CN220335293U - Winding type double-sided film plating equipment - Google Patents

Abstract

The utility model discloses a winding type double-sided coating device, which comprises: the first film plating chamber and the second film plating chamber are respectively provided with a plurality of film plating drums, and each film plating drum is respectively provided with a film plating source opposite to the film plating drum; a feeding part connected with one of the first film plating chamber and the second film plating chamber and used for feeding out the substrate; and the material receiving part is connected with the other one of the first coating chamber and the second coating chamber and is used for receiving the substrate with both surfaces coated with the coating. The substrate sequentially passes through the coating drums in the first coating chamber and the coating drums in the second coating chamber from the feeding part and is wound up in the material receiving part. Or, starting from the feeding part, the substrate sequentially passes through a plurality of coating drums in the second coating chamber and a plurality of coating drums in the first coating chamber and is wound up in the material receiving part. The winding type double-sided film plating equipment can improve the thickness of the film layer of the base material.

Description

Winding type double-sided film plating equipment

Technical Field

The utility model relates to the technical field of vacuum coating equipment, in particular to winding type double-sided coating equipment.

Background

The roll coating apparatus is an apparatus for coating a surface of a substrate as a roll in a vacuum chamber to prepare a thin film having a certain function on the surface of the substrate.

In the prior art, there are, for example, winding type reciprocating double-sided vapor deposition coating apparatuses, in which a winding wheel and an unwinding wheel are included, two main rolls between the winding wheel and the unwinding wheel, one main roll being matched with one coating source (evaporation source). One of the main rollers and one of the coating sources are used together to realize coating of one surface of the substrate, and the other main roller and the other coating source are used together to realize coating of the other surface of the substrate.

In the existing winding type double-eye coating equipment, although coating is carried out on two sides of a substrate, the technical problem that the thickness of a film layer is thinner still exists for a film layer coated on one side.

Disclosure of Invention

The present utility model aims to solve one of the problems of the prior art at least to some extent. Therefore, the utility model provides winding type double-sided coating equipment which can improve the thickness of the film layer of the substrate.

A roll-to-roll double-sided coating apparatus according to an aspect of the present utility model for coating both sides of a substrate, comprising: the first coating chamber and the second coating chamber are arranged below the first coating chamber and are communicated with the first coating chamber, a plurality of coating drums which are arranged along the horizontal direction are arranged in the first coating chamber and the second coating chamber, and each coating drum is provided with a coating source which is opposite to the coating drum; a feeding unit which is connected to one of the first plating chamber and the second plating chamber, and which holds the substrate in a roll shape and feeds the substrate toward the plating chamber connected thereto; a receiving unit which is connected to the other of the first plating chamber and the second plating chamber and receives the substrate, which is fed from the plating chamber adjacent thereto and has both sides plated, in a roll shape; the substrate is wound up from the feeding part through the coating drums in the first coating chamber and the coating drums in the second coating chamber in sequence in a manner that one surface of the substrate is opposite to the coating source in the first coating chamber and the other surface of the substrate is opposite to the coating source in the second coating chamber; or, the substrate is wound up from the feeding section sequentially through the plurality of coating drums in the second coating chamber and the plurality of coating drums in the first coating chamber so that one surface of the substrate faces the coating source in the second coating chamber and the other surface of the substrate faces the coating source in the first coating chamber.

The winding type double-sided coating equipment has the following beneficial effects: the thickness of the film layer of the substrate can be increased.

In some embodiments, the coating sources are disposed below the coating drums, respectively, opposite thereto.

In some embodiments, among the plurality of coating sources of the first coating chamber, at least one set of magnetron sputtering coating sources and at least one set of coating sources selected from electron beam coating sources and thermal evaporation coating sources are included; the magnetron sputtering coating source is arranged behind a coating source selected from the electron beam coating source and the thermal evaporation coating source along the transmission direction of the substrate.

In some embodiments, the magnetron sputtering coating source and the coating source selected from the electron beam coating source and the thermal evaporation coating source are alternately disposed in the first coating chamber along the transport direction of the substrate.

