WO2023188724A1

WO2023188724A1 - Printing device

Info

Publication number: WO2023188724A1
Application number: PCT/JP2023/001795
Authority: WO
Inventors: 正幸萬谷; 亮妹尾
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2022-03-31
Filing date: 2023-01-20
Publication date: 2023-10-05
Also published as: CN117858806A

Abstract

This printing device: prints a solder paste onto a first board using a first mask; prints the solder paste onto a second board using a second mask; after replacement with the second mask, measures a tension of the second mask; and if it is determined, on the basis of the measured tension of the second mask, that suction of second regions positioned on both sides of a first region capable of coming into contact with the first or second board is required for plate release between the second board and the second mask, sucks the second regions.

Description

printing device

The present disclosure relates to a printing device.

Patent Document 1 discloses a printing device that prints solder on a printed circuit board heavily mounted on the lower surface of the mask by supplying paste-like solder to the upper surface of the mask and then scratching the upper surface of the mask with a squeegee. The printing device includes a substrate having a mask, a squeegee, a squeegee motor that displaces the squeegee in a direction away from and an approach toward the mask, and an elevating section that displaces a printed circuit board in a direction away from and an approach toward the mask. A support device, a detection unit that detects the amount of depression of the squeegee when the squeegee is lowered from a state in which it is in contact with the mask, and the current value of the squeegee motor reaches a predetermined set value, and the amount of depression detected by the detection unit. A calculation unit calculates the amount of change in the amount of depression by comparing the amount with a reference value, and the amount of change in tension is specified from the amount of change in the amount of depression calculated by the calculation unit. The printing device changes the plate separation control pattern based on the specified amount of change in tension, and executes a plate separation operation based on the changed plate separation control pattern.

Japanese Patent Application Publication No. 2014-33645

In the production of printed circuit boards with solder printed on them, printing equipment removes the print from the mask in order to prevent deterioration in print quality, such as misalignment of the printed solder position due to plate separation and deterioration of the shape of the printed solder. It is desirable to release the substrate uniformly. However, the printing apparatus executes the plate separation operation by changing the amount of descent of the printed circuit board and the descending operation time (that is, the plate separation time) at the time of plate separation, based on the amount of change in the tension of the mask. When such a plate separation operation is performed, the printed circuit board first begins to separate from the periphery of the printed circuit board, and then completes separation from the periphery toward the center of the printed circuit board. In other words, in the printing apparatus, there is a possibility that the shape of the printed solder may be distorted and the printing quality may be deteriorated due to a change in the time at which the printed circuit board is separated from the mask at the periphery and the center thereof.

The present disclosure was devised in view of the conventional situation described above, and an object of the present disclosure is to provide a printing device that performs plate separation control more suitable for changes in mask tension and suppresses deterioration in print quality of solder paste. do.

The present disclosure includes printing a solder paste on a first substrate using a first mask provided with a first printed pattern, and printing a solder paste on a second substrate using a second mask provided with a second printed pattern. A printing device that prints the solder paste on a substrate, wherein the first mask and the second mask have a first region and a second region located on both sides of the first region. The printing device includes a holding unit that holds the substrate, a measurement unit that measures the tension of the first mask and the second mask, and a suction unit that is capable of suctioning the first area of the second mask. a suction part, and after the first mask is replaced with the second mask, the tension of the second mask is measured by the measurement part, and the second mask is measured by the measurement part. a control unit that determines whether suction of the second area by the suction unit is necessary during plate separation between the second substrate and the second mask, which is performed by the holding unit, based on the tension; Provided is a printing device comprising: the control unit causing the suction unit to suction the second area when it is determined that suction of the second area is necessary.

According to the present disclosure, it is possible to perform plate separation control more suitable for changes in mask tension and suppress deterioration in print quality of solder paste.

An overall perspective view of a printing device according to Embodiment 1 A partially transparent perspective view of a printing device according to Embodiment 1 A transparent side view of the printing device according to Embodiment 1 Partial cross-sectional side view of the printing section Diagram explaining an example of a print head Partial plan view of printing department A partial plan view of the printing section included in the printing device. Plan view showing an example of a mask Bottom view showing how the mask is held by the mask holding section Front view showing how the mask is guided by the mask guide Partial plan view of the printing section in Embodiment 1 Plan view of the printing section in Embodiment 1 Diagram showing an example of a tension measuring device A block diagram showing a control system of a printing apparatus according to Embodiment 1 Flowchart illustrating an example of a plate separation operation procedure of the printing apparatus according to the first embodiment Diagram illustrating an example of storage operation of the printing device Diagram illustrating an example of storage operation of the printing device Diagram illustrating an example of the pulling operation of the printing device Diagram illustrating an example of the pulling operation of the printing device Diagram explaining an example of mask tension measurement Diagram illustrating an example of a tension measuring device Diagram explaining plate separation mode (normal mode) Diagram explaining plate separation mode (mask adsorption plate separation mode) Diagram comparing control examples of the table lifting mechanism for each plate separation mode A diagram illustrating an example of an operation procedure when changing a mask model of a printing apparatus according to Embodiment 2.

Hereinafter, embodiments specifically disclosing the configuration and operation of a printing apparatus, a mask printing method, and a solder substrate manufacturing method according to the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of well-known matters or redundant explanations of substantially the same configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

(Embodiment 1)
First, with reference to FIG. 1, the printing apparatus 11 in the first embodiment will be described. FIG. 1 is an overall perspective view of a printing apparatus 11 according to the first embodiment.

The printing device 11 according to the first embodiment includes a printing unit 13 that prints solder paste Pst (see FIG. 2) such as solder paste on the upper surface of a substrate KB (see FIG. 2) as a printing target, and This device includes a mask changer 15 that stores masks 27 (see FIG. 2) supplied to the section 13. The mask 27 includes a stencil SUS provided with an opening pattern for printing the solder paste Pst on the substrate KB, and a mask frame 271 (see FIG. 8) that holds the stencil SUS while applying tension.

The printing unit 13 has a substrate transport holding unit 21 on a base 19 (see FIG. 2) covered by a printing unit cover 17, and prints solder paste Pst on the board KB transported to a predetermined printing position. .

The mask changer 15 is provided adjacent to the rear of the printing section 13. The housing 23 of the mask changer 15 has an internal space SP (see FIG. 2) in which the magazine 25 can be stored, and a mask 27 is stored in the lower part of the rear side of the housing 23 in the internal space SP. An opening 29 is provided through which the magazine 25 can be taken in and taken out. The mask changer 15 has a mask passing opening 71 (see FIG. 2) for supplying the mask 27 to the printing section 13, and is spatially connected to the inside of the printing section 13 through this mask passing opening 71. The housing 23 of the mask changer 15 has a touch panel 31 capable of outputting an alarm sound or an alarm screen, or other illumination device (for example, LED, etc.) at the upper part of the rear side.

Next, an overview of the printing section 13 and mask changer 15 will be explained with reference to FIGS. 2 to 4. FIG. 2 is a partially transparent perspective view of the printing device 11 according to the first embodiment. FIG. 3 is a perspective side view of the printing device 11 according to the first embodiment. FIG. 4 is a partially sectional side view of the printing section 13.

A mask guide 33 is provided above the substrate transport/holding section 21 . The mask guide 33 has an L-shaped cross section, and supports the mask 27 on the bottom surface (horizontal portion 95) while guiding the mask 27 to the mask holding position of the mask holding portion 35 on the side surface (vertical portion 97). . A print head 37 and a gas blowing section 43 are provided above the mask guide 33, respectively. Furthermore, two left and right cylinders 45 and four front, rear, left and right cylinders 47 are provided above the mask holding position. Below the mask guide 33, a camera moving mechanism 49, a camera 51, and a mask lower surface cleaner 53 are provided.

The substrate conveyance holding section 21 is provided on the intermediate conveyor 83. The substrate conveyance/holding section 21 holds the substrate KB, which is lifted and lowered in the Z-axis direction by the table lifting mechanism 67 and carried onto the intermediate conveyor 83, by sandwiching it between the clampers 87. Thereby, the board transport holding section 21 can suppress the positional shift of the board KB during printing of the solder paste Pst.

Further, the substrate transport and holding section 21 includes a suction section 20 that can suction the lower surface of the stencil SUS of the mask 27 while holding the substrate KB. The suction unit 20 is connected via piping to a pneumatic circuit (not shown) provided in the printing device 11 . A pneumatic pressure generating source is connected to the pneumatic circuit. The pneumatic source includes a vacuum pump and an air supply source. The suction unit 20 is connected to a pneumatic pressure source and a blow valve via a vacuum valve. The vacuum valve enables switching between the vacuum pressure and the blow pressure of the suction unit 20 by switching between an input port and an output port using a suction control unit 173, which will be described later.

The print head 37 includes two squeegees 121, a mask moving section 40, and a tension measuring device 183. The print head 37 is driven by a control section 159A (see FIG. 14).

The gas blowing section 43 functions as a pre-use mask cleaner that blows off dust etc. attached to the top surface of the stencil SUS before it becomes contaminated with solder paste Pst (that is, before use or before the first solder paste Pst is supplied to the mask 27). Function. The gas blowing part 43 includes a tubular part 55 that extends above the movement path of the mask 27 in a horizontal direction intersecting the movement direction (X-axis direction) of the mask 27, and a valve part that is connected to one end side of the tubular part 55. It is equipped with 57 and. The tubular portion 55 is provided on the rear end side of two later-described longitudinal guide portions so as to straddle each of the two longitudinal guide portions.

