WO2023236987A1 - Mold processing method, and workpiece polishing method and system - Google Patents

Abstract

A mold processing method, and a workpiece polishing method and system. The mold processing method comprises: acquiring first surface information of a first mold, wherein the first mold is manufactured on the basis of initial processing information; obtaining compensation information on the basis of the first surface information and target surface information; generating target processing information on the basis of the initial processing information and the compensation information; and preparing a standard mold on the basis of the target processing information, wherein the standard mold comprises a mold body and a covering layer. The mold processing method can improve the precision and consistency of mold processing. The workpiece polishing method comprises: determining at least a first polishing region and a second polishing region of a workpiece; polishing the first polishing region by using a first polishing mold; and polishing the second polishing region by using a second polishing mold, wherein the radius of curvature of the polishing surface of the first polishing mold is different from that of the polishing surface of the second polishing mold. The workpiece polishing method can realize standardized batch polishing.

Description

Mold processing method and workpiece polishing method and system

Cross-references to related applications

This application claims priority from the Chinese patent application with application number 202210650123.4 submitted on June 10, 2022, the entire content of which is incorporated herein by reference.

Technical field

The present application relates to the technical field of grinding and polishing processes, and in particular to a mold processing method, a workpiece polishing method and a system thereof.

Background technique

Polishing mold is an important tool in the crystal polishing process. Affected by factors such as polishing skin wear, the service life of the polishing mold is short. After polishing 20 to 30 crystals, a new polishing mold needs to be replaced.

The general processing method of polishing molds requires turning the original mold with processing equipment (such as lathes, engraving machines, etc.), and then laminating and polishing the original mold to obtain the polishing mold.

On the one hand, because the processing equipment will produce systematic errors after maintenance or maintenance, the original mold turned cannot meet the accuracy requirements of the polished crystal. Therefore, a time-consuming original mold correction process is required during polishing mold processing. The original mold correction process generally includes: making a coupling mold with diamond pellets coupled to the original mold; correcting the coupling mold based on a qualified polishing mold to make a correction mold; using the correction mold to correct the original mold; using the correction Make a polishing mold from the original mold, perform crystal polishing, and test the polishing accuracy. There is no correction standard for the above correction process, and it usually requires repeated correction and debugging until the polishing accuracy of the crystal meets the requirements.

On the other hand, since the original mold coating process generally uses manual methods to compact the polished skin onto the heated original mold, affected by temperature control, pressure uniformity and other factors, the thickness of the polished skin in different areas of the polishing mold may vary. average situation.

The above problems make the processing of polishing molds have problems such as poor consistency of finished products, poor processing accuracy, and low standardization of processing technology, which in turn limits the accuracy and efficiency of crystal polishing. Therefore, there is a need to provide a mold processing method and a workpiece polishing method and a system that can improve processing accuracy and consistency.

Contents of the invention

One or more embodiments of this specification provide a mold processing method. The method includes: obtaining first surface information of a first mold, which is produced based on initial processing information; obtaining compensation information based on the first surface information and target surface information; and obtaining compensation information based on the initial processing information and the target surface information. The compensation information generates target processing information; a standard mold is prepared based on the target processing information, and the standard mold includes a mold body and a covering layer.

In some embodiments, preparing a standard mold based on the target processing information includes: turning an initial mold based on the target processing information to prepare the mold body; attaching the covering layer to the mold body Above; the covering layer is turned based on the target processing information to obtain the standard mold.

In some embodiments, attaching the covering layer to the mold body includes: heating the mold body; compacting the covering layer with the heated mold body to cause the covering layer to adhere on the mold body.

In some embodiments, the mold body is heated by a heating coil, and the mold body to be heated is placed in the heating coil.

In some embodiments, the heating temperature of the heating coil is 160°C to 200°C.

In some embodiments, the covering layer and the heated mold body are compacted by a pressurized platen tool, and the curvature of the pressure surface of the platen tool matches the curvature of the pressure-bearing surface of the mold body.

In some embodiments, the pressure range of the pressure plate tooling is 0.1Mpa～0.8Mpa.

In some embodiments, the compensation information includes body compensation information and edge extension information; and obtaining the compensation information based on the first surface information and the target surface information includes: based on the first surface information and the target surface information. By comparison, body compensation information corresponding to the first mold body is obtained; based on the data trend of the first surface information, edge extension information corresponding to the edge of the first mold is obtained.

In some embodiments, generating target processing information based on the initial processing information and the compensation information includes: generating processing information to be verified based on the initial processing information and the compensation information; obtaining the second surface of the second mold Information, the second mold is made based on the processing information to be verified; based on the second surface information and the target surface information, it is determined whether the surface error of the second mold is within the preset value range; if so, Then it is determined that the processing information to be verified is the target processing information.

One or more embodiments of this specification provide a mold processing system. The system includes: a surface information acquisition module configured to acquire first surface information of a first mold based on initial processing information; a compensation information acquisition module configured to acquire first surface information based on the first mold and target surface information to obtain compensation information; a processing information generation module configured to generate target processing information based on the initial processing information and the compensation information; and a processing module configured to prepare a standard mold based on the target processing information, so The standard mold includes the mold body and the covering layer.

One or more embodiments of this specification provide a workpiece polishing method. The workpiece polishing method includes: determining at least a first polishing area and a second polishing area of the workpiece; using a first polishing mold to polish the first polishing area; and using a second polishing die to polish the second polishing area. Polishing; wherein the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii.

In some embodiments, the curvature of the surface to be polished in the first polishing area matches the curvature of the polishing surface of the first polishing mold; the curvature of the surface to be polished in the second polishing area matches the curvature of the polishing surface in the second polishing mold. Surface curvature fit.

In some embodiments, the first polishing mold has first polishing parameters, the first polishing parameters include at least a first swing parameter and a first pressure parameter; the second polishing mold has second polishing parameters, so The second polishing parameter includes at least a second swing parameter and a second pressure parameter; the first polishing parameter is different from the second polishing parameter.

In some embodiments, the first polishing mold and/or the second polishing mold is a standard mold, and the standard mold includes a mold body and a covering layer.

In some embodiments, the preparation of the standard mold includes: obtaining first surface information of a first mold, which is produced based on initial processing information; and obtaining compensation information based on the first surface information and target surface information. ; Generate target processing information based on the initial processing information and the compensation information; prepare a standard mold based on the target processing information, the standard mold including a mold body and a covering layer.

In some embodiments, preparing a standard mold based on the target processing information includes: turning an initial mold based on the target processing information to prepare the mold body; attaching the covering layer to the mold body Above; the covering layer is turned based on the target processing information to obtain the standard mold.

In some embodiments, determining at least the first polishing area and the second polishing area of the workpiece includes: determining the shape characteristics of the polishing area of the workpiece; pre-polishing the polishing area of the test workpiece based on the shape characteristics, so The test workpiece is selected from the workpiece; at least a first polishing area and a second polishing area of the workpiece are determined based on a pre-polishing result.

In some embodiments, the pre-polishing results include parameter information after pre-polishing of the polished area of the test workpiece; the parameter information includes polishing removal rate; the parameter information is obtained by comparing the polished area of the test workpiece. Determine the shape characteristics before and after pre-polishing.

In some embodiments, pre-polishing the polished area of the test workpiece based on the shape characteristics includes: pre-polishing the polished area of the test workpiece based on an overall polishing strategy to prepare the first test workpiece; obtaining the The first parameter information of the first test workpiece.

In some embodiments, determining at least the first polishing area and the second polishing area of the workpiece based on the pre-polishing result includes: determining at least the first polishing area of the workpiece based on the first parameter information and a preset threshold condition. polished area and a second polished area.

In some embodiments, pre-polishing the polished area of the test workpiece based on the shape characteristics further includes:

Based on the first parameter information and preset threshold conditions, a first partition polishing strategy is generated; based on the first partition polishing strategy, the polishing area of the test workpiece is pre-polished to obtain a second test workpiece; the second test workpiece is obtained test artifact Second parameter information.

In some embodiments, determining at least the first polishing area and the second polishing area of the workpiece based on the pre-polishing result includes: determining whether the second parameter information meets a preset threshold condition; if so, based on the first partition The polishing strategy determines at least a first polishing area and a second polishing area of the workpiece.

In some embodiments, the pre-polishing of the test workpiece is performed by using a pre-polishing tool, and the polishing surface shape characteristics of the pre-polishing tool are determined based on the shape characteristics of the polishing area of the workpiece and the corresponding polishing strategy.

One or more embodiments of this specification provide a workpiece polishing system. The system includes: a polishing area determination module configured to determine at least a first polishing area and a second polishing area of the workpiece; and a polishing module configured to use a first polishing mold to polish the first polishing area. A polishing area is polished, and is further configured to use a second polishing mold to polish the second polishing area; wherein the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii.

Description of the drawings

This specification is further explained by way of example embodiments, which are described in detail by means of the accompanying drawings. These embodiments are not limiting. In these embodiments, the same numbers represent the same structures, where:

Figure 1 is a schematic diagram of exemplary hardware and/or software of a mold processing system according to some embodiments of this specification;

Figure 2 is a schematic diagram of exemplary hardware and/or software of a workpiece polishing system according to some embodiments of the present specification;

Figure 3 is an exemplary flow diagram of a mold processing method according to some embodiments of this specification;

Figure 4 is an exemplary flow diagram of a compensation information acquisition process according to some embodiments of this specification;

Figure 5 is an exemplary flow diagram of a target processing information generation process according to some embodiments of this specification;

Figure 6 is an exemplary flow diagram of a standard mold preparation process according to some embodiments of this specification;

Figure 7 is an exemplary structural schematic diagram of a platen tooling pressing coating mold according to some embodiments of this specification;

Figure 8 is an exemplary flow diagram of a workpiece polishing method according to some embodiments of this specification;

Figure 9 is an exemplary structural schematic diagram of the polishing process of the first polishing area according to some embodiments of this specification;

Figure 10 is an exemplary structural schematic diagram of the polishing process of the second polishing area according to some embodiments of this specification;

Reference signs: 10-standard mold; 10'-initial mold; 10"-cladding mold; 11-mold body; 12-covering layer; 20-workpiece; 21-first polishing area; 22-second polishing area; 30-pressure plate tooling; 40-driving device; 41-driving rod; 10a-first polishing mold; 10b-second polishing mold; 13a, 13b-polishing surface.

