WO2023195450A1

WO2023195450A1 - Ceramic electronic component

Info

Publication number: WO2023195450A1
Application number: PCT/JP2023/013831
Authority: WO
Inventors: 裕史大家
Original assignee: 株式会社村田製作所
Priority date: 2022-04-04
Filing date: 2023-04-03
Publication date: 2023-10-12

Abstract

A ceramic electronic component (101) is provided with a body (1) having a structure in which a plurality of ceramic layers are stacked in a first direction (91). A coil is formed inside the body (1). The coil includes: a first conductor via (41) and a second conductor via (42) which are spaced apart from each other in a second direction (92) perpendicular to the first direction (91) inside the body (1) and are disposed to extend in the first direction (91); a first conductor pattern (51); and a second conductor pattern (52). At least a part of each of the first conductor pattern (51) and the second conductor pattern (52) is in the shape of a line extending in the second direction (92) inside the body (1). The first conductor via (41) and the second conductor via (42) are connected by both the first conductor pattern (51) and the second conductor pattern (52). A portion of the first conductor pattern (51) midway between the first conductor via (41) and the second conductor via (42) and a portion of the second conductor pattern (52) midway between the first conductor via (41) and the second conductor via (42) are connected by one or more central conductor vias (4).

Description

ceramic electronic components

The present invention relates to ceramic electronic components.

An example of the coil component is described in International Publication WO2021/053915A1 (Patent Document 1). This coil component includes a laminate in which a plurality of ceramic layers are laminated, and a coil formed by a wiring pattern is formed inside the laminate.

International publication WO2021/053915A1

The wiring pattern may be formed by screen printing on each ceramic layer. The plurality of ceramic layers are pressed in a stacked state. The wiring pattern formed by screen printing is crushed when the laminate is pressed. At this time, the wiring pattern located close to the conductive via is not crushed much because the surrounding conductor density is high, but the wiring pattern located far from the conductive via is pressed by the ceramic layer and crushed. Therefore, even if one looks at a single wiring pattern, the thickness will be different between the central part far from the conductive via and the end part close to the conductive via. At a location where the wiring pattern is significantly crushed, paying attention to the cross-sectional shape of the wiring pattern, both ends in the width direction are sharp like a beak, and electrolysis tends to concentrate on these sharp parts. If electrolysis concentrates at such a sharp end, energy will be lost and the Q value will deteriorate.

Furthermore, if the winding axis of the coil is parallel to the ceramic layer, the wiring patterns may be arranged in the same layer. If a wiring pattern located far from a conductive via, that is, a wiring pattern located far from a conductive via, is crushed by the ceramic layer and spreads in the width direction, the distance between adjacent wiring patterns placed on the same layer becomes narrower. If the distance between adjacent wiring patterns changes, the characteristics of the coil will also change.

Therefore, an object of the present invention is to provide a ceramic electronic component that can suppress collapse of wiring that forms part of a coil.

In order to achieve the above object, a ceramic electronic component based on the present invention includes a main body including a structure in which a plurality of ceramic layers are stacked in a first direction. A coil is formed inside the main body. The coil includes a first conductor via and a second conductor via which are spaced apart from each other in a second direction perpendicular to the first direction and extend in the first direction inside the main body. , a first conductor pattern, and a second conductor pattern. At least a portion of each of the first conductor pattern and the second conductor pattern has a linear shape extending in the second direction inside the main body. The first conductor via and the second conductor via are connected by the first conductor pattern. The first conductor via and the second conductor via are also connected by the second conductor pattern. In the middle of the section between the first conductor via and the second conductor via in the first conductor pattern, and between the first conductor via and the second conductor in the second conductor pattern It is connected to the middle of the section existing in , by one or more intermediate conductor vias.

According to the present invention, in the middle of the section existing between the first conductive via and the second conductive via in the first conductive pattern and between the first conductive via and the second conductive via in the second conductive pattern. Since the middle of the section existing in is connected by one or more intermediate conductor vias, it is possible to suppress collapse of the wiring forming a part of the coil.

