WO2023142173A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

Info

Publication number
WO2023142173A1
WO2023142173A1 PCT/CN2022/076178 CN2022076178W WO2023142173A1 WO 2023142173 A1 WO2023142173 A1 WO 2023142173A1 CN 2022076178 W CN2022076178 W CN 2022076178W WO 2023142173 A1 WO2023142173 A1 WO 2023142173A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
substrate
color
display panel
display area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/076178
Other languages
English (en)
French (fr)
Inventor
乔振洋
韩佰祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US17/638,101 priority Critical patent/US12256624B2/en
Publication of WO2023142173A1 publication Critical patent/WO2023142173A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present application relates to the display field, in particular to a display panel and a manufacturing method thereof.
  • OLED Organic Light-Emitting Diode
  • organic electro-laser display organic light-emitting semiconductor
  • LCD liquid crystal display
  • OLED display has excellent characteristics such as no backlight, low driving voltage, light weight and thinness, wide viewing angle, high contrast, fast response rate and bendability, etc., and is widely used in mobile phones, digital cameras, Display fields such as DVD players, notebook computers and TVs.
  • the color filter layer In order to adjust the neutral plane of the non-display area of the display panel, the color filter layer will be extended to the non-display area.
  • the color filter layer in the non-display area is easy to break, causing water vapor and oxygen to enter the display area from the break, affecting the display effect of the display panel, reducing the reliability of the display panel, and limiting the development of flexible display technology.
  • Embodiments of the present application provide a display panel and a manufacturing method thereof, which can solve the technical problem that the film layer in the non-display area of the display panel is easily broken after being bent multiple times.
  • An embodiment of the present application provides a display panel, including a display area and a non-display area located on one side of the display area, and the display panel includes:
  • a driving circuit layer disposed on one side of the first substrate
  • a light emitting device layer disposed on a side of the driving circuit layer away from the first substrate
  • the driving circuit layer and the light emitting device layer are located between the first substrate and the second substrate;
  • a stress release layer is disposed on a side of the second substrate close to the first substrate, the stress release layer is disposed corresponding to the non-display area, and the stress release layer is provided with a concave portion.
  • the stress release layer includes a plurality of color-resisting blocks arranged at intervals;
  • the concave portion includes a plurality of first grooves extending along a first direction, the plurality of first grooves are arranged along a second direction, and the first direction and the second direction intersect;
  • the first groove is provided between two adjacent color-resist blocks arranged along the second direction.
  • the width of the first groove is gradually expanded from the second substrate toward the first substrate.
  • the first direction and the second direction are vertically arranged.
  • the recessed portion further includes a plurality of second grooves extending along the second direction, and the plurality of second grooves are arranged along the first direction, The first groove communicates with the second groove;
  • the second groove is provided between two adjacent color-resist blocks arranged along the first direction.
  • the width of the second groove is gradually expanded from the second substrate toward the first substrate.
  • the recessed portion further includes a via hole provided in the color-resist block.
  • the cross-sectional area of the via hole is gradually expanded from the second substrate toward the first substrate.
  • the cross-sectional shape of the via hole is circular, oval or polygonal.
  • the color-resist block is selected from one of red color-resist, green color-resist and blue color-resist or a stacked structure of at least two of them.
  • the display panel further includes a color filter layer, and the color filter layer is disposed on a side of the second substrate close to the light emitting device layer, and the color filter layer A color filter layer is disposed corresponding to the display area, and the color filter layer includes the red color resistance, the green color resistance and the blue color resistance.
  • the display panel further includes a light-shielding layer, the light-shielding layer is disposed on a side of the second substrate close to the light-emitting device layer, and the light-shielding layer corresponds to the
  • the display area is provided with a plurality of accommodation slots, the red color resistance, the green color resistance and the blue color resistance of the display area are set in the corresponding accommodation slots, and the color resistance block is set on the side of the light-shielding layer close to the light-emitting device layer.
  • the heights of two adjacent color-resist blocks are different.
  • one of the color-resisting blocks is one of red color-resisting, green color-resisting and blue color-resisting
  • the other One color-resist block is a stacked structure including two or three of red color-resist, green color-resist and blue color-resist.
  • one of the color-resist blocks includes two types of red color-resist, green color-resist and blue color-resist A stacked structure
  • the other color resistance block is a stacked structure including red color resistance, green color resistance and blue color resistance.
  • the display panel further includes an encapsulation layer covering the light emitting device layer, and the thickness of the non-display area of the first substrate is smaller than that of the first substrate The thickness of the display area.
  • the driving circuit layer includes an active layer, a gate insulating layer disposed on a side of the active layer away from the first substrate, a gate insulating layer disposed on the The gate layer on the side of the gate insulating layer away from the active layer, the first insulating layer covering the gate and the active layer, and the source and drain disposed on the first insulating layer pole metal layer;
  • the thickness of the part of the first insulating layer corresponding to the non-display area is smaller than the thickness of the part of the first insulating layer corresponding to the display area.
  • the embodiment of the present application also provides a method for manufacturing a display panel, the display panel includes a display area and a non-display area located on one side of the display area, and the method for manufacturing the display panel includes the following steps:
  • a driving circuit layer and a light emitting device layer are formed on the first substrate, the driving circuit layer is arranged on one side of the first substrate, and the light emitting device layer is arranged on a side of the driving circuit layer away from the first substrate side;
  • the stress release layer is disposed corresponding to the non-display area, and the stress release layer is provided with a recess;
  • the second substrate is fixed on one side of the first substrate, and the driving circuit layer, the light emitting device layer and the stress release layer are located between the first substrate and the second substrate.
  • the step of forming a stress release layer on the second substrate includes:
  • a light-shielding layer is formed on the second substrate, and the light-shielding layer is provided with a plurality of accommodating grooves corresponding to the display area;
  • a color filter layer and a stress release layer are formed on the second substrate, the color filter layer is set corresponding to the display area, the stress release layer is set corresponding to the non-display area, and the color filter layer includes The red color resistance, the green color resistance and the blue color resistance of the display area, the red color resistance, the green color resistance and the blue color resistance of the display area are arranged in the corresponding accommodating grooves;
  • the color filter layer and the stress release layer are disposed on a side of the light-shielding layer close to the light-emitting device layer.
  • the stress release layer in the step of forming the color filter layer and the stress release layer on the second substrate, includes a plurality of color resist blocks, and a plurality of the color The resistance blocks are arranged at intervals, and the color resistance blocks are selected from one or at least two stacked structures of the red color resistance, the green color resistance and the blue color resistance.
  • the embodiment of the present application adopts a display panel and its manufacturing method.
  • a stress release layer with a depressed portion on the position of the second substrate corresponding to the non-display area, the depressed portion can release the stress when the display panel is bent.
  • the depressed portion can release the stress when the display panel is bent.
  • FIG. 1 is a schematic cross-sectional structure diagram of a first display panel provided by an embodiment of the present application
  • Fig. 2 is a top view structural schematic diagram 1 of the second substrate provided by the embodiment of the present application.
  • Fig. 3 is a top view structure schematic diagram II of the second substrate provided by the embodiment of the present application.
  • Fig. 4 is a top view structural schematic diagram 3 of the second substrate provided by the embodiment of the present application.
  • Fig. 5 is a top view structure schematic diagram 4 of the second substrate provided by the embodiment of the present application.
