WO2023160132A1

WO2023160132A1 - Display panel and preparation method therefor

Info

Publication number: WO2023160132A1
Application number: PCT/CN2022/138450
Authority: WO
Inventors: 李健林; 陈壮; 张昌健
Original assignee: 惠州视维新技术有限公司
Priority date: 2022-02-28
Filing date: 2022-12-12
Publication date: 2023-08-31
Also published as: CN114784172A

Abstract

Provided in the present application are a display panel and a preparation method therefor. The display panel is prepared by means of a process of arranging a plurality of micro-sized light-emitting chips on a light source plate, dispensing glue on the light-emitting chips, then semi-curing colloids, then mold-pressing the colloids by using a compression molding plate to form target colloids, and finally curing the target colloids to form micro lenses. The modified colloids in a semi-cured state have relatively high plasticity; therefore, a plurality of target colloids having the same surface shape can be formed on the light source plate by means of compression molding in one step by using the compression molding plate.

Description

Display panel and manufacturing method thereof

technical field

The present application relates to the technical field of display devices, in particular to a display panel and a manufacturing method thereof.

Background technique

In the field of Mini-LED or Micro-LED display panel preparation, especially in the field of direct display panels, light-emitting chips can be arranged on the PCB, and then glue is dispensed on the light-emitting chips to form a surface micro-lens structure.

In the prior art, processes such as blowing are often used to shape the colloid, and finally solidified to form a solid microlens.

However, the diameter of the lamp bead of the Mini-LED or Micro-LED display panel is small, and the display panel made by this process is likely to have large differences in the surface structure of each micro-lens, which in turn leads to uneven luminescence of the display panel and poor display effect. The problem.

technical problem

Embodiments of the present application provide a display panel and a manufacturing method thereof, so as to solve the problem of poor display effect of the display panel.

technical solution

In one aspect, the present application provides a method for preparing a display panel comprising:

A light source board and a compression molded board are provided. A plurality of light-emitting chips are arranged in an array on the substrate of the light source board. At least one side surface of the compression molded board is provided with a plurality of die grooves. The light-emitting chips are set in one-to-one correspondence;

dispensing glue on each of the light-emitting chips, and forming an initial glue;

Pre-crosslinking the initial colloid to form a modified colloid;

placing the compression-molded plate on the light source plate and molding it, so that the modified colloid forms a target colloid;

The target colloid is cured to form microlenses.

In the preparation method, the pre-crosslinking treatment of the initial colloid to form the modified colloid includes:

Pre-crosslinking the initial colloid for the first time to form the first colloid;

Pre-crosslinking the first colloid for the second time to form a modified colloid.

In the preparation method, the first pre-crosslinking temperature is lower than the second pre-crosslinking temperature.

In the preparation method, the duration of the first pre-crosslinking is lower than the duration of the second pre-crosslinking.

In the preparation method, the pre-crosslinking degree of the first colloid is not greater than the pre-crosslinking degree of the modified colloid, and the pre-crosslinking degree of the first colloid is different from the pre-crosslinking degree of the modified colloid. The difference between joint degrees is A, and A satisfies: 10%≤A≤50%.

In the preparation method, the initial colloid is pre-crosslinked for the first time, and after forming the first colloid, it includes:

The compression molded board is placed on the light source board and pre-molded.

In the preparation method, a plurality of molding grooves are respectively provided on both sides of the compression-molded plate.

In the preparation method, in the step of placing the compression-molded plate on the light source plate and pre-molding, the distance between the compression-molded plate and the substrate is not less than zero.

In the preparation method, the curing of the target colloid to form a lens includes:

The light source plate is irradiated with a UV lamp.

A heating furnace is used to bake the light source plate.

A heating furnace is used to bake the light source plate, and the baking temperature of the heating furnace is 100°C to 150°C.

In the preparation method, the refractive index of the initial colloid is B, and B satisfies: 1.2≤B≤1.8.

In the preparation method, the microlens includes at least one of a refractive lens or a reflective lens.

In the preparation method, before placing the compression-molded board on the light source board and molding it includes:

A release agent is sprayed in each of the die grooves.

