WO2023165547A1 - 电子设备及其制造方法 - Google Patents

电子设备及其制造方法 Download PDF

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Publication number
WO2023165547A1
WO2023165547A1 PCT/CN2023/079192 CN2023079192W WO2023165547A1 WO 2023165547 A1 WO2023165547 A1 WO 2023165547A1 CN 2023079192 W CN2023079192 W CN 2023079192W WO 2023165547 A1 WO2023165547 A1 WO 2023165547A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
circuit board
conductive member
conductive
electronic
Prior art date
Application number
PCT/CN2023/079192
Other languages
English (en)
French (fr)
Inventor
钱成
刘海庆
程永全
张仕文
张京涛
Original Assignee
苏州百孝医疗科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州百孝医疗科技有限公司 filed Critical 苏州百孝医疗科技有限公司
Publication of WO2023165547A1 publication Critical patent/WO2023165547A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/14532—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring glucose, e.g. by tissue impedance measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/533—Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members

Definitions

  • the present application relates to the technical field of electronic equipment, for example, to an electronic equipment and a manufacturing method thereof.
  • the course of the disease is long and the disease is protracted. It is necessary to monitor certain physiological parameters of the host in real time, so as to better track the treatment.
  • diabetes requires real-time monitoring of the host's blood sugar. Accurate self-monitoring of blood sugar is the key to achieving good blood sugar control. It is helpful to assess the degree of glucose metabolism disorder in diabetic patients, formulate a hypoglycemic plan, reflect the effect of hypoglycemic treatment and guide the adjustment of the treatment plan.
  • the blood glucose meter is the most widely used on the market. Patients need to collect blood from the tip of their finger to measure the blood sugar level at that moment.
  • Embodiments of the present application provide an electronic device and a manufacturing method thereof.
  • An embodiment of the present application provides an electronic device, including an electronic device main body and a conductive part arranged on the electronic device main body, an electronic circuit board is packaged in the electronic device main body, the conductive part includes at least one conductive member, and each of the The conductive member includes a first end and a second end, the first end protrudes into the main body of the electronic device and is electrically connected to the electronic circuit board, and the second end is left on the The exterior of the main body of the electronic device, and at least one side surface of the second end portion serves as an electrical contact surface.
  • An embodiment of the present application also provides a method for manufacturing an electronic device, including: installing a conductive part including at least one conductive member on the electronic device body, so that the first end of each conductive member protrudes into the electronic device body and electrically connected to the electronic circuit board, and the second end of each conductive member is left outside the main body of the electronic device, and at least one side of the second end is used as an electrical contact noodle.
  • Figure 1 is a schematic diagram of the structure of the transmitter.
  • Fig. 2 is a schematic diagram of a continuous blood glucose monitoring system.
  • Fig. 3 is a schematic diagram of installation of the body surface attachment unit and electronic equipment.
  • FIG. 4 is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a conductive portion of an embodiment of the present application.
  • FIG. 6 is a schematic diagram of forming a base on a conductive part according to an embodiment of the present application.
  • FIG. 7 is a schematic diagram of punching a conductive portion according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of the conductive part of the embodiment of the present application after being punched.
  • FIG. 9 is a schematic diagram of bending a conductive member according to an embodiment of the present application.
  • FIG. 10 is a schematic diagram of a bent conductive member according to an embodiment of the present application.
  • Fig. 11 is a schematic diagram of installing an electronic circuit board on a base according to an embodiment of the present application.
  • Fig. 12 is a schematic diagram of forming a cover on a base according to an embodiment of the present application.
  • 100 host; 200, body surface attachment unit; 210, sensor electrode; 220, shell; 221, signal output terminal; 222, power output terminal; 230, battery; 240, electronic equipment; 241, conductive part; 242 , signal input terminal; 243, power input terminal; 244, electronic circuit board; 245, conductive member; 246, first end portion; 247, hole; 248, second end portion; 249, connection portion; 250, base portion; 251 , cavity; 252, groove; 260, cover; 270, adhesive layer; 300, receiver; 400, injection mold; 500, first punch; 600, second punch; 700, launcher; 710 , PIN needle.
  • the blood glucose meter is the most widely used on the market. Patients need to collect blood from the tip of their finger to measure the blood sugar level at that moment. However, this method has the following defects: 1. It is impossible to know the change of blood glucose level between two measurements, and the patient may miss the peak and valley of blood glucose, which will cause some complications and cause irreversible damage to the patient; 2. Multiple fingertip punctures for blood collection have caused great pain to diabetic patients. In order to overcome the above defects, it is necessary to provide a method that can continuously monitor the blood sugar of patients, so that patients can know their blood sugar status in real time, and take timely countermeasures accordingly, so as to effectively control the disease and prevent complications, so as to obtain a higher blood sugar level. Quality of Life.
  • the sensor electrodes are fixed by the sensor base and applied to the skin of the host, and the transmitter and the sensor
  • the base of the sensor is detachably connected by means such as buckle, wherein the transmitter usually includes a plastic shell and a printed circuit board (Printed Circuit Board, PCB board) packaged in the plastic shell.
