WO2023212985A1 - 天线模组及天线模组的生产方法 - Google Patents

天线模组及天线模组的生产方法 Download PDF

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Publication number
WO2023212985A1
WO2023212985A1 PCT/CN2022/093827 CN2022093827W WO2023212985A1 WO 2023212985 A1 WO2023212985 A1 WO 2023212985A1 CN 2022093827 W CN2022093827 W CN 2022093827W WO 2023212985 A1 WO2023212985 A1 WO 2023212985A1
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WIPO (PCT)
Prior art keywords
antenna
circuit board
flexible circuit
radio frequency
chip
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PCT/CN2022/093827
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English (en)
French (fr)
Inventor
杨兆良
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昆山睿翔讯通通信技术有限公司
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Publication of WO2023212985A1 publication Critical patent/WO2023212985A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/525—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between emitting and receiving antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Definitions

  • the invention relates to an antenna module and a production method of the antenna module.
  • the built-in antenna is one of the more critical pieces of hardware for smartphones. Functions such as calls, Internet access, Bluetooth transmission, and GPS positioning are all implemented through the antenna. As mobile phones become smaller and lighter, more requirements are placed on the size and signal transmission and reception capabilities of antennas. Dr. Yuan Tao has improved the structure of the antenna in many papers, such as Zhang, X., Tan, T.Y., Wu, Q.S., Zhu, L., Zhong, S., & Yuan, T. (2021). Pin-loaded patch antenna fed with a dual-mode SIW resonator for bandwidth enhancement and stable high gain.
  • the purpose of the present invention is to provide an antenna module to solve the problem in the prior art that the radio frequency front end and antenna occupy a large space.
  • the present invention provides an antenna module, which includes a first flexible circuit board, a second flexible circuit board electrically connected to the first flexible circuit board, and a second flexible circuit board welded to the second flexible circuit board.
  • the antenna is fixed on the first flexible circuit board and electrically connected to the radio frequency front-end chip.
  • the first flexible circuit board is close to the second flexible circuit board.
  • the first flexible circuit board and the second flexible circuit board are FPC circuit boards or LCP circuit boards.
  • the first flexible circuit board and the second flexible circuit board are electrically connected through ball planting.
  • one or more of a capacitor, a resistor, and an inductor are embedded in the second flexible circuit board.
  • a receiving cavity and a glue injection hole connected to the receiving cavity for injecting glue into the receiving cavity are provided in the second flexible circuit board, and the radio frequency front-end chip is received in the said receiving cavity. Inside the containment chamber.
  • the antenna form is one of a loop antenna, a monopole antenna, an IFA antenna, a PIFA antenna, a MIMO antenna and an array antenna.
  • the radio frequency front-end chip includes a transceiver module
  • the transceiver module includes a first antenna tuning chip electrically connected to the antenna, a first radio frequency switch electrically connected to the antenna, a duplexer electrically connected to the first radio frequency switch, a power amplifier electrically connected to the duplexer, and a first low-noise amplifier.
  • the radio frequency front-end chip includes a receiving module, and the receiving module includes a second antenna tuning chip electrically connected to the antenna, a second radio frequency switch electrically connected to the antenna, a filter electrically connected to the second radio frequency switch, and a second low-noise amplifier electrically connected to the filter.
  • the present invention also provides a production method for forming the above-mentioned antenna module, including the following steps:
  • S1 Provide a first flexible circuit board, fix the antenna on the first flexible circuit board, provide a second flexible circuit board, open a receiving cavity on the second flexible circuit board and connect it to the receiving cavity.
  • S3 Electrically connect the first flexible circuit board and the second flexible circuit board through ball planting, and store the radio frequency front-end chip in the receiving cavity;
  • the second flexible circuit board provided in step S1 is embedded with one or more types of capacitors, resistors, and inductors, and is produced using a lamination process.
  • step S0 is also included before step S1: designing an antenna and a radio frequency front-end chip according to product requirements, and performing simulation according to the parameters of the antenna and radio frequency front-end chip.
