WO2023231994A9 - 过滤装置及电子设备 - Google Patents

过滤装置及电子设备 Download PDF

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Publication number
WO2023231994A9
WO2023231994A9 PCT/CN2023/096967 CN2023096967W WO2023231994A9 WO 2023231994 A9 WO2023231994 A9 WO 2023231994A9 CN 2023096967 W CN2023096967 W CN 2023096967W WO 2023231994 A9 WO2023231994 A9 WO 2023231994A9
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WO
WIPO (PCT)
Prior art keywords
layer
hole
filter
electronic device
filter layer
Prior art date
Application number
PCT/CN2023/096967
Other languages
English (en)
French (fr)
Other versions
WO2023231994A1 (zh
Inventor
林楠
赵梦龙
何谦
杨文建
张珂珉
刘壮
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023231994A1 publication Critical patent/WO2023231994A1/zh
Publication of WO2023231994A9 publication Critical patent/WO2023231994A9/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/50—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition
    • B01D29/56—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection
    • B01D29/58—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection arranged concentrically or coaxially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks

Definitions

  • the embodiments of the present application relate to the technical field of terminal equipment, and specifically to a filtering device and an electronic device.
  • the electronic device also includes a housing and a waterproof membrane.
  • the housing is provided with a functional hole running through it.
  • the microphone is provided on the housing, and the microphone is arranged toward the functional hole.
  • the functional hole is blocked by a waterproof membrane. When working, sound waves pass through the functional hole and the waterproof membrane to be received by the microphone.
  • the waterproof membrane can prevent external water from entering through the functional hole, thereby achieving the sealing of the housing.
  • the embodiments of the present application provide a filtering device and an electronic device, which aim to solve the problem that particles in water can easily damage the waterproof membrane, causing the shell sealing failure.
  • an embodiment of the present application provides a filtering device for being arranged on an electronic device.
  • the electronic device comprises:
  • a shell having an inner surface and an outer surface opposite to the inner surface, and the shell is provided with a functional hole penetrating the inner surface and the outer surface;
  • the filtering device comprises:
  • a first filter layer the first filter layer is located outside the outer surface, and the first filter layer covers the functional hole, and a plurality of first mesh holes are arranged at intervals on the first filter layer;
  • a second filter layer the second filter layer is located between the outer surface and the first filter layer, and the second filter layer covers the functional holes, and a plurality of second mesh holes are arranged at intervals on the second filter layer;
  • a cross-sectional area of the first mesh is greater than a cross-sectional area of the second mesh.
  • the filtering device further comprises:
  • the first bonding layer is arranged between the first filter layer and the second filter layer adjacent thereto, and between adjacent second filter layers, and the first bonding layer is provided with a first through hole communicating with the functional hole.
  • the filtering device further comprises:
  • the first supporting layer is arranged between the second filtering layer and the outer surface, and the first supporting layer is in contact with the outer surface; the first supporting layer is provided with a second through hole communicating with the functional hole.
  • the first filter layer is a rigid filter layer.
  • the two second filter layers are stacked, the first filter layer is located between the two second filter layers, and along the direction away from the outer surface, in the cross-section parallel to the first filter layer, the cross-sectional area of the second mesh on each second filter layer gradually increases.
  • the filtering device further comprises:
  • a first bonding layer is provided between the first filter layer and the second filter layer, and a first through hole communicating with the functional hole is provided on the first bonding layer.
  • the filtering device further comprises:
  • cover plate wherein the cover plate covers the outer surface, the first filter layer and the second filter layer are located between the cover plate and the outer surface, and a third through hole communicating with the functional hole is provided on the cover plate;
  • the cover plate is connected to the shell.
  • the filtering device further comprises:
  • a second bonding layer wherein the second bonding layer is disposed between the cover plate and the first filter layer, and a fourth through hole communicating with the functional hole is disposed on the second bonding layer.
  • a first groove is provided on the surface of the cover plate facing the housing, and at least a portion of the first filter layer is accommodated in the first groove.
  • a second groove is provided on the outer surface, and at least a portion of the second filter layer is accommodated in the second groove.
  • the electronic device further includes a sound module, the sound module is disposed on the inner surface, and the sound module is disposed in the functional hole.
  • an embodiment of the present application further provides an electronic device, including:
  • a shell having an inner surface and an outer surface opposite to the inner surface, and the shell is provided with a functional hole penetrating the inner surface and the outer surface;
  • a waterproof component is arranged on the functional hole, and the waterproof component is used to prevent liquid from passing through the functional hole;
  • the waterproof component is disposed on the inner surface, and the waterproof component includes:
  • a waterproof membrane, a third adhesive layer, a second supporting layer and a fourth adhesive layer are stacked in a direction away from the inner surface, the third adhesive layer is provided with a fifth through hole, the fourth adhesive layer is provided with a sixth through hole, and the fifth through hole and the sixth through hole are both connected to the functional hole;
  • a plurality of first holes are arranged at intervals in an area of the second supporting layer facing the functional hole.
  • the waterproof component further includes a buffer layer, the buffer layer is arranged on a side of the fourth bonding layer away from the inner surface, and a seventh through hole connected to the functional hole is provided on the buffer layer.
  • the waterproof assembly further includes:
  • a fifth bonding layer wherein the fifth bonding layer is disposed between the waterproof membrane and the inner surface, and an eighth through hole connected to the functional hole is disposed on the fifth bonding layer.
  • the waterproof assembly further includes:
  • the third supporting layer being arranged on the inner surface, and the third supporting layer being provided with a containing channel communicating with the functional hole;
  • the waterproof membrane is accommodated in the accommodating channel, and the edge of the waterproof membrane is in contact with the side wall of the accommodating channel; there is a gap between the waterproof membrane and the inner surface.
  • the second supporting layer is in contact with a surface of the third supporting layer facing away from the inner surface.
  • the third support layer includes a silicone layer.
  • the second supporting layer and the third supporting layer are an integral structure.
  • a sealing ring is provided between the third supporting layer and the shell, and the sealing ring is provided around the functional hole.
  • the waterproof assembly further includes:
  • An auxiliary supporting layer is provided between the third supporting layer and the inner surface, and a plurality of second holes are provided at intervals in the area of the auxiliary supporting layer facing the functional hole; the gap is located between the waterproof membrane and the auxiliary supporting layer.
  • the auxiliary supporting layer and the third supporting layer are an integral structure.
  • a sixth bonding layer is arranged between the third supporting layer and the second supporting layer, a ninth through hole is arranged on the sixth bonding layer, the third bonding layer is located in the ninth through hole, and the third bonding layer is bonded to the hole wall of the ninth through hole.
  • the waterproof assembly further includes:
  • a protective layer is provided on the surface of the waterproof membrane facing the inner surface, and a via hole connected to the functional hole is provided on the protective layer.
  • a first receiving groove is provided on the inner surface, and the waterproof component is provided in the first receiving groove.
  • the waterproof component is disposed on the outer surface, and the waterproof component includes:
  • a third adhesive layer, a waterproof film and a protective layer are stacked in a direction away from the outer surface, the third adhesive layer is provided with a fifth through hole connected to the functional hole, and the protective layer is provided with a via hole facing the functional hole.
  • the waterproof component also includes a second supporting layer, the second supporting layer is arranged between the third bonding layer and the outer surface, and a plurality of first holes are spaced apart in an area of the second supporting layer facing the functional hole.
  • a second receiving groove is provided on the outer surface, and the waterproof component is provided in the second receiving groove.
  • the electronic device further includes a sound module, the sound module The sound module is arranged on the inner surface, and the sound module is arranged in the functional hole.
  • the first filter layer is arranged outside the outer surface of the housing, and a plurality of first mesh holes are arranged at intervals on the first filter layer.
  • the second filter layer is arranged between the outer surface and the first filter layer, and a plurality of second mesh holes are arranged at intervals on the second filter layer, and the first filter layer and the second filter layer both cover the functional holes on the housing.
  • the first filter layer and the second filter layer can filter the water entering the functional holes to prevent impurities such as particles in the water from entering the functional holes; in a deep water environment, impurities such as particles can be prevented from damaging the waterproof membrane, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure and increasing the water depth of use of the electronic device.
  • FIG1 is a back view of a smart watch
  • FIG2 is a schematic diagram of the structure of a waterproof component in the related art
  • FIG3 is a first structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG4 is a schematic diagram of the connection between the first filter layer and the cover plate in the filter device provided in an embodiment of the present application;
  • FIG5 is a partial enlarged view of point A in FIG4 ;
  • FIG6 is an exploded view of the first filter layer and the second filter layer in FIG4 ;
  • FIG7 is a second structural schematic diagram of an electronic device provided in an embodiment of the present application.
  • FIG8 is a second schematic diagram of the connection between the first filter layer and the cover plate in the filter device provided in an embodiment of the present application;
  • FIG9 is a partial enlarged view of point B in FIG8 ;
  • FIG10 is an exploded view of the first filter layer and the second filter layer in FIG8 ;
  • FIG11 is a partial enlarged view of point C in FIG8 ;
  • FIG12 is a schematic diagram of the structure of a housing in an electronic device provided in an embodiment of the present application.
  • FIG13 is a schematic diagram of a structure in which a first filter layer is disposed between two second filter layers in a filter device provided in an embodiment of the present application;
  • FIG14 is a third structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG15 is a fourth structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG16 is a fifth structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG17 is a sixth structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG18 is a seventh structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG. 19 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.
  • the smart watch includes a housing 20, a microphone, and a waterproof component.
  • the housing 20 is provided with a functional hole 203, the microphone is provided in the functional hole, and the waterproof component is used to block the functional hole to prevent water from passing through while allowing sound waves to pass through, thereby sealing the functional hole 203.
  • the waterproof component 30 includes a waterproof membrane 301, a steel sheet 310, and a foam 320 which are stacked.
  • An adhesive layer 330 is provided between the waterproof membrane 301 and the housing 20, between the waterproof membrane 301 and the steel sheet 310, and between the steel sheet 310 and the foam 320 to fix each membrane layer.
  • the steel sheet 310 is provided with a plurality of holes. Since the waterproof membrane 301 has a microporous structure, sound waves from the outside can pass through the microporous structure, and pass through the holes and functional holes in sequence, and then be received by the microphone; and water has a certain surface tension and is difficult to pass through the microporous structure, thereby achieving a seal between the housing 20 and the outside.
  • the present application embodiment provides a filtering device 10 applied to an electronic device, and the filtering device 10 is used to be set on the electronic device.
  • the electronic device may include: a mobile phone, a smart watch (as shown in Figure 1), a PC, a tablet computer, VR, AR, a headset and other terminal devices, and the present embodiment does not limit the electronic device.
  • the electronic device may include a housing 20, which may be a shell of the electronic device.
  • the housing 20 is arranged to form a cavity for accommodating devices such as a battery (not shown) and a circuit board (not shown) in the electronic device.
  • the housing 20 has an inner surface 201 and an outer surface 202 that are arranged opposite to each other. It can be understood that the inner surface 201 may be a surface facing the inside of the electronic device (such as the cavity wall of the cavity), and correspondingly, the outer surface 202 is a surface of the housing 20 exposed to the outside.
  • the housing 20 is provided with a functional hole 203 that passes through the inner surface 201 and the outer surface 202.
  • the functional hole 203 may be a balancing hole (such as the functional hole 203 on the left side of FIG. 3). The balancing hole can balance the air pressure inside and outside the housing so that the speaker and the microphone can work normally.
  • the functional hole 203 can also be a hole for sound waves to pass through (such as the functional hole 203 on the right side of FIG. 3 ).
  • the electronic device also includes a sound module 40, which is arranged on the inner surface 201. In other words, the sound module 40 is located The sound module 40 is disposed in the cavity, and the sound module 40 is disposed in the functional hole 203.
  • the sound module 40 may include a speaker, and accordingly, the sound module 40 may emit sound waves to the outside of the housing 20 through the functional hole 203; of course, the sound module 40 may also include a microphone, and accordingly, the sound module 40 may receive sound waves outside the housing 20 through the functional hole 203 to obtain external sound signals. This embodiment does not limit the sound module 40.
  • the filter device 10 provided in this embodiment includes a first filter layer 101, which is arranged outside the outer surface 202 (the upper side in the orientation shown in FIG3), and has a plurality of first mesh holes (not shown) arranged at intervals on the first filter layer 101.
  • the first filter layer 101 covers the functional hole 203, that is, the functional hole 203 is located inside the projection of the first filter layer 101 on the outer surface 202, so that the first filter layer 101 and the first mesh holes thereon can filter the water entering the functional hole 203 to prevent impurities such as particles in the water from entering the functional hole 203.
  • the filter device 10 further includes a second filter layer 102, which is located between the outer surface 202 and the first filter layer 101, and has a plurality of second meshes (not shown) arranged at intervals.
  • the second filter layer 102 covers the functional hole 203, that is, the functional hole 203 is located inside the projection of the second filter layer 102 on the outer surface 202, so that the second filter layer 102 and the second mesh thereon can also filter the water entering the functional hole 203, so as to further prevent impurities such as particles in the water from entering the functional hole 203.
  • Both the first filter layer 101 and the second filter layer 102 can filter the water entering the functional hole 203, so as to further prevent impurities such as particles in the water from entering the functional hole 203.
  • the cross-sectional area of the first mesh 1011 is larger than the cross-sectional area of the second mesh 1021, that is, the projection area of the first mesh 1011 on the outer surface 202 is larger than the projection area of the second mesh 1021 on the outer surface 202.
  • the first filter layer 101 can prevent impurities with larger particle sizes from passing through
  • the second filter layer 102 can prevent impurities with smaller particle sizes from passing through.
  • the accumulation of large particle size impurities can be avoided, thereby preventing the first filter layer 101 and the second filter layer 102 from being blocked.
  • the cross-sections of the first mesh 1011 and the second mesh 1021 may be regular shapes such as rectangles and circles. Of course, the cross-sections of the first mesh 1011 and the second mesh 1021 may also be irregular shapes.
  • the aperture of the first mesh 1011 may be 0.1-0.5 mm
  • the thickness of the first filter layer 101 may be 0.1-0.3 mm
  • the aperture of the second mesh may be 0.5 ⁇ m-100 ⁇ m
  • the thickness of the second filter layer 102 may be 0.05-0.1 mm.
