WO2023218719A1 - Composite printed wiring board and method for manufacturing composite printed wiring board - Google Patents

Composite printed wiring board and method for manufacturing composite printed wiring board Download PDF

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Publication number
WO2023218719A1
WO2023218719A1 PCT/JP2023/005633 JP2023005633W WO2023218719A1 WO 2023218719 A1 WO2023218719 A1 WO 2023218719A1 JP 2023005633 W JP2023005633 W JP 2023005633W WO 2023218719 A1 WO2023218719 A1 WO 2023218719A1
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WO
WIPO (PCT)
Prior art keywords
printed wiring
wiring board
interlayer connection
land extension
land
Prior art date
Application number
PCT/JP2023/005633
Other languages
French (fr)
Japanese (ja)
Inventor
赳志 重岡
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to CN202380012463.7A priority Critical patent/CN117561799A/en
Publication of WO2023218719A1 publication Critical patent/WO2023218719A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • One aspect of the present disclosure relates to a bonded printed wiring board and a method for manufacturing the bonded printed wiring board.
  • Information communication devices such as smartphones, tablet terminals, and mobile phones have an antenna module for communicating with other devices and a main board on which electronic components such as semiconductor chips are mounted.
  • a bonded printed wiring board is used to electrically connect the antenna module and the main board.
  • Some bonded printed wiring boards include two printed wiring boards connected via a connector at a bonded portion. This connector is, for example, a small coaxial connector or a board-to-board connector.
  • the terminals of the connector have a minute stub structure.
  • a stub structure significantly reduces transmission efficiency by generating resonance in high frequency signal transmission useful for increasing the speed of digital signals.
  • the bonded portion which has increased in thickness due to the interposition of a connector, may obstruct the placement.
  • the characteristic impedance Z of the wiring is determined by the inductance component L and the capacitance component C. Specifically, the characteristic impedance Z of the wiring is given by the following equation (1).
  • the characteristic impedance Z of a printed wiring board is usually matched to 50 ⁇ .
  • capacitance occurs between the via and the ground layer. Therefore, the capacitance of the junction increases.
  • the characteristic impedance of the bonded portion decreases, resulting in a mismatch in characteristic impedance between the bonded portion and the wiring portion of the printed wiring board.
  • signal reflection occurs at the joint.
  • the vias of two printed wiring boards In order to prevent the vias from coming close to the ground layer, it is conceivable to arrange the vias of two printed wiring boards to face each other. However, in this case, when the printed wiring boards are bonded, the conductive material may flow into the dimples of the vias facing each other, making it difficult to ensure conduction stability of the bonded printed wiring boards.
  • One object of the present disclosure is to provide a bonded printed wiring board that can sufficiently suppress signal reflection at the bonded portion and has a stable and space-saving connection structure.
  • a bonded printed wiring board includes a first printed wiring board and a second printed wiring board bonded to the first printed wiring board, and includes a second printed wiring board bonded to the first printed wiring board.
  • the printed wiring board includes a first signal line, a first interlayer connection part whose one end is connected to the first signal line, and a first interlayer connection part extending from the other end of the first interlayer connection part, and a first interlayer connection part extending from the other end of the first interlayer connection part.
  • the second printed wiring board has a first land extension provided on a bonding surface of a printed wiring board, and a first ground layer provided on the bonding surface, and the second printed wiring board has a second land extension portion provided on a bonding surface of the printed wiring board.
  • a second interlayer connection portion having one end connected to the second signal line; and a second interlayer connection portion extending from the other end of the second interlayer connection portion and provided on the bonding surface of the second printed wiring board.
  • the first signal line includes a second land extension and a second ground layer provided on the joint surface, and the first signal line includes a second land extension and a second land extension.
  • the first interlayer connection portion does not face the second ground layer of the second printed wiring board, and is electrically connected to the second signal line through The portion does not face the first ground layer of the first printed wiring board.
  • the first interlayer connection part and the second interlayer connection part are arranged so as not to face each other, and the first land extension part is connected to the second interlayer connection part.
  • the second land extension does not extend to an opposing area of the first interlayer connection, and the first land extension and the second land extension do not extend to an opposing area of the first interlayer connection. may be arranged so as to face each other.
  • the first land extension part and the second land extension part are rectangular in plan view
  • the first land extension part and the second land extension part are rectangular in plan view.
  • the width is such that impedance is matched between the first land extension and the first signal line and between the second land extension and the second signal line, respectively. It may be adjusted.
  • the first interlayer connection portion and the second interlayer connection portion are arranged so as not to face each other, and the first land extension portion is arranged so as not to face each other.
  • the second land extension may extend to an opposite area of the interlayer connection and/or the second land extension may extend to an opposite area of the first interlayer connection.
  • the first land extension portion has a first receiving pad portion facing the second interlayer connection portion
  • the second land extension portion has a first receiving pad portion facing the second interlayer connection portion. It may have a second receiving pad portion facing the interlayer connection portion.
  • the first receiving pad portion includes an area opposite to the second interlayer connection portion
  • the second reception pad portion includes an area opposite to the first interlayer connection portion. It may include an area.
  • first land extension part and the second land extension part are arranged to face each other, and the first interlayer connection part and the second interlayer connection part may be arranged so as to face each other.
  • the first interlayer connection portion and/or the first land extension portion, and the second interlayer connection portion and/or the second land extension portion are made of a conductive material.
  • the conductive material may be an anisotropic conductive film, an anisotropic conductive paste, solder, or a conductive paste.
  • the first interlayer connection part and/or the first land extension part and the second interlayer connection part and/or the second land extension part are directly connected to each other,
  • the first printed wiring board and the second printed wiring board are electrically connected and are joined by a non-conductive material, and the non-conductive material is a non-conductive film, a non-conductive paste, or an adhesive. It may be an agent.
  • the first printed wiring board and/or the second printed wiring board may be a flexible printed wiring board.
  • the insulating base material of the flexible printed wiring board may contain a liquid crystal polymer, a fluorine-based material, or a polyimide-based material.
  • the first printed wiring board is connected to an antenna module including an antenna and an antenna board
  • the second printed wiring board is connected to a main board
  • the first printed wiring board is connected to an antenna module including an antenna and an antenna board.
  • the antenna may include a semiconductor chip that performs information processing based on the signal received by the antenna.
  • a bonded printed wiring board includes a first printed wiring board and a second printed wiring board bonded to the first printed wiring board, and includes a second printed wiring board bonded to the first printed wiring board.
  • the printed wiring board includes a plurality of first signal lines, a plurality of first interlayer connection parts each having one end connected to the plurality of first signal lines, and the other end of the plurality of first interlayer connection parts.
  • the printed wiring board includes a plurality of second signal lines, a plurality of second interlayer connection parts each having one end connected to the plurality of second signal lines, and the other end of the plurality of second interlayer connection parts.
  • a plurality of second land extensions extending from the second printed wiring board and provided on the bonding surface of the second printed wiring board; and a second ground layer provided on the bonding surface of the second printed wiring board;
  • Each of the one signal line is electrically connected to a corresponding second signal line of the plurality of second signal lines via the corresponding first land extension part and the second land extension part.
  • the plurality of first interlayer connection parts do not face the second ground layer of the second printed wiring board, and the plurality of second interlayer connection parts are connected to the first printed wiring board. It does not face the first ground layer of the wiring board.
  • the plurality of first interlayer connection parts may be arranged in a staggered manner along a predetermined direction.
  • the line connecting the first interlayer connection part and the first land extension part is arranged obliquely to the width direction of the first printed wiring board.
  • a first interlayer connection and the first land extension may be arranged.
  • the plurality of first interlayer connection parts and the plurality of first land extension parts may be arranged along the longitudinal direction of the first printed wiring board.
  • a ground via may be arranged between at least one pair of first interlayer connection parts among the plurality of first interlayer connection parts.
  • a ground via may be arranged so as to be surrounded by the plurality of first interlayer connection parts.
  • each of the plurality of first land extension parts has a receiving pad part facing the corresponding second interlayer connection part, and the plurality of first land extension parts And/or the plurality of receiving pad portions may be arranged in a triangular lattice shape.
  • At least one of the plurality of first land extensions may further include a connection part that connects the receiving pad part and the first interlayer connection part.
  • each of the plurality of first interlayer connection parts may be partitioned by the first ground layer.
  • a method for manufacturing a bonded printed wiring board includes: a first signal line, a first interlayer connection part whose one end is connected to the first signal line, and the other end of the first interlayer connection part. producing a first printed wiring board having a first land extension extending from the first land extension and a first ground layer provided on the same surface as the first land extension; a second interlayer connection portion having one end connected to the second signal line, a second land extension extending from the other end of the second interlayer connection portion, and the second land producing a second printed wiring board having a second ground layer provided on the same surface as the extension part; and the first signal line is connected to the first land extension part and the second ground layer.
  • the first interlayer connection does not face the second ground layer of the second printed wiring board, and the second The first printed wiring board and the second printed wiring board are joined so that the interlayer connection portion does not face the first ground layer of the first printed wiring board.
  • FIG. 1A is a perspective view of a bonded printed wiring board according to the first embodiment.
  • FIG. 1B is an enlarged view of the joint portion J in FIG. 1A.
  • FIG. 2A is a vertical cross-sectional view (first example) along a signal line of the bonded printed wiring board according to the first embodiment.
  • FIG. 2B is a vertical cross-sectional view (second example) along the signal line of the bonded printed wiring board according to the first embodiment.
  • FIG. 3 is a perspective view of the bonding surface of one printed wiring board of the bonded printed wiring board according to the first embodiment.
  • 4A to 4D are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment.
  • FIGS. 5A and 5B are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment, following FIGS. 4A to 4D.
  • 6A and B are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment, following FIGS. 5A and B.
  • 7A and 7B are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment, following FIGS. 6A and 6B.
  • FIGS. 8A and 8B are diagrams showing simulation results of transmission characteristics of the bonded printed wiring board according to the first embodiment.
  • FIG. 9 is a plan view of the bonding surface of one printed wiring board of the bonded printed wiring board according to Modification 1 of the first embodiment.
  • FIG. 9 is a plan view of the bonding surface of one printed wiring board of the bonded printed wiring board according to Modification 1 of the first embodiment.
  • FIG. 10 is a longitudinal sectional view along a signal line of a bonded printed wiring board according to a second modification of the first embodiment.
  • FIG. 11 is a perspective view of the bonding surface of one printed wiring board of the bonded printed wiring board according to the second embodiment.
  • FIG. 12 is a longitudinal cross-sectional view along the signal line of the bonded printed wiring board according to the second embodiment.
  • FIG. 13 is a plan view of the bonding surface of one printed wiring board of the bonded printed wiring board according to Modification 1 of the second embodiment.
  • FIG. 14 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to Modification 2 of the second embodiment.
  • FIG. 11 is a perspective view of the bonding surface of one printed wiring board of the bonded printed wiring board according to the second embodiment.
  • FIG. 12 is a longitudinal cross-sectional view along the signal line of the bonded printed wiring board according to the second embodiment.
  • FIG. 13 is a plan view of the bonding surface of
  • FIG. 15 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to Modification 3 of the second embodiment.
  • FIG. 16 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to Modification 4 of the second embodiment.
  • FIG. 17 is a plan view of a bonded surface of one printed wiring board of a bonded printed wiring board according to modification 5 of the second embodiment.
  • FIG. 18 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to modification 6 of the second embodiment.
  • FIG. 19 is a longitudinal cross-sectional view along a signal line of a bonded printed wiring board according to the third embodiment.
  • the bonded printed wiring board 1 includes a printed wiring board 10 and a printed wiring board 20 that are bonded to each other.
  • Printed wiring board 10 and printed wiring board 20 are examples of a first printed wiring board and a second printed wiring board, respectively.
  • printed wiring boards 10 and 20 are flexible printed wiring boards. Note that at least one of printed wiring board 10 and printed wiring board 20 may be a rigid printed wiring board.
  • the bonded printed wiring board 1 is used, for example, to electrically connect an antenna module and a main board in an information communication device such as a smartphone.
  • printed wiring board 10 is connected to, for example, an antenna module (not shown).
  • the antenna module includes an antenna and an antenna substrate on which the antenna is mounted.
  • Printed wiring board 20 is connected to, for example, a main board (not shown). For example, a semiconductor chip that processes information based on a signal received by an antenna is mounted on this main board.
  • the printed wiring board 10 itself may be an antenna board. Further, the printed wiring board 20 itself may be a main board on which a semiconductor chip is mounted.
  • the printed wiring board 10 is provided with a signal line 11, which is an example of a first signal line.
  • the printed wiring board 20 is provided with a signal line 21 that is an example of a second signal line.
  • the printed wiring board 10 is provided with at least one pair of ground lines 41 parallel to the signal line 11 .
  • This ground line 41 is electrically connected to an outer ground layer (an example of a first ground layer; ground layers 17 and 17A, which will be described later) of the printed wiring board 10 via a ground via 42.
  • the printed wiring board 20 is provided with at least one pair of ground lines 51 parallel to the signal line 21.
  • This ground line 51 is electrically connected to an outer ground layer (an example of a second ground layer; a ground layer 27 and/or ground layer 27A, which will be described later) of the printed wiring board 20 via a ground via 52. ing.
  • the arrangement of the signal lines 11, 21 and the ground lines 41, 51 shown in FIG. 1A is an example, and other arrangements may be used.
  • the signal line 11 may extend in a direction oblique to the longitudinal direction of the printed wiring board 10, and may be connected to an interlayer connection portion 12, which is an example of a first interlayer connection portion.
  • the signal line 11 is not limited to a straight line, and may be bent in the middle. The same applies to the signal line 21. The same holds true for the subsequent embodiments and modifications.
  • FIG. 1A the signal line 11 of the printed wiring board 10 and the signal line 21 of the printed wiring board 20 are electrically connected at a joint J.
  • the connection of the signal lines at the joint portion J will be described in detail with reference to FIG. 1B.
  • FIG. 1B is an enlarged view of the joint portion J.
  • the signal line 11 is connected to one end (lower end) of the interlayer connection section 12.
  • the interlayer connection portion 12 has a land 13.
  • the land extension part 14 is an example of the first land extension part, and extends from the other end (upper end) of the interlayer connection part 12. In other words, the land extension 14 extends from the land 13.
  • the signal line 21 is connected to one end (upper end) of an interlayer connection section 22, which is an example of a second interlayer connection section.
  • the interlayer connection portion 22 has a land 23.
  • the land extension part 24 is an example of a second land extension part, and extends from the other end (lower end) of the interlayer connection part 22. In other words, the land extension 24 extends from the land 23.
  • the land extension portion 14 is provided on the bonding surface of the printed wiring board 10 (the surface including the land 13 and the ground layer 17 and opposing region A1, which will be described later).
  • the land extension portion 24 is provided on the bonding surface of the printed wiring board 20 (the surface including the land 23, a ground layer 27 described later, and a facing area A2).
  • the land extensions 14 and 24 may extend from the lands 13 and 23 on the joint surface in a direction different from the direction in which the signal lines 11 and 21 extend. Additionally, the land extensions 14, 24 may extend in multiple directions. Alternatively, the land extensions 14, 24 may be formed by partially enlarging the diameters of the lands 13, 23. The same holds true for the subsequent embodiments and modifications.
  • the interlayer connections 12 and 22 are plated vias formed by plating the inner walls of bottomed via holes. Note that the configurations of the interlayer connections 12 and 22 are not particularly limited. The interlayer connections 12 and 22 may be filled vias, through holes, or the like.
  • the land extension portion 14 and the land extension portion 24 are arranged so that at least a portion thereof overlaps each other when viewed in the thickness direction of the bonded printed wiring board 1.
  • the land extension part 14 and the land extension part 24 are arranged so that their tip portions overlap each other.
  • the land extension portion 14 and the land extension portion 24 may be arranged so as to overlap each other as a whole.
  • the land extension portion 14 and the land extension portion 24 are electrically connected by a conductive material. Therefore, the signal line 11 is electrically connected to the signal line 21 via the land extension 14 and the land extension 24.
  • FIG. 2A and 2B show two examples of longitudinal cross-sectional views along signal lines 11 and 21 of bonded printed wiring board 1.
  • FIG. 2A an anisotropic conductive film (ACF) is used as the conductive material 30, and the printed wiring board 10 and the printed wiring board 20 are bonded.
  • ACF anisotropic conductive film
  • the signal lines 11 and 21 are electrically connected by a conductive paste 30a, and the conductive paste 30a is insulated by a non-conductive material 31.
  • insulating base material 18A and insulating base material 18B are bonded to each other via adhesive layer 19 in printed wiring board 10.
  • a ground layer 17 is provided on the bonding surface of the printed wiring board 10, that is, on the upper surface of the insulating base material 18A. Furthermore, the ground layer 17 is formed to surround the interlayer connection portion 12 . Further, a ground layer 17A is provided on the lower surface of the insulating base material 18B.
  • the signal line 11 is provided on the lower surface of the insulating base material 18A. An end of the signal line 11 is connected to one end of an interlayer connection portion 12 provided so as to penetrate the insulating base material 18A.
  • a land extension portion 14 extending from the other end of the interlayer connection portion 12 is provided on the upper surface of the insulating base material 18A. More specifically, the land extension portion 14 extends from the land 13 that the interlayer connection portion 12 has. In this embodiment, the land extension portion 14 extends from the interlayer connection portion 12 along the direction in which the signal line 11 extends.
  • an insulating base material 28A and an insulating base material 28B are bonded together with an adhesive layer 29 interposed therebetween.
  • a ground layer 27 is provided to face the ground layer 17. More specifically, the ground layer 27 is provided on the bonding surface of the printed wiring board 20, that is, on the lower surface of the insulating base material 28A. Furthermore, the ground layer 27 is formed so as to surround the interlayer connection portion 22 . Further, a ground layer 27A is provided on the upper surface of the insulating base material 28B.
  • the signal line 21 is provided on the upper surface of the insulating base material 28A. An end of the signal line 21 is connected to one end of an interlayer connection part 22 provided so as to penetrate the insulating base material 28A.
  • the land extension 14 and the land extension 24 are electrically connected via a conductive material 30.
  • the conductive material 30 is an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).
  • the conductive material 30 may be solder such as cream solder, or a conductive paste.
  • insulation between the conductive pastes 30a may be achieved using a non-conductive material 31.
  • Solder may be used instead of the conductive paste 30a.
  • the non-conductive material 31 for example, a non-conductive film (NCF), a non-conductive paste (NCP), or an adhesive (including a slight adhesive) is used. The same applies to subsequent embodiments and modifications.
  • a ground layer 17 is provided in a region of the printed wiring board 10 that faces the interlayer connection portion 22 of the printed wiring board 20 (hereinafter referred to as "opposing region A1"). Not yet. Therefore, the interlayer connection portion 22 of the printed wiring board 20 does not face the ground layer 17 of the printed wiring board 10.
  • ground layer 27 is not provided in the area of the printed wiring board 20 that faces the interlayer connection portion 12 of the printed wiring board 10 (hereinafter referred to as "opposing area A2"). Therefore, the interlayer connection portion 12 of the printed wiring board 10 does not face the ground layer 27 of the printed wiring board 20.
  • the ground layer is not provided in the area facing the interlayer connection portion, and the interlayer connection portion and the ground layer are not close to each other. Therefore, it is possible to avoid a decrease in characteristic impedance due to an increase in the capacitance component of the printed wiring board.
  • the interlayer connection portion 12 and the interlayer connection portion 22 of the printed wiring board 10 are arranged so as not to face each other, and the land extension portion 14 is It does not extend to the opposing area A1 of the interlayer connection portion 22.
  • the land extension portion 24 of the printed wiring board 20 does not extend to the opposing area A2 of the interlayer connection portion 22.
  • the land extension 14 and the land extension 24 are arranged to face each other and are connected to each other by a conductive material 30 or a conductive paste 30a.
  • FIG. 3 is a perspective view of the bonding surface of printed wiring board 10 (20) of bonded printed wiring board 1.
  • the bonding surface of the printed wiring board 10 is a surface including the lands 13, land extensions 14, ground layer 17, and opposing area A1.
  • the land extension part 14 (24) has a rectangular shape in plan view, and extends with a constant width L from the interlayer connection part 12 (22) to the front of the opposing area A1 (A2). .
  • the tip of the land extension portion 14 (24) may be rounded.
  • the width L of the land extension 14 (24) is adjusted so that the impedance is matched between the land extension 14 (24) and the signal line 11 (21).
  • the width L of the land extension portion 14 (24) is set to 192 ⁇ m in order to match the characteristic impedance (50 ⁇ ) of the printed wiring board 10 (20).
  • the land extension portion 14 may extend to the opposing area A1.
  • the land extension portion 24 may extend to the opposing area A2. Thereby, the conduction between the signal line 11 and the signal line 21 can be made more stable.
  • the size and shape of the portion where the ground layer 17 (27) is removed and where the land extension portion 14 (24) extends is not limited to the approximately circular shape shown in FIG. 3.
  • the shape of the portion may be a channel shape in which both sides of the land extension 14 (24) are narrowed in accordance with the shape of the land extension 14 (24).
  • the shape of the portion can be variously modified, such as a polygonal shape.
  • the size and shape of the gap between the land extension 14 (24) and the ground layers 17 (27) on both sides can also be modified in various ways.
  • the bonding surface may have multiple surfaces.
  • the bonding surface has a first surface and a second surface connected via a step, the first surface is provided with the land extension part 14 (24), and the second surface is provided with the ground layer 17. (27) may be provided.
  • a step may exist in the ground layer 17 (27), and the ground layer 17 (27) may be provided spanning the first surface and the second surface. The same applies to the subsequent embodiments and modifications.
  • a single-sided metal foil-clad laminate 100 having an insulating base material 110 and a metal foil 120 provided on the top surface of the insulating base material 110 is prepared.
  • the insulating base material 110 is an insulating film (for example, 100 ⁇ m thick) containing liquid crystal polymer (LCP) or the like.
