WO2023221808A1

WO2023221808A1 - Multi-purpose circuit board production line, application of multi-purpose production line and preparation method thereof

Info

Publication number: WO2023221808A1
Application number: PCT/CN2023/092895
Authority: WO
Inventors: 李龙凯
Original assignee: 世大新材料(深圳)有限公司
Priority date: 2022-05-19
Filing date: 2023-05-09
Publication date: 2023-11-23
Also published as: CN115529726A; CN115529726B

Abstract

Disclosed in the present invention is a multi-purpose circuit board production line, comprising: at least one material processing unit; a compositing unit; at least one peeling device; at least one coating device; and at least one stretching and delivery device. Also disclosed in the present invention is an application of the multi-purpose production line. According to the multi-purpose circuit board production line in the present invention, processing such as drilling and/or cutting, release film peep-off, alignment, compositing, baking, and curing can be directly performed on materials; materials related to circuit board production can be produced and processed by starting some or all of the processing areas, to finally produce single-sided flexible circuit boards, double-sided flexible circuit boards, multi-layer flexible circuit boards, and rigid-flex circuit boards; the use is flexible, the degree of automation is high, the entire processing flow from materials to products in circuit board production is changed, the production process of circuit boards is greatly simplified, manual operation is effectively reduced, water and electricity are saved, compliance with the carbon peak and carbon neutrality policy in China is achieved while reducing generation of industrial waste, innovative materials are combined with an innovative equipment integrated technical transformation scheme, new technologies in the semiconductor integrated circuit industry are innovated, intelligent manufacturing is implemented, and the application of revolutionary technologies subverts conventional circuit board production technical solutions.

Description

Multi-purpose circuit board production line, application of multi-purpose production line and preparation method thereof

Technical field

The invention relates to the field of circuit board processing, and in particular to a multi-purpose circuit board production line, the application of the multi-purpose production line and its preparation method.

Background technique

The existing circuit board process mainly includes material incoming material, cutting, pattern window opening, hole drilling, alignment lamination, laminated alignment lamination, etc. The materials include single-sided copper clad laminate, double-sided copper clad laminate, And including release film, semi-cured adhesive, release film structure combination adhesive, etc., the process is cumbersome and the equipment structure is complex, requiring a lot of manual work, and consuming a lot of water and electricity. Each process is independent of each other, often a certain The process, or the operation of certain processes separately, has resulted in rising labor costs, waste of raw materials, uneven product quality, huge investment in production equipment, large factory floor space and other disadvantages, which seriously deviates from the peak of carbon emissions and the reduction of industrial waste. Emissions concept.

Due to the wide variety of production materials and the chaotic mix of materials, materials need to be purchased from many different channels during procurement, resulting in a complex and chaotic supply chain structure that is difficult to manage.

The existing technology lacks a multi-purpose production line that can perform multiple processing steps at the same time and integrates the production and processing of circuit board materials.

Contents of the invention

The purpose of the present invention is to overcome the above-mentioned defects in the prior art and provide a multi-purpose circuit board production line that can directly punch and/or cut the material, peel off the release film, align, compound, bake, and solidify the material. and other processing; by activating part or all of the processing area, materials related to circuit board production can be produced and processed, and finally made into flexible single-sided, double-sided, multi-layer boards, and PCB multi-layer lamination composite processes including soft and hard Combined with integrated circuits, it is flexible to use and has a high degree of automation, simplifying the processing process, effectively reducing manual work, and saving water, electricity, and materials.

A multi-purpose circuit board production line, including:

At least one material processing unit: it includes a material unwinding roller arranged sequentially along the processing direction, and A conveying device, the material unwinding roller conveys the material to be processed to the conveying device, and a cutting device for punching and/or cutting the material is provided at the conveying device;

A composite unit: it includes a circuit board transmission device, a positioning device, a pre-pressing device, a hot pressing device, a tunnel oven, at least a pair of pressure rollers, and a punching inspection system arranged sequentially along the processing direction. , the circuit board transmission device transmits the circuit board to the alignment device;

At least one peeling device includes a guide unwinding roller, a peeling positioning roller, and a peeling and rewinding roller; the materials processed by the material processing unit are sequentially transferred to the alignment device through the guide unwinding roller and the peeling positioning roller, and are peeled off The rewinding roller rewinds and recycles the film material peeled off from the material after passing through the peeling and positioning roller;

At least one coating device, which includes a coating unwinding roller and a gluing machine. The coating unwinding roller conveys the substrate to be coated to the upper glue machine. The base material to be coated is coated with glue and then transferred to the opposite machine. bit device;

At least one pulling and conveying device, which includes at least a first pulling and unwinding roller, a second pulling and unwinding roller, and a pulling and winding roller, the first pulling and unwinding roller transmits the material to the pre-pressing device, After passing through the hot pressing device, it is transferred to the pulling and winding roller for winding, and the second pulling and unwinding roller transfers the material to the pressure roller.

As a further improvement of the present invention, the transmission device is a belt transmission device or a transmission roller.

As a further improvement of the present invention, the belt conveyor device includes a pair of conveyor rollers arranged oppositely along the processing direction, and a conveyor belt sleeved on the outside of the two conveyor rollers, wherein between the two conveyor rollers and away from the conveyor belt A support plate is provided on one side of the load-bearing surface, and evenly distributed toothed stripes are formed on the load-bearing surface of the conveyor belt. The cutting device is located at the support plate to punch holes and/or cut the material to be processed according to the circuit board pattern.

As a further improvement of the present invention, the material processing unit further includes a laminating roller respectively disposed at both ends of the conveying device, wherein the lower end of the laminating roller is lower than the upper end of the conveying roller and the upper end of the material unwinding roller respectively.

As a further improvement of the present invention, the cutting device includes at least one or more of an intelligent laser cutting device, a circular knife die cutting device, and a stamping and die cutting device.

As a further improvement of the present invention, it also includes at least one turning device, which includes at least two turning rollers arranged one above the other. The material processed by the cutting device is turned over by the two turning rollers in turn and then transported to the peeling device.

As a further improvement of the present invention, a material winding roller is also included. The material processed by the cutting device is transferred to the material winding roller for winding, and the rolled material is transferred to the guide unwinding roller for unwinding.

As a further improvement of the present invention, it is used to check the graphics on the material after being processed by the cutting device. The leak detection and repair system includes:

a server;

At least one pattern detection device, which is signal-connected to the server and used to collect image information and transmit the image information to the server;

And at least one laser drilling device, which is connected to the server signal and is used to receive instructions transmitted by the server and drill holes in the material according to the instructions;

At least one leak-repairing manipulator, which is connected to the server signal and is used to receive the instructions transmitted by the server and to repair the leaks of the release film that has fallen off at the window opening position of the material according to the instructions, or to remove the material that cannot be repaired to avoid flowing into the next process;

At least one processor also includes at least one leak detection and leak correction system, which is communicatively connected with a graphic inspection module, a visual inspection module, a storage module and a controller. The graphic inspection module is communicatively connected with a graphic detection device, and the graphic detection device detects Check and analyze whether the graphics on the cutting surface of the material after processing by the cutting device are complete. The specific analysis process includes:

Mark the material processed by the cutting device as the detection object i, i = 1, 2,..., n, n is a positive integer. Take an image of the cutting surface of the detection object i and obtain the detection image i, and obtain the standard through the storage module image, compare the detection image i with the standard image through image processing technology and obtain the coincidence degree CHi between the detection image i and the standard image, obtain the coincidence threshold CHmin through the storage module, and compare the coincidence degree CHi with the coincidence threshold CHmin: If If the coincidence degree CH is less than or equal to the coincidence threshold CHmin, it is determined that the pattern of the detection object i is unqualified, and the image inspection module sends a pattern failure signal to the processor; if the coincidence degree CH is greater than the coincidence threshold CHmax, it is determined that the pattern of the detection object i is qualified, as shown in Figure The inspection module sends a graphic pass signal to the processor;

Conduct continuity testing on test objects with unqualified graphics. The process of continuity testing includes: obtaining the first two graphic test results of the test object:

If the first two graphic results are both graphically qualified, the results are judged to be discontinuous;

If the first two graphic results are both unqualified graphics, the judgment results are continuous. The graphic inspection module sends a continuous unqualified signal to the processor. After receiving the continuous unqualified signal, the processor sends the continuous unqualified signal to the manager's mobile terminal. , after the management personnel receive the unqualified continuous signal, they will inspect and repair the cutting device and transmission device;

If the first two graphic results are one pass and one failure, analyze the order of occurrence of the graphic test results: if the graphic unqualified result comes first, the judgment result is discontinuous; if the graphic qualified result comes first, it is judged continuous and pending. , the image inspection module marks the next image inspection as a key inspection;

The process of key inspection is: take two images of the inspection object and compare the coincidence degree. When there is an unqualified graphic result in the two inspection results, it is judged that the image of the inspection object is unqualified, and the image inspection module sends the image to the processor. Failure signal;

The image inspection module is also used to analyze the distribution of graphics detection results. The process of result distribution analysis includes: establishing a coincidence set {CH1, CH2,..., CHn} for the coincidence degree CHi of the detection object i, calculating the variance of the coincidence set and Mark the calculation result as the distribution coefficient FB of the coincident set, obtain the distribution threshold FBmax through the storage module, and compare the distribution coefficient FB with the distribution threshold FB: if the distribution coefficient FB is less than or equal to the distribution threshold FBmax, it is determined that the cutting device is working stably; if If the distribution coefficient FB is greater than the distribution threshold FBmax, it is determined that the cutting device is unstable. The image inspection module sends a maintenance signal to the manager's mobile terminal through the processor. After receiving the maintenance signal, the manager detects and repairs the cutting device;

For materials that need to be opened, use the visual inspection module to check whether the release film has fallen off at the position to be opened. The specific inspection process includes: taking an image of the opening position of the material and marking the resulting image as an analysis image. The image is enlarged into a pixel grid image, and the pixel grid of the pixel grid image is marked as u, u = 1, 2,..., m, m is a positive integer, and the grayscale value HDu of the pixel grid u is obtained through image processing technology, and the grayscale value HDu of the pixel grid u is obtained through the storage module Obtain the grayscale threshold HDmin, and compare the grayscale value HDu with the grayscale threshold HDmin one by one: if the grayscale value HDu is less than or equal to the grayscale threshold HDmin, the corresponding pixel grid will be marked as a dropped pixel grid; if the grayscale value HDu is greater than If the grayscale threshold HDmin is set, the corresponding pixel grid is marked as a complete pixel grid; the number of dropped pixel grids is obtained and marked as w, and the ratio of w and m is marked as the dropout ratio. The dropout threshold is obtained through the storage module, and the dropout ratio is Compare the shedding threshold: if the shedding ratio is less than the shedding threshold, it is determined that the release film has not fallen off; if the shedding ratio is greater than or equal to the shedding threshold, it is determined that the release film has not fallen off. When the film falls off, the visual inspection module sends a leak-tightening signal to the processor. After receiving the leak-tightening signal, the processor sends the leak-tightening signal to the controller. After receiving the leak-tightening signal, the controller controls the leak-tightening manipulator to fix the leakage of the release film that has fallen off at the opening position. .

As a further improvement of the present invention, the pattern detection device is an AOI detection device or a CCD detection device.