  • FIG. 6 is a schematic cross-sectional structure diagram of a second display panel provided by an embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional structure diagram of a third display panel provided by an embodiment of the present application.
  • FIG. 8 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • Embodiments of the present application provide a display panel and a manufacturing method thereof. Each will be described in detail below. It should be noted that the description sequence of the following embodiments is not intended to limit the preferred sequence of the embodiments.
  • an embodiment of the present application provides a display panel, including a display area 111 and a non-display area 112 , and the non-display area 112 is disposed on one side of the display area 111 .
  • the non-display area 112 is set on the peripheral side of the display area 111, that is, the non-display area 112 is set around the display area 111.
  • the non-display area 112 can be set only One side of the display area 111 is not limited here.
  • the display panel includes a first substrate 110, a driving circuit layer 120 and a light emitting device layer 130.
  • the driving circuit layer 120 is disposed on one side of the first substrate 110, and the light emitting device layer 130 is disposed on a side of the driving circuit layer 120 away from the first substrate 110. side.
  • the light emitting device layer 130 is electrically connected to the driving circuit layer 120, and the light emitting device layer 130 is energized through the driving circuit layer 120, thereby driving the light emitting device layer 130 to emit light.
  • the display panel also includes a second substrate 210 and a stress release layer 231, the second substrate 210 is arranged opposite to the first substrate 110, the driving circuit layer 120 and the light emitting device layer 130 are arranged between the first substrate 110 and the second substrate 210, the stress The release layer 231 is disposed on a side of the second substrate 210 close to the first substrate 110 , the stress release layer 231 is disposed corresponding to the non-display area 112 , and the stress release layer 231 is provided with a concave portion 233 .
  • the recessed part 233 can release the stress, Avoid breaking the film layer of the non-display area 112 when the bending radius is small, prevent water vapor and oxygen from entering the display area 111 from the break of the non-display area 112, improve the reliability of the display panel, and reduce the risk of failure of the display panel.
  • the recessed portion 233 includes a plurality of first grooves 234 extending along the first direction X, and the plurality of first grooves 234 are arranged along the second direction Y, and the first direction X and The second direction Y intersects;
  • the stress release layer 231 includes a plurality of color-resisting blocks 232 arranged at intervals, and a first groove is provided between adjacent two color-resisting blocks 232 arranged along the second direction Y 234.
  • the first groove 234 can release the stress, prevent the film layer of the non-display area 112 from breaking, and effectively prevent water vapor and oxygen from flowing from the non-display area 112.
  • the broken part enters the display area 111, which improves the reliability of the display panel and reduces the failure risk of the display panel.
  • the first direction X and the second direction Y are vertically set.
  • the first direction X and the second direction Y can also be set at other angles. , which is not uniquely limited here.
  • the width of the first groove 234 is gradually expanded from the second substrate 210 toward the first substrate 110 .
  • the first groove 234 can provide enough space to facilitate the movement of the color resist block 232, and the first groove 234 can better release the stress, thereby avoiding the non-display area.
  • the film layer of 112 is broken, which effectively prevents water vapor and oxygen from entering the display area 111 from the break of the non-display area 112, improves the reliability of the display panel, and reduces the failure risk of the display panel.
  • the recessed portion 233 further includes a plurality of second grooves 235 extending along the second direction Y, the plurality of second grooves 235 are arranged along the first direction X, and the first grooves 234 communicates with the second groove 235 , and the second groove 235 is arranged between two adjacent color resist blocks 232 arranged along the first direction X.
  • the second groove 235 can release the stress, prevent the film layer of the non-display area 112 from breaking, and effectively prevent water vapor and oxygen from entering the non-display area 112.
  • a plurality of color-resistive blocks 232 are distributed in an array along the first direction X and the second direction Y.
  • the plurality of color-resistive blocks 232 can also be distributed according to other rules. , which is not uniquely limited here.
  • the width of the second groove 235 is gradually expanded from the second substrate 210 toward the first substrate 110 .
  • the second groove 235 can provide enough space to facilitate the movement of the color resist block 232, and the second groove 235 can better release the stress, thereby avoiding the non-display area.
  • the film layer of 112 is broken, which effectively prevents water vapor and oxygen from entering the display area 111 from the break of the non-display area 112, improves the reliability of the display panel, and reduces the failure risk of the display panel.
  • the recessed portion 233 further includes a via hole 236 disposed on the color resist block 232 .
  • the via hole 236 can improve the deformation ability of the color resistance block 232, greatly improve the flexibility of the display panel, thereby avoiding the breakage of the film layer in the non-display area 112, and effectively preventing water vapor and oxygen from breaking through the non-display area 112. Entering the display area 111, the reliability of the display panel is improved, and the risk of failure of the display panel is reduced.
  • the cross-sectional area of the via hole 236 is gradually expanded from the second substrate 210 toward the first substrate 110 .
  • the via hole 236 can provide enough space to facilitate the deformation of the color-resist block 232, and the via hole 236 can better release the stress, thereby avoiding the non-display area 112. Breakage occurs, effectively preventing water vapor and oxygen from entering the display area 111 from the break of the non-display area 112, improving the reliability of the display panel and reducing the failure risk of the display panel.
  • the cross-sectional shape of the via hole 236 is circular.
  • the cross-sectional shape of the via hole 236 can also be in other shapes according to the selection and specific needs of the actual situation, such as a via hole
  • the cross-sectional shape of 236 may be oval or polygonal, which is not particularly limited here.
  • the display panel further includes a color filter layer 230.
  • the color filter layer 230 is disposed on the side of the second substrate 210 close to the light emitting device layer 130.
  • the color filter layer 230 is disposed corresponding to the display area 111.
  • the color filter layer 230 includes a red color resist 237 , a green color resist 238 and a blue color resist 239 .
  • the color resistance block 232 is selected from one of red color resistance 237 , green color resistance 238 and blue color resistance 239 or a stacked structure of at least two of them.
  • the color resistance block 232 includes a red color resistance 237
  • the red color resistance 237 of the color resistance block 232 and the red color resistance 237 of the display area 111 can be formed at the same time;
  • the color resistance block 232 includes a green color resistance 238,
  • the green color resistance 238 of the color resistance block 232 and the green color resistance 238 of the display area 111 can be formed simultaneously;
  • Resistors 239 can be formed at the same time without additional photomasks and processes for making color resister blocks 232 , and the manufacturing process is simple and flexible and adjustable.
  • the color-resist block 232 is a stacked structure of a red color-resist 237 and a green color-resist 238 .
  • the color resistance block 232 can only include one color resistance, for example, the color resistance block 232 can be a red color resistance 237, a green color resistance 238 or a blue color resistance 239; 232 may include two kinds of color resistance, for example, color resistance block 232 may be a stacked structure including red color resistance 237 and blue color resistance 239, or color resistance block 232 may be a stacked structure including green color resistance 238 and blue color resistance 239 , or the color resistance block 232 can be a stacked structure including a red color resistance 237 and a green color resistance 238;
  • the stacked structure of 238 and blue color resist 239 is not limited here.
  • the heights of two adjacent color-resist blocks 232 are different. Under this structure, when the display panel is bent, the adjacent color-resist blocks 232 will not interfere and squeeze each other, thereby preventing the film layer of the non-display area 112 from breaking and effectively preventing water vapor and oxygen from flowing from the non-display area 112. The broken part enters the display area 111, which improves the reliability of the display panel and reduces the failure risk of the display panel.
  • one color-resisting block 232 includes a red color-resisting block 237, and the other color-resisting block 232 includes a red color-resisting block 237 and Green color resistance 238.