The mask lower surface cleaner 53 is provided so as to be movable in the Y-axis direction in the region below the mask guide 33 by a mask lower surface cleaner guide (not shown). The mask lower surface cleaner 53 is connected to a movable base 59 of the camera moving mechanism 49 by a movable base connecting portion (not shown) provided on the mask lower surface cleaner 53, and is integrally moved with the movable base 59 in the Y-axis direction. Moving.

When the mask lower surface cleaner 53 is not moved in the Y-axis direction by the moving base 59, it waits at a cleaner standby position located in front of the printing position (see FIG. 2). The mask lower surface cleaner 53 can be freely raised and lowered relative to the mask guide 33 (that is, relative to the mask 27 transported to the printing position) by a lower surface cleaner elevating section (not shown) provided in the mask lower surface cleaner guide. There is.

The mask moving unit 40 has a function of being able to move (transport) the mask 27 between a magazine 25 included in the mask changer 15, which will be described later, and a printing position in the printing unit 13. Specifically, the mask moving section 40 has a function of pulling out the mask 27 from the magazine 25, moving it to a printing position, and returning the mask 27 from the printing position in the printing section 13 to the magazine 25. The mask moving unit 40 is connected to the print head 37 and is movable in the Y-axis direction together with the operation of the print head 37. Further, the mask moving section 40 includes a cylinder 110 and a rod 115. When moving the mask 27, the rod 115 is moved in the Z-axis direction using the cylinder 110, and the rod 115 is brought into contact with the mask frame 271.

The mask changer 15 is provided adjacent to the rear of the printing section 13 and includes a housing 23, a magazine 25, an elevator 65, a mask passage opening 71, and an elevator 73. The elevator 65 includes a nut portion 75 provided at one end of the elevator body 73 having a shape that extends in a horizontal plane, a ball screw 77 that is threaded into the nut portion 75 and extends in the vertical direction, and a ball screw 77 that rotates. It is provided with an elevating body elevating motor 79 to be driven.

In the elevator 65, the ball screw 77 is rotated by the operation of the elevator motor 79, and the elevator 73 is raised and lowered via the nut portion 75 provided on the ball screw 77. The elevator 65 moves the magazine 25 carried in through the opening 29 of the housing 23 to the opening of the housing 23 by raising and lowering the lifting body 73 that supports the magazine 25 between the work space SP1 and the supply space SP2. 29 and the work space SP1, which is a position away from the opening 29, functions as a storage body moving mechanism.

The substrate transport/holding section 21 includes an input conveyor 81, an intermediate conveyor 83, an output conveyor 85, a clamper 87, and a multi-stage table 89. The carry-in conveyor 81, the intermediate conveyor 83, and the carry-out conveyor 85 are lined up in this order in the X-axis direction (referred to as the left-right direction), and the board KB is delivered and conveyed to the carry-in conveyor 81, the intermediate conveyor 83, and the carry-out conveyor 85 in this order. . The board conveyance holding unit 21 moves the board KB carried into the intermediate conveyor 83 up and down in the Z-axis direction, and prints the solder paste Pst on the board KB and prints the space between the lower surface of the stencil SUS of the mask 27 and the board KB. Make version separation executable.

The clamper 87 has a plurality of support pins 219 arranged corresponding to the size, shape, etc. of the board KB. The clamper 87 constitutes a unit together with the intermediate conveyor 83, and supports the substrate KB received by the intermediate conveyor 83 from the carry-in conveyor 81 in a state lifted from the intermediate conveyor 83 by each of the plurality of support pins 219, and Clamp and hold both sides of the board KB. The multi-stage table 89 is provided on the base 19, and the entire unit composed of the intermediate conveyor 83 and the clamper 87 is placed on the XY plane and in the vertical direction (Z-axis direction) with respect to the base 19. move it.

Next, the print head 37 in the first embodiment will be described with reference to FIG. 5. FIG. 5 is a diagram illustrating an example of the print head 37. In addition, in the printing section 13 shown in FIG. 5, illustration of the printing section cover 17 is omitted.

The drive of the print head 37 is controlled by a control unit 159A (see FIG. 13). The control unit 159A controls the two squeegees 121, the mask moving unit 40, and the tension measuring device 183.

The print head 37 includes a squeegee base 119 that extends in the X-axis direction and is movable in the Y-axis direction, two squeegees 121 that are provided below the squeegee base 119, and an upper surface of the squeegee base 119. The squeegee lifting drive unit 123 is provided. Each of the two squeegees 121 is arranged to face each other in the Y-axis direction. The squeegee lift drive section 123 raises and lowers each of the two squeegees 121 independently below the squeegee base 119.

The printing section 13 includes two cylinders 45 as shown in FIG. The cylinder 45 has a lifting rod 117, and the lifting rod 117 can be moved in the Z-axis direction. The lower end of the lifting rod 117 provided in each of the two cylinders 45 can come into contact with the upper surface of the mask frame 271, and fixes the mask 27 placed at the printing position.

The printing unit 13 further includes four cylinders 47. The cylinder 47 has a lifting rod that can be moved in the Z-axis direction. The lower end of the rod 115 included in the cylinder 47 can come into contact with the upper surface of the mask frame 271, and fixes the mask 27 placed at the printing position together with the lifting rod 117 of the cylinder 45. The cylinder 47 presses the four corners of the mask frame 271 downward. In this way, the mask 27 is pressed against the mask guide 33 by each of the

cylinders

45 and 47, and is fixed at the printing position.

The mask moving unit 40 drives the rod 115 using the cylinder 110, lowers the rod 115 along the side surface of the mask frame 271, and then moves the mask changer 15 in the Y-axis direction together with the operation of the print head 37. The mask 27 is stored in the mask changer 15, or the mask 27 is pulled out from the mask changer 15.

The print head 37 includes a squeegee base 119 that extends in the X-axis direction and is movable in the Y-axis direction, two squeegees 121 that are provided below the squeegee base 119, and an upper surface of the squeegee base 119. The squeegee lifting drive unit 123 is provided. The two squeegees 121 are arranged to face each other in the Y-axis direction. The squeegee elevation drive section 123 individually raises and lowers each of the two squeegees 121 below the squeegee base 119.

The print head 37 has a scraper unit 39. The scraper unit 39 functions as a paste collecting section that collects the solder paste Pst of the mask 27. The scraper unit 39 includes a scraper base 133 extending in the X-axis direction, a scraper lifting cylinder 135 provided on the scraper base 133, and a scraper 137 that is lifted and lowered by the scraper lifting cylinder 135. There is. Similar to the squeegee base 119, the scraper base 133 is supported at both left and right ends by the two squeegee base guides 125, respectively. The scraper base 133 is connected to the squeegee base 119 and moves together with the squeegee base 119 in the Y-axis direction. The scraper unit 39 drives the scraper elevating cylinder 135 to move the scraper 137 up and down.

The print head 37 includes an arm portion 139 connected to the scraper base 133, a tension measuring device holding portion 141 connected to the arm portion 139, and a tension measuring device 183.

The arm portion 139 is connected to each of the two cylinders 47 provided on the mask changer 15 side and the tension measuring device holding portion 141. The tension measuring device holding section 141 is connected to the arm section 139 and holds the tension measuring device 183.

The tension measuring device holding section 141 has an opening at the lower part of the tension measuring device holding section 141, and has a configuration in which the measuring element 187 can be placed on the upper surface (the surface on the Z direction side) of the stencil SUS through this opening. The tension measuring device holder 141 moves up and down in the Z-axis direction together with the print head 37, and the tension measuring device holder 141 moves up and down in the Z-axis direction, and the measuring point 187 is at a standby height position at a predetermined distance from the top surface of the SUS stencil. It is raised and lowered between the mounting height position where it is mounted on the upper surface. The tension measuring device holding section 141 is controlled by the control section 159A, measures the tension of the mask 27 after the measuring element 187 is placed on the upper surface of the stencil SUS, and outputs the measurement result to the control section 159A.

FIG. 6 is a partial plan view of the printing section 13. A mask guide 33 is provided above the substrate transport holding section 21 (see FIGS. 3 and 4). The mask guide 33 includes a pair of guide parts 91 that extend in the Y-axis direction (referred to as the front-back direction) and are arranged in parallel to face each other in the X-axis direction, and a pair of guide parts 91 that extend in the X-axis direction at the front ends of the pair of guide parts 91. It has a left-right direction guide part 93 provided extending therefrom. Each of the pair of guide parts 91 is formed to have an L-shaped cross section, and has a horizontal part 95 and a vertical part 97 formed outside the horizontal part 95. On the other hand, the left-right guide portion 93 is configured to be connected to each horizontal portion 95 of the pair of guide portions 91 .

FIG. 7 is a partial plan view of the printing section included in the printing device 11. The mask guide 33 guides the movement of the mask 27 from the printing position to the mask changer 15. The mask 27 has a rectangular shape in plan view, and its left and right Y-axis sides are each guided in the Y-axis direction by a pair of guide portions 91 of the mask guide 33. Mask 27 is fixed in the printing position by cylinder 45 and cylinder 47.

FIG. 8 is a plan view showing an example of the mask 27. The mask 27 is composed of a substantially rectangular metal plate. The mask 27 includes a stencil SUS in which a pattern opening 99 corresponding to an electrode pattern (not shown) formed on the surface of the substrate KB is formed. The outer periphery of the mask 27 is supported by a mask frame 271. The mask frame 271 is composed of a front frame body 103 on the front side in the Y direction, a rear frame body 105 on the rear side in the Y direction, a right frame body 107 on the right side in the X direction, and a left frame body 109 on the left side in the X direction, and is made of stencil SUS. and the mask frame 271 are connected by the connecting member 100.

