JP2020138360A - Mask printer, viscous fluid printing method - Google Patents

Abstract

To inhibit deterioration of printing accuracy of viscous fluid due to undulation of a mask.SOLUTION: A mask printer according to the invention acquires a degree of undulation of a mask, and a target height of a substrate on the basis of the acquired degree of undulation. Then, the substrate is lifted to the target height. Thus, the target height is acquired on the basis of the degree of undulation of the actual mask, therefore, an upper surface of the substrate and a lower surface of the mask can be appropriately surface-contacted even when the mask has some undulation. In addition, the substrate is prevented from excessively lifted, and the mask becomes more hardly subjected to some great stress.SELECTED DRAWING: Figure 10

Description

The present invention relates to a mask printing machine and a viscous fluid printing method for printing a viscous fluid on a circuit board via a mask.

Patent Document 1 describes a mask printing machine that prints a paste on a circuit board via a mask. In the mask printing machine described in Patent Document 1, in a state where the mask is tilted and held due to the distortion of the frame holding the mask, the circuit board (hereinafter, simply referred to as a substrate) is maintained in a state where the mask can be sucked. (Abbreviated) is raised above the standard height by the amount of lifting, and the mask is pushed up. As a result, the upper surface of the substrate and the lower surface of the mask are brought into surface contact with each other. The amount of push-up of the mask is determined based on the degree of distortion of the frame and the durability against stress applied to the mask during push-up ([0035]). The paste is printed with the substrate and mask lowered to the standard height ([0036]). In addition, the mask is lowered from the standard height, and plate release control is performed from that position. The suction of the mask is released and the top surface of the substrate is separated from the bottom surface of the mask ([0038]).

Japanese Unexamined Patent Publication No. 2015-139944

An object of the present invention is to suppress a decrease in printing accuracy of a viscous fluid due to waviness of a mask.

Means, actions and effects to solve problems

In the mask printing machine according to the present invention, the undulation degree of the mask is actually acquired, and the target height of the substrate is acquired based on the acquired actual undulation degree. Then, the substrate is raised to the target height, and the upper surface of the substrate and the lower surface of the mask are brought into surface contact with each other. In this way, since the target height of the substrate is obtained based on the actual degree of undulation of the mask, the upper surface of the substrate and the lower surface of the mask can be brought into good surface contact. In addition, it is possible to prevent the substrate from being raised too much and to prevent excessive stress from being applied to the mask.

It is a front view of the mask printing machine which concerns on this invention. It is a side view of the said mask printing machine. It is a side view which shows the substrate lifting device of the said mask printing machine. It is a top view which shows the substrate moving apparatus of the said substrate lifting apparatus. It is a top view which shows the mask moving apparatus of the mask holding apparatus of the mask apparatus. It is a top view which shows the laser length measuring instrument moving device of the said mask printing machine. It is a block diagram which conceptually shows the periphery of the control device of the mask printing machine. It is a figure which shows the state which the substrate (A) is below the standard height at the time of normal viscous fluid printing in the said mask printing machine. (B) It is a figure which shows the state which the substrate was raised to the standard height. It is a figure which shows the undulating state of the mask in the said mask printing machine. It is a figure which shows the state which raised | raised the substrate | column | degree by ΔH above standard height in the said mask printing machine. It is a figure which shows the state which lowered the substrate to a standard height while keeping the state which the upper surface of a substrate and the lower surface of a mask are in surface contact in the said mask printing machine. It is a figure which shows the state which lowered the substrate below the standard position while keeping the state which the upper surface of the substrate and the lower surface of a mask are in surface contact in the said mask printing machine. It is a flowchart which shows the viscous fluid printing program stored in the storage part of the control device of the mask printing machine. It is a flowchart which shows the viscous fluid printing program different from the said viscous fluid printing program.

A mode for carrying out the present invention

Hereinafter, the mask printing machine according to the embodiment of the present invention will be described in detail with reference to the drawings. In this mask printing machine, viscous fluid is printed.