Detailed ways

In order to explain the technical solutions of the embodiments of this specification more clearly, the accompanying drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some examples or embodiments of this specification. For those of ordinary skill in the art, without exerting any creative efforts, this specification can also be applied to other applications based on these drawings. Other similar scenarios. Unless obvious from the locale or otherwise stated, the same reference numbers in the figures represent the same structure or operation.

It will be understood that "system", "apparatus", "unit" and/or "module" as used herein are a means of distinguishing between different components, elements, parts, portions or assemblies at different levels. However, said words may be replaced by other expressions if they serve the same purpose.

As shown in this specification and claims, words such as "a", "an", "an" and/or "the" do not specifically refer to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "include" and "include" only imply the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements.

Flowcharts are used in this specification to illustrate operations performed by systems according to embodiments of this specification. It should be understood that preceding or following operations are not necessarily performed in exact order. Instead, it can be processed in reverse order or simultaneously various steps. At the same time, you can add other operations to these processes, or remove a step or steps from these processes.

Figure 1 is a schematic diagram of exemplary hardware and/or software of a mold processing system in accordance with some embodiments.

As shown in Figure 1, the mold processing system 100 may include a control module 110, a surface information acquisition module 120, a compensation information acquisition module 130, a processing information generation module 140, a processing module 150, a storage module 160, a communication module 170 and an input/output module. 180.

The control module 110 may be associated with other modules for processing information and data related to the mold processing system 100 . In some embodiments, the control module 110 can control the operating status of other modules (eg, surface information acquisition module 120, compensation information acquisition module 130, processing information generation module 140, processing module 150, etc.). In some embodiments, the control module 110 may manage the data acquisition or sending process in the communication module 170 .

The surface information acquisition module 120 may be used to acquire surface information of the mold. In some embodiments, the surface information acquisition module 120 may detect the first surface information of the first mold and send the surface information of the first mold to the control module 110 and/or the compensation information acquisition module 130 . In some embodiments, the surface information acquisition module 120 may detect the second surface information of the second mold, and send the surface information of the second mold to the control module 110 and/or the processing information generation module 140. In some embodiments, the surface information acquisition module 120 may send the first surface information and/or the second surface information to the storage module 160 for storage, ready for call by other modules. In some embodiments, the surface information acquisition module 120 includes a device for performing profile detection to obtain surface information, such as a contact profilometer or a non-contact profilometer.

The compensation information acquisition module 130 may be used to acquire compensation information that can reflect mold processing errors. In some embodiments, the compensation information acquisition module 130 may call the first surface information obtained by the surface information acquisition module 120 and the target surface information stored by the storage module 160 to obtain compensation information based on the first surface information and the target surface information. In some embodiments, the compensation information obtaining module 130 may send the obtained compensation information to the control module 110 . In some embodiments, the compensation information acquisition module 130 may send the obtained compensation information to the storage module 160 for storage, ready for invocation by the control module 110 and/or the processing information generation module 140 .

The processing information generation module 140 may be used to generate target processing information capable of correcting mold processing errors. In some embodiments, the processing information generation module 140 can call the compensation information obtained by the compensation information acquisition module 130 and the initial processing information stored by the storage module 160, and generate processing information to be verified based on the compensation information and the initial processing information. In some embodiments, the processing information generation module 140 can call the second surface information obtained by the surface information acquisition module 120 and the target surface information stored by the storage module 160. The second surface information is based on the second mold prepared based on the processing information to be verified. Surface information, based on the second surface information and the target surface information, determine whether the second mold meets the error limit requirements, and if so, determine the processing information to be verified as the target processing information. In some embodiments, the compensation information acquisition module 130 may send the generated target processing information to the control module 110 . In some embodiments, the compensation information acquisition module 130 may send the generated target processing information to the storage module 160 for storage, ready for invocation by the control module 110 and/or the processing module 150 .

The processing module 150 can be used for processing finished or semi-finished molds. In some embodiments, the processing module 150 may prepare a standard mold based on the target processing information generated by the processing information generation module 140 under the control of the control module 110 . In some embodiments, the machining module 150 includes a turning sub-module, a heating sub-module, and a press-fit sub-module.

The turning submodule can be used to turn molds. In some embodiments, according to the pending processing information sent by the processing information generation module 140, the control module 110 can control the turning sub-module to turn the raw material to produce the second mold. In some embodiments, according to the target processing information sent by the processing information generation module 140, the control module 110 can control the turning sub-module to turn the initial mold 10' into the mold body 11 of the standard mold 10. In some embodiments, the turning sub-module includes equipment for turning, such as lathes, engraving machines, etc.

The heating submodule can be used to heat the mold. In some embodiments, according to the heating parameters pre-stored in the storage module 160, the control module 110 can control the heating sub-module to heat the mold body 11 turned by the turning sub-module to a preset temperature. In some embodiments, the heating sub-module includes equipment for heating, such as high-frequency induction coils.

The press fitting sub-module can be used to press fit the mold. In some embodiments, according to the pressure parameters pre-stored in the storage module 160, the control module 110 can control the pressing sub-module to compact the mold body 11 and the covering layer 12 to produce the covering layer. layer mold. In some embodiments, the press-fitting sub-module includes equipment for press-fitting, such as a pressure plate tooling, etc.

The storage module 160 can be used to store instructions and/or data of each module of the mold processing system 100 (eg, the control module 110, the surface information acquisition module 120). For example, the storage module 160 may store initial processing information of the processing module 150 . For another example, the storage module 160 may store the first surface information of the first mold and the second surface information of the second mold detected by the surface information acquisition module 120 . For another example, the storage module 160 can store user input information received by the communication module 170, such as heating parameters of the heating submodule input by the user or error preset values for second mold surface error judgment, etc. In some embodiments, the storage module 160 may include mass storage, removable storage, volatile read-write memory, read-only memory (ROM), etc., or any combination thereof.

The communication module 170 may be used for the exchange of information or data. In some embodiments, the communication module 170 can be used for communication between internal components of the mold processing system 100, such as the control module 110, the surface information acquisition module 120, the compensation information acquisition module 130, the processing information generation module 140, the processing module 150 , storage module 160, communication module 170 and/or input/output module 180.

Input/output module 180 can acquire, transmit, and send signals. The input/output module 180 may connect or communicate with other components in the mold processing system 100 . Other components in the mold processing system 100 may be connected or communicated through the input/output module 180 . In some embodiments, the input/output module 180 can be connected to a network and obtain information through the network. In some embodiments, the input/output module 180 may obtain user input information through the network or communication module 170 for input. In some embodiments, the input/output module 180 may obtain control instructions or reminders from the control module 110 through the network or communication module 170 .

It should be noted that the above description of the mold processing system 100 is only for example and explanation, and does not limit the scope of application of this specification. For those skilled in the art, various modifications and changes can be made to the mold processing system 100 under the guidance of this description. However, such modifications and changes remain within the scope of this specification. For example, the processing information generation module 140 and the processing module 150 may be one module, and the module may have the function of determining target processing information and preparing the standard mold 10 based on the target processing information. Such modifications are within the protection scope of one or more embodiments of this specification.

Figure 2 is a schematic diagram of example hardware and/or software of a workpiece polishing system in accordance with some embodiments.

As shown in FIG. 2 , the workpiece polishing system 200 may include a control module 210 , a polishing area determination module 220 , a polishing module 230 , a storage module 240 , a communication module 250 and an input/output module 260 .

The control module 210 may be associated with other modules for processing information and data related to the workpiece polishing system 200 . In some embodiments, the control module 210 may control the operating status of other modules (eg, polishing area determination module 220, polishing module 230, etc.). In some embodiments, the control module 210 may manage the data acquisition or sending process in the communication module 250.

The polishing area determination module 220 is used to determine the sub-polishing area of the workpiece. In some embodiments, the control module 210 sends the workpiece polishing area information stored in the storage module 240 to the polishing area determination module 220, and the polishing area determination module 220 determines two or more sub-polishing areas of the workpiece based on the polishing area information.

The polishing module 230 is used for polishing the workpiece. In some embodiments, according to the sub-polishing area determined by the polishing area determination module 220, the control module 210 can control the corresponding polishing mold of the polishing module 230 to polish each sub-polishing area of the workpiece according to the polishing parameters of the corresponding polishing mold. The polishing parameters can be called from the storage module 240 . In some embodiments, the polishing module 230 includes a polishing device for controlling the polishing mold to polish the workpiece, and there may be one or more polishing devices.

The storage module 240 is used to store instructions and/or data of each module of the workpiece polishing system 200 (eg, the control module 210, the polishing area determination module 220). For example, the storage module 240 may store corresponding polishing parameters of each polishing mold of the polishing module 230 . For another example, the storage module 240 can store the polishing area information of the workpiece input by the user, so that the polishing area determination module 220 can call the polishing area information to determine the sub-polishing area of the workpiece. In some embodiments, the storage module 240 may include mass storage, removable storage, volatile read-write memory, read-only memory (ROM), etc., or any combination thereof. In some embodiments, the storage module 240 and the storage module 160 may be the same module.

The communication module 250 may be used for the exchange of information or data. In some embodiments, communication module 250 may be used to Communication between internal components of the workpiece polishing system 200, for example, communication between the control module 210, the polishing area determination module 220, the polishing module 230, the storage module 240, the communication module 250 and the input/output module 260. In some embodiments, the communication module 250 and the communication module 170 may be the same module.

Input/output module 260 can acquire, transmit, and send signals. The input/output module 260 may connect or communicate with other components in the workpiece polishing system 200 . Other components in the workpiece polishing system 200 may be connected or communicated through the input/output module 260 . In some embodiments, the input/output module 260 can be connected to a network and obtain information through the network. In some embodiments, the input/output module 260 may obtain user input information through the network or communication module 250 for input. In some embodiments, the input/output module 260 can obtain control instructions or reminders from the control module 210 through the network or communication module 250. In some embodiments, input/output module 260 and input/output module 180 may be the same module.

Figure 3 is an exemplary flow diagram of a mold processing method according to some embodiments.

As shown in FIG. 3 , the mold processing process 300 may include steps 310 to 340 . In some embodiments, the mold processing process 300 may be executed by a control device (such as the control module 110).

In step 310, first surface information of the first mold produced based on the initial processing information is obtained. In some embodiments, step 310 may be performed by surface information acquisition module 120.

