WO2023142762A1 - Vibration assembly and manufacturing method therefor, bone voiceprint sensor, and electronic device - Google Patents

Abstract

Disclosed are a vibration assembly and a manufacturing method therefor, a bone voiceprint sensor, and an electronic device. The method comprises: preparing a first diaphragm ring and a mass block, the mass block being provided with a pressure equalizing hole; fixing the first diaphragm ring and the mass block to a first diaphragm; and providing an air hole in an area of the first diaphragm covering the pressure equalizing hole. Before the first diaphragm ring and the mass block are fixed to the first diaphragm, the pressure equalizing hole has been provided in the mass block, so that when an air hole is provided in the area of the first diaphragm covering the pressure equalizing hole, it is only necessary to provide an air hole on the first diaphragm, and it is not necessary to use a high-energy laser to penetrate the mass block to form a pressure equalizing hole, thereby avoiding formation of a bulge and avoiding the problem of a fixing failure of the mass block and the first diaphragm, and improving the product quality of the vibration assembly.

Description

Vibration component and its preparation method, bone voiceprint sensor and electronic equipment

This disclosure claims the priority of the Chinese patent application submitted to the China Patent Office on January 25, 2022, with the application number 202210087641.X, and the application name is "vibration component and its preparation method, bone voiceprint sensor and electronic equipment". The entire contents are incorporated by reference in this disclosure.

technical field

The invention relates to the technical field of sensors, and more specifically, to a vibration component and a preparation method thereof, a bone voiceprint sensor and electronic equipment.

Background technique

The bone voiceprint sensor senses external vibration signals through its own vibration components, and converts the vibration signals into electrical signals to detect external vibration signals.

During the preparation of the vibrating component, holes need to be drilled. In the prior art, the high-energy laser penetrates the mass block and the diaphragm during the drilling process, and the high-energy laser is easy to form a hole in the hole, and the glue on the bonding part of the diaphragm and the mass block will volatilize. Pore tumors can easily lead to clogging of the pores, which is prone to suction film problems. The volatilization of the glue will cause the mass block to be bonded weakly, resulting in defective products and sensor failure.

Contents of the invention

An object of the present invention is to provide a vibration component and its preparation method, a bone voiceprint sensor and a new technical solution for electronic equipment.

According to a first aspect of the present invention, a method for preparing a vibrating component is provided, the method comprising:

Prepare a first diaphragm ring and a mass block, the mass block is provided with a pressure equalization hole;

Fixing the first diaphragm ring and mass to the first diaphragm;

An air hole is arranged in the area of the first diaphragm covering the pressure equalizing hole.

Optionally, the preparation of the first diaphragm ring and the mass, the mass being provided with pressure equalization holes includes:

The first diaphragm ring and the mass block are etched on the same substrate, and the pressure equalization hole is etched on the mass block.

Optionally, the preparation of the first diaphragm ring and the mass, the mass being provided with pressure equalization holes includes:

preparing the first diaphragm ring;

The mass block is prepared, and the pressure equalization hole is arranged on the mass block.

Optionally, said fixing the first diaphragm ring and the mass on the first diaphragm includes:

Bond the first diaphragm ring and mass to the first diaphragm.

Optionally, setting air holes in the area of the first diaphragm covering the pressure equalization holes includes:

A laser is used to drill holes in the area of the first diaphragm covering the pressure equalizing holes to form the air holes.

According to a second aspect of the present invention, there is provided a vibrating assembly, which is made according to any one of the vibrating assembly preparation methods described in the first aspect, and the vibrating assembly includes:

a first diaphragm, the first diaphragm is provided with air holes;

a first diaphragm ring, the first diaphragm ring is fixed on the first diaphragm;

A mass block, the mass block is fixed on the first diaphragm, the mass block is provided with a pressure equalization hole, and the air hole is located in a region of the first diaphragm covering the pressure equalization hole.

According to a third aspect of the present invention, a bone voiceprint sensor is provided, and the bone voiceprint sensor includes the vibration component as described in the second aspect.

