WO2023210126A1

WO2023210126A1 - Mounting machine

Info

Publication number: WO2023210126A1
Application number: PCT/JP2023/005912
Authority: WO
Inventors: 悟柴田
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2022-04-28
Filing date: 2023-02-20
Publication date: 2023-11-02

Abstract

The mounting machine according to the present invention comprises: a head that has a suction nozzle and that suctions up a component at the tip of the suction nozzle to mount the component on a board; a light source that emits light, a slit with a slit hole through which light passes; a sensor that has a light receiving element that receives light that has passed through the slit hole, and that irradiates the tip of the suction nozzle with the light, receives, by using the light receiving element, the light that has passed through the slit hole, and outputs the light intensity of the received light; and a control unit that determines whether a component is suctioned at the tip of the suction nozzle through which light passes on the basis of a differentiated value obtained by differentiating the light intensity of the light. The suction nozzle has a taper that tapers toward the tip, and the slit hole is arranged non-parallel to the taper.

Description

mounting machine

The present disclosure relates to a mounting machine.

Patent Document 1 discloses that a suction nozzle holding a component at its tip is positioned at a predetermined position of component mounting device information on an object to be mounted, and the suction nozzle is lowered from the predetermined position to mount the component at the component mounting position. A component mounting method is disclosed in which the component is released from being held by a suction nozzle and the suction nozzle is raised. The component mounting method is to set a measurement position at a predetermined height position on the suction nozzle's lifting path, and measure the time it takes for the component or suction nozzle to reach the measurement position from the predetermined position when the suction nozzle is lowered and/or raised. Based on the measured time, the quality of the holding and/or mounting state of the component by the suction nozzle is determined.

Japanese Patent Application Publication No. 2002-208800

The present disclosure was devised in view of the above-mentioned conventional circumstances, and aims to provide a mounting machine that more accurately acquires the suction state of components suctioned by a nozzle.

A mounting machine according to the present disclosure includes a suction nozzle, a head that suctions a component with a tip of the suction nozzle and mounts the component on a substrate, a light source that irradiates a light beam, and a slit through which the light beam passes. It has a slit having a hole and a light-receiving element that receives the light beam that has passed through the slit hole. a sensor that outputs the light intensity of the received light beam; and a sensor that differentiates the light intensity of the light beam output from the sensor to obtain a differential value, and based on the differential value, the light beam is and a control unit that determines whether or not the component is being attracted to the tip of the suction nozzle passing through. The suction nozzle has a taper that becomes thinner toward the tip, and the slit hole is arranged non-parallel to the taper.

According to the present disclosure, the suction state of a component suctioned by a nozzle can be determined with higher accuracy.

Block diagram showing an example of internal configuration of a mounting machine according to Embodiment 1 A diagram illustrating an example of a partial configuration of a mounting machine according to Embodiment 1. Enlarged view of main parts of mounting machine Diagram explaining an example of IV conversion processing A diagram illustrating an example of how the amount of diffracted light received changes depending on the arrangement of the suction nozzle and slit. A diagram illustrating a first example of relative positional relationship between the suction nozzle and the slit hole. A diagram illustrating a second example of relative positional relationship between the suction nozzle and the slit hole. A diagram illustrating a comparative example of an IV conversion graph and a differential graph based on the relative positional relationship between the suction nozzle and the slit hole. Diagram explaining the IV conversion graph of diffracted light Diagram explaining the IV conversion graph and differential graph when diffraction occurs

(Circumstances leading to this disclosure)
2. Description of the Related Art Conventionally, there is a mounting machine that uses an optical sensor to detect an electronic component (hereinafter referred to as "component") sucked at the tip of a suction nozzle to determine whether the suction state of the component is good or bad. The component mounting method and its device (hereinafter referred to as "mounter") of Patent Document 1 can detect the suction nozzle and components in a range corresponding to the component mounting position on the circuit board (hereinafter referred to as "board"). Using an optical sensor placed in the area, the passage time during descent when light is blocked by the suction nozzle and parts is calculated. In addition, the mounting machine calculates the theoretical value of the passing time when descending based on the descending speed of the suction nozzle, the thickness of the component, and the offset amount of the suction nozzle that are stored in advance. )≒(theoretical value of descending passing time), it is determined that the parts are normally suctioned.

However, in the above-described component mounting method, the theoretical value of the descending passage time is calculated using the offset amount of the suction nozzle that is stored in advance. Therefore, when the suction nozzle of the mounting machine has deteriorated due to wear or the like, the descending passage time becomes short, and the accuracy of determining the suction posture of the component may be reduced.

In addition, as another method for determining the quality of the suction state of parts using an optical sensor, the parts being transported by the suction nozzle can be detected using an optical sensor installed in the transport path of the parts from the parts supply position to the parts mounting position. There is a method to determine the adsorption state of. In the mounting machine, the light from the light source is blocked by the suction nozzle and the component that pass through the optical sensor, and the thickness of the component is calculated based on the amount of shielded light to determine the suction state of the component.

In this method, the amount of light shielding changes due to disturbances such as vibrations of the suction nozzle during transportation, so the mounting machine removes the disturbance by performing differential processing on the obtained light shielding amount, and calculates the differentially processed light shielding value. Based on this, the thickness of the parts was measured. However, because the amount of light shielding includes the diffracted light that is diffracted at the edge of the suction nozzle, it is difficult for the mounting machine to accurately measure the thickness of the component using the waveform of the amount of light shielding after differential processing. .

Here, with reference to FIGS. 9 and 10, the influence of the diffracted light on the adsorption determination of the component P0 using the optical sensor will be described. FIG. 9 is a diagram illustrating an IV conversion graph OpA of diffracted light. FIG. 10 is a diagram illustrating an IV conversion graph OpB and a differential graph DfB when diffraction occurs.

The optical sensor receives light emitted from a light source and converts the received light into an electrical signal. The optical sensor detects the tip of the suction nozzle 15Z based on the time-series changes in the differential value obtained by performing differential processing on a converted value (hereinafter referred to as "IV converted value") obtained by converting an electric signal (current) into a voltage. The thickness (height), width, posture (angle), etc. of the component P0 suctioned to the part are measured, and a determination process regarding the suction state or suction posture of the component P0 is executed.

