WO2023155518A1 - 加热元件及电子雾化装置 - Google Patents

加热元件及电子雾化装置 Download PDF

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WO2023155518A1
WO2023155518A1 PCT/CN2022/133177 CN2022133177W WO2023155518A1 WO 2023155518 A1 WO2023155518 A1 WO 2023155518A1 CN 2022133177 W CN2022133177 W CN 2022133177W WO 2023155518 A1 WO2023155518 A1 WO 2023155518A1
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film layer
heating
heating element
radiation
thickness
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PCT/CN2022/133177
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English (en)
French (fr)
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杜贤武
李欢喜
周宏明
李日红
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海南摩尔兄弟科技有限公司
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Publication of WO2023155518A1 publication Critical patent/WO2023155518A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means

Definitions

  • the present application relates to the technical field of atomization, in particular to a heating element and an electronic atomization device.
  • Aerosol is a colloidal dispersion system formed by dispersing small solid or liquid particles and suspending them in a gas medium. Aerosol can be absorbed by the human body through the respiratory system, providing users with a new alternative absorption method. For example, electronic atomization devices that can generate aerosols by baking and heating herbal or ointment aerosol-generating substrates are used in different fields to deliver inhalable aerosols to users, replacing conventional product forms and absorption Way.
  • the electronic atomization device uses a heating element to heat the aerosol-generating substrate to generate an aerosol for the user to inhale.
  • the heating element generally includes a substrate and a heating film layer.
  • the thickness of the heating film layer of the heating element in the prior art is relatively thin and the strength is poor, and it is easy to crack during use. Therefore, the resistance value of the heating film layer is relatively stable. Poor, as the number of times of use increases, the resistance of the heating film layer tends to change, which makes it difficult to control the heating temperature of the heating element.
  • a heating element and an electronic atomization device are provided.
  • the heating element includes a base body and a heating film layer arranged on the base body.
  • the thickness of the heating film layer is 5 ⁇ m to 15 ⁇ m.
  • the heating film layer is formed by a thick film printing process.
  • the heating film layer includes a first pattern area and a first hollow area; the heating element further includes a radiation film layer disposed on the substrate, and the radiation film layer includes a second pattern area and a second hollow area; the first hollow area corresponds to the second pattern area, and the second hollow area corresponds to the first pattern area.
  • the heating element further includes a radiation film layer disposed on the substrate, and the thickness of the radiation film layer is 10 ⁇ m ⁇ 100 ⁇ m.
  • the thickness of the radiation film layer is 20 ⁇ m ⁇ 40 ⁇ m.
  • the radiation film layer is formed by a thick film printing process.
  • the heating element further includes a radiation film layer disposed on the substrate, and the thickness of the radiation film layer is 1 ⁇ m ⁇ 10 ⁇ m.
  • the thickness of the radiation film layer is 1 ⁇ m ⁇ 5 ⁇ m.
  • the radiation film layer is formed by a thin film coating process.
  • the base has an accommodating cavity for accommodating the aerosol-generating substrate, and the heating film layer is arranged on the outer surface of the base.
  • the base has an accommodating cavity for accommodating the aerosol-generating substrate, and the heating film layer is arranged on the inner surface of the base
  • the base body is a cylindrical structure.
  • the base body is a solid structure
  • the heating film layer is provided on the outer surface of the base body.
  • the base body is in the shape of a pin.
  • An electronic atomization device comprising the heating element as described in any one of the above.
  • Fig. 1 is a perspective view of an electronic atomization device provided by an embodiment.
  • Fig. 2 is a perspective view of a heating element provided by an embodiment.
  • FIG. 3 is an exploded view of the heating element shown in FIG. 2 .
  • FIG. 4 is a perspective view of the heating film layer shown in FIG. 3 .
  • Fig. 5 is an exploded view of another embodiment of a heating element.
  • Fig. 6 is a perspective view of a heating element provided by another embodiment.