The rear end side of each of the pair of guide parts 91 of the mask guide 33 is located near the mask changer 15 on the horizontal plane (XY plane) (that is, near the mask passage opening 71 where the mask 27 is pulled out and stored). It extends to The mask guide 33 serves as a transport path for the mask 27 to be transported between the printing position of the mask 27 and the magazine 25 of the mask changer 15.

FIG. 9 is a bottom view showing the mask 27 in the printing position. The gas blowing part 43 is provided with a plurality of gas blowing holes 113 arranged in the X-axis direction on the lower surface side.

FIG. 10 is a front view showing how the mask 27 is guided by the mask guide 33. Each of the two cylinders 45 and each of the four cylinders 47 is fixed to a vertical portion 97 of each of the left and right guide portions 91 of the mask guide 33.

The two left and right cylinders 45 are each provided above the intermediate portion of the two left and right linear portions of the mask holding portion 35 extending in the Y-axis direction. Each of the four cylinders 47 is provided above the four corners of the mask holding section 35 or near the four corners.

FIG. 11 is a partial side view of the printing section 13 in the first embodiment. The mask 27 is fixed at the printing position by the mask frame 271 being pressed by the lifting rod 117 of the cylinder 45 and the rod 115 of the cylinder 47.

FIG. 12 is a plan view of the printing section 13 in the first embodiment. The squeegee base 119 has a shape extending in the Y-axis direction.

The left and right ends of the squeegee base 119 are supported by two squeegee base guides 125 that extend in the Y-axis direction and are arranged in parallel to face each other in the X-axis direction. A squeegee base moving ball screw 127 extending in the Y-axis direction is provided on the outside (outside in the X-axis direction) of one of the two squeegee base guides 125 .

The squeegee base moving ball screw 127 is screwed into a squeegee base nut 129 provided on the squeegee base 119. The squeegee base moving ball screw 127 is connected to the squeegee base drive motor 131, and when the squeegee base moving ball screw 127 is rotated by the drive of the squeegee base drive motor 131, the squeegee base 119 is moved in the Y-axis direction via the squeegee base nut 129. Moving.

The mask top surface cleaner 41 has a function of cleaning the top surface of the stencil SUS after the solder paste Pst is collected by the scraper unit 39, and is attached to the squeegee base 119 as shown in FIG. . As a result, the mask upper surface cleaner 41 is integrated with the squeegee base 119 to move and clean the mask 27, which has been transported to the printing position together with the print head 37, in the Y-axis direction. Note that in FIG. 11, illustration of the mask upper surface cleaner 41 is omitted.

The gas blowing part 43 includes a tubular part 55 that extends above the movement path of the mask 27 in a horizontal direction intersecting the movement direction (X-axis direction) of the mask 27, and a valve part that is connected to one end side of the tubular part 55. It is equipped with 57 and. The tubular portion 55 is provided at the rear end side of each of the two guide portions 91 so as to straddle each of the two guide portions 91 .

The tubular portion 55 supplies high-pressure gas GS via the valve portion 57 and injects the high-pressure gas GS from each of the plurality of gas jet holes 113 (see FIG. 12) toward the upper surface of the stencil SUS located below. Note that the mask top surface cleaner 41 is not limited to a device that sprays gas onto the top surface of the stencil SUS (that is, a device that blows); for example, a device that sucks the top surface of the stencil SUS, a device that brushes the top surface of the stencil SUS, or a device that wipes the top surface of the stencil SUS. It may also be something.

In the camera moving mechanism 49, a camera housing 153 of the camera 51 is attached to a moving base 59. The camera housing 153 is formed in a substantially hexahedral shape. In the camera housing 153, a lower imaging camera 155 is attached to the lower surface, and an upper imaging camera 157 is attached to the upper surface thereof, with their optical axes extending along the Z-axis.

The camera moving mechanism 49 can move the suction section 63 in the Y-axis direction by moving the moving base 59 in the Y-axis direction. The suction section 63 can further be moved by the YZ actuator 61 with respect to the movable base 59 in the direction along the Y axis and the direction along the Z axis. The movement mechanism of this YZ actuator 61 may be a linear drive mechanism, a linear motor mechanism, or the like composed of a rack and a pinion.

The suction section 63 is moved by the camera moving mechanism 49 to just in front of the mask passage opening 71. The suction unit 63 is moved to just before the mask passage opening 71, and then raised and lowered by the YZ actuator 61 to the storage height (in the Z-axis direction) of the mask 27 to be supplied, and then moved backward by the YZ actuator 61. Then, it enters the inside of the mask changer 15 and is moved to the position of the frame 101 (specifically, the front frame body 103) of the mask 27 stored in the magazine 25.

Furthermore, the suction section 63 is further moved in the Y-axis direction from this mask-facing position. This allows the suction unit 63 to finely adjust the suction position with respect to the frame 101. The suction unit 63, which has been finely adjusted to the suction position, suctions the side surface of the frame 101 (specifically, the front frame body 103) of the mask 27 stored in the magazine 25 of the mask changer 15, and the inside of the magazine 25. The mask 27 can be pulled out into the printing section 13 through the mask passage opening 71 from the mask passage opening 71 .

The operation of pulling out and storing the mask 27 is performed by the camera moving mechanism 49 and the print head 37. The camera moving mechanism 49 pulls out the mask 27 from inside the magazine 25 to the middle of the printing position inside the printing section 13. The print head 37 transports the mask 27 that has been pulled out halfway inside the printing section 13 to a printing position where printing processing is performed.

The suction unit 63 is connected to, for example, a pneumatic circuit (not shown) provided in the printing device 11 through piping. A pneumatic pressure generating source is connected to the pneumatic circuit. The pneumatic source includes a vacuum pump and an air supply source. The suction unit 63 is connected to a pneumatic pressure source and a blow valve via a vacuum valve. The vacuum valve makes it possible to switch between the vacuum pressure and the blow pressure of the adsorption section 63 by switching between an input port and an output port using a control section 159A, which will be described later.

The mask changer 15 and camera moving mechanism 49 pull out the mask 27 stored in the magazine 25 from the magazine 25 and transport it to the printing position.

Here, the tension measuring device 183 will be explained with reference to FIG. 13. FIG. 13 is a diagram illustrating an example of the tension measuring device 183. FIG. 3 is a perspective view of an arm section 139 and a tension measuring device holding section 141. The tension measuring device 183 is held by a tension measuring device holding section 141 provided on the arm section 139. The arm portion 139 is provided on the print head 37, and the tension measuring device 183 is driven integrally with the print head 37.

The tension measuring device 183 measures the tension of the mask 27. The tension measuring device 183 has an arm portion 139 in the print head 37 and a tension measuring device holding portion 141 connected to each other, and is moved integrally with the print head 37 in each of the X-axis direction, the Y-axis direction, and the Z-axis direction. Ru. The tension measuring device 183 measures the tension of the mask 27 when replacing the mask 27 or every time a predetermined number of substrates KB are printed, and outputs the measurement result to the tension measurement control section 178.

Specifically, the tension measuring device 183 has a configuration in which a measuring element 187 capable of measuring tension can be placed on the upper surface of the stencil SUS through an opening 185 formed in the tension measuring device holding portion 141. When the tension measurement device 183 is placed on the top surface of the stencil SUS by the tension measurement control unit 178, the measuring element 187 is placed on the top surface of the stencil SUS through the opening 185, and the tension is measured.

The tension measuring device 183 includes a housing 191, a tension measuring device holding section 141, and a tension gauge 193. The tension measuring device holding section 141 is connected to the arm section 139, faces the mask 27, and has a substantially rectangular installation surface. The tension measuring device holding section 141 supports the housing 191 and the tension gauge 193, and accommodates the measuring element 187 in an opening 185 formed at approximately the center of the installation surface.

The housing 191 is formed into a cylindrical shape, and accommodates the probe 187, the spindle shaft 189, and the measurement load 195, respectively. When the measuring element 187 is placed on the upper surface of the stencil SUS, a measurement load 195 is applied. The tension of the mask 27 is measured. The spindle shaft 189 is fixedly connected between the measuring head 187 and the connecting part 190, and is moved up and down in the Z-axis direction together with the measuring head 187 to which a measuring load 195 is applied when measuring tension. Ru. The connecting portion 190 is connected between the spindle shaft 189 and the tension gauge 193, respectively. In the connection part 190, the tension that pulls the tension gauge 193 or the height position of the connection part 190 changes based on the measurement load 195 applied in the -Z direction and the reaction in the Z direction received from the mask 27.

The tension gauge 193 is connected to the connection part 190 and measures the tension of the mask 27 based on the tension in the -Z direction transmitted by the connection part 190 or the amount of descent of the connection part 190 in the -Z direction. measure. The tension gauge 193 is electrically connected to the tension measurement control section 178 and outputs a measurement result to the tension measurement control section 178.

Next, with reference to FIG. 14, a control system of the printing apparatus 11 according to the first embodiment will be described. FIG. 14 is a block diagram showing a control system of the printing apparatus 11 according to the first embodiment.

The control unit 159A in the printing device 11 is a so-called processor, and is configured using, for example, a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and performs various processing and control in cooperation with the memory 159B. conduct. Specifically, the control unit 159A refers to programs and data held in the memory 159B, and executes the programs to implement the functions of each unit. Note that each section referred to here includes a substrate transport/holding control section 165, a mask transport/installation control section 167, a printing operation control section 169, an imaging control section 171, an adsorption control section 173, a scraper control section 174, an elevator control section 175, and a viscometer. They include a control section 177, a tension measurement control section 178, and the like.