As shown in FIGS. 1 to 3, this mask printing machine prints creamy solder (hereinafter abbreviated as solder) as a viscous fluid on a circuit board (hereinafter abbreviated as a substrate) P via a mask S. The frame 2, the substrate transfer device 4, the substrate lifting device 6, the substrate moving device 8, the mask device 10, the squeegee device 12, the imaging device 14, the laser length measuring device 16, and the like are included.

The substrate transfer device 4 conveys the substrate P, and includes, for example, a pair of conveyors 20a and 20b, a transfer motor (not shown) for driving the pair of conveyors 20a and 20b, and the like. Hereinafter, in the present specification, the transport direction of the substrate P is the x direction, the width direction of the substrate P is the y direction, and the thickness direction of the substrate P, that is, the vertical direction of the mask printing machine is the z direction. The x-direction, y-direction, and z-direction are orthogonal to each other.

The board lifting device 6 moves (lifts) the board P held by the board holding device 22 in the z direction, and the board moving device 8 moves the board P held by the board holding device 22 in the xy plane. It is something to move.

The board holding device 22 includes a plurality of support pins 26 attached to the support plate 24, a clamp device 28, a board holding device 30, and the like. The plurality of support pins 26 support the substrate P from below. The clamp device 28 holds the substrate P from both sides in the width direction (y direction), and holds the pair of holding members 35a, 35b and the pair of holding members 35a, 35b for holding the pair of clamp members 34a, 34b. It includes an approaching / separating device 36 for approaching and separating, and mask suction mechanisms 38a and 38b provided on the pair of holding members 35a and 35b, respectively. A plurality of openings are provided on the upper surfaces of the pair of clamp members 34a and 34b, and vacuum passages 39a and 39b extending in the vertical direction are provided so as to communicate with the plurality of openings. Then, the vacuum device 39v is commonly connected to the vacuum passages 39a and 39b. Although not shown, the vacuum device 39v includes a vacuum pump, a pump motor for driving the vacuum pump, and the like. By driving the pump motor, the vicinity of the openings formed on the upper surfaces of the clamp members 34a and 34b becomes negative pressure, and the mask S in contact with the upper surfaces of the clamp members 34a and 34b is sucked from the lower surface, whereby the mask S is sucked and held. To. A valve is provided between the vacuum device 39v and the vacuum passages 39a and 39b, and the vacuum device 39v can be selectively communicated with the vacuum passages 39a and 39b by opening and closing the valve.

The substrate pressing device 30 includes a pair of pressing members 40a and 40b, an approaching and separating device 41 that brings the pair of pressing members 40a and 40b close to each other and separated from each other. The height of the upper surface of the substrate P is defined by abutting the upper surfaces of the pair of clamp members 34a and 34b and the upper surface of the substrate P on the lower surfaces of the pair of pressing members 40a and 40b.

The board lifting device 6 includes a first lifting device 46, a second lifting device 47, a third lifting device 48, and the like. The first elevating device 46 includes an electric motor 54, a screw mechanism 56 as a motion conversion mechanism that converts the rotation of the electric motor 54 into linear movement in the z direction and transmits the rotation to the base 55, and includes a substrate holding device 22 and a substrate. The first elevating table 57 that supports the pressing device 30 and the like is moved up and down together with the base base 55. The second lifting device 47 converts the movement of the piston rods of the air cylinder 62 and the air cylinder 62 in the y direction into movement in the z direction and transmits the movement to the second lifting table 60 as a pair of cam mechanisms 63a. , 63b, etc., and the second lift 60 that supports the substrate holding device 22 is moved up and down with respect to the first lift 57. The third elevating device 48 is a screw mechanism 65 as a motion conversion mechanism that converts the rotations of the electric motor 64 and the electric motor 64 fixed to the second elevating table 60 into linear movement in the z direction and transmits the rotation to the support plate 24. The support plate 24 is moved up and down with respect to the second elevating platform 60, including the above.