  • the metal foil 120 is a copper foil (for example, 12 ⁇ m thick).
  • the insulating base material 110 is not limited to LCP, and may be, for example, a fluorine-based material such as PFA and PTFE, or a polyimide-based material such as MPI and PI.
  • the metal foil 120 may be a metal foil containing a metal other than copper (silver, aluminum, etc.).
  • an adhesive layer 130 is formed on the lower surface of the insulating base material 110.
  • the adhesive layer 130 may be formed by applying an adhesive to the lower surface of the insulating base material 110, or may be formed by bonding an adhesive film to the insulating base material 110.
  • the adhesive layer 130 can be formed by laminating a protective film with an adhesive layer, which is a protective film with an adhesive layer formed on one side, on the lower surface of the insulating base material 110 and then peeling off the protective film. Good too.
  • a double-sided metal foil clad laminate comprising an insulating base material 210, a metal foil 220 provided on the upper surface of the insulating base material 210, and a metal foil 230 provided on the lower surface of the insulating base material 210.
  • a board 200 is prepared.
  • the insulating base material 210 is an insulating film (for example, 100 ⁇ m thick) containing liquid crystal polymer (LCP) or the like.
  • the metal foils 220 and 230 are copper foils (for example, 12 ⁇ m thick).
  • the insulating base material 210 is not limited to LCP, and may be, for example, a fluorine-based material such as PFA and PTFE, or a polyimide-based material such as MPI and PI.
  • the metal foils 220 and 230 may be metal foils containing metals other than copper (silver, aluminum, etc.).
  • a signal line 220a and a ground line 220b are formed by patterning the metal foil 220 of the double-sided metal foil-clad laminate 200 using a known photofabrication method.
  • the signal line 220a corresponds to the aforementioned signal line 11 (21), and the ground line 220b corresponds to the aforementioned ground line 41 (51).
  • the second wiring board obtained in the process described with reference to FIG. 4B is laminated on the first wiring board obtained in the process described with reference to FIG. 4D.
  • a laminate shown in 5A is produced. More specifically, after the first wiring board and the second wiring board are laminated so that the signal line 220a and the ground line 220b are embedded in the adhesive layer 130, they are laminated using a vacuum press device or a vacuum laminator device. A laminate is produced by applying heat and pressure. The heating temperature is higher than the floating point of the adhesive layer 130 (for example, 170° C.). If the adhesive layer 130 is not sufficiently cured by this heat treatment, then a curing treatment in an oven (oven cure) may be further performed.
  • via holes H1 and H2 are formed by irradiating a predetermined region of the laminate with laser light. More specifically, first, by processing the metal foils 120 and 230, a conformal mask having openings is formed at the positions where the via holes H1 and H2 are to be formed. Then, by irradiating the opening portions of the metal foils 120, 230 with a laser pulse, the insulating base materials 110, 210 (and the adhesive layer 130 in forming the via hole H1) exposed in the openings are removed. Note that the via hole may be formed using a window method, a direct drilling method, or the like instead of the conformal mask method.
  • an infrared laser such as a carbon dioxide laser, a UV-YAG laser, or the like is used.
  • the diameter of the via holes H1 and H2 is, for example, 150 ⁇ m.
  • a desmear process is performed to remove resin residue at the boundary between the adhesive layer 130 and the signal line 220a and a treated film (eg, Ni/Cr film) on the back surface of the ground line 220b. In this way, a via hole H1 in which the signal line 220a is exposed on the bottom surface and a via hole H2 in which the ground line 220b is exposed in the bottom surface are formed.
  • a drill is used to form a through hole H3 that penetrates the laminate in the thickness direction. Note that the order of forming the via holes H1, H2 and the through hole H3 is arbitrary.
  • vias 310 and 320 and a plated through hole 330 are formed by forming a metal plating layer (for example, a copper plating layer) on the inner walls of the via holes H1 and H2 and the through hole H3.
  • a metal plating layer for example, a copper plating layer
  • This step is performed, for example, by a panel plating method in which copper plating is applied to the entire laminate, or a button plating (pattern plating) method in which copper plating is applied only to a predetermined region of the laminate.
  • a panel plating method in which copper plating is applied to the entire laminate
  • a button plating (pattern plating) method in which copper plating is applied only to a predetermined region of the laminate.
  • the dry film is exposed and developed to perform plating on areas not covered with the dry film.
  • FIG. 6A shows a case where a plating layer is formed only in the regions of via holes H1, H2 and through hole H3 by button plating.
  • the via 310 corresponds to the interlayer connection portion 12 (22) described above. Further, the via 320 and the plated through hole 330 correspond to the ground via 42 (52) described above or the ground via 16 described below.
  • the via 310 electrically connects the signal line 220a and the metal foil 120.
  • Via 320 electrically connects ground line 220b and metal foil 230.
  • Plated through hole 330 electrically connects ground line 220b, metal foil 120, and metal foil 230.
  • a via that electrically connects the ground line 220b and the metal foil 120 may be formed as something equivalent to the ground via 42 (52) described above or the ground via 16 described below.
  • the vias 310 and 320 may be vias other than those having the above configuration, such as filled vias, staggered vias, or stacked vias.
  • the configurations of vias 310 and vias 320 may be different from each other.
  • an interlayer connection portion that electrically connects the ground wire 220b, the metal foil 120, and the metal foil 230 may be formed by filling the through hole H3 with a conductive material.
  • the metal foil 120 is patterned using a known photofabrication method. This forms what corresponds to the land 13 (23), land extension 14 (24), and ground layer 17 (27) described above. Further, the metal foil 230 is patterned using a known photofabrication method. As a result, a layer corresponding to the aforementioned ground layer 17A (27A) is formed. Note that, by patterning the metal foil 120, those corresponding to the receiving pad portion 15 (25) and the connecting portion (line) 14A described in the second embodiment and its modification are also formed.
  • a protective film 140 is laminated on the top surface of the laminate so as to cover the patterned metal foil 120. Furthermore, a protective film 240 is laminated on the lower surface of the laminate so as to cover the patterned metal foil 230.
  • the protective films 140, 240 include an insulating material. As this insulating material, for example, polyimide-based materials and photosensitive photoresists can be applied.
  • openings 410 and 430 are formed in the protective film 140, and an opening 420 is formed in the protective film 240.
  • Metal foil electrically connected to the ground line 220b is exposed in the openings 410 and 420.
  • a metal foil electrically connected to the signal line 220a is exposed in the opening 430.
  • the metal foils exposed in the openings 410, 420, 430 are subjected to gold plating to form plating layers 410A, 420A, 430A.
  • the exposed metal foil can be protected in a state where it can be electrically connected.
  • the plating layers 410A, 420A, and 430A may be formed by alloy plating such as Ni/Au plating.
  • surface treatment using water-based preflux or the like may be performed.
  • Print wiring board 300 corresponds to printed wiring board 10 (20) described above.
  • a bonded printed wiring board 1 can be obtained by bonding two printed wiring boards 300 obtained as described above via a conductive material such as ACF. Specifically, two printed wiring boards 300 are connected so that the plating layer 430A of one printed wiring board 300 and the plating layer 430A of the other printed wiring board 300 are electrically connected via a conductive material. join each other. As a result, a bonded printed wiring board in which the signal lines 220a of each printed wiring board 300 are electrically connected to each other via two vias 310 is obtained.
  • ACF is used as the conductive material
  • ACF is applied to the joint portion of printed wiring boards 10 and 20 at a temperature below the curing temperature of ACF (temporary adhesion). Thereafter, the ACF is cured by heating to a temperature equal to or higher than the curing temperature.
  • the cream solder or conductive paste is placed at a predetermined connection position by printing or the like. After that, a non-conductive film, a non-conductive paste, an adhesive (a slight adhesive may be used), etc. are applied. Thereafter, the printed wiring boards 10 and 20 are aligned and stacked on each other, and the conductive material is melted by heating the bonded portion with a pulse heater.
  • the insulating base material 110 and the insulating base material 210 are bonded together using an adhesive.
  • the insulating base material 110 and the insulating base material 210 may be bonded together by heating and pressurizing at a temperature equal to or higher than the melting point of the insulating base materials 110 and 210 without using an adhesive.
  • the interlayer connection part 12 does not face the ground layer 27 of the printed wiring board 20, and the interlayer connection part 22 does not face the ground layer 27 of the printed wiring board 10. It does not face the ground layer 17. Therefore, it is possible to avoid a decrease in the characteristic impedance of the bonded printed wiring board due to an increase in the capacitance component of the printed wiring board.
  • FIG. 8A shows simulation results of characteristic impedance by time domain reflectometry (TDR).
  • FIG. 8B shows a simulation result of the frequency dependence of the voltage standing wave ratio (VSWR) of the bonded printed wiring board 1.
  • the characteristic impedance does not decrease in the joint portion J (arrow portion in the figure).
  • the voltage standing wave ratio of the bonded printed wiring board 1 is a sufficiently low value throughout the frequency range of 0 to 30 GHz. This shows that the characteristic impedances are matched.
  • the characteristic impedance does not decrease at the bonded portion J, and signal reflection at the bonded portion is sufficiently suppressed. can.
  • the signal lines 11 and 21 of the printed wiring boards 10 and 20 are electrically connected to each other via the land extensions 14 and 24. Therefore, the signal line 11 of the printed wiring board 10 and the signal line 21 of the printed wiring board 20 can be stably connected. Further, printed wiring board 10 and printed wiring board 20 are directly connected without using a board-to-board connector. Therefore, resonance due to minute stubs of high-frequency signals is less likely to occur, so deterioration of transmission characteristics can be suppressed.
  • the thickness of the bonded portion can be reduced compared to the case where printed wiring boards are bonded together via a connector such as a board-to-board connector, so a space-saving structure can be realized. It can be realized.
  • the signal lines 11 and 21 of the printed wiring boards 10 and 20 are electrically connected to each other via the land extensions 14 and 24. This can prevent the dimples on the surfaces of the interlayer connections 12 and 22 from being filled with the conductive material 30 and making the conduction between the printed wiring boards 10 and 20 unstable. As a result, the manufacturability and yield of bonded printed wiring boards can be improved.
  • the printed wiring boards 10 and 20 have a three-layer structure, and the signal lines are configured as stripline high-speed transmission lines.
  • the number of layers and the configuration of signal lines are not limited to the number of layers and configuration described above.
  • the signal line may be a wiring formed on the surface of an insulating base material, such as a microstrip line structure.
  • the microstrip line may be configured as a microstrip antenna or as a transmission path.
  • the bonded printed wiring board 1 is one in which two printed wiring boards 10 and 20 are bonded together.
  • the bonded printed wiring board 1 may have a plurality of bonded parts in which three or more printed wiring boards are sequentially bonded.
  • the plurality of printed wiring boards are not limited to being joined to each other so that their longitudinal directions are parallel, but may be joined to each other so that their longitudinal directions are orthogonal or oblique.
  • FIG. 9 is a plan view of the bonded surface of the printed wiring board 10 of the bonded printed wiring board 1 according to this modification.
  • the printed wiring board 10 includes, for each signal line 11, an interlayer connection portion 12, a land 13, and a land extension portion 14 extending from the interlayer connection portion 12.
  • the land extension 14 extends from the land 13.
  • An end of each signal line 11 is connected to one end of a corresponding interlayer connection section 12 .
  • Each interlayer connection portion 12 has a land 13.
  • the land extension portion 14 extends from the other end of each interlayer connection portion 12 .
  • printed wiring board 20 has a similar configuration to printed wiring board 10.
  • the number of interlayer connections 12 is not limited to four, and may be increased or decreased depending on the required number of signal lines.
  • the plurality of signal lines 11 extend parallel to each other along the extending direction of the land extension 14 (vertical direction in the figure).
  • each of the plurality of signal lines 11 is connected to the corresponding signal line of the plurality of signal lines 21 via the corresponding land extension 14, conductive material 30, and land extension 24. It is electrically connected to 21.
  • the ground layer 17 is not provided in the facing area A1 of the printed wiring board 10, as in the first embodiment. Therefore, the interlayer connection portion 22 of the printed wiring board 20 does not face the ground layer 17 of the printed wiring board 10.
  • the ground layer 27 is not provided in the facing area A2 of the printed wiring board 20. Therefore, the interlayer connection portion 12 of the printed wiring board 10 does not face the ground layer 27 of the printed wiring board 20. Therefore, similarly to the first embodiment, it is possible to avoid a decrease in characteristic impedance due to an increase in the capacitance component of the printed wiring board.
  • a plurality of interlayer connecting portions 12 are arranged in a staggered manner along the width direction (horizontal direction in the figure) of the printed wiring board 10. Furthermore, the plurality of land extensions 14 extend in the same direction (upward in the figure). In this way, the plurality of interlayer connections 12 are arranged such that the line connecting the centers of the interlayer connections 12 forms a zigzag shape. Therefore, according to this modification, the area of the connecting portion can be reduced.
  • the plurality of interlayer connections 12 may be arranged in a staggered manner along the longitudinal direction (vertical direction in the figure) of the printed wiring board 10.
  • the plurality of land extensions 14 extend toward the same side (upper side in the figure).
  • at least one land extension 14 may extend towards the opposite side (downward in the figure).
  • the land extensions 14 of adjacent interlayer connections 12 may alternately extend to opposite sides.
  • each interlayer connection section 12 is partitioned by a separate section S of the ground layer 17. That is, each interlayer connection part 12 is arranged in each of the plurality of openings provided in the ground layer 17.
  • each interlayer connection section 12 is partitioned by the separate section S of the ground layer 17. That is, each interlayer connection part 12 is arranged in each of the plurality of openings provided in the ground layer 17.
  • the bonding surface may have multiple surfaces.
  • the bonding surface has a first surface and a second surface connected to each other through a step, and the first surface is provided with a certain land extension 14 of the plurality of land extensions 14. Another one of the plurality of land extensions 14 may be provided on the second surface. The same applies to the subsequent embodiments and modifications.
  • the bonded printed wiring board 1 includes a plurality of signal lines 11 and 21. Therefore, it is possible to provide a bonded printed wiring board that can be used when four signal lines are used, when two sets of differential lines are used, and the like.
  • connection parts 12 Furthermore, by arranging the plurality of interlayer connection parts 12 in a staggered manner, the area of the connection parts can be reduced.
  • FIG. 10 is a longitudinal cross-sectional view along the signal line of the bonded printed wiring board 1 according to this modification.
  • the interlayer connection portion 12 of the printed wiring board 10 and the interlayer connection portion 22 of the printed wiring board 20 are arranged to face each other.
  • Land extensions 14 of printed wiring board 10 and land extensions 24 of printed wiring board 20 are also arranged to face each other.
  • the interlayer connection parts face each other.
  • the signal line 11 and the signal line 21 are electrically connected via land extensions 14 and 24. Therefore, even if the dimples on the surfaces of the interlayer connection parts 12 and 22 are filled with the conductive material 30 and the conduction between the interlayer connection parts 12 and 22 becomes unstable, the land extension parts 14 and 24 allow the signal lines 11 and 21 to It is possible to ensure continuity between the two. Note that the areas of the land extensions 14 and 24 are preferably as small as possible to ensure continuity between the signal lines 11 and 21.
  • FIG. 11 is a perspective view of the bonding surface of printed wiring board 10 (20) of the bonded printed wiring board according to the second embodiment.
  • the bonding surface is a surface including the ground layer 17 (27), the land 13 (23), and the receiving pad portion 15 (25).
  • FIG. 12 is a longitudinal cross-sectional view along the signal line of the bonded printed wiring board according to the second embodiment.
  • the land extension has a receiving pad portion formed to encompass the opposing area. It is. That is, the area of the receiving pad portion is greater than or equal to the total area of the land and via portions of the opposing interlayer connection portions.
  • the second embodiment will be described below, focusing on the differences.
  • a receiving pad portion 15 is provided as a land extension portion extending from the land 13 of the interlayer connection portion 12 of the printed wiring board 10.
  • This receiving pad portion 15 is an example of a first receiving pad portion, and is formed so as to include the facing area A1.
  • the receiving pad portion 15 faces the interlayer connection portion 22.
  • a receiving pad portion 25 is provided as the land extension portion 24 of the printed wiring board 20.
  • the receiving pad portion 25 is an example of a second receiving pad portion, and is formed to include the opposing area A2.
  • the receiving pad portion 25 faces the interlayer connection portion 12 of the printed wiring board 10 .
  • the diameter of the receiving pad portions 15, 25 is 400 ⁇ m, and the diameter of the lands 23, 13 is 350 ⁇ m. That is, the area of the receiving pad portion is larger than the area of the opposing region.
  • the lands 13, 23 will not protrude from the receiving pad portions 25, 15, respectively, when viewed in the thickness direction of the printed wiring boards 10, 20. Therefore, conduction between the signal lines can be ensured, and impedance mismatch and variation can be suppressed.
  • the receiving pad portion 15 of the printed wiring board 10 is bonded to the interlayer connection portion 22 and land 23 of the printed wiring board 20 via the conductive material 30. Further, the receiving pad portion 25 of the printed wiring board 20 is joined to the interlayer connection portion 12 and the land 13 of the printed wiring board 10 via the conductive material 30.
  • the interlayer connection portion and the receiving pad portion of each of printed wiring boards 10 and 20 are arranged to face each other.
  • the fluidity of the conductive material 30 such as ACF is reduced in the bonding process compared to a bonded structure in which the interlayer connecting portions 12 and 22 are butted against each other. Therefore, stable conduction can be obtained.
  • the receiving pad portion has a relatively large area so as to include the opposing region. Therefore, connection reliability can be improved compared to the first embodiment.
  • FIG. 13 is a plan view of the bonding surface of the printed wiring board 10 of the bonded printed wiring board 1 according to this modification.
  • the printed wiring board 10 includes, for each signal line 11, an interlayer connection portion 12, a land 13, and a receiving pad portion 15 extending from the interlayer connection portion 12 (land 13). An end of each signal line 11 is connected to a corresponding interlayer connection part 12. Each interlayer connection portion 12 has a land 13.
  • printed wiring board 20 has a similar configuration to printed wiring board 10. Thereby, a bonded printed wiring board is constructed in which the plurality of signal lines 11 of the printed wiring board 10 and the plurality of signal lines 21 of the printed wiring board 20 are electrically connected to each other.
  • the plurality of signal lines 11 extend parallel to each other along the direction (vertical direction in the figure) connecting the interlayer connection section 12 and the receiving pad section 15.
  • the number of interlayer connections 12 is not limited to four, and may be increased or decreased depending on the required number of signal lines.
  • each of the plurality of signal lines 11 of the printed wiring board 10 is connected to the corresponding receiving pad portion 15, the conductive material 30, and the receiving pad portion 25 of the printed wiring board 20. It is electrically connected to the corresponding signal line 21 of the plurality of signal lines 21 via.
  • the plurality of interlayer connections 12 are arranged in a staggered manner along the width direction (horizontal direction in the figure) of the printed wiring board 10. ing. That is, the plurality of interlayer connecting parts 12 are arranged so that the line connecting the centers of the interlayer connecting parts 12 forms a zigzag shape. Thereby, according to this modification, the widths of the plurality of interlayer connections 12 can be reduced. Therefore, the area of the connecting portion can be reduced.
  • the plurality of interlayer connections 12 may be arranged in a staggered manner along the longitudinal direction (vertical direction in the figure) of the printed wiring board 10.
  • the plurality of receiving pad portions 15 extend toward the same side (upper side in the figure).
  • at least one receiving pad portion 15 may extend toward the opposite side (lower side in the figure).
  • the plurality of receiving pad portions 15 may alternately extend to opposite sides along the arrangement direction of the interlayer connection portions 12 (the width direction or the longitudinal direction of the printed wiring board).
  • the interlayer connection portion 12 and the receiving pad portion 15 are arranged along the diagonal direction. That is, the interlayer connecting portion 12 and the receiving pad portion 15 are arranged such that the line connecting the center of the interlayer connecting portion 12 and the center of the receiving pad portion 15 is oblique to the width direction of the printed wiring board 10. There is. Thereby, the width X of the plurality of interlayer connection parts 12 can be reduced.
  • interlayer connections 12 is not limited to three, and may be increased or decreased depending on the required number of signal lines.
  • the plurality of interlayer connection parts 12 and the plurality of receiving pad parts 15 are arranged in a straight line along the vertical direction (the longitudinal direction of the printed wiring board 10). . Thereby, the width Y of the plurality of interlayer connection parts 12 can be further reduced.
  • interlayer connections 12 is not limited to three, and may be increased or decreased depending on the required number of signal lines.
  • the printed wiring board 10 further includes a ground via 16 electrically connected to the ground layer 17.
  • This ground via 16 is arranged between the interlayer connections 12.
  • ground via 16 may be electrically connected to the ground layer 17A. Further, the ground via 16 is generally different from the ground vias 42 and 52 of FIGS. 1A and 1B, but may be the same. Furthermore, the number of interlayer connections 12 is not limited to three, and may be increased or decreased depending on the required number of signal lines.
  • a plurality of interlayer connections 12 are arranged to surround a ground via 16.
  • the ground via 16 is shared by a plurality of interlayer connections 12.
  • each of the interlayer connection parts 12 is partitioned by a separate part S of the ground layer 17.
  • each interlayer connection part 12 is arranged in each of the plurality of openings provided in the ground layer 17.
  • the gap G between the interlayer connection portion 12 or the receiving pad portion 15 and the ground layer 17 is 50 ⁇ m, and the width W of the separate portion S is 50 ⁇ m.
  • the size of the gap G and width W may be changed. Further, as shown in FIGS. 15 and 18, the separate portion S may not be provided.
  • a plurality of interlayer connections 12 are arranged in a triangular lattice shape. That is, the plurality of interlayer connecting parts 12 are arranged such that the center of each interlayer connecting part 12 is located at the vertex of the triangle.
  • Triangles include triangle T1 and equilateral triangle T2.