The memory 159B includes, for example, a RAM (Random Access Memory) as a work memory used when executing each process of the control unit 159A, and a ROM (Read Only Memory) that stores programs and data that define the operation of the control unit 159A. and has. Data or information generated or acquired by the control unit 159A is temporarily stored in the RAM. A program that defines the operation of the control unit 159A is written in the ROM.

The memory 159B stores, based on the tension of the mask 27 measured by the tension measuring device 183, a first threshold value and a second threshold value for determining the plate separation mode of the substrate KB. The first threshold is a threshold for determining whether the measured tension of the mask 27 is a value that allows normal plate separation control to be performed. The second threshold value is a value smaller than the first threshold value, and is a threshold value for determining whether the measured tension of the mask 27 is a value that allows execution of the mask suction plate separation mode. Note that the first threshold value and the second threshold value may be set to different values for each type of mask 27.

Furthermore, the memory 159B stores production data for each mask 27 to be printed and information regarding the masks stored in the magazine 25 of the mask changer 15. Note that the production data includes at least information on the size of each mask and identification information on each mask. Further, the information regarding the masks includes identification information of each mask, information on the storage position in the magazine 25, information on whether the mask has been used for solder printing, and the like.

The substrate transport/holding control unit 165 controls the transport of the substrate KB by the substrate transport/holding unit 21 (specifically, carry-in control, carry-out control) and holding control. Further, the substrate transport/holding control unit 165 executes positioning control of the substrate KB with respect to the mask 27 based on a captured image of the substrate KB captured by the camera 51 when the substrate KB is carried in. When acquiring the completion report of the solder printing operation outputted from the printing operation control unit 169, the board transport holding control unit 165 moves the plurality of feed screws 69 of the table lifting mechanism 67 based on the currently set plate separation mode. are rotated by a motor (not shown) to lower the substrate conveying and holding section 21 in the -Z direction to perform a plate separation operation. The substrate transport/holding control unit 165 carries out the substrate KB which has finished the plate separation operation and is now in the plate separation state. Note that the table elevating mechanism 67 may include a cylinder capable of elevating the substrate KB in the Z-axis direction instead of the feed screw 69.

The mask conveyance and installation control unit 167 controls each of the print head 37 and camera movement mechanism 49, and controls the withdrawal and storage of the mask 27 into the mask changer 15. Specifically, the mask transport and installation control unit 167 controls the movement of the moving base 59 in the Y-axis direction by the moving base drive motor 151 and the movement control of the suction unit 63 in the Y-axis direction and the Z-axis direction by the YZ actuator 61. and suction control by the suction unit 63 to the side surface of the frame 101, respectively. After transporting the mask 27 to a predetermined printing position, the mask transport and installation control unit 167 drives each of the

cylinders

45 and 47 to hold the mask 27.

The printing operation control unit 169 controls printing by driving the print head 37 in the X-axis direction, Y-axis direction, and Z-axis direction. Specifically, the printing operation control unit 169 controls the movement of the squeegee base 119 in the Y-axis direction by the squeegee base drive motor 131, and controls the elevation of the squeegee 121 in the Z-axis direction by the squeegee elevation drive unit 123, respectively. do.

The printing operation control unit 169 controls each of the two squeegees 121 based on the parameters of the solder connection operation output from the viscometer control unit 177, and controls each of the two squeegees 121 to transfer the stencil SUS onto the upper surface of the new mask 27. The solder paste Pst is kneaded and adjusted to a predetermined viscosity (target value).

The imaging control unit 171 controls the camera 51 to image the lower surface of the board KB held by the board transport holding unit 21 at a predetermined board transport position and the upper surface of the stencil SUS transported to the printing position. . Specifically, the imaging control unit 171 controls the movement of the moving base 59 in the Y-axis direction by the moving base drive motor 151, controls the movement of the camera 51 along the moving base 59 in the X-axis direction, and controls the movement of the camera 51 in the X-axis direction. Imaging control of the upper surface of the board KB by the lower imaging camera 155 provided, and imaging control of the lower surface of the mask 27 by the upper imaging camera 157 included in the camera 51 are respectively executed.

When the mask 27 stored in the magazine 25 is pulled out, the suction control unit 173 connects a port to a vacuum valve provided in the pneumatic circuit based on a control command to start mask suction transmitted from the control unit 159A. A switching signal is transmitted, and the inside of the suction unit 63 included in the camera moving mechanism 49 is made negative pressure by a vacuum pump, and the side surface of the frame 101 (specifically, the front frame body 103 of the frame 101) is suctioned by the suction unit 63. . In addition, the suction control unit 173 sends a port switching signal to the vacuum valve provided in the pneumatic circuit based on the control command to end mask suction transmitted from the control unit 159A, and changes the port of the vacuum valve to the blow valve. The switch is made to release the suction state of the suction section 63.

In addition, when the plate separation mode is set to the mask suction plate separation mode, the suction control unit 173 sends a port switching signal to the vacuum valve provided in the pneumatic circuit based on the control command transmitted from the tension measurement control unit 178. is transmitted, and the inside of the adsorption part 20 of the substrate transfer holding part 21 is made negative pressure by a vacuum pump, and the lower surface of the stencil SUS (an example of the first region) of the mask 27 (specifically, the substrate KB) is applied to the adsorption part 20. (the side that comes into contact with the surface). Further, the suction control unit 173, after the table lifting mechanism 67 has been lowered by a predetermined height (for example, 5 mm, etc.), based on the control command to end the mask suction transmitted from the tension measurement control unit 178, A port switching signal is sent to the vacuum valve provided in the pneumatic circuit, the port of the vacuum valve is switched to the blow valve, and the suction state of the suction section 20 is released.

The scraper control unit 174 drives the scraper unit 39 and collects the solder paste Pst from the top surface of the currently installed stencil SUS before the mask conveyance and installation control unit 167 starts replacing the mask 27. Furthermore, when the mask conveyance and installation control section 167 finishes replacing the mask 27, the scraper control section 174 transfers the collected solder paste Pst onto the top surface of the newly brought in stencil SUS.

The elevator control unit 175 executes drive control of the elevator motor 79 in the elevator 65 to raise and lower the position (height) of the magazine 25 in the mask changer 15. Further, the elevator control section 175 is configured to include a safety control section 179.

When the scraper control unit 174 completes transferring the solder paste Pst to the upper surface of the newly brought in stencil SUS, the viscometer control unit 177 moves the print head 37 up and down to place the solder paste Pst at the position of the solder paste Pst on the XY plane. The viscometer lifting cylinder 198 is driven to lower the viscometer 197 from the standby height position to the contact height position. The viscometer control unit 177 brings the lower end of the viscometer 197 into contact with the solder paste Pst transferred onto the mask 27, and measures the viscosity of the contacted solder paste Pst. The viscometer control unit 177 obtains the measurement result of the viscosity of the solder paste Pst output from the viscometer 197. Based on the obtained measurement results, the viscometer control unit 177 determines solder connection operation parameters (for example, angle of squeegee 121, printing pressure, connection time, etc.) for adjusting the current viscosity of the solder paste Pst to a predetermined viscosity. Determine. The viscometer control unit 177 outputs the determined solder connection operation parameters to the printing operation control unit 169. When the soldering operation by the printing operation control section 169 is completed, the viscometer control section 177 causes the viscometer 197 to measure the viscosity of the solder paste Pst again.

Note that the viscometer control unit 177 may determine any one of the plurality of printing conditions recorded in advance in the memory 159B. The printing conditions here include the printing angle of the squeegee 121 with respect to each mask 27, the printing speed of the squeegee 121 (that is, the moving speed during printing), and the like.

When a new mask 27 is carried in by the mask conveyance and installation control unit 167, the tension measurement control unit 178 controls the measurement head of the tension measurement device 183 included in the print head 37 based on the size of the mask 27 stored in the memory 159B. The print head 37 is moved so that the print head 187 is located at the center position Pt of the mask 27 (see FIG. 22) and at the mounting height position. The tension measuring device 183 measures the tension of the mask 27 when the measuring element 187 is placed on the mask 27 . The tension measurement control unit 178 acquires the tension measured by the tension measurement device 183, and determines the plate separation mode based on the acquired tension. The tension measurement control unit 178 changes (sets) the currently set plate separation mode to the determined plate separation mode.

The safety control unit 179 executes various controls provided in the internal space SP of the mask changer 15 and controls power supply to the elevator 65. Specifically, the safety control unit 179 executes the above-described control by switching between the first operation mode and the second operation mode.

The first operation mode referred to here is a control executed while the operator is replacing the magazine 25 and supplying the mask 27 to the magazine 25, and is a control executed while the operator is replacing the magazine 25 and supplying the mask 27 to the magazine 25, and is a control that is executed while the operator is replacing the magazine 25 and supplying the mask 27 to the magazine 25. This is a control to stop the supply. Note that in the first operation mode, the safety control unit 179 may generate an alarm sound through the touch panel 31 to alert the operator.

Further, the second operation mode is a control that is executed while the mask 27 is being pulled out or stored between the magazine 25 and the printing unit 13, and is a control that is executed while the mask 27 is being pulled out or stored between the magazine 25 and the printing unit 13. This is a control that performs supply.