The board moving device 8 moves the first elevating table 57 with respect to the base base 55 in the xy plane, and includes the x moving device 70 and the two y moving devices 71 and 72 as shown in FIG. .. The y moving devices 71 and 72 are provided at portions of the first elevating platform 57 facing each other in the x direction. Since the x-moving device 70 and the y-moving devices 71 and 72 have the same structure, the x-moving device 70 will be described as a representative. The x-moving device 70 includes an electric motor 74, a moving member 75, a screw mechanism 76 as a motion conversion device that converts the rotation of the electric motor 74 into linear movement of the moving member 75, and the like, which are attached to the base base 55. A protruding portion 79 provided so as to be movable integrally with the first elevating platform 57 is engaged with the 75 via a roller 77 and a ball plunger 78. By driving the electric motor 74, the moving member 75 is moved in the x direction, and the projecting portion 79 and the first elevating base 57 are moved relative to the base base 55 in the x direction. The y-moving devices 71 and 72 are operated in different states and the x-moving device 70 is operated, so that the first elevating table 57 is rotated about the z-axis with respect to the base table 55. The relative movement of the first lift 57 with respect to the base 55 is smoothly allowed by a plurality of steel balls 58 (see FIG. 3) interposed between the first lift 57 and the base 55.

As shown in FIG. 5, the mask device 10 is provided above the substrate elevating device 6 and the like of the frame 2, and includes a mask holding device 82, a mask moving device 83, a clamp mechanism 84, and the like. The mask holding device 82 holds the mask S in a flat state in a pulled state, and includes a mesh 86 and a rectangular mask frame 87. The mask S is a thin film made of metal, and has a plurality of through holes formed in a plurality of portions corresponding to a plurality of printed portions of the substrate P.

The mesh 86 can be made of, for example, polyester fiber or the like and has elasticity. The mesh 86 generally has a frame shape, and is attached to the mask frame 87 at a peripheral portion by an adhesive. The mask S is attached to the mesh 86 with an adhesive in a pulled state at a peripheral portion.

The mask moving device 83 moves the mask S by moving the mask frame 87 in the xy plane. As shown in FIG. 5, the mask moving device 83 is provided on the frame cradle 90 for holding the mask frame 87. The mobile device 92, two y mobile devices 94, 95 and the like are included. Since the x-moving device 92 and the y-moving devices 94 and 95 have the same structure, the x-moving device 92 will be described as a representative. The x-moving device 92 includes a driving device 102 and a pressing device 103 provided in portions of the mask frame 87 facing each other in the x-direction. The drive device 102 includes an electric motor 100 and a motion conversion mechanism 101 that converts the rotation of the electric motor 100 into linear movement and transmits it to the mask frame 87. The pressing device 103 is composed of an air cylinder or the like, and applies a reaction force while allowing the mask frame 87 to move by the driving device 102. The driving device 102 and the pressing device 103 are respectively engaged with the mask frame 87 via the roller 104, and the mask frame 87 is held by the frame receiving portion 90 via the rotating body 105. As a result, the mask frame 87 can be smoothly moved in the xy plane. The mask frame 87 is rotated around the z-axis by operating the y-moving devices 94 and 95 in different states and operating the x-moving device 92.

The clamp mechanism 84 includes four clamp devices 108 provided apart from each other. The clamp device 108 includes a cylinder and a clamp member 106 integrally movably engaged with the piston rod of the cylinder, and a clamp position where the clamp member 106 presses the mask frame 87 by the operation of the cylinder. It is moved to a non-clamping position away from the mask frame 87. At the non-clamping position of the clamping member 106, the mask frame 87 is moved in the xy plane with respect to the frame cradle 90 by the operation of the x moving device 92 and the y moving device 94, 95, and at the clamp position of the clamping member 106. The mask frame 87 is held.

As shown in FIGS. 1 and 2, the squeegee device 12 includes a squeegee head 112 having a pair of squeegees 110a and 110b, and a squeegee moving device 114 for moving the squeegee head 112 in the y direction. The squeegee moving device 114 includes an electric motor 115, a slider (not shown), a screw mechanism 116 as a motion conversion mechanism that converts the rotation of the electric motor 115 into linear movement and transmits it to the slider, a guide rail 117 extending in the y direction, and the like. , The squeegee head 112 is fixedly held by the slider. The head body 119 of the squeegee head 112 is provided with elevating devices 118a, 118b and the like for raising and lowering the squeegees 110a and 110b, respectively. The squeegees 110a and 110b are held on the head body 119 so as to be able to move up and down, respectively.

