WO2023160122A1 - 一种电子器件的漏电检测方法、电子设备及存储介质 - Google Patents

一种电子器件的漏电检测方法、电子设备及存储介质 Download PDF

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Publication number
WO2023160122A1
WO2023160122A1 PCT/CN2022/138060 CN2022138060W WO2023160122A1 WO 2023160122 A1 WO2023160122 A1 WO 2023160122A1 CN 2022138060 W CN2022138060 W CN 2022138060W WO 2023160122 A1 WO2023160122 A1 WO 2023160122A1
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Prior art keywords
electronic device
target
temperature
electronic
processing
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PCT/CN2022/138060
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English (en)
French (fr)
Inventor
刘�东
赵京
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荣耀终端有限公司
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Priority to EP22912791.5A priority Critical patent/EP4261555A1/en
Publication of WO2023160122A1 publication Critical patent/WO2023160122A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0077—Imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48—Thermography; Techniques using wholly visual means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of terminals, and in particular to a leakage detection method of an electronic device, an electronic device and a storage medium.
  • Embodiments of the present application provide a method for detecting electric leakage of an electronic device, an electronic device, and a storage medium, which can reduce detection costs for detecting electric leakage of an electronic device and improve detection efficiency.
  • a method for detecting electric leakage of an electronic device is provided, which is applied to an electronic device.
  • the electronic device includes a plurality of first electronic devices and a plurality of second electronic devices, and the second electronic device is used to detect the temperature of the first electronic device;
  • the electronic device stores temperature distribution information of each first electronic device, and the temperature distribution information is used to indicate multiple temperature reference values at different positions on the first electronic device when the electronic device is performing a target task; the method includes: When the device performs the target task, the electronic device acquires the target temperature value at the target position of the first electronic device measured by the target temperature sensor; the target temperature sensor is one of the multiple second electronic devices; the electronic device obtains the target temperature value from the first electronic device In the temperature distribution information of the electronic device, a target temperature reference value corresponding to the target position is determined; when the difference between the target temperature value and the target temperature reference value is greater than or equal to a first threshold, the electronic device determines that the first electronic device is leaking.
  • the electronic device includes a plurality of first electronic devices and a plurality of second electronic devices, and the second electronic device is used to detect the temperature of the first electronic device; when the electronic device performs a target task, the electronic device acquires a target temperature sensor The measured target temperature value at the target position of the first electronic device; the target temperature sensor is one of the multiple second electronic devices; since the electronic device stores temperature distribution information of each first electronic device, The temperature distribution information is used to indicate multiple temperature reference values at different positions on the first electronic device when the electronic device performs the target task; therefore, the electronic device can determine the temperature corresponding to the target position from the temperature distribution information of the first electronic device.
  • Target temperature reference value when the difference between the target temperature value and the target temperature reference value is greater than or equal to the first threshold, the electronic device determines that the first electronic device is leaking, so that it can detect the device that has the leakage problem in the electronic device, and then can reduce detection cost and improve detection efficiency.
  • the temperature distribution information is a temperature contour map
  • the temperature contour map includes multiple closed curves
  • the temperature reference values on the same closed curve are the same
  • the electronic device starts from the first
  • determining the target temperature reference value corresponding to the target position includes: when the target position is located between two adjacent closed curves, the target temperature reference value is close to the target position in the two adjacent closed curves The temperature reference value on the closed curve; or, when the target position is between two adjacent closed curves, the electronic device determines the target temperature reference value according to the temperature reference value on the two adjacent closed curves; or, when the target position is between When the closed curves coincide, the target temperature reference value is the temperature reference value on the closed curves.
  • the temperature contour map since the temperature distribution information is a temperature contour map, the temperature contour map includes multiple closed curves, and the temperature reference values on the same closed curve are the same, so the electronic device can obtain the temperature from the temperature of the first electronic device. Determining the target temperature reference value corresponding to the target position in the contour map can improve the accuracy of detecting electric leakage of electronic devices.
  • the temperature contour map is established by the electronic device after performing at least one target task in advance under normal conditions.
  • the electronic device since the temperature contour map is established after the electronic equipment performs at least one target task in advance under normal conditions, that is, when the electronic equipment is under normal conditions, multiple temperature references of each electronic device are obtained in advance. value; then, the electronic device compares the temperature reference value measured under normal conditions with the target temperature value actually measured when the electronic device performs the target task to determine whether the first electronic device is leaking, thereby further improving the detection of electronic device leakage. accuracy.
  • the method further includes: when the electronic device determines that the first electronic device is leaking, the electronic device performs target processing on the first electronic device; the target processing is used to eliminate the leakage of the first electronic device. Leakage.
  • the electronic device determines that the first electronic device is leaking, the electronic device performs target processing on the first electronic device. Since the target processing is used to eliminate the leakage of the first electronic device, that is, the electronic device detects that the first electronic device In the case of electric leakage, the electric leakage generated by the first electronic device is eliminated, which improves the service life of the first electronic device and is beneficial to protect the electronic equipment.
  • the target processing includes: reducing the refresh rate of the display screen, reducing the image quality, reducing the brightness of the backlight, reducing the frequency of the processor, reducing the load of the first electronic device, reducing the One or more types of processing in which the device's power or volume is reduced.
  • the method further includes: when the target temperature value is in the first interval, the target treatment includes M types of treatment; when the target treatment is in the second interval, the target treatment includes N types Processing type; the maximum value of the first interval is smaller than the minimum value of the second interval, and M is smaller than N; or, the maximum value of the first interval is smaller than the minimum value of the second interval, the M processing types are the same as the N processing types, and the N processing types Among the processing types, the processing granularity of at least one processing type is greater than the processing granularity of the corresponding processing type in the M processing types; wherein, M and N are positive integers.
  • the target processing when the target temperature value is in the first interval, the target processing includes M types of processing; when the target processing is in the second interval, the target processing includes N types of processing; since the maximum value of the first interval is smaller than the first interval
  • the minimum value of the second interval that is, when the target temperature value is in the first interval, the target temperature value is lower; when the target temperature value is in the second interval, the target temperature value is higher, in this case, M is less than N, that is, the target temperature value
  • M is less than N, that is, the target temperature value
  • the number of processing types included in the target processing is small; it is beneficial to reduce power consumption of the device; or, in the case where the M processing types are the same as the N processing types, in the N processing types, at least one of the processing types
  • the processing granularity is greater than the processing granularity of the corresponding processing type in the M processing types, that is, when the target temperature value is high, the processing granularity of at least one of the processing types in N is greater than the
  • the method further includes: when the number of times the electronic device performs target processing on the first electronic device is greater than or equal to the first preset number of times, and when the electronic device does not eliminate the first
  • the electronic device displays indication information; the indication information is used to prompt the user that the electronic device does not support the continuation of the target task; or, the indication information is used to prompt the user whether to end the target task.
  • the electronic device displays indication information; Because the instruction information is used to prompt the user that the electronic device does not support the continuation of the target task; or, the instruction information is used to prompt the user whether to end the target task, so that the user can determine that the electronic device is malfunctioning according to the instruction information, which improves the user experience. .
  • the method further includes: when the target temperature reference value is greater than or equal to the second threshold, the electronic device displays indication information; the indication information is used to prompt the user that the electronic device does not support continuing execution The target task; or, the indication information is used to prompt the user whether to end the target task.
  • the electronic device when the target temperature reference value is greater than or equal to the second threshold value, the electronic device displays indication information; and when the target temperature reference value is larger, if the target temperature value is still greater than the target temperature reference value, the electronic device determines The first electronic device must have a leakage problem, and the leakage of the first electronic device is relatively serious; in this case, the electronic device prompts the user that the electronic device is faulty through the indication information, which improves user experience.
  • the method further includes: the electronic device ending the target task in response to the user's confirmation operation; or, the electronic device continuing to execute the target task in response to the user's cancel operation.
  • the electronic device ends the target task in response to the user's confirmation operation; or, the electronic device continues to execute the target task in response to the user's cancel operation, that is, the user can confirm whether to end the target task or continue to execute the target task according to the instruction information , which is conducive to further improving user experience.
  • the method further includes: when the number of cancel operations by the user is greater than or equal to the second preset number of times, the electronic device automatically ends the target task; or, when the user cancels the When the number of operations is greater than or equal to the second preset number of times, the electronic device is automatically shut down.
  • the electronic device when the number of cancel operations by the user is greater than or equal to the second preset number of times, the electronic device automatically ends the target task; or the electronic device automatically shuts down, thereby avoiding the unsafe situation caused by the leakage of the first electronic device. problem, which is conducive to protecting the user's own safety.
  • an electronic device in a second aspect, has the functions described in the first aspect above.
  • This function may be implemented by hardware, or may be implemented by executing corresponding software on the hardware.
  • the hardware or software includes one or more modules corresponding to the above functions.
  • an electronic device in a third aspect, includes a plurality of first electronic devices and a plurality of second electronic devices; the second electronic device is used to detect the temperature of the first electronic device; the plurality of first electronic devices includes a display screen, memory and one or more processors; the display screen, memory and processor are coupled; the memory is used to store computer program codes and temperature distribution information of each first electronic device, and the temperature distribution information is used to indicate that the electronic device is executing the target During the task, a plurality of temperature reference values at different positions on the first electronic device; the computer program code includes computer instructions; when the processor executes the computer instructions, the electronic device performs the following steps: when the electronic device executes the target task, the electronic device Obtain the target temperature value at the target position of the first electronic device measured by the target temperature sensor; the target temperature sensor is one of the multiple second electronic devices; the electronic device obtains the temperature distribution information of the first electronic device, Determine a target temperature reference value corresponding to the target position; when the difference between the target temperature value and the target
  • the temperature distribution information is a temperature contour map
  • the temperature contour map includes multiple closed curves
  • the temperature reference values on the same closed curve are the same; when the processor executes the computer
  • the electronic device specifically executes the following steps: when the target position is between two adjacent closed curves, the target temperature reference value is a temperature reference value on the closed curve in which the target position is close to the two adjacent closed curves; or , when the target position is between two adjacent closed curves, the electronic device determines the target temperature reference value according to the temperature reference values on the two adjacent closed curves; or, when the target position coincides with the closed curve, the target temperature reference value is the temperature reference value on the closed curve.
  • the temperature contour map is established after the electronic device executes the target task at least once under normal conditions.
  • the electronic device when the processor executes the computer instruction, the electronic device further executes the following step: when the electronic device determines that the first electronic device is leaking, the electronic device performs target processing on the first electronic device ;Target processing is used to eliminate electrical leakage of electronic devices.
  • the target processing includes: reducing the refresh rate of the display screen, reducing the image quality, reducing the brightness of the backlight, reducing the frequency of the processor, reducing the load of the first electronic device, reducing the One or more types of processing in which the device's power or volume is reduced.
  • the electronic device when the processor executes the computer instruction, the electronic device further executes the following steps: when the target temperature value is in the first range, the target processing includes M types of processing; when the target processing In the second interval, the target processing includes N types of processing; the maximum value of the first interval is smaller than the minimum value of the second interval, M is less than N; or, the maximum value of the first interval is smaller than the minimum value of the second interval, M types
  • the processing type is the same as the N processing types, and among the N processing types, the processing granularity of at least one processing type is larger than the processing granularity of the corresponding processing type among the M processing types; wherein, M and N are positive integers.
  • the electronic device when the processor executes the computer instruction, the electronic device further executes the following step: when the number of times the electronic device performs target processing on the first electronic device is greater than or equal to the first preset number of times, and when the electronic device does not eliminate the leakage of the first electronic device, the electronic device displays indication information; the indication information is used to prompt the user that the electronic device does not support the continued execution of the target task; or, the indication information is used to prompt the user whether to end target task.
  • the electronic device when the processor executes the computer instruction, the electronic device further executes the following steps: when the target temperature reference value is greater than or equal to the second threshold, the electronic device displays indication information; the indication information It is used to prompt the user that the electronic device does not support the continuation of the target task; or, the indication information is used to prompt the user whether to end the target task.
  • the electronic device when the processor executes the computer instruction, the electronic device further executes the following steps: the electronic device ends the target task in response to the user's confirmation operation; or, the electronic device responds to the user's confirmation operation. Cancel the operation and continue with the target task.
  • the electronic device when the processor executes the computer instruction, the electronic device further executes the following step: when the number of cancellation operations by the user is greater than or equal to the second preset number of times, the electronic device automatically ends The target task; or, when the number of cancellation operations by the user is greater than or equal to a second preset number of times, the electronic device is automatically shut down.
  • a computer-readable storage medium is provided, and computer instructions are stored in the computer-readable storage medium.
  • the computer instructions When the computer instructions are run on the computer, the computer can execute the method described in any one of the above-mentioned first aspects. Leakage detection method for electronic devices.
  • a computer program product containing instructions.
  • the instructions When the instructions are run on a computer, the computer can execute the method for detecting electric leakage of an electronic device according to any one of the above first aspects.
  • the technical effect brought by any one of the design methods in the second aspect to the fourth aspect can refer to the technical effect brought by different design methods in the first aspect, which will not be repeated here.
  • FIG. 1 is a schematic diagram of a hardware structure of an electronic device provided in an embodiment of the present application
  • FIG. 2 is a schematic diagram of a software framework of an electronic device provided in an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a comparison between the temperature of an electronic device when it is normal and the temperature when it is abnormal according to an embodiment of the present application;
  • FIG. 4 is a schematic structural diagram of a motherboard of an electronic device provided in an embodiment of the present application.
  • FIG. 5 is a schematic diagram of temperature comparison of electronic devices in different application scenarios provided by the embodiment of the present application.
  • FIG. 6 is a schematic diagram of establishing temperature contours of various electronic devices in different application scenarios provided by the embodiment of the present application.
  • FIG. 7 is a schematic diagram of a temperature contour of an audio amplifier in an audio scene provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of temperature contours of a processor in a game scene provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of the positional relationship between an electronic device and a temperature sensor provided in an embodiment of the present application.
  • FIG. 10 is a first schematic flow diagram of a leakage detection method for an electronic device provided in an embodiment of the present application.
  • FIG. 11 is a schematic diagram of determining a preset temperature value according to a temperature contour map provided by an embodiment of the present application.
  • FIG. 12 is a schematic diagram of an interface displaying a pop-up warning provided by an embodiment of the present application.
  • FIG. 13 is a schematic flow diagram II of a leakage detection method for an electronic device provided in an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a chip system provided by an embodiment of the present application.
  • At least one of the following or similar expressions refer to any combination of these items, including any combination of single or plural items.
  • at least one item (piece) of a, b, or c can represent: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple .
  • words such as “first” and “second” are used to distinguish the same or similar items with basically the same function and effect.
  • words such as “first” and “second” do not limit the quantity and execution order, and words such as “first” and “second” do not necessarily limit the difference.
  • words such as “exemplary” or “for example” are used as examples, illustrations or illustrations. Any embodiment or design scheme described as “exemplary” or “for example” in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes.
  • the use of words such as “exemplary” or “such as” is intended to present related concepts in a concrete manner for easy understanding.
  • An embodiment of the present application provides a method for detecting electric leakage of an electronic device, and the method is applied to an electronic device.
  • the electronic device can be a mobile phone, an action camera (GoPro), a digital camera, a tablet computer, a desktop, a laptop, a handheld computer, a notebook computer, a vehicle-mounted device, an ultra-mobile personal computer (UMPC), Netbooks, cellular phones, personal digital assistants (personal digital assistants, PDAs), augmented reality (augmented reality, AR) ⁇ virtual reality (virtual reality, VR) equipment, etc.
  • the embodiment of the present application does not make a special description of the specific form of the electronic equipment limit.
  • the electronic device 100 may include: a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (universal serial bus, USB) interface 130, a charging management module 140, a power management module 141, a battery 142, and an antenna 1 , antenna 2, mobile communication module 150, wireless communication module 160, audio module 170, speaker 170A, receiver 170B, microphone 170C, earphone jack 170D, sensor module 180, button 190, motor 191, indicator 192, camera 193, display screen 194, and a subscriber identification module (subscriber identification module, SIM) card interface 195, etc.
  • SIM subscriber identification module
  • the sensor module 180 may include a pressure sensor 180A, a gyro sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an environmental Light sensor 180L, bone conduction sensor 180M, etc.
