WO2023211414A2 - A high thermal conductor nano hybrid composite material for thermal interface applications and a production method thereof - Google Patents
A high thermal conductor nano hybrid composite material for thermal interface applications and a production method thereof Download PDFInfo
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- WO2023211414A2 WO2023211414A2 PCT/TR2023/050382 TR2023050382W WO2023211414A2 WO 2023211414 A2 WO2023211414 A2 WO 2023211414A2 TR 2023050382 W TR2023050382 W TR 2023050382W WO 2023211414 A2 WO2023211414 A2 WO 2023211414A2
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- Prior art keywords
- composite material
- hybrid composite
- thermally conductive
- highly thermally
- production method
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- 239000002131 composite material Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000002470 thermal conductor Substances 0.000 title description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims abstract description 51
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 34
- 229910017083 AlN Inorganic materials 0.000 claims abstract description 32
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 16
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 13
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 claims description 8
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 2
- 229920006362 Teflon® Polymers 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 27
- 238000001816 cooling Methods 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000011149 active material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
- C09D129/02—Homopolymers or copolymers of unsaturated alcohols
- C09D129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/168—After-treatment
- C01B32/174—Derivatisation; Solubilisation; Dispersion in solvents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a nano-hybrid composite material comprising aluminium nitride and carbon nanotube developed for thermal interface materials that remove heat from the system in electronic structures and the production method thereof.
Description
A HIGH THERMAL CONDUCTOR NANO HYBRID COMPOSITE MATERIAL FOR THERMAL INTERFACE APPLICATIONS AND A PRODUCTION METHOD THEREOF
Technical field of the invention
The invention relates to the thermal interface material produced to remove the heat from the system in electronic structures.
In particular, the invention relates to the production method of nano-hybrid composite material containing aluminium nitride and carbon nanotube as thermal interface material.
State of the Art
The heat generated when mechanical or electronic devices work affects the performance of the devices by affecting the working principles. Heat sink materials used to regulate the temperature of the device and to remove excess heat are passive heat exchangers that dissipate the heat generated by the device away from the device to another environment, usually.
Heat dissipation is important for long-term work and performance of electronic devices and circuits. In general, the temperature of the device or component depends on the component, the environment, the thermal resistance and the heat dissipated by the component. When designing electronic devices or circuits, an efficient heat transfer path is created from the device to the environment to prevent the component from overheating. This heat transfer path created varies according to the method of mounting the heat sink to a component, the material used between the surfaces in contact and thermal contact resistance. There will be a heat transfer across the interface from high temperature to low temperature between two objects in contact with each other. Micro/nano cracks and porosities on the contact surface increase thermal resistance and make heat transfer difficult.
This temperature variation, known as thermal contact resistance, is reduced by using thermal interface materials. The thermal interface material, TIM, is any material placed between two components in order to increase thermal coupling between them. The TIM is placed between a heat generating device and a heat dissipating part. Thus, it transfers the heat it receives from the heat generating device to the heat dissipating part. For this reason, the materials used as TIM should have high thermal conductivity.
Various thermal interface materials are used in electronic systems today. Thermal pastes are TIM materials that are generally used in the electronics industry, providing only thermal resistance without mechanical strength. Unlike thermal pastes, thermal adhesives provide mechanical strength as well as thermal resistance due to the need for curing. The thermal gap filler is the cured form of thermal pastes, but this TIM has a variety of limited adhesive properties. Although thermal conductive pads, which are in solid and soft form, are easy to apply, they require higher force application to hold on between surfaces. Thermal tapes are an enhanced version of the adhesive properties of thermal conductive pads. Thermal tapes that do not require curing time can be applied more easily than thermal conductive tapes. Phase-change materials, on the other hand, have low melting temperatures. Thus, it can pass from the solid form to the liquid phase and fill the gaps at the interface. Metal thermal interface materials have significantly higher thermal conductivity as well as the lowest thermal interface resistance.