  • the plurality of interlayer connection parts 12 can be arranged at a higher density than in the first modification.
  • the interlayer connection section 12 has a connection section (line) 14A that connects the receiving pad section 15 and the interlayer connection section 12.
  • connection section (line) 14A that connects the receiving pad section 15 and the interlayer connection section 12.
  • the size (area) of the land 13 and/or the receiving pad portion 15 may be changed for each interlayer connection portion 12.
  • the central receiving pad section 15 surrounded by the four interlayer connection sections 12 may be smaller than the other receiving pad sections 15.
  • the plurality of interlayer connections 12 can be arranged at a higher density.
  • FIG. 19 is a longitudinal cross-sectional view along signal lines 11 and 21 of a bonded printed wiring board according to the third embodiment.
  • the land extension portion 14 and the land extension portion 24 are directly electrically connected without using a conductive material.
  • Printed wiring board 10 and printed wiring board 20 are joined by a non-conductive material 31.
  • the non-conductive material 31 for example, a non-conductive film, a non-conductive paste or an adhesive is used.
  • the ground layer 17 and the ground layer 27 are also directly electrically connected to each other without using a conductive material.
  • the combination of items that are directly electrically connected is not limited to land extensions.
  • the interlayer connection parts and the land extension parts may be directly electrically connected to each other.
  • the land extension portion (receiving pad portion) and the interlayer connection portion may be directly electrically connected.
  • the thickness of the bonded portion of the bonded printed wiring board 1 can be further reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Provided is a composite printed wiring circuit board that is capable of adequately suppressing the reflection of signals in joined portions and that has a stable and space-saving connection structure.　In a composite printed wiring board 1, a printed wiring board 10 and a printed wiring board 20 are joined together. The printed wiring board 10 includes: signal wiring 11; an interlayer connection section 12; a land extension section 14 provided to a bonding surface of the printed wiring board 10; and a ground layer 17 provided to said bonding surface. The printed wiring board 20 includes: signal wiring 21; an interlayer connection section 22; a land extension section 24 provided to a bonding surface of the printed wiring board 20; and a ground layer 27 provided to said bonding surface. The signal wiring 11 is electrically connected to the signal wiring 21 via the land extension section 14 and the land extension section 24. The interlayer connection section 12 faces the ground layer 27 of the printed wiring board 20. The interlayer connection section 22 faces the ground layer 17 of the printed wiring board 10.

Description

接合プリント配線板および接合プリント配線板の製造方法Bonded printed wiring board and method for manufacturing bonded printed wiring board
　本開示の一態様は、接合プリント配線板、および、接合プリント配線板の製造方法に関する。 One aspect of the present disclosure relates to a bonded printed wiring board and a method for manufacturing the bonded printed wiring board.
　スマートフォン、タブレット端末および携帯電話などの情報通信機器は、他の装置と通信するためのアンテナモジュールと、半導体チップなどの電子部品が実装されるメイン基板とを有している。アンテナモジュールとメイン基板とを電気的に接続するために、接合プリント配線板が使用される。接合プリント配線板には、２つのプリント配線板が、接合部分においてコネクタを介して接続されているものがある。このコネクタは、たとえば、小型の同軸コネクタ、あるいは、ボードツーボードコネクタである。 Information communication devices such as smartphones, tablet terminals, and mobile phones have an antenna module for communicating with other devices and a main board on which electronic components such as semiconductor chips are mounted. A bonded printed wiring board is used to electrically connect the antenna module and the main board. Some bonded printed wiring boards include two printed wiring boards connected via a connector at a bonded portion. This connector is, for example, a small coaxial connector or a board-to-board connector.
国際公開第２０２０／１５８８１０号パンフレットInternational Publication No. 2020/158810 pamphlet
　２つのプリント配線板がコネクタを介して接続されている接合プリント配線板では、コネクタの端子が、微少なスタブ構造を有する。このようなスタブ構造は、デジタル信号の高速化に有用な高周波信号伝送において、共振を発生させることにより、伝送効率を著しく低下させる。また、情報通信機器等の装置内に接合プリント配線板を配置する際、コネクタの介在により厚みを増した接合部分が、配置の妨げとなることもある。 In a bonded printed wiring board in which two printed wiring boards are connected via a connector, the terminals of the connector have a minute stub structure. Such a stub structure significantly reduces transmission efficiency by generating resonance in high frequency signal transmission useful for increasing the speed of digital signals. Furthermore, when a bonded printed wiring board is placed in a device such as an information communication device, the bonded portion, which has increased in thickness due to the interposition of a connector, may obstruct the placement.
　そこで、コネクタ接続による伝送特性の劣化を回避し、接合部分を省スペース化するために、コネクタを含まない接合プリント配線板を用いることが考えられる。この接合プリント配線板では、たとえば、半田あるいは異方性導電材料などの導電材料を介して、２枚のプリント配線板が直接に接続される。このような接合プリント配線板において、配線の特性インピーダンスＺは、インダクタンス成分Ｌおよびキャパシタンス成分Ｃにより決定される。具体的には、配線の特性インピーダンスＺは、以下の式（１）で与えられる。
Therefore, in order to avoid deterioration of transmission characteristics due to connector connection and to save space in the joint portion, it is conceivable to use a joint printed wiring board that does not include a connector. In this bonded printed wiring board, two printed wiring boards are directly connected, for example, through a conductive material such as solder or an anisotropic conductive material. In such a bonded printed wiring board, the characteristic impedance Z of the wiring is determined by the inductance component L and the capacitance component C. Specifically, the characteristic impedance Z of the wiring is given by the following equation (1).
　たとえば、プリント配線板の特性インピーダンスＺは、通常、５０Ωに整合されている。しかし、接合部分においてビアとグランド層とが接近している構造の場合、ビアとグランド層との間でキャパシタンスが発生する。このため、接合部分のキャパシタンスが増大する。これにより、接合部分の特性インピーダンスが低下して、接合部分とプリント配線板の配線部分との間で特性インピーダンスが不整合となる。その結果、接合部分において、信号の反射が生じてしまう。 For example, the characteristic impedance Z of a printed wiring board is usually matched to 50Ω. However, in the case of a structure in which the via and the ground layer are close to each other at the junction, capacitance occurs between the via and the ground layer. Therefore, the capacitance of the junction increases. As a result, the characteristic impedance of the bonded portion decreases, resulting in a mismatch in characteristic impedance between the bonded portion and the wiring portion of the printed wiring board. As a result, signal reflection occurs at the joint.
　ビアとグランド層との接近を防ぐために、２枚のプリント配線板のビア同士を対向配置することが考えられる。しかし、この場合、プリント配線板を接合する際に、互いに対向するビアのディンプルに導電材料が流入してしまい、接合プリント配線板の導通安定性を確保することが困難となることがある。 In order to prevent the vias from coming close to the ground layer, it is conceivable to arrange the vias of two printed wiring boards to face each other. However, in this case, when the printed wiring boards are bonded, the conductive material may flow into the dimples of the vias facing each other, making it difficult to ensure conduction stability of the bonded printed wiring boards.
　本開示における１つの目的は、接合部分における信号の反射を十分に抑制可能であり、安定且つ省スペースの接続構造を有する、接合プリント配線板を提供することである。 One object of the present disclosure is to provide a bonded printed wiring board that can sufficiently suppress signal reflection at the bonded portion and has a stable and space-saving connection structure.
　本開示の第１の態様に係る接合プリント配線板は、第１のプリント配線板と、前記第１のプリント配線板と接合された第２のプリント配線板と、を有し、前記第１のプリント配線板は、第１の信号線と、前記第１の信号線に一端が接続された第１の層間接続部と、前記第１の層間接続部の他端から延出し、前記第１のプリント配線板の接合面に設けられた第１のランド延長部と、前記接合面に設けられた第１のグランド層と、を有し、前記第２のプリント配線板は、第２の信号線と、前記第２の信号線に一端が接続された第２の層間接続部と、前記第２の層間接続部の他端から延出し、前記第２のプリント配線板の接合面に設けられた第２のランド延長部と、前記接合面に設けられた第２のグランド層と、を有し、前記第１の信号線は、前記第１のランド延長部および前記第２のランド延長部を介して、前記第２の信号線に電気的に接続され、前記第１の層間接続部は、前記第２のプリント配線板の前記第２のグランド層と対向せず、前記第２の層間接続部は、前記第１のプリント配線板の前記第１のグランド層と対向していない。 A bonded printed wiring board according to a first aspect of the present disclosure includes a first printed wiring board and a second printed wiring board bonded to the first printed wiring board, and includes a second printed wiring board bonded to the first printed wiring board. The printed wiring board includes a first signal line, a first interlayer connection part whose one end is connected to the first signal line, and a first interlayer connection part extending from the other end of the first interlayer connection part, and a first interlayer connection part extending from the other end of the first interlayer connection part. The second printed wiring board has a first land extension provided on a bonding surface of a printed wiring board, and a first ground layer provided on the bonding surface, and the second printed wiring board has a second land extension portion provided on a bonding surface of the printed wiring board. a second interlayer connection portion having one end connected to the second signal line; and a second interlayer connection portion extending from the other end of the second interlayer connection portion and provided on the bonding surface of the second printed wiring board. The first signal line includes a second land extension and a second ground layer provided on the joint surface, and the first signal line includes a second land extension and a second land extension. the first interlayer connection portion does not face the second ground layer of the second printed wiring board, and is electrically connected to the second signal line through The portion does not face the first ground layer of the first printed wiring board.
　また、前記接合プリント配線板において、前記第１の層間接続部と前記第２の層間接続部とは、互いに対向しないように配置され、前記第１のランド延長部は、前記第２の層間接続部の対向領域まで延びておらず、前記第２のランド延長部は、前記第１の層間接続部の対向領域まで延びておらず、前記第１のランド延長部と前記第２のランド延長部とは、互いに対向するように配置されていてもよい。 Further, in the bonded printed wiring board, the first interlayer connection part and the second interlayer connection part are arranged so as not to face each other, and the first land extension part is connected to the second interlayer connection part. The second land extension does not extend to an opposing area of the first interlayer connection, and the first land extension and the second land extension do not extend to an opposing area of the first interlayer connection. may be arranged so as to face each other.
　また、前記接合プリント配線板において、前記第１のランド延長部および前記第２のランド延長部は、平面視で矩形状であり、前記第１のランド延長部および前記第２のランド延長部の幅は、それぞれ、前記第１のランド延長部と前記第１の信号線との間、および、前記第２のランド延長部と前記第２の信号線との間でインピーダンスが整合されるように調整されていてもよい。 Further, in the bonded printed wiring board, the first land extension part and the second land extension part are rectangular in plan view, and the first land extension part and the second land extension part are rectangular in plan view. The width is such that impedance is matched between the first land extension and the first signal line and between the second land extension and the second signal line, respectively. It may be adjusted.
　また、前記接合プリント配線板において、前記第１の層間接続部と前記第２の層間接続部とは、互いに対向しないように配置されており、前記第１のランド延長部は、前記第２の層間接続部の対向領域まで延びている、および／または、前記第２のランド延長部は、前記第１の層間接続部の対向領域まで延びていてもよい。 Further, in the bonded printed wiring board, the first interlayer connection portion and the second interlayer connection portion are arranged so as not to face each other, and the first land extension portion is arranged so as not to face each other. The second land extension may extend to an opposite area of the interlayer connection and/or the second land extension may extend to an opposite area of the first interlayer connection.
　また、前記接合プリント配線板において、前記第１のランド延長部は、前記第２の層間接続部に対向する第１の受けパッド部を有し、前記第２のランド延長部は、前記第１の層間接続部に対向する第２の受けパッド部を有していてもよい。 Further, in the bonded printed wiring board, the first land extension portion has a first receiving pad portion facing the second interlayer connection portion, and the second land extension portion has a first receiving pad portion facing the second interlayer connection portion. It may have a second receiving pad portion facing the interlayer connection portion.
　また、前記接合プリント配線板において、前記第１の受けパッド部は、前記第２の層間接続部の対向領域を包含し、前記第２の受けパッド部は、前記第１の層間接続部の対向領域を包含していてもよい。 Further, in the bonded printed wiring board, the first receiving pad portion includes an area opposite to the second interlayer connection portion, and the second reception pad portion includes an area opposite to the first interlayer connection portion. It may include an area.
　また、前記接合プリント配線板において、前記第１のランド延長部と前記第２のランド延長部とは、互いに対向するように配置され、前記第１の層間接続部と前記第２の層間接続部とは、互いに対向するように配置されていてもよい。 Further, in the bonded printed wiring board, the first land extension part and the second land extension part are arranged to face each other, and the first interlayer connection part and the second interlayer connection part may be arranged so as to face each other.
　また、前記接合プリント配線板において、前記第１の層間接続部および／または前記第１のランド延長部と、前記第２の層間接続部および／または前記第２のランド延長部とは、導電材料を介して電気的に接続されており、前記導電材料は、異方性導電フィルム、異方性導電ペースト、半田または導電ペーストであってもよい。 Further, in the bonded printed wiring board, the first interlayer connection portion and/or the first land extension portion, and the second interlayer connection portion and/or the second land extension portion are made of a conductive material. The conductive material may be an anisotropic conductive film, an anisotropic conductive paste, solder, or a conductive paste.
　また、前記接合プリント配線板において、前記第１の層間接続部および／または前記第１のランド延長部と、前記第２の層間接続部および／または前記第２のランド延長部とは、直接、電気的に接続され、前記第１のプリント配線板と前記第２のプリント配線板とは、非導電材料によって接合されており、前記非導電材料は、非導電性フィルム、非導電性ペーストまたは接着剤であってもよい。 Further, in the bonded printed wiring board, the first interlayer connection part and/or the first land extension part and the second interlayer connection part and/or the second land extension part are directly connected to each other, The first printed wiring board and the second printed wiring board are electrically connected and are joined by a non-conductive material, and the non-conductive material is a non-conductive film, a non-conductive paste, or an adhesive. It may be an agent.
　また、前記接合プリント配線板において、前記第１のプリント配線板および／または前記第２のプリント配線板は、フレキシブルプリント配線板であってもよい。 Furthermore, in the bonded printed wiring board, the first printed wiring board and/or the second printed wiring board may be a flexible printed wiring board.
　また、前記接合プリント配線板において、前記フレキシブルプリント配線板の絶縁基材は、液晶ポリマー、フッ素系材料またはポリイミド系材料を含んでいてもよい。 Furthermore, in the bonded printed wiring board, the insulating base material of the flexible printed wiring board may contain a liquid crystal polymer, a fluorine-based material, or a polyimide-based material.
　また、前記接合プリント配線板において、前記第１のプリント配線板は、アンテナおよびアンテナ基板を含むアンテナモジュールに接続され、前記第２のプリント配線板は、メイン基板に接続されており、前記メイン基板には、前記アンテナが受信した信号に基づき情報処理を行う半導体チップが実装されていてもよい。 Further, in the bonded printed wiring board, the first printed wiring board is connected to an antenna module including an antenna and an antenna board, and the second printed wiring board is connected to a main board, and the first printed wiring board is connected to an antenna module including an antenna and an antenna board. The antenna may include a semiconductor chip that performs information processing based on the signal received by the antenna.
　本開示の第２の態様に係る接合プリント配線板は、第１のプリント配線板と、前記第１のプリント配線板と接合された第２のプリント配線板と、を有し、前記第１のプリント配線板は、複数の第１の信号線と、前記複数の第１の信号線に一端が接続された複数の第１の層間接続部と、前記複数の第１の層間接続部の他端から延出し、前記第１のプリント配線板の接合面に設けられた複数の第１のランド延長部と、前記接合面に設けられた第１のグランド層と、を有し、前記第２のプリント配線板は、複数の第２の信号線と、前記複数の第２の信号線に一端が接続された複数の第２の層間接続部と、前記複数の第２の層間接続部の他端から延出し、前記第２のプリント配線板の接合面に設けられた複数の第２のランド延長部と、前記接合面に設けられた第２のグランド層と、を有し、前記複数の第１の信号線の各々は、対応する前記第１のランド延長部および前記第２のランド延長部を介して、前記複数の第２の信号線のうちの対応する第２の信号線に電気的に接続され、前記複数の第１の層間接続部は、前記第２のプリント配線板の前記第２のグランド層と対向せず、前記複数の第２の層間接続部は、前記第１のプリント配線板の前記第１のグランド層と対向していない。 A bonded printed wiring board according to a second aspect of the present disclosure includes a first printed wiring board and a second printed wiring board bonded to the first printed wiring board, and includes a second printed wiring board bonded to the first printed wiring board. The printed wiring board includes a plurality of first signal lines, a plurality of first interlayer connection parts each having one end connected to the plurality of first signal lines, and the other end of the plurality of first interlayer connection parts. a plurality of first land extensions extending from the first printed wiring board and provided on the bonding surface of the first printed wiring board; and a first ground layer provided on the bonding surface; The printed wiring board includes a plurality of second signal lines, a plurality of second interlayer connection parts each having one end connected to the plurality of second signal lines, and the other end of the plurality of second interlayer connection parts. a plurality of second land extensions extending from the second printed wiring board and provided on the bonding surface of the second printed wiring board; and a second ground layer provided on the bonding surface of the second printed wiring board; Each of the one signal line is electrically connected to a corresponding second signal line of the plurality of second signal lines via the corresponding first land extension part and the second land extension part. , the plurality of first interlayer connection parts do not face the second ground layer of the second printed wiring board, and the plurality of second interlayer connection parts are connected to the first printed wiring board. It does not face the first ground layer of the wiring board.
　また、前記接合プリント配線板において、前記複数の第１の層間接続部は、所定の方向に沿って千鳥状に配置されていてもよい。 Furthermore, in the bonded printed wiring board, the plurality of first interlayer connection parts may be arranged in a staggered manner along a predetermined direction.
　また、前記接合プリント配線板において、前記第１の層間接続部と前記第１のランド延長部とを結ぶ線が、前記第１のプリント配線板の幅方向に対して斜交するように、前記第１の層間接続部および前記第１のランド延長部が配置されていてもよい。 Further, in the bonded printed wiring board, the line connecting the first interlayer connection part and the first land extension part is arranged obliquely to the width direction of the first printed wiring board. A first interlayer connection and the first land extension may be arranged.
　また、前記接合プリント配線板において、前記複数の第１の層間接続部および前記複数の第１のランド延長部が、前記第１のプリント配線板の長手方向に沿って配置されていてもよい。 Furthermore, in the bonded printed wiring board, the plurality of first interlayer connection parts and the plurality of first land extension parts may be arranged along the longitudinal direction of the first printed wiring board.
　また、前記接合プリント配線板において、前記複数の第１の層間接続部のうち少なくとも一対の第１の層間接続部間に、グランドビアが配置されていてもよい。 Further, in the bonded printed wiring board, a ground via may be arranged between at least one pair of first interlayer connection parts among the plurality of first interlayer connection parts.
　また、前記接合プリント配線板において、前記複数の第１の層間接続部に囲まれるように、グランドビアが配置されていてもよい。 Further, in the bonded printed wiring board, a ground via may be arranged so as to be surrounded by the plurality of first interlayer connection parts.
　また、前記接合プリント配線板において、前記複数の第１のランド延長部の各々は、対応する前記第２の層間接続部に対向する受けパッド部を有し、前記複数の第１の層間接続部および／または複数の前記受けパッド部は、三角形格子状に配置されていてもよい。 Further, in the bonded printed wiring board, each of the plurality of first land extension parts has a receiving pad part facing the corresponding second interlayer connection part, and the plurality of first land extension parts And/or the plurality of receiving pad portions may be arranged in a triangular lattice shape.
　また、前記接合プリント配線板において、前記複数の第１のランド延長部のうち少なくとも１つは、前記受けパッド部と前記第１の層間接続部とを接続する接続部をさらに有してもよい。 Furthermore, in the bonded printed wiring board, at least one of the plurality of first land extensions may further include a connection part that connects the receiving pad part and the first interlayer connection part. .
　また、前記接合プリント配線板において、前記複数の第１の層間接続部の各々は、前記第１のグランド層により仕切られていてもよい。 Furthermore, in the bonded printed wiring board, each of the plurality of first interlayer connection parts may be partitioned by the first ground layer.
　本開示に係る接合プリント配線板の製造方法は、第１の信号線と、前記第１の信号線に一端が接続された第１の層間接続部と、前記第１の層間接続部の他端から延出する第１のランド延長部と、前記第１のランド延長部と同じ面に設けられた第１のグランド層と、を有する第１のプリント配線板を作製すること、第２の信号線と、前記第２の信号線に一端が接続された第２の層間接続部と、前記第２の層間接続部の他端から延出する第２のランド延長部と、前記第２のランド延長部と同じ面に設けられた第２のグランド層と、を有する第２のプリント配線板を作製すること、および、前記第１の信号線が前記第１のランド延長部および前記第２のランド延長部を介して前記第２の信号線に電気的に接続され、前記第１の層間接続部が前記第２のプリント配線板の前記第２のグランド層と対向せず、前記第２の層間接続部が前記第１のプリント配線板の前記第１のグランド層と対向しないように、前記第１のプリント配線板と前記第２のプリント配線板とを接合すること、を備えている。 A method for manufacturing a bonded printed wiring board according to the present disclosure includes: a first signal line, a first interlayer connection part whose one end is connected to the first signal line, and the other end of the first interlayer connection part. producing a first printed wiring board having a first land extension extending from the first land extension and a first ground layer provided on the same surface as the first land extension; a second interlayer connection portion having one end connected to the second signal line, a second land extension extending from the other end of the second interlayer connection portion, and the second land producing a second printed wiring board having a second ground layer provided on the same surface as the extension part; and the first signal line is connected to the first land extension part and the second ground layer. electrically connected to the second signal line via a land extension, the first interlayer connection does not face the second ground layer of the second printed wiring board, and the second The first printed wiring board and the second printed wiring board are joined so that the interlayer connection portion does not face the first ground layer of the first printed wiring board.
