WO2023215970A1 - Capteur de température à fibre optique avec élément de détection encapsulé - Google Patents
Capteur de température à fibre optique avec élément de détection encapsulé Download PDFInfo
- Publication number
- WO2023215970A1 WO2023215970A1 PCT/CA2023/050610 CA2023050610W WO2023215970A1 WO 2023215970 A1 WO2023215970 A1 WO 2023215970A1 CA 2023050610 W CA2023050610 W CA 2023050610W WO 2023215970 A1 WO2023215970 A1 WO 2023215970A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensing element
- temperature sensor
- sensing
- encapsulated
- optical fiber
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/268—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light using optical fibres
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
- G01K11/3206—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres at discrete locations in the fibre, e.g. using Bragg scattering
- G01K11/3213—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres at discrete locations in the fibre, e.g. using Bragg scattering using changes in luminescence, e.g. at the distal end of the fibres
Definitions
- the following is directed to a temperature sensor.
- the description is directed to a fiber optic temperature sensor having an encapsulated sensing element.
- Fiber optic temperature sensors such as temperature probes, normally include an optical fiber which can deliver light to a sensing material (e.g., phosphor). The light illuminates the phosphor which, in turn, luminesces visibly or in the near infrared. The temperature of the phosphor can be determined by observing the changes in certain characteristics of the emitted light.
- a sensing material e.g., phosphor
- thermographic phosphor sensors do not directly measure temperature but instead measure a physical property that exhibits strong temperature dependence, e.g., phosphorescence time decay. When this property is measured relative to a stable and accurate temperature source, the resulting relationship, or calibration curve can then be used to convert between the measured physical property, e.g., time decay, and temperature, enabling sensor functionality.
- Phosphor material used inside temperature sensor probes are often exposed to harsh environments with high temperatures and corrosive chemicals. For example, such probes are often used in systems that use active heating and are exposed to radio frequency (RF) through, e.g., plasma generation, such as plasma deposition processes in a chamber.
- RF radio frequency
- the phosphor should be protected from the environment to ensure long term reliability of the temperature sensor measurement systems.
- the mechanical design of the probe considers protection of the phosphor from the environment containing at least plasma and fluorine at temperatures up to or above, e.g., 300°C.
- a unique solution is required to achieve accurate contact temperature measurement at high temperatures in semiconductor process environments.
- the objective of the design often includes protecting the sensing material from the process environment, reducing the heat loss from the tip to improve contact measurement accuracy, and maximizing the material selection in the high temperature and semiconductor process environment.
- sensing material e.g., phosphor
- temperature measurement systems e.g., probes
- Other challenges with temperature measurement is producing temperature measurement systems (e.g., probes) which have consistent performance between made systems. For example, some processes impose undesirable variability in the performance of the temperature measurement system that require calibration.
- the following pertains to a temperature sensor including an optical fiber, and a sensing element spaced apart from the optical fiber.
- the sensing element is encapsulated in an optically transparent, non-porous material, isolating the sensing element from a surrounding environment.
- the optical fiber is aligned with the sensing element to deliver a source beam to interact with the sensing element and detect a return beam, where the return beam exhibits a temperature dependent property of the sensing element that is measured to determine a temperature of a measured object thermally coupled to the sensing element.
- the sensing element is intermixed within the optically transparent, non-porous material.
- the sensing element comprises a thermographic phosphor.
- a method of encapsulating a sensing material where the sensing material is a phosphor based sensing material (e.g., a thermographic phosphor).
- the method includes providing the sensing material and an encapsulating material.
- the method includes sintering the provided encapsulating material into an optically transparent, non-porous structured material encapsulating the sensing material.
- the encapsulating material is glass and the sensing material is a thermographic phosphor.
- Figure 1 is a schematic diagram of a fiber optic temperature sensor providing a gap between an optical fiber and a sensing element.
- Figure 2 is a schematic diagram of a fiber optic temperature sensor providing a gap between an optical fiber and a sensing element with the optical fiber being obliquely aligned with the sensing element.
- Figure 3 is a schematic diagram of a fiber optic temperature sensor providing a gap between an optical fiber and a sensing element with the optical fiber being aligned with a passage in an object between it and the sensing element.