Patent document no “TR2021016332” in the state of the art is reviewed. The abstract part of the invention that is the subject of the application reads “The invention relates to BN/AI2O3/CMC hybrid composite thermal interface material with high thermal conductivity and high strength, compatible with plate surfaces, and improved surface adhesion to fill micro-voids, for the cooling plates produced by using the slag formed in the casting of 6000 series Aluminium alloys to produce the cooling material.”
Patent document no “TR202010152” in the state of the art is reviewed. The abstract part of the invention that is the subject of the application reads “This invention relates to a device for material characterization in printed circuit boards, testing of thermal interface parts under vacuum and/or variable contact pressures, and examination of functional electronic boards under vacuum and variable thermal loads.”
Patent document no “TW201017692A” in the state of the art is reviewed. In the invention that is the subject of the application, the production method of a polymer matrix material containing 90-40% polymer and 10-60% surface modified particles and a thermal conductivity higher than 3 W/mK is mentioned.
Patent document no “KR2052386B1” in the state of the art is reviewed. In the invention that is the subject of the application, a heat-emitting paint is used to spread the heat on the hot surface homogeneously on the surface, where various nanoparticles are added in order to increase the thermal conductivity into the polyurethane resin is mentioned.
Patent document no “EP3227399B1” in the state of the art is reviewed. In the invention that is the subject of the application, a thermal interface material containing at least one phase change material, at least one polymer matrix material and a heat- conducting filler material with one large and one small particle size is mentioned.
The aim of the invention
The most important aim of the invention is to ensure that the material used as a thermal interface can be used throughout the life of the device. The nano-hybrid composite material developed within the scope of the invention provides thermal conductivity throughout the life of the device since it does not lose its thermal conductivity with its stable structure and its ability to fill micro cracks or porosities at the interface.
Another aim of the invention is to provide a superior heat conduction than the existing products used as thermal interface material in the market. Thus, the time required for cooling the device to which it is applied is shortened.
Another aim of the invention is to extend the life of the device to which it is applied, since it can cool the device to which it is applied in a short time and ensures the stability of the part without being affected by the heat on the device.
Another aim of the invention is to ensure that the carbon nanotubes are dispersed homogeneously without clumping.
Another aim of the invention is to eliminate the inter-repellency of aluminium nitride and carbon nanotubes due to the surface charges by means of the used surface active material. Thus, aluminium nitride and carbon nanotubes can be mixed homogeneously.
Description of drawings:
FIGURE 1; is the drawing that gives the use of the subject of the invention in the cooling system.
FIGURE-2; is the drawing that gives a representative view of the interior structure of the cross-sectional surface representation of the coating that is the subject of the invention.
FIGURE-3; is the drawing that gives a scanning electron microscope image taken from the cross-sectional surface of the coating that is the subject of the invention.
FIGURE-4; is the drawing that gives a scanning electron microscope image taken from the upper surface of the coating that is the subject of the invention.
Reference numbers:
100. Thermal Interface Material
110. AIN
120. CNT
200. Chip
300. Base
400. Chip Package
500. Heat Sink Block
A. Heat Direction
Description of the invention
The invention comprises the production method for using nano-hybrid composite material containing aluminium nitride (AIN) (110), and carbon nanotube (CNT) (120) as thermal interface material (100).
Aluminium nitride, AIN (110), which has an insulating property, has high thermal conductivity. The carbon nanotube, CNT (120), is a two-dimensional carbon structure wound in the form of a hexagonal cylinder formed by the combining of the carbon element thereto. CNTs (120) are filling materials that increase thermal conductivity due to their unique properties. CNTs (120) have high thermal conductivity and thermal stability.
Although AIN (110) and CNT (120) have high thermal conductivity, some problems emerge when these are used together. First of all, CNTs (120) have a large surface area, so they create problems such as clumping or not being homogeneously dispersed in the compound during an application to CNT (120). Also, the zeta potentials of AIN (110) and CNT (120) are negative. For this reason, in cases where two materials are desired to be mixed, negative surface charges make it difficult to obtain a homogeneous mixture because they repel each other. To eliminate this problem, it is necessary to use surface active materials. Within the scope of the invention, tetraethyl orthosilicate (TEOS) or trimethylsilyl chloride (TMCS) surfactants are used to control the surface charge.