  • the structure shown in this embodiment does not constitute a specific limitation on the electronic device 100 .
  • the electronic device 100 may include more or fewer components than shown, or combine certain components, or separate certain components, or arrange different components.
  • the illustrated components can be realized in hardware, software or a combination of software and hardware.
  • the processor 110 may include one or more processing units, for example: the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processing unit (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), controller, memory, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural network processor (neural-network processing unit, NPU) wait. Wherein, different processing units may be independent devices, or may be integrated in one or more processors.
  • application processor application processor, AP
  • modem processor graphics processing unit
  • GPU graphics processing unit
  • image signal processor image signal processor
  • ISP image signal processor
  • controller memory
  • video codec digital signal processor
  • DSP digital signal processor
  • baseband processor baseband processor
  • neural network processor neural-network processing unit, NPU
  • the controller may be the nerve center and command center of the electronic device 100 .
  • the controller can generate an operation control signal according to the instruction opcode and timing signal, and complete the control of fetching and executing the instruction.
  • a memory may also be provided in the processor 110 for storing instructions and data.
  • the memory in processor 110 is a cache memory.
  • the memory may hold instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to use the instruction or data again, it can be directly recalled from the memory. Repeated access is avoided, and the waiting time of the processor 110 is reduced, thereby improving the efficiency of the system.
  • processor 110 may include one or more interfaces.
  • the interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous transmitter (universal asynchronous receiver/transmitter, UART) interface, mobile industry processor interface (mobile industry processor interface, MIPI), general-purpose input and output (general-purpose input/output, GPIO) interface, subscriber identity module (subscriber identity module, SIM) interface, and /or universal serial bus (universal serial bus, USB) interface, etc.
  • I2C integrated circuit
  • I2S integrated circuit built-in audio
  • PCM pulse code modulation
  • PCM pulse code modulation
  • UART universal asynchronous transmitter
  • MIPI mobile industry processor interface
  • GPIO general-purpose input and output
  • subscriber identity module subscriber identity module
  • SIM subscriber identity module
  • USB universal serial bus
  • the interface connection relationship among the modules shown in this embodiment is only a schematic illustration, and does not constitute a structural limitation of the electronic device.
  • the electronic device may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.
  • the charging management module 140 is configured to receive a charging input from a charger.
  • the charger may be a wireless charger or a wired charger.
  • the charging management module 140 can receive charging input from the wired charger through the USB interface 130 .
  • the charging management module 140 may receive wireless charging input through a wireless charging coil of the electronic device. While the charging management module 140 is charging the battery 142 , it can also supply power to the electronic device through the power management module 141 .
  • the power management module 141 is used for connecting the battery 142 , the charging management module 140 and the processor 110 .
  • the power management module 141 receives the input from the battery 142 and/or the charging management module 140 to provide power for the processor 110 , the internal memory 121 , the external memory, the display screen 194 , the camera 193 , and the wireless communication module 160 .
  • the power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle times, and battery health status (leakage, impedance).
  • the power management module 141 may also be disposed in the processor 110 .
  • the power management module 141 and the charging management module 140 may also be set in the same device.
  • the wireless communication function of the electronic device 100 can be realized by the antenna 1 , the antenna 2 , the mobile communication module 150 , the wireless communication module 160 , a modem processor, a baseband processor, and the like.
  • the electronic device 100 realizes the display function through the GPU, the display screen 194 , and the application processor.
  • the GPU is a microprocessor for image processing, and is connected to the display screen 194 and the application processor. GPUs are used to perform mathematical and geometric calculations for graphics rendering.
  • Processor 110 may include one or more GPUs that execute program instructions to generate or change display information.
  • the display screen 194 is used to display images, videos and the like.
  • the display screen 194 includes a display panel (or called a display substrate).
  • the display panel may use an organic light-emitting diode (OLED).
  • OLED organic light-emitting diode
  • the display screen is an LTPO display screen; the display unit (such as TFT) in the display panel included in the LTPO display screen is an LTPO TFT.
  • TFT organic light-emitting diode
  • the electronic device 100 can realize the shooting function through the ISP, the camera 193 , the video codec, the GPU, the display screen 194 and the application processor.
  • the ISP is used for processing the data fed back by the camera 193 .
  • the light is transmitted to the photosensitive element of the camera through the lens, and the light signal is converted into an electrical signal, and the photosensitive element of the camera transmits the electrical signal to the ISP for processing, and converts it into an image visible to the naked eye.
  • ISP can also perform algorithm optimization on image noise, brightness, and skin color.
  • ISP can also optimize the exposure, color temperature and other parameters of the shooting scene.
  • the ISP may be located in the camera 193.
  • Camera 193 is used to capture still images or video.
  • the object generates an optical image through the lens and projects it to the photosensitive element.
  • the photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor.
  • CMOS complementary metal-oxide-semiconductor
  • the photosensitive element converts the light signal into an electrical signal, and then transmits the electrical signal to the ISP to convert it into a digital image signal.
  • the ISP outputs the digital image signal to the DSP for processing.
  • DSP converts digital image signals into standard RGB, YUV and other image signals.
  • the electronic device may include 1 or N cameras 193, where N is a positive integer greater than 1.
  • Digital signal processors are used to process digital signals. In addition to digital image signals, they can also process other digital signals. For example, when an electronic device selects a frequency point, a digital signal processor is used to perform Fourier transform on the frequency point energy, etc.
  • Video codecs are used to compress or decompress digital video.
  • the electronic device 100 may support one or more video codecs.
  • the electronic device can play or record video in multiple encoding formats, for example: moving picture experts group (moving picture experts group, MPEG) 1, MPEG2, MPEG3, MPEG4, etc.
  • the NPU is a neural-network (NN) computing processor.
  • NPU neural-network
  • Applications such as intelligent cognition of electronic devices can be realized through NPU, such as: image recognition, face recognition, speech recognition, text understanding, etc.
  • the electronic device 100 can implement audio functions through the audio module 170 , the speaker 170A, the receiver 170B, the microphone 170C, the earphone interface 170D, and the application processor. Such as music playback, recording, etc.
  • the audio module 170 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signal.
  • the audio module 170 may also be used to encode and decode audio signals.
  • the audio module 170 may be set in the processor 110 , or some functional modules of the audio module 170 may be set in the processor 110 .
  • Speaker 170A also referred to as a "horn” is used to convert audio electrical signals into sound signals.
  • Receiver 170B also called “earpiece”, is used to convert audio electrical signals into sound signals.
  • the microphone 170C also called “microphone” or “microphone”, is used to convert sound signals into electrical signals.
  • the earphone interface 170D is used for connecting wired earphones.
  • the earphone interface 170D can be a USB interface 130, or a 3.5mm open mobile terminal platform (OMTP) standard interface, or a cellular telecommunications industry association of the USA (CTIA) standard interface.
  • OMTP open mobile terminal platform
  • CTIA cellular telecommunications industry association of the USA
  • the external memory interface 120 may be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device.
  • the external memory card communicates with the processor 110 through the external memory interface 120 to implement a data storage function. Such as saving audio, video, etc. files in an external memory card.
  • the internal memory 121 may be used to store computer-executable program codes including instructions.
  • the processor 110 executes various functional applications and data processing of the electronic device by executing instructions stored in the internal memory 121 .
  • the processor 110 may execute instructions stored in the internal memory 121, and the internal memory 121 may include a program storage area and a data storage area.
  • the stored program area can store an operating system, at least one application program required by a function (such as a sound playing function, an image playing function, etc.) and the like.
  • the storage data area can store data (such as audio data, phone book, etc.) created during the use of the electronic device.
  • the internal memory 121 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, flash memory device, universal flash storage (universal flash storage, UFS) and the like.
  • the keys 190 include a power key, a volume key and the like.
  • the key 190 may be a mechanical key. It can also be a touch button.
  • the motor 191 can generate a vibrating reminder.
  • the motor 191 can be used for incoming call vibration prompts, and can also be used for touch vibration feedback.
  • the indicator 192 can be an indicator light, and can be used to indicate charging status, power change, and can also be used to indicate messages, missed calls, notifications, and the like.
  • the SIM card interface 195 is used for connecting a SIM card.
  • the SIM card can be inserted into the SIM card interface 195 or pulled out from the SIM card interface 195 to realize contact and separation with the electronic device.
  • the electronic device can support 1 or N SIM card interfaces, where N is a positive integer greater than 1.
  • SIM card interface 195 can support Nano SIM card, Micro SIM card, SIM card etc.
  • the software system of the electronic device 100 may adopt a layered architecture, an event-driven architecture, a micro-kernel architecture, a micro-service architecture or a cloud architecture.
  • the software architecture of the electronic device 100 is exemplarily described by taking the Android system with a layered architecture as an example.
  • FIG. 2 is a block diagram of the software structure of the electronic device 100 according to the embodiment of the present application.
  • the layered architecture divides the software into several layers, and each layer has a clear role and division of labor. Layers communicate through software interfaces.
  • the Android system is divided into four layers, which are respectively the application program layer, the application program framework layer, the Android runtime (Android runtime) and the system library, and the kernel layer from top to bottom.
  • the application layer can consist of a series of application packages.
  • the application package can include applications such as camera, gallery, calendar, call, map, navigation, WLAN, Bluetooth, music, video, short message and voice assistant.
  • applications such as camera, gallery, calendar, call, map, navigation, WLAN, Bluetooth, music, video, short message and voice assistant.
  • the application framework layer provides an application programming interface (application programming interface, API) and a programming framework for the application layer and applications.
  • the application framework layer includes some predefined functions.
  • the application framework layer can include window managers, content providers, view systems, phone managers, resource managers, notification managers, and so on.
  • a window manager is used to manage window programs.
  • the window manager can get the size of the display screen, determine whether there is a status bar, lock the screen, capture the screen, etc.
  • Content providers are used to store and retrieve data and make it accessible to applications.
  • Said data may include video, images, audio, calls made and received, browsing history and bookmarks, phonebook, etc.
  • the view system includes visual controls, such as controls for displaying text, controls for displaying pictures, and so on.
  • the view system can be used to build applications.
  • a display interface can consist of one or more views.
  • a display interface including a text message notification icon may include a view for displaying text and a view for displaying pictures.
  • the phone manager is used to provide communication functions of the electronic device 100 . For example, the management of call status (including connected, hung up, etc.).
  • the resource manager provides various resources for the application, such as localized characters, icons, pictures, layout files, video files, etc.
  • the notification manager enables the application to display notification information in the status bar, which can be used to convey notification-type messages, and can automatically disappear after a short stay without user interaction.
  • the notification manager is used to notify the download completion, message reminder, etc.
  • the notification manager can also be a notification that appears in the status bar at the top of the system in the form of a chart or scroll bar text, such as a notification of an application running in the background, or a notification that appears on the screen in the form of a dialog window.
  • prompting text information in the status bar issuing a prompt sound, vibrating the electronic device, and flashing the indicator light, etc.
  • Android Runtime includes core library and virtual machine. Android Runtime is responsible for the scheduling and management of the Android system.
  • the core library consists of two parts: one part is the function function that the java language needs to call, and the other part is the core library of Android.
  • the application layer and the application framework layer run in virtual machines.
  • the virtual machine executes the java files of the application program layer and the application program framework layer as binary files.
  • the virtual machine is used to perform functions such as object life cycle management, stack management, thread management, security and exception management, and garbage collection.
  • a system library can include multiple function modules. For example: surface manager (surface manager) media library (Media Libraries), 3D graphics processing library (eg: OpenGL ES), 2D graphics engine (eg: SGL), etc.
  • surface manager surface manager
  • Media Libraries Media Libraries
  • 3D graphics processing library eg: OpenGL ES
  • 2D graphics engine eg: SGL
  • the surface manager is used to manage the display subsystem and provides the fusion of 2D and 3D layers for multiple applications.
  • the media library supports playback and recording of various commonly used audio and video formats, as well as still image files, etc.
  • the media library can support multiple audio encoding formats, such as: MPEG4, H.264, MP3, AAC, AMR, JPG, PNG, etc.
  • the 3D graphics processing library is used to implement 3D graphics drawing, image rendering, compositing and layer processing, etc.
  • 2D graphics engine is a drawing engine for 2D drawing.
  • the kernel layer is the layer between hardware and software.
  • the kernel layer includes at least a display driver, a camera driver, an audio driver, and a sensor driver.
  • electronic equipment At present, during the production process of electronic equipment, some reasons (such as unreasonable software control, or hardware failure, etc.) may cause electric leakage problems in the integrated electronic device (or called the first electronic device) in the electronic equipment. Based on this, in related technologies, electronic equipment generally detects the leakage of electronic devices integrated in the electronic equipment in the following two situations. In one case, electric leakage detection of electronic devices will be performed before the electronic equipment leaves the factory.
  • the user when the user is using the electronic device, if the user finds that the electronic device is abnormal in the working process (such as fast power consumption, the temperature of the electronic device is too high, etc.), the user will report to the manufacturer of the electronic device The abnormal problem is fed back, so that the manufacturer can detect the electric leakage of the electronic device integrated in the electronic device according to the abnormal problem.
  • the electronic device is abnormal in the working process (such as fast power consumption, the temperature of the electronic device is too high, etc.)
  • the user will report to the manufacturer of the electronic device The abnormal problem is fed back, so that the manufacturer can detect the electric leakage of the electronic device integrated in the electronic device according to the abnormal problem.
  • leakage refers to current leakage (also referred to as leakage current) caused by electronic devices due to their own failure or unreasonable software control and other reasons.
  • the resistance of the electronic device is a certain value
  • the current flowing through the electronic device is a certain value
  • the magnitude of the electric heat is proportional to the time. For example, when an electronic device is working (that is, a current flows through the electronic device), the electric heat generated increases with time. However, when an electronic device has a leakage problem, that is, the electronic device has a current leakage, this will cause an increase in the current flowing through the electronic device, so the electric heat generated by the electronic device will increase.
  • the same electronic device works for the same time (that is, the time t is equal), when the electronic device is normal (that is, no leakage problem occurs), then the current flowing through the electronic device is a certain value, and the electric heat generated is Q1.
  • the electronic device is abnormal (that is, a leakage problem occurs)
  • the current flowing through the electronic device will increase, and the generated electric heat is Q2.
  • the electric heat generated by the electronic device increases due to the increase of the current flowing through the electronic device, that is, Q2 is greater than Q1.
  • electrothermal generation is the process of converting electrical energy into heat energy when current passes through an electronic device
  • the electronic device when current passes through an electronic device, the electronic device will generate heat, that is, the temperature of the electronic device will increase.
  • the electric heat generated by the abnormal (that is, the leakage problem) electronic device is greater than the electric heat generated by the normal (that is, no leakage) electronic device, when the same electronic device works for the same time, the temperature of the electronic device in the case of leakage will increase. Higher than the temperature of the electronic device without leakage current.
  • the electric heat generated by the electronic device when the working time is t1 is Q1; and when the electronic device is abnormal (that is, leakage occurs)
  • the electric heat generated when the electronic device works for t1 is Q2.
  • the temperature of the electronic device is W1; when the electric heat generated by the electronic device is Q2, the temperature of the electronic device is W2.
  • Q2 is greater than Q1, so W2 is also greater than W1, that is, the temperature of the electronic device with leakage is higher than that of the electronic device without leakage.
  • the embodiment of the present application provides a leakage detection method for electronic devices, which is applied to electronic equipment.
  • This method can intelligently identify the electronic components that cause leakage problems without dismantling parts or destroying the hardware structure of the electronic equipment.
  • device or the first electronic device.
  • the method can detect the temperature of each electronic device among the multiple electronic devices integrated in the electronic device when the electronic device performs a task, and compare the temperature (or target temperature value) of each electronic device with the preset temperature Value (or target temperature reference value) is compared, and the electronic device whose temperature is higher than the preset temperature value is the electronic device that has the leakage problem. In this way, not only the time and manpower required for detecting electric leakage of electronic devices are saved, but also the detection efficiency is improved.
  • the electronic device determines that the electronic device is leaking electricity.
  • the first threshold may be set according to specific needs, and the embodiment of the present application does not limit the first threshold.
