WO2023138961A1 - Procédé permettant le perçage au laser d'un trou dans une pièce avec une première et une seconde intensité de faisceau moyenne, et dispositif de perçage au laser correspondant - Google Patents

Procédé permettant le perçage au laser d'un trou dans une pièce avec une première et une seconde intensité de faisceau moyenne, et dispositif de perçage au laser correspondant Download PDF

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Publication number
WO2023138961A1
WO2023138961A1 PCT/EP2023/050511 EP2023050511W WO2023138961A1 WO 2023138961 A1 WO2023138961 A1 WO 2023138961A1 EP 2023050511 W EP2023050511 W EP 2023050511W WO 2023138961 A1 WO2023138961 A1 WO 2023138961A1
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WO
WIPO (PCT)
Prior art keywords
laser beam
laser
intensity
workpiece
mean
Prior art date
Application number
PCT/EP2023/050511
Other languages
German (de)
English (en)
Inventor
Oliver BOCKSROCKER
Nicolai Speker
Tim Hesse
Original Assignee
Trumpf Laser- Und Systemtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Laser- Und Systemtechnik Gmbh filed Critical Trumpf Laser- Und Systemtechnik Gmbh
Publication of WO2023138961A1 publication Critical patent/WO2023138961A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Definitions

  • the invention relates to a method for laser drilling a hole in a workpiece according to the preamble of claim 1 and a corresponding laser drilling device.
  • Figures 1a, 1b and 1c each show a cross-sectional view through a workpiece 10 of three known methods in use.
  • a method also known as trepanning is used, in which the bore 11 is also produced by a plurality of laser pulses 21 of a laser beam 20, the laser beam 20 also being moved or projected along the trajectory 22 shown. is rotated to expand the bore 11 in the x-y plane of the x,y,z coordinate system shown.
  • a region 12 of the bore 11 still has material from the workpiece 10 and still has to be drilled through.
  • a method also known as single-shot drilling is used, in which the hole 11 is drilled by a single laser pulse 21 of a laser beam 20 of high intensity along the entire spot surface of the laser beam 20 on the workpiece 10.
  • FIG. 1c Like the method of FIG. 1c associated Figures 2a and 2b show, as well as in the method of FIG. 1a, 1b, the material of the workpiece 10 is almost completely melted and/or evaporated.
  • the outer region 13 of the bore 11 has the melted zene or. melt liquid material.
  • the melt 14 shown is expelled from the bore 11 by the steam pressure.
  • the material of the workpiece 10 has evaporated in the area 15 surrounded by the outer area 13 . This is how it appears in Fig. 2b shown workpiece 10 with the bore 11 .
  • the object of the invention is to propose an improved method and an improved laser drilling device for laser drilling a hole in a workpiece, which in particular allow more precise laser drilling with increased process efficiency.
  • a method for laser drilling a hole in a workpiece wherein at least one laser beam is used for the laser drilling.
  • the laser beam cross-section of the at least one laser beam has a central surface with a first laser beam profile having a first mean beam intensity and an outer edge surface surrounding the central surface with a second laser beam profile having a second mean beam intensity, with the second mean beam intensity being greater than the first mean beam intensity.
  • an increased process efficiency and thus also a reduced cycle time can be achieved during laser drilling, because the material of the workpiece is processed particularly intensively, in particular evaporated and/or melted, only in an edge area of the bore that essentially corresponds to the outer edge surface of the laser beam cross section (locally by the generated laser spot of the laser beam), and the material lying within the edge area is less edited or is heated, in particular can remain in a solid state.
  • more power of the laser radiation is targeted to the surface of the periphery of the bore rather than to the surface of the interior of the bore, thereby enabling the machining at the periphery that ultimately enables the creation of the borehole.
  • the area or Central area are punched out by the at least one laser beam.
  • the hole diameter of the bore can be set particularly precisely and a more precise roundness and cylindricity of the bore can be achieved than is the case with the methods known from the prior art, in which the beam intensity typically decreases from the inside to the outside, as shown in FIG. 2a can be removed.
  • Workpieces of different materials for example metallic materials, ceramic materials, polymer-based materials or materials with combinations of the aforementioned materials, can be drilled with the method according to the invention.
  • the workpiece can be designed in one layer or with several layers made of the same or different materials, in particular different of the aforementioned materials.
  • the laser drilling can be carried out with a fluence H ⁇ 500 kJ/mm 2 , in particular with a fluence H ⁇ 100 kJ/mm 2 , of the at least one laser beam.
  • a fluence H ⁇ 500 kJ/mm 2 in particular with a fluence H ⁇ 100 kJ/mm 2
  • the Total intensity of the entire at least one laser beam and/or the second average beam intensity can in particular have an intensity I of the at least one laser beam of I ⁇ 15. 000 kW/mm 2 , especially from I ⁇ 6 . 500 kW/mm 2 can be used.
  • Radiation intensity is understood here as that energy of the laser beam that is transported in a specific time through the laser beam cross section, ie an area perpendicular to the direction of propagation of the at least one laser beam.