  • FIG. 7 is an exploded view of the heating element shown in FIG. 6 .
  • Fig. 8 is a perspective view of a heating element provided by another embodiment.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • the features defined as “first” and “second” may explicitly or implicitly include at least one of these features.
  • “plurality” means at least two, such as two, three, etc., unless otherwise specifically defined.
  • a first feature being "on” or “under” a second feature may mean that the first and second features are in direct contact, or that the first and second features are indirect through an intermediary. touch.
  • “above”, “above” and “above” the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • “Below”, “beneath” and “beneath” the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.
  • an embodiment of the present application provides an electronic atomization device 200 , which includes a heating element 100 .
  • the electronic atomization device 200 uses the heating element 100 to heat the aerosol generating substrate, so that the aerosol generating substrate is heated and baked to volatilize corresponding components to form an aerosol.
  • a suction airflow is generated, and the generated aerosol enters the user's oral cavity following the suction airflow, and is sucked by the user.
  • the heating element 100 includes a substrate 10 and a heating film layer 20 , and the heating film layer 20 is disposed on the substrate 10 .
  • the heating film layer 20 is energized to generate heat to heat the aerosol generating substrate.
  • the material of the substrate 10 is selected from at least one of transparent quartz glass, sapphire single crystal, yttrium aluminum garnet, magnesium aluminum spinel, magnesium fluoride, yttrium oxide and aluminum oxynitride.
  • the base body 10 is approximately hollow cylindrical, and the base body 10 is axially penetrated with an accommodating cavity 11 .
  • the aerosol-generating substrate can be inserted into the accommodating chamber 11 .
  • the heating film layer 20 is disposed on the outer surface of the substrate 10 . When the heating film layer 20 is energized to generate heat, the aerosol generating substrate located in the accommodating cavity 11 can be heated to generate atomized gas for the user to inhale. It can be understood that, in some other embodiments, one end of the accommodating cavity 11 may also be closed, and the other end forms an opening for inserting the aerosol generating matrix. In another embodiment, the heating film layer 20 may also be disposed on the inner surface of the base body 10 , that is, on the sidewall of the accommodating cavity 11 .
  • the base body 10 is substantially in the shape of a solid cylinder, that is, the base body 10 does not have an accommodating cavity 11 .
  • the matrix 10 can now be inserted into the aerosol-generating matrix.
  • the heating film layer 20 is energized to generate heat
  • the aerosol-generating substrate located around the substrate 10 can be heated to generate nebulized gas for inhalation by the user.
  • the base body 10 may be in the shape of a pin, which facilitates the insertion of the heating element 100 into the aerosol-generating substrate to heat the aerosol-generating substrate. It can be understood that, in some other embodiments, the base body 10 may also be configured as a sheet structure, which is not specifically limited here.
  • the thickness of the base body 10 (that is, the distance between the inner surface and the outer surface of the base body 10 ) can be set at 0.5mm ⁇ 1.5mm. In this way, the heat conduction effect of the base body 10 is improved while ensuring the strength of the base body 10 .
  • the wall thickness of the base body 10 is 0.5 mm ⁇ 1.0 mm.
  • the thickness of the heating film layer 20 is 5 ⁇ m ⁇ 15 ⁇ m.
  • the thickness of the heating film layer 20 is 5 ⁇ m to 15 ⁇ m, compared with the heating element 100 in the prior art, the thickness of the heating film layer 20 is increased, so that the heating film layer 20 of the heating element 100 is not easy to crack during use, and The resistance change rate of the heating film layer 20 is small, which is convenient for controlling the heating temperature of the heating element 100 .
  • the thickness of the heating film layer 20 is 8 ⁇ m ⁇ 12 ⁇ m, for example, 10 ⁇ m.
  • the thickness of the heating film layer 20 is the thickness of the heating film layer 20 covering the substrate 10 .
  • the thickness of the heating film layer 20 is the thickness of the paste printed on the outer surface of the substrate 10 .
