JP2014022633A - Component mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting machine which can normally mount a component on a substrate even though the state of the component sucked by a suction nozzle is in oblique suction.SOLUTION: A suction nozzle inclination angle adjustment device 25 is provided on a mounting head 16 of a component mounting machine. A suction nozzle 26 is held by the suction nozzle inclination angle adjustment device 25. An inclination angle θ1 of a component 28 is detected by passing the component 28 sucked by the suction nozzle 26 above a line laser sensor 27. An inclination angle θ2 of a substrate 18 is detected by measuring difference of elevation of three or more measuring object points on an upper surface of the substrate 18 by a height measurement laser sensor 31. The inclination angle θ1 of the component 28 is corrected by operating the suction nozzle inclination angle adjustment device 25 so as to make the inclination angle θ1 of the component 28 correspond with the inclination angle θ2 of the substrate 18. After the position of the component 28 is recognized by photographing the component 28 with a part camera, the component 28 is mounted on a predetermined mounting position of the substrate 18.

Description

  The present invention relates to a component mounter that sucks a component supplied by a component supply device to a suction nozzle and mounts it on a substrate.

  In the component mounting machine, when the component supplied by the component supply device is adsorbed by the adsorption nozzle, the component may be adsorbed obliquely for some reason (for example, dust adhesion). When a component sucked diagonally by the suction nozzle is mounted on the substrate, a part of the lower surface of the component comes into contact with the substrate first, so the component may be displaced or mounted in an inclined state. Yes, it causes mounting failure.

  As a countermeasure against this, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2006-114821), a part picked up by a pick-up nozzle is imaged by a camera, and the picking posture of the part is normal picked up or slanted by image processing technology. Techniques for identifying adsorption are being developed. In this case, all the parts determined to be diagonally picked up are discarded in a predetermined disposal place, and the operation of picking up new parts again is repeated, or an error is stopped, and the part is returned to the operator. The adsorption state is confirmed.

JP 2006-114421 A

  By the way, if all the parts determined to be diagonally sucked are discarded at a predetermined disposal location and the operation of sucking new parts again is repeated or an error is stopped, the productivity is lowered.

  Therefore, the problem to be solved by the present invention is to provide a component mounting machine that can normally mount a component sucked by a suction nozzle on a substrate even when obliquely sucked, and can achieve both mounting failure prevention and productivity improvement. It is.

  In order to solve the above-described problem, an invention according to claim 1 is a component mounting machine that sucks a component supplied by a component feeding device to a suction nozzle and mounts the component on a substrate, and holds the suction nozzle in a tiltable manner. The suction nozzle tilt angle adjusting means for adjusting the tilt angle of the suction nozzle, the component tilt angle measuring means for measuring the tilt angle of the part sucked by the suction nozzle, and the component tilt angle measured by the component tilt angle measuring means And a control means for adjusting the inclination angle of the suction nozzle by operating the suction nozzle inclination angle adjusting means so as to correct the inclination of the component based on the above.

  In this configuration, the inclination angle of the component adsorbed to the adsorption nozzle is measured by the component inclination angle measurement means, and the adsorption nozzle inclination angle adjustment means is operated so as to correct the inclination of the component, thereby adjusting the inclination angle of the adsorption nozzle. Therefore, even if the component adsorbed to the adsorption nozzle is obliquely adsorbed, the inclination of the component can be corrected and normally mounted on the substrate, and both mounting failure prevention and productivity improvement can be achieved.

  In general, the inclination of the upper surface (mounting surface) of the substrate due to the warp of the substrate is small compared to the inclination of the component adsorbed to the adsorption nozzle, and there are many cases where the influence is small. Therefore, the upper surface of the substrate is regarded as a horizontal plane. Even if the present invention is implemented, there is almost no problem. However, when more accurate mounting is required in consideration of the board inclination, the inclination angle of the board on which the component is mounted is measured as in claim 2. And a board tilt angle measuring means for measuring the component tilt angle measured by the component tilt angle measuring means and the board tilt angle measured by the board tilt angle measuring means. The suction nozzle tilt angle adjusting means may be operated to adjust the suction nozzle tilt angle so that the lower surfaces are parallel. In this way, the lower surface of the component is parallel to the upper surface of the substrate based on the component inclination angle measured by the component inclination angle measuring unit and the substrate inclination angle measured by the substrate inclination angle measuring unit. Therefore, even if the upper surface of the substrate is inclined due to warpage of the substrate, the inclination angle of the suction nozzle is adjusted so that the lower surface of the component is parallel to the upper surface of the substrate. Therefore, even if both the component and the board are inclined, the component can be mounted with high accuracy.