1 is a perspective view of a ceramic electronic component in Embodiment 1 based on the present invention. 1 is a partial perspective view of a coil included in a ceramic electronic component in Embodiment 1 based on the present invention. 1 is a partial cross-sectional view of a ceramic electronic component in Embodiment 1 based on the present invention. FIG. 2 is an explanatory diagram of the first step of the method for manufacturing a ceramic electronic component in Embodiment 1 based on the present invention. FIG. 3 is an explanatory diagram of the second step of the method for manufacturing a ceramic electronic component in Embodiment 1 based on the present invention. It is an explanatory view of the third process of the manufacturing method of the ceramic electronic component in Embodiment 1 based on the present invention. FIG. 7 is an explanatory diagram of the fourth step of the method for manufacturing a ceramic electronic component in Embodiment 1 based on the present invention. It is an explanatory view of the 5th process of the manufacturing method of the ceramic electronic component in Embodiment 1 based on the present invention. FIG. 7 is an explanatory diagram of the sixth step of the method for manufacturing a ceramic electronic component in Embodiment 1 based on the present invention. It is an explanatory view of the 7th process of the manufacturing method of the ceramic electronic component in Embodiment 1 based on the present invention. It is an explanatory view of the 8th process of the manufacturing method of the ceramic electronic component in Embodiment 1 based on the present invention. It is an explanatory view of the 9th process of the manufacturing method of the ceramic electronic component in Embodiment 1 based on the present invention. It is an explanatory view of the 10th process of the manufacturing method of the ceramic electronic component in Embodiment 1 based on the present invention. FIG. 3 is an explanatory diagram of a state in which the first conductor pattern and the second conductor pattern are crushed and deformed by press working. FIG. 3 is an explanatory diagram of an example in which the number of intermediate conductor vias is one. FIG. 3 is an explanatory diagram of an example in which the number of intermediate conductor vias is three. FIG. 3 is an explanatory diagram of an example in which the number of intermediate conductor vias is five. It is a partial perspective view of the coil contained in the ceramic electronic component in Embodiment 2 based on this invention. FIG. 3 is a partial plan view of a coil included in a ceramic electronic component according to a second embodiment of the present invention. It is a perspective view of the ceramic electronic component in Embodiment 2 based on this invention. FIG. 7 is a partial cross-sectional view of a ceramic electronic component in Embodiment 3 based on the present invention. FIG. 7 is an explanatory diagram of a first ceramic green sheet used for manufacturing a ceramic electronic component in Embodiment 3 based on the present invention. FIG. 7 is an explanatory diagram of a second ceramic green sheet used for manufacturing a ceramic electronic component in Embodiment 3 based on the present invention.

The dimensional ratios shown in the drawings do not necessarily faithfully represent the reality, and the dimensional ratios may be exaggerated for convenience of explanation. In the following description, references to the concepts of top or bottom do not necessarily mean absolute top or bottom, but may mean relative top or bottom within the illustrated posture. .

(Embodiment 1)
A ceramic electronic component according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 shows a perspective view of the internal structure of a ceramic electronic component 101 in this embodiment.

The ceramic electronic component 101 includes a main body 1 including a structure in which a plurality of ceramic layers are stacked in a first direction 91. A coil is formed inside the main body 1. Figure 2 shows a portion of this coil taken out. FIG. 3 shows a partial cross-sectional view of the ceramic electronic component 101 in which a portion of this coil is visible. What is shown in FIGS. 2 and 3 corresponds to a portion of one turn of the coil.

This coil includes a first conductor via 41 and a second conductor arranged in a second direction 92 perpendicular to the first direction 91 inside the main body 1 so as to be spaced apart from each other and extending in the first direction 91. Via 42 is included. Furthermore, this coil includes a first conductor pattern 51 and a second conductor pattern 52. At least a portion of each of the first conductor pattern 51 and the second conductor pattern 52 has a linear shape extending in the second direction 92 inside the main body 1 . The first conductor via 41 and the second conductor via 42 are connected by a first conductor pattern 51. The first conductive via 41 and the second conductive via 42 are also connected by a second conductive pattern 52. In the middle of the section existing between the first conductor via 41 and the second conductor via 42 in the first conductor pattern 51 and between the first conductor via 41 and the second conductor via 42 in the second conductor pattern 52 The intermediate conductor vias 4 are connected to the middle of the section existing in the section.