As a further improvement of the present invention, the positioning device includes at least one horizontal positioning roller, at least a pair of horizontal guide rollers, and a pair of positioning systems. The horizontal positioning roller and the horizontal guide roller are arranged horizontally. After peeling off the positioning roller, The material passes through the horizontal positioning roller and the horizontal guide roller in turn. The horizontal positioning roller and the horizontal guide roller make the material horizontally transported and parallel to the circuit board. The alignment system is used to align the positioning holes and/or opening patterns of the material with the positioning holes and the circuit board. / Or the opening pattern is aligned, and the gap between the two horizontal guide rollers is adjustable.

As a further improvement of the present invention, the pre-pressing device is at least one pair of pre-pressing rollers, and the gap between the two pre-pressing rollers is adjustable.

As a further improvement of the present invention, a circuit board detection device is provided between the circuit board conveying device and the pre-pressing device for detecting the circuit board.

As a further improvement of the present invention, it also includes a composite material winding roller or a composite material cutting device. The multi-layer plates or materials processed by the composite unit are transferred to the composite material winding roller or the composite material cutting device. The composite material winding roller rolls up the multi-layer boards or materials; or the composite material cutting device cuts the multi-layer boards or materials into sheets, and stacks the sheet-shaped multi-layer boards or materials in sequence through the robot; The rolled multi-layer board or the multi-layer board cut into sheets then undergoes a process including dry film application, exposure, development, electroplating and etching to form a multi-layer circuit board.

As a further improvement of the present invention, the hot-pressing device includes at least a pair of hot-pressing rollers or a flat-plate hot-pressing device, and the gap between the two hot-pressing rollers is adjustable; the flat-plate hot pressing device includes an upper and lower oppositely arranged At least a pair of liftable hot-pressed flat plates, and an annular track corresponding to the hot-pressed flat plates. The hot-pressed flat plates are movably connected to the annular track. The annular track allows the hot-pressed flat plates to move along the processing direction of the composite unit, and after the lamination is completed, Continue moving along the circular track back to the starting position.

As a further improvement of the present invention, the circuit board conveying device is a circuit board unwinding roller and/or a belt conveying device. The circuit board unwinding roller can be used to convey roll-shaped FPC (Flexible Printed Circuit). board) circuit board, the belt conveyor can be used to transport sheet FPC circuit boards or sheet PCB (Printed Circuit Board) circuit boards.

As a further improvement of the present invention, a nitrogen device is provided in the tunnel oven for blowing nitrogen into the tunnel oven.

The application of multi-purpose circuit board production line can be used to process FRCC materials, cover films, copper foil, prepreg films, copper-clad laminates or other related materials, and compound them with circuit boards to form multi-layer boards, and then etch circuits to prepare Flexible single-sided circuit boards, flexible double-sided circuit boards, flexible multi-layer circuit boards and soft-hard combination multi-layer circuit boards can also be used with coating devices, including single- and double-sided FCCL (Flexible Copper Clad Laminate), FRCC (flexible resin coated) Production of copper) materials, covering films or other coating materials.

The invention also discloses a processing method of multi-layer boards, which is processed by using FRCC materials in conjunction with a multi-purpose circuit board production line.

The FRCC (flexible resin coated copper) material includes a copper layer, a cured film layer, a semi-cured adhesive layer, and a release film layer from bottom to top;

The semi-cured adhesive layer is made through a coating process;

The release film layer is made of PET material;

The processing method of the multilayer board includes the following steps:

S1. FRCC material preprocessing: first place the rolled FRCC material on the material unwinding roller, start the material processing unit, and transfer the FRCC material to the transmission device, and the cutting device will punch and/or cut the FRCC material;

S2. Release film peeling: Transfer the FRCC material processed in step S1 to the peeling device. The FRCC material passes through the guide unwinding roller and the peeling positioning roller in sequence. After passing through the peeling positioning roller, the release film on the FRCC material is peeled off and It is sent to the peeling and winding roller for winding, and the FRCC material after peeling off the release film is sent to the alignment device;

S3. Multi-layer board lamination: The circuit board transmission device transmits the circuit board, so that the circuit board and the FRCC material after peeling off the release film are simultaneously transmitted to the alignment device. After the circuit board and FRCC material are aligned, they are sequentially transmitted to the pre-pressing device. device, hot pressing device, tunnel oven, and then pass between the two pressure rollers to complete the pressing and baking of the FRCC material and the circuit board. At this time, the semi-cured adhesive layer on the FRCC material is completely solidified. The FRCC material is tightly attached to the circuit board and then sent to the punching inspection system to punch and inspect the multilayer board;

In step S1, after drilling and/or cutting by the cutting device, positioning holes and/or opening patterns are formed on the FRCC material. When it is necessary to form opening patterns on the FRCC material, the material unwinding roller is During the process of transferring the FRCC material to the conveyor, the release film of the FRCC material faces the cutting device, and the cutting device only cuts the contour line of the corresponding shape on the release film according to the opening pattern; when it is only necessary to form a positioning on the FRCC material hole, there is no limit on the orientation of the release film during the transfer of the FRCC material; at the same time, in the step S2, when the release film of the FRCC material has the outline of the opening pattern, the FRCC material after peeling off the release film A release film of corresponding shape is retained on the cover and located at the opening position;

When the material unwinding roller delivers the FRCC material to the conveying device, the release film of the FRCC material faces the cutting device, and the FRCC material processed by the cutting device is directly conveyed to the peeling device through the turning device;

In the step S2, the leak detection and leak filling system is also used to detect the opening pattern on the FRCC material after the release film is peeled off and the detection results are recorded, and the leak filling robot replenishes the release film of the corresponding shape at the peeling position;

In the step S2, the circuit board detection device detects the circuit board transmitted by the circuit board conveying device and records the detection results. The horizontal positioning roller and the horizontal guide roller transport the FRCC material after peeling off the release film horizontally and connect it with the circuit board. In parallel, at the same time, use the alignment system to align the positioning holes and/or opening patterns on the FRCC material with the positioning holes and/or opening patterns on the circuit board. The aligned FRCC material and circuit board pass through two Pre-pressing is carried out between the pre-pressing rollers and then sent to the hot pressing device for hot pressing;

In the step S2, the protective film is also transferred to the pre-pressing device through the first pulling and unwinding roller, so that the protective film covers the FRCC material and passes through the pre-pressing device and the hot pressing device together with the FRCC material and the circuit board, completing the process. The FRCC material and the circuit board are pressed together to form a multi-layer board. At this time, the protective film is transferred to the pulling and winding roller for winding, and the multi-layer board formed by the hot pressing device is baked in a tunnel oven. , forming a multi-layer board with stable performance. The multi-layer board is sent to the punching inspection system. The punching inspection system punches holes in the FRCC material of the multi-layer board to form through holes and blind holes and inspects and confirms the holes on the multi-layer board. ;Finally, the multi-layer board is rolled up;

The protective film is PET film, silica gel film or TPX (polymer of 4-methylpentene-1);

The hot-pressing device is a flat-plate hot-pressing device. When the FRCC material and circuit board are transferred from the pre-pressing device to the hot-pressing device, the two opposite hot-pressing flat plates are pressed toward each other, and the FRCC material and circuit board are hot-pressed. Move forward along the circular track with the FRCC material and circuit board until the preset lamination time is reached. The two pressed hot pressing plates separate and continue to move along the circular track to the initial position, waiting to be transferred by the pre-pressing device. FRCC material and circuit board, and repeat the above actions;

The circuit board transmission device is a circuit board unwinding roller used to transport roll-shaped FPC circuit boards;

The processing method of the multilayer board also includes the following steps:

S4. The multilayer board is then subjected to a process including dry film application, exposure, development, electroplating and etching to form circuits on the FRCC material to obtain a multilayer circuit board. At the same time, the copper on the FRCC material and located at the opening position is etched. An opening corresponding to the opening pattern is formed, and the release film retained on the FRCC material corresponds to the opening one-to-one;

S5. Uncapping: Cut the FRCC material along the edge of the opening formed by etching in step S4, and peel off the remaining FRCC material at the cut point to complete the uncapping;

S6. Repeat steps S2, S3, S4, and S5 for the multilayer circuit board after the lid is opened until a multilayer circuit board with the required number of layers is obtained.

The invention also discloses a processing method for preparing FRCC materials in a multi-purpose circuit board production line, which includes the following steps:

Ⅰ. Material preparation: Place a roll of single-sided copper clad plate on the coating unwinding roller. The coating unwinding roller 41 transfers the single-sided copper clad plate to the upper glue machine and coats glue on the insulating film layer of the single-sided copper clad plate to form One adhesive-backed copper-clad board;

Ⅱ. Baking: The gluing machine sends the adhesive-backed copper-clad plate to the alignment device. After bypassing the horizontal positioning roller, the adhesive-backed copper-clad plate passes sequentially between two horizontal guide rollers, between two pre-pressure rollers, and heat Pressure device and tunnel oven to completely evaporate the solvent in the glue on the adhesive-backed copper-clad board to form a semi-cured glue layer;

Ⅲ. Release film lamination: The adhesive-backed copper-clad laminate baked in a tunnel oven is transferred to between the two pressure rollers. At this time, the second pulling and unwinding roller transfers the release film between the two pressure rollers, so that the release film The molded film is bonded to the semi-cured adhesive layer of the adhesive-backed copper-clad laminate, and then transferred to the composite material winding roller for winding to make the FRCC material.

In step II, the horizontal guide roller, pre-pressure roller, and hot pressure roller close to the glue layer side of the adhesive-backed copper-clad laminate are raised.

The beneficial effects of the present invention are:

According to the circuit board production process, each processing area is integrated into a multi-purpose circuit board production line. During the material transfer process in the multi-purpose production line, the material can be directly punched and/or cut, the release film peeled off, aligned, and compounded. , baking, curing and other processing; by activating part or all of the processing area, it can be used to process FRCC materials, cover films, copper foil, semi-cured films, copper-clad laminates or other related materials, and composite them with circuit boards Single, double and multi-layer boards can be used with etching process lines to prepare single-double-layer circuit boards or multi-layer circuit boards. It can also be used with coating devices to produce single-double panel materials, FRCC materials or cover films, etc. It is flexible to use and It has a high degree of automation, simplifies the processing process, effectively reduces manual work, saves water, electricity and materials, greatly reduces processing costs, material costs, reduces the generation and emission of industrial waste, and subverts circuit board production and traditional supply chain models.