  • the loss of sound waves passing through the first filter layer 101 and the second filter layer 102 is small; in addition, the thickness of the first filter layer 101 and the second filter layer 102 is small, which can improve the compactness of the electronic device.
  • the first filter layer 101 can be a rigid filter layer, that is, the first filter layer 101 can be composed of a material with a certain rigidity, such as a steel mesh, a perforated steel sheet, a perforated plastic plate, etc. Since the first filter layer 101 is the outermost filter layer, in this configuration, the first filter layer 101 filters relatively hard and sharp impurities (such as sand, metal particles, etc.), which can prevent impurities such as particulate matter from damaging the first filter layer 101; in addition, since the first filter layer 101 has a certain rigidity, it can play a certain supporting role for the second filter layer 102 and other membrane layers to avoid wrinkles in the second filter layer 102 and other membrane layers.
  • impurities such as sand, metal particles, etc.
  • the second filter layer 102 can be a filter layer with a certain flexibility.
  • the second filter layer 102 can include a dustproof net, and the material of the dustproof net can include polyethylene terephthalate (PET), polyether ether ketone (PEEK), etc.
  • the electronic device further includes a waterproof component 30, which is arranged on the housing 20, and the waterproof component 30 blocks the functional hole 203 to achieve the closure of the functional hole 203.
  • the waterproof component 30 can be arranged on the inner surface 201 of the housing 20, and the waterproof component 30 is located between the sound module 40 and the inner surface 201.
  • the waterproof component 30 allows sound waves to pass through, while preventing water from passing through; of course, the waterproof component 30 can also be located on the inner side of the balance hole (such as the functional hole 203 on the left side of FIG. 3 ), in which case the waterproof component 30 allows air to pass through while preventing water from passing through.
  • the waterproof component 30 may include a waterproof breathable membrane, which has a microporous structure, part of the air can pass through the microporous structure, and water has a certain surface tension that makes it difficult to pass through the microporous structure, so that the waterproof component 30 can allow sound waves and air to pass through while preventing water from passing through, thereby achieving sealing.
  • the material of the waterproof breathable membrane may include expanded polytetrafluoroethylene (expanded PTFE, referred to as e-PTFE) and the like.
  • the pore size of the microporous structure in the waterproof breathable membrane can range from 0.05 to 10 ⁇ m, for example, 0.085 ⁇ m, 0.1 ⁇ m, etc. This arrangement can improve the waterproof effect of the waterproof breathable membrane to increase the water depth of use of electronic equipment.
  • the waterproof breathable membrane can also achieve the transmission of sound waves from one side of the waterproof breathable membrane to the other side through its own vibration.
  • two functional holes 203 may be provided on the housing 20, and the corresponding sound module 40 may include a speaker 402 and a microphone 401, wherein the speaker 402 is provided toward one functional hole 203, and the microphone 401 is provided toward the other functional hole 203.
  • the speaker 402 emits sound waves to the outside of the housing 20 through the corresponding functional hole 203, and the microphone 401 receives sound waves from the outside through the corresponding functional hole 203.
  • a waterproof component 30 is provided between the speaker 402 and the inner surface 201, and between the microphone 401 and the inner surface 201, so as to achieve sealing of the two functional holes 203.
  • the filter device 10 can cover the two functional holes 203, that is, the two functional holes 203 are both located within the projections of the first filter layer 101 and the second filter layer 102 on the outer surface 202, so that the water entering the two functional holes 203 can be filtered by the first filter layer 101 and the second filter layer 102.
  • each filter device 10 there may be two filter devices 10, one of which is provided corresponding to one functional hole 203, and the other filter device 10 is provided corresponding to another functional hole 203. That is, the first filter layer 101 and the second filter layer 102 in one filter device 10 cover one functional hole 203, and the functional hole 203 is located within the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202; the first filter layer 101 and the second filter layer 102 in another filter device 10 cover another functional hole 203, and the functional hole 203 is located within the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202. In this way, each filter device 10 can filter the water entering its corresponding functional hole 203.
  • the first filter layer 101 is arranged outside the outer surface 202 of the housing 20, and a plurality of first meshes 1011 are arranged at intervals on the first filter layer 101.
  • the second filter layer 102 is arranged between the outer surface 202 and the first filter layer 101, and a plurality of second meshes 1021 are arranged at intervals on the second filter layer 102, and the first filter layer 101 and the second filter layer 102 both cover the functional holes 203 on the housing 20.
  • the first filter layer 101 and the second filter layer 102 can filter the water entering the functional holes 203 to prevent impurities such as particles in the water from entering the functional holes 203; especially in a deep water environment, impurities such as particles can be prevented from damaging the waterproof membrane 301, thereby improving the waterproof performance of the electronic device in the deep water environment, that is, improving the ability of the electronic device to withstand water pressure, and increasing the water depth of use of the electronic device.
  • the cross-sectional area of the first mesh 1011 is greater than the cross-sectional area of the second mesh 1021.
  • the first filter layer 101 can prevent impurities with larger particle sizes from passing through, and the second filter layer 102 can prevent impurities with smaller particle sizes from passing through. Compared with setting only one filter layer, accumulation of impurities with larger particle sizes can be avoided, thereby avoiding blocking of the filter layer.
  • multiple second filter layers 102 there may be multiple second filter layers 102, and multiple second filter layers 102 are stacked and arranged between the first filter layer 101 and the outer surface 202.
  • multiple second filter layers 102 can further improve the filtering effect of impurities such as particulate matter, so as to further improve the waterproof performance of the electronic device in a deep water environment and increase the water depth of use of the electronic device.
  • the cross-sectional area of the second mesh 1021 on each second filter layer 102 gradually increases.
  • the cross-sectional area of the second mesh 1021 of the second filter layer 102 close to the first filter layer 101 is greater than the cross-sectional area of the second mesh 1021 on the second filter layer 102 away from the first filter layer 101.
  • impurities with larger particle sizes stay on the second filter layer 102 close to the first filter layer 101, and impurities with smaller particle sizes stay on the second filter layer 102 away from the first filter layer 101, which can avoid the accumulation of impurities on each second filter layer 102, thereby avoiding the clogging of the second filter layer 102.
  • the cross-sectional areas of the second meshes 1021 on each second filter layer 102 may also be the same.
  • the number of the second filter layers 102 can be 2, 3, 4, etc., and this embodiment does not limit the number of the second filter layers 102.
  • the number of the second filter layers 102 is 2, and the aperture of the second mesh 1021 on the second filter layer 102 close to the first filter layer 101 can be 50 ⁇ m, and the aperture of the second mesh 1021 on the second filter layer 102 away from the first filter layer 101 can be 25 ⁇ m; at this time, while ensuring a high filtering effect, the loss of sound waves when passing through the filter device 10 can be reduced, and the acoustic performance of the electronic device can be improved.
  • the water pressure that the electronic device can withstand can reach 1.25 MPa (about 12.5 atm), that is, the water depth of the electronic device can reach 125 meters.
  • the filter device 10 further includes a first bonding layer 103, and the first bonding layer 103 is arranged between the first filter layer 101 and the second filter layer 102 adjacent thereto, and between adjacent second filter layers 102.
  • the first bonding layer 103 can achieve bonding between the first filter layer 101 and the second filter layer 102 adjacent thereto, and between adjacent second filter layers 102.
  • first filter layer 101 can be connected to the second filter layer 102 adjacent thereto, and the adjacent second filter layer 102 through the first bonding layer 103 to form a filter layer assembly, so as to achieve pre-assembly of the filter device 10, and then the filter layer assembly is mounted on the housing 20, which facilitates the assembly of the electronic device.
  • the first bonding layer 103 is provided with a first through hole 1031, which is used to connect to the functional hole 203; that is, the projection of the first through hole 1031 on the outer surface 202 at least covers a portion of the functional hole 203; so that the first filter layer 101 and the second filter layer 102 corresponding to the first through hole 1031 can filter the water entering the functional hole 203, and the sound waves and the filtered water can enter the functional hole 203 through the first through hole 1031.
  • the center line of the first through hole 1031 is colinear with the center line of the functional hole 203, and the projections of the first through holes 1031 on the outer surface 202 can completely overlap; at this time, the projection of the first through hole 1031 on the outer surface 202 can partially overlap or completely overlap with the functional hole 203.
  • the functional hole 203 can also be located inside the projection of the first through hole 1031 on the outer surface 202, so that the loss of sound waves when passing through the filter device 10 can be reduced.
  • the filter device 10 provided in this embodiment further includes a first support layer 105.
  • the support layer 105 is disposed between the second filter layer 102 and the outer surface 202 (as shown in FIG. 7 ), the first support layer 105 is in contact with the outer surface 202, and the first support layer 105 is provided with a second through hole 1051 for communicating with the functional hole 203.
  • the second filter layer 102 close to the outer surface 202 can be supported on the outer surface 202 by the first support layer 105, thereby avoiding direct contact between the second filter layer 102 and the outer surface 202, so as to avoid the outer surface squeezing the second filter layer 102 and damaging the second filter layer 102.
  • the center line of the second through hole 1051 may be colinear with the center line of the first through hole 1031, and the projection of the second through hole 1051 on the outer surface 202 may completely overlap with the projection of the first through hole 1031 on the outer surface 202, or the projection of the second through hole 1051 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202.
  • the first support layer 105 may be a silicone layer, a waterproof adhesive layer, or the first support layer 105 includes a waterproof adhesive layer and a steel sheet stacked in a direction away from the outer surface 202, and accordingly, both the waterproof adhesive layer and the steel sheet have openings connected to the functional holes 203, so as to achieve sealing between the second filter layer 102 and the outer surface while ensuring that the first support layer 105 has a certain support effect.
  • the filter device 10 also includes a cover plate 106, which covers the outer surface 202 of the shell 20, and the first filter layer 101 and the second filter layer 102 are sandwiched between the cover plate 106 and the outer surface 202; that is, the first filter layer 101 and the second filter layer 102 are located between the cover plate 106 and the outer surface 202, and the first filter layer 101 and the second filter layer 102 can be fixed to the shell 20 through the cover plate 106.
  • the cover plate 106 can be bonded to the outer surface 202 of the housing 20 by adhesive, thereby fixing the cover plate 106.
  • the adhesive can be adhesive, etc., to facilitate the installation of the cover plate 106; accordingly, a glue-containing groove 204 can be provided on the outer surface 202, and the glue-containing groove 204 can accommodate adhesive to avoid that the distance between the cover plate 106 and the outer surface 202 is too large.
  • the cover plate 106 can also be connected to the housing 20 in a detachable manner such as snap connection or bolt connection, so that the filter device 10 can be removed from the housing 20 during maintenance.
  • adhesive is also provided between the cover plate 106 and the housing 20 to further improve the sealing performance.
  • the cover plate 106 is provided with a third through hole 1061 for connecting with the functional hole 203, that is, the center line of the third through hole 1061 can be colinear with the center line of the functional hole 203, and the functional hole 203 can be located within the projection of the third through hole 1061 on the outer surface 202.
  • the external sound waves and water can enter the inside of the housing 20 through the functional hole 203 to be received by the sound module 40; or the sound waves emitted by the sound module 40 can pass through the functional hole 203 and propagate to the outside of the housing 20 through the third through hole 1061.
  • a second adhesive layer 104 may be provided between the cover plate 106 and the first filter layer 101, and a fourth through hole 1041 for communicating with the functional hole 203 is provided on the second adhesive layer 104.
  • the second adhesive layer 104 can fix the filter device 10 on the cover plate 106, thereby pre-installing the filter device 10.
  • the cover plate 106 with the first filter layer 101 and the second filter layer 102 is installed on the housing 20, thereby completing the installation of the filter device 10, thereby simplifying the installation process.
  • the center line of the fourth through hole 1041 can be colinear with the center line of the first through hole 1031, and the projection of the fourth through hole 1041 on the outer surface 202 can completely coincide with the projection of the first through hole 1031 on the outer surface 202; or the projection of the fourth through hole 1041 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202.
  • the cover plate 106 may be provided with a surface facing the outer surface 202.
  • the first groove 1062 correspondingly at least a part of the first filter layer 101 is accommodated in the first groove 1062.
  • Such a configuration can avoid a large distance between the cover plate 106 and the outer surface 202 caused by the first filter layer 101 and the second filter layer 102 being sandwiched between the cover plate 106 and the outer surface 202, thereby improving the compactness of the electronic device and reducing the volume of the electronic device.
  • the first filter layer 101 may be completely accommodated in the first groove 1062; of course, at least a portion of the second filter layer 102 may also be accommodated in the first groove 1062 to further improve the compactness of the electronic device and reduce the volume of the electronic device.
  • a second groove 206 is provided on the outer surface 202, and correspondingly at least a portion of the second filter layer 102 is accommodated in the second groove 206.
  • Such a configuration can avoid a large distance between the cover plate 106 and the outer surface 202 caused by the first filter layer 101 and the second filter layer 102 being sandwiched between the cover plate 106 and the outer surface 202, thereby improving the compactness of the electronic device and reducing the volume of the electronic device.
  • the first filter layer 101 and the second filter layer 102 can be both accommodated in the second groove 206, so as to further improve the compactness of the electronic device and reduce the volume of the electronic device.
  • the first groove 1062 is provided on the surface of the cover plate 106 facing the outer surface 202
  • part of the first filter layer 101 is accommodated in the first groove 1062
  • the rest of the first filter layer 101 and the second filter layer 102 are both accommodated in the second groove 206; in this way, the first groove 1062 and the second groove 206 jointly accommodate the filter device 10, which can avoid the first groove 1062 and the second groove 206 from being too deep.
  • the first filter layer 101 is a rigid layer and the second filter layer 102 is a dustproof net
  • the first filter layer 101 is located between the two second filter layers 102, and along the direction away from the outer surface, in the cross section parallel to the first filter layer 101, the cross-sectional area of the second mesh on each second filter layer 102 gradually increases.
  • the first filter layer 101 can be sandwiched between the two second filter layers 102, thereby avoiding the exposure of the first filter layer 101, and improving the decorative effect of the electronic device.