Production method of nano-hybrid composite coating containing AIN (110) and CNT (120) comprises the process steps of: a) Mixing of 0.005% to 0.01 % by weight CNT (120) with 10 ml of ethanol, propanol or methanol in a magnetic stirrer using a Teflon-coated magnet at 250-450 rpm for 30 minutes at room temperature, b) Adding 0.5-1 .5 ml of tetraethyl orthosilicate (TEOS) or trimethylsilyl chloride (TMCS) dropwise during the mixing process, c) Obtaining a stable CNT (120) solution by ultrasonically mixing the mixture for 30 minutes,
d) Addition of 0.5-1.5% by weight of polyvinyl alcohol (PVA) into 100 ml of ethanol, propanol or methanol, e) Obtaining the PVA mixture by mixing in a magnetic stirrer using a Teflon- coated magnet at 250-450 rpm for 30 minutes at room temperature, f) Transferring the PVA mixture into the axial mill container, g) Adding balls to the axial mill container such that they cover 1/3 of the container, h) Adding 1-10% AIN (110) powder by weight of the mixture to the mill, i) Obtaining AIN (110) mixture by grinding in an axial mill at 350 rpm for 1 hour, j) Adding the stable CNT (120) solution to the mixture containing PVA and AIN in the mill chamber, k) Mixing the entire mixture in the axial mill bowl for 1 hour, and l) Performing the coating with the prepared solution.
During these process steps, preferably 10 ml of propanol and 1 ml of TMCS are used in the preparation of the CNT solution. Preferably, 1 % PVA and propanol are used to obtain the PVA mixture, while 5% AIN (110) powder is preferably used to obtain the AIN (110) mixture.
In the production method of AIN (110) and CNT (120) nano-hybrid composite coating, the coating process step is coating the solution obtained on the surface where the thermal conductivity is desired to be increased. This coating process can be carried out by any of the methods of dip coating, spraying or electrospray coating. Preferably, the electrospray coating method is used. The process comprises the process step of:
• Coating in the range of 0.02-0.05 ml/min flow rate,
• Using 5-15 cm surface-nozzle distance,
• At 3-10 kV voltage range,
• Within 5-30 minutes.
During these steps, the coating process is preferably applied for 10-20 minutes using a flow rate of 0.03 ml/min, a distance of 10 cm from the surface to the nozzle, and a voltage of 6kV. As a result of this process, 10-100 pm thick nano-hybrid composite
coating is obtained. The thermal dissipation value of this coating is in the range of 35- 50 mm2/second.
The use of AIN (110) and CNT (120) nano-hybrid composite coating in the cooling system is shown in Figure-1 . Accordingly, the composite thermal interface material (100) produced from AIN (110) and CNT (120) is coated on the chip (200) placed on the board, which is used as a base (300). The task of the thermal interface material in this region is to rapidly remove the heat released in the chip from the chip and transmit it to the electrically insulating chip package (400) in a sandwich structure. A composite thermal interface material produced from AIN (110) and CNT (120) is coated on the chip package (400) layer. The heat sink block (500), which removes the heat from the system, is placed on this second thermal interface coating. Thus, a cooling system structure consisting of different layers is obtained, preventing the heating of the chip (200) structure by removing the heat from it which is heated as a result of electronic processes. The heat direction (A) shown in Figure-1 shows the conduction direction of the thermal interface material (100) to remove heat. The heat direction (A) is always made from the hot part to the cold part.
The schematic representation of the internal structure of the nano-hybrid composite coating comprising AIN (110) and CNT (120) is shown in Figure-2. The internal structure of the coating, which is formed by the homogeneous distribution of CNTs (120) surrounding the AIN (110) particles, is shown as a representation.
In Figure-3 and Figure-4, the microstructure of the nano-hybrid composite coating comprising AIN (110) and CNT (120) is shown from the cross-sectional surface and the upper surface, respectively, under the scanning electron microscope.
Claims
1. A highly thermally conductive nano-hybrid composite material, comprising aluminium nitride (AIN) (110), and carbon nanotube (CNT) (120), which are homogeneously dispersed in each other and form a nano-hybrid composite material.