The imaging device 14 is a mask through-hole imaging device that images a through hole formed in the mask S from above, and is movable along the mask S above the mask S. The image pickup device moving device for moving the image pickup device 14 includes an x moving device 120 provided in the head main body 119. The x-moving device 120 includes a guide rail 124 extending in the x-direction, an electric motor 125, a ball screw 126 rotated by the electric motor 125, a slider 127 having a nut member engaged with the ball screw 126, and the like. The imaging device 14 is integrally movably held in 127. The image pickup device 14 is moved in the x direction by the x moving device 120, and is moved in the y direction by the squeegee moving device 114. From this, it can be considered that the image pickup device moving device is composed of the x moving device 120, the squeegee moving device 114, and the like.

The laser length measuring device 16 measures the distance Lz (see FIG. 9) to the lower surface Sf of the mask S, and the mask is based on the distance Lz to the lower surface Sf of the mask S acquired by the laser length measuring device 16. The swell degree ΔLz indicating the degree of swell of S is acquired. The laser length measuring device 16 is made accessible by the laser length measuring device moving device 130 between the substrate holding device 22 and the mask device 10. As shown in FIG. 6, the laser length measuring device moving device 130 includes an x moving device 142 and a y moving device 144. The x-moving device 142 includes an electric motor 150, a motion conversion mechanism 154 that converts the rotation of the electric motor 150 into a linear motion of the x-slider 152, guide rails 156a and 156b extending in the x-direction, and the like. The y-moving device 144 is provided on the x-slider 152, and includes an electric motor 158, a y-slider 161, a motion conversion mechanism 160 that converts the rotation of the electric motor 158 into linear movement of the slider 161, a guide rail 162 extending in the y-direction, and the like. Including. The laser length measuring device 16 is integrally movably held by the y slider 161 and is made movable in the xy plane by the x moving device 142 and the y moving device 144.

The mask printing machine is controlled by the control device 200 shown in FIG. 7. The control device 200 is mainly a computer, and includes an execution unit 204, a storage unit 206, an input / output unit 208, and the like. An image pickup device 14, a laser length measuring device 16, a display 210, and the like are connected to the input / output unit 208, and a board transfer device 4, a board lifting device 6, a board moving device 8, a mask device 10, a squeegee device 12, and the like. The image pickup device moving device, the laser length measuring device moving device 130, the mask suction mechanisms 38a, 38b and the like are connected via the drive circuit 212, respectively. The display 210 shows the status of the mask printing machine.

In a mask printing machine, the substrate P is usually located below the standard height H0, and as shown in FIG. 8A, the upper surface Pf of the substrate P is located below the lower surface Sf of the mask S with a gap. When the substrate P is transported to a predetermined position below the mask S by the substrate transport device 4, reference marks formed on each of the substrate P and the mask S are imaged. Then, the position correction value, which is the amount of movement of the substrate P, is acquired so that the center points of these reference marks coincide with each other, and the substrate P is moved by the substrate moving device 8. The relative positions of the substrate P and the mask S in the xy plane are controlled, and the alignment is performed. After that, as shown in FIG. 8B, the substrate P is raised to a standard height H0 at which the upper surface Pf of the substrate P abuts on the lower surface Sf of the mask S. After that, the heights of the squeegees 110a and 110b are adjusted, and the squeegees 110a and 110b are moved in the horizontal direction, so that the creamy solder as a viscous fluid is applied to the printed portion of the substrate P. Solder printing as printing is performed. The standard height H0 is, for example, the frame cradle 90 that holds the mask frame 87 of the mask holding device 82 from below from a predetermined surface of the mask printing machine (for example, the upper surface of the base 12). It can be the height to the top surface.