  • the cross-sectional area of the first mesh on the first filter layer 101 can be greater than the cross-sectional area of the second mesh on each second filter layer 102.
  • the filter device 10 further includes a first bonding layer 103, which is disposed between the first filter layer 101 and the second filter layer 102, and a first through hole 1031 communicating with the functional hole 203 is disposed on the first bonding layer 103.
  • the first bonding layer 103 can achieve the connection between the first filter layer 101 and each second filter layer 102, and can also achieve the sealing between the first filter layer 101 and each second filter layer 102.
  • An embodiment of the present application also provides an electronic device, which may include a mobile phone, a smart watch (as shown in FIG1 ), a PC, a tablet computer, VR, AR, headphones, etc. This embodiment does not limit the electronic device.
  • the electronic device includes a housing 20, which may be a shell of the electronic device.
  • the housing 20 is arranged to form a cavity for accommodating devices such as batteries and circuit boards in the electronic device.
  • the housing 20 has an inner surface 201 and an outer surface 202 that are arranged opposite to each other. It can be understood that the inner surface 201 may be a surface facing the inside of the electronic device (such as the cavity wall of the cavity), and correspondingly, the outer surface 202 is the surface of the housing 20 exposed to the outside.
  • the housing 20 is provided with a functional hole 203 that passes through the inner surface 201 and the outer surface 202.
  • the functional hole 203 may be a balancing hole (such as the functional hole 203 on the left side of FIG3 ), and the balancing hole may balance the air pressure inside and outside the housing so that the speaker and the microphone may work normally.
  • the functional hole 203 may also be a hole for sound waves to pass through (such as the functional hole 203 on the right side of FIG3 ).
  • the filter device 10 provided in any of the above embodiments is disposed on the outer surface 202 of the housing 20 to filter the liquid flowing into the housing 20.
  • the water in the functional hole 203 is filtered, thereby preventing impurities such as particles from entering the functional hole 203 .
  • the electronic device further includes a sound module 40 , which may be a device for emitting sound waves such as a speaker, or a device for receiving sound waves such as a microphone. This embodiment does not limit the sound module 40 .
  • the sound module 40 is disposed on the inner surface 201 , and is disposed toward the functional hole 203 , so that the sound module 40 can emit sound waves outward through the functional hole 203 , or receive sound waves from outside the shell 20 via the functional hole 203 .
  • the electronic device further includes a waterproof component 30, which is disposed on the housing 20.
  • the waterproof component 30 may be disposed corresponding to the sound module 40 to allow sound waves to pass through, while preventing water from passing through.
  • the waterproof component 30 may also be located on the inner side of the balance hole (such as the functional hole 203 on the left side of FIG3 ). In this case, the waterproof component 30 allows air to pass through while preventing water from passing through, thereby achieving sealing of the functional hole 203.
  • the waterproof component 30 can be arranged in various positions and structures, as long as it can prevent water from passing through while allowing gas to pass through.
  • the structure and arrangement position of the waterproof component 30 will be introduced in multiple scenarios below:
  • the waterproof component 30 can be arranged on the inner surface 201, and the corresponding waterproof component 30 needs to be located between the housing 20 and the sound module 40, or the waterproof component 30 is arranged corresponding to the balance hole to achieve the closure of the functional hole 203.
  • the waterproof component 30 may include: a waterproof membrane 301, a third adhesive layer 302, a second support layer 303 and a fourth adhesive layer 304 stacked in a direction away from the inner surface 201, a fifth through hole 3021 is arranged on the third adhesive layer 302, and a sixth through hole 3041 is arranged on the fourth adhesive layer 304, and the fifth through hole 3021 and the sixth through hole 3041 are both used to connect the functional hole 203.
  • the center lines of the fifth through hole 3021 and the sixth through hole 3041 can be arranged colinearly with the center line of the functional hole 203, the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201 can completely overlap, and the functional hole 203 can be located within the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201, or the functional hole 203 can completely overlap with the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201.
  • the waterproof component 30 further includes a buffer layer 305, which is disposed on the side of the fourth adhesive layer 304 away from the inner surface 201, and is provided with a seventh through hole 3051 connected to the functional hole 203.
  • the buffer layer 305 can support the entire waterproof component 30.
  • the waterproof membrane 301 has a microporous structure, part of the air can pass through the microporous structure, while water has a certain surface tension and is difficult to pass through the microporous structure, so that the waterproof component 30 can prevent water from passing through while allowing sound waves to pass through, thereby achieving sealing; at this time, the corresponding waterproof component 30 is set in the balance hole or the corresponding sound module 40.
  • the material of the waterproof membrane 301 can include expanded polytetrafluoroethylene, and the pore size range of the microporous structure in the waterproof membrane 301 can be 0.05-10 ⁇ m, for example: 0.085 ⁇ m, 0.1 ⁇ m, etc., so that the waterproof membrane 301 can withstand a water pressure of up to 1.25MPa, and the use depth can reach 125 meters, and has a certain air permeability, and at an audio frequency of 100-10000Hz, the sound blocking amount is not greater than 5dB.
  • the waterproof component includes a polymer film that has been hydrophobically modified.
  • the film is a dense film, that is, the film does not allow gas to pass through, and the transmission of sound waves on both sides of the film is achieved through its own vibration; the elastic modulus of the film is 2000-8000MPa, and the sound blocking amount is 1.5-6dB at an audio frequency of 100-10000Hz.
  • the surface energy of the film is less than 50mN/m, so that the electronic equipment using the film can withstand a water pressure of more than 1MPa and the operating water depth can reach 100 meters.
  • the waterproof component 30 adopts the waterproof membrane 301 in this embodiment. Since the waterproof membrane 301 has a microporous structure, it can ensure that it can withstand a large water pressure (such as 1.25MPa) while not affecting the transmission of sound waves due to changes in external air pressure. It can be understood that in the implementation of the waterproof component 30 corresponding to the speaker setting, a breathable membrane such as a waterproof membrane 301 with a microporous structure can be used.
  • a waterproof membrane 301 with a microporous structure or a dense membrane can be used.
  • the corresponding waterproof membrane 301 needs to be a breathable membrane such as a waterproof membrane 301 with a microporous structure.
  • a plurality of first holes 3031 are arranged at intervals in the area of the second supporting layer 303 facing the functional hole 203, that is, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 completely overlaps with the projection of the area on the inner surface 201.
  • air can pass through the second supporting layer 303 through the first holes 3031.
  • the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is set, and the functional hole 203 is located within the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201.
  • the second supporting layer 303 may have a certain rigidity.
  • the material of the second supporting layer 303 may include stainless steel, copper, etc., so that the second supporting layer 303 can play a better supporting role for the waterproof membrane 301 .
  • the housing 20 is provided with a first receiving groove 205, and the waterproof component 30 is received in the first receiving groove 205.
  • the inner surface 201 of the housing 20 includes a first groove bottom 2051 of the first receiving groove 205 and a portion of the first shell wall 2011 outside the first receiving groove 205.
  • the waterproof component 30 further includes a fifth adhesive layer 306, which is disposed between the waterproof membrane 301 and the inner surface 201 (i.e., between the waterproof membrane 301 and the first groove bottom 2051), and an eighth through hole 3061 communicating with the functional hole 203 is disposed on the fifth adhesive layer 306.
  • the fifth adhesive layer 306 can achieve connection between the waterproof membrane 301 and the housing 20, and at the same time, the fifth adhesive layer 306 can also achieve sealing between the waterproof membrane 301 and the housing 20.
  • the center line of the eighth through hole 3061 can be colinear with the center line of the fifth through hole 3021, and the projection of the eighth through hole 3061 on the inner surface 201 can completely overlap with the projection of the fifth through hole 3021 on the inner surface 201, so that sound waves can be transmitted to the waterproof membrane 301 after passing through the eighth through hole 3061.
  • the material of the buffer layer 305 may include: polyurethane foam, silica gel, polyethylene foam glue, etc., so that the buffer layer 305 has a certain amount of compression.
  • a certain pre-pressure can be applied between the film layers to improve the sealing between the adjacent film layers, and also improve the sealing between the waterproof component 30 and the housing 20. In this way, the waterproof performance of the electronic device in the deep water environment is improved, that is, the ability of the electronic device to withstand water pressure is improved, and the water depth of the electronic device is increased.
  • the buffer layer 305 when the buffer layer 305 is compressed by 50%, the obtained pre-pressure can meet the sealing requirements of the use water depth of 50 meters; while the buffer layer 305 of the same material needs to meet the use water depth of more than 125 meters, the buffer layer 305 needs to be compressed by more than 80% to obtain sufficient pre-pressure.
  • a buffer layer 305 with a relatively gentle stress-strain curve may be used so that a slight change in thickness will not lead to an excessive change in pre-pressure.
  • the elastic modulus of the buffer layer 305 may be appropriately increased to reduce the deformation of the buffer layer 305 (eg, compress it by 50%) while obtaining the same preload, so that the deformation of the buffer layer 305 is within the use range.
  • the projection area of the waterproof membrane 301 on the inner surface 201 can be appropriately increased, thereby increasing the projection areas of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 to improve the sealing properties of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306.
  • the pre-pressure on the buffer layer 305 can be reduced to avoid damage to the buffer layer 305.
  • it can also prevent the waterproof membrane 301 from being wrinkled due to excessive force, thereby affecting the transmission of sound waves.
  • the waterproof membrane 301 can be in a regular shape, such as a circle, a rectangle, etc.
  • the waterproof membrane 301 can also be an irregular shape; this embodiment does not limit the shape of the waterproof membrane 301. Accordingly, the outer edges of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 are flush with the outer edge of the waterproof membrane 301, that is, the projections of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 completely overlap; the projection area of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 can be 10-40mm2 (such as: 10mm2 , 14mm2 , 20mm2 , 40mm2 , etc.), and the bonding width of the third adhesive layer 302 (the width from the outer edge of the third adhesive layer 302 to the hole wall of the fifth through hole 3021) must be 1.2-3mm (such as: 1.2mm, 2mm, 3mm, etc.).
  • each adhesive layer can have sufficient adhesive force to ensure sufficient sealing while reducing the pre-pressure to avoid damage to the buffer layer 305; at the same time, it can also prevent the waterproof membrane 301 from being wrinkled due to excessive force, thereby affecting the transmission of sound waves.
  • the fifth adhesive layer 306, the waterproof membrane 301, the third adhesive layer 302, the second supporting layer 303, the fourth adhesive layer 304, and the buffer layer 305 can be sequentially attached to the housing 20 to achieve the assembly of the waterproof component 30.
  • the fourth adhesive layer 304, the second supporting layer 303, the third adhesive layer 302, the waterproof membrane 301, and the fifth adhesive layer 306 can also be sequentially attached to the buffer layer 305 to form a pre-installed component, and then the component is assembled to the housing 20 as a whole to complete the assembly of the waterproof component 30, thereby simplifying the assembly difficulty of the electronic device.
  • the waterproof component 30 can be arranged on the inner surface 201.
  • the corresponding waterproof component 30 needs to be located between the housing 20 and the sound module 40, or the waterproof component 30 is arranged corresponding to the balance hole to achieve the closure of the functional hole 203.
  • the waterproof component 30 may include: a waterproof membrane 301, a third adhesive layer 302, a second support layer 303, a fourth adhesive layer 304 and a buffer layer 305 stacked in a direction away from the inner surface 201.
  • the third adhesive layer 302 is provided with a fifth through hole 3021
  • the fourth adhesive layer 304 is provided with a sixth through hole 3041
  • the buffer layer 305 is provided with a seventh through hole 3051.
  • the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 are all used to connect the functional hole 203. That is, the center lines of the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 can be arranged colinearly with the center line of the functional hole 203, the projections of the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 on the inner surface 201 can completely overlap, and the functional hole 203 can be located within the projections of the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 on the inner surface 201, or the functional hole 203
  • the projections of the fifth through hole 3021 , the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 may completely overlap, so as to prevent the third adhesive layer 302 , the fourth adhesive layer 304 and the buffer layer 305 from hindering the propagation of sound waves.
  • the waterproof membrane 301 may have a microporous structure, through which some air can pass, but water has difficulty passing due to its own surface tension, so that the waterproof component 30 can prevent water from passing while allowing sound waves to pass, thereby achieving sealing.
  • the waterproof membrane 301 may be made of expanded polytetrafluoroethylene.
  • a plurality of first holes 3031 are arranged at intervals in the area of the second supporting layer 303 facing the functional hole 203, that is, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 completely overlaps with the projection of the area on the inner surface 201.
  • air can pass through the second supporting layer 303 through the first holes 3031.
  • the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is set, and the functional hole 203 is located within the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201.
  • the second supporting layer 303 may have a certain rigidity.
  • the material of the second supporting layer 303 may include stainless steel, copper, etc., so that the second supporting layer 303 can play a better supporting role for the waterproof membrane 301 .
  • a first receiving groove 205 is provided on the housing 20, and the waterproof component 30 is received in the first receiving groove 205.
  • the inner surface 201 of the housing 20 includes a first groove bottom 2051 of the first receiving groove 205 and a portion of the first shell wall 2011 outside the first receiving groove 205.
  • the waterproof assembly 30 further includes a third supporting layer 307, which is arranged on the inner surface 201 (i.e., the first groove bottom 2051), and is provided with a receiving channel 3071 communicating with the functional hole 203; the waterproof membrane 301 is accommodated in the receiving channel 3071, and the waterproof membrane 301 is in contact with the side wall of the receiving channel 3071, and there is a gap 3072 (forming a U-shaped cavity structure) between the waterproof membrane 301 and the inner surface 201 (i.e., the first groove bottom 2051).
  • a third supporting layer 307 which is arranged on the inner surface 201 (i.e., the first groove bottom 2051), and is provided with a receiving channel 3071 communicating with the functional hole 203; the waterproof membrane 301 is accommodated in the receiving channel 3071, and the waterproof membrane 301 is in contact with the side wall of the receiving channel 3071, and there is a gap 3072 (forming a U-shaped cavity structure) between the waterproof membrane 301 and the inner surface 201 (i.e.,
  • the third supporting layer 307 is supported between the second supporting layer 303 and the housing 20, and there is a gap 3072 between the waterproof membrane 301 and the inner surface (i.e., the first groove bottom 2051).