  • the first threshold is, for example, equal to zero, that is, the temperature of the electronic device is equal to the preset temperature value.
  • the electronic device in the embodiment of the present application may be the smallest granularity unit in the electronic device that can independently perform the control transformation function, or it may be a unit assembled with multiple components.
  • the plurality of electronic devices may include, for example, a display screen (or screen), a central processing unit (central processing unit, CPU), an audio amplifier (SmartPA), and a modem (modem).
  • the audio amplifier may also be referred to as an intelligent power amplifier.
  • the plurality of electronic devices may also include other hardware structures or components of the electronic device, which will not be listed here one by one. For examples of other electronic devices, reference may be made to the electronic device shown in FIG. 2 in the above embodiment. Individual hardware in the hardware structure.
  • the main board is one of the most basic and also the most important components of electronic equipment; the main board may also be called a main board, a system board, or a mother board.
  • the motherboard 200 may include electronic components such as a processor, a fast charging chip, a flash memory, a Bluetooth chip, an audio amplifier, and a power amplifier.
  • an infrared thermal image may be obtained by scanning an electronic device with an infrared thermal imager.
  • the infrared thermal imager uses the infrared detector, the optical imaging objective lens and the optical machine scanning system to receive the infrared radiation energy distribution pattern of the electronic device and reflect it on the photosensitive element of the infrared detector.
  • the optical-mechanical scanning mechanism scans the infrared thermal image of the electronic device and focuses it on the unit or spectroscopic detector.
  • the detector converts the infrared radiation energy into an electrical signal. After amplification, conversion or standard video signal passes through the TV screen or detection
  • the monitor displays an infrared thermal image.
  • the temperature of electronic devices can be seen.
  • the temperature of electronic devices gradually decreases from the inside to the outside, that is, around the processor, the temperature near the processor is higher, and conversely, the temperature farther away from the processor is the lower the temperature.
  • the temperature at the center of the processor is the highest (eg, reaches 55° C.), while the temperature away from the center of the processor decreases gradually (eg, decreases from 55° C. to 25° C.).
  • the temperatures of different electronic devices are also different.
  • the maximum temperature of the processor is the highest (such as higher than 55°C), while the temperature of electronic components such as fast charging chips, flash memory, Bluetooth chips, audio amplifiers, and power amplifiers is relatively low (such as between 55°C and 25°C).
  • the different division of labor in the working process of the multiple electronic devices means that the task loads undertaken by the multiple electronic devices are different in the working process.
  • the temperature of each of the plurality of electronic devices is thus made different. For example, in the mainboard 200 shown in FIG.
  • Electronic components such as audio amplifiers and power amplifiers perform different tasks during operation, resulting in different temperatures for these electronic components.
  • the processor undertakes a large amount of tasks during the working process (for example, the processor mainly undertakes the algorithm part), so the temperature of the processor is relatively high.
  • electronic devices such as fast charging chips, flash memory, Bluetooth chips, audio amplifiers, and power amplifiers undertake relatively small tasks in the working process (such as only undertaking the task of assisting the processor to run algorithms), so the inquiries of these electronic devices are relatively small. Low. Based on this, when the main board 200 is scanned by the infrared thermal imager, different temperatures of various electronic components can be clearly seen in the presented infrared thermal image.
  • the application scene of the electronic device refers to a scene when the user uses the electronic device to realize a certain function.
  • the application scene may be a game scene; when the user uses the electronic device to play music, the application scene may be an audio scene, for example.
  • the application scenario may also be called a usage scenario.
  • the above application scenario is only used as an illustration in the embodiments of the present application, and does not constitute a limitation to the present application.
  • the application scenario may also be a video scenario, a browser scenario, etc., which will not be listed here.
  • the amount of tasks undertaken by the multiple electronic devices during the working process is different, so the temperatures of the multiple electronic devices will also be different.
  • the amount of tasks undertaken by the processor is greater than that of other electronic devices (such as Bluetooth chips, power amplifiers, audio amplifiers, etc.), so the temperature of the processor will be higher than that of other electronic devices.
  • the application scene is an audio scene, that is, the user is using the electronic device to play music.
  • the audio amplifier takes on more tasks than other electronic devices (such as Bluetooth chips, power amplifiers, processors, etc.), so the temperature of the audio amplifier will be higher than that of other electronic devices.
  • the temperature of the electronic device is also different.
  • the temperature of the processor in a game scene is higher than that in an audio scene.
  • the determination of the preset temperature value needs Combining different application scenarios of electronic equipment.
  • the preset temperature values mentioned in the embodiments of the present application are determined based on different application scenarios.
  • the preset temperature value is the data obtained by developers after multiple experiments in the early stage of device debugging.
  • developers can simulate users using electronic devices to perform different tasks (even if the electronic devices are in different application scenarios), and obtain the preset temperature values of each electronic device in different application scenarios by collecting and summarizing.
  • developers can simulate users using electronic devices to perform different tasks to simulate different application scenarios, and scan each electronic device in different application scenarios with an infrared thermal imager to obtain the infrared heat of each electronic device in different application scenarios. Imaging diagram. And the infrared thermal imaging images of each electronic device are processed to obtain the temperature of each position around each electronic device.
  • developers can establish a temperature coordinate system for each electronic device in different scenarios based on the temperatures at various locations around each electronic device. Wherein, each coordinate in the temperature coordinate system is used to indicate a position around the electronic device. In addition, the number marked on each coordinate is the temperature at that position.
  • the developer may establish a temperature contour line (or a temperature contour map) of each electronic device in different scenarios based on the temperatures at various locations around each electronic device.
  • the temperature contour line refers to a curve formed by connecting adjacent points with equal temperatures on the main board of the electronic device. Specifically, the curve formed by connecting points with the same temperature on the main board is projected vertically onto a horizontal plane, and then scaled down on the drawing to obtain the temperature contour.
  • this temperature contour can be formed as a closed curve.
  • the temperature contour can also be regarded as the intersection line between the horizontal planes at different heights and the actual main board surface, so the temperature contour is a closed curve.
  • the number marked on the temperature contour line is the temperature of the temperature contour line.
  • the temperature contour map is established after the electronic device executes the target task at least once under normal conditions.
  • the normal condition of electronic equipment refers to that before (or after) the electronic equipment leaves the factory, each electronic component of the electronic equipment is tested by professional equipment, and after the testing is completed, it is determined that each electronic component in the electronic equipment is normal.
  • the pre-execution of the target task at least once refers to: when the electronic equipment is determined to be normal, before the electronic equipment leaves the factory; At least one objective mission.
  • the display screen is scanned by an infrared thermal imager, and a temperature contour (such as temperature contour a) of the display screen is established;
  • the processor is scanned by an infrared thermal imager, and Establish the temperature contour of the processor (such as temperature contour b); scan the audio amplifier through the infrared thermal imager, and establish the temperature contour of the audio amplifier (such as temperature contour c), etc.
  • the display screen is scanned by the infrared thermal imager, and the temperature contour (such as temperature contour A) of the display screen is established; the processor is scanned by the infrared thermal imager, and the temperature contour line is established The temperature contour of the processor (such as temperature contour B); scan the audio amplifier through the infrared thermal imager, and establish the temperature contour of the audio amplifier (such as temperature contour C), etc.
  • the temperature contours corresponding to the same electronic device are not completely the same.
  • the temperature contour line a is not exactly the same as the temperature contour line A; the temperature contour line b is not completely the same as the temperature contour line B; the temperature contour line c is not completely the same as the temperature contour line C.
  • the application scenarios described in the above embodiments may be further subdivided.
  • the audio scene can be subdivided into audio scene 1, audio scene 2, and audio scene 3 according to the volume when the user uses the electronic device to play audio.
  • the audio scene 1 can be [0%, 35%] when the user uses an electronic device to play audio, for example;
  • the audio scene 2 can be [36%, 70%] when the user uses an electronic device to play audio, for example;
  • the audio scene 3 may be, for example, a volume of [71%, 100%] when the user uses the electronic device to play audio.
  • each electronic device can be scanned by an infrared thermal imager in audio scene 1, audio scene 2, and audio scene 3 respectively, and the temperature contours of each electronic device can be established.
  • the game scene can be subdivided into game scene 1, game scene 2, and game scene 3 according to the game category when the user uses the electronic device to play the game.
  • game scene 1 can be, for example, a scene when a user uses an electronic device to play a casual game
  • game scene 2 for example, can be a scene when a user uses an electronic device to play a simulation game
  • game scene 3 for example, can be a scene when a user uses an electronic device Scenes when playing other types of games.
  • each electronic device can be scanned by an infrared thermal imager in game scene 1, game scene 2 and game scene 3 respectively, and the temperature contours of each electronic device can be established.
  • the temperature contour of the audio amplifier is shown in Figure 7 (a) shown.
  • the temperature contour of the audio amplifier is shown in (b) in Figure 7.
  • the temperature contour line is a closed curve, and the number marked on the temperature contour line is the temperature around the audio amplifier; it can be seen that the closer to the audio amplifier The temperature at the location is higher, and conversely, the temperature at the location farther away from the audio amplifier is lower.
  • the temperature contours shown in Figure 7(a) and Figure 7(b) the temperature of the audio amplifier with leakage at the same position is significantly higher than that of the audio amplifier without leakage at the same position .
  • the temperature contour of the processor is shown in Figure 8 (a) shown.
  • the temperature contour of the processor is shown in (b) of FIG. 8 .
  • the temperature contour is a closed curve, and the number marked on the temperature contour is the temperature around the processor; it can be seen that the closer to the processor The temperature at the location is higher, and conversely, the temperature at the location farther away from the processor is lower.
  • the temperature of the processor with leakage at the same position is significantly higher than the temperature at the same position of the processor without leakage .
  • the infrared thermal imaging images of each electronic device in different scenarios are obtained according to the infrared thermal imager scanning, and different The temperature contours of each electronic device in the scene. Then, the temperature contours of each electronic device in different scenarios are stored in the electronic device. In other words, at the initial stage of equipment debugging, the temperature contours of each electronic device in different scenarios have been stored in the equipment.
  • the numbers marked on the temperature contour lines can be used as the preset temperature values described in the embodiments of the present application.
  • the electronic equipment can detect the temperature of each electronic device in the current application scenario, and determine the electronic device with a temperature greater than a preset temperature value as the electronic device with leakage.
  • multiple temperature sensors can be set in the electronic device, and these temperature sensors are used to detect the temperature of each electronic device, so that when an electronic device has a leakage problem, it can be intelligently identified Electronic devices with leakage problems.
  • the temperature sensor can be integrated inside the electronic device (ie, the temperature sensor is included in the components of the electronic device).
  • the temperature sensor may be separately arranged on the main board of the electronic device (the main board shown in FIG. 4 ). It should be noted that the position of the temperature sensor on the main board can be set according to actual needs, which is not limited in this embodiment of the present application.
  • the temperature sensor can be arranged near the electronic device, so as to detect the temperature of the electronic device.
  • a plurality of electronic devices including a display screen, a processor, and an audio amplifier are taken as an example for illustration.
  • the electronic device may further include a first temperature sensor, a second temperature sensor, and a third temperature sensor.
  • the first temperature sensor is used to detect the temperature data of the display screen
  • the second temperature sensor is used to detect the temperature data of the processor
  • the third temperature sensor is used to detect the temperature data of the audio amplifier.
  • the first temperature sensor is arranged near the display screen, so as to detect the temperature data of the display screen;
  • the second temperature sensor is arranged near the processor, so as to detect the temperature data of the processor;
  • the temperature sensor is arranged near the audio amplifier so as to detect the temperature data of the audio amplifier.
  • setting the temperature sensor near the electronic device means that the distance between the temperature sensor and the electronic device is less than or equal to a preset distance.
  • the preset distance may be set according to specific needs, which is not limited in this embodiment of the present application.
  • the identification of the corresponding electronic device is stored in the temperature sensor. After the temperature sensor detects the temperature of the electronic device, the electronic device can determine the electronic device corresponding to the temperature detected by the temperature sensor according to the identifier of the electronic device stored in the temperature sensor.
  • the identifier of the display screen is stored in the first temperature sensor, such as LCD_them; the identifier of the processor is stored in the second temperature sensor, such as CPU_them; the audio frequency is stored in the third temperature sensor
  • An identifier of the amplifier for example, the identifier may be SmartPA_them.
  • Fig. 10 is a schematic flow chart of a leakage detection method for an electronic device provided in an embodiment of the present application. As shown in Fig. 10, when the electronic device is performing a task, in the application scenario corresponding to the task, the electronic device performs steps S301- S304. It should be understood that temperature contours of each electronic device in different application scenarios are stored in the electronic device.
  • the electronic device acquires a temperature of a target electronic device in a target application scenario.
  • the target application scenario is an application scenario corresponding to a task currently executed by the electronic device (such as a target task); the target electronic device is any one of multiple electronic devices.
  • the target application scene may be, for example, an audio scene, a game scene, and the like.
  • the electronic device detects the temperature of the electronic device through a temperature sensor.
  • a temperature sensor On this basis, multiple temperature sensors are provided in the electronic device, and one temperature sensor corresponds to one electronic device.
  • the electronic device can detect the temperature of its corresponding target electronic device through a temperature sensor.
  • the electronic device when the target electronic device is a display screen, the electronic device detects the temperature of the display screen through the first temperature sensor; when the target electronic device is a processor, the electronic device detects the temperature of the processor through the second temperature sensor. Temperature: when the target electronic device is an audio amplifier, the electronic device detects the temperature of the audio amplifier through the third temperature sensor.
  • the electronic device determines a preset temperature value of a target electronic device in a target application scenario.
  • the electronic device determines the temperature of the audio amplifier according to the temperature contour line around the audio amplifier and the position information of the target temperature sensor in the audio scene. Preset temperature value.
  • the target temperature sensor is a temperature sensor for detecting the target electronic device.
  • the target temperature sensor is the third temperature sensor described in the above embodiment.
  • the temperature contour of the audio amplifier here is: the temperature contour established when the audio amplifier is normal.
  • the temperature contour of the audio amplifier is the temperature contour shown in (a) of FIG. 7 .
  • the preset temperature value of the audio amplifier is determined according to the position information of the target temperature sensor.
  • the position information of the target temperature sensor refers to the position where the target temperature sensor is arranged around the audio amplifier.
  • the preset of the audio amplifier is the temperature marked on the temperature contour coincident with the position of the target sensor (eg, 50° C.).
  • the preset temperature value of the audio amplifier is close to the center position of the target sensor
  • the temperature marked on the temperature contour line eg 60°C.
  • the electronic device determines that a current leakage occurs in the target electronic device.
  • the preset temperature value is 50° C.
  • the temperature of the target electronic device is 51° C., it is determined that the target electronic device has electric leakage.
  • the electronic device performs target processing on the target electronic device.
  • the target treatment is used to eliminate the leakage of the target electronic device.
  • the target processing includes one or more of reducing the refresh rate of the display screen, reducing the image quality, reducing the brightness of the backlight, reducing the frequency of the processor, reducing the load of the electronic device, reducing the power of the electronic device or reducing the volume processing type.
  • the target process may be, for example, a reset operation.
  • the electronic device may select corresponding target processing according to the target application scenario and the target electronic device. That is to say, in the same application scenario, different electronic devices can choose different target processing.
  • the target processing may be, for example, one or more types of processing in which the refresh rate is reduced, the image quality is reduced, and the brightness of the backlight is reduced; when the electronic device is a CPU, The target processing may be, for example, to reduce the CPU frequency (or unplug the core).
  • the electronic device may also select different processing types of the target processing according to the preset temperature value, that is, the processing types of the target processing are also different for different preset temperature values.
  • the processing granularity of the target processing type is also different.
  • the target processing when the preset temperature value (or target temperature value) is in the first interval, the target processing includes M types of processing; when the preset temperature value is in the second interval, the target processing includes N type of processing; where. M and N are positive integers.
  • the interval is only used as an illustration in the embodiments of the present application, and does not constitute a limitation to the present application. Wherein, the interval can also be replaced with other descriptions such as "mode” or "level".
  • the maximum value of the first interval is smaller than the minimum value of the second interval; that is, the preset temperature value in the second interval is higher than the preset temperature value in the first interval.