  • the PCB board is generally placed in the injection cavity of the mold first, and the plastic shell is formed on the PCB board by one or two high-temperature injection molding processes. Injecting high-temperature injection molding sol in the middle, high-temperature injection molding sol is easy to cause damage to the electronic components on the PCB board, affecting its performance, causing the PCB board to fail to work normally, and resulting in a high product defect rate.
  • the existing transmitter 700 establishes an electrical connection with the sensor electrodes on the sensor base through the end face of the PIN pin 710 on the PCB board, which requires that the PIN pin is exposed on the finished shell of the transmitter 700 710 end faces.
  • the commonly used method is to reserve a longer length of PIN pin 710 before high-temperature injection molding so that after high-temperature injection molding of the shell, some PIN pins 710 protrude from the surface of the shell, and by grinding the PIN pin 710, the end face of the PIN pin 710 is aligned with the surface of the shell.
  • embodiments of the present application provide an electronic device and a manufacturing method thereof.
  • CGM Continuous Glucose Monitoring
  • FIG. 2 is a schematic diagram of a continuous blood glucose monitoring system attached to a host 100 .
  • a continuous blood glucose monitoring system comprising a body surface attachment unit 200 with sensor electrodes 210 attached to the skin surface of the host 100 through an adhesive layer 270 is shown in FIGS. 2 and 3 .
  • the body surface attachment unit 200 has a built-in circuit module electrically connected to the sensor electrode 210, and is used to send the glucose concentration information monitored by the sensor electrode 210 to the receiver 300.
  • the receiver 300 can usually be a smart phone, a smart watch, or a dedicated device. and analogs.
  • the sensor electrode 210 is partially located under the skin of the host 100, in contact with the subcutaneous tissue fluid.
  • FIG. 3 is a schematic structural diagram of a body surface attachment unit 200 for a continuous blood glucose monitoring system.
  • the body surface attachment unit 200 includes a housing 220 and sensor electrodes attached to the housing 220 210 , the battery 230 and the electronic device 240 detachably installed in the housing 220 , the electronic device 240 is equipped with a circuit module, and the circuit module sends the glucose concentration information monitored by the sensor electrode 210 to the receiver 300 .
  • the extracorporeal part of the sensor electrode 210 protrudes into the shell 220 of the body surface attachment unit 200, and is bent and attached to the inner wall of the shell 220.
  • Two signal output terminals 221 are arranged on the inner wall of the shell 220, wherein One signal output terminal 221 is electrically connected to the reference electrode of the sensor electrode 210 , and the other signal output terminal 221 is electrically connected to the working electrode of the sensor electrode 210 .
  • the battery 230 is installed on the bottom surface of the casing 220, for example, the bottom surface of the casing 220 can be provided with a battery holder (not shown) for installing the battery 230, the battery 230 is installed in the battery holder, and the inner wall of the casing 220 is equipped with Two power output terminals 222, wherein one power output terminal 222 is electrically connected to the positive pole of the battery 230 through a conductive sheet, and the other power output terminal 222 is electrically connected to the negative pole of the battery 230 through a conductive sheet, wherein the power output terminal 222 is connected to the negative pole of the battery 230 through a conductive sheet.
  • the conductive sheet can be of integral structure.
  • both the signal output terminal 221 and the power output terminal 222 can use metal conductive sheets, for example, copper sheets can be used, for example, the copper sheets can be gold-plated.
  • the electronic device 240 can be mounted on the housing 220 of the body surface attachment unit 200 by, for example, plugging and unplugging. Electrically connect and form a working circuit.
  • the electronic device 240 is equipped with a conductive part 241, and the conductive part 241 includes two signal input terminals 242 and two power input terminals 243.
  • the two signal input terminals 242 correspond one-to-one to the two signal output terminals 221 and form electrical contact
  • the two power input terminals 243 correspond to the two power output terminals 222 one-to-one. and form electrical contact.
  • the signal input terminal 242 and/or the signal output terminal 221 can be set as an elastic metal conductive sheet, so that the signal input terminal 242 is in a state of extrusion force when it is in electrical contact with the signal output terminal 221, This ensures that the signal input terminal 242 is in a stable electrical contact state with the signal output terminal 221 when the electronic device 240 is mounted on the housing 220 of the body surface attachment unit 200 .
  • the arrangement of the power input terminal 243 and the power output terminal 222 can also be similar to the arrangement of the signal input terminal 242 and the signal output terminal 221 .
  • the electronic device 240 includes a main body of the electronic device, an electronic circuit board 244 sealed in the main body of the electronic device, and a conductive part 241 partially located in the main body of the electronic device.
  • the electronic device body includes a base 250 and a cover 260.
  • a cavity 251 for accommodating the electronic circuit board 244 is formed on the base 250.
  • the cover 260 with base 250 The fit seals the electronic circuit board 244 within the cavity 251 .
  • the electronic circuit board 244 may be a PCB circuit board or a flexible printed circuit board (Flexible Printed Circuit, FPC). In this embodiment of the present application, an FPC flexible circuit board is used as an optional implementation manner.
  • the electronic circuit board 244 is made of FPC flexible circuit boards, which has the advantage of smaller thickness, which helps the entire body surface attachment unit 200 to be lighter and thinner. to enhance the user's wearing experience.
  • the electronic circuit board 244 is integrated with several electronic components, such as a microcontroller unit (Microcontroller Unit, MCU microprocessor), a Bluetooth chip, and the like.