  • the antenna module of the present invention can improve the sensitivity of antenna reception, reduce power consumption, and extend the battery life; compared with the current design, it can save 15% of the area, save a layer of substrate, and reduce the metal shielding cover , the height of the RF front-end circuit can be reduced by about 0.5mm.
  • FIG. 1 is a schematic structural diagram of the antenna module of the present invention.
  • Figure 2 is a schematic structural diagram of the radio frequency front-end chip and antenna of the antenna module of the present invention
  • FIG. 3 is a flow chart of the production method of the antenna module of the present invention.
  • connection should be understood in a broad sense.
  • connection or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components.
  • connection or integral connection
  • connection or integral connection
  • connection can be a mechanical connection or an electrical connection
  • it can be a direct connection or an indirect connection through an intermediate medium
  • it can be an internal connection between two components.
  • specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
  • the present invention provides an antenna module 100, which is used in communication equipment and is connected to the transceiver chip 201 on the mainboard 200 in the communication equipment through a radio frequency cable 202.
  • the antenna module 100 includes a first flexible circuit board 1, a second flexible circuit board 2 electrically connected to the first flexible circuit board 1, a radio frequency front-end chip 3 and an antenna 4 welded in the second flexible circuit board 2.
  • the first flexible circuit board 1 and the second flexible circuit board 2 are used to bury circuits and components.
  • the first flexible circuit board 1 and the second flexible circuit board 2 are FPC circuit boards or LCP circuit boards.
  • LCP circuit boards When using LCP circuit boards, the dielectric constant is small and the loss of high-frequency current is small; when using FPC circuit boards, the cost is lower.
  • the first flexible circuit board 1 is provided with a soldering pad 11 on one side, and the antenna 4 is fixed on the other side.
  • the side with the soldering pad 11 faces the second flexible circuit board 2 , and the radio frequency front-end chip 3 is soldered on the soldering pad 11 in a bare chip flip-chip manner.
  • the radio frequency front-end chip 3 is fixed in the form of a bare chip, so it only needs to be packaged once, which reduces the thickness and size of the antenna module 100 and has better performance than two packages.
  • the radio frequency front-end chip 3 includes a transceiver module 31.
  • the transceiver module 31 includes a first antenna tuning chip 311 electrically connected to the antenna 4, and a third antenna tuning chip 311 electrically connected to the antenna 4.
  • the radio frequency front-end chip 3 further includes a receiving module 32.
  • the receiving module 32 includes a second antenna tuning chip 321 electrically connected to the antenna 4, and a second antenna tuning chip 321 electrically connected to the antenna 4.
  • Antenna 4 is one of a loop antenna, a monopole antenna, an IFA antenna, a PIFA antenna, a MIMO antenna, and an array antenna.
  • the antenna 4 is used for receiving and radiating wireless signals.
  • the signal transmitted by the radio frequency transmitting front-end chip 3 is radiated through the antenna 4; the wireless signal in space is received by the antenna 4 and then transmitted to the radio frequency receiving front-end chip 3.
  • the first antenna tuning chip 311 and the second antenna tuning chip 321 are used to optimize the performance of the antenna 4 and are located between the antenna 4 and the radio frequency front-end chip. By switching different states, the performance of antenna 4 is optimized.
  • the first radio frequency switch 312 and the second radio frequency switch 322 are used for selecting radio frequency signals, and are generally located between the radio frequency front-end chip and the first tuning chip 311 or antenna 4/the second tuning chip 311 or antenna 4. According to the requirements of the working frequency, select the corresponding signal.
  • the duplexer 313 is located between the first radio frequency switch 312 and the power amplifier 314, and is used for filtering the receiving/transmitting signals and isolating the transmitting and receiving signals.
  • the filter 323 is located between the second radio frequency switch 322 and the second low noise amplifier 324, and is used for filtering the received signal.
  • the power amplifier 314 is electrically connected to the duplexer 313 and is used for amplifying the transmitted signal.
  • the duplexer 313 or the power amplifier 314 is integrated into the antenna module 100, so that the antenna 4 receives a signal and passes the first radio frequency switch 312 to select the corresponding duplexer 313 or the first low-frequency signal according to the channel of the received signal.
