WO2023159784A1

WO2023159784A1 - Flexible substrate coating device and coating method

Info

Publication number: WO2023159784A1
Application number: PCT/CN2022/094850
Authority: WO
Inventors: 程毅; 周高阳; 李学法; 张国平
Original assignee: 江阴纳力新材料科技有限公司
Priority date: 2022-02-28
Filing date: 2022-05-25
Publication date: 2023-08-31
Also published as: CN114411111A

Abstract

The present invention relates to a flexible substrate coating device and coating method. The flexible substrate coating device comprises a vacuum chamber, a partition plate, an unwinding roller, a heating member, a coating roller, a plating member and a winding roller. The partition plate is located in the vacuum chamber and used for dividing the vacuum chamber into a heating chamber and a coating chamber; the partition plate is provided with a first through hole and a second through hole, the first through hole is used for a substrate to be conveyed from the heating chamber to the coating chamber, and the second through hole is used for the substrate to be conveyed from the coating chamber to the heating chamber. The unwinding roller, the heating member and the winding roller are located in the heating chamber, the unwinding roller is used for unwinding the substrate, the heating member is used for heating the substrate in the heating chamber, and the winding roller is used for winding the substrate. The coating roller and the plating member are located in the coating chamber, and the plating member is close to the coating roller and used for plating the substrate on the surface of the coating roller, thereby forming a thin film coating on the surface of the substrate. By using the device, the adhesion, compactness and thickness uniformity of the thin film coating on the surface of the substrate can be improved.

Description

Flexible substrate coating device and coating method

technical field

The invention relates to the technical field of film coating, in particular to a flexible substrate film coating device and a film coating method.

Background technique

With the continuous improvement of material processing technology, coating thin films on the surface of flexible substrates to endow flexible substrates with corresponding properties has been widely used. In the process of coating thin films on the surface of flexible substrates, since flexible substrates and films are often made of different materials, problems such as poor uniformity of film coating thickness, poor adhesion, and poor compactness are prone to occur when coating thin films on the surface of flexible substrates.

Contents of the invention

Based on this, it is necessary to provide a coating device and a coating method that can improve the adhesion, compactness, and thickness uniformity of the thin film coating on the surface of the flexible substrate.

For solving above technical problem, technical scheme of the present invention is:

A flexible substrate coating device, comprising a vacuum chamber, a partition, an unwinding roller, a heating element, a coating roller, a coating member and a winding roller, the partition is located in the vacuum chamber for the vacuum chamber Divided into a heating chamber and a coating chamber; the partition is provided with a first through hole and a second through hole, the first through hole is used for transferring the substrate from the heating chamber to the coating chamber, the The second through hole is used for transporting the substrate from the coating chamber to the heating chamber;

The unwinding roller, the heating element and the winding roller are located in the heating chamber, the unwinding roller is used to unwind the substrate, and the heating element is used to heat the substrate in the heating chamber, The winding roller is used for winding the base material;

The coating roller and the coating member are located in the coating chamber, and the coating member is close to the coating roller for coating the substrate on the surface of the coating roller, thereby forming a thin film coating on the surface of the substrate.

In one embodiment, the flexible substrate coating device further includes a cooling element, the cooling element is located in the coating chamber, and the cooling element is used for cooling the water vapor in the coating chamber.

In one of the embodiments, the flexible substrate coating device further includes a coating baffle, the coating baffle is located inside the coating chamber and is arranged between the coating roller and the coating applicator, and the coating baffle is A coating opening is provided on the plate, the coating roller is located at the coating opening, and the coating material formed by the coating member escapes from the coating opening to the substrate surface on the coating roller.

In one of the embodiments, in the direction from the coating roller to the coating applicator, the diameter of the coating opening gradually increases.

In one of the embodiments, the coating baffle divides the coating chamber into a cooling chamber and a plating chamber, the cooling member is located in the cooling chamber, and the plating member is located in the plating chamber.