The suction nozzle 15Z passes the light (ray) irradiated from the light source while the component P0 is suctioned at the tip. The light from the light source that is blocked by the suction nozzle 15Z and the component P0 is diffracted by the suction nozzle 15Z and the component P0, which are obstacles. The diffracted light DL1 shown in FIG. 9 is the diffracted light when the suction nozzle 15Z does not suction the component P0. Diffracted light DL1 is light that is generated along edge EG1 and whose emission intensity changes periodically. Diffracted light DL2 indicates diffracted light when diffracted by suction nozzle 15Z in a state of suctioning component P0. The diffracted light DL2 is light that is generated along the edge EG2 and whose emission intensity changes periodically.

The IV conversion graph OpA is a graph showing a time-series change in the IV conversion value of the diffracted light DL2 received by the optical sensor and moving away from the suction nozzle 15A with reference to the position EG0 of the suction nozzle 15Z. The emission intensity of the diffracted light DL2 is an attenuated wave that attenuates as it gets farther from the suction nozzle 15Z and the edge EG2 of the component P0, which are obstacles.

The IV conversion graph OpB shown in FIG. 10 is a graph showing time-series changes in the diffracted light DL2 received by the optical sensor and the IV conversion value of the light source. Note that the IV conversion graph OpB1 indicated by a broken line is a graph showing a time-series change in the IV conversion value when the component P0 is not suctioned by the suction nozzle 15Z. The IV conversion graph OpB2 shown by a solid line is a graph showing a time-series change in the IV conversion value when the component P0 is sucked in the correct posture by the suction nozzle 15Z. The IV conversion graph OpB indicated by a dashed line is a graph showing a time-series change in the IV conversion value when the component P0 is not sucked in the correct posture by the suction nozzle 15Z.

In the IV conversion graph OpB when diffraction occurs, the IV conversion values corresponding to the diffracted light DL2 of the suction nozzle 15Z appear at points Pt11 and Pt14, and the thickness of the component P0 sucked by the suction nozzle 15Z appears at points Pt12 and Pt13. (that is, the amount of light shielded by the component P0), an IV conversion value corresponding to the amount of light shielded by the component P0 appears.

The differential graph DfB is a graph showing a time-series change in the differential value of the IV conversion value obtained by differentiating the IV conversion graph OpB. Note that the differential graph DfB1 indicated by a broken line is a graph showing a time-series change in the differential value when the component P0 is not sucked by the suction nozzle 15Z. The differential graph DfB2 indicated by a solid line is a graph showing a time-series change in the differential value when the component P0 is sucked in the correct posture by the suction nozzle 15Z. The differential graph DfB3 indicated by a dashed-dotted line is a graph showing a time-series change in the differential value when the component P0 is not attracted to the suction nozzle 15Z in the correct posture.

In the differential graph DfB, peaks Pk11 and Pk14 due to the diffracted light DL2 occur at positions (times) corresponding to points Pt11 and Pt14 of the IV conversion graph OpA, respectively. Further, in the differential graph DfB, peaks Pk12 and Pk13 due to the component P0 occur at positions (times) corresponding to points Pt12 and Pt13 of the IV conversion graph OpA, respectively. As described above, when diffracted light is generated, in the differential graph DfB, peaks Pk11 and Pk14 indicating the intensity of the diffracted light LD2 are larger than peaks Pk12 and Pk13 indicating the thickness of the component P0. Therefore, it was difficult for the mounting machine to measure the thickness of the component P0 based on the peak of the differential value obtained from the differential graph DfB.

Hereinafter, embodiments specifically disclosing the configuration and operation of the mounting machine according to the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of well-known matters or redundant explanations of substantially the same configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

Furthermore, in the following figures, the X direction and the Y direction are directions perpendicular to each other within the horizontal plane. The Z direction is a height direction (vertical direction) orthogonal to the X direction and the Y direction.

(Embodiment 1)
First, the internal configuration of mounting machine 100 according to the first embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a diagram illustrating an example of the internal configuration of mounting machine 100 according to the first embodiment. FIG. 2 is a diagram illustrating a partial configuration example of the mounting machine 100 according to the first embodiment. FIG. 3 is an enlarged view of the main parts of the mounting machine 100.

Note that in the example shown in FIG. 1, the number of mounting machines connected to the management computer 21 is one, but a plurality of mounting machines may be connected at the same time. Further, in FIG. 1, illustration of the X-axis rail 10A, the Y-axis rail 10B, the component supply section 12, and the board rail 16 is omitted.

The mounting machine 100 according to the first embodiment drives each of the pair of board rails 16 to carry in the board 13. The mounting machine 100 drives the head 11 each having one or more suction nozzles 15, and causes each of the suction nozzles 15 to suction the component P (see FIG. 3) supplied by the component supply section 12. The mounting machine 100 sucks the component P with the suction nozzle 15, moves the head 11 onto the board 13, conveys the component P to the top of the board 13, and then places the component P at each component mounting position on the board 13. Implement. The mounting machine 100 produces a mounted board by mounting (installing) all the components P to be mounted on the board 13, and then drives each of the pair of board rails 16 to carry out the produced mounted board. do.

The mounting machine 100 includes a head 11, a component supply section 12, a measurement system 14, one or more suction nozzles 15, a pair of board rails 16, a processor 17, a memory 18, and an output section 19. Consists of. Note that the communication unit 20 is not an essential component and may be omitted. Moreover, when the mounting machine 100 is configured to include the communication unit 20, it may be communicably connected to the management computer 21 (that is, an external device) and may be capable of transmitting and receiving data.

Each of the pair of X-axis rails 10A is coupled to the Y-axis rail 10B, and supports the Y-axis rail 10B so as to be movable in the X direction and the −X direction. The Y-axis rail 10B is connected to the head 11 and supports the head 11 so as to be movable in the Y direction and the -Y direction. Each of the pair of X-axis rails 10A and the Y-axis rail 10B constitute a moving mechanism that moves the head 11.

The head 11 is controlled by a movement mechanism and is driven (moved) in each of the X-axis direction, Y-axis direction, and Z-axis direction. The head 11 is coupled to the Y-axis rail 10B and transports the component P between the component supply section 12 and a predetermined component mounting position on the board 13.

