座本体40211和凸起40212，管座本体40211的顶面设置有第一基板4025，管座本体40211的侧面与凸起40212的内侧面相接触，管座本体40211的底面与第四管脚40234连接，第一管脚40231、第二管脚40232和第三管脚40233均由管座本体40211的底面向管座本体40211的顶面延伸，并延伸出管座本体40211的顶面，管帽4022与凸起40212的顶面相接触，凸起40212的顶面高于管座本体40211的顶面。由于凸起40212的顶面高于管座本体40211的顶面，管帽4022仅与凸起40212的顶面相接触，不与管座本体40211的顶面相接触，则管帽4022拆下后仅凸起40212的顶面有残留物，管座本体40211的顶面没有残留物。由于第一基板4025的顶面高度高于凸起40212的顶面高度，当再次将管帽4022与凸起40212通过电阻焊连接前，先将管座本体40211顶面的第一基板4025掰除，然后对凸起40212的顶面进行打磨。再次将管帽4022与凸起40212通过电阻焊连接前，对凸起40212的顶面进行打磨，提高凸起40212的顶面的平整度，避免凸起40212的顶面与管帽4022之间存在缝隙，进而避免光发射器件402出现漏气或者光路偏移问题。
其中，管座本体40211的顶面指的是管座本体40211中靠近管帽4022的一面，管座本体40211的底面指的是管座本体40211中远离管帽4022的一面，凸起40212的顶面指的是凸起40212中靠近管帽4022的一面。
当管脚4023突出管座4021的高度低于凸起40212的顶面与管座本体40211的顶面的高度差时，对凸起40212的顶面进行打磨容易打磨到管脚4023，使得凸起40212的顶面的平整度较低。为了提高凸起40212的顶面的平整度，在一些实施例中，凸起40212的顶面与管座本体40211的顶面的高度差大于管脚4023突出管座4021的高度。其中，管脚4023突出管座4021的高度，指的是管脚4023突出管座4021的部分与管座本体40211的高度差。
凸起40212的顶面与管座本体40211的顶面的高度差大于管脚4023突出管座4021的高度，在打磨凸起40212的顶面时，可以避免打磨到管脚4023，提高凸起40212的顶面的平整度较高，避免凸起40212的顶面与管帽4022之间存在缝隙，进而避免光发射器件402出现漏气或者光路偏移问题。
管座本体40211与凸起40212可以是两个独立的结构件，也可以是一体成型结构件。 当管座本体40211与凸起40212为两个独立的结构件时，管座本体40211的侧面与凸起40212的部分内侧面相接触。当管座本体40211与凸起40212为一体成型结构件时，凸起40212由管座本体40211的边缘朝向管帽4022延伸得到。
由于管座本体40211的俯视图的形状为圆形，那么与管座本体40211相接触的凸起40212的俯视图的形状为环形。
图18为根据一些实施例的第一基板、激光芯片和管脚的第一角度结构图。图19为根据一些实施例的第一基板、激光芯片和管脚的第二角度结构图。图20为根据一些实施例的第一基板与激光芯片的第一角度结构图。图21为根据一些实施例的第一基板与激光芯片的第二角度结构图。图22为根据一些实施例的第一基板的第一角度结构图。图23为根据一些实施例的第一基板的第二角度结构图。如图8-13和18-23可知，在一些实施例中，第一基板4025位于管座本体40211的顶面，第一基板4025上设置有激光芯片4026，且第一基板4025为陶瓷基板。
传统光模块中，激光芯片位于金属凸台上。由于金属凸台与突出管座的管脚之间相互作用产生电容效应，使得与管脚连接的高频信号线阻抗不匹配，进而影响高频信号线的带宽。
在一些实施例中，管座本体40211的顶面上仅设置有固定激光芯片的第一基板4025，并没有设置金属凸台，且该第一基板4025为陶瓷基板。由于光发射器件内没有固定激光芯片的金属凸台，仅有固定激光芯片的第一基板4025，且第一基板4025为陶瓷基板，避免了金属凸台与管脚4023相互作用产生的电容效应，减少因电容效应造成的与管脚连接的高频信号线阻抗不匹配的情况，进而减少因高频信号线阻抗不匹配造成的信号反射现象，提高高频信号线的带宽。