In one of the embodiments, the heating element is a hollow heating tube, and a heating medium is installed in the hollow heating tube.

In one of the embodiments, the flexible substrate coating device further includes a heating roller, the heating roller is located in the heating chamber, and the heating roller is located between the coating roller and the take-up roller for heating after coating , The substrate before receiving.

A flexible substrate coating method, using the flexible substrate coating device described in any of the above embodiments, the flexible substrate coating method includes the following steps:

The base material is unwound by the unwinding roller, the base material passes through the first through hole, the coating roller, and the second through hole in sequence, and then the base material is wound up by the winding roller.

In one of the embodiments, the temperature of the substrate in the heating chamber is controlled by the heating element to be 20°C to 100°C.

In one of the embodiments, the temperature of the substrate on the surface of the coating roller is controlled to be -30°C to 30°C; and/or,

The flexible substrate coating device also includes a heating roller, the heating roller is located in the heating chamber, the heating roller is located between the coating roller and the winding roller, and the temperature of the substrate on the surface of the heating roller is controlled. The temperature is 30°C to 120°C.

The above flexible substrate coating device includes a vacuum chamber, a partition, an unwinding roller, a heating element, a coating roller, a coating element and a winding roller, and the partition is located in the vacuum chamber to separate the vacuum chamber into a heating chamber and a coating chamber; The separator is provided with a first through hole and a second through hole, the first through hole is used for transferring the substrate from the heating chamber to the coating chamber, and the second through hole is used for transferring the substrate from the coating chamber to the heating chamber. The unwinding roller, the heating element and the winding roller are located in the heating chamber, the unwinding roller is used for unwinding the substrate, the heating element is used for heating the substrate in the heating chamber, and the winding roller is used for winding the substrate. The coating roller and the coating member are located in the coating chamber, and the coating member is close to the coating roller for coating the substrate on the surface of the coating roller, thereby forming a thin film coating on the surface of the substrate. In the flexible substrate coating device, after the substrate is discharged from the unwinding roller, it passes through the coating roller, and then is wound up on the winding roller. In this process, the substrate is first heated in the heating chamber. At this time, the heating process can have a good degassing effect on the substrate, which is conducive to improving the bonding force and bonding force between the thin film coating and the surface of the substrate during the coating process. The degree of compactness, thereby improving the uniformity of the thickness of the film coating on the surface of the substrate. Then, with the further transmission of the substrate, the substrate is transferred to the surface of the coating roller, and at this time, the formed coating material is transferred to the surface of the substrate through the action of the coating member, and then a film is deposited on the surface of the substrate to form a thin film coating. After the coating is completed, the substrate with the thin film coating on the surface enters the heating chamber again through the second through hole on the separator, and is heated again in the heating chamber. At this time, the continuous crystallization of the thin film coating can be effectively maintained and the compactness of the film can be improved. , the stress of the thin film coating can also be fully released, so that the internal stress of the thin film coating can better match the internal stress of the substrate, which is conducive to improving the quality of the thin film coating and further improving the uniformity of the thickness of the thin film coating on the surface of the substrate. After the substrate with thin film coating on the surface is reheated in the heating chamber, the substrate is wound up on the winding roller to complete the coating and winding of the flexible substrate. The above-mentioned flexible substrate coating device can effectively improve the uniformity of the thickness of the film coating on the surface of the substrate on the one hand, and can also control the temperature at each stage in the coating process to effectively maintain and improve the thickness of the film coating on the surface of the substrate. Strong binding force, so that the thin film coating on the surface of the substrate is not easy to fall off. At the same time, when the above-mentioned flexible substrate coating device is used to coat the flexible substrate, the thin film coating can be continuously crystallized, the compactness and quality of the thin film coating can be improved, and the crystallization can be continued during the coating process, avoiding an additional crystallization process And flow time to improve the efficiency of coating processing.