Note that the direction of the winding axis of this coil is the third direction 93. The third direction 93 is a direction perpendicular to both the first direction 91 and the second direction 92.

In this embodiment, in the middle of the section between the first conductor via 41 and the second conductor via 42 in the first conductor pattern 51, and in the section between the first conductor via 41 and the second conductor via in the second conductor pattern 52, Since the middle of the section existing between the conductor via 42 is connected by one or more intermediate conductor vias 4, the first conductor pattern 51 and the second conductor pattern 52 are connected even when the laminate is pressed. It is possible to prevent the intermediate portion from collapsing. That is, it is possible to suppress collapse of the wiring that forms part of the coil. Thereby, deterioration of the Q value can be suppressed. Furthermore, it is possible to reduce characteristic variations due to coil coupling variations.

Note that, when viewed from the first direction 91, it is preferable that the first conductor pattern 51 and the second conductor pattern 52 have the same shape and the same size. By adopting this configuration, design becomes easy.

(Production method)
A manufacturing method for obtaining the ceramic electronic component 101 will be explained.

First, as shown in FIG. 4, a ceramic green sheet 21 is prepared. Ceramic green sheet 21 is held by carrier film 20. In FIG. 4, a ceramic green sheet 21 is arranged to cover the lower surface of the carrier film 20.

Next, as shown in FIG. 5, a through hole 22 is formed. The through hole 22 is formed so as to penetrate the carrier film 20 and the ceramic green sheet 21 all at once. The through hole 22 can be formed by laser processing, for example. As shown in FIG. 6, the through holes 22 are filled with conductive paste 23 and dried.

Next, as shown in FIG. 7, a conductor pattern 24 is formed on the surface of the ceramic green sheet 21 as necessary. The conductive pattern 24 can be formed on the surface of the ceramic green sheet 21 by, for example, screen printing a conductive paste. The conductor pattern 24 may be formed by other methods. The conductor pattern 24 will later become a first conductor pattern 51, a second conductor pattern 52,

conductor patterns

5, 8, etc.

The ceramic green sheet 21 is peeled off from the carrier film 20 and laminated. By stacking a plurality of ceramic green sheets 21, a laminate is formed as shown in FIG. 8. The plurality of ceramic green sheets 21 become the plurality of insulating layers 2. Each process is progressing as a collective substrate corresponding to multiple ceramic electronic components. In FIG. 8, the laminate extends to the left and right, but a portion corresponding to one ceramic electronic component 101 is displayed in the center. FIG. 8 shows the state of the collective substrate before it is cut into individual product sizes. In FIG. 8, the cut surface 13 is also shown. The cut surface 13 is a surface to be cut later.

As shown in FIG. 8, the lower end of the first conductor via 41 is connected to the conductor pattern 8. The upper end of the first conductor via 41 is connected to the first conductor pattern 51. The second conductor pattern 52 is connected to the middle of the first conductor via 41 . The upper end of the second conductor via 42 is connected to the first conductor pattern 51. The second conductor pattern 52 is connected to the middle of the second conductor via 42 . The lower end of the second conductor via 42 is connected to the conductor pattern 5. The conductor pattern 5 is arranged below the conductor pattern 8. The conductor pattern 5 and the conductor pattern 6 are connected by a conductor via 7. The conductor pattern 6 is arranged on the lower surface of the laminate and exposed to the outside.

Pressing is performed on the laminate shown in FIG. 8. As shown in FIG. 9, the conductor pattern 6 disposed on the lower surface sinks into the lowermost insulating layer 2.

The steps up to this point were carried out with the assembled substrate 11 as shown in FIG. The collective substrate 11 is held by a carrier sheet 25 having adhesive properties. The aggregate substrate 11 is cut at the cutting surface 13 . The cutting may be performed, for example, by dicing. As a result of cutting the collective substrate 11 and removing it from the carrier sheet 25, a plurality of element bodies 12 are obtained as shown in FIG. This element body 12 is subjected to barrel polishing. As a result, the corners of the element body 12 become rounded as shown in FIG.