　本開示における上記した態様によれば、接合部分における信号の反射を十分に抑制可能であり、安定且つ省スペースの接続構造を有する、接合プリント配線板を提供することができる。 According to the above-described aspects of the present disclosure, it is possible to provide a bonded printed wiring board that can sufficiently suppress signal reflection at the bonded portion and has a stable and space-saving connection structure.
　図１Ａは、第１の実施形態に係る接合プリント配線板の斜視図である。
　図１Ｂは、図１Ａの接合部分Ｊを拡大した図である。
　図２Ａは、第１の実施形態に係る接合プリント配線板の、信号線に沿った縦断面図（第１の例）である。
　図２Ｂは、第１の実施形態に係る接合プリント配線板の、信号線に沿った縦断面図（第２の例）である。
　図３は、第１の実施形態に係る接合プリント配線板の、一方のプリント配線板の接合面の斜視図である。
　図４Ａ～Ｄは、第１の実施形態に係る接合プリント配線板の製造方法を説明するための工程断面図である。
　図５ＡおよびＢは、図４Ａ～Ｄに続く、第１の実施形態に係る接合プリント配線板の製造方法を説明するための工程断面図である。
　図６ＡおよびＢは、図５ＡおよびＢに続く、第１の実施形態に係る接合プリント配線板の製造方法を説明するための工程断面図である。
　図７ＡおよびＢは、図６ＡおよびＢに続く、第１の実施形態に係る接合プリント配線板の製造方法を説明するための工程断面図である。
　図８ＡおよびＢは、第１の実施形態に係る接合プリント配線板の伝送特性のシミュレーション結果を示す図である。
　図９は、第１の実施形態の変形例１に係る接合プリント配線板の、一方のプリント配線板の接合面の平面図である。
　図１０は、第１の実施形態の変形例２に係る接合プリント配線板の、信号線に沿った縦断面図である。
　図１１は、第２の実施形態に係る接合プリント配線板、の一方のプリント配線板の接合面の斜視図である。
　図１２は、第２の実施形態に係る接合プリント配線板の、信号線に沿った縦断面図である。
　図１３は、第２の実施形態の変形例１に係る接合プリント配線板の、一方のプリント配線板の接合面の平面図である。
　図１４は、第２の実施形態の変形例２に係る接合プリント配線板の、一方のプリント配線板の接合面の平面図である。
　図１５は、第２の実施形態の変形例３に係る接合プリント配線板の、一方のプリント配線板の接合面の平面図である。
　図１６は、第２の実施形態の変形例４に係る接合プリント配線板の、一方のプリント配線板の接合面の平面図である。
　図１７は、第２の実施形態の変形例５に係る接合プリント配線板の、一方のプリント配線板の接合面の平面図である。
　図１８は、第２の実施形態の変形例６に係る接合プリント配線板の、一方のプリント配線板の接合面の平面図である。
　図１９は、第３の実施形態に係る接合プリント配線板の、信号線に沿った縦断面図である。 FIG. 1A is a perspective view of a bonded printed wiring board according to the first embodiment.
FIG. 1B is an enlarged view of the joint portion J in FIG. 1A.
FIG. 2A is a vertical cross-sectional view (first example) along a signal line of the bonded printed wiring board according to the first embodiment.
FIG. 2B is a vertical cross-sectional view (second example) along the signal line of the bonded printed wiring board according to the first embodiment.
FIG. 3 is a perspective view of the bonding surface of one printed wiring board of the bonded printed wiring board according to the first embodiment.
4A to 4D are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment.
5A and 5B are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment, following FIGS. 4A to 4D.
6A and B are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment, following FIGS. 5A and B.
7A and 7B are process cross-sectional views for explaining the method for manufacturing the bonded printed wiring board according to the first embodiment, following FIGS. 6A and 6B.
FIGS. 8A and 8B are diagrams showing simulation results of transmission characteristics of the bonded printed wiring board according to the first embodiment.
FIG. 9 is a plan view of the bonding surface of one printed wiring board of the bonded printed wiring board according to Modification 1 of the first embodiment.
FIG. 10 is a longitudinal sectional view along a signal line of a bonded printed wiring board according to a second modification of the first embodiment.
FIG. 11 is a perspective view of the bonding surface of one printed wiring board of the bonded printed wiring board according to the second embodiment.
FIG. 12 is a longitudinal cross-sectional view along the signal line of the bonded printed wiring board according to the second embodiment.
FIG. 13 is a plan view of the bonding surface of one printed wiring board of the bonded printed wiring board according to Modification 1 of the second embodiment.
FIG. 14 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to Modification 2 of the second embodiment.
FIG. 15 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to Modification 3 of the second embodiment.
FIG. 16 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to Modification 4 of the second embodiment.
FIG. 17 is a plan view of a bonded surface of one printed wiring board of a bonded printed wiring board according to modification 5 of the second embodiment.
FIG. 18 is a plan view of a bonding surface of one printed wiring board of a bonded printed wiring board according to modification 6 of the second embodiment.
FIG. 19 is a longitudinal cross-sectional view along a signal line of a bonded printed wiring board according to the third embodiment.
　以下、本開示に係る実施形態について、図面を参照しながら説明する。なお、各図においては、同等の機能を有する構成要素に、同一の符号を付している。また、各構成要素の縮尺比率は、図面上で認識可能な程度の大きさとするため、適宜に変えられており、現実の縮尺比率と一致しないことがある。 Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. Note that in each figure, the same reference numerals are given to components having the same function. Further, the scale ratio of each component is changed as appropriate in order to make the size recognizable on the drawing, and may not match the actual scale ratio.
（第１の実施形態）
　図１Ａ～図３を参照して、第１の実施形態に係る接合プリント配線板１について説明する。図１Ａは、第１の実施形態に係る接合プリント配線板１の斜視図である。図１Ｂは、図１Ａの接合部分Ｊを拡大した図である。図２Ａおよび図２Ｂは、接合プリント配線板１の信号線１１，２１に沿った縦断面図に関する、２つの例を示す。図３は、接合プリント配線板１のプリント配線板１０（２０）の接合面の斜視図である。 (First embodiment)
A bonded printed wiring board 1 according to a first embodiment will be described with reference to FIGS. 1A to 3. FIG. 1A is a perspective view of a bonded printed wiring board 1 according to the first embodiment. FIG. 1B is an enlarged view of the joint portion J in FIG. 1A. 2A and 2B show two examples of longitudinal cross-sectional views along signal lines 11 and 21 of bonded printed wiring board 1. FIG. FIG. 3 is a perspective view of the bonding surface of printed wiring board 10 (20) of bonded printed wiring board 1. FIG.
　図１Ａに示すように、接合プリント配線板１は、互いに接合されたプリント配線板１０およびプリント配線板２０を備える。プリント配線板１０およびプリント配線板２０は、それぞれ、第１のプリント配線板および第２のプリント配線板の一例である。本実施形態において、プリント配線板１０，２０は、フレキシブルプリント配線板である。なお、プリント配線板１０とプリント配線板２０との少なくともいずれか一方が、リジッドプリント配線板であってもよい。 As shown in FIG. 1A, the bonded printed wiring board 1 includes a printed wiring board 10 and a printed wiring board 20 that are bonded to each other. Printed wiring board 10 and printed wiring board 20 are examples of a first printed wiring board and a second printed wiring board, respectively. In this embodiment, printed wiring boards 10 and 20 are flexible printed wiring boards. Note that at least one of printed wiring board 10 and printed wiring board 20 may be a rigid printed wiring board.
　接合プリント配線板１は、たとえば、スマートフォンなどの情報通信機器において、アンテナモジュールとメイン基板とを電気的に接続するために使用される。この場合、プリント配線板１０は、たとえば、アンテナモジュール（図示せず）に接続される。アンテナモジュールは、アンテナと、アンテナが実装されたアンテナ基板とを含む。プリント配線板２０は、たとえば、メイン基板（図示せず）に接続される。このメイン基板には、たとえば、アンテナが受信した信号に基づき情報処理を行う半導体チップが実装されている。 The bonded printed wiring board 1 is used, for example, to electrically connect an antenna module and a main board in an information communication device such as a smartphone. In this case, printed wiring board 10 is connected to, for example, an antenna module (not shown). The antenna module includes an antenna and an antenna substrate on which the antenna is mounted. Printed wiring board 20 is connected to, for example, a main board (not shown). For example, a semiconductor chip that processes information based on a signal received by an antenna is mounted on this main board.
　なお、プリント配線板１０自体がアンテナ基板であってもよい。また、プリント配線板２０自体が、半導体チップが実装されたメイン基板であってもよい。 Note that the printed wiring board 10 itself may be an antenna board. Further, the printed wiring board 20 itself may be a main board on which a semiconductor chip is mounted.
　図１Ａに示すように、プリント配線板１０には、第１の信号線の一例である信号線１１が設けられている。プリント配線板２０には、第２の信号線の一例である信号線２１が設けられている。また、プリント配線板１０には、信号線１１に平行な少なくとも１対のグランド線４１が設けられている。このグランド線４１は、グランドビア４２を介して、プリント配線板１０の外層のグランド層（第１のグランド層の一例。後述のグランド層１７，１７Ａ）に、電気的に接続されている。 As shown in FIG. 1A, the printed wiring board 10 is provided with a signal line 11, which is an example of a first signal line. The printed wiring board 20 is provided with a signal line 21 that is an example of a second signal line. Furthermore, the printed wiring board 10 is provided with at least one pair of ground lines 41 parallel to the signal line 11 . This ground line 41 is electrically connected to an outer ground layer (an example of a first ground layer; ground layers 17 and 17A, which will be described later) of the printed wiring board 10 via a ground via 42.
　同様に、プリント配線板２０には、信号線２１に平行な少なくとも１対のグランド線５１が設けられている。このグランド線５１は、グランドビア５２を介して、プリント配線板２０の外層のグランド層（第２のグランド層の一例。後述のグランド層２７および／またはグランド層２７Ａ）に、電気的に接続されている。 Similarly, the printed wiring board 20 is provided with at least one pair of ground lines 51 parallel to the signal line 21. This ground line 51 is electrically connected to an outer ground layer (an example of a second ground layer; a ground layer 27 and/or ground layer 27A, which will be described later) of the printed wiring board 20 via a ground via 52. ing.
　なお、図１Ａに示す信号線１１，２１およびグランド線４１，５１の配置は、一例であり、他の配置であってもよい。たとえば、信号線１１は、プリント配線板１０の長手方向と斜交する方向に延在し、第１の層間接続部の一例である層間接続部１２に接続されていてもよい。また、信号線１１は、直線に限られず、途中で折れ曲がっていてもよい。信号線２１についても同様である。これらのことは、以降の実施形態および変形例においても同様である。 Note that the arrangement of the signal lines 11, 21 and the ground lines 41, 51 shown in FIG. 1A is an example, and other arrangements may be used. For example, the signal line 11 may extend in a direction oblique to the longitudinal direction of the printed wiring board 10, and may be connected to an interlayer connection portion 12, which is an example of a first interlayer connection portion. Further, the signal line 11 is not limited to a straight line, and may be bent in the middle. The same applies to the signal line 21. The same holds true for the subsequent embodiments and modifications.
　図１Ａに示すように、プリント配線板１０の信号線１１とプリント配線板２０の信号線２１とは、接合部分Ｊにおいて電気的に接続されている。接合部分Ｊにおける信号線の接続について、図１Ｂを参照して詳しく説明する。図１Ｂは、接合部分Ｊを拡大した図である。 As shown in FIG. 1A, the signal line 11 of the printed wiring board 10 and the signal line 21 of the printed wiring board 20 are electrically connected at a joint J. The connection of the signal lines at the joint portion J will be described in detail with reference to FIG. 1B. FIG. 1B is an enlarged view of the joint portion J.
　図１Ｂに示すように、信号線１１は、層間接続部１２の一端（下端）に接続されている。層間接続部１２は、ランド１３を有する。ランド延長部１４は、第１のランド延長部の一例であり、層間接続部１２の他端（上端）から延出する。換言すれば、ランド延長部１４は、ランド１３から延出する。 As shown in FIG. 1B, the signal line 11 is connected to one end (lower end) of the interlayer connection section 12. The interlayer connection portion 12 has a land 13. The land extension part 14 is an example of the first land extension part, and extends from the other end (upper end) of the interlayer connection part 12. In other words, the land extension 14 extends from the land 13.
　同様に、信号線２１は、第２の層間接続部の一例である層間接続部２２の一端（上端）に接続されている。層間接続部２２は、ランド２３を有する。ランド延長部２４は、第２のランド延長部の一例であり、層間接続部２２の他端（下端）から延出する。換言すれば、ランド延長部２４は、ランド２３から延出する。 Similarly, the signal line 21 is connected to one end (upper end) of an interlayer connection section 22, which is an example of a second interlayer connection section. The interlayer connection portion 22 has a land 23. The land extension part 24 is an example of a second land extension part, and extends from the other end (lower end) of the interlayer connection part 22. In other words, the land extension 24 extends from the land 23.
　ランド延長部１４は、プリント配線板１０の接合面（ランド１３ならびに後述するグランド層１７および対向領域Ａ１を含む面）に設けられている。同様に、ランド延長部２４は、プリント配線板２０の接合面（ランド２３ならびに後述するグランド層２７および対向領域Ａ２を含む面）に設けられている。 The land extension portion 14 is provided on the bonding surface of the printed wiring board 10 (the surface including the land 13 and the ground layer 17 and opposing region A1, which will be described later). Similarly, the land extension portion 24 is provided on the bonding surface of the printed wiring board 20 (the surface including the land 23, a ground layer 27 described later, and a facing area A2).
　なお、ランド延長部１４，２４は、接合面上でランド１３，２３から、信号線１１，２１の延在方向とは別の方向に延出してもよい。また、ランド延長部１４，２４は、複数の方向に延出してもよい。あるいは、ランド延長部１４，２４は、ランド１３，２３の径を部分的に大きくすることで形成されていてもよい。これらのことは、以降の実施形態、変形例においても同様である。 Note that the land extensions 14 and 24 may extend from the lands 13 and 23 on the joint surface in a direction different from the direction in which the signal lines 11 and 21 extend. Additionally, the land extensions 14, 24 may extend in multiple directions. Alternatively, the land extensions 14, 24 may be formed by partially enlarging the diameters of the lands 13, 23. The same holds true for the subsequent embodiments and modifications.
　層間接続部１２，２２は、本実施形態では、有底ビアホールの内壁をめっきすることによって形成される、めっきビアである。なお、層間接続部１２，２２の構成は、特に限定されない。層間接続部１２，２２は、フィルドビア、あるいはスルーホールなどであってもよい。 In this embodiment, the interlayer connections 12 and 22 are plated vias formed by plating the inner walls of bottomed via holes. Note that the configurations of the interlayer connections 12 and 22 are not particularly limited. The interlayer connections 12 and 22 may be filled vias, through holes, or the like.
　ランド延長部１４およびランド延長部２４は、接合プリント配線板１の厚さ方向に見て少なくとも一部が互いに重なるように配置されている。本実施形態では、図１Ｂに示すように、ランド延長部１４およびランド延長部２４は、先端部分が互いに重なるように配置されている。なお、ランド延長部１４およびランド延長部２４は、全体的に互いに重なるように配置されてもよい。 The land extension portion 14 and the land extension portion 24 are arranged so that at least a portion thereof overlaps each other when viewed in the thickness direction of the bonded printed wiring board 1. In this embodiment, as shown in FIG. 1B, the land extension part 14 and the land extension part 24 are arranged so that their tip portions overlap each other. Note that the land extension portion 14 and the land extension portion 24 may be arranged so as to overlap each other as a whole.
　後述するように、本実施形態および第２の実施形態では、ランド延長部１４とランド延長部２４とは、導電材料により電気的に接続されている。したがって、信号線１１は、ランド延長部１４およびランド延長部２４を介して、信号線２１に電気的に接続されている。 As described later, in the present embodiment and the second embodiment, the land extension portion 14 and the land extension portion 24 are electrically connected by a conductive material. Therefore, the signal line 11 is electrically connected to the signal line 21 via the land extension 14 and the land extension 24.
　次に、本実施形態に係る接合プリント配線板１の断面構造について説明する。図２Ａおよび図２Ｂは、接合プリント配線板１の信号線１１，２１に沿った縦断面図の２つの例を示している。図２Ａの例では、導電材料３０として異方性導電フィルム（ＡＣＦ）が用いられ、プリント配線板１０とプリント配線板２０とが接合されている。図２Ｂの例では、導電ペースト３０ａにより信号線１１，２１間が電気的に接続され、導電ペースト３０ａ間は非導電材料３１により絶縁されている。 Next, the cross-sectional structure of the bonded printed wiring board 1 according to this embodiment will be explained. 2A and 2B show two examples of longitudinal cross-sectional views along signal lines 11 and 21 of bonded printed wiring board 1. FIG. In the example of FIG. 2A, an anisotropic conductive film (ACF) is used as the conductive material 30, and the printed wiring board 10 and the printed wiring board 20 are bonded. In the example of FIG. 2B, the signal lines 11 and 21 are electrically connected by a conductive paste 30a, and the conductive paste 30a is insulated by a non-conductive material 31.
　図２Ａおよび図２Ｂに示すように、本実施形態においては、プリント配線板１０では、絶縁基材１８Ａと絶縁基材１８Ｂとが、接着剤層１９を介して貼り合わされている。グランド層１７が、プリント配線板１０の接合面、すなわち、絶縁基材１８Ａの上面に設けられている。また、グランド層１７は、層間接続部１２を囲むように形成されている。さらに、グランド層１７Ａが、絶縁基材１８Ｂの下面に設けられている。 As shown in FIGS. 2A and 2B, in the present embodiment, insulating base material 18A and insulating base material 18B are bonded to each other via adhesive layer 19 in printed wiring board 10. A ground layer 17 is provided on the bonding surface of the printed wiring board 10, that is, on the upper surface of the insulating base material 18A. Furthermore, the ground layer 17 is formed to surround the interlayer connection portion 12 . Further, a ground layer 17A is provided on the lower surface of the insulating base material 18B.
　信号線１１は、絶縁基材１８Ａの下面に設けられている。信号線１１の端部は、絶縁基材１８Ａを貫通するように設けられた層間接続部１２の一端に接続されている。 The signal line 11 is provided on the lower surface of the insulating base material 18A. An end of the signal line 11 is connected to one end of an interlayer connection portion 12 provided so as to penetrate the insulating base material 18A.
　層間接続部１２の他端から延出するランド延長部１４は、絶縁基材１８Ａの上面に設けられている。より詳しくは、ランド延長部１４は、層間接続部１２が有するランド１３から延出している。本実施形態では、ランド延長部１４は、信号線１１が延びる方向に沿って、層間接続部１２から延出している。 A land extension portion 14 extending from the other end of the interlayer connection portion 12 is provided on the upper surface of the insulating base material 18A. More specifically, the land extension portion 14 extends from the land 13 that the interlayer connection portion 12 has. In this embodiment, the land extension portion 14 extends from the interlayer connection portion 12 along the direction in which the signal line 11 extends.
　同様に、プリント配線板２０では、絶縁基材２８Ａと絶縁基材２８Ｂとが、接着剤層２９を介して貼り合わされている。グランド層２７が、グランド層１７と対向するように設けられている。より詳しくは、グランド層２７が、プリント配線板２０の接合面、すなわち、絶縁基材２８Ａの下面に設けられている。また、グランド層２７は、層間接続部２２を囲むように形成されている。さらに、グランド層２７Ａが、絶縁基材２８Ｂの上面に設けられている。 Similarly, in the printed wiring board 20, an insulating base material 28A and an insulating base material 28B are bonded together with an adhesive layer 29 interposed therebetween. A ground layer 27 is provided to face the ground layer 17. More specifically, the ground layer 27 is provided on the bonding surface of the printed wiring board 20, that is, on the lower surface of the insulating base material 28A. Furthermore, the ground layer 27 is formed so as to surround the interlayer connection portion 22 . Further, a ground layer 27A is provided on the upper surface of the insulating base material 28B.
　信号線２１は、絶縁基材２８Ａの上面に設けられている。信号線２１の端部は、絶縁基材２８Ａを貫通するように設けられた層間接続部２２の一端に接続されている。 The signal line 21 is provided on the upper surface of the insulating base material 28A. An end of the signal line 21 is connected to one end of an interlayer connection part 22 provided so as to penetrate the insulating base material 28A.
　層間接続部２２の他端から延出するランド延長部２４は、絶縁基材２８Ａの下面に設けられている。より詳しくは、ランド延長部２４は、層間接続部２２が有するランド２３から延出している。本実施形態では、ランド延長部２４は、信号線２１が延びる方向に沿って、層間接続部２２から延出している。 A land extension portion 24 extending from the other end of the interlayer connection portion 22 is provided on the lower surface of the insulating base material 28A. More specifically, the land extension portion 24 extends from the land 23 that the interlayer connection portion 22 has. In this embodiment, the land extension portion 24 extends from the interlayer connection portion 22 along the direction in which the signal line 21 extends.
　絶縁基材１８Ａ，１８Ｂ，２８Ａ，２８Ｂの材料は、本実施形態では、液晶ポリマー（ＬＣＰ）である。なお、絶縁基材１８Ａ，１８Ｂ，２８Ａ，２８Ｂの材料は、ＬＣＰに限られず、たとえば、ＰＦＡ（テトラフルオロエチレン－パーフルオロアルキルビニルエーテル共重合体）およびＰＴＦＥ（ポリテトラフルオロエチレン）などのフッ素系材料、または、変性ポリイミド（ＭＰＩ）およびポリイミド（ＰＩ）などのポリイミド系材料であってもよい。また、絶縁基材１８Ａ，１８Ｂ，２８Ａ，２８Ｂの材料は、それぞれ独立に、任意に選択可能である。 In this embodiment, the material of the insulating base materials 18A, 18B, 28A, and 28B is liquid crystal polymer (LCP). Note that the material of the insulating base materials 18A, 18B, 28A, and 28B is not limited to LCP, and may include, for example, fluorine-based materials such as PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer) and PTFE (polytetrafluoroethylene). Alternatively, it may be a polyimide-based material such as modified polyimide (MPI) and polyimide (PI). Moreover, the materials of the insulating base materials 18A, 18B, 28A, and 28B can be independently selected arbitrarily.