Further, the coating device for flexible substrates also includes a cooling element, which is located in the coating chamber, and is used for cooling water vapor in the coating chamber. After the substrate is heated and degassed in the heating chamber, the substrate enters the coating chamber through the first through hole on the partition plate. At this time, the water vapor in the coating chamber can be condensed by the cooling effect of the cooling element in the coating chamber. For example, the water can be condensed. The vapor condenses into solid ice, which removes the water vapor in the coating chamber. Avoiding the movement of water vapor in the coating chamber will adversely affect the vacuum effect of the coating chamber, thereby enabling the substrate to be stably coated in the coating chamber, and further improving the bonding force and density between the thin film coating and the surface of the substrate during the coating process.

The above flexible substrate coating method adopts the above flexible substrate coating device, and the flexible substrate coating method includes the following steps: unwinding the substrate through an unwinding roller, making the substrate sequentially pass through the first through hole, the coating roller, the second Two through holes, and then the substrate is rewound by the rewinding roller. The flexible substrate coating method above can effectively improve the uniformity of the film coating thickness on the surface of the flexible substrate, improve the bonding force between the film coating and the substrate surface, improve the quality of the film coating, and improve the processing efficiency of the flexible substrate coating.

Description of drawings

FIG. 1 is a schematic structural view of such a flexible substrate coating device according to an embodiment of the present invention.

Instructions for marks in the figure:

100. Flexible substrate coating device; 101. Separator; 102. Unwinding roller; 103. Heating element; 104. Cooling element; 105. Coating roller; 106. Plating element; 107. Rewinding roller; 108. Heating chamber 109, cooling chamber; 110, plating chamber; 111, coating baffle; 112, coating opening; 113, coating material; 114, heating roller; 115, temperature sensor; 116, guide roller; 200, substrate.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise specified limit. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to FIG. 1 , an embodiment of the present invention provides a flexible substrate coating device 100 . The flexible substrate coating device 100 includes a vacuum chamber, a partition 101, an unwinding roll 102, a heating element 103, a coating roll 105, a plating part 106, and a take-up roll 107, and the partition 101 is located in the vacuum chamber for turning the vacuum chamber Divided into a heating chamber 108 and a coating chamber; the partition 101 is provided with a first through hole and a second through hole, the first through hole is used for transferring the substrate from the heating chamber 108 to the coating chamber, and the second through hole is used for supplying The substrate is transferred from the coating chamber to the heating chamber 108 . The unwinding roller 102, the heating element 103 and the winding roller 107 are located in the heating chamber 108, the unwinding roller 102 is used for unwinding the substrate, the heating element 103 is used for heating the substrate in the heating chamber 108, and the winding roller 107 is used for Rewind the substrate. The coating roller 105 and the coating member 106 are located in the coating chamber. The coating member 106 is close to the coating roller 105 for coating the substrate on the surface of the coating roller 105 , thereby forming a thin film coating on the surface of the substrate.

In the flexible substrate coating device 100 of this embodiment, after the substrate 200 is discharged from the unwinding roller 102 , it passes through the coating roller 105 and is then wound up on the winding roller 107 . During this process, the substrate is first heated in the heating chamber 108. At this time, the heating process can have a good degassing effect on the substrate, which is conducive to improving the bonding between the thin film coating and the surface of the substrate during the coating process. Strength and compactness, thereby improving the uniformity of the thickness of the thin film coating on the surface of the substrate. Then along with the further transmission of the base material, the base material is transported to the surface of the coating roller 105, at this moment, the coating material 113 formed is delivered to the base material surface by the effect of the plating member 106, and then deposited on the base material surface to form a film, forming Thin film coating. After the coating is completed, the substrate with the thin film coating on the surface enters the heating chamber 108 again through the second through hole on the partition 101, and is heated again in the heating chamber 108. At this time, the continuous crystallization of the thin film coating can be effectively maintained. The stress of the thin-film coating can also be fully released, so that the internal stress of the thin-film coating can better match the internal stress of the substrate, which is conducive to improving the quality of the thin-film coating and further improving the uniformity of the thickness of the thin-film coating on the surface of the substrate. After the substrate with thin-film coating formed on its surface is heated again in the heating chamber 108, the substrate is wound up on the winding roller 107 to complete the coating and winding of the flexible substrate. The medium-flexible substrate coating device 100 of this embodiment can effectively improve the uniformity of the film coating thickness on the surface of the substrate on the one hand, and can also control the temperature at each stage in the coating process to effectively maintain and improve the thin film coating. The bonding force on the surface of the substrate makes the thin film coating on the surface of the substrate difficult to fall off. At the same time, when the flexible substrate coating device 100 is used to coat the flexible substrate, the thin film coating can be continuously crystallized, the quality of the thin film coating can be improved, and the efficiency of the coating process can also be improved.