On the other hand, the present application also provides a display panel, the preparation method adopted by the display panel includes:

Pre-crosslinking the initial colloid to form a modified colloid;

The target colloid is cured to form microlenses.

In the display panel, the pre-crosslinking treatment of the initial colloid to form the modified colloid includes:

In the display panel, the degree of pre-crosslinking of the first colloid is not greater than the degree of pre-crosslinking of the modified colloid, and the degree of pre-crosslinking of the first colloid is different from the degree of pre-crosslinking of the modified colloid. The difference between joint degrees is A, and A satisfies: 10%≤A≤50%.

In the display panel, the initial colloid is pre-crosslinked for the first time, and after forming the first colloid, it includes:

In the display panel, the curing of the target colloid to form a lens includes:

irradiating the light source panel with an ultraviolet lamp; and/or

A heating furnace is used to bake the light source plate.

In the display panel, the refractive index of the initial colloid is B, and B satisfies: 1.2≤B≤1.8.

Beneficial effect

The beneficial effects of the present application are as follows: by arranging a plurality of small-sized light-emitting chips on the light source board, and dispensing glue on the light-emitting chips, then semi-curing the glue, and then using a compression-plastic plate to mold the glue to form the target glue, and finally curing the goal glue The process of forming microlenses produces a display panel. The modified colloid in the semi-cured state not only has a stable surface structure, but also has high plasticity; furthermore, multiple target colloids with the same surface shape can be molded on the light source board at one time through the compression plastic plate, that is, they can be simultaneously on the light source board. The preparation of a plurality of microlenses adapted to micro-sized light-emitting chips improves the manufacturing efficiency of the display panel, ensures the surface consistency of the plurality of microlenses, and improves the display effect of the display panel.

Description of drawings

The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application below in conjunction with the accompanying drawings.

FIG. 1 is a flow chart of a method for preparing a display panel provided by an embodiment of the present application;

Fig. 2 is the structural representation of the compression molded plate provided by the embodiment of the present application;

Fig. 3 is the cross-sectional view of the compression-molded plate taken by line E-E in Fig. 2;

Fig. 4 is a side view of the light source board provided by the embodiment of the present application after dispensing glue;

FIG. 5 is a side view of a display panel provided by an embodiment of the present application.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In this application, unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and arrangements of specific examples are described below. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

Please refer to FIG. 1 to FIG. 5 , the embodiment of the present application provides a method for manufacturing a display panel 300, including:

A light source board 100 and a compression molded board 200 are provided. A plurality of light-emitting chips 120 are arrayed on the substrate 110 of the light source board 100. A plurality of die grooves 210 are provided on at least one side of the compression molded board 200. A plurality of die grooves 210 It is arranged in one-to-one correspondence with a plurality of light-emitting chips 120 .

It should be noted that a circuit (not shown in the figure) is also arranged on the substrate 110 for supplying power to the light emitting chip 120 and controlling the light emitting chip 120 to emit light. When the compression molding board 200 is placed on the light source board 100 , the molding grooves 210 on one side surface of the compression molding board 200 correspond to the light emitting chips 120 one by one. The shape of the inner cavity of the die groove 210 is the same as the surface shape of the prepared microlens 140 .

It should also be noted that the preparation method provided in the embodiment of the present application is especially suitable for preparing the display panel 300 of miniature-sized lamp beads such as Mini-LED and Micro-LED.

By using the compression molded plate 200 to prepare the display panel 300 , the surface shape of each lens can be precisely controlled, and the luminous effect and manufacturing efficiency of the display panel 300 can be improved.

Specifically, the substrate 110 may be a PCB board, that is, a printed circuit board, and the microcircuit structure on its surface can better adapt to the smaller-sized light-emitting chip 120 .

Furthermore, in some other embodiments, the substrate 110 can also be made of materials such as PET, or PC, or PI; that is, the flexible and rollable substrate 110 can enrich the application scenarios of the display panel 300 . Do not make too many limitations here.

Optionally, the compression-molded plate 200 is a plate-shaped component, and a plurality of compression-molding grooves 210 are respectively provided on both sides thereof. Wherein, the shapes of the die grooves 210 on both sides may be different. In this way, one compression molded plate 200 can be adapted to the preparation of microlenses 140 of different shapes.