  • the range of the interval may be, for example, [25°C, 70°C]; wherein, the first interval may be, for example, [25°C, 45°C]; the second interval may be, for example, [46°C, 70°C].
  • M is less than N when the maximum value of the first interval is less than the minimum value of the second interval. That is, the smaller the preset temperature value, the fewer processing types of the corresponding target processing; correspondingly, the larger the preset temperature value, the more processing types of the corresponding target processing.
  • the target processing may include reducing the brightness of the backlight; when the preset temperature value is 45°C, the target processing may include reducing the brightness of the backlight and reducing the image quality .
  • the target processing may include reducing the brightness of the backlight by 60%; when the preset temperature value is 45°C, the target processing may include reducing the brightness of the backlight by 90% and reducing image quality. It can be seen that although M is smaller than N, the processing granularity of the M processing types is greater than that of the N processing types.
  • the M processing types are the same as the N processing types; wherein, among the N processing types, the processing granularity of at least one processing type is greater than The processing granularity of the corresponding processing type in the processing type in M.
  • the target processing includes N (for example, two) processing types (such as reducing backlight brightness and reducing image quality); when the preset temperature value When the temperature is 35° C., the target processing includes M (for example, two) types of processing (such as reducing backlight brightness and reducing image quality).
  • the target treatment includes reducing the brightness of the backlight ⁇ 90 %; when the preset temperature value is 35°C, the target processing includes reducing the brightness of the backlight ⁇ 90%.
  • the target processing corresponding to different electronic devices at different preset temperature values can be referred to as shown in Table 1 below.
  • Table 1 uses a game scene and an audio scene as examples for illustration.
  • the target electronic devices are, for example, a display screen and a CPU; in an audio scenario, the target electronic devices are, for example, a CPU and an audio amplifier.
  • the target processing is to reduce the refresh rate.
  • the target processing is to reduce the image quality.
  • the preset temperature value of the display screen is 35°C
  • the target processing is to reduce the brightness of the backlight to 90%.
  • the preset temperature value of the display screen is 40°C
  • the target processing is to reduce the brightness of the backlight to 80%.
  • the target processing is to reduce the brightness of the backlight to 70%.
  • the preset temperature value of the display screen is 50° C.
  • the electronic device triggers a pop-up window warning.
  • the pop-up window warning is used to prompt the user that the electronic equipment fails.
  • the pop-up window warning may be: whether the electronic device fails, whether to exit the application.
  • the pop-up warning is: the current temperature of the electronic device is too high and cannot continue to work.
  • the electronic device can perform target processing on the target electronic device to solve the problem of electric leakage of the target electronic device.
  • the electronic device Show instructions (such as triggering a popup alert).
  • the electronic device displays indication information (such as triggering a pop-up window warning).
  • the indication information is used to prompt the user that the electronic device does not support the continuation of the target task; or, the indication information is used to prompt the user whether to end the target task.
  • the electronic device when the preset temperature value is greater than or equal to 50° C., the electronic device triggers a pop-up window warning.
  • the preset times can be set according to actual needs, and the embodiment of the present application does not specifically limit the preset times.
  • the preset number of times may be 3 times, 4 times or more than 5 times.
  • the electronic device can trigger a pop-up window warning to remind the user that the CPU temperature is too high and the game cannot be continued.
  • the pop-up warning is: CPU temperature is too high, the game cannot continue, do you want to exit the application?
  • the user clicks the "exit” control the electronic device exits the application; when the user clicks the "cancel” control, the user can continue the game.
  • the electronic device when the number of consecutive clicks on the "cancel" control by the electronic device is greater than a threshold (or called the second preset number of times) (eg, 3 times), the electronic device can automatically exit the application. Alternatively, the electronic device triggers a shutdown mode, so that the electronic device enters a shutdown state.
  • a threshold or called the second preset number of times
  • the electronic device compares the temperature of the target electronic device with the preset temperature value by detecting the temperature of the target electronic device, and if the temperature of the target electronic device is greater than or equal to the preset temperature value, Then it is determined that the target electronic device has a leakage problem. In this way, not only the time and manpower required for detecting electric leakage of electronic devices are saved, but also the detection efficiency is improved.
  • the electronic device may also perform targeted processing on the target electronic device to solve the leakage problem of the target electronic device.
  • FIG. 13 is a schematic flowchart of a method for detecting electric leakage of an electronic device provided by an embodiment of the present application. Exemplarily, the method includes S401-S403.
  • the leakage detection method of an electronic device provided in the embodiment of the present application is applied to an electronic device, and the electronic device includes a plurality of first electronic devices and a plurality of second electronic devices, and the second electronic device is used to detect the leakage of the first electronic device.
  • Temperature the electronic device also stores temperature distribution information of each first electronic device, and the temperature distribution information is used to indicate multiple temperature reference values at different positions on the first electronic device when the electronic device performs a target task.
  • the plurality of first electronic devices may be, for example, the plurality of electronic devices described in the above embodiments (such as processors, fast charging chips, flash memory, Bluetooth chips, audio amplifiers and power amplifiers, etc.);
  • the second electronic device can be, for example, the multiple temperature sensors described in the above embodiments.
  • the temperature distribution information may be, for example, the temperature coordinate system described in the above embodiments or a temperature contour line (or a temperature contour map).
  • the temperature contour map includes multiple closed curves, and the temperature reference values on the same closed curve are the same.
  • the electronic device or the target temperature sensor measures the target temperature value at the target position of the first electronic device.
  • the target temperature sensor is one of the multiple second electronic devices.
  • the target task may be any one of the different tasks performed by the electronic device in the foregoing embodiments.
  • the target task may be a game task (ie, a game task performed by the electronic device); or an audio playback task (ie, an audio playback task performed by the electronic device).
  • the application scenarios of electronic devices corresponding to different target tasks are different.
  • the application scenario of the electronic device may be, for example, the target application scenario described in the foregoing embodiments.
  • the target position is the position where the target temperature sensor is located.
  • the target temperature sensor is used to detect the temperature of the first electronic device, therefore, the target temperature value detected by the target temperature sensor at the target position is the target temperature value at a certain position of the first electronic device.
  • the first electronic device here may be, for example, the target electronic device described in the foregoing embodiments.
  • the target temperature sensor may be disposed inside the first electronic device (ie, the components of the first electronic device include the target temperature sensor); in this case, the target position is the position where the target temperature sensor is disposed inside the electronic device.
  • the target temperature sensor can also be arranged in the vicinity of the first electronic device (that is, the target temperature sensor is not included in the components of the first electronic device); Location.
  • the corresponding target temperature sensors for detecting the first electronic devices are also different.
