WO2023236364A1 - Écran d'affichage, procédé de préparation pour écran d'affichage et appareil d'affichage - Google Patents

Écran d'affichage, procédé de préparation pour écran d'affichage et appareil d'affichage Download PDF

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Publication number
WO2023236364A1
WO2023236364A1 PCT/CN2022/114845 CN2022114845W WO2023236364A1 WO 2023236364 A1 WO2023236364 A1 WO 2023236364A1 CN 2022114845 W CN2022114845 W CN 2022114845W WO 2023236364 A1 WO2023236364 A1 WO 2023236364A1
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WIPO (PCT)
Prior art keywords
layer
light
substrate
sub
display panel
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PCT/CN2022/114845
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English (en)
Chinese (zh)
Inventor
刘梓钰
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昆山国显光电有限公司
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Publication of WO2023236364A1 publication Critical patent/WO2023236364A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present application belongs to the technical field of electronic products, and in particular relates to a display panel, a display panel preparation method and a display device.
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • patterned cathode technology Due to the limitations of the existing film layer structure, it is used for molding and patterning.
  • the metal layer of the cathode has poor flatness and requires an additional planarization layer, which affects the overall thickness of the display panel.
  • Embodiments of the present application provide a display panel, a display panel preparation method, and a display device. Compared with display panels in the prior art, a separate thin film deposition is not required to serve as a planarization layer for the light-shielding layer, and the sub-substrate layer is flat. The thickness is good, while ensuring the overall thickness of the display panel, it simplifies the production process and reduces the cost.
  • embodiments of the present application provide a display panel having a first display area and a second display area at least partially surrounding the first display area.
  • the light transmittance of the first display area is greater than that of the second display area.
  • the display panel includes: a substrate, the substrate includes at least two laminated sub-substrate layers; a light-shielding layer, at least partially located in the first display area, the light-shielding layer is provided in any between two adjacent sub-substrate layers, and the light-shielding layer includes a patterned first opening; a conductive layer is provided on one side of the substrate, and the conductive layer has and the first The second opening corresponding to the opening.
  • the substrate includes a first sub-substrate layer and a second sub-substrate layer arranged in a stack, and the light-shielding layer is provided between the first sub-substrate layer and the second sub-substrate layer. , and a portion of at least one of the first sub-substrate layer and the second sub-substrate layer is filled in the first opening of the light-shielding layer.
  • the present application further includes an array layer, the array layer is provided between the substrate and the conductive layer, the array layer includes a pixel circuit, and the first opening is on the substrate.
  • the orthographic projection and the orthographic projection of the pixel circuit on the substrate do not overlap.
  • the present application also includes a light-emitting layer provided on a side of the array layer facing away from the substrate.
  • the light-emitting layer includes a first electrode layer and an organic light-emitting layer stacked along the thickness direction of the display panel. and a second electrode layer, at least part of which is reused as the conductive layer.
  • the first electrode layer includes first electrode blocks, and an orthographic projection of the first opening on the first electrode layer at least partially falls within a gap between the first electrode blocks.
  • the thickness of the light-shielding layer is less than or equal to the thickness of the sub-substrate layer; preferably, the thickness of the light-shielding layer is 5 ⁇ m to 15 ⁇ m; and the thickness of the sub-substrate layer is 10 ⁇ m to 20 ⁇ m.
  • the light-shielding layer is a single metal layer; or the light-shielding layer is a composite metal layer including at least two layers of metal; preferably, the light-shielding layer includes silver, copper, aluminum, indium or At least one of titanium, aluminum and titanium.
  • the display panel has a first display area and a second display area that at least partially surrounds the first display area.
  • the light transmission of the first display area is The light transmittance is greater than the light transmittance of the second display area, including: providing a substrate, the substrate including at least two sub-substrate layers arranged in a stack, and between any two adjacent sub-substrate layers Forming a light-shielding layer, the light-shielding layer is at least partially located in the first display area, and the light-shielding layer includes a patterned first opening; forming a conductive layer to be processed on one side of the substrate; using the light-shielding layer The conductive layer to be processed is etched for shielding, so that the conductive layer to be processed forms a second opening corresponding to the first opening.
  • the step of etching the conductive layer to be processed using the light-shielding layer as a shield includes: using the light-shielding layer as a shield to etch the conductive layer to be processed through a laser etching process.
  • the conductive layer to be processed is etched.