The control unit 159A causes the viscometer control unit 177 to repeatedly perform the viscosity measurement operation of the solder paste Pst and the printing operation control unit 169 to perform the soldering connection operation until the viscosity of the solder paste Pst reaches a predetermined viscosity.

Next, with reference to FIG. 15, the setting procedure of the plate separation mode and the procedure of the plate separation operation will be described. FIG. 15 is a flowchart illustrating an example of a plate separation operation procedure of the printing apparatus 11 according to the first embodiment. Note that the processing from step St11 to step St16 in the operation procedure shown in FIG. 15 is a plate separation mode setting process for setting the plate separation mode. Further, the processing from step St17 to step St22 in the operation procedure shown in FIG. 15 is a plate separation operation process for executing plate separation of the printed board KB based on the set plate separation mode.

The printing unit 13 executes the operation procedure shown in FIG. 15 at the timing when the type of the board KB to be produced is changed. It should be noted that each of the processes from step St12 to step St16 in the operation procedure shown in FIG. Alternatively, it may be executed at the timing when the power of the printing device 11 is turned on.

When the mask conveyance and installation control unit 167 determines that there is a change in the type of the board KB based on the production data stored in the memory 159B, the mask conveyance and installation control unit 167 causes the scraper control unit 174 to remove the solder paste Pst placed on the top surface of the stencil SUS. to carry out collection. The mask conveyance and installation control unit 167 transfers the mask 27 currently being used for printing to the board KB, which is a new production target, based on the notification of completion of the solder paste Pst recovery process output from the scraper control unit 174. A mask replacement operation (specifically, a storage operation and a withdrawal operation of the mask 27) for replacing the mask 27 with a corresponding mask 27 is performed (St11). Here, each mechanism of the print head 37 related to the storing or pulling out operation of the mask 27 will be explained.

The print head 37 is controlled by the mask transport and installation control section 167 (see FIG. 14) in the control section 159A, and is driven in the X-axis direction, Y-axis direction, and Z-axis direction. The rod 115 is connected to the cylinder 110 and driven integrally with the cylinder 110 in the direction along the Y axis. The rod 115 is moved up and down in the Z-axis direction and comes into contact with the side surface of the frame 101 of the mask 27 pulled out from the magazine 25 in the mask changer 15 by the suction part 63, and is driven in the direction along the Y-axis to move the mask 27. Convey in the direction along the Y axis.

The cylinder 110 is provided in the print head 37 that prints the solder paste Pst on the board KB, and is driven integrally with the print head 37. The print head 37 has a squeegee base 119 extending in the direction along the X axis. The mask transport and installation control unit 167 drives the squeegee base drive motor 131, and the rod 115 of the cylinder 110, which is integrally formed with the squeegee base 119, is moved in the direction along the Y axis. In other words, the mask conveyance and installation control unit 167 can convey the mask 27 to the printing position along the mask guide 33 by moving the rod 115 in the direction along the Y axis with the rod 115 in contact with the frame 101. .

The print head 37 individually raises and lowers each of the two squeegees 121 below the squeegee base 119 by each of the two Z-axis motors 163 provided in the squeegee lift drive section 123. This allows the squeegee 121 to move to the retracted position above the mask 27. In other words, the squeegee 121 can avoid interference with the frame 101 of the mask 27 when moving to the retracted position.

The suction unit 63 is provided in a camera moving mechanism 49 that includes a camera 51 that images the upper surface of the substrate KB and the lower surface of the mask 27. The camera moving mechanism 49 has a moving base 59 extending in the direction along the X-axis. The camera moving mechanism 49 is provided movably with respect to the moving base 59 in the extending direction of the moving base 59 (direction along the X-axis). A moving base nut 149 is fixed to this moving base 59. The moving base nut 149 is screwed into a moving base moving ball screw 147 extending in the direction along the Y-axis. The moving base moving ball screw 147 is driven by the moving base drive motor 151. When the moving base drive motor 151 is driven and the moving base nut 149 moves via the moving base moving ball screw 147, the suction part 63 provided on the moving base 59 moves in the direction along the Y axis together with the camera 51. be done. Thereby, the mask 27 with the frame 101 attracted to the suction part 63 is conveyed by the mask guide 33 in the direction along the Y-axis.

Further, the mask conveyance and installation control section 167 (see FIG. 14) in the control section 159A drives the squeegee base drive motor 131 to move the mask 27 while the rod 115 is in contact with the side surface of the frame 101 of the mask 27. The mask 27 can be transported to the printing position, or the mask 27 at the printing position can be transported toward the mask changer 15 side.

In addition, the mask transport and installation control section 167 (see FIG. 14) in the control section 159A drives the moving base drive motor 151 and the YZ actuator 61 with the suction section 63 in contact with the side surface of the frame 101. , the mask 27 is pulled out from the magazine 25 through the mask passage opening 71, and the mask 27 conveyed to the rear of the printing position by the rod 115 is stored in the magazine 25 through the mask passage opening 71.

(Mask storage operation)
Next, with reference to FIGS. 16 and 17, a storing operation for storing the mask 27 located at the printing position in the magazine 25 will be described in detail. FIG. 16 is a diagram illustrating an example of the storage operation of the printing device 11. FIG. 17 is a diagram illustrating an example of the storage operation of the printing device 11. In addition, in the example of the operation procedure shown in FIG. 15, the operation procedure regarding the viscosity adjustment of the solder paste Pst is omitted.

When storing the mask 27 in the magazine 25 of the mask changer 15, the mask conveyance and installation control unit 167 in the printing device 11 lowers the rod 115 using the cylinder 110, and moves the rod 115 of the cylinder 110 to the front side of the rear frame 105. (St11-1). Note that the mask conveyance and installation control unit 167 moves the rod 115 until it is located in front of the rear frame 105, lowers the rod 115, and then moves the print head 37 in the direction along the Y axis and in the direction of the mask. The rod 115 may be brought into contact with the front side surface of the rear frame body 105 by moving in a direction approaching the changer 15 . Note that at this time, the camera moving mechanism 49 is on standby at the retracted position.

As shown in step St11-2 in FIG. 16, the mask conveyance and installation control unit 167 moves the squeegee base 119 in the direction along the Y axis with the rod 115 in contact with the front side of the rear frame 105, and The print head 37 is moved in a direction approaching the mask changer 15. The mask conveyance and installation control unit 167 moves the mask 27 that the rod 115 has contacted to the limit of movement of the squeegee base 119 (St11-2).

After transporting the mask 27 to the movement limit of the squeegee base 119, the mask transport and installation control unit 167 raises the rod 115 using the cylinder 110, as shown in step St11-3 in FIG. , the print head 37 is moved (evacuated) in a direction away from the mask changer 15.

The mask transport and installation control unit 167 moves the camera moving mechanism 49 from the retracted position after the print head 37 is retracted by the mask transport and installation control unit 167. The mask transport and installation control section 167 moves the camera moving mechanism 49 to a position where the suction section 63 comes into contact with the side surface (front surface) of the front frame body 103 (St11-3).

The mask conveyance and installation control section 167 moves the camera movement mechanism 49 in the direction along the Y axis and in the direction approaching the mask changer 15 to move the mask 27 that is in contact with the suction section 63 through the mask passage opening 71. It is moved to a predetermined storage position within the magazine 25 (St11-4). At this time, the suction section 63 may store the mask 27 without suctioning the frame 101, or may store the mask 27 while suctioning the frame 101.

(Mask pull-out operation)
Referring to FIGS. 18 and 19, a procedure for pulling out the mask 27 of the printing apparatus 11 according to the first embodiment will be described. FIG. 18 is a diagram illustrating an example of an operation procedure for pulling out the mask 27 of the printing apparatus 11 according to the first embodiment. FIG. 19 is a diagram illustrating an example of an operation procedure for pulling out the mask 27 of the printing apparatus 11 according to the first embodiment.

When pulling out the mask 27 from the mask changer 15, the mask transport and installation control unit 167 in the printing device 11 moves the camera movement mechanism 49 in the direction along the Y-axis and in the direction closer to the mask changer 15. In the camera moving mechanism 49, the suction portion 63 stops at a position immediately in front of the mask passage opening 71. The YZ actuator 61 is controlled by the mask conveyance and installation control section 167 to raise the position (height) of the suction section 63 in the direction along the Z-axis to a position (height) at which the mask 27 can be pulled out from the mask passage opening 71. Then, the position of the suction part 63 is moved in the direction along the Y-axis to a position where it comes into contact with the frame 101 of the mask 27 stored in the magazine 25. As shown in step St11-5 in FIG. 18, when the suction unit 63 comes into contact with the side surface of the frame 101 of the mask 27 to be pulled out, the suction control unit 173 drives the vacuum valve to remove the frame 101 by the suction unit 63. Adsorption of the side surface is performed (St11-5).

The mask conveyance and installation control unit 167 moves the camera movement mechanism 49 in the direction along the Y axis and in the direction away from the mask changer 15, and pulls the mask 27 sucked by the suction unit 63 (St11- 6). The mask conveyance and installation control unit 167 pulls the mask 27 attracted by the attraction unit 63 to the movement limit of the moving base 59, as shown in step St11-6 in FIG. After executing the traction control to the movement limit, the mask transport and installation control unit 167 moves the camera movement mechanism 49 to avoid interference (collision) between the mask 27 and print head 37 and the camera movement mechanism 49. Evacuate. Specifically, the mask transport and installation control unit 167 drives the YZ actuator 61 to lower the position (height) of the suction unit 63 in the Z-axis direction, and moves the camera movement mechanism from the transport path of the mask 27 to the printing position. Evacuate 49. Note that the evacuation method is not limited to this. The mask transport and installation control unit 167 may evacuate the camera movement mechanism 49 from the transport trajectory of the mask 27 to the printing position, for example, by lowering the camera movement mechanism 49 itself in the Z-axis direction.