Optionally, the bone voiceprint sensor also includes:

a first shell, the first shell is provided with a first sound hole;

A connection ring, the connection ring is arranged in the first housing, the first sound hole is connected to the inner side of the connection ring, the first diaphragm ring is stacked on the connection ring, the The first diaphragm is located on a side of the first diaphragm ring away from the connecting ring;

an annular spacer, the annular spacer is arranged on the first diaphragm;

a first circuit board, the first circuit board is connected to the first housing;

an insulating ring, the insulating ring is arranged between the ring gasket and the first circuit board;

A pole plate, the pole plate is arranged on the side of the ring gasket away from the first diaphragm, and the pole plate is electrically connected to the first circuit board;

Wherein, a first air guiding channel is provided between the connecting ring and the first shell, the inner space of the connecting ring and the outer space of the connecting ring are communicated through the first air guiding channel, and the A second air guide channel is provided between the first circuit board and the first casing, and the outside of the first casing communicates with the outer space of the connecting ring.

Optionally, a second diaphragm and a second diaphragm ring are stacked between the first diaphragm and the annular gasket, and the second diaphragm is located on the side where the annular gasket is located;

A third air guide channel is provided between the second diaphragm ring and the first diaphragm ring, and the inner space of the second diaphragm ring and the outer space of the second diaphragm ring pass through the third The air guide channel is connected, and the outside of the first shell is connected to the outer space of the second diaphragm ring;

The second diaphragm ring is electrically connected to the first housing.

Optionally, the outer space of the second diaphragm ring is provided with silver paste, and the second diaphragm ring is electrically connected to the first housing through the silver paste.

Optionally, the bone voiceprint sensor also includes:

a second shell, the second shell is provided with a second sound hole;

The second circuit board, the second circuit board is connected to the second housing, the first diaphragm ring is connected to the second circuit board, and the first diaphragm is located on the first diaphragm ring a side away from the second circuit board;

A connecting piece, a third sound hole is provided on the connecting piece, an annular boss is arranged on the connecting piece, the third sound hole is located inside the annular boss, and the annular boss is connected to the first vibrating boss. membrane connection;

A MEMS sensor, the MEMS sensor is arranged on the connecting piece, and the back cavity of the MEMS sensor is connected to the third acoustic hole;

An ASIC sensor, the ASIC sensor is arranged on the connecting sheet, and the ASIC sensor is electrically connected to the MEMS sensor and the second circuit board.

According to a fourth aspect of the present invention, an electronic device is provided, and the electronic device includes the bone voiceprint sensor according to any one of the third aspect.

According to an embodiment of the present disclosure, by preparing the first diaphragm ring and the mass block, the mass block is provided with a pressure equalization hole, and the first diaphragm ring and the mass block are fixed in front of the first diaphragm, on the mass block The pressure equalization hole has been set. In the process of setting the air hole in the area covering the pressure equalization hole of the first diaphragm, it is only necessary to set the air hole on the first diaphragm. It is not necessary to use a high-energy laser to penetrate the mass block to form a pressure equalization hole, avoiding Forming hole nodules and avoiding the failure of fixing the mass block and the first diaphragm, improve the product quality of the vibrating component.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

Fig. 1 is one of the structural schematic diagrams of a vibrating assembly in an embodiment of the present disclosure.

Fig. 2 is a cross-sectional view of the vibrating assembly in Fig. 1 .

Fig. 3 is the second structural schematic diagram of the vibrating assembly in an embodiment of the present disclosure.

Fig. 4 is a cross-sectional view of the vibrating assembly in Fig. 3 .

Fig. 5 is one of the structural schematic diagrams of the bone voiceprint sensor in an embodiment of the present disclosure.

Fig. 6 is the second structural schematic diagram of the bone voiceprint sensor in an embodiment of the present disclosure.

Fig. 7 is a third structural schematic diagram of a bone voiceprint sensor in an embodiment of the present disclosure.

11. First diaphragm ring; 12. Mass block; 120. Pressure equalizing hole; 13. First diaphragm; 130. Air hole; 21. First shell; 211. First sound hole; 22. Connecting ring; 220. 23. Annular gasket; 24. First circuit board; 25. Insulating ring; 26. Pole plate; 27. Conducting ring; 28. Second diaphragm ring; 280. Third gas guiding channel ; 281, silver paste; 29, the second diaphragm; 31, the second shell; 311, the second sound hole; 32, the second circuit board; 33, the connecting piece; 330, the third sound hole; 331, the ring boss ; 34, MEMS sensor; 35, ASIC sensor; 36, gold wire.