The head 11 includes one or more suction nozzles 15. The suction nozzle 15 is raised and lowered by the processor 17 in the direction along the Z-axis direction (elevating direction) between the conveyance height of the component P and the mounting height of the component P onto the board 13 . In the head 11, the processor 17 causes each of the suction nozzles 15 to suck the component P, and to release the suction. The head 11 adsorbs the component P supplied by the component supply unit 12 with the tip of the suction nozzle 15, transports it to a predetermined component mounting position on the board 13, and then releases the adsorption of the component P to place the component P on the board 13. Implement on top.

Here, after the head 11 sucks the component P, the component P sucked to the tip of the suction nozzle 15 is placed between the component supply section 12 and the substrate 13, and the light beam irradiated from the light source 14A Move to pass 14B. Thereby, the mounting machine 100 measures the thickness of the component P sucked at the tip of each suction nozzle 15 based on the amount of light 14B blocked (that is, the amount of variation in the amount of received light), and Determine the condition.

The component supply unit 12 is controlled by the processor 17 and supplies components P to be mounted on the board 13. Note that the component supply unit 12 may be able to simultaneously supply a plurality of different types of components P. Further, the arrangement of the component supply section 12 shown in FIG. 2 is an example, and the arrangement is not limited thereto.

The measurement system 14 as an example of a sensor includes a light source 14A, a slit 14C, a photoelectric conversion element 14D, and a current-voltage conversion section 14E. The slit 14C has a slit hole 141C and is arranged on the surface facing the light source 14A. Note that the arrangement positions of the measurement system 14 shown in each of FIGS. 1 to 3 are merely examples, and the present invention is not limited thereto.

The photoelectric conversion element 14D, which is an example of a light receiving element, converts light (ray 14B) emitted from a light source 14A such as an LED (Light Emitting Diode) or an LD (Laser Diode) and passed through the slit hole 141C of the slit 14C into electricity. The signal is converted into a signal and output to the current-voltage converter 14E. The current-voltage converter 14E converts the electric signal (current) output from the photoelectric conversion element 14D into a voltage and outputs a converted value (hereinafter referred to as "IV converted value") to the differential processor 17A in the processor 17. Note that the current-voltage conversion section 14E outputs the IV conversion value to the differential processing section 17A at a predetermined period (for example, a period on the order of kHz).

The slit 14C is arranged such that the substantially rectangular slit hole 141C is located at a predetermined position (height) relative to the suction nozzle 15. Specifically, the slit hole 141C of the slit 14C is formed by the thickness A of the component P in the Z direction (see FIGS. 6 and 7) and the tip heights H2 and H5 of the suction nozzle 15 attached to the head 11 (see FIG. 6). , see FIG. 7), the upper limit value of the placement height of the suction nozzle 15 (height B, which will be described later) is determined. The slit 14C is arranged based on the determined upper limit of the arrangement height for the suction nozzle 15 (height B described later). Note that the shape of the slit hole 141C is not limited to a substantially rectangular shape. At least a portion of the slit hole 141C may be parallel to the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C. For example, both ends of the slit hole 141C in the height direction may be formed in an arc shape. It's okay.

The processor 17 as an example of a control unit is, for example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), or an FPGA (Field Programmable Gate Arra). y), and controls the operation of each part of the processor 17. The processor 17 cooperates with the memory 18 to perform various types of processing and control in an integrated manner. Specifically, the processor 17 references programs and data held in the memory 18 and executes the programs to realize the functions of each section. Note that each section referred to here is a differential processing section 17A and a determination section 17B.

The differential processing unit 17A calculates the differential (difference) of each of the two consecutive IV converted values output from the current-voltage conversion unit 14E, and obtains a differential value indicating the amount of change in the IV converted value. The differential processing section 17A outputs each of the obtained differential values to the determining section 17B.

The determination unit 17B determines the thickness (height) in the Z direction and the width in the , posture (angle), etc., and performs determination processing regarding the suction state or suction posture of the component P.

Based on the differential value output from the differential processing unit 17A and the threshold value 18A stored in the memory 18, the determination unit 17B determines whether the thickness of the component P sucked by each suction nozzle 15 is normal or not. It is determined whether the thickness of the part P is the same as when it is being sucked. Further, the determination unit 17B determines the suction posture (angle) of the component P suctioned by each suction nozzle 15 based on the differential value output from the differential processing unit 17A and the threshold value 18A stored in the memory 18. It is determined whether the suction posture of the component P is one in which the component P is normally suctioned.

Note that the normal posture (angle) referred to here is data regarding the posture (angle) of the component P that is set corresponding to the orientation of the component P mounted on the board 13, and is, for example, data that is included in production data. It will be done. The head 11 sucks and takes out the component P from the component supply section 12 based on the attitude (angle) of the component P included in the production data, and conveys and mounts it onto the board 13.

The determination unit 17B outputs the determination result to the output unit 19. Note that the determination unit 17B may output the determination result to the output unit 19 only when determining that the component P is not normally suctioned or is not in a normal suction posture. Further, the determination unit 17B may store the determination result in the memory 18. Further, when the mounting machine 100 is communicably connected to the management computer 21 via the communication unit 20, the judgment unit 17B outputs the judgment result to the management computer 21 via the communication unit 20. It's okay.

Note that when determining that the component P is normally suctioned and is not in a normal suction posture, the determination unit 17B calculates the angular difference between the measured suction angle of the component P and the normal suction angle. , the corresponding suction nozzle 15 may be rotated based on the calculated angular difference. Thereby, the mounting machine 100 can correct the suction posture (angle) of the component P to a normal suction posture.

The memory 18 includes, for example, a RAM (Random Access Memory) as a work memory used when executing each process of the processor 17, and a ROM (Read Only Memory) that stores programs and data that define the operations of the processor 17. have Data or information generated or acquired by the processor 17 is temporarily stored in the RAM. A program that defines the operation of the processor 17 is written in the ROM. The memory 18 stores a threshold value 18A used for various determinations performed by the determination unit 17B. Further, the memory 18 stores production data for producing a mounting board to be produced.

The production data here is information used to produce mounted boards by the mounting machine 100. The production data includes, for example, the size of the substrate 13, the size and shape of the component P, information regarding the suction nozzle, the number of substrates produced, and the like. Note that the production data does not need to be limited to the data of the items described above. The production data may include information on a threshold value 18A for each part P, which will be described later.