Initial processing information refers to information related to the processing equipment for making molds. In some embodiments, the initial processing information may be an initial processing program set by the processing equipment. In some embodiments, the initial processing information may be initial operating parameters set by the processing equipment.

The first mold refers to the mold made by the processing equipment without error correction. In some embodiments, the first mold may serve as a vehicle for representing processing errors of the processing equipment. For example, processing equipment is affected by factors such as maintenance and repairs, resulting in processing errors. The first mold is made by the processing equipment based on its initial processing information. The first mold can materialize the processing errors of the processing equipment and manifest itself as the surface of the processed surface. Deformation etc.

Surface information refers to information that reflects the three-dimensional surface topography of an object. Correspondingly, the first surface information refers to information corresponding to the three-dimensional surface topography of the first mold. In some embodiments, the first surface information may include two-dimensional data characterizing the actual surface curve of the first mold. For example, the first mold is a mold produced by rotational turning using a CNC lathe, so that the processed surface of the first mold is a surface of revolution. The first surface information includes two-dimensional data characterizing the characteristics of the surface of revolution, such as rotation axis, generatrix, longitude, latitude and other data. In some embodiments, the first surface information may include three-dimensional data characterizing the actual surface shape of the first mold.

In some embodiments, the first surface information may be obtained through contour detection. In some embodiments, the device that can perform profile detection to obtain the first surface information includes a contact profiler and a non-contact profiler. For example, the contact profiler can include an inductive profiler, a piezoelectric profiler, and an induction profiler. Non-contact profiler can include optical profiler, etc.

In some embodiments, the first surface information may be original surface information obtained by contour detection. In some embodiments, the first surface information may be obtained based on preprocessing of raw surface information. Among them, the original surface information is directly detected through contour detection. In some embodiments, the control module 110 controls the contact profiler of the surface information acquisition module 120 to perform surface profile detection on the first mold to obtain two-dimensional original surface curve data. The surface information acquisition module 120 is based on the original surface curve data. Preprocessing is performed to eliminate some errors and obtain the first surface information.

In some embodiments, the preprocessing may include filtering. In some embodiments, the filtering process may include, but is not limited to, average filtering, high-pass filtering, low-pass filtering, linear interpolation, limiting filtering, or median filtering, etc.

Taking average filtering as an example, the original surface curve data of the first mold obtained by the surface information acquisition module 120 includes a series of data points, and the data format of each data point is (X, Y). Starting from the initial data point, the X value and Y value of every 1000 data points are averaged respectively to replace the value of the current data point to obtain the first surface information.

Taking high-pass filtering as an example, the surface roughness of the first mold is lower than the first threshold (such as Ra12.5 or Ra6.3), and the surface of the first mold is relatively smooth, then the surface information acquisition module 120 obtains the first mold through contour detection. After obtaining the original surface curve data, you can use a high-pass filter (such as ideal high-pass filter, Butterworth high-pass filter, Gaussian high-pass filter device, etc.) to filter the original surface curve data.

Taking low-pass filtering as an example, the surface roughness of the first mold is higher than the first threshold (such as Ra12.5 or Ra6.3) and lower than the second threshold (such as Ra100 or Ra50). The surface of the first mold is rough, then After the surface information acquisition module 120 obtains the original surface curve data of the first mold through contour detection, it can use a high-pass filter and a low-pass filter (such as an ideal low-pass filter, a Butterworth low-pass filter, a Gaussian low-pass filter device, etc.) to filter the original surface curve data.

In some embodiments, linear interpolation may include linear interpolation, arc interpolation, parabolic interpolation, spline interpolation, etc. For example, if there are defects such as burrs or protrusions on the surface of the first mold that can be detected through machine vision or naked eye observation, the surface information acquisition module 120 performs linear interpolation on the original surface curve data corresponding to the defect location.

In some embodiments, the first mold is an uncoated mold. The mold processing methods of some embodiments of this specification can be used to process polishing molds. The surface of the polishing mold has a porous flexible covering layer (such as polishing leather) to facilitate the attachment of polishing powder. The flexible covering layer affects the accuracy of contour detection. If the first mold is a mold without a covering layer, accurate and reliable first surface information can be obtained through contour detection.

In some embodiments, the first mold is made of metal material, such as pure metal material or alloy material. The properties and processing performance of the metal material make the first mold easy to process and the surface roughness meets expectations, so as to facilitate contour detection and preprocessing of the first surface information. In some embodiments, the first mold is preferably made of brass.

In step 320, compensation information is obtained based on the first surface information and the target surface information. In some embodiments, step 320 may be performed by the compensation information acquisition module 130.

The target surface information refers to the information that reflects the three-dimensional surface topography generated by the target mold theory. Among them, the target mold is the theoretically generated mold. In some embodiments, the target surface information may include two-dimensional data reflecting a theoretical surface curve of the target mold. For example, the theoretical processing surface of the target mold is an ellipsoid, and the target surface information may include two-dimensional data characterizing the characteristics of the ellipsoid, such as center coordinates, major axis, minor axis and other data.

In some embodiments, the target surface information is generated through a mathematical prediction model based on the initial machining information. For example, the compensation information acquisition module 130 can call the initial processing information stored in the storage module 160 and use a mathematical prediction model to generate target surface information. In some embodiments, target surface information is determined based on user input. For example, the control module 110 can receive the target surface information input by the user through the input/output module 180 and store it in the storage module 160 .

Compensation information refers to information related to processing errors of processing equipment. In some embodiments, the machining error is a systematic error. For example, the maintenance or repair factors of processing equipment lead to systematic errors, so that the initial processing information determined before maintenance or repair cannot be applied to the processing equipment after maintenance or repair. The first mold and target obtained by the processing equipment based on the initial processing information The error between molds exceeds the allowable range.

In some embodiments, the compensation information is obtained by comparing the first surface information with the target surface information. For example, the theoretical processing surface of the target mold is a surface of revolution, and its theoretical bus is a parabola. The target surface information includes two-dimensional data representing the theoretical bus, and the target surface information is stored in the storage module 160 . The actual busbar of the first mold processing surface measured by the surface information acquisition module 120 is another parabola. The first surface information includes two-dimensional data characterizing the actual busbar, in which the maximum curvature radius difference between the theoretical busbar and the actual busbar is Can be greater than the preset threshold. The compensation information acquisition module 130 can call the two-dimensional data of the theoretical bus and the actual bus for comparison and calculation to obtain the compensation information.

Some embodiments of this specification obtain compensation information based on the first surface information and the target surface information. The compensation information reflects the processing error of the first mold, so that the mold processing process can be corrected based on the compensation information, thereby improving the processing accuracy.

See Figure 4 and its description for more information on compensation information acquisition.

In step 330, target processing information is generated based on the initial processing information and the compensation information. In some embodiments, step 330 may be performed by the processing information generation module 140.

In some embodiments, the target processing information is generated after one or more compensations of the initial processing information. In some embodiments, the target processing information may be a target processing program or a target processing parameter.

In some embodiments, the initial processing information is an initial processing program, which can be generated based on the initial processing program and the compensation information. Become the first compensation procedure. The control module 110 calls the first compensation program generated by the processing information generation module 140, and controls the processing equipment of the processing module 150 to produce the mold. If the mold meets the error limit requirements, the first compensation program is the target processing program; if the processing module 150 If the mold produced by the processing equipment using the first compensation program does not meet the error limit requirements, steps 320 and 330 are repeatedly executed to cause the processing information generation module 140 to iterate the initial processing program multiple times until the target processing program is generated.

In some embodiments, the initial processing information is initial processing parameters, and the first compensation parameter can be generated based on the initial processing parameters and the compensation information. For example, the processing equipment is a lathe, and its initial processing parameters may include the feed amount, the feed angle, and the feed speed. Based on the compensation information and the initial processing parameters, the first compensated feed amount, the first compensated feed angle, and the first compensated feed angle may be generated. Compensate the feed speed. The control module 110 calls the first compensation parameters generated by the processing information generation module 140. The control module 110 resets the processing equipment of the processing module 150 based on the first compensation parameters and prepares the mold. If the mold obtained after resetting the parameters meets the error If the restriction requirements are met, then the first compensation parameter is the target processing parameter; otherwise, steps 320 and 330 are repeatedly executed to update the initial processing parameters multiple times until the target processing parameters are generated.

See Figure 5 and its description for more information on target processing information generation.

In step 340 , a standard mold 10 is prepared based on the target processing information. The standard mold 10 includes a mold body 11 and a covering layer 12 . In some embodiments, step 340 may be performed by processing module 150.

Standard mold 10 refers to a mold that meets the error-related limit requirements. In some embodiments, the mold body 11 of the standard mold 10 is made of hard material, such as metal material or alloy material. The mold body 11 is used to provide structural support for the standard mold 10, and the mold body 11 made of hard material facilitates processing. In some embodiments, hard materials that can be used to process the mold body 11 include, but are not limited to, brass, aluminum, stainless steel, cast iron, etc. In some embodiments, the hard material used to process the mold body 11 is preferably brass.

In some embodiments, the covering layer 12 of the standard mold 10 is made of flexible materials, such as polymer materials. Depending on its application scenarios, the covering layer 12 of the standard mold 10 has different functions. For example, the standard mold 10 is a mold used for polishing, and its covering layer 12 has the function of assisting in polishing. Several holes are provided on the covering layer 12 to facilitate the entry and adhesion of polishing powder. In some embodiments, flexible materials that can be used to process the cover layer 12 include, but are not limited to, polyurethane, damping cloth, synthetic organic matter, and the like. In some embodiments, the flexible material used to fabricate cover 12 is preferably polyurethane.

In some embodiments, the standard mold 10 is manufactured by step-by-step processing of the mold body 11 and the covering layer 12 .

In some embodiments, the mold body 11 is produced by turning based on target processing information. For example, the control module 110 can call the target processing program generated by the processing information generation module 140, and the control module 110 can control the turning device of the turning sub-module to turn the raw material based on the target processing program or target processing parameters to obtain the mold body 11.

In some embodiments, the covering layer 12 is attached to the mold body 11 and then polished through the covering layer 12 to obtain the standard mold 10 . The control module 110 can control the processing module 150 to polish the covering layer 12 that is attached to the processing surface of the mold body 11 to reduce or eliminate wrinkles and/or undulations of the covering layer 12 caused by the attachment.