  • the noise amplifier 315 path the weak signal is amplified by the first low-noise amplifier 315 and then enters the radio frequency cable 202 for transmission to the transceiver chip 201 of the communication device, thereby effectively improving the receiving sensitivity. Instead, the signal from the antenna 4 directly passes through the radio frequency cable 202, causing power loss.
  • the first antenna tuning chip 311 is used to electrically connect with the antenna 4 to improve the performance of the antenna 4 .
  • the small transmission signal output by the transceiver chip 201 is transmitted on the radio frequency cable 202, and the energy loss is much smaller than that of the amplified signal.
  • This topology can reduce the length of the line and get it closer to the antenna 4, reduce energy loss, improve reception sensitivity, reduce power consumption, and increase the battery life of the communication equipment.
  • the transceiver module 31 and the receiving module 32 work on the same principle. By reducing the intermediate loss during transmitting and receiving, the receiving sensitivity can be effectively improved, the transmitting and receiving performance can be improved, and the call and data communication effects are better.
  • the second flexible circuit board 2 is embedded with one or more of a capacitor 22 , a resistor 21 , and an inductor 23 .
  • a capacitor 22 , a resistor 21 and an inductor 23 are simultaneously embedded in the second flexible circuit board 2 .
  • the second flexible circuit board 2 is provided with a receiving cavity and a glue injection hole connected with the receiving cavity for injecting glue into the receiving cavity.
  • the opening of the receiving cavity faces the first flexible circuit board 1.
  • the radio frequency front-end chip 3 is received in the receiving cavity.
  • glue is injected into the receiving cavity through the glue injection hole to achieve the effect of encapsulating the radio frequency front-end chip 3 .
  • the first flexible circuit board 1 and the second flexible circuit board 2 are electrically connected through ball mounting 12 . That is, interconnection ports are provided on the first flexible circuit board 1 and the second flexible circuit board 2 to realize electrical connection between the first flexible circuit board 1 and the second flexible circuit board 2 .
  • the production method of the antenna module 100 of the present invention includes the following steps:
  • S0 Design the antenna 4 and the radio frequency front-end chip 3 according to the product requirements, and conduct simulation according to the parameters of the antenna 4 and the radio frequency front-end chip 3 to determine the topology and matching.
  • step S1 Provide a first flexible circuit board 1, fix the antenna 4 on the first flexible circuit board 1, provide a second flexible circuit board 2, open a receiving cavity on the second flexible circuit board 2 and connect it with The receiving cavity is connected with a glue injection hole for injecting glue into the receiving cavity.
  • the second flexible circuit board 2 provided in step S1 is embedded with one or more of the capacitor 22, the resistor 21, and the inductor 23, and is produced using a lamination process.
  • the second flexible circuit board 2 contains electromagnetic shielding.
  • the method of burying the resistor 21 is as follows: embedding the resistor 21 material into the second flexible circuit board 2 and thinning the corresponding dielectric material layer of the flexible circuit board. After the flexible circuit board is pressed together, the resistor 21 function is realized. By adjusting the resistor 21 material How many resistors of different resistance values are achieved 21.
  • the method of embedding the capacitor 22 is as follows: using the metal of adjacent layers of the second flexible circuit board 2 and the medium in between to realize the function of the capacitor 22 , and adjusting the capacitance value of the capacitor 22 by controlling the size of the metal area, the thickness and characteristics of the medium.
  • the method of burying the inductor 23 is as follows: on the metal layer of the second flexible circuit board 2, threaded metal wires are made, and functions of different inductor 23 values are realized by adjusting the length of the metal wires, spacing of the metal wires and other parameters.
  • the resistor 21 , the capacitor 22 and the inductor 23 are all buried in the middle layer of the second flexible circuit board 2 .
  • the RF front-end chip 3 is embedded in the first flexible circuit board 1 and the second flexible circuit board 2 using a bare chip flip-chip method and a resistor-capacitor inductor, so that the thickness of the antenna module 100 can be reduced.
  • the production method of the antenna module 100 of the present invention can effectively reduce the area and height of the antenna module 100 and save more space in communication equipment.