  • the pre-pressure acts on the third supporting layer 307, so as to prevent the waterproof membrane 301 from being wrinkled due to the pre-pressure, thereby preventing the wrinkles from affecting the acoustic performance.
  • the second support layer 303 may be in contact with the surface of the third support layer 307 away from the inner surface 201, that is, the second support layer 303 is in contact with the surface of the third support layer 307 away from the first groove bottom 2051.
  • the third support layer 307 may include a silicone layer, which can achieve a certain support effect while achieving a seal between the second support layer 303 and the housing 20; the water pressure that the electronic device can withstand can reach 1MPa (about 10atm), that is, the water depth of the electronic device can reach 100 meters.
  • the third support layer 307 can also be other rubber layers, etc.
  • the fourth adhesive layer 304, the second supporting layer 303, the third adhesive layer 302, the waterproof membrane 301, and the fifth adhesive layer 306 may be sequentially attached to the buffer layer 305, and then the third supporting layer 307 may be attached to the second supporting layer 303 to form a pre-installed assembly, and then the assembly may be assembled onto the housing 20 as a whole to complete the assembly of the waterproof assembly 30, thereby simplifying the assembly difficulty of the electronic device.
  • the waterproof membrane 301 and the fifth adhesive layer 306 are sequentially attached to the second supporting layer 303 to form a pre-installed assembly, and then the assembly is assembled onto the housing 20 as a whole.
  • the third adhesive layer 302 can be a waterproof adhesive backing. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051, during assembly, it is only necessary to activate the third adhesive layer 302. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second support layer 303.
  • the third support layer 307 and the second support layer 303 can be an integrated structure.
  • the integrated structure formed by stamping, injection molding and other processes simplifies the structure of the waterproof component 30 and facilitates the assembly of the waterproof component 30.
  • a sealing ring (O-ring) 3073 is provided between the third supporting layer 307 and the housing 20, and the sealing ring 3073 is provided around the functional hole 203, that is, the sealing ring 3073 surrounds the outside of the functional hole 203.
  • Such a configuration can improve the sealing between the third supporting layer 307 and the housing 20, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure, and increasing the water depth of use of the electronic device.
  • the water pressure that the electronic device can withstand can reach 1MPa (about 10atm), that is, the water depth of use of the electronic device can reach 100 meters.
  • annular groove 3074 can be provided on the inner surface 201 (i.e., the first groove bottom 2051), the sealing ring 3073 is provided in the annular groove 3074, and part of the sealing ring 3073 extends out of the annular groove 3074, and one end of the third supporting layer 307 facing the inner surface 201 (i.e., the first groove bottom 2051) contacts the sealing ring 3073 located outside the annular groove 3074.
  • annular grooves 3074 can also be provided on both the inner surface 201 and one end of the third supporting layer 307 facing the inner surface 201 (i.e., the first groove bottom 2051), and accordingly, part of the sealing ring 3073 is located in the annular groove 3074 on the inner surface 201 (i.e., the first groove bottom 2051), and the remaining part of the sealing ring 3073 is located in the annular groove 3074 on the third supporting layer 307.
  • the fourth adhesive layer 304 and the second supporting layer 303 can be sequentially attached to the buffer layer 305, and then the third adhesive layer 302 and the waterproof membrane 301 can be sequentially attached to the second supporting layer 303 to form a pre-installed component.
  • the component is then assembled as a whole to the housing 20, thereby simplifying the difficulty of assembling the electronic device.
  • the third adhesive layer 302 may be a waterproof adhesive backing. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051 , during assembly, only the third adhesive layer 302 needs to be activated. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, thereby automatically achieving bonding between the waterproof membrane 301 and the second support layer 303 .
  • the waterproof component 30 in this scenario may further include an auxiliary support layer 3032, which is disposed between the third support layer 307 and the housing 20 (i.e., the first groove bottom 2051), and the auxiliary support layer 3032 is provided with a plurality of second holes 3033 at intervals in the region facing the functional hole 203, so that sound waves can pass through the auxiliary support layer 3032 through the second holes 3033.
  • the waterproof membrane 301 is sandwiched between the second support layer 303 and the auxiliary support layer 3032, which can improve the support effect on the waterproof membrane 301.
  • the gap 3072 is located between the waterproof membrane 301 and the auxiliary supporting layer 3032 to prevent the waterproof membrane 301 from contacting the auxiliary supporting layer 3032, thereby preventing the waterproof membrane 301 from being stressed and wrinkled.
  • the functional hole 203 can be located within the projection of the area where the second hole 3033 is set on the shell 20, or the functional hole 203 completely overlaps with the projection of the area where the second hole 3033 is set on the shell 20, so that the area where the second hole 3033 is set faces the functional hole 203.
  • the auxiliary support layer 3032 can be an integral structure with the third support layer 307 , and the integral structure is formed by stamping or injection molding, which can simplify the structure of the waterproof component 30 and facilitate the installation of the waterproof component 30 .
  • a seventh adhesive layer 3034 may be provided between the auxiliary support layer 3032 and the inner surface 201 (i.e., the first groove bottom 2051), and correspondingly, a tenth through hole 3035 communicating with the functional hole 203 is provided on the seventh adhesive layer 3034.
  • the functional hole 203 may be located within the projection of the tenth through hole 3035 on the inner surface 201, or the projection of the functional hole 203 and the tenth through hole 3035 on the inner surface 201 completely overlap.
  • the auxiliary support layer 3032 may be fixed to the housing 20 through the seventh adhesive layer 3034, thereby achieving the fixing of the waterproof component 30; and at the same time, the sealing between the auxiliary support layer 3032 and the housing 20 may also be achieved.
  • a sixth adhesive layer 3023 is provided between the third supporting layer 307 and the second supporting layer 303, a ninth through hole 3024 is provided on the sixth adhesive layer 3023, the waterproof membrane 301 can be flush with the surface of the third supporting layer 307 away from the inner surface 201, the third adhesive layer 302 is located in the ninth through hole 3024, and the third adhesive layer 302 is bonded to the hole wall of the ninth through hole 3024.
  • connection between the third supporting layer 307 and the second supporting layer 303 can be achieved through the sixth adhesive layer 3023, and when the pre-pressure is applied through the buffer layer 305, the sixth adhesive layer 3023 located between the second supporting layer 303 and the third supporting layer 307 is stressed, while the third adhesive layer 302 is not stressed, thus avoiding the third adhesive layer 302 and the waterproof membrane 301 on the third adhesive layer 302 from being stressed and wrinkled; at the same time, the third adhesive layer 302 is bonded to the sixth adhesive layer 3023, which can improve the sealing between the third supporting layer 307 and the second supporting layer 303.
  • the waterproof membrane 301 may also partially protrude outside the accommodating channel 3071, and this embodiment does not limit this.
  • the fourth adhesive layer 304, the second supporting layer 303, the sixth adhesive layer 3023, the third adhesive layer 302, the waterproof membrane 301, the third supporting layer 307, and the seventh adhesive layer 3034 can be sequentially attached to the buffer layer 305 to form a pre-installed component, and then the component is assembled to the housing 20 as a whole, which simplifies the assembly difficulty of the electronic device.
  • the pre-installed component can also be transported separately to achieve modularization of the electronic device.
  • the water pressure that the electronic device can withstand can reach 1 MPa (about 10 atm), that is, the water depth at which the electronic device can be used can reach 100 meters.
  • the third adhesive layer 302 can be a waterproof adhesive backing. Since there is a gap 3072 between the waterproof membrane 301 and the auxiliary supporting layer 3032, during assembly, it is only necessary to activate the third adhesive layer 302. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second supporting layer 303.
  • the waterproof component 30 further includes a protective layer 308, which is disposed on the surface of the waterproof membrane 301 facing the inner surface 201 (i.e., the first groove bottom 2051), and the protective layer 308 is provided with a through hole 3081 connected to the functional hole 203.
  • the functional hole 203 can be located within the projection of the through hole 3081 on the inner surface 201, or the functional hole 203 and the projection of the through hole 3081 on the inner surface 201 completely overlap.
  • the gap 3072 is located between the protective layer 308 and the inner surface 201 (i.e., the first groove bottom 2051).
  • the protective layer 308 can make the force on the waterproof membrane 301 more uniform to avoid wrinkles; in addition, the protective layer 308 can play a certain supporting role to prevent the edge of the waterproof membrane 301 from warping.
  • the material of the protection layer 308 may include polyethylene glycol terephthalate (PET) and the like.
  • the difference between this scene and scene one and scene two is that the setting position of the waterproof component 30 is different.
  • the waterproof component 30 can be set on the outer surface 202.
  • the corresponding waterproof component 30 needs to be located between the shell 20 and the filter device 10 to prevent impurities such as particulate matter in the water from contacting the waterproof component 30.
  • the housing 20 is provided with a second receiving groove 207, and the second groove bottom 2071 of the second receiving groove 207 and the second shell wall 2021 outside the receiving groove 205 constitute the outer surface 202.
  • the waterproof component 30 can be arranged in the receiving groove 205 to improve the compactness of the electronic device and reduce the volume of the electronic device.
  • the waterproof assembly 30 includes: a third adhesive layer 302, a waterproof membrane 301 and a protective layer 308 which are stacked in a direction away from the outer surface 202 (i.e., the second groove bottom 2071), a fifth through hole 3021 which is connected to the functional hole 203 is provided on the third adhesive layer 302, and a through hole 3081 which is connected to the functional hole 203 is provided on the protective layer 308.
  • the waterproof membrane 301 is fixed on the housing 20 through the third adhesive layer 302, and the sealing between the waterproof membrane 301 and the housing 20 can be achieved.
  • the water pressure acts on the protective layer 308, and then acts on the third adhesive layer 302, which can further improve the sealing between the waterproof membrane 301 and the housing 20; therefore, during the assembly process, the waterproof membrane 301 can be installed without applying pre-pressure, or a small pre-pressure can be applied to the waterproof membrane 301, so as to avoid wrinkles caused by excessive force on the waterproof membrane 301.
  • the protective layer 308 can make the force on the waterproof membrane 301 more uniform to avoid wrinkles caused by uneven force.
  • the protective layer 308 can play a certain supporting role to prevent the edge of the waterproof membrane 301 from warping.
  • center lines of the via hole 3081 and the fifth through hole 3021 can be arranged colinearly with the center line of the functional hole 203, and the functional hole 203 can be located within the projection of the via hole 3081 and the fifth through hole 3021 on the second groove bottom 2071, or the functional hole 203 completely overlaps with the projection of the via hole 3081 and the fifth through hole 3021 on the second groove bottom 2071.
  • the waterproof component 30 further includes a second supporting layer 303, which is disposed between the third adhesive layer 302 and the outer surface 202.
  • the second supporting layer 303 is provided with a plurality of first holes 3031 at intervals in the region facing the functional hole 203.
  • the second supporting layer 303 can support the waterproof membrane 30. It is understood that an adhesive layer (not shown) can be provided between the second supporting layer 303 and the outer surface 202 to fix the second supporting layer 303 and seal the second supporting layer 303 and the outer surface 202.
  • the first filter layer 101 in the filter device 10 is arranged outside the outer surface 202 of the housing 20, and a plurality of first meshes are arranged at intervals on the first filter layer 101.
  • the second filter layer 102 is arranged between the outer surface 202 and the first filter layer 101, and a plurality of second meshes are arranged at intervals on the second filter layer 102, and the first filter layer 101 and the second filter layer 102 both cover the functional hole 203 on the housing 20.
  • the first filter layer 101 and the second filter layer 102 can filter the water entering the functional hole 203 to prevent impurities such as particles in the liquid from entering the functional hole 203; especially in a deep water environment, impurities such as particles can be prevented from damaging the waterproof membrane 301 of the waterproof component 30, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure, and increasing the water depth of use of the electronic device.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or an integral connection; it can also be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or an integral connection; it can also be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components.