- Figure 4 is a schematic diagram of a fiber optic temperature sensing system having multiple sensors with a gap between a respective optical fiber and a respective sensing element with the optical fibers being aligned with passages in an object between them and the sensing elements.
- Figure 5 is a schematic diagram of a fiber optic temperature probe providing a gap between a probe shaft containing an optical fiber and a sensing tip containing a sensing element.
- Figure 6 is a schematic diagram of a fiber optic temperature sensor for sensing the temperature of an object in a chamber, providing separation between an optical fiber outside of the chamber and a sensing element within the chamber.
- Figure 7 is a schematic diagram of a fiber optic temperature sensing system having multiple sensors with optical fibers aligned with passages through an ESC in a processing chamber.
- Figure 8 is a schematic diagram of a silicon wafer with a phosphor sensing element.
- Figure 9 is a schematic diagram of a system setup for the silicon wafer shown in Figure 8.
- Figure 10 is a schematic illustration of the temperature probe, optical cable and temperature sensor converter.
- Figure 11 is a schematic illustration further depicting details of the interior components of the temperature sensor converter.
- Figure 12 is a cross-sectional top perspective view of the temperature probe.
- Figure 13 is a cross-sectional view of the temperature probe mounted to a showerhead of a semiconductor deposition chamber.
- Figure 14 is a cross sectional view of the tip.
- Figure 15 is a perspective view of the tip.
- Figure 16 is a cross sectional view of the tip showing an adhesive applied between the window and the body of the tip.
- Figure 17 is a schematic diagram of a fiber optic temperature sensor having encapsulated sensing material.
- Figures 18A and 18B are each an image of an example encapsulated sensing material.
- Figure 19A and 19B are, respectively, a top view and a cross sectional view of part of the example encapsulated sensing material of Figure 18B.
- Figures 20A and 20B are each a cross-sectional diagram of part of an example temperature probe.
- Figure 21 A is a schematic diagram of an example fiber optic temperature sensor having an encapsulated sensing material.
- Figure 21 B is a schematic diagram of an example mounted encapsulated sensing material.
- Figure 22 is a diagram of experimental results of the performance of example encapsulated sensing material.
- Figure 23 is a flow chart diagram of an example method of manufacturing an encapsulated sensing material.
- Figure 24 is another diagram of experimental results of the performance of encapsulated sensing material.
- Figure 1 illustrates a temperature sensor 10 that provides a separation between an optical fiber 12 used as the light source and a sensing element 14 that is used to measure the temperature of a measured object 16.
- the separation between the optical fiber 12 and the sensing element 14 can be implemented for various purposes as discussed below, for example, to thermally separate a probe tip from a probe shaft, to enable remote temperature sensing of a closed or separated environment such as a chamber, etc.
- the optical fiber 12 can be positioned to direct a source beam 18 towards the sensing element 14 across a boundary 22, and detect a return beam 20 that has interacted with the sensing element 14 to measure the temperature of the measured object 16.
- the boundary 22 in this example is shown in dashed lines to illustrate that the boundary 22 can take the form of a physical boundary such as an optically transparent “window” or passage, and/or may represent a gap between the optical fiber 12 and the sensing element 14 and any structural element(s) (not shown) that contain or support them.
- a physical boundary such as an optically transparent “window” or passage
- any structural element(s) not shown
- examples herein may refer to temperature sensing, monitoring and control in semiconductor processing, the principles discussed herein can be applied to any application using such functionality.
- Figure 2 illustrates an alternative arrangement for the sensor 10 wherein the optical fiber 12 is aligned obliquely relative to the boundary 22 such that the beam 18 interacts with the sensing element 14 at an angle.
- the arrangement shown in Figure 2 can allow the sensor 10 to be deployed in various applications where straight-line separation is not possible or is difficult.
- the oblique arrangement can be used when the supporting element(s) provide constraints making a straight-line arrangement difficult.
- Figures 3 and 4 illustrate other forms the boundary 22 may take, namely in which the optical fiber 12 is aligned with a passage 30 in a structural element 32 which is interposed between the optical fiber 12 and the sensing element 14.
- the arrangement shown in Figures 3 and 4 can be implemented in scenarios where temperature sensing is performed from below the measured object 16, e.g., within a plasma chamber. It can be appreciated that this arrangement can also be implemented from above the sensing element 14 and measurement object 16.