　高周波信号の伝送特性を確保するために、絶縁基材の材料として、低誘電率かつ低誘電正接の材料を適用することが望ましい。接着剤層１９，２９についても、低誘電率かつ低誘電正接の材料を適用することが望ましい。 In order to ensure the transmission characteristics of high-frequency signals, it is desirable to use a material with a low dielectric constant and a low dielectric loss tangent as the material of the insulating base material. It is desirable to use a material with a low dielectric constant and a low dielectric loss tangent for the adhesive layers 19 and 29 as well.
　図２Ａおよび図２Ｂに示すように、ランド延長部１４とランド延長部２４とは、導電材料３０を介して電気的に接続されている。導電材料３０は、本実施形態では、異方性導電フィルム（ＡＣＦ）または異方性導電ペースト（ＡＣＰ）である。 As shown in FIGS. 2A and 2B, the land extension 14 and the land extension 24 are electrically connected via a conductive material 30. In this embodiment, the conductive material 30 is an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).
　なお、導電材料３０は、クリーム半田等の半田、または、導電ペーストであってもよい。この場合は、図２Ｂに示すように、非導電材料３１により、導電ペースト３０ａ間の絶縁を図るようにしてもよい。導電ペースト３０ａの代わりに、半田を用いてもよい。非導電材料３１としては、たとえば、非導電性フィルム（ＮＣＦ）、非導電性ペースト（ＮＣＰ）または接着剤（微粘着剤を含む。）が用いられる。以降の実施形態、変形例についても同様である。 Note that the conductive material 30 may be solder such as cream solder, or a conductive paste. In this case, as shown in FIG. 2B, insulation between the conductive pastes 30a may be achieved using a non-conductive material 31. Solder may be used instead of the conductive paste 30a. As the non-conductive material 31, for example, a non-conductive film (NCF), a non-conductive paste (NCP), or an adhesive (including a slight adhesive) is used. The same applies to subsequent embodiments and modifications.
　図２Ａおよび図２Ｂに示すように、プリント配線板１０のうち、プリント配線板２０の層間接続部２２と対向する領域（以下、「対向領域Ａ１」という。）には、グランド層１７が設けられていない。このため、プリント配線板２０の層間接続部２２は、プリント配線板１０のグランド層１７と対向しない。 As shown in FIGS. 2A and 2B, a ground layer 17 is provided in a region of the printed wiring board 10 that faces the interlayer connection portion 22 of the printed wiring board 20 (hereinafter referred to as "opposing region A1"). Not yet. Therefore, the interlayer connection portion 22 of the printed wiring board 20 does not face the ground layer 17 of the printed wiring board 10.
　同様に、プリント配線板２０のうち、プリント配線板１０の層間接続部１２と対向する領域（以下、「対向領域Ａ２」という。）には、グランド層２７が設けられていない。このため、プリント配線板１０の層間接続部１２は、プリント配線板２０のグランド層２７と対向しない。 Similarly, the ground layer 27 is not provided in the area of the printed wiring board 20 that faces the interlayer connection portion 12 of the printed wiring board 10 (hereinafter referred to as "opposing area A2"). Therefore, the interlayer connection portion 12 of the printed wiring board 10 does not face the ground layer 27 of the printed wiring board 20.
　このように、本実施形態では、層間接続部の対向領域にグランド層が設けられておらず、層間接続部とグランド層とが接近していない。このため、プリント配線板の容量成分の増加により特性インピーダンスが低下することを、回避できる。 As described above, in this embodiment, the ground layer is not provided in the area facing the interlayer connection portion, and the interlayer connection portion and the ground layer are not close to each other. Therefore, it is possible to avoid a decrease in characteristic impedance due to an increase in the capacitance component of the printed wiring board.
　図１Ｂ、図２Ａおよび図２Ｂに示すように、本実施形態では、プリント配線板１０の層間接続部１２と層間接続部２２とが互いに対向しないように配置されており、ランド延長部１４は、層間接続部２２の対向領域Ａ１まで延びていない。同様に、プリント配線板２０のランド延長部２４は、層間接続部２２の対向領域Ａ２まで延びていない。そして、図２Ａおよび図２Ｂに示すように、ランド延長部１４とランド延長部２４とは、互いに対向するように配置されていて、導電材料３０または導電ペースト３０ａによって互いに接続されている。 As shown in FIGS. 1B, 2A, and 2B, in this embodiment, the interlayer connection portion 12 and the interlayer connection portion 22 of the printed wiring board 10 are arranged so as not to face each other, and the land extension portion 14 is It does not extend to the opposing area A1 of the interlayer connection portion 22. Similarly, the land extension portion 24 of the printed wiring board 20 does not extend to the opposing area A2 of the interlayer connection portion 22. As shown in FIGS. 2A and 2B, the land extension 14 and the land extension 24 are arranged to face each other and are connected to each other by a conductive material 30 or a conductive paste 30a.
　次に、図３を参照して、ランド延長部について説明する。図３は、接合プリント配線板１のプリント配線板１０（２０）の接合面の斜視図である。前述したように、プリント配線板１０の接合面は、ランド１３、ランド延長部１４、グランド層１７および対向領域Ａ１を含む面のことである。 Next, the land extension will be explained with reference to FIG. 3. FIG. 3 is a perspective view of the bonding surface of printed wiring board 10 (20) of bonded printed wiring board 1. FIG. As described above, the bonding surface of the printed wiring board 10 is a surface including the lands 13, land extensions 14, ground layer 17, and opposing area A1.
　本実施形態では、ランド延長部１４（２４）は、平面視で矩形状であり、層間接続部１２（２２）から対向領域Ａ１（Ａ２）の前まで、一定の幅Ｌで延在している。なお、図３に示すように、ランド延長部１４（２４）の先端は、丸くなっていてもよい。ランド延長部１４（２４）の幅Ｌは、それぞれ、ランド延長部１４（２４）と信号線１１（２１）との間でインピーダンスが整合されるように調整されている。本実施形態では、プリント配線板１０（２０）の特性インピーダンス（５０Ω）と整合させるため、ランド延長部１４（２４）の幅Ｌを１９２μｍとしている。 In this embodiment, the land extension part 14 (24) has a rectangular shape in plan view, and extends with a constant width L from the interlayer connection part 12 (22) to the front of the opposing area A1 (A2). . Note that, as shown in FIG. 3, the tip of the land extension portion 14 (24) may be rounded. The width L of the land extension 14 (24) is adjusted so that the impedance is matched between the land extension 14 (24) and the signal line 11 (21). In this embodiment, the width L of the land extension portion 14 (24) is set to 192 μm in order to match the characteristic impedance (50Ω) of the printed wiring board 10 (20).
　なお、ランド延長部１４は、対向領域Ａ１まで延びていてもよい。同様に、ランド延長部２４は、対向領域Ａ２まで延びていてもよい。これにより、信号線１１および信号線２１間の導通を、より安定化することができる。 Note that the land extension portion 14 may extend to the opposing area A1. Similarly, the land extension portion 24 may extend to the opposing area A2. Thereby, the conduction between the signal line 11 and the signal line 21 can be made more stable.
　また、グランド層１７（２７）が除去された部分であって、ランド延長部１４（２４）が延在する部分の大きさおよび形状は、図３に示すような略円形状に限られない。たとえば、後述する図９に示すように、当該部分の形状は、ランド延長部１４（２４）の形状に合わせて、ランド延長部１４（２４）の両脇が狭窄したチャネル状でもよい。当該部分の形状は、その他、多角形状など、種々に変形されることが可能である。ランド延長部１４（２４）と、両側のグランド層１７（２７）との間隙の大きさおよび形状についても、種々に変形されることが可能である。 Further, the size and shape of the portion where the ground layer 17 (27) is removed and where the land extension portion 14 (24) extends is not limited to the approximately circular shape shown in FIG. 3. For example, as shown in FIG. 9, which will be described later, the shape of the portion may be a channel shape in which both sides of the land extension 14 (24) are narrowed in accordance with the shape of the land extension 14 (24). The shape of the portion can be variously modified, such as a polygonal shape. The size and shape of the gap between the land extension 14 (24) and the ground layers 17 (27) on both sides can also be modified in various ways.
　また、接合面は、複数の面を有してもよい。たとえば、接合面は、段差を介して接続された第１の面および第２の面を有し、第１の面にランド延長部１４（２４）が設けられ、第２の面にグランド層１７（２７）が設けられてもよい。あるいは、グランド層１７（２７）に段差が存在し、グランド層１７（２７）が第１の面および第２の面に跨がって設けられてもよい。これらのことは、以降の実施形態および変形例についても同様である。 Furthermore, the bonding surface may have multiple surfaces. For example, the bonding surface has a first surface and a second surface connected via a step, the first surface is provided with the land extension part 14 (24), and the second surface is provided with the ground layer 17. (27) may be provided. Alternatively, a step may exist in the ground layer 17 (27), and the ground layer 17 (27) may be provided spanning the first surface and the second surface. The same applies to the subsequent embodiments and modifications.
（接合プリント配線板の製造方法）
　次に、図４～図７を参照して、接合プリント配線板１を構成するプリント配線板１０（２０）の製造方法の一例を説明する。 (Method for manufacturing bonded printed wiring board)
Next, an example of a method for manufacturing printed wiring board 10 (20) constituting bonded printed wiring board 1 will be described with reference to FIGS. 4 to 7.
　図４Ａに示すように、絶縁基材１１０と、絶縁基材１１０の上面に設けられた金属箔１２０とを有する、片面金属箔張積層板１００を用意する。絶縁基材１１０は、液晶ポリマー（ＬＣＰ）などを含む絶縁フィルム（たとえば１００μｍ厚）である。金属箔１２０は、銅箔（たとえば１２μｍ厚）である。なお、絶縁基材１１０は、ＬＣＰに限定されず、たとえば、ＰＦＡおよびＰＴＦＥなどのフッ素系材料、または、ＭＰＩおよびＰＩなどのポリイミド系材料であってもよい。また、金属箔１２０は、銅以外の金属（銀、アルミニウムなど）を含む金属箔でもよい。 As shown in FIG. 4A, a single-sided metal foil-clad laminate 100 having an insulating base material 110 and a metal foil 120 provided on the top surface of the insulating base material 110 is prepared. The insulating base material 110 is an insulating film (for example, 100 μm thick) containing liquid crystal polymer (LCP) or the like. The metal foil 120 is a copper foil (for example, 12 μm thick). Note that the insulating base material 110 is not limited to LCP, and may be, for example, a fluorine-based material such as PFA and PTFE, or a polyimide-based material such as MPI and PI. Further, the metal foil 120 may be a metal foil containing a metal other than copper (silver, aluminum, etc.).
　次に、図４Ｂに示すように、絶縁基材１１０の下面に、接着剤層１３０を形成する。接着剤層１３０は、絶縁基材１１０の下面に接着剤を塗布することによって形成されてもよいし、接着剤フィルムを絶縁基材１１０に貼り合わせることによって形成されてもよい。あるいは、片面に接着剤層が形成された保護フィルムである接着剤層付保護フィルムを、絶縁基材１１０の下面にラミネートした後、保護フィルムを剥離することで、接着剤層１３０を形成してもよい。 Next, as shown in FIG. 4B, an adhesive layer 130 is formed on the lower surface of the insulating base material 110. The adhesive layer 130 may be formed by applying an adhesive to the lower surface of the insulating base material 110, or may be formed by bonding an adhesive film to the insulating base material 110. Alternatively, the adhesive layer 130 can be formed by laminating a protective film with an adhesive layer, which is a protective film with an adhesive layer formed on one side, on the lower surface of the insulating base material 110 and then peeling off the protective film. Good too.
　図４Ｃに示すように、絶縁基材２１０と、絶縁基材２１０の上面に設けられた金属箔２２０と、絶縁基材２１０の下面に設けられた金属箔２３０とを有する、両面金属箔張積層板２００を用意する。絶縁基材２１０は、液晶ポリマー（ＬＣＰ）などを含む絶縁フィルム（たとえば１００μｍ厚）である。金属箔２２０，２３０は、銅箔（たとえば１２μｍ厚）である。なお、絶縁基材２１０は、ＬＣＰに限定されず、たとえば、ＰＦＡおよびＰＴＦＥなどのフッ素系材料、または、ＭＰＩおよびＰＩなどのポリイミド系材料であってもよい。また、金属箔２２０，２３０は、銅以外の金属（銀、アルミニウムなど）を含む金属箔でもよい。 As shown in FIG. 4C, a double-sided metal foil clad laminate comprising an insulating base material 210, a metal foil 220 provided on the upper surface of the insulating base material 210, and a metal foil 230 provided on the lower surface of the insulating base material 210. A board 200 is prepared. The insulating base material 210 is an insulating film (for example, 100 μm thick) containing liquid crystal polymer (LCP) or the like. The metal foils 220 and 230 are copper foils (for example, 12 μm thick). Note that the insulating base material 210 is not limited to LCP, and may be, for example, a fluorine-based material such as PFA and PTFE, or a polyimide-based material such as MPI and PI. Moreover, the metal foils 220 and 230 may be metal foils containing metals other than copper (silver, aluminum, etc.).
　次に、図４Ｄに示すように、両面金属箔張積層板２００の金属箔２２０を、公知のフォトファブリケーション手法によりパターニングすることにより、信号線２２０ａと、グランド線２２０ｂとを形成する。信号線２２０ａは前述の信号線１１（２１）に相当し、グランド線２２０ｂは前述のグランド線４１（５１）に相当する。 Next, as shown in FIG. 4D, a signal line 220a and a ground line 220b are formed by patterning the metal foil 220 of the double-sided metal foil-clad laminate 200 using a known photofabrication method. The signal line 220a corresponds to the aforementioned signal line 11 (21), and the ground line 220b corresponds to the aforementioned ground line 41 (51).
　次に、図４Ｄを参照して説明した工程で得られた第１の配線板の上に、図４Ｂを参照して説明した工程で得られた第２の配線板を積層することにより、図５Ａに示す積層板を作製する。より詳しくは、信号線２２０ａおよびグランド線２２０ｂが接着剤層１３０に埋設されるように、第１の配線板と第２の配線板とを積層した後、真空プレス装置または真空ラミネータ装置を用いて加熱加圧を実施することで、積層板を作製する。加熱温度は、接着剤層１３０のフローティングポイントよりも高い温度（たとえば１７０℃）とされる。この加熱処理で接着剤層１３０が十分に硬化しない場合には、その後、さらに、オーブンでの硬化処理（オ
ーブンキュア）を行ってもよい。 Next, the second wiring board obtained in the process described with reference to FIG. 4B is laminated on the first wiring board obtained in the process described with reference to FIG. 4D. A laminate shown in 5A is produced. More specifically, after the first wiring board and the second wiring board are laminated so that the signal line 220a and the ground line 220b are embedded in the adhesive layer 130, they are laminated using a vacuum press device or a vacuum laminator device. A laminate is produced by applying heat and pressure. The heating temperature is higher than the floating point of the adhesive layer 130 (for example, 170° C.). If the adhesive layer 130 is not sufficiently cured by this heat treatment, then a curing treatment in an oven (oven cure) may be further performed.
　次に、図５Ｂに示すように、レーザ光を積層板の所定の領域に照射することによって、ビアホールＨ１，Ｈ２を形成する。より詳しくは、まず、金属箔１２０，２３０を加工することによって、ビアホールＨ１，Ｈ２を形成する位置に、開口を有するコンフォーマルマスクを形成しておく。そして、金属箔１２０，２３０の開口部分にレーザパルスを照射することによって、開口に露出した絶縁基材１１０，２１０（ビアホールＨ１の形成においては、さらに接着剤層１３０）を除去する。なお、コンフォーマルマスク法に代えて、ウィンドウ法あるいはダイレクトドリリング法などを用いて、ビアホールを形成してもよい。 Next, as shown in FIG. 5B, via holes H1 and H2 are formed by irradiating a predetermined region of the laminate with laser light. More specifically, first, by processing the metal foils 120 and 230, a conformal mask having openings is formed at the positions where the via holes H1 and H2 are to be formed. Then, by irradiating the opening portions of the metal foils 120, 230 with a laser pulse, the insulating base materials 110, 210 (and the adhesive layer 130 in forming the via hole H1) exposed in the openings are removed. Note that the via hole may be formed using a window method, a direct drilling method, or the like instead of the conformal mask method.
　レーザ光の照射には、たとえば、炭酸ガスレーザなどの赤外線レーザ、あるいは、ＵＶ－ＹＡＧレーザなどを用いる。なお、ビアホールＨ１，Ｈ２の径は、たとえば、１５０μｍである。その後、デスミア処理を行うことによって、接着剤層１３０と信号線２２０ａと間の境界における樹脂残渣、および、グランド線２２０ｂの裏面の処理膜（たとえばＮｉ／Ｃｒ膜）を除去する。このようにして、底面に信号線２２０ａが露出したビアホールＨ１、および、底面にグランド線２２０ｂが露出したビアホールＨ２を形成する。 For laser light irradiation, for example, an infrared laser such as a carbon dioxide laser, a UV-YAG laser, or the like is used. Note that the diameter of the via holes H1 and H2 is, for example, 150 μm. Thereafter, a desmear process is performed to remove resin residue at the boundary between the adhesive layer 130 and the signal line 220a and a treated film (eg, Ni/Cr film) on the back surface of the ground line 220b. In this way, a via hole H1 in which the signal line 220a is exposed on the bottom surface and a via hole H2 in which the ground line 220b is exposed in the bottom surface are formed.
　次に、図５Ｂに示すように、ドリルを用いて、積層板を厚さ方向に貫通する貫通孔Ｈ３を形成する。なお、ビアホールＨ１，Ｈ２および貫通孔Ｈ３の形成順序は、任意である。 Next, as shown in FIG. 5B, a drill is used to form a through hole H3 that penetrates the laminate in the thickness direction. Note that the order of forming the via holes H1, H2 and the through hole H3 is arbitrary.
　次に、図６Ａに示すように、ビアホールＨ１，Ｈ２および貫通孔Ｈ３の内壁に金属めっき層（たとえば銅めっき層）を形成することにより、ビア３１０，３２０およびめっきスルーホール３３０を形成する。 Next, as shown in FIG. 6A, vias 310 and 320 and a plated through hole 330 are formed by forming a metal plating layer (for example, a copper plating layer) on the inner walls of the via holes H1 and H2 and the through hole H3.
　本工程は、たとえば、積層板全体に銅めっき処理を施すパネルめっき法、または、積層板の所定の領域のみに銅めっき処理を施すボタンめっき（パターンめっき）法により行われる。後者の方法では、積層板にドライフィルムをラミネートした後、ドライフィルムを露光および現像することによって、ドライフィルムで被覆されていない領域にめっき処理を施す。図６Ａには、ボタンめっき処理によりビアホールＨ１，Ｈ２および貫通孔Ｈ３の領域のみにめっき層を形成した場合を示している。 This step is performed, for example, by a panel plating method in which copper plating is applied to the entire laminate, or a button plating (pattern plating) method in which copper plating is applied only to a predetermined region of the laminate. In the latter method, after laminating a dry film onto a laminate, the dry film is exposed and developed to perform plating on areas not covered with the dry film. FIG. 6A shows a case where a plating layer is formed only in the regions of via holes H1, H2 and through hole H3 by button plating.
　ビア３１０は、前述の層間接続部１２（２２）に相当する。また、ビア３２０およびめっきスルーホール３３０は、前述のグランドビア４２（５２）または後述のグランドビア１６に相当する。 The via 310 corresponds to the interlayer connection portion 12 (22) described above. Further, the via 320 and the plated through hole 330 correspond to the ground via 42 (52) described above or the ground via 16 described below.
　ビア３１０は、信号線２２０ａと金属箔１２０とを電気的に接続する。ビア３２０は、グランド線２２０ｂと金属箔２３０とを電気的に接続する。めっきスルーホール３３０は、グランド線２２０ｂ、金属箔１２０および金属箔２３０を電気的に接続する。 The via 310 electrically connects the signal line 220a and the metal foil 120. Via 320 electrically connects ground line 220b and metal foil 230. Plated through hole 330 electrically connects ground line 220b, metal foil 120, and metal foil 230.
　なお、図示しないが、前述のグランドビア４２（５２）または後述のグランドビア１６に相当するものとして、グランド線２２０ｂと金属箔１２０とを電気的に接続するビアを形成してもよい。 Note that although not shown, a via that electrically connects the ground line 220b and the metal foil 120 may be formed as something equivalent to the ground via 42 (52) described above or the ground via 16 described below.
　また、ビア３１０，３２０は、上記構成以外のビア、たとえば、フィルドビア、スタガードビア、あるいはスタックビアなどであってもよい。ビア３１０およびビア３２０の構成は、互いに異なってもよい。また、めっきスルーホール３３０に代えて、貫通孔Ｈ３に導電材料を充填することによって、グランド線２２０ｂ、金属箔１２０および金属箔２３０を電気的に接続する層間接続部を形成してもよい。 Furthermore, the vias 310 and 320 may be vias other than those having the above configuration, such as filled vias, staggered vias, or stacked vias. The configurations of vias 310 and vias 320 may be different from each other. Further, instead of the plated through hole 330, an interlayer connection portion that electrically connects the ground wire 220b, the metal foil 120, and the metal foil 230 may be formed by filling the through hole H3 with a conductive material.