In some embodiments, the covering layer 12 is attached to the mold body 11 and then the covering layer 12 is turned to obtain the standard mold 10 . The control module 110 can control the turning sub-module of the processing module 150 to turn the covering layer 12 attached to the processing surface of the mold body 11 based on the target processing information. The coated mold formed after the covering layer 12 is attached to the mold body 11 cannot be used for error analysis and processing accuracy control through contour detection and other means (the flexible covering layer affects the detection accuracy). Compared with the grinding process, which is difficult to quantify and standardize production, , standardized turning based on target processing information can ensure processing accuracy and consistency of mold finished products, and improve the yield rate.

For more information on standard mold preparation, see Figures 6 and 7 and their descriptions.

Some embodiments of this specification prepare standard molds based on target processing information, which can enable standardized batch processing of standard molds with high processing accuracy and finished product consistency.

Figure 4 is an exemplary flow diagram of a compensation information obtaining process according to some embodiments.

In the process of using a contour detection device to detect the three-dimensional surface topography of the mold, there may be problems with data distortion or missing data at the edge portions corresponding to the surface topography. For example, the control module 110 controls the surface information acquisition module 120 The contact profilometer detects the first mold. Since the contact profiler performs contour detection based on a preset starting range, in order for the probe of the contact profiler to always be in contact with the surface of the first mold during the detection process, the edge of the first mold needs to be in the preset range. outside the startup range. Therefore, the first surface information of the first mold obtained by the surface information acquisition module 120 lacks relevant data of the edge portion of the first mold, which further leads to the problem of increased error in the compensation information at the edge portion of the first mold.

As shown in FIG. 4 , the compensation information obtaining process 400 may include step 410 and step 420 . In some embodiments, the compensation information obtaining process 400 may be performed by a control device (such as the control module 110). In some embodiments, the compensation information obtaining process 400 can separately compensate and expand the main body and edges of the first mold to reduce errors.

In step 410, based on the comparison of the first surface information and the target surface information, body compensation information corresponding to the first mold body is obtained. In some embodiments, step 410 may be performed by the main compensation sub-module of the compensation information acquisition module 130 .

In some embodiments, the body and edges of the first mold may be determined based on the range of contour detection. For example only, the surface to be measured (processed surface) of the first mold is the surface of revolution, and its cross-sectional diameter is perpendicular to the axis of rotation. In the range of 0mm~50mm. Wherein, the detection range of the contact profiler can be the cross-sectional diameter of the first mold The surface area within the range of 1mm to 49mm corresponds to the main body of the first mold; the cross-sectional diameter of the first mold The surface area within the range of 0 mm to 1 mm and the range of 49 mm to 50 mm corresponds to the edge of the first mold.

In some embodiments, the body of the first mold may be determined based on user input. For example, before the control module 110 controls the surface information acquisition module 120 to detect the first mold to obtain the first surface information, the user can send the start and end position information of the contour detection to the control module 110 through the input/output module 180, and the control module 110 determines the main body range of the first mold based on the start and end position information input by the user, and controls the surface information acquisition module 120 to perform contour detection.

In some embodiments, the body of the first mold may be determined based on preset rules. For example, based on the aforementioned example in which the first mold processing surface is a surface of revolution, the generatrix of the surface of revolution may be an arc, and the control module 110 controls the profile detector of the surface information acquisition module 120 to perform contour detection along the generatrix of the surface of revolution. The control module 110 may determine based on the preset rules that the distance between the starting position of the contour detection and the first end of the bus bar is a first predetermined value (such as 1 mm, 3 mm, 5 mm, etc.), and that the distance between the final position of the contour detection and the bus bar is The distance between the second ends is the first predetermined value, and the area between the starting position and the end position of the contour detection corresponds to the main body of the first mold. In some embodiments, the preset rules may be stored in the storage module 160 .

In some embodiments, the body compensation information corresponding to the first mold body may be obtained based on a comparison of the first surface information and the target surface information. There may be an error between the first surface information and the target surface information, and the main body compensation information obtained by comparing the two may reflect the error. For example, combined with the aforementioned example of the first mold processing surface being a surface of revolution, the first surface information includes two-dimensional curve data corresponding to the first mold body on the generatrix of the first mold, and the target surface information includes the target mold on the generatrix of the target mold. Two-dimensional curve data of the body. By comparing the data of the first surface information and the target surface information, the X value and/or Y value difference between each point on the bus line of the first mold and the corresponding point on the target mold can be obtained, that is, the body compensation information can be obtained.

In step 420, edge extension information corresponding to the first mold edge is obtained based on the data trend of the first surface information. In some embodiments, step 420 may be performed by the edge compensation sub-module of the compensation information acquisition module 130.

In some embodiments, the first surface information may reflect changes in the three-dimensional topography of the main body of the first mold. By performing numerical fitting based on the data trend of the first surface information, edge surface information corresponding to the edge of the first mold may be obtained. For example, based on the aforementioned example in which the first mold processing surface is a surface of revolution, the generatrix of the surface of revolution may be a polyline, and the control module 110 controls the profile detector of the surface information acquisition module 120 to perform contour detection along the generatrix of the surface of revolution. The first surface information of the first mold includes curve data corresponding to the main body of the first mold on the bus line of the first mold. This curve data (such as end data) can be used to perform linear fitting (such as one-variable linear regression fitting), thereby obtaining Edge surface information corresponding to the edge of the first mold.

In some embodiments, the edge extension information may be further obtained based on a comparison of edge surface information and target surface information. There may be errors between the edge surface information and the target surface information, and the edge extension information obtained by comparing the two can reflect the error. For example, combined with the aforementioned example of the first mold processing surface being a surface of revolution, the edge surface information includes two-dimensional curve data corresponding to the first mold edge on the generatrix of the first mold, and the target surface information includes the target mold edge corresponding to the generatrix of the target mold. two-dimensional curve data. By comparing the data of the edge surface information and the target surface information, the X value and/or Y value difference between each point on the bus line of the first mold and the corresponding point on the target mold can be obtained, that is, the edge extension information can be obtained.

Figure 5 is an exemplary flow diagram of a target processing information generation process according to some embodiments.

As shown in FIG. 5 , the target processing information generating process 500 may include steps 510 to 540 . In some embodiments, process 500 may be performed by a control device (eg, control module 110).

In step 510, processing information to be verified is generated based on the initial processing information and the compensation information. In some embodiments, step 510 may be performed by the processing information generation module 140. In some embodiments, the processing information to be verified can be used to verify processing errors, thereby ensuring the error correction effect of the generated target processing information and ensuring processing accuracy.

In step 520, second surface information of the second mold is obtained, and the second mold is produced based on the processing information to be verified. In some embodiments, step 520 may be performed by surface information acquisition module 120.

In some embodiments, the second surface information refers to information reflecting the three-dimensional surface topography of the second mold. In some embodiments, the second surface information can be obtained through contour detection by the surface information acquisition module 120; the second mold can be produced by the processing module 150. For example, the control module 110 calls the processing information to be verified generated by the processing information generation module 140, and controls the turning sub-module of the processing module 150 to turn the second mold according to the processing information to be verified, where the processed surface of the second mold obtained by turning is: Surface of revolution; the control module 110 controls the contact profiler of the surface information acquisition module 120 to detect the surface profile of the processed surface of the second mold to obtain two-dimensional surface curve data.

In step 530, based on the second surface information and the target surface information, it is determined whether the surface error of the second mold is within a preset value range. In some embodiments, step 530 may be performed by the processing information generation module 140.

In some embodiments, both the second surface information and the target surface information are two-dimensional surface curve data, and the surface error of the second mold can be calculated based on the data based on the second surface information and the target surface information. The surface error of the second mold refers to the error between each point on the processing surface of the second mold or a representative series of feature points and each corresponding point on the target mold. For example, the second surface information includes the two-dimensional coordinates of a series of detection points on the second mold surface, and the target surface information includes the two-dimensional coordinates of a series of simulation points on the target mold surface, which can be obtained by calculating the distance between the detection points and the corresponding simulation points. The surface error value corresponding to this detection point.

In some embodiments, the surface error of the second mold being within the preset value range may mean that the maximum surface error is less than the preset value. Surface errors in various parts of the second mold may be the same or different, and if the maximum surface error is less than a specific preset value, it can be considered that the second mold meets the error limit requirements.

In some embodiments, the preset value is a default value stored in the storage module 160 that can be called and read. For example, the preset value may be 10 μm. In some embodiments, the preset value may be determined based on user input. For example, before the processing information generation module 140 determines whether the surface error of the second mold is within the preset value range, the control module 110 sends query information to the user through the input/output module 180 to determine whether to set the preset value. After the user responds, the control module 110 obtains the preset value input by the user and sends it to the processing information generation module 140 .

In step 540, target processing information is determined based on the surface error judgment result of the second mold. In some embodiments, step 540 may be performed by the processing information generation module 140.

In some embodiments, step 540 further includes: if it is determined that the surface error of the second mold is within the preset value range, determining the processing information to be verified corresponding to the second mold as the target processing information. The target processing information corrects the system error of the processing equipment (such as a lathe) of the processing module 150, so that the processing module 150 can perform high-precision, standardized mold processing based on the target processing information, and can be adapted to batch processing of molds.

In some embodiments, step 540 further includes: if it is determined that the surface error of the second mold is not within the preset value range, then the current round of process 500 is terminated, and the next round of steps 320 and process 500 are started until the target processing information is generated. . For example, if the processing information generation module 140 determines that the surface error of the second mold is not within the preset value range, the control module 110 controls the processing information generation module 140 to terminate the currently executed target processing information generation process 500 . The control module 110 sends the second surface information measured by the surface information acquisition module 120 to the compensation information acquisition module 130; the control module 110 controls The compensation information obtaining module 130 executes step 320 to obtain the compensation information for the second time based on the second surface information and the target surface information. The control module 110 sends the compensation information obtained for the second time to the processing information generation module 140 and controls the processing information generation module. 140 executes the second round of process 500 . If the second round of process 500 determines that the surface error of the third mold is not within the preset range, the control module 110 will terminate the second round of process 500 and continue to execute the next round of steps 320 and process 500 in a loop until the target processing information is generated.

The target processing information generation process of some embodiments of this specification corrects the system error of the processing equipment (such as the turning sub-module of the processing module 150). The processing equipment can perform mold processing in batches based on the target processing information generated by the target processing information generation process. Improve processing accuracy and standardization.

Figure 6 is an exemplary flow diagram of a standard mold preparation process according to some embodiments.