  • This application adjusts the height difference between two adjacent color-resisting blocks 232 by adjusting the number of layers of color-resisting blocks, for example, between two adjacent color-resisting blocks 232, one of the color-resisting blocks 232 is a red color-resisting block 237 , one of the green color resistance 238 and the blue color resistance 239, and the other color resistance block 232 is a stacked structure including two or three of the red color resistance 237, the green color resistance 238 and the blue color resistance 239; or, Between two adjacent color resistance blocks 232, one of the color resistance blocks 232 is a stacked structure including red color resistance 237, green color resistance 238 and blue color resistance 239, and the other color resistance block 232 is composed of red A stacked structure of the color resistance 237 , the green color resistance 238 and the blue color resistance 239 .
  • the display panel further includes an encapsulation layer 140 covering the light emitting device layer 130, and the encapsulation layer 140 is located on the side of the color filter layer 230 close to the light emitting device layer 130,
  • the thickness of the non-display area 112 of the first substrate 110 is smaller than the thickness of the display area 111 of the first substrate 110 .
  • the part of the encapsulation layer 140 corresponding to the non-display area 112 can be adjusted to the neutral plane of the display panel , increasing the bending radius of the encapsulation layer 140 to prevent the encapsulation layer 140 from breaking when the display panel is bent.
  • the portion of the encapsulation layer 140 corresponding to the non-display area 112 can be adjusted to the neutral plane of the display panel, increasing the bending radius of the encapsulation layer 140 to prevent display The encapsulation layer 140 is broken when the panel is bent.
  • the encapsulation layer 140 includes a first inorganic layer 141, an organic layer 142 and a second inorganic layer 143.
  • the first inorganic layer 141 covers the side of the light emitting device layer 130 away from the driving circuit layer 120
  • the organic layer 142 covers the second inorganic layer.
  • One side of the inorganic layer 141 away from the light-emitting device layer 130, and the second inorganic layer 143 covers the side of the organic layer 142 away from the first inorganic layer 141, thereby preventing water vapor and oxygen from corroding the light-emitting device layer 130 and the driving circuit layer 120 , improve the reliability of the display panel, and reduce the failure risk of the display panel.
  • the display panel further includes a light-shielding layer 220 , and the light-shielding layer 220 may be, but not limited to, a black matrix.
  • the light-shielding layer 220 is disposed on the side of the second substrate 210 close to the light-emitting device layer 130.
  • the light-shielding layer 220 is arranged corresponding to the display area 111 and the non-display area 112.
  • the placement groove 221 is set through the light-shielding layer 220, the red color resistance 237, the green color resistance 238 and the blue color resistance 239 of the display area 111 are set in the corresponding accommodating groove 221, and the stress release layer 231 (color resistance block 232) is set in the light-shielding The side of the layer 220 close to the light emitting device layer 130 .
  • the driving circuit layer 120 includes a buffer layer 127 , an active layer 121 disposed on the side of the buffer layer 127 away from the first substrate 110 , and an active layer 121 disposed on the side of the buffer layer 127 away from the first substrate 110 .
  • the thickness of the portion of the display area 112 is smaller than the thickness of the portion of the first insulating layer 124 corresponding to the display area 111 .
  • the part of the encapsulation layer 140 corresponding to the non-display region 112 can be adjusted to display At the neutral plane of the panel, the bending radius of the encapsulation layer 140 is increased to prevent the encapsulation layer 140 from breaking when the display panel is bent.
  • the light emitting device layer 130 includes a plurality of OLED devices 131 disposed in the display area 111 , and the plurality of OLED devices 131 are arranged in an array, and each OLED device 131 corresponds to the display area 111
  • One of red color resistance 237, green color resistance 238 and blue color resistance 239 is set.
  • the OLED device 131 includes an anode 132 disposed on the second insulating layer 126, a light-emitting functional layer disposed on the anode 132, and a cathode disposed on the light-emitting functional layer, and the anode 132 is electrically connected to the source and drain
  • the metal layer 125 and the driving circuit layer 120 energize the OLED device 131 through the source-drain metal layer 125 , so that there is a voltage difference between the anode 132 and the cathode, thereby driving the light-emitting functional layer of the OLED device 131 to emit light.
  • the light-emitting functional layer includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer that are sequentially stacked from the anode 132 toward the cathode.
  • the holes pass through the hole injection layer and the hole transport layer in turn and then reach the light-emitting layer
  • the ions pass through the electron injection layer and the electron transport layer in turn and then reach the light-emitting layer
  • the holes and electrons combine in the light-emitting layer, and the energy generated by the combination makes the material
  • the outermost electrons are excited and cross to the outer electron orbit. Because it is only excited, the orbit of the outermost electron is unstable, and the outermost electron will return to the original orbit immediately, so that the excess energy will be released in the form of light, thereby realizing luminescence.
  • the embodiment of the present application also provides a method for manufacturing the above-mentioned display panel.
  • the display panel includes a display area 111 and a non-display area 112, and the non-display area 112 is set side.
  • the non-display area 112 is set on the peripheral side of the display area 111, that is, the non-display area 112 is set around the display area 111.
  • the non-display area 112 can be set only One side of the display area 111 is not limited here.
  • the manufacturing method of the display panel includes the following steps:
  • Step B1 forming the driving circuit layer 120 and the light emitting device layer 130 on the first substrate 110, the driving circuit layer 120 is disposed on one side of the first substrate 110, and the light emitting device layer 130 is disposed on the driving circuit layer 120 away from the first substrate 110 side of
  • Step B2 forming a stress release layer 231 on the second substrate 210, the stress release layer 231 is arranged corresponding to the non-display area 112, and the stress release layer 231 is provided with a concave portion 233;
  • Step B3 fixing the second substrate 210 on one side of the first substrate 110, the driving circuit layer 120, the light emitting device layer 130 and the stress release layer 231 are located between the first substrate 110 and the second substrate 210, the second substrate 210 can But not limited to being fixed on one side of the first substrate 110 by the fixing glue 300 .
  • the order of the above-mentioned step B1 and step B2 can be replaced, and there is no unique limitation here.
  • the recessed part 233 can play the role of releasing the stress, avoiding a large bending radius.
  • the stress release layer 231 is broken, water vapor and oxygen are prevented from entering the display area 111 from the break of the stress release layer 231, thereby improving the reliability of the display panel and reducing the failure risk of the display panel.
  • step B2 includes:
  • Step B21 forming a light-shielding layer 220 on the second substrate 210, the light-shielding layer 220 is set corresponding to the display area 111 and the non-display area 112, and the light-shielding layer 220 is provided with a plurality of accommodating grooves 221 corresponding to the display area 111, and the accommodating grooves 221 run through the light-shielding area layer 220 settings;
  • Step B22 forming a color filter layer 230 and a stress release layer 231 on the second substrate 210, the color filter layer 230 and the stress release layer 231 are arranged on the side of the light shielding layer 220 close to the light emitting device layer 130, and the color filter layer 230 is set corresponding to the display area 111, the stress release layer 231 is set corresponding to the non-display area 112, the color filter layer 230 includes the red color resistance 237, the green color resistance 238 and the blue color resistance 239 arranged in the display area 111, the red color resistance of the display area 111 The color resistance 237 , the green color resistance 238 and the blue color resistance 239 are disposed in the corresponding accommodating grooves 221 .
  • the stress release layer 231 includes a plurality of color resistance blocks 232, the plurality of color resistance blocks 232 are arranged at intervals, and the color resistance blocks 232 are selected from the red color resistance 237, the green color resistance 238 and the blue color resistance 239 One or at least two stacked structures.
  • the color resistance block 232 when the color resistance block 232 includes a red color resistance 237, the red color resistance 237 of the color resistance block 232 and the red color resistance 237 of the display area 111 can be formed simultaneously; when the color resistance block 232 includes a green color resistance 238, The green color resistance 238 of the color resistance block 232 and the green color resistance 238 of the display area 111 can be formed simultaneously; Resistors 239 can be formed at the same time without additional photomasks and processes for making color resister blocks 232 , and the manufacturing process is simple and flexible and adjustable.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板及其制作方法，显示面板包括第一基板(110)、设置于第一基板(110)的一侧的驱动电路层(120)、设置于驱动电路层(120)的远离第一基板(110)的一侧的发光器件层(130)、设于发光器件层(130)的远离驱动电路层(120)的一侧的第二基板(210)以及设置于第二基板(210)的靠近发光器件层(130)的一侧的应力释放层(231)，应力释放层(231)对应非显示区(112)设置，应力释放层(231)设有凹陷部(233)。