如图18-23可知，在一些实施例中，第一基板4025朝向光探测器4027的一端设置有第一信号传输区域40251、第二信号传输区域40252、第一缺口区域40253、第二缺口区域40254和第三缺口区域40255。
在本公开的某一些实施例中，第一信号传输区域40251由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的底面。由于第一基板4025为陶瓷基板，表面上可铺设高频信号线形成电路图案，则第一基板4025上的第一信号传输区域40251内铺设有第一高频信号线，形成第一信号线传输层。
第一信号线传输层，第一端与第一管脚40231焊接，第二端与激光芯片4026的正极管脚打线连接，被配置为传输第一高频信号。
第二信号传输区域40252由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的底面。由于第一基板4025为陶瓷基板，表面上可铺设高频信号线形成电路图案，则第一基板4025上的第二信号传输区域40252内铺设有第二高频信号线，形成第二信号线传输层。其中，第一基板4025朝向光探测器4027的面为第一基板4025的第一侧面。
第二信号线传输层，第一端与第二管脚40232焊接，第二端与激光芯片4026的负极管脚打线连接，被配置为传输第二高频信号。
激光芯片4026的负极管脚与第二信号线传输层表面连接，激光芯片4026的正极管脚 与第一信号线传输层表面打线连接。
激光芯片4026在第一高频信号和第二高频信号的作用下生成数据光。其中，第一高频信号为第一驱动电流和第一调制电流，第二高频信号为第二驱动电流和第二调制电流，第一驱动电流和第二驱动电流反相，第一调制电流和第二调制电流反相。
第一缺口区域40253由第一基板4025朝向光探测器4027的一面和第一基板4025底面均向内凹陷形成。第一缺口区域40253内设置有第一管脚40231。由于第一信号线传输层由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的底面，那么第一信号线传输层由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的第一缺口区域40253的顶面。由于第一信号线传输层由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的第一缺口区域40253的顶面，那么第一管脚40231的第一端与位于第一缺口区域40253顶面的第一信号线传输层连接，第一管脚40231的第二端通过柔性电路板与激光驱动芯片连接。
第二缺口区域40254由第一基板4025朝向光探测器4027的一面和第一基板4025底面均向内凹陷形成。第二缺口区域40254内设置有第二管脚40232。由于第一信号线传输层由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的底面，那么第一信号线传输层由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的第二缺口区域40254的顶面。由于第二信号线传输层由第一基板4025朝向光探测器4027的面向下延伸至第一基板4025的第二缺口区域40254的顶面，那么第二管脚40232的第一端与位于第二缺口区域40254顶面的第二信号线传输层连接，第二管脚40232的第二端通过柔性电路板与激光驱动芯片连接。
由于第一缺口区域40253内放置第一管脚40231，第二缺口区域40254内放置第二管脚40232，在将第一基板4025放置于管座4021的顶面时，只需根据第一管脚40231和第二管脚40232的位置即可确定第一基板4025在管座4021顶面的放置位置。即第一缺口区域40253内放置第一管脚40231，第二缺口区域40254内放置第二管脚40232，方便确定第一基板4025在管座4021上的放置位置，从而保证管帽4022的同心度满足生产要求(管帽的同心度满足生产要求指的是第一基板上的激光芯片发出的光的光轴与管帽上的第一透镜的中心轴线之间有部分偏差，但偏差在预设偏差之内)，进而提高耦合效率。
