WO2023181117A1 - Dispositif de refroidissement et procédé de refroidissement pour dispositif de refroidissement - Google Patents

Dispositif de refroidissement et procédé de refroidissement pour dispositif de refroidissement Download PDF

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Publication number
WO2023181117A1
WO2023181117A1 PCT/JP2022/013160 JP2022013160W WO2023181117A1 WO 2023181117 A1 WO2023181117 A1 WO 2023181117A1 JP 2022013160 W JP2022013160 W JP 2022013160W WO 2023181117 A1 WO2023181117 A1 WO 2023181117A1
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WO
WIPO (PCT)
Prior art keywords
heat
evaporators
refrigerant
evaporator
cooling device
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Application number
PCT/JP2022/013160
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English (en)
Japanese (ja)
Inventor
孔一 轟
実 吉川
憲司 小林
善則 宮本
正樹 千葉
真弘 蜂矢
隆 大塚
信夫 金子
ひろみ 山本
Original Assignee
日本電気株式会社
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Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to PCT/JP2022/013160 priority Critical patent/WO2023181117A1/fr
Publication of WO2023181117A1 publication Critical patent/WO2023181117A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
    • F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel

Definitions

  • the present invention relates to a cooling device and a cooling method for the cooling device.
  • the local cooling device has a heat receiver that receives heat from air discharged from the server, a compressor that compresses the refrigerant received by the heat receiver, and a radiator that radiates heat from the refrigerant compressed by the compressor as main components.
  • the specifications of the local cooling system are based on the number of servers (server racks) installed in the server room and the load of each server (average and peak heat generation predicted from the load of each server and the number of servers).
  • the cooling capacity is estimated and determined by considering the installation of a sufficient number of heat receivers, compressors, and radiators to satisfy the estimated cooling capacity.
  • Patent Document 1 related to the present invention describes a technique for increasing the number of indoor units and outdoor units according to cooling capacity requirements when heat exchange is performed between a plurality of indoor units and a plurality of outdoor units using a heat pump device. is disclosed. Further, a technique is disclosed in which the diameter of a pipe through which a refrigerant flows is set according to the cooling capacity.
  • Patent Document 2 related to the present invention discloses a technique for adjusting the flow rate of refrigerant supplied to each indoor unit using a regulating valve in a refrigeration cycle device that supplies refrigerant from one outdoor unit to a plurality of indoor units. There is.
  • Patent Document 3 related to the present invention describes that in an air conditioner that supplies refrigerant from one outdoor unit to multiple indoor units, the adjustment range of the cooling capacity of one outdoor unit corresponds to an increase or decrease in the number of multiple indoor units.
  • a technique is disclosed for configuring the settings so that it can be done.
  • Patent Documents 1, 2, and 3 are all techniques related to indoor air conditioning, and cannot be immediately applied to local cooling of many servers installed in an air-conditioned room. In other words, it is possible to ensure reliability suitable for continuous operation throughout the day such as in a data center, and it is also possible to respond to fluctuations in cooling load due to seasonal, temporal, or sudden factors, and to maintain system performance. Air conditioners intended for residences and offices, such as those described in Patent Documents 1, 2, and 3, cannot be immediately applied to cooling devices for server rooms that require expandability.
  • An object of the present invention is to provide a cooling device that can flexibly adjust its cooling capacity depending on the situation of the object to be cooled, and a method for manufacturing the same.
  • a cooling device has the following features.
  • the cooling device includes a plurality of evaporators that absorb heat from an object into a refrigerant, a compressor that compresses the refrigerant that has received heat from the evaporators, and a condenser that radiates heat and condenses the refrigerant compressed by the compressors.
  • the cooling device has a refrigeration cycle that circulates refrigerant between the first header pipe, which supplies the refrigerant that has received heat in the plurality of evaporators to the compressor, and the refrigerant that has been condensed in the condenser, and which supplies the refrigerant that has been condensed in the condenser to the the evaporator is provided in each of the plurality of objects, and the evaporator is configured to be able to adjust the amount of heat absorbed from each of the objects. .