In some embodiments, among the plurality of coating sources of the second coating chamber, at least one set of magnetron sputtering coating sources and at least one set of coating sources selected from electron beam coating sources and thermal evaporation coating sources; the magnetron sputtering coating source is arranged behind a coating source selected from the electron beam coating source and the thermal evaporation coating source along the transmission direction of the substrate.

In some embodiments, the magnetron sputtering coating source and the coating source selected from the electron beam coating source and the thermal evaporation coating source are alternately disposed in the second coating chamber along the transport direction of the substrate.

In some embodiments, among the plurality of coating sources, a magnetron sputtering coating source is included, the magnetron sputtering coating source includes a plurality of sets of targets, the plurality of sets of targets are below the coating drum and circumferentially distributed around the coating drum, and the targets do not overlap with the coating drum above the coating drum in a top view.

In some embodiments, each of the magnetron sputtering coating sources includes four or more and ten or less of the targets.

In some embodiments, the feeding portion is disposed at one side of the first plating chamber in the horizontal direction, the receiving portion is disposed at one side of the second plating chamber in the horizontal direction, and the feeding portion and the receiving portion are on the same side.

In some embodiments, the apparatus further comprises a guide roller group that guides the substrate to the stock receiving portion in such a manner that the substrate is transported along a lower portion of each of the coating drums from the stock feeding portion.

In some embodiments, the device comprises a plurality of coating units spliced along the horizontal direction, wherein each coating unit comprises an upper coating chamber and a lower coating chamber, at least one coating drum is arranged in the upper coating chamber, and at least one coating drum is arranged in the lower coating chamber; the upper coating chambers together form one of the first coating chamber and the second coating chamber, and the lower coating chambers together form the other of the first coating chamber and the second coating chamber.

Drawings

FIG. 1 is a schematic view of one embodiment of a roll-to-roll double-sided coating apparatus of the present utility model.

Fig. 2 is a schematic view of another embodiment of the winding type double-sided plating apparatus of the present utility model.

Fig. 3 is a schematic view of another embodiment of the winding type double-sided plating apparatus of the present utility model.

Fig. 4 is a schematic view of another embodiment of the winding type double-sided plating apparatus of the present utility model.

Detailed Description

Examples of the present embodiment are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The examples described below by referring to the drawings are illustrative only for the explanation of the present embodiment and are not to be construed as limiting the present embodiment.

The drawings used in the present embodiment are schematic and schematic, and are merely for convenience in describing the present embodiment and for simplifying the description, and thus should not be construed as limiting the present embodiment.

In the description of the present embodiment, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present embodiment, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly, and those skilled in the art may reasonably determine the specific meaning of the above terms in the present embodiment in combination with the specific contents of the technical solution.

Fig. 1-4 are schematic diagrams of various embodiments of a roll-to-roll double-sided coating apparatus.

Referring to fig. 1 to 4, and mainly to fig. 1, a roll-to-roll type double-sided plating apparatus (hereinafter, sometimes simply referred to as "plating apparatus" for convenience of description) according to the present embodiment for plating both sides of a substrate 200, includes: a first coating chamber 101, a second coating chamber 102, a feeding part 103 and a receiving part 104. The first film plating chamber 101 and the second film plating chamber 102 are arranged in the vertical direction, and the second film plating chamber 102 is disposed below the first film plating chamber 101 and communicates with the first film plating chamber 101. The first film plating chamber 101 and the second film plating chamber 102 are respectively provided with a plurality of film plating drums 105 which are arranged along the horizontal direction, and each film plating drum 105 is respectively provided with a film plating source 106 opposite to the film plating drum. The feeding portion 103 is connected to one of the first plating chamber 101 and the second plating chamber 102. The feeding portion 103 holds the substrate 200 in a roll shape and feeds the substrate 200 toward a plating chamber (for example, a first plating chamber 101 in the drawing) connected thereto. The material receiving portion 104 is connected to the other of the first plating chamber 101 and the second plating chamber 102. The receiving portion 104 receives, in a roll, a substrate 200, which is fed from a coating chamber adjacent thereto (for example, the second coating chamber 102 in the drawing) and is coated on both surfaces. The substrate 200 is wound up in the material receiving section 104 from the feeding section 103 sequentially through the plurality of coating drums 105 in the first coating chamber 101 and the plurality of coating drums 105 in the second coating chamber 102 so that one surface faces the coating source 106 in the first coating chamber 101 and the other surface faces the coating source 106 in the second coating chamber 102. Alternatively, the substrate 200 may be wound up in the material receiving section 104 from the feeding section 103 sequentially through the plurality of coating drums 105 in the second coating chamber 102 and the plurality of coating drums 105 in the first coating chamber 101 so that one surface faces the coating source 106 in the second coating chamber 102 and the other surface faces the coating source 106 in the first coating chamber 101.