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Abstract

一种过滤装置（10）及电子设备，第一过滤层（101）设置在壳体的外表面外侧，第二过滤层（102）设置在外表面和第一过滤层（101）之间，第一过滤层（101）和第二过滤层（102）均覆盖壳体上的功能孔（203），第一过滤层（101）和第二过滤层（102）可以对进入到功能孔（203）内的水进行过滤，以阻止水中的颗粒物等杂质进入功能孔（203）。

Description

过滤装置及电子设备
本申请要求于2022年05月31日提交国家知识产权局、申请号为202210611368.6、申请名称为“过滤装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端设备技术领域，具体涉及一种过滤装置及电子设备。
背景技术
电子设备(如：智能手表、手机等)常设置有麦克风，以通过麦克风可以实现外界声波的采集。具体地，电子设备还包括壳体、以及防水膜，壳体上设置有贯穿其的功能孔，麦克风设置在壳体上，麦克风朝向功能孔设置，功能孔上封堵有防水膜。工作时，声波穿过功能孔和防水膜，以被麦克风接收，防水膜可以阻止外界的水经功能孔进入，进而实现壳体的密封。
然而，在深水环境中，水的压力较大，此时水中的颗粒物容易损伤防水膜，容易导致壳体密封失效。
发明内容
本申请实施例提供一种过滤装置及电子设备，旨在解决水中的颗粒物容易损伤防水膜，导致壳体密封失效的问题。
一方面，本申请实施例提供一种过滤装置，用于设置在电子设备上，
所述电子设备包括：
壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
所述过滤装置包括：
第一过滤层，所述第一过滤层位于所述外表面的外侧，且所述第一过滤层覆盖所述功能孔，所述第一过滤层上间隔的设置有多个第一网孔；
第二过滤层，所述第二过滤层位于所述外表面和所述第一过滤层之间，且所述第二过滤层覆盖所述功能孔，所述第二过滤层上间隔的设置有多个第二网孔；
在平行于所述第一过滤层的截面中所述第一网孔的截面面积大于所述第二网孔的截面面积。
在可以包括上述实施例的一些实施例中，所述第二过滤层为多个，多个所述第二过滤层层叠的设置；沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第一粘结层，所述第一粘结层设置在所述第一过滤层和靠近其的所述第二过滤层之间、以及相邻的所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第一支撑层，所述第一支撑层设置在所述第二过滤层和所述外表面之间，所述第一支撑层与所述外表面贴合；所述第一支撑层上设置有连通所述功能孔的第二通孔。
在可以包括上述实施例的一些实施例中，所述第一过滤层为刚性过滤层。
在可以包括上述实施例的一些实施例中，所述第二过滤层为两个，两个所述第二过滤层层叠的设置，所述第一过滤层位于两个所述第二过滤层之间，沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第一粘结层，所述第一粘结层设置在所述第一过滤层和所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
盖板，所述盖板覆盖在所述外表面上，所述第一过滤层和所述第二过滤层位于所述盖板和所述外表面之间，所述盖板上设置有连通所述功能孔的第三通孔；
所述盖板与所述壳体连接。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第二粘结层，所述第二粘结层设置在所述盖板和所述第一过滤层之间，所述第二粘结层上设置有连通所述功能孔的第四通孔。
在可以包括上述实施例的一些实施例中，所述盖板朝向所述壳体的表面上设置有第一凹槽，至少部分所述第一过滤层容置在所述第一凹槽内。
在可以包括上述实施例的一些实施例中，所述外表面上设置有第二凹槽，至少部分所述第二过滤层容置在所述第二凹槽内。
在可以包括上述实施例的一些实施例中，所述电子设备还包括声音模组，所述声音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
另一方面，本申请实施例还提供一种电子设备，包括：
壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
防水组件，所述防水组件设置于所述功能孔上，所述防水组件用于阻止液体通过所述功能孔；
以及，如上所述的过滤装置。
在可以包括上述实施例的一些实施例中，所述防水组件设置在所述内表面上，所述防水组件包括：
沿远离所述内表面方向层叠设置的防水膜、第三粘结层、第二支撑层以及第四粘结层，所述第三粘结层上设置有第五通孔，所述第四粘结层上设置有第六通孔，所述第五通孔和所述第六通孔均连通所述功能孔；
所述第二支撑层面向所述功能孔的区域间隔的设置有多个第一孔洞。
在可以包括上述实施例的一些实施例中，所述防水组件还包括缓冲层，所述缓冲层设置在所述第四粘结层远离所述内表面的一侧，所述缓冲层上设置有连通所述功能孔的第七通孔。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
第五粘结层，所述第五粘结层设置在所述防水膜和所述内表面之间，所述第五粘结层上设置有连通所述功能孔的第八通孔。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
第三支撑层，所述第三支撑层设置在所述内表面上，所述第三支撑层上设置有连通所述功能孔的容置通道；
所述防水膜容置在所述容置通道内，且所述防水膜的边缘与所述容置通道的侧壁贴合；所述防水膜与所述内表面之间具有间隙。
在可以包括上述实施例的一些实施例中，所述第二支撑层与所述第三支撑层背离所述内表面的表面接触。
在可以包括上述实施例的一些实施例中，所述第三支撑层包括硅胶层。
在可以包括上述实施例的一些实施例中，所述第二支撑层与所述第三支撑层为一体结构。
在可以包括上述实施例的一些实施例中，所述第三支撑层与所述壳体之间设置有密封圈，所述密封圈环绕所述功能孔设置。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
辅助支撑层，所述辅助支撑层设置在所述第三支撑层和所述内表面之间，所述辅助支撑层面向所述功能孔的区域间隔的设置有多个第二孔洞；所述间隙位于所述防水膜和所述辅助支撑层之间。
在可以包括上述实施例的一些实施例中，所述辅助支撑层与所述第三支撑层为一体结构。
在可以包括上述实施例的一些实施例中，所述第三支撑层和所述第二支撑层之间设置有第六粘结层，所述第六粘结层上设置有第九通孔，所述第三粘结层位于所述第九通孔内，且所述第三粘结层与所述第九通孔的孔壁粘接。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
保护层，所述保护层设置在所述防水膜朝向所述内表面的表面上，所述保护层上设置有连通所述功能孔的过孔。
在可以包括上述实施例的一些实施例中，所述内表面上设置有第一容置槽，所述防水组件设置在所述第一容置槽内。
在可以包括上述实施例的一些实施例中，所述防水组件设置在所述外表面上，所述防水组件包括：
沿远离所述外表面方向层叠设置的第三粘结层、防水膜以及保护层，所述第三粘结层上设置有连通所述功能孔的第五通孔，所述保护层上设置有正对所述功能孔的过孔。
在可以包括上述实施例的一些实施例中，所述防水组件还包括第二支撑层，所述第二支撑层设置在所述第三粘结层和所述外表面之间，所述第二支撑层上面向所述功能孔的区域间隔的设置有多个第一孔洞。
在可以包括上述实施例的一些实施例中，所述外表面上设置有第二容置槽，所述防水组件设置在所述第二容置槽内。
在可以包括上述实施例的一些实施例中，所述电子设备还包括声音模组，所述声 音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
本申请实施例提供的过滤装置及电子设备，第一过滤层设置在壳体的外表面外侧，第一过滤层上间隔的设置有多个第一网孔。第二过滤层设置在外表面和第一过滤层之间，第二过滤层上间隔的设置有多个第二网孔，第一过滤层和第二过滤层均覆盖壳体上的功能孔。如此设置，第一过滤层和第二过滤层可以对进入到功能孔内的水进行过滤，以阻止水中的颗粒物等杂质进入功能孔；在深水环境中，可以避免杂质等颗粒物损坏防水膜，进而提高了电子设备在深水环境中的防水性能，即提高了电子设备承受水压的能力，增大了电子设备的使用水深。
附图说明
图1为智能手表的背面视图；
图2为相关技术中防水组件的结构示意图；
图3为本申请实施例提供的电子设备的结构示意图一；
图4为本申请实施例提供的过滤装置中第一过滤层与盖板的连接示意图一；
图5为图4中A处的局部放大图；
图6为图4中第一过滤层和第二过滤层的爆炸图；
图7为本申请实施例提供的电子设备的结构示意图二；
图8为本申请实施例提供的过滤装置中第一过滤层与盖板的连接示意图二；
图9为图8中B处的局部放大图；
图10为图8中第一过滤层和第二过滤层的爆炸图；
图11为图8中C处的局部放大图；
图12为本申请实施例提供的电子设备中壳体的结构示意图；
图13为本申请实施例提供的过滤装置中第一过滤层设置在两个第二过滤层之间的结构示意图；
图14为本申请实施例提供的电子设备的结构示意图三；
图15为本申请实施例提供的电子设备的结构示意图四；
图16为本申请实施例提供的电子设备的结构示意图五；
图17为本申请实施例提供的电子设备的结构示意图六；
图18为本申请实施例提供的电子设备的结构示意图七；
图19为本申请实施例提供的电子设备的结构示意图八。
附图标记说明
10：过滤装置；
101：第一过滤层；
102：第二过滤层；
103：第一粘结层；
104：第二粘结层；
105：第一支撑层；
106：盖板；
1011：第一网孔；
1021：第二网孔；
1031：第一通孔；
1041：第四通孔；
1051：第二通孔；
1061：第三通孔；
1062：第一凹槽；
20：壳体；
201：内表面；
202：外表面；
203：功能孔；
204：容胶槽；
205：第一容置槽；
206：第二凹槽；
207：第二容置槽；
2011：第一壳壁；
2021：第二壳壁；
2051：第一槽底；
2071：第二槽底；
30：防水组件；
301：防水膜；
302：第三粘结层；
303：第二支撑层；
304：第四粘结层；
305：缓冲层；
306：第五粘结层；
307：第三支撑层；
308：保护层；
3021：第五通孔；
3023：第六粘结层；
3024：第九通孔；
3031：第一孔洞；
3032：辅助支撑层；
3033：第二孔洞；
3034：第七粘结层；
3035：第十通孔；
3041：第六通孔；
3051：第七通孔；
3061：第八通孔；
3071：容置通道；
3072：间隙；
3073：密封圈；
3074：环形槽；
3081：过孔；
40：声音模组；
401：麦克风；
402：扬声器。
具体实施方式
随着终端设备技术的逐渐发展，手机、智能手表等电子设备已经得到普遍的应用。为了提高电子设备的性能，电子设备常需进行防水设计。如图1所示，相关技术中，智能手表包括壳体20、麦克风以及防水组件，壳体20上设置有功能孔203，麦克风设置于功能孔，防水组件用于封堵功能孔，以在允许声波的通过的同时阻止水通过，实现对功能孔203的密封。
请参照图2，防水组件30包括层叠设置的防水膜301、钢片310、以及泡棉320，在防水膜301与壳体20之间、防水膜301和钢片310之间以及钢片310与泡棉320之间均设置粘结层330，以实现各膜层的固定。钢片310上设置有多个孔洞，由于防水膜301上具有微孔结构，来自外界的声波可以经该微孔结构穿过，并依次穿过孔洞和功能孔，进而被麦克风接收；而水具有一定表面张力，而难以穿过微孔结构，进而实现壳体20与外界间的密封。当电子设备置于水中时，随着水深的增加，水中的压力逐渐增大，此时水中的颗粒物等杂质会损伤微孔结构，使得水能够穿过防水膜301，进而进入到壳体内部，造成壳体20的密封失效，导致电子设备在深水环境下的防水失效。
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参照图1和图3，本申请实施例提供一种应用于电子设备中的过滤装置10，该过滤装置10用于设置在电子设备上。示例性的，电子设备可以包括：手机、智能手表(如图1所示)PC、平板电脑、VR、AR、耳机等终端设备，本实施例对电子设备不作限制。
其中，电子设备可以包括壳体20，壳体20可以为电子设备的外壳，壳体20围设成用于容纳电子设备中电池(未示出)、电路板(未示出)等装置的腔体。壳体20具有相对设置的内表面201和外表面202，可以理解的是，内表面201可以为朝向电子设备内部的表面(如：腔体的腔壁)，相应的，外表面202为壳体20暴露在外的表面。壳体20上设置有贯穿内表面201和外表面202的功能孔203，功能孔203可以为平衡孔(如图3中左侧的功能孔203)，平衡孔可以平衡壳体内外的气压，以使得扬声器和麦克风可以正常工作。
当然，功能孔203也可以为供声波通过的孔(如图3中右侧的功能孔203)。电子设备还包括声音模组40，声音模组40设置内表面201上，也就说声音模组40位于 腔体内，并且声音模组40设置于功能孔203。示例性的，声音模组40可以包括扬声器，相应的，声音模组40可以通过功能孔203向壳体20外部发出声波；当然声音模组40也可以包括麦克风，相应的，声音模组40通过功能孔203接收壳体20外的声波，以获取外部声音信号。本实施例对声音模组40不作限制。
请参照图3和图4，本实施例提供的过滤装置10包括第一过滤层101，第一过滤层101设置在外表面202的外侧(图3所示方位中的上方)，第一过滤层101上具有多个间隔设置的第一网孔(未示出)。第一过滤层101覆盖功能孔203，也就是说，功能孔203位于第一过滤层101在外表面202上的投影内部，使得第一过滤层101及其上的第一网孔可以对进入功能孔203的水进行过滤，以阻止水中的颗粒物等杂质进入到功能孔203内。
请参照图4和图5，过滤装置10还包括第二过滤层102，第二过滤层102位于外表面202和第一过滤层101之间，第二过滤层102具有间隔设置的多个第二网孔(未示出)。第二过滤层102覆盖功能孔203，也就是说，功能孔203位于第二过滤层102在外表面202上的投影内部，使得第二过滤层102及其上的第二网孔也可以对进入功能孔203的水进行过滤，以进一步阻止水中的颗粒物等杂质进入到功能孔203内。第一过滤层101和第二过滤层102均可以对进入到功能孔203内的水进行过滤，可以进一步阻止水中的颗粒物等杂质进入到功能孔203内。
请参照图6，在上述实现方式中，在平行于第一过滤层101的截面中第一网孔1011的截面面积大于第二网孔1021的截面面积，也就是说，第一网孔1011在外表面202上的投影面积大于第二网孔1021在外表面202上的投影面积。如此设置，第一过滤层101可以阻止粒径较大的杂质经过，第二过滤层102可以阻止粒径较小的杂质经过，与仅设置一层过滤层相比，可以避免大粒径杂质的堆积，进而避免第一过滤层101和第二过滤层102堵塞。