  • the cooling method includes a step of absorbing the heat of the object by a refrigerant flowing through a plurality of evaporators, a step of compressing the refrigerant that has absorbed the heat with a compressor, and a step of radiating heat and condensing the compressed refrigerant in a condenser. a step of circulating the heat to an evaporator; a step of setting the heat absorption amount of each of the plurality of evaporators to be larger than a heat radiation amount of one of the objects; and a step of stopping heat absorption by a part of the plurality of evaporators. and increasing the amount of heat absorbed by at least some of the plurality of evaporators that do not stop absorbing heat.
  • the cooling capacity of the cooling device can be flexibly adjusted.
  • FIG. 2 is a piping system diagram of a cooling device according to a minimum configuration example of the present invention. It is a process diagram of the cooling method of the cooling device concerning the minimum structural example of this invention.
  • FIG. 1 is a perspective view showing the appearance of a cooling device according to a first embodiment of the present invention.
  • 4 is a piping system diagram of the cooling device in FIG. 3.
  • FIG. 4 is a piping system diagram in one operation mode of the cooling device shown in FIG. 3.
  • FIG. It is a piping system diagram of the cooling device concerning a 2nd embodiment of the present invention. It is a sectional view showing details of an evaporator part of a cooling device concerning a 3rd embodiment of the present invention.
  • It is a block diagram of a cooling device concerning a 4th embodiment of the present invention.
  • This cooling device includes a plurality of evaporators 1 that absorb heat of an object S into a refrigerant, a compressor 2 that compresses the refrigerant received by the evaporators 1, and a compressor 2 that radiates heat from the refrigerant compressed by the compressor 2.
  • a cooling device having a refrigeration cycle that circulates refrigerant between a condenser 3 for condensing, and a first header pipe 4 for supplying the refrigerant that has received heat in the plurality of evaporators 1 to the compressor 2; a second header pipe 5 for supplying the refrigerant condensed in the container 3 to the plurality of evaporators 1, the evaporator 1 is provided for each of the plurality of objects S, and the evaporator 1 includes: Each of them is configured to be able to adjust the amount of heat absorbed from the object S.
  • the heat released from the object S is absorbed by the refrigerant by the evaporator 1 provided in each of the objects S, and the refrigerant absorbed by each evaporator 1 is transferred to the first header pipe 4.
  • the heat generated in the object S is transferred to the outside of the system by being distributed and circulated from the second header pipe 5 to the evaporator 1. Can be discharged.
  • a part of the plurality of objects S is removed or cooling becomes unnecessary, or if a part of the evaporator 1 provided for each of the objects S breaks down or due to maintenance. If it has to be stopped, the remaining objects S can be continued to be cooled by continuing to operate the compressor 2 and condenser 3.
  • This method consists of a step SP1 in which the heat of the object is absorbed by the refrigerant flowing through a plurality of evaporators, a step SP2 in which the refrigerant that has absorbed the heat is compressed by a compressor, and a condenser radiates heat from the compressed refrigerant and condenses it. , a step SP3 of circulating the heat to the evaporator, a step SP4 of setting the heat absorption amount of each of the plurality of evaporators to be larger than the heat release amount of one of the object objects, and absorption of heat by a part of the plurality of evaporators. and a step SP6 of increasing the amount of heat absorbed by at least some of the plurality of evaporators that do not stop absorbing heat.
  • the heat emitted from the object is absorbed by the refrigerant by the evaporator, the refrigerant absorbed by each evaporator is compressed by the compressor, and after being condensed by the condenser, it is distributed to the evaporator and circulated.
  • the heat generated in the object can be discharged to the outside of the system.
  • some of the multiple objects are removed or cooling is no longer required, or some of the multiple evaporators installed in each of the objects are stopped due to failure or maintenance. If this becomes necessary, by continuing to operate the compressor and condenser, the cooling of the first object can be continued using the refrigerant circulating through the remaining radiator.
  • FIGS. 3 to 5 An embodiment of the present invention will be described with reference to FIGS. 3 to 5. Note that in FIGS. 3 to 5, the same components as those in FIG. 1 are given the same reference numerals to simplify the explanation.