由于第一管脚40231与位于第一缺口区域40253内的第一信号线传输层连接，增加了第一管脚与第一信号线传输层的接触面积，进而提高高频信号的传输速率。对应的，第二管脚与位于第二缺口区域内的第二信号线传输层连接，增加了第二管脚与第二信号线传输层的接触面积，进而提高高频信号的传输速率。其中，第一管脚40231与位于第一缺口区域40253顶面的第一信号线传输层通过焊料焊接，第二管脚40232与位于第二缺口区域40254顶面的第二信号线传输层通过焊料焊接。
由于第一管脚40231与位于第一缺口区域40253顶面的第一信号线传输层通过焊料焊接，第二管脚40232与位于第二缺口区域40254顶面的第二信号线传输层通过焊料焊接，且焊料材质不同焊料对应的介电常数不同，可以通过更改第一缺口区域40253顶面的形状来以适应位于第一缺口区域40253顶面与第一管脚40231之间的焊料，使得该焊料的阻抗 更接近与第一信号线传输层或第一管脚的阻抗；也可以通过更改第二缺口区域40254顶面的形状来以适应位于第二缺口区域40254顶面与第二管脚40232之间的焊料，使得该焊料的阻抗更接近与第二信号线传输层或第二管脚的阻抗。因此，第一缺口区域40253内放置第一管脚40231，第二缺口区域40254内放置第二管脚40232，还可以通过控制第一缺口区域40253和第二缺口区域40254的形状实现第一管脚与第一信号线传输层的阻抗匹配，和，第二管脚与第二信号线传输层的阻抗匹配。
第三缺口区域40255由第一基板4025朝向光探测器4027的一面和第一基板4025底面均向内凹陷形成。第三缺口区域40255位于第一缺口区域40253和第二缺口区域40254之间，光探测器4027位于第三缺口区域40255与管座本体40211的顶面围城的空腔内。
激光芯片4026位于第一基板4025的第一侧面，且激光芯片4026与第一基板4025的第一侧面之间的距离较近，当光探测器4027不位于该空腔内(即没有设置第三缺口区域)时，部分监控光会经第一基板4025的第一侧面反射，使得接收的监控光有限，可能会造成监控准确性较低。为了提高监控准确性，在一些实施例中，将光探测器4027放置于第三缺口区域40255与管座本体40211的顶面围城的空腔内。光探测器4027位于该空腔内，可以接收较多的监控光，提高监控准确性。
第三缺口区域40255的顶面与激光芯片4026之间的距离为200μm-400μm。第三缺口区域40255的顶面与激光芯片4026之间的距离，指的是第三缺口区域40255的顶面与激光芯片的底面之间的距离。其中，激光芯片的底面指的是激光芯片中靠近第三缺口区域的一面，不是与第一基板的第一侧面连接的一面，也不是与第一基板的第一侧面远离的一面。
本公开提供了一种光模块，包括光发射器件。光发射器件包括管座和管脚。管座上设置有第一基板。管脚包括伸入并延伸出管座的第一管脚和第二管脚。第一基板上设置有第一缺口区域、第二缺口区域、第一信号传输区域和第二信号传输区域。第一缺口区域和第二缺口区域均由第一基板的第一侧面和第一基板的底面均向内凹陷形成。第一缺口区域内设置有第一管脚。第二缺口区域内设置有第二管脚。第一缺口区域内放置第一管脚，第二缺口区域内放置第二管脚，便于确定第一基板在管座上的放置位置，进而提高耦合效率。第一信号传输区域由第一基板的第一侧面向下延伸至第一缺口区域的顶面。第一信号传输区域的表面铺设第一高频信号线，以形成第一信号线传输层。第二信号传输区域由第一基板的第一侧面向下延伸至第二缺口区域的顶面。第二信号传输区域的表面铺设第二高频信号线，以形成第二信号线传输层。第一管脚与位于第一缺口区域内的第一信号线传输层连接。第二管脚与位于第二缺口区域内的第二信号线传输层连接。第一管脚与位于第一缺口区域内的第一信号线传输层连接，增加了第一管脚与第一信号线传输层的接触面积，进而提高高频信号的传输速率。对应的，第二管脚与位于第二缺口区域内的第二信号线传输层连接，增加了第二管脚与第二信号线传输层的接触面积，进而提高高频信号的传输速率。第二信号线传输层表面设置有激光芯片。激光芯片，负极管脚与第二信号线传输层表面连接，正极管脚与第一信号线传输层表面打线连接。本公开中，光发射器件内没有固定激光芯片的金属凸台，仅有固定激光芯片的第一基板，第一基板为陶瓷基板，避免了金属凸台 与管脚相互作用产生的电容效应，减少了因电容效应造成的与管脚连接的高频信号线阻抗不匹配的情况，进而减少因高频信号线阻抗不匹配造成的信号反射现象，提高高频信号线的带宽。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (10)