When the mask S is pulled by the mesh 86 and stretched in a plane, the upper surface Pf of the substrate P and the mask S are when the substrate P is raised to the standard height H0 as described above. It is usual that the surface contact with the lower surface Sf of the above surface is good. On the other hand, for example, as shown in FIG. 9, when the mask S undulates due to the decrease in the tensile force of the mesh 86, even if the substrate P is raised to the standard height H0, it becomes the upper surface Pf of the substrate P. The lower surface Sf of the mask S does not make good surface contact, and a portion that contacts the mask S and a portion that does not contact may occur. For example, if the mesh 86 is stretched or the flatness of the mesh 86 is impaired, it is considered that the mask S undulates. Therefore, it becomes difficult to perform solder printing well.
In addition, in FIGS. 9 to 12, the waviness of the mask S is shown larger than the actual size in order to facilitate understanding.

Therefore, in this embodiment, the actual undulation degree of the mask S is acquired, and the amount of increase ΔH from the standard height H0 of the substrate P is acquired based on the undulation degree. Then, the substrate P is raised above the standard height H0 by ΔH or more. The degree of undulation is a value representing the degree of undulation of the mask S. For example, when the degree of undulation is large, the amount of increase ΔH can be obtained as a larger value than when the degree of undulation is small. The amount of rise ΔH rises above the standard height H0 of the substrate P (the height at which the upper surface Pf of the substrate P and the lower surface Sf of the mask S can make surface contact when the degree of undulation of the mask S is small). It is estimated that the upper surface Pf of the substrate P and the lower surface Sf of the mask S can be in good surface contact with each other.

In this embodiment, the maximum value of the amplitude ΔLz of the mask S is acquired as the degree of undulation ΔLz. As shown in FIG. 9, when the upper surface Pf of the substrate P is separated from the lower surface Sf of the mask S, the laser length measuring device 16 is moved by the laser length measuring device moving device 130 while the lower surface of the mask S is moved. The distances Lz to a plurality of points of Sf are acquired respectively. Then, the value obtained by subtracting the minimum value from the maximum value of the distance Lz, in other words, the maximum value ΔLz of the amplitude of the mask S is acquired as the degree of undulation. Further, the amount of increase ΔH from the standard height H0 of the substrate P is acquired based on the undulation degree ΔLz of the mask S. For example, the degree of swell ΔLz can be set to the amount of increase ΔH (= ΔLz). It is presumed that the upper surface Pf of the substrate P is brought into surface contact with the lower surface Sf of the mask S as shown in FIG. 10 by raising the substrate P from the standard height H0 to the upper side of ΔH.

Further, it is desirable that the amplitude ΔLz is acquired based on the waviness in the y direction rather than the waviness in the x direction of the mask S. As shown in FIG. 5, the pair of clamp members 34a and 34b of the substrate holding device 22 extend in the x direction. Therefore, undulations are likely to occur between the clamp members 34a and 34b, that is, in the y direction (width direction of the substrate P) orthogonal to the clamp members 34a and 34b.

The degree of undulation ΔLz can be obtained, for example, based on a value (Ly−L0) obtained by subtracting the length L0 in the actual frame of the mesh 86 from the actual length Ly of the mask S. This is because the length of the mesh 86 in the actual frame in the y direction becomes shorter in the state where the mask S undulates due to the extension of the mesh 86. Further, the amount of increase ΔH can be, for example, 1/2 (ΔH = ΔLz / 2) of the degree of swell ΔLz.

Further, in this embodiment, as shown in FIG. 11, solder printing is performed in a state where the substrate P is lowered to the standard height H0. In that case, the heights of the squeegees 110a and 110b can be adjusted in the same manner as in the normal case, and solder printing can be performed in the same manner as in the normal case.
After the solder printing is completed, the plate release control is performed, and the plate release control is started after the height is lowered by ΔH or more from the standard height H0 as shown in FIG. At a height of ΔH or more below the standard height H0, the upper surface Pf of the substrate P and the lower surface Sf of the mask S are in surface contact with each other, but by slightly lowering the substrate P from this height, the substrate P It is presumed that the upper surface Pf of the mask S is separated from the lower surface Sf of the mask S. Therefore, the plate release control is performed from a position lower than the standard height H0 by ΔH or more.