  • the antenna module 100 and the production method of the antenna module 100 of the present invention can improve the reception sensitivity of the antenna 4, reduce power consumption, and extend the battery life; compared with the current design, it can save 15% of the area, save one layer of substrate, and reduce With a metal shield, the height of the RF front-end circuit can be reduced by about 0.5mm.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
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Abstract

本发明提供了一种天线模组，所述天线模组包括第一柔性电路板、与所述第一柔性电路板电性连接的第二柔性电路板、焊接在所述第二柔性电路板内的射频前端芯片、天线，所述天线固定在所述第一柔性电路板上且与所述射频前端芯片电性连接，所述第一柔性电路板靠近所述第二柔性电路板的一侧设有焊盘，所述射频前端芯片以裸芯片倒装方式焊接在所述焊盘上。本发明的天线模组，可以提高天线接收的灵敏度，降低功耗，提升电池的续航时间；相比目前设计可节约15％面积，节约一层基板，减少金属屏蔽罩，射频前端电路的高度可降低约0.5mm。

Description

天线模组及天线模组的生产方法 技术领域
本发明涉及一种天线模组及天线模组的生产方法。
背景技术
内置天线是智能手机较为关键的硬件之一，通话、上网、蓝牙传输、GPS定位等功能都要通过天线来实现。当手机变得越来越小巧、轻薄时，对天线的体积与信号发射接收能力也提出了更多要求。袁涛博士在多篇论文中对天线的结构进行改进，如Zhang,X.,Tan,T.Y.,Wu,Q.S.,Zhu,L.,Zhong,S.,&Yuan,T.(2021).Pin-loaded patch antenna fed with a dual-mode SIW resonator for bandwidth enhancement and stable high gain.IEEE Antennas and Wireless Propagation Letters,20(2),279-283.、Huang,G.L.,Sim,C.Y.D.,Liang,S.Y.,Liao,W.S.,&Yuan,T.(2018).Low-profile flexible UHF RFID tag design for wristbands applications.Wireless Communications and Mobile Computing,2018.、Li,G.X.,Zhang,X.,Hong,K.D.,Zhu,L.,&Yuan,T.(2020,December).Differentially-Fed Circular Patch Antenna under Dual High-order Modes for Enhanced Bandwidth and Stable High Gain.In 2020 IEEE Asia-Pacific Microwave Conference(APMC)(pp.66-68).IEEE.、Han,C.Z.,Huang,G.L.,Yuan,T.,&Hong,W.(2018).A frequency-reconfigurable tuner-loaded coupled-fed frame-antenna for all-metal-shell handsets.IEEE Access,6,64041-64049.、Huang,G.L.,Zhou,S.G.,Chio,T.H.,&Yuan,T.(2017).Lightweight perforated waveguide structure  realized by 3-D printing for RF applications.IEEE Transactions on Antennas and Propagation,65(8),3897-3904.。