  By the way, when the inclination angle of the suction nozzle is adjusted, the positions (XY coordinates) of the parts sucked by the suction nozzle are shifted before and after that.

  In consideration of this point, the suction nozzle tilt angle adjusting means is actuated to adjust the tilt angle of the suction nozzle, and then the part sucked by the suction nozzle is imaged by the camera from below and imaged. Image processing means for recognizing the position (XY coordinate) of the component by processing, and the suction is performed so that the component is mounted at a predetermined mounting position on the substrate based on the recognition result of the position of the component by the image processing means. You may make it move the mounting head holding a nozzle. By doing this, it is possible to recognize the position of the component (XY coordinates) shifted by adjusting the inclination angle of the suction nozzle and to mount the component at a predetermined mounting position on the board with high accuracy.

  In addition, since the displacement amount (ΔX, ΔY) of the component due to the adjustment of the inclination angle of the suction nozzle can be calculated geometrically, the part of the component sucked by the suction nozzle by the component inclination angle measuring means as in claim 4 is provided. When measuring the tilt angle, the position of the component is also measured, and the position displacement amount (ΔX, ΔY) of the component by adjusting the tilt angle of the suction nozzle based on the tilt angle of the component measured by the component tilt angle measuring means And a mounting head that holds the suction nozzle so as to mount the component at a predetermined mounting position on the substrate based on the corrected position of the component based on the corrected position of the component. May be moved. In this case, since the component tilt angle measuring means measures the position of the component in addition to the tilt angle of the component, a dedicated camera or the like for measuring the position of the component is not required, and the manufacturing cost is correspondingly reduced. Can be reduced.

  Also, if the tilt angle of the component sucked by the suction nozzle becomes too large, the angle range that can be adjusted by the suction nozzle tilt angle adjusting means will be exceeded, or the suction state of the component with respect to the suction nozzle will be unstable. This may cause mounting failure.

  In consideration of such circumstances, when the component inclination angle measured by the component inclination angle measuring means is equal to or greater than a predetermined angle as in claim 5, it is determined that the adjustable angle range is exceeded and an error occurs. Processing may be performed. Here, in the error processing, for example, the part sucked by the suction nozzle is discarded in a predetermined disposal place, and the operation of sucking a new part again is repeated, or the error is stopped. You may make it confirm the adsorption | suction state of components. In this way, it is possible to prevent the occurrence of mounting defects due to an excessively large inclination angle of the component sucked by the suction nozzle.

FIG. 1 is a diagram for explaining the configuration of the main part of a component mounter according to an embodiment of the present invention. FIG. 2 is a block diagram showing the configuration of the control system of the component mounter. FIG. 3 is a diagram for explaining the operation of measuring the tilt angle of the component sucked by the suction nozzle and the tilt angle of the substrate. FIG. 4 is a diagram for explaining the operation of correcting the tilt angle of the component sucked by the suction nozzle. FIG. 5 is a diagram for explaining the operation of mounting the component sucked by the suction nozzle on the substrate. FIG. 6 is a flowchart showing the flow of processing of the component mounting operation control program.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the system configuration of the component mounting machine will be described with reference to FIG.