Description of the drawings

In order to explain this embodiment or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiment or the prior art will be briefly introduced below. Obviously, the drawings in the following description are the For some embodiments of the invention, those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the processing flow of the material processing unit in the processing method of multi-layer boards in Embodiment 2 of the present invention;

Figure 2 is a schematic diagram of the processing flow of the multi-layer board composite processing unit in the multi-layer board processing method in Embodiment 2 of the present invention;

Figure 3 is a schematic diagram of the processing flow of the material processing unit in the processing method of the circuit board laminating cover film in Embodiment 4 of the present invention;

Figure 4 is a cross-sectional view of the covering film;

Figure 5 is a schematic diagram of the processing flow of the composite unit in the processing method of circuit board lamination and covering film in Embodiment 4 of the present invention;

Figure 6 is a schematic plan view of a processing method for a multilayer board according to Embodiment 5 of the present invention;

Figure 7 is a stacked cross-sectional view of PCB board 702 in Embodiment 5 of the present invention;

Figure 8 is a schematic plan view of the transmission roller in the present invention;

Figure 9 is a schematic plan view of the processing method of FRCC materials in Embodiment 6 of the present invention;

Figure 10 is a schematic plan view of the processing method of the flexible double-sided copper clad laminate in Embodiment 7 of the present invention;

Figure 11 is a schematic structural diagram of the belt transmission device in the present invention;

Figure 12 is a schematic diagram of the ring track structure in the multi-purpose circuit board production line of the present invention;

Figure 13 is a structural schematic diagram of the process of cutting the FRCC material and peeling off the release film at the opening position in the multi-layer board processing method in Embodiment 2 of the present invention;

Figure 14 is a schematic diagram of the lamination structure of the FRCC material and the circuit board in the processing method of the multilayer board in Embodiment 2 of the present invention;

Figure 15 is a schematic structural diagram of the opening formed at the uncovered position of the multilayer board after etching in Step S4 of the multilayer board processing method in Embodiment 2 of the present invention;

Figure 16 is a schematic structural diagram of the lid opening in step S5 of the multilayer board processing method in Embodiment 2 of the present invention;

Figure 17 is a schematic plan view of the cut surface after processing of FRCC material in the processing method of multi-layer boards in Embodiment 2 of the present invention;

Figure 18 is a partial enlarged view of the opening position after the FRCC material peels off the release film in the processing method of the multi-layer board in Embodiment 2 of the present invention;

Figures 19 to 24 are schematic plan views of six embodiments of the coating machine of the present invention;

Figure 25 is a schematic diagram of the processing flow of the multi-layer board composite processing unit in the multi-layer board processing method in Embodiment 8 of the present invention;

Figure 26 is a schematic diagram of the processing flow of using a flat plate hot pressing device to hot press the multi-layer board in the multi-layer board processing method in Embodiment 8 of the present invention;

Figure 27 is a flow chart for the preparation of FRCC materials in Embodiment 6 of the present invention;

Figure 28 is a flow chart for preparing a flexible single-sided copper-clad laminate in Embodiment 7 of the present invention;

Figure 29 is a flow chart for the preparation of flexible double-sided copper-clad laminates in Embodiment 7 of the present invention;

Figure 30 is a flow chart for the preparation of the covering film in Embodiment 8 of the present invention;

Figure 31 is a flow chart of the preparation of multilayer boards in the multilayer board processing method in Embodiment 2 of the present invention;

Figure 32 is a flow chart for the preparation of a multi-layer IC substrate in Embodiment 9 of the present invention;

Figure 33 is a work flow chart of the leak detection and repair system of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of this embodiment clearer, the technical solutions in this embodiment will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.

Embodiment 1

Please refer to Figures 1 to 13. This embodiment provides a multi-purpose circuit board production line, including:

At least one material processing unit 1: It includes a material unwinding roller 11 arranged sequentially along the processing direction, and a conveying device 12. The material unwinding roller 11 conveys the material to be processed to the conveying device 12, which is provided at the conveying device 12. There is a cutting device 13 for punching and/or cutting the material;

A composite unit 2: It includes a circuit board conveying device 21, a positioning device 22, a pre-pressing device 23, a hot pressing device 24, a tunnel oven 25, and at least a pair of pressing rollers 26 arranged sequentially along the processing direction. , and a punching inspection system 27, the circuit board transmission device 21 transmits the circuit board to the alignment device 22;

At least one peeling device 3 includes a guide unwinding roller 31, a peeling positioning roller 32, and a peeling and winding roller 33; the material processed by the material processing unit 1 passes through the guide unwinding roller 31 and the peeling positioning roller 32 in sequence. Transferred to the alignment device 22, the peeling and winding roller 33 winds up and recovers the film material peeled off from the material after passing through the peeling and positioning roller 32;

At least one coating device 4 includes a coating unwinding roller 41 and a gluing machine 42. The coating unwinding roller 41 transports the substrate to be coated to the upper gluing machine 42 and applies coating on the substrate to be coated. The glue is then transferred to the alignment device 22;

At least one pulling and conveying device 5 includes at least a first pulling and unwinding roller 51, a second pulling and unwinding roller 52, and a pulling and winding roller 53. The first pulling and unwinding roller 51 moves toward the predetermined direction. The pressing device 22 transfers the material, After passing through the hot pressing device 24, it is transferred to the pulling and winding roller 53 for winding, and the second pulling and unwinding roller 52 transfers the material to the pressure roller 26.

In this embodiment, according to the circuit board production process, each processing area is integrated into a multi-purpose circuit board production line. During the material transfer process in the multi-purpose production line, the material can be directly punched and/or cut, inspected, and released. Peeling, alignment, lamination, baking, curing and other processing.

By activating part or all of the processing area, it can be used to process FRCC material 10, cover film 20, copper foil 30, prepreg 40, copper clad laminate 50, RCC (Resin Coated Copper) 60 or other related materials, and be used with The circuit board 70 is composited into a multi-layer board, and then combined with etched circuits to prepare a single or double-layer circuit board or a multi-layer circuit board. It can also be used with the coating device 4 to coat single- and double-panel materials, FRCC material 10 or cover film 20 , etc. The production of process materials is flexible and highly automated, simplifying the processing process, effectively reducing manual work, and saving water, electricity, and materials.

As shown in Figure 11, in this embodiment, the conveyor device adopts a belt conveyor device 12 for conveying, which includes a pair of conveying rollers 121 arranged oppositely along the processing direction, and a conveying roller sleeved on the outside of the two conveying rollers 121. Belt 122, in which a support plate 123 is provided between the two conveying rollers 121 and on the side away from the carrying surface of the conveying belt 122. Evenly distributed toothed stripes are formed on the carrying surface of the conveying belt 122. The cutting device 13 is located on the supporting surface. The processing material is punched and/or cut according to the circuit board pattern at board 123 . Compared with directly pulling and transmitting the materials for processing, by setting up the transmission device 12 for transmission, the shaking and dislocation of the materials for processing are avoided during the transmission process, so that the cutting device 13 can accurately punch and/or cut the materials. .

In this embodiment, the material processing unit 1 also includes a pressing roller 14 respectively disposed at both ends of the conveying device 12 , wherein the lower end of the pressing roller 14 is lower than the upper end of the conveying roller 121 and the material unwinding roller 11 respectively. upper end. The laminating roller 14 presses the material at both ends of the conveying device 12 downward so that the material is tightly attached to the conveying belt 122 to avoid relative movement of the material and the conveying belt 122 during the conveying process, so that the material is conveyed stably, which is conducive to improving the cutting device. 13. Accuracy in punching and/or cutting material.

Of course, in other embodiments, the requirements for cutting accuracy are not high. At the same time, in order to reduce equipment costs, the transmission device can directly use the transmission roller 12' for transmission. Specifically, as shown in Figure 3, the transmission roller 12 'Includes two transmission pressure roller groups 121' arranged oppositely along the processing direction. The support plate 123 is provided between the two transmission pressure roller groups 121'. Send pressure wheel 1211', and the material passes between the two transmission pressure wheels 1211'.

The cutting device 13 includes at least one or more of an intelligent laser cutting device 131 , a circular knife die cutting device 132 , and a stamping and die cutting device 133 . Laser cutting has the characteristics of high precision. Using laser cutting can effectively improve the accuracy of drilling and/or cutting graphics. The circular knife die-cutting device 132 and the stamping die-cutting device 133 have lower equipment costs and are used for processing larger apertures. When punching and/or cutting graphics with larger cutting areas, the cutting efficiency is higher and has obvious advantages.

In actual production, the cutting device 13 can be selected according to the precision of the cutting pattern and the cutting area. Of course, one of the intelligent laser cutting device 131, the circular knife die-cutting device 132, and the stamping and die-cutting device 133 can also be used. Or both can be used together to ensure the accuracy of drilling and/or cutting graphics, and at the same time, improve production efficiency.

The multi-purpose production line also includes at least one turning device 15, which includes at least two turning rollers 151 arranged up and down. The materials processed by the cutting device 13 are turned over by the two turning rollers 151 in turn and then transported to the peeling device 3. By arranging at least one turning device 15 corresponding to the material processing unit 1, the material processed by the cutting device 13 is turned over. The direction of the cutting surface can be directly changed during the material transfer process without manual adjustment, thereby improving the production line. compactness and continuity.

Of course, in other embodiments, the material processing unit 1 also includes at least one material winding roller 16. The material processed by the cutting device is transferred to the material winding roller 16 for winding; the rolled material 3 is transferred to The unwinding roller 31 is guided for unwinding, so that there is no need to provide a turning device 15 to change the direction of the cutting surface of the material.

It also includes at least one leak checking and leak filling system 6, which is used to check the graphics on the material after being processed by the cutting device 13. The leak checking and leak filling system 6 includes:

a server;

At least one pattern detection device 61, which is connected with the server signal and is used to collect image information and transmit the image information to the server;

And at least one laser drilling device 62, which is connected with the server signal and is used to receive instructions transmitted by the server and drill holes in the material according to the instructions;

At least one leak-tightening manipulator, which is connected to the server signal and is used to receive the instructions transmitted by the server and according to the instructions, repair the leaks of the release film that has fallen off at the window opening position on the material, or that cannot be removed. Repair materials should be prevented from flowing into the next process;