  • the conductive part 241 includes four conductive members 245, the first end 246 of each conductive member 245 penetrates the base 250 and protrudes into the cavity 251 of the base 250, when the electronic circuit board 244 is placed on When in the cavity 251, the first end 246 is electrically connected to the electronic circuit board 244.
  • the through hole 247 fixes the conductive column on the electronic circuit board 244 by welding.
  • the conductive column can be welded in the hole 247 by spot welding. At this time, the first end 246 and the electronic circuit board 244 form a electrical connection. Referring to Fig. 5 and Fig.
  • the second end 248 of each conductive member 245 is left outside the base 250 and attached to the outer surface of the base 250 after being bent, wherein the second end 248 of the two conductive members 245
  • the end portion 248 is used as the signal input terminal 242
  • the second end portions 248 of the other two conductive members 245 are used as the power input terminal 243 .
  • the second end 248 of the conductive member 245 can be a conductive piece, and the side surface of the conductive piece is used as the electrical contact surface after being bent. , without additional processing steps.
  • the second end 248 of the conductive member 245 When the second end 248 of the conductive member 245 is a conductive sheet, the second end 248 of the conductive member 245 includes two sides, one of which is attached to the outer surface of the base 250 when the second end 248 is bent. On the other side as the electrical contact surface.
  • the number of conductive parts 241 can also be several other than four.
  • the electronic device 240 Only two conductive members 245 are required to be electrically connected to the sensor electrodes 210 , and two conductive members 245 for power input are omitted.
  • the manufacturing method of the electronic device 240 may include:
  • Step 1 performing gold-plating treatment on the conductive part 241 including several conductive members 245;
  • Step 2 place the part of the conductive member 245 in the injection mold 400, form the base 250 with the cavity 251 on the conductive member 245 by injection molding, and make the first end of the conductive member 245 246 is located in the cavity 251, and the second end 248 of the conductive member 245 is positioned on the exterior of the base 250;
  • Step 3 placing the electronic circuit board 244 in the cavity 251, and electrically connecting the first end 246 of the conductive member 245 to the electronic circuit board 244;
  • Step 4 referring to FIG. 12 , forming a cover portion 260 in the cavity 251 , so that the cover portion 260 and the base portion 250 together form an electronic device housing for encapsulating the electronic circuit board 244 .
  • the conductive part 241 can be made of gold-plated copper sheet.
  • Gold-plated copper sheet can increase the service life of the copper sheet, improve electrical conductivity and high thermal performance, and prevent oxidation and corrosion.
  • the conductive part 241 in step 1 is provided with a connecting part 249 at the second end 248 of the conductive member 245, for example, the second end 248 of each conductive member 245 is integrally connected with the connecting part 249 .
  • the connecting part 249 it is convenient to use tooling to clamp and transfer the conductive part 241, especially suitable for automatic production lines.
  • a mechanical arm can be used to clamp and transfer the conductive part 241, and a positioning The hole is conducive to the clamping and positioning of the mechanical arm.
  • a base portion 250 with a cavity 251 is formed on the conductive portion 241 by using an embedded molding process, and the bottom surface of the cavity 251 is formed to accommodate electronic components on the electronic circuit board 244.
  • the groove 252 of components by setting the groove 252, when the electronic circuit board 244 is placed in the cavity 251, the electronic components on the lower surface of the electronic circuit board 244 are accommodated in the groove 252, and then the electronic circuit board 244 The lower surface is attached to the bottom surface of the cavity 251 , especially when the electronic circuit board 244 is an FPC flexible circuit board, the FPC flexible circuit board can also be fixed through the cooperation of the electronic components and the groove 252 .
  • the slot 252 may be a large slot capable of simultaneously accommodating each electronic component on the electronic circuit board 244 , or may be a plurality of small slots corresponding to each electronic component on the electronic circuit board 244 .
  • the embedding molding process can be, for example: preheating the conductive part 241, the injection molding raw material, and the injection mold 400 respectively; heating and melting the injection molding raw material to obtain an injection molding sol; mold 400 , and inject molding sol into the injection cavity of the injection mold 400 to obtain the base 250 with the conductive part 241 .
  • the conductive part 241 is preheated at a temperature of 55-65°C for at least 30 minutes; the injection molding raw material is preheated at a temperature of 115-125°C for 2-4 hours to obtain a dried injection molding raw material; the injection mold 400 is preheated to The working temperature is maintained at 90-100°C; the injection molding raw materials are heated and melted at a temperature of 290-300°C to obtain injection molding sol.
  • the injection molding material is selected from polycarbonate (PC) particles, PBT particles or ABS particles.
  • the conductive portion 241 is processed. 7, the conductive part 241 is punched by the first punch 500, the second end 248 of the conductive member 245 is separated from the connecting part 249, and then the second end 248 of the conductive member 245 is The end face is polished to obtain a base 250 with a conductive member 245, as shown in FIG. 8 , at this time, the second The end portion 248 is approximately perpendicular to the outer surface of the base portion 250, and then the second end portion 248 of the conductive member 245 is bent by the second punch 600, so that the second end portion 248 of the conductive member 245 is attached to the outer surface of the base portion 250.
  • the second end 248 of the conductive member 245 can be bent downward, as shown in FIGS.