The threshold value 18A is set for each type of component P, and is a threshold value for determining whether the component P is normally suctioned by the suction nozzle 15. Specifically, the threshold value 18A stored in the memory 18 is a threshold value ThA for determining whether or not the component P is normally suctioned based on the thickness of the component P; , Threshold ThB for determining whether the suction posture (angle) of the part P is normal or not, Based on the width of the part P, the suction posture (angle) of the part P and whether the suction surface is normal or not. It includes a threshold value ThC for determining. Note that at least one threshold value may be set as the threshold value used for each determination.

The output unit 19 is configured using a display such as an LCD (Liquid Crystal Display) or an organic EL (Electroluminescence). The output unit 19 displays the determination result regarding the suction state or suction posture of the component P output from the determination unit 17B, and outputs audio.

The communication unit 20 is connected to the management computer 21 for wireless or wired communication, and transmits and receives data. The communication unit 20 transmits the determination result regarding the suction state or suction posture of the component P output from the determination unit 17B to the management computer 21. The communication unit 20 also acquires the production data of the board 13, the production data for each part P, or the threshold value for each part P transmitted from the management computer 21, and outputs it to the processor 17. Note that the wireless communication referred to here is communication via a wireless LAN (Local Area Network) such as Wi-Fi (registered trademark).

Note that the determination process regarding the suction state or suction posture (angle) of the component P may be executed by the management computer 21. In such a case, the processor 17 in the mounter 100 associates the IV conversion value output from the current-voltage converter 14E with identification information that can identify the mounter 100 and the suction nozzle 15, and sends it to the management computer 21. Alternatively, the differential value calculated by the differential processing section 17A and identification information that can identify the mounting machine 100 and the suction nozzle 15 may be associated with each other and transmitted to the management computer 21. Further, in such a case, the mounting machine 100 may acquire the determination result regarding the suction state or suction posture of the component P transmitted from the management computer 21, store it in the memory 18, and output it to the output unit 19. .

The management computer 21 is, for example, a PC (Personal Computer), a notebook PC, a tablet terminal, etc., and is operated by a worker. The management computer 21 is communicably connected to one or more mounting machines, and generates production information related to the mounting board production process input or set in advance by an operator, and an execution command for executing the production process. and send it to each mounting machine.

Next, with reference to FIG. 4, the IV (current-voltage) conversion process executed by the current-voltage converter 14E will be described. FIG. 4 is a diagram illustrating an example of IV conversion processing. Note that in FIG. 4, illustration of the head 11 is omitted to make the explanation easier to understand.

Each of the plurality of suction nozzles 15 included in the head 11 may have individual differences in the length to the tip that suctions the component P, the shape of the tip, etc. due to manufacturing errors, deterioration over time, etc. Hereinafter, changes in the IV conversion output value due to individual differences in the suction nozzles 15 will be specifically explained.

Here, in the example shown in FIG. 4, in order to make the explanation easier to understand, two suction nozzles 15A and 15B that suction the same part P are lined up along the irradiation direction (Y direction) of the light beam 14B. An example of placement is shown below. However, in reality, each of the plurality of suction nozzles 15 is simultaneously detected by the measurement system 14 in a direction different from the irradiation direction (Y direction) of the light beam 14B, as shown in FIGS. 2 and 3. Placed so as not to be detected. Thereby, the mounting machine 100 can detect the suction state (or suction posture) of the component P for each suction nozzle 15.

In the example shown in FIG. 4, the suction nozzle 15A is suctioning the component P at a height HA. The suction nozzle 15B suctions the component P at a height HB. The amount of light ray 14B blocked by suction nozzle 15A is larger than the amount of light ray 14B blocked by suction nozzle 15B.

The IV conversion graph Op1 is a graph showing a time-series change in the IV conversion value obtained when the suction nozzle 15A passes the light beam 14B. The IV conversion graph Op2 is a graph showing a time-series change in the IV conversion value obtained when the suction nozzle 15B passes the light beam 14B. The vertical axis of each of the IV conversion graphs Op1 and Op2 indicates the IV conversion value output from the current-voltage converter 14E. The horizontal axis of each of the IV conversion graphs Op1 and Op2 indicates time. The respective IV conversion values of the IV conversion graphs Op1 and Op2 increase in proportion to the amount of light ray 14B blocked. The light blocking level LV0A is an IV conversion value indicating that the light beam 14B is not blocked by the suction nozzle.

In such a case, in the IV conversion graph Op1 corresponding to the suction nozzle 15A, the amount of light shielding becomes maximum as the suction nozzle 15A and the component P pass the light beam 14B in the time period T11, and the IV conversion value reaches the maximum value V11. Become. Similarly, in the IV conversion graph Op2, when the suction nozzle 15A and the component P pass the light beam 14B in the time period T12, the amount of light shielding becomes maximum, and the IV conversion value becomes the maximum value V12. In this way, when the amount of shielding of the light beam 14B differs due to individual differences between the suction nozzles 15A and 15B, the mounting machine 100 has different IV conversion values when picking up the component P indicated by the IV conversion graphs Op1 and Op2. It becomes difficult to determine the suction state of the component P more accurately.

Therefore, in the mounting machine 100 according to the first embodiment, the differentiation processing section 17A differentiates each of the two consecutive IV conversion values output from the current-voltage conversion section 14E. As a result, the mounting machine 100 generates time-series data of differential values (differences) indicating the amount of change in the IV converted value excluding individual differences between suction nozzles from the IV converted value (for example, the differential graphs Df41 and Df51 shown in FIG. 8). etc.) can be generated.

Here, with reference to FIG. 5, a change in the amount of received diffracted light due to the arrangement of the suction nozzle 15 and the slit 14C will be explained. FIG. 5 is a diagram illustrating an example of how the amount of received diffracted light changes depending on the arrangement of the suction nozzle 15 and the slit 14C. In addition, in FIG. 5, an example will be described in which the edge EG of the suction nozzle 15 does not have a tapered shape.

The diffracted light is generated along the edge EG of the suction nozzle 15. Each of the IV conversion graphs Op31, Op32, Op33, and Op34 shows a time-series change in the IV conversion value obtained by performing IV conversion on the amount of received diffracted light when the head 11 is moved in the direction of the arrow in the figure. It is a graph. The vertical axis of each of the IV conversion graphs Op31 to Op34 indicates the IV conversion value. The horizontal axis of each of the IV conversion graphs Op31 to Op34 indicates time.