Specifically, the shape of the die groove 210 may be hemispherical, and the light output line thereof is a straight line, which can reduce light scattering in other directions and improve brightness.

It can also be understood that, due to the arrangement of adjacent light-emitting chips 120 , some areas may be brighter and some areas may be darker alternately on the display panel 300 , affecting the display effect.

Therefore preferably, the shape of the molding groove 210 on any side of the compression molding plate 200 can be set as a wine glass shape, that is, the microlens 140 with an M-shaped cross-sectional shape is prepared, and the light emitted by the light-emitting chip 120 passes through the microlens 140 and has a concave area. After the curved surface, the light emitting route of the light emitting chip 120 is a broken line. The light emitted by the light-emitting chip 120 can be better scattered to its surrounding area, so that the brightness of the light in each area of the display panel 300 remains consistent or similar.

In some embodiments, after the above steps are completed, glue is dispensed on each light-emitting chip 120 to form the initial glue 130 .

It should be noted that, in order to prevent the surface material of the light-emitting chip 120 from being damaged by foreign objects and better light output, in the prior art, it is usually necessary to dispense glue on the light-emitting chip 120 and form the microlens 140 .

It should also be noted that, in order to facilitate the discharge of the colloid material, the initial colloid 130 is mostly a liquid fluid. And the shape of the initial colloid 130 is generally hemispherical.

In some embodiments, the refractive index of the initial colloid 130 is B, and B satisfies: 1.2≦B≦1.8.

The microlens 140 made of the refractive index colloid material has a better light emitting effect.

Furthermore, in some other embodiments, B may also satisfy: 1.0≦B<1.2, or 1.8<B≦2.0, etc., which will not be limited too much here.

In some embodiments, after the above steps are completed, the initial colloid 130 is pre-crosslinked to form a modified colloid.

It can be understood that the initial colloid 130 is in a liquid state, which itself has a certain viscous resistance and poor fluidity. However, under the action of its own gravity and other factors, the initial colloid 130 is still easy to flow around, making the surface shape of the initial colloid 130 uncontrollable, which easily leads to a large difference in the surface shape of each microlens 140 .

By pre-crosslinking the initial colloid 130, the initial colloid 130 can be semi-cured, so that the self-structural strength of the modified colloid is higher than that of the initial colloid 130, greatly reducing the fluidity of the modified colloid, and maintaining the hemispherical shape of the initial colloid 130 shape longer. It is convenient for subsequent further processing of the surface shape of the modified colloid, and it is beneficial for the surface shape of each microlens 140 to be similar after the display panel 300 is prepared, thereby improving the light emitting uniformity of the display panel 300 .

Specifically, the initial colloid 130 may be pre-crosslinked by using a furnace baking process.

In addition, the baking temperature in the pre-crosslinking treatment can be selected according to the characteristics of the material, and the above is a common technique in the art, and will not be elaborated here.

In some embodiments, the above steps further include: pre-crosslinking the initial colloid 130 for the first time to form the first colloid. The second pre-crosslinking is performed on the first colloid, and a modified colloid is formed.

It should be noted that during the heating and baking process of the colloid, if the continuous heating time is too long, the heating rate is too fast or the temperature is too high, etc., it is easy to cause uneven curing of the colloid in each part of the initial colloid 130 or a local temperature is too high, and then in the colloid. The formation of voids in the body or the formation of cracks on the surface of the microlens 140 affects the display effect of the display panel 300 .

Therefore, by using the initial colloid 130 for two pre-crosslinking treatments, that is, the first pre-crosslinking cures the initial colloid 130 to a first colloid with a lower degree of crosslinking, that is, the initial colloid 130 in a pre-cured state, and then the second The secondary pre-crosslinking cures the first colloid into a semi-cured modified colloid. The process of curing the initial colloid 130 into the modified colloid can be prolonged, thereby avoiding the formation of voids in the colloid or the formation of cracks on the surface of the modified colloid, and improving the display effect of the display panel 300 .