  The component mounting machine includes a control device 11 (control means) configured by a computer, an input device 12 such as a keyboard and a mouse, a display device 13 such as a liquid crystal display and a CRT, and a component mounting operation control program shown in FIG. A storage device 14 (storage means) for storing various programs and data such as, a mounting head moving device 17 for moving the mounting head 16 (see FIG. 1) in the XYZ directions, and a substrate 18 on which a component 28 is mounted (FIG. 3). 5), a clamping device 20 for clamping the substrate 18 carried to the mounting position by the substrate conveying device 19, and a tape feeder, tray-type feeder, and bulk-type feeder for supplying the components 28. A part feeding device 21 such as a stick type feeder and a part for picking up an image of the component 28 adsorbed by the adsorption nozzle 26 from below. A camera 22, has a configuration including a mark camera 23 which takes an image of the reference marks of the substrate 18 upper surface from above. The mounting position on the upper surface of the substrate 18 is determined based on the position of the reference mark imaged by the mark camera 23.

  As shown in FIG. 1, a suction nozzle tilt angle adjusting device 25 (suction nozzle tilt angle adjusting means) is provided below the mounting head 16, and the suction nozzle 26 can be replaced with the suction nozzle tilt angle adjusting device 25. Is retained. The suction nozzle tilt angle adjusting device 25 is configured to be able to adjust the tilt angle of the suction nozzle 26 in any direction of 360 ° using, for example, a biaxial rotation mechanism, a piezoelectric element (piezoelectric actuator), or the like. .

  In the component mounting machine, a line laser sensor 27 (line laser scanner) for height measurement is provided at a predetermined position below the moving region of the suction nozzle 26 (for example, in the middle of the movement path between the component suction position and the mounting position). It is provided upwards. The line laser sensor 27 functions as a component tilt angle measuring unit that measures the tilt angle θ1 (angle between the lower surface of the component 28 and the horizontal plane) of the component 28 sucked by the suction nozzle 26. While the component mounter is in operation, the component 28 supplied by the component supply device 21 is adsorbed by the adsorption nozzle 26 and the component 28 is passed over the line laser sensor 27, so that the component 28 is separated from the line laser sensor 27. By irradiating a line laser beam sequentially to a plurality of locations on the lower surface and detecting the reflected light, a plurality of laser beams on each laser beam irradiation line are respectively detected along the plurality of laser beam irradiation lines on the lower surface of the component 28. The height of the measurement target point is measured, and the tilt angle θ1 and the tilt direction of the component 28 are detected based on the height difference / distance between the measurement target points and the position (XY coordinate) of each measurement target point. For the inclination angle θ1 of the component 28, an average value or median value of height difference / distance between the measurement target points may be calculated.

  The mounting head 16 is provided with a height measuring laser sensor 31 facing downward. This height measuring laser sensor 31 functions as a substrate tilt angle measuring means for measuring the tilt angle θ2 (an angle between the upper surface of the substrate 18 and the horizontal plane) of the substrate 18 on which the component 28 is mounted. While the component mounter is in operation, the height measuring laser sensor 31 is moved above the substrate 18 clamped by the clamp device 20 and the measurement target points on the upper surface (mounting surface) of the substrate 18 are sequentially measured. Is irradiated with a laser spot light to measure the height of each measurement target point, and the tilt angle θ2 of the substrate 18 based on the height difference / distance between the measurement target points and the position (XY coordinate) of each measurement target point. And detect the tilt direction. When the substrate 18 is warped or curved, the inclination angle θ2 may differ depending on the mounting position on the substrate 18, and therefore, between the measurement target points around it at every mounting position (or at every predetermined interval). The inclination angle θ2 may be obtained by calculating the height difference / distance.

  During the operation of the component mounting machine, after the inclination angle θ1 of the component 28 sucked by the suction nozzle 26 and the inclination angle θ2 of the substrate 18 are measured by the above-described method, the inclination angle θ1 of the component 28 is measured as shown in FIG. The suction nozzle tilt angle adjusting device 25 is operated so as to match the tilt angle θ 2 of the substrate 18 to adjust the tilt angle of the suction nozzle 26 so that the lower surface of the component 28 is parallel to the upper surface of the substrate 18. The inclination angle θ1 of the part 28 is corrected.

  After the inclination angle θ1 of the component 28 is corrected, the mounting head 16 holding the suction nozzle 26 is moved to a predetermined component imaging position by the mounting head moving device 17, and the component 28 sucked by the suction nozzle 26 is viewed from below the parts camera 22. And image processing is performed by the image processing function (image processing means) of the control device 11 to recognize the position (XY coordinates) of the component 28 after the inclination angle θ1 is corrected.