In the IV conversion graph Op31, the angle between the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 0 (zero) degrees (that is, the angle between the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C). shows the amount of received diffracted light when (parallel). In such a case, when the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C are parallel, the diffracted light is divided into high-intensity (bright) diffracted light and low-intensity (dark) diffracted light. The light passes through the slit holes 141C alternately. As a result, the amount of change in the amount of light received by the photoelectric conversion element 14D increases, so that the diffracted light appears as a large peak (differential value) in the differential graph obtained by the differential processing.

The IV conversion graph Op32 shows the amount of diffracted light received when the angle between the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 5°. In such a case, in the diffracted light passing through the slit hole 141C, the proportion of the diffracted light with low intensity (dark) increases, and the proportion occupied by the diffracted light with high intensity (bright) decreases. Therefore, the amount of change in the amount of received diffracted light when the angle between the suction nozzle 15 and the opening direction of the slit hole 141C is 5 degrees is the same as when the suction nozzle 15 and the opening direction of the slit hole 141C are parallel to each other. becomes smaller than

Further, the IV conversion graph Op33 shows the amount of diffracted light received when the angle between the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 20°. In such a case, in the diffracted light passing through the slit hole 141C, the proportion of the diffracted light with low intensity (dark) further increases, and the proportion occupied by the diffracted light with high intensity (bright) further decreases. Therefore, when the angle between the suction nozzle 15 and the opening direction of the slit hole 141C is 20 degrees, the amount of change in the amount of received diffracted light is as follows: The angle between the suction nozzle 15 and the opening direction of the slit hole 141C is 5 It will be smaller than in the case of °.

Similarly, the IV conversion graph Op34 shows the amount of diffracted light received when the angle between the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C is 30°. In such a case, in the diffracted light passing through the slit hole 141C, the proportion of the diffracted light with low intensity (dark) further increases, and the proportion occupied by the diffracted light with high intensity (bright) further decreases. Therefore, when the angle between the suction nozzle 15 and the opening direction of the slit hole 141C is 30 degrees, the amount of change in the amount of received diffracted light is 20 degrees. It is even smaller than in the case of °.

As described above, in the mounting machine 100, the smaller the angle between the edge EG of the suction nozzle 15 and the opening direction of the slit hole 141C of the slit 14C, the larger the amount of change in the amount of received diffracted light becomes. It becomes difficult to judge whether the used part P is adsorbed. In addition, the mounting machine 100 uses a differential graph because the more the edge EG of the suction nozzle 15 and the slit hole 141C of the slit 14C overlap in the height direction, the smaller the amount of change in the received amount of diffracted light becomes. It is possible to perform suction determination of the component P with higher accuracy.

Hereinafter, the arrangement of the suction nozzles 15, 15C and the slit hole 141C of the slit 14C in this embodiment will be explained.

Next, with reference to FIG. 6, the relative positional relationship between the suction nozzles 15, 15C and the slit hole 141C of the slit 14C will be described. FIG. 6 is a diagram illustrating a first example of relative positional relationship between the suction nozzle 15 and the slit hole 141C. Note that in FIG. 6, only the slit hole 141C is shown as the slit 14C to make the explanation easier to understand.

Further, although the shape of the suction nozzle 15 shown in FIG. 6 shows an example in which the entire shape is formed in a tapered shape, the shape is not limited to this. For example, only the tip of the suction nozzle 15 that suctions the component P may be formed into a tapered shape (that is, the taper angle θb=0 (zero) degree). That is, the suction nozzle 15 shown in FIG. 6 has a taper that becomes narrower toward the tip.

The relative positional relationship between the suction nozzles 15, 15C and the slit hole 141C of the slit 14C is determined based on the thickness A of the component P to be suctioned by the suction nozzles 15, 15C. Note that the thickness A of the component here is the height (size) of the component P in the Z direction that is sucked and held by the suction nozzles 15 and 15C.

When the suction nozzle 15 has a tapered shape, the slit 14C is arranged at a height such that the height H1 of one end of the slit hole 141C is less than the height B in the +Z direction from the tapered height H0 of the suction nozzle 15. In addition, the slit 14C is arranged so that the opening direction of the slit hole 141C (Z direction in the example shown in FIG. 6) is approximately parallel to the extending direction of the suction nozzle 15 (arranged approximately parallel to the vertical direction of the suction nozzle 15). ).

Note that the taper formation height H0 here indicates the height of the intersection Pt1 of surfaces having two different taper angles θa and θb. Taper angle θa>taper angle θb.

Note that the value of height B may be 0 (zero). In such a case, the slit hole 141C is arranged so that the height H1 of one end of the slit hole 141C is between the taper formation height H0 and the suction height of the component P (the tip height H2 of the suction nozzle 15).

As described above, when the slit hole 141C is arranged approximately parallel to the extending direction of the suction nozzle 15, the angle between the opening direction of the slit hole 141C and the edges EG11 and EG12 of the suction nozzle 15 is the taper angle θa. , θb. In other words, the mounting machine 100 measures the overlapping height (that is, the height B) where the edge EG11 having the small taper angle θb among the edges of the suction nozzle 15 overlaps with the slit hole 141C in the Z direction. By making the thickness smaller than the thickness A of a certain component P, the amount of change in the diffracted light that passes through the slit hole 141C and is received by the photoelectric conversion element 14D can be reduced.

Thereby, the mounting machine 100 can more effectively remove the influence of diffracted light on the differential graph obtained by performing differential processing on the IV conversion output value. Therefore, in the differential graph obtained by the differential processing, the mounting machine 100 makes the differential value (peak) corresponding to the amount of change in the diffracted light smaller than the differential value (peak) corresponding to the thickness A of the component P. , it is possible to perform suction determination or suction posture determination of the part P based on the peak value of the differential graph.

Further, with reference to FIG. 7, the relative positional relationship between the suction nozzles 15, 15C and the slit hole 141C of the slit 14C will be described. FIG. 7 is a diagram illustrating a second example of relative positional relationship between the suction nozzle 15C and the slit hole 141C.