It can be understood that the plating member 106 may be, but not limited to, a vacuum evaporation plating member, a vacuum sputtering plating member, and a vacuum ion plating member. The coating material 113 can be formed through the action of the coating member 106, and the coating material 113 can be a material formed by hitting the target, and then form a thin film coating on the surface of the substrate. In the actual coating process, the appropriate target can be selected according to the coating requirements, and then a thin film coating that meets the requirements can be formed on the surface of the substrate.

In a specific example, the flexible substrate coating device 100 further includes a cooling element 104 located in the coating chamber, and the cooling element 104 is used to cool water vapor in the coating chamber. After the substrate is heated and degassed in the heating chamber 103, the substrate enters the coating chamber through the first through hole on the partition plate 101. At this time, the water vapor in the coating chamber can be condensed by the cooling effect of the cooling element in the coating chamber. The function of the component can condense the water vapor into solid ice, and then remove the water vapor in the coating chamber. Avoiding the movement of water vapor in the coating chamber will adversely affect the vacuum effect of the coating chamber, thereby enabling the substrate to be stably coated in the coating chamber, and further improving the bonding force and density between the thin film coating and the surface of the substrate during the coating process.

In a specific example, the flexible substrate coating device 100 also includes a coating baffle 111, the coating baffle 111 is located inside the coating chamber and is arranged between the coating roller 105 and the coating member 106, and the coating baffle 111 is provided with The coating opening 112 , the coating roller 105 is located at the coating opening 112 , the coating material 113 formed by the coating member 106 escapes from the coating opening 112 to the substrate surface on the coating roller 105 . During the coating process, the material on the surface of the target is knocked out by the action of the coating member 106 to form a coating material 113, and the coating material 113 escapes to the surface of the substrate on the coating roller 105, and then deposits on the surface of the substrate to form a thin film coating. Through the setting of the coating baffle 111 and the opening of the coating opening 112 on the coating baffle 111 , the coating material 113 escapes from the coating opening 112 to the substrate surface on the coating roller 105 . The excess coating material 113 can be intercepted by the coating baffle 111 , which can improve the accuracy of deposition of the coating material 113 on the surface of the substrate. In addition, the coating material 113 intercepted by the coating baffle plate 111 can be recycled to improve the utilization rate of the coating material 113 . Especially when the coating material 113 is a precious metal, recycling the precious metal through the setting of the coating baffle 111 can effectively reduce the cost of the coating process.

Further, in the direction from the coating roller 105 to the coating member 106 , the diameter of the coating opening 112 gradually increases. In this way, the coating material 113 formed by the coating member 106 can fully act on the surface of the substrate exposed from the coating opening 112, which is beneficial to further improving the uniformity of the thickness of the thin film coating on the surface of the substrate.