　次に、図６Ｂに示すように、公知のフォトファブリケーション手法により、金属箔１２０をパターニングする。これにより、前述のランド１３（２３）、ランド延長部１４（２４）およびグランド層１７（２７）に相当するものが形成される。また、公知のフォトファブリケーション手法により、金属箔２３０をパターニングする。これにより、前述のグランド層１７Ａ（２７Ａ）に相当するものが形成される。なお、金属箔１２０のパターニングにより、第２の実施形態およびその変形例で説明する受けパッド部１５（２５）および接続部（ライン）１４Ａに相当するものも形成される。 Next, as shown in FIG. 6B, the metal foil 120 is patterned using a known photofabrication method. This forms what corresponds to the land 13 (23), land extension 14 (24), and ground layer 17 (27) described above. Further, the metal foil 230 is patterned using a known photofabrication method. As a result, a layer corresponding to the aforementioned ground layer 17A (27A) is formed. Note that, by patterning the metal foil 120, those corresponding to the receiving pad portion 15 (25) and the connecting portion (line) 14A described in the second embodiment and its modification are also formed.
　次に、図７Ａおよび図７Ｂに示すように、パターニングされた金属箔１２０を被覆するように、積層板の上面に、保護フィルム１４０をラミネートする。さらに、パターニングされた金属箔２３０を被覆するように、積層板の下面に、保護フィルム２４０をラミネートする。保護フィルム１４０，２４０は絶縁材料を含む。この絶縁材料としては、たとえば、ポリイミド系材料および感光性フォトレジストが適用可能である。 Next, as shown in FIGS. 7A and 7B, a protective film 140 is laminated on the top surface of the laminate so as to cover the patterned metal foil 120. Furthermore, a protective film 240 is laminated on the lower surface of the laminate so as to cover the patterned metal foil 230. The protective films 140, 240 include an insulating material. As this insulating material, for example, polyimide-based materials and photosensitive photoresists can be applied.
　次に、図７Ａおよび図７Ｂに示すように、保護フィルム１４０に開口４１０，４３０を形成するとともに、保護フィルム２４０に開口４２０を形成する。開口４１０，４２０には、グランド線２２０ｂに電気的に接続された金属箔が露出している。開口４３０には、信号線２２０ａに電気的に接続された金属箔が露出している。 Next, as shown in FIGS. 7A and 7B, openings 410 and 430 are formed in the protective film 140, and an opening 420 is formed in the protective film 240. Metal foil electrically connected to the ground line 220b is exposed in the openings 410 and 420. A metal foil electrically connected to the signal line 220a is exposed in the opening 430.
　最後に、図７Ａおよび図７Ｂに示すように、開口４１０，４２０，４３０に露出した金属箔に金めっき処理を施することによって、めっき層４１０Ａ，４２０Ａ，４３０Ａを形成する。めっき処理を施すことによって、露出した金属箔を、電気的に接続可能な状態で保護することができる。なお、めっき層４１０Ａ，４２０Ａ，４３０Ａは、Ｎｉ／Ａｕめっきなどの合金めっきによって形成されてもよい。また、金めっき処理に代えて、水性プリフラックスなどによる表面処理を行ってもよい。 Finally, as shown in FIGS. 7A and 7B, the metal foils exposed in the openings 410, 420, 430 are subjected to gold plating to form plating layers 410A, 420A, 430A. By plating, the exposed metal foil can be protected in a state where it can be electrically connected. Note that the plating layers 410A, 420A, and 430A may be formed by alloy plating such as Ni/Au plating. Furthermore, instead of gold plating, surface treatment using water-based preflux or the like may be performed.
　上記の工程を経て、図７Ａおよび図７Ｂに示すプリント配線板３００を得る。プリント配線板３００は、前述のプリント配線板１０（２０）に相当するものである。 Through the above steps, a printed wiring board 300 shown in FIGS. 7A and 7B is obtained. Printed wiring board 300 corresponds to printed wiring board 10 (20) described above.
　なお、前述の図２Ａおよび図２Ｂならびに後述の図１０、図１２および図１９に示す断面図では、保護フィルム１４０，２４０、開口４１０，４２０，４３０、およびめっき層４１０Ａ，４２０Ａ，４３０Ａに相当する構成は、図示されていない。 In addition, in the cross-sectional views shown in FIGS. 2A and 2B mentioned above and FIGS. The configuration is not shown.
　上記のようにして得られた２枚のプリント配線板３００を、ＡＣＦなどの導電材料を介して接合することで、接合プリント配線板１を得ることができる。詳しくは、一方のプリント配線板３００のめっき層４３０Ａと、他方のプリント配線板３００のめっき層４３０Ａとが、導電材料を介して電気的に接続されるように、２枚のプリント配線板３００を互いに接合する。これにより、各プリント配線板３００の信号線２２０ａ同士が２つのビア３１０を介して電気的に接続された、接合プリント配線板が得られる。 A bonded printed wiring board 1 can be obtained by bonding two printed wiring boards 300 obtained as described above via a conductive material such as ACF. Specifically, two printed wiring boards 300 are connected so that the plating layer 430A of one printed wiring board 300 and the plating layer 430A of the other printed wiring board 300 are electrically connected via a conductive material. join each other. As a result, a bonded printed wiring board in which the signal lines 220a of each printed wiring board 300 are electrically connected to each other via two vias 310 is obtained.
　なお、導電材料としてＡＣＦを使用する場合、まず、ＡＣＦの硬化温度以下で、ＡＣＦを、プリント配線板１０，２０の接合部分に塗布する（仮接着）。その後、硬化温度以上の温度に加熱することで、ＡＣＦを硬化させる。 Note that when ACF is used as the conductive material, first, ACF is applied to the joint portion of printed wiring boards 10 and 20 at a temperature below the curing temperature of ACF (temporary adhesion). Thereafter, the ACF is cured by heating to a temperature equal to or higher than the curing temperature.
　また、導電材料としてクリーム半田または導電ペーストを使用する場合、所定の接続位置に、クリーム半田または導電ペーストを、印刷等により配置する。その後、非導電性フィルム、非導電性ペーストまたは接着剤（微粘着剤でもよい。）などを塗布する。その後、プリント配線板１０，２０を位置合わせしてから互いに積層し、パルスヒータで接合部分を加温することによって、導電材料を溶融させる。 Furthermore, when using cream solder or conductive paste as the conductive material, the cream solder or conductive paste is placed at a predetermined connection position by printing or the like. After that, a non-conductive film, a non-conductive paste, an adhesive (a slight adhesive may be used), etc. are applied. Thereafter, the printed wiring boards 10 and 20 are aligned and stacked on each other, and the conductive material is melted by heating the bonded portion with a pulse heater.
　なお、上記の製造方法では、接着剤を用いて、絶縁基材１１０と絶縁基材２１０とを接着している。これに関し、接着剤を用いずに、絶縁基材１１０，２１０の融点以上の温度で加熱および加圧を実施することで、絶縁基材１１０と絶縁基材２１０とを接着してもよい。 Note that in the above manufacturing method, the insulating base material 110 and the insulating base material 210 are bonded together using an adhesive. In this regard, the insulating base material 110 and the insulating base material 210 may be bonded together by heating and pressurizing at a temperature equal to or higher than the melting point of the insulating base materials 110 and 210 without using an adhesive.
　以上説明したように、本実施形態に係る接合プリント配線板１において、層間接続部１２は、プリント配線板２０のグランド層２７と対向せず、かつ、層間接続部２２は、プリント配線板１０のグランド層１７と対向しない。このため、プリント配線板の容量成分の増加により接合プリント配線板の特性インピーダンスが低下することを、回避できる。 As explained above, in the bonded printed wiring board 1 according to the present embodiment, the interlayer connection part 12 does not face the ground layer 27 of the printed wiring board 20, and the interlayer connection part 22 does not face the ground layer 27 of the printed wiring board 10. It does not face the ground layer 17. Therefore, it is possible to avoid a decrease in the characteristic impedance of the bonded printed wiring board due to an increase in the capacitance component of the printed wiring board.
　ここで、本実施形態に係る接合プリント配線板１の特性について、シミュレーションソフトウェアＨＦＳＳ（Ａｎｓｙｓ社）を用いて評価した結果を示す。図８Ａは、時間領域反射率測定法（Ｔｉｍｅ　Ｄｏｍａｉｎ　Ｒｅｆｌｅｃｔｏｍｅｔｒｙ：ＴＤＲ）による特性インピーダンスのシミュレーション結果を示している。図８Ｂは、接合プリント配線板１の電圧定在波比（Ｖｏｌｔａｇｅ　Ｓｔａｎｄｉｎｇ　Ｗａｖｅ　Ｒａｔｉｏ：ＶＳＷＲ）の周波数依存性のシミュレーション結果を示している。 Here, the results of evaluating the characteristics of the bonded printed wiring board 1 according to the present embodiment using simulation software HFSS (manufactured by Ansys) will be shown. FIG. 8A shows simulation results of characteristic impedance by time domain reflectometry (TDR). FIG. 8B shows a simulation result of the frequency dependence of the voltage standing wave ratio (VSWR) of the bonded printed wiring board 1.
　図８Ａに示すように、接合部分Ｊ（図中矢印部分）において、特性インピーダンスが低下していない。また、図８Ｂに示すように、接合プリント配線板１の電圧定在波比は、０～３０ＧＨｚの周波数全域を通じて、十分に低い値である。これにより、特性インピーダンスが整合されているとわかる。このように、伝送特性を表すＴＤＲおよびＶＳＷＲの評価結果から、本実施形態に係る接合プリント配線板１は、接合部分Ｊにおいて、特性インピーダンスが低下せず、接合部分における信号の反射を十分に抑制できる。 As shown in FIG. 8A, the characteristic impedance does not decrease in the joint portion J (arrow portion in the figure). Further, as shown in FIG. 8B, the voltage standing wave ratio of the bonded printed wiring board 1 is a sufficiently low value throughout the frequency range of 0 to 30 GHz. This shows that the characteristic impedances are matched. As described above, from the evaluation results of TDR and VSWR, which represent transmission characteristics, in the bonded printed wiring board 1 according to the present embodiment, the characteristic impedance does not decrease at the bonded portion J, and signal reflection at the bonded portion is sufficiently suppressed. can.
　さらに、本実施形態に係る接合プリント配線板１では、プリント配線板１０，２０の信号線１１，２１が、ランド延長部１４，２４を介して電気的に互いに接続される。このため、プリント配線板１０の信号線１１とプリント配線板２０の信号線２１とを、安定的に接続することができる。また、ボードツーボードコネクタを用いずに、プリント配線板１０とプリント配線板２０とが、直接に接合されている。このため、高周波信号の微小なスタブによる共振が発生しにくいので、伝送特性の低下を抑制することができる。 Further, in the bonded printed wiring board 1 according to the present embodiment, the signal lines 11 and 21 of the printed wiring boards 10 and 20 are electrically connected to each other via the land extensions 14 and 24. Therefore, the signal line 11 of the printed wiring board 10 and the signal line 21 of the printed wiring board 20 can be stably connected. Further, printed wiring board 10 and printed wiring board 20 are directly connected without using a board-to-board connector. Therefore, resonance due to minute stubs of high-frequency signals is less likely to occur, so deterioration of transmission characteristics can be suppressed.
　さらに、本実施形態に係る接合プリント配線板１では、ボードツーボードコネクタなどのコネクタを介してプリント配線板同士を接合する場合と比べて、接合部分の厚みが抑えられるので、省スペースの構造を実現することができる。 Furthermore, in the bonded printed wiring board 1 according to the present embodiment, the thickness of the bonded portion can be reduced compared to the case where printed wiring boards are bonded together via a connector such as a board-to-board connector, so a space-saving structure can be realized. It can be realized.
　したがって、本実施形態によれば、接合部分における信号の反射を十分に抑制可能であり、安定且つ省スペースの接続構造を有する、接合プリント配線板を提供することができる。 Therefore, according to the present embodiment, it is possible to provide a bonded printed wiring board that can sufficiently suppress signal reflection at the bonded portion and has a stable and space-saving connection structure.
　また、本実施形態の製造方法によれば、プリント配線板１０，２０の信号線１１，２１を、ランド延長部１４，２４を介して電気的に互いに接続している。これにより、層間接続部１２，２２の表面のディンプルに導電材料３０が充填されてプリント配線板１０，２０間の導通が不安定になることを、回避できる。その結果、接合プリント配線板の製造性および歩留まりを改善することができる。 Furthermore, according to the manufacturing method of this embodiment, the signal lines 11 and 21 of the printed wiring boards 10 and 20 are electrically connected to each other via the land extensions 14 and 24. This can prevent the dimples on the surfaces of the interlayer connections 12 and 22 from being filled with the conductive material 30 and making the conduction between the printed wiring boards 10 and 20 unstable. As a result, the manufacturability and yield of bonded printed wiring boards can be improved.
　なお、上記の説明では、プリント配線板１０，２０は３層構造であり、信号線はストリップラインの高速伝送線路として構成されている。これに関し、層数および信号線の構成は、上記の層数および構成に限られない。たとえば、信号線は、マイクロストリップライン構造のように、絶縁基材の表面に形成された配線であってもよい。この場合、マイクロストリップラインは、マイクロストリップアンテナとして構成されてもよいし、伝送路として構成されてもよい。 In the above description, the printed wiring boards 10 and 20 have a three-layer structure, and the signal lines are configured as stripline high-speed transmission lines. In this regard, the number of layers and the configuration of signal lines are not limited to the number of layers and configuration described above. For example, the signal line may be a wiring formed on the surface of an insulating base material, such as a microstrip line structure. In this case, the microstrip line may be configured as a microstrip antenna or as a transmission path.
　また、上記の説明では、接合プリント配線板１は、２枚のプリント配線板１０，２０を接合したものである。これに関し、接合プリント配線板１は、３枚以上のプリント配線板を順次接合した、複数の接合部分を有するものであってもよい。 Furthermore, in the above description, the bonded printed wiring board 1 is one in which two printed wiring boards 10 and 20 are bonded together. In this regard, the bonded printed wiring board 1 may have a plurality of bonded parts in which three or more printed wiring boards are sequentially bonded.
　また、複数のプリント配線板は、長手方向が平行になるように互いに接合される場合に限られず、長手方向が直交もしくは斜交するように互いに接合されてもよい。 Furthermore, the plurality of printed wiring boards are not limited to being joined to each other so that their longitudinal directions are parallel, but may be joined to each other so that their longitudinal directions are orthogonal or oblique.
　次に、第１の実施形態に係る２つの変型例について説明する。いずれの変型例によっても、上記第１の実施形態の効果を得ることができる。 Next, two modified examples of the first embodiment will be described. Any modification can provide the effects of the first embodiment.
（第１の実施形態の変形例１）
　図９を参照して、第１の実施形態の変形例１について説明する。図９は、本変形例に係る接合プリント配線板１の、プリント配線板１０の接合面の平面図である。 (Modification 1 of the first embodiment)
Modification 1 of the first embodiment will be described with reference to FIG. 9. FIG. 9 is a plan view of the bonded surface of the printed wiring board 10 of the bonded printed wiring board 1 according to this modification.
　本変型例は、プリント配線板１０，２０が複数の信号線を有する場合に関する。図９に示すように、プリント配線板１０は、各信号線１１について、層間接続部１２と、ランド１３と、層間接続部１２から延出するランド延長部１４と、を有する。換言すれば、ランド延長部１４は、ランド１３から延出する。各信号線１１の端部は、対応する層間接続部１２の一端に接続されている。各層間接続部１２は、ランド１３を有する。ランド延長部１４は、各層間接続部１２の他端から延出する。プリント配線板２０は、図示されていないが、プリント配線板１０と同様の構成を有する。これにより、プリント配線板１０の複数の信号線１１と、プリント配線板２０の複数の信号線２１とがそれぞれ電気的に接続された、接合プリント配線板を構成することができる。なお、層間接続部１２の数は、４つに限定されず、所要の信号線数に応じて増減されてよい。 This modification relates to a case where printed wiring boards 10 and 20 have a plurality of signal lines. As shown in FIG. 9, the printed wiring board 10 includes, for each signal line 11, an interlayer connection portion 12, a land 13, and a land extension portion 14 extending from the interlayer connection portion 12. In other words, the land extension 14 extends from the land 13. An end of each signal line 11 is connected to one end of a corresponding interlayer connection section 12 . Each interlayer connection portion 12 has a land 13. The land extension portion 14 extends from the other end of each interlayer connection portion 12 . Although not shown, printed wiring board 20 has a similar configuration to printed wiring board 10. Thereby, it is possible to configure a bonded printed wiring board in which the plurality of signal lines 11 of the printed wiring board 10 and the plurality of signal lines 21 of the printed wiring board 20 are respectively electrically connected. Note that the number of interlayer connections 12 is not limited to four, and may be increased or decreased depending on the required number of signal lines.
　複数の信号線１１は、図９に示すように、ランド延長部１４の延在方向（図中縦方向）に沿って、互いに平行に延在している。 As shown in FIG. 9, the plurality of signal lines 11 extend parallel to each other along the extending direction of the land extension 14 (vertical direction in the figure).
　上記のように、本変型例では、複数の信号線１１の各々は、対応するランド延長部１４、導電材料３０およびランド延長部２４を介して、複数の信号線２１のうちの対応する信号線２１に、電気的に接続されている。 As described above, in this modification, each of the plurality of signal lines 11 is connected to the corresponding signal line of the plurality of signal lines 21 via the corresponding land extension 14, conductive material 30, and land extension 24. It is electrically connected to 21.
　図９に示すように、本変形例においては、第１の実施形態の場合と同様に、プリント配線板１０の対向領域Ａ１に、グランド層１７が設けられていない。このため、プリント配線板２０の層間接続部２２は、プリント配線板１０のグランド層１７と対向しない。同様に、プリント配線板２０の対向領域Ａ２に、グランド層２７が設けられていない。このため、プリント配線板１０の層間接続部１２は、プリント配線板２０のグランド層２７と対向しない。このため、第１の実施形態と同様に、プリント配線板の容量成分の増加により特性インピーダンスが低下することを、回避できる。 As shown in FIG. 9, in this modification, the ground layer 17 is not provided in the facing area A1 of the printed wiring board 10, as in the first embodiment. Therefore, the interlayer connection portion 22 of the printed wiring board 20 does not face the ground layer 17 of the printed wiring board 10. Similarly, the ground layer 27 is not provided in the facing area A2 of the printed wiring board 20. Therefore, the interlayer connection portion 12 of the printed wiring board 10 does not face the ground layer 27 of the printed wiring board 20. Therefore, similarly to the first embodiment, it is possible to avoid a decrease in characteristic impedance due to an increase in the capacitance component of the printed wiring board.
　さらに、図９に示すように、本変形例においては、複数の層間接続部１２が、プリント配線板１０の幅方向（図中横方向）に沿って、千鳥状に配置されている。さらに、複数のランド延長部１４が、同じ向き（図中上向き）に延在している。このように、層間接続部１２の中心を結ぶ線がジグザグ状になるように、複数の層間接続部１２が配置されている。このため、本変型例によれば、接続部分の面積を低減することができる。 Further, as shown in FIG. 9, in this modification, a plurality of interlayer connecting portions 12 are arranged in a staggered manner along the width direction (horizontal direction in the figure) of the printed wiring board 10. Furthermore, the plurality of land extensions 14 extend in the same direction (upward in the figure). In this way, the plurality of interlayer connections 12 are arranged such that the line connecting the centers of the interlayer connections 12 forms a zigzag shape. Therefore, according to this modification, the area of the connecting portion can be reduced.
　なお、複数の層間接続部１２が、プリント配線板１０の長手方向（図中縦方向）に沿って、千鳥状に配置されてもよい。 Note that the plurality of interlayer connections 12 may be arranged in a staggered manner along the longitudinal direction (vertical direction in the figure) of the printed wiring board 10.
　また、図９では、複数のランド延長部１４が、同じ側（図中上側）に向かって延在している。これに関し、少なくとも一つのランド延長部１４が、反対側（図中下側）に向かって延在していてもよい。たとえば、隣り合う層間接続部１２のランド延長部１４が、交互に反対側に延在していてもよい。 Furthermore, in FIG. 9, the plurality of land extensions 14 extend toward the same side (upper side in the figure). In this regard, at least one land extension 14 may extend towards the opposite side (downward in the figure). For example, the land extensions 14 of adjacent interlayer connections 12 may alternately extend to opposite sides.
　また、図９に示すように、各層間接続部１２は、グランド層１７のセパレート部Ｓによって仕切られている。すなわち、各層間接続部１２は、グランド層１７に設けられた複数の開口部の各々に配置されている。セパレート部Ｓによって層間接続部１２を仕切ることによって、信号線間のクロストークを低減することができる。さらに、セパレート部Ｓにおいてグランド層１７とグランド層２７とが導電材料３０を介して互いに接続されることで、グランド層の余計なスタブを排除することができる。 Furthermore, as shown in FIG. 9, each interlayer connection section 12 is partitioned by a separate section S of the ground layer 17. That is, each interlayer connection part 12 is arranged in each of the plurality of openings provided in the ground layer 17. By partitioning the interlayer connection section 12 by the separate section S, crosstalk between signal lines can be reduced. Furthermore, since the ground layer 17 and the ground layer 27 are connected to each other via the conductive material 30 in the separate portion S, unnecessary stubs in the ground layer can be eliminated.
　なお、後述する図１５および図１８に示すように、セパレート部Ｓが設けられてなくてもよい。このことは、他の実施形態および変形例においても同様である。 Note that, as shown in FIGS. 15 and 18, which will be described later, the separate portion S may not be provided. This also applies to other embodiments and modifications.
　また、接合面は、複数の面を有してもよい。たとえば、接合面は、接合面が段差を介して接続された第１の面および第２の面を有し、第１の面に複数のランド延長部１４のうちのあるランド延長部１４が設けられ、第２の面に複数のランド延長部１４のうちの別のランド延長部１４が設けられてもよい。これらのことは、以降の実施形態および変形例についても同様である。 Furthermore, the bonding surface may have multiple surfaces. For example, the bonding surface has a first surface and a second surface connected to each other through a step, and the first surface is provided with a certain land extension 14 of the plurality of land extensions 14. Another one of the plurality of land extensions 14 may be provided on the second surface. The same applies to the subsequent embodiments and modifications.