  • the above-mentioned heating film layer 20 can be formed by thick film printing process.
  • the thick film printing process can print the paste formed by the heating material on the substrate 10 according to a certain thickness and shape, so as to facilitate the formation of the heating film layer 20 with the above-mentioned thickness.
  • the heating film layer 20 is formed by the thick film printing process, not only the process is simple, the production efficiency is high, and the resistance value of the heating film layer 20 is consistent.
  • the heating film layer 20 can be designed in any pattern according to the requirements of the temperature field. The design space of the temperature field is large, and the resistance value range of the heating film layer pattern is controlled within 0.1 ohm to 2.0 ohm.
  • the material of the heating film layer 20 can be selected from materials with a temperature coefficient of resistance (TCR) greater than 1000ppm/°C, such as copper, aluminum, silver, platinum, etc., to facilitate temperature measurement by detecting changes in the resistance value of the heating film layer.
  • TCR temperature coefficient of resistance
  • the heating element 100 also includes a radiation film layer 30 disposed on the substrate 10 .
  • the radiation film layer 30 can be heated by the heating film layer 20 and then emit infrared radiation, so as to radiatively heat the aerosol-generating substrate. It can be understood that, in some other embodiments, the radiation film layer 30 may also be omitted.
  • both the radiation film layer 30 and the heating film layer 20 are disposed on the outer surface of the substrate 10 .
  • the radiation film layer 30 is arranged on the outer surface of the substrate 10, and the heating film layer 20 covers the radiation film layer 30.
  • This arrangement can maximize the infrared radiation area of the radiation film layer 30 and improve the radiation power.
  • the heating film layer 20 is arranged on the outer surface of the substrate 10, and the radiation film layer 30 is covered on the heating film layer 20. With this arrangement, the radiation film layer 30 can heat the The film layer 20 performs a certain isolation protection.
  • the radiation film layer 30 may cover a part of the outer surface of the base body 10 , or cover the entire outer surface of the base body 10 .
  • the area of the heating film layer 20 is not larger than the area of the radiating film layer 30, so as to save the material of the heating film layer 20 and make the radiating film layer 30 play a better radiation effect.
  • the radiation film layer 30 may also be provided on the inner surface of the base 10
  • the heating film layer 20 may be provided on the outer surface of the base 10 .
  • the thickness of the radiation film layer 30 is 10 ⁇ m ⁇ 100 ⁇ m.
  • the thickness of the radiation film layer 30 is the thickness of the radiation film layer 30 covering the substrate 10 .
  • the thickness of the radiation film layer 30 is the thickness of the paste printed on the outer surface of the substrate 10 .
  • the radiation film layer 30 with the above thickness improves the heat radiation effect.
  • the thickness of the radiation film layer 30 is 20 ⁇ m ⁇ 40 ⁇ m.
  • the radiation film layer 30 is formed by a thick film printing process.
  • the thick film printing process can print the radiation paste on the substrate 10 according to a certain thickness and shape, so as to facilitate the formation of the radiation film layer 30 with the above-mentioned thickness.
  • the thick film printing process can make the composition of the radiation film adjustable in a large range, and it is convenient to adjust the infrared spectral emissivity.
  • the material of the radiation film layer 30 is selected from at least one of HBQ black silicon, cordierite, transition metal oxide series spinel, rare earth oxide, ion co-doped perovskite, silicon carbide, zircon and boron nitride. A sort of.
  • the thickness of the radiation film layer 30 may also be set to 1 ⁇ m ⁇ 10 ⁇ m, so as to facilitate the manufacture of the radiation film layer 30 . In some embodiments, the thickness of the radiation film layer 30 is 1 ⁇ m ⁇ 5 ⁇ m. At this time, the radiation film layer 30 is formed by thin film evaporation.
  • the material of the radiation film layer 30 can be CrC, TiCN, diamond-like carbon film (DLC) and so on.