Still further, the coating baffle 111 divides the coating chamber into a cooling chamber 109 and a plating chamber 110 , the cooling member 104 is located in the cooling chamber 109 , and the plating member 106 is located in the plating chamber 110 . At this time, the coating baffle plate 111 divides the coating chamber into a cooling chamber 109 and a plating chamber 110, that is, the cooling of the substrate and the coating of the substrate can be carried out separately by the coating, so as to avoid the gap between the coating member 106 and the cooling member 104. interfere with each other. At the same time, it is also possible to better limit the redundant coating material 113 during the coating process, effectively preventing the redundant coating material 113 from escaping into the cooling chamber 109 and causing adverse effects on the cooling chamber 109 .

As a specific option of the heating element 103, the heating element 103 is a hollow heating tube, and a heating medium is installed in the hollow heating tube. Through the use of the hollow heating tube and the heating medium, the substrate in the heating chamber 108 can be heated stably, and the temperature of the substrate can be controlled conveniently. Specifically, through the use of the heating element 103, the temperature of the substrate in the heating chamber 108 is controlled to be 20°C to 100°C, for example, the temperature of the substrate in the heating chamber 108 is controlled to be 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C or 100°C. It can be understood that, when the heating element 103 is used to heat the substrate in the heating chamber 108, the temperature of the substrate in the heating chamber 108 can also be controlled to other temperature values within the range of 20°C to 100°C. Further, the shape of the heating element 103 is serpentine. At this time, the serpentine heating element 103 can exhibit a more uniform heating effect, which facilitates sufficient heating of the heating chamber 108 and keeps the substrate in the heating chamber 108 in a stable temperature atmosphere, which is beneficial to improving the heating effect.

As a specific option of the cooling element 104, the cooling element 104 is a hollow cooling tube, and a cooling medium is installed in the hollow cooling tube. Through the use of the hollow cooling tube and the cooling medium, the water vapor in the coating chamber can be cooled stably, and the temperature of the water vapor can be controlled conveniently. Specifically, through the use of the cooling element 104, the temperature in the coating chamber is controlled to be below -100°C. Optionally, by using the cooling element 104, the temperature in the coating chamber is controlled to be -100°C to -150°C. For example, control the temperature in the coating chamber to -100°C, -105°C, -110°C, -115°C, -120°C, -125°C, -130°C, -135°C, -140°C, -145°C or -150°C ℃. It can be understood that, when the cooling element 104 is used to cool the water vapor in the coating chamber, the temperature in the coating chamber can also be controlled to other temperature values below -100°C. Further, the shape of the cooling element 104 is serpentine. At this time, the serpentine cooling member 104 can exhibit a more uniform cooling effect, which is convenient for fully cooling the coating chamber, and keeps the substrate in the coating chamber in a stable temperature atmosphere, which is beneficial to improve the cooling effect. Optionally, the hollow cooling pipe is a copper pipe.

In a specific example, the coating roller 105 is a coating roller 105 with a heating function. For example, the coating roller 105 is provided with a heating assembly for heating the substrate on the coating roller 105 surface. Specifically, through the heating function of the coating roller 105, the temperature of the base material on the surface of the coating roller 105 is controlled to be -30°C to 30°C. For example, through the heating function of the coating roller 105, the temperature of the substrate on the surface of the coating roller 105 is controlled to be -30°C, -25°C, -20°C, -15°C, -10°C, 0°C, 5°C, 10°C, 15°C, 20°C, 20°C or 30°C. It can be understood that, when the temperature of the substrate on the surface of the coating roller 105 is controlled through the heating function of the coating roller 105, the temperature of the substrate on the surface of the coating roller 105 can also be controlled to be other temperature values within the range of -30°C to 30°C .

In a specific example, the first through hole communicates with the second through hole.