　本変型例によれば、接合プリント配線板１が、複数の信号線１１，２１を含む。このため、４本の信号線が用いられる場合、および、２組の差動線路が用いられる場合などに対応可能な接合プリント配線板を提供することができる。 According to this modification, the bonded printed wiring board 1 includes a plurality of signal lines 11 and 21. Therefore, it is possible to provide a bonded printed wiring board that can be used when four signal lines are used, when two sets of differential lines are used, and the like.
　さらに、複数の層間接続部１２が千鳥状に配置されることで、接続部分の面積を削減することができる。 Furthermore, by arranging the plurality of interlayer connection parts 12 in a staggered manner, the area of the connection parts can be reduced.
（第１の実施形態の変形例２）
　図１０を参照して、第１の実施形態の変形例２に係る接合プリント配線板１について説明する。図１０は、本変形例に係る接合プリント配線板１の、信号線に沿った縦断面図である。 (Modification 2 of the first embodiment)
With reference to FIG. 10, a bonded printed wiring board 1 according to a second modification of the first embodiment will be described. FIG. 10 is a longitudinal cross-sectional view along the signal line of the bonded printed wiring board 1 according to this modification.
　図１０に示すように、本変形例においては、プリント配線板１０の層間接続部１２およびプリント配線板２０の層間接続部２２が、互いに対向するように配置されている。そして、プリント配線板１０のランド延長部１４およびプリント配線板２０のランド延長部２４も、互いに対向するように配置されている。 As shown in FIG. 10, in this modification, the interlayer connection portion 12 of the printed wiring board 10 and the interlayer connection portion 22 of the printed wiring board 20 are arranged to face each other. Land extensions 14 of printed wiring board 10 and land extensions 24 of printed wiring board 20 are also arranged to face each other.
　上記のように本変形例に係る接続構造においては、層間接続部同士が対向している。そして、信号線１１と信号線２１とは、ランド延長部１４，２４を介して電気的に接続されている。したがって、層間接続部１２，２２の表面のディンプルに導電材料３０が充填されて層間接続部１２，２２間の導通が不安定化したとしても、ランド延長部１４，２４により、信号線１１，２１間の導通を確保することができる。なお、ランド延長部１４，２４の面積は、信号線１１，２１間の導通を確保することができる範囲で、より小さいことが好ましい。 As described above, in the connection structure according to this modification, the interlayer connection parts face each other. The signal line 11 and the signal line 21 are electrically connected via land extensions 14 and 24. Therefore, even if the dimples on the surfaces of the interlayer connection parts 12 and 22 are filled with the conductive material 30 and the conduction between the interlayer connection parts 12 and 22 becomes unstable, the land extension parts 14 and 24 allow the signal lines 11 and 21 to It is possible to ensure continuity between the two. Note that the areas of the land extensions 14 and 24 are preferably as small as possible to ensure continuity between the signal lines 11 and 21.
（第２の実施形態）
　次に、図１１および図１２を参照して、第２の実施形態に係る接合プリント配線板１について説明する。図１１は、第２の実施形態に係る接合プリント配線板のプリント配線板１０（２０）の接合面の斜視図である。ここで、接合面は、グランド層１７（２７）、ランド１３（２３）および受けパッド部１５（２５）を含む面のことである。また、図１２は、第２の実施形態に係る接合プリント配線板の、信号線に沿った縦断面図である。 (Second embodiment)
Next, a bonded printed wiring board 1 according to a second embodiment will be described with reference to FIGS. 11 and 12. FIG. 11 is a perspective view of the bonding surface of printed wiring board 10 (20) of the bonded printed wiring board according to the second embodiment. Here, the bonding surface is a surface including the ground layer 17 (27), the land 13 (23), and the receiving pad portion 15 (25). Moreover, FIG. 12 is a longitudinal cross-sectional view along the signal line of the bonded printed wiring board according to the second embodiment.
　第１の実施形態と第２の実施形態との間の相違点の一つは、第２の実施形態では、ランド延長部が、対向領域を包含するように形成された受けパッド部を有する点である。すなわち、受けパッド部の面積は、対向する層間接続部の有するランドおよびビア部分の合計面積以上の面積である。以下、相違点を中心に、第２の実施形態について説明する。 One of the differences between the first embodiment and the second embodiment is that in the second embodiment, the land extension has a receiving pad portion formed to encompass the opposing area. It is. That is, the area of the receiving pad portion is greater than or equal to the total area of the land and via portions of the opposing interlayer connection portions. The second embodiment will be described below, focusing on the differences.
　図１１に示すように、プリント配線板１０の層間接続部１２のランド１３から延長するランド延長部として、受けパッド部１５が設けられている。この受けパッド部１５は、第１の受けパッド部の一例であり、対向領域Ａ１を包含するように形成されている。図１２に示すように、受けパッド部１５は、層間接続部２２と対向する。同様に、プリント配線板２０のランド延長部２４として、受けパッド部２５が設けられている。受けパッド部２５は、第２の受けパッド部の一例であり、対向領域Ａ２を包含するように形成されている。受けパッド部２５は、プリント配線板１０の層間接続部１２と対向する。 As shown in FIG. 11, a receiving pad portion 15 is provided as a land extension portion extending from the land 13 of the interlayer connection portion 12 of the printed wiring board 10. This receiving pad portion 15 is an example of a first receiving pad portion, and is formed so as to include the facing area A1. As shown in FIG. 12, the receiving pad portion 15 faces the interlayer connection portion 22. As shown in FIG. Similarly, a receiving pad portion 25 is provided as the land extension portion 24 of the printed wiring board 20. The receiving pad portion 25 is an example of a second receiving pad portion, and is formed to include the opposing area A2. The receiving pad portion 25 faces the interlayer connection portion 12 of the printed wiring board 10 .
　本実施形態では、受けパッド部１５，２５の直径は４００μｍであり、ランド２３，１３の直径は３５０μｍである。すなわち、受けパッド部の面積が、対向領域の面積より大きい。これにより、プリント配線板１０，２０の積層ずれが多少生じたとしても、プリント配線板１０，２０の厚さ方向に見て、ランド１３，２３は、受けパッド部２５，１５からそれぞれはみ出ない。このため、信号線間の導通を確保することができるとともに、インピーダンスの不整合およびばらつきを抑制することができる。 In this embodiment, the diameter of the receiving pad portions 15, 25 is 400 μm, and the diameter of the lands 23, 13 is 350 μm. That is, the area of the receiving pad portion is larger than the area of the opposing region. As a result, even if the printed wiring boards 10, 20 are slightly misaligned, the lands 13, 23 will not protrude from the receiving pad portions 25, 15, respectively, when viewed in the thickness direction of the printed wiring boards 10, 20. Therefore, conduction between the signal lines can be ensured, and impedance mismatch and variation can be suppressed.
　図１２に示すように、プリント配線板１０の受けパッド部１５は、導電材料３０を介して、プリント配線板２０の層間接続部２２およびランド２３と接合する。また、プリント配線板２０の受けパッド部２５は、導電材料３０を介して、プリント配線板１０の層間接続部１２およびランド１３と接合する。 As shown in FIG. 12, the receiving pad portion 15 of the printed wiring board 10 is bonded to the interlayer connection portion 22 and land 23 of the printed wiring board 20 via the conductive material 30. Further, the receiving pad portion 25 of the printed wiring board 20 is joined to the interlayer connection portion 12 and the land 13 of the printed wiring board 10 via the conductive material 30.
　上記接合構造によれば、プリント配線板１０，２０の各々について、層間接続部と受けパッド部とが、互いに対向するように配置される。このため、層間接続部１２，２２同士を突き合わせた接合構造に比べて、接合工程において、ＡＣＦなどの導電材料３０の流動性が低下する。このため、安定した導通を得ることができる。また、受けパッド部は、対向領域を包含するように、比較的大きな面積を有する。このため、第１の実施形態と比べて、接続信頼性を向上させることができる。 According to the above bonding structure, the interlayer connection portion and the receiving pad portion of each of printed wiring boards 10 and 20 are arranged to face each other. For this reason, the fluidity of the conductive material 30 such as ACF is reduced in the bonding process compared to a bonded structure in which the interlayer connecting portions 12 and 22 are butted against each other. Therefore, stable conduction can be obtained. Further, the receiving pad portion has a relatively large area so as to include the opposing region. Therefore, connection reliability can be improved compared to the first embodiment.
　次に、第２の実施形態に係る変型例１～５について説明する。いずれの変型例によっても、上記第２の実施形態の効果を得ることができる。 Next, Modifications 1 to 5 according to the second embodiment will be described. Any modification can provide the effects of the second embodiment.
（第２の実施形態の変形例１）
　図１３を参照して、第２の実施形態の変形例１に係る接合プリント配線板１について説明する。図１３は、本変形例に係る接合プリント配線板１のプリント配線板１０の接合面の平面図である。 (Modification 1 of the second embodiment)
With reference to FIG. 13, a bonded printed wiring board 1 according to a first modification of the second embodiment will be described. FIG. 13 is a plan view of the bonding surface of the printed wiring board 10 of the bonded printed wiring board 1 according to this modification.
　本変型例は、第１の実施形態の変形例１と同様に、プリント配線板１０，２０が複数の信号線を有する場合に関する。図１３に示すように、プリント配線板１０は、各信号線１１について、層間接続部１２と、ランド１３と、層間接続部１２（ランド１３）から延出する受けパッド部１５と、を有する。各信号線１１の端部は、対応する層間接続部１２に接続されている。各層間接続部１２は、ランド１３を有する。プリント配線板２０は、図示されていないが、プリント配線板１０と同様の構成を有する。これにより、プリント配線板１０の複数の信号線１１と、プリント配線板２０の複数の信号線２１とがそれぞれ電気的に接続された、接合プリント配線板が構成される。 This modification relates to a case where printed wiring boards 10 and 20 have a plurality of signal lines, similar to Modification 1 of the first embodiment. As shown in FIG. 13, the printed wiring board 10 includes, for each signal line 11, an interlayer connection portion 12, a land 13, and a receiving pad portion 15 extending from the interlayer connection portion 12 (land 13). An end of each signal line 11 is connected to a corresponding interlayer connection part 12. Each interlayer connection portion 12 has a land 13. Although not shown, printed wiring board 20 has a similar configuration to printed wiring board 10. Thereby, a bonded printed wiring board is constructed in which the plurality of signal lines 11 of the printed wiring board 10 and the plurality of signal lines 21 of the printed wiring board 20 are electrically connected to each other.
　複数の信号線１１は、図１３に示すように、層間接続部１２と受けパッド部１５とを結ぶ方向（図中縦方向）に沿って、互いに平行に延在している。なお、層間接続部１２の数は、４つに限定されず、所要の信号線数に応じて増減されてよい。 As shown in FIG. 13, the plurality of signal lines 11 extend parallel to each other along the direction (vertical direction in the figure) connecting the interlayer connection section 12 and the receiving pad section 15. Note that the number of interlayer connections 12 is not limited to four, and may be increased or decreased depending on the required number of signal lines.
　上記のように、本変型例の接合プリント配線板１では、プリント配線板１０の複数の信号線１１の各々は、対応する受けパッド部１５、導電材料３０およびプリント配線板２０の受けパッド部２５を介して、複数の信号線２１のうちの対応する信号線２１に、電気的に接続されている。 As described above, in the bonded printed wiring board 1 of this modification, each of the plurality of signal lines 11 of the printed wiring board 10 is connected to the corresponding receiving pad portion 15, the conductive material 30, and the receiving pad portion 25 of the printed wiring board 20. It is electrically connected to the corresponding signal line 21 of the plurality of signal lines 21 via.
　図１３に示すように、第１の実施形態の変形例１と同様に、複数の層間接続部１２は、プリント配線板１０の幅方向（図中横方向）に沿って、千鳥状に配置されている。すなわち、層間接続部１２の中心を結ぶ線がジグザグ状になるように、複数の層間接続部１２が配置されている。これにより、本変型例によれば、複数の層間接続部１２の幅を小さくすることができる。したがって、接続部分の面積を低減することができる。 As shown in FIG. 13, similar to the first modification of the first embodiment, the plurality of interlayer connections 12 are arranged in a staggered manner along the width direction (horizontal direction in the figure) of the printed wiring board 10. ing. That is, the plurality of interlayer connecting parts 12 are arranged so that the line connecting the centers of the interlayer connecting parts 12 forms a zigzag shape. Thereby, according to this modification, the widths of the plurality of interlayer connections 12 can be reduced. Therefore, the area of the connecting portion can be reduced.
　なお、複数の層間接続部１２が、プリント配線板１０の長手方向（図中縦方向）に沿って、千鳥状に配置されてもよい。 Note that the plurality of interlayer connections 12 may be arranged in a staggered manner along the longitudinal direction (vertical direction in the figure) of the printed wiring board 10.
　また、図１３では、複数の受けパッド部１５が、同じ側（図中上側）に向かって延在している。これに関し、少なくとも一つの受けパッド部１５が、反対側（図中下側）に向かって延在していてもよい。たとえば、複数の受けパッド部１５が、層間接続部１２の配列方向（プリント配線板の幅方向または長手方向）に沿って、交互に反対側に延在していてもよい。 Furthermore, in FIG. 13, the plurality of receiving pad portions 15 extend toward the same side (upper side in the figure). In this regard, at least one receiving pad portion 15 may extend toward the opposite side (lower side in the figure). For example, the plurality of receiving pad portions 15 may alternately extend to opposite sides along the arrangement direction of the interlayer connection portions 12 (the width direction or the longitudinal direction of the printed wiring board).
（第２の実施形態の変形例２）
　図１４を参照して、第２の実施形態の変形例２に係る接合プリント配線板１について説明する。 (Modification 2 of the second embodiment)
With reference to FIG. 14, a bonded printed wiring board 1 according to a second modification of the second embodiment will be described.
　図１４に示すように、本変形例においては、層間接続部１２および受けパッド部１５が、斜め方向に沿って配置される。すなわち、層間接続部１２の中心と受けパッド部１５の中心とを結ぶ線が、プリント配線板１０の幅方向に対して斜交するように、層間接続部１２および受けパッド部１５が配置されている。これにより、複数の層間接続部１２の幅Ｘを小さくすることができる。 As shown in FIG. 14, in this modification, the interlayer connection portion 12 and the receiving pad portion 15 are arranged along the diagonal direction. That is, the interlayer connecting portion 12 and the receiving pad portion 15 are arranged such that the line connecting the center of the interlayer connecting portion 12 and the center of the receiving pad portion 15 is oblique to the width direction of the printed wiring board 10. There is. Thereby, the width X of the plurality of interlayer connection parts 12 can be reduced.
　なお、層間接続部１２の数は、３つに限定されず、所要の信号線数に応じて増減されてよい。 Note that the number of interlayer connections 12 is not limited to three, and may be increased or decreased depending on the required number of signal lines.
（第２の実施形態の変形例３）
　図１５を参照して、第２の実施形態の変形例３に係る接合プリント配線板１について説明する。 (Variation 3 of the second embodiment)
With reference to FIG. 15, a bonded printed wiring board 1 according to a third modification of the second embodiment will be described.
　図１５に示すように、本変形例においては、複数の層間接続部１２および複数の受けパッド部１５が、縦方向（プリント配線板１０の長手方向）に沿って、一直線上に配置されている。これにより、複数の層間接続部１２の幅Ｙを、さらに小さくすることができる。 As shown in FIG. 15, in this modification, the plurality of interlayer connection parts 12 and the plurality of receiving pad parts 15 are arranged in a straight line along the vertical direction (the longitudinal direction of the printed wiring board 10). . Thereby, the width Y of the plurality of interlayer connection parts 12 can be further reduced.
　なお、層間接続部１２の数は、３つに限定されず、所要の信号線数に応じて増減されてよい。 Note that the number of interlayer connections 12 is not limited to three, and may be increased or decreased depending on the required number of signal lines.
（第２の実施形態の変形例４）
　図１６を参照して、第２の実施形態の変形例４に係る接合プリント配線板１について説明する。 (Modification 4 of the second embodiment)
With reference to FIG. 16, a bonded printed wiring board 1 according to a fourth modification of the second embodiment will be described.
　図１６に示すように、本変形例においては、プリント配線板１０は、グランド層１７に電気的に接続されるグランドビア１６をさらに有する。このグランドビア１６は、層間接続部１２の間に配置される。これにより、信号線１１間のクロストークを低減することができる。また、変型例２に比べて、信号の伝送特性を向上させることができる。 As shown in FIG. 16, in this modification, the printed wiring board 10 further includes a ground via 16 electrically connected to the ground layer 17. This ground via 16 is arranged between the interlayer connections 12. Thereby, crosstalk between the signal lines 11 can be reduced. Furthermore, compared to Modification 2, signal transmission characteristics can be improved.
　なお、グランドビア１６は、グランド層１７Ａに電気的に接続されてもよい。また、グランドビア１６は、一般には、図１Ａおよび図１Ｂのグランドビア４２，５２と異なるものであるが、これらと同一のものであってもよい。また、層間接続部１２の数は、３つに限定されず、所要の信号線数に応じて増減されてよい。 Note that the ground via 16 may be electrically connected to the ground layer 17A. Further, the ground via 16 is generally different from the ground vias 42 and 52 of FIGS. 1A and 1B, but may be the same. Furthermore, the number of interlayer connections 12 is not limited to three, and may be increased or decreased depending on the required number of signal lines.
（第２の実施形態の変形例５）
　図１７を参照して、第２の実施形態の変形例５に係る接合プリント配線板１について説明する。 (Variation 5 of the second embodiment)
With reference to FIG. 17, a bonded printed wiring board 1 according to a fifth modification of the second embodiment will be described.
　本変形例では、図１７に示すように、複数の層間接続部１２が、グランドビア１６を囲むように配置されている。グランドビア１６は、複数の層間接続部１２に共有されている。これにより、信号線間のクロストークを低減することができるとともに、接続部分の面積を低減することができる。 In this modification, as shown in FIG. 17, a plurality of interlayer connections 12 are arranged to surround a ground via 16. The ground via 16 is shared by a plurality of interlayer connections 12. Thereby, crosstalk between signal lines can be reduced, and the area of the connection portion can be reduced.
　図１７に示すように、層間接続部１２の各々は、グランド層１７のセパレート部Ｓにより仕切られている。換言すれば、各層間接続部１２は、グランド層１７に設けられた複数の開口部の各々に配置されている。セパレート部Ｓを設けることによって、信号線間のクロストークを低減できる。 As shown in FIG. 17, each of the interlayer connection parts 12 is partitioned by a separate part S of the ground layer 17. In other words, each interlayer connection part 12 is arranged in each of the plurality of openings provided in the ground layer 17. By providing the separate section S, crosstalk between signal lines can be reduced.
　なお、本変型例では、層間接続部１２または受けパッド部１５とグランド層１７との間のギャップＧは５０μｍであり、セパレート部Ｓの幅Ｗは５０μｍである。ギャップＧおよび幅Ｗの大きさは、変更されてもよい。また、図１５および図１８のように、セパレート部Ｓを設けなくてもよい。 In this modification, the gap G between the interlayer connection portion 12 or the receiving pad portion 15 and the ground layer 17 is 50 μm, and the width W of the separate portion S is 50 μm. The size of the gap G and width W may be changed. Further, as shown in FIGS. 15 and 18, the separate portion S may not be provided.
（第２の実施形態の変形例６）
　図１８を参照して、第２の実施形態の変形例６に係る接合プリント配線板１について説明する。 (Variation 6 of the second embodiment)
With reference to FIG. 18, a bonded printed wiring board 1 according to a sixth modification of the second embodiment will be described.
　図１８に示すように、本変形例においては、複数の層間接続部１２が、三角形格子状に配置される。すなわち、各層間接続部１２の中心が三角形の頂点に位置するように、複数の層間接続部１２が配置される。三角形には、三角形Ｔ１および正三角形Ｔ２が含まれる。 As shown in FIG. 18, in this modification, a plurality of interlayer connections 12 are arranged in a triangular lattice shape. That is, the plurality of interlayer connecting parts 12 are arranged such that the center of each interlayer connecting part 12 is located at the vertex of the triangle. Triangles include triangle T1 and equilateral triangle T2.
　このように、複数の層間接続部１２が三角形格子状に配置されることにより、変型例１に比べて、複数の層間接続部１２を高密度で配置することができる。 In this way, by arranging the plurality of interlayer connection parts 12 in a triangular lattice shape, the plurality of interlayer connection parts 12 can be arranged at a higher density than in the first modification.
　図１８に示すように、層間接続部１２は、受けパッド部１５と層間接続部１２とを接続する接続部（ライン）１４Ａを有する。接続部１４Ａを設けることで、三角形格子の形状を、正三角形にすることができる。これにより、複数の層間接続部１２の幅Ｚを、さらに小さくすることができる。 As shown in FIG. 18, the interlayer connection section 12 has a connection section (line) 14A that connects the receiving pad section 15 and the interlayer connection section 12. By providing the connecting portion 14A, the shape of the triangular lattice can be made into an equilateral triangle. Thereby, the width Z of the plurality of interlayer connections 12 can be further reduced.
　本変型例によれば、４本の信号線が用いられる場合、および、２組の差動線路が用いられる場合などに対応可能な接合プリント配線板を提供することができる。 According to this modification, it is possible to provide a bonded printed wiring board that can be used when four signal lines are used, when two sets of differential lines are used, etc.
　なお、ランド１３および／または受けパッド部１５の大きさ（面積）を、層間接続部１２ごとに変更してもよい。たとえば、図１８において、４つの層間接続部１２に囲まれた中央の受けパッド部１５を、他の受けパッド部１５よりも小さくしてもよい。これにより、変型例１に比べて、複数の層間接続部１２を、さらに高密度で配置することができる。 Note that the size (area) of the land 13 and/or the receiving pad portion 15 may be changed for each interlayer connection portion 12. For example, in FIG. 18, the central receiving pad section 15 surrounded by the four interlayer connection sections 12 may be smaller than the other receiving pad sections 15. Thereby, compared to the first modification, the plurality of interlayer connections 12 can be arranged at a higher density.