  • the side of the second end 248 of the member 245 has been gold-plated in step 1, and the gold-plated coating on the side of the second end 248 of the conductive member 245 has not been damaged during the subsequent processing, so there is no need to
  • the side surface of the second end portion 248 of the conductive member 245 is subjected to secondary gold plating; and the end face of the second end portion 248 of the conductive member 245 is not used as a conductive contact surface, so even if the end face of the second end portion 248 of the conductive member 245 There is no need for secondary gold plating if exposed to oxidation. In this way, the process is simplified, the cost caused by secondary gold plating is reduced, and the efficiency is improved.
  • the electronic circuit board 244 is placed in the cavity 251 of the base 250, and the conductive column of the first end 246 of the conductive member 245 passes through the hole 247 on the electronic circuit board 244, and then passes through for example
  • the conductive post is fixed to the electronic circuit board 244 by spot welding, for example, the conductive post is fixed to the edge of the hole 247 .
  • the cover 260 is molded on the base 250 by the glue filling process, and a sealed connection can be formed between the cover 260 and the base 250 through glue molding. , to prevent water vapor from entering the cavity 251 of the base 250 .
  • the potting material can be, for example, epoxy resin potting compound, silicone potting compound and polyurethane potting compound. Taking epoxy resin potting glue as an example, two methods of manual vacuum potting and mechanical vacuum potting can be used.
  • the components are mixed and then degassed, and then put The glue is poured into the cavity 251 of the base 250 to ensure that the glue is leveled, and finally the finished electronic device 240 is obtained by heating or curing at room temperature.
  • the temperature of the epoxy resin potting glue is generally 20-30°C, and the curing is generally carried out at room temperature or in an oven at a temperature of 40-50°C to dry and cure the cover part 260. Therefore, when the electronic circuit board 244 is installed Forming the cover portion 260 on the base portion 250 by filling glue into the cavity 251 of the base portion 250 will not cause damage to the electronic components on the electronic circuit board 244 .
  • the cover 260 can also be formed by injection molding first, and the cover 260 can be fixed to the base 250 by, for example, ultrasonic welding. Apply sealant to the seams.
  • the glue filling process is used to form the cover part 260 .