In addition, since the initial colloid 130 is in a liquid state, the deformation of the initial colloid 130 may be relatively high, and the flow area to the surrounding area may be too large, resulting in the modified colloid becoming a semi-ellipsoid; and the bottom area of the modified colloid is larger than that of the die groove 210 When molding the modified colloid in a semi-cured state in the subsequent process, some colloids may not completely enter the mold groove 210, which may lead to insufficient colloid in the mold groove 210, so that the pressure cannot be formed. The cavity 210 shapes the target colloid.

By pre-crosslinking the initial colloid 130 for the first time, the initial colloid 130 can be pre-cured to slow down its fluidity and avoid a large change in the surface shape of the initial colloid 130 . And it is beneficial for technicians to select a suitable temperature to carry out the second pre-crosslinking of the first colloid according to actual needs. It can effectively improve the molding effect of the target colloid.

Optionally, the temperature of the first pre-crosslinking is lower than the temperature of the second pre-crosslinking, and/or the duration of the first pre-crosslinking is lower than the duration of the second pre-crosslinking.

In some embodiments, the degree of pre-crosslinking of the first colloid is not greater than the degree of pre-crosslinking of the modified colloid, and the difference between the degree of pre-crosslinking of the first colloid and the degree of pre-crosslinking of the modified colloid is A, Among them, A satisfies: 10%≤A≤50%.

It can be understood that the higher the degree of pre-crosslinking of the colloid, the greater its internal viscous resistance and the worse its fluidity.

That is, the present application sets the difference between the pre-crosslinking degree of the first colloid and the pre-crosslinking degree of the modified colloid as A. It can ensure that the initial colloid 130 is cured gradually in the process of sequentially forming the first colloid and the modified colloid, which can effectively reduce the formation of voids in the colloid. And it is beneficial to the rapid prototyping of the first colloid pre-molding with a lower degree of pre-crosslinking.

Exemplarily, the pre-crosslinking degree of the first colloid may range from 10% to 45%, and the pre-crosslinking degree of the modified colloid may range from 20% to 95%.

In some embodiments, performing the first pre-crosslinking on the initial colloid 130 and forming the first colloid include: placing the compression molded plate 200 on the light source plate 100 and pre-molding.

It can be known from the above description that the curing degree of the first colloid is lower than that of the modified colloid, but higher than that of the initial colloid 130 in liquid state. By molding the first colloid first, that is, pre-molding the first colloid, the first colloid can be quickly molded into the shape of the mold groove 210 . Moreover, the deformation of the first colloid in the shape of the molding groove 210 is small after the second pre-crosslinking, which can improve the surface quality of the modified colloid in the subsequent molding step, and improve the manufacturing efficiency and display effect of the display panel 300 .

Alternatively, a compression-molded plate 200 with a plurality of compression-molding grooves 210 on both sides may be used.

Exemplarily, the compression-molded board 200 is provided with a plurality of wine glass-shaped molding grooves 210 on one side of the compression-molded board 200 , and the compression-molded board 200 is provided with a plurality of hemispherical molding grooves 210 on the other side.

That is, the surface of the compression-plastic plate 200 provided with the hemispherical molding groove 210 can be snapped onto the light source plate 100, and the shape of the first colloid is pre-molded into a hemispherical shape; Pre-cross-linked and semi-cured; finally, the compression-molded board 200 is turned over so that its surface provided with a wine glass-shaped molding groove 210 is fastened to the light source plate 100, and finally the modified colloid is molded into the shape of the molding groove 210 target colloid.

In this way, it is possible to make full use of the compression-molded plate 200 with a plurality of molded grooves 210 of different shapes on both sides, and to prepare the display panel 300 by alternately performing two pre-crosslinking and two shaping processes. Effectively reducing the formation of voids in the colloid and avoiding cracks on the surface of the colloid, improving the yield rate of the display panel 300 .

In some other embodiments, when the compression molded plate 200 is used for molding, the distance between the compression molded plate 200 and the substrate 110 is not less than zero.

It can be understood that the internal shape of the die groove 210 can be approximately regarded as a combination of a cylinder segment and an M-shaped curved surface segment. Therefore, in the process of pre-molding the first colloid, the distance between the compression molded plate 200 and the substrate 110 is not less than zero, that is, the molded plate is not completely pressed on the light source plate 100, that is, only the cylinder of the molded groove 210 The segment shapes the first colloid.