As shown in FIG. 6 , the standard mold preparation process 600 may include steps 610 to 630 . In some embodiments, process 600 may be performed by a control device (eg, control module 110).

In step 610, the initial mold 10' is turned based on the target processing information to obtain the mold body 11. In some embodiments, step 610 may be performed by a machining module 150 (eg, a turning submodule).

In some embodiments, the initial mold 10' is the raw material to be processed. For example, the initial mold 10' can be a cylindrical metal raw material, and the surface to be processed of the initial mold 10' is a flat surface. The mold body 11 is turned based on the surface to be processed of the initial mold 10', and the processing surface of the mold body 11 is an inner spherical surface.

In some embodiments, the initial mold 10' can be directly turned based on the target processing information to obtain the mold body 11. For example, the turning sub-module of the processing module 150 calls the target processing program generated by the processing information generation module 140 to perform turning of the initial mold 10', thereby obtaining the mold body 11.

In step 620 , the covering layer 12 is attached to the mold body 11 . In some embodiments, step 620 may be performed by the heating submodule and the pressing submodule of the processing module 150 .

In some embodiments step 620 further includes a heating step. In the heating step, the mold body 11 is heated. In some embodiments, the heating step may be performed by a heating submodule of the processing module 150 .

In some embodiments, the mold body 11 may be heated by a heating coil. Preferably, the heating coil is a high-frequency induction coil. The heating coil can form an eddy current amount in the mold body 11 as an electrical conductor, and quickly heat the mold body 11 through electromagnetic induction.

In some embodiments, controlling the heating position of the heating coil relative to the mold body 11 during the heating process can adjust the heating uniformity of the mold body and improve heating efficiency. In some embodiments, the heating position of the heating coil relative to the mold body 11 may be determined based on the dimensions of the mold body, such as the diameter and/or height of the mold body. In a specific example, the diameter of the mold body 11 is smaller than a preset value (for example, 100 mm), and the heating coil may be disposed on the peripheral side of the mold body 11 . When the height of the mold body 11 is greater than the height of the heating coil, the bottom surface of the heating coil can be flush with the bottom surface of the mold body 11 . When the height of the mold body 11 is less than or equal to the height of the heating coil, the top surface of the heating coil can be flush with the top surface of the mold body 11 . In another specific example, the diameter of the mold body 11 is greater than or equal to a preset value (for example, 100 mm), and the heating coil can be disposed at the bottom of the mold body 11 . In some embodiments, the mold body 11 can be heated more evenly by rotating the mold body 11 .

In some embodiments, the axis of the heating coil passes through the mold body 11 to be heated. In some preferred embodiments, the mold body 11 can be a rotary body, and the axis of the heating coil coincides with the axis of the mold body 11 to be heated, so as to improve the heating effect.

In some embodiments, the heating temperature of the heating coil is 160°C to 200°C. For example, the heating temperature may be about 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C, or 200°C. . In some embodiments, the heating temperature of the heating coil is preferably 170°C to 190°C. When the mold body 11 is heated to a suitable temperature, the covering layer 12 can be easily combined.

In some embodiments, step 620 further includes a pressing step. In the pressing step, the covering layer 12 is compacted with the heated mold body 11 so that the covering layer 12 is attached to the mold body 11 . In some embodiments, the pressing step may be performed by the pressing sub-module of processing module 150 .

In some embodiments, the overlay 12 can be aligned with the heated mold body based on the physical properties of the overlay 12 itself. 11 combined. For example, the covering layer 12 is made of a flexible polymer material, such as polyurethane. The mold body 11 is heated to within the melting point range of the polyurethane, so that the portion of the covering layer 12 that contacts the mold body 11 is melted, and the melted portion is tightly combined with the mold body 11 so that the covering layer 12 is attached to the mold body 11 .

In some embodiments, the surface of the heated mold body 11 is pre-set with an adhesive medium, and the covering layer 12 is combined with the heated mold body 11 through the adhesive medium. For example, a predetermined amount of polyurethane is pre-melted and then coated on the heated mold body 11, and then a covering layer 12 made of polyurethane is placed on the mold body 11, so that the covering layer 12 and the mold body 11 are adhered to each other through the pre-melted polyurethane. combine. In some embodiments, the adhesive medium may be the material used to prepare the covering layer 12 , or the adhesive medium may be other materials with adhesive effects, which is not limited in this embodiment.

In some embodiments, the covering layer 12 and the heated mold body 11 are compacted by a pressurized platen tool 30 to produce a coated mold 10". Exemplarily, as shown in Figure 7, the heated mold body 11 is placed On the tooling base, the covering layer 12 is placed on the pressure-bearing surface of the mold body 11. The driving device 40 of the pressure plate tooling 30 is installed above the mold body 11 through the tooling bracket, and the pressure plate tooling 30 is fixed on the driving rod of the driving device 40. 41. The pressure plate tool 30, the covering layer 12 and the heated mold body 11 are aligned in the vertical direction, and the platen tool 30 moves in the vertical direction to pressurize the covering layer 12 and the heated mold body 11, so that The covering layer 12 is compacted with the heated mold body 11 to obtain a covered mold 10".

In some embodiments, the curvature of the pressure surface of the platen tool 30 matches the curvature of the pressure-bearing surface of the mold body 11 . The curvature matching makes the pressure surface of the pressure plate tool 30 and the pressure surface of the mold body 11 in time, and the pressure surface and the pressure surface are roughly parallel, that is, the curvature radius of each point on the pressure surface and the corresponding point on the pressure surface The difference is within the preset threshold range (for example, no more than 1 mm), so that the covering layer 12 placed on the pressure-bearing surface of the mold body 11 is evenly stressed everywhere, so that the covering layer 12 is evenly attached to the mold body. 11 on the pressure-bearing surface.

In some embodiments, the pressure range of the pressure plate tool 30 is 0.1Mpa～0.8Mpa. For example, the pressure surface of the platen tool 30 can apply a pressure of about 0.1Mpa, 0.2Mpa, 0.3Mpa, 0.4Mpa, 0.5Mpa, 0.6Mpa, 0.7Mpa or 0.8Mpa to the pressure-bearing surface of the mold body 11, so that the covering layer 12 is compactly attached to the mold body 11 . In some preferred embodiments, the pressure range of the pressure plate tool 30 is 0.3Mpa～0.6Mpa. For example, if the pressure-bearing surface (i.e., the processing surface) of the mold body 11 is a rotating surface, and the maximum cross-sectional diameter of the rotating surface is ≤ 50 mm, then the pressure exerted by the platen tool 30 can be about 0.3 MPa. For another example, if the pressure-bearing surface (i.e., the processing surface) of the mold body 11 is a rotating surface, and the maximum cross-sectional diameter of the rotating surface is ≤80mm, and the maximum cross-sectional diameter is ≥51mm, then the pressure exerted by the pressure plate tool 30 can be about 0.6Mpa. .

In some embodiments, the driving device 40 of the platen tool 30 may be a pneumatic cylinder or a hydraulic cylinder. In some embodiments, the driving device 40 of the platen tool 30 can be other devices with a driving function, which is not limited in this embodiment.

In step 630, the covering layer 12 is turned based on the target processing information to prepare the standard mold 10. In some embodiments, step 630 may be performed by the turning submodule of the machining module 150 .

In some embodiments, after the covering layer 12 and the mold body 11 are compacted, there are unpredictable and controllable undulations on the surface of the covering layer 12 . Turning the covering layer 12 of the coating mold 10" based on the target processing information can reduce or eliminate the errors caused by the above-mentioned unevenness. For example, the control module 110 calls the target processing program generated by the processing information generation module 140 to control the turning of the processing module 150 The sub-module performs turning of the covering layer 12 of the cladding mold 10" through the target machining program to eliminate the undulating wrinkles on the surface of the covering layer 12 that do not meet the error limit requirements, and prepare the standard mold 10.

In some embodiments, turning the covering layer 12 based on the target processing information to produce the standard mold 10 may further include: generating covering compensation information based on the target processing information and covering layer information; based on covering layer compensation The information is used to turn the covering layer 12 of the cladding mold 10" to obtain the standard mold 10. The influence of the covering layer 12 is eliminated when generating the target processing information, and the cladding compensation information can be introduced when processing the standard mold 10 corresponding to the covering layer 12 correction to avoid excessive turning of the cover layer 12. For example, the processing information generation module 140 performs cover layer correction (such as shifting the entire processing surface by a predetermined distance) to the target processing program based on the cover layer information (such as thickness) input by the user, Obtain the cladding compensation program; the control module 110 calls the cladding compensation program generated by the processing information generation module 140, and uses the cladding compensation program to control the turning sub-module of the processing module 150 to turn the covering layer 12 of the cladding mold 10" to obtain Standard mold 10.

In the preparation process of the standard mold in some embodiments of this specification, the covering layer 12 of the cladding mold 10" is turned based on the target processing information to obtain the standard mold 10. Compared with the grinding process, the turning of the cladding mold 10" is easier to achieve the standard. Specialized batch processing, short processing time and high consistency of finished products.

The standard molds prepared by the mold processing methods of some embodiments of this specification can be used to polish workpieces, helping to standardize the workpiece polishing process. The polishing process of the workpiece usually uses a separate polishing mold to polish all polishing areas of the workpiece, which needs to be achieved by frequently adjusting the polishing parameters (such as swing, pressure, etc.) of the polishing equipment. This not only makes the production of polishing molds more difficult, but also limits the polishing accuracy because it is difficult to fully take into account the polishing of all polishing areas. In addition, frequent adjustments to polishing parameters also make the adjustment of polishing equipment difficult and time-consuming, limiting the standardization of the polishing process. In some embodiments of this specification, multiple standard molds are used to perform zoned polishing on workpieces. When the polishing requirements remain unchanged, the polishing parameters of the polishing equipment corresponding to each standard mold remain unchanged, and similar workpieces can be polished without frequent adjustments. Carry out batch, standardized, high-precision polishing corresponding to the partition, reducing the time cost caused by polishing equipment adjustment. At the same time, zoned polishing of multiple standard molds can reduce the processing difficulty of a single standard mold and ensure the processing accuracy of a single standard mold, thereby further improving the polishing accuracy.

Figure 8 is an exemplary flow diagram of a workpiece polishing method according to some embodiments.