示例性的，第一网孔1011和第二网孔1021的截面可以呈矩形、圆形等规则形状，当然第一网孔1011和第二网孔1021的截面也可以为呈不规则形状。在第一网孔1011和第二网孔1021的截面呈圆形的实现方式中，第一网孔1011的孔径可以为0.1-0.5mm，第一过滤层101的厚度可以为0.1-0.3mm，相应的，第二网孔的孔径可以为0.5μm-100μm，第二过滤层102的厚度可以为0.05-0.1mm，如此，在保证具有较好的过滤效果的同时，声波在经过第一过滤层101和第二过滤层102的损失较小；另外，第一过滤层101和第二过滤层102的厚度较小，可以提高电子设备的结构紧凑性。
本实施例中，第一过滤层101可以为刚性过滤层，也就是说，第一过滤层101可以由钢网、开孔钢片、开孔塑料板等具有一定刚性的材料构成。由于第一过滤层101为最外侧的过滤层，如此设置，第一过滤层101过滤较为坚硬和尖锐的杂质(如砂石、金属颗粒等)，可以避免颗粒物等杂质损伤第一过滤层101；另外，由于第一过滤层101具有一定的刚性，可以对第二过滤层102等膜层起到一定的支撑作用，以避免第二过滤层102等膜层褶皱。相应的，第二过滤层102可以为具有一定柔性的过滤层，示例性的，第二过滤层102可以包括防尘网，防尘网的材质可以包括聚对苯二甲酸乙二醇酯(polyethylene terephthalate简称PET)、聚醚醚酮(poly(ether-ether-ketone)简称PEEK)等。
继续参照图3，由上述可知本实施例中，电子设备还包括防水组件30，防水组件30设置在壳体20上，防水组件30封堵功能孔203，以实现对功能孔203的封闭。防水组件30可以设置在壳体20的内表面201上，并且防水组件30位于声音模组40和内表面201之间，防水组件30允许声波通过，同时防水组件30阻止水通过；当然防水组件30也可以位于平衡孔的内侧(如图3中左侧的功能孔203)，此时防水组件30允许空气通过的同时阻止水通过。示例性的，防水组件30可以包括防水透气膜，防水透气膜具有微孔结构，部分空气可以透过微孔结构，而水由于自身具有一定的表面张力而难以透过微孔结构，以使得防水组件30能够在允许声波和空气通过的同时阻止水通过，进而实现密封。其中，防水透气膜的材质可以包括膨体聚四氟乙烯(expanded PTFE简称e-PTFE)等。防水透气膜中的微孔结构的孔径范围可以为0.05-10μm，例如：0.085μm、0.1μm等；如此设置，可以提高防水透气膜的防水效果，以提高电子设备的使用水深。当然，防水透气膜也可以通过自身的振动，实现声波由防水透气膜的一侧向另一侧传递。
请参照图7，壳体20上可以设置有两个功能孔203，相应的声音模组40可以包括扬声器402以及麦克风401，扬声器402朝向一个功能孔203设置，麦克风401朝向另一功能孔203设置。也就是说，扬声器402通过与其对应的功能孔203向壳体20外发出声波，麦克风401通过与其对应的功能孔203接收外界的声波。相应的，在扬声器402与内表面201之间、以及麦克风401与内表面201之间均设置防水组件30，以实现对两个功能孔203的密封。
可以理解的是，上述实现方式中，过滤装置10可以覆盖两个功能孔203，也就是说，两个功能孔203均位于第一过滤层101和第二过滤层102在外表面202上的投影内，如此，可以通过第一过滤层101和第二过滤层102实现对进入两个功能孔203内的水的过滤。
当然，在一些实现方式中，过滤装置10可以为两个，其中一个过滤装置10对应一个功能孔203设置，另一过滤装置10对应另一功能孔203设置。也就是说，一个过滤装置10中的第一过滤层101和第二过滤层102覆盖一个功能孔203，该功能孔203位于该第一过滤层101和第二过滤层102在外表面202上的投影内；另一过滤装置10中的第一过滤层101和第二过滤层102覆盖另一功能孔203，该功能孔203位于该第一过滤层101和第二过滤层102在外表面202上的投影内。如此，每一过滤装置10可以对进入其对应的功能孔203内的水进行过滤。
本实施例提供的过滤装置10，第一过滤层101设置在壳体20的外表面202外侧，第一过滤层101上间隔的设置有多个第一网孔1011。第二过滤层102设置在外表面202和第一过滤层101之间，第二过滤层102上间隔的设置有多个第二网孔1021，第一过滤层101和第二过滤层102均覆盖壳体20上的功能孔203。如此设置，在进入水中时，第一过滤层101和第二过滤层102可以对进入到功能孔203内的水进行过滤，以阻止水中的颗粒物等杂质进入功能孔203；尤其在深水环境中，可以避免杂质等颗粒物损坏防水膜301，进而提高了电子设备在深水环境中的防水性能，即提高了电子设备承受水压的能力，增大了电子设备的使用水深。
另一方面，第一网孔1011的截面面积大于第二网孔1021的截面面积，如此设置， 第一过滤层101可以阻止粒径较大的杂质经过，第二过滤层102可以阻止粒径较小的杂质经过，与仅设置一层过滤层相比，可以避免大粒径杂质的堆积，进而避免阻塞过滤层。
请参照图8和图9，在一些实施例中，第二过滤层102可以为多个，多个第二过滤层102层叠的设置在第一过滤层101和外表面202之间。如此设置，多个第二过滤层102可以进一步提高对颗粒物等杂质的过滤效果，以进一步提高电子设备在深水环境中的防水性能，增大电子设备的使用水深。
请参照图9和图10，在一些实现方式中，沿远离外表面202的方向(图10中向上的方向)，在平行于第一过滤层101的截面中。各第二过滤层102上的第二网孔1021截面面积逐渐增大。也就是说，靠近第一过滤层101的第二过滤层102的第二网孔1021截面面积，大于远离第一过滤层101的第二过滤层102上的第二网孔1021截面面积。如此设置，较大粒径的杂质停留在靠近第一过滤层101的第二过滤层102上，较小粒径的杂质停留在远离第一过滤层101的第二过滤层102上，可以避免杂质在各第二过滤层102上堆积，进而避免第二过滤层102堵塞。
在其他实现方式中，各第二过滤层102上的第二网孔1021的截面面积也可以相同。
本实施例中，第二过滤层102的数量可以为2、3、4等，本实施例对第二过滤层102的数量不做限制。如图9所示，第二过滤层102的数量为2，靠近第一过滤层101的第二过滤层102上的第二网孔1021的孔径可以为50μm，相应的远离第一过滤层101的第二过滤层102上的第二网孔1021的孔径可以为25μm；此时在保证具有较高的过滤效果的同时，可以减小声波在透过过滤装置10时的损耗，提高电子设备的声学性能。与不设置过滤装置10相比，电子设备能够承受的水压可以达到1.25MPa(约12.5atm)，即电子设备的使用水深可达到125米。
继续参照图9，在过滤装置10包括层叠设置的多个第二过滤层102的实现方式中，过滤装置10还包括第一粘结层103，第一粘结层103设置在第一过滤层101和靠近其的第二过滤层102之间、以及相邻的第二过滤层102之间。如此设置，第一粘结层103可以实现第一过滤层101与靠近其的第二过滤层102之间、以及相邻的第二过滤层102之间的粘结。另外，可以先通过第一粘结层103将第一过滤层101与靠近其的第二过滤层102、以及相邻的第二过滤层102连接起来形成过滤层组件，实现过滤装置10的预装配，之后将该过滤层组件安装在壳体20上，方便了电子设备的装配。
第一粘结层103上设置有第一通孔1031，第一通孔1031用于连通功能孔203；也就是说，第一通孔1031在外表面202上的投影至少覆盖部分功能孔203；以使得第一通孔1031对应的第一过滤层101和第二过滤层102可以对进入到功能孔203内的水进行过滤，声波和被过滤后的水，可以通过第一通孔1031进入到功能孔203内。
可以理解的是，第一通孔1031的中心线与功能孔203的中心线共线，并且各第一通孔1031在外表面202上的投影可以完全重合；此时第一通孔1031在外表面202上的投影可以与功能孔203部分重叠或者完全重叠。当然，功能孔203也可以位于第一通孔1031在外表面202上的投影内部，如此，可以减小声波在透过过滤装置10时的损耗。
继续参照图8和图9，本实施例提供的过滤装置10还包括第一支撑层105，第一 支撑层105设置在第二过滤层102和外表面202(如图7所示)之间，第一支撑层105与外表面202贴合，第一支撑层105上设置有用于连通功能孔203的第二通孔1051。如此设置，靠近外表面202的第二过滤层102可以通过第一支撑层105支撑在外表面202上，进而避免该第二过滤层102与外表面202直接接触，以免外表面挤压第二过滤层102而损伤第二过滤层102。
示例性的，第二通孔1051的中心线可以与第一通孔1031的中心线共线，并且第二通孔1051在外表面202上的投影可以与第一通孔1031在外表面202上的投影完全重合，或者第二通孔1051在外表面202上的投影位于第一通孔1031在外表面202上的投影内。第一支撑层105可以为硅胶层、防水背胶层、或者第一支撑层105包括沿远离外表面202方向层叠设置的防水背胶层和钢片，相应的，防水背胶层和钢片上均具有连通功能孔203的开孔，以在保证第一支撑层105具有一定的支撑效果的同时，实现第二过滤层102和外表面之间的密封。
继续参照图7和图8，在一些实施例中，过滤装置10还包括盖板106，盖板106覆盖在壳体20的外表面202上，第一过滤层101和第二过滤层102夹设在盖板106和外表面202之间；也就是说第一过滤层101和第二过滤层102位于盖板106和外表面202之间，通过盖板106可以将第一过滤层101和第二过滤层102固定在壳体20上。
示例性的，盖板106可以通过粘结胶与壳体20的外表面202粘接，进而实现对盖板106的固定，粘结胶可以为背胶等，以便于盖板106的安装；相应的可以在外表面202上设置有容胶槽204，容胶槽204可以容置粘结胶，以避免盖板106与外表面202之间的距离过大。当然，盖板106也可以通过卡接或者螺栓连接等可拆卸的方式与壳体20之间连接，以便于在进行维护时，将过滤装置10由壳体20上拆卸下来。在一些实现方式中，在盖板106通过螺栓连接或者卡接的方式与壳体20连接的同时，在盖板106和壳体20之间也设置有粘结胶，以进一步提高密封性。
盖板106上设置有用于连通功能孔203的第三通孔1061，也就是说，第三通孔1061的中心线可以与功能孔203的中心线共线，并且功能孔203可以位于第三通孔1061在外表面202上的投影内。如此，外界的声波和水在穿过第三通孔1061后，可以经功能孔203进入到壳体20内部，以被声音模组40接收；或者声音模组40发出的声波穿过功能孔203后，经第三通孔1061传播至壳体20外。
继续参照图9，盖板106和第一过滤层101之间可以设置有第二粘结层104，第二粘结层104上设置有用于连通功能孔203的第四通孔1041。如此设置，第二粘结层104可以将过滤装置10固定在盖板106上，实现过滤装置10的预安装，之后将带有第一过滤层101和第二过滤层102的盖板106安装在壳体20上，即可完成过滤装置10的安装，简化了安装过程。
示例性的，第四通孔1041的中心线可以与第一通孔1031的中心线共线，并且第四通孔1041在外表面202上的投影可以与第一通孔1031在外表面202上的投影完全重合；或者第四通孔1041在外表面202上的投影位于第一通孔1031在外表面202上的投影内。
请参照图11，在上述实现方式中，盖板106朝向外表面202的表面上可以设置有 第一凹槽1062，相应的至少部分第一过滤层101容置在第一凹槽1062内。如此设置，可以避免因第一过滤层101和第二过滤层102夹在盖板106与外表面202之间，导致的盖板106与外表面202之间的距离较大，进而提高了电子设备的结构紧凑型，缩小了电子设备的体积。
示例性的，第一过滤层101可以全部容置在第一凹槽1062内；当然，至少部分第二过滤层102也可容置在第一凹槽1062内，以进一步提高电子设备的结构紧凑型，缩小电子设备的体积。
请参照图12，本实施例中，外表面202上设置有第二凹槽206，相应的至少部分第二过滤层102容置在第二凹槽206内。如此设置，可以避免因第一过滤层101和第二过滤层102夹在盖板106与外表面202之间，导致的盖板106与外表面202之间的距离较大，进而提高了电子设备的结构紧凑型，缩小了电子设备的体积。
示例性的，在盖板106覆盖在外表面202上时，第一过滤层101以及第二过滤层102可以均容置在第二凹槽206内，以进一步提高电子设备的结构紧凑型，缩小电子设备的体积。当然，在盖板106朝向外表面202的表面上设置有第一凹槽1062的实现方式中，部分第一过滤层101容置在第一凹槽1062内，相应的，其余部分第一过滤层101和第二过滤层102均容置在第二凹槽206内；如此设置，第一凹槽1062和第二凹槽206共同容置过滤装置10，可以避免第一凹槽1062和第二凹槽206的深度过大。
请参照图13，在第一过滤层101为刚性层、第二过滤层102为防尘网的实现方式中，第二过滤层102为两个，两个第二过滤层102层叠的设置，第一过滤层101位于两个第二过滤层102之间，沿远离外表面的方向，在平行于第一过滤层101的截面中，各第二过滤层102上的第二网孔截面面积逐渐增大。如此设置，第一过滤层101可以夹设在两个第二过滤层102之间，进而避免第一过滤层101暴露，提高了电子设备的装饰效果。此时，第一过滤层101上的第一网孔的截面面积可以大于各第二过滤层102上的第二网孔的截面面积。
继续参照图13，过滤装置10还包括第一粘结层103，第一粘结层103设置在第一过滤层101和第二过滤层102之间，第一粘结层103上设置有连通功能孔203的第一通孔1031。第一粘结层103可以实现第一过滤层101与各第二过滤层102之间的连接，同时可以实现第一过滤层101与各第二过滤层102之间的密封。
本申请实施例还提供一种电子设备，该电子设备可以包括手机、智能手表(如图1所示)、PC、平板电脑、VR、AR、耳机等，本实施例对电子设备不作限制。
如图3所示，电子设备包括壳体20，壳体20可以为电子设备的外壳，壳体20围设成用于容纳电子设备中电池、电路板等装置的腔体。壳体20具有相对设置的内表面201和外表面202，可以理解的是，内表面201可以为朝向电子设备内部的表面(如：腔体的腔壁)，相应的，外表面202为壳体20暴露在外的表面。壳体20上设置有贯穿内表面201和外表面202的功能孔203，功能孔203可以为平衡孔(如图3中左侧的功能孔203)，平衡孔可以平衡壳体内外的气压，以使得扬声器和麦克风可以正常工作。当然，功能孔203也可以为供声波通过的孔(如图3中右侧的功能孔203)。
上述任一实施例提供的过滤装置10设置在壳体20的外表面202上，以对流入到 功能孔203内的水进行过滤，进而阻止颗粒物等杂质进入到功能孔203内。
电子设备还包括声音模组40，声音模组40可以为扬声器等发出声波的装置，当然声音模组40也可以为麦克风等接收声波的装置，本实施例对声音模组40不作限制。
声音模组40设置在内表面201上，声音模组40朝向功能孔203设置，以便于声音模组40通过功能孔203向外发出声波，或者经由功能孔203接收来自壳体20外的声波。
如图3所示，电子设备还包括防水组件30，防水组件30设置在壳体20上，防水组件30可以对应声音模组40设置，以允许声波通过，同时防水组件30阻止水通过；当然防水组件30也可以位于平衡孔的内侧(如图3中左侧的功能孔203)，此时防水组件30允许空气通过的同时阻止水通过，进而实现对功能孔203的密封。
