CN201868423U - Multiple-chip LED (Light-Emitting Diode) - Google Patents
Multiple-chip LED (Light-Emitting Diode) Download PDFInfo
- Publication number
- CN201868423U CN201868423U CN2010202023166U CN201020202316U CN201868423U CN 201868423 U CN201868423 U CN 201868423U CN 2010202023166 U CN2010202023166 U CN 2010202023166U CN 201020202316 U CN201020202316 U CN 201020202316U CN 201868423 U CN201868423 U CN 201868423U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model discloses a multiple-chip LED (Light-Emitting Diode). The multiple-chip LED comprises a plurality of LED chips and a base plate which is provided with a cavity, wherein the LED chips are arranged at the bottom of the cavity; the two adjacent chips are spaced with a certain distance; an adhesive layer is filled in the cavity; and the upper surface of the adhesive layer comprises a plurality of convex spherical surfaces which are respectively corresponding to the position of each chip. As the LED chips are adopted, and the light emitted by each LED chip can be irradiated out from the ball-shaped light outlet surface in a divergent way as much as possible, the light emitting uniformity of the LED is obviously improved.
Description
Technical field
The utility model relates to a kind of LED, relates in particular to a kind of multi-chip LED.
Background technology
LED has advantages such as response speed is fast, contrast is high, solid-state environmental protection, image quality is good, thickness is little, is progressively replacing traditional luminescent device, obtains application more and more widely in fields such as illumination, demonstrations.
Along with the LED technology rapid development, led light source is used in fields such as illumination, demonstration, when especially being applied to large scale backlight such as LCD TV, require LED to possess the certain brightness and the luminous uniformity, thereby guarantee the display quality of image.As shown in Figure 1 to Figure 3, existing most of LED comprises the substrate 1 that has cavity 11, metal heavy cup 4 is arranged on cavity 11 bottoms, a led chip 3 is fixed on the center of heavy cup 4 bottom surfaces, its two ends connect the metal pins 2 that is located at supporting body 1 two ends, exiting surface 5 as a whole planes by gold thread 6.Yet as shown in Figure 4, center brightness was higher when this encapsulating structure caused LED luminous easily, and surrounding brightness is lower; Along with the increase of LED size, luminance difference can be more obvious.When this LED is applied in large-sized liquid crystal display or some lighting apparatus, can cause the brightness of LCDs and color inhomogeneous, influence image quality and visual effect, perhaps influence illuminating effect owing to non-uniform light.
The utility model content
The main technical problems to be solved in the utility model is that a kind of multi-chip LED that improves the luminous uniformity is provided.
For solving the problems of the technologies described above, the utility model provides a kind of multi-chip LED, comprises the substrate and a plurality of led chip that have cavity, and described a plurality of led chips are arranged on described cavity bottom, keep at a certain distance away between the two adjacent LEDs chip;
Fill glue-line in the described cavity, the upper surface of described glue-line comprises the sphere of a plurality of projectioies, and each sphere is corresponding with the position of each led chip.
Further, the bottom of described cavity also is provided with the metal heavy cup, and described a plurality of chips are fixed on the cup end of described heavy cup.
Described glue-line is substratum transparent or fluorescent material mixed layer.
Described a plurality of led chip serial or parallel connection.
Preferably, described heavy cup has at the bottom of a plurality of glasss, and adjacent cup is spaced from each other by recess at the end.
Described recess is at the inner reflecting surface of inclination that forms of heavy cup.
Preferably, the distance between the central point of two adjacent LEDs chip is d1, and the distance between the summit of two spheres corresponding with described two led chips is d2, d1＜d2.
In a kind of execution mode, the contour shape of described substrate is square, and described a plurality of led chip matrix distribution are at described cavity bottom.
Described led chip is the purple light chip.
The beneficial effects of the utility model are: among the LED of the present utility model, above each chip, form a plurality of brightness crests when a plurality of led chips are simultaneously luminous, because each corresponding exiting surface in led chip top all is the sphere of projection, can utilize the optically focused principle of convex lens, the luminous energy that each led chip is sent as far as possible divergently penetrates from exiting surface, significantly improves the luminous uniformity of LED.
Further, the utility model LED is continuing to light in the process, makes the temperature of heavy cup even relatively, and the heat that has effectively disperseed led chip to produce has reduced LED junction temperature and brightness decay, has therefore improved the reliability of LED.