  • a display device including: a display panel, the display panel being the display panel described in any of the above embodiments; an optical element corresponding to the first display area of the display panel set up.
  • the display panel provided by the embodiment of the present application includes a substrate, a light-shielding layer and a conductive layer.
  • the substrate includes at least two sub-substrate layers that are stacked on top of each other.
  • the light-shielding layer is provided on any two adjacent layers. Between the sub-substrate layers, that is, at least the upper and lower surfaces of the light-shielding layer are covered by the sub-substrate layer. Since the sub-substrate layer is usually made of flexible material, it has certain fluidity and good flatness, so the sub-substrate layer covering the light-shielding layer can It plays the role of a planarizing layer.
  • the sub-substrate layer is used as the planarizing layer of the light-shielding layer.
  • the sub-substrate layer has good flatness and ensures the overall thickness of the display panel. At the same time, the production process is simplified and the cost is reduced.
  • the sub-substrate layer since the upper and lower surfaces of the light-shielding layer are covered by the sub-substrate layer, that is, the light-shielding layer is located inside the substrate, and the substrate has a certain thickness, when the display panel is bent or bent, the sub-substrate layer can effectively absorb the light-shielding layer due to bending.
  • the stress generated by folding or bending is more conducive to releasing the stress of the light-shielding layer itself, and the light-shielding layer has better reliability performance.
  • Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • Figure 2 is a structural diagram of the film layer at B-B in Figure 1;
  • Figure 3 is a schematic diagram of an optical path of a display panel provided by an embodiment of the present application.
  • Figure 4 is a flow chart of a display panel preparation method provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display panel preparation method provided by an embodiment of the present application.
  • Embodiments of a display panel, a display panel preparation method and a display device will be described below with reference to FIGS. 1 to 5 of the accompanying drawings.
  • Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application
  • Figure 2 is a structural diagram of the film layer at B-B in Figure 1
  • Figure 3 is a schematic structural diagram of a display panel provided by an embodiment of the present application. Schematic diagram of the light path of the display panel.
  • a display panel provided by an embodiment of the present application has a first display area AA1 and a second display area AA2 that at least partially surrounds the first display area AA1.
  • the light transmittance of the first display area AA1 is greater than the transmittance of the second display area AA2.
  • the light rate includes: a substrate 1, which includes at least two laminated sub-substrate layers; a light-shielding layer 2, which is at least partially located in the first display area AA1, and the light-shielding layer 2 is provided on any two adjacent layers between the sub-substrate layers, and the light-shielding layer 2 includes a patterned first opening K1; the conductive layer C is provided on one side of the substrate 1, and the conductive layer C has a second opening K2 corresponding to the first opening K1.
  • the display panel provided by the embodiment of the present application includes a substrate 1, a light-shielding layer 2 and a conductive layer C.
  • the substrate 1 includes at least two laminated sub-substrate layers, and the light-shielding layer 2 is provided on any two adjacent sub-substrate layers. Between the substrate layers, that is, at least the upper and lower surfaces of the light-shielding layer 2 are covered by the sub-substrate layer. Since the sub-substrate layer is usually made of flexible material and has certain fluidity and good flatness, the sub-substrate layer covering the light-shielding layer 2 can It plays the role of a planarization layer. Compared with the display panel in the prior art, no separate thin film deposition is required.
  • the sub-substrate layer is used as the planarization layer of the light-shielding layer 2.
  • the sub-substrate layer has good flatness and ensures the overall display panel. While reducing the thickness, it simplifies the production process and reduces costs.
  • the sub-substrate layer can effectively absorb light when the display panel is bent or bent.
  • the stress generated by the bending or bending of layer 2 is more conducive to releasing the stress of the light-shielding layer 2 itself, and the light-shielding layer 2 has better reliability performance.
  • the substrate 1 is mainly used to support the device disposed thereon, and its material may be polyimide, polystyrene, polyethylene terephthalate, polyparaxylene, or polyether. Sulfone or polyethylene naphthalate, etc. It can also be other silicone rubber materials with a light transmittance of more than 90%, or other organic rubber materials with a slightly lower light transmittance (greater than 80%) and a slightly higher bending strength, which is not limited in this embodiment.
  • the light-shielding layer 2 can be made of a material such as metal that has good light-shielding properties and can absorb a certain amount of heat. When using a laser to etch the conductive layer C, it can be used as a mask so that the conductive layer C can form the required pattern shape. Moreover, the light-shielding layer 2 can also play a role in absorbing laser heat and protecting the pixel circuit T.