At least one processor; its communication connection includes a graphic inspection module, a visual inspection module, a storage module and a controller. The graphic inspection module is communicatively connected to the graphic detection device 61. The graphic detection device 61 detects the material processed by the cutting device 13 through the graphic inspection module. Check and analyze whether the graphics on the cutting surface are complete. The specific analysis process includes: marking the material processed by the cutting device 13 as the detection object i, i=1, 2,...,n, n is a positive integer, and for the detection object i Take an image of the cutting surface and obtain the detection image i, obtain the standard image through the storage module, compare the detection image i with the standard image through image processing technology, and obtain the coincidence degree CHi of the detection image i and the standard image, image processing technology It is a technology that uses computers to process image information, mainly including image digitization, image enhancement and restoration, image data encoding, image segmentation and image recognition, etc. The coincidence threshold CHmin is obtained through the storage module, and the coincidence degree CHi is compared with the coincidence threshold CHmin: if the coincidence degree CH is less than or equal to the coincidence threshold CHmin, it is determined that the pattern of the detection object i is unqualified, and the image inspection module sends the pattern unqualified to the processor. signal; if the coincidence degree CH is greater than the coincidence threshold CHmax, it is determined that the pattern of the detection object i is qualified, and the image inspection module sends a pattern qualified signal to the processor; there are many reasons for the pattern to be unqualified, mainly including two categories, the first category is material The material itself is a problem. This type of reason cannot be avoided, and the occurrence is low and will not occur in batches; the second type is equipment failure. If the equipment is not adjusted and repaired in a timely manner, batch failures will occur; therefore, it is necessary to check the graphics for unqualified Conduct continuity testing on the test object, and analyze the causes of unqualified graphics through continuity testing. The process of continuity testing includes: obtaining the first two graphic test results of the test object, if the first two graphic results are both graphically qualified , then the judgment result is discontinuous, and the unqualified graphics are caused by the unqualified material itself; if the first two graphic results are both unqualified graphics, then the judgment results are continuous, and the image inspection module sends a continuous unqualified signal to the processor, and the graphic is not qualified. Qualification is caused by equipment failure, and the fault needs to be debugged and repaired. After receiving the unqualified continuous signal, the processor will send the unqualified continuous signal to the mobile phone terminal of the manager. After receiving the unqualified continuous signal, the manager will check the cutting device 13 and The transmission device 12 performs inspection and maintenance; if the first two graphic results are one pass and one failure, then the order of occurrence of the graphic test results is analyzed: if the graphic failure result is first, the judgment result is discontinuous; if the graphic is qualified If the result is first, the judgment is continuous and pending. If two detection objects with unqualified graphics appear in succession, the image inspection module will mark the next image inspection as a key inspection. The process of key inspection is: image the inspection object twice. Compare the shooting and coincidence degree. When there is an unqualified graphic result in the two detection results, it is judged that the graphic of the detection object is unqualified. The image inspection module sends a graphic unqualified signal to the processor, that is, as long as the coincidence degree is less than the coincidence threshold once, , then it is judged that the graphic of the detection object is unqualified. The image inspection module is also used to analyze the distribution of graphics detection results. The process of result distribution analysis includes: establishing a coincidence set {CH1, CH2,..., CHn} for the coincidence degree CHi of the detection object i, calculating the variance of the coincidence set and The calculation result is marked as the distribution coefficient FB of the coincident set, the distribution threshold FBmax is obtained through the storage module, and the distribution coefficient FB is compared with the distribution threshold FB: if the distribution coefficient FB is less than or equal to the distribution threshold FBmax, it is determined that the cutting device 13 is working stably; If the distribution coefficient FB is greater than the distribution threshold FBmax, it is determined that the cutting device 13 is working unstable. The image inspection module sends a maintenance signal to the manager's mobile terminal through the processor. The manager receives the maintenance signal and detects and repairs the cutting device.

At the same time, for materials that need to be opened, the visual inspection module is used to check whether the release film 34' has fallen off at the position to be opened. The specific inspection process includes: taking an image of the opening position of the material and marking the obtained image for analysis. Image, enlarge the analyzed image into a pixel grid image, mark the pixel grid of the pixel grid image as u, u=1, 2,..., m, m is a positive integer, and obtain the grayscale value HDu of the pixel grid u through image processing technology , the grayscale threshold HDmin is obtained through the storage module, and the grayscale value HDu is compared with the grayscale threshold HDmin one by one: if the grayscale value HDu is less than or equal to the grayscale threshold HDmin, the corresponding pixel grid is marked as a fallen pixel grid; The degree value HDu is greater than the gray threshold HDmin, then the corresponding pixel grid is marked as a complete pixel grid; the number of dropped pixel grids is obtained and marked as w, the ratio of w and m is marked as the dropout ratio, and the dropout threshold is obtained through the storage module. Compare the shedding ratio with the shedding threshold: if the shedding ratio is less than the shedding threshold, it is determined that the release film 34' has not fallen off; if the shedding ratio is greater than or equal to the shedding threshold, it is determined that the release film 34' has fallen off, and the visual inspection module sends a message to the processor. After receiving the leak compensation signal, the processor sends the leak compensation signal to the controller. After receiving the leak compensation signal, the controller controls the leak compensation manipulator to repair the leakage of the release film 34' that has fallen off at the position of opening the cover. Specifically, the pattern detection equipment is an AOI (Automated Optical Inspection) pattern detection device.

Specifically, as shown in Figure 33, complete cutting graphic information is pre-stored in the server. When the material processed by the cutting device 13 is transferred to the leak detection and repair system 6, the graphic detection device 61 automatically captures the cutting surface of the material. Cut the graphics to obtain the graphics information and send it to the server, the server will receive The obtained graphic information is compared with the pre-stored cutting graphic information. When the collected graphic information is consistent with the parameters of the cutting graphic information in the server, it is determined to be qualified. When the collected graphic information is consistent with the parameters of the cutting graphic information in the server, it is judged to be qualified. When there are differences in parameters, the corresponding difference parameters are recorded to determine whether to repair or scrap, and the server transmits the determination results to the laser drilling equipment 62 and the leak repair manipulator respectively; the laser drilling equipment 62 receives instructions from the server to drill holes in the material to form a through hole. holes and/or blind holes, or to repair the holes that have been formed in the material; the leak repair robot receives the instructions transmitted by the server and according to the instructions, repairs the leaks of the release film that has fallen off at the window opening position on the material, or takes out the material that cannot be repaired , to avoid flowing into the next process.

The parameters include the shape of the cutting pattern at each corresponding position, the integrity of the cutting pattern, the depth of the cutting, and whether the material on the cutting surface has fallen off. Specifically, for materials that need to be opened, the parameters include the opening pattern. The shape, the integrity of the cover opening pattern, the depth of cutting, and whether the release film 34' has fallen off at the cover opening position. For example, when the server detects that the release film 34' has fallen off at the cover opening position, it will record the falling off position. The specific coordinates of the position are positioned according to the coordinates and the leak-repairing robot is controlled to repair the leakage of the release film 34' that has fallen off at the position of opening the cover.

The pattern detection device 61 is an AOI (Automated Optical Inspection) detection device or a CCD detection device. Specifically, when the requirements for processing accuracy are high, AOI testing equipment is generally used, and when the requirements for processing accuracy are not high, CCD testing equipment is generally used. Of course, in other embodiments, other detection devices may be used instead, as long as image information collection of the cutting pattern can be achieved.

The leak detection and repair system 6 can be installed between the cutting device 131 and the alignment device 22. Specifically, it can be installed between the cutting device 131 and the peeling device 3 and/or between the peeling device 3 and the alignment device 22, so as to ensure The integrity of the positioning holes and/or opening patterns on the material facilitates precise alignment of the material and circuit board. In this embodiment, the leak detection and repair system 6 is provided between the peeling device 3 and the alignment device 22 .

In this embodiment, the positioning device 22 includes at least one horizontal positioning roller 221, at least a pair of horizontal guide rollers 222, and a positioning system 223. The horizontal positioning roller 221 and the horizontal guide roller 222 are arranged horizontally, and after peeling The material behind the positioning roller 32 passes through the horizontal positioning roller 221 and the horizontal guide roller 222 in sequence. The horizontal positioning roller 221 and the horizontal guide roller 222 make the material horizontally transported and parallel to the circuit board. The alignment system 223 is used to align the material and the circuit board, and the gap between the two horizontal guide rollers 222 is adjustable; specifically, the alignment system 223 is a CCD visual auxiliary alignment system, and the CCD visual auxiliary alignment system is used The positioning holes and/or the opening pattern on the material conveyed by the guide unwinding roller 31 are aligned with the positioning holes and/or the opening pattern of the circuit board to achieve precise alignment of the material and the circuit board, which is beneficial to improving the processing of the circuit board. Accuracy.

In this embodiment, the pre-pressing device 23 is at least a pair of pre-pressing rollers 231, and the gap between the two pre-pressing rollers is adjustable.

In this embodiment, a circuit board detection device 28 is provided between the circuit board conveying device 21 and the pre-pressing device 23 for detecting the circuit board. Specifically, the circuit board detection device 28 is an AOI circuit board detection device.

In order to facilitate operation, in this embodiment, the multi-purpose circuit board production line also includes a composite material winding roller 71 or a composite material cutting device 72. The multi-layer boards or materials processed by the composite unit 2 are transferred to the composite material. The winding roller 71 or the composite material cutting device 72. The composite material winding roller 71 winds up the multi-layer board or material; or the composite material cutting device 72 cuts the multi-layer board or material into sheets. , and use a robot to stack the sheet-shaped multi-layer boards or materials in sequence; the rolled-up multi-layer boards or multi-layer boards cut into sheets are then processed through a process including dry film application, exposure, development, electroplating and etching to form multi-layer circuit board.

The heat pressing device 24 includes at least a pair of heat pressing rollers 241 or a flat plate heat pressing device 242, and the gap between the two heat pressing rollers 241 is adjustable; as shown in Figure 2, Figure 5 and Figure 12, the The flat plate hot pressing device 242 includes at least a pair of hot pressing flat plates 2421 that are arranged oppositely up and down and can be raised and lowered, and an annular track 2422 arranged corresponding to the hot pressing flat plates 2421. The hot pressing plate 2421 moves along the processing direction of the composite unit 2, and continues to move along the circular track 2422 back to the initial position after the pressing is completed. Specifically, when the pre-pressed material and/or circuit board is transferred to the flat plate hot pressing device 242, the two opposite hot pressing flat plates 2421 are pressed toward each other to heat press the material and/or circuit board along the circular track. 2422 moves forward synchronously with the material and/or circuit board until the pressing time reaches the preset time. At this time, the hot pressing plate 2421 pressed together separates and continues to move along the circular track 2422 back to the initial position, waiting. materials and/or circuit boards delivered by the pre-pressing device 23, and repeat the above actions, by reasonably setting the number of the hot pressing plate 2421 amount, and according to the transmission frequency of the composite unit 2, the hot pressing plate 2421 is continuously moved and pressed along the annular track 2422, without pressure leakage, and the pressing effect is effectively improved.

Compared with the hot pressing roller, the flat plate hot pressing has a large active area and continuously pressurizes the product in the vertical direction, so that the heat and pressure on the product are uniform at all parts. In this way, the semi-cured The glue spreads evenly under the action of heat and pressure, and can fully fill the gaps between lines, effectively improving the lamination effect. Specifically, due to the soft and thin characteristics of flexible materials such as FCCL and FPC or circuit boards, after being heated The material is softer, especially for FPC boards. Since there are lines on the surface, there is an obvious height difference. If a hot press roller is used for lamination, the semi-cured glue cannot fully fill the gaps between the lines, resulting in interlayer pressure. The bonding effect is not good. Therefore, for products with soft and thin materials, flat plate hot pressing devices are generally used for hot pressing during production. However, for hard boards, because the hard boards are thicker and relatively hard, the The height difference between the circuits on the hard board is not obvious and is not easily deformed under the action of heat. Therefore, the use of hot pressure rollers can also have a good lamination effect. Of course, the above-mentioned selection of the hot pressing device is only for general situations and does not limit the use occasions of the hot pressing roller and the flat plate hot pressing device.

The circuit board conveying device 21 is a circuit board unwinding roller 211 and/or a belt conveying device 212. The circuit board unwinding roller 211 can be used to convey roll-shaped FPC circuit boards, and the belt conveying device 212 can be used to convey sheet-shaped FPC circuit boards. FPC circuit boards can also be used to transport sheet PCB circuit boards.

Specifically, a nitrogen device is provided in the tunnel oven 25 for blowing nitrogen into the tunnel oven 25 . When used to prepare FRCC materials 60, multilayer boards, and copper-clad laminates 50, since these products contain copper foil, the copper foil is easily oxidized during high-temperature baking. By blowing nitrogen into the tunnel oven 25, it can It has the function of isolating oxygen, preventing oxidation and discoloration of copper foil or other easily oxidized materials, and ensuring product performance.