The suction nozzle 15C shown in FIG. 7 is a suction nozzle in which the boundary between the first and second tapered surfaces having two different taper angles (that is, the intersection point Pt1 shown in FIG. 6) is formed in an R shape. In such a case, the slit 14C is formed at one end of the slit hole 141C with reference to the height H3 of the intersection Pt2 between the tangent L2 along the edge EG13 of the first tapered surface and the tangent L1 along the edge EG14 of the second tapered surface. It is arranged at a height where the height H4 is less than the height B in the +Z direction from the height H3 of the intersection Pt2. Further, as shown in FIG. 7, the slit hole 141C of the slit 14C is arranged non-parallel to both the tangent line L1 and the tangent line L2.

Note that when the height B is 0 (zero), the slit hole 141C has a height H4 of one end of the slit hole 141C that is equal to the height H3 of the intersection point Pt2 and the suction height of the component P (that is, the tip of the suction nozzle 15). height H5).

As described above, when the slit hole 141C is arranged approximately parallel to the extending direction of the suction nozzle 15, the opening direction of the slit hole 141C and the tangents L1, L2 along the edges EG13, EG14 of the suction nozzle 15, respectively. The angles formed have values close to the taper angles θa and θb, respectively. In other words, in the Z direction, the mounting machine 100 measures the overlapping height (that is, height B) where the edge EG11 having a small taper angle θb among the edges of the suction nozzle 15 overlaps with the slit hole 141C. By making the thickness smaller than the thickness A of a certain component P, the amount of change in the diffracted light that passes through the slit hole 141C and is received by the photoelectric conversion element 14D can be reduced.

With reference to FIG. 8, a comparative example of an IV conversion graph and a differential graph based on the relative positions of the suction nozzle 15 and the slit hole 141C will be described. FIG. 8 is a diagram illustrating a comparative example of IV conversion graphs Op41, Op51 and differential graphs Df41, Df51 based on the relative positional relationship between the suction nozzle 15 and the slit hole 141C. Note that in the following explanation, an IV conversion graph and a differential graph based on the relative position between the suction nozzle 15 and the slit hole 141C will be explained, but the same applies to the suction nozzle 15C.

The vertical axis of each of the IV conversion graphs Op41 and Op51 indicates the IV conversion value. The horizontal axis of each of the IV conversion graphs Op41 and Op51 indicates time. The vertical axis of each of the differential graphs Df41 and Df51 indicates the differential value. The horizontal axis of each of the differential graphs Df41 and Df51 indicates time.

In the IV conversion graph Op41, the height B (see FIGS. 6 and 7) where the edges EG11, EG13 and the slit hole 141C overlap in the height direction is greater than or equal to the thickness A of the component P (thickness A≦height It is a graph which shows the time series change of the IV conversion value in case B). Further, the level LV0D indicates that the light beam 14B is not blocked and the IV conversion value output from the current-voltage converter 14E is 0 (zero).

Point Pt41A indicates the timing before and after the suction nozzle 15 and the component P start blocking the light beam 14B. In the IV conversion graph Op41, the IV conversion value fluctuates in response to the amount of received diffracted light generated at the edge portion of the suction nozzle 15 at point Pt41A.

Point Pt42A indicates the timing before and after the suction nozzle 15 and the part P suctioned to the tip of the suction nozzle 15 start blocking the light beam 14B. In the IV conversion graph Op41, an IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the part P sucked to the tip of the suction nozzle 15 is output at a point Pt42A. Here, the level LV40 is an IV conversion value that is output from the current-voltage converter 14E and corresponds to the tip height H2 of the suction nozzle 15 and the thickness A of the component P sucked to the tip of the suction nozzle 15. .

Point Pt43A indicates the timing before and after the suction nozzle 15 and the component P suctioned to the tip of the suction nozzle 15 end blocking the light beam 14B. In the IV conversion graph Op41, an IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the part P sucked to the tip of the suction nozzle 15 is output at a point Pt43A.

Point Pt44A indicates the timing before and after the suction nozzle 15 and the component P finish blocking the light beam 14B. In the IV conversion graph Op41, the IV conversion value fluctuates in response to the amount of received diffracted light generated at the edge portion of the suction nozzle 15 at point Pt41A.

The differential graph Df41 is a graph showing a time-series change in the differential value obtained by differentially processing the IV conversion value of the IV conversion graph Op41. Further, level LV0E indicates that the amount of change in the IV conversion value is 0 (zero), and that the differential value output from the differential processing section 17A is 0 (zero).

The peak Pk41B is a peak corresponding to the point Pt41A of the IV conversion graph Op41. Peak Pk42B is a peak corresponding to point Pt42A of IV conversion graph Op41. Peak Pk43B is a peak corresponding to point Pt43A of IV conversion graph Op41. Peak Pk44B is a peak corresponding to point Pt44A of IV conversion graph Op41.

Here, each of the peaks Pk42B and Pk43B corresponding to the thickness A of the component P is smaller than each of the peaks Pk41B and Pk44B corresponding to the diffracted light of the suction nozzle 15. Therefore, when the thickness A of the component P is less than or equal to the height B of the slit hole 141C relative to the suction nozzle 15 (thickness A≦height B), the determination unit 17B determines that the maximum negative value of the differential value is the peak Pk41B. , since the maximum positive value of the differential value is the peak Pk44B, the thickness of the component P is Another process is required to detect the differential value corresponding to the difference.

In the IV conversion graph Op51, the height B (see FIGS. 6 and 7) where the edges EG11, EG13 and the slit hole 141C overlap in the height direction is less than the thickness A of the component P (thickness A>height It is a graph showing the time series change of the IV conversion value in case B). Note that the height B may be 0 (zero). In such a case, the slit hole 141C indicates that one end height H1 is located between the suction height of the component P (the tip height H2 of the suction nozzle 15) and the height H0.

Point Pt51A indicates the timing before and after the suction nozzle 15 and the component P start blocking the light beam 14B. In the IV conversion graph Op51, the IV conversion value fluctuates in response to the amount of received light of the diffracted light generated at the edge portion of the suction nozzle 15 at a point Pt51A.

Point Pt52A indicates the timing before and after the suction nozzle 15 and the part P suctioned to the tip of the suction nozzle 15 start blocking the light beam 14B. In the IV conversion graph Op51, an IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the part P sucked to the tip of the suction nozzle 15 is output at a point Pt52A. Here, the level LV40 is an IV conversion value that is output from the current-voltage converter 14E and corresponds to the tip height H2 of the suction nozzle 15 and the thickness A of the component P sucked to the tip of the suction nozzle 15. .