Further plating treatment is performed. As a result, as shown in FIG. 13, a plating film 10 is formed to cover the conductor pattern 6 on the lower surface. The plating film 10 has, for example, a two-layer structure. In the example shown here, the plating film 10 includes a first plating film 10a and a second plating film 10b.

In addition, in the press working, the first conductor pattern 51 and the second conductor pattern 52 are crushed and deformed to a state as shown in FIG. 14. The first conductor pattern 51 and the second conductor pattern 52 do not deform much in the vicinity of the first conductor via 41, intermediate conductor via 4, and second conductor via 42, but deform significantly in locations far from these. Near the center between the first conductor via 41 and the intermediate conductor via 4, the first conductor pattern 51 and the second conductor pattern 52 each become locally thinner, and the difference between the first conductor pattern 51 and the second conductor pattern 52 becomes thinner. The distance between them is a little narrower. The same applies to the vicinity of the center between the intermediate conductor via 4 and the second conductor via 42. In the vicinity of the first conductor via 41, the intermediate conductor via 4, and the second conductor via 42, the amount of deformation is kept small by the rigidity of these conductor vias, so the distance A and the distance B are approximately equal. The distance B between the first conductor pattern 51 and the second conductor pattern 52 at the center of the first conductor pattern 51 and the second conductor pattern 52 is It is approximately equal to the distance A between the first conductor pattern 51 and the second conductor pattern 52. In FIG. 14, for convenience of explanation, an example in which only one intermediate conductor via 4 is arranged has been described.

As shown in FIGS. 15 to 17, at least one of the one or more intermediate conductor vias 4 is located in a section of the first conductor pattern 51 that exists between the first conductor via 41 and the second conductor via 42. Preferably, it is centrally connected. 15 shows an example with one intermediate conductor via 4, FIG. 16 shows an example with three intermediate conductor vias 4, and FIG. 17 shows an example with five intermediate conductor vias 4. It is preferable that the number of intermediate conductor vias 4 increases because the rigidity increases and the first conductor pattern 51 and the second conductor pattern 52 become less likely to deform during press working. In any of the examples shown in FIGS. 15 to 17, at least one of the one or more intermediate conductor vias 4 is located between the first conductor via 41 and the second conductor via 42 in the first conductor pattern 51. Connected to the center of the existing section.

As shown in FIGS. 15 to 17, one or more intermediate conductor vias are preferably arranged so as to equally divide the section between the first conductor via 41 and the second conductor via 42. By arranging them in this manner, the force acting during press working is distributed as evenly as possible, so that deformation can be efficiently prevented.

(Embodiment 2)
A ceramic electronic component according to a second embodiment of the present invention will be described with reference to FIGS. 18 to 20. FIG. 18 shows a part of the coil included in the ceramic electronic component 102 in this embodiment. FIG. 19 shows a plan view of the portion shown in FIG. 18, that is, a view from the first direction 91. FIG. 20 shows a perspective view of the internal structure of the ceramic electronic component 102. As shown in FIGS. 18 and 19, the diameter of the intermediate conductor via 4 is larger than the diameters of the first conductor via 41 and the second conductor via 42.

When viewed from the first direction 91, each of the one or more intermediate conductor vias 4 is arranged so as not to protrude in the width direction from either the first conductor pattern 51 or the second conductor pattern 52. . In this embodiment, the number of intermediate conductor vias 4 is one, but the same applies even if two or more intermediate conductor vias 4 are provided.

Also in this embodiment, the effects described in Embodiment 1 can be obtained. Generally, when the intermediate conductor via 4 protrudes from the first conductor pattern 51 or the second conductor pattern 52 in the width direction, the distance D in FIG. 20 becomes shorter. Distance D is the distance between one turn and an adjacent turn of a coil included in ceramic electronic component 102 . If the distance D changes, the characteristics of the coil will change. However, in the present embodiment, each of the one or more intermediate conductor vias 4 is arranged so as not to protrude in the width direction from either the first conductor pattern 51 or the second conductor pattern 52. This kind of situation can be avoided.