  • the target temperature sensor when the first electronic device is a display screen, the target temperature sensor is the first temperature sensor; when the first electronic device is a processor, the target temperature sensor is the second temperature sensor; When the electronic device is an audio amplifier, the target temperature sensor is the third temperature sensor.
  • the electronic device determines a target temperature reference value corresponding to the target position from the temperature distribution information of the first electronic device.
  • target temperature reference value here may be, for example, the preset temperature value described in the above-mentioned embodiments.
  • the target temperature The reference value is a temperature reference value on a closed curve in which the target position is close to two adjacent closed curves.
  • the target temperature reference value is the target position (ie, the position where the target temperature sensor is located) Close to the temperature reference value (such as 60°C) on the closed curve among the two adjacent non-drinking curves.
  • the target temperature reference value is the temperature reference value at the target position.
  • the electronic device may obtain the temperature reference value at the target position through interpolation calculation according to the temperature reference values on two adjacent closed curves, so as to determine the temperature reference value at the target position as the target temperature reference value.
  • the target temperature reference value is a temperature reference value on the closed curve.
  • the target temperature reference value is the temperature reference value on the closed curve.
  • the electronic device determines that the first electronic device is leaking electricity.
  • the first threshold may be set according to specific needs, and the embodiment of the present application does not limit the first threshold.
  • the first threshold is, for example, equal to zero, that is, the target temperature value is equal to the target temperature reference value.
  • the electronic device includes a plurality of first electronic devices and a plurality of second electronic devices, and the second electronic device is used to detect the temperature of the first electronic device; when the electronic device performs a target task, the electronic device obtains the target temperature The target temperature value at the target position of the first electronic device measured by the sensor; the target temperature sensor is one of the multiple second electronic devices; since the electronic device stores temperature distribution information of each first electronic device , the temperature distribution information is used to indicate multiple temperature reference values at different positions on the first electronic device when the electronic device performs the target task; therefore, the electronic device can determine the corresponding temperature of the target position from the temperature distribution information of the first electronic device.
  • the target temperature reference value when the difference between the target temperature value and the target temperature reference value is greater than or equal to the first threshold, the electronic device determines that the first electronic device is leaking, so that the device that has a leakage problem in the electronic device can be detected, and then can Reduce detection cost and improve detection efficiency.
  • An embodiment of the present application provides an electronic device, the electronic device includes a plurality of electronic devices and a plurality of temperature sensors; the temperature sensor is used to detect the temperature of the electronic device; the plurality of electronic devices include a display screen, a memory, and one or more processors ; Computer program codes are stored in the memory, and the computer program codes include computer instructions. When the computer instructions are executed by the processor, the electronic device can execute various functions or steps performed by the electronic device in the above-mentioned embodiments. For the structure of the electronic device, reference may be made to the structure of the electronic device 100 shown in FIG. 1 .
  • the embodiment of the present application further provides a chip system, as shown in FIG. 14 , the chip system 1800 includes at least one processor 1801 and at least one interface circuit 1802 .
  • the processor 1801 may be the processor 110 shown in FIG. 1 in the foregoing embodiment.
  • the interface circuit 1802 may be, for example, an interface circuit between the processor 110 and the external memory 120 ; or an interface circuit between the processor 110 and the internal memory 121 .
  • the above-mentioned processor 1801 and the interface circuit 1802 may be interconnected through lines.
  • interface circuit 1802 may be used to receive signals from other devices, such as memory of an electronic device.
  • the interface circuit 1802 may be used to send signals to other devices (such as the processor 1801).
  • the interface circuit 1802 can read instructions stored in the memory, and send the instructions to the processor 1801 .
  • the electronic device may be made to perform various steps performed by the electronic device in the foregoing embodiments.
  • the chip system may also include other discrete devices, which is not specifically limited in this embodiment of the present application.
  • An embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium includes computer instructions, and when the computer instructions are run on an electronic device, the electronic device is made to perform the steps performed by the electronic device in the above-mentioned method embodiments. individual functions or steps.
  • An embodiment of the present application further provides a computer program product, which, when running on a computer, causes the computer to execute the various functions or steps performed by the electronic device in the above method embodiments.
  • the disclosed devices and methods may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components can be Incorporation or may be integrated into another device, or some features may be omitted, or not implemented.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
  • the unit described as a separate component may or may not be physically separated, and the component displayed as a unit may be one physical unit or multiple physical units, that is, it may be located in one place, or may be distributed to multiple different places . Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.
  • the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a readable storage medium.
  • the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the software product is stored in a storage medium Among them, several instructions are included to make a device (which may be a single-chip microcomputer, a chip, etc.) or a processor (processor) execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage medium includes: various media that can store program codes such as U disk, mobile hard disk, read only memory (ROM), random access memory (random access memory, RAM), magnetic disk or optical disk.

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Abstract

一种电子器件的漏电检测方法、电子设备及存储介质，能够减少检测电子器件漏电的检测成本以及提高检测效率，该方法包括：当电子设备执行目标任务时，电子设备获取目标温度传感器测得的第一电子器件的目标位置处的目标温度值（S401）；目标温度传感器为多个第二电子器件中的其中一个电子器件；电子设备从第一电子器件的温度分布信息中，确定目标位置对应的目标温度参考值（S402）；当目标温度值与目标温度参考值的差值大于或等于第一阈值时，电子设备确定第一电子器件漏电（S403）。

Description

一种电子器件的漏电检测方法、电子设备及存储介质
本申请要求于2022年02月22日提交国家知识产权局、申请号为202210164991.1、发明名称为“一种电子器件的漏电检测方法、电子设备及存储介质”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端技术领域，尤其涉及一种电子器件的漏电检测方法、电子设备及存储介质。
背景技术
随着电子技术的发展，手机、平板电脑等电子设备的功能越来越强大，使得电子设备的内部集成了大量的电子器件，各个电子器件相互配合工作以实现电子设备的功能。但是，当电子设备中的某一个电子器件发生漏电时，若不及时准确的检测出发生漏电的电子器件，不仅会影响电子设备的性能和寿命，也会影响电子设备的续航时间。相关技术中，在检测发生漏电的电子器件时，受限于电子设备的硬件结构，需要维修人员通过拆壳或者破坏电子设备的硬件的方式来进行检测。这种传统的人工检修方式不仅耗时耗力，而且效率低下。
发明内容
本申请实施例提供一种电子器件的漏电检测方法、电子设备及存储介质，能够减少检测电子器件漏电的检测成本以及提高检测效率。
本申请的实施例采用如下技术方案：
第一方面，提供一种电子器件的漏电检测方法，应用于电子设备，电子设备包括多个第一电子器件和多个第二电子器件，第二电子器件用于检测第一电子器件的温度；电子设备存储有每个第一电子器件的温度分布信息，温度分布信息用于指示电子设备在执行目标任务时，第一电子器件上不同位置处的多个温度参考值；该方法包括：当电子设备执行目标任务时，电子设备获取目标温度传感器测得的第一电子器件的目标位置处的目标温度值；目标温度传感器为多个第二电子器件中的其中一个电子器件；电子设备从第一电子器件的温度分布信息中，确定目标位置对应的目标温度参考值；当目标温度值与目标温度参考值的差值大于或等于第一阈值时，电子设备确定第一电子器件漏电。
基于第一方面，电子设备包括多个第一电子器件和多个第二电子器件，第二电子器件用于检测第一电子器件的温度；当电子设备执行目标任务时，电子设备获取目标温度传感器测得的第一电子器件的目标位置处的目标温度值；目标温度传感器为多个第二电子器件中的其中一个电子器件；由于电子设备中存储有每个第一电子器件的温度分布信息，该温度分布信息用于指示电子设备在执行目标任务时，第一电子器件上不同位置处的多个温度参考值；因此电子设备可以从第一电子器件的温度分布信息中，确定目标位置对应的目标温度参考值；当目标温度值与目标温度参考值的差值大于或 等于第一阈值时，电子设备确定第一电子器件漏电，从而能够检测出电子设备中发生漏电问题的器件，进而能够减少检测成本以及提高检测效率。
在第一方面的一种可能的实现方式中，温度分布信息为温度等高线图，温度等高线图包括多条闭合曲线，同一条闭合曲线上的温度参考值相同；电子设备从第一电子器件的温度分布信息中，确定目标位置对应的目标温度参考值，包括：当目标位置位于相邻两条闭合曲线之间时，目标温度参考值为目标位置靠近相邻两条闭合曲线中的闭合曲线上的温度参考值；或者，当目标位置位于相邻两条闭合曲线之间时，电子设备根据相邻两条闭合曲线上的温度参考值确定目标温度参考值；或者，当目标位置与闭合曲线重合时，目标温度参考值为闭合曲线上的温度参考值。
在该设计方式中，由于温度分布信息为温度等高线图，温度等高线图包括多条闭合曲线，同一条闭合曲线上的温度参考值相同，因此电子设备可以从第一电子器件的温度等高线图中确定目标位置对应的目标温度参考值，能够提高检测电子器件漏电的准确性。
在第一方面的一种可能的实现方式中，温度等高线图为电子设备在正常情况下，预先执行至少一次目标任务后建立的。
在该设计方式中，由于温度等高线图为电子设备在正常情况下，预先执行至少一次目标任务后建立的，即当电子设备在正常情况下，预先得到每个电子器件的多个温度参考值；而后，电子设备根据正常情况下测得的温度参考值与电子设备的执行目标任务时实际测得的目标温度值进行对比，确定第一电子器件是否漏电，从而能够进一步提高检测电子器件漏电的准确性。