  Thereafter, the mounting head 16 is moved by the mounting head moving device 17 so as to mount the component 28 at a predetermined mounting position on the substrate 18 based on the recognition result of the position of the component 28, and as shown in FIG. The component 28 is mounted at a predetermined mounting position on the substrate 18. Since the tilt angle θ1 of the component 28 is corrected so that the lower surface of the component 28 is parallel to the upper surface of the substrate 18 before mounting, the entire lower surface of the component 28 is mounted on the substrate 18 when the component 28 is mounted on the substrate 18. Simultaneously abuts the top surface. As a result, it is possible to prevent the component 28 from being mounted on the substrate 18 in an inclined state, and to prevent the position of the component 28 from being displaced due to a part of the lower surface of the component 28 being first in contact with the substrate 18 during mounting. The occurrence of mounting defects can be prevented.

  The component mounting operation of the present embodiment described above is executed according to the component mounting operation control program of FIG. 6 by the control device 11 (control unit, image processing unit) of the component mounting machine. The component mounting operation control program of FIG. 6 is repeatedly executed periodically during operation of the component mounting machine. When this program is started, first, in step 101, the component 28 supplied by the component supply device 21 is sucked by the suction nozzle 26. Thereafter, the process proceeds to step 102, and the line laser light is sequentially irradiated from the line laser sensor 27 to a plurality of positions on the lower surface of the part 28 by passing the part 28 sucked by the suction nozzle 26 over the line laser sensor 27. By detecting the reflected light, the height of a plurality of measurement target points on the lower surface of the component 28 is measured, and the height difference / distance between each measurement target point and the position (XY coordinate) of each measurement target point Based on the above, the inclination angle θ1 and the inclination direction of the component 28 are detected.

  Thereafter, the process proceeds to step 103, the height measuring laser sensor 31 is moved above the substrate 18 clamped by the clamping device 20, and the laser spot light is sequentially applied to three or more measurement target points on the upper surface of the substrate 18. Is used to measure the height of each measurement target point, and the inclination angle θ2 and the inclination direction of the substrate 18 are determined based on the height difference / distance between the measurement target points and the position (XY coordinate) of each measurement target point. To detect.

  Thereafter, the routine proceeds to step 104, where it is determined whether or not the inclination angle θ1 of the component 28 is smaller than the predetermined value K1 and the inclination angle θ2 of the substrate 18 is smaller than the predetermined value K2. If the determination result in step 104 is “No”, that is, if the inclination angle θ1 of the component 28 is determined to be greater than or equal to the predetermined value K1, and / or the inclination angle θ2 of the substrate 18 is determined to be greater than or equal to the predetermined value K2. If it is determined that the tilt angle .theta.1 and / or .theta.2 exceeds the adjustable angle range, the process proceeds to step 108 to execute error processing.

  Here, in the error processing, for example, when the inclination angle θ1 of the component 28 is determined to be equal to or larger than the predetermined value K1, the component 28 adsorbed by the adsorption nozzle 26 is discarded to a predetermined disposal place, and again a new one is obtained. The operation of sucking the component 28 may be repeated, or an error may be stopped and a warning displayed on the display device 13 to allow the operator to check the suction state of the component 28. If it is determined that the inclination angle θ2 of the substrate 18 is equal to or greater than the predetermined value K2, an error is stopped and a warning is displayed on the display device 13 so that the operator can confirm the inclination state of the substrate 18. By this error processing, it is possible to prevent the occurrence of mounting defects. Note that error processing may be performed when the absolute value | θ1−θ2 | of the difference value between the tilt angle θ1 of the component 28 and the tilt angle θ2 of the substrate 18 is equal to or greater than a predetermined value.