Point Pt53A indicates the timing before and after the suction nozzle 15 and the part P suctioned to the tip of the suction nozzle 15 end blocking the light beam 14B. In the IV conversion graph Op51, an IV conversion value corresponding to the tip height H2 of the suction nozzle 15 and the thickness A of the part P sucked to the tip of the suction nozzle 15 is output at a point Pt53A.

Point Pt54A indicates the timing before and after the suction nozzle 15 and the component P finish blocking the light beam 14B. In the IV conversion graph Op51, the IV conversion value fluctuates in response to the amount of received light of the diffracted light generated at the edge portion of the suction nozzle 15 at a point Pt51A.

The differential graph Df51 is a graph showing a time-series change in the differential value obtained by differentially processing the IV conversion value of the IV conversion graph Op51.

The peak Pk51B is a peak corresponding to the point Pt51A of the IV conversion graph Op51. Peak Pk52B is a peak corresponding to point Pt52A of IV conversion graph Op51. Peak Pk53B is a peak corresponding to point Pt53A of IV conversion graph Op51. Peak Pk54B is a peak corresponding to point Pt54A of IV conversion graph Op51.

Here, each of the peaks Pk52B and Pk53B corresponding to the thickness A of the component P is larger than each of the peaks Pk51B and Pk54B corresponding to the diffracted light of the suction nozzle 15. Therefore, in such a case, the determination unit 17B determines that the maximum negative value of the differential value is the peak Pk52B, and the maximum positive value of the differential value is the peak Pk53B, so that the maximum negative and positive values of the differential value, By comparing the threshold values ThA and ThB, it is possible to more easily determine whether or not the component P is being attracted to the suction nozzle 15.

Specifically, if the determination unit 17B determines that the maximum negative value of the differential value is equal to or less than the threshold ThB, and the maximum positive value of the differentiated value is equal to or greater than the threshold ThA, the determination unit 17B places the component P at the tip of the suction nozzle 15. is determined to be adsorbed. Further, when determining that the maximum negative value of the differential value is not more than the threshold ThB and the maximum positive value of the differential value is not more than the threshold ThA, the determining unit 17B determines that the component P is not normally placed at the tip of the suction nozzle 15. It is determined that it is not absorbed.

Furthermore, the determination unit 17B measures the width of the component P based on the time zone in which the differential value is less than or equal to the threshold ThB and greater than or equal to the threshold ThA in the differential graph. For example, the determination unit 17B determines whether the moving speed of the head 11, the maximum negative value of the differential value (that is, peak Pk52B), and the maximum positive value of the differential value (that is, peak Pk53B) are detected. Calculate time period T5. The determination unit 17B determines the suction posture, suction surface, etc. of the component P picked up by the suction nozzle 15 by comparing the time period T5 corresponding to the width of the component P with the threshold ThC for determining the suction posture of the component P. Determine whether or not it is normal.

In the example shown in FIG. 8, if the determination unit 17B determines that the time period T5 is less than the threshold ThC, it determines that the suction posture, suction surface, etc. of the component P are normal, and the time period T5 is less than the threshold ThC. If it is determined that this is not the case, it is determined that the suction posture, suction surface, etc. of the component P are defective.

Note that when the threshold ThC is a threshold corresponding to the width of the component P when the component P is normally picked up, the determining unit 17B determines that the time period T5 is equal to or greater than the threshold ThC, the component It may be determined that the suction posture, suction surface, etc. of P are normal.

In the present embodiment described above, the conveyance height between the component supply section 12 and the component mounting position of the component P by the head 11 is constant, and the height of the slit 14C relative to the suction nozzle 15 attached to the head 11 is constant. Although the arrangement position has been described, the conveyance height may be variable.

When the conveyance height between the component supply unit 12 and the component mounting position of the component P by the head 11 is variable, the mounting machine 100 can move the component P based on the position (height) of one end height H1, H3 of the slit 14C. , the height of the suction nozzle 15 relative to the slit hole 141C of the slit 14C may be controlled so that the thickness A of the component P>height B.

As described above, the mounting machine 100 according to the first embodiment sucks the component P with the tip of at least one suction nozzle 15, 15C, and irradiates the head 11 that mounts the component onto the substrate 13 with the light source 14A and the light source 14A. The photoelectric conversion element 14D (an example of a light receiving element) is arranged between the light source and the photoelectric conversion element 14D to irradiate the tip of the suction nozzle 15, 15C with the light beam 14B. A measurement system 14 (an example of a sensor) that receives the light beam 14B that has passed through the slit hole 141C by a photoelectric conversion element 14D and outputs the light intensity of the received light beam 14B; It includes a processor 17 (an example of a control unit) that determines, based on the intensity, whether the component P is attracted to the tips of the suction nozzles 15 and 15C through which the light beam 14B passes. The suction nozzles 15, 15C are tapered toward their tips. The slit hole 141C is arranged non-parallel to the taper.

As a result, the mounting machine 100 according to the first embodiment can reduce the amount of diffracted light that passes through the slit hole 141C and is received by the photoelectric conversion element 14D. The differential value based on the increase/decrease in the amount of received light can be more effectively removed. Therefore, the mounting machine 100 can determine the suction state of the component P with higher precision using the differential value.

Furthermore, as described above, one end of the slit hole 141C in the mounting machine 100 according to the first embodiment is at the suction height of the component P to be suctioned at the tip (that is, the tip height H2 of the suction nozzle 15) in the height direction. . For example, it is arranged below the height B (an example of a predetermined height) from the taper formation height H0 with the edge EG12 and the tangent L1 or the height H3 of the intersection Pt2. As a result, the mounting machine 100 according to the first embodiment has slit holes corresponding to the edges EG11 and EG12 of the suction nozzles 15 and 15C (in the example of the suction nozzle 15C, tangents L1 and L2 along the edges EG13 and EG14, respectively). By simply defining the height of 141C, the amount of diffracted light received by photoelectric conversion element 14D can be more easily reduced.