在第一方面的一种可能的实现方式中，该方法还包括：当电子设备确定第一电子器件漏电时，电子设备对第一电子器件进行目标处理；目标处理用于消除第一电子器件的漏电。
在该设计方式中，当电子设备确定第一电子器件漏电时，电子设备对第一电子器件进行目标处理，由于目标处理用于消除第一电子器件的漏电，即电子设备检测出第一电子器件漏电的情况下，对该第一电子器件产生的漏电进行消除，提高了第一电子器件的使用寿命，有利于保护电子设备。
在第一方面的一种可能的实现方式中，目标处理包括：降低显示屏的刷新率、降低画质、减少背光亮度、降低处理器的频率、降低第一电子器件的负载、降低第一电子器件的功率或者减小音量中的一种或多种处理类型。
在第一方面的一种可能的实现方式中，该方法还包括：当目标温度值在第一区间时，目标处理包括M种处理类型；当目标处理在第二区间时，目标处理包括N种处理类型；第一区间的最大值小于第二区间的最小值，M小于N；或者，第一区间的最大值小于第二区间的最小值，M种处理类型与N种处理类型相同，N种处理类型中，至少一个处理类型的处理粒度大于M种处理类型中对应处理类型的处理粒度；其中，M、N为正整数。
在该设计方式中，当目标温度值在第一区间时，目标处理包括M种处理类型；当目标处理在第二区间时，目标处理包括N种处理类型；由于第一区间的最大值小于第二区间的最小值，即目标温度值在第一区间时，目标温度值较低；目标温度值在第二 区间时，目标温度值较高，在此情况下，M小于N，即目标温度值较低时，目标处理包括的处理类型的数量较小；有利于减少设备功耗；或者，在M种处理类型与N种处理类型相同的情况下，N种处理类型中，至少一个处理类型的处理粒度大于M种处理类型中对应处理类型的处理粒度，即目标温度值较高时，N中处理类型中至少有一个处理类型的处理粒度大于M种处理类型中对应处理类型的处理粒度，有利于进一步消除第一电子器件的漏电。
在第一方面的一种可能的实现方式中，该方法还包括：当电子设备对第一电子器件进行目标处理的处理次数大于或等于第一预设次数时，且当电子设备未消除第一电子器件的漏电时，电子设备显示指示信息；指示信息用于向用户提示电子设备不支持继续执行目标任务；或者，指示信息用于向用户提示是否结束目标任务。
在该设计方式中，当电子设备对第一电子器件进行目标处理的处理次数大于或等于第一预设次数时，且当电子设备未消除第一电子器件的漏电时，电子设备显示指示信息；由于指示信息用于向用户提示电子设备不支持继续执行目标任务；或者，指示信息用于向用户提示是否结束目标任务，这样一来，用户可以根据指示信息确定电子设备发生故障，提高了用户体验。
在第一方面的一种可能的实现方式中，该方法还包括：当目标温度参考值大于或等于第二阈值时，电子设备显示指示信息；指示信息用于向用户提示电子设备不支持继续执行目标任务；或者，指示信息用于向用户提示是否结束目标任务。
在该设计方式中，当目标温度参考值大于或等于第二阈值时，电子设备显示指示信息；而当目标温度参考值越大时，若目标温度值依然大于目标温度参考值，则电子设备确定第一电子器件一定发生漏电问题，并且第一电子器件的漏电较为严重；在此情况下，电子设备通过指示信息向用户提示电子设备发生故障，提高了用户体验。
在第一方面的一种可能的实现方式中，该方法还包括：电子设备响应于用户的确认操作，结束目标任务；或者，电子设备响应于用户的取消操作，继续执行目标任务。
在该设计方式中，电子设备响应于用户的确认操作，结束目标任务；或者，电子设备响应于用户的取消操作，继续执行目标任务，即用户可以根据指示信息确认结束目标任务还是继续执行目标任务，有利于进一步提高用户体验。
在第一方面的一种可能的实现方式中，该方法还包括：当用户的取消操作的次数大于或等于第二预设次数时，电子设备自动结束所述目标任务；或者，当用户的取消操作的次数大于或等于第二预设次数时，所述电子设备自动关机。
在该设计方式中，当用户的取消操作的次数大于或等于第二预设次数时，电子设备自动结束目标任务；或者电子设备自动关机，从而避免了由于第一电子器件发生漏电产生的不安全问题，有利于保护用户自身安全。
第二方面，提供一种电子设备，该电子设备具有实现上述第一方面所述的功能。该功能可以通过硬件实现，也可以通过硬件执行相应的软件实现。该硬件或软件包括一个或多个与上述功能相对应的模块。
第三方面，提供一种电子设备，该电子设备包括多个第一电子器件和多个第二电子器件；第二电子器件用于检测第一电子器件的温度；多个第一电子器件包括显示屏、存储器和一个或多个处理器；显示屏、存储器和处理器耦合；存储器用于存储计算机 程序代码和每个第一电子器件的温度分布信息，温度分布信息用于指示电子设备在执行目标任务时，第一电子器件上不同位置处的多个温度参考值；计算机程序代码包括计算机指令；当处理器执行计算机指令时，使得电子设备执行如下步骤：当电子设备执行目标任务时，电子设备获取目标温度传感器测得的第一电子器件的目标位置处的目标温度值；目标温度传感器为多个第二电子器件中的其中一个电子器件；电子设备从第一电子器件的温度分布信息中，确定目标位置对应的目标温度参考值；当目标温度值与目标温度参考值的差值大于或等于第一阈值时，电子设备确定第一电子器件漏电。
在第三方面的一种可能的实现方式中，温度分布信息为温度等高线图，温度等高线图包括多条闭合曲线，同一条闭合曲线上的温度参考值相同；当处理器执行计算机指令时，使得电子设备具体执行如下步骤：当目标位置位于相邻两条闭合曲线之间时，目标温度参考值为目标位置靠近相邻两条闭合曲线中的闭合曲线上的温度参考值；或者，当目标位置位于相邻两条闭合曲线之间时，电子设备根据相邻两条闭合曲线上的温度参考值确定目标温度参考值；或者，当目标位置与闭合曲线重合时，目标温度参考值为闭合曲线上的温度参考值。
在第三方面的一种可能的实现方式中，温度等高线图为电子设备在正常情况下，预先执行至少一次目标任务后建立的。
在第三方面的一种可能的实现方式中，当处理器执行计算机指令时，使得电子设备还执行如下步骤：当电子设备确定第一电子器件漏电时，电子设备对第一电子器件进行目标处理；目标处理用于消除电子器件的漏电。
在第三方面的一种可能的实现方式中，目标处理包括：降低显示屏的刷新率、降低画质、减少背光亮度、降低处理器的频率、降低第一电子器件的负载、降低第一电子器件的功率或者减小音量中的一种或多种处理类型。
在第三方面的一种可能的实现方式中，当处理器执行计算机指令时，使得电子设备还执行如下步骤：当目标温度值在第一区间时，目标处理包括M种处理类型；当目标处理在第二区间时，目标处理包括N种处理类型；第一区间的最大值小于第二区间的最小值，M小于N；或者，第一区间的最大值小于第二区间的最小值，M种处理类型与N种处理类型相同，N种处理类型中，至少一个处理类型的处理粒度大于M种处理类型中对应处理类型的处理粒度；其中，M、N为正整数。
在第三方面的一种可能的实现方式中，当处理器执行计算机指令时，使得电子设备还执行如下步骤：当电子设备对第一电子器件进行目标处理的处理次数大于或等于第一预设次数时，且当电子设备未消除第一电子器件的漏电时，电子设备显示指示信息；指示信息用于向用户提示电子设备不支持继续执行目标任务；或者，指示信息用于向用户提示是否结束目标任务。
在第三方面的一种可能的实现方式中，当处理器执行计算机指令时，使得电子设备还执行如下步骤：当目标温度参考值大于或等于第二阈值时，电子设备显示指示信息；指示信息用于向用户提示电子设备不支持继续执行目标任务；或者，指示信息用于向用户提示是否结束目标任务。
在第三方面的一种可能的实现方式中，当处理器执行计算机指令时，使得电子设 备还执行如下步骤：电子设备响应于用户的确认操作，结束目标任务；或者，电子设备响应于用户的取消操作，继续执行目标任务。
在第三方面的一种可能的实现方式中，当处理器执行计算机指令时，使得电子设备还执行如下步骤：当用户的取消操作的次数大于或等于第二预设次数时，电子设备自动结束所述目标任务；或者，当用户的取消操作的次数大于或等于第二预设次数时，所述电子设备自动关机。
第四方面，提供了一种计算机可读存储介质，该计算机可读存储介质中存储有计算机指令，当计算机指令在计算机上运行时，使得计算机可以执行上述第一方面中任一项所述的电子器件的漏电检测方法。
第五方面，提供了一种包含指令的计算机程序产品，当该指令在计算机上运行时，使得计算机可以执行上述第一方面中任一项所述的电子器件的漏电检测方法。
其中，第二方面至第四方面中任一种设计方式所带来的技术效果可参见第一方面中不同设计方式所带来的技术效果，此处不再赘述。
附图说明
图1为本申请实施例提供的一种电子设备的硬件结构示意图；
图2为本申请实施例提供的一种电子设备的软件框架示意图；
图3为本申请实施例提供的一种电子设备正常时的温度与异常时的温度的对比示意图；
图4为本申请实施例提供的一种电子设备的主板的结构示意图；
图5为本申请实施例提供的一种不同应用场景下电子器件的温度对比示意图；
图6为本申请实施例提供的一种不同应用场景下建立各个电子器件温度等高线的示意图；
图7为本申请实施例提供的一种音频场景下音频放大器的温度等高线的示意图；
图8为本申请实施例提供的一种游戏场景下处理器的温度等高线的示意图；
图9为本申请实施例提供的一种电子器件与温度传感器的位置关系示意图；
图10为本申请实施例提供的一种电子器件的漏电检测方法的流程示意图一；
图11为本申请实施例提供的一种根据温度等高线图确定预设温度值的示意图；
图12为本申请实施例提供的一种显示弹窗警告的界面示意图；
图13为本申请实施例提供的一种电子器件的漏电检测方法的流程示意图二；
图14为本申请实施例提供的一种芯片系统的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述。其中，在本申请的描述中，除非另有说明，“/”表示前后关联的对象是一种“或”的关系，例如，A/B可以表示A或B；本申请中的“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况，其中A，B可以是单数或者复数。并且，在本申请的描述中，除非另有说明，“多个”是指两个或多于两个。“以下至少一项(个)”或其类似表达，是指的这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a，b，或c中的至少一项(个)，可以表示：a，b，c，a-b，a-c，b-c，或a-b-c，其中a，b， c可以是单个，也可以是多个。另外，为了便于清楚描述本申请实施例的技术方案，在本申请的实施例中，采用了“第一”、“第二”等字样对功能和作用基本相同的相同项或相似项进行区分。本领域技术人员可以理解“第一”、“第二”等字样并不对数量和执行次序进行限定，并且“第一”、“第二”等字样也并不限定一定不同。同时，在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念，便于理解。
本申请实施例提供一种电子器件的漏电检测方法，该方法应用于电子设备中。其中，电子设备可以为手机、运动相机(GoPro)、数码相机、平板电脑、桌面型、膝上型、手持计算机、笔记本电脑、车载设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本，以及蜂窝电话、个人数字助理(personal digital assistant，PDA)、增强现实(augmented reality，AR)\虚拟现实(virtual reality，VR)设备等，本申请实施例对该电子设备的具体形态不作特殊限制。
如图1所示，为电子设备100的一种硬件结构示意图。其中，电子设备100可以包括：处理器110，外部存储器接口120，内部存储器121，通用串行总线(universal serial bus，USB)接口130，充电管理模块140，电源管理模块141，电池142，天线1，天线2，移动通信模块150，无线通信模块160，音频模块170，扬声器170A，受话器170B，麦克风170C，耳机接口170D，传感器模块180，按键190，马达191，指示器192，摄像头193，显示屏194，以及用户标识模块(subscriber identification module，SIM)卡接口195等。其中，传感器模块180可以包括压力传感器180A，陀螺仪传感器180B，气压传感器180C，磁传感器180D，加速度传感器180E，距离传感器180F，接近光传感器180G，指纹传感器180H，温度传感器180J，触摸传感器180K，环境光传感器180L，骨传导传感器180M等。
可以理解的是，本实施例示意的结构并不构成对电子设备100的具体限定。在另一些实施例中，电子设备100可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。图示的部件可以以硬件，软件或软件和硬件的组合实现。
处理器110可以包括一个或多个处理单元，例如：处理器110可以包括应用处理器(application processor，AP)，调制解调处理器，图形处理器(graphics processing unit，GPU)，图像信号处理器(image signal processor，ISP)，控制器，存储器，视频编解码器，数字信号处理器(digital signal processor，DSP)，基带处理器，和/或神经网络处理器(neural-network processing unit，NPU)等。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。
控制器可以是电子设备100的神经中枢和指挥中心。控制器可以根据指令操作码和时序信号，产生操作控制信号，完成取指令和执行指令的控制。
处理器110中还可以设置存储器，用于存储指令和数据。在一些实施例中，处理器110中的存储器为高速缓冲存储器。该存储器可以保存处理器110刚用过或循环使用的指令或数据。如果处理器110需要再次使用该指令或数据，可从所述存储器中直 接调用。避免了重复存取，减少了处理器110的等待时间，因而提高了系统的效率。
在一些实施例中，处理器110可以包括一个或多个接口。接口可以包括集成电路(inter-integrated circuit，I2C)接口，集成电路内置音频(inter-integrated circuit sound，I2S)接口，脉冲编码调制(pulse code modulation，PCM)接口，通用异步收发传输器(universal asynchronous receiver/transmitter，UART)接口，移动产业处理器接口(mobile industry processor interface，MIPI)，通用输入输出(general-purpose input/output，GPIO)接口，用户标识模块(subscriber identity module，SIM)接口，和/或通用串行总线(universal serial bus，USB)接口等。
可以理解的是，本实施例示意的各模块间的接口连接关系，只是示意性说明，并不构成对电子设备的结构限定。在另一些实施例中，电子设备也可以采用上述实施例中不同的接口连接方式，或多种接口连接方式的组合。
充电管理模块140用于从充电器接收充电输入。其中，充电器可以是无线充电器，也可以是有线充电器。在一些有线充电的实施例中，充电管理模块140可以通过USB接口130接收有线充电器的充电输入。在一些无线充电的实施例中，充电管理模块140可以通过电子设备的无线充电线圈接收无线充电输入。充电管理模块140为电池142充电的同时，还可以通过电源管理模块141为电子设备供电。
电源管理模块141用于连接电池142，充电管理模块140与处理器110。电源管理模块141接收电池142和/或充电管理模块140的输入，为处理器110，内部存储器121，外部存储器，显示屏194，摄像头193，和无线通信模块160等供电。电源管理模块141还可以用于监测电池容量，电池循环次数，电池健康状态(漏电，阻抗)等参数。在其他一些实施例中，电源管理模块141也可以设置于处理器110中。在另一些实施例中，电源管理模块141和充电管理模块140也可以设置于同一个器件中。
电子设备100的无线通信功能可以通过天线1，天线2，移动通信模块150，无线通信模块160，调制解调处理器以及基带处理器等实现。
电子设备100通过GPU，显示屏194，以及应用处理器等实现显示功能。GPU为图像处理的微处理器，连接显示屏194和应用处理器。GPU用于执行数学和几何计算，用于图形渲染。处理器110可包括一个或多个GPU，其执行程序指令以生成或改变显示信息。
显示屏194用于显示图像，视频等。该显示屏194包括显示面板(或称显示基板)。显示面板可以采用有机发光二极管(organic light-emitting diode，OLED)。在本申请实施例中，显示屏为LTPO显示屏；LTPO显示屏包括的显示面板中的显示单元(如TFT)为LTPO TFT。其中，对于LTPO的举例说明可以参考上述实施例，此处不再一一赘述。
电子设备100可以通过ISP，摄像头193，视频编解码器，GPU，显示屏194以及应用处理器等实现拍摄功能。
ISP用于处理摄像头193反馈的数据。例如，拍照时，打开快门，光线通过镜头被传递到摄像头感光元件上，光信号转换为电信号，摄像头感光元件将所述电信号传递给ISP处理，转化为肉眼可见的图像。ISP还可以对图像的噪点，亮度，肤色进行算法优化。ISP还可以对拍摄场景的曝光，色温等参数优化。在一些实施例中，ISP可 以设置在摄像头193中。
摄像头193用于捕获静态图像或视频。物体通过镜头生成光学图像投射到感光元件。感光元件可以是电荷耦合器件(charge coupled device，CCD)或互补金属氧化物半导体(complementary metal-oxide-semiconductor，CMOS)光电晶体管。感光元件把光信号转换成电信号，之后将电信号传递给ISP转换成数字图像信号。ISP将数字图像信号输出到DSP加工处理。DSP将数字图像信号转换成标准的RGB，YUV等格式的图像信号。在一些实施例中，电子设备可以包括1个或N个摄像头193，N为大于1的正整数。
数字信号处理器用于处理数字信号，除了可以处理数字图像信号，还可以处理其他数字信号。例如，当电子设备在频点选择时，数字信号处理器用于对频点能量进行傅里叶变换等。
视频编解码器用于对数字视频压缩或解压缩。电子设备100可以支持一种或多种视频编解码器。这样，电子设备可以播放或录制多种编码格式的视频，例如：动态图像专家组(moving picture experts group，MPEG)1，MPEG2，MPEG3，MPEG4等。
NPU为神经网络(neural-network，NN)计算处理器，通过借鉴生物神经网络结构，例如借鉴人脑神经元之间传递模式，对输入信息快速处理，还可以不断的自学习。通过NPU可以实现电子设备的智能认知等应用，例如：图像识别，人脸识别，语音识别，文本理解等。
电子设备100可以通过音频模块170，扬声器170A，受话器170B，麦克风170C，耳机接口170D，以及应用处理器等实现音频功能。例如音乐播放，录音等。
音频模块170用于将数字音频信息转换成模拟音频信号输出，也用于将模拟音频输入转换为数字音频信号。音频模块170还可以用于对音频信号编码和解码。在一些实施例中，音频模块170可以设置于处理器110中，或将音频模块170的部分功能模块设置于处理器110中。扬声器170A，也称“喇叭”，用于将音频电信号转换为声音信号。受话器170B，也称“听筒”，用于将音频电信号转换成声音信号。麦克风170C，也称“话筒”，“传声器”，用于将声音信号转换为电信号。
耳机接口170D用于连接有线耳机。耳机接口170D可以是USB接口130，也可以是3.5mm的开放移动电子设备平台(open mobile terminal platform，OMTP)标准接口，美国蜂窝电信工业协会(cellular telecommunications industry association of the USA，CTIA)标准接口。
外部存储器接口120可以用于连接外部存储卡，例如Micro SD卡，实现扩展电子设备的存储能力。外部存储卡通过外部存储器接口120与处理器110通信，实现数据存储功能。例如将音频，视频等文件保存在外部存储卡中。
内部存储器121可以用于存储计算机可执行程序代码，所述可执行程序代码包括指令。处理器110通过运行存储在内部存储器121的指令，从而执行电子设备的各种功能应用以及数据处理。例如，在本申请实施例中，处理器110可以通过执行存储在内部存储器121中的指令，内部存储器121可以包括存储程序区和存储数据区。
其中，存储程序区可存储操作系统，至少一个功能所需的应用程序(比如声音播放功能，图像播放功能等)等。存储数据区可存储电子设备使用过程中所创建的数据 (比如音频数据，电话本等)等。此外，内部存储器121可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件，闪存器件，通用闪存存储器(universal flash storage，UFS)等。
按键190包括开机键，音量键等。按键190可以是机械按键。也可以是触摸式按键。马达191可以产生振动提示。马达191可以用于来电振动提示，也可以用于触摸振动反馈。指示器192可以是指示灯，可以用于指示充电状态，电量变化，也可以用于指示消息，未接来电，通知等。SIM卡接口195用于连接SIM卡。SIM卡可以通过插入SIM卡接口195，或从SIM卡接口195拔出，实现和电子设备的接触和分离。电子设备可以支持1个或N个SIM卡接口，N为大于1的正整数。SIM卡接口195可以支持Nano SIM卡，Micro SIM卡，SIM卡等。