- the optical fiber 12 is shown to be positioned at a distance from the passage 30, the optical fiber 12 can also be inserted into the passage 30 or otherwise embedded or secured in the structural element 32.
- multiple sensors 10a, 10b, 10c can be integrated into a temperature measurement system.
- a first optical fiber 12a remotely interacts with a first sensing element 14a
- second and third optical fibers 12b, 12c remotely interact with second and third sensing elements 14b, 14c via first, second and third passages 30a, 30b, 30c for measuring at multiple points on the measured object 16.
- this multiple sensor arrangement can also be implemented with the configurations shown in Figures 1 and 2. It can also be appreciated that the multiple sensor arrangement can be used to measure multiple measured objects (not shown).
- the boundary 22 takes the form of a gap between a probe shaft 42 containing the optical fiber 12 and a probe tip 44 that includes an object engaging portion 46, sometimes referred to as a “button”, with a sensing element 14.
- the sensing element 14 engages the object engaging portion 46 to detect the temperature of the measured object 16.
- the boundary 22 also includes a window 48 that is used to protect the sensing element 14 in the tip 44.
- Figure 6 illustrates a temperature sensing system 60 for a semiconductor processing chamber 68, wherein the boundary 22 includes a transparent window 64 in a lid 66 of the chamber 68.
- the optical fiber 12 is positioned outside of the chamber 68 and is aligned with the window 64 to enable the source beam 18 to reach the sensing element 14 that is on or integrated with a silicon wafer 70 supported by an ESC 72. It can be appreciated that details of the interior 74 of the chamber 68 are omitted for ease of illustration. It can also be appreciated that multiple sensing elements 14 and multiple optical fibers 12 can be included in an arrangement such as that shown in Figure 6, with either a sufficiently wide window 64 or multiple windows 64 in the lid 66 (not shown). Also shown in Figure 6 is a lens 62 (or lens device or system) that can be used to focus the beam 18 in applications where the distance between the optical fiber 12 and the sensing element 14 requires.
- a lens 62 or lens device or system
- FIG. 7 illustrates another temperature sensing system 80 for a semiconductor processing chamber 82.
- an ESC 72 supports a wafer 70 but a pair of sensing elements 14a, 14b are applied or embedded in the underside of the ESC 72.
- a structural element 32 supports the ESC 72 with a pair of passages 30a, 30b aligned with the sensing elements 14a, 14b to enable corresponding optical fibers 12a, 12b to direct source beams 18 at the sensing elements 14a, 14b.
- lenses 62a, 62b can also be used to focus the source beams 18.
- a showerhead 86 is shown supported beneath a lid 84 of the chamber 82.
- FIG. 8 Yet another configuration is shown in FIG. 8 in which a silicon wafer 90 includes a sensing element 14 embedded in its underside, e.g., on a recessed pocket in the silicon water 90 and downwardly facing to interact with the source beam 18 of an optical fiber 12 (not shown).
- the phosphor sensing element 14 in this example is protected from its environment by a sealing window 91 that is sealed in the recessed pocket using an adhesive 92 or binding joint.
- FIG. 8 The configuration shown in FIG. 8 enables the temperature of the silicon wafer 90 to be measured using the sensing element 14.
- An example of a system configuration is shown in FIG. 9, in which a light guide or other light transmission component 93 is positioned adjacent and in alignment with the sensing element 14 on the silicon wafer 90.
- the component 93 can be a sapphire rod or any other suitable material.
- the component 93 is coupled to a converter 95 via a cable 94 (e.g., an SMA patch cord).
- the converter 95 is powered by a power supply 96 (e.g., 12 VDC as illustrated) and can be coupled to a computer 97 or other computing device to enable a temperature sensing operation.
- a power supply 96 e.g., 12 VDC as illustrated
- Figures 10-16 provide additional detail for the configuration shown in Figure 5.
- Figure 10 shows an optical temperature sensor having a temperature probe 102, comprising a tip 109 and a mount 104.
- the mount 104 contains a fiber optical cable 106 therein and this fiber optical cable 106 extends out from the mount 104 to optically couple the mount 104 to a temperature sensor converter 108.