As shown in FIG. 8 , the workpiece polishing process 800 may include steps 810 to 830 . In some embodiments, workpiece polishing process 800 may be performed by a control device (eg, control module 210). In some embodiments, the workpiece polishing process 800 can differentiate polishing of molds according to different polishing areas of the workpiece, reducing the difficulty of polishing mold processing while improving polishing accuracy and efficiency.

In some embodiments, the workpiece 20 may include a polishing area to be zoned polished, such as a single-sided lens including a convex or concave polishing area. In some embodiments, the workpiece may include multiple polishing areas to be polished separately, and the distribution range of the multiple polishing areas on the surface of the workpiece does not overlap. For example, a double-sided lens includes two convex or concave polishing areas. For each polishing area of one or more polishing areas of the workpiece, the process 800 can be performed independently to perform zoned polishing.

In step 810, at least the first polishing area 21 and the second polishing area 22 of the workpiece 20 are determined. In some embodiments, step 810 may be performed by polishing area determination module 220.

In some embodiments, the workpiece 20 may have two sub-polishing areas, such as a first polishing area 21 and a second polishing area 22 , and the two sub-polishing areas of the workpiece 20 may cover the polishing area of the workpiece 20 . In some embodiments, the workpiece 20 may further include a third polishing area, a fourth polishing area to an Nth polishing area, and more than two sub-polishing areas of the workpiece 20 cover the polishing area of the workpiece 20 . This embodiment does not limit the number of sub-polishing areas.

In some embodiments, different sub-polishing areas of the workpiece 20 may be determined based on the radius of curvature of the polishing area, such as determining at least the first polishing area 21 and the second polishing area 22 .

For example only, the workpiece 20 is a single-sided lens to be polished, and its polishing area is an aspherical surface of revolution (convex surface). The projection of its axial section in the axial-radial coordinate system is a parabola. The radius of curvature of the polishing area is Between 5mm～35mm. The polishing area determination module 220 can determine the first polishing area 21 as a polishing area with a curvature radius of 5 mm to 10 mm based on the curvature radius range of the polishing area of the workpiece 20, and determine the second polishing area 22 as a polishing area with a curvature radius of 10 mm to 35 mm. area. The curvature radius range of each sub-polishing area of the workpiece 20 can be set according to actual processing requirements, and is not limited in this embodiment.

In some embodiments, for each polishing area of the workpiece 20, the polishing area is partitioned based on the radius of curvature, and the sub-polishing areas have different curvature radii. For example, the workpiece 20 has an aspherical polishing area, in which the first polishing area 21 and the second polishing area 22 cover the polishing area of the workpiece 20. The first polishing area 21 and the second polishing area 22 have different curvature radii, and zone polishing is performed so that To achieve the purpose of standardized batch polishing.

In some embodiments, different sub-polishing areas of the workpiece 20 may be determined based on the pre-polishing process, such as determining at least the first polishing area 21 and the second polishing area 22 . The pre-polishing process may include a shape feature determining step, a pre-polishing step and a sub-polishing area determining step.

In the characterization step, shape characteristics of the polished area of the workpiece 20 may be determined. In some embodiments, the shape characteristics may include a radius of curvature, a change rate of the radius of curvature, or a curved surface profile, or any combination thereof.

In the pre-polishing step, the polishing area of the test workpiece may be pre-polished based on the shape characteristics of the polishing area of the workpiece 20 , and the test workpiece is selected from the workpiece 20 .

Pre-polishing refers to the process of obtaining the polishing results of a test workpiece under a predetermined polishing strategy (for example, an overall polishing strategy and/or a partitioned polishing strategy). In some embodiments, one or more workpieces 20 produced in the same batch may be selected as test workpieces for pre-polishing.

The polishing results can be used to guide zoned polishing of the polishing area of the workpiece 20 . In some embodiments, the polishing results include pre-polished parameter information of the polished area of the test workpiece. Parameter information can be used to reflect the changes in shape characteristics of the test workpiece before and after pre-polishing. In some embodiments, the parameter information is determined by comparing the shape characteristics of the polished area of the test workpiece before and after pre-polishing.

In some embodiments, the parameter information includes polish removal rate. After the test workpiece is pre-polished, there may be differences in the polishing removal rates of two or more areas, and the difference in polishing removal rates may indicate the optimization direction of the polishing strategy for the workpiece 20 . In some embodiments, the polishing removal rate of the test workpiece after pre-polishing can be obtained through contour detection. For example, before and after pre-polishing, perform contour detection on the polished area of the test workpiece to obtain curve (or surface) data before pre-polishing and curve (or surface) data after pre-polishing. Based on the comparison of the curve (or surface) data before pre-polishing and the curve (or surface) data after pre-polishing, the polishing removal rate after pre-polishing in each part of the polishing area is determined.

In some embodiments, the pre-polishing step further includes: pre-polishing the polishing area of the test workpiece based on the overall polishing strategy to prepare the first test workpiece; and obtaining first parameter information of the first test workpiece.

The first test workpiece can be used to simulate the polishing effect of the workpiece 20 under the overall polishing strategy. In some embodiments, there may be one or more first test workpieces; the first parameter information may be determined based on comprehensive analysis of parameter information of multiple first test workpieces.

The first parameter information can be used to reflect the changes in shape characteristics of the test workpiece before and after overall pre-polishing. In some embodiments, the first reference information may be obtained based on detection analysis of one or more first test artifacts.

In some embodiments, the pre-polishing of the test workpiece is performed by using a pre-polishing tool, and the polishing surface shape characteristics of the pre-polishing tool are determined based on the shape characteristics of the polishing area of the workpiece 20 and the corresponding polishing strategy. The first test workpiece is produced by overall pre-polishing the test workpiece using a first polishing tool, and the polishing surface characteristics of the first pre-polishing tool are determined based on the shape characteristics of the polishing area of the workpiece 20 and the overall polishing strategy.

In one specific example, the surfaces to be polished of the workpiece 20 and the test workpiece are aspherical surfaces. The polishing surface of the first pre-polishing tool may be another aspherical surface that is fitted with the aspherical surface to be polished. Alternatively, the polishing surface of the first pre-polishing tool may be a spherical surface that is in contact with the aspherical surface to be polished. For example, the curvature radius of the spherical surface of the polishing surface may be the average curvature radius of the aspherical surface to be polished. In another specific example, the surfaces to be polished of the workpiece 20 and the test workpiece are spherical surfaces. The polishing surface of the first pre-polishing tool may be another spherical surface fitted with the spherical surface to be polished. Alternatively, the polishing surface of the first pre-polishing tool can be an aspheric surface that is in contact with the spherical surface to be polished. For example, the polishing surface can be an ellipsoid or other arc-shaped surface of revolution, and the inner side of the ellipsoid or other arc-shaped surface of revolution can be It is connected to a spherical circle with a specific radius outside the spherical surface to be polished, and the difference in the curvature radius of the two connecting parts is within the preset threshold range (for example, not exceeding 0.01mm, 0.03mm, 0.05mm or 0.08mm).

In some embodiments, the pre-polishing step further includes: generating a first partition polishing strategy based on the first parameter information and a preset threshold condition; pre-polishing the polishing area of the test workpiece based on the first partition polishing strategy to obtain a third Two test workpieces; obtain second parameter information of the second test workpiece.

Preset threshold conditions can be used to classify/screen sub-polishing areas with different polishing results in the polishing area. In some embodiments, the preset threshold condition includes a polishing removal rate threshold. For example, after the polished area of the test workpiece is pre-polished, the polishing removal rate of some sub-polished areas may be low, which can be considered to have not been effectively polished. It is suitable to use the polishing removal rate threshold to set the classification conditions of the sub-polished areas for polishing. Partition optimization of strategies. In some embodiments, the polishing removal rate threshold may be fixed, for example, it may be calculated based on the maximum polishing removal rate and/or the minimum polishing removal rate. For example, the polishing removal rate threshold may be the average of the maximum polishing removal rate and the minimum polishing removal rate, or may be the product of the minimum polishing removal rate and an empirical coefficient (eg, 1.1, 1.2, 1.3, or 1.5). In other embodiments, the polishing removal rate threshold may be an empirical value based on user input.

In some embodiments, the preset threshold condition further includes a difference threshold of polishing removal rate. For example, the throwing of test artifacts After the light area is pre-polished, there are differences in the polishing removal rates of two or more sub-polished areas. When the polishing removal rate of all sub-polishing areas is greater than or equal to the polishing removal rate threshold, the difference in polishing removal rate between one or more sub-polishing areas and the sub-polishing area with the highest polishing removal rate may be too large, and it can be considered that it The polishing accuracy needs to be optimized, and it is suitable to use the difference threshold of the polishing removal rate to set the classification conditions of the sub-polishing area to perform partitioning optimization of the polishing strategy.

In some embodiments, the overall pre-polishing may make it difficult for the first test workpiece to meet the polishing accuracy requirements. The partitioning of the polishing area can be determined by comparing the first parameter information and the preset threshold conditions, thereby formulating a targeted first partitioning polishing strategy. . For example, for the polishing area of the first test workpiece, the sub-polishing area with a polishing removal rate greater than or equal to the polishing removal rate threshold can be marked as a category 1 area, and the sub-polishing area with a polishing removal rate less than the polishing removal rate threshold can be marked as category 2. area, and generate a first partition polishing strategy based on the above partitions. For another example, if there is a situation where the polishing removal rate difference of some sub-polishing areas in the aforementioned Type 2 area is greater than the difference threshold, it can be divided from the Type 2 area and marked as a Type 3 area, and the first partition is generated based on the above partitions. Polishing strategy.

The second test workpiece is used to simulate the polishing effect of the workpiece 20 under the zoned polishing strategy. In some embodiments, the second test workpiece is produced by pre-polishing the test workpiece using a second polishing tool, and the polishing surface shape characteristics of the second polishing tool are based on the shape characteristics of the polishing area of the workpiece 20 and the first zone polishing strategy to determine. For example, the surfaces to be polished of the workpiece 20 and the test workpiece are aspherical. The first partition polishing strategy divides the polishing area of the test workpiece into type 1 and type 2 areas. The type 1 and type 2 areas are processed using different second pre-polishing tools. Pre-polished. The polishing surface of any one of the two second pre-polishing tools can be: a spherical surface that is in contact with the corresponding surface to be polished; or an aspheric surface that is fitted with the corresponding surface to be polished. For another example, the surfaces to be polished of the workpiece 20 and the test workpiece are spherical surfaces, and the polishing surface of any one of the two aforementioned second pre-polishing tools can be: an aspheric surface (for example, an ellipsoid or other surface) that is in contact with the corresponding surface to be polished. Arc-shaped surface of revolution); or, a spherical surface fitted with the corresponding surface to be polished. For more information about the second pre-polishing tool, please refer to other parts of this specification (for example, the relevant description of the first pre-polishing tool).