Description

显示面板及其制作方法 技术领域
本申请涉及显示领域，具体涉及一种显示面板及其制作方法。
 背景技术
OLED(Organic Light-Emitting Diode)，又称为有机电激光显示、有机发光半导体。相对于传统液晶显示器(Liquid Crystal Display，LCD)，OLED显示器具有不需背光源、驱动电压低、重量轻且薄、具有宽视角、高对比度、快速响应速率和可弯折等优异特性，被广泛应用于手机、数码摄像机、DVD机、笔记本电脑和电视等显示领域。
对于可弯折的显示面板而言，为了调整显示面板的非显示区的中性面，会将彩色滤光层延伸至非显示区，然而，当显示面板的非显示区经过多次弯折后，非显示区的彩色滤光层容易断裂，导致水汽和氧气从断裂处进入显示区，影响显示面板的显示效果，降低了显示面板的可靠性，限制了柔性显示技术的发展。
 技术问题
本申请实施例提供一种显示面板及其制作方法，可以解决显示面板经过多次弯折后的非显示区的膜层容易断裂的技术问题。
 技术解决方案
本申请实施例提供一种显示面板，包括显示区和位于所述显示区一侧的非显示区，所述显示面板包括：
第一基板；
驱动电路层，设置于所述第一基板的一侧；
发光器件层，设置于所述驱动电路层的远离所述第一基板的一侧；
第二基板，与所述第一基板相对设置，所述驱动电路层和所述发光器件层位于所述第一基板和所述第二基板之间；以及
应力释放层，设置于所述第二基板的靠近所述第一基板的一侧，所述应力释放层对应所述非显示区设置，所述应力释放层设有凹陷部。
可选的，在本申请的一些实施例中，所述应力释放层包括间隔设置的多个色阻块；
所述凹陷部包括多个沿第一方向延伸的第一凹槽，多个所述第一凹槽沿第二方向排列，所述第一方向和所述第二方向相交；
沿所述第二方向排列的相邻两个所述色阻块之间设有所述第一凹槽。
可选的，在本申请的一些实施例中，所述第一凹槽的宽度由所述第二基板朝所述第一基板的方向呈渐扩设置。
可选的，在本申请的一些实施例中，所述第一方向和所述第二方向垂直设置。
可选的，在本申请的一些实施例中，所述凹陷部还包括多个沿所述第二方向延伸的第二凹槽，多个所述第二凹槽沿所述第一方向排列，所述第一凹槽和所述第二凹槽连通；
沿所述第一方向排列的相邻两个所述色阻块之间设有所述第二凹槽。
可选的，在本申请的一些实施例中，所述第二凹槽的宽度由所述第二基板朝所述第一基板的方向呈渐扩设置。
可选的，在本申请的一些实施例中，所述凹陷部还包括设于所述色阻块的过孔。
可选的，在本申请的一些实施例中，所述过孔的横截面积由所述第二基板朝所述第一基板的方向呈渐扩设置。
可选的，在本申请的一些实施例中，所述过孔的横截面形状呈圆形、椭圆形或多边形。
可选的，在本申请的一些实施例中，所述色阻块选自红色色阻、绿色色阻和蓝色色阻中的一种或至少两种的堆叠结构。
可选的，在本申请的一些实施例中，所述显示面板还包括彩色滤光层，所述彩色滤光层设置于所述第二基板的靠近所述发光器件层的一侧，所述彩色滤光层对应所述显示区设置，所述彩色滤光层包括所述红色色阻、所述绿色色阻和所述蓝色色阻。
可选的，在本申请的一些实施例中，所述显示面板还包括遮光层，所述遮光层设置于所述第二基板的靠近所述发光器件层的一侧，所述遮光层对应所述显示区设有多个容置槽，所述显示区的所述红色色阻、所述绿色色阻和所述蓝色色阻设于对应的所述容置槽中，所述色阻块设置于所述遮光层的靠近所述发光器件层的一侧。
可选的，在本申请的一些实施例中，相邻两个所述色阻块的高度不同。
可选的，在本申请的一些实施例中，相邻两个所述色阻块之间，其中一个所述色阻块为红色色阻、绿色色阻和蓝色色阻中的一种，另一个所述色阻块为包括红色色阻、绿色色阻和蓝色色阻中的两种或三种的堆叠结构。
可选的，在本申请的一些实施例中，相邻两个所述色阻块之间，其中一个所述色阻块为包括红色色阻、绿色色阻和蓝色色阻中的两种的堆叠结构，另一个所述色阻块为包括红色色阻、绿色色阻和蓝色色阻的堆叠结构。
可选的，在本申请的一些实施例中，所述显示面板还包括覆盖于所述发光器件层上的封装层，所述第一基板的所述非显示区的厚度小于所述第一基板的所述显示区的厚度。
可选的，在本申请的一些实施例中，所述驱动电路层包括有源层、设于所述有源层的背离所述第一基板的一侧的栅极绝缘层、设于所述栅极绝缘层的背离所述有源层的一侧的栅极层、覆盖于所述栅极和所述有源层上的第一绝缘层以及设于所述第一绝缘层上的源漏极金属层；
所述第一绝缘层对应所述非显示区的部分的厚度小于所述第一绝缘层对应所述显示区的部分的厚度。
本申请实施例还提供一种显示面板的制作方法，所述显示面板包括显示区和位于所述显示区一侧的非显示区，所述显示面板的制作方法包括以下步骤：
在第一基板上形成驱动电路层和发光器件层，所述驱动电路层设置于所述第一基板的一侧，所述发光器件层设置于所述驱动电路层的远离所述第一基板的一侧；
在第二基板上形成应力释放层，所述应力释放层对应所述非显示区设置，所述应力释放层设有凹陷部；
将所述第二基板固定于所述第一基板的一侧，所述驱动电路层、所述发光器件层和所述应力释放层位于所述第一基板和所述第二基板之间。
可选的，在本申请的一些实施例中，在第二基板上形成应力释放层的步骤包括：
在第二基板上形成遮光层，所述遮光层对应所述显示区设有多个容置槽；
在所述第二基板上形成彩色滤光层和应力释放层，所述彩色滤光层对应所述显示区设置，所述应力释放层对应所述非显示区设置，彩色滤光层包括设于显示区的红色色阻、绿色色阻和蓝色色阻，所述显示区的所述红色色阻、所述绿色色阻和所述蓝色色阻设于对应的所述容置槽中；
将所述第二基板固定于所述第一基板的一侧后，所述彩色滤光层和所述应力释放层设置于所述遮光层的靠近所述发光器件层的一侧。
可选的，在本申请的一些实施例中，在所述第二基板上形成彩色滤光层和应力释放层的步骤中，所述应力释放层包括多个色阻块，多个所述色阻块间隔设置，所述色阻块选自所述红色色阻、所述绿色色阻和所述蓝色色阻中的一种或至少两种的堆叠结构。
 有益效果
本申请实施例采用一种显示面板及其制作方法，通过在第二基板对应非显示区的位置设置具有凹陷部的应力释放层，当显示面板弯折时，凹陷部可以起到释放应力的作用，避免弯曲半径较小时非显示区的膜层发生断裂，防止水汽和氧气从非显示区的断裂处进入显示区，提高显示面板的可靠性，降低显示面板失效风险。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的第一种显示面板的剖视结构示意图；
图2是本申请实施例提供的第二基板的俯视结构示意图一；
图3是本申请实施例提供的第二基板的俯视结构示意图二；
图4是本申请实施例提供的第二基板的俯视结构示意图三；
图5是本申请实施例提供的第二基板的俯视结构示意图四；
图6是本申请实施例提供的第二种显示面板的剖视结构示意图；
图7是本申请实施例提供的第三种显示面板的剖视结构示意图；
