WO2011035777A1 - Procédé de séparation sans bavure de pièces d'usinage avec modifications de paramètres d'usinage laser - Google Patents

Procédé de séparation sans bavure de pièces d'usinage avec modifications de paramètres d'usinage laser Download PDF

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Publication number
WO2011035777A1
WO2011035777A1 PCT/DE2010/001176 DE2010001176W WO2011035777A1 WO 2011035777 A1 WO2011035777 A1 WO 2011035777A1 DE 2010001176 W DE2010001176 W DE 2010001176W WO 2011035777 A1 WO2011035777 A1 WO 2011035777A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
processing
phase
kerf
laser
Prior art date
Application number
PCT/DE2010/001176
Other languages
German (de)
English (en)
Inventor
Matthias LÜTKE
Sebastian Stelzer
Thomas Himmer
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Technische Universität Dresden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V., Technische Universität Dresden filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Publication of WO2011035777A1 publication Critical patent/WO2011035777A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Definitions

  • the invention relates to a method for burr-free cutting machining of workpieces with a two-dimensionally deflectable, focused laser beam.
  • Cutting gas is expelled even though it produces high tively with small processing times.
  • a relative movement of laser beam and workpiece can be carried out by means of technical means known per se.
  • the laser beam is also deflected two-dimensionally in order to increase the feed rate and be able to respond flexibly to desired geometric contours.
  • An important parameter during processing is a minimum power density at the focal point of the laser beam of 1 ⁇ 10 7 W / cm 2 , preferably at least 1 ⁇ 10 8 W / cm 2 and a minimum feed rate of 150 m / min, preferably 200 m / min, especially preferably of at least 700 m / min.
  • the procedure is that the processing takes place in at least two phases to be carried out one after the other.
  • an at least two-dimensionally deflectable, focused laser beam which is emitted by a single-mode fiber laser or a disk laser is directed onto a workpiece surface to form a kerf so that material removal is achieved exclusively by ablation.
  • the focal spot of the laser beam is repeatedly moved over the same positions of the workpiece surface along a trainee cutting contour in a first phase of machining.
  • the processing parameters of the process are not changed in this first phase of the processing and then in a subsequent further phase of processing before complete cutting of the workpiece.
  • the focal spot of the laser beam is moved during the further (second) second phase of the machining at least once with changed parameters along the cutting contour to be formed, thereby forming a Remelting and / or material removal at the edges of the kerf can be achieved.
  • Such a work piece is then work on the edges of kerfs, if not completely, at least for the most part burr-free.
  • the focal spot during the further phase of the processing but more than once over each position along a trainees denden cutting contour can be moved.
  • a feed rate of at least 150 m / min, a power density at the focal point of at least 1 ⁇ 10 7 W / cm 2 should be maintained and the laser beam should be focused such that the focal point has a diameter smaller than 100 ⁇ has.
  • the focal spot of the laser beam can be moved n-fold over the cutting contour to be formed, so that each position is exposed n times to the influence of the laser radiation. Until then, however, the workpiece is not completely severed, ie the kerf is not yet sufficient through the entire thickness of the workpiece.
  • the complete separation is carried out exclusively during a further phase of processing and thereby changed process parameters, which will be discussed in more detail below. However, this should be preceded by the fact that the individual possible parameter changes can also be combined with one another in the second phase in the process according to the invention. It is also possible to carry out the process in more than two phases of the processing and thereby repeatedly change the processing parameters, whereby the quality, so the burr freedom further improved can be.
  • the power density in the focal spot of the laser beam during processing can be reduced in a further second and possibly an additional further phase following the second phase. This can be achieved by reducing the laser power and / or defocusing the laser beam.
  • the focal spot can be increased so that its diameter is at least three times as large as the width of the formed kerf.
  • He may have a diameter of 325 ⁇ at a distance of the focal point of 5 mm to the workpiece surface, preferably a diameter of 650 ⁇ at a distance of the focal point of 10 mm.
  • the method according to the invention can be controlled
  • a distance signal or a depth measurement signal can be used, for example, to change the position of the focal point.
  • the feed rate can also be reduced.
  • a kerf that does not fully extend through the workpiece during the first phase of machining can be formed and burr formation avoided by performing at least one final kerf cut along the cutting contour to be formed in the further phase the processing is performed, the laser power is increased. It can be processed with "a power that corresponds to at least 1.5 times the power during the first phase.
  • the laser power is increased during a further phase of the machining, it is also possible to proceed in such a way that a small kerf is formed during the machining in a previously performed phase with reduced laser power.
  • the focal spot is moved at least once along the entire cutting contour to be formed. Following this phase, the complete separation of a workpiece with the significantly higher laser power can then be carried out. In this case, the focal spot with a higher number along the trainees
  • Cutting contour can be exposed to the laser energy accordingly often.
  • the focal spot can be guided with different numbers in the various phases of the machining along the cutting contour to be formed.
  • the feed rate should be kept very high compared to the conventional methods. It should always be kept above 200 m / min, preferably above 500 m / min and more preferably above 700 m / min.
  • the workpiece had a thickness of 1 mm and was made of stainless steel 1.4301.
  • the workpiece has not been completely severed by then.
  • a residual layer thickness of 0.05 mm remained in the kerf until the machining parameters for a second phase of machining were changed to completely separate the workpiece.
  • the cutting contour was traversed twice with the focal spot.
  • the feed rate of 800 m / min was maintained and only the power of the laser source in a range between 500 and 750 W cuted.
  • the edges of the kerf still showed a ridge with a width of 100 ⁇ and a height of 25 ⁇ .
  • the feed rate has been kept constant at 800 m / min.
  • the laser beam was but
  • the edges of the kerf showed after this phase of processing still a ridge with a width of 100 ⁇ on.
  • the height of the ridge was still at 20 um.
  • the focal spot was guided twice along the cutting contour to be formed.
  • the focal spot is moved at a feed rate of 800 m / min and a focal point diameter of 25 ⁇ .
  • the power of the laser radiation was in the range between 500 W and 750 W. With this relative low power was a kerf along the trainee cutting contour formed, which had a depth of 0.05 mm.
  • only the power P L of the laser was increased to 5 kW and the focal spot was moved a further 16 times along the cutting contour to be formed, thereby completely cutting through the workpiece in the last separating cut.
  • the remaining ridge at the edges of the kerf again had a width of 100 ⁇ m and a height of -25 ⁇ m.