It should be noted that in the pre-polishing step, pre-polishing based on different polishing strategies is implemented using different test workpieces. Specifically, there may be multiple test workpieces. The pre-polishing step may use one of the multiple test workpieces for pre-polishing to produce the first test workpiece, and the pre-polishing step may use another of the multiple test workpieces for pre-polishing to produce the first test workpiece. Second test artifact.

The second parameter information is used to reflect the changes in shape characteristics of the test workpiece before and after zoned pre-polishing. In some embodiments, the second reference information may be obtained based on inspection analysis of one or more first test artifacts.

In the sub-polishing area determining step, at least the first polishing area and the second polishing area of the workpiece 20 may be determined based on the pre-polishing result.

In some embodiments, the sub-polishing area determining step may further include: determining at least the first polishing area and the second polishing area of the workpiece 20 based on the first parameter information and the preset threshold condition. In some embodiments, one or more rounds of overall polishing can be performed on the test workpiece based on the overall polishing strategy, and a comprehensive analysis is performed based on the polishing results of the overall polishing to obtain a partitioned polishing strategy (for example, a first partitioned polishing strategy), so that The sub-polishing area of the workpiece 20 is determined. For more information on obtaining this partition polishing strategy, please refer to other parts of this specification (for example, the relevant description of the first partition polishing strategy).

In some embodiments, the step of determining the sub-polishing area may further include: determining whether the second parameter information of the second test workpiece meets a preset threshold condition; if so, determining at least the first polishing area of the workpiece based on the first partition polishing strategy and Second polishing area.

In some embodiments, the preset threshold condition can also be used to determine whether the polishing result meets the polishing accuracy requirements. The sub-polishing area determination step can verify whether the second parameter information obtained based on the first partition polishing strategy meets the polishing accuracy requirements before determining the sub-polishing area of the workpiece 20 . When the second parameter information meets the preset threshold condition, the sub-polishing area of the workpiece 20 can be determined based on the first partition polishing strategy; when the second parameter information does not meet the preset threshold condition, the second round can be continued. or more rounds of zoned pre-polishing until the obtained corresponding zoned polishing strategy can make the polishing result of the test workpiece (and the workpiece 20 ) meet the polishing accuracy requirements. In some embodiments, the second round of partitioned pre-polishing includes: generating a second partitioned polishing strategy based on the second parameter information and predicted polishing conditions; pre-polishing the polishing area of the test workpiece based on the first partitioned polishing strategy to obtain a third Second test workpiece; obtain the second parameter information of the second test workpiece.

Some embodiments of this specification determine different sub-polishing areas of the workpiece as the basis for partitioned polishing. If the polishing accuracy of the workpiece does not meet the standard, the sub-polishing areas that need to be optimized can be accurately located to facilitate the adjustment of polishing parameters and/or polishing molds.

In step 820, the first polishing area 21 is polished using the first polishing mold 10a. In some embodiments, step 820 may be performed by the first polishing sub-module of polishing module 230.

The first polishing mold 10a is used for polishing the first polishing area 21. In some embodiments, the curvature of the polishing surface of the first polishing mold 10a matches the curvature of the surface to be polished in the first polishing area 21. For example, the first polishing area 21 is a partial area of an aspherical polishing area, and the polishing surface of the first polishing mold 10a is a spherical surface. The difference in curvature radius of each point on the polishing surface of the first polishing mold 10a and the corresponding point on the to-be-polished surface of the first polishing area 21 is within a preset threshold range (for example, no more than 0.01mm, 0.03mm, 0.05mm or 0.08mm), the polishing surface 13a of the first polishing mold 10a and the surface to be polished in the first polishing area 21 are timed, and the surface to be polished can closely fit the polishing surface 13a for polishing. For another example, the first polishing area 21 is a partial area of a spherical polishing area, and the polishing surface of the first polishing mold 10a is an aspheric surface (for example, an ellipsoid or other arc-shaped surface of revolution). The polishing surface of the first polishing mold 10a is connected to the surface to be polished of the first polishing area 21, and the difference in the curvature radius of the connecting parts is within a preset threshold range (for example, no more than 0.01mm, 0.03mm, 0.05mm or 0.08mm), so that the surface to be polished can closely fit with the polishing surface at the connecting part for polishing during the polishing process.

In some embodiments, polishing of the first polishing area 21 may be performed by at least one of axial rotation of the first polishing mold 10a, rotational swing of the first polishing mold 10a, and axial rotation of the workpiece 20.

Figure 9 is an exemplary structural schematic diagram of the polishing process of the first polishing area according to some embodiments. In a specific embodiment, as shown in FIG. 9 , the control module 210 controls the first polishing sub-module of the polishing module 230 to polish the first polishing area 21 of the workpiece 20 , where the surface to be polished of the workpiece 20 is an aspherical surface. , the polishing surface 13a of the first polishing mold 10a is a spherical surface. According to the control instructions of the control module 210, the first polishing sub-module controls the first polishing mold 10a to rotate and swing in the direction w1 with O1 as the origin, and controls the first polishing mold 10a to rotate axially in the n'1 direction with L2 as the axis. Rotate and manipulate the workpiece 20 to rotate axially along the direction n1 with L1 as the axis. The first polishing area 21 matches the curvature of the polishing surface 13a of the first polishing mold 10a. During the above-mentioned rotational swing and axial rotation process, the first polishing mold 10a continues to apply pressure P1 to the workpiece 20, so that the polishing surface 13a is in contact with the first polishing mold 13a. The areas 21 are in close contact with each other to achieve the effect of polishing the first polishing area 21 .

In some embodiments, the first polishing mold 10a has first polishing parameters, and the first polishing parameters at least include a first swing parameter and a first pressure parameter. In some embodiments, the first polishing parameter may also include a first mold rotation parameter and/or a first workpiece rotation parameter.

Some embodiments of this specification use different polishing molds and polishing parameters to polish different sub-polishing areas of the workpiece, thereby reducing the difficulty of adjusting the polishing equipment. When the workpiece polishing accuracy meets the requirements, after completing the assembly of the polishing mold and setting the polishing parameters corresponding to the polishing mold, the polishing equipment does not need to set parameters again to avoid frequent machine adjustments that affect polishing efficiency.

In step 830, the second polishing area 22 is polished using the second polishing mold 10b. The polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b have different curvature radii. In some embodiments, step 830 may be performed by the second polishing sub-module of polishing module 230.

The second polishing mold 10b is used for polishing the second polishing area 22. In some embodiments, the curvature of the polishing surface 13b of the second polishing mold 10b matches the curvature of the surface to be polished in the second polishing area 22. For example, the second polishing area 22 is a partial area of an aspherical polishing area, and the polishing surface of the second polishing mold 10b is a spherical surface. The difference in the curvature radius of each point on the polishing surface of the second polishing mold 10b and the corresponding point on the surface to be polished in the second polishing area 22 is within a preset threshold range (for example, no more than 0.01mm, 0.03mm, 0.05mm or 0.08mm), the polishing surface 13b of the second polishing mold 10b and the surface to be polished in the second polishing area 22 are timed, and the surface to be polished can closely fit the polishing surface 13b for polishing. For another example, the second polishing area 22 is a partial area of a spherical polishing area, and the polishing surface of the second polishing mold 10b is an aspheric surface (for example, an ellipsoid or other arc-shaped surface of revolution). The polishing surface of the second polishing mold 10b is connected with the surface to be polished in the second polishing area 22, and the difference in the curvature radius of the connecting parts is within a preset threshold range (for example, no more than 0.01mm, 0.03mm, 0.05mm or 0.08mm), so that the surface to be polished can closely fit the polishing surface at the connecting part during the polishing process. Light.

In some embodiments, polishing of the second polishing area 22 may be performed by at least one of axial rotation of the second polishing mold 10b, rotational swing of the second polishing mold 10b, and axial rotation of the workpiece 20.

Figure 10 is an exemplary structural schematic diagram of the polishing process of the second polishing area according to some embodiments. In a specific embodiment, as shown in Figure 10, the control module 210 controls the second polishing sub-module of the polishing module 230 to polish the second polishing area 22 of the workpiece 20, where the surface to be polished of the workpiece 20 is an aspheric surface. , the polishing surface 13b of the second polishing mold 10b is a spherical surface. According to the control instructions of the control module 210, the second polishing sub-module controls the second polishing mold 10b to rotate and swing in the direction w2 with O2 as the origin, and controls the second polishing mold 10b to rotate axially in the n'2 direction with L3 as the axis. Rotate, and control the workpiece 20 to perform axial rotation along the direction n2 with L1 as the axis. The second polishing area 22 matches the curvature of the polishing surface 13b of the second polishing mold 10b. During the above-mentioned rotational swing and axial rotation process, the second polishing mold 10b continues to apply pressure P2 to the workpiece 20, so that the polishing surface 13b is in contact with the second polishing mold 10b. The areas 22 are in close contact with each other and rubbed together to achieve the effect of polishing the second polishing area 22 .

In some embodiments, the second polishing mold 10b has second polishing parameters, and the second polishing parameters at least include a second swing parameter and a second pressure parameter. In some embodiments, the second polishing parameter may also include a second mold rotation parameter and/or a second workpiece rotation parameter.

In some embodiments, the polishing parameters of different polishing molds are different from each other, for example, the first polishing parameter of the first polishing mold 10a and the second polishing parameter of the second polishing mold 10b are different. The polishing parameters being different from each other means that among the multiple parameters of the polishing parameters, at least one parameter is different from each other. For example, the first polishing parameter is different from the second polishing parameter, the first swing parameter is different from the second swing parameter, and the first pressure parameter is the same as the second pressure parameter.

In some embodiments, the first polishing mold 10a and the second polishing mold 10b respectively polish different sub-polishing areas of the workpiece 20, and the polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b have different curvature radii. . For example, as shown in FIGS. 9 and 10 , the first polishing mold 10 a and the second polishing mold 10 b zone polish the aspherical polishing area of the workpiece 20 . The curvature radius of the polishing surface 13a of the first polishing mold 10a is 45mm, and the first polishing mold 10a polishes the first polishing area 21 of the workpiece 20; the curvature radius of the polishing surface 13b of the second polishing mold 10b is 60mm, and the second polishing mold 10b polishes the workpiece. The second polishing area 22 of 20.