随着频段增加、MIMO及CA的广泛使用，5G手机的射频前端+天线的部件数量增加/复杂度大大提升，而极致的外观和大容量电池需求进一步压缩射频前端和天线空间。小尺寸和高性能的迫切需求，不断牵引着天线和射频前端朝着模组化方向发展。
有鉴于此，有必要对现有的天线模组予以改进，以解决上述问题。
发明内容
本发明的目的在于提供一种天线模组，以解决现有技术中射频前端和天线空间占用较大的问题。
为实现上述目的，本发明提供一种天线模组，所述天线模组包括第一柔性电路板、与所述第一柔性电路板电性连接的第二柔性电路板、焊接在所述第二柔性电路板内的射频前端芯片、天线，所述天线固定在所述第一柔性电路板上且与所述射频前端芯片电性连接，所述第一柔性电路板靠近所述第二柔性电路板的一侧设有焊盘，所述射频前端芯片以裸芯片倒装方式焊接在所述焊盘上。
作为本发明的进一步改进，所述第一柔性电路板和所述第二柔性电路板为FPC电路板或者LCP电路板。
作为本发明的进一步改进，所述第一柔性电路板和所述第二柔性电路板通过植球方式电性连接。
作为本发明的进一步改进，所述第二柔性电路板内埋设有电容、电阻、电感中的其中一种或者多种。
作为本发明的进一步改进，所述第二柔性电路板内开设有收容腔及 与所述收容腔连通用以向所述收容腔内注胶的注胶孔，所述射频前端芯片收容在所述收容腔内。
作为本发明的进一步改进，天线形式为环形天线、单极子天线、IFA天线、PIFA天线、MIMO天线、阵列天线中的一种。
作为本发明的进一步改进，所述射频前端芯片包括收发模组，所述收发模组包括与所述天线电性连接的第一天线调谐芯片、与所述天线电性连接的第一射频开关、与所述第一射频开关电性连接的双工器、与所述双工器电性连接的功放和第一低噪放大器。
作为本发明的进一步改进，所述射频前端芯片包括接收模组，所述接收模组包括与所述天线电性连接的第二天线调谐芯片、与所述天线电性连接的第二射频开关、与所述第二射频开关电性连接的滤波器、与所述滤波器电性连接的第二低噪放大器。
本发明还提供一种用以形成如上述的天线模组的生产方法，包括如下步骤：
S1：提供第一柔性电路板，将所述天线固定在所述第一柔性电路板上，提供第二柔性电路板，在所述第二柔性电路板上开设收容腔及与所述收容腔连通用以向所述收容腔内注胶的注胶孔；
S2：将射频前端芯片以裸芯片倒装方式焊接在所述第一柔性电路板芯片上；
S3：将所述第一柔性电路板和所述第二柔性电路板通过植球方式电性连接，所述射频前端芯片收容在所述收容腔内；
S4：通过所述注胶孔向所述收容腔内注入树脂。
作为本发明的进一步改进，步骤S1中提供的第二柔性电路板内埋设有电容、电阻、电感中的其中一种或者多种，且采用层压工艺生产获得。
作为本发明的进一步改进，在步骤S1前还包括步骤S0：根据产品需求，设计天线和射频前端芯片，并根据天线和射频前端芯片的参数进行仿真。
本发明的有益效果是：本发明的天线模组，可以提高天线接收的灵敏度，降低功耗，提升电池的续航时间；相比目前设计可节约15％面积，节约一层基板，减少金属屏蔽罩，射频前端电路的高度可降低约0.5mm。
附图说明
图1是本发明的天线模组的结构示意图；
图2是本发明的天线模组的射频前端芯片和天线结构示意图；
图3是本发明的天线模组的生产方法的流程图。
具体实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位 构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。此外，下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
如图1至图2所示，本发明提供一种天线模组100，用在通讯设备内，与所述通讯设备内的主板200上收发芯片201通过射频线缆202连接，所述天线模组100包括第一柔性电路板1、与所述第一柔性电路板1电性连接的第二柔性电路板2、焊接在所述第二柔性电路板2内的射频前端芯片3、天线4。
所述第一柔性电路板1和所述第二柔性电路板2用以埋置线路和元器件。所述第一柔性电路板1和所述第二柔性电路板2为FPC电路板或者LCP电路板。选用LCP线路板时，介电常数小，对高频电流的损耗小；选用FPC线路板时，成本较低。