In another specific example, the flexible substrate coating device 100 further includes a heating roller 114, the heating roller 114 is located in the heating chamber 108, and the heating roller 114 is located between the coating roller 105 and the take-up roller 107 for heating and winding after coating. Substrate before material. The setting of the heating roller 114 can better release the stress of the thin film coating, better balance the internal stress between the thin film coating and the substrate, and improve the quality of the thin film coating. Further, the temperature of the substrate on the surface of the heating roller 114 is controlled to be 30° C. to 120° C. by the heating roller 114 . Optionally, the temperature of the substrate on the surface of the heating roller 114 is controlled by the heating roller 114 to be 30° C., 35° C., 40° C., 45° C., 50° C., 55° C., 60° C., 65° C., 70° C., 75° C., 80° C. °C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C or 120°C. It can be understood that, the temperature of the substrate on the surface of the heating roller 114 controlled by the heating roller 114 may also be other temperature values within the range of 30°C to 120°C.

In another specific example, the flexible substrate coating device 100 also includes a temperature sensor 115, the temperature sensor 115 is located in the heating chamber 108 and/or the coating chamber, and the temperature sensor 115 is used to detect the temperature of the substrate in the heating chamber 108 and/or the coating chamber temperature. The temperature of the heating chamber 108 and/or the substrate in the coating chamber can be conveniently detected by setting the temperature sensor 115 , so as to monitor the coating process.

Specifically, in the flexible substrate coating device 100 shown in Figure 1, there are 2 temperature sensors 115, and the 2 temperature sensors 115 are located at the unwinding roller 102 and the winding roller 107 respectively for the substrates of the unwinding. and the temperature of the received substrate is detected. It can be understood that the number of temperature sensors 115 can also be other values. For example, the number of temperature sensors 115 is 1 to 10, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 and so on. The position of the temperature sensor 115 can be set in an appropriate position of the heating chamber 108 and/or the coating chamber according to the temperature measurement requirements.

In another specific example, the flexible substrate coating device 100 further includes a material guide roller 116 located in the heating chamber 108 and/or the coating chamber, and the material guide roller 116 is used to conduct the substrate. The conveying direction of the substrate can be effectively controlled by setting the guide roller 116 . In the flexible substrate coating device 100 shown in FIG. 1 , there are ten material guide rollers 116 . Of course, it can be understood that the number and position of the material guide rollers 116 can also be properly set according to actual transmission requirements.

Still another embodiment of the present invention provides a method for coating a flexible substrate. The flexible centralized coating method adopts the above-mentioned flexible substrate coating device 100, and the flexible substrate coating method includes the following steps: unwinding the substrate through the unwinding roller 102, so that the substrate passes through the first through hole, coating roller 105, The second through hole, and then the base material is wound up by the winding roller 107 . The flexible substrate coating method can effectively improve the uniformity of the film coating thickness on the surface of the flexible substrate, improve the bonding force between the film coating and the substrate surface, improve the quality of the film coating, and improve the processing efficiency of the flexible substrate coating.

In a specific example, the temperature of the substrate in the heating chamber 108 is controlled by the heating element 103 to be 20°C-100°C. For example, the temperature of the substrate in the heating chamber 108 is controlled to be 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C , 85°C, 90°C, 95°C or 100°C. It can be understood that, when the heating element 103 is used to heat the substrate in the heating chamber 108, the temperature of the substrate in the heating chamber 108 can also be controlled to other temperature values within the range of 20°C to 100°C.

In a specific example, the temperature in the coating chamber is controlled by the cooling element 104 to be below -100°C. Optionally, by using the cooling element 104, the temperature in the coating chamber is controlled to be -100°C to -150°C. For example, control the temperature in the coating chamber to -100°C, -105°C, -110°C, -115°C, -120°C, -125°C, -130°C, -135°C, -140°C, -145°C or -150°C ℃. It can be understood that, when the cooling element 104 is used to cool the water vapor in the coating chamber, the temperature of the water vapor in the coating chamber can also be controlled to be other temperature values below -100°C.

In a specific example, the temperature of the substrate on the surface of the coating roller 105 is controlled by the coating roller 105 to be -30°C to 30°C. For example, through the heating function of the coating roller 105, the temperature of the substrate on the surface of the coating roller 105 is controlled to be -30°C, -25°C, -20°C, -15°C, -10°C, 0°C, 5°C, 10°C, 15°C, 20°C, 20°C or 30°C. It can be understood that, when the temperature of the substrate on the surface of the coating roller 105 is controlled through the heating function of the coating roller 105, the temperature of the substrate on the surface of the coating roller 105 can also be controlled to be other temperature values within the range of -30°C to 30°C .