  • the cover part 260 and the base part 250 formed by the glue filling process are combined more closely and have better sealing performance.
  • the embodiments of the present application provide an electronic device and a manufacturing method thereof, which not only can simplify the process and save costs, but also can prevent electronic components from being damaged due to high temperature.
  • the second end of the conductive member is bent, and the side surface of the bent second end is used as the electrical contact surface for conduction, so as to avoid the end surface of the second end being cut after being punched.
  • the embodiment of the present application does not need to place the electronic circuit board in the injection mold to participate in injection molding, avoiding the damage of the electronic components on the electronic circuit board by high temperature injection molding, ensuring the effectiveness of the electronic equipment and improving the yield rate.

Abstract

本申请提供一种电子设备及其制造方法，方法包括：将包含有至少一个导电构件(245)的导电部(241)安装到电子设备主体上，使得每个导电构件(245)的第一端部(246)伸入所述电子设备主体中并电性连接到电子线路板(244)上，以及使得每个导电构件(245)的第二端部(248)被留置在所述电子设备主体的外部，并且以所述第二端部(248)的至少一个侧面作为电接触面。

Description

电子设备及其制造方法
本申请要求在2022年03月03日提交中国专利局、申请号为202210203336.2的中国专利申请的优先权，以上申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，例如涉及一种电子设备及其制造方法。
背景技术
一些生理性的疾病，病程长且病情迁延不愈，需要实时地对宿主的某些生理参数进行监测，以能更好的跟踪治疗。比如糖尿病，需要对宿主血糖进行实时的监测。准确的血糖自我监测，是实现良好血糖控制的关键，有助于评估糖尿病患者糖代谢紊乱的程度，制定降糖方案，同时反映降糖治疗效果并指导对治疗方案的调整。
市面上使用最多的是指血血糖仪，患者需要自行采集手指末梢血来测量该时刻的血糖水平。
发明内容
本申请实施例提供一种电子设备及其制造方法。
本申请实施例提供一种电子设备，包括电子设备主体和配置在电子设备主体上的导电部，所述电子设备主体内封装有电子线路板，所述导电部包括至少一个导电构件，每个所述导电构件包括第一端部和第二端部，所述第一端部伸入所述电子设备主体中并电性连接到所述电子线路板上，所述第二端部被留置在所述电子设备主体的外部，并且以所述第二端部的至少一个侧面作为电接触面。
本申请实施例还提供一种电子设备的制造方法，包括：将包含有至少一个导电构件的导电部安装到电子设备主体上，使得每个导电构件的第一端部伸入所述电子设备主体中并电性连接到所述电子线路板上，以及使得每个导电构件的第二端部被留置在所述电子设备主体的外部，并且以所述第二端部的至少一个侧面作为电接触面。
附图说明
图1是发射器的结构示意图。
图2是连续血糖监测系统示意图。
图3是体表附接单元与电子设备安装示意图。
图4是本申请实施例的电子设备的制造方法流程图。
图5是本申请实施例的导电部的示意图。
图6是本申请实施例的在导电部上成型基部的示意图。
图7是本申请实施例的对导电部进行冲切的示意图。
图8是本申请实施例的导电部被冲切后的示意图。
图9是本申请实施例的对导电构件进行折弯的示意图。
图10是本申请实施例的导电构件被折弯后的示意图。
图11是本申请实施例的在基部安装电子线路板的示意图。
图12是本申请实施例的在基部成型盖部的示意图。
其中：100、宿主；200、体表附接单元；210、传感器电极；220、外壳；221、信号输出端子；222、电源输出端子；230、电池；240、电子设备；241、导电部；242、信号输入端子；243、电源输入端子；244、电子线路板；245、导电构件；246、第一端部；247、孔；248、第二端部；249、连接部；250、基部；251、腔体；252、槽；260、盖部；270、粘合剂层；300、接收器；400、注塑模具；500、第一冲头；600、第二冲头；700、发射器；710、PIN针。
具体实施方式
市面上使用最多的是指血血糖仪，患者需要自行采集手指末梢血来测量该时刻的血糖水平。但这种方法存在以下缺陷：一、无法获知两次测量之间的血糖水平变化情况，患者可能会遗漏血糖峰值和谷值，从而引起一些并发症，对患者造成不可逆的伤害；二、每日多次的指尖穿刺采血，给糖尿病患者造成了很大的痛楚。为克服上述缺陷，需要提供一种能够进行连续监测患者血糖的方法，方便患者实时了解自己的血糖状况，并据此及时采取应对措施，从而有效地控制病情，防止并发症，以获得较高的生活质量。
针对上述需求，技术人员开发了可以植入皮下组织进行持续监测皮下血糖的监测技术，该技术通过在皮下组织刺入一个传感器电极，传感器电极在患者的组织间液与体内葡萄糖发生氧化反应，反应时会形成电信号，通过发射器将电信号转换为血糖读数，并每隔1～5分钟将血糖读数传输到无线接收器上，在无线接收器上显示相应的血糖数据以及形成图谱，供患者及医生参考。