Although an example in which the shape of the intermediate conductor via 4 is a cylinder is shown here, the shape of the intermediate conductor via 4 is not limited to a cylinder. The shape of the intermediate conductor via 4 may be, for example, an elliptical cylinder or a square cylinder. Even in the case of these shapes, it is preferable that they are arranged so as not to protrude in the width direction from either the first conductor pattern 51 or the second conductor pattern 52.

(Embodiment 3)
A ceramic electronic component according to a third embodiment of the present invention will be described with reference to FIGS. 21 to 23. FIG. 21 shows a part of the coil included in the ceramic electronic component in this embodiment.

The first conductor via 41 includes a portion 41a and a portion 41b. The second conductor via 42 includes a portion 42a and a portion 42b. Three intermediate conductor vias 4 are arranged between the first conductor pattern 51 and the second conductor pattern 52. Here, as an example, the number of intermediate conductor vias 4 is three, but the number of intermediate conductor vias 4 is not limited to this. It is sufficient that one or more intermediate conductor vias 4 are arranged.

The ratio of pores included in one or more intermediate conductor vias 4 is determined by the ratio of pores in the first conductor via 41 and the second conductor via 42 other than the portion between the first conductor pattern 51 and the second conductor pattern 52. Small compared to the pore ratio. That is, the ratio of pores included in intermediate conductor via 4 is smaller than the ratio of pores included in

portions

41a and 42a. A pore is a void. These voids are formed due to the resin component contained in the conductive paste 23 that is filled into the through hole 22 to form the conductive via. The resin component is intentionally mixed in order to bring the shrinkage rate of the conductive paste 23 during firing closer to that of the surrounding ceramic. If the resin component contained in the conductive paste 23 is small, the difference in shrinkage rate will be large compared to the surrounding ceramic, so cracks may occur. However, in this embodiment, one or more intermediate conductors The resin component contained in the conductive paste 23 for forming the via 4 is deliberately made small. As a result, the ratio of pores included in one or more intermediate conductor vias 4 is reduced as described above.

When filling the conductive paste 23 into the through holes 22 formed in the ceramic green sheet 21 for forming the

portions

41a and 42a, the conductive paste 23 containing a large amount of resin component 26 is used, as shown in FIG. It will be done. When filling the conductive paste 23 into the through holes 22 formed in the ceramic green sheet 21 to form the

portions

41b and 42b, the conductive paste 23 containing less resin component 26 is used, as shown in FIG. It will be done. 22 and 23 show a state in which the ceramic green sheet 21 is held by the carrier film 20. Actually, the ceramic green sheet 21 is peeled off from the carrier film 20, and a plurality of ceramic green sheets 21 are stacked.

Also in this embodiment, the effects described in Embodiment 1 can be obtained. Furthermore, in this embodiment, the fact that the pore ratio is small in one or more intermediate conductor vias 4 means that the degree of shrinkage during firing is small, and this is due to the small deformation during press working. It also leads to Since one or more intermediate conductor vias 4 can be stretched with sufficient rigidity, the shape of the coil can be stabilized.

In each of the embodiments described so far, a ceramic electronic component is used in which the winding axis of the coil included in the main body is parallel to the main surface of the laminated insulating layers, that is, perpendicular to the lamination direction. However, the direction of the winding axis of the coil included in the main body is not limited to this. The matters described in each of the above embodiments also apply to a ceramic electronic component in which the winding axis of the coil included in the main body is parallel to the lamination direction, that is, perpendicular to the main surface of the laminated insulating layers.