The utility model LED can also increase the area of dissipation of heavy cup, reduces light decay, effectively promotes the brightness of LED.
Description of drawings
Fig. 1 is a kind of existing LED vertical view;
Fig. 2 is the cutaway view of a kind of existing LED along the B-B direction;
Fig. 3 is the cutaway view of a kind of existing LED along the A-A direction;
Fig. 4 is the light distribution schematic diagram of existing LED;
Fig. 5 is the multi-chip LED vertical view of first kind of embodiment of the utility model;
Fig. 6 is the cutaway view of the multi-chip LED of first embodiment along the B-B direction;
Fig. 7 is the cutaway view of the multi-chip LED of first embodiment along the A-A direction;
Fig. 8 is the multi-chip LED vertical view of the utility model second embodiment;
Fig. 9 is the cutaway view of the multi-chip LED of second embodiment along the B-B direction;
Figure 10 is the cutaway view of the multi-chip LED of second embodiment along the A-A direction;
Figure 11 is the light distribution schematic diagram of the multi-chip LED of a kind of embodiment of the utility model.
Embodiment
In conjunction with the accompanying drawings the utility model is described in further detail below by embodiment.
Embodiment one:
Please refer to Fig. 5 to Fig. 7, the multi-chip LED of present embodiment comprises substrate 1 and a plurality of led chip 3 that has cavity 11.A plurality of chips 3 are arranged on cavity 11 bottoms, the certain distance in interval between the two adjacent LEDs chip, and for example each led chip 3 can equidistantly be provided with, and the distance between the central point of two adjacent LEDs chip 3 is d1.Each led chip 3 interconnects by the mode of serial or parallel connection, and exposes the metal pins 2 at substrate 1 two ends by gold thread 6 conductings.
Fill substratum transparent in the cavity 11, perhaps for white light LEDs, the fluorescent material mixed layer of available mixed fluorescent powder 7 replaces substratum transparent.The upper surface of glue-line is the exiting surface 5 of LED, be made up of the sphere of a plurality of projectioies, and each sphere is corresponding with each led chip 3, and promptly the exiting surface 5 of the top correspondence of each led chip 3 all is the dome shape projection.
Generally, adopt injecting glue technology that the silica gel of transparent silica gel or mixed fluorescent powder is filled in the cavity 11 of LED in the LED manufacturing process, silica gel material also available silicon resin replaces.In the present embodiment, for the ease of the moulding of dome shape exiting surface 5, can utilize automatic press mold machine in conjunction with mould, the cavity 11 with the transparent silica gel or the mixed fluorescent powder of liquid state is pressed into LED forms substratum transparent or fluorescent material mixed layer.
A plurality of 3 whiles of led chip owing to form a plurality of brightness crests above each chip, have not only increased brightness when luminous, and can reduce LED at center and luminance difference on every side, significantly improve the luminous uniformity of LED; Because the exiting surface 5 of each led chip 3 top correspondence all is the sphere of projection, can utilize the optically focused principle of convex lens, the luminous energy that each led chip 3 is sent as far as possible divergently penetrates from exiting surface 5, and multi-chip LED light source is carried out homogenizing processing further.Adopt present embodiment LED even as the large-sized liquid crystal display brightness and the color of backlight, image quality obviously improves; The LED of present embodiment during as illumination or other field, also can effectively be promoted the luminosity and the luminous uniformity of luminescent device.
Further, the bottom of cavity 11 also is provided with the metal heavy cup 4 that is used to dispel the heat, and heavy cup 4 comprises the reflecting wall 41 and the cup end, and a plurality of chips 3 are fixed on the cup end of heavy cup 4.The existing LED that comprises a led chip 3 is continuing to light in the process, and led chip 3 heatings cause heavy cup 4 central region temperature drifts, and environment temperature is on the low side, and the even state of this temperature distributing disproportionation causes the LED junction temperature higher, and brightness decay is bigger; And the LED of present embodiment maintains a certain distance d1 between adjacent LED chip 3, makes the temperature of heavy cup 4 even relatively, and the heat that has effectively disperseed led chip 3 to produce has reduced LED junction temperature and brightness decay, has therefore improved the reliability of LED.