Specifically, as shown in Figures 19-24, the optional implementation modes of the gluing machine 42 include the following six:

A. The gluing machine 42a includes a first coating roller 42a1 and a first glue discharging head 42a2 arranged on the left and right. The film passes between the first coating roller 42a1 and the first glue discharging head 42a2. The gap between the first glue discharging head 42a2 and the coating roller 42a1 is changed to control the glue thickness, as shown in Figure 19.

B. The gluing machine 42b includes a left coating roller 42b1 and a right coating roller 42b2 arranged on the left and right. A second glue discharging head 42b3 is provided below the right coating roller 42b2, and a second glue discharging head 42b3 is provided below the left coating roller 42b1. There is a first squeegee 42b4, and the film sequentially passes between the second glue outlet 42b3 and the right coating roller 42b2, and between the left coating roller 42b1 and the right coating roller 42b2. The glue thickness is controlled by controlling the gap between the left coating roller 42b1 and the right coating roller 42b2, as shown in Figure 20.

C. The gluing machine 42c includes a first glue tank 42c1. An upper coating roller 42c2 and a lower coating roller 42c3 are provided above the first glue tank 42c1. The lower end of the lower coating roller 42c3 is immersed in the In the first glue tank 42c1, a second squeegee (42c4', 42c4″) is provided on one side of the lower coating roller 42c3, and the film passes between the upper coating roller 42c2 and the lower coating roller 42c3. Through control The gap between the upper coating roller 42c2 and the lower coating roller 42c3 controls the glue thickness, as shown in Figures 21 and 22.

D. The gluing machine 42d includes a second coating roller 42d1. A second glue groove 42d2 is provided obliquely above the second coating roller 42d1, and a scraper is provided opposite to the second coating roller 42d1. The rubber roller 42d3 and the rubber squeegee roller 42d3 are partially immersed in the second rubber groove 42d2, wherein a scraping groove 42d31 is formed on the rubber squeegee roller 42d3 and on opposite sides. The film passes through the rubber squeegee roller 42d3 and the second rubber groove 42d2. Coating roller 42d1 room. During the coating process, the scraper roller 42d3 rotates to cause the scraper 42d31 to rotate back and forth between the second glue slot 42d2 and the film, thereby coating the glue on the film. By controlling the relationship between the scraper roller 42d3 and the second coating roller 42d1 gap to control the glue thickness, as shown in Figure 23.

E. The gluing machine 42e includes a third coating roller 42e1. A coating pressure roller 42e2 is provided above the third coating roller 42e1 and on opposite sides. The third coating roller 42e1 is provided on one side. There is a glue scraper 42e3, which scrapes the glue layer after gluing. The lower end of the third coating roller 42e1 is immersed in a third glue tank 42e4. The two coating pressure rollers 42e2 press the film on Above the third coating roller 42e1, the glue thickness is controlled by controlling the gap between the film and the third coating roller 42e1, as shown in Figure 24.

Embodiment 2

Embodiment 2 discloses a processing method of a multi-layer board, which is processed by using the FRCC material 10 in conjunction with a multi-purpose circuit board production line.

As shown in Figures 14 and 31, the FRCC (flexible resin coated copper) material 10 includes a copper layer 101, a cured film layer 102, a semi-cured adhesive layer 103, and a release film layer 104 from bottom to top.

Specifically, the semi-cured adhesive layer 103 is made through a coating process; it is beneficial to form a tight connection between the cured film layer 102 and the semi-cured adhesive layer 103, and it is difficult to generate bubbles between the layers.

The release film layer 104 is made of PET material.

As shown in Figure 1 and Figure 2, in this embodiment, the processing method of the multi-layer board includes the following steps:

S1. FRCC material 10 pre-processing: first place the roll-shaped FRCC material 10 on the material unwinding roller 11, start the material processing unit 1, transfer the FRCC material 10 to the conveying device 12, and cut the FRCC material 10 by the cutting device 13 punching and/or cutting;

S2. Release film peeling: Transfer the FRCC material 10 processed in step S1 to the peeling device 3. The FRCC material passes through the guide unwinding roller 31 and the peeling positioning roller 32 10 times. After passing through the peeling positioning roller 32, the FRCC material 10 The release film 104 is peeled off and sent to the peeling and winding roller 32 for winding, and the FRCC material 10' after peeling off the release film is sent to the alignment device 22;

S3. Multi-layer board lamination: The circuit board transmission device 21 transmits the circuit board 70 so that the circuit board 70 and the FRCC material 10' after peeling off the release film are simultaneously transmitted to the alignment device 22 to complete the circuit board 70 and the FRCC material 10 After alignment, it is sent to the pre-pressing device 23, the hot pressing device 24, and the tunnel oven 25 in sequence, and then passes between the two pressure rollers 26 to complete the pressing and baking of the FRCC material 10 and the circuit board 70, as shown in Figure 14 As shown, at this time, the semi-cured adhesive layer 103 on the FRCC material 10' is completely solidified so that the FRCC material 10' is tightly attached to the circuit board 70, and is then sent to the punching inspection system 27 to punch holes in the multilayer board. examine;

Specifically, in the step S1, after drilling and/or cutting by the cutting device 13, positioning holes and/or opening patterns are formed on the FRCC material 10. When it is necessary to form an opening pattern on the FRCC material 10 When the material unwinding roller 11 is conveying the FRCC material 10 to the conveying device 12, the release film 104 of the FRCC material 10 faces the cutting device 13, and the cutting device 13 only cuts the corresponding shape on the release film 104 according to the opening pattern. contour line; and when it is only necessary to form positioning holes on the FRCC material 10, there is no limit to the direction of the release film 104 during the transfer of the FRCC material 10; at the same time, in the step S2, when the release film of the FRCC material 10 The film 104 has an outline of an opening pattern, and a release film 104' of a corresponding shape remains on the FRCC material 10' after peeling off the release film and at the opening position, as shown in Figure 1, Figure 3, Figure 17 and Figure Shown in 18.

In order to achieve continuity of production, in this embodiment, the material unwinding roller 11 is moving towards the conveyor 12 During the process of conveying the FRCC material 10 , the release film 104 of the FRCC material 10 faces the cutting device 13 , and the FRCC material processed by the cutting device 13 is directly conveyed to the peeling device 3 through the turning device 15 .

Specifically, in the step S2, the leak detection and repair system 6 is also used to detect the opening pattern on the FRCC material 10' after peeling off the release film and record the detection results. Release film.

Specifically, in the step S2, the circuit board detection device 28 detects the circuit board conveyed by the circuit board conveying device 21 and records the detection results. The horizontal positioning roller 221 and the horizontal guide roller 222 remove the FRCC after peeling off the release film. The material 10' is transported horizontally and parallel to the circuit board 70. At the same time, the alignment system 223 is used to align the positioning holes and/or opening patterns on the FRCC material 10' with the positioning holes and/or opening patterns on the circuit board 70. , the aligned FRCC material 10' and the circuit board 70 pass between the two pre-pressing rollers 231 for pre-pressing, and then are sent to the hot pressing device 24 for hot pressing.

Specifically, due to the high rigidity of copper, it is not easily deformed under the action of pressure and heat. At the same time, there are lines on the circuit board 70 and there will be a height difference. Therefore, in actual production, the FRCC material 10 is used with the circuit board. 70 When laminating to prepare a multilayer board, if the hot pressing device 24 directly acts on the copper layer 101 of the FRCC material 10 for hot pressing, the semi-cured adhesive layer 103 on the FRCC material 10 cannot fill the gaps between the lines well. , thereby affecting the bonding effect between the FRCC material 10' and the circuit board 70. Therefore, in the step S2, the protective film is also transported to the pre-pressing device 23 through the first pulling and unwinding roller 51, so that the protective film covers the FRCC material 10' and passes along the FRCC material 10' and the circuit board 70. The pre-pressing device 23 and the hot pressing device 24 complete the pressing of the FRCC material 10' and the circuit board 70 to form a multi-layer board. At this time, the protective film is sent to the pulling and winding roller 53 for winding, and passes through the hot pressing device. 24 The multilayer board formed by lamination is baked in a tunnel oven 25 to form a multilayer board with stable performance. The multilayer board is transferred to the punching inspection system 27. The punching inspection system 27 is installed on the FRCC material of the multilayer board. Drill holes to form through holes and blind holes and check and confirm the holes on the multi-layer board; finally, the multi-layer board is rolled up.

Specifically, the protective film is PET film, silica gel film or TPX (polymer of 4-methylpentene-1). The material of the protective film is relatively soft or softens when heated. Therefore, when passing through the hot pressing device 24, During the hot pressing process, a lamination pattern matching the circuit board pattern is formed, and the FRCC material 10' is driven to deform, so that the semi-cured adhesive layer 103 on the FRCC material 10' fully fills the gaps between the circuits, thereby making the FRCC material 10' It is closely attached to the circuit board 70. Compared with the heat pressing device 24 acting directly on the circuit board 70, Compared with hot pressing of FRCC material 10', a protective film with softer material or softened by heat is used between the FRCC material 10' and the hot pressing device 24 to isolate the product from glue. The lamination effect is better, and the protective film can also protect The copper layer 101 on the FRCC material 10' prevents the copper layer 101 from being scratched during the hot pressing and transportation processes.

In this embodiment, the hot-pressing device 24 is a flat-plate hot-pressing device 242. When the FRCC material 10' and the circuit board 70 are transferred to the hot-pressing device 24 from the pre-pressing device 23, the two opposite hot-pressing flat plates 2421 press each other. When the FRCC material 10' and the circuit board 70 are combined, the FRCC material 10' and the circuit board 70 are hot pressed, and the FRCC material 10' and the circuit board 70 move forward along the circular track 2422 until the preset pressing time is reached. 2421 separated, and continue to move along the circular track 2422 to the initial position, waiting for the FRCC material 10' and circuit board 70 delivered by the pre-pressing device 23, and repeat the above action, by reasonably setting the number of hot pressing plates 2421, and according to The composite unit 2 transmits the frequency so that the hot pressing plate 2421 continuously moves and presses along the annular track 2422, without pressure leakage, and effectively improves the pressing effect.

The circuit board conveying device 21 is a circuit board unwinding roller 211 used to convey roll-shaped FPC circuit boards.

In the step 3, when the circuit board 70 and the FRCC material 10' are compounded and sent to the tunnel oven 25, the nitrogen device in the tunnel oven 25 is started to fill the tunnel oven 25 with nitrogen to prevent the circuit board 70 from being combined with the FRCC material. The copper foil on material 10' is oxidized and discolored.

Specifically, the multilayer board processing method further includes the following steps:

S4. The multilayer board is then subjected to a process including dry film application, exposure, development, electroplating and etching to form circuits on the FRCC material 10' to obtain a multilayer circuit board. At the same time, on the FRCC material 10' and at the opening position The copper is etched to form an opening 9 corresponding to the opening pattern, and the release film 104' retained on the FRCC material 10' corresponds to the opening 9 one-to-one, as shown in Figure 15;

S5. Uncovering: Cut the FRCC material 10' along the edge of the opening 9 formed by etching in step S4, and peel off the remaining FRCC material at the cut point to complete the uncapping; then press the FRCC material 10' with the circuit board 70 At this time, since the semi-cured glue 103 and the circuit board 70 are separated by the remaining release film 104' at the position corresponding to the opening 9, they will not be bonded together. Therefore, the cured insulating film layer 102 and the glue layer 103 are cut off. Finally, the remaining FRCC material can be easily peeled off, as shown in Figure 16;

S6. Repeat step S2, step S3, step S4, and S5 for the multilayer circuit board after the lid is opened until Obtain a multilayer circuit board with the required number of layers.