图8是本申请实施例提供的一种显示面板的制作方法的流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种显示面板及其制作方法。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
请参阅图1，本申请实施例提供一种显示面板，包括显示区111和非显示区112，非显示区112设于显示区111的一侧。在本申请实施例中，非显示区112设于显示区111的周侧，即非显示区112环绕显示区111设置，当然，根据实际情况的选择和具体需求设置，非显示区112可以仅设置于显示区111的一侧，在此不做唯一限定。
显示面板包括第一基板110、驱动电路层120和发光器件层130，驱动电路层120设置于第一基板110的一侧，发光器件层130设置于驱动电路层120的远离第一基板110的一侧。在此实施例中，发光器件层130电性连接于驱动电路层120，通过驱动电路层120对发光器件层130进行通电，从而驱动发光器件层130发光。
显示面板还包括第二基板210和应力释放层231，第二基板210与第一基板110相对设置，驱动电路层120和发光器件层130设于第一基板110与第二基板210之间，应力释放层231设置于第二基板210的靠近第一基板110的一侧，应力释放层231对应非显示区112设置，应力释放层231设有凹陷部233。
本申请实施例的显示面板，通过在第二基板210对应非显示区112的位置设置具有凹陷部233的应力释放层231，当显示面板弯折时，凹陷部233可以起到释放应力的作用，避免弯曲半径较小时非显示区112的膜层发生断裂，防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。
具体的，如图1和图2所示，凹陷部233包括多个沿第一方向X延伸的第一凹槽234，多个第一凹槽234沿第二方向Y排列，第一方向X和第二方向Y相交；应力释放层231包括多个色阻块232，多个色阻块232间隔设置，沿第二方向Y排列的相邻两个色阻块232之间设有第一凹槽234。此结构下，当显示面板沿第二方向Y弯折时，第一凹槽234可以起到释放应力的效果，避免非显示区112的膜层发生断裂，有效防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。在本申请实施例中，第一方向X和第二方向Y垂直设置，当然，根据实际情况的选择和具体需求设置，第一方向X和第二方向Y之间也可以呈其他夹角相交设置，在此不做唯一限定。
具体的，第一凹槽234的宽度由第二基板210朝第一基板110的方向呈渐扩设置。此结构下，当显示面板弯折的弯曲半径较小时，第一凹槽234可以提供足够的空间以便于色阻块232移动，第一凹槽234可以更好地释放应力，从而避免非显示区112的膜层发生断裂，有效防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。
具体的，如图1和图3所示，凹陷部233还包括多个沿第二方向Y延伸的第二凹槽235，多个第二凹槽235沿第一方向X排列，第一凹槽234和第二凹槽235连通，沿第一方向X排列的相邻两个色阻块232之间设有第二凹槽235。此结构下，当显示面板沿第一方向X弯折时，第二凹槽235可以起到释放应力的效果，避免非显示区112的膜层发生断裂，有效防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。在此实施例中，多个色阻块232沿第一方向X和第二方向Y呈阵列分布，当然，根据实际情况的选择和具体需求设置，多个色阻块232也可以按照其他规律分布，在此不做唯一限定。
具体的，第二凹槽235的宽度由第二基板210朝第一基板110的方向呈渐扩设置。此结构下，当显示面板弯折的弯曲半径较小时，第二凹槽235可以提供足够的空间以便于色阻块232移动，第二凹槽235可以更好地释放应力，从而避免非显示区112的膜层发生断裂，有效防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。
具体的，如图1、图4和图5所示，凹陷部233还包括设于色阻块232的过孔236。此结构下，过孔236可以提高色阻块232的变形能力，大大提高显示面板的挠性，从而避免非显示区112的膜层发生断裂，有效防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。
具体的，过孔236的横截面积由第二基板210朝第一基板110的方向呈渐扩设置。此结构下，当显示面板弯折的弯曲半径较小时，过孔236可以提供足够的空间以便于色阻块232变形，过孔236可以更好地释放应力，从而避免非显示区112的膜层发生断裂，有效防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。
具体的，如图4和图5所示，过孔236的横截面形状呈圆形，当然根据实际情况的选择和具体需求设置，过孔236的横截面形状也可以呈其他形状，例如过孔236的横截面形状可以呈椭圆形或多边形，在此不做特别限定。
具体的，如图1所示，显示面板还包括彩色滤光层230，彩色滤光层230设置于第二基板210的靠近发光器件层130的一侧，彩色滤光层230对应显示区111设置，彩色滤光层230包括红色色阻237、绿色色阻238和蓝色色阻239。
具体的，如图1所示，色阻块232选自红色色阻237、绿色色阻238和蓝色色阻239中的一种或至少两种的堆叠结构。此结构下，当色阻块232包括红色色阻237时，色阻块232的红色色阻237和显示区111的红色色阻237可以同时形成；当色阻块232包括绿色色阻238时，色阻块232的绿色色阻238和显示区111的绿色色阻238可以同时形成；当色阻块232包括蓝色色阻239时，色阻块232的蓝色色阻239和显示区111的蓝色色阻239可以同时形成，不需要增加用于制作色阻块232的光罩和工艺，制程简单，灵活可调。
如图1所示，本申请实施例的显示面板中，色阻块232为红色色阻237和绿色色阻238的堆叠结构。当然，根据实际情况的选择和具体需求设置，色阻块232可以仅包括一种色阻，例如，色阻块232可以为红色色阻237、绿色色阻238或蓝色色阻239；色阻块232可以包括两种色阻，例如，色阻块232可以为包括红色色阻237和蓝色色阻239的堆叠结构，或者色阻块232可以为包括绿色色阻238和蓝色色阻239的堆叠结构，或者色阻块232可以为包括红色色阻237和绿色色阻238的堆叠结构；色阻块232可以包括三种色阻，例如，色阻块232可以为包括红色色阻237、绿色色阻238和蓝色色阻239的堆叠结构，在此不做唯一限定。
具体的，如图6所示，相邻两个色阻块232的高度不同。此结构下，当显示面板弯折时，相邻的色阻块232之间不会互相干涉和挤压，从而避免非显示区112的膜层发生断裂，有效防止水汽和氧气从非显示区112的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。