The led chip 3 of present embodiment can be selected blue chip or purple light chip according to concrete needs.
Embodiment two:
As shown in Figures 8 to 10, the heavy cup 4 of present embodiment LED has at the bottom of a plurality of glasss, and is spaced from each other by recess 42 at adjacent the glass end, and when a plurality of led chips 3 were matrix distribution, recess 42 was latticed even distribution.Because heavy cup 4 is certain thickness metal stamping formed by having, present embodiment is improved diel, and the transition position between making at the bottom of each glass of heavy cup 4 is inwardly recessed.Compare with a mode at the bottom of the cup is only arranged, present embodiment obviously can increase the area of dissipation of heavy cup 4, reduces light decay, effectively promotes the reliability of LED.
Further, as Fig. 9 and shown in Figure 10, recess 42 is at the heavy cup 4 inner reflectings surface that form two inclinations, and the reflecting wall 41 of this reflecting surface and heavy cup 4 all is used to strengthen the reflecting effect of luminous energy, thereby improves light emission rate and the brightness of LED.
Above content be in conjunction with concrete execution mode to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (9)
1. a multi-chip LED comprises the substrate and a plurality of led chip that have cavity, it is characterized in that described a plurality of led chips are arranged on described cavity bottom, keep at a certain distance away between the two adjacent LEDs chip;
Fill glue-line in the described cavity, the upper surface of described glue-line comprises the sphere of a plurality of projectioies, and each sphere is corresponding with the position of each led chip.
2. multi-chip LED as claimed in claim 1 is characterized in that the bottom of described cavity also is provided with the metal heavy cup, and described a plurality of chips are fixed on the cup end of described heavy cup.
3. multi-chip LED as claimed in claim 2 is characterized in that, described glue-line is substratum transparent or fluorescent material mixed layer.
4. multi-chip LED as claimed in claim 2 is characterized in that, described a plurality of led chip serial or parallel connections.
5. as each described multi-chip LED in the claim 2 to 4, it is characterized in that described heavy cup has at the bottom of a plurality of glasss, adjacent cup is spaced from each other by recess at the end.
6. multi-chip LED as claimed in claim 5 is characterized in that, described recess is at the inner reflecting surface of inclination that forms of heavy cup.
7. as each described multi-chip LED in the claim 1 to 4, it is characterized in that the distance between the central point of two adjacent LEDs chip is d1, the distance between the summit of two spheres corresponding with described two led chips is d2, d1＜d2.
8. multi-chip LED as claimed in claim 7 is characterized in that, the contour shape of described substrate is square, and described a plurality of led chip matrix distribution are at described cavity bottom.
9. as each described multi-chip LED in the claim 1 to 4, it is characterized in that described led chip is the purple light chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202023166U CN201868423U (en) | 2010-05-25 | 2010-05-25 | Multiple-chip LED (Light-Emitting Diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202023166U CN201868423U (en) | 2010-05-25 | 2010-05-25 | Multiple-chip LED (Light-Emitting Diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201868423U true CN201868423U (en) | 2011-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202023166U Expired - Fee Related CN201868423U (en) | 2010-05-25 | 2010-05-25 | Multiple-chip LED (Light-Emitting Diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201868423U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103982787A (en) * | 2014-04-14 | 2014-08-13 | 江门市亮美电子有限公司 | Polycrystalline serial LED (Light-Emitting Diode) light source |
-
2010
- 2010-05-25 CN CN2010202023166U patent/CN201868423U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103982787A (en) * | 2014-04-14 | 2014-08-13 | 江门市亮美电子有限公司 | Polycrystalline serial LED (Light-Emitting Diode) light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SKYWORTH LIQUID CRYSTAL DEVICES (SHENZHEN) CO., LT Free format text: FORMER OWNER: SHENZHEN CITY JUFEI OPTOELECTRONIC CO., LTD. Effective date: 20120913 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 518108 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120913 Address after: 518108, Shenzhen, Guangdong province Baoan District Shiyan street, Tong Tau Industrial Zone, SKYWORTH science and Technology Industrial Park, the first floor of the West Patentee after: Skyworth LCD Modules (Shenzhen) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Dalang Street Community creative Peak Road No. 65 building 1-4 layer Patentee before: Shenzhen City Jufei Optoelectronic Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20140525 |