Solder printing is performed by executing the solder printing program shown in the flowchart of FIG.
In step 1 (hereinafter, simply abbreviated as S1; the same applies to other steps), the laser length measuring instrument 16 acquires the distances Lz to each of the plurality of points of the lower surface Sf of the mask S, and these distances are obtained. The undulation degree ΔLz of the mask S is acquired based on Lz. In S2, it is determined whether or not the undulation degree ΔLz is larger than the alarm threshold value ΔLw and is so large that solder printing cannot be performed. When the determination is NO, in S3, ΔLz is smaller than the alarm threshold value ΔLw and larger than the correction threshold value ΔLth, and even if the substrate P is raised to the standard height H0 due to undulation, the substrate It is determined whether or not the upper surface Pf of P and the lower surface Sf of the mask S are in a state where it is presumed that they do not make good surface contact. If the determination is NO, normal solder printing is performed. In S4 to 7, the substrate P is raised to the standard height H0, and the heights of the squeegees 110a and 110b are adjusted. After that, the squeegees 110a and 110b are moved in the y direction to perform solder printing. After the solder printing is completed, plate release control is performed. By lowering the substrate P, the upper surface of the substrate P is separated from the lower surface of the mask S. In the plate release control, the descending speed of the substrate P is controlled so that the lower surface Sf of the mask S is satisfactorily separated from the upper surface Pf of the substrate P.

On the other hand, if the determination in S3 is YES, S8 to 15 are executed.
In S8, the amount of increase ΔH from the standard height H0 is acquired based on the degree of swell ΔLz, and in S9, the substrate P is increased to a height ΔH or more above the standard height H0. As shown in FIG. 10, it is presumed that the lower surface Sf of the mask S and the upper surface Pf of the substrate P are in good surface contact with each other in a state where the substrate P is raised to a height (H0 + ΔH or more). In S10, the mask S is attracted and held on both sides of the substrate P by the mask suction mechanisms 38a and 38b. In S11, as shown in FIG. 11, the substrate P is lowered to the standard height H0 and stopped. In S12 and 13, the heights of the squeegees 110a and 11b are adjusted, and the squeegees 110a and 110b perform solder printing. The heights of the squeegees 110a and 110b may be the same as when normal solder printing is performed. Then, after the solder printing is performed, in S14, the substrate P is lowered from the standard height H0 by ΔH or more (H0−ΔH or more). At this height, the lower surface Sf of the mask S is in good surface contact with the upper surface Pf of the substrate P. From this height, in S15, the suction of the mask S by the mask suction mechanisms 38a and 38b is released, and the plate release control is performed. As a result, the upper surface Pf of the substrate P can be satisfactorily separated from the lower surface Sf of the mask S.
On the other hand, if the determination in S2 is YES, that is notified in S16. For example, the display 210 may indicate that it is desirable to replace the mesh 86.

As described above, in this embodiment, the undulation degree ΔLz of the mask S is actually acquired, and the increase amount ΔH is acquired based on the actually acquired undulation degree ΔLz. Then, the height obtained by adding the value of the increase amount ΔH or more to the standard height H0 is set as the first target height (H0 + ΔH or more), and the substrate P is increased to the target height. As a result, even if the mask S is undulating, the upper surface Pf of the substrate P can be brought into good contact with the lower surface Sf of the mask S, and solder printing can be performed satisfactorily. Further, since the rising amount ΔH is acquired based on the actual undulation degree ΔLz, the substrate P can be raised to a height at which the upper surface Pf is in surface contact with the lower surface Sf of the mask S, and solder printing can be performed with high accuracy. Can be done. Further, it is possible to make it difficult to apply more stress than necessary to the mask S, and it is possible to suppress a decrease in the durability of the mask S.