  • the first display area AA1 is a light-transmitting area used for setting optical elements F such as cameras.
  • the light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2, so that the corresponding optical element F Receive enough incoming light to ensure its imaging effect.
  • the light-shielding layer 2 in the embodiment of the present application is provided between any two adjacent sub-substrate layers. Compared with the prior art, In the solution where the light-shielding layer 2 is disposed between the substrate 1 and the array layer 3, the light-shielding layer 2 in the embodiment of the present application is closer to the optical element F, and the viewing angle is increased.
  • the substrate 1 includes a stacked first sub-substrate layer 11 and a second sub-substrate layer 12, and the light-shielding layer 2 is provided between the first sub-substrate layer 11 and the second sub-substrate layer 12. , and at least one of the first sub-substrate layer 11 and the second sub-substrate layer 12 is partially filled in the first opening K1 of the light-shielding layer 2 .
  • the substrate 1 includes two sub-substrate layers, the first sub-substrate layer 11 and the second sub-substrate layer 12. Since the light-shielding layer 2 has a first opening K1 to facilitate the passage of laser light, In order to ensure that the flatness of each film layer on the light-shielding layer 2 is not affected by the first opening K1, at least one of the first sub-substrate layer 11 and the second sub-substrate layer 12 is partially filled in the first opening of the light-shielding layer 2 K1, it can be understood that the first sub-substrate layer 11 and the second sub-substrate layer 12 are made of light-transmitting materials, so a part of at least one of the first sub-substrate layer 11 and the second sub-substrate layer 12 is The first opening K1 filled in the light-shielding layer 2 will not affect the passage of laser light in the first opening K1.
  • part of the second sub-substrate layer 12 can be filled in the first opening K1 of the light-shielding layer 2 , and the second sub-substrate layer 12 is provided on the side of the light-shielding layer 2 close to the conductive layer C.
  • the second sub-substrate layer 12 that is, the sub-substrate layer covering the upper surface of the light-shielding layer 2 , makes it easier for the second sub-substrate layer 12 to fill the first opening K1 under the action of gravity.
  • part of the first sub-substrate layer 11 can also be filled in the first opening K1 of the light-shielding layer 2 , or parts of both the first sub-substrate layer 11 and the second sub-substrate layer 12 can be filled in the first opening K1 of the light-shielding layer 2 .
  • opening K1 There is no special limit for opening K1 and can be selected according to the actual process.
  • the display panel further includes an array layer 3.
  • the array layer 3 is provided between the substrate 1 and the conductive layer C.
  • the array layer 3 includes a pixel circuit T, and the first opening K1 is on the front side of the substrate.
  • the projection and the orthographic projection of the pixel circuit T on the substrate 1 do not overlap.
  • the laser when using a laser to etch the conductive layer C, the laser will emit from the first opening K1.
  • the orthographic projection of the first opening K1 on the substrate 1 and the pixel circuit T on the substrate does not overlap to prevent the laser emitted from the first opening K1 from irradiating the pixel circuit T, thereby preventing the laser from causing thermal damage to the thin film transistor or wiring of the pixel circuit T.
  • the sub-substrate layer can also play a role.
  • the function of the thermal buffer layer is to absorb part of the heat, further reduce the heat loss of the T device of the pixel circuit, and improve the reliability of the T device of the pixel circuit.
  • the thin film transistor of the pixel circuit T includes an active layer Y, a gate electrode G, a source electrode S, and a drain electrode D.
  • the materials of the drain electrode D, the source electrode S, and the gate electrode G may include molybdenum, titanium, aluminum, or copper. One or a combination of more of these.
  • the gate G of the thin film transistor is usually used to receive a control signal, so that the thin film transistor is turned on or off under the control of the control signal.
  • the display panel also includes a luminescent layer 4 provided on the side of the array layer 3 facing away from the substrate 1.
  • the luminescent layer 4 includes laminated layers arranged along the thickness direction of the display panel.
  • the first electrode layer 41, the organic light-emitting layer 42 and the second electrode layer 43 are reused as the conductive layer C at least in part.
  • At least part of the second electrode layer 43 is reused as the conductive layer C, that is, at least part of the second electrode layer 43 located in the first display area AA1 is patterned, such as laser etching. process to form a second opening K2 corresponding to the first opening K1 to increase the amount of external ambient light entering the under-screen optical element F through the second opening K2, that is, to increase the transmittance of the second electrode layer 43 in the first display area AA1 light rate.