  • radiation intensity is energy per time per area and can be expressed in W/mm 2 .
  • the radiation power Radiant power refers to the radiated energy over time, which can be given in watts.
  • the beam intensity is the beam power in relation to the laser beam cross section.
  • the first average radiation intensity consequently means the radiation intensity averaged over the central area.
  • the second average radiation intensity correspondingly means the radiation intensity averaged over the outer edge surface.
  • the radiation intensity varies across the central area or the outer edge area, it can be averaged over the entire central area, so that the first or second average radiation intensity is obtained, which can also be specified in W/mm 2 .
  • the central surface and the outer edge surface surrounding it preferably together form the entire laser beam cross section of the laser beam. With the outer edge surface is therefore meant in particular that the outer edge surface on the outside of the
  • Laser beam cross-section is located and in particular the central area completely surrounds. It is advantageous if the outer edge surface and the central surface are in a certain size relation to each other.
  • the outer edge surface can preferably have a maximum diameter which is at least 1, 2 times, at least 1, 5 times or at least 2 times the maximum diameter of the central surface.
  • a maximum diameter of the outer edge surface can preferably be at most 5 times, very particularly at most 4 times the maximum diameter of the central surface.
  • the material of the workpiece is only visible in an edge region of the borehole or of the borehole is melted and/or evaporated.
  • the material in a central area of the hole corresponding to the central surface of the laser beam cross-section is not melted or melted. vaporize .
  • the power of the laser device used for laser drilling can be used entirely for process-efficient laser drilling in the edge area of the hole, which also means that greater precision can be achieved during laser drilling.
  • the laser drilling of the hole can be done by one or more laser pulses of the at least one laser beam.
  • Laser pulse or percussion drilling i.e. laser drilling with several consecutive laser pulses
  • a pulse duration of a laser pulse in the range of 5 ps to 1. 000 ms , especially in the range from 10 ps to 1 . 000 hp , lie .
  • a pulse duration of a laser pulse can particularly preferably be in the range from 5 ps to 200 ps. In the ranges mentioned, high pulse energies of more than 50 mJ enable sufficient vaporization and melt ejection. In addition, short interaction times in this pulse duration range ensure that there is a need-based melting or Heating and removal of the material with little heat input at the edges of the hole.
  • the first laser beam profile and/or the second laser beam profile is changed during a laser pulse.
  • Such a change can be sudden or continuous.
  • the entire laser beam profile of the at least one laser beam, i.e. the first and second laser beam profile together, or the first or second laser beam profile in each case can be changed in such a way that a laser beam profile is switched between a Gauss-like, top-hat-like and/or ring-like laser beam profile. It can also be provided that there is a gradual switchover between intermediate stages between two or all three of the aforementioned laser beam profiles.
  • a diameter of the at least one laser beam is changed during a laser pulse.
  • Such a change can be sudden or continuous. Also this makes it possible to change the borehole diameter in particular continuously in the drilling direction.
  • a pulse shape of a laser pulse is rectangular, triangular, sinusoidal or a combination of at least two of the aforementioned shapes. In this way, improved coupling of the laser beam and targeted vaporization and targeted expulsion of molten material from the workpiece can be achieved.
  • the second mean radiation intensity is preferably at least 10% greater, particularly at least 20% greater and also particularly at least 50% greater than the first mean radiation intensity. It has been shown that the drilling precision is particularly high with such an average radiation intensity distribution.
  • an intensity gradient of the second laser beam profile is greater than an intensity gradient of the first laser beam profile. Accordingly, a standardized intensity gradient of AI>50 kW/(mm 2 *dw) with beam diameter dw can be deliberately deviated from.
  • the beam diameter is in particular the 86% diameter of the laser beam, ie the diameter of the part of the laser beam that is at least 86% of the total energy of the beam contains . This allows the size and extent of the melted area to be reproduced, even with different surface qualities on the workpieces, and the drill hole diameter can also be set very precisely.
  • the at least one laser beam it is possible for the at least one laser beam to have a minimum radiation intensity in the central area.
  • the beam intensity can have its minimum over the entire laser beam cross section in the central area.
  • the radiation intensity minimum can very particularly lie in or near the center of area of the laser beam cross section. As a result, it can be avoided to a particular extent that material lying inside the bore is heated less and is therefore preferably not melted and/or not evaporated.