- the temperature sensor converter 108 contains therein, an illumination device 110 for providing a source beam 18 to be projected down the fiber optical cable 106 and a photodetector 112 to receive a return beam 20.
- Figure 12 illustrates a fiber optic temperature sensor 102 having a shaft 104, a tip 109, and a base 107.
- An optical fiber 111 fed through optical cable 106, run through a channel 113 in the shaft 104 and base 107.
- the fiber 111 is a fused silica fiber with a silica cladding. While various sizes of fibers would be known, in an embodiment, the fiber has a 1 mm diameter.
- the optical fiber 111 is exposed at the bottom end 114 of the shaft 104. Below the shaft 104, and spaced from the shaft 104, is the tip 109.
- the space between the shaft 104 and the tip 109 contains the atmosphere of the environment in which the sensor 102 is being used.
- the space, or gap 116, between the shaft 104 and tip 109 can vary, e.g., approximately, 0.25 to 1.5 mm.
- the optical fiber 111 is held in place by the base 107 and shaft 104, however the illumination device 110, photodetector 112 and means for processing the light and wavelength returning to the temperature sensor converter 108 can be located external to probe 102, as shown in Figure 11 .
- the optical fiber 111 extends outside the probe 102 as part of optical cable 106. In this way, the light source and means for processing a light signal can be located away from the any harsh environment in which the temperature sensor is being used.
- FIG 13 shows the temperature sensor 102 fixed to the body of a showerhead for use in semiconductor environments. While the temperature sensor 102 described herein could be used in a variety of environments, due to the harsh nature of semiconductor chambers, the temperature sensor 102 has particular advantages for use in semiconductor environments, for example in semiconductor deposition chambers or semiconductor etch chambers. However, it will be appreciated by a person skilled in the art that the temperature sensor 102 could be used in any environment suitable for a contact optical temperature sensor. As such, the design of the base 107 can be varied to be suitable for use in any environment where an optical contact temperature sensor is required.
- the temperature sensor 102 is coupled to the body of the showerhead 118.
- a sealing device such as the O-ring 120 is compressed between the top surface 103 of showerhead 118 and the bottom surface 105 of base 107.
- This seal is used to maintain the vacuum in the semiconductor chamber.
- the seal can be omitted.
- the O-ring 120 sits in groove 122 of the showerhead 118 to provide proper positioning of the O-ring 120 relative to the sensor base 107 and to allow for ease of assembly without the O-ring 120 shifting.
- the base 107 may then be fixed to the showerhead 118 using screws 124 in this example.
- screws 124 are shown for coupling the base 107 to the showerhead 118, other fastening mechanisms could be used. While only two screws 124 are shown in the figures as points of attachment, it can be appreciated that any suitable number of points of attachment could be used.
- the tip 109 shown in Figures 14 and 15, has a body 126 made of a thermally conductive material.
- the body 126 is made of alumina. While other suitable materials may be known to a person skilled in the art, alumina allows for good conductivity while being resistant to high temperatures and corrosive environments, such as those in semiconductor deposition chambers containing plasma and other chemicals such as, Fluorine.
- sensing material 14 can be phosphorescent such as phosphor, although other materials would be known to a person skilled in the art.
- the sensing material 14 is applied onto the thermally conductive tip 109.
- the sensing material 14 can be mixed with a suitable adhesive.
- Application of the sensing material 14 and adhesive combination can be done by any suitable method known to a person skilled in the art including, but not limited to deposition, sputtering, bonding, panting, and spin on.
- the sensing material 14 is excited by light transmitted through the optical fiber 111 .
- the body material 126 is thermally conductive to increase the heat flow from the measurement surface 130 of the measured object 16, to the sensing material 14 for more accurate measurement.
- the sensing material 14 can be protected from the environment using a window 48 positioned between the sensing material 14 and the gap 116.
- the window 48 is sealed to the body 126 of the tip 109 using any suitable sealing process that will hermetically seal the window 48 between the body material 126 and the gap 116.
- An adhesive having high temperature resistance and resistance to radicals can be used.
- the window 48 is transparent to allow for light to be transmitted from the optical fiber 111 to the sensing material 14.