In a specific example, the temperature of the substrate on the surface of the heating roller 114 is controlled by the heating roller 114 to be 30° C. to 120° C. Optionally, the temperature of the substrate on the surface of the heating roller 114 is controlled by the heating roller 114 to be 30° C., 35° C., 40° C., 45° C., 50° C., 55° C., 60° C., 65° C., 70° C., 75° C., 80° C. °C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C or 120°C. It can be understood that, the temperature of the substrate on the surface of the heating roller 114 controlled by the heating roller 114 may also be other temperature values within the range of 30°C to 120°C.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be determined by the appended claims, and the description and drawings can be used to explain the content of the claims.

Claims

A flexible substrate coating device is characterized in that it includes a vacuum chamber, a partition, an unwinding roller, a heating element, a coating roller, a coating member and a winding roller, and the partition is located in the vacuum chamber for the The vacuum chamber is divided into a heating chamber and a coating chamber; a first through hole and a second through hole are arranged on the partition, and the first through hole is used for transferring the substrate from the heating chamber to the coating film chamber, the second through hole is used for transporting the substrate from the coating chamber to the heating chamber;

The unwinding roller, the heating element and the winding roller are located in the heating chamber, the unwinding roller is used to unwind the substrate, and the heating element is used to heat the substrate in the heating chamber, The winding roller is used for winding the base material;

The coating roller and the coating member are located in the coating chamber, and the coating member is close to the coating roller for coating the substrate on the surface of the coating roller, thereby forming a thin film coating on the surface of the substrate.
The flexible substrate coating device according to claim 1, further comprising a cooling element, the cooling element is located in the coating chamber, and the cooling element is used for cooling the water vapor in the coating chamber.
The flexible substrate coating device according to claim 2, further comprising a coating baffle, the coating baffle is located inside the coating chamber and is arranged between the coating roller and the coating member , the coating baffle is provided with a coating opening, the coating roller is located at the coating opening, and the coating material formed by the coating member escapes from the coating opening to the surface of the substrate on the coating roller .
The flexible substrate coating device according to claim 3, characterized in that, in the direction from the coating roller to the coating applicator, the diameter of the coating opening gradually increases.
The flexible substrate coating device according to claim 3, wherein the coating baffle divides the coating chamber into a cooling chamber and a plating chamber, the cooling element is located in the cooling chamber, and the plating chamber The parts are located in the plating chamber.
The flexible substrate coating device according to claim 1, wherein the heating element is a hollow heating tube, and a heating medium is installed in the hollow heating tube.
The flexible substrate coating device according to any one of claims 1 to 6, further comprising a heating roller, the heating roller is located in the heating chamber, and the heating roller is located between the coating roller and the Between the rewinding rollers, it is used to heat the substrate after coating and before rewinding.
A method for coating a flexible substrate, characterized in that the coating device for a flexible substrate according to any one of claims 1 to 7 is used, and the method for coating a flexible substrate comprises the following steps:

The base material is unwound by the unwinding roller, the base material passes through the first through hole, the coating roller, and the second through hole in sequence, and then the base material is wound up by the winding roller.
The method for coating a flexible substrate according to claim 8, wherein the temperature of the substrate in the heating chamber is controlled by the heating element to be 20°C-100°C.
The method for coating a flexible substrate according to claim 8, wherein the temperature of the substrate on the surface of the coating roller is controlled to be -30°C to 30°C; and/or,

The flexible substrate coating device also includes a heating roller, the heating roller is located in the heating chamber, the heating roller is located between the coating roller and the winding roller, and the temperature of the substrate on the surface of the heating roller is controlled. The temperature is 30°C-120°C.