  • the heating film layer 20 includes a complementary first pattern area 21 and a first hollow area 22
  • the radiation film layer 30 includes a complementary second pattern area 31 and a second hollow area 32 .
  • the first hollow area 22 at least partially corresponds to the second pattern area 31, and the second hollow area 32 at least partially corresponds to the first pattern area 21, so as to reduce the heat loss of the base 10 radiated outward, which is beneficial to reduce the outer surface of the base 10. temperature rise.
  • the heating element 100 further includes an electrode 40 disposed on the substrate 10 and electrically connected to the heating film layer 20 to make the heating film layer 20 energized and generate heat.
  • the heating element 100 includes two electrodes 40 , and the two electrodes 40 are respectively electrically connected to two ends of the heating film layer 20 .
  • the shape of the electrode 40 matches the shape of the base body 10 .
  • the electrode 40 is arc-shaped.
  • the shape of the electrode 40 also changes accordingly.
  • the heating element 100 and the electronic atomization device provided in the above embodiments have the following beneficial effects:
  • the thickness of the heating film layer 20 is set to 5 ⁇ m to 15 ⁇ m, that is, the thickness of the heating film layer 20 is larger than that of the heating film layer in the prior art, so that the heating film layer 20 is not easy to crack during the use of the heating element 100 , and the resistance value of the heating film layer 20 is not easy to change, and the thermal stability is good.
  • the resistance change rate of the heating film layer 20 is small, which is convenient for controlling the heating temperature of the heating element 100 .
  • the heating film layer 20 is formed by a thick film printing process.
  • the thick film printing process is simple and the production efficiency is high, so that the resistance value of the heating film layer 20 is consistent.