Detailed ways

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

According to an embodiment of the present disclosure, there is provided a method for manufacturing a vibration component, wherein the method includes:

Prepare the first diaphragm ring 11 and the mass block 12, the mass block 12 is provided with a pressure equalization hole 120;

Fixing the first diaphragm ring 11 and the mass 12 to the first diaphragm 13;

An air hole 130 is provided in a region of the first diaphragm 13 covering the pressure equalizing hole 120 .

In this embodiment, by preparing the first diaphragm ring 11 and the mass block 12, the mass block 12 is provided with a pressure equalization hole 120, and the first diaphragm ring 11 and the mass block 12 are fixed on the first diaphragm 13 Before, the pressure equalization hole 120 has been set on the mass block 12. In the process of setting the air hole 130 in the area covering the pressure equalization hole 120 of the first diaphragm 13, it is only necessary to set the air hole 130 on the first diaphragm 13 without using The high-energy laser penetrates the mass block 12 to form a pressure equalizing hole 120, avoiding the formation of hole nodules and avoiding the failure of fixing the mass block 12 and the first diaphragm 13, thereby improving the product quality of the vibration assembly.

The mass 12 and the first diaphragm ring 11 are fixed on the first diaphragm 13 , the first diaphragm ring 11 is ring-shaped, and the mass 12 is located inside the first diaphragm ring 11 . The first diaphragm 13 is drilled in the pressure equalizing hole 120 by laser drilling to form the air hole 130 .

As shown in FIGS. 1-4 , the vibrating component can be in the shape of a circle or a rectangle as a whole. For example, in FIG. 1 and FIG. 2 , the first diaphragm ring 11 , the mass 12 and the first diaphragm 13 are all ring-shaped, forming an overall circular vibration assembly. For example, as shown in FIG. 3 and FIG. 4 , the first diaphragm ring 11 , the mass 12 and the first diaphragm 13 are all in the shape of a rectangular ring, forming a rectangular vibration assembly as a whole.

In one embodiment, the preparation of the first diaphragm ring 11 and the mass block 12, the mass block 12 being provided with a pressure equalizing hole 120 includes:

The first diaphragm ring 11 and the mass block 12 are etched on the same substrate, and the pressure equalization hole 120 is etched on the mass block 12 .

In this embodiment, one etching is performed on one substrate to obtain the first diaphragm ring 11 and the mass block 12 , and the pressure equalization hole 120 is simultaneously etched on the mass block 12 . The two components of the mass block 12 and the first diaphragm ring 11 are obtained through one etching process, which simplifies the processing process, reduces the material consumption for processing, and effectively reduces the cost.

For example, after the first diaphragm ring 11 and the mass block 12 are formed, the first diaphragm 13 is fixed on the same side of the first diaphragm ring 11 and the mass block 12 .

In one embodiment, the preparation of the first diaphragm ring 11 and the mass block 12, the mass block 12 being provided with a pressure equalizing hole 120 includes:

Prepare the first diaphragm ring 11;

The mass block 12 is prepared, and the pressure equalization hole 120 is arranged on the mass block 12 .

In this embodiment, the first diaphragm ring 11 and the mass block 12 are processed and prepared separately. For example, the first diaphragm ring 11 is formed by stamping technology. The mass block 12 is formed by stamping technology, and the pressure equalizing hole 120 is simultaneously formed. This method simplifies the preparation procedure and reduces the processing cost.

For example, the prepared first diaphragm ring 11 is fixed on the first diaphragm 13 , and the prepared mass 12 is fixed on the first diaphragm 13 . The mass 12 and the first diaphragm ring 11 can be fixed on different sides of the first diaphragm 13 .

In one embodiment, the fixing the first diaphragm ring 11 and the mass 12 on the first diaphragm 13 includes:

The first diaphragm ring 11 and the mass block 12 are bonded to the first diaphragm 13 .

In this embodiment, the first diaphragm ring 11 and the mass 12 are glued on the first diaphragm 13 . When drilling holes on the first diaphragm 13 , no high-energy laser is needed, and the firmness of bonding will not be affected, which ensures the fixing strength of the first diaphragm ring 11 and the mass 12 to the first diaphragm 13 .

In one embodiment, setting the air hole 130 in the area of the first diaphragm 13 covering the pressure equalizing hole 120 includes:

The air hole 130 is formed by drilling a hole in the area of the first diaphragm 13 covering the pressure equalizing hole 120 by laser.