  On the other hand, if it is determined in step 104 that the tilt angle θ1 of the component 28 is smaller than the predetermined value K1 and the tilt angle θ2 of the substrate 18 is smaller than the predetermined value K2, the tilt angles θ1 and θ2 are If it is determined that the angle is within the adjustable range, the process proceeds to step 105, where the suction nozzle tilt angle adjusting device 25 is operated so that the tilt angle θ1 of the component 28 matches the tilt angle θ2 of the substrate 18, thereby sucking the nozzle 26. Is adjusted so that the lower surface of the component 28 is parallel to the upper surface of the substrate 18.

  Thereafter, the process proceeds to step 106, where the mounting head 16 holding the suction nozzle 26 is moved to a predetermined part imaging position by the mounting head moving device 17, and the part 28 sucked by the suction nozzle 26 is moved from below by the parts camera 22. The image is picked up and image-processed by the image processing function (image processing means) of the control device 11 to recognize the position (XY coordinate) of the component 28 after the inclination angle θ1 is corrected.

  Thereafter, the process proceeds to step 107, and the mounting head 16 is moved by the mounting head moving device 17 so that the component 28 is mounted at a predetermined mounting position on the substrate 18 based on the recognition result of the position of the component 28 after the inclination angle θ1 is corrected. The component 28 is moved to be mounted at a predetermined mounting position on the substrate 18. Thereafter, the above processing is repeatedly executed.

  According to the present embodiment described above, the inclination angle θ1 of the component 28 sucked by the suction nozzle 26 and the inclination angle θ2 of the substrate 18 on which the component 28 is mounted are measured, and the inclination angle θ1 of the component 28 is determined as the inclination of the substrate 18. The inclination angle of the component 28 is adjusted so that the lower surface of the component 28 is parallel to the upper surface of the substrate 18 by adjusting the inclination angle of the suction nozzle 26 by operating the suction nozzle inclination angle adjusting device 25 so as to coincide with the angle θ2. Since θ1 is corrected, even if the component 28 adsorbed to the adsorption nozzle 26 is obliquely adsorbed, the inclination of the component 28 can be corrected so that it can be normally mounted on the substrate 18, mounting defects can be prevented, and diagonally It is not necessary to perform error processing on all the parts 28 determined to be attracted, and productivity can be improved.

  In general, the inclination of the upper surface of the substrate 18 due to the warp of the substrate 18 is small compared to the inclination of the component 28 adsorbed to the adsorption nozzle 26, and there are many cases where there is little influence. There are many cases where there is almost no problem even if considered. In consideration of this point, the function of measuring the tilt angle θ2 of the substrate 18 is omitted, and only the function of measuring the tilt angle θ1 of the component 28 is mounted. The inclination angle .theta.1 of the component 28 may be corrected so that the lower surface of the component 28 is horizontal.

  Further, in this embodiment, the inclination angle θ1 of the component 28 is taken into consideration that the position (XY coordinate) of the component 28 sucked by the suction nozzle 26 before and after adjusting the tilt angle of the suction nozzle 26 is shifted. After the correction, the mounting head 16 is moved to a predetermined part imaging position, and the part 28 picked up by the suction nozzle 26 is picked up by the parts camera 22 from below to recognize the position of the part 28 after the correction of the inclination angle θ1. However, since the positional deviation amount (ΔX, ΔY) of the component 28 by adjusting the tilt angle of the suction nozzle 26 can be calculated geometrically, the suction nozzle 26 is used by the component tilt angle measuring means (line laser sensor 27). When measuring the tilt angle of the component 28 adsorbed on the component, the position (XY coordinate) of the component 28 is also measured, and the component measured by the component tilt angle measuring means (line laser sensor 27) The position deviation amount (ΔX, ΔY) of the component 28 by adjusting the inclination angle of the suction nozzle 26 is calculated on the basis of the inclination angle θ1 of 8, and the position of the component 28 is corrected by the amount of the position deviation. The mounting head 16 holding the suction nozzle 26 may be moved so that the component 28 is mounted at a predetermined mounting position on the substrate 18 based on the position of the component 28. In this case, since the component tilt angle measuring means (line laser sensor 27) measures the position of the component 28 in addition to the tilt angle θ1 of the component 28, a dedicated camera for measuring the position of the component 28 is used. (Parts camera 22) becomes unnecessary, and the manufacturing cost can be reduced correspondingly.