在一些实施例中，电子设备100的软件系统可以采用分层架构，事件驱动架构，微核架构，微服务架构或云架构。本发明实施例以分层架构的Android系统为例，示例性的说明电子设备100的软件架构。
图2为本申请实施例的电子设备100的软件结构框图。
分层架构将软件分成若干个层，每一层都有清晰的角色和分工。层与层之间通过软件接口通信。在一些实施例中，将Android系统分为四层，从上至下分别为应用程序层，应用程序框架层，安卓运行时(Android runtime)和系统库，以及内核层。
应用程序层可以包括一系列应用程序包。
如图2所示，应用程序包可以包括相机，图库，日历，通话，地图，导航，WLAN，蓝牙，音乐，视频，短信息和语音助手等应用程序。
应用程序框架层为应用程序层和应用程序提供应用编程接口(application programming interface，API)和编程框架。应用程序框架层包括一些预先定义的函数。
如图2所示，应用程序框架层可以包括窗口管理器，内容提供器，视图系统，电话管理器，资源管理器，通知管理器等。
窗口管理器用于管理窗口程序。窗口管理器可以获取显示屏大小，判断是否有状态栏，锁定屏幕，截取屏幕等。
内容提供器用来存放和获取数据，并使这些数据可以被应用程序访问。所述数据可以包括视频，图像，音频，拨打和接听电话，浏览历史和书签，电话薄等。
视图系统包括可视控件，例如显示文字的控件，显示图片的控件等。视图系统可用于构建应用程序。显示界面可以由一个或多个视图组成的。例如，包括短信通知图标的显示界面，可以包括显示文字的视图以及显示图片的视图。
电话管理器用于提供电子设备100的通信功能。例如通话状态的管理(包括接通，挂断等)。
资源管理器为应用程序提供各种资源，比如本地化字符，图标，图片，布局文件，视频文件等。
通知管理器使应用程序可以在状态栏中显示通知信息，可以用于传达告知类型的消息，可以短暂停留后自动消失，无需用户交互。比如通知管理器被用于告知下载完成，消息提醒等。通知管理器还可以是以图表或者滚动条文本形式出现在系统顶部状态栏的通知，例如后台运行的应用程序的通知，还可以是以对话窗口形式出现在屏幕 上的通知。例如在状态栏提示文本信息，发出提示音，电子设备振动，指示灯闪烁等。
Android Runtime包括核心库和虚拟机。Android Runtime负责安卓系统的调度和管理。
核心库包含两部分：一部分是java语言需要调用的功能函数，另一部分是安卓的核心库。
应用程序层和应用程序框架层运行在虚拟机中。虚拟机将应用程序层和应用程序框架层的java文件执行为二进制文件。虚拟机用于执行对象生命周期的管理，堆栈管理，线程管理，安全和异常的管理，以及垃圾回收等功能。
系统库可以包括多个功能模块。例如：表面管理器(surface manager)媒体库(Media Libraries)，三维图形处理库(例如：OpenGL ES)，2D图形引擎(例如：SGL)等。
表面管理器用于对显示子系统进行管理，并且为多个应用程序提供了2D和3D图层的融合。
媒体库支持多种常用的音频，视频格式回放和录制，以及静态图像文件等。媒体库可以支持多种音频编码格式，例如：MPEG4，H.264，MP3，AAC，AMR，JPG，PNG等。
三维图形处理库用于实现三维图形绘图，图像渲染，合成和图层处理等。
2D图形引擎是2D绘图的绘图引擎。
内核层是硬件和软件之间的层。内核层至少包含显示驱动，摄像头驱动，音频驱动，传感器驱动。
为了便于理解，首先对本申请实施例涉及到的相关技术进行描述。
目前，电子设备在生产过程中可能会由于一些原因(如软件管控不合理，或者硬件故障等)导致电子设备内集成的电子器件(或称第一电子器件)出现漏电问题。基于此，在相关技术中，电子设备一般会在以下两种情况下，对电子设备内集成的电子器件的漏电情况进行检测。一种情况下，电子设备在出厂前会进行电子器件的漏电检测。另一种情况下，当用户在使用电子设备的过程中，若用户发现电子设备在工作过程中出现异常(如耗电快，电子设备的温度过高等)，则用户会向该电子设备的厂商反馈异常问题，以使得厂商针对该异常问题会对电子设备内集成的电子器件进行漏电检测。
其中，漏电指的是电子器件由于自身故障原因或者软件管控不合理等其他原因引起的电流泄露(也可简称为漏电流)。
需要说明的是，由于电子器件为导体，而当电流通过导体时，导体会发热。这种由电流产生的热叫做电热，因此电子器件也可以称为电热元件。在一些实施例中，电热与通过电子器件的电流和电子器件的电阻(或称阻抗)有关。示例性的，电热与电流和电阻的关系满足如下公式：Q＝I 2×R×t。其中，Q为电热(单位为：V·A·S)，I为电流(单位为：A)，R为电阻(单位为：Ω)，t为时间(单位为：S)。
由上述公式可以看出，电子器件的电阻为一定值，而当流过电子器件的电流为一定值时，电热的大小与时间成正比。例如，当电子器件工作(即有电流流过电子器件)时，产生的电热随着时间的增加而增加。但是，当电子器件发生漏电问题时，即电子器件有电流泄露，这样一来，就会导致流过电子器件的电流增大，因此该电子器件产 生的电热就会增加。换言之，同一电子器件工作相同的时间(即时间t相等)，当该电子器件正常(即未发生漏电问题)时，那么流过该电子器件的电流即为一定值，并且产生的电热为Q1。当该电子器件异常(即发生漏电问题)时，那么流过该电子器件的电流就会增加，并且产生的电热为Q2。在同一电子器件工作相同的时间的情况下，当该电子器件发生漏电的问题时，由于流过该电子器件的电流增加，从而导致该电子器件产生的电热增加，即Q2大于Q1。
需要说明的是，由于电热产生是电流通过电子器件时，将电能转化为热能的过程，因此当电流通过电子器件时，电子器件会发热，即电子器件的温度会升高。并且由于异常(即发生漏电问题)的电子器件产生的电热大于正常(即未发生漏电)的电子器件产生的电热，因此当同一电子器件工作相同时间时，发生漏电情况下的电子器件的温度会高于未发生漏电情况下的电子器件的温度。
示例性的，如图3所示，电子器件在正常(即未发生漏电)的情况下，电子器件工作时长为t1时所产生的电热为Q1；而电子器件在异常(即发生漏电)的情况下，电子器件工作时长为t1时所产生的电热为Q2。其中，当电子器件产生的电热为Q1时，电子器件的温度为W1；当电子器件产生的电热为Q2时，电子器件的温度为W2。结合上述实施例可知，Q2大于Q1，因此W2也大于W1，即发生漏电的电子器件在工作时的温度高于未发生漏电的电子器件在工作时的温度。
基于此，本申请实施例提供一种电子器件的漏电检测方法，应用于电子设备中，该方法可以在不拆件、不破坏电子设备的硬件结构的前提下，智能识别出产生漏电问题的电子器件(或称第一电子器件)。示例性的，该方法能够在电子设备执行任务时，检测电子设备内集成的多个电子器件中的各个电子器件的温度，并将各个电子器件的温度(或称目标温度值)与预设温度值(或称目标温度参考值)进行对比，温度高于预设温度值的电子器件即为产生漏电问题的电子器件。这样一来，不仅节省了检测电子器件漏电时所需的时间和人力，而且还提高了检测效率。
在一些实施例中，当电子器件的温度与预设温度值的差值大于或等于第一阈值时，电子设备确定电子器件漏电。需要说明的是，第一阈值可以根据具体需要进行设置，本申请实施例对于第一阈值不作限定。在一些实施例中，第一阈值例如等于零，即电子器件的温度与预设温度值相等。
需要说明的是，本申请实施例中的电子器件可以是电子设备中能独立起控制变换作用的最小粒度的单元，也可以是多个元件组装起来的单元。在一些实施例中，多个电子器件例如可以包括显示屏(或称屏幕)、中央处理器(central processing unit，CPU)、音频放大器(SmartPA)以及调制解调器(modem)等。其中，音频放大器也可以称为智能功率放大器。需要说明的是，多个电子器件还可以包括电子设备的其他硬件结构或部件，此处不再一一列举，对于其他电子器件的举例说明可以参考上述实施例中图2所示的电子设备的硬件结构中的各个硬件。
下面将结合说明书附图，对本申请实施例提供的技术方案进行详细描述。
在一些实施例中，多个电子器件可以集成在电子设备的主板上。其中，主板是电子设备最基本同时也是最重要的组成部件之一；主板也可以称为主机板(mainboard)，系统板(systemboard)、或称母板(motherboard)。示例性的，如图4所示，主板200 可以包括处理器、快充芯片、闪存、蓝牙芯片、音频放大器以及功率放大器等电子器件。
应理解，当电流通过电子器件时，电子器件会发热，即电子器件的温度会升高。在一些实施例中，通过对电子器件的红外热像进行扫描，可以直观的看到电子设备内集成的多个电子器件的温度，这些温度会通过红外热像图直观的表现出来。示例性的，可以通过红外热像仪扫描电子器件得到红外热像图。其中，红外热像仪是利用红外探测器、光学成像物镜和光机扫描系统接收电子器件的红外辐射能量分布图形反映到红外探测器的光敏元上，在光学系统和红外探测器之间，有一个光机扫描机构对电子器件的红外热像进行扫描，并聚焦在单元或分光探测器上，由探测器将红外辐射能转换成电信号，经放大处理、转换或标准视频信号通过电视屏或检测器显示红外热像图。
仍如图4所示，主板200经过红外热像扫描之后，能够看到电子器件(如处理器、快充芯片、闪存、蓝牙芯片、音频放大器以及功率放大器等)的温度。由图4可以看出，电子器件(如处理器)的温度由内向外逐渐降低，即在处理器的周围，越靠近处理器的位置处的温度越高，反之，越远离处理器的位置处的温度越低。例如，在处理器中心位置的温度最高(如达到55℃)，而远离处理器中心位置的温度逐渐降低(如由55℃降低至25℃)。
另外，仍由图4可以看出，不同电子器件的温度也不相同。如处理器的最高温度最高(如高于55℃)，而快充芯片、闪存、蓝牙芯片、音频放大器以及功率放大器等电子器件的温度较低(如在55℃～25℃之间)。这是由于电子设备在执行任务时，多个电子器件工作过程中的分工不同，因此使得多个电子器件中的每个电子器件的温度不同。其中，多个电子器件在工作过程中的分工不同指的是，多个电子器件在工作过程中承担的任务量不同。因而使得多个电子器件中的每个电子器件的温度不同。例如，在图4所示的主板200中，由于处理器、快充芯片、闪存、蓝牙芯片、音频放大器以及功率放大器等电子器件的分工不同，即处理器、快充芯片、闪存、蓝牙芯片、音频放大器以及功率放大器等电子器件在工作过程中承担的任务量不同，因此导致这些电子器件的温度不同。如，处理器在工作过程中承担的任务量较大(如处理器主要承担算法部分)，因此处理器的温度较高。而快充芯片、闪存、蓝牙芯片、音频放大器以及功率放大器等电子器件在工作过程中承担的任务量较小(如仅承担辅助处理器运行算法的任务)，因此这些电子器件的问询相对较低。基于此，当通过红外热像仪对主板200进行扫描之后，所呈现出的红外热像图中，能够清楚的看到各个电子器件的不同温度。
需要说明的是，多个电子器件中每个电子器件在工作过程中所承担的任务量会根据电子设备执行的任务不同而发生改变。其中，当电子设备执行的任务不同时，电子设备的应用场景也不同。其中，电子设备的应用场景指的是用户使用电子设备实现某种功能时的场景。示例性的，当用户使用电子设备在玩游戏时，应用场景例如可以为游戏场景；当用户使用电子设备在播放音乐时，应用场景例如可以为音频场景。在一些实施例中，该应用场景也可以称为使用场景。另外，上述应用场景仅仅作为本申请实施例中的一种举例说明，并不构成对本申请的限定。例如，应用场景还可以为视频场景、浏览器场景等，此处不再一一列举。
由于多个电子器件的分工不同，因此多个电子器件在工作过程中所承担的任务量不同，因此多个电子器件的温度也会不同。示例性的，如图5所示，当应用场景为游戏场景时，即用户使用电子设备在玩游戏。在此情况下，处理器承担的任务量大于其他电子器件(如蓝牙芯片、功率放大器、音频放大器等)的任务量，因此，处理器的温度会高于其他电子器件的温度。当应用场景为音频场景时，即用户使用电子设备在播放音乐。在此情况下，音频放大器承担的任务量大于其他电子器件(如蓝牙芯片、功率放大器、处理器等)的任务量，因此，音频放大器的温度会高于其他电子器件的温度。
可以理解的是，同一电子器件，当电子设备的应用场景不同时，该电子器件的温度也不相同。以电子器件为处理器为例，例如，游戏场景下处理器的温度高于音频场景下处理器的温度。基于此，在本申请实施例中，通过检测各个电子器件的温度，并将各个电子器件的温度与预设温度值进行对比确定出发生漏电问题的电子器件时，对于预设温度值的确定需要结合电子设备的不同应用场景。换言之，本申请实施例中所提到的预设温度值是基于不同应用场景确定出来的。
在一些实施例中，预设温度值是由开发人员在设备调试初期，经过多次实验之后得到的数据。示例性的，在设备调试初期，开发人员可以模拟用户使用电子设备执行不同的任务(即使电子设备处于不同应用场景下)，通过采集并汇总得到不同应用场景下各个电子器件的预设温度值。
示例性的，开发人员可以模拟用户使用电子设备执行不同的任务，以模拟不同的应用场景，并通过红外热成像仪扫描不同应用场景下各个电子器件，得到不同应用场景下各个电子器件的红外热成像图。并对各个电子器件的红外热成像图进行处理，得到每个电子器件周围各个位置上的温度。在一些实施例中，开发人员可以基于每个电子器件周围各个位置上的温度，建立不同场景下每个电子器件的温度坐标系。其中，温度坐标系中每个坐标用于指示电子器件周围的一个位置。另外，每个坐标上标注的数字为该位置处的温度。在另一些实施例中，开发人员可以基于每个电子器件周围各个位置上的温度，建立不同场景下每个电子器件的温度等高线(或称温度等高线图)。其中，温度等高线指的是电子设备的主板上温度相等的相邻各点所连成的曲线。具体的，把主板面上温度相同的点连成的曲线，并垂直投影到一个水平面上，并按比例缩绘在图纸上，就得到了温度等高线。通常，该温度等高线可以形成为闭合曲线。其中，温度等高线也可以看作是不同高度的水平面与实际主板面的交线，所以温度等高线是闭合曲线。另外，在温度等高线上标注的数字为该温度等高线的温度。
在一些实施例中，温度等高线图为电子设备在正常情况下，预先执行至少一次目标任务后建立的。其中，电子设备在正常情况下指的是电子设备在出厂前(或者出厂后)，经过专业设备对电子设备的各个电子器件进行检测，检测完成后确定电子设备中各个电子器件为正常的。另外，在电子设备正常情况下，预先执行至少一次目标任务指的是：当确定电子设备正常时，在电子设备出厂前；或者在检测电子设备内集成的各个电子器件是否漏电之前，模拟用户执行至少一次目标任务。
例如，如图6所示，在游戏场景下，通过红外热成像仪扫描显示屏，并建立显示屏的温度等高线(如温度等高线a)；通过红外热成像仪扫描处理器，并建立处理器 的温度等高线(如温度等高线b)；通过红外热成像仪扫描音频放大器，并建立音频放大器的温度等高线(如温度等高线c)等。仍如图6所示，在音频场景下，通过红外热成像仪扫描显示屏，并建立显示屏的温度等高线(如温度等高线A)；通过红外热成像仪扫描处理器，并建立处理器的温度等高线(如温度等高线B)；通过红外热成像仪扫描音频放大器，并建立音频放大器的温度等高线(如温度等高线C)等。
应理解，由于应用场景不同，因此同一电子器件对应的温度等高线不完全相同。例如温度等高线a与温度等高线A不完全相同；温度等高线b与温度等高线B不完全相同；温度等高线c与温度等高线C不完全相同。
为了更加清楚准确的检测出发生漏电问题的电子器件，在一些实施例中，可以进一步将上述实施例中所述的应用场景进行细分。例如可以根据用户使用电子设备播放音频时的音量将音频场景细分为音频场景1、音频场景2以及音频场景3。其中，音频场景1例如可以为用户使用电子设备播放音频时的音量为[0％，35％]；音频场景2例如可以为用户使用电子设备播放音频时的音量为[36％，70％]；音频场景3例如可以为用户使用电子设备播放音频时的音量为[71％，100％]。在此基础上，可以分别在音频场景1、音频场景2以及音频场景3下，通过红外热成像仪扫描各个电子器件，并建立各个电子器件的温度等高线。
相应地，可以根据用户使用电子设备玩游戏时的游戏类别将游戏场景细分为游戏场景1、游戏场景2以及游戏场景3。示例性的，游戏场景1例如可以为用户使用电子设备玩休闲类游戏时的场景；游戏场景2例如可以为用户使用电子设备玩模拟类游戏时的场景；游戏场景3例如可以为用户使用电子设备玩其他类型游戏时的场景。在此基础上，可以分别在游戏场景1、游戏场景2以及游戏场景3下，通过红外热成像仪扫描各个电子器件，并建立各个电子器件的温度等高线。
需要说明的是，将应用场景细分后，根据不同应用场景建立各个电子器件的温度等高线的具体实施方式可以参考上述实施例以及图6所示，此处不再一一赘述。
以在音频场景下建立音频放大器的温度等高线为例进行示意，示例性的，在音频放大器正常(即未发生漏电)的情况下，音频放大器的温度等高线如图7中(a)所示。在音频放大器异常(即发生漏电)的情况下，音频放大器的温度等高线如图7中(b)所示。参考图7中(a)和图7中(b)所示，温度等高线为一闭合曲线，温度等高线上标注的数字为音频放大器周围的温度；可以看出，越靠近音频放大器的位置处的温度越高，反之，越远离音频放大器的位置处的温度越低。另外，对比图7中(a)和图7中(b)所示的温度等高线，发生漏电的音频放大器在同一位置处的温度明显高于未发生漏电的音频放大器在同一位置处的温度。
以在游戏场景下建立处理器的温度等高线为例进行示意，示例性的，在处理器正常(即未发生漏电)的情况下，处理器的温度等高线如图8中(a)所示。在处理器异常(即发生漏电)的情况下，处理器的温度等高线如图8中(b)所示。参考图8中(a)和图8中(b)所示，温度等高线为一闭合曲线，温度等高线上标注的数字为处理器周围的温度；可以看出，越靠近处理器的位置处的温度越高，反之，越远离处理器的位置处的温度越低。另外，对比图8中(a)和图8中(b)所示的温度等高线，发生漏电的处理器在同一位置处的温度明显高于未发生漏电的处理器在同一位置处的温度。
基于上述实施例，在开发人员模拟用户使用电子设备执行不同任务(不同任务对应不同的应用场景)的情况下，根据红外热成像仪扫描得到不同场景下各个电子器件的红外热成像图，建立不同场景下各个电子器件的温度等高线。而后，将不同场景下各个电子器件的温度等高线存储在电子设备中。换言之，在设备调试初期，设备中已经存储有不同场景下各个电子器件的温度等高线。其中，温度等高线上标注的数字均可以作为本申请实施例中所述的预设温度值。
在电子设备的使用阶段(即电子设备出厂后)，电子设备可以检测当前应用场景下各个电子器件的温度，将温度大于预设温度值的电子器件确定为发生漏电的电子器件。示例性的，电子设备中可以设置多个温度传感器(或称多个第二电子器件)，这些温度传感器用于检测各个电子器件的温度，以便于在电子器件发生漏电问题时，智能识别出发生漏电问题的电子器件。在一些实施例中，温度传感器可以集成在电子器件的内部(即电子器件的组成部件中包括温度传感器)。在另一些实施例中，温度传感器可以单独设置在电子设备的主板(如图4所示的主板)上。需要说明的是，温度传感器设置在主板上的位置可以根据实际需要进行设置，本申请实施例对此不作限定。
示例性的，温度传感器可以设置在电子器件的附近，以便于检测电子器件的温度。以多个电子器件包括显示屏、处理器、音频放大器为例进行示意，示例性的，电子设备还可以包括第一温度传感器、第二温度传感器和第三温度传感器。其中，第一温度传感器用于检测显示屏的温度数据，第二温度传感器用于检测处理器的温度数据，第三温度传感器用于检测音频放大器的温度数据。例如，如图9所示，第一温度传感器设置在显示屏的附近，以便于检测显示屏的温度数据；第二温度传感器设置在处理器的附近，以便于检测处理器的温度数据；第三温度传感器设置在音频放大器的附近，以便于检测音频放大器的温度数据。
需要说明的是，温度传感器设置在电子器件的附近指的是温度传感器与电子器件之间的距离小于或等于预设距离。其中，预设距离可以根据具体需要进行设置，本申请实施例对此不作限定。
在一些实施例中，温度传感器中存储有对应的电子器件的标识。当温度传感器检测出电子器件的温度之后，电子设备可以根据温度传感器中存储的电子器件的标识，确定出该温度传感器检测的温度对应的电子器件。示例性的，第一温度传感器中存储有显示屏的标识，该标识例如可以为LCD_them；第二温度传感器中存储有处理器的标识，该标识例如可以为CPU_them；第三温度传感器中存储有音频放大器的标识，该标识例如可以为SmartPA_them。
下面结合说明书附图对本申请实施例提供的电子器件的漏电检测方法进行详细描述。
图10为本申请实施例提供的一种电子器件的漏电检测方法的流程示意图，如图10所示，当电子设备在执行任务时，在该任务对应的应用场景下，电子设备执行步骤S301-S304。应理解，电子设备中存储有不同应用场景下，各个电子器件的温度等高线。
S301、电子设备获取目标应用场景下的目标电子器件的温度。
其中，目标应用场景为电子设备当前执行的任务(如目标任务)对应的应用场景；目标电子器件为多个电子器件中的任意一个电子器件。
示例性的，目标应用场景例如可以为音频场景、游戏场景等。
在一些实施例中，电子设备通过温度传感器检测电子器件的温度。在此基础上，电子设备中设置有多个温度传感器，一个温度传感器与一个电子器件对应。电子设备可以通过温度传感器检测与其对应的目标电子器件的温度。
例如，结合图9所示，当目标电子器件为显示屏时，电子设备通过第一温度传感器检测显示屏的温度；当目标电子器件为处理器时，电子设备通过第二温度传感器检测处理器的温度；当目标电子器件为音频放大器时，电子设备通过第三温度传感器检测音频放大器的温度。
S302、电子设备确定目标应用场景下的目标电子器件的预设温度值。
以目标应用场景为音频场景，目标电子器件为音频放大器为例进行示意，示例性的，电子设备根据音频场景下，音频放大器周围的温度等高线以及目标温度传感器的位置信息，确定音频放大器的预设温度值。其中，该目标温度传感器为检测目标电子器件的温度传感器。例如，当目标电子器件为音频放大器时，该目标温度传感器为上述实施例中所述的第三温度传感器。