According to the winding type double-sided plating apparatus of the present embodiment, the thickness of the film layer of the substrate 200 can be increased. Specifically, since the plurality of coating drums 105 are provided in different coating chambers for coating the both surfaces of the substrate 200, and each of the coating drums 105 has the coating source 106 corresponding thereto, it is possible to perform a plurality of coating operations on one surface of the substrate 200 in one coating chamber, and thus it is possible to increase the thickness of the coating layer of the substrate 200. In addition, in the case of ensuring the thickness of the film layer of the substrate 200, since the plurality of film coating sources 106 are provided, since the film coating time required for each film coating source 106 in one film coating chamber can also be reduced, the time required to reach the required thickness of the film layer can be shortened, and the deposition rate can be increased.

In the following description, the conveyance direction of the substrate 200 is described as the front and rear for convenience. Specifically, the feeding portion 103 is positioned at the rearmost side of the conveyance direction of the substrate 200, and the receiving portion 104 is positioned at the foremost side of the conveyance path of the substrate 200. When referring to the coating drums 105 of the first coating chamber 101 or the coating drums 105 of the second coating chamber 102, it can be said that these coating drums 105 are located in front of the feeding section 103 and behind the receiving section 104.

Referring to fig. 1, two or more (i.e., a plurality of) coating drums 105 are provided in each of the first coating chamber 101 and the second coating chamber 102. In the following description, for convenience, the first plating chamber 101 and the second plating chamber 102 each have two plating drums 105 will be described as an example. The first plating chamber 101 and the second plating chamber 102 may be substantially rectangular plating chambers formed by joining plates such as stainless steel plates. The first coating chamber 101 is disposed directly above the second coating chamber 102. The first plating chamber 101 and the second plating chamber 102 may be partitioned by a partition 107 therebetween in the vertical direction, and a communication port 108 for the transfer of the substrate 200 is provided only at one side in the horizontal direction. In addition, the partition 107 may not be provided between the first plating chamber 101 and the second plating chamber 102 in the vertical direction, that is, the first plating chamber 101 and the second plating chamber 102 are completely opened in the vertical direction. Among the first coating chambers 101, the plurality of coating drums 105 are horizontally arranged at intervals in the first coating chamber 101, and the coating drums 105 may be located at the same position in the vertical direction in the first coating chamber 101 or may be offset from each other in the vertical direction. Similarly, in the second coating chamber 102, the plurality of coating drums 105 are horizontally arranged in the second coating chamber 102, and each of the coating drums 105 may be located at the same position in the vertical direction in the first coating chamber 101 or may be offset from each other in the vertical direction.

The dimensions of the plating drums 105 in the first plating chamber 101 and the second plating chamber 102 may be the same as each other, and for example, the diameter of the plating drum 105 may be 700mm or more and 900mm or less. In a specific embodiment, for example, the coating drum 105 may have a diameter of 800mm. In the coating apparatus of the present embodiment, since a plurality of coating drums 105 are provided in one coating chamber for coating one surface of the substrate 200, the diameter of the coating drum 105 can be reduced to some extent, and thus the entire coating apparatus can be miniaturized.

In addition, in order to evacuate the first plating chamber 101 and the second plating chamber 102, a plurality of evacuation pumps 109 may be installed on the wall portion of the first plating chamber 101 and/or the second plating chamber 102. The type of the vacuum pump 109 is not particularly limited, and for example, a molecular pump or the like may be selected. The installation position of the vacuum pump 109 is not particularly limited, and may be set in the upper part of the first plating chamber 101, the lower part of the second plating chamber 102, the side parts of the first plating chamber 101 and the second plating chamber 102, between the plating drums 105 of the first plating chamber 101, between the plating drums 105 of the second plating chamber 102, and the like. The installation positions, the number, and the like of the vacuum pumps 109 can be freely combined according to actual needs.