（第３の実施形態）
　最後に、図１９を参照して、第３の実施形態に係る接合プリント配線板１について説明する。図１９は、第３の実施形態に係る接合プリント配線板の、信号線１１，２１に沿った縦断面図である。 (Third embodiment)
Finally, with reference to FIG. 19, a bonded printed wiring board 1 according to a third embodiment will be described. FIG. 19 is a longitudinal cross-sectional view along signal lines 11 and 21 of a bonded printed wiring board according to the third embodiment.
　図１９に示すように、本実施形態は、第１および第２の実施形態と異なり、ランド延長部１４とランド延長部２４とが、導電材料を介すことなく、直接、電気的に接続されている。プリント配線板１０とプリント配線板２０とは、非導電材料３１によって接合されている。非導電材料３１として、たとえば、非導電性フィルム、非導電性ペーストまたは接着剤が用いられる。また、グランド層１７およびグランド層２７も、導電材料を介すことなく、直接、電気的に互いに接続されている。 As shown in FIG. 19, unlike the first and second embodiments, in this embodiment, the land extension portion 14 and the land extension portion 24 are directly electrically connected without using a conductive material. ing. Printed wiring board 10 and printed wiring board 20 are joined by a non-conductive material 31. As the non-conductive material 31, for example, a non-conductive film, a non-conductive paste or an adhesive is used. Further, the ground layer 17 and the ground layer 27 are also directly electrically connected to each other without using a conductive material.
　なお、直接、電気的に接続されるものの組み合わせは、ランド延長部同士の場合に限られない。たとえば、第１の実施形態の変形例２と同様の組み合わせとして、層間接続部同士およびランド延長部同士が、直接、電気的に接続されてもよい。あるいは、第２の実施形態と同様の組み合わせとして、ランド延長部（受けパッド部）と層間接続部とが、直接、電気的に接続されてもよい。 Note that the combination of items that are directly electrically connected is not limited to land extensions. For example, as a combination similar to Modification 2 of the first embodiment, the interlayer connection parts and the land extension parts may be directly electrically connected to each other. Alternatively, as a combination similar to the second embodiment, the land extension portion (receiving pad portion) and the interlayer connection portion may be directly electrically connected.
　図１９に示すように、層間接続部１２，２２の対向領域Ａ２，Ａ１にグランド層２７，１７が設けられていないため、このような接続を実現することができる。 As shown in FIG. 19, since the ground layers 27, 17 are not provided in the opposing regions A2, A1 of the interlayer connections 12, 22, such a connection can be realized.
　本実施形態によれば、導電材料を必要としない。また、第１および第２の実施形態と比較して、接合プリント配線板１の接合部分の厚みを、さらに小さくすることができる。 According to this embodiment, no conductive material is required. Furthermore, compared to the first and second embodiments, the thickness of the bonded portion of the bonded printed wiring board 1 can be further reduced.
　上記の記載に基づいて、当業者であれば、本開示の技術の追加の効果および種々の変形を想到できるかもしれない。本開示の態様は、上述した個々の実施形態に限定されるものではない。異なる実施形態にわたる構成要素を、適宜組み合わせてもよい。特許請求の範囲に規定された内容およびその均等物から導き出される本開示の技術の概念的な思想および趣旨を逸脱しない範囲で、種々の追加、変更および部分的削除が可能である。 Based on the above description, those skilled in the art may be able to envision additional effects and various modifications of the technology of the present disclosure. Aspects of the present disclosure are not limited to the individual embodiments described above. Components from different embodiments may be combined as appropriate. Various additions, changes, and partial deletions are possible without departing from the conceptual idea and gist of the technology of the present disclosure derived from the content defined in the claims and equivalents thereof.
１　接合プリント配線板
１０，２０　プリント配線板
１１，２１　信号線
１２，２２　層間接続部
１３，２３　ランド
１４，２４　ランド延長部
１４Ａ　接続部（ライン）
１５，２５　受けパッド部
１６，２６　グランドビア
１７，１７Ａ，２７，２７Ａ　グランド層
１８Ａ，１８Ｂ，２８Ａ，２８Ｂ　絶縁基材
１９，２９　接着剤層
３０　導電材料
３０ａ　導電ペースト
３１　非導電材料
４１，５１　グランド線
４２，５２　グランドビア
１００　片面金属箔張積層板
１１０，２１０　絶縁基材
１２０，２２０，２３０　金属箔
１３０　接着剤層
１４０，２４０　保護フィルム
２００　両面金属箔張積層板
２２０ａ　信号線
２２０ｂ　グランド線
３００　プリント配線板
３１０，３２０　ビア
３３０　めっきスルーホール
４１０，４２０，４３０　開口
４１０Ａ，４２０Ａ，４３０Ａ　めっき層
Ａ１，Ａ２　対向領域
Ｈ１，Ｈ２　ビアホール
Ｈ３　貫通孔
Ｊ　接合部分
Ｓ　セパレート部 1 Bonded printed wiring board 10, 20 Printed wiring board 11, 21 Signal line 12, 22 Interlayer connection part 13, 23 Land 14, 24 Land extension part 14A Connection part (line)
15, 25 Receiving pad portion 16, 26 Ground via 17, 17A, 27, 27A Ground layer 18A, 18B, 28A, 28B Insulating base material 19, 29 Adhesive layer 30 Conductive material 30a Conductive paste 31 Non-conductive material 41, 51 Ground Wires 42, 52 Ground via 100 Single-sided metal foil-clad laminate 110, 210 Insulating base material 120, 220, 230 Metal foil 130 Adhesive layer 140, 240 Protective film 200 Double-sided metal foil-clad laminate 220a Signal line 220b Ground line 300 Print Wiring board 310, 320 Via 330 Plated through hole 410, 420, 430 Opening 410A, 420A, 430A Plating layer A1, A2 Opposing area H1, H2 Via hole H3 Through hole J Joint part S Separate part

Claims (22)

  1. 　第１のプリント配線板と、
    　前記第１のプリント配線板と接合された第２のプリント配線板と、を有し、
    　前記第１のプリント配線板は、
    　　第１の信号線と、
    　　前記第１の信号線に一端が接続された第１の層間接続部と、
    　　前記第１の層間接続部の他端から延出し、前記第１のプリント配線板の接合面に設けられた第１のランド延長部と、
    　　前記接合面に設けられた第１のグランド層と、を有し、
    　前記第２のプリント配線板は、
    　　第２の信号線と、
    　　前記第２の信号線に一端が接続された第２の層間接続部と、
    　　前記第２の層間接続部の他端から延出し、前記第２のプリント配線板の接合面に設けられた第２のランド延長部と、
    　　前記接合面に設けられた第２のグランド層と、を有し、
    　前記第１の信号線は、前記第１のランド延長部および前記第２のランド延長部を介して、前記第２の信号線に電気的に接続され、
    　前記第１の層間接続部は、前記第２のプリント配線板の前記第２のグランド層と対向せず、
    　前記第２の層間接続部は、前記第１のプリント配線板の前記第１のグランド層と対向していない、
    接合プリント配線板。     a first printed wiring board;
    a second printed wiring board joined to the first printed wiring board,
    The first printed wiring board includes:
    a first signal line;
    a first interlayer connection portion having one end connected to the first signal line;
    a first land extension extending from the other end of the first interlayer connection portion and provided on the bonding surface of the first printed wiring board;
    a first ground layer provided on the bonding surface;
    The second printed wiring board is
    a second signal line;
    a second interlayer connection portion having one end connected to the second signal line;
    a second land extension extending from the other end of the second interlayer connection portion and provided on the bonding surface of the second printed wiring board;
    a second ground layer provided on the bonding surface;
    the first signal line is electrically connected to the second signal line via the first land extension and the second land extension,
    The first interlayer connection portion does not face the second ground layer of the second printed wiring board,
    The second interlayer connection portion does not face the first ground layer of the first printed wiring board.
    Bonded printed wiring board.
  2. 　前記第１の層間接続部と前記第２の層間接続部とは、互いに対向しないように配置され、
    　前記第１のランド延長部は、前記第２の層間接続部の対向領域まで延びておらず、
    　前記第２のランド延長部は、前記第１の層間接続部の対向領域まで延びておらず、
    　前記第１のランド延長部と前記第２のランド延長部とは、互いに対向するように配置されている、
    請求項１に記載の接合プリント配線板。     The first interlayer connection part and the second interlayer connection part are arranged so as not to face each other,
    the first land extension does not extend to an opposing area of the second interlayer connection;
    the second land extension does not extend to an area opposite the first interlayer connection;
    the first land extension and the second land extension are arranged to face each other;
    The bonded printed wiring board according to claim 1.
  3. 　前記第１のランド延長部および前記第２のランド延長部は、平面視で矩形状であり、
    　前記第１のランド延長部および前記第２のランド延長部の幅は、それぞれ、前記第１のランド延長部と前記第１の信号線との間、および、前記第２のランド延長部と前記第２の信号線との間でインピーダンスが整合されるように調整されている、
    請求項２に記載の接合プリント配線板。     The first land extension and the second land extension have a rectangular shape in plan view,
    The widths of the first land extension and the second land extension are determined respectively between the first land extension and the first signal line and the width between the second land extension and the second land extension. The impedance is adjusted to match the impedance between the second signal line and the second signal line.
    The bonded printed wiring board according to claim 2.
  4. 　前記第１の層間接続部と前記第２の層間接続部とは、互いに対向しないように配置されており、
    　前記第１のランド延長部は、前記第２の層間接続部の対向領域まで延びている、および／または、前記第２のランド延長部は、前記第１の層間接続部の対向領域まで延びている、
    請求項１に記載の接合プリント配線板。     The first interlayer connection portion and the second interlayer connection portion are arranged so as not to face each other,
    The first land extension extends to an area opposite the second interlayer connection, and/or the second land extension extends to an area opposite the first interlayer connection. There is,
    The bonded printed wiring board according to claim 1.
  5. 　前記第１のランド延長部は、前記第２の層間接続部に対向する第１の受けパッド部を有し、
    　前記第２のランド延長部は、前記第１の層間接続部に対向する第２の受けパッド部を有する、
    請求項４に記載の接合プリント配線板。     The first land extension portion has a first receiving pad portion facing the second interlayer connection portion,
    The second land extension portion has a second receiving pad portion facing the first interlayer connection portion.
    The bonded printed wiring board according to claim 4.
  6. 　前記第１の受けパッド部は、前記第２の層間接続部の対向領域を包含し、
    　前記第２の受けパッド部は、前記第１の層間接続部の対向領域を包含する、
    請求項５に記載の接合プリント配線板。     The first receiving pad portion includes a region facing the second interlayer connection portion,
    the second receiving pad portion includes a region facing the first interlayer connection portion;
    The bonded printed wiring board according to claim 5.
  7. 　前記第１のランド延長部と前記第２のランド延長部とは、互いに対向するように配置され、
    　前記第１の層間接続部と前記第２の層間接続部とは、互いに対向するように配置されている、
    請求項１に記載の接合プリント配線板。     the first land extension and the second land extension are arranged to face each other,
    The first interlayer connection part and the second interlayer connection part are arranged to face each other,
    The bonded printed wiring board according to claim 1.
  8. 　前記第１の層間接続部および／または前記第１のランド延長部と、前記第２の層間接続部および／または前記第２のランド延長部とは、導電材料を介して電気的に接続されており、
    　前記導電材料は、異方性導電フィルム、異方性導電ペースト、半田または導電ペーストである、
    請求項１に記載の接合プリント配線板。     The first interlayer connection portion and/or the first land extension portion and the second interlayer connection portion and/or the second land extension portion are electrically connected via a conductive material. Ori,
    The conductive material is an anisotropic conductive film, an anisotropic conductive paste, solder, or a conductive paste.
    The bonded printed wiring board according to claim 1.
  9. 　前記第１の層間接続部および／または前記第１のランド延長部と、前記第２の層間接続部および／または前記第２のランド延長部とは、直接、電気的に接続され、
    　前記第１のプリント配線板と前記第２のプリント配線板とは、非導電材料によって接合されており、
    　前記非導電材料は、非導電性フィルム、非導電性ペーストまたは接着剤である、
    請求項１に記載の接合プリント配線板。     The first interlayer connection portion and/or the first land extension portion and the second interlayer connection portion and/or the second land extension portion are directly electrically connected,
    The first printed wiring board and the second printed wiring board are joined by a non-conductive material,
    the non-conductive material is a non-conductive film, a non-conductive paste or an adhesive;
    The bonded printed wiring board according to claim 1.
  10. 　前記第１のプリント配線板および／または前記第２のプリント配線板は、フレキシブルプリント配線板である、
    請求項１に記載の接合プリント配線板。     the first printed wiring board and/or the second printed wiring board is a flexible printed wiring board;
    The bonded printed wiring board according to claim 1.
  11. 　前記フレキシブルプリント配線板の絶縁基材は、液晶ポリマー、フッ素系材料またはポリイミド系材料を含む、
    請求項１０に記載の接合プリント配線板。     The insulating base material of the flexible printed wiring board includes a liquid crystal polymer, a fluorine-based material, or a polyimide-based material.
    The bonded printed wiring board according to claim 10.
  12. 　前記第１のプリント配線板は、アンテナおよびアンテナ基板を含むアンテナモジュールに接続され、
    　前記第２のプリント配線板は、メイン基板に接続されており、前記メイン基板には、前記アンテナが受信した信号に基づき情報処理を行う半導体チップが実装されている、
    請求項１０または１１に記載の接合プリント配線板。     the first printed wiring board is connected to an antenna module including an antenna and an antenna substrate;
    The second printed wiring board is connected to a main board, and a semiconductor chip that performs information processing based on the signal received by the antenna is mounted on the main board.
    The bonded printed wiring board according to claim 10 or 11.
  13. 　第１のプリント配線板と、
    　前記第１のプリント配線板と接合された第２のプリント配線板と、を有し、
    　前記第１のプリント配線板は、
    　　複数の第１の信号線と、
    　　前記複数の第１の信号線に一端が接続された複数の第１の層間接続部と、
    　　前記複数の第１の層間接続部の他端から延出し、前記第１のプリント配線板の接合面に設けられた複数の第１のランド延長部と、
    　　前記接合面に設けられた第１のグランド層と、を有し、
    　前記第２のプリント配線板は、
    　　複数の第２の信号線と、
    　　前記複数の第２の信号線に一端が接続された複数の第２の層間接続部と、
    　　前記複数の第２の層間接続部の他端から延出し、前記第２のプリント配線板の接合面に設けられた複数の第２のランド延長部と、
    　　前記接合面に設けられた第２のグランド層と、を有し、
    　前記複数の第１の信号線の各々は、対応する前記第１のランド延長部および前記第２のランド延長部を介して、前記複数の第２の信号線のうちの対応する第２の信号線に電気的に接続され、
    　前記複数の第１の層間接続部は、前記第２のプリント配線板の前記第２のグランド層と対向せず、
    　前記複数の第２の層間接続部は、前記第１のプリント配線板の前記第１のグランド層と対向していない、
    接合プリント配線板。     a first printed wiring board;
    a second printed wiring board joined to the first printed wiring board,
    The first printed wiring board includes:
    a plurality of first signal lines;
    a plurality of first interlayer connection parts each having one end connected to the plurality of first signal lines;
    a plurality of first land extensions extending from the other ends of the plurality of first interlayer connection parts and provided on the bonding surface of the first printed wiring board;
    a first ground layer provided on the bonding surface;
    The second printed wiring board is
    a plurality of second signal lines;
    a plurality of second interlayer connection parts each having one end connected to the plurality of second signal lines;
    a plurality of second land extensions extending from the other ends of the plurality of second interlayer connection parts and provided on the bonding surface of the second printed wiring board;
    a second ground layer provided on the bonding surface;
    Each of the plurality of first signal lines connects a corresponding second signal of the plurality of second signal lines via the corresponding first land extension part and the second land extension part. electrically connected to the line,
    The plurality of first interlayer connections do not face the second ground layer of the second printed wiring board,
    The plurality of second interlayer connections do not face the first ground layer of the first printed wiring board.
    Bonded printed wiring board.
  14. 　前記複数の第１の層間接続部は、所定の方向に沿って千鳥状に配置されている、
    請求項１３に記載の接合プリント配線板。     The plurality of first interlayer connections are arranged in a staggered manner along a predetermined direction.
    The bonded printed wiring board according to claim 13.
  15. 　前記第１の層間接続部と前記第１のランド延長部とを結ぶ線が、前記第１のプリント配線板の幅方向に対して斜交するように、前記第１の層間接続部および前記第１のランド延長部が配置されている、
    請求項１３に記載の接合プリント配線板。     The first interlayer connection portion and the first land extension portion are connected such that a line connecting the first interlayer connection portion and the first land extension portion is oblique to the width direction of the first printed wiring board. 1 land extension is arranged,
    The bonded printed wiring board according to claim 13.
  16. 　前記複数の第１の層間接続部および前記複数の第１のランド延長部が、前記第１のプリント配線板の長手方向に沿って配置されている、
    請求項１３に記載の接合プリント配線板。     the plurality of first interlayer connection parts and the plurality of first land extension parts are arranged along the longitudinal direction of the first printed wiring board;
    The bonded printed wiring board according to claim 13.
  17. 　前記複数の第１の層間接続部のうち少なくとも一対の第１の層間接続部間に、グランドビアが配置されている、
    請求項１３に記載の接合プリント配線板。     A ground via is arranged between at least one pair of first interlayer connection parts among the plurality of first interlayer connection parts.
    The bonded printed wiring board according to claim 13.
  18. 　前記複数の第１の層間接続部に囲まれるように、グランドビアが配置されている、
    請求項１３に記載の接合プリント配線板。     a ground via is arranged so as to be surrounded by the plurality of first interlayer connections;
    The bonded printed wiring board according to claim 13.
  19. 　前記複数の第１のランド延長部の各々は、対応する前記第２の層間接続部に対向する受けパッド部を有し、
    　前記複数の第１の層間接続部および／または複数の前記受けパッド部は、三角形格子状に配置されている、
    請求項１３に記載の接合プリント配線板。     Each of the plurality of first land extension portions has a receiving pad portion facing the corresponding second interlayer connection portion,
    The plurality of first interlayer connection parts and/or the plurality of receiving pad parts are arranged in a triangular lattice shape,
    The bonded printed wiring board according to claim 13.
  20. 　前記複数の第１のランド延長部のうち少なくとも１つは、前記受けパッド部と前記第１の層間接続部とを接続する接続部をさらに有する、
    請求項１９に記載の接合プリント配線板。     At least one of the plurality of first land extensions further includes a connection part that connects the receiving pad part and the first interlayer connection part.
    The bonded printed wiring board according to claim 19.
  21. 　前記複数の第１の層間接続部の各々は、前記第１のグランド層により仕切られている、
    請求項１３に記載の接合プリント配線板。     Each of the plurality of first interlayer connections is partitioned by the first ground layer,
    The bonded printed wiring board according to claim 13.
  22. 　第１の信号線と、前記第１の信号線に一端が接続された第１の層間接続部と、前記第１の層間接続部の他端から延出する第１のランド延長部と、前記第１のランド延長部と同じ面に設けられた第１のグランド層と、を有する第１のプリント配線板を作製すること、
    　第２の信号線と、前記第２の信号線に一端が接続された第２の層間接続部と、前記第２の層間接続部の他端から延出する第２のランド延長部と、前記第２のランド延長部と同じ面に設けられた第２のグランド層と、を有する第２のプリント配線板を作製すること、および、
    　前記第１の信号線が前記第１のランド延長部および前記第２のランド延長部を介して前記第２の信号線に電気的に接続され、前記第１の層間接続部が前記第２のプリント配線板の前記第２のグランド層と対向せず、前記第２の層間接続部が前記第１のプリント配線板の前記第１のグランド層と対向しないように、前記第１のプリント配線板と前記第２のプリント配線板とを接合すること、を備えている、
    接合プリント配線板の製造方法。     a first signal line, a first interlayer connection portion having one end connected to the first signal line, a first land extension portion extending from the other end of the first interlayer connection portion; producing a first printed wiring board having a first ground layer provided on the same surface as the first land extension;
    a second signal line, a second interlayer connection portion having one end connected to the second signal line, a second land extension portion extending from the other end of the second interlayer connection portion; producing a second printed wiring board having a second ground layer provided on the same surface as the second land extension; and
    The first signal line is electrically connected to the second signal line via the first land extension and the second land extension, and the first interlayer connection is connected to the second the first printed wiring board so that it does not face the second ground layer of the printed wiring board and the second interlayer connection part does not face the first ground layer of the first printed wiring board; and the second printed wiring board.
    A method for manufacturing a bonded printed wiring board.
PCT/JP2023/005633 2022-05-11 2023-02-17 Composite printed wiring board and method for manufacturing composite printed wiring board WO2023218719A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019131288A1 (en) * 2017-12-28 2019-07-04 株式会社村田製作所 Transmission line device
WO2021230226A1 (en) * 2020-05-14 2021-11-18 株式会社村田製作所 Circuit board, circuit board connecting structure, and method for manufacturing circuit board connecting structure
WO2022004169A1 (en) * 2020-07-02 2022-01-06 株式会社村田製作所 Antenna module, connecting member, and communication device equipped with same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019131288A1 (en) * 2017-12-28 2019-07-04 株式会社村田製作所 Transmission line device
WO2021230226A1 (en) * 2020-05-14 2021-11-18 株式会社村田製作所 Circuit board, circuit board connecting structure, and method for manufacturing circuit board connecting structure
WO2022004169A1 (en) * 2020-07-02 2022-01-06 株式会社村田製作所 Antenna module, connecting member, and communication device equipped with same

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