In this embodiment, after the first diaphragm ring 11 and the mass 12 are fixed on the first diaphragm 13 , it is necessary to punch holes in the first diaphragm 13 to form air holes 130 .

After the mass 12 is fixed on the first diaphragm 13 , a part of the first diaphragm 13 covers the pressure equalizing hole 120 . Air holes 130 are formed by perforating the area with a laser.

For example, according to the requirement of the aperture of the air hole 130 , the laser passes through the pressure equalizing hole 120 and punches through the first diaphragm 13 to form the air hole 130 , or the laser surrounds a part of the area to cut to form the air hole 130 .

According to an embodiment of the present disclosure, there is provided a vibrating assembly, the vibrating assembly is made according to any one of the methods for preparing a vibrating assembly in the embodiments of the present disclosure, and the vibrating assembly includes:

A first diaphragm 13, the first diaphragm 13 is provided with an air hole 130;

A first diaphragm ring 11, the first diaphragm ring 11 is fixed on the first diaphragm 13;

Mass block 12, the mass block 12 is fixed on the first diaphragm 13, the mass block 12 is provided with a pressure equalizing hole 120, and the air hole 130 is located on the first diaphragm 13 covering the equalizing pressure area of hole 120 .

In this embodiment, there is no porosity in the pressure equalizing hole 120 and the air hole 130 of the vibrating assembly, which will not affect the function of the first diaphragm 13 and avoid the problem of suction film. The mass block 12 and the first diaphragm ring 11 are firmly fixed to the first diaphragm 13 .

According to an embodiment of the present disclosure, a bone voiceprint sensor is provided, and the bone voiceprint sensor includes the vibration assembly described in the embodiments of the present disclosure.

In this embodiment, the bone voiceprint sensor has the technical effect brought about by the vibration component in the embodiment of the present disclosure.

In one embodiment, as shown in Figure 5, the bone voiceprint sensor further includes:

The first shell 21 is provided with a first sound hole 211 .

A connection ring 22 , the connection ring 22 is disposed in the first casing 21 , and the first sound hole 211 is connected to the inner side of the connection ring 22 . The connecting ring 22 is a ring structure. The rings of the first diaphragm 13 are stacked on the connecting ring 22 , and the first diaphragm 13 is located on a side of the first diaphragm ring 11 away from the connecting ring 22 . The connecting ring 22 is a metal piece with electrical conductivity.

An annular spacer 23 , the annular spacer 23 is arranged on the first diaphragm 13 . The ring spacer 23 is a ring structure, for example, the ring spacer 23 is arranged coaxially with the first diaphragm ring 11 and the connecting ring 22 to form a stacked structure.

The first circuit board 24 is connected to the first housing 21 . The first circuit board 24 is provided with relevant acoustic-electric conversion elements of the circuit of the bone voiceprint sensor.

An insulating ring 25 , the insulating ring 25 is disposed between the ring gasket 23 and the first circuit board 24 .

An electrode plate 26 , the electrode plate 26 is disposed on a side of the annular spacer 23 away from the first diaphragm 13 , and the electrode plate 26 is electrically connected to the first circuit board 24 . There is a distance between the pole plate 26 and the first diaphragm 13. When the first diaphragm 13 is vibrated by the air flow, the distance between the first diaphragm 13 and the pole plate 26 changes, resulting in a voltage change. The voltage changes Vibration signals can be acquired by switching components on the first circuit board 24 .

Wherein, a first air guiding channel 220 is provided between the connecting ring 22 and the first shell 21, and the inner space of the connecting ring 22 and the outer space of the connecting ring 22 pass through the first air guiding channel. 220 conducts to balance the air pressure. A second air guide channel is provided between the first circuit board 24 and the first housing 21 , and the outside of the first housing 21 communicates with the outer space of the connecting ring 22 .

The insulating ring 25 is laminated with the annular spacer 23, the connecting ring 22, the first diaphragm ring 11, the annular spacer 23 and the insulating ring 25 form a cylindrical structure, and the first circuit board 24 and the first housing 21 are in the cylindrical structure. The openings at both ends are covered. The first sound hole 211 communicates with the inner space of the connecting ring 22 , so that the air flow generated by the vibration can enter through the first sound hole 211 . The first air guide channel 220 and the second air guide channel can balance the pressure generated by the air flow, so that the first diaphragm 13 can effectively vibrate when the product is in a closed state.