  • server racks S equipment in which multiple servers are stored in racks stacked one on top of the other serve as objects to be cooled, and are arranged in multiple rows as shown in Figure 3. It is located.
  • Each server rack S sucks low-temperature air (air that is relatively colder than the air released to the hot aisle 6B) sucked in from the cold aisle 6A side of the server room in which it is installed in the direction of arrow A in FIG. (hereinafter used with the same meaning in this specification) to the hot aisle 6B, the internal CPU (Central Processing Unit), memory, etc. of each of the servers stored in the server rack S is released. dissipates heat generated from heat-generating parts.
  • CPU Central Processing Unit
  • An evaporator 10 is arranged above each of the plurality of server racks S at a position on the hot aisle 6B side.
  • the plurality of evaporators 10 are connected to the first header pipe 4 via a branch pipe 41 and further an intermediate branch pipe 42, as shown in FIG.
  • the compressor 2 compresses the refrigerant discharged from the evaporator 10 and joins in the first header pipe 4, and sends it to the condenser 3 as shown by arrow C in FIGS. 3 and 4.
  • the condenser 3 radiates heat from the compressed refrigerant.
  • the refrigerant condensed due to heat radiation expands due to fluid resistance when passing through the expansion valve 30, and then passes through the second header pipe 5, as shown by arrow D in FIGS. 3 and 4, to the intermediate branch pipe 52 and the branch pipe. 51 to each evaporator 10.
  • the heat dissipation in the condenser 3 can be carried out by exchanging heat with the atmosphere using heat dissipation fins provided in the piping through which the refrigerant flows, or by exchanging heat with cooling water through the piping through which the refrigerant flows, and then discharging this cooling water with the atmosphere in a cooling tower. This is done by exchanging methods, etc.
  • the compression capacity of the compressor 2 and the heat radiation capacity of the radiator 3 are calculated based on the total amount of heat radiation of the current eight server racks S, and may be larger than the total cooling capacity (endothermic capacity) of the eight evaporators 10.
  • the first header pipe 4 is constructed so that the pressure loss upstream from the compressor 2 (evaporator 10) is smaller than the pressure loss in the pipe 4' downstream from the compressor 2 (condenser 3). It is made of piping material of the same diameter.
  • the cooling device configured as above and the cooling method will be explained.
  • the compressor 2 starts compressing the refrigerant with the startup of the eight server racks S
  • the compressed gaseous refrigerant radiates heat in the condenser 3 and becomes a liquid phase, and after being expanded and depressurized by the expansion valve 30.
  • the refrigerant in the evaporator 10 evaporates.
  • each evaporator 10 passes through the cold aisle 6A of the server room, is sucked into the server rack S as shown by arrow A in FIG. 3, reaches a high temperature as shown by arrow B, and is then exhausted. and is sucked into the evaporator 10 again.
  • the refrigerant that has absorbed heat in the evaporator 10 passes through a branch pipe 41 and an intermediate branch pipe 42 and joins the first header pipe 4, is compressed in the compressor 2, is radiated in the condenser 3, and is then transferred to the second header pipe again. 5 and circulated through the cooling cycle.
  • one of the evaporators 10 breaks down and the supply and discharge of refrigerant to the evaporator 10A stops (only when the refrigerant cannot flow due to the fault) (including cases in which the flow of refrigerant is artificially stopped for maintenance and inspection), as shown in FIG.
  • High-temperature exhaust gas from SA is sucked in and cooled.
  • the exhaust heat from the four server racks SA, SB, SC, and SD that should be absorbed by the four evaporators 10A, 10B, 10C, and 10D is absorbed.
  • FIG. 6 A second embodiment of the present invention will be described with reference to FIG.
  • This second embodiment has a configuration in which a regulating valve V is provided in each branch pipe 51 that branches from the second header pipe 5 and supplies refrigerant to the plurality of evaporators 10, respectively.
  • the regulating valve V has a function of individually increasing or decreasing the flow rate of the refrigerant supplied to the plurality of evaporators 10 by adjusting its opening degree.