Embodiment 3

Embodiment 3 discloses a processing method in which a multi-purpose circuit board production line is combined with FRCC material 10 and sheet PCB board 702 to form a multi-layer circuit board. As shown in Figure 25, the main difference between Embodiment 3 and Embodiment 2 is that in step In S1, after the pre-processing of the FRCC material 10 is completed, it is transferred to the material winding roller 16 for winding; in step S2, the pre-processed FRCC material 10 is transferred to the guide unwinding roller 31 of the peeling device 3 to complete the separation of the FRCC material 10. Molding film peeling; in step S3 multi-layer board compounding, the conveying device 21 uses the belt conveying device 212 to convey the PCB board 702. At this time, on the peeling device 3 located below the belt conveying device 212, the FRCC that completes the release film peeling The material 10' passes through the horizontal positioning roller 221 and is transported to the belt conveyor 212 and is conveyed along with the belt. At this time, the semi-cured adhesive layer 103 of the FRCC material 10' faces away from the conveyor belt. At the same time, the PCB board 702 is placed on the belt conveyor through the robot. The semi-cured adhesive layer 103 of the FRCC material is aligned with the alignment holes and/or opening patterns on the FRCC material 10', so that the aligned PCB board 702 and the lower FRCC material 10' pass through the level with the belt. between the guide rollers 222; and on the peeling device 3 located above the belt conveyor 212, the FRCC material 10' that has completed the release film peeling passes through the horizontal positioning roller 221 and the alignment system 223 in sequence. The alignment system 223 separates the FRCC material 10 above. After the positioning holes and/or opening patterns are aligned with the positioning holes and/or opening patterns on the PCB board 702, they pass between the two horizontal guide rollers 222, and then are sequentially transmitted to the pre-pressing device 23, The hot pressing device 24 and the tunnel oven 25 then pass between the two pressure rollers 26 to affix the FRCC material 10' to the upper and lower surfaces of the PCB board 702 at the same time to complete the lamination and bonding of the FRCC material 10' and the PCB board 702. bake.

In this embodiment, the hot pressing device 24 uses a hot pressing roller 241 to perform hot pressing. The multi-layer boards processed by the composite unit 2 are transferred to the composite material cutting device 72 to cut the multi-layer boards into sheets and pass through The manipulator stacks the sheet-shaped multi-layer boards in sequence.

Of course, in other embodiments, the flat plate hot pressing device 242 can also be used for hot pressing, as shown in FIG. 26 .

Other processing steps are the same as those in Embodiment 3.

Embodiment 4

Embodiment 4 discloses a processing method for laminating a circuit board with a covering film. The circuit board 70 and the covering film 20 are processed by cooperating with a multi-purpose circuit board production line.

As shown in Figure 4, the covering film 20 includes an insulating film layer 201, a semi-cured adhesive layer 202, and a release film layer 203 from top to bottom;

As shown in Figures 3 and 5, the processing method of the circuit board laminating cover film includes the following steps:

(1) Preprocessing of the cover film 20: first place the roll cover film 20 on the material unwinding roller 11, start the material processing unit 1, and transfer the cover film 20 to the conveyor 12. The first cutting device 13 cuts the film according to the line pattern. The covering film 20 is perforated and/or cut, wherein the insulating film layer 201 of the covering film 20 faces the cutting device 13, and the cutting device 13 only cuts the insulating film layer 201 and semi-cured glue layer 202 of the covering film 20;

(2) Rewinding: The covering film 20 processed by the cutting device 13 is transferred to the material rewinding roller 16 for rewinding;

(3) Peeling of the cover film 20: Transfer the cover film 20 rolled up in step (2) to the guide unwinding roller 31, and after passing through the peeling and positioning roller 32, peel off the release film 203 on the cover film 20 and remove it from the cover film 20. The peeling and rewinding roller 33 rewinds and recycles the release film 203, and the covering film 20' after peeling off the release film is sent to the alignment device 22;

(4) Lamination of the covering film 20: The circuit board conveying device 21 conveys the circuit board 70, so that the circuit board 70 and the covering film 20' after peeling off the protective film are simultaneously conveyed to the alignment device 22, and the horizontal positioning roller 221 and the horizontal guide The roller 222 makes the cover film 20' parallel to the circuit board 70. At this time, the semi-cured adhesive layer 202 of the cover film 20' faces the circuit board 70, and the alignment device 22 aligns the alignment holes and the opening pattern on the cover film 20' with the The alignment holes and opening patterns on the circuit board 70 are aligned, and then sent to the pre-pressing device 23, the hot pressing device 24, the tunnel oven 25, and then pass between the two pressure rollers 26. In this way, the covering film 20 The semi-cured adhesive layer 202 on ' is completely cured and the cover film 20 ' is tightly attached to the circuit board 70;

(5) Rewinding or cutting: The circuit board 70 with the covering film 20' attached is sent to the composite material rewinding roller 71 for rewinding; or sent to the cutting device 62 to be cut into sheets, and the sheets are cut by a robot. The multi-layer boards are stacked one after another.

Embodiment 5

As shown in Figures 6 and 7, Embodiment 5 discloses a processing method for preparing multi-layer boards using copper foil 30, prepreg (PP) 40 and sheet PCB board 702 in conjunction with a multi-purpose circuit board production line, including the following steps:

a. Material preparation: Place the copper foil 30 on the guide unwinding roller 31; stack the prepreg film 40, PCB board 702, and prepreg film 40 in sequence to form a PCB board 702 stack 702', and place them on the belt for transmission Transmit together on device 212;

b. Multilayer board preparation: the belt conveyor 212 conveys the PCB board stack 702' to the alignment device 22, the guide unwinding roller 31 synchronously conveys the copper foil 30 to the alignment device 22, the horizontal positioning roller 221 and the horizontal guide roller 222 makes the copper foil 30 and the PCB board stack 702' parallel, the alignment system 223 aligns both sides of the copper foil 30 with the two sides of the PCB board stack 702', and then sequentially sends them to the pre-pressing and pre-pressing device 23, heat Pressing device 24, tunnel oven 25, and then passes between two pressing rollers 26. In this way, the semi-cured film 40 is completely solidified so that the copper foil 30 is tightly attached to the PCB board 702 to form a multi-layer board;

c. Multilayer board processing: The punching inspection system 27 punches and/or cuts the multilayer board at the corresponding position according to the circuit board pattern, and then sends it to the cutting device 72 to cut into sheets, and the sheet is cut by the robot. Multiple layers of boards are stacked in sequence;

d. Multilayer circuit board processing: Cut the multilayer board into sheets and then go through the exposure, development and etching circuit board production process to form a multilayer circuit board.

In this embodiment, in step b, when the PCB board 702 stack 702' and the copper foil 30 are transferred to the alignment device 22, the pulling and unwinding roller 51 synchronously transfers the protective film to the pre-pressing device 23, and the protective film covers On the surface of the copper foil 30 and transported forward together with the copper foil 30 and the circuit board stack 702', after passing through the heat pressing device 24, the protective film is transported to the pulling and winding roller 53 for winding.

In step b, before the copper foil 30 and the PCB board stack 702' are transferred to the tunnel oven 25, the nitrogen device in the tunnel oven 25 is started to fill the tunnel oven 25 with nitrogen to prevent the copper foil 30 and the PCB from interfering with each other. The copper foil on board stack 702' is oxidized and discolored.

In other embodiments, sheet FPC can also be used instead of sheet PCB to prepare flexible multilayer boards.

Embodiment 6

As shown in Figures 9 and 27, Embodiment 6 discloses a processing method for preparing FRCC materials on a multi-purpose circuit board production line, which includes the following steps:

Ⅰ. Material preparation: Place a roll of single-sided copper clad laminate 501 on the coating unwinding roller 41. The coating unwinding roller 41 transfers the single-sided copper clad laminate 501 to the upper glue machine 42 and installs the insulating film layer of the single-sided copper clad laminate 501. Apply glue on the top to form an adhesive-backed copper-clad board 501';

Ⅱ. Baking: The gluing machine 42 sends the adhesive-backed copper-clad plate 501' to the alignment device 22. After bypassing the horizontal positioning roller 221, the adhesive-backed copper-clad plate 501' passes between two horizontal guide rollers 222 and two A pre-pressure roller 233 room, a hot pressing device 24, and a tunnel oven 25 completely evaporate the solvent in the glue on the adhesive-backed copper-clad plate 501' to form a semi-cured glue layer;

Ⅲ. Release film lamination: The adhesive-backed copper-clad laminate 501' baked in the tunnel oven 25 is transferred to between the two pressing rollers 26. At this time, the second pulling and unwinding roller 52 is transferred to the room between the two pressing rollers 26. The release film is adhered to the semi-cured adhesive layer of the adhesive-backed copper-clad laminate 501', and then transferred to the composite material winding roller 71 for winding, thereby making the FRCC material 10.

In this embodiment, the hot pressing device 24 is a hot pressing roller 241. In step II, the horizontal guide roller 222, the pre-pressing roller 231, and the hot pressing roller 241 close to the glue layer side of the adhesive-backed copper-clad plate 501' be raised to avoid contact with the glue layer and affect the coating effect.

In step II, before the adhesive-backed copper-clad board 501' is transferred to the tunnel oven 25, the nitrogen device in the tunnel oven 25 is started to fill the tunnel oven 25 with nitrogen to prevent the copper on the adhesive-backed copper-clad board 501' from Foil oxidation and discoloration.

Embodiment 7

As shown in Figures 10 and 29, Embodiment 7 discloses a processing method for preparing flexible double-sided copper clad laminates by a multi-purpose circuit board production line, which includes the following steps:

(1) During material preparation, a roll of copper foil 30 is placed on the coating unwinding roller 41. The coating unwinding roller 41 transfers the copper foil 30 to the upper glue machine 42 and coats glue on the surface of the copper foil 302 to form a Adhesive copper foil 30';

(2) Baking: The gluing machine 42 sends the adhesive-backed copper foil 30' to the alignment device 22. After the adhesive-backed copper foil 30' bypasses the horizontal positioning roller 221, it passes through two horizontal guide rollers in sequence. 222 rooms, two pre-pressure Between the pressing roller 233, the hot pressing device 24, and the tunnel oven 25, the solvent in the glue on the adhesive-backed copper foil 30' is completely evaporated to form a semi-cured glue layer; and then it is transferred to the composite material winding roller 71 for winding. Obtain roll-shaped adhesive-backed copper foil 30';

(3) Lamination: The roll-shaped adhesive-backed copper foil 30' is transferred to the guide unwinding roller 31 opposite to the coating device 4. At the same time, a roll-shaped copper foil 30 is placed on the coating unwinding roller 41 to guide the unwinding. The roller 31 transfers the roll-shaped adhesive-backed copper foil 30' to the peeling positioning roller 32, then bypasses the horizontal positioning roller 221 and transfers it to the alignment system 223; at this time, the coating unwinding roller 41 transfers the copper foil 30 to the upper glue machine 42 And apply a thin layer of glue on the copper foil 30. The glue-coated copper foil 30" bypasses the horizontal positioning roller 221 and is sent to the alignment system 223. The alignment system 223 makes the adhesive-backed copper foil 30' and The two sides of the copper foil 30" after being coated with glue are aligned and then pass through the two horizontal guide rollers 222 simultaneously, and then pass through the pre-pressing roller 231, the hot pressing device 24, the tunnel oven 25, and two between the pressing rollers 26, so that the semi-cured adhesive layer of the adhesive-backed copper foil 30' is completely solidified and the two layers of copper foil 30 are tightly bonded together to form a flexible double-sided panel 502, which is finally transferred to the composite material rewinding roller 71 for rewinding. roll.