本实施例中防水组件30的设置位置和结构可以有多种，只要能够在允许气体通过的同时阻止水通过即可。下面将分多个场景对防水组件30的结构和设置位置进行介绍：
场景一
如图14所示，本场景中，防水组件30可以设置在内表面201上，相应的防水组件30需位于壳体20和声音模组40之间，或者，防水组件30对应于平衡孔设置，以实现对功能孔203的封闭。相应的，防水组件30可以包括：沿远离内表面201方向层叠设置的防水膜301、第三粘结层302、第二支撑层303以及第四粘结层304，第三粘结层302上设置有第五通孔3021，第四粘结层304上设置有第六通孔3041，第五通孔3021以及第六通孔3041均用于连通功能孔203设置。也就是说，第五通孔3021和第六通孔3041的中心线可以与功能孔203的中心线共线设置，第五通孔3021和第六通孔3041在内表面201上的投影可以完全重合，并且功能孔203可以位于第五通孔3021和第六通孔3041在内表面201上投影内、或者功能孔203可以与第五通孔3021和第六通孔3041在内表面201上投影完全重合。以使避免第三粘结层302以及第四粘结层304对声波的传播造成阻碍。
防水组件30还包括缓冲层305，缓冲层305设置在第四粘结层304远离内表面201的一侧，缓冲层305上设置有连通功能孔203的第七通孔3051。缓冲层305可以对整个防水组件30起到支撑的作用。
其中，防水膜301具有微孔结构，部分空气可以透过微孔结构，而水由于自身具有一定的表面张力而难以透过微孔结构，以使得防水组件30能够在允许声波通过的同时阻止水通过，进而实现密封；此时，对应的防水组件30设置于平衡孔或者对应声音模组40设置。其中，防水膜301的材质可以包括膨体聚四氟乙烯，防水膜301中的微孔结构的孔径范围可以为0.05-10μm，例如：0.085μm、0.1μm等，以使得防水膜301可承受的水压可达到1.25MPa，使用水深可达到125米，并且具有一定的透气量，在100-10000Hz的声频下，并且声音的阻隔量不大于5dB。相关技术中，防水组件包括经过疏水改性处理的聚合物薄膜，该薄膜为致密膜，即该薄膜不允许气体通过，通过自身的振动，实现薄膜两侧声波的传递；该薄膜的弹性模量为2000-8000MPa，在100-10000Hz的声频下，声音的阻隔量为1.5-6dB，该薄膜的表面能小于50mN/m，进而使得使用该薄膜的电子设备可以承受的水压1MPa以上，使用水深可达到100米。
然而，由于该薄膜不允许气体通过，在外界的气压发生变化时，在内外气压的作用下， 容易导致薄膜变形(如：鼓胀或者凹陷)，进而影响声波的传递。与之相比，防水组件30采用本实施例中的防水膜301，由于防水膜301具有微孔结构，可以在保证能够承受较大水压(如1.25MPa)的同时，并不会因外界气压的变化而影响声波的传递。可以理解的，在防水组件30对应扬声器设置的实现方式中，可以采用具有微孔结构的防水膜301等透气膜，在防水组件30对应麦克风设置的实现方式中，可以采用具有微孔结构或者致密膜的防水膜301，在防水组件30应用于对平衡孔的密封时，对应的防水膜301需为微孔结构的防水膜301等透气膜。
第二支撑层303上面向功能孔203的区域内间隔的设置有多个第一孔洞3031，也就是说，功能孔203位于该区域在内表面201上的投影内、或者功能孔203与该区域在内表面201上的投影完全重合。在使用的过程中，空气可以经第一孔洞3031透过第二支撑层303。
如图14所示，第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影可以与设置第一孔洞3031的区域完全重合，并且功能孔203位于第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上的投影内。
在上述实现方式中，第二支撑层303可以具有一定的刚性，示例性的，第二支撑层303的材质可以包括不锈钢、铜等；以使得第二支撑层303可以对防水膜301起到较好的支撑作用。
继续参照图14，壳体20上设置有第一容置槽205，防水组件30容置在第一容置槽205内。如此设置，可以提高电子设备的结构紧凑性，进而缩小电子设备的体积。可以理解的是，此时壳体20的内表面201包括第一容置槽205的第一槽底2051以及第一容置槽205外的部分第一壳壁2011。
继续参照图14，防水组件30还包括第五粘结层306，第五粘结层306设置在防水膜301和内表面201之间(即防水膜301和第一槽底2051之间)，第五粘结层306上设置有连通功能孔203的第八通孔3061。第五粘结层306可以实现防水膜301和壳体20之间的连接，同时，第五粘结层306也可以实现防水膜301和壳体20之间的密封。
示例性的，第八通孔3061的中心线可以与第五通孔3021的中心线共线设置，并且第八通孔3061在内表面201上的投影与第五通孔3021在内表面201上的投影可以完全重合，使得声波可以通过第八通孔3061后传递至防水膜301。
继续参照图14，本场景中，缓冲层305的材质可以包括：聚氨酯泡棉、硅胶、聚乙烯泡棉胶等，使得缓冲层305具有一定的压缩量。在安装防水组件30的过程中，通过适当的压缩缓冲层305(例如压缩60％左右)，即可在各膜层之间施加一定的预压力，以提高相邻膜层之间的密封性，同时也提高了防水组件30和壳体20之间的密封性。进而提高电子设备在深水环境中的防水性能，即提高电子设备承受水压的能力，增大电子设备的使用水深。以第三粘结层302、第四粘结层304、以及第五粘结层306均呈环形，并且外圆直径为4毫米，内圆直径为1.75毫米为例，在缓冲层305压缩50％时，所获得的预压力可满足50米使用水深的密封要求；而相同材料的缓冲层305要满足125米以上的使用水深，则需缓冲层305压缩80％以上，以获得足够的预压力。
可以理解的是，预压力过大容易导致防水膜301发生褶皱，而影响声学性能；预 压力过小容易导致各粘结层之间的粘结力较小，密封性不足。相应的，可以采用应力应变曲线较为平缓的缓冲层305，以使得厚度的微小变化不会导致预压力的过大变化。
在一些实现方式中，可以适当的增大缓冲层305的弹性模量，以在获得相同的预压力的同时，可以缩小缓冲层305的形变量(例如压缩50％)，使缓冲层305形变量在使用范围内。
本场景中，可以适当增大防水膜301在内表面201上的投影面积，进而增大第三粘结层302、第四粘结层304、以及第五粘结层306在内表面上201的投影面积，以提高第三粘结层302、第四粘结层304、以及第五粘结层306的密封性，进而在进行装配时，可降低对缓冲层305的预压力，以避免缓冲层305损坏；另外，还可以避免防水膜301受力过大而发生褶皱，进而影响声波传递。
可以理解的是，防水膜301可以为规则形状，例如：圆形、矩形等。
当然，由于壳体20上一般还设置有螺栓等结构，为了躲避螺栓等结构，防水膜301也可以为不规则形状；本实施例对防水膜301的形状不作限制。相应的，第三粘结层302、第四粘结层304、以及第五粘结层306的外边缘与防水膜301的外边缘平齐，也就是说，第三粘结层302、第四粘结层304、以及第五粘结层306在内表面201上的投影完全重合；第三粘结层302、第四粘结层304、以及第五粘结层306在内表面201上的投影面积可以为10-40mm2(如：10mm2、14mm2、20mm2、40mm2等)，并且需保证第三粘结层302的粘结宽度(第三粘结层302的外边缘至第五通孔3021的孔壁间的宽度)为1.2-3mm(如：1.2mm、2mm、3mm等)。如此，可以在各粘结层具有足够的粘结力，以保证足够的密封性的同时，降低预压力，以避免缓冲层305损坏；同时，还可以避免防水膜301受力过大而发生褶皱，进而影响声波传递。
在本场景中，装配时可以将第五粘结层306、防水膜301、第三粘结层302、第二支撑层303、第四粘结层304、以及缓冲层305依次贴附在壳体20上，以实现防水组件30的装配。当然，也可以先将第四粘结层304、第二支撑层303、第三粘结层302、防水膜301以及第五粘结层306依次贴附在缓冲层305上，以形成预安装组件，之后将该组件整体装配至壳体20上，以完成防水组件30的装配，进而简化了电子设备的装配难度。
场景二
请参照图15，本场景中，防水组件30可以设置在内表面201上，相应的防水组件30需位于壳体20和声音模组40之间，或者防水组件30对应于平衡孔设置，以实现对功能孔203的封闭。相应的，防水组件30可以包括：沿远离内表面201方向层叠设置的防水膜301、第三粘结层302、第二支撑层303、第四粘结层304以及缓冲层305，第三粘结层302上设置有第五通孔3021，第四粘结层304上设置有第六通孔3041，缓冲层305上设置有第七通孔3051，第五通孔3021、第六通孔3041以及第七通孔3051均用于连通功能孔203。也就是说，第五通孔3021、第六通孔3041以及第七通孔3051的中心线可以与功能孔203的中心线共线设置，第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上的投影可以完全重合，并且功能孔203可以位于第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影内、或者功能孔203 可以与第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影完全重合。以避免第三粘结层302、第四粘结层304以及缓冲层305阻碍对声波传播。
其中，防水膜301可以具有微孔结构，部分空气可以透过微孔结构，而水由于自身具有一定的表面张力而难以透过微孔结构，以使得防水组件30能够在允许声波通过的同时阻止水通过，进而实现密封。其中，防水膜301的材质可以包括膨体聚四氟乙烯。
第二支撑层303上面向功能孔203的区域内间隔的设置有多个第一孔洞3031，也就是说，功能孔203位于该区域在内表面201上的投影内、或者功能孔203与该区域在内表面201上的投影完全重合。在使用的过程中，空气可以经第一孔洞3031透过第二支撑层303。
如图15所示，第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影可以与设置第一孔洞3031的区域完全重合，并且功能孔203位于第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上的投影内。
在上述实现方式中，第二支撑层303可以具有一定的刚性，示例性的，第二支撑层303的材质可以包括不锈钢、铜等；以使得第二支撑层303可以对防水膜301起到较好的支撑作用。
请参照图15，壳体20上设置有第一容置槽205，防水组件30容置在第一容置槽205内。如此设置，可以提高电子设备的结构紧凑性，进而缩小电子设备的体积。可以理解的是，此时壳体20的内表面201包括第一容置槽205的第一槽底2051以及第一容置槽205外的部分第一壳壁2011。
继续参照图15，防水组件30还包括第三支撑层307，第三支撑层307设置在内表面201(即第一槽底2051)上，第三支撑层307上设置有连通功能孔203的容置通道3071；防水膜301容置在容置通道3071内，并且防水膜301与容置通道3071的侧壁贴合，并且防水膜301与内表面201(即第一槽底2051)之间具有间隙3072(构成U形腔体结构)。如此设置，第三支撑层307支撑在第二支撑层303和壳体20之间，并且防水膜301和内表面(即第一槽底2051)之间具有间隙3072，在安装的过程中通过缓冲层305向壳体20施加预压力时，该预压力作用在第三支撑层307上，避免防水膜301受到预压力而发生褶皱，进而避免因褶皱而影响声学性能。
在上述实现方式中，第二支撑层303可以为与第三支撑层307背离内表面201的表面接触，也就是说第二支撑层303与第三支撑层307背离第一槽底2051的表面接触。相应的，第三支撑层307可以包括硅胶层，如此设置，可以在保证具有一定支撑效果的同时，实现了第二支撑层303与壳体20之间的密封；电子设备能够承受的水压可以达到1MPa(约10atm)，即电子设备的使用水深可达到100米。当然，第三支撑层307也可以为其他的橡胶层等。
继续参照图15，装配时可以先将第四粘结层304、第二支撑层303、第三粘结层302、防水膜301以及第五粘结层306依次贴附在缓冲层305上，再将第三支撑层307贴附至第二支撑层303上，以形成预安装组件，之后将该组件整体装配至壳体20上，以完成防水组件30的装配，进而简化了电子设备的装配难度。当然也可以先将第四粘结层304、第二支撑层303、第三粘结层302、以及第三支撑层307依次贴附在缓冲层 305上，再将防水膜301以及第五粘结层306依次贴附至第二支撑层303上，以形成预安装组件，之后将该组件整体装配至壳体20上。
继续参照图15，第三粘结层302可以为防水背胶，由于防水膜301与第一槽底2051之间具有间隙3072，因此在装配时，只需对第三粘结层302进行活化处理，在使用过程中，水压会作用在防水膜301上，进而挤压第三粘结层302，即可自动实现防水膜301和第二支撑层303之间的粘结。
请参照图16，在其他的实现方式中，第三支撑层307与第二支撑层303可以为一体结构，如此设置，通过冲压、注塑等工艺形成的一体结构，简化了防水组件30的结构，同时方便了防水组件30的装配。
继续参照图16，第三支撑层307和壳体20之间设置有密封圈(O-ring)3073，密封圈3073环绕功能孔203设置，也就是说，密封圈3073环绕在功能孔203的外侧。如此设置，可以提高第三支撑层307与壳体20之间的密封性，进而提高电子设备在深水环境中的防水性能，即提高电子设备承受水压的能力，增大电子设备的使用水深。示例性的，采用图16所示的防水组件30，电子设备能够承受的水压可以达到1MPa(约10atm)，即电子设备的使用水深可达到100米。
可以理解的是，可以在内表面201(即第一槽底2051)上设置有环形槽3074，密封圈3073设置在环形槽3074内，并且部分密封圈3073伸出至环形槽3074外，第三支撑层307朝向内表面201(即第一槽底2051)的一端与位于环形槽3074外的密封圈3073接触。当然，也可以在内表面201和第三支撑层307朝向内表面201(即第一槽底2051)的一端均设置环形槽3074，相应的，一部分密封圈3073位于内表面201(即第一槽底2051)上的环形槽3074内，其余部分密封圈3073位于第三支撑层307上的环形槽3074内。
继续参照图16，装配时可以先将第四粘结层304、第二支撑层303依次贴附在缓冲层305上，再将第三粘结层302以及防水膜301依次贴附至第二支撑层303上，以形成预安装组件，之后将该组件整体装配至壳体20上，简化了电子设备的装配难度。
继续参照图16，第三粘结层302可以为防水背胶，由于防水膜301与第一槽底2051之间具有间隙3072，因此在装配时，只需对第三粘结层302进行活化处理，在使用过程中，水压会作用在防水膜301上，进而挤压第三粘结层302，即可自动实现防水膜301和第二支撑层303之间的粘结。