  • the regulating valve V provided in the branch pipe 51 that goes to the evaporator 10B adjacent to the evaporator 10A is further opened to allow more refrigerant to flow in (or the evaporator 10A, 10B
  • the exhaust air of the adjacent server rack SA can be reduced. It can supplement cooling.
  • the regulating valve V is provided in the branch pipe 41 that causes the refrigerant that has absorbed heat in the evaporator 10 to join the first header pipe 4.
  • the cooling capacity may be adjusted by adjusting the regulating valve V on the outlet side of the evaporator 10, or the regulating valves V provided on both the branch pipes 41 and 51 of the evaporator 10 may be closed to reduce the evaporation.
  • the device 10 (for example, the evaporator 10A) may be separated from the first header pipe 4 and the second header pipe 5 and removed from the cooling device for maintenance, inspection, or replacement.
  • FIG. 7 A third embodiment of the present invention will be described with reference to FIG.
  • the same components as those in FIGS. 1 and 3 to 6 are given the same reference numerals to simplify the explanation.
  • a specific configuration as shown in FIG. 7 is adopted as the evaporator 10.
  • Reference numeral S indicates one server rack, and this server rack S has a fan 70 that discharges low-temperature air sucked in from the cold aisle 6A in the direction of arrow A to the hot aisle 6B in the direction of arrow B.
  • three fans are shown, but it is assumed that each of the plurality of servers included in the server rack S is provided with a fan 70.
  • the evaporator 10 has ducts 11 that open downward on each of the cold aisle 6A side and the hot aisle 6B side.
  • a fan 12 is provided at the opening of this duct on the hot aisle 6B side, and the fan 12 is configured to suck high-temperature exhaust from the server rack S into the duct 11.
  • This evaporator main body 13 is arranged above the fan 12.
  • This evaporator main body 13 mainly includes a heat exchange pipe that receives refrigerant from the branch pipe 51 and discharges it to the branch pipe 41.
  • This heat exchange pipe exchanges heat with the air flowing through the duct 11. Equipped with heat dissipation fins for promotion.
  • a sheet-shaped guide curtain 14 is provided at the opening of the duct 11 on the cold aisle 6A side to direct the low-temperature air released from the duct 11 in the direction of arrow A, giving priority to the air in the server room.
  • the server rack S may be guided and sucked into the server rack S.
  • the evaporator 10 configured as described above cools the air sucked in by the fan 12 through heat exchange with the refrigerant in the evaporator main body 13, and discharges the air to the cold aisle 6A side, so that the air is delivered to the server rack S at a low temperature. air can be supplied. Furthermore, by controlling the rotation of the fan 12, the amount of cooling of the evaporator 10 that cools any one of the plurality of server racks S can be increased or decreased. For example, if one of the evaporators 10 is stopped due to a failure or maintenance inspection, the fan 12 of the evaporator 10 (for example, 10A) is stopped, and the fan 12 of the other evaporator 10B adjacent to this evaporator 10A is stopped. By increasing the rotation speed of the fan 12, the amount of heat absorbed by the other evaporator 10B can be increased.
  • This fourth embodiment includes a control unit 80 that adjusts the cooling capacity according to the cooling load required of the cooling device.
  • the control unit 80 controls the fan 12 of the evaporator 10 (specifically, the rotation speed of the motor that drives the fan), the opening degree of the regulating valve V that increases or decreases the amount of refrigerant supplied to the evaporator 10, and the compression
  • the compressor 2 specifically, the rotation speed of the motor that drives the compressor
  • the radiator 3 specifically, the flow rate of cooling air and cooling water supplied to the radiator
  • the liquid level and refrigerant are controlled in a tank (not shown) that is installed in the refrigerant circulation system and performs gas-liquid separation, primary storage, etc. of the refrigerant.
  • the control unit 80 may control the flow rate of a pump (not shown) provided in the middle of the flow path.
  • the opening degree of a damper that adjusts the flow rate of air flowing through the duct 11 of the evaporator 10 may be controlled.
  • the control section 80 is configured to control the evaporator 10A by inputting an operation command from an operator or by a detection signal indicating that the evaporator 10A has stopped.