Note that a combination of a plurality of the above embodiments may be adopted as appropriate.
[Additional note 1]
a body including a structure in which a plurality of ceramic layers are stacked in a first direction;
A coil is formed inside the main body,
The coil includes a first conductor via and a second conductor via arranged in a second direction perpendicular to the first direction inside the main body so as to be spaced apart from each other and extending in the first direction. , including a first conductor pattern and a second conductor pattern,
At least a portion of each of the first conductor pattern and the second conductor pattern is linear extending in the second direction inside the main body,
The first conductor via and the second conductor via are connected by the first conductor pattern,
The first conductor via and the second conductor via are also connected by the second conductor pattern,
In the middle of a section of the first conductor pattern that exists between the first conductor via and the second conductor via, and in the second conductor pattern between the first conductor via and the second conductor via. A ceramic electronic component that is connected to the middle of the section by one or more intermediate conductor vias.
[Additional note 2]
At least one of the one or more intermediate conductor vias is connected to the center of a section of the first conductor pattern that exists between the first conductor via and the second conductor via, Ceramic electronic components listed.
[Additional note 3]
When viewed from the first direction, each of the one or more intermediate conductor vias is arranged so as not to protrude in the width direction from either the first conductor pattern or the second conductor pattern. , the ceramic electronic component according to

appendix

1 or 2.
[Additional note 4]
The ceramic electronic according to any one of Supplementary Notes 1 to 3, wherein the one or more intermediate conductor vias are arranged so as to equally divide the section between the first conductor via and the second conductor via. parts.
[Additional note 5]
The ratio of pores included in the one or more intermediate conductor vias is determined by the ratio of pores in the first conductor via and the second conductor via in a portion other than the portion between the first conductor pattern and the second conductor pattern. The ceramic electronic component according to any one of Supplementary Notes 1 to 4, which is smaller than the pore ratio.
[Additional note 6]
The ceramic electronic component according to any one of Supplementary Notes 1 to 5, wherein the first conductor pattern and the second conductor pattern have the same shape and the same size when viewed from the first direction.

Note that the above-described embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the present invention is indicated by the claims, and includes meanings equivalent to the claims and all changes within the range.

1 Main body, 2 Insulating layer, 4 Intermediate conductor via, 5, 6, 8 Conductor pattern, 7 Conductor via, 10 Plating film, 10a First plating film, 10b Second plating film, 11 Collective substrate, 12 Element body, 13 Cutting surface, 20 carrier film, 21 ceramic green sheet, 22 through hole, 23 conductive paste, 24 conductor pattern, 25 carrier sheet, 26 resin component, 41 first conductor via, 41a, 41b portion, 42 second conductor via, 42a , 42b part, 51 first conductor pattern, 52 second conductor pattern, 91 first direction, 92 second direction, 93 third direction, 101, 102 ceramic electronic component.

Claims

a body including a structure in which a plurality of ceramic layers are stacked in a first direction;
A coil is formed inside the main body,
The coil includes a first conductor via and a second conductor via arranged in a second direction perpendicular to the first direction inside the main body so as to be spaced apart from each other and extending in the first direction. , including a first conductor pattern and a second conductor pattern,
At least a portion of each of the first conductor pattern and the second conductor pattern is linear extending in the second direction inside the main body,
The first conductor via and the second conductor via are connected by the first conductor pattern,
The first conductor via and the second conductor via are also connected by the second conductor pattern,
In the middle of a section of the first conductor pattern that exists between the first conductor via and the second conductor via, and in the second conductor pattern between the first conductor via and the second conductor via. A ceramic electronic component that is connected to the middle of the section by one or more intermediate conductor vias.
At least one of the one or more intermediate conductor vias is connected to the center of a section of the first conductor pattern that exists between the first conductor via and the second conductor via. Ceramic electronic components described in .
When viewed from the first direction, each of the one or more intermediate conductor vias is arranged so as not to protrude in the width direction from either the first conductor pattern or the second conductor pattern. , The ceramic electronic component according to claim 1 or 2.
The ceramic according to any one of claims 1 to 3, wherein the one or more intermediate conductor vias are arranged to equally divide a section between the first conductor via and the second conductor via. electronic components.
The ratio of pores included in the one or more intermediate conductor vias is determined by the ratio of pores in the first conductor via and the second conductor via in a portion other than the portion between the first conductor pattern and the second conductor pattern. The ceramic electronic component according to any one of claims 1 to 4, wherein the ceramic electronic component is small compared to the proportion of pores.
The ceramic electronic component according to any one of claims 1 to 5, wherein the first conductor pattern and the second conductor pattern have the same shape and the same size when viewed from the first direction.