In this way, the first colloid can be shaped into a cylinder-like body, which is convenient for its second molding; it can also reduce the deformation of the first colloid, and the molding rate of the colloid can be improved through two gradual shaping processes , improving the yield of the display panel 300 .

In some embodiments, after the above steps are completed, the compression molded plate 200 is placed on the light source plate 100 and molded, so that the modified colloid forms the target colloid;

By using the compression plastic plate 200 to mold the modified colloid in a semi-cured state and form the target colloid, the molding speed of the target colloid can be increased to improve the production efficiency of the display panel 300; and the surface shape of each target colloid has a good consistency , and furthermore, the uniformity of light emission of the display panel 300 can be improved.

In some embodiments, after performing the above steps, it includes: spraying a separating agent in each die groove 210 .

That is, before each molding process, the separating agent is sprayed in the mold groove 210; after the molding is completed, the separation effect between the compression-plastic plate 200 and the target colloid can be improved, and the surface smoothness of the target colloid can be improved.

The microlens 140 formed by curing the target colloid has a stable structure and a smooth surface, which can provide a stable light-emitting route for the light-emitting chip 120 and improve its display effect.

In some embodiments, the step of curing the target colloid to form the microlens 140 includes: irradiating the light source plate 100 with an ultraviolet lamp; and/or baking the light source plate 100 with a heating furnace.

It should be noted that the curing speed of the microlens 140 irradiated by the ultraviolet lamp is fast and the transparency is high; the baking speed of the heating furnace is relatively slow, but the adhesion of the microlens 140 after curing is better, and heat curing is suitable for most types of colloids. Its applicability is better. Technicians can choose a suitable process to cure the target colloid according to their needs.

In some embodiments, when using a heating furnace to bake the light source plate 100, the baking temperature is 100°C to 150°C.

By thermally curing the target colloid within this temperature range, the molding effect of the microlens 140 can be improved.

In some embodiments, the microlens 140 includes at least one of a refractive lens or a reflective lens.

By arranging a refracting lens or a reflective lens, the light output range of the microlens 140 can be increased, thereby reducing the number of light emitting chips 120; on the basis of ensuring the light output effect of the display panel 300, the manufacturing cost of the display panel 300 can be reduced.

To sum up, by arranging a plurality of small-sized light-emitting chips 120 on the light source board 100, dispensing glue on the light-emitting chips 120, then semi-curing the glue, and then using the compression-molded board 200 to mold the glue to form the target glue, and finally curing The process of forming the microlens 140 from the target colloid prepares the display panel 300 . The modified colloid in a semi-cured state not only has a stable surface structure, but also has high plasticity; furthermore, multiple target colloids with the same surface shape can be molded on the light source plate 100 at one time through the compression plastic plate 200, that is, it can be simultaneously on the light source plate. A plurality of microlenses 140 adapted to micro-sized light-emitting chips 120 are prepared simultaneously on the 100, which improves the manufacturing efficiency of the display panel 300, ensures the surface consistency of the plurality of microlenses 140, and improves the display effect of the display panel 300.

The embodiment of the present application also provides a display panel 300 prepared by the above-mentioned manufacturing method. The surface array of the display panel 300 is provided with a plurality of microlenses 140 . Since the display panel 300 is prepared by the above-mentioned manufacturing method, it has all the same beneficial effects, and the present invention will not repeat them here.

The embodiment of the present application does not specifically limit the application of the display panel 300, which may be a TV, a notebook computer, a tablet computer, a wearable display device (such as a smart bracelet, a smart watch, etc.), a mobile phone, a virtual reality device, Augmented reality equipment, vehicle displays, advertising light boxes and any other products or components with display functions.

In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.

The above is a detailed introduction to a display panel and its preparation method provided by the embodiment of the present application. In this paper, specific examples are used to illustrate the principle and implementation of the present application. The description of the above embodiment is only used to help understand the present application. The technical solution of the application and its core idea; those skilled in the art should understand that it can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements, The essence of the corresponding technical solutions does not depart from the scope of the technical solutions of the embodiments of the present application.