  • the thickness of the radiation film layer 30 is 10 ⁇ m-100 ⁇ m, which improves the heat radiation effect of the heat radiation film layer 30 compared with the thinner radiation film layer in the prior art.
  • the radiation film layer 30 is formed by a thick film printing process, which can make the components of the radiation film layer 30 adjustable in a wide range, and facilitate the adjustment of the infrared spectral emissivity.

Abstract

一种加热元件(100)及电子雾化装置(200)，加热元件包括基体(10)及设置于基体(10)上的加热膜层(20)，加热膜层(20)的厚度为5μm～15μm。

Description

加热元件及电子雾化装置
相关申请的交叉引用
本申请要求2022年2月17日申请的，申请号为2022203244012，名称为“加热元件及电子雾化装置”的中国专利申请的优先权，在此将其全文引入作为参考。
技术领域
本申请涉及雾化技术领域，特别是涉及一种加热元件及电子雾化装置。
背景技术
气溶胶是一种由固体或液体小质点分散并悬浮在气体介质中形成的胶体分散体系，气溶胶可通过呼吸系统被人体吸收，为用户提供一种新型的替代吸收方式。例如，可对草本类或膏类的气溶胶生成基质烘烤加热而产生气溶胶的电子雾化装置，应用于不同领域中，为用户递送可供吸入的气溶胶，替代常规的产品形态及吸收方式。
电子雾化装置利用加热元件对气溶胶生成基质进行加热，以产生供用户吸食的气溶胶。加热元件一般包括基体及加热膜层，然而，现有技术中的加热元件的加热膜层的厚度较薄而强度较差，在使用过程中容易开裂，因此加热膜层的阻值的稳定性较差，随着使用次数的增加，加热膜层的阻值易于发生变化，从而导致加热元件的加热温度不便于控制。
发明内容
根据一些实施例，提供一种加热元件及电子雾化装置。
一种加热元件，所述加热元件包括基体及设置于所述基体上的加热膜层，所述加热膜层的厚度为5μm～15μm。
在其中一个实施例中，所述加热膜层采用厚膜印刷工艺制作形成。
在其中一个实施例中，所述加热膜层包括第一图案区域和第一镂空区域；所述加热元件还包括设置于所述基体上的辐射膜层，所述辐射膜层包括第二图案区域和第二镂空区域；所述第一镂空区域与所述第二图案区域对应，所述第二镂空区域与所述第一图案区域对应。
在其中一个实施例中，所述加热元件还包括设置于所述基体上的辐射膜层，所述辐射膜层的厚度为10μm～100μm。
在其中一个实施例中，所述辐射膜层的厚度为20μm～40μm。
在其中一个实施例中，所述辐射膜层采用厚膜印刷工艺形成。
在其中一个实施例中，所述加热元件还包括设置于所述基体上的辐射膜层，所述辐射膜层的厚度为1μm～10μm。
在其中一个实施例中，所述辐射膜层的厚度为1μm～5μm。
在其中一个实施例中，所述辐射膜层采用薄膜镀膜工艺形成。
在其中一个实施例中，所述基体内具有用于容置气溶胶生成基质的容置腔，所述加热膜层设于所述基体的外表面。
在其中一个实施例中，所述基体内具有用于容置气溶胶生成基质的容置腔，所述加热膜层设于所述基体的内表面
在其中一个实施例中，所述基体为圆筒状结构。
在其中一个实施例中，所述基体为实心结构，所述加热膜层设于所述基体的外表面。
在其中一个实施例中，所述基体呈销钉状。
一种电子雾化装置，包括如上述任一项所述的加热元件。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更清楚地说明本申请实施例或传统技术中的技术方案，下面将对实施例或传统技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据公开的附图获得其他的附图。
图1为一实施例提供的电子雾化装置的立体图。
图2为一实施例提供的加热元件的立体图。
图3为图2中所示的加热元件的爆炸图。
图4为图3所示的加热膜层的立体图。
图5为另一实施例的加热元件的爆炸图。
图6为另一实施例提供的加热元件的立体图。
图7为图6中所示的加热元件的爆炸图。