通常，传感器电极通过传感器底座固定并敷贴到宿主皮肤上，发射器与传 感器底座通过诸如卡扣等方式可拆卸连接，其中，发射器通常包括塑料外壳和封装在塑料外壳中的印制电路板(Printed Circuit Board，PCB板)。在制作发射器时，一般先将PCB板放置在模具的注塑腔体中，采用一次或二次高温注塑成型的工艺在PCB板上形成塑料外壳，高温注塑成型过程中需要向模具的注塑腔体中注入高温注塑溶胶，高温注塑溶胶容易对PCB板上的电子元器件造成损害，影响其性能，导致PCB板无法正常工作，进而导致较高的产品不良率。为解决PCB板上的电子元器件受到高温注塑溶胶的损害，在将PCB板放置在模具的注塑腔体中之前，会在PCB板上涂覆一层隔热层，这在某种程度上导致PCB板处理成本的增加。
此外，请参见图1所示，现有发射器700通过PCB板上的PIN针710的端面与传感器底座上的传感器电极建立电性连接，这就要求发射器700成品的外壳上裸露出PIN针710的端面。常用的方法为，在高温注塑之前预留较长的PIN针710长度使得在高温注塑成型外壳之后有部分PIN针710伸出外壳表面，通过打磨PIN针710使得PIN针710的端面与外壳的表面几乎位于同一平面内，由于PIN针710多由铜制成，打磨后的PIN针710的端面容易被氧化进而影响导电性能，这就需要再给PIN针710的端面镀金。这种方法不但使得发射器700的制造工序更加复杂，而且在打磨PIN针710的过程中容易刮花外壳表面从而破坏外壳表面的平整性和美观性。
针对上述情况，本申请实施例提供一种电子设备及其制造方法。
以下描述和例子说明了所公开的申请的一些示例性实施例。本领域技术人员将认识到，本申请存在由其范围包括的许多变化和修改。因此，某一示例性实施例的描述不应被认为是限制本申请的范围。
连续血糖监测(CGM，Continuous Glucose Monitoring)系统
请参见图2所示，是附接到宿主100上的连续血糖监测系统的示意图。图2和图3中示出了包括带有传感器电极210的体表附接单元200的连续血糖监测系统，其通过粘合剂层270附接到宿主100的皮肤表面。体表附接单元200内置电性连接到传感器电极210的电路模块，用于将传感器电极210监测到的葡萄糖浓度信息发送到接收器300，接收器300通常可以为智能电话、智能手表、专用设备和类似物。在使用过程中，传感器电极210部分位于宿主100皮肤的下方，与皮下组织液接触。
请参见图3所示，是一种用于连续血糖监测系统的体表附接单元200的结构示意图，体表附接单元200包括外壳220、附接到外壳220内的传感器电极 210、电池230和以可拆卸的方式安装到外壳220内的电子设备240，电子设备240内配置有电路模块，电路模块将传感器电极210监测到的葡萄糖浓度信息发送到接收器300。传感器电极210的体外部分伸入到体表附接单元200的外壳220内，并经折弯处理后贴合到外壳220的内壁上，外壳220的内壁上配置有两个信号输出端子221，其中一个信号输出端子221电性连接到传感器电极210的参比电极，另一个信号输出端子221电性连接到传感器电极210的工作电极。电池230被安装到外壳220的底面，例如，外壳220的底面可以设置有用于安装电池230的电池座(图中未示出)，电池230被安装到电池座中，外壳220的内壁上配置有两个电源输出端子222，其中一个电源输出端子222通过导电片电性连接到电池230的正极，另一个电源输出端子222通过导电片电性连接到电池230的负极，其中，电源输出端子222与导电片可以为一体结构。
在一种实施方式中，信号输出端子221和电源输出端子222均可以采用金属导电片，例如，可以采用铜片，例如，可以对铜片进行镀金处理。
电子设备240可以采用例如插拔的方式安装到体表附接单元200的外壳220上，为实现电子设备240在安装到外壳220上时，电子设备240的电路模块与电池230、传感器电极210建立电性连接并形成工作回路，参考图3和图5，电子设备240上配置有导电部241，导电部241包括两个信号输入端子242和两个电源输入端子243，当电子设备240安装到体表附接单元200的外壳220上时，两个信号输入端子242与两个信号输出端子221一一对应并形成电接触，以及，两个电源输入端子243与两个电源输出端子222一一对应并形成电接触。为确保上述电接触的有效性，例如可以将信号输入端子242和/或信号输出端子221设置成弹性金属导电片，使得信号输入端子242与信号输出端子221电接触时处于挤压受力状态，从而确保在电子设备240安装到体表附接单元200的外壳220上时信号输入端子242与信号输出端子221处于稳定的电接触状态。电源输入端子243与电源输出端子222的设置方式也可以采用类似于信号输入端子242与信号输出端子221的设置方式。通过上述对电接触方式的设置，能够确保电子设备240的电路模块与电池230、传感器电极210的电性连接的稳定性，进而确保体表附接单元200持续有效工作。
继续参考图11，电子设备240包括电子设备主体、密封在电子设备主体内的电子线路板244以及部分位于电子设备主体内的导电部241。参考图10-12，电子设备主体包括基部250和盖部260，基部250上形成有用于容纳电子线路板244的腔体251，当电子线路板244被放置在腔体251中时，盖部260与基部250 配合将电子线路板244密封在腔体251中。电子线路板244可以选用PCB电路板也可以选用柔性电路板(Flexible Printed Circuit，FPC)，本申请实施例以FPC柔性电路板作为可选的实施方式。电子线路板244选用FPC柔性电路板所制成的电子设备240相比于选用PCB电路板所制成的电子设备240，具有厚度更小的优势，从而有利于整个体表附接单元200更加轻薄化，提升用户佩戴的体验。以FPC柔性电路板为例，电子线路板244上集成有若干个电子元器件，例如集成有微控制单元(Microcontroller Unit，MCU微处理器)、蓝牙芯片等。参考图5和图6，导电部241包括四个导电构件245，每个导电构件245的第一端部246贯穿基部250并伸入基部250的腔体251中，当电子线路板244被放置在腔体251中时，第一端部246电性连接到电子线路板244上，例如，参考图11，第一端部246可以为导电柱，电子线路板244上形成有孔247，将导电柱贯穿孔247再以焊接的方式将导电柱固定在电子线路板244上，例如，可以采用点焊的方式将导电柱焊接在孔247中，此时，第一端部246与电子线路板244构成电性连接。参考图5和图6，每个导电构件245的第二端部248被留置在基部250的外部，并经折弯后贴合到基部250的外表面上，其中两个导电构件245的第二端部248被作为信号输入端子242，另外两个导电构件245的第二端部248被作为电源输入端子243。例如，导电构件245的第二端部248可以为导电片，导电片被折弯后以侧面作为电接触面，此时，导电片的端面不作为功能构件，因此，对导电片的端面要求低，无需多余的处理工序。