- a suitable example material is sapphire as it is highly transparent, compatible with the preferred hermetic sealing technique (described below), capable of surviving high temperature environments and resistant to the harsh chemical environment of a semiconductor chamber.
- similar coefficients of thermal expansion can be defined as coefficients of thermal expansion which are sufficiently similar such that when window material and body material expand and contract, the rates and amount of expansion and contraction are not so different as to cause separation between the two.
- materials wherein the difference in coefficients of thermal expansion is in the range of 6 -10 x 10 -6 °C or less will be suitable. It can be appreciated by a person skilled in the art that other window and tip materials with similar coefficients of thermal expansion could be used.
- the body 126 of the tip 109 has a shoulder or sealing surface 136 to allow for the sealing of the window 48 to the body 126 without contacting the sensing material 14.
- the outer edges of the window 48 can be affixed to the body 126 using zinc borosilicate glass due to its ability to adhere to both sapphire and alumina and maintain adhesion in high temperature applications.
- zinc borosilicate glass is used as an adhesive in a preferred embodiment, other adhesives would be known to a person skilled in the art.
- the adhesive for example zinc borosilicate glass
- the adhesive is heated.
- zinc borosilicate glass it is heated to approximately 400°C to 700°C.
- a film of the adhesive can be applied to the sapphire, or alumina, or both the sapphire and alumina, using any suitable method, including, but not limited to, chemical vapor deposition, sputtering, evaporating and spin on.
- Figure 16 shows the sealing material 127 between the window 48 and the body 126.
- the application of the glass seal can be screen printed or painted onto the surface.
- a stencil is made with a geometry adapted to fill the volume of space between the sensing material and the sealing surface.
- the glass seal is applied, and the stencil is removed.
- the window is then placed atop the adhesive using a fixture to ensure concentricity between the window to the tip.
- the entire assembly is then placed in a furnace and baked at atmospheric pressure.
- a layer of gas 134 such as air, can be left between the sensing material 14 and the window 48. This layer of gas 134 ensures that the sensing material 14 does not touch the window 48. In this way, the sensing material 14 is inhibited from losing heat to the window 48 which aids in more accurate temperature measurements.
- the window 48 can be directly sealed onto the probe tip 109 in which the sensing material 14 is applied. By sealing the window 48 in the probe tip 109, the tip assembly is self contained and can be used for various tip geometries to maximize contact and heat transfer from the measured surface 130.
- a transparent coating of sapphire or other suitable material, such as aluminum oxide, is applied on to the upper surface of the body of the tip 126 to completely cover the sensing material 14, isolating the sensing material 14 from the surrounding environment.
- the tip 109 When in use, the tip 109 can be placed in contact with the measured object 16 for which the temperature reading is required. Since the body 126 of the tip 109 is made of conductive material, the heat flows from the measurement surface 130 through the body 126 of the tip 109 and to the sensing material 14.
- a source beam 18 from the illumination device (shown in Figure 11) is provided using the optical fiber 111. The light shines through the transparent window 48 and on to the sensing material 14. The incoming light of the source beam 18 excites the sensing material 14 causing it to emit a wavelength of light (i.e. the return beam 20) back through the window 48 and into the optical fiber 111. This light is transmitted through the optical cable 106 to the temperature sensor converter 108.
- the temperature sensor converter 108 uses the wavelength to determine the temperature of the sensing material 14 which is reflective of the temperature of the measurement surface 130.
- temperature can be measured with an accuracy of approximately +/- 2 °C.
- Figure 17 shows an example embodiment of sensing material within the tip 109 being isolated from the surrounding environment.
- the sensing material e.g., sensing material 14
- the sensing material and the encapsulating material are identified by the reference numeral 137, and hereinafter jointly referred to by as the encapsulated sensing material 137.
- the encapsulated sensing material 137 can be a variety of different shapes and sizes, depending on the required application.
- Figure 18A shows the encapsulated sensing material 137 as a wafer.
- the shape or size of the encapsulated sensing material 137 can be further configured or manipulated at various stages of assembly or manufacture.
- Figure 18B shows the encapsulated sensing material 137 in a diced wafer shape. The shape can be the result of machining or manipulating the wafer encapsulated sensing material 137.
- Figures 19A, 19B each show magnified images of the structure of an example Thermographic Phosphor in Glass (TPiG) encapsulated sensing material 137.