Referring to fig. 1-3, in some embodiments, the coating sources 106 are disposed below the coating drums 105, respectively, opposite thereto. Specifically, examples of the plating source 106 include: a magnetron sputtering coating source 110, an electron beam coating source 111, a thermal vapor deposition coating source 112, and the like. These plating sources 106 are each disposed below the plating drum 105 opposite thereto, so that falling off of dust, small pieces, and the like generated on the plating sources 106 onto the surface of the substrate 200 is suppressed. The lower part described here is not limited to the part directly below the plating drum 105, but includes a region extending in the circumferential direction with reference to the part directly below the plating drum 105. For example, it includes right under, side under, and the like of the plating drum 105.

With continued reference to fig. 1, for example, among the plurality of coating sources 106, the magnetron sputtering coating source 110 is included, the magnetron sputtering coating source 110 includes a plurality of sets of targets 113, the plurality of sets of targets 113 are disposed below the coating drum 105 around the circumference of the coating drum 105, and the targets 113 do not overlap with the coating drum 105 above the coating drum 105 in a top view. For example, referring to fig. 1, the coating sources 106 of the first coating chamber 101 may be all magnetron sputtering coating sources 110, whereby the adhesion of the coating layer on the substrate 200 can be improved. By using the magnetron sputtering coating source 110, the adhesion of the coating layer on the substrate 200 can be improved. Likewise, the coating sources 106 of the second coating chamber 102 may be all magnetron sputtering coating sources 110.

The magnetron sputtering coating source 110 includes, for example, a plurality of targets 113, and the targets 113 are uniformly distributed in the circumferential direction of the coating drum 105 from immediately below the coating drum 105. Preferably, the height of the targets 113 distributed along the circumferential direction of the plating drum 105 is at a position of 1/2 or more and 2/3 or less of the diameter of the plating drum 105 from the lower end portion directly below the plating drum 105. In the drawings, the height of the target 113 does not reach 1/2 or more of the diameter of the coating drum 105 for convenience. By making the height of the target 113 distributed along the circumferential direction of the plating drum 105 be 1/2 or more of the height of the diameter of the plating drum 105 from the lower end of the plating drum 105, more targets 113 can be arranged as much as possible, so that a larger area of the substrate 200 can be simultaneously deposited with plating, and the deposition rate can be increased. Further, by setting the height of the target 113 distributed along the circumferential direction of the coating drum 105 to a height of 2/3 or less of the diameter of the coating drum 105 from the lower end of the coating drum 105, it is possible to ensure that the target 113 does not overlap the coating drum 105 above the coating drum 105 in a plan view, and to suppress dust, small pieces, or the like generated on the target 113 from falling on the surface of the substrate 200, thereby improving the quality of the film. In the case where the height of the targets 113 distributed in the circumferential direction of the coating drum 105 is at a position of 1/2 or more and 2/3 or less of the diameter of the coating drum 105 from the lower end portion of the coating drum 105, the number of targets 113 is not particularly limited, and for example, each magnetron sputtering coating source 110 may include four or more and ten or less targets 113. For example, the target 113 may be symmetrically disposed on both sides of the coating drum 105 with reference to the lower end portion directly below the drum.

With continued reference to fig. 2 and 3, in addition, in order to further increase the thickness of the film, among the plurality of film sources 106 in the first film plating chamber 101, at least one set of magnetron sputtering film plating sources 110 and at least one set of film plating sources 106 selected from the group consisting of electron beam film plating sources 111 and thermal vapor deposition film plating sources 112 are included. The magnetron sputtering source 110 is disposed behind the coating source 106 selected from the electron beam source 111 and the thermal vapor deposition source 112 along the transport direction of the substrate 200. Similarly, among the plurality of coating sources 106 in the second coating chamber 102, at least one set of magnetron sputtering coating sources 110 and at least one set of coating sources 106 selected from the group consisting of electron beam coating sources 111 and thermal vapor deposition coating sources 112 are also included. The magnetron sputtering source 110 is disposed behind the coating source 106 selected from the electron beam source 111 and the thermal vapor deposition source 112 along the transport direction of the substrate 200. The arrangement of the plating source 106 in the first plating chamber 101 may be substantially the same as the arrangement of the plating source 106 in the second plating chamber 102, and thus both are collectively described herein, and individually described when necessary.