Further, the plate release control is started from a state in which the substrate P is lowered to the second target height (H0-ΔH or more), which is the height obtained by subtracting the value of ΔH or more from the standard height H0. The second target height, that is, the upper surface Pf of the substrate P and the lower surface Sf of the mask S are in surface contact with each other, and when the substrate P is slightly lowered, the upper surface Pf of the substrate P is separated from the lower surface Sf of the mask S. The plate release control is started from the height at which the printing starts. Therefore, when the upper surface Pf of the substrate P is satisfactorily separated from the lower surface Sf of the mask S, the solder printing accuracy can be less likely to be impaired.

Although the distance Lz to the lower surface Sf of the mask S is measured by the laser length measuring device 16, it is not indispensable to use the laser length measuring device 16, and a distance sensor that widely uses electromagnetic waves or the like is used. It can be measured.
Further, the mask suction mechanisms 38a and 38b are not indispensable. For example, in a mask printing machine provided with mask suction mechanisms 38a and 38b, solder printing can be performed without using the mask suction mechanisms 38a and 38b, or in a mask printing machine not provided with mask suction mechanisms 38a and 38b. , Solder printing can be performed. An example of this case is shown in the flowchart of FIG. In the flowchart of FIG. 14, the steps in which the same execution as that of the flowchart of FIG. 13 is performed are assigned the same step numbers and the description thereof will be omitted.

In the flowchart of FIG. 14, there is no step S10, 11, 14 of the flowchart of FIG. In S9, the substrate P is raised to a height higher than the standard height H0 by an amount of ΔH or more, and the upper surface Pf of the substrate P and the lower surface Sf of the mask S are in surface contact with each other. After that, in S20, the heights of the squeegees 110a and 110b are adjusted, and in S13, solder printing is performed by the squeegees 110a and 110b. In this embodiment, the squeegees 110a and 110b are positioned at a height higher than ΔH from the case where normal solder printing is performed. After that, in S21, the substrate P is lowered to the standard height H0, and in S22, the plate release control is started from the standard height H0. Since the mask S is not sucked by the mask suction mechanisms 38a and 38b, the upper surface Pf of the substrate P and the lower surface Sf of the mask S are in surface contact with each other while the substrate P is lowered to a height (H0-ΔH or more). This is because it may not be retained. Therefore, the plate release control is started from the standard height H0.

As described above, in this embodiment, the degree of swell is acquired by the portion that stores S1 of the viscous fluid printing program represented by the flowcharts of FIGS. 13 and 14 of the laser length measuring device 16 and the control device 200, the portion that executes the program, and the like. The device is configured, the first target height acquisition unit and the ascending amount acquisition unit are configured by the part that stores S8 of the control device 200, the part that executes it, and the substrate is composed of the part that stores S4 and S9, the part that executes. The elevating control unit is configured, and the plate release control unit is composed of a portion that stores S15, a portion that executes S15, and the like.
Further, the execution of S1 of the viscous fluid printing program shown in the flowcharts of FIGS. 13 and 14 corresponds to the undulation degree acquisition process, the execution of S8 corresponds to the increase amount acquisition process, and the execution of S9 corresponds to the substrate elevation process. Then, the execution of S13 corresponds to the printing process. Further, the execution of S10 of the viscous fluid printing program represented by the flowchart of FIG. 13 corresponds to the suction step, the execution of S11 corresponds to the first lowering step, the execution of S14 corresponds to the second lowering step, and S15. Corresponds to the second edition separation control process. On the other hand, the execution of S21 of the viscous fluid printing program represented by the flowchart of FIG. 14 corresponds to the substrate lowering step, and the execution of S22 corresponds to the first plate separation control step.

The present invention can be carried out in a form in which various modifications and improvements have been made based on the knowledge of those skilled in the art.