  • the material of the second electrode layer 43 generally uses a material with a lower work function to facilitate electron injection. In addition, it can also reduce the heat generated during operation and extend the service life of the OLED device.
  • the material of the second electrode layer 43 may be one of metal materials such as silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca) or indium (In), It can also be an alloy of the aforementioned metal materials, such as magnesium-silver alloy (Mg/Ag), lithium-aluminum alloy (Li/Al), which is not limited in this embodiment.
  • the material of the first electrode layer 41 is generally a material with a high work function in order to improve the hole injection efficiency, and can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), or indium tin oxide (ITO). , zinc tin oxide (IZO) or transparent conductive polymer (such as polyaniline), etc.
  • the first electrode layer 41 includes first electrode blocks, and the orthographic projection of the first opening K1 on the first electrode layer 41 at least partially falls within the interval between the first electrode blocks.
  • the first electrode layer 41 is provided between the light shielding layer 2 and the second electrode layer 43, that is, the laser light emitted from the light shielding layer 2 will pass through the first electrode layer 41 and then be emitted to the second electrode layer 43, and Each first electrode block of the first electrode layer 41 is arranged at intervals.
  • the orthographic projection of the first opening K1 on the first electrode layer 41 at least partially falls between the first electrode blocks. within the interval.
  • the orthographic projection of the first opening K1 on the first electrode layer 41 all falls within the interval between the first electrode blocks. Since the first electrode layer 41 is usually made of opaque metal, therefore, The first electrode layer 41 can also play a certain role as a mask.
  • the thickness of the light-shielding layer 2 is less than or equal to the thickness of the sub-substrate layer. It can be understood that the thickness of the light-shielding layer 2 should not be too large. If it is too large, it will affect the bending performance and reduce the sub-substrate layer. When the thickness of is set to be greater than the thickness of the light-shielding layer 2, the sub-substrate layer can be effectively utilized to absorb the bending stress generated when the light-shielding layer 2 is bent or bent.
  • the thickness of the light-shielding layer 2 is 5 ⁇ m-15 ⁇ m; the thickness of the sub-substrate layer is 10 ⁇ m-20 ⁇ m.
  • the light-shielding layer 2 is a single metal layer; or, the light-shielding layer 2 is a composite metal layer including at least two layers of metal.
  • the light-shielding layer 2 since the light-shielding layer 2 is used to block laser light, it needs to have good light-shielding and heat-insulating properties.
  • the light-shielding layer 2 includes at least one of silver, copper, aluminum, indium or titanium, aluminum, and titanium. .
  • an embodiment of the present application also provides a method for manufacturing a display panel.
  • the display panel has a first display area AA1 and a second display area AA2 that at least partially surrounds the first display area AA1.
  • the transparent area of the first display area AA1 is The light rate is greater than the light transmittance of the second display area AA2, including:
  • the substrate 1 includes at least two laminated sub-substrate layers, and a light-shielding layer 2 is formed between any two adjacent sub-substrate layers.
  • the light-shielding layer 2 is at least partially located in the first display area. AA1, and the light-shielding layer 2 includes a patterned first opening K1;
  • the display panel preparation method provided by the embodiment of the present application is to dispose the light-shielding layer 2 between any two adjacent sub-substrate layers, that is, at least the upper and lower surfaces of the light-shielding layer 2 are covered by the sub-substrate layers. Since the sub-substrate layers The bottom layer is usually made of flexible material, which itself has certain fluidity and good flatness. Therefore, the sub-substrate layer covering the light-shielding layer 2 can play the role of a flattening layer. Compared with the display panel in the prior art, a separate film is not required.
  • the sub-substrate layer has good flatness, which not only ensures the overall thickness of the display panel, but also simplifies the production process and reduces the cost.
  • the sub-substrate layer can effectively absorb the light when the display panel is bent or bent.
  • the stress generated by the bending or bending of the light-shielding layer 2 is more conducive to releasing the stress of the light-shielding layer 2 itself, and the light-shielding layer 2 has better reliability performance.
  • a sub-substrate layer may be formed first, and then the light-shielding layer 2 may be formed on the sub-substrate layer, and then another sub-substrate layer may be formed on the light-shielding layer 2.
  • the upper sub-substrate layer may be partially filled during formation.