  • the beam intensity minimum can preferably propagate in the laser beam propagation direction of the at least one laser beam. This means in particular that the beam intensity minimum continues over a distance of the order of magnitude of a Rayleigh length or more along the laser beam propagation direction.
  • This property can be generated via an optical fiber in which a near-diffraction-limited laser beam is guided by exerting a mechanical force on this optical fiber.
  • beam-shaping elements can be used that impose a vortex-shaped phase distribution, such as e.g. B. Vortex mirrors or vortex phase plates. As a result, a high tolerance width can be achieved in the direction of the optical axis of the laser beam.
  • the outer edge surface can preferably have a ring shape, a square shape or a polygon shape.
  • the polygon shape can have any number of corners, for example three, five, six or more, for example twelve.
  • the second laser beam profile consists of several, in particular azimuthal (to the workpiece) arranged or oriented , laser beams is generated . This makes it possible for all of the multiple (individual) laser beams to be variable in their beam power independently of one another.
  • the second laser beam profile is essentially homogeneous with regard to its beam intensity.
  • Essentially homogeneous includes technically caused deviations or Tolerances from a mathematically perfectly homogeneous beam intensity distribution over the outer edge surface, which in reality hardly or not at all. is very difficult to achieve.
  • the homogeneous beam profile can be created, for example, by an appropriate beam-shaping element, e.g. a di f fractive optical element in the laser drilling device, in particular its optics, can be achieved.
  • the method according to the invention can be used in a particularly advantageous manner to produce a bore with a bore depth of ⁇ 3 mm, in particular ⁇ 500 ⁇ m, and/or with an aspect ratio of bore depth to minimum width of the bore (11) of ⁇ 1:100, in particular ⁇ 1:10.
  • Laser drilling device for laser drilling a hole in a Workpiece, wherein the laser drilling device has a laser beam device for emitting at least one laser beam and an optical system for aligning the at least one laser beam onto the workpiece in such a way that a laser beam cross section of the at least one laser beam has a central surface with a first laser beam profile having a first average radiation intensity and an outer edge surface surrounding the central surface with a second laser beam profile having a second average radiation intensity, the second average radiation intensity being greater than the first average radiation intensity.
  • the features described herein in relation to the method according to the invention can of course also be used in relation to the laser drilling device according to the invention, and vice versa.
  • the laser drilling device can be set up to carry out the method according to the invention.
  • scanner optics ie optics with one or more movable mirrors for deflecting the laser beam
  • the scanner optics can, for example, have an imaging ratio in the range from 1:1 to 5:1, in particular in the range from 1.5:1 to 2:1.
  • the scanner optics sold by TRUMPF under the designation FPO33-2 can be used.
  • the laser beam device of the laser drilling device can be, for example, a quasi-continuous wave laser or a VIS laser, i.e. a laser with a visible wavelength of the Laser light works.
  • a different laser beam device and/or, in principle, the use of flying optics, in particular with the same imaging ratios, is also possible, for example such as is marketed by TRUMPF under the name BEO.
  • a single-mode laser for example a laser sold by TRUMPF under the name TruFiber (pulse) 500-2000, or a multimode laser, for example a disk laser sold by TRUMPF under the name TruDisk (pulse) 2000-5000, can be used as a quasi-continuous-wave laser.
  • TRUMPF under the name variMODE Pro, which is characterized by a single-core fiber on which mechanical pressure is exerted so that a ring-like beam profile is generated from a Gaussian-like beam profile.
  • variMODE Star which is characterized by a ring fiber that is fed from several laser modules.
  • a beam parameter product SPP of the at least one laser beam is in the range from 0.3 mm*mrad to 34 mm*mrad, in particular in the range from 0.38 mm*mrad to 32 mm*mrad.
  • an SPP of 0.6 mm*rad or less has proven particularly advantageous.
  • an SPP of 4 mm*rad or less is particularly advantageous.
  • Beam diameter of the at least one laser beam in the area from 10 gm to 800 gm, in particular in the range from 20 gm to 200 gm.
  • a beam diameter in the range from 20 gm to 50 gm has proven advantageous
  • a beam diameter in the range from 50 gm to 200 gm has proven advantageous.
  • a wavelength of the at least one laser beam is in the range from 800 nm to 1200 nm, in particular in the range from 1030 nm to 1070 nm.
  • a wavelength of the at least one laser beam is in the range from 380 nm to 530 nm, particularly in the range from 400 nm to 515 nm or in the range from 400 nm to 450 nm (blue light) including 515 nm (green light).
  • the average laser power Pav can be in the range of 2 W to 2 . 000 W, especially in the range of 50 W to 700 W.
  • the pulse peak power Ppeak can also be in the aforementioned ranges.
  • a switching frequency with respect to the changing or Switching the laser beam profile can be greater than the pulse frequency f out . Further details and advantageous configurations of the invention can be found in the following description, on the basis of which exemplary embodiments of the invention are described and explained in more detail.