2. Highly thermally conductive nano-hybrid composite material according to Claim 1 , comprising CNT (120) surrounding AIN (110) particles.
3. Highly thermally conductive nano-hybrid composite material according to Claim 1 , comprising AIN (110) with a particle size of 0.3-3 pm.
4. Highly thermally conductive nano-hybrid composite material according to Claim 1 , wherein it is a nano-hybrid composite material with a thermal dissipation value of 35-50 mm2/s
5. Production method of highly thermally conductive nano-hybrid composite material, comprising the process steps of: a) Mixing of 0.005% to 0.01 % by weight CNT (120) with 10 ml of ethanol, propanol or methanol in a magnetic stirrer using a Teflon-coated magnet at 250-450 rpm for 30 minutes at room temperature, b) Adding 0.5-1.5 ml of tetraethyl orthosilicate (TEOS) or trimethylsilyl chloride (TMCS) dropwise during the mixing process, c) Obtaining a stable CNT (120) solution by ultrasonically mixing the mixture for 30 minutes, d) Addition of 0.5-1.5% by weight of polyvinyl alcohol (PVA) into 100 ml of ethanol, propanol or methanol, e) Obtaining the PVA mixture by mixing in a magnetic stirrer using a Teflon- coated magnet at 250-450 rpm for 30 minutes at room temperature, f) Transferring the PVA mixture into the axial mill container, g) Adding balls to the axial mill container such that they cover 1/3 of the container, h) Adding 1 -10% AIN (110) powder by weight of the mixture to the mill, i) Obtaining AIN (110) mixture by grinding in an axial mill at 350 rpm for 1 hour,
j) Adding the stable CNT (120) solution to the mixture containing PVA and AIN in the mill chamber, k) Mixing the entire mixture in the axial mill bowl for 1 hour, and l) Performing the coating with the prepared solution.
6. Production method of highly thermally conductive nano-hybrid composite material according to Claim 5, wherein the coating methods applied in the coating process step are dip coating, spraying or electrospray.
7. Production method of highly thermally conductive nano-hybrid composite material according to Claim 6, wherein the electrospray coating method comprises the process step of:
• Coating in the range of 0.02-0.05 ml/min flow rate,
• Using 5-15 cm surface-nozzle distance,
• At 3-10 kV voltage range,
• Within 5-30 minutes.
8. Production method of highly thermally conductive nano-hybrid composite material according to Claim 5, wherein 10 ml of propanol and 1 ml of TMCS are used.
9. Production method of highly thermally conductive nano-hybrid composite material according to Claim 5, wherein 100 ml of propanol and 5% AIN (110) powder is used with 1 % PVA.
10. Production method of highly thermally conductive nano-hybrid composite material according to Claim 7, wherein 0.03 ml/min flow rate, 10 cm surface-to- nozzle distance and 6 kV voltage are used.
11. Production method of highly thermally conductive nano-hybrid composite material according to Claim 7, wherein the coating process is applied for 10-20 minutes.
12. Production method of highly thermally conductive nano-hybrid composite material according to Claim 7, wherein 10-100 pm thick nano-hybrid composite coating is performed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TR2022006809 | 2022-04-26 | ||
| TR2022/006809 TR2022006809A1 (en) | 2022-04-26 | A highly thermally conductive nanohybrid composite material for thermal interface applications and a method for its production. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2023211414A2 true WO2023211414A2 (en) | 2023-11-02 |
| WO2023211414A3 WO2023211414A3 (en) | 2024-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/TR2023/050382 WO2023211414A2 (en) | 2022-04-26 | 2023-04-24 | A high thermal conductor nano hybrid composite material for thermal interface applications and a production method thereof |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009227845A (en) * | 2008-03-24 | 2009-10-08 | Toyota Central R&D Labs Inc | Carbon nanocomposite, dispersion liquid and resin composition containing the same, and method for producing the carbon nanocomposite |
| WO2015084945A1 (en) * | 2013-12-04 | 2015-06-11 | Cornell University | Electrospun composite nanofiber comprising graphene nanoribbon or graphene oxide nanoribbon, methods for producing same, and applications of same |
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