Referring to fig. 2 and 3, the first plating chamber 101 and the second plating chamber 102 each have two plating drums 105. For example, after the substrate 200 fed from the material receiving unit 104 first enters the first plating chamber 101 (may be the second plating chamber 102), the plating source 106 facing the first plating drum 105 (for convenience of explanation, also referred to as "first plating drum 114") is the magnetron sputtering plating source 110, and after the first layer is deposited on the surface of the substrate 200 by the magnetron sputtering plating source 110, the plating source 106 facing the second plating drum 105 (for convenience of explanation, also referred to as "second plating drum 115") is the electron beam plating source 111 and the thermal evaporation plating source 112, whereby the plating can be rapidly continued on the surface of the base layer and the thickness of the layer can be increased. After the film formation on one surface of the substrate 200 is completed, the substrate 200 enters the second film formation chamber 102 (may also be the first film formation chamber 101), the film formation source 106 opposite to the first film formation drum 105 (for convenience of description, also referred to as "third film formation drum 116") is the magnetron sputtering film formation source 110, and after the first film layer is deposited on the surface of the substrate 200 by the magnetron sputtering film formation source 110, the film formation source 106 opposite to the second film formation drum 105 (for convenience of description, also referred to as "fourth film formation drum 117") is the electron beam film formation source 111 and the thermal evaporation film formation source 112, whereby film formation can be rapidly continued on the surface of the base layer, and the thickness of the film layer can be increased.

Thus, in each of the plating chambers, by providing the magnetron sputtering plating source 110 as the first plating source 106 along the transport direction of the substrate 200, the adhesion of the plated film layer can be improved, and thereafter, by using the electron beam plating source 111 and the thermal evaporation plating source 112, the thickness of the film layer can be improved and the deposition rate can be improved.

Referring to fig. 4, in the case where three or more plating sources 106 are provided in the plating chamber, for example, the magnetron sputtering plating source 110 and the plating source 106 selected from the electron beam plating source 111 and the thermal vapor deposition plating source 112 may be alternately provided in the first plating chamber 101 along the transport direction of the substrate 200. That is, along the transport direction of the substrate 200, the substrate 200 is first coated with a magnetron sputtering coating source 110, then coated with an electron beam coating source 111 or a thermal evaporation coating source 112, and then further coated with a magnetron sputtering coating source 110. Similarly, in the second plating chamber 102, the magnetron sputtering plating source 110 and the plating source 106 selected from the electron beam plating source 111 and the thermal vapor plating source 112 may be alternately disposed along the transport direction of the substrate 200 in the second plating chamber 102. By alternately disposing the electron beam plating source 111 or the thermal vapor plating source 112 and the magnetron sputtering plating source 110, not only the thickness of the plating layer can be increased, but also the adhesion of the plating layer can be ensured. For example, the deposition rates of the electron beam deposition source 111 and the thermal vapor deposition source 112 may be as high as a micrometer scale, and the deposition rate may be greatly increased as compared with the magnetron sputtering deposition source 110 having a deposition rate of approximately a nanometer scale. Thereby, the thickness of the plating layer and the deposition rate can be increased. In addition, by using the plating layer formed by the magnetron sputtering plating source 110 as the underlayer film in the first layer of the plating layer, damage to the substrate 200 can be suppressed and the adhesion of the film layer can be greatly improved.