需要说明的是，此处的音频放大器的温度等高线为：在音频放大器正常的情况下，建立的温度等高线。例如结合图7所示，该音频放大器的温度等高线为图7中(a)所示的温度等高线。
示例性的，在图7中(a)所示的温度等高线的基础上，根据目标温度传感器的位置信息确定音频放大器的预设温度值。其中，目标温度传感器的位置信息指的是目标温度传感器设置在音频放大器周围的位置。示例性的，如图11中(a)所示，当目标传感器设置在音频放大器的温度等高线的位置处(即目标传感器与音频放大器的温度等高线重合)时，音频放大器的预设温度值为与目标传感器的位置重合的温度等高线上标注的温度(如50℃)。又示例性的，如图11中(b)所示，当目标传感器设置在音频放大器相邻两条温度等高线之间时，音频放大器的预设温度值为与目标传感器的中心位置相近的温度等高线上标注的温度(如60℃)。
S303、当目标电子器件的温度大于或等于预设温度值时，电子设备确定该目标电子器件发生漏电。
示例性的，当预设温度值为50℃时，若目标电子器件的温度为51℃，则确定该目标电子器件发生漏电。
S304、电子设备对目标电子器件进行目标处理。
其中，目标处理用于消除目标电子器件发生的漏电。示例性的，目标处理包括降低显示屏的刷新率、降低画质、减少背光亮度、降低处理器的频率、降低电子器件的负载、降低电子器件的功率或者减小音量中的一种或多种处理类型。在一些实施例中，目标处理例如可以为复位操作。
在一些实施例中，电子设备可以根据目标应用场景以及目标电子器件选择相应的目标处理。也就是说，在同一应用场景下，不同的电子器件可以选择不同的目标处理。
示例性的，在游戏场景中，当电子器件为显示屏时，目标处理例如可以为降低刷新率、降低画质、降低背光亮度中的一种或多种处理类型；当电子器件为CPU时，目标处理例如可以为降低CPU频率(或者拔核)。
在一些实施例中，电子设备也可以根据预设温度值选择不同的目标处理的处理类型，即预设温度值不同，目标处理的处理类型也不同。另外，当预设温度值不同时，目标处理类型的处理粒度也不同。
结合上述实施例，示例性的，当预设温度值(或称目标温度值)在第一区间时，目标处理包括M种处理类型；当预设温度值在第二区间时，目标处理包括N种处理类型；其中。M、N为正整数。需要说明的是，区间仅仅作为本申请实施例中的一种举例说明，并不构成对本申请的限定。其中，区间也可以用“模式”或者“等级”等其他描述进行替换。
在一些实施例中，第一区间的最大值小于第二区间的最小值；也就是说，第二区间内的预设温度值高于第一区间内的预设温度值。示例性的，区间的范围例如可以为[25℃，70℃]；其中，第一区间例如可以为[25℃，45℃]；第二区间例如可以为[46℃，70℃]。
在一些实施例中，当第一区间的最大值小于第二区间的最小值时，M小于N。即预设温度值越小，对应的目标处理的处理类型越少；相应地，预设温度值越大，对应的目标处理的处理类型越多。以电子器件为显示屏为例，例如，当预设温度值为35℃时，目标处理可以包括降低背光亮度；当预设温度值为45℃时，目标处理可以包括降低背光亮度和降低画质。
示例性的，在该实施例中，对于M种处理类型的处理粒度和N种处理类型的处理粒度的大小不作限定。例如，当预设温度值为35℃时，目标处理可以包括降低背光亮度60％；当预设温度值为45℃时，目标处理可以包括降低背光亮度90％和降低画质。可以看出，虽然M小于N，但是在M种处理类型的处理粒度大于N种处理类型的处理粒度。
在另一些实施例中，当第一区间的最大值小于第二区间的最小值时，M种处理类型与N种处理类型相同；其中，N种处理类型中，至少一个处理类型的处理粒度大于M中处理类型中对应处理类型的处理粒度。仍以电子器件为显示屏为例，例如，当预设温度值为55℃时，目标处理包括N种(例如两种)处理类型(如降低背光亮度和降低画质)；当预设温度值为35℃时，目标处理包括M种(例如两种)处理类型(如降低背光亮度和降低画质)。在一些实施例中，以N种(例如两种)处理类型中至少一个处理类型为降低背光亮度为例，示例性的，当预设温度值为55℃时，目标处理包括降低背光亮度×90％；当预设温度值为35℃时，目标处理包括降低背光亮度×90％。
示例性的，在不同应用场景下，不同电子器件在不同预设温度值对应的目标处理可以参考如下表1所示。其中，表1以游戏场景和音频场景为例进行示意。在游戏场景下，目标电子器件例如为显示屏和CPU；在音频场景下，目标电子器件例如为CPU和音频放大器。
表1
Figure PCTCN2022138060-appb-000001
Figure PCTCN2022138060-appb-000002
如上述表1所示，在游戏场景下，当显示屏的预设温度值为25℃时，若当前显示屏的温度大于25℃，则目标处理为降低刷新率。当显示屏的预设温度值为30℃时，若当前显示屏的温度大于30℃，则目标处理为降低画质。当显示屏的预设温度值为35℃时，若当前显示屏的温度大于35℃，则目标处理为将背光亮度降低至90％。当显示屏的预设温度值为40℃时，若当前显示屏的温度大于40℃，则目标处理为将背光亮度降低至80％。当显示屏的预设温度值为45℃时，若当前显示屏的温度大于45℃，则目标处理为将背光亮度降低至70％。当显示屏的预设温度值为50℃时，若当前显示屏的温度大于50℃，则电子设备触发弹窗警告。其中，该弹窗警告用于提示用户电子设备发生故障。示例性的，该弹窗警告例如可以为：电子设备出现故障，是否退出应用。或者，该弹窗警告为：电子设备当前温度过高，无法继续工作。
需要说明的是，上述表1中，对于游戏场景下CPU的举例说明，以及对于音频场景下CPU和音频放大器的举例说明可以参考上述实施例，此处不再一一赘述。
在目标电子器件发生漏电的情况下，电子设备可以对该目标电子器件进行目标处理，已解决目标电子器件的漏电问题。在一些实施例中，当电子设备对该目标电子器件执行的目标处理的次数达到预设次数(或称第一预设次数)之后，若电子设备未解决目标电子器件的漏电问题，则电子设备显示指示信息(如触发弹窗警告)。在另一些实施例中，当预设温度值大于或等于第二阈值时，电子设备显示指示信息(如触发弹窗警告)。其中，指示信息用于向用户提示电子设备不支持继续执行目标任务；或者，指示信息用于向用户提示是否结束目标任务。
例如，参考上述表1所示，以电子器件为显示屏为例，示例性的，当预设温度值大于或等于50℃时，电子设备触发弹窗警告。
需要说明的是，预设次数可以根据实际需要进行设置，本申请实施例对预设次数不作具体限制。示例性的，预设次数可以为3次、4次或者5次以上。
以应用场景为游戏场景为例，示例性的，当用户使用电子设备在玩游戏时，若电子设备检测到CPU发生漏电，并且当电子设备对CPU尝试3次目标处理之后，仍未解决CPU的漏电问题，此时电子设备可触发弹窗警告，以提示用户CPU温度过高，无法继续游戏。示例性的如图12所示，该弹窗警告为：CPU温度过高，无法继续游戏，是否退出应用？在此基础上，当用户点击“退出”控件后，电子设备退出该应用；当用户点击“取消”控件后，则用户可继续游戏。
为了确保用户安全，在一些实施例中，当电子设备连续点击“取消”控件的次数大于阈值(或称第二预设次数)(如3次)时，电子设备可自动退出应用。或者，电子设备触发关机模式，以使电子设备进入关机状态。
综上所述，在本申请实施例中，电子设备通过检测目标电子器件的温度，将目标电子器件的温度与预设温度值进行对比，若目标电子器件的温度大于或等于预设温度值，则确定该目标电子器件发生漏电问题。这样一来，不仅节省了检测电子器件漏电时所需的时间和人力，而且还提高了检测效率。
另外，在确定目标电子器件发生漏电问题的情况下，电子设备还可以对该目标电子器件进行目标处理，以解决该目标电子器件的漏电问题。
图13为本申请实施例提供的一种电子器件的漏电检测方法的流程示意图，示例性的，该方法包括S401-S403。
其中，本申请实施例提供的电子器件的漏电检测方法应用于电子设备中，该电子设备包括多个第一电子器件和多个第二电子器件，第二电子器件用于检测第一电子器件的温度；电子设备还存储有每个第一电子器件的温度分布信息，该温度分布信息用于指示电子设备在执行目标任务时，第一电子器件上不同位置处的多个温度参考值。
需要说明的是，多个第一电子器件例如可以为上述实施例中所述的多个电子器件(如处理器、快充芯片、闪存、蓝牙芯片、音频放大器以及功率放大器等)；多个第二电子器件例如可以为上述实施例中所述的多个温度传感器。
示例性的，温度分布信息例如可以为上述实施例中所述的温度坐标系或者为温度等高线(或称温度等高线图)。在温度分布信息为温度等高线图的情况下，温度等高线图包括多条闭合曲线，同一条闭合曲线上的温度参考值相同。
S401、当电子设备执行目标任务时，电子设备或者目标温度传感器测得的第一电子器件的目标位置处的目标温度值。
其中，目标温度传感器为多个第二电子器件中的其中一个电子器件。
示例性的，目标任务可以为上述实施例中电子设备执行的不同任务中的任意一个任务。例如，目标任务可以为游戏任务(即电子设备执行的游戏任务)；或者为音频播放任务(即电子设备执行的音频播放任务)。其中，不同目标任务对应的电子设备的应用场景不同。例如，当目标任务为游戏任务时，电子设备的应用场景为游戏场景；当目标任务为音频播放任务时，电子设备的应用场景为音频场景。应理解，当电子设备执行目标任务时，电子设备的应用场景例如可以为上述实施例中所述的目标应用场景。
需要说明的是，目标位置为目标温度传感器所在的位置。而目标温度传感器是用来检测第一电子器件的温度，因此，目标温度传感器在目标位置检测到的目标温度值， 为第一电子器件某一位置处的目标温度值。其中，此处的第一电子器件例如可以为上述实施例中所述的目标电子器件。
应理解，目标温度传感器可以设置在第一电子器件的内部(即第一电子器件的组成部件中包括目标温度传感器)；在此情况下，目标位置为电子器件内部设置有目标温度传感器的位置。相应地，目标温度传感器也可以设置在第一电子器件的附近(即第一电子器件的组成部件中不包括目标温度传感器)；在此情况下，目标位置为电子器件周围设置有目标温度传感器的位置。
在一些实施例中，当第一电子器件不同时，对应检测第一电子器件的目标温度传感器也不同。示例性的，如图9所示，当第一电子器件为显示屏时，目标温度传感器为第一温度传感器；当第一电子器件为处理器时，目标温度传感器为第二温度传感器；当第一电子器件为音频放大器时，目标温度传感器为第三温度传感器。
S402、电子设备从第一电子器件的温度分布信息中，确定目标位置对应的目标温度参考值。
需要说明的是，此处的目标温度参考值例如可以为上述实施例中所述的预设温度值。
以温度分布信息为温度等高线图为例，在一些实施例中，当目标位置位于相邻两条闭合曲线之间(即目标温度传感器位于相邻两条闭合曲线之间)时，目标温度参考值为目标位置靠近相邻两条闭合曲线中的闭合曲线上的温度参考值。示例性的，如图11中(b)所示，当温度传感器(如目标温度传感器)位于相邻两条闭合曲线之间时，目标温度参考值为目标位置(即目标温度传感器所在的位置)靠近相邻两条不喝曲线中的闭合曲线上的温度参考值(如60℃)。
或者，当目标位置位于相邻两条闭合曲线之间(即目标温度传感器位于相邻两条闭合曲线之间)时，目标温度参考值为目标位置处的温度参考值。示例性的，电子设备可以根据相邻两条闭合曲线上的温度参考值，通过插值计算得到目标位置处的温度参考值，从而将目标位置处的温度参考值确定为目标温度参考值。
又或者，当目标位置与闭合曲线重合(即目标温度传感器)时，目标温度参考值为闭合曲线上的温度参考值。示例性的，如图11中(a)所示，温度传感器(如目标温度传感器)位于闭合曲线上时，目标温度参考值为闭合曲线上的温度参考值。
S403、当目标温度值与目标温度参考值的差值大于或等于第一阈值时，电子设备确定第一电子器件漏电。需要说明的是，第一阈值可以根据具体需要进行设置，本申请实施例对于第一阈值不作限定。在一些实施例中，第一阈值例如等于零，即目标温度值与目标温度参考值相等。
在该实施例中，电子设备包括多个第一电子器件和多个第二电子器件，第二电子器件用于检测第一电子器件的温度；当电子设备执行目标任务时，电子设备获取目标温度传感器测得的第一电子器件的目标位置处的目标温度值；目标温度传感器为多个第二电子器件中的其中一个电子器件；由于电子设备中存储有每个第一电子器件的温度分布信息，该温度分布信息用于指示电子设备在执行目标任务时，第一电子器件上不同位置处的多个温度参考值；因此电子设备可以从第一电子器件的温度分布信息中，确定目标位置对应的目标温度参考值；当目标温度值与目标温度参考值的差值大于或 等于第一阈值时，电子设备确定第一电子器件漏电，从而能够检测出电子设备中发生漏电问题的器件，进而能够减少检测成本以及提高检测效率。
本申请实施例提供一种电子设备，该电子设备包括多个电子器件和多个温度传感器；温度传感器用于检测电子器件的温度；多个电子器件包括显示屏、存储器以及一个或多个处理器；存储器中存储有计算机程序代码，计算机程序代码包括计算机指令，当计算机指令被所述处理器执行时，使得所述电子设备可执行上述实施例中电子设备执行的各个功能或者步骤。该电子设备的结构可以参考图1所示的电子设备100的结构。
本申请实施例还提供一种芯片系统，如图14所示，该芯片系统1800包括至少一个处理器1801和至少一个接口电路1802。其中，处理器1801可以是上述实施例中图1所示的处理器110。接口电路1802例如可以为处理器110和外部存储器120之间的接口电路；或者为处理器110和内部存储器121之间的接口电路。
上述处理器1801和接口电路1802可通过线路互联。例如，接口电路1802可用于从其它装置(例如电子设备的存储器)接收信号。又例如，接口电路1802可用于向其它装置(例如处理器1801)发送信号。示例性的，接口电路1802可读取存储器中存储的指令，并将该指令发送给处理器1801。当所述指令被处理器1801执行时，可使得电子设备执行上述实施例中电子设备执行的各个步骤。当然，该芯片系统还可以包含其他分立器件，本申请实施例对此不作具体限定。
本申请实施例还提供一种计算机可读存储介质，该计算机可读存储介质包括计算机指令，当所述计算机指令在电子设备上运行时，使得该电子设备执行上述方法实施例中电子设备执行的各个功能或者步骤。
本申请实施例还提供一种计算机程序产品，当所述计算机程序产品在计算机上运行时，使得所述计算机执行上述方法实施例中电子设备执行的各个功能或者步骤。
通过以上实施方式的描述，所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，仅以上述各功能模块的划分进行举例说明，实际应用中，可以根据需要而将上述功能分配由不同的功能模块完成，即将装置的内部结构划分成不同的功能模块，以完成以上描述的全部或者部分功能。
在本申请所提供的几个实施例中，应该理解到，所揭露的装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述模块或单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个装置，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是一个物理单元或多个物理单元，即可以位于一个地方，或者也可以分布到多个不同地方。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成 的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个可读取存储介质中。基于这样的理解，本申请实施例的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该软件产品存储在一个存储介质中，包括若干指令用以使得一个设备(可以是单片机，芯片等)或处理器(processor)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(read only memory，ROM)、随机存取存储器(random access memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上内容，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何在本申请揭露的技术范围内的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (12)

  1. 一种电子器件的漏电检测方法，其特征在于，应用于电子设备，所述电子设备包括多个第一电子器件和多个第二电子器件，所述第二电子器件用于检测所述第一电子器件的温度；所述电子设备存储有每个所述第一电子器件的温度分布信息，所述温度分布信息用于指示所述电子设备在执行目标任务时，所述第一电子器件上不同位置处的多个温度参考值；所述方法包括：
    当所述电子设备执行所述目标任务时，所述电子设备获取目标温度传感器测得的所述第一电子器件的目标位置处的目标温度值；所述目标温度传感器为所述多个第二电子器件中的其中一个电子器件；
    所述电子设备从所述第一电子器件的温度分布信息中，确定所述目标位置对应的目标温度参考值；
    当所述目标温度值与所述目标温度参考值的差值大于或等于第一阈值时，所述电子设备确定所述第一电子器件漏电。
  2. 根据权利要求1所述的方法，其特征在于，所述温度分布信息为温度等高线图，所述温度等高线图包括多条闭合曲线，同一条闭合曲线上的温度参考值相同；所述电子设备从所述第一电子器件的温度分布信息中，确定所述目标位置对应的目标温度参考值，包括：
    当所述目标位置位于相邻两条闭合曲线之间时，所述目标温度参考值为所述目标位置靠近所述相邻两条闭合曲线中的闭合曲线上的温度参考值；或者，
    当所述目标位置位于相邻两条闭合曲线之间时，所述电子设备根据所述相邻两条闭合曲线上的温度参考值确定所述目标温度参考值；或者，
    当所述目标位置与所述闭合曲线重合时，所述目标温度参考值为所述闭合曲线上的温度参考值。
  3. 根据权利要求2所述的方法，其特征在于，
    所述温度等高线图为所述电子设备在正常情况下，预先执行至少一次所述目标任务后建立的。
  4. 根据权利要求1-3任一项所述的方法，其特征在于，所述方法还包括：
    当所述电子设备确定所述第一电子器件漏电时，所述电子设备对所述第一电子器件进行目标处理；所述目标处理用于消除所述第一电子器件的漏电。
  5. 根据权利要求4所述的方法，其特征在于，
    所述目标处理包括：降低显示屏的刷新率、降低画质、减少背光亮度、降低处理器的频率、降低所述第一电子器件的负载、降低所述第一电子器件的功率或者减小音量中的一种或多种处理类型。
  6. 根据权利要求4或5所述的方法，其特征在于，所述方法还包括：
    当所述目标温度值在第一区间时，所述目标处理包括M种处理类型；
    当所述目标温度值在第二区间时，所述目标处理包括N种处理类型；
    所述第一区间的最大值小于所述第二区间的最小值，所述M小于所述N；或者，
    所述第一区间的最大值小于所述第二区间的最小值，所述M种处理类型与所述N种处理类型相同，所述N种处理类型中，至少一个处理类型的处理粒度大于所述M种 处理类型中对应处理类型的处理粒度；其中，M、N为正整数。
  7. 根据权利要求4-6任一项所述的方法，其特征在于，所述方法还包括：
    当所述电子设备对所述第一电子器件进行目标处理的处理次数大于或等于第一预设次数时，且当所述电子设备未消除所述第一电子器件的漏电时，所述电子设备显示指示信息；所述指示信息用于向用户提示所述电子设备不支持继续执行所述目标任务；或者，所述指示信息用于向用户提示是否结束所述目标任务。
  8. 根据权利要求1-6任一项所述的方法，其特征在于，所述方法还包括：
    当所述目标温度参考值大于或等于第二阈值时，所述电子设备显示指示信息；所述指示信息用于向用户提示所述电子设备不支持继续执行所述目标任务；或者，所述指示信息用于向用户提示是否结束所述目标任务。
  9. 根据权利要求7或8所述的方法，其特征在于，所述方法还包括：
    所述电子设备响应于用户的确认操作，结束所述目标任务；或者
    所述电子设备响应于用户的取消操作，继续执行所述目标任务。
  10. 根据权利要求9所述的方法，其特征在于，所述方法还包括：
    当用户的取消操作的次数大于或等于第二预设次数时，所述电子设备自动结束所述目标任务；或者，当用户的取消操作的次数大于或等于所述第二预设次数时，所述电子设备自动关机。
  11. 一种电子设备，其特征在于，所述电子设备包括多个第一电子器件和多个第二电子器件；所述第二电子器件用于检测所述第一电子器件的温度；所述多个第一电子器件包括显示屏、存储器和一个或多个处理器；所述显示屏、所述存储器和所述处理器耦合；
    所述存储器用于存储计算机程序代码和每个所述第一电子器件的温度分布信息，所述温度分布信息用于指示所述电子设备在执行目标任务时，所述第一电子器件上不同位置处的多个温度参考值；所述计算机程序代码包括计算机指令；当所述处理器执行所述计算机指令时，使得所述电子设备执行如权利要求1-10任一项所述的方法。
  12. 一种计算机可读存储介质，其特征在于，包括计算机指令；当所述计算机指令在所述电子设备上运行时，使得所述电子设备执行如权利要求1-10任一项所述的方法。
PCT/CN2022/138060 2022-02-22 2022-12-09 一种电子器件的漏电检测方法、电子设备及存储介质 WO2023160122A1 (zh)

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