6: Substrate elevating device 10: Mask device 12: Squeegee device 16: Laser length measuring device 38a, 38b: Mask suction mechanism 82: Mask holding device 86: Mesh 87: Mask frame 110a, 110b: Squeegee 114: Squeegee moving device 120: x moving device 130: laser length measuring device moving device 200: control device

Claims (8)

A mask printing machine that prints viscous fluid on a circuit board through a plurality of through holes formed in a mask.
A board holding device for holding the circuit board and
A mask holding device that holds the mask above the circuit board held by the board holding device,
A substrate lifting device that raises and lowers the circuit board with respect to the mask held by the mask holding device.
A swell degree acquisition device that acquires the degree of swell, which is the degree of swell of the mask held by the mask holding device,
A first target height acquisition unit that acquires a first target height, which is a target height of the circuit board, based on the undulation degree acquired by the undulation degree acquisition device.
By controlling the board elevating device, the circuit board is raised to the first target height acquired by the first target height acquisition unit, so that the circuit board and the mask are brought into surface contact with each other. Mask printing machine including parts. The rise amount acquisition unit that the first target height acquisition unit acquires the rise amount of the circuit board from the standard height determined by the mask holding device based on the swell degree acquired by the swell degree acquisition device. Is included, and a value equal to or greater than the value obtained by adding the increase amount acquired by the increase amount acquisition unit to the standard height is acquired as the first target height.
When the swell degree acquired by the swell degree acquisition device is smaller than the set value, the board elevating control unit raises the circuit board to the standard height by controlling the board elevating device, thereby causing the circuit board. And the mask are brought into surface contact with each other, and when the degree of swell is equal to or higher than the set value, the circuit board is raised to the first target height by controlling the board elevating device, whereby the circuit board and the mask are raised. The mask printing machine according to claim 1, wherein the and is brought into surface contact with each other. By controlling the substrate elevating device, the substrate elevating control unit keeps the circuit board in a state where the circuit board and the mask are in surface contact with each other, and at the same amount as the ascending amount from the standard height. It lowers to the second target height, which is lower than a certain amount of descent.
A claim including a plate release control unit in which the mask printing machine starts plate release control for separating the upper surface of the circuit board from the lower surface of the mask from a state in which the circuit board is lowered to the second target height. The mask printing machine according to 2. The mask printing machine according to any one of claims 1 to 3, wherein the substrate holding device includes a pair of mask suction mechanisms for sucking the mask on both side portions of the circuit board. The swell degree acquisition process for acquiring the swell degree, which is the degree of swell of the mask held by the mask holding device,
An increase amount acquisition step of acquiring the increase amount of the circuit board from the standard height determined by the mask holding device based on the undulation degree acquired in the undulation degree acquisition step.
A substrate raising step of raising the circuit board to a first target height, which is a height higher than the standard height by the amount of rising or more.
A viscous fluid printing method including a printing step of printing a viscous fluid on the circuit board raised to the first target height via the mask. After the printing step, a substrate lowering step of lowering the circuit board to the standard height while maintaining a state in which the circuit board and the mask are in surface contact with each other.
The viscous fluid printing method according to claim 5, further comprising a first plate release control step of starting a plate release control for separating the circuit board from the mask in a state where the circuit board is lowered to the standard height. The swell degree acquisition process for acquiring the swell degree, which is the degree of swell of the mask held by the mask holding device,
An increase amount acquisition step of acquiring an increase amount from a standard height determined by the mask holding device of the circuit board based on the undulation degree acquired in the undulation degree acquisition step.
A substrate raising step of raising the circuit board to a first target height, which is a height equal to or higher than the standard height plus the rising amount.
A suction step of sucking the mask on both sides of the circuit board raised to the first target height,
The first lowering step of lowering the circuit board to the standard height while maintaining the state in which the mask is sucked on both sides of the circuit board.
A viscous fluid printing method including a printing step of printing a viscous fluid on the circuit board lowered to the standard height through the mask. After the printing step, the state in which the mask is sucked on both sides of the circuit board to a second target height, which is a height lower than the standard height by a lowering amount or more, which is the same amount as the rising amount. The second lowering process of lowering while holding,
After the circuit board is lowered to the second target height, the suction of the mask on both sides of the circuit board is canceled, and the plate release control for separating the upper surface of the circuit board from the lower surface of the mask is started. The viscous fluid printing method according to claim 7, which includes a two-plate separation control step.

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