  • FIGS. 1a-1c show cross-sectional views through a workpiece which is drilled using laser drilling methods known from the prior art
  • FIGS. 2a, 2b perspective views of the workpiece from FIG. 1c ;
  • FIGS. 3a, 3b perspective views of a workpiece which is drilled by means of an exemplary embodiment of a laser drilling method according to the invention
  • Figure 4 is a schematic cross-sectional view of a
  • FIGS. 5a, 5b are schematic views of possible laser beam cross sections of the laser drilling device from FIG. 4 laser beam used for laser drilling;
  • Figures 7a-7c schematic representations compared to Figs. 6a-6c alternative laser beam cross section with intensity distribution graphs in the plane of the laser beam cross section.
  • FIGS. 1a-1c and FIGS. 2a, 2b show the laser drilling methods already explained at the outset in use on the workpiece 10, as are known from the prior art.
  • FIGS. 3a, 3b and 4 show an exemplary embodiment of a method according to the invention for laser drilling the hole 11 in the workpiece 10 by means of a laser drilling device 40 set up according to an exemplary embodiment of the invention.
  • FIG. 3a shows, other laser beam profiles 32, 34 (see FIG. 4) are used than are shown in FIG. 3a is the case with the prior art.
  • FIG. 4 shows a different beam intensity distribution set on the basis of the laser beam cross section 30 of the laser beam 20 directed by the laser drilling device 40 onto the workpiece 10 with a laser pulse 21 .
  • Fig. 4 shown first laser beam profile 32 in the central surface 31 of the laser beam cross section 30 in FIG on the spanned x, y-plane lower, in particular by at least 10% lower and very particularly significantly lower, so that there is an intensity minimum in a centroid of the laser beam cross section 30 than a second average radiation intensity of the second laser beam profile 34 in the edge surface 33 of the laser beam cross section 30 .
  • a central area 17 in the area of the bore 11 in the workpiece 10 which is not melted and is surrounded by an edge area 16 .
  • the central area 17 corresponds locally essentially to the central area 31 of a laser spot of the laser beam 20 .
  • the edge region 16 corresponds locally essentially to the edge surface 33 of the laser spot of the laser beam 20 or its laser beam cross section 30 . Consequently, the bore 11 can be drilled very precisely, with the central area 17 being punched out, which, unlike the edge area 16 , has no area 13 with molten material and no area 15 with vaporized material of the workpiece 10 .
  • the laser drilling device 40 has a laser processing head 41 in which a laser beam device 42 is at least partially arranged, which in turn can be connected to a laser beam source (not shown) or can have this. Furthermore, the Laser processing head 41 has optics 43 , which in particular can be embodied as scanner optics 43 .
  • Figures 5a, 5b show alternative laser beam cross sections 30, according to which the laser beam 20 can be formed.
  • the outer edge surface 33 in the example of FIG. 5a rectangular, in particular square, instead of ring-shaped, as in FIG. 4 shaped .
  • the laser beam cross-section 30 is shaped as a 12-corner polygon.
  • a bore 11 with a rectangular or polygonal cross section can be produced with such laser beam cross sections 30 .
  • Fig. 6a once again shows the laser beam cross section 30 from FIG. 4 .
  • These show the Fig. 6b and 6c two intensity distribution graphs of the laser beam intensity I of the laser beam cross section 30, namely once in the x direction and once in the y direction of the x, y plane of the laser beam cross section 30 shown. It can be seen how the second average beam intensity of the second laser beam profile 34 has clear intensity peaks or Intensity maxima 35 , while the first average beam intensity of the first laser beam profile 32 in the central region 31 shows a clear intensity minimum 36 between the two intensity peaks 35 , in particular in or near a centroid of the laser beam cross section 30 .
  • Fig. 7a shows another laser beam cross section 30 for a possible laser beam 20 with which the laser drilling can be carried out according to the invention.
  • the intensity minimum 36 in the central region 31 is not quite as strong as in the laser beam cross section 30 of FIG. 6a, whereby a high process efficiency can still be achieved and the drilling diameter of the bore 11 can be set precisely.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un procédé permettant le perçage au laser d'un trou dans une pièce (10), au moins un faisceau laser (20) étant utilisé pour le perçage au laser, une section transversale (30) dudit au moins un faisceau laser (20) présentant une surface centrale (31) pourvue d'un premier profil de faisceau laser (32) présentant une première intensité de faisceau moyenne et une surface périphérique extérieure (33) entourant la surface centrale (31), pourvue d'un second profil de faisceau laser (34) présentant une seconde intensité de faisceau moyenne, la seconde intensité de faisceau moyenne étant supérieure à la première intensité de faisceau moyenne.
PCT/EP2023/050511 2022-01-18 2023-01-11 Procédé permettant le perçage au laser d'un trou dans une pièce avec une première et une seconde intensité de faisceau moyenne, et dispositif de perçage au laser correspondant WO2023138961A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022101094.5A DE102022101094A1 (de) 2022-01-18 2022-01-18 Verfahren zum Laserbohren einer Bohrung in ein Werkstück sowie Laserbohrvorrichtung
DE102022101094.5 2022-01-18