With continued reference to fig. 1-3, in some embodiments, the feeding portion 103 may be disposed on one side of the first coating chamber 101 in the horizontal direction, the receiving portion 104 may be disposed on one side of the second coating chamber 102 in the horizontal direction, and the feeding portion 103 and the receiving portion 104 are on the same side. Specifically, the material receiving portion 104 is provided on the same side in the horizontal direction as the first plating chamber 101 and the second plating chamber 102, and the material feeding portion 103 is located above the material receiving portion 104. The communication port 108 for conveying the substrate 200 is provided on the opposite side of the feeding portion 103 and the receiving portion 104. That is, the substrate 200 fed from the feeding unit 103 first enters the first coating chamber 101, and when passing through the plurality of coating drums 105 of the first coating chamber 101, one surface thereof is coated by the coating sources 106 corresponding to the coating drums 105. Then, the substrate 200 passes through the communication port 108 to enter the second plating chamber 102, and is plated on the other surface thereof by the plating sources 106 corresponding to the plating drums 105 while passing through the plurality of plating drums 105 of the second plating chamber 102. After coating the both sides of the substrate 200, the substrate 200 is wound up by the take-up section 104. Thereby, the double-sided plating of the substrate 200 is completed.

The feeding section 103 has a feeding chamber 118 and a feeding mechanism 119 provided in the feeding chamber 118. The feeding chamber 118 communicates with the first plating chamber 101, and a first gate valve 120 is provided between the feeding chamber 118 and the first plating chamber 101. The substrate 200 fed from the feeding mechanism 119 passes through the first gate valve 120 and then enters the first film plating chamber 101. The feeding mechanism 119 may be selected from feeding mechanisms 119 known to those skilled in the art, and will not be described in detail herein. In addition, when the material is to be changed, the first gate valve 120 is closed to separate the first coating chamber 101 from the feeding chamber 118, thereby maintaining the vacuum state of the first coating chamber 101, and the feeding chamber 118 is broken to be vacuumized, thereby changing the material. After the completion of the reloading, the feeding chamber 118 is evacuated and then the first gate valve 120 is opened, thereby allowing the feeding chamber 119 to communicate with the first plating chamber 101.

Similarly, the receiving unit 104 includes a receiving chamber 121 and a receiving mechanism 122 provided in the receiving chamber 121. The material receiving chamber 121 is communicated with the second coating chamber 102, and a second gate valve 123 is arranged between the material receiving chamber 121 and the second coating chamber 102. The substrate 200 fed out from the second coating chamber 102 passes through the second gate valve 123 and then into the collecting chamber 121. Likewise, the receiving mechanism 122 may be selected from receiving mechanisms 122 known to those skilled in the art. In addition, when the blanking is required, the second gate valve 123 is closed to separate the second coating chamber 102 from the receiving chamber 121, so that the vacuum state of the second coating chamber 102 is maintained, and the receiving chamber 121 is broken to be vacuumized, so that the material is changed. After the completion of the reloading, the loading chamber 121 is evacuated, and then the second gate valve 123 is opened, thereby allowing the loading chamber 121 to communicate with the second plating chamber 102.

Thus, the uncoated substrate 200 fed from the feeding unit 103 first enters the first coating chamber 101, after one surface is coated, enters the second coating chamber 102 through the communication port 108, and after the other surface is coated, enters the receiving unit 104 from the second coating chamber 102. In the present embodiment, by positioning the feeding portion 103 and the receiving portion 104 on the same side in the horizontal direction in the first plating chamber 101 and the second plating chamber 102, not only feeding and discharging but also maintenance can be facilitated.

In addition, although the feeding portion 103 is provided on one side in the horizontal direction of the first plating chamber 101 and the receiving portion 104 is provided on one side in the horizontal direction of the second plating chamber 102, it is described above, but the present utility model is not limited thereto. The feeding portion 103 may be provided on one side of the second plating chamber 102 in the horizontal direction, and the receiving portion 104 may be provided on one side of the first plating chamber 101 in the horizontal direction.