- TPiG Thermographic Phosphor in Glass
- the potential high hermiticity of the example encapsulated sensing material 137 is shown owing to relatively few black spaces 152A indicative of low hermicity.
- the cross-sectional view shown in Figure 19B (with the shown sample having a depth 150C of 498.95 micrometers) similarly shows the potential high hermiticity owing to the relatively few dead spaces 152B in the image.
- the encapsulated sensing material 137 can be used in part to define an assembly.
- the channel 113 extending through the shaft 104 is shown having a threaded end 138.
- the body 126 of the tip 109 includes a channel 139 which is sized to receive the threaded end 138, and further includes threading 140 to enable mating with the threaded end 138.
- the threaded end 138 is shown mated with the threading 140 and threaded to contact the encapsulating sensing material 137.
- Assembly of the temperature probe 10 is therefore easier as the encapsulating sensing material 137 provides feedback as to when the shaft 104 is completely engaged with the tip 109.
- the encapsulated sensing material 137 can be assembled in a manner similar to that discussed herein with respect to the isolated sensing material 14.
- the encapsulated sensing material 137 can be secured via adhesive to the tip 109.
- the tip 109 can consist of the encapsulated sensing material 137 ( Figure 21 A).
- the encapsulated sensing material 137 can be applied to a measured object 141 ( Figure 21 B), in a recess of that object 141 , etc.
- the encapsulated material 137 can be used in the angled applications discussed in respect of Figure 2.
- FIG. 22 shows experimental results of testing an example TPiG encapsulated sensing material 137 at different temperatures.
- the time constant of the measured TPiG encapsulated sensing material 137 is shown on the vertical axis, and the temperature being measured is shown on the horizontal axis.
- the relationship between the TPiG encapsulated sensing material’s time constant and the temperature being measured is monotonic (in this shown graph continuously sloping downward) even at high temperatures, so that a single measurement of the time constant can be correlated to a measured temperature.
- the performance of the example TPiG encapsulated sensing material 137 is relatively consistent, possibly allowing for easier calibration.
- FIG. 23 An example method of creating the encapsulated sensing material 137 is shown in Figure. 23.
- the sensing material 14 can be encapsulated into the encapsulated sensing material 137 via sintering.
- the sensing material 14 and the material used to encapsulate the sensing material 14 to form the encapsulating sensing material 137 are provided.
- the sensing material 14 is a thermographic phosphor
- the encapsulating material includes glass, binders, and/or other types of additive materials.
- the materials can be in a powder, crystal or other non-liquid form, or the materials can include at least some liquid materials.
- Providing the materials sensing material 14 and the encapsulating material can, in at least some example embodiments, include molding or manipulating the mixed materials into a final shape or precursor shape.
- the mixed materials may be provided in a mold in the shape of a wafer or ingot.
- the molding can require an initial compaction or heating to ensure the mixed materials take the shape of the mold.
- the sensing material 14 and the encapsulating material can be treated to remove volatile species and binders (whether organic or inorganic). Treating can comprise heat treatment, or other types of treatment.
- the block 2204 may be unnecessary where the sensing material 14 or the encapsulating material do not include volatile species or binders which cannot be removed via heat treating.
- the mixed materials are sintered in a controlled atmosphere to create an optically transparent, non-porous material.
- the controlled atmosphere can be a vacuum, or controlled to substantially be composed of or include a sufficient amount of inert gases to avoid adverse reactions.
- the controlled environment is primarily composed of air. Sintering can result in a non-porous, structured material that will block the diffusion of gasses into the encapsulating sensing material 137 which would otherwise affect the light scattering properties of the encapsulating sensing material 137.
- Encapsulated sensing material 137 created at least in part by sintering can exhibit high hermiticity, increasing the material’s durability in harsh environments.
- the encapsulating sensing material 137 can be manipulated into a final shape.
- Manipulating can include, for example, dicing, laser cutting, machining, or other suitable methods known to a person skilled in the art.
- the disclosed TPiG encapsulated sensing material 137 may have lower sample to sample variability, allowing for more consistent and reliable temperature probes.