  1. 一种光模块，包括：
    光发射器件，包括管座和管脚；
    所述管座，上设置有第一基板；
    所述管脚，包括伸入并延伸出所述管座的第一管脚和第二管脚；
    所述第一基板，为陶瓷基板，上设置有第一缺口区域、第二缺口区域、第一信号传输区域和第二信号传输区域；
    所述第一缺口区域，由所述第一基板的第一侧面和所述第一基板的底面均向内凹陷形成，内设置有所述第一管脚；
    所述第二缺口区域，由所述第一基板的第一侧面和所述第一基板的底面均向内凹陷形成，内设置有所述第二管脚；
    所述第一信号传输区域，由所述第一基板的第一侧面向下延伸至所述第一缺口区域的顶面，表面铺设第一高频信号线，以形成第一信号线传输层；
    所述第二信号传输区域，与所述第一信号传输区域不连接，由所述第一基板的第一侧面向下延伸至所述第二缺口区域的顶面，表面铺设第二高频信号线，以形成第二信号线传输层；
    所述第一管脚，与位于所述第一缺口区域内的第一信号线传输层连接；
    所述第二管脚，与位于所述第二缺口区域内的第二信号线传输层连接；
    所述第二信号线传输层，表面设置有激光芯片；
    所述激光芯片，负极管脚与所述第二信号线传输层表面连接，正极管脚与所述第一信号线传输层表面打线连接。
  2. 根据权利要求1所述的光模块，其中，所述管座包括：
    管座本体，顶面设置有第一基板；
    凸起，内侧面与所述管座本体的侧面相接触，所述顶面与管帽相接触，顶面与所述管座本体的顶面的高度差大于所述管脚突出所述管座本体顶面的高度。
  3. 根据权利要求2所述的光模块，其中，所述凸起由所述管座本体的边缘朝向所述管帽延伸得到。
  4. 根据权利要求1所述的光模块，其中，所述第一基板还设置有第三缺口区域；
    所述第三缺口区域，位于所述第一缺口区域和所述第二缺口区域之间，与所述管座本体的顶面围成一个空腔；
    所述空腔内设置有光探测器。
  5. 根据权利要求4所述的光模块，其中，所述第三缺口区域的顶面与所述激光芯片之间的距离为200μm-400μm。
  6. 根据权利要求4所述的光模块，其中，还包括第二基板；
    所述第二基板，底面固定于所述管座本体的顶面，顶面上设置有焊盘区域；
    所述焊盘区域，与所述激光芯片的正极管脚打线连接；
    所述光探测器，位于第二基板的顶面，负极管脚也与所述焊盘区域连接，正极管脚与所述管脚的第三管脚连接。
  7. 根据权利要求4所述的光模块，其中，还包括第二基板；
    所述第二基板，底面固定于所述管座本体的顶面，顶面上设置有焊盘区域；
    所述焊盘区域，与所述管脚的第三管脚打线连接；
    所述光探测器，位于第二基板的顶面，负极管脚与所述焊盘区域连接，正极管脚与管座连接。
  8. 根据权利要求1所述的光模块，其中，所述管脚还包括第四管脚；
    所述第四管脚，第一端接地，第二端与所述管座连接。
  9. 根据权利要求2所述的光模块，其中，所述凸起的俯视图的形状为环形。
  10. 根据权利要求1所述的光模块，其中，还包括：
    圆方管体，设置有第一管口和第二管口，所述光发射器镶嵌于所述第一管口；
    光接收器件，镶嵌于所述第二管口；
    光学组件，设置于所述圆方管体的内腔，被配置为调整光发射器件发射的数据光以及调整入射至光接收器件的数据光。
PCT/CN2022/139701 2022-06-23 2022-12-16 光模块 Ceased WO2023246019A1 (zh)

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