In one embodiment, as shown in FIG. 6 , a second diaphragm 29 and a second diaphragm ring 28 are stacked between the first diaphragm 13 and the annular spacer 23 , and the second diaphragm The membrane 29 is located on the side where the annular gasket 23 is located. There is a gap between the second diaphragm 29 and the pole plate 26, and the vibration of the first diaphragm 13 will drive the second diaphragm 29 to vibrate, thereby changing the distance between the second diaphragm 29 and the pole plate 26 to generate a voltage change .

A third air guide channel 280 is provided between the second diaphragm ring 28 and the first diaphragm 13 , for example, a groove is made on the second diaphragm ring 28 to form the third air guide channel 280 . The inner space of the second diaphragm ring 28 is communicated with the outer space of the second diaphragm ring 28 through the third air guide channel 280, and the outside of the first housing 21 and the second diaphragm ring The outer space of the ring 28 is conductive. The space between the first diaphragm 13 and the second diaphragm 29 realizes air pressure equalization through the third air guide channel 280 .

The second diaphragm ring 28 is electrically connected to the first housing 21 for the second diaphragm ring 28 to be grounded.

Vibration makes air flow through the first sound hole 211 to drive the first diaphragm 13 to vibrate, and the vibration of the first diaphragm 13 drives the second diaphragm 29 to vibrate, and the distance between the second diaphragm 29 and the pole plate 26 during vibration Changes in distance result in voltage changes. The changed voltage is converted into corresponding electrical signals via the first circuit board 24 .

In one embodiment, as shown in FIG. 6 , the outer space of the second diaphragm ring 28 is provided with silver paste 281 , and the second diaphragm ring 28 and the first housing 21 pass through the silver paste 281 electrical connection. The silver paste 281 can effectively ensure the reliability of the electrical connection between the second diaphragm ring 28 and the first housing 21 , improving product performance. The ring spacer 23 is electrically connected to the second diaphragm ring 28 , and is electrically connected to the first housing 21 through the second diaphragm ring 28 .

In one embodiment, as shown in Figure 7, the bone voiceprint sensor further includes:

The second shell 31, the second shell 31 is provided with a second sound hole 311, the second sound hole 311 can conduct the outside and inside of the second shell 31 to balance the air pressure.

The second circuit board 32, the second circuit board 32 is connected to the second housing 31, the first diaphragm ring 11 is connected to the second circuit board 32, the first diaphragm 13 is located on the The side of the first diaphragm ring 11 away from the second circuit board 32 .

A connecting piece 33, the connecting piece 33 is provided with a third sound hole 330, the connecting piece 33 is provided with an annular boss 331, the third sound hole 330 is located inside the annular boss 331, the The annular boss 331 is connected with the first diaphragm 13 . The annular boss 331 forms a space between the first diaphragm 13 and the connecting piece 33 .

A MEMS sensor 34 , the MEMS sensor 34 is disposed on the connecting sheet 33 , and the back cavity of the MEMS sensor 34 is connected to the third acoustic hole 330 . The air flow driven by the vibration of the first diaphragm 13 can enter the third acoustic hole 330 through the space inside the annular boss 331 to enter the back cavity of the MEMS sensor 34 , so that the MEMS sensor 34 can sense the vibration.

An ASIC sensor 35 , the ASIC sensor 35 is disposed on the connecting sheet 33 , and the ASIC sensor 35 is electrically connected to the MEMS sensor 34 and the second circuit board 32 .

The MEMS sensor 34 , the ASIC sensor 35 and the second circuit board 32 are capable of converting the vibration signal into an electrical signal to characterize the sensed vibration signal of the first diaphragm 13 .

According to an embodiment of the present disclosure, an electronic device is provided, and the electronic device includes the bone voiceprint sensor described in any one of the present disclosure. The electronic device has the technical effect brought by the bone voiceprint sensor. The above-mentioned embodiments focus on the differences between the various embodiments. As long as the different optimization features of the various embodiments do not contradict each other, they can be combined to form a better embodiment. Considering the brevity of the text, no further repeat.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are for illustration only and not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (12)

1. A method for preparing a vibrating component, wherein the method includes:

   Prepare a first diaphragm ring and a mass block, the mass block is provided with a pressure equalization hole;

   Fixing the first diaphragm ring and mass to the first diaphragm;