如图6所示，本申请实施例的显示面板中，相邻两个色阻块232之间，其中一个色阻块232包括红色色阻237，另一个色阻块232包括红色色阻237和绿色色阻238。本申请是通过调整色阻的层数来调整相邻两个色阻块232之间的高度差，例如，相邻两个色阻块232之间，其中一个色阻块232为红色色阻237、绿色色阻238和蓝色色阻239中的一种，另一个色阻块232为包括红色色阻237、绿色色阻238和蓝色色阻239中的两种或三种的堆叠结构；或者，相邻两个色阻块232之间，其中一个色阻块232为包括红色色阻237、绿色色阻238和蓝色色阻239中的两种的堆叠结构，另一个色阻块232为包括红色色阻237、绿色色阻238和蓝色色阻239的堆叠结构。
具体的，如图1、图6和图7所示，显示面板还包括覆盖于发光器件层130上的封装层140，封装层140位于彩色滤光层230的靠近发光器件层130的一侧，第一基板110的非显示区112的厚度小于第一基板110的显示区111的厚度。此结构下，通过使第一基板110的非显示区112的厚度小于第一基板110的显示区111的厚度，可以将封装层140对应非显示区112的部分调整至显示面板的中性面处，增加封装层140的弯曲半径，防止显示面板弯折时封装层140断裂的情况发生。在此实施例中，通过在非显示区112增设应力释放层231，可以将封装层140对应非显示区112的部分调整至显示面板的中性面处，增加封装层140的弯曲半径，防止显示面板弯折时封装层140断裂的情况发生。
具体的，封装层140包括第一无机层141、有机层142和第二无机层143，第一无机层141覆盖在发光器件层130的远离驱动电路层120的一侧，有机层142覆盖在第一无机层141的远离发光器件层130的一侧，第二无机层143覆盖在有机层142的远离第一无机层141的一侧，从而避免水汽和氧气侵蚀发光器件层130和驱动电路层120，提高显示面板的可靠性，降低显示面板失效风险。
具体的，如图1、图6和图7所示，本申请实施例的显示面板中，显示面板还包括遮光层220，遮光层220可以但不限于为黑色矩阵。遮光层220设置于第二基板210的靠近发光器件层130的一侧，遮光层220对应显示区111和非显示区112设置，遮光层220对应显示区111设有多个容置槽221，容置槽221贯穿遮光层220设置，显示区111的红色色阻237、绿色色阻238和蓝色色阻239设于对应的容置槽221中，应力释放层231(色阻块232)设置于遮光层220的靠近发光器件层130的一侧。
具体的，如图1、图6和图7所示，驱动电路层120包括缓冲层127、设于缓冲层127的背离第一基板110的一侧的有源层121、设于有源层121的背离第一基板110的一侧的栅极绝缘层122、设于栅极绝缘层122的背离有源层121的一侧的栅极层123、覆盖于栅极和有源层121上的第一绝缘层124、设于第一绝缘层124上的源漏极金属层125以及设于源漏极金属层125和第一绝缘层124上的第二绝缘层126；第一绝缘层124对应非显示区112的部分的厚度小于第一绝缘层124对应显示区111的部分的厚度。此结构下，通过使第一绝缘层124对应非显示区112的部分的厚度小于第一绝缘层124对应显示区111的部分的厚度，可以将封装层140对应非显示区112的部分调整至显示面板的中性面处，增加封装层140的弯曲半径，防止显示面板弯折时封装层140断裂的情况发生。
具体的，如图1、图6和图7所示，发光器件层130包括设于显示区111的多个OLED器件131，多个OLED器件131呈阵列分布，每一个OLED器件131对应显示区111的红色色阻237、绿色色阻238和蓝色色阻239中的一种设置。在此实施例中，OLED器件131包括设于第二绝缘层126上的阳极132、设于阳极132上的发光功能层以及设于发光功能层上的阴极，阳极132电性连接于源漏极金属层125，驱动电路层120通过源漏极金属层125对OLED器件131进行通电，使得阳极132和阴极之间具有电压差，从而驱动OLED器件131的发光功能层发光。
具体的，发光功能层包括由阳极132朝阴极的方向依次层叠设置的空穴注入层、空穴传输层、发光层、电子传输层和电子注入层，当阳极132和阴极之间具有电压差时，空穴依次经过空穴注入层和空穴传输层后到达发光层，离子依次经过电子注入层和电子传输层后到达发光层，空穴和电子在发光层结合，结合所产生的能量使材料的最外层电子被激发，跨越到外一层电子轨道。由于只是激发，最外层电子轨道不稳定，最外层电子马上又会回到原来的轨道，这样就会把过剩的能量以光的形式释放出来，从而实现发光。
请参阅图8，同时结合图1至图7，本申请实施例还提供一种上述显示面板的制作方法，显示面板包括显示区111和非显示区112，非显示区112设于显示区111的一侧。在本申请实施例中，非显示区112设于显示区111的周侧，即非显示区112环绕显示区111设置，当然，根据实际情况的选择和具体需求设置，非显示区112可以仅设置于显示区111的一侧，在此不做唯一限定。显示面板的制作方法包括以下步骤：
步骤B1、在第一基板110上形成驱动电路层120和发光器件层130，驱动电路层120设置于第一基板110的一侧，发光器件层130设置于驱动电路层120的远离第一基板110的一侧；
步骤B2、在第二基板210上形成应力释放层231，应力释放层231对应非显示区112设置，应力释放层231设有凹陷部233；
步骤B3、将第二基板210固定于第一基板110的一侧，驱动电路层120、发光器件层130和应力释放层231位于第一基板110和第二基板210之间，第二基板210可以但不限于通过固定胶300固定于第一基板110的一侧。在此实施例中，上述步骤B1和步骤B2的先后顺序可以替换，在此不做唯一限定。
本申请实施例通过在第二基板210对应非显示区112的位置设置具有凹陷部233的应力释放层231，当显示面板弯折时，凹陷部233可以起到释放应力的作用，避免弯曲半径较小时应力释放层231发生断裂，防止水汽和氧气从应力释放层231的断裂处进入显示区111，提高显示面板的可靠性，降低显示面板失效风险。
具体的，上述步骤B2包括：
步骤B21、在第二基板210上形成遮光层220，遮光层220对应显示区111和非显示区112设置，遮光层220对应显示区111设有多个容置槽221，容置槽221贯穿遮光层220设置；
步骤B22、在第二基板210上形成彩色滤光层230和应力释放层231，彩色滤光层230和应力释放层231设置于遮光层220的靠近发光器件层130的一侧，彩色滤光层230对应显示区111设置，应力释放层231对应非显示区112设置，彩色滤光层230包括设于显示区111的红色色阻237、绿色色阻238和蓝色色阻239，显示区111的红色色阻237、绿色色阻238和蓝色色阻239设于对应的容置槽221中。