In this embodiment, in step (3), the horizontal guide roller 222, the pre-pressing roller 231, and the hot pressing roller 241 are all in a pressing state.

In this embodiment, in step (3), when the adhesive-backed copper foil 30' and the glue-coated copper foil 30" are transferred to the pre-pressing device 23, the first pulling and unwinding roller 51 synchronously transfers the protective film to In the pre-pressing device 23, the protective films are respectively covered on the surfaces of the two copper foils and transported forward together. After passing through the hot pressing device 24, the protective films are transported to the pulling and winding roller 53 for winding.

In the step (2), before the adhesive-backed copper foil 30' is transferred to the tunnel oven 25, the nitrogen device in the tunnel oven 25 is started to fill the tunnel oven 25 with nitrogen to prevent the adhesive-backed copper foil 30' from getting on the tunnel oven 25. The copper foil is oxidized and discolored.

In this embodiment, the glue is any one of liquid PI glue, liquid MPI glue, liquid LCP glue, liquid TFP glue, liquid PTFE glue, liquid PPS glue, liquid FPA glue and liquid EP glue, and is passed through a tunnel oven 25 After baking, liquid PI glue, liquid MPI glue, liquid LCP glue, liquid TFP glue, liquid PTFE glue, liquid PPS glue, liquid FPA glue and liquid EP glue solidify respectively to form PI film, MPI film, LCP film, TFP Film, PTFE film, PPS film, FPA film and EP film.

In order to ensure the stability of the performance of the double-sided panels, the glue in steps (1) and (3) is the same glue system.

In step (2), the adhesive-backed copper foil 30' is baked so that the solvent in the glue on the adhesive-backed copper foil 30' is completely volatilized and fully solidified, and a flexible single-sided copper-clad laminate 501 can be obtained, as shown in Figure 28. Show.

Specifically, the PI film is a polyimide film (Polyimide Film), which is a film-type insulating material with good performance. It is composed of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a highly polar It is formed by polycondensation and casting in a solvent to form a film and then imidization.

MPI (ModifiedPI) is modified polyimide, which is an improved formula of polyimide (PI). Specifically, the fluoride formula has been improved.

LCP, which stands for Liquid Crystal Polymer, is a new type of thermoplastic organic material that generally exhibits liquid crystallinity in the molten state. TFP is a unique thermoplastic material. Specifically, TFP is a general name for high-frequency materials, which are low dielectric constant materials (many types of TPX and TPFE also belong to this type).

PTFE, Chinese name: Polytetrafluoroethylene (abbreviated as PTFE), also known as: Teflon, Teflon, Teflon, Taofulon, Teflon.

PFA is a copolymer of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene (Perfluoroalkoxy). The PFA film is used as the film layer of the flexible double-sided board. Compared with other films, it has unparalleled lowDK and LowDf properties, and With a high temperature resistance of 260 degrees, the Dk of the PFA film is 2.1 and the Df is below 0.001, ensuring the high-frequency and high-speed signal transmission requirements of 5G flexible circuit boards.

The full name of PPS polyphenylene sulfide is polyphenylene sulfide, which is Polyphenylene Sulfide in English, so it is also called PPS. The molecular main chain of polyphenylene sulfide is formed by the alternating arrangement of benzene rings and sulfur atoms. The benzene ring structure gives the polyphenylene sulfide Phenyl sulfide is rigid, and the thioether bond provides a certain degree of flexibility, so they have excellent high temperature resistance, corrosion resistance, radiation resistance, flame retardancy, dimensional stability and excellent electrical properties.

EP is epoxy resin glue (epoxy).

Anti-ion glue, high-frequency glue and heat-resistant glue mainly use additives in the glue or purify the glue to make the glue have anti-ion migration properties after curing, or be suitable for high-frequency transmission situations, or have high-temperature resistance .

Embodiment 8

Embodiment 8 discloses a method for preparing a cover film. The main difference between Embodiment 8 and Embodiment 6 is that in step I material preparation, a roll-shaped insulating film is placed on the coating and unwinding roller 41, and the coating and unwinding are The roller 41 conveys the insulating film to the upper glue machine 42 and applies glue on the surface of the insulating film to form an adhesive-backed insulating film;

The other processing steps are the same as those in Embodiment 5, and the covering film 20 is finally produced, as shown in Figure 30 .

In this embodiment, the insulating film layer is a PI film.

Embodiment 9

Embodiment 9 discloses a processing method for preparing multi-layer IC carrier boards in a multi-purpose circuit board production line, which is prepared from RCC (Resin Coated Copper) material 80 and multi-layer circuit boards.

The RCC material includes a copper layer and a semi-cured adhesive layer from top to bottom.

The semi-cured glue layer is ABF glue system.

The main difference between Embodiment 9 and Embodiment 3 is that RCC material 80 is used instead of FRCC material 10. Other processing steps are the same as in Embodiment 2, and a multi-layer IC carrier board is finally made, as shown in Figure 32.

The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, etc. may be made without departing from the spirit and principles of the present invention. All simplifications should be equivalent substitutions, and are all included in the protection scope of the present invention.

Claims

The multi-purpose circuit board production line is characterized by including:

At least one material processing unit: it includes a material unwinding roller arranged sequentially along the processing direction, and a conveying device. The material unwinding roller conveys the material to be processed to the conveying device, and a device for punching the material is provided at the conveying device. a cutting device for drilling and/or cutting;

A composite unit: it includes a circuit board transmission device, a positioning device, a pre-pressing device, a hot pressing device, a tunnel oven, at least a pair of pressure rollers, and a punching inspection system arranged sequentially along the processing direction. , the circuit board transmission device transmits the circuit board to the alignment device;

At least one peeling device includes a guide unwinding roller, a peeling positioning roller, and a peeling and rewinding roller; the materials processed by the material processing unit are sequentially transferred to the alignment device through the guide unwinding roller and the peeling positioning roller, and are peeled off The rewinding roller rewinds and recycles the film material peeled off from the material after passing through the peeling and positioning roller;

At least one coating device, which includes a coating unwinding roller and a gluing machine. The coating unwinding roller conveys the substrate to be coated to the upper glue machine. The base material to be coated is coated with glue and then transferred to the opposite machine. bit device;

At least one pulling and conveying device, which includes at least a first pulling and unwinding roller, a second pulling and unwinding roller, and a pulling and winding roller, the first pulling and unwinding roller transmits the material to the pre-pressing device, After passing through the hot pressing device, it is transferred to the pulling and winding roller for winding, and the second pulling and unwinding roller transfers the material to the pressing roller;

It also includes at least one leak-checking and leak-filling system for checking the graphics on the material after being processed by the cutting device. The leak-checking and leak-filling system includes:

a server;

At least one pattern detection device, which is signal-connected to the server and used to collect image information and transmit the image information to the server;

And at least one laser drilling device, which is connected to the server signal and is used to receive instructions transmitted by the server and drill holes in the material according to the instructions;

At least one leak-repairing manipulator, which is connected to the server signal and is used to receive the instructions transmitted by the server and to repair the leaks of the release film that has fallen off at the window opening position of the material according to the instructions, or to remove the material that cannot be repaired to avoid flowing into the next process;

At least one processor, which is communicatively connected with a graphic inspection module, a visual inspection module, a storage module and a controller. The graphic inspection module is communicatively connected with a graphic detection device. The graphic detection device detects the warp cutting device through the graphic inspection module. Check and analyze whether the graphics on the cutting surface of the material after processing are complete. The specific analysis process includes:

Mark the material processed by the cutting device as the detection object i, i = 1, 2,..., n, n is a positive integer. Take an image of the cutting surface of the detection object i and obtain the detection image i, and obtain the standard through the storage module image, compare the detection image i with the standard image through image processing technology and obtain the coincidence degree CHi between the detection image i and the standard image, obtain the coincidence threshold CHmin through the storage module, and compare the coincidence degree CHi with the coincidence threshold CHmin: If If the coincidence degree CH is less than or equal to the coincidence threshold CHmin, it is determined that the pattern of the detection object i is unqualified, and the image inspection module sends a pattern failure signal to the processor; if the coincidence degree CH is greater than the coincidence threshold CHmax, it is determined that the pattern of the detection object i is qualified, as shown in Figure The inspection module sends a graphic pass signal to the processor;

Conduct continuity testing on test objects with unqualified graphics. The process of continuity testing includes: obtaining the first two graphic test results of the test object;

If the first two graphic results are both graphically qualified, the results are judged to be discontinuous;

If the first two graphic results are both unqualified graphics, the judgment results are continuous. The graphic inspection module sends a continuous unqualified signal to the processor. After receiving the continuous unqualified signal, the processor sends the continuous unqualified signal to the manager's mobile terminal. , after the management personnel receive the unqualified continuous signal, they will inspect and repair the cutting device and transmission device;

If the first two graphic results are one pass and one failure, analyze the order of occurrence of the graphic test results: if the graphic unqualified result comes first, the judgment result is discontinuous; if the graphic qualified result comes first, it is judged continuous and pending. , the image inspection module marks the next image inspection as a key inspection;

The process of key inspection is: take two images of the inspection object and compare the coincidence degree. When there is an unqualified graphic result in the two inspection results, it is judged that the image of the inspection object is unqualified, and the image inspection module sends the image to the processor. Failure signal;

The image inspection module is also used to analyze the distribution of graphics detection results. The process of result distribution analysis includes: establishing a coincidence set {CH1, CH2,..., CHn} for the coincidence degree CHi of the detection object i, calculating the variance of the coincidence set and Mark the calculation result as the distribution coefficient FB of the coincident set, obtain the distribution threshold FBmax through the storage module, and compare the distribution coefficient FB with the distribution threshold FB: if the distribution coefficient FB is less than or equal to the distribution threshold FBmax, it is determined that the cutting device is working stably; if If the distribution coefficient FB is greater than the distribution threshold FBmax, it is determined that the cutting device is unstable, and the image inspection module reports to the management through the processor The personnel's mobile phone terminal sends a maintenance signal, and the management staff detects and repairs the cutting device after receiving the maintenance signal;