  • the control section 80 By closing the regulating valve V of the evaporator 10A and opening the regulating valve V of the evaporator 10B adjacent to the evaporator 10A, the high-temperature air released from the server rack SA to be absorbed by the evaporator 10A that is stopped is removed. Cooling can be performed by another adjacent evaporator 10B.
  • the control section 80 similarly stops the fan 12 of the first evaporator 10A and increases the rotation speed of the fan 12 of the adjacent evaporator 10B.
  • the high temperature air discharged from the server rack SA that is to be absorbed by the evaporator 10A can be cooled by drawing it into another adjacent evaporator 10B.
  • branch pipe 41, the branch pipe 51, and the refrigerant pipes constituting the evaporator 10 connected thereto may be provided with flange joints in advance to facilitate installation and removal. desirable.
  • the number of branch pipes 41 and branch pipes 51 is not limited to the number equal to the number of existing server racks S, as shown in the illustrated example, but the number of branch pipes 41 and branch pipes 51 that exceed the number of evaporators 10 currently connected is not limited to the number equal to the number of existing server racks S.
  • the branch pipe 51 may be provided in the intermediate branch pipe 42 and the intermediate branch pipe 52, and these may be sealed with flanges or the like in preparation for expansion.
  • the object to be cooled is not limited to the server of the embodiment, but can be used to cool various heat generating devices such as power supplies and other electronic devices.
  • the present invention can be used in a cooling device and a cooling method in the cooling device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement et un procédé de refroidissement permettant de régler une capacité de refroidissement en fonction d'un objet à refroidir.　Un dispositif de refroidissement selon la présente invention comprend un cycle de réfrigération pour faire circuler un réfrigérant entre une pluralité d'évaporateurs (1) pour faire absorber la chaleur des objets cibles (S) par le réfrigérant, un compresseur (2) pour comprimer le réfrigérant qui a reçu de la chaleur dans les évaporateurs (1), et un condenseur (3) pour dissiper la chaleur du réfrigérant comprimé par le compresseur (2) pour faire se condenser le réfrigérant, le dispositif de refroidissement est équipé d'un premier tuyau collecteur (4) pour fournir au compresseur (2) le réfrigérant qui a reçu de la chaleur dans la pluralité d'évaporateurs, et d'un second tuyau collecteur (5) pour fournir à la pluralité d'évaporateurs (1) le réfrigérant condensé par le condenseur (3), les évaporateurs (1) étant fournis respectivement pour la pluralité d'objets cibles (S), et les évaporateurs (1) étant respectivement configurés pour pouvoir ajuster une quantité de chaleur absorbée par les objets cibles (S).
PCT/JP2022/013160 2022-03-22 2022-03-22 Dispositif de refroidissement et procédé de refroidissement pour dispositif de refroidissement WO2023181117A1 (fr)

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PCT/JP2022/013160 WO2023181117A1 (fr) 2022-03-22 2022-03-22 Dispositif de refroidissement et procédé de refroidissement pour dispositif de refroidissement

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006509294A (ja) * 2002-12-04 2006-03-16 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． 蒸発器を直列に配置したクーリングシステム
JP2013175069A (ja) * 2012-02-27 2013-09-05 Hitachi Ltd 電子機器装置および冷却システム
JP2014163548A (ja) * 2013-02-22 2014-09-08 Fujitsu General Ltd 空気調和装置
WO2021005701A1 (fr) * 2019-07-09 2021-01-14 日本電気株式会社 Système de refroidissement
JP2022032788A (ja) * 2020-08-14 2022-02-25 日本電気株式会社 冷却装置、冷却システム、および冷却方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006509294A (ja) * 2002-12-04 2006-03-16 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． 蒸発器を直列に配置したクーリングシステム
JP2013175069A (ja) * 2012-02-27 2013-09-05 Hitachi Ltd 電子機器装置および冷却システム
JP2014163548A (ja) * 2013-02-22 2014-09-08 Fujitsu General Ltd 空気調和装置
WO2021005701A1 (fr) * 2019-07-09 2021-01-14 日本電気株式会社 Système de refroidissement
JP2022032788A (ja) * 2020-08-14 2022-02-25 日本電気株式会社 冷却装置、冷却システム、および冷却方法

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