具体的，在上述步骤B22中，应力释放层231包括多个色阻块232，多个色阻块232间隔设置，色阻块232选自红色色阻237、绿色色阻238和蓝色色阻239中的一种或至少两种的堆叠结构。此设置下，当色阻块232包括红色色阻237时，色阻块232的红色色阻237和显示区111的红色色阻237可以同时形成；当色阻块232包括绿色色阻238时，色阻块232的绿色色阻238和显示区111的绿色色阻238可以同时形成；当色阻块232包括蓝色色阻239时，色阻块232的蓝色色阻239和显示区111的蓝色色阻239可以同时形成，不需要增加用于制作色阻块232的光罩和工艺，制程简单，灵活可调。
以上对本申请实施例所提供的一种显示面板及其制作方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，其包括显示区和位于所述显示区一侧的非显示区，所述显示面板包括：
    第一基板；
    驱动电路层，设置于所述第一基板的一侧；
    发光器件层，设置于所述驱动电路层的远离所述第一基板的一侧；
    第二基板，与所述第一基板相对设置，所述驱动电路层和所述发光器件层位于所述第一基板和所述第二基板之间；以及
    应力释放层，设置于所述第二基板的靠近所述第一基板的一侧，所述应力释放层对应所述非显示区设置，所述应力释放层设有凹陷部。
  2. 如权利要求1所述的显示面板，其中，所述应力释放层包括间隔设置的多个色阻块；
    所述凹陷部包括多个沿第一方向延伸的第一凹槽，多个所述第一凹槽沿第二方向排列，所述第一方向和所述第二方向相交；
    沿所述第二方向排列的相邻两个所述色阻块之间设有所述第一凹槽。
  3. 如权利要求2所述的显示面板，其中，所述第一凹槽的宽度由所述第二基板朝所述第一基板的方向呈渐扩设置。
  4. 如权利要求2所述的显示面板，其中，所述第一方向和所述第二方向垂直设置。
  5. 如权利要求2所述的显示面板，其中，所述凹陷部还包括多个沿所述第二方向延伸的第二凹槽，多个所述第二凹槽沿所述第一方向排列，所述第一凹槽和所述第二凹槽连通；
    沿所述第一方向排列的相邻两个所述色阻块之间设有所述第二凹槽。
  6. 如权利要求5所述的显示面板，其中，所述第二凹槽的宽度由所述第二基板朝所述第一基板的方向呈渐扩设置。
  7. 如权利要求2所述的显示面板，其中，所述凹陷部还包括设于所述色阻块的过孔。
  8. 如权利要求7所述的显示面板，其中，所述过孔的横截面积由所述第二基板朝所述第一基板的方向呈渐扩设置。
  9. 如权利要求7所述的显示面板，其中，所述过孔的横截面形状呈圆形、椭圆形或多边形。
  10. 如权利要求2所述的显示面板，其中，所述色阻块选自红色色阻、绿色色阻和蓝色色阻中的一种或至少两种的堆叠结构。
  11. 如权利要求10所述的显示面板，其中，所述显示面板还包括彩色滤光层，所述彩色滤光层设置于所述第二基板的靠近所述发光器件层的一侧，所述彩色滤光层对应所述显示区设置，所述彩色滤光层包括所述红色色阻、所述绿色色阻和所述蓝色色阻。
  12. 如权利要求11所述的显示面板，其中，所述显示面板还包括遮光层，所述遮光层设置于所述第二基板的靠近所述发光器件层的一侧，所述遮光层对应所述显示区设有多个容置槽，所述显示区的所述红色色阻、所述绿色色阻和所述蓝色色阻设于对应的所述容置槽中，所述色阻块设置于所述遮光层的靠近所述发光器件层的一侧。
  13. 如权利要求2所述的显示面板，其中，相邻两个所述色阻块的高度不同。
  14. 如权利要求2所述的显示面板，其中，相邻两个所述色阻块之间，其中一个所述色阻块为红色色阻、绿色色阻和蓝色色阻中的一种，另一个所述色阻块为包括红色色阻、绿色色阻和蓝色色阻中的两种或三种的堆叠结构。
  15. 如权利要求2所述的显示面板，其中，相邻两个所述色阻块之间，其中一个所述色阻块为包括红色色阻、绿色色阻和蓝色色阻中的两种的堆叠结构，另一个所述色阻块为包括红色色阻、绿色色阻和蓝色色阻的堆叠结构。
  16. 如权利要求1所述的显示面板，其中，所述显示面板还包括覆盖于所述发光器件层上的封装层，所述第一基板的所述非显示区的厚度小于所述第一基板的所述显示区的厚度。
  17. 如权利要求16所述的显示面板，其中，所述驱动电路层包括有源层、设于所述有源层的背离所述第一基板的一侧的栅极绝缘层、设于所述栅极绝缘层的背离所述有源层的一侧的栅极层、覆盖于所述栅极和所述有源层上的第一绝缘层以及设于所述第一绝缘层上的源漏极金属层；
    所述第一绝缘层对应所述非显示区的部分的厚度小于所述第一绝缘层对应所述显示区的部分的厚度。
  18. 一种显示面板的制作方法，所述显示面板包括显示区和位于所述显示区一侧的非显示区，其中，所述显示面板的制作方法包括以下步骤：
    在第一基板上形成驱动电路层和发光器件层，所述驱动电路层设置于所述第一基板的一侧，所述发光器件层设置于所述驱动电路层的远离所述第一基板的一侧；
    在第二基板上形成应力释放层，所述应力释放层对应所述非显示区设置，所述应力释放层设有凹陷部；
    将所述第二基板固定于所述第一基板的一侧，所述驱动电路层、所述发光器件层和所述应力释放层位于所述第一基板和所述第二基板之间。
  19. 如权利要求18所述的显示面板的制作方法，其中，在第二基板上形成应力释放层的步骤包括：
    在第二基板上形成遮光层，所述遮光层对应所述显示区设有多个容置槽；
    在所述第二基板上形成彩色滤光层和应力释放层，所述彩色滤光层对应所述显示区设置，所述应力释放层对应所述非显示区设置，彩色滤光层包括设于显示区的红色色阻、绿色色阻和蓝色色阻，所述显示区的所述红色色阻、所述绿色色阻和所述蓝色色阻设于对应的所述容置槽中；
    将所述第二基板固定于所述第一基板的一侧后，所述彩色滤光层和所述应力释放层设置于所述遮光层的靠近所述发光器件层的一侧。
  20. 如权利要求19所述的显示面板的制作方法，其中，在所述第二基板上形成彩色滤光层和应力释放层的步骤中，所述应力释放层包括多个色阻块，多个所述色阻块间隔设置，所述色阻块选自所述红色色阻、所述绿色色阻和所述蓝色色阻中的一种或至少两种的堆叠结构。
PCT/CN2022/076178 2022-01-25 2022-02-14 显示面板及其制作方法 Ceased WO2023142173A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/638,101 US12256624B2 (en) 2022-01-25 2022-02-14 Display panel and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210088279.8A CN114447077B (zh) 2022-01-25 2022-01-25 显示面板及其制作方法
CN202210088279.8 2022-01-25