Claims

A method for preparing a display panel, comprising:

A light source board and a compression molded board are provided. A plurality of light-emitting chips are arranged in an array on the substrate of the light source board. At least one side surface of the compression molded board is provided with a plurality of die grooves. The light-emitting chips are set in one-to-one correspondence;

dispensing glue on each of the light-emitting chips, and forming an initial glue;

Pre-crosslinking the initial colloid to form a modified colloid;

placing the compression-molded plate on the light source plate and molding it, so that the modified colloid forms a target colloid;

The target colloid is cured to form microlenses.
The preparation method according to claim 1, wherein said initial colloid pre-crosslinking treatment to form a modified colloid includes:

Pre-crosslinking the initial colloid for the first time to form the first colloid;

Pre-crosslinking the first colloid for the second time to form a modified colloid.
The preparation method according to claim 2, wherein the temperature of the first pre-crosslinking is lower than the temperature of the second pre-crosslinking.
The preparation method according to claim 2, wherein the duration of the first pre-crosslinking is lower than the duration of the second pre-crosslinking.
The preparation method according to claim 2, wherein, the degree of pre-crosslinking of the first colloid is not greater than the degree of pre-crosslinking of the modified colloid, and the degree of pre-crosslinking of the first colloid is different from that of the modified colloid. The difference between the pre-crosslinking degrees of the colloids is A, where A satisfies: 10%≤A≤50%.
The preparation method according to claim 2, wherein said initial colloid is pre-crosslinked for the first time, and after forming the first colloid, it comprises:

The compression molded board is placed on the light source board and pre-molded.
The preparation method according to claim 6, wherein a plurality of molding grooves are respectively provided on the two side surfaces of the compression molding board.
The preparation method according to claim 6, wherein, in the step of placing the compression-molded plate on the light source plate and pre-molding, the distance between the compression-molded plate and the substrate is not less than zero .
The preparation method according to claim 1, wherein said curing said target colloid to form a lens comprises:

The light source plate is irradiated with a UV lamp.
The preparation method according to claim 1, wherein said curing said target colloid to form a lens comprises:

A heating furnace is used to bake the light source plate.
The preparation method according to claim 1, wherein said curing said target colloid to form a lens comprises:

A heating furnace is used to bake the light source plate, and the baking temperature of the heating furnace is 100°C to 150°C.
The preparation method according to claim 1, wherein the refractive index of the initial colloid is B, and B satisfies: 1.2≤B≤1.8.
The manufacturing method according to claim 1, wherein the microlens comprises at least one of a refractive lens or a reflective lens.
The preparation method according to claim 1, wherein, before placing the compression-molded plate on the light source plate and molding it comprises:

A release agent is sprayed in each of the die grooves.
A display panel, wherein, the preparation method adopted by the display panel includes:

A light source board and a compression molded board are provided. A plurality of light-emitting chips are arrayed on the substrate of the light source board. A plurality of molded grooves are provided on at least one side of the pressure molded board. The light-emitting chips are set in one-to-one correspondence;

dispensing glue on each of the light-emitting chips, and forming an initial glue;

Pre-crosslinking the initial colloid to form a modified colloid;

placing the compression-molded plate on the light source plate and molding it, so that the modified colloid forms a target colloid;

The target colloid is cured to form microlenses.
The display panel according to claim 15, wherein the pre-crosslinking treatment of the initial colloid to form a modified colloid includes:

Pre-crosslinking the initial colloid for the first time to form the first colloid;

Pre-crosslinking the first colloid for the second time to form a modified colloid.
The display panel according to claim 16, wherein the degree of pre-crosslinking of the first colloid is not greater than the degree of pre-crosslinking of the modified colloid, and the degree of pre-crosslinking of the first colloid is the same as that of the modified colloid. The difference between the pre-crosslinking degrees of the colloids is A, where A satisfies: 10%≤A≤50%.
The display panel according to claim 16, wherein, after performing the first pre-crosslinking on the initial colloid and forming the first colloid, it comprises:

The compression molded board is placed on the light source board and pre-molded.
The display panel according to claim 15, wherein said curing said target colloid to form a lens comprises:

irradiating the light source panel with an ultraviolet lamp; and/or

A heating furnace is used to bake the light source plate.
The display panel according to claim 15, wherein the refractive index of the initial colloid is B, and B satisfies: 1.2≤B≤1.8.