For materials that need to be opened, use the visual inspection module to check whether the release film has fallen off at the position to be opened. The specific inspection process includes: taking an image of the opening position of the material and marking the resulting image as an analysis image. The image is enlarged into a pixel grid image, and the pixel grid of the pixel grid image is marked as u, u = 1, 2,..., m, m is a positive integer, and the grayscale value HDu of the pixel grid u is obtained through image processing technology, and the grayscale value HDu of the pixel grid u is obtained through the storage module Obtain the grayscale threshold HDmin, and compare the grayscale value HDu with the grayscale threshold HDmin one by one: if the grayscale value HDu is less than or equal to the grayscale threshold HDmin, the corresponding pixel grid will be marked as a dropped pixel grid; if the grayscale value HDu is greater than If the grayscale threshold HDmin is set, the corresponding pixel grid is marked as a complete pixel grid; the number of dropped pixel grids is obtained and marked as w, and the ratio of w and m is marked as the dropout ratio. The dropout threshold is obtained through the storage module, and the dropout ratio is Compare the shedding threshold: If the shedding ratio is less than the shedding threshold, it is determined that the release film has not fallen off; if the shedding ratio is greater than or equal to the shedding threshold, it is determined that the release film has fallen off, and the visual inspection module sends a leak compensation signal to the processor, and the processor receives the leak compensation signal. After receiving the signal, the leak-tightening signal is sent to the controller. After receiving the leak-tightening signal, the controller controls the leak-tightening manipulator to fix the leakage of the release film that has fallen off at the opening position.
The multi-purpose circuit board production line according to claim 1, wherein the transmission device is a belt transmission device or a transmission roller.
The multi-purpose circuit board production line according to claim 2, wherein the belt conveying device includes a pair of conveying rollers arranged oppositely along the processing direction, and a conveying belt sleeved on the outside of the two conveying rollers, wherein, A support plate is provided between the two conveying rollers and on the side away from the carrying surface of the conveying belt. Evenly distributed toothed stripes are formed on the carrying surface of the conveying belt. The cutting device is located on the supporting plate and cuts the material to be processed according to the circuit board pattern. Punch and/or cut.
The multi-purpose circuit board production line according to claim 2, wherein the material processing unit further includes a laminating roller respectively provided at both ends of the conveying device, wherein the lower ends of the laminating rollers are respectively lower than the upper ends of the conveying rollers. with the upper end of the material unwinding roller.
The multi-purpose circuit board production line according to claim 1, wherein the cutting device includes at least one or more of an intelligent laser cutting device, a circular knife die cutting device, and a stamping and die cutting device.
The multi-purpose circuit board production line according to claim 1, further comprising at least one turning device, which includes at least two turning rollers arranged up and down, and the materials processed by the cutting device are turned over in turn through the two turning rollers. and then sent to the peeling device.
The multi-purpose circuit board production line according to claim 1, further comprising a material winding roller, the material processed by the cutting device is transferred to the material winding roller for winding, and the rolled material is transferred to the guide The unwinding roller performs unwinding.
The multi-purpose circuit board production line according to claim 7, characterized in that the pattern detection equipment is an AOI detection equipment or a CCD detection equipment.
The multi-purpose circuit board production line according to claim 1, characterized in that the alignment device includes at least one horizontal positioning roller, at least a pair of horizontal guide rollers, and a positioning system, the horizontal positioning roller and the horizontal guide The rollers are set horizontally. The material after peeling off the positioning roller passes through the horizontal positioning roller and the horizontal guide roller in turn. The horizontal positioning roller and the horizontal guide roller make the material horizontally transported and parallel to the circuit board. Use the alignment system to position the material's positioning holes and/or The cover opening pattern is aligned with the positioning hole of the circuit board and/or the cover opening pattern, and the gap between the two horizontal guide rollers is adjustable.
The multi-purpose circuit board production line according to claim 1, wherein the pre-pressing device is at least a pair of pre-pressing rollers, and the gap between the two pre-pressing rollers is adjustable.
The multi-purpose circuit board production line according to claim 1, characterized in that a circuit board detection device is provided between the circuit board conveying device and the pre-pressing device for detecting the circuit board.
The multi-purpose circuit board production line according to claim 1, further comprising a composite material rewinding roller or a composite material cutting device, and the multi-layer boards or materials processed by the composite unit are transferred to the composite material rewinding device. Roller or composite material cutting device, the composite material winding roller rolls up the multi-layer board or material; or the composite material cutting device cuts the multi-layer board or material into sheets, and the sheet is cut by a robot The multi-layer boards or materials are stacked in sequence; the rolled-up multi-layer boards or the multi-layer boards cut into sheets then go through a process including dry film application, exposure, development, electroplating and etching to form a multi-layer circuit board.
The multi-purpose circuit board production line according to claim 1, wherein the heat pressing device includes at least a pair of heat pressing rollers or a flat plate heat pressing device, and the gap between the two heat pressing rollers is adjustable; The flat plate hot-pressing device includes at least a pair of hot-pressing flat plates that are arranged oppositely up and down and can be lifted and lowered, and an annular track provided corresponding to the hot-pressing flat plates. The hot-pressing flat plates are movably connected to the annular track. The hot pressing plate moves along the processing direction of the composite unit, and continues to move along the circular track back to the initial position after the pressing is completed.
The multi-purpose circuit board production line according to claim 1, wherein the circuit board conveying device is a circuit board unwinding roller and/or a belt conveying device, and the circuit board unwinding roller can be used to convey roll-shaped FPC (Flexible Printed Circuit board) circuit board, the belt conveyor can be used to convey sheet FPC circuit boards or sheet PCB (Printed Circuit Board) circuit boards.
The multi-purpose circuit board production line according to claim 1, characterized in that a nitrogen device is provided in the tunnel oven for blowing nitrogen into the tunnel oven.
The application of the multi-purpose circuit board production line according to any one of claims 1 to 15, is characterized in that it can be used to include FRCC (flexible resin coated copper) materials, covering films, copper foil, semi-cured film, copper-clad laminates or other related materials. Process and combine with circuit boards to form multi-layer boards, and then use etched circuits to prepare flexible single-sided circuit boards, flexible double-sided circuit boards, flexible multi-layer circuit boards and soft-hard combination multi-layer circuit boards. It can also be used with coating The device performs the production of single- and double-sided FCCL (Flexible Copper Clad Laminate), FRCC materials, cover films or other coating materials.
A multi-layer board processing method, which uses FRCC materials and a multi-purpose circuit board production line to process, and is characterized by:

The FRCC (flexible resin coated copper) material includes a copper layer, a cured film layer, a semi-cured adhesive layer, and a release film layer from bottom to top;

The semi-cured adhesive layer is made through a coating process;

The release film layer is made of PET material;

The processing method of the multilayer board includes the following steps:

S1. FRCC material preprocessing: first place the rolled FRCC material on the material unwinding roller, start the material processing unit, and transfer the FRCC material to the transmission device, and the cutting device will punch and/or cut the FRCC material;

S2. Release film peeling: Transfer the FRCC material processed in step S1 to the peeling device. The FRCC material passes through the guide unwinding roller and the peeling positioning roller in sequence. After passing through the peeling positioning roller, the release film on the FRCC material is peeled off and It is sent to the peeling and winding roller for winding, and the FRCC material after peeling off the release film is sent to the alignment device;

S3. Multi-layer board lamination: The circuit board transmission device transmits the circuit board, so that the circuit board and the FRCC material after peeling off the release film are simultaneously transmitted to the alignment device. After the alignment of the circuit board and the FRCC material is completed, they are sequentially transmitted to the pre-pressing device. device, hot pressing device, tunnel oven, and then pass between the two pressure rollers to complete the pressing and baking of the FRCC material and the circuit board. At this time, the semi-cured adhesive layer on the FRCC material is completely solidified to make the FRCC material tightly It is attached to the circuit board and then sent to the punching inspection system to punch and inspect the multi-layer board;

In step S1, after drilling and/or cutting by the cutting device, positioning holes and/or opening patterns are formed on the FRCC material. When it is necessary to form opening patterns on the FRCC material, the material unwinding roller is During the process of transferring the FRCC material to the conveyor, the release film of the FRCC material faces the cutting device, and the cutting device only cuts the contour line of the corresponding shape on the release film according to the opening pattern; when it is only necessary to form a positioning on the FRCC material hole, there is no limit on the orientation of the release film during the transfer of the FRCC material; at the same time, in the step S2, when the release film of the FRCC material has the outline of the opening pattern, the FRCC material after peeling off the release film A release film of corresponding shape is retained on the cover and located at the opening position;

When the material unwinding roller delivers the FRCC material to the conveying device, the release film of the FRCC material faces the cutting device, and the FRCC material processed by the cutting device is directly conveyed to the peeling device through the turning device;

In the step S2, the leak detection and leak filling system is also used to detect the opening pattern on the FRCC material after the release film is peeled off and the detection results are recorded, and the leak filling robot replenishes the release film of the corresponding shape at the peeling position;

In the step S2, the circuit board detection device detects the circuit board transmitted by the circuit board conveying device and records the detection results. The horizontal positioning roller and the horizontal guide roller transport the FRCC material after peeling off the release film horizontally and connect it with the circuit board. In parallel, at the same time, use the alignment system to align the positioning holes and/or opening patterns on the FRCC material with the positioning holes and/or opening patterns on the circuit board. The aligned FRCC material and circuit board pass through two Pre-pressing is carried out between the pre-pressing rollers and then sent to the hot pressing device for hot pressing;

In the step S2, the protective film is also transferred to the pre-pressing device through the first pulling and unwinding roller, so that the protective film covers the FRCC material and passes through the pre-pressing device and the hot pressing device together with the FRCC material and the circuit board, completing the process. The FRCC material and the circuit board are pressed together to form a multi-layer board. At this time, the protective film is transferred to The rewinding roller is pulled to rewind, and the multi-layer board formed by the hot pressing device is baked in a tunnel oven to form a multi-layer board with stable performance. The multi-layer board is transferred to the punching inspection system and punched. The inspection system punches holes in the FRCC material of the multi-layer board to form through holes and blind holes and inspects and confirms the holes on the multi-layer board; finally, the multi-layer board is rolled up;

The protective film is PET film, silica gel film or TPX (polymer of 4-methylpentene-1);

The hot-pressing device is a flat-plate hot-pressing device. When the FRCC material and circuit board are transferred from the pre-pressing device to the hot-pressing device, the two opposite hot-pressing flat plates are pressed toward each other, and the FRCC material and circuit board are hot-pressed. Move forward along the circular track with the FRCC material and circuit board until the preset lamination time is reached. The two pressed hot pressing plates separate and continue to move along the circular track to the initial position, waiting to be transferred by the pre-pressing device. FRCC material and circuit board, and repeat the above actions;

The circuit board transmission device is a circuit board unwinding roller used to transport roll-shaped FPC circuit boards;

The processing method of the multilayer board also includes the following steps:

S4. The multilayer board is then subjected to a process including dry film application, exposure, development, electroplating and etching to form circuits on the FRCC material to obtain a multilayer circuit board. At the same time, the copper on the FRCC material and located at the opening position is etched. An opening corresponding to the opening pattern is formed, and the release film retained on the FRCC material corresponds to the opening one-to-one;

S5. Uncapping: Cut the FRCC material along the edge of the opening formed by etching in step S4, and peel off the remaining FRCC material at the cut point to complete the uncapping;

S6. Repeat steps S2, S3, S4, and S5 for the multilayer circuit board after the lid is opened until a multilayer circuit board with the required number of layers is obtained.