所述第一柔性电路板1的一侧设有焊盘11，天线4固定在另一侧。设有焊盘11的一侧朝向所述第二柔性电路板2，且所述射频前端芯片3以裸芯片倒装方式焊接在所述焊盘11上。
所述射频前端芯片3以裸芯片形式固定，从而仅仅需要一次封装， 降低所述天线模组100的厚度及尺寸，并且相对两次封装性能更好。
本实施例中，所述射频前端芯片3包括收发模组31，所述收发模组31包括与所述天线4电性连接的第一天线调谐芯片311、与所述天线4电性连接的第一射频开关312、与所述第一射频开关312电性连接的双工器313、与所述双工器313电性连接的功放314和第一低噪放大器315。
在其他实施例中，所述射频前端芯片3还包括接收模组32，所述接收模组32包括与所述天线4电性连接的第二天线调谐芯片321、与所述天线4电性连接的第二射频开关322、与所述第二射频开关322电性连接的滤波器323、与所述滤波器323电性连接的第二低噪放大器324。
天线4为环形天线、单极子天线、IFA天线、PIFA天线、MIMO天线、阵列天线中的一种。所述天线4用于无线信号的接收与辐射。射频发射前端芯片3传送过来的信号通过天线4辐射出去；空间的无线信号经过天线4接收后传输到射频接收前端芯片3。
所述第一天线调谐芯片311和所述第二天线调谐芯片321用于天线4性能优化，处于天线4与射频前端芯片之间。通过切换不同的状态，使天线4的性能达到最优。
第一射频开关312和第二射频开关322用于射频信号的选择，一般处于射频前端芯片与第一调谐芯片311或者天线4/第二调谐芯片311或者天线4之间。根据工作频率的需求，选择对应的信号。
所述双工器313处于第一射频开关312与功放314之间，用于接收/发射信号的滤波，以及收发信号的隔离。
所述滤波器323处于第二射频开关322与第二低噪声放大器324之 间，用于接收信号的滤波。
所述功放314与双工器313电性连接，用于发射信号的放大。
对于收发模组31，将双工器313或者功放314集成到天线模组100内，从而天线4接收到信号通过第一射频开关312根据接收信号的频道选择对应的双工器313或者第一低噪放大器315通路，弱信号经过第一低噪放大器315放大后再进入射频线缆202传输到通讯设备的收发芯片201，从而有效的提升接收的灵敏度。而非天线4的信号直接经过射频线缆202而造成功率损耗。所述第一天线调谐芯片311用以与天线4电性连接以提高所述天线4的性能。
收发芯片201输出的发射小信号在射频线缆202上传输，能量损耗比放大后的信号小很多。这种拓扑结构能够减少线的长度，离天线4更近，降低能量损耗，提升接收灵敏度，降低功耗，提升通讯设备的电池的续航时间。
收发模组31和接收模组32工作原理相同，通过降低发射、接收时中间损耗，可以有效的提升接收的灵敏度，并且可以提高发射和接收性能，通话、数据通信效果更好。
所述第二柔性电路板2内埋设有电容22、电阻21、电感23中的其中一种或者多种。本实施例中，所述第二柔性电路板2内同时埋设电容22、电阻21和电感23。
所述第二柔性电路板2内开设有收容腔及与所述收容腔连通用以向所述收容腔内注胶的注胶孔。
所述收容腔的开口朝向所述第一柔性电路板1，当所述第二柔性电 路板2与所述第一柔性电路板1连接时，所述射频前端芯片3收容在所述收容腔内。然后通过注胶孔向所述收容腔内注胶，即可实现对所述射频前端芯片3封装的效果。
所述第一柔性电路板1和所述第二柔性电路板2通过植球12方式电性连接。即在所述第一柔性电路板1和所述第二柔性电路板2上设置互联端口，实现所述第一柔性电路板1和所述第二柔性电路板2的电性连接。
本发明的天线模组100的生产方法，包括如下步骤：
S0：根据产品需求，设计天线4和射频前端芯片3，并根据天线4和射频前端芯片3的参数进行仿真，确定拓扑结构及匹配。
S1：提供第一柔性电路板1，将所述天线4固定在所述第一柔性电路板1上，提供第二柔性电路板2，在所述第二柔性电路板2上开设收容腔及与所述收容腔连通用以向所述收容腔内注胶的注胶孔。步骤S1中提供的第二柔性电路板2内埋设有电容22、电阻21、电感23中的其中一种或者多种，且采用层压工艺生产获得，第二柔性电路板2中包含电磁屏蔽。
埋设电阻21方式如下：将电阻21材料嵌入到第二柔性电路板2中，并对相应的柔性电路板介质材层进行减薄，柔性电路板压合后实现电阻21功能，通过调整电阻21材料的多少实现不同阻值的电阻21。