In some embodiments, the first polishing mold 10a and the second polishing mold 10b respectively polish different sub-polishing areas of the workpiece 20, and the curvature radii of the polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b change. The rates are different. For example, the first polishing mold 10a and the second polishing mold 10b partition the spherical polishing area of the workpiece 20 for polishing. The polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b may be aspherical surfaces (for example, ellipsoidal surfaces or other arc-shaped revolution surfaces). The radius of curvature of the connecting portion of the polishing surface 13a and the surface to be polished in the first polishing area 21 and the radius of curvature of the connecting portion of the polishing surface 13b and the surface to be polished of the second polishing area 21 may be the same or similar, but overall See, the curvature radius change rate of the polishing surface 13a of the first polishing mold 10a is different from the curvature radius change rate of the polishing surface 13b of the second polishing mold 10b. The curvature radii of the surface 13b are also different in order to accurately fit the sub-polishing areas with different positions on the spherical surface.

In some embodiments, the process 800 may further include a third polishing area polishing step, a fourth polishing area polishing step to an Nth polishing area polishing step. Each polishing area uses a corresponding polishing mold that matches the curvature of the surface to be polished, and the polishing parameters are set based on different polishing areas.

In some embodiments, the standard mold prepared by the mold processing process 300 can be used as the polishing mold of the sub-polishing area, such as using the standard mold prepared by the process 300 as the first polishing mold and/or the second polishing mold. For more information about the structure and processing method of the standard mold that can be used as the first polishing mold and/or the second polishing mold, please refer to the relevant descriptions in Figures 3 to 8, which will not be described again here.

The workpiece polishing method in some embodiments of this specification uses multiple polishing molds with different curvature radii to polish the workpiece in zones, thereby reducing the difficulty of processing the polishing mold in each sub-polishing area. In particular, after using this workpiece polishing method to determine the polishing molds and polishing parameters corresponding to multiple sub-polishing areas of the workpiece, the polishing equipment can perform standardized batch polishing of the workpieces without further equipment debugging during the process, thereby improving the polishing accuracy and accuracy of the workpieces. Polishing efficiency.

The possible beneficial effects of the mold processing method and workpiece polishing method disclosed in this specification include but are not limited to: (1) The mold processing method of the embodiment of this specification performs one or more compensation corrections on the initial processing information to obtain target processing Information, the standard mold processed based on the target processing information can effectively reduce or eliminate the impact of systematic errors of the processing equipment; (2) The mold processing method of the embodiment of this specification can achieve standardized batch production of molds, with good consistency of finished products and high mold processing accuracy. and high processing efficiency; (3) The workpiece polishing method in the embodiment of this specification is divided into different sub-polishing areas, different polishing molds, and different polishing parameters to finely polish the workpiece. Compared with using a single polishing mold to complete the overall polishing of the workpiece, this fine Chemical polishing can improve the polishing accuracy of the workpiece; (4) Compared with using a single polishing mold to complete the overall polishing of the workpiece, using the workpiece polishing method of the embodiment of this specification, multiple polishing equipment can be used to perform continuous polishing operations without the need to adjust the machine midway. Reduce the difficulty of polishing and improve the polishing efficiency; (5) The workpiece polishing method in the embodiment of this specification uses different polishing molds to perform partitioned polishing of the workpiece, which reduces the processing difficulty of a single polishing mold. It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

Those skilled in the art should understand that the above embodiments are only for illustrating the present invention and do not limit the present invention. Any modifications, equivalent substitutions and changes made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims (24)

1. A mold processing method, characterized by including:

   Obtaining first surface information of the first mold, which is produced based on the initial processing information;

   Obtain compensation information based on the first surface information and target surface information;

   Generate target processing information based on the initial processing information and the compensation information;

   A standard mold is prepared based on the target processing information, and the standard mold includes a mold body and a covering layer.
2. The mold processing method of claim 1, wherein preparing a standard mold based on the target processing information includes:

   Turn the initial mold based on the target processing information to obtain the mold body;

   Attach the covering layer to the mold body;

   The covering layer is turned based on the target processing information to prepare the standard mold.
3. The mold processing method according to claim 2, wherein attaching the covering layer to the mold body includes:

   heating the mold body;

   The covering layer is compacted with the heated mold body so that the covering layer adheres to the mold body.
4. The mold processing method according to claim 3, wherein the mold body is heated by a heating coil, and the mold body to be heated is placed in the heating coil.
5. The mold processing method according to claim 4, wherein the heating temperature of the heating coil is 160°C to 200°C.
6. The mold processing method according to claim 3, characterized in that the covering layer and the heated mold body are compacted by a pressurized platen tooling, and the curvature of the pressure surface of the platen tooling is consistent with that of the mold. The curvature of the pressure-bearing surface of the body matches.
7. The mold processing method according to claim 6, characterized in that the pressure range of the pressure plate tooling is 0.1Mpa～0.8Mpa.
8. The mold processing method according to claim 1, wherein the compensation information includes body compensation information and edge extension information; and obtaining the compensation information based on the first surface information and target surface information includes:

   Based on the comparison between the first surface information and the target surface information, obtain body compensation information corresponding to the first mold body;

   Based on the data trend of the first surface information, edge extension information corresponding to the edge of the first mold is obtained.
9. The mold processing method of claim 1, wherein generating target processing information based on the initial processing information and the compensation information includes:

   Generate processing information to be verified based on the initial processing information and the compensation information;

   Obtain the second surface information of the second mold, which is produced based on the processing information to be verified;

   Based on the second surface information and the target surface information, determine whether the surface error of the second mold is within a preset value range;

   If so, the processing information to be verified is determined to be the target processing information.
10. A mold processing system, characterized in that the system includes:

    a surface information acquisition module configured to acquire first surface information of the first mold, which is produced based on the initial processing information;

    a compensation information acquisition module configured to obtain compensation information based on the first surface information and the target surface information;

    a processing information generation module configured to generate target processing information based on the initial processing information and the compensation information; and

    A processing module configured to prepare a standard mold based on the target processing information, where the standard mold includes a mold body and a covering layer.
11. A workpiece polishing method, characterized in that the method includes:

    determining at least a first polished area and a second polished area of the workpiece;

    Polish the first polishing area using a first polishing mold; and

    Use a second polishing mold to polish the second polishing area;

    Wherein, the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii.
12. The workpiece polishing method according to claim 11, characterized in that the curvature of the surface to be polished in the first polishing area matches the curvature of the polishing surface of the first polishing mold; the curvature of the surface to be polished in the second polishing area Matching with the curvature of the polishing surface of the second polishing mold.
13. The workpiece polishing method according to claim 11, characterized in that the first polishing mold has first polishing parameters, the first polishing parameters at least include a first swing parameter and a first pressure parameter; the second The polishing mold has second polishing parameters, the second polishing parameters include at least a second swing parameter and a second pressure parameter; the first polishing parameter is different from the second polishing parameter.
14. The workpiece polishing method according to claim 11, wherein the first polishing mold and/or the second polishing mold are standard molds, and the standard molds include a mold body and a covering layer.
15. The workpiece polishing method according to claim 14, wherein the preparation of the standard mold includes:

    Obtaining first surface information of the first mold, which is produced based on the initial processing information;

    Obtain compensation information based on the first surface information and target surface information;

    Generate target processing information based on the initial processing information and the compensation information;

    A standard mold is prepared based on the target processing information, and the standard mold includes a mold body and a covering layer.
16. The workpiece polishing method according to claim 15, wherein preparing a standard mold based on the target processing information includes:

    Turn the initial mold based on the target processing information to obtain the mold body;

    Attach the covering layer to the mold body;

    The covering layer is turned based on the target processing information to prepare the standard mold.
17. The workpiece polishing method according to claim 11, wherein determining at least the first polishing area and the second polishing area of the workpiece includes:

    Determining the shape characteristics of the polished area of the workpiece;

    Pre-polishing a polished area of a test workpiece selected from the workpiece based on the shape characteristics;

    At least a first polishing area and a second polishing area of the workpiece are determined based on pre-polishing results.
18. The workpiece polishing method according to claim 17, wherein the pre-polishing result includes parameter information after pre-polishing the polished area of the test workpiece; the parameter information includes polishing removal rate; the parameter information is obtained by It is determined by comparing the shape characteristics of the polished area of the test workpiece before and after pre-polishing.
19. The workpiece polishing method according to claim 18, wherein pre-polishing the polishing area of the test workpiece based on the shape characteristics includes:

    Pre-polishing the polished area of the test workpiece based on the overall polishing strategy to prepare the first test workpiece;

    Obtain first parameter information of the first test workpiece.
20. The workpiece polishing method according to claim 19, wherein determining at least the first polishing area and the second polishing area of the workpiece based on the pre-polishing result includes:

    Based on the first parameter information and the preset threshold condition, at least a first polishing area and a second polishing area of the workpiece are determined.
21. The workpiece polishing method according to claim 19, wherein pre-polishing the polishing area of the test workpiece based on the shape characteristics further includes:

    Generate a first partition polishing strategy based on the first parameter information and preset threshold conditions;

    Pre-polishing the polishing area of the test workpiece based on the first partition polishing strategy to prepare a second test workpiece;

    Obtain second parameter information of the second test workpiece.
22. The workpiece polishing method according to claim 21, wherein determining at least the first polishing area and the second polishing area of the workpiece based on the pre-polishing results includes:

    Determine whether the second parameter information meets a preset threshold condition;

    If so, at least a first polishing area and a second polishing area of the workpiece are determined based on the first zoned polishing strategy.
23. The workpiece polishing method according to any one of claims 19 to 22, wherein the pre-polishing of the test workpiece is performed by using a pre-polishing tool, and the polishing surface shape characteristics of the pre-polishing tool are based on the workpiece. The shape characteristics of the polishing area and the corresponding polishing strategy are determined.
24. A workpiece polishing system, characterized in that the system includes:

    The polishing area determination module is configured as:

    determining at least a first polished area and a second polished area of the workpiece;

    Polishing module, configured as:

    Use a first polishing mold to polish the first polishing area;

    Use a second polishing mold to polish the second polishing area;

    Wherein, the polishing surface of the first polishing mold and the polishing surface of the second polishing mold have different curvature radii.