图8为又一实施例提供的加热元件的立体图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“上”、“下”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
请参阅图1，本申请一实施例提供了一种电子雾化装置200，该电子雾化装置包括加热元件100。上述电子雾化装置200利用加热元件100对气溶胶生成基质进行加热，使得气溶胶生成基质受热烘烤而挥发相应的成分从而形成气溶胶。用户对电子雾化装置或气溶 胶生成基质进行抽吸时产生抽吸气流，产生的气溶胶跟随抽吸气流进入用户口腔中，即被用户吸食。
参阅图2至图4，加热元件100包括基体10和加热膜层20，加热膜层20设于基体10上。加热膜层20通电产生热量，以对气溶胶生成基质进行加热。
基体10的材质选自透明石英玻璃、蓝宝石单晶、钇铝石榴石、镁铝尖晶石、氟化镁、氧化钇和氧氮化铝中的至少一种。
本实施例中，基体10大致为空心圆筒状，且基体10内沿轴向贯穿设置有容置腔11。气溶胶生成基质可以插入到容置腔11的内部。加热膜层20设置于基体10的外表面。当加热膜层20通电产生热量时，可以加热位于容置腔11的气溶胶生成基质以产生供使用者吸入的雾化气体。可以理解，在另一些实施例中，容置腔11的一端也可封闭，另一端形成供气溶胶生成基质插入的开口。在另一实施例中，加热膜层20也可以设置于基体10的内表面，即位于容置腔11的侧壁上。
请参阅图8，另一实施例中，基体10大致为实心圆柱状，即基体10不具有容置腔11。此时基体10可以插入到气溶胶生成基质中。当加热膜层20通电产生热量时，可以加热位于基体10周围的气溶胶生成基质以产生供使用者吸入的雾化气体。在一些实施例中，基体10可以为销钉状，这样可以方便加热元件100插入气溶胶生成基质中以加热气溶胶生成基质。可以理解的是，在另一些实施例中，基体10也可以设置为片状结构，在此不作具体限定。
当基体10具有容置腔11时，基体10的厚度(即基体10的内表面与外表面之间的间距)可以设置为0.5mm～1.5mm。如此在保证基体10强度的同时，提高基体10的导热效果。在一些实施例中，基体10的壁厚为0.5mm～1.0mm。
一实施例中，加热膜层20的厚度为5μm～15μm。当加热膜层20的厚度为5μm～15μm时，相对于现有技术中的加热元件100，增加了加热膜层20的厚度，使得加热元件100在使用的过程中加热膜层20不易开裂，且加热膜层20的阻值变化率小，进而便于方便控制加热元件100的加热温度。进一步地，加热膜层20的厚度为8μm～12μm，例如为10μm。
在此需要说明的是，上述加热膜层20的厚度为加热膜层20覆盖于基体10上的厚度。当加热膜层20采用厚膜印刷工艺制作形成时，加热膜层20的厚度为印刷至基体10外表面的浆料的厚度。
上述加热膜层20可以采用厚膜印刷工艺制作形成。厚膜印刷工艺能够将发热材料形成的浆料按照一定的厚度和形状印刷在基体10上，以方便形成上述厚度的加热膜层20。通过厚膜印刷工艺制作形成加热膜层20，不但工艺简单、生产效率高，且加热膜层20的 阻值一致性好。加热膜层20可以根据温度场要求进行任意图案设计，温度场可设计空间大，加热膜层图案的阻值范围控制在0.1欧姆～2.0欧姆。
具体地，加热膜层20的材料选择可以选择电阻温度系数(TCR)大于1000ppm/℃的材料，例如铜、铝、银、铂等，以方便通过检测加热膜层的阻值变化来测温。
加热元件100还包括设置于基体10上的辐射膜层30。当加热膜层20通电发热时，辐射膜层30能够被加热膜层20加热后进行红外辐射，以对气溶胶生成基质进行辐射加热。可以理解的是，在另一些实施例中，也可以省略辐射膜层30。
参阅图2及图3，本实施例中，辐射膜层30与加热膜层20均设于基体10的外表面上。具体的，辐射膜层30设置在基体10的外表面，加热膜层20覆盖在辐射膜层30上，此布置方式可最大限度增大辐射膜层30的红外辐射面积，提高辐射功率。参阅图6及图7，在另一个实施例中，加热膜层20设置在基体10的外表面，辐射膜层30覆盖在加热膜层20上，采用此布置方式，辐射膜层30可以对加热膜层20进行一定的隔离保护。
进一步地，辐射膜层30可覆盖基体10的局部外表面，也可以覆盖基体10的整个外表面。加热膜层20的区域不大于辐射膜层30的区域，以节省加热膜层20的材料，且使辐射膜层30发挥更好的辐射作用。
应当理解的是，在另一些实施例中，也可以将辐射膜层30设于基体10的内表面，而将加热膜层20设于基体10的外表面。