请参照图17，本场景中的防水组件30还可以包括辅助支撑层3032，辅助支撑层3032设置在第三支撑层307和壳体20(即第一槽底2051)之间，辅助支撑层3032面向功能孔203的区域间隔的设置有多个第二孔洞3033；以使得声波可以通过第二孔洞3033穿过辅助支撑层3032。如此设置，防水膜301夹设在第二支撑层303和辅助支撑层3032之间，可以提高对防水膜301的支撑效果。
相应的，间隙3072位于防水膜301和辅助支撑层3032之间，以避免防水膜301与辅助支撑层3032接触，进而避免防水膜301受力而发生褶皱。
可以理解的是，功能孔203可以位于设置第二孔洞3033的区域在壳体20上的投影内，或者功能孔203与设置第二孔洞3033的区域在壳体20上的投影完全重合，以使得设置第二孔洞3033的区域面向功能孔203。
在上述实现方式中，辅助支撑层3032可以与第三支撑层307为一体结构，通过冲压或注塑的方式形成一体结构，可以简化防水组件30的结构，同时方便了防水组件30的安装。
继续参照图17，辅助支撑层3032和内表面201(即第一槽底2051)之间可以设置第七粘结层3034，相应的，第七粘结层3034上设置有连通功能孔203的第十通孔3035。可以理解的是，功能孔203可以位于第十通孔3035在内表面201上的投影内，或者，功能孔203与第十通孔3035在内表面201上的投影完全重合。如此设置，通过第七粘结层3034可以将辅助支撑层3032固定在壳体20上，进而实现对防水组件30的固定；同时还可以实现辅助支撑层3032与壳体20之间的密封。
继续参照图17，第三支撑层307和第二支撑层303之间设置有第六粘结层3023，第六粘结层3023上设置有第九通孔3024，防水膜301可以与第三支撑层307背离内表面201的表面平齐，第三粘结层302位于第九通孔3024内，且第三粘结层302与第九通孔3024的孔壁粘结。如此设置，用过第六粘结层3023可以实现第三支撑层307和第二支撑层303之间的连接，并且在通过缓冲层305施加预压力时，位于第二支撑层303和第三支撑层307之间的第六粘结层3023受力，此时第三粘结层302并不受力，避免了第三粘结层302以及第三粘结层302上的防水膜301受力而发生褶皱；同时，第三粘结层302与第六粘结层3023接合，可以提高第三支撑层307和第二支撑层303之间的密封性。
当然在其他实现方式中，防水膜301也可以部分凸出于容置通道3071外，本实施例对此不做限制。
继续参照图17，在装配时，可以先将第四粘结层304、第二支撑层303、第六粘结层3023、第三粘结层302、防水膜301、第三支撑层307、第七粘结层3034依次贴附在缓冲层305上，以形成预安装组件，之后将该组件整体装配至壳体20上，简化了电子设备的装配难度。另外，该预安装组件也可以进行单独的运输，以实现电子设备的模块化。
示例性的，采用图17所示的防水组件30，电子设备能够承受的水压可以达到1MPa(约10atm)，即电子设备的使用水深可达到100米。
继续参照图17，第三粘结层302可以为防水背胶，由于防水膜301与辅助支撑层3032之间具有间隙3072，因此在装配时，只需对第三粘结层302进行活化处理，在使用过程中，水压会作用在防水膜301上，进而挤压第三粘结层302，即可自动实现防水膜301和第二支撑层303之间的粘结。
继续参照图15-图17，在本场景中，防水组件30还包括保护层308，保护层308设置在防水膜301朝向内表面201(即第一槽底2051)的表面上，保护层308上设置有连通功能孔203的过孔3081。可以理解的是，功能孔203可以位于过孔3081在内表面201上的投影内，或者功能孔203与过孔3081在内表面201上的投影完全重合。
相应的，间隙3072位于保护层308和内表面201(即第一槽底2051)之间。如此设置，在水压的作用下，保护层308可以使得防水膜301的受力较为均匀，以避免发生褶皱；另外保护层308可以起到一定的支撑作用，以避免防水膜301边缘翘起。示 例性的，保护层308的材质可以包括聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate简称PET)等。
场景三
请参照图18，本场景与场景一和场景二的不同之处在于防水组件30的设置位置不同，防水组件30可以设置在外表面202上，相应的防水组件30需位于壳体20和过滤装置10之间，以避免水中的颗粒物等杂质与防水组件30接触。
继续参照图18，壳体20上设置有第二容置槽207，相应的第二容置槽207的第二槽底2071以及容置槽205外的第二壳壁2021构成外表面202。防水组件30可以设置在容置槽205内，以提高电子设备的结构紧凑性，缩小了电子设备的体积。
防水组件30包括：沿远离外表面202(即第二槽底2071)方向层叠设置的第三粘结层302、防水膜301以及保护层308，第三粘结层302上设置有连通功能孔203的第五通孔3021，保护层308上设置有连通功能孔203的过孔3081。如此设置，防水膜301通过第三粘结层302固定在壳体20上，并且可以实现防水膜301和壳体20之间的密封。另外，使用时，水压作用在保护层308上，进而作用在第三粘结层302上，可进一步提高防水膜301和壳体20之间的密封性；因此，在装配的过程中，无需对防水膜301施加预压力，或者对防水膜301施加较小的预压力，即可完成安装，可避免防水膜301受力过大而发生褶皱。
上述实现方式中，保护层308可以使得防水膜301的受力较为均匀，以避免因受力不均导致的褶皱，另外，保护层308可以起到一定的支撑作用，以避免防水膜301的边缘翘起。
可以理解的是，过孔3081和第五通孔3021的中心线可以与功能孔203的中心线共线设置，并且功能孔203可以位于过孔3081和第五通孔3021在第二槽底2071上的投影内，或者功能孔203与过孔3081和第五通孔3021在第二槽底2071上的投影完全重合。
请参照图19，防水组件30还包括第二支撑层303，第二支撑层303设置在第三粘结层302和外表面202之间，第二支撑层303面向功能孔203的区域间隔的设置有多个第一孔洞3031。第二支撑层303可以对防水膜30起到支撑作用。可以理解的是，可以在第二支撑层303和外表面202之间设置粘结胶层(未示出)，以实现第二支撑层303的固定，以及第二支撑层303和外表面202之间的密封。
本实施例提供的电子设备中，过滤装置10中的第一过滤层101设置在壳体20的外表面202外侧，第一过滤层101上间隔的设置有多个第一网孔。第二过滤层102设置在外表面202和第一过滤层101之间，第二过滤层102上间隔的设置有多个第二网孔，第一过滤层101和第二过滤层102均覆盖壳体20上的功能孔203。如此设置，在进入水中时，第一过滤层101和第二过滤层102可以对进入到功能孔203内的水进行过滤，以阻止液体中的颗粒物等杂质进入功能孔203；尤其在深水环境中，可以避免杂质等颗粒物损坏防水组件30的防水膜301，进而提高了电子设备在深水环境中的防水性能，即提高了电子设备承受水压的能力，增大了电子设备的使用水深。
需要说明的是，本申请实施例的描述中，除非另有明确的规定和限定，术语中“相连”、“连接”应做广义理解，例如，可以是固定连接，或一体地连接；也可以是机械连接，也可以是电连接；可以是直接的连接，也可以是通过中间媒介间接的连接，也可以是两个构件内部的连通。对于本领域技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其进行限制；尽管参照前述各实施例对本申请进行了详细说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中的部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (30)

  1. 一种过滤装置，用于设置在电子设备上，其特征在于，
    所述电子设备包括：
    壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
    所述过滤装置包括：
    第一过滤层，所述第一过滤层位于所述外表面的外侧，且所述第一过滤层覆盖所述功能孔，所述第一过滤层上间隔的设置有多个第一网孔；
    第二过滤层，所述第二过滤层位于所述外表面和所述第一过滤层之间，且所述第二过滤层覆盖所述功能孔，所述第二过滤层上间隔的设置有多个第二网孔；
    在平行于所述第一过滤层的截面中所述第一网孔的截面面积大于所述第二网孔的截面面积。
  2. 根据权利要求1所述的过滤装置，其特征在于，所述第二过滤层为多个，多个所述第二过滤层层叠的设置；沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
  3. 根据权利要求2所述的过滤装置，其特征在于，所述过滤装置还包括：
    第一粘结层，所述第一粘结层设置在所述第一过滤层和靠近其的所述第二过滤层之间、以及相邻的所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
  4. 根据权利要求1所述的过滤装置，其特征在于，所述过滤装置还包括：
    第一支撑层，所述第一支撑层设置在所述第二过滤层和所述外表面之间，所述第一支撑层与所述外表面贴合；所述第一支撑层上设置有连通所述功能孔的第二通孔。
  5. 根据权利要求1所述的过滤装置，其特征在于，所述第一过滤层为刚性过滤层。
  6. 根据权利要求5所述的过滤装置，其特征在于，所述第二过滤层为两个，两个所述第二过滤层层叠的设置，所述第一过滤层位于两个所述第二过滤层之间，沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
  7. 根据权利要求6所述的过滤装置，其特征在于，所述过滤装置还包括：
    第一粘结层，所述第一粘结层设置在所述第一过滤层和所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
  8. 根据权利要求1所述的过滤装置，其特征在于，所述过滤装置还包括：
    盖板，所述盖板覆盖在所述外表面上，所述第一过滤层和所述第二过滤层位于所述盖板和所述外表面之间，所述盖板上设置有连通所述功能孔的第三通孔；
    所述盖板与所述壳体连接。
  9. 根据权利要求8所述的过滤装置，其特征在于，所述过滤装置还包括：
    第二粘结层，所述第二粘结层设置在所述盖板和所述第一过滤层之间，所述第二粘结层上设置有连通所述功能孔的第四通孔。
  10. 根据权利要求8所述的过滤装置，其特征在于，所述盖板朝向所述壳体的表面 上设置有第一凹槽，至少部分所述第一过滤层容置在所述第一凹槽内。
  11. 根据权利要求8所述的过滤装置，其特征在于，所述外表面上设置有第二凹槽，至少部分所述第二过滤层容置在所述第二凹槽内。
  12. 根据权利要求1-10任一项所述的过滤装置，其特征在于，所述电子设备还包括声音模组，所述声音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
  13. 一种电子设备，其特征在于，包括：
    壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
    防水组件，所述防水组件设置于所述功能孔上，所述防水组件用于阻止液体通过所述功能孔；
    以及，权利要求1-12任一项所述的过滤装置。
  14. 根据权利要求13所述的电子设备，其特征在于，所述防水组件设置在所述内表面上，所述防水组件包括：
    沿远离所述内表面方向层叠设置的防水膜、第三粘结层、第二支撑层以及第四粘结层，所述第三粘结层上设置有第五通孔，所述第四粘结层上设置有第六通孔，所述第五通孔和所述第六通孔均连通所述功能孔；
    所述第二支撑层面向所述功能孔的区域间隔的设置有多个第一孔洞。
  15. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括缓冲层，所述缓冲层设置在所述第四粘结层远离所述内表面的一侧，所述缓冲层上设置有连通所述功能孔的第七通孔。
  16. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括：
    第五粘结层，所述第五粘结层设置在所述防水膜和所述内表面之间，所述第五粘结层上设置有连通所述功能孔的第八通孔。
  17. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括：
    第三支撑层，所述第三支撑层设置在所述内表面上，所述第三支撑层上设置有连通所述功能孔的容置通道；
    所述防水膜容置在所述容置通道内，且所述防水膜的边缘与所述容置通道的侧壁贴合；所述防水膜与所述内表面之间具有间隙。
  18. 根据权利要求17所述的电子设备，其特征在于，所述第二支撑层与所述第三支撑层背离所述内表面的表面接触。
  19. 根据权利要求18所述的电子设备，其特征在于，所述第三支撑层包括硅胶层。
  20. 根据权利要求18所述的电子设备，其特征在于，所述第二支撑层与所述第三支撑层为一体结构。
  21. 根据权利要求20所述的电子设备，其特征在于，所述第三支撑层与所述壳体之间设置有密封圈，所述密封圈环绕所述功能孔设置。
  22. 根据权利要求17所述的电子设备，其特征在于，所述防水组件还包括：
    辅助支撑层，所述辅助支撑层设置在所述第三支撑层和所述内表面之间，所述辅助支撑层面向所述功能孔的区域间隔的设置有多个第二孔洞；所述间隙位于所述防水膜和所述辅助支撑层之间。
  23. 根据权利要求22所述的电子设备，其特征在于，所述辅助支撑层与所述第三支撑层为一体结构。
  24. 根据权利要求22所述的电子设备，其特征在于，所述第三支撑层和所述第二支撑层之间设置有第六粘结层，所述第六粘结层上设置有第九通孔，所述第三粘结层位于所述第九通孔内，且所述第三粘结层与所述第九通孔的孔壁粘接。
  25. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括：
    保护层，所述保护层设置在所述防水膜朝向所述内表面的表面上，所述保护层上设置有连通所述功能孔的过孔。
  26. 根据权利要求13所述的电子设备，其特征在于，所述内表面上设置有第一容置槽，所述防水组件设置在所述第一容置槽内。
  27. 根据权利要求13所述的电子设备，其特征在于，所述防水组件设置在所述外表面上，所述防水组件包括：
    沿远离所述外表面方向层叠设置的第三粘结层、防水膜以及保护层，所述第三粘结层上设置有连通所述功能孔的第五通孔，所述保护层上设置有正对所述功能孔的过孔。
  28. 根据权利要求27所述的电子设备，其特征在于，所述防水组件还包括第二支撑层，所述第二支撑层设置在所述第三粘结层和所述外表面之间，所述第二支撑层上面向所述功能孔的区域间隔的设置有多个第一孔洞。
  29. 根据权利要求27所述的电子设备，其特征在于，所述外表面上设置有第二容置槽，所述防水组件设置在所述第二容置槽内。
  30. 根据权利要求13所述的电子设备，其特征在于，所述电子设备还包括声音模组，所述声音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
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