After the camera movement mechanism 49 is evacuated by the mask transport and installation control unit 167, the mask transport and installation control unit 167 moves the squeegee base 119 in the direction along the Y axis and in the direction approaching the mask changer 15. The print head 37 is moved to . The mask conveyance and installation control unit 167 moves the rod 115 of the cylinder 110 until it is positioned behind the frame 101 of the mask 27 (specifically, the rear frame body 105), and then lowers the rod 115 using the cylinder 110. Then, the rod 115 is brought into contact with the rear side surface of the rear frame body 105 (that is, the rod 115 is hooked on the rear side surface of the rear frame body 105) (St11-7). Note that the mask conveyance and installation control unit 167 moves the rod 115 until it is located behind the rear frame body 105 and lowers the print head 37, and then moves the print head 37 in the direction along the Y axis, and The rod 115 may be brought into contact with the rear side surface of the rear frame body 105 by moving in a direction away from the mask changer 15 .

The mask conveyance and installation control unit 167 moves the print head 37 in the direction along the Y axis and in the direction away from the mask changer 15 with the rod 115 in contact with the rear side surface of the rear frame 105 to perform printing. The mask 27 is transported to the position (St11-8). After moving the mask 27 to the printing position, the mask conveyance and installation control unit 167 raises the print head 37 and separates the rod 115 from the rear frame 105, thereby ending the operation of pulling out the mask 27.

After finishing the drawing operation of the mask 27, the mask conveyance and installation control unit 167 drives the print head 37, and prints each of the two cylinders 45 and each of the four cylinders 47 at the four corners of the mask holding unit 35. Press the frame 101 (see FIG. 8) downward. The mask transport and installation control unit 167 generates a control command indicating that the replacement operation of the mask 27 has been completed, and outputs the generated control command to the tension measurement control unit 178.

The tension measurement control unit 178 starts measuring the tension of the new mask 27 based on the control command output from the mask transport and installation control unit 167. The tension measurement control unit 178 drives the print head 37, places the probe 187 of the tension measurement control unit 178 on the upper surface of the stencil SUS, and measures the tension of the mask 27. In the tension measurement control unit 178, the measuring element 187 is placed on the upper surface of the stencil SUS through the opening 185, and the tension is measured (St12).

Here, measurement of the tension of the mask 27 will be described with reference to FIGS. 20 and 21, respectively. FIG. 20 is a diagram illustrating an example of the tension measuring device 183 for the mask 27. FIG. 21 is a diagram illustrating an example of the tension measuring device 183. In addition, in FIG. 20, in order to make the explanation easy to understand, illustration of the arm portion 139 is omitted, and the tension measuring device holding portion 141 is partially illustrated.

In the mask 27, the stencil SUS as an example of the first region and the frame 101 are connected by a connecting member 100 such as polyester cloth. The connecting member 100, which is an example of the second region, is attached with a predetermined tension so as to connect the stencil SUS and the frame 101, and determines the relative position of the stencil SUS and the frame 101.

The tension measurement device 183 is placed on the top surface of the stencil SUS by the tension measurement control unit 178 and measures the tension of the mask 27. Specifically, the tension measuring device 183 applies a measurement load 195 to the measuring tip 187 in the −Z direction when the measuring tip 187 is placed at the center position Pt of the stencil SUS. Note that the center position Pt is the intersection of the diagonal lines at the four corners of the frame 101. The tension measuring device 183 measures tension based on the height position of the connecting portion 190 or the tension of the connecting portion 190 based on the measurement load 195 applied in the -Z direction and the reaction in the Z direction received from the mask 27. do. Tension measurement device 183 outputs the measurement result to tension measurement control section 178.

The tension measurement control unit 178 determines whether the measured tension of the mask 27 is sufficient to execute the normal plate separation mode based on the first threshold value and the second threshold value stored in the memory 159B. It is determined whether there is one (St13).

If the tension measurement control unit 178 determines in the process of step St13 that the measured tension of the mask 27 is equal to or higher than the first threshold value, the tension measurement control unit 178 determines that the tension is sufficient to execute the normal plate separation mode. (St13, YES), and the plate separation mode is set to normal mode (St14).

Further, if the tension measurement control unit 178 determines in the process of step St13 that the measured tension of the mask 27 is less than the first threshold value and greater than or equal to the second threshold value, the tension measurement control unit 178 executes the normal plate separation mode. It is determined that the tension is not sufficient to release the mask (St13, Warning), and the plate separation mode is set to the mask suction plate separation mode (St15).

Further, in the process of step St13, if the tension measurement control unit 178 determines that the measured tension of the mask 27 is less than the second threshold, the tension measurement control unit 178 determines that the tension is not necessary for executing the plate separation operation (St13 , NO), a warning to the effect that the tension is insufficient is generated and output to the touch panel 31, and the operation of the printing device 11 (that is, the equipment) is stopped (St16).

Here, with reference to FIG. 22, the plate separation operation in the normal mode executed in the processing of steps St17 to St18 will be described. FIG. 22 is a diagram illustrating the plate separation mode (normal mode).

The printing operation control unit 169 slides the squeegee 121 on the upper surface of the stencil SUS on which the solder paste Pst is placed, and prints the substrate KB through the electrode pattern formed in the first region AR1 (see FIG. 23) of the stencil SUS. The solder paste Pst is printed (St17). Based on the currently set normal mode, the printing operation control unit 169 lowers the table lifting mechanism 67 to perform a plate separation operation to separate the substrate KB from the lower surface of the mask 27 (specifically, the stencil SUS). Execute (St18).

Here, with reference to FIG. 23, a description will be given of the plate separation operation in the mask suction plate separation mode executed in the processes of steps St19 to St22. FIG. 23 is a diagram illustrating the plate separation mode (mask suction plate separation mode).

Further, after the process in step St15, the printing operation control unit 169 vacuum-suctions the second region AR2 on the lower surface of the stencil SUS using the suction unit 20 included in the substrate transport and holding unit 21 (St19). The printing operation control unit 169 slides the squeegee 121 on the top surface of the stencil SUS on which the solder paste Pst is placed, while maintaining the vacuum suction of the stencil SUS by the suction unit 20, to remove the electrode pattern formed on the stencil SUS. The solder paste Pst is printed on the board KB through the solder paste (St20). As a result, even if the tension of the mask 27 is not sufficient, the printing apparatus 11 according to the first embodiment can perform the printing operation in which the squeegee 121 slides on the upper surface of the stencil SUS. , stencil SUS) can be more effectively suppressed.

After the printing of the solder paste Pst is completed, the printing operation control unit 169 maintains the vacuum suction of the second area AR2 on the lower surface of the stencil SUS by the substrate conveying and holding unit 21, and applies a specified amount H1 (for example, 2 mm, 5 mm). etc.), the table lifting mechanism 67 is lowered (St21). Note that the specified amount H1 may be determined or calculated based on the tension of the mask 27. For example, when the printing operation control unit 169 determines that the tension of the mask 27 is less than the first threshold value and greater than or equal to the second threshold value, the print operation control unit 169 further executes a determination process for determining the specified amount H1. , a specified amount H1 more suitable for the measured tension may be determined or calculated.

After lowering the table lifting mechanism 67 by a specified amount H1, the printing operation control unit 169 turns off the vacuum suction of the second area AR2 on the lower surface of the stencil SUS by the suction control unit 173, and lowers the table lifting mechanism 67. Then, a plate separation operation is performed to separate the substrate KB from the lower surface of the stencil SUS (specifically, the first region AR1) (St22).

As described above, even if the tension of the mask 27 is not sufficient, the printing apparatus 11 according to the first embodiment can move the lower surface of the stencil SUS (first region AR1) and the substrate KB by vacuum suction by the substrate transport holding section 21. The table lifting mechanism 67 is lowered by a specified amount H1 while maintaining contact with the upper surface of the table. Thereby, the printing device 11 can increase the tension of the connection member 100, and can reproduce the contact state between the lower surface of the stencil SUS and the upper surface of the substrate KB when the tension is sufficiently high.

In addition, the printing device 11 turns off the vacuum suction by the substrate conveying and holding unit 21 and starts the table lifting mechanism 67 from a state that reproduces the contact state between the lower surface of the stencil SUS and the upper surface of the substrate KB when the tension is sufficiently high. By lowering it, the plate separation operation in normal mode can be reproduced. Therefore, even if the tension is not sufficient, the printing device 11 can uniformly separate the top surface of the board KB from the bottom surface of the stencil SUS (plate separation), so that the solder paste printed on the top surface of the board KB can be evenly separated from the bottom surface of the stencil SUS. It is possible to suppress deterioration of print quality by suppressing changes in the shape of the print.

Referring to FIG. 24, the lowering control of the table lifting mechanism 67 in the normal mode and the lowering control of the table lifting mechanism 67 in the mask suction plate separation mode will be described. FIG. 24 is a diagram comparing control examples of the table lifting mechanism 67 for each plate separation mode.