埋设电容22方式如下：利用第二柔性电路板2相邻层的金属及其中间的介质实现电容22功能，通过控制金属面积的大小、介质厚度及特性调整电容22的容值。
埋设电感23方式如下：在第二柔性电路板2的金属层上，制作出螺纹装金属线，通过调整金属线的长度、金属线间隔等参数实现不同电感23值的功能。
本实施例中，所述电阻21、电容22和电感23均埋设在所述第二柔性电路板2的中间层。
S2：将射频前端芯片3以裸芯片倒装方式焊接在所述第一柔性电路板1芯片上。
将射频前端芯片3以裸芯片倒装方式及阻容感埋置在第一柔性电路板1及第二柔性电路板2里，可以降低天线模组100的厚度。
S3：将所述第一柔性电路板1和所述第二柔性电路板2通过植球12方式电性连接，所述射频前端芯片3收容在所述收容腔内。
S4：通过所述注胶孔向所述收容腔内注入树脂。
采用本发明的天线模组100的生产方法可以有效降低所述天线模组100的面积和高度，可以给通讯设备内节省更多的空间。
本发明的天线模组100及天线模组100的生产方法，可以提高天线4接收的灵敏度，降低功耗，提升电池的续航时间；相比目前设计可节约15％面积，节约一层基板，减少金属屏蔽罩，射频前端电路的高度可降低约0.5mm。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (11)

  1. 一种天线模组，其特征在于：所述天线模组包括第一柔性电路板、与所述第一柔性电路板电性连接的第二柔性电路板、焊接在所述第二柔性电路板内的射频前端芯片、天线，所述天线固定在所述第一柔性电路板上且与所述射频前端芯片电性连接，所述第一柔性电路板靠近所述第二柔性电路板的一侧设有焊盘，所述射频前端芯片以裸芯片倒装方式焊接在所述焊盘上。
  2. 根据权利要求1所述的天线模组，其特征在于：所述第一柔性电路板和所述第二柔性电路板为FPC电路板或者LCP电路板。
  3. 根据权利要求1所述的天线模组，其特征在于：所述第一柔性电路板和所述第二柔性电路板通过植球方式电性连接。
  4. 根据权利要求1所述的天线模组，其特征在于：所述第二柔性电路板内埋设有电容、电阻、电感中的其中一种或者多种。
  5. 根据权利要求1所述的天线模组，其特征在于：所述第二柔性电路板内开设有收容腔及与所述收容腔连通用以向所述收容腔内注胶的注胶孔，所述射频前端芯片收容在所述收容腔内。
  6. 根据权利要求1所述的天线模组，其特征在于：天线形式为环形天线、单极子天线、IFA天线、PIFA天线、MIMO天线、阵列天线中的一种。
  7. 根据权利要求1所述的天线模组，其特征在于：所述射频前端芯片包括收发模组，所述收发模组包括与所述天线电性连接的第一天线调谐芯片、与所述天线电性连接的第一射频开关、与所述第一射频开关电性连接的双工器、与所述双工器电性连接的功放和第一低噪放大器。
  8. 根据权利要求7所述的天线模组，其特征在于：所述射频前端芯片包括接收模组，所述接收模组包括与所述天线电性连接的第二天线调谐芯片、与所述天线电性连接的第二射频开关、与所述第二射频开关电性连接的滤波器、与所述滤波器电性连接的第二低噪放大器。
  9. 一种用以形成如权利要求1-8任意一项所述的天线模组的生产方法，其特征在于：包括如下步骤：
    S1：提供第一柔性电路板，将所述天线固定在所述第一柔性电路板上，提供第二柔性电路板，在所述第二柔性电路板上开设收容腔及与所述收容腔连通用以向所述收容腔内注胶的注胶孔；
    S2：将射频前端芯片以裸芯片倒装方式焊接在所述第一柔性电路板芯片上；
    S3：将所述第一柔性电路板和所述第二柔性电路板通过植球方式电性连接，所述射频前端芯片收容在所述收容腔内；
    S4：通过所述注胶孔向所述收容腔内注入树脂。
  10. 根据权利要求9所述的天线模组的生产方法，其特征在于：步骤S1中提供的第二柔性电路板内埋设有电容、电阻、电感中的其中一种或者多种，且采用层压工艺生产获得。
  11. 根据权利要求9所述的天线模组的生产方法，其特征在于：在步骤S1前还包括步骤S0：根据产品需求，设计天线和射频前端芯片，并根据天线和射频前端芯片的参数进行仿真。
PCT/CN2022/093827 2022-05-03 2022-05-19 天线模组及天线模组的生产方法 WO2023212985A1 (zh)

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