With continued reference to fig. 1, the coating apparatus of the present embodiment further includes a guide roller group 124, and the guide roller group 124 guides the substrate 200 to the stock portion 104 in such a manner that the substrate 200 is transported along the lower portion of each coating drum 105 from the stock portion 103. Taking the example in which the feeding portion 103 is provided on one side of the first plating chamber 101 in the horizontal direction and the receiving portion 104 is provided on one side of the second plating chamber 102 in the horizontal direction, the description will be made. For example, the guide roller set 124 includes a first roller set 125 associated with the first coating drum 114, and among the first roller set 125, for example, a first guide roller 126, a second guide roller 127, and a third guide roller 128 are included. The first guide roller 126 is disposed behind the first coating drum 114 in the transport direction of the substrate 200 and higher than the first coating drum 114. The second guide roller 127 and the third guide roller 128 are respectively on both sides of a position above the center of the first plating drum 114 and are close to the first plating drum 114. Thereby, the substrate 200 fed from the feeding portion 103 is guided to the lower portion of the first coating drum 114 via the first guide roller 126 and the second guide roller 127, and is further pulled up from the lower portion of the first coating drum 114 via the third guide roller 128.

Likewise, the guide roller set 124 also includes a second roller set 128 associated with the second coating drum 115, the second roller set 128 being similar to the first roller set 125. For example, the second roller group 128 includes a fourth guide roller 129, a fifth guide roller 130, and a sixth guide roller 131. The fourth guide roller 129 is disposed in front of the third guide roller 128 in the transport direction of the substrate 200 and is higher than the second plating drum 115. The fifth guide roller 130 and the sixth guide roller 131 are respectively located on both sides of the position above the center of the second plating drum 115 and close to the second plating drum 115. Thereby, the substrate 200 fed from the first coating drum 114 is lifted by the fourth guide roller 129, guided to the lower portion of the second coating drum 115 via the fifth guide roller 130, and continuously pulled up from the lower portion of the second coating drum 115 via the sixth guide roller 131.

The substrate 200 was guided by the same guiding method for both the third coating drum 116 and the fourth coating drum 117. In addition, the guide roller group 124 further includes a tensioning mechanism 132 or the like provided at the other side of the first plating chamber 101 and the second plating chamber 102 in the horizontal direction.

By providing the guide roller group 124 for guiding the substrate 200 to the collecting section 104 so that the substrate 200 is transported along the lower portion of each coating drum 105 from the feeding section 103, it is possible to not only realize coating of both sides of the substrate 200, but also greatly reduce the number of rollers, simplify the structure of the distribution of the rollers, and further, at the time of re-feeding the substrate 200, it is possible to perform feeding very easily without complicated feeding work.

With continued reference to fig. 3, in addition, by providing such a guide roller set 124, splicing of the coating equipment can also be achieved very easily. Specifically, for example, in some embodiments, the coating apparatus may further include a plurality of coating units 133 spliced in a horizontal direction, where each coating unit 133 includes an upper coating chamber 134 and a lower coating chamber 135, at least one coating drum 105 is disposed in the upper coating chamber 134, and at least one coating drum 105 is disposed in the lower coating chamber 135. The plurality of upper coating chambers 134 together form one of the first coating chamber 101 and the second coating chamber 102, and the plurality of lower coating chambers 135 together form the other of the first coating chamber 101 and the second coating chamber 102.

Specifically, for example, in the above example of the coating apparatus having the first coating chamber 101 and the second coating chamber 102 each having two coating drums 105, the coating apparatus may be formed by splicing two coating units 133. The first coating drum 114 is disposed in the upper coating chamber 134 of one of the coating units 133, and the fourth coating drum 117 is disposed in the lower coating chamber 135. And the second coating drum 115 is disposed in the upper coating chamber 134 of the other coating unit 133, and the third coating drum 116 is disposed in the lower coating chamber 135. In addition, a first roller set 125 is disposed in the upper layer coating chamber 134 of one coating unit 133, and a second roller set 128 may be disposed in the upper layer coating chamber 134 of the other coating unit 133. Thus, when the coating drum 105 needs to be added, the coating unit 133 may be continuously spliced in the horizontal direction. In addition, since the upper coating chamber 134 and the lower coating chamber 135 of each coating unit 133 are respectively provided with the guide rollers having similar distribution structures, the substrate 200 is directly subjected to the same winding process without complicated winding processes during splicing, and complicated feeding operations are not required. In addition, since more coating units 133 can be conveniently spliced, the coating source 106 can be increased according to actual needs, and thus the thickness of the coating layer of the coating film can be easily increased and the deposition rate can be increased.

While examples of the present embodiment have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the embodiments, the scope of which is defined by the claims and their equivalents.