A speed graph CON1 is a graph showing the descending speed of the table lifting mechanism 67 (that is, the substrate KB) when the plate separation mode is set to the normal mode. When the plate separation mode is set to the normal mode, the printing operation control unit 169 executes the lowering control of the table lifting mechanism 67 shown in the speed graph CON1. Specifically, the printing operation control unit 169 in the normal mode lowers the table lifting mechanism 67 while turning off the vacuum suction of the substrate KB by the substrate transport holding unit 21, so that the bottom surface of the stencil SUS and the top surface of the substrate KB are aligned. spaced apart.

A speed graph CON2 is a graph showing the descending speed of the table lifting mechanism 67 (that is, the substrate KB) when the plate separation mode is set to the mask suction plate separation mode. When the plate separation mode is set to the mask suction plate separation mode, the printing operation control unit 169 executes the lowering control of the table lifting mechanism 67 shown in the speed graph CON2.

Specifically, the printing operation control unit 169 in the normal mode lowers the table lifting mechanism 67 by a specified amount H1 while turning on the vacuum suction of the substrate KB by the substrate transport holding unit 21, and then lowers the table lifting mechanism 67 by a specified amount H1. The lowering control is stopped and the vacuum suction of the substrate KB is turned off. After turning off the vacuum suction of the substrate KB, the printing operation control unit 169 restarts the lowering control of the table lifting mechanism 67 to separate the lower surface of the stencil SUS from the upper surface of the substrate KB.

As described above, the printing unit 13 in the first embodiment can uniformly separate the top surface of the substrate KB from the bottom surface of the stencil SUS by changing the plate separation mode based on the tension measurement result.

As described above, the printing device 11 according to the first embodiment is provided with a predetermined pattern opening 99 (an example of a printing pattern), and has a first region AR1 that can contact the substrate KB, and a first region AR1 on both sides of the first region AR1. The solder paste Pst is printed on the substrate KB using the mask 27 having the second region AR2 located thereon. The printing device 11 includes a substrate transport holding section 21 (an example of a holding section) that holds a substrate KB and raises and lowers the held substrate KB, and a tension measuring device 183 (an example of a measuring section) that measures the tension of the mask 27. , a suction unit 20 (an example of a suction unit) capable of suctioning the second region AR2 of the mask 27, and the substrate transport holding unit 21 performs the substrate transfer based on the tension of the mask 27 measured by the tension measuring device 183. A control unit 159A is provided that determines whether suction of the second area AR2 by the suction unit 20 is necessary when the KB and the mask 27 are separated from each other. When the control section 159A determines that suction of the lower surface of the stencil SUS is necessary, the control section 159A causes the suction section 20 to suction the lower surface of the stencil SUS.

Thereby, the printing apparatus 11 according to the first embodiment can perform a plate separation operation more suitable for the tension of the mask 27. Therefore, the printing device 11 can uniformly separate the lower surface of the mask 27 (first region AR1) from the upper surface of the substrate KB by executing a mask plate separation mode that is more suitable for the new tension of the mask 27. This makes it possible to suppress deterioration in print quality caused by tension.

Further, as described above, when the control unit 159A in the printing apparatus 11 according to the first embodiment determines that suction of the second area AR2 is necessary, the control unit 159A moves the substrate while the suction unit 20 is suctioning the second area AR2. After lowering the transport holding section 21 by a predetermined height (for example, 5 mm, etc.), the suction of the second area AR2 by the suction section 20 is stopped, and the substrate transport holding section 21 is lowered to perform plate separation. Thereby, the printing apparatus 11 according to the first embodiment can perform a plate separation operation more suitable for the tension of the mask 27. Therefore, even if the tension of the mask 27 is low, the printing device 11 executes the mask suction plate separation mode in which the suction unit 20 suctions the second region AR2 on the bottom surface of the stencil SUS, so that the bottom surface of the mask 27 ( The first region AR1) and the upper surface of the substrate KB can be uniformly separated from each other, and deterioration of printing quality due to tension can be suppressed.

Further, as described above, when the control unit 159A in the printing apparatus 11 according to the first embodiment determines that the tension of the mask 27 is equal to or higher than the first threshold based on the measured tension of the mask 27, the suction unit The suction of the second region AR2 by 20 is omitted. Thereby, when the printing apparatus 11 according to the first embodiment determines that the tension of the mask 27 is sufficient for the plate separation operation, the printing apparatus 11 sets the plate separation mode to the normal mode and executes the plate separation operation.

Further, as described above, the control unit 159A in the printing apparatus 11 according to the first embodiment determines, based on the tension of the mask 27, that the tension of the mask 27 is less than the first threshold and that the second If it is determined that the second area AR2 is greater than or equal to the threshold value, the suction unit 20 is caused to suction the second area AR2. Thereby, when the printing apparatus 11 according to the first embodiment determines that the tension of the mask 27 is not the tension during the plate separation operation, the printing apparatus 11 sets the plate separation mode to the mask suction plate separation mode and executes the plate separation operation.

Further, as described above, when the control unit 159A in the printing apparatus 11 according to the first embodiment determines that the tension of the mask 27 is less than the second threshold, the control unit 159A stops plate separation, generates and outputs warning information. do. As a result, when the printing apparatus 11 according to the first embodiment determines that the tension of the mask 27 is not the tension necessary for the plate separation operation, the printing apparatus 11 sets the plate separation mode to the mask suction plate separation mode and executes the plate separation operation. do.

Furthermore, as described above, the substrate transport and holding section 21 in the printing apparatus 11 according to the first embodiment includes a pair of clampers 87 (an example of a contact section) that abuts both side surfaces of the substrate KB and holds the substrate KB. The adsorption section 20 is provided in the substrate transport and holding section 21 . Thereby, the printing apparatus 11 according to the first embodiment can suppress misalignment of the board KB in printing the solder paste Pst by holding the board KB in contact with both side surfaces of the board KB.

(Embodiment 2)
The printing apparatus 11 according to the first embodiment described above has an example in which the tension of the mask 27 is measured at a predetermined timing such as when the mask 27 is replaced, and the plate separation mode is determined based on the measured tension. The printing device 11 according to the second embodiment not only measures the tension and determines the plate separation mode, but also collects and transfers the solder paste Pst, changes the arrangement of the support pins 219 that support the board KB, and measures the viscosity of the solder paste Pst. An example of automatically executing each process such as measurement and viscosity adjustment will be described. Note that since the configuration of the printing device 11 according to the second embodiment has substantially the same configuration as the printing device 11 according to the first embodiment, the same components are given the same reference numerals and the explanation will be omitted.

Next, with reference to FIG. 25, the operation procedure of the printing apparatus 11 according to the second embodiment will be described. FIG. 25 is a diagram illustrating an example of an operation procedure when changing the mask model of the printing apparatus according to the second embodiment.

When the control unit 159A in the printing device 11 determines that the production (printing) of the board KB of “model A” has been completed based on the production data, it starts the operation of replacing the mask 27. The control unit 159A reads the production data of the "model B" board KB that is stored in the memory 159B and will be produced next (St31).

The scraper control unit 174 controls the scraper 137 to collect the solder paste Pst on the upper surface of the mask 27 (that is, the currently used mask 27) corresponding to the board KB of "model A" (St32).

The mask transport and installation control unit 167 and the imaging control unit 171 respectively drive the print head 37 and camera movement mechanism 49 to store the mask 27 corresponding to the board KB of “model A” in the magazine 25 of the mask changer 15. (St33).

The control unit 159A changes and rearranges the support pins 219 of the board KB based on the production data of the "model B" board KB stored in the memory 159B (St34).

The mask conveyance and installation control unit 167 and the imaging control unit 171 drive the print head 37 and camera movement mechanism 49, respectively, to pull out the mask 27 corresponding to the “model B” substrate KB from the magazine 25 of the mask changer 15. , and carry it to the printing position (St35).

The tension measurement control unit 178 drives the print head 37 and places the measuring tip 187 of the tension measurement device 183 approximately in the center of the upper surface of the stencil SUS corresponding to the substrate KB of "model B" located at the printing position, The tension of the mask 27 is measured (St36).

Based on the measured tension of the mask 27, the tension measurement control unit 178 determines and sets the plate separation mode of the mask 27 corresponding to "model B" (St37).

The substrate transport and holding control unit 165 changes (adjusts) the distance between the pair of clampers 87 that hold the substrate KB to a width corresponding to the substrate KB of "model B" (St38).

The scraper control unit 174 controls the scraper 137 and transfers the collected solder paste Pst onto the upper surface of the stencil SUS corresponding to the board KB of "model B" (St39).

The viscometer control unit 177 drives the print head 37 and uses the viscometer 197 to measure the viscosity of the solder paste Pst transferred to the top surface of the stencil SUS (St40). The viscometer control unit 177 determines a soldering connection operation to bring the viscosity of the solder paste Pst to a preset target value (that is, a predetermined viscosity) based on the viscosity measured by the viscometer 197, and performs printing. It is output to the operation control section 169.

The printing operation control unit 169 drives the squeegee 121 of the print head 37 based on the control command output from the viscometer control unit 177, and performs a soldering operation on the solder paste Pst (St41).

The control unit 159A controls a temperature controller (not shown) included in the printing unit 13, and changes the temperature setting of the atmosphere inside the printing unit 13 (St42). The control unit 159A starts production (printing) of the "model B" board KB based on the production data.

As described above, when there is a mask 27 replacement operation, the printing apparatus 11 according to the second embodiment automatically replaces the mask 27 with the mask 27 corresponding to the new substrate KB, sets the plate separation mode, and sets the support pin 219. By changing the arrangement of the solder paste Pst, adjusting the viscosity of the solder paste Pst, etc., production of the board KB using a new mask 27 can be started more efficiently.