当导电构件245的第二端部248为导电片时，导电构件245的第二端部248包括两个侧面，其中一个侧面在第二端部248被折弯时贴合到基部250的外表面上，另一个侧面作为电接触面。
在其他实施方式中，针对电性连接方式的不同，导电部241还可以为除四个以外的若干个，例如，当电池230被集成在电子设备240的电子线路板244上时，电子设备240仅需两个导电构件245与传感器电极210电性连接即可，省去了两个用于电源输入的导电构件245。
请参见图4所示，在一种实施方式中，上述电子设备240的制造方法可以包括：
步骤一、对包含有若干个导电构件245的导电部241进行镀金处理；
步骤二、参考图7，将导电构件245的部分放置在注塑模具400中，以注塑成型的方式在导电构件245上形成带有腔体251的基部250，并使得导电构件245的第一端部246位于腔体251中，以及使得导电构件245的第二端部248位 于基部250的外部；
步骤三、在腔体251中放置电子线路板244，并将导电构件245的第一端部246电性连接到电子线路板244上；
步骤四、参考图12，在腔体251中形成盖部260，使得盖部260与基部250共同构成封装电子线路板244的电子设备外壳。
在步骤一中，导电部241可以选用经过镀金处理的铜片，通过对铜片进行镀金处理，能够增加铜片的使用寿命，提高电传导性和高热能性，以及防氧化和腐蚀。请参见图5所示，步骤一中的导电部241在导电构件245的第二端部248设置有连接部249，例如，每个导电构件245的第二端部248均与连接部249一体连接。通过设置连接部249，方便使用工装对导电部241进行夹持及转移，尤其适用于自动化产线上，例如，可以使用机械臂对导电部241进行夹持及转移，连接部249上可以设置定位孔，有利于机械臂的夹持定位。
请参见图6所示，在步骤二中，采用埋入成型的工艺，在导电部241上成型出带有腔体251的基部250，腔体251的底面成型有用于容纳电子线路板244上电子元器件的槽252，通过设置槽252，使得电子线路板244被放置在腔体251中时电子线路板244的下表面上的电子元器件被收纳在槽252中，进而使得电子线路板244的下表面与腔体251的底面贴合，尤其当电子线路板244选用FPC柔性电路板时，还可以通过电子元器件与槽252配合对FPC柔性电路板进行固定。其中，槽252可以为能够同时容纳电子线路板244上各电子元器件的大槽，也可以为一一对应电子线路板244上各电子元器件的多个小槽。
在一种实施方式中，埋入成型的工艺例如可以为：分别对导电部241、注塑原料和注塑模具400进行预热处理；加热融化注塑原料得到注塑溶胶；将导电构件245的部分放置在注塑模具400中，并向注塑模具400的注塑腔体中注入注塑溶胶，得到带有导电部241的基部250。其中，导电部241被以55～65℃的温度预热至少30分钟；注塑原料被以115～125℃的温度预热2～4小时，得到烘干的注塑原料；注塑模具400被预热至保持在90～100℃的工作温度；注塑原料被以290～300℃的温度加热融化得到注塑溶胶。其中，注塑原料选用聚碳酸酯(Polycarbonate，PC)颗粒或PBT颗粒或ABS颗粒。
在基部250成型完成之后，对导电部241进行加工。请参见图7所示，通过第一冲头500对导电部241进行冲切处理，将导电构件245的第二端部248与连接部249分离，然后对导电构件245的第二端部248的端面进行打磨，得到带有导电构件245的基部250，请参见图8所示，此时，导电构件245的第二 端部248大致垂直于基部250的外表面，再通过第二冲头600对导电构件245的第二端部248进行折弯，使得导电构件245的第二端部248贴合到基部250的外表面上，例如可以向下折弯导电构件245的第二端部248，请参见图9和10所示，此时，导电构件245的第二端部248的侧面被作为导电接触面，由于导电构件245的第二端部248的侧面已在步骤一中进行了镀金处理，并且在后续处理过程中并未破坏导电构件245的第二端部248的侧面上的镀金涂层，因此不需要对导电构件245的第二端部248的侧面进行二次镀金处理；而导电构件245的第二端部248的端面不被作为导电接触面，因此，即使导电构件245的第二端部248的端面裸露在外被氧化也无需进行二次镀金处理。通过这种方式，简化了工序，减少了因二次镀金而产生的成本，提高了效率。
请参见图11所示，将电子线路板244放置在基部250的腔体251中，并使得导电构件245的第一端部246的导电柱穿过电子线路板244上的孔247，再通过例如点焊的方式将导电柱固定到电子线路板244上，例如，将导电柱固定到孔247的边缘。
请参见图12所示，在安装好电子线路板244之后，采用灌胶工艺在基部250上成型出盖部260，通过灌胶成型的方式，能够使得盖部260与基部250之间形成密封连接，防止水汽进入基部250的腔体251中。灌胶材料例如可以选用环氧树脂灌封胶、有机硅灌封胶和聚氨酯灌封胶。以环氧树脂灌封胶为例，可以采用手工真空灌封和机械真空灌封两种方式，以机械真空灌封为例，将各组分混合后进行脱泡处理，然后在操作时间内将胶料灌注到基部250的腔体251中确保胶料流平，最后通过加温或室温固化，即得到电子设备240成品。采用环氧树脂灌封胶的温度一般在20～30℃，固化一般采用室温或采用烘箱在40～50℃的温度环境中对盖部260进行烘干固化，因此，在将电子线路板244安装到基部250的腔体251中再采用灌胶工艺在基部250上形成盖部260不会对电子线路板244上的电子元器件造成损害。
在其他实施方式中，还可以先采用注塑成型的工艺成型出盖部260，盖部260可以采用例如超声波焊接的方式固定到基部250上，为确保密封性，还可以在盖部260和基部250的接缝处点涂密封胶。
本申请实施例采用灌胶工艺成型盖部260，相比于超声波焊接，灌胶工艺成型的盖部260与基部250的结合更紧密，密封性更好。