一个实施例中，辐射膜层30的厚度为10μm～100μm。上述辐射膜层30的厚度为辐射膜层30覆盖于基体10上的厚度。当辐射膜层30采用厚膜印刷工艺制作形成时，辐射膜层30的厚度为印刷至基体10外表面的浆料的厚度。相对于现有技术中厚度较薄的辐射膜层30，上述厚度的辐射膜层30提高了热辐射效果。在一些实施例中，辐射膜层30的厚度为20μm～40μm。辐射膜层30通过厚膜印刷工艺制作形成，厚膜印刷工艺能够将辐射浆料按照一定的厚度和形状印刷在基体10上，以方便形成上述厚度的辐射膜层30。且厚膜印刷工艺可以使辐射膜的成分的可调配范围大，方便调控红外的光谱发射率。具体地，辐射膜层30材质选自HBQ黑硅、堇青石、过渡金属氧化物系列尖晶石、稀土氧化物、离子共掺杂钙钛矿、碳化硅、锆英石和氮化硼中的至少一种。另一个实施例中，辐射膜层30的厚度也可以设置为1μm～10μm，以方便制作辐射膜层30。在一些实施例中，辐射膜层30的厚度为1μm～5μm。此时，辐射膜层30通过薄膜蒸镀方式制作形成。辐射膜层30的材质可为CrC、TiCN和类金刚石薄膜(DLC)等。
请参阅图5，加热膜层20包括互补的第一图案区域21及第一镂空区域22，辐射膜层30包括互补的第二图案区域31及第二镂空区域32。第一镂空区域22与第二图案区域31 至少部分相对应，第二镂空区域32与第一图案区域21至少部分相对应，以减小基体10向外辐射的热损失，有利于降低基体10外侧的温升。
参阅图2、图3及图5，加热元件100还包括电极40，电极40设置在基体10上，并与加热膜层20电连接，以使加热膜层20通电发热。在一实施例中，加热元件100包括两个电极40，两个电极40分别与加热膜层20的两端电连接。在此需要说明的是，电极40的形状与基体10的形状相适配。如当基体10为圆筒状结构时，电极40为圆弧状。当基体10的形状改变时，电极40的形状也做相应改变。
上述实施例提供的加热元件100及电子雾化装置，具有以下有益效果：
1、设置加热膜层20的厚度为5μm～15μm，即为加热膜层20的厚度比现有技术中的加热膜层的厚度大，使得在加热元件100的使用过程中加热膜层20不易开裂，且加热膜层20的阻值不易发生变化，热稳定性好。加热膜层20的阻值变化率小，进而便于方便控制加热元件100的加热温度。
2、加热膜层20通过厚膜印刷工艺制作形成，厚膜印刷工艺简单，生产效率高，使加热膜层20的阻值一致性好。
3、辐射膜层30的厚度为10μm～100μm，相对于现有技术中厚度较薄的辐射膜层，提高了热辐射膜层30的热辐射效果。
4、辐射膜层30通过厚膜印刷工艺制作形成，厚膜印刷工艺可以使辐射膜层30的成分的可调配范围大，方便调控红外的光谱发射率。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (11)

  1. 一种加热元件，包括基体及设置于所述基体上的加热膜层，其中所述加热膜层的厚度为5μm～15μm。
  2. 根据权利要求1所述的加热元件，其特征在于，所述加热膜层包括第一图案区域和第一镂空区域；所述加热元件还包括设置于所述基体上的辐射膜层，所述辐射膜层包括第二图案区域和第二镂空区域；所述第一镂空区域与所述第二图案区域对应，所述第二镂空区域与所述第一图案区域对应。
  3. 根据权利要求1所述的加热元件，其特征在于，还包括设置于所述基体上的辐射膜层，所述辐射膜层的厚度为10μm～100μm。
  4. 根据权利要求3所述的加热元件，其特征在于，所述辐射膜层的厚度为20μm～40μm。
  5. 根据权利要求1所述的加热元件，其特征在于，还包括设置于所述基体上的辐射膜层，所述辐射膜层的厚度为1μm～10μm。
  6. 根据权利要求5所述的加热元件，其特征在于，所述辐射膜层的厚度为1μm～5μm。
  7. 根据权利要求1所述的加热元件，其特征在于，所述基体内具有用于容置气溶胶生成基质的容置腔，所述加热膜层设于所述基体的外表面。
  8. 根据权利要求1所述的加热元件，其特征在于，所述基体内具有用于容置气溶胶生成基质的容置腔，所述加热膜层设于所述容置腔的侧壁。
  9. 根据权利要求7或8所述的加热元件，其特征在于，所述基体呈圆筒状。
  10. 根据权利要求1所述的加热元件，其特征在于，所述基体为实心结构，所述加热膜层设于所述基体的外表面。
  11. 一种电子雾化装置，包括如权利要求1～10任一项所述的加热元件。
PCT/CN2022/133177 2022-02-17 2022-11-21 加热元件及电子雾化装置 WO2023155518A1 (zh)

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