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Publication Number Publication Date
WO2023138961A1 true WO2023138961A1 (fr) 2023-07-27

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WO (1) WO2023138961A1 (fr)

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DE69908868T2 (de) * 1998-07-30 2004-05-06 Snecma Moteurs Vorrichtung zur Bearbeitung von Löchern oder von Formen mit veränderlichem Profil mittels eines Excimerlasers
US20090084755A1 (en) * 2007-09-28 2009-04-02 Intel Corporation Method for forming micro-vias on a substrate
US20160271727A1 (en) * 2013-10-17 2016-09-22 Centre National De La Recherche Scientifique Method and device for laser micromachining
DE102019108131A1 (de) * 2019-03-28 2020-10-01 Pulsar Photonics Gmbh Vorrichtung und Verfahren zur Ausbildung von VIA-Laserbohrungen

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DE102004014820B4 (de) 2004-03-24 2006-10-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen von Bohrungen mit großem Aspektverhältnis in metallischen Werkstoffen sowie in geschichteten metallischen Werkstoffen und solchen, die mindestens eine keramische Schicht aufweisen
US9211609B2 (en) 2005-12-28 2015-12-15 Intel Corporation Laser via drilling apparatus and methods
EP3307473B1 (fr) 2015-06-10 2020-07-22 IPG Photonics Corporation Methode et system de percage laser avec modification de l'énergie d'un faisceau laser pour réduire les repercussions sur les parois pendant le perçage au laser
IT201600070352A1 (it) 2016-07-06 2018-01-06 Adige Spa Procedimento di lavorazione laser di un materiale metallico con controllo della distribuzione di potenza trasversale del fascio laser in un piano di lavorazione, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento.
DE102017001684A1 (de) 2016-11-11 2018-05-17 Rj Lasertechnik Gmbh Verfahren zum Bohren von Löchern mit einem gepulsten Laser

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69908868T2 (de) * 1998-07-30 2004-05-06 Snecma Moteurs Vorrichtung zur Bearbeitung von Löchern oder von Formen mit veränderlichem Profil mittels eines Excimerlasers
US20090084755A1 (en) * 2007-09-28 2009-04-02 Intel Corporation Method for forming micro-vias on a substrate
US20160271727A1 (en) * 2013-10-17 2016-09-22 Centre National De La Recherche Scientifique Method and device for laser micromachining
DE102019108131A1 (de) * 2019-03-28 2020-10-01 Pulsar Photonics Gmbh Vorrichtung und Verfahren zur Ausbildung von VIA-Laserbohrungen

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