Furthermore, as described above, in the mounting machine 100 according to the first embodiment, the height B is the height A of the component. As a result, in the mounting machine 100 according to the first embodiment, the differential value obtained by differentiating the amount of variation in the amount of received diffracted light is the amount of variation in the amount of received light based on the blocking of the light beam 14B when the component P passes. Since it is smaller than the differential value obtained by differentiation, the suction determination of the component P can be performed based on the peak of the differential value.

Furthermore, as described above, the slit hole 141C of the mounting machine 100 according to the first embodiment is arranged substantially parallel to the suction nozzles 15, 15C. As a result, the mounting machine 100 according to the first embodiment has slit holes corresponding to the edges EG11 and EG12 of the suction nozzles 15 and 15C (in the example of the suction nozzle 15C, tangents L1 and L2 along the edges EG13 and EG14, respectively). By simply defining the height of 141C, the amount of diffracted light received by photoelectric conversion element 14D can be more easily reduced.

Further, as described above, the processor 17 in the mounting machine 100 according to the first embodiment has a differential value equal to or greater than the threshold ThA (an example of a first threshold) and a threshold ThB (an example of a second threshold) that is larger than the threshold ThA. If it is determined that the value is less than 1, it is determined that the component P is attracted to the tip portion through which the light beam 14B passes. Thereby, the mounting machine 100 can determine whether or not the component P is suctioned, and determine the suction posture of the component P, based on the thickness A (height) of the component P indicated by the differential value.

Furthermore, as described above, when the processor 17 in the mounting machine 100 according to the first embodiment determines that the differential value is less than the threshold ThA, the processor 17 determines that the component P is not attracted to the tip portion passing through the light beam 14B. , generates and outputs a notification that the suction state of the component P is poor. As a result, when the mounting machine 100 determines that the suction posture (state) of the component P is defective based on the thickness A (height) of the component P indicated by the differential value, the mounting machine 100 notifies that the suction is defective. can be generated and output.

Further, as described above, when the processor 17 in the mounting machine 100 according to the first embodiment determines that the differential value is equal to or greater than the threshold ThB, the processor 17 generates and outputs a notification that the suction state of the component P is poor. . As a result, when the mounting machine 100 determines that the suction posture (state) of the component P is defective based on the thickness A (height) of the component P indicated by the differential value, the mounting machine 100 notifies that the suction is defective. can be generated and output.

Further, as described above, the processor 17 in the mounting machine 100 according to the first embodiment measures the time period T5 in which the differential value is greater than or equal to the threshold ThA and less than the threshold ThB, and based on the measured time period T5, The suction posture of the part P is determined. As a result, the mounting machine 100 selects the component P based on the width of the component P that corresponds to the length of the time period T5 in which the differential value indicating the state in which the component P is being sucked is greater than or equal to the threshold ThA and less than the threshold ThB. The adsorption posture of P can be determined.

Further, as described above, when the processor 17 in the mounting machine 100 according to the first embodiment determines that the length of the time period T5 is equal to or greater than the threshold value ThC, the processor 17 determines that the suction posture of the component P is bad, and A notification indicating that the suction state of P is poor is generated and output. As a result, the mounting machine 100 determines whether the suction posture, suction surface, etc. of the component P are normal based on the width of the component P, and if it is determined that the suction surface is not normal, a notification is sent that the suction is defective. can generate and output notifications.

Although various embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that those skilled in the art can come up with various changes, modifications, substitutions, additions, deletions, and equivalents within the scope of the claims, and It is understood that it falls within the technical scope of the present disclosure. Further, each of the constituent elements in the various embodiments described above may be arbitrarily combined without departing from the spirit of the invention.

The present disclosure is useful as a mounting machine that can more accurately determine the suction state of components suctioned by a nozzle.

11 Head 12 Component supply section 13 Substrate 14 Measurement system 14A Light source 14B Light beam 14C Slit 14D Photoelectric conversion element 14E Current-voltage conversion section 15, 15A, 15B, 15C Suction nozzle 17 Processor 17A Differential processing section 17B Judgment section 18 Memory 18A Threshold 19 Output Part 21 Management computer 100 Mounting machine EG, EG11, EG12, EG13, EG14 Edge P, P0 Parts

Claims

a head having a suction nozzle, suctioning a component with a tip of the suction nozzle, and mounting the component on a substrate;
A light source that irradiates a light beam, a slit having a slit hole through which the light beam passes, and a light receiving element that receives the light beam that has passed through the slit hole, and irradiates the tip of the suction nozzle with the light beam. , a sensor that receives the light beam passing through the slit hole with the light receiving element and outputs the light intensity of the received light beam;
Differentiating the light intensity of the light beam output from the sensor to obtain a differential value, and based on the differential value, determining whether or not the component is attracted to the tip of the suction nozzle through which the light beam passes. a control unit that determines the
The suction nozzle has a taper that becomes narrower toward the tip,
the slit hole is arranged non-parallel to the taper;
mounting machine.
The suction nozzle has a first edge and a second edge,
One end of the slit hole has a height in the height direction that is greater than or equal to the suction height of the component to be suctioned to the tip, and that is between a first tangent of the first edge and a second tangent of the second edge. located less than a predetermined height from the intersection,
The mounting machine according to claim 1.
the predetermined height is the height of the component;
The mounting machine according to claim 2.
The slit hole is arranged substantially parallel to the suction nozzle,
The mounting machine according to claim 1.
If the control unit determines that the differential value is greater than or equal to a first threshold and less than a second threshold that is larger than the first threshold, the control unit may cause the component to be attracted to the tip through which the light beam passes. It is determined that
The mounting machine according to claim 1.
If the control unit determines that the differential value is less than the first threshold, the control unit determines that the component is not suctioned at the tip through which the light beam passes, and that the suction state of the component is poor. Generate and output a notification to that effect,
The mounting machine according to claim 5.
When the control unit determines that the differential value is equal to or greater than the second threshold, the control unit generates and outputs a notification that the suction state of the component is poor.
The mounting machine according to claim 5.
The control unit measures a time period in which the differential value is greater than or equal to the first threshold value and less than the second threshold value, and determines a suction posture of the component based on the measured time period. ,
The mounting machine according to claim 5.
If the control unit determines that the length of the time period is equal to or greater than a third threshold, the control unit determines that the suction posture of the component is poor, and sends a notification that the suction state of the component is poor. generate and output,
The mounting machine according to claim 8.