  • the first opening K1 of the light-shielding layer 2 is used to improve the flatness of the film layer.
  • the conductive layer C to be processed specifically refers to a whole layer of conductive layer C that has not been patterned, that is, the conductive layer C has not yet formed the second opening K2.
  • step S130 the light-shielding layer 2 is used as a mask to form the second opening K2 corresponding to the first opening K1 on the conductive layer C to be processed, that is, the conductive layer C to be processed is patterned.
  • the step of etching the conductive layer C to be processed with the light-shielding layer 2 as a shield includes: using a laser etching process to etch the conductive layer C with the light-shielding layer 2 as a shield. etching.
  • the basic principle of laser etching is to focus a low-power laser beam with high beam quality (usually ultraviolet laser, fiber laser) into a very small spot, forming a very high power density at the focus, causing the material to vaporize and evaporate in an instant.
  • the material of the processed conductive layer C corresponding to the position of the first opening K1 is removed to form the second opening K2.
  • An embodiment of the present application also provides a display device, including: a display panel, which is the display panel in any of the above embodiments; and the optical element F is provided corresponding to the first display area AA1 of the display panel.
  • the optical element F in the embodiment of the present application can be a camera, a fingerprint recognition element, a face recognition element, etc.
  • the display device provided by the embodiments of the present application has the technical effects of the technical solution of the display panel in any of the above embodiments.
  • the structures and terminology that are the same as or corresponding to the above embodiments will not be described again here.
  • the display device provided by the embodiment of the present application can be applied to mobile phones or any electronic product with a display function, including but not limited to the following categories: televisions, notebook computers, desktop monitors, tablet computers, digital cameras, smart phones Rings, smart glasses, vehicle-mounted displays, medical equipment, industrial control equipment, touch interactive terminals, etc.
  • the embodiments of this application do not specifically limit this.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

La présente invention concerne un écran d'affichage, un procédé de préparation pour un écran d'affichage et un appareil d'affichage. L'écran d'affichage est pourvu d'une première zone d'affichage, et d'une seconde zone d'affichage, qui entoure au moins partiellement la première zone d'affichage, le facteur de transmission de lumière de la première zone d'affichage étant supérieur au facteur de transmission de lumière de la seconde zone d'affichage. L'écran d'affichage comprend: une base, qui comprend au moins deux sous-couches de base agencées en superposition; une couche de protection contre la lumière, qui est au moins partiellement située dans la première zone d'affichage, est disposée entre deux sous-couches de base adjacentes quelconques, et comprend une première ouverture à motifs; et une couche conductrice, qui est disposée sur un côté de la base, et est pourvue d'une seconde ouverture correspondant à la première ouverture. Les sous-couches de base agissent comme couches de planarisation de la couche de protection contre la lumière, et la planéité des sous-couches de base est bonne, de sorte que l'épaisseur globale de l'écran d'affichage est garantie, et un processus de production est également simplifié, permettant ainsi d'en réduire le coût. Les sous-couches de base peuvent absorber efficacement la contrainte générée par le pliage ou la flexion de la couche de protection contre la lumière, de sorte que la contrainte de la couche de protection contre la lumière elle-même peut être mieux relâchée, et la couche de protection contre la lumière présente une meilleure performance de fiabilité.
PCT/CN2022/114845 2022-06-10 2022-08-25 Écran d'affichage, procédé de préparation pour écran d'affichage et appareil d'affichage WO2023236364A1 (fr)

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CN202210650380.8A CN114927551A (zh) 2022-06-10 2022-06-10 显示面板、显示面板制备方法及显示装置
CN202210650380.8 2022-06-10

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CN114927551A (zh) * 2022-06-10 2022-08-19 昆山国显光电有限公司 显示面板、显示面板制备方法及显示装置

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CN114927551A (zh) * 2022-06-10 2022-08-19 昆山国显光电有限公司 显示面板、显示面板制备方法及显示装置

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CN108445668A (zh) * 2018-03-09 2018-08-24 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN113594210A (zh) * 2021-07-28 2021-11-02 昆山国显光电有限公司 显示面板及其制作方法
CN114267685A (zh) * 2021-12-14 2022-04-01 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN114512520A (zh) * 2022-02-07 2022-05-17 武汉华星光电半导体显示技术有限公司 显示面板和显示装置
CN114927551A (zh) * 2022-06-10 2022-08-19 昆山国显光电有限公司 显示面板、显示面板制备方法及显示装置

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