- the greater sample to sample variability can result from the sintering process, where the thermographic phosphor sensing material 14 does not change its chemical composition during sintering, allowing for greater control of the final composition of the TPiG encapsulated sensing material 137.
- sintering can allow for more precise selection of the sensing material 14, to target specific operating environments (e.g., high temperature environments).
- the TPiG encapsulated sensing material 137 owing to its generation via sintering or a similar process, can allow for greater uniformity between TPiG encapsulated sensing material 137 batches as the TPiG encapsulated sensing material 137 results in a more predictable shape and composition compared to other approaches (e.g., a ceramic blend approach).
- thermographic phosphor i.e., sensing material
- the amount of sensing material may vary as the sensing material amounts may be eroded or created as a result of less predictable or more variable chemical interactions.
- the final shape of different TPiG encapsulated sensing materials 13 may be more consistent, as sintering may cause the TPiG encapsulated sensing materials 13 to shrink with a greater degree of predictably into a final shape (e.g., the expected shrinking can be accounted for by way of mold creation and material selection).
- the described sintering process can advantageously allow for selection of encapsulating material that can reduce porosity of the TPiG encapsulated sensing material 137 to a relatively larger extent given the aforementioned stability of the TPiG, increasing the overall robustness of the TPiG encapsulated sensing material 137.
- materials which have reduced porosity may be selected without regard to the encapsulating material’s properties that define chemical interactions with the sensing material.
- the encapsulating material can be selected to facilitate specific applications, such as a high temperature application.
- the encapsulating material can be a glass which performs well in high temperature environments.
- the TPiG encapsulated sensing material 137 can be a sensor with a glass encapsulating material that performs well in environments having a temperature of 450 degrees Celsius, or as high as 750 degrees Celsius, or even as high as 900 degrees Celsius.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
L'invention concerne un capteur de température comprenant une fibre optique, et un élément de détection espacé de la fibre optique. L'élément de détection est encapsulé dans un matériau non poreux optiquement transparent, isolant l'élément de détection de l'environnement. La fibre optique est alignée avec l'élément de détection pour délivrer un faisceau source afin d'interagir avec l'élément de détection et détecter un faisceau de retour, le faisceau de retour présentant une propriété dépendant de la température qui est mesurée pour déterminer une température d'un objet mesuré couplé thermiquement à l'élément de détection.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US17/742,877 US20220334004A1 (en) | 2019-06-14 | 2022-05-12 | Fiber Optic Temperature Sensor Having Encapsulated Sensing Element |
US17/742,877 | 2022-05-12 |
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WO2023215970A1 true WO2023215970A1 (fr) | 2023-11-16 |
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PCT/CA2023/050610 WO2023215970A1 (fr) | 2022-05-12 | 2023-05-04 | Capteur de température à fibre optique avec élément de détection encapsulé |
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US20110267598A1 (en) * | 2010-04-30 | 2011-11-03 | Vestas Wind Systems A/S | Optical sensor system and detecting method for an enclosed semiconductor device module |
US20120177319A1 (en) * | 2009-07-16 | 2012-07-12 | Hamidreza Alemohammad | Optical fiber sensor and methods of manufacture |
US20160011060A1 (en) * | 2014-07-08 | 2016-01-14 | Watlow Electric Manufacturing Company | Bonded assembly with integrated temperature sensing in bond layer |
US20200393307A1 (en) * | 2019-06-14 | 2020-12-17 | Photon Control Inc. | Fiber Optic Temperature Sensor |
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US6511946B1 (en) * | 1998-07-28 | 2003-01-28 | Fuchs Petrolub Ag | Water-miscible cooling lubricant concentrate |
US20120177319A1 (en) * | 2009-07-16 | 2012-07-12 | Hamidreza Alemohammad | Optical fiber sensor and methods of manufacture |
US20110267598A1 (en) * | 2010-04-30 | 2011-11-03 | Vestas Wind Systems A/S | Optical sensor system and detecting method for an enclosed semiconductor device module |
US20160011060A1 (en) * | 2014-07-08 | 2016-01-14 | Watlow Electric Manufacturing Company | Bonded assembly with integrated temperature sensing in bond layer |
US20200393307A1 (en) * | 2019-06-14 | 2020-12-17 | Photon Control Inc. | Fiber Optic Temperature Sensor |
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