As described above, the printing apparatus 11 according to the second embodiment prints the solder paste Pst on the first substrate using the first mask provided with the first pattern opening (an example of the first printed pattern). , the solder paste Pst is printed on the second substrate using a second mask provided with a second pattern opening (an example of a second printed pattern). The first mask and the second mask have a first region AR1 that can contact the substrate KB, and a second region AR2 located on both sides of the first region AR1. The printing apparatus 11 includes a substrate transport holding section 21 (an example of a holding section) that holds a first substrate or a second substrate, and a viscometer 197 (measuring section) that measures the tension of the first mask and the second mask. example), a suction unit 20 capable of suctioning the second region AR2 of the second mask in contact with the second substrate, and a viscometer 197 after the first mask is replaced with the second mask. The tension of the second mask is measured, and based on the tension of the second mask measured by the viscometer 197, the plate separation between the second substrate and the second mask is performed by the substrate transport holding unit 21. It includes a control unit 159A that determines whether or not suction of the second region AR2 by the suction unit 20 is necessary. When the control unit 159A determines that suction of the second area AR2 is necessary, the control unit 159A causes the suction unit 20 to suction the second area AR2.

Note that the first board here corresponds to "model A" in the operation procedure of FIG. 25, for example. The first mask is, for example, the mask 27 corresponding to "model A" in the operation procedure of FIG. 25. Similarly, the second board corresponds to "model B" in the operating procedure of FIG. 25, for example. The second mask is, for example, the mask 27 corresponding to "model B" in the operation procedure of FIG. 25.

Note that the first pattern opening referred to here is an opening provided in the stencil SUS with an arrangement corresponding to the arrangement of an electrode pattern (not shown) formed on the surface of the first substrate. The second pattern opening is an opening provided in the stencil SUS with a layout corresponding to the layout of an electrode pattern (not shown) formed on the surface of the second substrate.

Thereby, the printing apparatus 11 according to the second embodiment can set a plate separation mode more suitable for the new mask 27 when the mask 27 is replaced. Therefore, the printing apparatus 11 can uniformly separate the first region AR1 on the lower surface of the mask 27 from the upper surface of the substrate KB by executing a mask plate separation mode that is more suitable for the new tension of the mask 27. This makes it possible to suppress deterioration in print quality due to tension.

Furthermore, as described above, the printing apparatus 11 according to the second embodiment further includes a print head 37 and a camera movement mechanism 49 (an example of a mask pulling section) for exchanging the first mask and the second mask. The print head 37 and the camera movement mechanism 49 abut against a frame 101 included in the first mask and store the first mask in the magazine 25 that can store each of the plurality of masks 27, and the first mask is stored in the magazine 25. The side surface of the frame 101 provided with the second mask is pulled out from the magazine 25 and pulled to the printing position of the solder paste Pst. Thereby, the printing apparatus 11 according to the second embodiment automatically replaces the first mask and the second mask, and creates a new mask 27 that is more suitable for the new mask based on the tension of the second mask after the replacement. You can set remote mode.

Further, as described above, the printing apparatus 11 according to the second embodiment has the scraper 137 (transfer unit) that collects the solder paste Pst from the upper surface of the first mask and transfers the solder paste Pst onto the upper surface of the second mask. (an example of) and. When exchanging the first mask and the second mask, the control unit 159A causes the scraper 137 to collect the solder paste Pst on the upper surface of the first mask, and causes the print head 37 and camera movement mechanism 49 to move the solder paste Pst to the second printing position. After the second mask is pulled, the solder paste Pst collected by the scraper 137 is transferred onto the upper surface of the second mask. Thereby, the printing apparatus 11 according to the second embodiment automatically replaces the first mask and the second mask, and creates a new mask 27 that is more suitable for the new mask based on the tension of the second mask after the replacement. You can set remote mode.

Further, as described above, the printing apparatus 11 according to the second embodiment includes a viscometer 197 (an example of a viscosity measurement unit) that measures the viscosity of the solder paste Pst, and a solder paste Pst transferred onto the upper surface of the second mask. The apparatus further includes a squeegee 121 for kneading. After the solder paste Pst is transferred onto the upper surface of the second mask, the control unit 159A causes the viscometer 197 to measure the viscosity of the solder paste Pst, and controls the squeegee 121 based on the measured viscosity of the solder paste Pst. Knead the solder paste Pst. As a result, even if the viscosity of the solder paste Pst changes while automatically replacing the first mask and the second mask, the printing apparatus 11 according to the second embodiment can measure the viscosity using the viscosity meter 197. Based on the determined viscosity, solder kneading can be performed. Therefore, the printing device 11 can more efficiently start producing the second substrate using the second mask.

Further, as described above, the printing apparatus 11 according to the second embodiment changes the positions of the plurality of support pins 219 (an example of lower support pins) that support the lower surface of the first substrate and the plurality of support pins 219. A suction head 233 and a suction nozzle 235 (an example of a suction unit) are provided. After the first mask is stored in the magazine 25 by the print head 37 and the camera moving mechanism 49, the control unit 159A sucks each of the plurality of support pins 219 by the suction head 233 and the suction nozzle 235, and Transport and install the board to a position where the bottom surface can be supported. Thereby, the printing apparatus 11 according to the second embodiment adjusts the arrangement of each of the plurality of support pins 219 so as to correspond to the second substrate while automatically exchanging the first mask and the second mask. Can be changed. Therefore, the printing device 11 can more efficiently start producing the second substrate using the second mask.

Furthermore, as described above, the substrate transport and holding section 21 in the printing apparatus 11 according to the second embodiment includes a pair of clampers 87 (an example of a contact section) that abuts both side surfaces of the substrate KB and holds the substrate KB. The adsorption section 20 is provided in the substrate transport and holding section 21 . Thereby, the printing device 11 according to the second embodiment can suppress misalignment of the substrate KB in printing the solder paste Pst by holding the substrate KB in contact with both side surfaces of the substrate KB.

Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that those skilled in the art can come up with various changes, modifications, substitutions, additions, deletions, and equivalents within the scope of the claims, and It is understood that it naturally falls within the technical scope of the present disclosure. Further, each of the constituent elements in the various embodiments described above may be arbitrarily combined without departing from the spirit of the invention.

Note that this application is based on a Japanese patent application (Japanese Patent Application No. 2022-059452) filed on March 31, 2022, and the contents thereof are incorporated as a reference in this application.

The present disclosure is useful as a printing device that performs plate separation control more suitable for changes in mask tension and suppresses deterioration in print quality of solder paste.

11 Printing device 15 Mask changer 20 Adsorption section 21 Substrate transport holding section 27 Mask 37 Print head 49 Camera movement mechanism 87 Clamper 99 Pattern opening 100 Connection member 101 Frame 131 Squeegee base drive motor 115 Rod 159A Control section 183 Tension measuring device 197 Viscometer 219 Support pin 233 Suction head 235 Suction nozzle KB Substrate SUS Stencil Pst Solder paste

Claims

A first mask provided with a first printed pattern is used to print solder paste on a first substrate, and a second mask provided with a second printed pattern is used to print the solder paste on a second substrate. A printing device that prints paste,
The first mask and the second mask are
comprising a first region that can be contacted with the first substrate or the second substrate, and second regions located on both sides of the first region,
The printing device includes:
a holding part that holds the first substrate or the second substrate;
a measurement unit that measures the tension of the first mask and the second mask;
a suction unit capable of suctioning the second region of the second mask;
After the first mask is replaced with the second mask, the tension of the second mask is measured by the measurement unit, and based on the tension of the second mask measured by the measurement unit. a control unit that determines whether or not suction of the second area by the suction unit is necessary during plate separation between the second substrate and the second mask performed by the holding unit;
When the control unit determines that suction of the second area is necessary, the control unit causes the suction unit to suction the second area.
Printing device.
further comprising a mask pulling part for exchanging the first mask and the second mask,
The mask pulling section contacts a frame included in the first mask to store the first mask into a magazine that can store each of the plurality of masks, and to store the first mask in a magazine that can store each of the plurality of masks, and to store the second mask stored in the magazine. suctioning the side surface of a frame provided by the mask, pulling out the second mask from the magazine and pulling it to the printing position of the solder paste;
The printing device according to claim 1.
further comprising a transfer unit that collects the solder paste from the top surface of the first mask and transfers the solder paste to the top surface of the second mask,
The control unit includes:
When exchanging the first mask and the second mask, causing the transfer unit to collect the solder paste on the upper surface of the first mask;
After the second mask is pulled to the printing position by the mask pulling unit, the collected solder paste is transferred to the upper surface of the second mask by the transfer unit.
The printing device according to claim 2.
a viscosity measurement unit that measures the viscosity of the solder paste;
further comprising: a squeegee for kneading the solder paste transferred to the upper surface of the second mask;
The control unit causes the viscosity measurement unit to measure the viscosity of the solder paste after the solder paste is transferred to the upper surface of the second mask, and based on the measured viscosity of the solder paste. , causing the squeegee to knead the solder paste;
The printing device according to claim 3.
a plurality of lower support pins supporting the lower surface of the first substrate;
a suction part that can change the position of each of the plurality of lower receiving pins,
After the first mask is stored in the magazine by the mask pulling unit, the control unit causes the suction unit to suction each of the plurality of lower receiving pins to support the lower surface of the second substrate. Transport and install it in a possible location,
The printing device according to claim 2.
The holding part has a pair of contact parts that come into contact with both side surfaces of the second board and hold the second board,
The suction part is provided in the holding part,
The printing device according to claim 1.