  The component inclination angle measuring means may use a laser sensor instead of the line laser sensor 27. Similarly, the board inclination angle measuring means may be replaced with the height measuring laser sensor 31 and replaced with a line laser sensor. It may be used. Further, the component tilt angle measuring unit and the substrate tilt angle measuring unit are not limited to the laser sensor, and may be configured using a 3D measuring camera or a three-dimensional measuring machine. Also, a mechanism for moving one tilt angle measuring means upside down is provided, and one tilt angle measuring means is moved upside down so that the tilt angle θ1 of the component 28 and the tilt angle θ2 of the substrate 18 are moved. Both of them may be measured.

  If a plurality of suction nozzles 26 are held by the mounting head 16, the components 28 are sucked by the plurality of suction nozzles 26 held by the mounting head 16, and then the inclination angle θ 1 of each component 28 is set. It is only necessary to measure and correct the inclination angle of each suction nozzle 26.

  In addition, the present invention is not limited to the above-described embodiments. For example, the difference | θ1−θ2 | between the inclination angle θ1 of the component 28 and the inclination angle θ2 of the substrate 18 is so small that the component mounting accuracy is hardly affected. In this case, it goes without saying that the component 28 may be mounted on the substrate 18 without correcting the inclination angle of the suction nozzle 26, and various modifications can be made without departing from the spirit of the invention.

  DESCRIPTION OF SYMBOLS 11 ... Control apparatus (control means, image processing means) 16 ... Mounting head, 17 ... Mounting head moving device, 18 ... Substrate, 19 ... Substrate transport device, 20 ... Clamp device, 21 ... Component supply device, 22 ... Parts camera , 23 ... Mark camera, 25 ... Suction nozzle tilt angle adjusting device (suction nozzle tilt angle adjusting means), 26 ... Suction nozzle, 27 ... Line laser sensor (part tilt angle measuring means), 28 ... Parts, 31 ... Height measurement Laser sensor (substrate tilt angle measuring means)

Claims (5)

In a component mounting machine that adsorbs components supplied by a component supply device to an adsorption nozzle and mounts them on a substrate
A suction nozzle tilt angle adjusting means for holding the suction nozzle to be tiltable and adjusting a tilt angle of the suction nozzle;
Component tilt angle measuring means for measuring the tilt angle of the component sucked by the suction nozzle;
Control means for adjusting the inclination angle of the suction nozzle by operating the suction nozzle inclination angle adjusting means so as to correct the inclination of the part based on the inclination angle of the part measured by the part inclination angle measuring means. A component mounting machine characterized by Provided with a board inclination angle measuring means for measuring the inclination angle of the board on which the component is mounted,
The control means is configured such that the lower surface of the component is parallel to the upper surface of the substrate based on the inclination angle of the component measured by the component inclination angle measurement device and the inclination angle of the substrate measured by the substrate inclination angle measurement device. 2. The component mounting machine according to claim 1, wherein the suction nozzle tilt angle adjusting means is operated to adjust the tilt angle of the suction nozzle. An image processing unit that operates the suction nozzle tilt angle adjusting unit to adjust the tilt angle of the suction nozzle and then picks up a component sucked by the suction nozzle from below and recognizes the position of the component by image processing. With
The control unit moves a mounting head that holds the suction nozzle so that the component is mounted at a predetermined mounting position on the substrate based on a recognition result of the position of the component by the image processing unit. The component mounting machine according to claim 1 or 2. The component tilt angle measuring means also measures the position of the component when measuring the tilt angle of the component sucked by the suction nozzle,
The control means calculates the position displacement amount of the component by adjusting the inclination angle of the suction nozzle based on the component inclination angle measured by the component inclination angle measurement means, and calculates the position of the component by the position displacement amount. The mounting head that holds the suction nozzle is moved so that the component is mounted at a predetermined mounting position on the substrate based on the corrected position of the component. The component mounting machine described in 1.   The control means performs error processing by determining that the adjustable angle range is exceeded when a component inclination angle measured by the component inclination angle measuring means is equal to or greater than a predetermined angle. The component mounting machine according to any one of 1 to 4.

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