本申请实施例提供一种电子设备及其制造方法，不但能够简化工序、节省成本，而且能够避免电子元器件因受高温而损坏。
由于上述实施例的运用，本申请实施例与相关技术相比具有下列特点：
1、本申请实施例对导电构件的第二端部进行折弯处理，以折弯后的第二端部的侧面作为电接触面进行导电，规避了第二端部的端面在冲切后被氧化而对导电性能造成的影响，无需对导电构件进行二次镀金，简化了制造工序，降低了制造成本；
2、本申请实施例无需将电子线路板放置在注塑模具中参与注塑，避免了电子线路板上的电子元器件受到高温注塑的损害，保证了电子设备的有效性，提高了良品率。
此外，尽管为了简明和理解的目的已经借助于图示和例子详细描述了前述内容，但是对于本领域技术人员而言明显的是，可以实施某些变化和改变。因此，描述和例子不应当看作是将本申请的范围限制为本文所述的特定的实施例和例子，而是还涵盖符合本申请的真实范围和精神的所有修改和替代形式。

Claims (22)

  1. 一种电子设备，包括电子设备主体和配置在电子设备主体上的导电部(241)，所述电子设备主体内封装有电子线路板(244)，所述导电部(241)包括至少一个导电构件(245)，每个所述导电构件(245)包括第一端部(246)和第二端部(248)，所述第一端部(246)伸入所述电子设备主体中并电性连接到所述电子线路板(244)上，所述第二端部(248)被留置在所述电子设备主体的外部，并且以所述第二端部(248)的至少一个侧面作为电接触面。
  2. 根据权利要求1所述的电子设备，其中，所述电子设备主体包括基部(250)和盖部(260)，所述基部(250)与盖部(260)配合封装所述电子线路板(244)。
  3. 根据权利要求2所述的电子设备，其中，所述基部(250)上形成有腔体(251)，所述电子线路板(244)被配置在所述腔体(251)中，并且所述电子线路板(244)与伸入所述腔体(251)中的第一端部(246)电性连接。
  4. 根据权利要求3所述的电子设备，其中，所述基部(250)被配置为以注塑成型的方式附接到所述至少一个导电构件(245)上。
  5. 根据权利要求3所述的电子设备，其中，所述腔体(251)的底面形成有至少一个槽(252)，所述至少一个槽(252)被配置为容纳所述电子线路板(244)上的电子元器件。
  6. 根据权利要求3所述的电子设备，其中，所述基部(250)的腔体(251)中以灌胶成型的方式形成有盖部(260)。
  7. 根据权利要求1所述的电子设备，其中，所述电子线路板(244)为印制电路板PCB电路板或柔性电路板FPC。
  8. 根据权利要求1所述的电子设备，其中，每个导电构件(245)的第一端部(246)被配置为以焊接的方式电性连接到所述电子线路板(244)上。
  9. 根据权利要求1所述的电子设备，其中，所述电子线路板(244)上形成有大于或等于导电构件数量的孔(247)，所述至少一个导电构件(245)的第一端部(246)贯穿所述孔(247)。
  10. 根据权利要求1所述的电子设备，其中，所述至少一个导电构件(245)上包覆有镀金涂层。
  11. 根据权利要求10所述的电子设备，其中，所述镀金涂层未覆盖所述至少一个导电构件(245)的第二端部(248)的端面。
  12. 根据权利要求1所述的电子设备，其中，每个导电构件(245)的第二端部(248)被配置为以折弯的方式贴合到所述电子设备主体的外表面上。
  13. 根据权利要求1所述的电子设备，其中，所述电子设备被配置为用于连续血糖监测系统。
  14. 一种电子设备的制造方法，用于制造权利要求1至13中任一项所述的电子设备，包括：将包含有至少一个导电构件(245)的导电部(241)安装到电子设备主体上，使得每个导电构件(245)的第一端部(246)伸入所述电子设备主体中并电性连接到所述电子线路板(244)上，以及使得每个导电构件(245)的第二端部(248)被留置在所述电子设备主体的外部，并且以所述第二端部(248)的至少一个侧面作为电接触面。
  15. 根据权利要求14所述的电子设备的制造方法，在将所述导电部(241)安装到所述电子设备主体上之前，还包括：对所述导电部(241)进行镀金处理，在所述导电部(241)的表面形成镀金涂层。
  16. 根据权利要求14所述的电子设备的制造方法，还包括：将每个导电构件(245)的部分放置在注塑模具(400)中，以注塑成型的方式在所述至少一个导电构件(245)上形成所述电子设备主体的基部(250)，并使得每个导电构件(245)的第一端部(246)位于所述基部(250)的腔体(251)中，以及使得每个导电构件(245)的第二端部(248)位于所述基部(250)的外部。
  17. 根据权利要求16所述的电子设备的制造方法，还包括：在所述基部(250)的腔体(251)中放置电子线路板(244)，并将每个导电构件(245)的第一端部(246)电性连接到电子线路板(244)上。
  18. 根据权利要求17所述的电子设备的制造方法，还包括：在所述基部(250)的腔体(251)中形成电子设备主体的盖部(260)，使得所述盖部(260)与所述基部(250)共同构成封装所述电子线路板(244)的电子设备主体的外壳。
  19. 根据权利要求18所述的电子设备的制造方法，还包括：将所述基部(250)放置在灌胶模具中，以灌胶成型的方式在所述基部(250)的腔体(251)中形成盖部(260)。
  20. 根据权利要求14所述的电子设备的制造方法，其中，所述导电部(241)还包括连接部(249)，所述连接部(249)分别与每个导电构件(245)的第二端部(248)一体连接。
  21. 根据权利要求20所述的电子设备的制造方法，在将所述导电部(241)安装到电子设备主体上之后，还包括：以冲切的方式将所述连接部(249)与每个导电构件(245)的第二端部(248)分离。
  22. 根据权利要求21所述的电子设备的制造方法，在将所述连接部(249)与每个导电构件(245)分离之后，还包括：折弯每个导电构件(245)的第二端部(248)至贴合到所述电子设备主体的外表面上。
PCT/CN2023/079192 2022-03-03 2023-03-02 电子设备及其制造方法 WO2023165547A1 (zh)

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