Abstract

L'invention concerne un procédé de séparation sans bavure de pièces d'usinage au moyen d'un faisceau laser bidimensionnel focalisé et pouvant être dévié. Selon le procédé de l'invention, un faisceau laser émis par un laser à fibres monomode ou par un laser à disques est dirigé vers la surface d'une pièce d'usinage pour former une saignée de manière que la matière soit exclusivement enlevée par ablation et que le foyer du faisceau laser soit déplacé plusieurs fois au-dessus des mêmes emplacements de la surface de la pièce d'usinage le long d'une ligne de coupe à former dans une première phase d'usinage. Les paramètres d'usinage laser du procédé sont modifiés dans au moins une phase d'usinage suivante, avant la séparation complète de la pièce usinée, et le foyer du faisceau laser est déplacé au moins une fois selon des paramètres modifiés le long de la ligne de coupe à former, ce qui permet de refondre et/ou d'enlever de la matière sur les bords de la saignée.
PCT/DE2010/001176 2009-09-28 2010-09-27 Procédé de séparation sans bavure de pièces d'usinage avec modifications de paramètres d'usinage laser WO2011035777A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009047995A DE102009047995B3 (de) 2009-09-28 2009-09-28 Verfahren zur gratfreien trennenden Bearbeitung von Werkstücken
DE102009047995.3 2009-09-28

Publications (1)

Publication Number Publication Date
WO2011035777A1 true WO2011035777A1 (fr) 2011-03-31

Family

ID=43446698

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2010/001176 WO2011035777A1 (fr) 2009-09-28 2010-09-27 Procédé de séparation sans bavure de pièces d'usinage avec modifications de paramètres d'usinage laser

Country Status (2)

Country Link
DE (1) DE102009047995B3 (fr)
WO (1) WO2011035777A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110818241A (zh) * 2019-11-29 2020-02-21 北京兆维电子(集团)有限责任公司 一种玻璃切割方法
CN112867580A (zh) * 2018-10-01 2021-05-28 通快机床两合公司 用于加工工件的方法和设备
CN113646124A (zh) * 2019-02-25 2021-11-12 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN114367749B (zh) * 2019-02-25 2024-05-10 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012217766B4 (de) 2012-09-28 2016-06-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zum Dampfdruck-Abtragschneiden eines metallischen Werkstücks
DE102013204222B4 (de) 2013-03-12 2017-09-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und system zum bearbeiten eines objekts mit einem laserstrahl

Citations (5)

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Publication number Priority date Publication date Assignee Title
US20020190037A1 (en) * 2001-05-23 2002-12-19 Steur Hubert De Method for drilling micro-holes with a laser beam
EP1433563A2 (fr) * 2002-12-23 2004-06-30 Maschinenfabrik Spaichingen GmbH Procédé et dispositif de coupage au laser
US20050087522A1 (en) * 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
EP2017030A1 (fr) * 2007-07-19 2009-01-21 Nitto Denko Corporation Procédé de traitement d'un faisceau laser
DE102008027130A1 (de) 2008-05-29 2009-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl

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JPH08108287A (ja) * 1994-10-07 1996-04-30 Seiji Ishibe 面取り加工方法
JP2008008168A (ja) * 2006-06-28 2008-01-17 Denso Corp 噴孔プレートの製造方法
DE102006052824B4 (de) * 2006-11-09 2009-05-07 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Vorrichtung beim Laserstrahlschneiden eines metallischen Bauteils

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020190037A1 (en) * 2001-05-23 2002-12-19 Steur Hubert De Method for drilling micro-holes with a laser beam
EP1433563A2 (fr) * 2002-12-23 2004-06-30 Maschinenfabrik Spaichingen GmbH Procédé et dispositif de coupage au laser
US20050087522A1 (en) * 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
EP2017030A1 (fr) * 2007-07-19 2009-01-21 Nitto Denko Corporation Procédé de traitement d'un faisceau laser
DE102008027130A1 (de) 2008-05-29 2009-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867580A (zh) * 2018-10-01 2021-05-28 通快机床两合公司 用于加工工件的方法和设备
CN112867580B (zh) * 2018-10-01 2024-01-12 通快机床欧洲股份公司 用于加工工件的方法和设备
CN113646124A (zh) * 2019-02-25 2021-11-12 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN114367749A (zh) * 2019-02-25 2022-04-19 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN113646124B (zh) * 2019-02-25 2022-09-27 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN114367749B (zh) * 2019-02-25 2024-05-10 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN110818241A (zh) * 2019-11-29 2020-02-21 北京兆维电子(集团)有限责任公司 一种玻璃切割方法

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