   An air hole is arranged in the area of the first diaphragm covering the pressure equalizing hole.
2. The method for preparing a vibrating component according to claim 1, wherein said preparing the first diaphragm ring and the mass, the mass being provided with a pressure equalizing hole comprises:

   The first diaphragm ring and the mass block are etched on the same substrate, and the pressure equalization hole is etched on the mass block.
3. The method for preparing a vibrating component according to claim 1, wherein said preparing the first diaphragm ring and the mass, the mass being provided with a pressure equalizing hole comprises:

   preparing the first diaphragm ring;

   The mass block is prepared, and the pressure equalization hole is arranged on the mass block.
4. The method for preparing a vibrating component according to claim 1, wherein said fixing the first diaphragm ring and the mass on the first diaphragm comprises:

   Bond the first diaphragm ring and mass to the first diaphragm.
5. The method for preparing a vibrating component according to claim 1, wherein said arranging air holes in the region of the first diaphragm covering the pressure equalizing hole comprises:

   A laser is used to drill holes in the area of the first diaphragm covering the pressure equalizing holes to form the air holes.
6. A vibrating component manufactured according to the method for preparing a vibrating component according to any one of claims 1-5, comprising:

   a first diaphragm, the first diaphragm is provided with air holes;

   a first diaphragm ring, the first diaphragm ring is fixed on the first diaphragm;

   A mass block, the mass block is fixed on the first diaphragm, the mass block is provided with a pressure equalization hole, and the air hole is located in a region of the first diaphragm covering the pressure equalization hole.
7. A bone voiceprint sensor, comprising the vibration assembly as claimed in claim 6.
8. The bone voiceprint sensor according to claim 7, wherein the bone voiceprint sensor further comprises:

   a first shell, the first shell is provided with a first sound hole;

   A connection ring, the connection ring is arranged in the first housing, the first sound hole is connected to the inner side of the connection ring, the first diaphragm ring is stacked on the connection ring, the The first diaphragm is located on a side of the first diaphragm ring away from the connecting ring;

   an annular spacer, the annular spacer is arranged on the first diaphragm;

   a first circuit board, the first circuit board is connected to the first housing;

   an insulating ring, the insulating ring is arranged between the ring gasket and the first circuit board;

   a polar plate, the polar plate is arranged on a side of the ring gasket away from the first diaphragm, and the polar plate is electrically connected to the first circuit board;

   Wherein, a first air guiding channel is provided between the connecting ring and the first shell, the inner space of the connecting ring and the outer space of the connecting ring are communicated through the first air guiding channel, and the A second air guide channel is provided between the first circuit board and the first casing, and the outside of the first casing communicates with the outer space of the connecting ring.
9. The bone voiceprint sensor according to claim 8, wherein a second diaphragm and a second diaphragm ring are laminated between the first diaphragm and the ring spacer, and the second diaphragm is located at The side where the ring gasket is located;

   A third air guide channel is provided between the second diaphragm ring and the first diaphragm ring, and the inner space of the second diaphragm ring and the outer space of the second diaphragm ring pass through the third The air guide channel is connected, and the outside of the first shell is connected to the outer space of the second diaphragm ring;

   The second diaphragm ring is electrically connected to the first housing.
10. The bone voiceprint sensor according to claim 9, wherein the outer space of the second diaphragm ring is provided with silver paste, and the second diaphragm ring is electrically connected to the first housing through the silver paste.
11. The bone voiceprint sensor according to claim 7, wherein the bone voiceprint sensor further comprises:

    a second shell, the second shell is provided with a second sound hole;

    The second circuit board, the second circuit board is connected to the second housing, the first diaphragm ring is connected to the second circuit board, and the first diaphragm is located on the first diaphragm ring a side away from the second circuit board;

    A connecting piece, a third sound hole is provided on the connecting piece, an annular boss is arranged on the connecting piece, the third sound hole is located inside the annular boss, and the annular boss is connected to the first vibrating boss. membrane connection;

    A MEMS sensor, the MEMS sensor is arranged on the connecting piece, and the back cavity of the MEMS sensor is connected to the third acoustic hole;

    An ASIC sensor, the ASIC sensor is arranged on the connecting sheet, and the ASIC sensor is electrically connected to the MEMS sensor and the second circuit board.
12. An electronic device, comprising the bone voiceprint sensor according to any one of claims 7-11.

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