Publications (1)

Publication Number Publication Date
WO2023142173A1 true WO2023142173A1 (zh) 2023-08-03

Family

ID=81369521

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/076178 Ceased WO2023142173A1 (zh) 2022-01-25 2022-02-14 显示面板及其制作方法

Country Status (3)

Country Link
US (1) US12256624B2 (zh)
CN (1) CN114447077B (zh)
WO (1) WO2023142173A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114975484B (zh) * 2022-05-27 2025-08-19 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN117116540B (zh) * 2023-08-25 2024-06-14 扬州市德友线缆有限公司 一种耐高温无机绝缘信号电缆及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06214110A (ja) * 1993-01-18 1994-08-05 Toshiba Corp カラ−フィルタ及びカラ−液晶表示装置
CN106959549A (zh) * 2017-05-17 2017-07-18 京东方科技集团股份有限公司 色阻结构、滤光组件、显示装置以及色阻结构的制备方法
CN208127245U (zh) * 2018-03-09 2018-11-20 上海和辉光电有限公司 一种柔性有机发光显示面板及显示装置
CN109728196A (zh) * 2018-12-29 2019-05-07 厦门天马微电子有限公司 显示面板、其制作方法和显示装置
CN109802053A (zh) * 2019-01-29 2019-05-24 昆山国显光电有限公司 一种显示面板
CN110211998A (zh) * 2019-05-31 2019-09-06 武汉天马微电子有限公司 一种有机发光显示面板及显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287191B2 (en) * 2011-10-12 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device package and method
KR102405257B1 (ko) * 2015-01-28 2022-06-03 삼성디스플레이 주식회사 표시 장치
CN108878687B (zh) * 2018-06-29 2020-03-10 上海天马微电子有限公司 一种显示面板和电子设备
CN109119450B (zh) * 2018-08-31 2021-01-15 京东方科技集团股份有限公司 显示基板及其制作方法、显示面板、显示装置
KR102777184B1 (ko) * 2019-03-25 2025-03-06 삼성디스플레이 주식회사 표시 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06214110A (ja) * 1993-01-18 1994-08-05 Toshiba Corp カラ−フィルタ及びカラ−液晶表示装置
CN106959549A (zh) * 2017-05-17 2017-07-18 京东方科技集团股份有限公司 色阻结构、滤光组件、显示装置以及色阻结构的制备方法
CN208127245U (zh) * 2018-03-09 2018-11-20 上海和辉光电有限公司 一种柔性有机发光显示面板及显示装置
CN109728196A (zh) * 2018-12-29 2019-05-07 厦门天马微电子有限公司 显示面板、其制作方法和显示装置
CN109802053A (zh) * 2019-01-29 2019-05-24 昆山国显光电有限公司 一种显示面板
CN110211998A (zh) * 2019-05-31 2019-09-06 武汉天马微电子有限公司 一种有机发光显示面板及显示装置

Also Published As

Publication number Publication date
CN114447077A (zh) 2022-05-06
US12256624B2 (en) 2025-03-18
CN114447077B (zh) 2025-07-08
US20240244927A1 (en) 2024-07-18

Similar Documents

Publication Publication Date Title
CN107342304B (zh) 有机发光显示装置及其制造方法
CN110246879B (zh) 一种有机发光显示面板及装置
WO2020199445A1 (zh) 一种oled显示器件及其制备方法
CN110828535A (zh) 一种阵列基板、显示面板和显示装置
CN115132796A (zh) 显示面板及其制备方法、显示装置
CN113130821B (zh) 显示面板及其制造方法、显示装置
WO2022237017A1 (zh) 显示面板及其制作方法、显示装置
CN113488510B (zh) 显示面板及显示装置
WO2023197373A1 (zh) 显示面板及显示装置
CN111554722B (zh) 显示基板及显示装置
WO2020239071A1 (zh) 显示基板及其制作方法、显示面板和显示装置
CN118922029A (zh) 显示面板、显示装置和显示面板的制备方法
CN108091677A (zh) 阵列基板、显示装置以及阵列基板的制造方法
CN115666163A (zh) 一种显示面板、制作方法及移动终端
WO2024254937A1 (zh) 显示面板及显示装置
WO2023010603A1 (zh) 显示面板及电子设备
WO2022213420A1 (zh) 一种阵列基板及其制备方法、oled显示面板
WO2023142173A1 (zh) 显示面板及其制作方法
WO2021164105A1 (zh) 显示面板及其制作方法
CN110581229A (zh) 显示面板、显示装置及显示面板的制备方法
WO2024255131A1 (zh) 显示面板、显示装置及显示面板的制备方法
WO2022170479A1 (zh) 显示基板及其制作方法、显示装置
CN108461524B (zh) 显示面板、显示面板制备方法及电子装置
CN111223890B (zh) 显示面板及其制备方法与显示装置
WO2023019603A1 (zh) 显示面板、显示面板的制作方法以及显示装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 17638101

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22922995

Country of ref document: EP

Kind code of ref document: A1

WWG Wipo information: grant in national office

Ref document number: 17638101

Country of ref document: US