WO2023189799A1 - 自己架橋性ポリマー及びレジスト下層膜形成組成物 - Google Patents

自己架橋性ポリマー及びレジスト下層膜形成組成物 Download PDF

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Publication number
WO2023189799A1
WO2023189799A1 PCT/JP2023/010815 JP2023010815W WO2023189799A1 WO 2023189799 A1 WO2023189799 A1 WO 2023189799A1 JP 2023010815 W JP2023010815 W JP 2023010815W WO 2023189799 A1 WO2023189799 A1 WO 2023189799A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
aromatic
underlayer film
resist underlayer
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/010815
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
遥 岸川
光 ▲徳▼永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to CN202380031323.4A priority Critical patent/CN118974135A/zh
Priority to JP2024511865A priority patent/JPWO2023189799A1/ja
Priority to US18/850,809 priority patent/US20260022203A1/en
Priority to KR1020247035246A priority patent/KR20240168378A/ko
Publication of WO2023189799A1 publication Critical patent/WO2023189799A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C08G61/124—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2150/00—Compositions for coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10—Definition of the polymer structure
    • C08G2261/14—Side-groups
    • C08G2261/142—Side-chains containing oxygen
    • C08G2261/1424—Side-chains containing oxygen containing ether groups, including alkoxy
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/314—Condensed aromatic systems, e.g. perylene, anthracene or pyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
    • C08G2261/344—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing heteroatoms

Definitions

  • An object of the present invention is to provide a resist underlayer film forming composition containing a polymer resin.
  • It may also be an organic group having a structure in which two or more aromatic rings are connected by a divalent linking group such as an alkylene group.
  • Non-aromatic polycyclic refers to a polycyclic hydrocarbon that does not belong to the aromatic group, and is typically a polycyclic alicyclic compound.
  • Aliphatic polycycles may include aliphatic heteropolycycles (at least one of the monocycles constituting the polycycle is an aliphatic heterocycle), and even if they contain unsaturated bonds as long as they do not belong to aromatic compounds You can also call it ⁇ good''. Includes non-aromatic bicyclic rings, non-aromatic tricyclic rings, and non-aromatic tetracyclic rings.
  • R and R' in formula (II) when at least one of R and R' in formula (II) is an aromatic ring, such an aromatic ring and another unit structure B are bonded, and at the same time, the unit When bonded to the aromatic ring of structure A, it may replace at least a portion of composite unit structure AB as one unit structure C equivalent to composite unit structure AB. Therefore, such a unit structure C may be included in a unit structure including the structure represented by formula (II).
  • the other bonding arm of formula (II) may be bonded to, for example, a polymer terminal group or bonded to an aromatic ring in another polymer chain to form a crosslink.
  • unit structure B forms a covalent bond with the polymer end group.
  • Such polymer terminal groups may or may not be aromatic rings derived from unit structure A.
  • an aromatic ring residue having 6 to 30 carbon atoms which may have a substituent, an unsaturated hydrocarbon group having 1 to 10 carbon atoms which may have a substituent, Examples include hydroxyl group and hydrogen atom.
  • the resist underlayer film forming composition [7] which is an embodiment of the present invention, onto a semiconductor substrate having a portion with a step and a portion without a step (a so-called step substrate), and baking it, It is possible to reduce the level difference between the part having the level difference and the part not having the level difference.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Architecture (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
PCT/JP2023/010815 2022-03-28 2023-03-20 自己架橋性ポリマー及びレジスト下層膜形成組成物 Ceased WO2023189799A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202380031323.4A CN118974135A (zh) 2022-03-28 2023-03-20 自交联性聚合物及抗蚀剂下层膜形成用组合物
JP2024511865A JPWO2023189799A1 (https=) 2022-03-28 2023-03-20
US18/850,809 US20260022203A1 (en) 2022-03-28 2023-03-20 Self-crosslinkable polymer and resist underlayer film forming composition
KR1020247035246A KR20240168378A (ko) 2022-03-28 2023-03-20 자기가교성 폴리머 및 레지스트 하층막 형성 조성물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-051966 2022-03-28
JP2022051966 2022-03-28

Publications (1)

Publication Number Publication Date
WO2023189799A1 true WO2023189799A1 (ja) 2023-10-05

Family

ID=88201087

Family Applications (1)

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PCT/JP2023/010815 Ceased WO2023189799A1 (ja) 2022-03-28 2023-03-20 自己架橋性ポリマー及びレジスト下層膜形成組成物

Country Status (6)

Country Link
US (1) US20260022203A1 (https=)
JP (1) JPWO2023189799A1 (https=)
KR (1) KR20240168378A (https=)
CN (1) CN118974135A (https=)
TW (1) TW202406971A (https=)
WO (1) WO2023189799A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025095106A1 (ja) * 2023-11-02 2025-05-08 日産化学株式会社 レジスト下層膜形成用組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140227887A1 (en) * 2011-09-06 2014-08-14 Dongjin Semichem Co., Ltd. Phenol-based self-crosslinking polymer and resist underlayer film composition including same
JP2019041059A (ja) * 2017-08-28 2019-03-14 信越化学工業株式会社 有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び重合体
JP2019044022A (ja) * 2017-08-30 2019-03-22 信越化学工業株式会社 有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び重合体
CN110041345A (zh) * 2019-05-10 2019-07-23 福建泓光半导体材料有限公司 一种抗蚀剂下层膜单体和组合物及图案形成方法
JP2021105703A (ja) * 2020-06-01 2021-07-26 日産化学株式会社 イオン液体を含むレジスト下層膜形成組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140227887A1 (en) * 2011-09-06 2014-08-14 Dongjin Semichem Co., Ltd. Phenol-based self-crosslinking polymer and resist underlayer film composition including same
JP2019041059A (ja) * 2017-08-28 2019-03-14 信越化学工業株式会社 有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び重合体
JP2019044022A (ja) * 2017-08-30 2019-03-22 信越化学工業株式会社 有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び重合体
CN110041345A (zh) * 2019-05-10 2019-07-23 福建泓光半导体材料有限公司 一种抗蚀剂下层膜单体和组合物及图案形成方法
JP2021105703A (ja) * 2020-06-01 2021-07-26 日産化学株式会社 イオン液体を含むレジスト下層膜形成組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025095106A1 (ja) * 2023-11-02 2025-05-08 日産化学株式会社 レジスト下層膜形成用組成物

Also Published As

Publication number Publication date
KR20240168378A (ko) 2024-11-29
TW202406971A (zh) 2024-02-16
US20260022203A1 (en) 2026-01-22
CN118974135A (zh) 2024-11-15
JPWO2023189799A1 (https=) 2023-10-05

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