Claims (11)

1. Winding type double-sided coating equipment is used for coating film on the double sides of a substrate, and is characterized by comprising:

the first coating chamber and the second coating chamber are arranged below the first coating chamber and are communicated with the first coating chamber, a plurality of coating drums which are arranged along the horizontal direction are arranged in the first coating chamber and the second coating chamber, and each coating drum is provided with a coating source which is opposite to the coating drum;

a feeding unit which is connected to one of the first plating chamber and the second plating chamber, and which holds the substrate in a roll shape and feeds the substrate toward the plating chamber connected thereto;

a receiving unit which is connected to the other of the first plating chamber and the second plating chamber and receives the substrate, which is fed from the plating chamber adjacent thereto and has both sides plated, in a roll shape;

the substrate is wound up from the feeding part through the coating drums in the first coating chamber and the coating drums in the second coating chamber in sequence in a manner that one surface of the substrate is opposite to the coating source in the first coating chamber and the other surface of the substrate is opposite to the coating source in the second coating chamber; or,

the substrate is wound up from the feeding section sequentially through the coating drums in the second coating chamber and the coating drums in the first coating chamber in such a manner that one surface of the substrate faces the coating source in the second coating chamber and the other surface of the substrate faces the coating source in the first coating chamber.

2. The winding type double-sided plating apparatus according to claim 1, wherein the plating sources are disposed below the plating drums, respectively, opposite thereto.

3. The roll-to-roll double-sided coating apparatus of claim 1 or 2, wherein among the plurality of coating sources of the first coating chamber, at least one set of magnetron sputtering coating sources and at least one set of coating sources selected from the group consisting of electron beam coating sources and thermal evaporation coating sources;

the magnetron sputtering coating source is arranged behind a coating source selected from the electron beam coating source and the thermal evaporation coating source along the transmission direction of the substrate.

4. A winding type double-sided plating apparatus according to claim 3, wherein the magnetron sputtering plating source and a plating source selected from the electron beam plating source and the thermal vapor plating source are alternately arranged in the first plating chamber along the transport direction of the substrate.

5. The roll-to-roll double-sided coating apparatus of claim 1 or 2, wherein among the plurality of coating sources of the second coating chamber, at least one set of magnetron sputtering coating sources and at least one set of coating sources selected from the group consisting of electron beam coating sources and thermal evaporation coating sources;

the magnetron sputtering coating source is arranged behind a coating source selected from the electron beam coating source and the thermal evaporation coating source along the transmission direction of the substrate.

6. The roll-to-roll double-sided coating apparatus according to claim 5, wherein the magnetron sputtering coating source and a coating source selected from the electron beam coating source and the thermal vapor deposition coating source are alternately disposed in the second coating chamber along the transport direction of the substrate.

7. The roll-to-roll double-sided coating apparatus according to claim 1 or 2, characterized in that among the plurality of coating sources, a magnetron sputtering coating source is included, the magnetron sputtering coating source includes plural sets of targets, plural sets of targets are below the coating drum, distributed around the circumference of the coating drum, and the targets do not coincide with the coating drum above the coating drum in a plan view.

8. The roll-to-roll double-sided coating apparatus of claim 7, wherein each of the magnetron sputtering coating sources comprises four or more and ten or less of the targets.

9. The winding type double-sided plating apparatus according to claim 1, wherein the feeding portion is provided at one side of the first plating chamber in the horizontal direction, the receiving portion is provided at one side of the second plating chamber in the horizontal direction, and the feeding portion and the receiving portion are on the same side.

10. The roll-to-roll double-sided coating apparatus according to claim 1 or 9, further comprising a guide roller group that guides the substrate to the stock section in such a manner that the substrate is transported along the lower portion of each of the coating drums, starting from the stock section.

11. The winding type double-sided coating equipment according to claim 10, comprising a plurality of coating units spliced in the horizontal direction, wherein each coating unit comprises an upper coating chamber and a lower coating chamber, at least one coating drum is arranged in the upper coating chamber, and at least one coating drum is arranged in the lower coating chamber;

the upper coating chambers together form one of the first coating chamber and the second coating chamber, and the lower coating chambers together form the other of the first coating chamber and the second coating chamber.